Component mounting device, and component mounting method

Abstract

To easily collect a foreign substance which is left in a transfer tray together with paste.SOLUTION: A component mounting device comprises: a transfer tray to which a transfer material is supplied; a head to which a component can be adsorbed by a nozzle; a squeegee of which the lower end is positioned at an upper side of the transfer tray; a scraper of which the lower end is in contact with a top face of the transfer tray; a filter through which the transfer material passes and the component does not pass; and a control device. The control device executes: a coating step of forming a coating of the transfer material over the top face of the transfer tray by horizontally moving the transfer tray of the squeegee in a direction in which a first end of the transfer tray and the squeegee are separated in a state where the squeegee falls; a transfer step of transferring the transfer material to the component adsorbed by the nozzle by controlling the head to move the nozzle downward to the coating of the transfer tray; and a scrape step of scraping the transfer material using the scraper by horizontally moving the transfer tray or the scraper in a direction in which the first end of the transfer tray and the scraper are close in a state where the squeegee rises. The transfer material passes through the filter in the scrape step.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method.

Background Art

[0002] Patent Document 1 discloses a paste transfer device for transferring paste to an electronic component. The paste transfer device has a base portion and side walls rising from the side of the base portion, and has a transfer stage to which paste for transferring to the electronic component is supplied. Further, the paste transfer device includes a paste coating film forming portion for forming a paste coating film on the transfer stage, and a paste scraping portion for scraping the paste coating film formed on the transfer stage. By bringing the electronic component adsorbed to the nozzle into contact with the paste coating film on the transfer stage, the paste is transferred to the electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When transferring paste to an electronic component, there is a possibility that the electronic component comes off the nozzle and remains on the transfer stage (transfer tray). The electronic component (foreign matter) remaining on the transfer stage (transfer tray) in this way is scraped together during the scraping of the paste coating film and remains also during the next paste coating film.

[0005] An object of the present disclosure is to provide a technique capable of easily collecting foreign matter remaining on the transfer tray together with the paste.

Means for Solving the Problems

[0006] A component mounting apparatus according to one aspect includes a transfer dish to which a transfer material is supplied, a head capable of adsorbing a component with a nozzle, a squeegee having a lower end positioned above the transfer dish, a scraper having a lower end in contact with the upper surface of the transfer dish, and a filter through which the transfer material passes and the component does not pass. The control device includes a coating film step of forming a coating film of the transfer material on the upper surface of the transfer dish by horizontally moving the transfer dish or the squeegee in a direction in which the first end of the transfer dish and the squeegee are separated from each other with the squeegee lowered, a transfer step of controlling the head to lower the nozzle toward the coating film of the transfer dish and transferring the transfer material to the component adsorbed by the nozzle, and a scraping step of horizontally moving the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other with the squeegee raised and scraping the transfer material with the scraper. The transfer material passes through the filter during the scraping step.

[0007] A component mounting method according to one aspect is a component mounting method using an apparatus including a transfer dish to which a transfer material is supplied, a head capable of adsorbing a component with a nozzle, a squeegee having a lower end positioned above the transfer dish, a scraper having a lower end in contact with the upper surface of the transfer dish, and a filter through which the transfer material passes and the component does not pass. The method includes a coating film step of forming a coating film of the transfer material on the upper surface of the transfer dish by horizontally moving the transfer dish or the squeegee in a direction in which the first end of the transfer dish and the squeegee are separated from each other with the squeegee lowered, a transfer step of controlling the head to lower the nozzle toward the coating film of the transfer dish and transferring the transfer material to the component adsorbed by the nozzle, and a scraping step of horizontally moving the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other with the squeegee raised and scraping the transfer material with the scraper. The transfer material passes through the filter during the scraping step.

[0008] Note that these general or specific aspects may be implemented in a system, apparatus, method, integrated circuit, computer program, or recording medium, or may be implemented in any combination of a system, apparatus, method, integrated circuit, computer program, and recording medium.

