Component mounting device

By integrating electrostatic discharge portions at the contact points between the component supply unit and the base, the component mounting device mitigates the risk of electrostatic discharge, protecting electronic components and ensuring operational reliability.

JP2025083845APending Publication Date: 2025-06-02PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2023197474
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-21
Publication Date
2025-06-02

AI Technical Summary

Technical Problem

Static electricity generated during the transportation of the component supply unit can cause electrostatic discharge when connecting it to the component mounting device, potentially damaging electronic components such as LSIs.

Method used

Incorporating an electrostatic discharge portion, such as conductive guides, at the point of contact between the component supply unit and the unit mounting portion of the base, to safely discharge static electricity before it reaches the electronic components.

Benefits of technology

This solution effectively alleviates the problems caused by electrostatic discharge, preventing damage to electronic components and ensuring reliable operation of the component mounting device.

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Abstract

To provide a component mounting device capable of alleviating a problem caused by electrostatic discharge when a component supply unit is mounted.SOLUTION: A component mounting device 1 for mounting a component, which is supplied from a component supply unit U, on a base plate comprises a base 1a having a unit mounting part 4 on which the component supply unit U moving on a floor is mounted. At least either the unit mounting part 4 or the component supply unit U has an electrostatic discharge part S provided in a position in which the unit mounting part 4 is brought into contact with the component supply unit U during mounting on the unit mounting part 4.SELECTED DRAWING: Figure 5
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Description

Technical Field

[0001] The present invention relates to a component mounting device that mounts components supplied from a component supply unit onto a substrate.

Background Art

[0002] A component mounting device mounts components supplied from a feeder onto a substrate. The component mounting device can manufacture various mounting substrates by changing the types of components supplied from the feeder. In order to quickly change the types of mounting substrates to be manufactured, a component mounting device with a detachable feeder is known (see, for example, Patent Document 1). Patent Document 1 discloses a component mounting device that can be freely attached to and detached from a base a trolley that holds a tray feeder that can be transported on the floor or a plurality of tape feeders. The tray feeder or the trolley (component supply unit) is provided with a unit-side connector, and when the unit-side connector is connected to the device-side connector provided on the base while being connected to the component mounting device, the tape feeders held by the tray feeder or the trolley are electrically connected to the component mounting device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Incidentally, static electricity may be generated when the component supply unit is transported on the floor. When the component supply unit charged with static electricity contacts the base of the component mounting device when being connected to the component mounting device, the static electricity accumulated in the component supply unit may be discharged to the base, and electronic components such as LSIs provided in the component mounting device may be damaged. However, in the prior art including Patent Document 1, there is no disclosure regarding countermeasures against electrostatic discharge when connecting the component supply unit, and there is room for further improvement in order to solve problems caused by electrostatic discharge.

[0005] Therefore, an object of the present invention is to provide a component mounting device capable of alleviating problems caused by electrostatic discharge when mounting a component supply unit.

Means for Solving the Problems

[0006] The component mounting device of the present invention is a component mounting device that mounts components supplied from a component supply unit on a substrate, and includes a base having a unit mounting portion on which a component supply unit that moves on the floor is mounted. At least one of the unit mounting portion or the component supply unit includes an electrostatic discharge portion at a position where the component supply unit being mounted on the unit mounting portion contacts the unit mounting portion.

Effects of the Invention

[0007] According to the present invention, problems caused by electrostatic discharge when mounting the component supply unit can be alleviated.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0009] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting apparatus, carriage, and tray feeder. Hereinafter, corresponding elements in all the drawings are denoted by the same reference numerals, and redundant explanations are omitted. In FIG. 1 and a part described later, as two axes orthogonal to each other in the horizontal plane, the X-axis (left-right direction in FIG. 1) in the substrate conveyance direction and the Y-axis (up-down direction in FIG. 1) orthogonal to the substrate conveyance direction are shown. In FIG. 2 and a part described later, the Z-axis (up-down direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane.

[0010] First, with reference to FIGS. 1 to 3, the configuration of the component mounting apparatus 1 will be described. FIG. 2 schematically shows a part of the component mounting apparatus 1 in FIG. 1. The component mounting apparatus 1 has a function of performing a component mounting operation of mounting components supplied from a component supply unit on a substrate. A substrate conveyance mechanism 2 is arranged along the X-axis at the center of the base 1a. The substrate conveyance mechanism 2 conveys the substrate 3 conveyed from the upstream into the mounting work position, positions it, and holds it. Further, the substrate conveyance mechanism 2 conveys the substrate 3 on which the component mounting operation has been completed downstream.

