Configurable and modular load lock chamber systems and methods of making load locks for semiconductor processing systems

Abstract

To provide configurable and modular load lock chamber systems and methods of making load locks for semiconductor processing systems.SOLUTION: A load lock arrangement includes a load lock body that has: an upper plate defining an upper accessory seat at the upper accessory seat aperture; an intermediate plate spaced apart from the upper plate and defining an intermediate accessory seat at the intermediate accessory seat aperture; and a lower plate separated from the upper plate by the intermediate plate and defining a lower accessory seat at the lower accessory seat aperture. A first accessory plate is fixed to the upper accessory seat, and a second accessory plate is fixed to the lower accessory seat. The upper accessory seat aperture, the intermediate accessory seat aperture and the lower accessory seat aperture are vertically aligned to form a load lock body aperture. Semiconductor processing systems and methods of making load lock arrangements are also described.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure generally relates to manufacturing semiconductor devices. More specifically, the present disclosure relates to a load lock device for a semiconductor processing system used to manufacture semiconductor devices.

Background Art

[0002] A semiconductor processing system, such as a semiconductor processing system having a cluster type platform, generally includes a front end connected to the back end by a load lock. The front end generally interfaces the semiconductor processing system to the external environment and typically includes a front end robot for transporting substrates between the front end of the semiconductor processing system and the load lock. The back end typically includes a process module where substrate processing is achieved and a back end robot for transporting substrates between the load lock and the process module. The load lock generally couples the back end of the semiconductor processing system to the front end of the semiconductor processing system and is typically arranged to separate the environment maintained in the back end of the semiconductor processing system from the environment maintained in the front end of the semiconductor processing system.

[0003] One challenge of load locks is the need to incorporate different types of accessories within the load lock to facilitate substrate processing in semiconductor processing systems. For example, a heating device may be incorporated into the load lock to heat the substrate before it is transferred into the process module, improving the overall system by limiting the time required for the temperature increase within the process module. A cooling device may be incorporated into the load lock to cool the substrate before transfer from the process module to the load lock, limiting the time required to ramp the substrate from the desired material layer deposition temperature following material layer deposition. This can also improve system throughput by shortening the time the substrate can remain within the process module after material layer deposition. Incorporating substrate heating and substrate cooling into the load lock generally requires that the load lock have a customized configuration that meets the substrate heating and / or substrate cooling requirements of the process executed in the process module coupled to the load lock. Additionally, conventional semiconductor processing systems have one of two types of load lock devices: 1) those that accommodate one wafer at a time, or 2) those that accommodate batch wafers (i.e., a cassette of wafers, e.g., 25 wafers at a time).

[0004] However, conventional systems require different load lock chambers for each processing operation depending on the requirements of a given processing operation. That is, if a given processing operation is different from a previous processing operation, it may be necessary to replace the load lock with a load lock having accessories that were not originally included in the load lock in order to support the given processing operation. Thus, a new load lock chamber may be required each time the processing operation differs from the previous one. Such customization of load locks can complicate the redeployment and / or reuse of semiconductor processing systems.

[0005] Accordingly, in the art, there is a need for an improved load lock device, a semiconductor processing system having the load lock device, a method of depositing a material layer, and a method of fabricating a load lock device for a semiconductor processing system. The present disclosure provides a solution to this need. SUMMARY OF THE INVENTION MEANS FOR SOLVING THE PROBLEM

[0006] A load lock device is provided. The load lock device includes a load lock body having an upper accessory seat opening and an upper plate defining an upper accessory seat at the upper accessory seat opening, an intermediate plate spaced from the upper plate and having an intermediate accessory seat opening and defining an intermediate accessory seat at the intermediate accessory seat opening, and a lower plate separated from the upper plate by the intermediate plate and having a lower accessory seat opening and defining a lower accessory seat at the lower accessory seat opening. A first accessory plate is fixed to the upper accessory seat, and a second accessory plate is fixed to the lower accessory seat. The upper accessory seat opening, the intermediate accessory seat opening, and the lower accessory seat opening are vertically aligned to form a load lock body opening.

