Substrate processing system and substrate processing method

Abstract

To provide a substrate processing system and a substrate processing method, capable of suppressing variations of a processing in each substrate.SOLUTION: A control part 180 of a substrate processing system 1 controls a lifter LF1 to perform a batch processing at a first time that a plurality of substrates W of a vertical posture is sunk to a chemical liquid in a chemical liquid processing tank BT1. The control part 180 rotates the plurality of substrates W to which the batch processing at the first time is processed by controlling a second posture conversion mechanism 43, and thus, vertically inverts the plurality of substrates W of the vertical posture. The control part 180 controls the lifter LF1 to perform the batch processing at a second time for sinking the plurality of substrates W of which the vertical posture is vertically inverted into the chemical liquid in the chemical liquid processing tank BT1.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing system and a substrate processing method for processing a substrate. Examples of the substrate include a semiconductor substrate, a substrate for a flat panel display (FPD), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic electroluminescence (EL) display device, and the like.

Background Art

[0002] A conventional substrate processing apparatus includes a substrate transfer mechanism for transferring a group of substrates to be processed collectively, a processing tank for storing a heated phosphoric acid solution, and a lifter for holding the group of substrates and immersing the group of substrates in the phosphoric acid solution. When the group of substrates is transferred to the processing tank by the substrate transfer mechanism, the lifter receives the group of substrates from the substrate transfer mechanism and immerses the group of substrates in the phosphoric acid solution in the processing tank. Thereby, the etching process is performed collectively on the group of substrates (see, for example, Patent Document 1).

[0003] Patent Document 2 discloses a substrate processing system including a batch processing unit for processing a plurality of substrates collectively, a single-wafer processing unit for processing substrates one by one, and an interface unit for transferring substrates between the single-wafer processing unit and the batch processing unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] A plurality of substrates in a vertical posture are immersed in a phosphoric acid solution in a processing tank. Thereby, the plurality of substrates are collectively subjected to an etching process. At this time, in order to circulate the phosphoric acid solution in the processing tank, for example, at least one of the phosphoric acid solution and bubbles is flowed from the bottom of the processing tank upward. Such an etching process is performed until a preset time (for example, 4 hours) elapses. However, perhaps because a fresher phosphoric acid solution acts on the substrate more on the bottom side in the processing tank, the degree of the etching process may be different between the upper half and the lower half of each substrate in the vertical posture.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing system and a substrate processing method capable of suppressing variations in processing for each substrate.

Means for Solving the Problems

[0007] In order to achieve such an object, the present invention has the following configuration. That is, a substrate processing system for processing a substrate according to the present invention includes a batch processing apparatus for processing a plurality of substrates collectively. The batch processing apparatus includes a first carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal posture is placed, a first posture conversion mechanism for converting the plurality of substrates between a horizontal posture and a vertical posture, a substrate handling mechanism for transporting the plurality of substrates between the carrier placed on the carrier mounting shelf and the first posture conversion mechanism, a processing tank for storing a chemical solution, a lifter capable of immersing the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical posture, a second posture conversion mechanism for rotating the plurality of substrates around a horizontal axis orthogonal to a central axis passing through the center of each substrate, a first batch transfer robot for transporting the plurality of substrates between the first posture conversion mechanism, the lifter, and the second posture conversion mechanism while holding the plurality of substrates in a vertical posture, and a control unit. The control unit: (1) controls the substrate handling mechanism to transport the plurality of substrates in a horizontal posture received from the carrier placed on the first carrier mounting shelf to the first posture conversion mechanism; (2) controls the first posture conversion mechanism to convert the plurality of substrates from a horizontal posture to a vertical posture; (3) controls the first batch transfer robot to transport the plurality of substrates converted to a vertical posture to the lifter; (4) controls the lifter to perform a first batch process of immersing the plurality of substrates in a vertical posture in the chemical solution in the processing tank; (5) controls the first batch transfer robot to transport the plurality of substrates on which the first batch process has been performed to the second posture conversion mechanism; (6) controls the second posture conversion mechanism to rotate the plurality of substrates on which the first batch process has been performed around the horizontal axis, thereby inverting the plurality of substrates in a vertical posture upside down; (7) controls the first batch transfer robot to transport the plurality of substrates inverted upside down in a vertical posture to the lifter; and (8) controls the lifter to perform a second batch process of immersing the plurality of substrates inverted upside down in a vertical posture in the chemical solution in the processing tank.

[0008] According to the substrate processing apparatus of the present invention, a first batch process and a second batch process of immersing a plurality of substrates in a chemical solution in a processing tank are performed. Here, the second posture conversion mechanism rotates the plurality of substrates on which the first batch process has been performed around a horizontal axis, thereby inverting the plurality of substrates in a vertical posture upside down. That is, between the first batch process and the second batch process, an operation of inverting the plurality of substrates in a vertical posture upside down is performed. Therefore, it is possible to suppress the processing variations that occur in the upper half and the lower half of each substrate.

[0009] Further, in the above-described substrate processing system, it is preferable that the second posture conversion mechanism has an inversion chuck that holds the plurality of substrates and rotates the inversion chuck around the horizontal axis. The operation of inverting the plurality of substrates in a vertical posture upside down is performed by rotating the inversion chuck that holds the plurality of substrates around the horizontal axis.

[0010] Further, in the above-described substrate processing system, the inversion chuck includes two chuck members having a plurality of pairs of holding grooves, the two chuck members are openable and closable along the horizontal axis, and each of the plurality of pairs of holding grooves is orthogonal to the direction in which the two chuck members open and close, and is a first support portion that stops the movement of one substrate to be accommodated in a predetermined direction among the substrate loading and unloading directions along the device surface of one substrate to be accommodated, and a second support portion that stops the movement of one substrate to be accommodated in the opposite direction of the predetermined direction. It is preferable to include.

[0011] In the inversion chuck, the first support portion and the second support portion of each pair of holding grooves stop the movement of one substrate in both directions of the substrate loading and unloading direction. Therefore, the operation of inverting the plurality of substrates in a vertical posture upside down can be easily performed.

[0012] Further, in the above-described substrate processing system, the system further includes a first horizontal substrate transfer robot having a first hand for holding one substrate in a horizontal posture and transferring the one substrate, and the control unit controls the second posture conversion mechanism to rotate the inversion chuck around the horizontal axis while holding the plurality of substrates by the inversion chuck, thereby converting the plurality of substrates that have undergone the first batch process from a vertical posture to a horizontal posture. By controlling the horizontal substrate transfer robot, a sorting operation is performed to rearrange the plurality of substrates converted to the horizontal posture within the inversion chuck so as to exchange the positions of the outer substrate and the inner substrate in the direction in which the plurality of substrates are arranged. By controlling the second posture conversion mechanism, while holding the plurality of substrates by the inversion chuck, the inversion chuck is further rotated around the horizontal axis to invert the plurality of substrates in the vertical posture when the first batch process was performed, so that it is preferable to convert the plurality of substrates on which the sorting operation has been performed from the horizontal posture to the vertical posture.

[0013] In addition to the operation of inverting the plurality of substrates in the vertical posture, a sorting operation is being performed. The sorting operation is an operation of rearranging the plurality of substrates converted to the horizontal posture within the inversion chuck so as to exchange the positions of the outer substrate and the inner substrate in the direction in which the plurality of substrates are arranged. Therefore, it is possible to suppress the processing variations that occur between the outer substrate and the inner substrate in the direction in which the plurality of substrates are arranged.

[0014] Also, in the above-described substrate processing system, in addition to the batch processing apparatus, it includes a single-wafer processing apparatus that processes the plurality of substrates one by one, and a relay apparatus that conveys the plurality of substrates from the batch processing apparatus to the single-wafer processing apparatus. The relay apparatus includes a first hand that holds a single substrate in a horizontal posture and a first horizontal substrate transfer robot that transfers the single substrate. The single-wafer processing apparatus includes a single-wafer processing chamber that performs single-wafer processing on the single substrate in a horizontal posture, a second carrier placement shelf on which the carrier is placed, a second hand that holds the single substrate in a horizontal posture, and a second horizontal substrate transfer robot that transfers the single substrate among the relay apparatus, the single-wafer processing chamber, and the carrier placed on the second carrier placement shelf. The control unit controls the first batch transfer robot to transfer the plurality of substrates on which the second batch processing has been performed to the second posture conversion mechanism, controls the second posture conversion mechanism to convert the plurality of substrates on which the second batch processing has been performed from a vertical posture to a horizontal posture, controls the first horizontal substrate transfer robot to transfer the single substrate converted to the horizontal posture from the second posture conversion mechanism to the single-wafer processing apparatus, controls the second horizontal substrate transfer robot to transfer the single substrate transferred by the first horizontal substrate transfer robot to the single-wafer processing chamber, controls the single-wafer processing chamber to perform the single-wafer processing on the single substrate, and preferably controls the second horizontal substrate transfer robot to transfer the single substrate that has undergone the single-wafer processing from the single-wafer processing chamber to the carrier placed on the second carrier placement shelf.

[0015] The substrate processing system includes a single-wafer processing apparatus and a relay apparatus in addition to the batch processing apparatus. A plurality of substrates on which the second batch processing has been performed are sent to the single-wafer processing apparatus via the relay apparatus. Here, in addition to the operation of inverting a plurality of substrates in the vertical posture upside down, the second posture conversion mechanism performs an operation of converting a plurality of substrates from the vertical posture to the horizontal posture. In other words, the second posture conversion mechanism performs an upside-down operation in addition to the operation of converting to the horizontal posture. Therefore, it is not necessary to separately provide a mechanism for converting to the horizontal posture and a mechanism for performing the upside-down operation, so that the configuration of the substrate processing system can be made compact.

[0016] Also, in the above-described substrate processing system, the control unit controls the substrate handling mechanism to convey the plurality of substrates in the horizontal posture received from the first carrier placed on the first carrier placement shelf to the first posture conversion mechanism, and also conveys a plurality of second substrates in the horizontal posture received from the second carrier placed on the first carrier placement shelf to the first posture conversion mechanism. By controlling the first posture conversion mechanism, a processed substrate group in which the plurality of substrates and the plurality of second substrates are alternately arranged is formed, and the processed substrate group is converted from the horizontal posture to the vertical posture. By controlling the first batch transfer robot, the processed substrate group in the vertical posture is conveyed to the lifter. By controlling the lifter, the first batch processing of immersing the processed substrate group in the chemical solution in the processing tank is performed. By controlling the first batch transfer robot, the processed substrate group on which the first batch processing has been performed is conveyed to the second posture conversion mechanism. By controlling the second posture conversion mechanism, the plurality of substrates among the processed substrate group on which the first batch processing has been performed are rotated around the horizontal axis, and the plurality of second substrates among the processed substrate group on which the first batch processing has been performed are rotated around the horizontal axis. Thereby, the plurality of substrates and the plurality of second substrates in the vertical posture are turned upside down. By controlling the first batch transfer robot, the processed substrate group in the vertical posture that has been turned upside down is conveyed to the lifter. By controlling the lifter, it is preferable to perform the second batch processing of immersing the processed substrate group in the vertical posture that has been turned upside down in the chemical solution in the processing tank.

[0017] The substrate processing system can suppress the processing variations occurring in the upper half and the lower half of each substrate in the processing substrate group by vertically inverting the processing substrate group in which a plurality of substrates and a plurality of second substrates are alternately arranged.

[0018] Also, in the above-described substrate processing system, the second posture conversion mechanism further includes a standby lifter that holds the processing substrate group in a vertical posture, and a second batch transfer robot that transfers the processing substrate group between the standby lifter and the inversion chuck. The control unit controls the first posture conversion mechanism to form a processing substrate group in which the plurality of substrates and the plurality of second substrates are alternately arranged and all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of second substrates face each other. Further, the control unit controls the second batch transfer robot to transfer the plurality of substrates that have been vertically inverted and the plurality of second substrates that have been vertically inverted to the standby lifter so that all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of second substrates face each other.

[0019] The processing substrate group is formed such that a plurality of substrates and a plurality of second substrates are alternately arranged and all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of second substrates face each other. Assume that after the processing substrate group is vertically inverted, in the direction in which the processing substrate group is arranged, the two device surfaces of the two substrates at both ends may not face the two device surfaces of the other two substrates. In this case, when batch processing is performed, for example, the amount of chemical solution flowing is different between the substrate whose device surfaces do not face each other and the two substrates whose device surfaces face each other. Therefore, there is a possibility of causing processing variations. Therefore, such processing variations can be prevented by making all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of second substrates face each other even after the processing substrate group is vertically inverted.

[0020] Also, in the above-described substrate processing system, the batch processing apparatus further includes a batch drying unit that collectively dries the plurality of substrates, and the first batch transfer robot holds the plurality of substrates in a vertical posture and transfers the plurality of substrates between the first posture conversion mechanism, the lifter, the second posture conversion mechanism, and the batch drying unit. The control unit controls the first batch transfer robot to transfer the plurality of substrates subjected to the second batch processing to the batch drying unit, and preferably controls the batch drying unit to collectively dry the plurality of substrates subjected to the second batch processing.

[0021] The substrate processing system does not send the plurality of substrates subjected to the second batch processing to the single-substrate processing apparatus, but can collectively dry the plurality of substrates subjected to the second batch processing using the batch drying unit.