[0011] In the base 1a, unit mounting parts 4 are provided on both sides (in the front - rear direction of the Y - axis) of the substrate transfer mechanism 2. Between a pair of opposing side walls 4a of the front unit mounting part 4, a carriage 6 for holding a plurality of tape feeders 5 in parallel along the X - axis is mounted. The tape feeder 5 feeds the component tape 15 storing the component D in pitch, and supplies the component D to a component supply position 5a where the component D is taken out by a mounting head 11 described below. Between a pair of opposing side walls 4a of the rear unit mounting part 4, a tray feeder 7 is mounted. The tray feeder 7 supplies a plurality of components D stored in the tray 8 to the component supply position.

[0012] In this way, the carriage 6 holding a plurality of tape feeders 5 for supplying the component D and the tray feeder 7 for supplying the component D stored in the tray 8 are component supply units U that supply the component D to be mounted by the component mounting apparatus 1 onto the substrate 3. And the component mounting apparatus 1 includes a base 1a having a unit mounting part 4 on which the component supply unit U is mounted.

[0013] In FIGS. 1 and 2, on both ends in the X - axis direction on the upper surface of the base 1a, Y - axis tables 9 having linear drive mechanisms are arranged along the Y - axis. On the Y - axis table 9, a beam 10 having a linear drive mechanism in the same way is movably coupled along the Y - axis. The beam 10 is arranged along the X - axis. On the beam 10, a plate 10a is movably mounted along the X - axis. On the plate 10a, a mounting head 11 is mounted. The mounting head 11 includes a suction unit 11a capable of lifting while sucking the component D. At the lower end of the suction unit 11a, a nozzle 11b for sucking and holding the component D is mounted.

[0014] In FIG. 1, the Y-axis table 9 and the beam 10 constitute a head movement mechanism 12 that moves the mounting head 11 in the X-axis and Y-axis directions. The head movement mechanism 12 and the mounting head 11 perform a mounting cycle of sucking and taking out the component D from the component supply position 5a of the tape feeder 5 arranged at the unit mounting portion 4 by the nozzle 11b and mounting it at the mounting position of the substrate 3 positioned by the substrate transfer mechanism 2. That is, the Y-axis table 9, the beam 10, and the mounting head 11 constitute component mounting means for holding the component D supplied to the component supply position 5a of the tape feeder 5 with the nozzle 11b and mounting it on the substrate 3.

[0015] In FIGS. 1 and 2, a component recognition camera 13 is arranged between the unit mounting portion 4 and the substrate transfer mechanism 2. When the mounting head 11 that has taken out the component D from the component supply unit U (the carriage 6, the tray feeder 7) mounted on the unit mounting portion 4 moves above the component recognition camera 13, the component recognition camera 13 images the component D held by the mounting head 11. From the imaging result, the holding posture of the component D is recognized. A substrate recognition camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The substrate recognition camera 14 moves integrally with the mounting head 11.

[0016] By the movement of the mounting head 11, the substrate recognition camera 14 moves above the substrate 3 positioned by the substrate transfer mechanism 2 and images the substrate mark 3a provided on the substrate 3. From the imaging result, the position of the substrate 3 is recognized. In the component mounting operation on the substrate 3 by the mounting head 11, correction of the mounting position is performed in consideration of the recognition result of the component D by the component recognition camera 13 and the recognition result of the substrate position by the substrate recognition camera 14.

[0017] In FIGS. 2 and 3, a carriage 6 in a state where a plurality of tape feeders 5 are pre-held on a feeder base 6a is set in the front unit mounting portion 4. The carriage 6 holds a tape reel 16 that stores a component tape 15 holding a component D in a wound state. The component tape 15 pulled out from the tape reel 16 is pitch-fed by the tape feeder 5 to the component supply position 5a. Wheels 17 are arranged at the lower part of the carriage 6, and the carriage 6 moves on the floor FL and is mounted on the unit mounting portion 4. Similarly, wheels (not shown) are also arranged at the lower part of the tray feeder 7, and the tray feeder 7 moves on the floor FL and is mounted on the unit mounting portion 4.

[0018] In FIGS. 1 and 2, a device-side connector 18 is arranged in the unit mounting portion 4. A unit-side connector 19 is arranged on the carriage 6. When the carriage 6 is mounted on the unit mounting portion 4 along between a pair of opposing side walls 4a, the device-side connector 18 and the unit-side connector 19 are connected. Thereby, the control device 20 provided in the component mounting apparatus 1 and the tape feeder control unit 5b provided in the tape feeder 5 held by the carriage 6 are electrically connected.