[0007] A method of fabricating a load lock device is provided. The method includes a load lock chamber body having an upper accessory seat opening and an upper plate defining an upper accessory seat in the upper accessory seat opening, an intermediate plate spaced from the upper plate and having an intermediate accessory seat opening and defining an intermediate accessory seat in the intermediate accessory seat opening, and a lower plate separated from the upper plate by the intermediate plate and having a lower accessory seat opening and defining a lower accessory seat in the lower accessory seat opening. The method further includes determining a processing operation of a process module, the process module being coupled to a backend transfer module, and the backend transfer module being coupled to the load lock chamber body. If the processing operation is determined to require substrate cooling in at least one chamber of the load lock chamber body, the method includes fixing a chill plate to at least one of the upper accessory seat, the lower accessory seat, and the intermediate accessory seat. If the processing operation is determined to require substrate heating in at least one chamber of the load lock chamber body, the method includes fixing a heater plate to at least one of the upper accessory seat, the lower accessory seat, and the intermediate accessory seat.

[0008] A semiconductor processing system is provided. The system includes a process module, a back-end transfer module connected to the process module and housing a back-end substrate transfer robot, and a load lock device connected to the back-end transfer module and further connected to an equipment front-end module housing a front-end substrate transfer robot. The load lock device has an upper accessory seat opening, an upper plate defining an upper accessory seat at the upper accessory seat opening, an intermediate accessory seat opening, an intermediate plate spaced from the upper plate and defining an intermediate accessory seat at the intermediate accessory seat opening, a lower accessory seat opening, a lower plate separated from the upper plate by the intermediate plate defining a lower accessory seat at the lower accessory seat opening, a first accessory plate fixed to the upper accessory seat, and a second accessory plate fixed to the lower accessory seat, and further includes a load lock chamber body. The upper accessory seat opening, the intermediate accessory seat opening, and the lower accessory seat opening are vertically aligned to form a load lock body opening. The front-end substrate transfer robot and the back-end substrate transfer robot are configured to transfer substrates between the equipment front-end module and the process module through the load lock chamber body.

[0009] This summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail in the following detailed description of examples of the present disclosure. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0010] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the drawings of certain embodiments, which are intended to illustrate the invention and not to limit the invention.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2a

Figure 2b

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

DETAILED DESCRIPTION OF THE INVENTION

[0012] It should be understood that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some of the elements in the figures may be exaggerated compared to other elements to assist in the understanding of the illustrated embodiments of the present disclosure.

[0013] Detailed Description of Exemplary Embodiments Referring now to the drawings, like reference numerals identify similar structural features or aspects of the present disclosure. For purposes of explanation and illustration (not limitation), a partial view of a load lock apparatus coupling a process module to an equipment front-end module (EFEM) of a semiconductor processing system according to the present disclosure is shown in FIG. 1 and is designated generally by reference numeral 100. Other examples, or aspects, of the load lock apparatus according to the present disclosure, a semiconductor processing system having the load lock apparatus, a method of depositing a material layer, and a method of fabricating the load lock apparatus are shown in FIGS. 2-7 as described below. The systems and methods of the present disclosure can be semiconductor processing systems used to deposit material layers using chemical vapor deposition (CVD) techniques and atomic layer deposition (ALD) techniques during the manufacture of logic devices and memory devices, but the present disclosure is not limited to any semiconductor processing operation or the manufacture of any particular semiconductor device in general.

[0014] As used herein, the term "substrate" may refer to any single or multiple underlying materials, which may be modified or on which devices, circuits, or films may be formed. The "substrate" may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. The substrate may be in any form such as powder, plate, or workpiece. The substrate in the form of a plate may include wafers of various shapes and sizes. The wafer may be 200 millimeters in diameter, 300 millimeters in diameter, or 450 millimeters in diameter. The substrate may be formed from one or more semiconductor materials including, by way of non-limiting example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0015] Referring to FIG. 1, a semiconductor processing system 10 is shown. The semiconductor processing system 10 includes at least one process module 12, a back-end transfer module 14, and a load lock device 100. The semiconductor processing system 10 also includes an equipment front-end module 16, a processor 18, and an exhaust source 20. In the illustrated example, the semiconductor processing system 10 includes a cluster-type platform 22 having four process modules configured to deposit a material layer on a substrate using atomic layer deposition technology. This is for illustrative and explanatory purposes only and is non-limiting. As would be understood by those skilled in the art in view of the present disclosure, semiconductor processing systems configured for other material layer deposition operations, and semiconductor processing systems configured for processing operations other than material layer deposition, may also benefit from the present disclosure.