Advantages of the Invention

[0009] According to the present disclosure, foreign matter remaining on the transfer dish together with the paste can be easily recovered.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, a more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid making the following description unnecessarily redundant and to facilitate the understanding of those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] (This embodiment) <Configuration of component mounting device> First, with reference to FIG. 1, the overall configuration of the component mounting device 1 in this embodiment will be described. FIG. 1 is a plan view of the component mounting device 1 in this embodiment.

[0013] The component mounting device 1 has a function of mounting electronic components 5 (see FIG. 2) on a substrate. On the base 1a, a substrate transfer mechanism 2 is disposed in the X direction, which is the substrate transfer direction. The substrate transfer mechanism 2 transfers the substrate 3 that is the object of the component mounting operation.

[0014] On both sides of the substrate transfer mechanism 2, component supply units for supplying the electronic components 5 are disposed.

[0015] On one side's electronic component supply unit 4A, a plurality of tape feeders 6 for supplying the electronic components 5 held on a tape and a paste transfer device 7 are arranged in parallel.

[0016] The paste transfer device 7 transfers the paste P, which is a transfer material of a viscous fluid such as flux, to the electronic component 5 taken out by the mounting head 11A described below. Details of the paste transfer device 7 will be described later (see FIG. 2).

[0017] On the other side's electronic component supply unit 4B, a tray feeder 8 for supplying a tray 8a containing tray components (not shown), which are large-sized electronic components, is set.

[0018] At one end of the base 1a in the X direction, a Y-axis table 9 is disposed in the Y direction orthogonal to the substrate transfer mechanism 2. Two X-axis tables 10A and 10B are movably coupled to the Y-axis table 9 in the Y direction. Mounting heads 11A and 11B are respectively mounted on the X-axis tables 10A and 10B.

[0019] By driving the X-axis table 10A and the Y-axis table 9, the mounting head 11A picks up the electronic component 5 from the tape feeder 6 of the electronic component supply unit 4A by the nozzle 11a (FIG. 2) mounted at the lower part, accesses the paste transfer device 7 for paste transfer, and transfers and mounts the electronic component 5 after paste transfer to the substrate 3 positioned and held by the substrate transfer mechanism 2. That is, the mounting head 11A picks up the electronic component 5 from the electronic component supply unit 4A and mounts it on the substrate 3.

[0020] The X-axis table 10A and the Y-axis table 9 constitute head moving means for moving the mounting head 11A to access the substrate 3 and the paste transfer device 7.

[0021] Also, by driving the X-axis table 10B and the Y-axis table 9, the mounting head 11B takes out the tray parts from the tray 8a held by the tray feeder 8 of the electronic component supply unit 4B and transfers and mounts them on the substrate 3 positioned and held by the substrate transfer mechanism 2.

[0022] The X-axis table 10A is equipped with a substrate recognition camera 12 that moves integrally with the mounting head 11A. When the mounting head 11A moves above the substrate 3, the substrate recognition camera 12 also moves integrally to image the substrate 3. Similarly, the X-axis table 10B is equipped with a substrate recognition camera 12 that moves integrally with the mounting head 11B. When the mounting head 11B moves above the substrate 3, the substrate recognition camera 12 also moves integrally to image the substrate 3.

[0023] Note that the X-axis tables 10A and 10B, the Y-axis table 9, and the mounting heads 11A and 11B are collectively referred to as a component mounting mechanism 25 (see FIG. 7).

[0024] In the base 1a, a component recognition camera 13 and a nozzle stocker 14 are disposed between the electronic component supply unit 4A and the substrate transfer mechanism 2. Similarly, a component recognition camera 13 and a nozzle stocker 14 are disposed between the electronic component supply unit 4B and the substrate transfer mechanism 2.

[0025] The nozzle stocker 14 stores nozzles 11a attached to the mounting heads 11A and 11B for a plurality of component types. The mounting heads 11A and 11B access the nozzle stocker 14 and execute a predetermined nozzle replacement operation. Thereby, the mounting heads 11A and 11B can replace the nozzles 11a according to the component types.