[0022] Further, the substrate processing method according to the present invention is a substrate processing system including a batch processing apparatus for collectively processing a plurality of substrates, wherein the batch processing apparatus includes a carrier mounting shelf on which a carrier for storing a plurality of substrates in a horizontal posture is mounted, a first posture conversion mechanism for converting the plurality of substrates between a horizontal posture and a vertical posture, a substrate handling mechanism for transporting the plurality of substrates between the carrier mounted on the carrier mounting shelf and the first posture conversion mechanism, a processing tank for storing a chemical solution, a lifter capable of immersing the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical posture, and a first batch transfer robot for transporting the plurality of substrates while holding the plurality of substrates in a vertical posture. In the substrate processing method of the substrate processing system, a first substrate transfer step of transferring the plurality of substrates in a horizontal posture received from the carrier mounted on the first carrier mounting shelf to the first posture conversion mechanism by the substrate handling mechanism, a vertical posture conversion step of converting the plurality of substrates from a horizontal posture to a vertical posture by the first posture conversion mechanism, a second substrate transfer step of transferring the plurality of substrates converted to a vertical posture to the lifter by the first batch transfer robot, a first batch processing step of causing the lifter to perform a first batch process of immersing the plurality of substrates in a vertical posture in the chemical solution in the processing tank, a third substrate transfer step of transferring the plurality of substrates subjected to the first batch process to a second posture conversion mechanism by the first batch transfer robot, a vertical inversion step of rotating the plurality of substrates subjected to the first batch process around a horizontal axis orthogonal to a central axis passing through the center of each substrate, thereby inverting the plurality of substrates in a vertical posture upside down, a fourth substrate transfer step of transferring the plurality of substrates inverted upside down in a vertical posture to the lifter by the first batch transfer robot, and a second batch processing step of causing the lifter to perform a second batch process of immersing the plurality of substrates inverted upside down in a vertical posture in the chemical solution in the processing tank.

Effect of the Invention

[0023] According to the substrate processing system and the substrate processing method according to the present invention, variations in processing for each substrate can be suppressed.

Brief Description of the Drawings

[0024]

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Example 1

[0025] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the schematic configuration of the substrate processing system 1 according to Example 1.

[0026] In this specification, for the sake of convenience, the direction in which the transfer block 19 (described later) and the processing block 21 (described later) are arranged side by side is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, for example, the direction from the processing block 21 toward the transfer block 19 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0027] <1. Overall Configuration> Referring to FIG. 1, the substrate processing system 1 processes a substrate W. The substrate processing system 1 performs, for example, chemical solution processing, cleaning processing, drying processing, etc. on the substrate W. The substrate processing system 1 performs batch processing for collectively processing a plurality of (for example, 50 or 25) substrates W and single-wafer processing for processing a plurality of substrates W one by one. Therefore, the substrate processing system 1 is called a hybrid-type substrate processing system 1.

[0028] The substrate processing system 1 includes a stocker device 2, a batch processing device 3, a relay device 5, and a single-wafer processing device 7. The batch processing device 3 collectively processes a plurality of substrates W. The single-wafer processing device 7 processes a plurality of substrates W one by one. The single-wafer processing device 7 is arranged to the right of the batch processing device 3 and is arranged away from the batch processing device 3. The relay device 5 connects the batch processing device 3 and the single-wafer processing device 7.

[0029] <2. Stocker Device> The stocker device 2 houses at least one carrier C. The stocker device 2 is adjacent to the front of the batch processing device 3. The carrier C houses a plurality of (for example, 25) substrates W in a horizontal posture with a predetermined interval (for example, 10 mm) therebetween. Inside the carrier C, the plurality of substrates W are aligned in the vertical direction Z or the thickness direction of each substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited thereto.

[0030] The stocker device 2 includes a plurality (for example, two) of load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used for carrying the carrier C in and out. Further, the stocker device 2 includes at least one storage shelf 11 and a carrier transfer robot 13. The storage shelf 11 is a shelf for storing the carrier C. The carrier C is placed on the storage shelf 11.

[0031] The carrier transfer robot 13 transfers the carrier C among the two load ports 9, the storage shelf 11, and a placement shelf 17 (to be described later). The carrier transfer robot 13 includes a gripping portion 15 that grips, for example, a protrusion provided on the upper surface of the carrier C. The carrier transfer robot 13 can move the gripping portion 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transfer robot 13 is driven by one or more electric motors. Note that the carrier transfer robot 13 may be a movable support portion that supports the lower surface of the carrier C.

[0032] <3. Batch Processing Device> The batch processing device 3 includes a placement shelf 17, a transfer block 19, a processing block 21, and a batch transfer area R1. The placement shelf 17 is adjacent to the front of the transfer block 19. The processing block 21 is arranged behind the transfer block 19 via an attitude conversion area R2 (to be described later). The batch transfer area R1 extends rearward from the transfer block 19. The batch transfer area R1 is adjacent to the left of the transfer block 19, the processing block 21, and the attitude conversion area R2.

[0033] <3-1. Transfer Block> The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first attitude conversion mechanism 23. The substrate handling mechanism HTR is provided behind the placement shelf 17. The substrate handling mechanism HTR transfers a plurality (for example, 25) of substrates W in a horizontal attitude between the carrier C placed on the placement shelf 17 and the first attitude conversion mechanism 23.

[0034] Refer to FIGS. 2(a) to 2(c). The substrate handling mechanism HTR includes a plurality (e.g., 25) of hands 25. Each hand 25 holds one substrate W. In FIGS. 2(a) to 2(c), for the sake of illustration, the substrate handling mechanism HTR is assumed to include three hands 25. Also, a pair of horizontal holding portions 31B and a pair of vertical holding portions 31C, which will be described later, are assumed to hold three substrates W. Further, a pusher 33A, which will be described later, is assumed to support six substrates W.

[0035] The substrate handling mechanism HTR further includes a hand support portion 26, a forward and backward movement portion 27, and a lifting and rotating portion 29. The hand support portion 26 supports a plurality of hands 25. The forward and backward movement portion 27 moves a plurality of hands 25 forward and backward via the hand support portion 26. The lifting and rotating portion 29 rotates the forward and backward movement portion 27 around the vertical axis AX1 to change the orientation of the hands 25. The lifting and rotating portion 29 is fixed to the floor surface. Note that the forward and backward movement portion 27 and the lifting and rotating portion 29 each include an electric motor. Also, the substrate handling mechanism HTR may include, separately from the hands 25, a movable hand (not shown) for transporting only one substrate W.

[0036] The first posture conversion mechanism 23 includes a posture conversion portion 31 and a pusher mechanism 33. The substrate handling mechanism HTR, the posture conversion portion 31, and the pusher mechanism 33 are arranged to the left in this order.

[0037] The posture conversion unit 31 converts a plurality of (for example, 25) substrates W between a horizontal posture and a vertical posture. For example, the posture conversion unit 31 converts a plurality of substrates W received from the substrate handling mechanism HTR from a horizontal posture to a vertical posture. As shown in Fig. 2(a), the posture conversion unit 31 includes a support base 31A, a pair of horizontal holding parts 31B, a pair of vertical holding parts 31C, and a rotation drive part 31D. The pair of horizontal holding parts 31B and the pair of vertical holding parts 31C are provided on the support base 31A. When the substrate W is in the horizontal posture, the pair of horizontal holding parts 31B support the substrate W from below while contacting the lower surface of each substrate W. Also, when the substrate W is in the vertical posture, the pair of vertical holding parts 31C hold the substrate W. The rotation drive part 31D rotates the support base 31A around the horizontal axis AX2.

[0038] As shown in Fig. 2(c), the pusher mechanism 33 includes a pusher 33A, a lifting and rotating part 33B, a horizontal moving part 33C, and a rail 33D. The pusher 33A holds the lower part of each of a plurality of (for example, 25 or 50) substrates W converted to the vertical posture by the posture conversion unit 31. The lifting and rotating part 33B moves the pusher 33A up and down in the vertical direction Z. Also, the lifting and rotating part 33B rotates the pusher 33A around the vertical axis AX3. Thereby, the orientation of the device surface of the substrate W indicated by the arrow AR1 can be set in an arbitrary direction.

[0039] The horizontal moving part 33C moves the pusher 33A and the lifting and rotating part 33B horizontally along the rail 33D. The rail 33D extends in the width direction Y. Note that the rotation drive part 31D, the lifting and rotating part 33B, and the horizontal moving part 33C each include an electric motor.

[0040] Here, the operation of the first posture conversion mechanism 23 will be described. For example, the four batch processing tanks BT1 to BT4, which will be described later in the processing block 21, each process 50 substrates W corresponding to two carriers C at once. Therefore, while converting the postures of the 50 substrates W (W1, W2) in batches of 25, the pusher 33A holds the 50 substrates W. The 25 substrates W1 are called the first substrate group. The 25 substrates W2 are called the second substrate group. The 50 substrates W (W1, W2) are called the processing substrate group. When the substrates W1 and W2 are not particularly distinguished, the substrates W1 and W2 are described as the substrate W.

[0041] Refer to FIG. 2(a). The posture conversion unit 31 receives 25 substrates W1 from the substrate handling mechanism HTR. At this time, the 25 substrates W1 are in a horizontal posture and are aligned at a full pitch (for example, at intervals of 10 mm). The full pitch is also called the normal pitch. Also, the device surface of each substrate W1 faces upward. The device surface of the substrate W is the surface on which the electronic circuit is formed and includes the surface on which the electronic circuit is being formed. The device surface is also called the "front surface" or the "main surface". Also, the back surface of the substrate W refers to the surface on which no electronic circuit is formed. The surface opposite to the device surface is the back surface.

[0042] Refer to FIG. 2(b). The rotation drive unit 31D of the posture conversion unit 31 rotates a pair of horizontal holding units 31B, etc. by 90 degrees around the horizontal axis AX2 to convert the 25 substrates W1 from the horizontal posture to the vertical posture. Then, the pusher mechanism 33 raises the pusher 33A to receive the 25 substrates W1 from the posture conversion unit 31. Then, the pusher mechanism 33 rotates the pusher 33A by 180 degrees around the vertical axis AX3. Thereby, the orientation of the 25 substrates W1 is changed from left to right.

[0043] Thereafter, the posture conversion unit 31 receives 25 substrates W2 from the substrate handling mechanism HTR and converts the 25 substrates W2 from the horizontal posture to the vertical posture. Then, the pusher mechanism 33 raises the pusher 33A that holds the 25 substrates W1. As a result, the pusher 33A further receives the 25 substrates W2.

[0044] Refer to FIG. 2(c). The pusher 33A holds 50 substrates W (W1, W2). Twenty-five substrates W1 and twenty-five substrates W2 are alternately arranged. The 50 substrates W are aligned at a half pitch (for example, at an interval of 5 mm). Note that the half pitch is an interval that is half of the full pitch. Also, the 50 substrates W are arranged in a face-to-face manner. Therefore, the two device surfaces (or two back surfaces) of two adjacent substrates W1 and W2 face each other. Thereafter, the pusher mechanism 33 moves the pusher 33A that holds the 50 substrates W along the rail 33D to the substrate transfer position PP below the chuck 37 (described later) of the batch transfer robot WTR1 (described later).

[0045] Note that the posture conversion unit 31 of the first posture conversion mechanism 23 cannot invert a plurality of substrates W in the vertical posture. Also, the mounting shelf 17 corresponds to the first carrier mounting shelf of the present invention.

[0046] <3-2. Processing block> The processing block 21 includes a plurality (for example, four) of batch processing tanks BT1 to BT4 and a batch drying unit 35. The four batch processing tanks BT1 to BT4 are arranged side by side in the front-rear direction X in which the batch processing apparatus 3 extends. Each of the four batch processing tanks BT1 to BT4 immerses a plurality of (for example, 25 or 50) substrates W in a batch. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical solution or pure water) for immersing a plurality of substrates W.

[0047] The four batch processing tanks BT1 to BT4 are composed of, for example, two chemical solution processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. One set consists of the chemical solution processing tank BT1 and the cleaning processing tank BT2, and the other set consists of the chemical solution processing tank BT3 and the cleaning processing tank BT4. Note that the combination of the chemical solution processing tank and the cleaning processing tank is not limited to this example. Also, the number of batch processing tanks is not limited to four and may be one or more.

[0048] The two chemical liquid treatment tanks BT1 and BT3 each perform an etching process with a chemical liquid. For example, a phosphoric acid solution is used as the chemical liquid. The chemical liquid is heated to a preset temperature. At the bottom inside each of the chemical liquid treatment tanks BT1 and BT3, a chemical liquid ejection pipe (not shown) is provided. The chemical liquid treatment tanks BT1 and BT3 each store the chemical liquid supplied from the chemical liquid ejection pipe. Also, a gas supply pipe (not shown) may be provided at the bottom inside each of the chemical liquid treatment tanks BT1 and BT3. The gas supply pipe supplies, for example, a bubbly inert gas (e.g., nitrogen gas) into the chemical liquid in the chemical liquid treatment tank BT1. For example, when a plurality of substrates W are immersed in the chemical liquid in the chemical liquid treatment tank BT1, at least one of supplying the chemical liquid from the chemical liquid supply pipe and supplying the bubbly inert gas from the gas supply pipe may be performed to circulate the chemical liquid.

[0049] The two cleaning treatment tanks BT2 and BT4 each perform a cleaning process of washing away the chemical liquid adhering to a plurality of substrates W with a cleaning liquid (rinse liquid). As the cleaning liquid, for example, pure water such as deionized water (DIW) is used. The cleaning treatment tanks BT2 and BT4 each store the pure water supplied from a pure water ejection pipe (not shown).

[0050] Four batch treatment tanks BT1 to BT4 are each provided with four lifters LF1 to LF4. For example, the lifter LF1 includes a plurality (e.g., 50) of holding grooves (not shown) arranged in the width direction Y. The lifter LF1 holds, for example, 50 substrates W in a vertical posture aligned at a half pitch (e.g., 5 mm intervals) at predetermined intervals with 50 holding grooves. Note that the lifter LF1 may include 51 or more holding grooves to hold 50 substrates W.

[0051] The lifter LF1 can immerse 50 substrates W in the chemical liquid in the batch treatment tank BT1 while holding the 50 substrates W in a vertical posture. The lifter LF1 raises and lowers a plurality of substrates W between the processing position inside the batch treatment tank BT1 and the delivery position above the batch treatment tank BT1. The other three lifters LF2 to LF4 are also configured in the same manner as the lifter LF1.