[0016] At least one process module 12 is coupled to a back-end transfer module 14 by at least one process module gate valve 24. In some examples, the process module 12 may include a second process module gate valve that also couples the process module 12 to the back-end transfer module 14. The process module 12 further includes at least one process chamber. In some examples, the process module 12 may include two or more process chambers. The process chamber(s) may be configured to flow a material layer precursor or reactant across a substrate during deposition of the material layer on the substrate. A reactant source is fluidly coupled to the process chamber of the process module and may provide reactants to the process chamber to deposit a material layer on the substrate.

[0017] The process module 12 includes a process module surface 32 parallel to one of the back-end transfer surfaces 34. Thus, the process module 12 is coupled to the process module gate valve 24 at the process module surface 32, and the process module gate valve 24 is coupled to the back-end transfer module 14 at the back-end transfer module surface 34. Thus, the process module 12 is coupled to the back-end transfer module 14 using the process module gate valve 24, and the process module gate valve 24 is configured to provide selective communication between the process chamber of the process module 12 and the back-end transfer module 14. It is contemplated that the process module gate valve 24 is configured to be able to transfer a substrate between the back-end transfer module 14 and the process module 12 before and after depositing a material layer on the substrate. In a particular example, the material layer may be deposited using ALD or CVD deposition techniques. In some examples, the material layer may be deposited using plasma enhanced ALD (PEALD) or plasma enhanced CVD (PECVD) techniques.

[0018] The back-end transfer module 14 is coupled to the load lock device 100 and includes a back-end chamber body and a back-end substrate transfer robot. The back-end transfer module 14 is further coupled to the load lock device 100 via a back-end gate valve 26. In a particular exemplary embodiment, the back-end gate valve 26 is similar to the process module gate valve 24. In that regard, the back-end gate valve 26 may be configured to enable the transfer of one or more substrates between the load lock device 100 and the back-end transfer module 14. As shown in FIG. 1, the load lock device 100 includes a load lock device back-end surface 106. The back-end gate valve 26 is coupled to the load lock device 100 at the load lock device back-end surface 106, and the back-end valve 26 is further coupled to the back-end transfer module 14 at the back-end transfer module surface 36. Thus, the load lock device 100 is coupled to the back-end transfer module 14 using the back-end gate valve 26, and the back-end gate valve 26 is configured to provide selective communication between the back-end transfer module 14 and the load lock chamber of the load lock device 100. In an exemplary embodiment, the load lock device back-end surface 106 is arranged in a configuration parallel to the back-end transfer module surface 36.

[0019] In an exemplary embodiment, the back-end chamber body of the back-end transfer module has a polygonal shape. In the embodiment shown in FIG. 1, the back-end chamber body of the back-end transfer module 14 has five sides, four of which include a back-end transfer module surface 34 that couples the back-end transfer module 14 to at least one process module 12, and the fifth side includes a back-end transfer module surface 36 that couples the back-end transfer module 14 to the load lock device 100. In other exemplary embodiments, the back-end chamber body may have more than five sides or less than five sides, and may have a regular or irregular polygonal shape.

[0020] The load lock device 100 is further coupled to the EFEM 16 via a load lock gate valve 46. In a particular exemplary embodiment, the load lock gate valve 46 is similar to the back end gate valve 26. In that regard, the load lock gate valve 46 can be configured to allow the transfer of one or more substrates between the load lock device 100 and the EFEM 16. The EFEM 16 further includes an enclosure 44 that houses a front end substrate transfer robot, which is configured to move within the enclosure 44 for the transfer of substrates between one or more load ports 48 and the load lock device 100. One or more load ports 48 included within the EFEM 16 are connected to the enclosure 44 and are configured to place pods 8 that house one or more substrates before and after depositing a material layer on the substrate. In the example shown in FIG. 1, the EFEM 16 includes three load ports 48. However, in other examples, the EFEM 16 can include fewer or additional load ports.

[0021] The processor 18 is coupled to the semiconductor processing system 10, for example, through (or via) a wired or wireless link. The processor 18 is operably connected to a user interface and is arranged to communicate with the memory 56. The memory 56 includes a non-transitory machine-readable medium on which a plurality of program modules are recorded, which, when read by the processor 52, include instructions that cause the processor to execute certain operations.