[0026] By relatively moving the mounting head 11A holding the electronic component 5 in the X direction above the component recognition camera 13, the component recognition camera 13 reads an image of the electronic component 5 from below. Thereby, the type and shape of the electronic component 5 in the state held by the mounting head 11A are recognized.

[0027] In the mounting operation of the electronic component 5 by the mounting head 11A, correction of the mounting position on the substrate 3 is performed in consideration of the substrate recognition result by the substrate recognition camera 12 and the component recognition result by the component recognition camera 13. The same applies when mounting the tray component by the mounting head 11B.

[0028] <Configuration of the paste transfer device> Next, with reference to FIG. 2, the structure of the paste transfer device 7 will be described. FIG. 2 is a perspective view of the paste transfer device 7 included in the component mounting apparatus 1 according to the present embodiment. In this specification, the access side of the mounting head 11A is defined as the front side, and the opposite direction is defined as the rear side.

[0029] In FIG. 2, the paste transfer device 7 includes an engaging portion 20a for fixing the unit base portion 20 and a handle 21 protruding rearward from the engaging portion 20a.

[0030] On the upper surface of the unit base portion 20, a guide rail 22 is disposed in the longitudinal direction. The transfer tray 24 is detachably attached to a slider 23 that is slidably fitted to the guide rail 22. A nut (not shown) coupled to the lower surface of the transfer tray 24 is screwed onto a feed screw 26. The feed screw 26 is rotationally driven by a motor 27 disposed on the rear end side of the unit base portion 20. By driving the motor 27, the transfer tray 24 can reciprocate in the longitudinal direction (Y direction) on the upper surface of the unit base portion 20.

[0031] That is, the guide rail 22, the slider 23, the feed screw 26, and the motor 27 serve as stage driving means for reciprocating the transfer tray 24 in the longitudinal direction with respect to the unit base portion 20. This stage driving means is covered with a safety cover 28 to ensure the safety of the operator.

[0032] The paste supply syringe 35 supplies the paste P to the transfer tray 24. The transfer tray 24 is held by a bracket 36. As a result, the horizontal position of the transfer tray 24 is fixed with respect to the unit base portion 20. A transfer area 32 is set in front of the transfer tray 24, and the mounting head 11A moves the electronic component 5 to the transfer area 32 and transfers the paste P to the electronic component 5.

[0033] <Configuration of Transfer Tray> Next, with reference to FIG. 3, the transfer tray 24 included in the component mounting apparatus 1 according to the present embodiment will be described. FIG. 3 is a perspective view of the transfer tray 24 included in the component mounting apparatus 1 according to the present embodiment.

[0034] The transfer tray 24 mainly includes a base portion 30 having a smooth upper surface in a rectangular plate shape, and has a concave structure having side walls 31A rising from both sides in the longitudinal direction of the base portion 30 and side walls 31B rising from both sides in the width direction of the base portion 30. The paste P for transferring to the electronic component 5 is supplied to the transfer tray 24. The upper surface of the base portion 30 forms a coating film of the paste P and serves as a transfer surface for transferring the paste P to the electronic component 5.

[0035] There are multiple types of transfer trays 24, each with a different size. The transfer tray 24 has a code 37. The code 37 is associated with identification information capable of discriminating the type of the transfer tray 24. The code 37 is, for example, a barcode, a Quick Response code (hereinafter referred to as "QR code (registered trademark)"), Radio Frequency Identification (hereinafter referred to as "RFID"), or the like.

[0036] The component mounting device 1 reads the code 37 with a substrate recognition camera 12 or a reader (not shown) or the like, and discriminates the type of the transfer tray 24 attached to the paste transfer device 7.

[0037] Note that the transfer tray 24 does not necessarily have to have the code 37, and the component mounting device 1 may discriminate the size of the transfer tray 24 using a camera. For example, a camera capable of imaging the transfer tray 24 may be installed, and the component mounting device 1 may analyze the captured image of the transfer tray 24 captured by the camera to discriminate the size of the transfer tray 24.