[0052] The batch drying unit 35 dries a plurality of substrates W collectively. The batch drying unit 35 is used, for example, when the single-wafer processing apparatus 7 cannot be used. The batch drying unit 35 is provided in front of the four batch processing tanks BT1 to BT4. That is, the batch drying unit 35 is provided between the transfer block 19 and the four batch processing tanks BT1 to BT4. The batch drying unit 35 includes a lifter LF7.

[0053] <3-3. Batch Transfer Region> The batch transfer region R1 includes a batch transfer robot WTR1. The batch transfer robot WTR1 transfers a plurality of substrates W in a vertical posture between the first posture conversion mechanism 23 (including the pusher mechanism 33), the four lifters LF1 to LF4, the relay device 5 (the second posture conversion mechanism 43 described later), and the lifter LF7 of the batch drying unit 35 while holding the plurality of substrates W in a vertical posture.

[0054] The substrate transfer position PP, the four lifters LF1 to LF4, the lifter LF7 of the batch drying unit 35, and the standby lifter LF9 (described later) are aligned in a row in the front-rear direction X. Therefore, the batch transfer robot WTR1 transfers a plurality of substrates W in a vertical posture in the front-rear direction X.

[0055] The batch transfer robot WTR1 includes a chuck 37 and a guide rail 39. The chuck 37 includes two chuck members 41 and 42. The two chuck members 41 and 42 each include, for example, 50 pairs of holding grooves for holding 50 substrates W. Therefore, the first chuck member 41 includes 50 holding grooves, and the second chuck member 42 includes 50 holding grooves. Note that the two chuck members 41 and 42 may each include 51 pairs or more of holding grooves for holding 50 substrates W. The two chuck members 41 and 42 each extend in the width direction Y. The batch transfer robot WTR1 opens and closes the two chuck members 41 and 42. The guide rail 39 extends in the front-rear direction X. The batch transfer robot WTR1 moves the chuck 37 along the guide rail 39. The batch transfer robot WTR1 is driven by an electric motor.

[0056] <4. Relay Device (Interface Device)> The outline of the relay device 5 will be described. The relay device 5 reverses the top and bottom of a plurality of substrates W in a vertical posture that have undergone the first batch process in either of the two chemical solution treatment tanks BT1 and BT3. Further, the relay device 5 converts a plurality of substrates W that have undergone the second batch process in either of the two chemical solution treatment tanks BT1 and BT3 from a vertical posture to a horizontal posture. The relay device 5 transports, for example, a plurality of substrates W converted to a horizontal posture to the single-wafer processing device 7. That is, the relay device 5 transports a plurality of substrates W that have undergone the second batch process (chemical solution treatment and pure water washing process) from the batch processing device 3 to the single-wafer processing device 7.

[0057] The details of the relay device 5 will be described. As shown in FIG. 1, the relay device 5 includes an attitude conversion region R2 and a relay region R3 arranged in the width direction Y. The relay region R3 extends to the right from the attitude conversion region R2. In the front-rear direction X, the attitude conversion region R2 is arranged between the first attitude conversion mechanism 23 of the transfer block 19 and the four batch processing tanks BT1 to BT4 of the processing block 21. Also, the left side portion of the relay region R3 is arranged between the transfer block 19 and the processing block 21.

[0058] <4-1. Second Attitude Conversion Mechanism> A second attitude conversion mechanism 43 is provided in the attitude conversion region R2. The second attitude conversion mechanism 43 rotates a plurality of substrates W around a horizontal axis AX orthogonal to the central axis CA passing through the center of each substrate W. In other words, the second attitude conversion mechanism 43 rotates a plurality of substrates W around a horizontal axis AX extending along the device surface (front surface or main surface) of each substrate W of the plurality of substrates W. Thereby, the second attitude conversion mechanism 43 has two functions. The first function is to reverse the top and bottom of a plurality of substrates W in a vertical posture. The second function is to convert a plurality of substrates W from a vertical posture to a horizontal posture.

[0059] The second posture conversion mechanism 43 includes a standby tank 45, a standby lifter LF9, a posture conversion tank 47, a posture conversion unit 49, and a second batch transfer robot WTR2. FIGS. 3(a) and 3(b) are plan views of the standby tank 45, the standby lifter LF9, and the batch transfer robot WTR2. In FIGS. 3(a) and 3(b), two chuck members 95 and 96 of the batch transfer robot WTR2, which will be described later, are shown in a cross-sectional view. Also, in FIGS. 3(a) and 3(b), for the convenience of illustration, the lifter LF9 holds six substrates W.

[0060] The standby tank 45 stores a dipping liquid for dipping a plurality of substrates W. As the dipping liquid, pure water (for example, DIW) is used. The pure water is supplied from a pure water ejection pipe (not shown).

[0061] The standby lifter LF9 receives a plurality of substrates W from the batch transfer robot WTR1 and holds the plurality of substrates W in a vertical posture. The standby lifter LF9 includes a plurality of (for example, three) support members 51 extending in the width direction Y. Each of the plurality of support members 51 is provided with a plurality of holding grooves MZ for holding a plurality of substrates W. The number of the holding grooves MZ is set to be larger than the number of substrates W to be processed collectively in the batch processing tanks BT1 to BT4. In this case, the number of substrates W is the number when there is no missing part in the row of the substrates W. For example, when 50 substrates W without missing parts are processed collectively in the batch processing tanks BT1 to BT4, the number of the holding grooves MZ is 51 or more.

[0062] FIG. 4 is a longitudinal sectional view seen from the front of the posture conversion tank 47 and the posture conversion unit 49. FIG. 5(a) is a front view showing a state where the inverted chuck 53 in the open state supports a plurality of substrates W in a horizontal posture. In FIG. 5(a), for the convenience of illustration, the inverted chuck 53 supports three substrates W. FIG. 5(b) is a cross-sectional view showing a state where a pair of holding grooves 57 and 58 of the inverted chuck 53 in the open state supports one substrate W in a horizontal posture.

[0063] Refer to FIG. 4. The posture conversion tank 47 stores the immersion liquid for immersing a plurality of substrates W. As the immersion liquid, pure water (for example, DIW) is used. The pure water is supplied from a pure water ejection pipe (not shown). Note that the posture conversion tank 47 may store a different type of immersion liquid from the standby tank 45.

[0064] The posture conversion unit 49 includes a reversing chuck 53 that holds a plurality of (for example, 25) substrates W. The posture conversion unit 49 rotates the reversing chuck 53 around the horizontal axis AX4. The reversing chuck 53 includes two chuck members 55 and 56. The two chuck members 55 and 56 are openable and closable along the horizontal axis AX4. The two chuck members 55 and 56 include a plurality of pairs (for example, 25 pairs) of holding grooves 57 and 58 as shown in FIG. 5(a). That is, the first chuck member 55 is provided with a plurality of (for example, 25) holding grooves 57. Also, the second chuck member 56 is provided with a plurality of (for example, 25) holding grooves 58. Each pair of holding grooves 57 and 58 faces each other.

[0065] Each of the holding grooves 57 and 58 is formed in a V shape so that the depth becomes narrower in the thickness direction of the substrate W. Also, each of the holding grooves 57 and 58 is formed in an arc shape in the direction along the device surface of the substrate W. The arc shape is a shape along the outer edge of the substrate W.

[0066] The direction DR1 shown in FIG. 5(b) is orthogonal to the direction in which the two chuck members 55 and 56 open and close, and is the direction along the device surface of one substrate W to be accommodated. The direction DR1 is called the substrate loading and unloading direction. The direction DR1 is the direction when one substrate W is accommodated in each pair of holding grooves 57 and 58 or one substrate W is taken out when the two chuck members 55 and 56 are in the open state. Each of the plurality of pairs of holding grooves 57 and 58 includes a first support portion SU1 that stops the movement of one substrate W accommodated in a predetermined direction in the direction DR1 and a second support portion SU2 that stops the movement of one substrate W accommodated in the opposite direction of the predetermined direction.

[0067] The posture conversion unit 49 includes a drive mechanism 61 in addition to the inversion chuck 53. The drive mechanism 61 includes rotating parts 63A, 63B, opening / closing parts 65A, 65B, and lifting parts 67A, 67B. The rotating parts 63A, 63B rotate the inversion chuck 53 around the horizontal axis AX4. The opening / closing parts 65A, 65B open and close the inversion chuck 53 along the horizontal axis AX4. The lifting parts 67A, 67B lift and lower the inversion chuck 53 in the vertical direction Z.

[0068] The rotating part 63A, the opening / closing part 65A, and the lifting part 67A drive the first chuck member 55. In contrast, the rotating part 63B, the opening / closing part 65B, and the lifting part 67B drive the second chuck member 56. The rotating part 63A, the opening / closing part 65A, and the lifting part 67A are configured substantially the same as the rotating part 63B, the opening / closing part 65B, and the lifting part 67B. Therefore, the rotating part 63A, the opening / closing part 65A, and the lifting part 67A will be described as representatives.

[0069] The rotating part 63A includes an arm member 69, a rotating shaft 71, a pulley 73, an electric motor 75, a pulley 77, a belt 79, and a case 80.

[0070] The arm member 69 rotatably supports the chuck member 55 around the horizontal axis AX4. The arm member 69 includes a vertical portion 69L extending in the vertical direction Z and a horizontal member 69U extending in the horizontal direction (front-rear direction X) from the upper end of the vertical member 69L. A pulley 73 is connected to the back surface of the chuck member 55 via the rotating shaft 71. Therefore, the rotating shaft 71 extends in the front-rear direction X. The rotating shaft 71 penetrates the vertical portion 69L of the arm member 69.

[0071] An electric motor 75 is provided on the upper surface of the horizontal member 69U of the arm member 69. A pulley 77 is connected to the output shaft of the electric motor 75. A belt 79 is looped around the two pulleys 73 and 77. When the electric motor 75 rotates the pulley 77 around the horizontal axis AX5, the pulley 73 and the chuck member 55 are rotated around the horizontal axis AX4. The horizontal axis AX5 extends in the front-rear direction X. Note that the case 80 is configured such that immersion liquid does not enter the case 80 when it is immersed in the immersion liquid in the posture conversion tank 47.

[0072] The opening / closing part 65A includes a guide rail 81, an opening / closing drive part 83, and a moving piece 85. The guide rail 81 and the opening / closing drive part 83 are provided on the upper surface of a lifting / lowering member 87 described later. The guide rail 81 extends in the front-rear direction X, which is the direction in which the two chuck members 55 and 56 open and close. The horizontal member 69U of the arm member 69 is connected to the lifting / lowering member 87 via the guide rail 81 and is movable in the front-rear direction X along the guide rail 81.

[0073] The opening / closing drive part 83 includes, for example, an air cylinder, but may include an electric motor. The opening / closing drive part 83 moves the moving piece 85 in the front-rear direction X. The moving piece 85 is fixed to the horizontal member 69U. Thereby, when the opening / closing drive part 83 pushes out the moving piece 85, the chuck member 55 is pushed out toward the substrate W side via the arm member 69. Also, when the opening / closing drive part 83 pulls the moving piece 85, the chuck member 55 moves away from the substrate W via the arm member 69.

[0074] The lifting / lowering part 67A includes a lifting / lowering member 87 and a lifting / lowering drive part 89. The lifting / lowering drive part 89 raises and lowers the lifting / lowering member 87 in the vertical direction Z. The lifting / lowering drive part 89 includes, for example, an electric motor, a screw shaft, a guide rail, and a slider (none of which are shown). The lifting / lowering drive part 89 may include an air cylinder instead of an electric motor or the like.

[0075] Refer to FIGS. 3(a) and 3(b). The second batch transfer robot WTR2 transfers a plurality of (for example, 25) substrates W between the standby lifter LF9 and the inversion chuck 53 of the posture conversion unit 49. For example, it is assumed that the standby lifter LF9 holds 50 substrates W (W1, W2) in which 25 substrates W1 and 25 substrates W2 are alternately arranged. The second batch transfer robot WTR2 can selectively extract, for example, one of 25 substrates W1 and 25 substrates W2 from 50 substrates W.

[0076] The second batch transfer robot WTR2 includes an extraction chuck 91 and a drive mechanism 93. The extraction chuck 91 is movable in the width direction Y and can be opened and closed. The extraction chuck 91 includes a pair of chuck members 95, 96. The pair of chuck members 95, 96 includes a plurality of pairs (for example, 25 pairs) of holding grooves 97, 98 and a plurality of pairs (for example, 26 pairs) of passing grooves 101, 102. The 25 pairs of holding grooves 97, 98 and the 26 pairs of passing grooves 101, 102 are alternately arranged.

[0077] That is, the first chuck member 95 is provided with 25 holding grooves 97 and 26 passing grooves 101 that are alternately arranged. The second chuck member 96 is provided with 25 holding grooves 98 and 26 passing grooves 102 that are alternately arranged. Each pair of holding grooves 97, 98 faces each other, and each pair of passing grooves 101, 102 faces each other.

[0078] The drive mechanism 93 moves the extraction chuck 91 in the width direction Y. The drive mechanism 93 opens and closes the extraction chuck 91 by moving the two chuck members 95, 96 in the front-rear direction X. Note that FIG. 3(a) shows the closed state of the extraction chuck 91, and FIG. 3(b) shows the open state of the extraction chuck 91. When the extraction chuck 91 is in the open state, the two chuck members 95, 96 are opened wider than the diameter of each substrate W. The drive mechanism 93 includes, for example, at least one of an electric motor and an air cylinder.

[0079] <4-2. Relay Transfer Robot> Refer to FIG. 1. In the relay area R3, a substrate transfer robot 105 and a substrate placement unit PS1 are provided. The substrate transfer robot 105 uses a relay hand 111 to transfer a plurality of substrates W that have been converted to a horizontal posture by the second posture conversion mechanism 43. The relay area R3 is shielded from the external atmosphere by a housing 109.

