Induction heating cooking device

By configuring each inverter on an individual power supply board with copper foil patterns and using a metal spacer for heat transfer, the induction heating cooking apparatus achieves efficient cooling of both boards, addressing the inefficiencies of conventional systems.

JP2025087983APending Publication Date: 2025-06-11RB CONTROLS CO LTD
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Patent Information

Application Number
JP2023202347
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-30
Publication Date
2025-06-11

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Abstract

To solve the problem in the conventional induction heating cooking device that a passage for supplying an individual cooling air need to be provided to each inverter because a plurality of inverters are mounted to one power supply substrate, the cooling air is also blown to an inverter that is not operated because a fan for blowing the cooling air to each inverter is used by only one, and the power supply substrate cannot be efficiently cooled.SOLUTION: Two power supply substrates are held while having a predetermined interval so that both of pattern surfaces are opposite, and an air for cooling flows to between both pattern surfaces.SELECTED DRAWING: Figure 2
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Description

Technical Field

[0001] The present invention relates to an induction heating cooking apparatus including a plurality of induction heating units.

Background Art

[0002] In an induction heating cooking apparatus, so-called built-in type, which is attached to a top plate, generally a plurality of induction heating units are set on the top plate. Induction coils are disposed below the top plate for these induction heating units, and a power supply board called an inverter is provided to supply high-frequency power to these induction coils. This inverter needs to have the same configuration for each induction coil. Therefore, in an induction heating cooking apparatus provided with two induction heating units, two inverters having the same configuration are required.

[0003] Further, since these inverters need to supply large power to the induction coils, the amount of heat generated is large, and it is necessary to cool them efficiently (for example, see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the above conventional induction heating cooking apparatus, since a plurality of inverters are mounted on a single power supply board, it is necessary to provide a passage for supplying individual cooling air to each inverter, and since one fan is used to blow the cooling air to each inverter, the cooling air is wasted and blown to the inverter that is not operating, resulting in a problem that the power supply board cannot be cooled efficiently.

[0006] Therefore, in view of the above problems, an object of the present invention is to provide an induction heating cooking apparatus that can solve the above problems by configuring each inverter on an individual power supply board and sharing the air flow path for each power supply board.

Means for Solving the Problems

[0007] In order to solve the above problems, an induction heating cooking apparatus according to the present invention includes a plurality of induction heating cooking units, and in the induction heating cooking apparatus in which power supply boards for supplying power to each induction heating unit are provided respectively, the power supply board has various electronic components mounted on one component mounting surface, and a pattern made of copper foil for electrically connecting the respective electronic components is adhered to the other pattern surface. Two power supply boards are held at a predetermined interval with the pattern surfaces facing each other, and air for cooling is caused to flow between both pattern surfaces.

[0008] The heat generated in the power supply board is easily radiated from the pattern made of copper foil adhered to the pattern surface. Therefore, by holding the two power supply boards with their respective pattern surfaces facing each other and causing air for cooling to flow between the two power supply boards, it is possible to cool both power supply boards simultaneously.

[0009] Further, the two power supply boards are interconnected via a rod-shaped spacer of a predetermined length, and at least one of these spacers is provided in a heat radiation pattern portion corresponding to a heat sink mounted on the mounting surface side of the power supply board. The spacer provided in the heat radiation pattern is made of metal, and in a state where only one of the interconnected power supply boards is operating, the heat of the heat sink of the operating power supply board is transmitted via the spacer to the heat radiation pattern and the heat sink of the non-operating power supply board.

[0010] By the way, a deflector plate may be provided to turn back the flow of the cooling air passing between the two power supply boards and direct it toward the heat sink, so as to efficiently cool the heat sink.

[0011] Then, a pair of side plates parallel to the flow of the cooling air are provided so as to sandwich the flow of this air, and openings for sucking ambient air into the flow of the cooling air by the ejector effect are provided in each side plate, so that the low-temperature ambient air can be taken into the cooling air.

Advantages of the Invention

[0012] As is clear from the above description, the present invention can efficiently cool both power supply substrates by holding the pattern surfaces of the two power supply substrates so as to face each other and flowing cooling air between the two power supply substrates.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0014] Referring to FIG. 1, IH is an induction heating cooking appliance attached to a countertop, and induction heating units H are set at two locations on the left and right on the top plate of the induction heating cooking appliance IH. An induction coil (not shown) is disposed below both induction heating units H, and a power supply substrate for supplying high-frequency power of the high power of the induction coil is connected thereto.