[0038] <When a filter section is provided in the scraper> FIG. 4 is a diagram showing a configuration example of the filter section in the present embodiment, (a) shows a side view of the filter section 50, and (b) shows a front view of the filter section 50. FIG. 5 is a diagram for explaining an example of the operation of the flux transfer unit 40 in which the filter section 50 is provided in the scraper 42 in the present embodiment.

[0039] As shown in FIG. 5, the flux transfer unit 40 in the present embodiment includes a transfer tray 24 (see FIG. 3), a squeegee 41, a scraper 42, and a filter section 50.

[0040] The squeegee 41 has a lower end positioned above the transfer tray 24 and is capable of ascending and descending. The squeegee 41 forms a coating film of the paste P on the transfer tray 24. Details of the operation of the squeegee 41 will be described later.

[0041] The scraper 42 has its lower end in contact with the upper surface of the transfer tray 24. The scraper 42 scrapes and collects the coating film of the paste P used for transfer to the electronic component 5. Details of the operation of the scraper 42 will be described later.

[0042] As shown in FIG. 4(b), the filter unit 50 includes a mesh filter 51. The mesh filter 51 may be composed of a mesh sized to allow the paste P to pass through and not allow foreign objects (such as the electronic component 5) to pass through. For example, the size of the mesh is 1 mm or less. However, the size of the mesh may be any size as long as it is less than the size of the foreign object that is not to be passed through.

[0043] As shown in FIG. 4(a), the mesh filter 51 may have a hook-shaped cross-sectional shape when viewed from the side. Thereby, the mesh filter 51 can hold the caught foreign objects. However, the shape of the mesh filter 51 is not limited to the hook shape, and may be any shape as long as it can hold the caught foreign objects.

[0044] As shown in FIG. 5, the filter unit 50 may be provided on the side closer to the squeegee 41 of the scraper 42. For example, the filter unit 50 may be provided on the side closer to the squeegee 41 of the scraper 42 such that the front surface of the mesh filter 51 faces the front-rear direction of the transfer tray 24, the inner surface (the concave surface) of the hook shape of the mesh filter 51 faces the scraper 42, and the lower end of the mesh filter 51 does not contact the transfer tray 24.

[0045] Next, with reference to FIG. 5, the operation of the flux transfer unit 40 provided with the filter unit 50 on the scraper 42 will be described. The flux transfer unit 40 performs the operations of the following steps S11 to S15. Note that the following operations may be controlled by the mechanism control unit 120 shown in FIG. 7. That is, the subject of the following operations can be read as the mechanism control unit 120.

[0046] (S11) As the paste coating film process, the squeegee 41 descends so that the lower end of the squeegee 41 is positioned at a position where the coating film of the paste P has a predetermined film thickness.

[0047] (S12) As the paste coating film process, the transfer plate 24 moves in the right direction of the drawing. As a result, the paste P on the transfer plate 24 is stretched to a predetermined film thickness by the squeegee 41 that is descending in step S11 to form a coating film. Instead of the movement of the transfer plate 24, the squeegee 41 may move in the left direction of the drawing. That is, the transfer plate 24 or the squeegee 41 horizontally moves in a direction in which the front end (first end) of the transfer plate 24 and the squeegee 41 are separated from each other, and a coating film of the paste P is formed on the upper surface of the transfer plate 24.

[0048] (S13) As the paste transfer process, the mounting head 11A moves above the coating film of the transfer plate 24 in a state where the electronic component 5 is adsorbed to the nozzle 11a. Then, the mounting head 11A descends and brings the electronic component 5 adsorbed to the nozzle 11a into contact with the paste P, thereby transferring the paste P to the electronic component 5, and then rises. At this time, for example, when the electronic component 5 is small and the adhesive force of the paste P is greater than the adsorption force of the nozzle 11a, when the mounting head 11A rises, the electronic component 5 may separate from the nozzle 11a and remain on the transfer plate 24. Also, when the mounting head 11A is positioned above the transfer plate 24, the electronic component 5 may separate from the nozzle 11a and fall, and the fallen electronic component 5 may remain on the transfer plate 24. Alternatively, for example, an operator may accidentally drop some fine object onto the paste P on the transfer plate 24, and the object may remain on the transfer plate 24. In the present embodiment, the electronic component 5 or object that remains on the transfer plate 24 in this way is referred to as a foreign object.