[0080] The substrate transfer robot 105 includes a relay hand 111, a forward and backward movement unit 113, a rotation unit 115, and a horizontal movement unit 117. Note that the substrate transfer robot 105 corresponds to the first horizontal substrate transfer robot of the present invention. The relay hand 111 corresponds to the hand of the present invention.

[0081] The relay hand 111 holds one substrate W in a horizontal posture and is movable. The forward and backward movement unit 113 moves the relay hand 111 forward and backward. The rotation unit 115 rotates the relay hand 111 and the forward and backward movement unit 113 around a vertical axis AX6 set in this rotation unit 115. The horizontal movement unit 117 moves the relay hand 111, the forward and backward movement unit 113, and the rotation unit 115 in the width direction Y. The forward and backward movement unit 113, the rotation unit 115, and the horizontal movement unit 117 are each driven by an electric motor. The substrate placement unit PS1 can place one or more substrates W.

[0082] <5 - Sheet Processing Apparatus> Refer to FIG. 1. The sheet - by - sheet processing apparatus 7 performs predetermined sheet - by - sheet processing on a plurality of substrates W received from the relay apparatus 5 one by one, and conveys the plurality of substrates W on which the sheet - by - sheet processing has been performed to a carrier C placed on any one of four placement shelves 125.

[0083] The sheet - by - sheet processing apparatus 7 includes an index block 121 and a processing block 123. The index block 121 includes a plurality (for example, four) of placement shelves 125 and an index robot IR. The four placement shelves 125 are arranged in the width direction Y. The four placement shelves 125 are arranged in front of the index robot IR. A carrier C is placed on each placement shelf 125.

[0084] The indexer robot IR includes a hand 127, an articulated arm 129, and a lift table 131. The hand 127 holds a single substrate W in a horizontal posture. The articulated arm 129 is composed of, for example, a scalar type robot arm. The base end portion of the articulated arm 129 is attached to the lift table 131. Also, the tip end portion of the articulated arm 129 connects to the hand 127.

[0085] The indexer robot IR conveys the substrate W between four carriers C placed on each of the four placement shelves 125 and a substrate placement portion PS2 described later. For example, the indexer robot IR receives the substrate W from the substrate placement portion PS2 described later and conveys the substrate W to a carrier C placed on any one of the four placement shelves 125.

[0086] Note that the indexer robot corresponds to the second horizontal substrate transfer robot of the present invention. The hand 127 corresponds to the second hand of the present invention. The placement shelf 127 corresponds to the second carrier placement shelf of the present invention.

[0087] The processing block 123 is adjacent to the rear of the index block 121. The processing block 123 includes a substrate transfer region R4 and, for example, four towers TW1 to TW4. The substrate transfer region R4 extends rearward from the index block 121. That is, the substrate transfer region R4 extends in the front-rear direction X. The four towers TW1 to TW4 are provided along the substrate transfer region R4. Two towers TW1 and TW2 are arranged to face two towers TW3 and TW4 via the substrate transfer region R4. The tower TW2 is provided behind the tower TW1. The tower TW4 is provided behind the tower TW3.

[0088] Tower TW1 includes three single-wafer processing chambers SW1 arranged in the vertical direction Z. Tower TW3 includes two single-wafer processing chambers SW1 arranged in the vertical direction Z. In tower TW3, between the two single-wafer processing chambers SW1, the substrate mounting portion PS1 of the relay device 5 is arranged. The two towers TW2 and TW4 each include three single-wafer processing chambers SW2 arranged in the vertical direction Z. Each of the 11 single-wafer processing chambers SW1 and SW2 processes one substrate W in a horizontal posture.

[0089] Note that the number of the single-wafer processing chambers SW1 and SW2 is not limited to 11. Also, the number of the single-wafer processing chambers SW1 is not limited to 5 and may be one or more. Further, the number of the single-wafer processing chambers SW2 is not limited to 6 and may be one or more.

[0090] The single-wafer processing chamber SW1 includes, for example, a holding and rotating portion 141 and a nozzle 143. The holding and rotating portion 141 includes a spin chuck that holds one substrate W in a horizontal posture and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 143 supplies a processing liquid onto the substrate W held by the holding and rotating portion 141. As the processing liquid, for example, pure water (e.g., DIW) and IPA (isopropyl alcohol) are used. The single-wafer processing chamber SW1, for example, performs a cleaning process on the substrate W with pure water and then forms a liquid film of IPA on the upper surface of the substrate W.

[0091] Each of the single-wafer processing chambers SW2 performs a drying process using a supercritical fluid. As the fluid, for example, carbon dioxide is used. When the fluid is carbon dioxide, the supercritical state is obtained when the critical temperature is 31°C and the critical pressure is 7.38 MPa. By performing the drying process using a supercritical fluid, it is possible to make it difficult for pattern collapse to occur in the substrate W.

[0092] The second wafer processing chamber SW2 includes a chamber body (container) 145, a support tray 147, and a lid. The chamber body 145 includes a processing space provided inside, an opening for placing the substrate W in this processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray 147. The lid closes the opening of the chamber body 145. For example, each wafer processing chamber SW2 makes a fluid reach a supercritical state and supplies a supercritical fluid from the supply port to the processing space inside the chamber body 145. Drying processing for one substrate W is performed by the supercritical fluid supplied to the processing space.

[0093] In the substrate transfer region R4, a center robot CR and a substrate placement unit PS2 are provided. The substrate placement unit PS2 is arranged between the index robot IR and the center robot CR. One or more substrates W are placed on the substrate placement unit PS2.

[0094] The center robot CR includes, for example, two hands 151, a forward and backward movement unit 153, and a lifting and rotating unit 155. Each of the two hands 151 holds one substrate W in a horizontal posture. The forward and backward movement unit 153 moves the two hands 151 forward and backward individually. The lifting and rotating unit 155 moves the two hands 151 and the forward and backward movement unit 153 up and down. Further, the lifting and rotating unit 155 rotates the two hands 151 and the forward and backward movement unit 153 around the vertical axis AX7 in order to change the direction of the two hands 151.

[0095] The center robot CR transports one substrate W in a horizontal posture, for example, between the substrate placement units PS1, PS2 and the 11 wafer processing chambers SW1, SW2. For example, the center robot CR receives one substrate transported by the substrate transfer robot 105 of the relay device 5, and transports the received one substrate W to any one of the five wafer processing chambers SW1.

[0096] <6. Control Unit> The substrate processing system 1 includes a control unit 180 (see FIG. 1) and a storage unit (not shown). The control unit 180 controls each component of the substrate processing system 1. That is, the control unit 180 controls each component of the batch processing apparatus 3, the relay apparatus 5, and the single-wafer processing apparatus 7. The control unit 180 includes one or more processors such as a central processing unit (CPU). The storage unit includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs necessary for controlling each component of the substrate processing system 1.

[0097] <7. Operation of Substrate Processing System> Next, the operation of the substrate processing system 1 will be described with reference to the flowchart of FIG. 6.

[0098] 〔Step S01〕Taking out the substrate from the carrier Refer to FIG. 1. An external transfer robot (not shown) transfers two carriers C to the load port 9. The carrier transfer robot 13 of the stocker apparatus 2 transfers the first carrier C from the load port 9 to the placement shelf 17. At this time, 25 substrates W1 before processing are stored in the first carrier C. Note that the external transfer robot transfers the carrier C along the transfer path RT shown in FIG. 1.

[0099] Thereafter, the substrate handling mechanism HTR of the batch processing apparatus 3 transfers 25 substrates W1 (first substrate group) in a horizontal posture received from the first carrier C placed on the placement shelf 17 to the posture conversion unit 31 of the first posture conversion mechanism 23. That is, the substrate handling mechanism HTR takes out 25 substrates W1 from the first carrier C placed on the placement shelf 17 and transfers the taken-out 25 substrates W1 to the posture conversion unit 31 in a horizontal posture.

[0100] After that, the carrier transfer robot 13 transfers the first carrier C (empty carrier) from which 25 substrates W1 have been taken out from the placement shelf 17 to the load port 9. After that, the carrier transfer robot 13 transfers the second carrier C from the load port 9 to the placement shelf 17. At this time, 25 substrates W2 before processing are stored in the second carrier C. After that, the substrate handling mechanism HTR transfers the 25 substrates W2 (second substrate group) in a horizontal posture received from the second carrier C placed on the placement shelf 17 to the posture conversion unit 31 of the first posture conversion mechanism 23.

[0101] After that, the carrier transfer robot 13 transfers the second carrier C (empty carrier) from which 25 substrates W2 have been taken out from the placement shelf 17 to the load port 9. The external transfer robot transfers two carriers C (two empty carriers) in order from the load port 9 to any one of the four placement shelves 125 of the single wafer processing apparatus 7.

[0102] 〔Step S02〕Vertical Posture Conversion The first posture conversion mechanism 23 forms 50 substrates W1, W2 (processing substrate group) in which 25 substrates W1 and 25 substrates W2 are alternately arranged, and all the device surfaces of the 25 substrates W1 and all the device surfaces of the 25 substrates W2 face each other. Further, the first posture conversion mechanism 23 converts the 50 substrates W1, W2 from a horizontal posture to a vertical posture. The 50 substrates W1, W2 are hereinafter appropriately referred to as "50 substrates W".

[0103] Specifically, as shown in FIGS. 2(a) to 2(c), the posture conversion unit 31 converts 25 substrates W1 from a horizontal posture to a vertical posture, and also converts 25 substrates W2 from a horizontal posture to a vertical posture. Further, the pusher 33A of the pusher mechanism 33 holds 50 substrates W in which 25 substrates W1 and 25 substrates W2 are alternately arranged in a vertical posture. After that, the pusher mechanism 33 transfers 50 substrates W to the substrate transfer position PP.

[0104] 〔Step S03〕Batch Processing In this embodiment, the batch process (chemical solution process) performed on 50 substrates W all at once is divided into two times, the first half and the second half. Further, between the first batch process and the second batch process, a vertical inversion operation is performed on the 50 substrates W. Thereby, the variation in the process on each substrate W that appears in the upper half and the lower half of each substrate is suppressed. The vertical inversion operation is performed separately on 25 substrates W1 and 25 substrates W2.

[0105] Next, with reference to FIGS. 7 and 8, the specific operation of the batch process in step S03 will be described. Steps S13 to S17 shown in FIG. 7 are descriptions of the operations on 25 substrates W1 that are the first substrate group. Also, steps S18 to S22 shown in FIG. 8 are descriptions of the operations on 25 substrates W2 that are the second substrate group. Incidentally, for example, the black triangular mark shown in FIG. 9(a) indicates the device surface (front surface or main surface) of the substrate W and its orientation.

[0106] 〔Step S11〕First batch process The batch transfer robot WTR1 receives 50 substrates W in a vertical posture from the pusher mechanism 33 at the substrate transfer position PP, and transfers the 50 substrates W to one of the two lifters LF1 and LF3 of the two chemical solution treatment tanks BT1 and BT3.

[0107] For example, the batch transfer robot WTR1 transfers 50 substrates W (processing substrate group) in a vertical posture to the lifter LF1. The lifter LF1 receives 50 substrates W at a position above the chemical solution treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the phosphoric acid solution that is the chemical solution in the chemical solution treatment tank BT1. Thereby, the first batch process (etching process) is performed. The first batch process is performed until a time that is half of the normal processing time (for example, 2 hours) has elapsed. After the first batch process, the lifter LF1 pulls up the 50 substrates W from the phosphoric acid solution in the chemical solution treatment tank BT1. Incidentally, when the 50 substrates W are transferred to the lifter LF3 of the other chemical solution treatment tank BT3, the same process as that of the chemical solution treatment tank BT1 is performed.

[0108] Thereafter, the batch transfer robot WTR1 receives, for example, 50 substrates W in a vertical posture from the lifter LF1 and transfers the 50 substrates W to the lifter LF2 of the cleaning treatment tank BT2. The lifter LF2 receives the 50 substrates W at a position above the cleaning treatment tank BT2. The lifter LF2 immerses the 50 substrates W in pure water in the cleaning treatment tank BT2. Thereby, the cleaning treatment (batch treatment) is performed.

[0109] In addition, when the batch transfer robot WTR1 receives 50 substrates W in a vertical posture from the lifter LF3, the batch transfer robot WTR1 transfers the 50 substrates W to the lifter LF4 of the cleaning treatment tank BT4. The lifter LF4 immerses the 50 substrates W in pure water in the cleaning treatment tank BT4.

[0110] 〔Step S12〕Transfer and immersion of the processing substrate group to the second posture conversion mechanism Thereafter, the batch transfer robot WTR1 receives 50 substrates W that have been subjected to a cleaning treatment in one of the two batch treatment tanks BT2 and BT4. That is, the batch transfer robot WTR1 receives the 50 substrates W that have been subjected to a cleaning treatment from one of the two lifters LF2 and LF4. When transferring the 50 substrates W, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the cleaning treatment tank BT2. Thereafter, the batch transfer robot WTR1 transfers the 50 substrates W (processing substrate group) that have been subjected to the first batch treatment (etching treatment or the like) to the second posture conversion mechanism 43.

[0111] When the batch transfer robot WTR1 moves the 50 substrates W above the standby tank 45 and the standby lifter LF9 of the second posture conversion mechanism 43, the standby lifter LF9 raises the support member 51 and holds the 50 substrates W held by the batch transfer robot WTR1 from below. Thereafter, when the chuck 37 of the batch transfer robot WTR1 is opened, the 50 substrates W are delivered to the standby lifter LF9. Thereafter, as shown in FIG. 9(a), the standby lifter LF9 immerses the 50 substrates W in pure water in the standby tank 45 in order to prevent the substrates W from drying.