[0019] Similarly, a unit-side connector 21 is arranged on the tray feeder 7. When the tray feeder 7 is mounted on the unit mounting portion 4 along between a pair of opposing side walls 4a, the device-side connector 18 and the unit-side connector 21 of the tray feeder 7 are connected, and the control device 20 and a tray feeder control unit (not shown) provided in the tray feeder 7 are electrically connected. Thus, a connector (device-side connector 18) that is electrically connected to the component supply unit U (carriage 6 holding the tape feeder 5, tray feeder 7) whose mounting is completed is arranged in the unit mounting portion 4.

[0020] In FIGS. 1 and 3, a touch panel 22 operated by an operator is installed at a position where the operator works in front of the component mounting apparatus 1. The touch panel 22 displays various information on its display portion, and the operator performs data input and operation of the component mounting apparatus 1 using operation buttons and the like displayed on the display portion.

[0021] On a pair of side walls 4a of the unit mounting portion 4, there are arranged a pair of guides G that guide the X-axis direction position of the unit side connector 19 of the component supply unit U (the carriage 6 holding the tape feeder 5, the tray feeder 7) mounted on the unit mounting portion 4 to match the device side connector 18. The component supply unit U is mounted on the unit mounting portion 4 while its position is corrected by contacting either the left or right guide G in the X-axis direction (see FIG. 5).

[0022] Here, referring to FIG. 4, the influence of static electricity accumulated in the component supply unit U such as the carriage 6 and the tray feeder 7 will be described using an electrical equivalent circuit. Here, the carriage 6 will be described as an example of the component supply unit U. FIG. 4 shows an equivalent circuit of the carriage 6 and the component mounting apparatus 1 using the portion of the rectangle A shown in FIG. 3. The carriage 6 on which the tape feeder 5 for supplying the component D to be mounted on the substrate 3 in the production of the next mounting substrate or the like is set in the preparation area or the like moves on the floor FL to the component mounting apparatus 1. In the process of this movement, due to friction such as the rotating wheels 17, charges (static electricity) are accumulated in the parasitic capacitance C existing between the floor FL grounded to the GND level and the carriage 6.

[0023] And when the countermeasures against static electricity are insufficient or the effect of the countermeasures against static electricity decreases due to the influence of dust or the like, the resistance R1 of the discharge path of the static electricity with respect to the floor FL becomes large. When the resistance R1 of the discharge path becomes large, the static electricity accumulated in the carriage 6 is not discharged, and the carriage 6 is mounted on the unit mounting portion 4 of the component mounting apparatus 1. When the carriage 6 contacts the guide G in the process of mounting the carriage 6 on the unit mounting portion 4, the charges accumulated in the parasitic capacitance C are discharged to the device GND of the component mounting apparatus 1 through the resistance R2 of the metal frame of the carriage 6, the resistance Rg of the guide G, the resistance R3 of the base 1a of the metal component mounting apparatus 1, and the parasitic inductance L.

[0024] Here, the resistance R2 of the frame of the metal cart 6 and the resistance R3 of the base 1a of the component mounting device 1 are small. And when the guide G is formed of a low-resistance material such as metal and the resistance Rg of the guide G is small, the charge accumulated in the stray capacitance C is discharged in a short time, so that a surge current i with a large peak value flows from the cart 6 into the component mounting device 1. The surge current i generated by electrostatic discharge may flow into a component recognition camera 13 or the like provided in the component mounting device 1, or may generate an overvoltage due to electromagnetic induction by the parasitic inductance L or a counter electromotive force, and may damage the electronic components of the component mounting device 1.

[0025] Next, with reference to FIG. 5, measures for preventing damage to the electronic components of the component mounting device 1 due to the discharge of static electricity charged on the cart 6 will be described. FIG. 5 is an enlarged view of the rectangle B shown in FIG. 1. The component mounting device 1 shown in FIG. 5 includes a pair of guides G1 formed of a conductive material having an electrical resistivity of 10 2 ~10 4 Ω·cm on a pair of side walls 4a of the unit mounting portion 4. Further, the pair of guides G1 have buffer portions G1a that cover a part of the front surface including the corner portion at the entrance of the unit mounting portion 4 to mitigate the impact caused by the collision of the cart 6 or the tray feeder 7.