[0049] (S14) - (S15) As the scraping process of the paste, the squeegee 41 rises, and the transfer dish 24 moves in the left direction of the drawing. Instead of the movement of the transfer dish 24, the scraper 42 may move in the right direction of the drawing. That is, the transfer dish 24 or the scraper 42 moves horizontally in the direction in which the front end (first end) of the transfer dish 24 approaches the scraper 42. At this time, the paste P is pushed up along the surface of the scraper 42 while being scraped by the scraper 42. The paste P pushed up along the surface of the scraper 42 flows downward while passing through the mesh filter 51 of the filter unit 50 due to gravity. When this paste P passes through the mesh filter 51, foreign matters remaining in the paste P cannot pass through the mesh filter 51 and are collected (and held) by the mesh filter 51.

[0050] Note that the filter unit 50 may be detachable from the scraper 42. Thereby, by replacing the filter unit 50, the foreign matters held by the mesh filter 51 can be easily collected.

[0051] In this way, by providing the filter unit 50 on the scraper 42, foreign matters remaining in the paste P can be removed during the scraping process of the paste P.

[0052] <When a filter unit is provided on the squeegee> FIG. 6 is a diagram for explaining an example of the operation of the flux transfer unit 40 provided with the filter unit 50 on the squeegee 41 in the present embodiment. The location where the filter unit 50 is provided is not limited to the scraper 42 shown in FIG. 5, and may be the squeegee 41 as shown in FIG. 6.

[0053] As shown in FIG. 6, the filter unit 50 may be provided on the side closer to the scraper 42 of the squeegee 41. For example, on the side closer to the scraper 42 of the squeegee 41, the front surface of the mesh filter 51 faces the front-rear direction of the transfer plate 24, the hook-shaped outer surface (mountain side surface) of the mesh filter 51 faces the scraper 42, and it may be provided so as to be able to move up and down with respect to the squeegee 41.

[0054] Next, referring to FIG. 6, the operation of the flux transfer unit 40 provided with the filter unit 50 on the squeegee 41 will be described. The flux transfer unit 40 performs the operations of the following steps S21 to S25. Note that the following operations may be controlled by the mechanism control unit 120 shown in FIG. 7. That is, the subject of the following operations can be read as the mechanism control unit 120.

[0055] (S21) As a paste coating step, the squeegee 41 descends so that the lower end of the squeegee 41 is positioned at a position where the coating film of the paste P has a predetermined film thickness. At this time, the filter unit 50 rises with respect to the squeegee 41 so as not to interfere with the coating film of the paste P.

[0056] (S22) As a paste coating step, the transfer plate 24 moves in the right direction in the drawing. As a result, the paste P on the transfer plate 24 is stretched by the squeegee 41 that has descended in step S21 to form a coating film with a predetermined film thickness. Instead of the movement of the transfer plate 24, the squeegee 41 may move in the left direction in the drawing. That is, the transfer plate 24 or the squeegee 41 horizontally moves in a direction in which the front end (first end) of the transfer plate 24 and the squeegee 41 are separated from each other, and a coating film of the paste P is formed on the upper surface of the transfer plate 24.

[0057] (S23) As a paste transfer process, the mounting head 11A moves above the coating film of the transfer plate 24 with the electronic component 5 adsorbed to the nozzle 11a. Then, the mounting head 11A descends to bring the electronic component 5 adsorbed to the nozzle 11a into contact with the paste P, thereby transferring the paste P to the electronic component 5, and then ascends. There is a possibility that foreign matter may remain on the transfer plate 24.