[0112] 〔Step S13〕Extraction of the first substrate group by the extraction chuck Refer to Fig. 9(b). Subsequently, the standby lifter LF9 raises 50 substrates W and pulls up 50 substrates W from the pure water in the standby tank 45. Also, the standby lifter LF9 raises 50 substrates W to a position higher than the extraction chuck 91 of the batch transfer robot WTR2. At this time, the extraction chuck 91 is in an open state. Therefore, the 50 substrates W rise between the two chuck members 95, 96 of the extraction chuck 91.

[0113] Subsequently, the batch transfer robot WTR2 moves the extraction chuck 91 to a preset position in the arrangement direction (width direction Y) of the 50 substrates W in order to extract 25 substrates W1 (the first substrate group or the odd-numbered substrate group). Subsequently, the batch transfer robot WTR2 closes the extraction chuck 91 by bringing the two chuck members 95, 96 closer to each other. Also, the inversion chuck 53 of the posture conversion unit 49 is raised to the upper position H1.

[0114] Refer to Fig. 9(c). Subsequently, the standby lifter LF9 lowers the support member 51. As a result, the extraction chuck 91 of the batch transfer robot WTR2 extracts 25 substrates W1 from the 50 substrates W (W1, W2). Specifically, the 25 pairs of holding grooves 97, 98 of the extraction chuck 91 hold 25 substrates W1. Also, the 26 pairs of passing grooves 101, 102 of the extraction chuck 91 allow 25 substrates W2 to pass through. Therefore, 25 substrates W1 are held by the extraction chuck 91, and 25 substrates W2 are left on the standby lifter LF9. Subsequently, the standby lifter LF9 immerses the 25 substrates W2 in the pure water in the standby tank 45 in order to prevent the substrates W2 from drying.

[0115] 〔Step S14〕Transfer of the first substrate group to the inversion chuck Subsequently, the batch transfer robot WTR2 advances the 25 substrates W1 held by the extraction chuck 91 to a preset delivery position below the inversion chuck 53 (or above the posture conversion tank 47).

[0116] Refer to Fig. 10(a). Thereafter, the elevating parts 67A and 67B (Fig. 4) of the posture conversion unit 49 lower the inversion chuck 53 to the handover height position H2 while 25 substrates W1 are respectively accommodated in 25 pairs of holding grooves 57 and 58. Thereafter, the opening / closing parts 65A and 65B (Fig. 4) of the posture conversion unit 49 close the inversion chuck 53 by bringing the two chuck members 55 and 56 of the inversion chuck 53 closer to each other. Thereby, the inversion chuck 53 holds 25 substrates W1.

[0117] Refer to Fig. 10(b). Thereafter, the batch transfer robot WTR2 opens the extraction chuck 91 by moving the two chuck members 95 and 96 away from each other. Thereafter, the batch transfer robot WTR2 retracts the extraction chuck 91 in the width direction Y to a position above the standby tank 45.

[0118] 〔Step S15〕Upside-down inversion of the first substrate group by the inversion chuck Thereafter, the posture conversion unit 49 rotates the 25 substrates W1 on which the first batch process has been performed around the horizontal axis AX4. Thereby, the top and bottom of the 25 substrates W1 in the vertical posture are inverted. Specifically, by rotating the two electric motors 75 of the rotating parts 63A and 63B shown in Fig. 4, the two chuck members 55 and 56 of the inversion chuck 53 are rotated 180 degrees (degrees) around the horizontal axis AX4. Thereby, the 25 substrates W1 held by the inversion chuck 53 are rotated 180 degrees. Note that the upside-down inversion operation may be performed with the 25 substrates W immersed in pure water in the posture conversion tank 47. Also, at least one of before and after performing the upside-down inversion operation, the posture conversion unit 49 may immerse the 25 substrates W1 held by the chuck 53 in pure water in the posture conversion tank 47 in order to prevent the substrates W1 from drying.

[0119] 〔Step S16〕Transfer of the first substrate group to the extraction chuck Refer to Fig. 10(c). After the up-and-down inversion operation for the 25 substrates W1 (the first substrate group), the batch transfer robot WTR2 advances the extraction chuck 91 to a preset delivery position below the inversion chuck 53. At this time, the extraction chuck 91 is in an open state. Note that the open extraction chuck 91 does not interfere with the 25 substrates W1 held by the inversion chuck 53 even when the extraction chuck 91 moves in the width direction Y.

[0120] Thereafter, the batch transfer robot WTR2 closes the extraction chuck 91 to hold the 25 substrates W1 from below with the extraction chuck 91. Thereafter, the posture conversion unit 49 opens the inversion chuck 53 by moving the two chuck members 55, 56 of the inversion chuck 53 away from each other. As a result, the 25 substrates W1 are held only by the extraction chuck 91.

[0121] 〔Step S17〕Transfer of the first substrate group to the standby lifter Refer to Fig. 11(a). Thereafter, the posture conversion unit 49 raises the inversion chuck 53 to an upper position H1 that does not interfere with the 25 substrates W1. Thereafter, the batch transfer robot WTR2 retreats the 25 substrates W1 subjected to the up-and-down inversion operation from the delivery position to a position above the standby lifter LF9. At this time, the batch transfer robot WTR2 shifts by one pitch from the extraction position (original position) of the standby lifter LF9 so that the device surface of each substrate W1 faces one substrate W2 of the second substrate group after the up-and-down inversion of the 50 substrates W1, W2. One pitch in this case is the interval between each of the 25 substrates W1 (for example, 10 mm).

[0122] For example, before performing the up-and-down inversion operation, it is assumed that the standby lifter LF9 holds 25 substrates W1 (the first substrate group) in the holding grooves MZ numbered 1, 3, 5, ···, 45, 47, 49. After performing the up-and-down inversion operation, the batch transfer robot WTR2 adjusts the positions of the 25 substrates W1 held by the extraction chuck 91 in the width direction Y of the standby lifter LF9 so that the standby lifter LF9 holds 25 substrates W1 in the holding grooves numbered 3, 5, 7, ···, 47, 49, 51. Note that the holding groove MZ numbered 1 and the holding groove MZ numbered 3 are provided on the proximal end side of the support member 51, and the holding groove MZ numbered 49 and the holding groove MZ numbered 51 are provided on the distal end side of the support member 51.

[0123] Refer to FIG. 11(b). After the 25 substrates W1 are moved to a preset position above the standby lifter LF9, the standby lifter LF9 raises the support member 51 that holds the 25 substrates W2 (the second substrate group). Thereby, the standby lifter LF9 holds the 25 substrates W1 from below in addition to the 25 substrates W2. The standby lifter LF9 raises the support member 51 to a position higher than the extraction chuck 91.

[0124] Note that in FIG. 11(b), for the sake of illustration, the standby lifter LF9 holds 3 substrates W1 and 3 substrates W2 and is provided with the holding grooves MZ numbered 1 to 7. In FIG. 9(b), the standby lifter LF9 holds 3 substrates W1 in the holding grooves MZ numbered 1, 3, and 5. After performing the up-and-down inversion operation, as shown in FIG. 11(b), the standby lifter LF9 holds 3 substrates W1 in the holding grooves MZ numbered 3, 5, and 7. In FIGS. 9(b) and 11(b), the holding grooves MZ numbered 1, 3, 5, and 7 are denoted by reference numerals MZ1, MZ3, MZ5, and MZ7.

[0125] 〔Step S18〕Extraction of the second substrate group by the extraction chuck Next, operations on the 25 substrates W2 that are the second substrate group will be described. Note that descriptions overlapping with steps S13 to S17 will be omitted as appropriate.

[0126] Refer to FIG. 11(c). The standby lifter LF9 holds 50 substrates W including 25 substrates W1 that have undergone an up-and-down inversion operation. The batch transfer robot WTR2 moves the extraction chuck 91 to a preset position in the arrangement direction (width direction Y) of the 50 substrates W in order to extract 25 substrates W2 (the second substrate group or the even-numbered substrate group). Note that the extraction chuck 91 is in a closed state.

[0127] Refer to FIG. 12(a). Thereafter, the standby lifter LF9 lowers the 50 substrates W. As a result, the 25 substrates W2 are held by the extraction chuck 91, and the 25 substrates W1 are left on the standby lifter LF9. Thereafter, the standby lifter LF9 immerses the 25 substrates W1 in pure water in the standby tank 45.

[0128] 〔Step S19〕Transfer of the second substrate group to the inversion chuck Thereafter, the batch transfer robot WTR2 advances the 25 substrates W2 held by the extraction chuck 91 to the delivery position below the inversion chuck 53. Thereafter, the posture conversion unit 49 lowers the inversion chuck 53 to the delivery height position H2. Thereafter, the posture conversion unit 49 closes the inversion chuck 53. As a result, the inversion chuck 53 holds the 25 substrates W2.

[0129] Refer to FIG. 12(b). Thereafter, the batch transfer robot WTR2 opens the extraction chuck 91. Thereafter, the batch transfer robot WTR2 retracts the extraction chuck 91 in the width direction Y to a position above the standby lifter LF9.

[0130] 〔Step S20〕Upside-down inversion of the second substrate group by the inversion chuck Thereafter, the posture conversion unit 49 rotates the 25 substrates W2 on which the first batch process has been performed around the horizontal axis AX4. Thereby, the top and bottom of the 25 substrates W2 in the vertical posture are inverted.

[0131] 〔Step S21〕Transfer of the second substrate group to the extraction chuck Refer to Fig. 12(c). After the up-and-down inversion operation for the 25 substrates W2 (the second substrate group), the batch transfer robot WTR2 advances the extraction chuck 91 to the delivery position below the inversion chuck 53. At this time, the extraction chuck 91 is in the open state.

[0132] Thereafter, the batch transfer robot WTR2 closes the extraction chuck 91 to hold the 25 substrates W1 from below with the extraction chuck 91. Thereafter, the posture conversion unit 49 opens the inversion chuck 53. As a result, the 25 substrates W1 are held only by the extraction chuck 91.

[0133] 〔Step S22〕Transfer of the second substrate group to the standby lifter Refer to Fig. 13(a). Thereafter, the posture conversion unit 49 raises the inversion chuck 53 to the upper position H1. Thereafter, the batch transfer robot WTR2 retreats the 25 substrates W2 that have undergone the up-and-down inversion operation from the delivery position to a position above the standby lifter LF9.

[0134] At this time, the batch transfer robot WTR2 adjusts the position in the width direction Y (the substrate arrangement direction) of the 25 substrates W2 so as to return to the holding groove MZ that was held before the up-and-down inversion operation. For example, before the up-and-down inversion operation, it is assumed that the standby lifter LF9 holds the 25 substrates W2 (the second substrate group) in the 2nd, 4th, 6th, ···, 46th, 48th, 50th holding grooves MZ. After the up-and-down inversion operation, the batch transfer robot WTR2 adjusts the position in the width direction Y of the 25 substrates W2 held by the extraction chuck 91 so that the standby lifter LF9 holds the 25 substrates W2 in the 2nd, 4th, 6th, ···, 46th, 48th, 50th holding grooves MZ.

[0135] Refer to FIG. 13(b). After adjusting the positions of the 25 substrates W2 in the width direction Y, the standby lifter LF9 further holds the 25 substrates W2 by raising the support member 51 that holds the 25 substrates W1. Thereafter, the extraction chuck 91 is opened. By such an operation, as shown in FIG. 13(c), the 50 substrates W are turned upside down. Note that the 25 substrates W1 that have been turned upside down and the 25 substrates W2 that have been turned upside down are conveyed to the standby lifter LF9 by the batch transfer robot WTR2 such that all the device surfaces of the 25 substrates W1 and all the device surfaces of the 25 substrates W2 face each other. Thereafter, the standby lifter LF9 immerses the 50 substrates W in pure water in the standby tank 45, for example, to prevent the substrates W from drying.

[0136] [Step S23] Conveying the group of processing substrates to the chemical solution treatment tank The batch transfer robot WTR1 conveys the 50 substrates W that have been turned upside down in the vertical posture from the standby lifter LF9 to either one of the two lifters LF1 and LF3. Specifically, the batch transfer robot WTR1 receives the 50 substrates W that have been turned upside down from the standby lifter LF9 in the vertical posture. At this time, the standby lifter LF9 lifts the 50 substrates W out of the pure water in the standby tank 45. Thereafter, the batch transfer robot WTR1 conveys the 50 substrates W that have been turned upside down to either one of the two lifters LF1 and LF3. The batch transfer robot WTR1 conveys the 50 substrates W to the lifter LF1 in the vertical posture, for example. At this time, the lifter LF1 receives the 50 substrates W at a position above the chemical solution treatment tank BT1.

[0137] [Step S24] Second batch process The lifter LF1 immerses the 50 substrates W in a phosphoric acid solution, which is the chemical solution in the chemical solution treatment tank BT1. Thereby, the second batch process (etching process) is performed. The second batch process is also performed until half of the normal processing time (for example, 2 hours) has elapsed, similar to the first batch process. After the second batch process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid solution in the chemical solution treatment tank BT1.

[0138] Thereafter, the batch transfer robot WTR1 receives, for example, 50 substrates W in a vertical posture from the lifter LF1, and transfers the 50 substrates W to the lifter LF2 of the cleaning treatment tank BT2. The lifter LF2 receives the 50 substrates W at a position above the cleaning treatment tank BT2. The lifter LF2 immerses the 50 substrates W in pure water in the cleaning treatment tank BT2. Thereby, the cleaning treatment (batch treatment) is performed.

[0139] Also, when the batch transfer robot WTR1 receives 50 substrates W in a vertical posture from the lifter LF3, the batch transfer robot WTR1 transfers the 50 substrates W to the lifter LF4 of the cleaning treatment tank BT4. When 50 substrates W are transferred to the lifter LF3, the chemical solution treatment tank BT3 performs the same treatment as the chemical solution treatment tank BT1. When 50 substrates W are transferred to the lifter LF4, the cleaning treatment tank BT4 performs the same treatment as the cleaning treatment tank BT2.