[0026] In the process of mounting the cart 6 on the unit mounting portion 4 (arrows a1, a2), when the cart 6 comes into contact with the buffer portion G1a or the side surface of the guide G1 (circle E), the charge (static electricity) accumulated in the stray capacitance C of the cart 6 is discharged to the component mounting device 1 through the resistance Rg of the guide G1. And since the resistance Rg of the guide G1 is set to be moderately large, the static electricity is discharged gently and the peak value of the surge current i becomes small, preventing damage to the electronic components of the component mounting device 1.

[0027] In addition, before the unit-side connector 19 of the cart 6 is connected to the device-side connector 18, the static electricity accumulated in the cart 6 has been sufficiently discharged, so that damage to the electronic components of the component mounting device 1 due to electrostatic discharge through the device-side connector 18 is also prevented.

[0028] Next, referring to FIG. 6, another embodiment of a guide for preventing destruction of electronic components included in the component mounting apparatus 1 due to discharge of static electricity on the carriage 6 (hereinafter simply referred to as "guide G2") will be described. The guide G2 includes a metal leaf spring 23 and a conductive sheet 24 having an electrical resistivity of 10 7 ~10 9 Ω·cm sandwiched between the leaf spring 23 and the base 1a of the component mounting apparatus 1. Similar to the guide G1, since the resistance Rg of the guide G2 is set to be moderately large, static electricity is discharged gently and the peak value of the surge current i becomes small, preventing destruction of the electronic components included in the component mounting apparatus 1.

[0029] Thus, the guide G1 and the guide G2 are static electricity discharge parts S provided at the positions where the component supply unit U (carriage 6, tray feeder 7) being mounted on the unit mounting part 4 comes into contact with the unit mounting part 4. The static electricity discharge part S has a conductive material (guide G1, conductive sheet 24) connected in series between the contacting component supply unit U and the unit mounting part 4. And the static electricity discharge part S is arranged at the position where the unit mounting part 4 and the component supply unit U come into contact before the component supply unit U being mounted on the unit mounting part 4 comes into contact with the connector (apparatus-side connector 18).

[0030] Note that the static electricity discharge part S is not limited to being configured to be arranged on the unit mounting part 4. For example, a configuration in which a conductive material such as a conductive sheet is arranged at the position where the carriage 6 or the tray feeder 7 first comes into contact with the unit mounting part 4 may be adopted. That is, at least either the unit mounting part 4 or the component supply unit U may be configured to include the static electricity discharge part S.

[0031] As described above, the component mounting device 1 that mounts the component D supplied from the component supply unit U (the carriage 6 that holds the tape feeder 5 and the tray feeder 7) of the present embodiment onto the substrate 3 includes a base 1a having a unit mounting portion 4 on which the component supply unit U that moves on the floor FL is mounted. At least one of the unit mounting portion 4 or the component supply unit U includes an electrostatic discharge portion S (guides G1, G2) at a position where the component supply unit U being mounted on the unit mounting portion 4 and the unit mounting portion 4 come into contact. Thereby, problems caused by electrostatic discharge when mounting the component supply unit U can be alleviated.

Industrial Applicability

[0032] The component mounting device of the present invention has the effect of being able to alleviate problems caused by electrostatic discharge when mounting a component supply unit, and is useful in the field of mounting components on a substrate.

Explanation of Reference Numerals

[0033] 1 Component mounting device 1a Base 3 Substrate 4 Unit mounting portion 5 Tape feeder 6 Carriage 18 Device-side connector (connector) D Component FL Floor S Electrostatic discharge portion U Component supply unit

Claims

1. A component mounting device for mounting components supplied from a component supply unit onto a substrate, comprising a base having a unit mounting portion on which a component supply unit that moves on a floor is mounted. At least one of the unit mounting portion or the component supply unit includes an electrostatic discharge portion at a position where the component supply unit mounted on the unit mounting portion and the unit mounting portion come into contact with each other. A component mounting device.

2. The component mounting device according to claim 1, wherein the electrostatic discharge portion has a conductive material connected in series between the component supply unit and the unit mounting portion that come into contact with each other.

3. A connector that is electrically connected to the component supply unit that has been mounted is disposed on the unit mounting portion. The component mounting device according to claim 1, wherein the electrostatic discharge portion is disposed at a position where the unit mounting portion and the component supply unit come into contact with each other before the component supply unit mounted on the unit mounting portion comes into contact with the connector.

4. The component mounting device according to claim 1, wherein the component supply unit is a carriage that holds a plurality of tape feeders for supplying components.

Citation Information

Patent Citations

  • Component mounting system, component mounting device, and voltage supply method in component mounting system

    JP2022150190A