[0058] (S24)-(S25) As a paste scraping process, the squeegee 41 ascends. At this time, the filter part 50 descends with respect to the squeegee 41. For example, the filter part 50 descends to a position where the lower end contacts the upper surface of the transfer plate 24. Then, the transfer plate 24 moves in the left direction in the drawing. Instead of the movement of the transfer plate 24, the scraper 42 may move in the right direction in the drawing. That is, the transfer plate 24 or the scraper 42 horizontally moves in a direction in which the front end (first end) of the transfer plate 24 and the scraper 42 approach each other. Thereby, the paste P moves toward the scraper 42, and when passing through the mesh filter 51 of the filter part 50, foreign matter remaining in the paste P cannot pass through the mesh filter 51 and is collected (and held) by the mesh filter 51.

[0059] Note that the filter part 50 may be detachable with respect to the squeegee 41. Thereby, by replacing the filter part 50, the foreign matter held by the mesh filter 51 can be easily collected.

[0060] In this way, by providing the filter part 50 on the squeegee 41, foreign matter remaining in the paste P can be removed during the paste scraping process.

[0061] Note that the flux transfer unit 40 may be configured to provide the filter part 50 on the scraper 42 as shown in FIG. 4, and further provide the filter part 50 on the squeegee 41 as shown in FIG. 6. Thereby, foreign matter remaining in the paste P can be collected more reliably.

[0062] Further, the flux transfer unit 40 may include an independently movable filter unit 50 between the scraper 42 and the squeegee 41. Even with such a configuration, as described above, foreign matter remaining in the paste P can be collected.

[0063] In this way, by providing the filter unit 50, foreign matter remaining in the paste P during the scraping process of the paste P can be collected, so that in the next paste coating process, it can be prevented that the foreign matter is coated together. If the foreign matter is coated together, in the next transfer process, the foreign matter will interfere and the transfer of the paste to the electronic component 5 will fail, resulting in a significant decrease in the manufacturing quality and manufacturing efficiency. According to the present embodiment, such a decrease in the manufacturing quality and manufacturing efficiency can be prevented.

[0064] <Control device> Next, with reference to FIG. 7, the control device included in the component mounting device 1 will be described. FIG. 7 is a block diagram showing an example of the functional configuration of the control device 100 included in the component mounting device 1 in the present embodiment.

[0065] The control device 100 is a device for controlling the operation of the component mounting device 1, and as functions, it has a storage unit 110, a mechanism control unit 120, and an imaging processing unit 130.

[0066] The storage unit 110 is composed of, for example, a volatile storage medium and / or a non-volatile storage medium, and data can be read and written. The functions of the mechanism control unit 120 and the imaging processing unit 130 may be realized by a processor (not shown) included in the control device 100 executing a computer program in cooperation with the storage unit 110. Note that the functions of the mechanism control unit 120 and the imaging processing unit 130 may also be realized by an integrated circuit such as a Programmable Logic Device (PLD), a Field Programmable Gate Array (FPGA), or an Application Specific Integrated Circuit (ASIC).

[0067] The memory unit 110 stores the mounting data 111 and the component data 112. The mounting data 111 has information indicating, for each substrate 3, the type and mounting posture (e.g., orientation and / or angle) of the electronic component 5 to be mounted, the mounting order of the electronic components 5, the mounting timing of the electronic components 5, and the like. The component data 112 has information indicating, for each electronic component 5, the component ID, type, size, horizontal movement speed in the XY plane, rotational speed in the XY plane, and the like.

[0068] The mechanism control unit 120 controls various mechanisms provided in the component mounter 1. For example, the mechanism control unit 120 performs the following controls. The mechanism control unit 120 controls the substrate transfer mechanism 2 to transfer the substrate 3. The mechanism control unit 120 controls the tape feeder 6 to supply the electronic component 5. While referring to the mounting data 111 and the component data 112 in the memory unit 110, the mechanism control unit 120 controls the component mounting mechanism 25 to perform operations such as sucking the electronic component 5, moving it to the flux transfer unit 40, transferring the paste P to the electronic component 5, and mounting the electronic component 5 on the substrate 3. The mechanism control unit 120 controls the flux transfer unit 40 to perform operations such as the coating process and scraping process of the paste P described above with reference to FIG. 5 or FIG. 6.