[0022] As described above, in some semiconductor processing systems, substrate heating and / or substrate cooling within the system load lock is required for throughput purposes and the like. For example, in some semiconductor processing systems, substrate heating within the system load lock may be required to limit the processing time within the process module and reduce the time required to raise the substrate temperature to the desired material layer deposition temperature. As another method, or in addition, substrate cooling within the system load lock may be required to limit the processing time within the system process module, or otherwise may be required to limit the time required for substrate cooling within the process module after material layer deposition. Conventional semiconductor processing systems cannot modify the load lock configuration in a modular manner. For example, the configuration of the load lock chamber to meet the requirements of substrate cooling is different from the requirements of substrate heating. Therefore, when a semiconductor processing system houses a load lock chamber configured for substrate cooling, it is necessary to first remove such a load lock chamber and install a new load lock chamber configured to meet the requirements of substrate heating in order to switch to a heating configuration. The load lock apparatus 100 provided herein alleviates this problem by providing a load lock chamber that can accommodate multiple configurations with a single design.

[0023] Referring to FIG. 2a, the load lock apparatus 100 is shown in a top view. As shown in FIG. 2a, the load lock apparatus 100 includes a load lock chamber body 150, a load lock gate valve 46, and a back-end gate valve 26. As shown in FIG. 2a, the back-end gate valve 26 is connected to the load lock apparatus 100 at the back-end wall (back-end surface 106), and the load lock gate valve 46 is connected to the load lock apparatus 100 at the front-end wall (front-end surface 108). The load lock chamber body 150 further includes an upper plate 104. In the example shown in FIG. 2a, the load lock chamber body 150 further includes two openings 102a and 102b.

[0024] Referring now to FIG. 2b, a cross-sectional view of the load lock device 100 is shown. As shown in FIG. 2b, the load lock chamber body 150 includes a first side wall 112 and a second side wall 114. Further, the load lock chamber body 150 includes an upper plate 104 and a lower plate 118. The upper plate 104 and the lower plate 118 are connected to the first side wall 112, and the upper plate 104 and the lower plate 118 are connected to the second side wall 114 to form the load lock chamber body 150. That is, the upper plate 104, the lower plate 118, the first side wall 112 and the second side wall 114 together form the outer periphery of the load lock chamber body 150.

[0025] In an exemplary embodiment, the load lock chamber body 150 further includes a partition wall 116 that divides the load lock chamber body 150 into two different chambers 132a and 132b. Similar to the first side wall 112 and the second side wall 114, the partition wall 116 is connected to the upper plate 104 and the lower plate 118 to form two chambers 132a and 132b, respectively. In an exemplary embodiment, the load lock chamber 150 further includes at least one intermediate plate for further dividing the load lock chamber 150 into a top chamber and a bottom chamber. As shown in FIG. 2b, the intermediate plate 128 is coupled to the first side wall 112 and the second side wall 114 to facilitate the formation of an upper left chamber and a lower left chamber. In fact, the intermediate plate 128 is disposed below the upper plate 104 and above the lower plate 118 and is coupled to the upper plate 104 and the lower plate 118 by a front end wall (including the front end surface 108), a back end wall (including the back end surface 106), the first side wall 112, and the second side wall 114. The upper plate 104 is spaced from the intermediate plate 128 by the upper chamber 160, and the lower plate 118 is spaced from the intermediate plate 128 by the lower chamber 162. In an exemplary embodiment, the space between the upper plate 104 and the intermediate plate 128 is the same as the space between the intermediate plate 128 and the lower plate 118. In the exemplary embodiment shown in FIG. 2a, the load lock chamber body 150 further includes a partition wall 116 that divides the load lock chamber body 150 into two chambers 132a and 132b. As a result, similar to the side walls 112 and 114, the intermediate plate 128 is coupled to the partition wall 116.

[0026] As shown in FIG. 2a, the upper plate 104 includes at least one upper accessory sheet opening 134 and defines an upper accessory sheet 144 configured to accommodate various fixing types. Similarly, the intermediate plate 128 includes at least one intermediate accessory sheet opening 130 and defines an intermediate accessory sheet 140 configured to accommodate various fixing types. Further, the lower plate 118 includes at least one lower accessory sheet opening 136 and defines a lower accessory sheet 146 configured to accommodate various fixing types. The upper accessory sheet opening 134, the intermediate accessory sheet opening 130, and the lower accessory sheet opening 136 are vertically aligned to form an opening 102 through the load lock chamber body 150.

[0027] In a particular example, the upper accessory sheet 144 may be a first upper accessory sheet 144a, and the upper plate 104 may further include a second upper accessory opening 134b for defining a second upper accessory sheet 144b. The second upper accessory sheet 144b may be similar to the first upper accessory sheet 144a and, additionally, may be laterally offset from the first upper accessory sheet 144a, for example, on the side of a partition wall 116 (shown in FIG. 2a) opposite to the side of the first upper accessory sheet 144a.