[0140] 〔Step S04〕Horizontal posture conversion Returning to the description of the flowchart in FIG. 6, the batch transfer robot WTR1 receives 50 substrates W on which the second batch treatment (etching treatment and cleaning treatment) has been performed from either the lifter LF2 or LF4. At this time, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the cleaning treatment tank BT2. The batch transfer robot WTR1 transfers the 50 substrates W on which the second batch treatment has been performed to the second posture conversion mechanism 43. The standby lifter LF9 receives the 50 substrates W from the batch transfer robot WTR1 at a position above the standby tank 45, and immerses the 50 substrates W in pure water in the standby tank 45.

[0141] Thereafter, 25 substrates W1 (first substrate group) are extracted from the 50 substrates W held by the standby lifter LF9, and the extracted 25 substrates W1 are transferred to the inversion chuck 53. This operation is performed as in steps S13 and S14 of FIG. 7. After transferring the 25 substrates W1 to the inversion chuck 53, the posture conversion unit 49 lowers the inversion chuck 53 holding the 25 substrates W1 to immerse the 25 substrates W1 in pure water in the posture conversion tank 47.

[0142] Refer to FIG. 14(a). Thereafter, the posture conversion unit 49 rotates the inversion chuck 53 around the horizontal axis AX4 to convert the 25 substrates W1 subjected to the second batch process from the vertical posture to the horizontal posture. At this time, the inversion chuck 53 holding the 25 substrates W1 is rotated so that the device surface of each substrate W1 faces upward. For example, in FIG. 14(a), the inversion chuck 53 is rotated 90 degrees clockwise about the horizontal axis AX4.

[0143] Refer to FIG. 14(b). When transporting the substrate W1 to the single-wafer processing apparatus 7, the posture conversion unit 49 raises the inversion chuck 53, thereby pulling up the substrate W1 at the highest position held in the horizontal posture by the inversion chuck 53 from the pure water in the posture conversion tank 47. After the relay hand 111 enters the inversion chuck 53, the substrate transfer robot 105 provided in the relay region R3 takes out the substrate W in the horizontal posture while lifting it. When taking out the substrate W from the inversion chuck 53, the inversion chuck 53 is opened. Further, the substrate transfer robot 105 transports the taken-out substrate W1 to the substrate placement unit PS1 (FIG. 1). Similarly, the substrate transfer robot 105 transports the remaining substrates W1 one by one from the inversion chuck 53 to the substrate placement unit PS1 in the horizontal posture.

[0144] After all the substrates W1 (first substrate group) are transported from the inversion chuck 53, the batch transfer robot WTR2 receives the 25 substrates W2 left in the standby lifter LF9 and transports the 25 substrates W2 to the inversion chuck 53. This operation is performed as in steps S18 and S19 of FIG. 8. After the 25 substrates W2 are transported to the inversion chuck 53, the posture conversion unit 49 immerses the 25 substrates W in the pure water in the posture conversion tank 47.

[0145] Refer to FIG. 15. The posture conversion unit 49 converts the 25 substrates W2 subjected to the second batch process from the vertical posture to the horizontal posture so that the device surface of each substrate W2 faces upward. For example, in FIG. 15, the inversion chuck 53 is rotated 90 degrees counterclockwise about the horizontal axis AX4.

[0146] After that, the posture conversion unit 49 pulls up the 25 horizontally oriented substrates W2 one by one from the pure water in the posture conversion tank 47. Correspondingly, the substrate transfer robot 105 transfers the pulled-up substrate W2 from the inversion chuck 53 to the substrate placement unit PS1.

[0147] 〔Step S05〕First wafer processing Referring to FIG. 1, the center robot CR uses the first hand 151 out of the two hands 151 to receive one wet substrate W placed on the substrate placement unit PS1, and transfers the one substrate W to any one of the five wafer processing chambers SW1 of the two towers TW1 and TW3. The holding and rotating unit 141 of each wafer processing chamber SW1 holds and rotates the substrate W with the device surface facing upward in a horizontal posture. Also, each wafer processing chamber SW1 supplies pure water from the nozzle 143 to the device surface (upper surface) of the rotated substrate W, and then supplies IPA from the nozzle 143 to the device surface. Thereby, the pure water on the substrate W is replaced with IPA.

[0148] 〔Step S06〕Second wafer processing The center robot CR uses the first hand 151 to receive one wet substrate W that has been subjected to replacement processing with IPA from any one of the five wafer processing chambers SW1, and transfers the substrate W to any one of the six wafer processing chambers SW2. Each second wafer processing chamber SW2 performs a drying process on one substrate W using supercritical carbon dioxide (supercritical fluid). The drying process using the supercritical fluid suppresses the pattern collapse of the pattern surface (device surface) of the substrate W.

[0149] 〔Step S07〕Substrate transfer to the carrier The center robot CR uses the second hand 151 to receive one substrate W that has been dried from any one of the six wafer processing chambers SW2, and transfers the one substrate W to the substrate placement unit PS2. Fifty dried substrates W1 and W2 are sequentially transferred to the substrate placement unit PS2.

[0150] The indexer robot IR uses the hand 127 to convey the substrate W1 of the first substrate group placed on the substrate placement unit PS2 to the first carrier C placed on the placement shelf 125. When 25 substrates W1 that have undergone a drying process are conveyed to the first carrier C, an external transfer robot (not shown) conveys the first carrier C from the placement shelf 125 to the next destination.

[0151] The indexer robot IR uses the hand 127 to convey the substrate W2 of the second substrate group placed on the substrate placement unit PS2 to the second carrier C placed on the placement shelf 125. When 25 substrates W2 that have undergone a drying process are conveyed to the second carrier C, the external transfer robot conveys the second carrier C from the placement shelf 125 to the next destination.

[0152] According to this embodiment, a first batch process and a second batch process are performed in which a plurality of substrates W are immersed in the chemical solution in the chemical solution treatment tank BT1. Here, the second posture conversion mechanism 43 rotates the plurality of substrates W that have undergone the first batch process around the horizontal axis AX4, thereby inverting the plurality of substrates W in the vertical posture upside down. That is, between the first batch process and the second batch process, an operation of inverting the plurality of substrates W in the vertical posture upside down is performed. Therefore, it is possible to suppress the processing variations that occur in the upper half and the lower half of each substrate W.

[0153] Further, for example, when the substrate W is not turned upside down by the second posture conversion mechanism 43, the following operation can be considered. That is, the substrate W that has undergone the first batch process is dried, and then the substrate W is returned to the carrier C. Another device of the substrate processing system 1 turns the substrate W upside down. Thereafter, in the substrate processing system 1, the second batch process is performed on the substrate W that has been turned upside down. In this case, in order to turn it upside down by another device, the substrate W is dried. Therefore, there is a possibility that the pattern of the substrate W collapses due to drying. In addition, there is a possibility that particles adhere to the substrate W by being transported to another device or the like, and there is also a possibility that an oxide film adheres. When an oxide film adheres, a process for removing the oxide film may be required. However, according to the present embodiment, since the upside-down operation of the substrate W is performed within the substrate processing system 1, those possibilities can be avoided.

[0154] Further, the operation of turning upside down a plurality of substrates W in the vertical posture is performed by rotating an inversion chuck 53 that holds the plurality of substrates W around the horizontal axis AX4.

[0155] In the inversion chuck 53, the first support portion SU1 and the second support portion SU1 of each pair of holding grooves 57, 58 stop the movement of one substrate W in both directions of the substrate loading / unloading direction DR1, as shown in FIG. 5(b). Therefore, the operation of turning upside down a plurality of substrates W in the vertical posture can be easily performed.

[0156] In addition to the batch processing device 3, the substrate processing system 1 includes a single-wafer processing device 7 and a relay device 5. The plurality of substrates W that have undergone the second batch process are sent to the single-wafer processing device 7 via the relay device 5. Here, in addition to the operation of turning upside down a plurality of substrates W in the vertical posture, the second posture conversion mechanism 43 performs an operation of converting a plurality of substrates W from the vertical posture to the horizontal posture. In other words, the second posture conversion mechanism 43 performs an upside-down operation in addition to the operation of converting to the horizontal posture. Therefore, it is not necessary to separately provide a mechanism for converting to the horizontal posture and a mechanism for performing the upside-down operation, so the configuration of the substrate processing system 1 can be made compact.

[0157] The substrate processing system 1 can suppress the processing variations occurring in the upper and lower halves of each substrate W in the processing substrate group by inverting the processing substrate group (50 substrates W1, W2) in which 25 substrates W1 and 25 substrates W2 are alternately arranged.

[0158] The processing substrate group (50 substrates W) is formed such that 25 substrates W1 and 25 substrates W2 are alternately arranged, and all the device surfaces of the 25 substrates W1 and all the device surfaces of the 25 substrates W2 face each other. Refer to FIG. 16. After inverting the processing substrate group (50 substrates W) upside down, in the direction in which the processing substrate group is arranged, there may be a case where the two device surfaces of the two substrates W at both ends do not face the two device surfaces of the other two substrates W. In this case, when batch processing is performed, for example, the amount of chemical solution flowing through the substrate W whose device surfaces do not face each other is different from that flowing through the two substrates W whose device surfaces face each other.

[0159] For example, as shown by the reference sign FW1 in FIG. 16, a certain space is formed between the two substrates W1 and W2 whose device surfaces face each other. On the other hand, as shown by the reference sign FW2, for the substrate W2 whose device surfaces do not face each other, the certain space shown by the reference sign FW1 is not formed. Therefore, for example, the amount of chemical solution flowing through the spaces shown by the reference signs FW1 and FW2 is different. Therefore, there is a possibility of causing processing variations. Therefore, even after inverting the processing substrate group upside down, such processing variations can be prevented by making all the device surfaces of the 25 substrates W1 and all the device surfaces of the 25 substrates W2 face each other.

Example 2

[0160] Next, Example 2 of the present invention will be described with reference to the drawings. Note that the descriptions overlapping with those in Example 1 are omitted.

[0161] In Example 1, the posture conversion unit 49, for example, rotated the inversion chuck 53 by 180 degrees around the horizontal axis AX, thereby inverting the top and bottom of 25 substrates W1 at once. In this regard, in Example 2, the posture conversion unit 49 converts 25 substrates W1 from the vertical posture to the horizontal posture, and further converts 25 substrates W1 from the horizontal posture to the vertical posture. Thereby, the top and bottom of 25 substrates W1 are inverted. Here, a sorting operation of 25 substrates W1 in the inversion chuck 53 is performed between the two posture conversions.

[0162] To perform the sorting operation, the inversion chuck 53 includes a plurality of pairs (for example, 27 pairs) of holding grooves 57, 58 that are more than the plurality of substrates W1 (for example, 25 substrates) held by the inversion chuck 53.

[0163] FIG. 17 is a flowchart showing the detailed top and bottom inversion operation of 25 substrates W1 (first substrate group) by the inversion chuck 53 according to Example 2. FIG. 18(a) is a longitudinal sectional view showing the state before inverting the top and bottom of 25 substrates W1. FIG. 18(b) is a longitudinal sectional view showing the state in which 25 substrates W1 are converted from the vertical posture to the horizontal posture. FIG. 18(c) is a longitudinal sectional view showing the state in which 25 substrates W1 are converted from the horizontal posture to the vertical posture (the state after top and bottom inversion).

[0164] As shown in FIGS. 7 and 8, a top and bottom inversion operation for 25 substrates W1 and a top and bottom inversion operation for 25 substrates W2 are performed. The top and bottom inversion operation for 25 substrates W1 is performed in substantially the same manner as the top and bottom inversion operation for 25 substrates W2. Therefore, the top and bottom inversion operation for 25 substrates W1 will be described representatively. Step S15 shown in FIG. 7 includes three steps S15A, S15B, and S15C.

[0165] The batch transfer robot WTR2 transfers the 25 substrates W1 extracted by the extraction chuck 91 to the posture conversion unit 49 in the vertical posture. The posture conversion unit 49 receives 25 vertically oriented W1s from the batch transfer robot WTR2 using the inversion chuck 53. Note that when the inversion chuck 53 is in the closed state, the inversion chuck 53 holds 25 substrates W1.

[0166] 〔Step S15A〕Horizontal posture conversion Thereafter, the posture conversion unit 49 lowers the inversion chuck 53 and immerses 25 substrates W1 in the pure water in the posture conversion tank 47. Thereafter, while holding the 25 substrates W1 with the inversion chuck 53, the posture conversion unit 49 rotates the inversion chuck 53 around the horizontal axis AX4 to convert the 25 substrates W1 that have undergone the first batch process from the vertical posture to the horizontal posture. At this time, the 25 substrates W1 are converted to the horizontal posture so that the device surface of each substrate W1 faces upward. The rotation of the inversion chuck 53 is rotated 90 degrees counterclockwise as shown in FIGS. 18(a) and 18(b), but may be rotated 270 degrees clockwise.

[0167] 〔Step S15B〕Rearrangement of substrates in the inversion chuck FIGS. 19(a) to 19(g) are front views for explaining the rearrangement operation of the substrate W in the inversion chuck 53. In FIGS. 19(a) to 19(g), for the sake of illustration, it is assumed that the inversion chuck 53 houses 7 substrates W1. Also, in order to distinguish the 7 substrates W1, the 7 substrates W1 are denoted by reference numerals W1-1, W1-2, W1-3, W1-4, W1-5, W1-6, and W1-7. Further, in FIGS. 19(a) to 19(g), the inversion chuck 53 is provided with, for example, 9 pairs of holding grooves 57 and 58, which are more than the 7 substrates W1. In order to distinguish the 9 pairs of holding grooves 57 and 58, the positions of the 9 pairs of holding grooves 57 and 58 are denoted by reference numerals SL1 to SL9.