[0069] The imaging processing unit 130 processes the images captured by the component recognition camera 13 and the substrate recognition camera 12. Further, the imaging processing unit 130 may include a camera control unit 131. The camera control unit 131 controls the driving of the substrate recognition camera 12 as described above with reference to FIG. 1. The imaging processing unit 130 recognizes the position and posture of the electronic component 5 with respect to the nozzle 11a from the image captured by the component recognition camera 13. Further, the imaging processing unit 130 recognizes the mounting position of the electronic component 5 from the image captured by the substrate recognition camera 12 and corrects the position and posture of the nozzle 11a that holds the electronic component 5. Thereby, the electronic component 5 is accurately mounted on the substrate 3.

[0070] (Summary of this embodiment) According to the description of the above embodiment, the following technology is disclosed.

[0071] <Technology 1> The component mounting device (1) according to this embodiment includes a transfer dish (24) to which a transfer material (for example, paste P) is supplied, a head (for example, mounting head 11A) capable of sucking a component (for example, electronic component 5) with a nozzle (11a), a squeegee (41) whose lower end is located above the transfer dish, a scraper (42) whose lower end contacts the upper surface of the transfer dish, a filter (for example, filter unit 50) through which the transfer material passes and the component does not pass, and a control device (100). The control device forms a coating film of the transfer material on the upper surface of the transfer dish by horizontally moving the transfer dish or the squeegee in a direction in which the first end of the transfer dish and the squeegee are separated from each other with the squeegee lowered, a coating film forming step; controls the head to lower the nozzle toward the coating film of the transfer dish, and transfers the transfer material to the component adsorbed by the nozzle, a transfer step; and horizontally moves the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other with the squeegee raised, and scrapes the transfer material with the scraper, a scraping step. The transfer material passes through the filter during the scraping step. Thereby, foreign matter (for example, electronic component 5) remaining in the transfer material on the transfer dish can be collected by the filter during the scraping step.

[0072] <Technology 2> In the component mounting device according to Technology 1, the filter is attached to the scraper. Thereby, foreign matter can be collected by the filter attached to the scraper.

[0073] <Technology 3> In the component mounting device according to Technology 1, the filter is attached to the squeegee. Thereby, foreign matter can be collected by the filter attached to the squeegee.

[0074] <Technology 4> In the component mounting apparatus according to Technique 3, the filter is attached so as to be movable up and down with respect to the squeegee, and the control device raises the filter during the coating film process and lowers the filter during the scraping process. Thereby, the coating film process can be performed without the filter getting in the way, and foreign matter can be collected by the filter attached to the squeegee during the scraping process.

[0075] <Technique 5> In the component mounting apparatus according to Technique 1, the filter is attached to the scraper and the squeegee. Thereby, foreign matter can be collected more reliably.

[0076] <Technique 6> The component mounting method according to the present embodiment uses an apparatus (for example, component mounting apparatus 1) including a transfer dish (24) to which a transfer material (for example, paste P) is supplied, a head (for example, mounting head 11A) capable of adsorbing a component (for example, electronic component 5) with a nozzle (11a), a squeegee (41) whose lower end is positioned above the transfer dish, a scraper (42) whose lower end contacts the upper surface of the transfer dish, and a filter (for example, filter unit 50) through which the transfer material passes and the component does not pass. The method includes a coating film process of forming a coating film of the transfer material on the upper surface of the transfer dish by horizontally moving the transfer dish or the squeegee in a direction in which the first end of the transfer dish and the squeegee are separated from each other with the squeegee lowered, a transfer process of controlling the head to lower the nozzle toward the coating film of the transfer dish and transferring the transfer material to the component adsorbed by the nozzle, and a scraping process of horizontally moving the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other with the squeegee raised and scraping the transfer material with the scraper. The transfer material passes through the filter during the scraping process. Thereby, foreign matter (for example, electronic component 5) remaining in the transfer material of the transfer dish can be collected by the filter during the scraping process.