[0028] Similarly, in a particular example, the intermediate accessory sheet 140 may be a first intermediate accessory sheet 140a, and the intermediate plate 128 may further include a second intermediate accessory opening 130b for defining a second intermediate accessory sheet 140b. The second intermediate accessory sheet 140b may be similar to the first intermediate accessory sheet 140a and, additionally, may be laterally offset from the first intermediate accessory sheet 140a, for example, on the side of a partition wall 116 (shown in FIG. 2a) opposite to the first intermediate accessory sheet 140a.

[0029] Furthermore, in certain examples, the lower accessory sheet 146 may be the first lower accessory sheet 146a, and the lower plate 118 may further include a second lower accessory opening 136b for defining a second lower accessory sheet 146b. The second lower accessory sheet 146b may be similar to the first lower accessory sheet 146a and, additionally, may be laterally offset from the first lower accessory sheet 146a, for example, on a side surface of the partition wall 116 opposite the side surface of the first lower accessory sheet 146a (shown in FIG. 2a).

[0030] In certain such examples, the first upper opening 134a, the intermediate opening 130a, and the lower opening 136a are vertically aligned to form an opening 102a through the load lock chamber 150. Similarly, the second upper accessory opening 134b, the intermediate accessory opening 130b, and the lower accessory opening 136b are vertically aligned to form an opening 102b through the load lock chamber 150. These openings (102a and 102b) may be covered by accessory components selected based on the requirements of the processing operation.

[0031] In certain examples, the load lock chamber body 150 may be formed in a monolithic manner. That is, the intermediate plate 128, one or more front end walls (including the front end surface 108), one or more back end walls (including the back end surface 106), the first side wall 112, the second side wall 114, the partition wall 116, the upper plate 104, and the lower plate 118 may be formed from a common stock piece. In this regard, a portion of the load lock body 100 including the intermediate plate 128 may be formed from a common stock piece using subtractive techniques, and the upper plate 104 may be fixed using fasteners or welding. In a further aspect, a portion of the load lock body 150 may be formed using additive techniques, and the upper plate 104 may be fixed to the intermediate plate 128 through one or more of the front end wall, the back end wall, the first side wall 112, and the second side wall 114.

[0032] Referring now to FIG. 3, a cross-sectional view of an exemplary load lock apparatus 300 for an ALD process module is shown. The load lock chamber body 150 shown in FIG. 3A is similar to the load lock chamber body of FIG. 2a. In this particular embodiment, heating and cooling of the substrate are not required within the load lock chamber body 150 during transfer. Accordingly, at least one of the upper accessory opening 134 and the lower accessory opening 136 may be covered by a blanking plate 304 to fluidly isolate the load lock chamber body 150 from the external environment outside the load lock chamber body 150. In the example shown herein, the first lower opening 136 of the load lock chamber body 150 is covered by a blanking plate 304 to fluidly isolate the lower chamber of the load lock chamber body from the external environment outside the load lock chamber body. The blanking plate 304 is received by the load lock chamber body 150 with a lower accessory sheet 146. A gasket or seal member may be compression-fixed between the lower plate 118 and the blanking plate 304 to isolate the lower chamber 162 from the external environment.

[0033] In a particular example, the upper opening 144 may also be covered by a blanking plate, such as the blanking plate 304, and attached to the upper accessory sheet 134 in a manner similar to the attachment in the lower accessory sheet 146. However, in the example shown herein, the substrate support plate 302 is received by the upper accessory sheet 134 and covers the upper accessory opening 134. The substrate support plate 302 is configured to support a substrate within the upper chamber 160 of the load lock chamber body. As shown in FIG. 3a, the substrate support plate 302 includes at least four fingers 310, 312, 314, and 316, and the substrate received within the upper chamber 160 may be supported within the fingers 310, 312, 314, and 316.

[0034] In a specific example, the blanking plate 304 may be a first blanking plate 304a that covers the first lower accessory opening 136a with the first lower accessory sheet 146a, and the substrate support plate 302 may be a first substrate support plate 302a that covers the first upper accessory opening 134a with the first upper accessory sheet 144a. The blanking plate 304 may further include a second blanking plate 304b that covers the second lower accessory opening 136b with the second lower accessory sheet 146b, and the substrate support plate 302 may include a second substrate support plate 302b that covers the second upper accessory opening 134b with the second upper accessory sheet 144b. Although the load lock device 300 is shown and described herein as having a specific device, it should be understood and recognized that the load lock device may have different devices in other examples and may be within the scope of the present disclosure.