[0168] First, as shown in FIGS. 5(a) and 5(b), the posture conversion unit 49 opens the inversion chuck 53 in order to insert and remove the substrate W1 with respect to the inversion chuck 53. Thereafter, the substrate transfer robot 105 in the relay region R3 rearranges the 25 substrates W1 converted to the horizontal posture by the posture conversion unit 49 in the inversion chuck 53 so as to exchange the positions of the outer substrate W1 and the inner substrate W1 in the direction (vertical direction Z) in which the 25 substrates W1 are arranged.

[0169] This operation will be specifically described. FIG. 19(a) shows the state before the rearrangement operation of the substrate W1. The rearrangement operation is performed in two regions as indicated by the dashed line LN in FIG. 19(a). The dashed line LN is preset approximately at the center of the 25 substrates W1 in the direction in which the 25 substrates W1 are arranged. Refer to FIG. 19(b). The substrate transfer robot 105 moves the third substrate W1-3 from the position SL4 to the position SL1 using the relay hand 111. Also, the substrate transfer robot 105 moves the fourth substrate W1-4 from the position SL5 to the position SL9 using the relay hand 111.

[0170] Note that the rearrangement operation is performed by combining the lifting and lowering operation of the inversion chuck 53 by the posture conversion unit 49 and the forward and backward movement of the relay hand 111 by the substrate transfer robot 105. When the inversion chuck 53 is lifted and lowered, the inversion chuck 53 may be in a closed state. Also, the substrate transfer robot 105 may be provided with a lifting unit (having an electric motor) that can lift and lower the relay hand 111 and the advancing and retreating unit 113.

[0171] Refer to FIG. 19(c). Thereafter, the substrate transfer robot 105 moves the first substrate W1-1 from the position SL2 to the position SL4. Also, the substrate transfer robot 105 moves the seventh substrate W1-7 from the position SL8 to the position SL5.

[0172] Refer to FIG. 19(d). Thereafter, the substrate transfer robot 105 moves the third substrate W1-3 from the position SL1 to the position SL2. Thereby, the rearrangement of the three substrates W1 above the dashed line LN is completed. In the case of the arrangement of the seven substrates W1 in FIG. 19(a), the second substrate W1-2 at the position SL3 is not moved. Also, in FIG. 19(d), the substrate transfer robot 105 moves the fifth substrate W1-5 from the position SL6 to the position SL8.

[0173] Refer to FIG. 19(e). Thereafter, the substrate transfer robot 105 moves the sixth substrate W1-6 from position SL7 to position SL6. Refer to FIG. 19(f). Thereafter, the fifth substrate W1-5 is moved from position SL8 to position SL7. Refer to FIG. 19(g). Thereafter, the fourth substrate W1-4 is moved from position SL9 to position SL8. As a result, the rearrangement operation of the four substrates W1 below the dashed-dotted line LN is completed, and the rearrangement operation of the seven substrates W1 is completed. The positions of the outer substrate W1 and the inner substrate W1 shown in FIG. 19(g) are exchanged with respect to the substrate W1 shown in FIG. 19(a).

[0174] Note that after rearranging the three substrates W1-1, W1-2, and W1-3, the rearrangement of the four substrates W1-4, W1-5, W1-6, and W1-7 may be performed. Also, after rearranging the four substrates W1-4, W1-5, W1-6, and W1-7, the rearrangement of the three substrates W1-1, W1-2, and W1-3 may be performed.

[0175] [Step S15C] Vertical posture conversion Thereafter, the posture conversion unit 49 closes the inversion chuck 53. Thereafter, the posture conversion unit 49 further rotates the inversion chuck 53 around the horizontal axis AX4 while holding 25 substrates W1 with the inversion chuck 53. For example, in FIG. 18(c), the posture conversion unit 49 rotates the inversion chuck 53 counterclockwise by 90 degrees, but the inversion chuck 53 may be rotated clockwise by 270 degrees. As a result, the posture conversion unit 49 converts the 25 substrates W1 in the horizontal posture to the vertical posture so as to turn upside down the 25 substrates W1 in the vertical posture when the first batch process is performed.

[0176] That is, with respect to the 25 substrates W1 shown in FIG. 18(a), as shown in FIG. 18(c), an upside-down operation is performed. The same rearrangement operation as that of the 25 substrates W1 in the first substrate group is also performed on the 25 substrates W2 in the second substrate group.

[0177] After that, in the horizontal posture conversion step (step S04) shown in FIG. 6, the arrangement of the 25 substrates W1 and the 25 substrates W2 remains in the state where the sorting operation has been performed. Therefore, for example, after the 25 substrates W1 are converted to the horizontal posture by the posture conversion unit 49, the state shown in FIG. 19(g) is obtained. The substrate transfer robot 105 of the relay device 5 uses the relay hand 111 to transfer the substrates W1 from the inversion chuck 53 to the substrate placement unit PS1 one by one in the order of substrates W1-1, W1-2, W1-3, W1-4, W1-5, W1-6, W1-7. The same applies to the 25 substrates W2 for which the sorting operation has been performed.

[0178] According to the present embodiment, in addition to the operation of inverting the 25 substrates W in the vertical posture, a sorting operation is performed. The sorting operation is an operation of sorting the 25 substrates converted to the horizontal posture within the inversion chuck 53 so as to exchange the positions of the outer substrate W and the inner substrate W in the direction in which the 25 substrates W are arranged. Therefore, it is possible to suppress the processing variation that occurs between the outer substrate W and the inner substrate W in the direction in which the 25 substrates W are arranged.

Example 3

[0179] Next, Example 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of Examples 1 and 2 are omitted.

[0180] In Examples 1 and 2, the 50 substrates W for which the second batch process (chemical solution process and pure water washing process) was performed were dried by the single wafer processing apparatus 7. In Example 3, the 50 substrates W for which the second batch process was performed may be dried by the batch processing apparatus 3.

[0181] As shown in FIG. 1, the substrate processing system 1 of this embodiment may include a stocker device 2, a batch processing device 3, a relay device 5, and a single-wafer processing device 7. Also, as shown in FIG. 20, the substrate processing system 1 of this embodiment may not include the single-wafer processing device 7 and may include the stocker device 2 and the batch processing device 3. In this case, the batch processing device 3 may include a second posture conversion mechanism 43 and a substrate transfer robot 105 in a region R9 between the transfer block 19 and the processing block 21.

[0182] In FIG. 20, the standby tank 45, the posture conversion tank 47, and the substrate transfer robot 105 are arranged in this order to the right. The substrate transfer robot 105 may not include the rotating part 115 and the horizontal moving part 117 shown in FIG. 1.

[0183] As shown in FIGS. 1 and 20, the batch processing device 3 includes a batch drying unit 35 that dries a plurality of (for example, 50) substrates W at once. The batch transfer robot WTR1 transfers 50 substrates W between the first posture conversion mechanism 23, four lifters LF1 to LF4, the second posture conversion mechanism 43, and the lifter LF7 of the batch drying unit 35 while holding the 50 substrates W in a vertical posture.

[0184] Details of the batch drying unit 35 will be described. The batch drying unit 35 includes a processing tank 35A, a chamber 35B that houses the processing tank 35A, and a lifter LF7. The processing tank 35A stores pure water such as DIW ejected from an ejection pipe (not shown). The lifter LF7 moves up and down. The lifter LF7 includes a plurality of (for example, 50 or 51 or more) holding grooves arranged in the width direction Y and holds a plurality of (for example, 50) substrates W in a vertical posture. A movable lid is provided on the upper part of the chamber 35B. A solvent nozzle and a water repellent agent nozzle are provided in the chamber 35B. The inside of the chamber 35B is configured to be depressurized by a vacuum pump.

[0185] Here, the operation of the batch drying unit 35 will be described. A plurality of substrates W that have undergone pure water washing treatment in one of the washing treatment tanks BT2 and BT4 are conveyed above the lifter LF7 of the batch drying unit 35 by the batch transfer robot WTR1. The lifter LF7 ascends, receives the plurality of substrates W from the batch transfer robot, descends, and immerses the plurality of substrates W in pure water in the treatment tank 35A. Then, the movable lid is closed, and the inside of the chamber 35B is depressurized by a vacuum pump. Thereafter, vapor of, for example, isopropyl alcohol (IPA) is ejected as a solvent from the solvent nozzle. As a result, the inside of the chamber 35B becomes an atmosphere of IPA vapor.

[0186] Thereafter, inside the chamber 35B, the lifter LF7 pulls up the plurality of substrates W from the pure water in the treatment tank 35A. Thereby, the pure water adhering to each substrate W is replaced with IPA. Thereafter, vapor of a water repellent agent is ejected from the water repellent agent nozzle. Thereby, the IPA adhering to each substrate W is replaced with a water repellent agent. The water repellent agent modifies the surface of the substrate W to be water repellent. Thereafter, IPA vapor is ejected again from the solvent nozzle. Thereby, the water repellent agent adhering to each substrate is replaced with IPA. Thereafter, the ejection of IPA vapor from the solvent nozzle is stopped. As a result, inside the depressurized chamber 35B, the IPA adhering to each substrate W volatilizes, and the drying of each substrate W proceeds. After the drying process, the chamber 35B is returned to atmospheric pressure.

[0187] Next, with reference to the flowchart of FIG. 21, the operation of the substrate processing system 1 of the present embodiment will be described. Steps S01 to S03 shown in FIG. 21 are substantially the same as the descriptions of steps S01 to S03 shown in FIG. 6, so their descriptions will be omitted. In step S01, two carriers C (empty carriers) are placed on two storage shelves 11.

[0188] 〔Step S31〕Drying process (batch process) The batch transfer robot WTR1 receives 50 substrates W on which the second batch process (chemical solution process and cleaning process) has been performed from either of the lifters LF2 and LF4. Then, the batch transfer robot WTR1 transfers the 50 substrates W on which the second batch process has been performed to the batch drying unit 35. The batch drying unit 35 dries the 50 substrates W all at once.

[0189] 〔Step S32〕Horizontal posture conversion After the drying process by the batch drying unit 35, the upper part of the chamber 35B is opened by the movable lid. Then, the lifter FL7 raises the 50 substrates W on which the drying process has been performed above the chamber 35B. The batch transfer robot WTR1 receives the 50 substrates W from the lifter FL7 and transfers the 50 substrates W to the substrate transfer position PP. The pusher mechanism 33 of the first posture conversion mechanism 23 uses the pusher 33A to receive the 50 substrates W on which the drying process has been performed from the batch transfer robot WTR1.

[0190] The posture conversion unit 31 of the first posture conversion mechanism 23 extracts, for example, 25 substrates W1 of the first substrate group from the 50 substrates W held by the pusher 33A. As shown in FIG. 13(c), the 25 substrates W1 face leftward. Therefore, the posture conversion unit 31 converts the 25 substrates W1 from the vertical posture to the horizontal posture without rotating the 25 substrates W1 by 180 degrees around the vertical axis AX3. As a result, the device surfaces of the 25 substrates W1 converted to the horizontal posture face upward. The substrate handling mechanism HTR receives the 25 substrates W1 from the posture conversion unit 31.

[0191] Thereafter, the posture conversion unit 31 receives the 25 substrates W2 of the second substrate group held by the pusher 33A from the pusher 33A. As shown in FIG. 13(c), the 25 substrates W2 face rightward. Therefore, the posture conversion unit 31 rotates the 25 substrates W2 by 180 degrees around the vertical axis AX3 to turn the device surfaces of the 25 substrates W2 leftward. Then, the posture conversion unit 31 converts the 25 substrates W2 from the vertical posture to the horizontal posture.

[0192] [Step S33] Substrate transfer to the carrier The carrier transfer robot 13 transfers the first carrier C (empty carrier) from the storage shelf 11 to the placement shelf 17. The substrate handling mechanism HTR transfers the received 25 substrates W1 to the first carrier on the placement shelf 17. Thereafter, the carrier transfer robot 13 transfers the first carrier C that stores the 25 substrates W1 that have undergone the drying process to the load port 9.

[0193] After the first carrier C that stores the 25 substrates W1 that have undergone the drying process is transferred from the placement shelf 17, the carrier transfer robot 13 transfers the second carrier C (empty carrier) from the storage shelf 11 to the placement shelf 17. The substrate handling mechanism HTR transfers the 25 substrates W2 that have been converted to the horizontal posture from the posture conversion unit 31 to the second carrier C on the placement shelf 17. Thereafter, the carrier transfer robot 13 transfers the second carrier C that stores the 25 substrates W2 that have undergone the drying process to the load port 9.

[0194] Thereafter, the external transfer mechanism sequentially transfers the two carriers C from the load port 9 to the next destination.

[0195] According to this embodiment, the substrate processing system 1 does not send, for example, 50 substrates W that have undergone the second batch process to the single wafer processing apparatus 7, but uses the batch drying unit 35 to collectively dry the 50 substrates that have undergone the second batch process.

[0196] Note that the drying process of the batch drying unit 35 is performed by supplying IPA vapor and water repellent vapor into the chamber 35, but it may also be performed by supplying a supercritical fluid into the chamber.

[0197] The present invention is not limited to the above-described embodiment, and can be modified as follows.

[0198] (1) In the above-described Examples 1 and 2, the batch drying unit 35 is provided. When the batch drying unit 35 is not used, the batch drying unit 35 may not be provided.

[0199] (2) In each of the above-described embodiments and modification examples (1), the center robot CR conveyed the substrate W to the index robot IR via the substrate placement unit PS2. In this regard, the center robot CR may directly convey the substrate W to the index robot IR without passing through the substrate placement unit PS2. Note that the center robot CR may directly receive the substrate W from the substrate transfer robot 105 without passing through the substrate placement unit PS1.

[0200] (3) In each of the above-described embodiments and modification examples, the single-wafer processing apparatus 7 includes the index robot IR and the center robot CR as the second horizontal substrate transfer robots. The index robot IR and the center robot CR shared the conveyance of a single substrate W between the substrate placement unit PS1 of the relay device 5, the 11 single-wafer processing chambers SW1 and SW2, and the carriers C placed on the respective placement shelves 125. In this regard, a single second horizontal substrate transfer robot may convey a single substrate W between the substrate placement unit PS1 of the relay device 5, the 11 single-wafer processing chambers SW1 and SW2, and the carriers C placed on the respective placement shelves 125.