[0015] Referring to FIG. 2, a power supply board 1 is provided for each of the induction coils of the two induction heating units H. In this embodiment, two power supply boards 1 are required. Therefore, the two power supply boards 1 are arranged such that their pattern surfaces face each other, and the two power supply boards 1 are connected via five spacers 13 and 14 so as to ensure a gap with a predetermined interval therebetween. These spacers 13 and 14 are made of cylindrical materials, and the power supply board 1 is fixed to the spacers 13 and 14 by screwing screws 15 into the screw holes formed at both ends.

[0016] At least the spacer 13 of these spacers 13 and 14 is made of a metal with good thermal conductivity. The remaining spacer 14 may also be made of metal, but it may also be made of resin. A heat sink 11 to which an element with a particularly large calorific value is attached is mounted on the mounting surface side, and a heat dissipation pattern 12 is provided on the pattern surface side corresponding to the heat sink 11. And the spacer 13 is provided in contact with this heat dissipation pattern.

[0017] In addition to the case where both of the two induction heating units H are used simultaneously, only one of them may be used. In that case, only one of the two power supply boards 1 will operate. Then, only one of the power supply boards 1 will generate heat. However, the heat of the heat sink 11 that particularly requires heat dissipation is transmitted from the heat dissipation pattern 12 through the spacer 13 to the other heat dissipation pattern 12, so the heat dissipation pattern 12 to which the heat is transmitted and the heat sink 11 corresponding to that pattern 12 will also contribute to heat dissipation.

[0018] Referring to FIGS. 3 and 4, air from the blower 2 is allowed to flow between the two power supply boards 1 as cooling air. Also, a pair of side plates 3 are attached to both the left and right sides so that the cooling air does not deviate from the power supply board 1. An opening 31 is formed in this side plate 3, and ambient air is sucked between the two power supply boards 1 by the ejector effect with respect to the air flow from the blower 2. Note that 32 is a wind guiding part provided so that the sucked air is not obstructed. Also, a deflector plate 4 is provided at the outlet of the cooling air so that the cooling air flows toward the heat sink 11.

[0019] By the way, the side plates and the deflector plate are detachably attached to the spacers 14 and 13 by the legs 33 and 41, and the blower is provided with a driving motor 21. 5 is an element with a large heat generation amount, which is fixed to the heat sink 11 and is configured such that the generated heat is transmitted to the heat sink 11.

[0020] In the above embodiment, it has been described that the cooling air flows from below to above, but the layout may be such that the cooling air flows in the horizontal direction by arranging the power supply board 1 horizontally or the like.

[0021] Note that the present invention is not limited to the above-described form, and various modifications may be made without departing from the gist of the present invention.

Explanation of Reference Numerals

[0022] 1 Power supply board 2 Blower 3 Side plate 4 Deflector plate 11 Heat sink 12 Heat dissipation pattern 13 (Metal) Spacer 14 Spacer 31 Opening 33, 41 Legs H Induction heating part IH Induction heating cooking appliance

Claims

1. In an induction heating cooking apparatus including a plurality of induction heating cooking units, each provided with a power supply board for supplying power to each induction heating unit, the power supply board has various electronic components mounted on one component mounting surface, and a pattern made of copper foil for electrically connecting the respective electronic components is deposited on the other pattern surface. The induction heating cooking apparatus is characterized in that two power supply boards are held at a predetermined interval with the pattern surfaces facing each other, and cooling air is caused to flow between both pattern surfaces.

2. The two power supply boards are interconnected via a rod-shaped spacer of a predetermined length, and at least one of these spacers is provided in a heat radiation pattern portion corresponding to a heat sink mounted on the mounting surface side of the power supply board. The spacer provided in the heat radiation pattern is made of metal, and in a state where only one of the interconnected power supply boards is operating, heat of the heat sink of the operating power supply board is transmitted through the spacer to the heat radiation pattern and the heat sink of the non-operating power supply board. The induction heating cooking apparatus according to claim 1, characterized in that.

3. The induction heating cooking apparatus according to claim 2, characterized in that a deflector plate is provided for turning back the flow of cooling air passing between both power supply boards and directing it toward the heat sink.

4. The induction heating cooking apparatus according to any one of claims 1 to 3, characterized in that a pair of side plates parallel to the flow of the cooling air are provided so as to sandwich the flow of the air, and openings for sucking ambient air into the flow of the cooling air by an ejector effect are provided in each side plate.

Citation Information

Patent Citations

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