[0077] The embodiments have been described above with reference to the accompanying drawings, but the present disclosure is not limited to such examples. It is obvious that those skilled in the art can conceive of various modification examples, correction examples, substitution examples, addition examples, deletion examples, and equivalent examples within the scope described in the claims, and it is understood that they also belong to the technical scope of the present disclosure. Further, within the scope not departing from the gist of the invention, the constituent elements in the above-described embodiments may be arbitrarily combined.

Industrial Applicability

[0078] The technology of the present disclosure is useful for an apparatus and a method for mounting components.

Explanation of Reference Numerals

[0079] 1 Component mounting apparatus 1a Base 2 Substrate transfer mechanism 3 Substrate 4A, 4B Electronic component supply unit 5 Electronic component 6 Tape feeder 7 Paste transfer device 8 Tray feeder 8a Tray 9 Y-axis table 10A, 10B X-axis table 11A, 11B Mounting head 11a Nozzle 12 Substrate recognition camera 13 Component recognition camera 14 Nozzle stocker 20 Unit base part 20a Engagement part 21 Handle 22 Guide rail 23 Slider 24 Transfer dish 25 Component mounting mechanism 27 Motor 28 Safety cover 30 Base part 31A, 31B Side wall 32 Transfer Area 35 Paste Supply Syringe 36 Bracket 37 Cable 40 Flux Transfer Unit 41 Squeegee 42 Scraper 50 Filter Section 51 Mesh Filter 100 Control Device 110 Memory Section 111 Mounting Data 112 Component Data 120 Mechanism Control Section 130 Imaging Processing Section 131 Camera Control Section

Claims

1. A transfer dish supplied with a transfer material, A head capable of adsorbing parts with a nozzle, A squeegee whose lower end is located above the transfer dish, A scraper whose lower end contacts the upper surface of the transfer dish, A filter through which the transfer material passes and the parts do not pass, A control device, and The control device is In a state where the squeegee is lowered, a coating film step of horizontally moving the transfer dish or the squeegee in a direction away from the first end of the transfer dish and the squeegee to form a coating film of the transfer material on the upper surface of the transfer dish, A transfer step of controlling the head to lower the nozzle toward the coating film of the transfer dish and transferring the transfer material to the parts adsorbed by the nozzle, In a state where the squeegee is raised, a scraping step of horizontally moving the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other and scraping the transfer material with the scraper is executed, The transfer material passes through the filter during the scraping step, A component mounting device.

2. The filter is attached to the scraper, The component mounting device according to claim 1.

3. The filter is attached to the squeegee, The component mounting device according to claim 1.

4. The filter is attached to the squeegee so as to be capable of rising and falling with respect to the squeegee, The control device raises the filter during the coating film step and lowers the filter during the scraping step, The component mounting device according to claim 3.

5. The filter is attached to the scraper and the squeegee, The component mounting device according to claim 1.

6. A component mounting method using a device including a transfer dish supplied with a transfer material, A head capable of adsorbing parts with a nozzle, A squeegee whose lower end is located above the transfer dish, A scraper whose lower end contacts the upper surface of the transfer dish, A filter through which the transfer material passes and the parts do not pass, A coating film step of horizontally moving the transfer dish or the squeegee in a direction away from the first end of the transfer dish and the squeegee in a state where the squeegee is lowered to form a coating film of the transfer material on the upper surface of the transfer dish, A transfer step of controlling the head to lower the nozzle toward the coating film of the transfer dish and transferring the transfer material to the parts adsorbed by the nozzle, A scraping step of horizontally moving the transfer dish or the scraper in a direction in which the first end of the transfer dish and the scraper approach each other with the squeegee raised, and scraping the transfer material with the scraper, is included. The transfer material passes through the filter during the scraping step. Component mounting method.

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