[0201] Moreover, a plurality of (not limited to two) second horizontal substrate transfer robots may share the conveyance of a single substrate W between the substrate placement unit PS1 of the relay device 5, the 11 single-wafer processing chambers SW1 and SW2, and the carriers C placed on the respective placement shelves 125.

[0202] (4) In each of the above-described embodiments and modification examples, the four batch processing tanks BT1 to BT4 are composed of two chemical solution processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. In this regard, each of the four batch processing tanks BT1 to BT4 may be a processing tank that performs chemical solution processing and cleaning processing in sequence.

[0203] (5) In each of the above-described embodiments and modified examples, as shown in FIG. 1, four lifters LF1 to LF4 were respectively provided for the four batch processing tanks BT1 to BT4. In this regard, for example, the lifter LF1 may be used for two batch processing tanks BT1 and BT2, and the lifter LF3 may be used for two batch processing tanks BT3 and BT4. In this case, the two lifters LF2 and LF4 are not provided. The lifter LF1 may be provided with a forward and backward movement unit including, for example, an electric motor so as to be movable in the forward and backward direction X between the two batch processing tanks BT1 and BT2. Similarly to the lifter LF1, the lifter LF3 is configured to be movable in the forward and backward direction X between the two batch processing tanks BT3 and BT4.

[0204] (6) In each of the above-described embodiments and modified examples, the single-wafer processing chamber SW2 performed a drying process on the substrate W using a supercritical fluid. In this regard, the single-wafer processing chamber SW2 may be provided with a rotation processing unit 141 and a nozzle 143, similar to the single-wafer processing chamber SW1. In this case, each of the eleven single-wafer processing chambers SW1 and SW2, for example, supplies pure water and IPA to the substrate W in this order and then performs a drying process (spin drying) on the substrate W.

[0205] (7) In each of the above-described embodiments and modified examples, each chemical solution processing tank BT1, BT3 chemically treated 50 substrates W taken out from two carriers C all at once. In this regard, each chemical solution processing tank BT1, BT3 may chemically treat a plurality of substrates W (for example, 25 substrates) taken out from one carrier C all at once.

[0206] (8) In each of the above-described embodiments and modified examples, each chemical solution processing tank BT1, BT3 chemically treated 50 substrates (processing substrate group) in which 25 substrates W1 and 25 substrates W2 were alternately arranged all at once. Here, the device surfaces of the 25 substrates W1 faced in the opposite direction to the device surfaces of the 25 substrates W2. In this regard, the device surfaces of the 25 substrates W1 may face in the same direction as the device surfaces of the 25 substrates W2.

[0207] (9) In each of the above-described embodiments and each modification, the posture conversion unit 49 performed the operations of turning 50 substrates W upside down and converting the horizontal posture, 25 substrates at a time. In this regard, the posture conversion unit 49 may perform the operations of turning 50 substrates W upside down and converting the horizontal posture all at once.

Explanation of Signs

[0208] 1 … Substrate processing system 3 … Batch processing apparatus 5 … Relay apparatus 7 … Single-wafer processing apparatus 17 … Loading shelf HTR … Substrate handling mechanism 23 … First posture conversion mechanism 35 … Batch drying unit BT1, BT3 … Chemical solution processing tank (batch processing tank) LF1, LF3 … Lifter WTR1 … Batch transfer robot WTR2 … Batch transfer robot 43 … Second posture conversion mechanism LF9 … Standby lifter 53 … Inversion chuck 55, 56 … Chuck member 57, 58 … Holding groove 105 … Substrate transfer robot 111 … Relay hand 125 … Loading shelf IR … Indexer robot 127 … Hand SW1, SW2 … Single-wafer processing chamber CR … Center robot 151 … Hand 180 … Control unit AX4 … Horizontal axis C … Carrier DR1 … Direction SU1 … First support portion SU2 … Second support portion

Claims

1. A substrate processing system for processing substrates, comprising a batch processing apparatus for processing a plurality of substrates in a batch, wherein the batch processing apparatus comprises a first carrier placement shelf on which a carrier for accommodating the plurality of substrates in a horizontal posture is placed, a first posture conversion mechanism for converting the plurality of substrates between a horizontal posture and a vertical posture, a substrate handling mechanism for transporting the plurality of substrates between the carrier placed on the carrier placement shelf and the first posture conversion mechanism, a processing tank for storing a chemical solution, a lifter capable of immersing the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical posture, a second posture conversion mechanism for rotating the plurality of substrates around a horizontal axis orthogonal to a central axis passing through the center of each substrate, a first batch transfer robot for transporting the plurality of substrates between the first posture conversion mechanism, the lifter, and the second posture conversion mechanism while holding the plurality of substrates in a vertical posture, and a control unit, wherein the control unit (1) controls the substrate handling mechanism to transport the plurality of substrates in a horizontal posture received from the carrier placed on the first carrier placement shelf to the first posture conversion mechanism; (2) controls the first posture conversion mechanism to convert the plurality of substrates from a horizontal posture to a vertical posture; (3) controls the first batch transfer robot to transport the plurality of substrates converted to a vertical posture to the lifter; (4) controls the lifter to perform a first batch process of immersing the plurality of substrates in a vertical posture in the chemical solution in the processing tank; (5) controls the first batch transfer robot to transport the plurality of substrates on which the first batch process has been performed to the second posture conversion mechanism; (6) controls the second posture conversion mechanism to rotate the plurality of substrates on which the first batch process has been performed around the horizontal axis, thereby inverting the plurality of substrates in a vertical posture upside down; (7) controls the first batch transfer robot to transport the plurality of substrates inverted upside down in a vertical posture to the lifter; (8) controls the lifter to perform a second batch process of immersing the plurality of substrates inverted upside down in a vertical posture in the chemical solution in the processing tank. A substrate processing system characterized by the above.

2. In the substrate processing system according to Claim 1, The substrate processing system is characterized in that the second posture conversion mechanism has an inversion chuck for holding the plurality of substrates, and rotates the inversion chuck around the horizontal axis.

3. In the substrate processing system according to claim 2, the inversion chuck includes two chuck members having a plurality of pairs of holding grooves, the two chuck members are openable and closable along the horizontal axis, each of the plurality of pairs of holding grooves includes a first support portion that stops the movement of the one substrate to be accommodated in a predetermined direction among the substrate loading and unloading directions along the device surface of the one substrate to be accommodated, which is orthogonal to the direction in which the two chuck members open and close, and a second support portion that stops the movement of the one substrate to be accommodated in the direction opposite to the predetermined direction. The substrate processing system is characterized by this.

4. In the substrate processing system according to claim 2, it further includes a first horizontal substrate transfer robot having a first hand for holding one substrate in a horizontal posture and transferring the one substrate, the control unit controls the second posture conversion mechanism to rotate the inversion chuck around the horizontal axis while holding the plurality of substrates by the inversion chuck, thereby converting the plurality of substrates that have undergone the first batch process from a vertical posture to a horizontal posture, controls the horizontal substrate transfer robot to perform a sorting operation of sorting the plurality of substrates converted to a horizontal posture within the inversion chuck so as to exchange the positions of the outer substrate and the inner substrate in the direction in which the plurality of substrates are arranged, controls the second posture conversion mechanism to further rotate the inversion chuck around the horizontal axis while holding the plurality of substrates by the inversion chuck, thereby converting the plurality of substrates that have undergone the sorting operation from a horizontal posture to a vertical posture so as to turn the plurality of substrates in a vertical posture when the first batch process was performed upside down. The substrate processing system is characterized by this.

5. In the substrate processing system according to claim 1, in addition to the batch processing device, it includes a single-wafer processing device for processing the plurality of substrates one by one, and a relay device for transferring the plurality of substrates from the batch processing device to the single-wafer processing device, the relay device includes a first hand for holding one substrate in a horizontal posture and a first horizontal substrate transfer robot for transferring the one substrate, the single-wafer processing device A single-wafer processing chamber that performs single-wafer processing on the single substrate in a horizontal posture, A second carrier placement shelf on which the carrier is placed, A second horizontal substrate transfer robot having a second hand that holds the single substrate in a horizontal posture and transfers the single substrate between the relay device, the single-wafer processing chamber, and the carrier placed on the second carrier placement shelf, The control unit, By controlling the first batch transfer robot, the plurality of substrates on which the second batch process has been performed are transferred to the second posture conversion mechanism, By controlling the second posture conversion mechanism, the plurality of substrates on which the second batch process has been performed are converted from a vertical posture to a horizontal posture, By controlling the first horizontal substrate transfer robot, the single substrate converted to a horizontal posture is transferred from the second posture conversion mechanism to the single-wafer processing apparatus, By controlling the second horizontal substrate transfer robot, the single substrate transferred by the first horizontal substrate transfer robot is transferred to the single-wafer processing chamber, By controlling the single-wafer processing chamber, the single-wafer processing is performed on the single substrate, A substrate processing system, characterized in that by controlling the second horizontal substrate transfer robot, the single substrate that has been subjected to the single-wafer processing is transferred from the single-wafer processing chamber to the carrier placed on the second carrier placement shelf.

6. In the substrate processing system according to claim 1, The control unit, By controlling the substrate handling mechanism, the plurality of substrates in a horizontal posture received from the first carrier placed on the first carrier placement shelf are transferred to the first posture conversion mechanism, and also, a plurality of second substrates in a horizontal posture received from the second carrier placed on the first carrier placement shelf are transferred to the first posture conversion mechanism, By controlling the first posture conversion mechanism, a processed substrate group in which the plurality of substrates and the plurality of second substrates are alternately arranged is formed, and the processed substrate group is converted from a horizontal posture to a vertical posture, By controlling the first batch transfer robot, the processed substrate group in a vertical posture is transferred to the lifter, By controlling the lifter, the first batch process of immersing the processed substrate group in the chemical solution in the processing tank is performed, By controlling the first batch transfer robot, the processed substrate group on which the first batch process has been performed is transferred to the second posture conversion mechanism, By controlling the second posture conversion mechanism, the plurality of substrates among the group of processing substrates on which the first batch process has been performed are rotated around the horizontal axis, and the plurality of second substrates among the group of processing substrates on which the first batch process has been performed are rotated around the horizontal axis, whereby the plurality of substrates and the plurality of second substrates in the vertical posture are turned upside down. By controlling the first batch transfer robot, the group of processing substrates turned upside down in the vertical posture is transferred to the lifter. A substrate processing system characterized by performing a second batch process of immersing the group of processing substrates with the top and bottom reversed in the vertical posture in the chemical solution in the processing tank by controlling the lifter.

7. In the substrate processing system according to claim 6, The second posture conversion mechanism A standby lifter for holding the group of processing substrates in a vertical posture, And a second batch transfer robot for transferring the group of processing substrates between the standby lifter and the inversion chuck. The control unit By controlling the first posture conversion mechanism, a group of processing substrates is formed in which the plurality of substrates and the plurality of second substrates are alternately arranged, and all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of substrates face each other, and the group of processing substrates is converted from a horizontal posture to a vertical posture. A substrate processing system characterized by transferring the plurality of substrates turned upside down and the plurality of second substrates turned upside down to the standby lifter by controlling the second batch transfer robot so that all the device surfaces of the plurality of substrates and all the device surfaces of the plurality of substrates face each other.

8. In the substrate processing system according to claim 1, The batch processing device further includes a batch drying unit for drying the plurality of substrates collectively. The first batch transfer robot transfers the plurality of substrates between the first posture conversion mechanism, the lifter, the second posture conversion mechanism, and the batch drying unit while holding the plurality of substrates in a vertical posture. The control unit By controlling the first batch transfer robot, the plurality of substrates on which the second batch process has been performed are transferred to the batch drying unit. A substrate processing system characterized by drying the plurality of substrates on which the second batch process has been performed collectively by controlling the batch drying unit.

9. A substrate processing system including a batch processing apparatus for processing a plurality of substrates collectively, wherein the batch processing apparatus has a carrier mounting shelf on which a carrier for storing a plurality of substrates in a horizontal posture is placed, a first posture conversion mechanism for converting the plurality of substrates between a horizontal posture and a vertical posture, a substrate handling mechanism for conveying the plurality of substrates between the carrier placed on the carrier mounting shelf and the first posture conversion mechanism, a processing tank for storing a chemical solution, a lifter capable of immersing the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical posture, a first batch transfer robot for conveying the plurality of substrates in a vertical posture, in the substrate processing method of the substrate processing system comprising: a first substrate transfer step of causing the substrate handling mechanism to transfer the plurality of substrates in a horizontal posture received from the carrier placed on the first carrier mounting shelf to the first posture conversion mechanism; a vertical posture conversion step of causing the first posture conversion mechanism to convert the plurality of substrates from a horizontal posture to a vertical posture; a second substrate transfer step of causing the first batch transfer robot to transfer the plurality of substrates converted to a vertical posture to the lifter; a first batch processing step of causing the lifter to perform a first batch process of immersing the plurality of substrates in a vertical posture in the chemical solution in the processing tank; a third substrate transfer step of causing the first batch transfer robot to transfer the plurality of substrates on which the first batch process has been performed to a second posture conversion mechanism; a vertical inversion step of causing the second posture conversion mechanism to rotate the plurality of substrates on which the first batch process has been performed around a horizontal axis orthogonal to a central axis passing through the center of each substrate, thereby inverting the plurality of substrates in a vertical posture upside down; a fourth substrate transfer step of causing the first batch transfer robot to transfer the plurality of substrates inverted upside down in a vertical posture to the lifter; a second batch processing step of causing the lifter to perform a second batch process of immersing the plurality of substrates inverted upside down in a vertical posture in the chemical solution in the processing tank; A substrate processing method characterized by comprising the above steps.

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