[0035] Referring to FIG. 4, a cross-sectional view of an exemplary load lock device 400 for a process module that requires substrate cooling in the lower chamber 162 of the load lock chamber body 150 is shown. The load lock chamber body 150 shown in FIG. 4A is similar to the load lock chamber body of FIG. 2a. The load lock device 400 is similar to the load lock device 300 of FIG. 3A. However, since the processing operation requires substrate cooling within the load lock chamber body 150, the chill plate is fixed to at least one of the upper accessory sheet 144, the intermediate accessory sheet 140, and the lower accessory sheet 146.

[0036] In the exemplary embodiment shown in FIG. 4, the lower chill plate 404 is fixed to the lower accessory sheet 146 and covers the lower accessory opening 136. In the example shown in FIG. 4, the intermediate accessory opening 130 remains uncovered. Thus, the lower chill plate 404 fixed to the lower accessory sheet 146 may be configured to cool a substrate supported within the chamber defining the opening 102. Cooling may be achieved, for example, by convection by introducing a fluid between the substrate and the upper surfaces of the lower chill plates 404a and 404b.

[0037] In a particular example, the lower chill plate 404 may be a first lower chill plate 404a that covers the first lower accessory opening 136a with a first lower accessory sheet 146a. The lower chill plate 404 may further include a second lower chill plate 404b that covers the second lower accessory opening 136b with a second lower accessory sheet 146b. The second lower chill plate 404b may be similar to the first lower chill plate 404a. According to a particular example, the second lower accessory sheet 146b (and the second lower chill plate 404b) is laterally separated from the first lower accessory sheet 146a (and the first lower chill plate 404a) to use the fluid flowing out from the first lower chill plate 404a and the second lower chill plate 404b to provide symmetrical cooling of a substrate supported above the first lower chill plate 404a and the second lower chill plate 404b.

[0038] As shown in FIG. 4, the substrate support plate 302a covers the first upper accessory opening 134a with the first upper accessory sheet 144a, and the substrate support plate 302b covers the second upper accessory opening 134b with the second upper accessory sheet 144b. Thus, the substrate support plates 302a and 302b remain unchanged from the configuration of FIG. 3 to the configuration of FIG. 4. In fact, as shown in FIG. 4, the chill plates 404a and 404b are configured to cool one or more substrates supported by the substrate support plates 302a and 302b, respectively. Thus, the change in the processing operation does not require a change in the entire load lock chamber body. Rather, only the lower accessory needs to be replaced to accommodate the change in the processing operation.

[0039] Referring now to FIG. 5, a cross-sectional view of an exemplary load lock apparatus 500 for a six-sided platform is shown. In the exemplary embodiment shown in FIG. 5, the processing operation requires cooling in the upper and lower chambers of the load lock chamber body 150. Thus, as shown in FIG. 5, the chill plate is secured to at least two of the upper accessory sheet 144, the intermediate accessory sheet 140, and the lower accessory sheet 146.

[0040] As will be appreciated by those skilled in the art in view of the present disclosure, the load lock apparatus 100 may include other elements and / or may omit certain specific elements shown, and still be within the scope of the present disclosure. As will be appreciated by those skilled in the art in view of the present disclosure, the load lock apparatus 100 may include other elements and / or may omit certain specific elements shown, and still be within the scope of the present disclosure.

[0041] In a particular example, the lower chill plate shown in FIG. 5 may be the same as the lower chill plate shown in FIG. 4. Thus, the lower chill plate 404 covers the lower accessory opening 136 and is fixed to the lower accessory sheet 146. Similar to FIG. 4, in a particular example, the lower chill plate 404 may be a first lower chill plate 404a that covers the first lower accessory opening 136a with the first lower accessory sheet 146a. The lower chill plate 404 may further include a second lower chill plate 404b that covers the second lower accessory opening 136b with the second lower accessory sheet 146b. The second lower chill plate 404b may be similar to the first lower chill plate 404a. According to a particular example, the second lower accessory sheet 146b (and the second lower chill plate 404b) is laterally separated from the first lower accessory sheet 146a (and the first lower chill plate 404a) and uses the fluid flowing out from the first lower chill plate 404a and the second lower chill plate 404b to provide symmetrical cooling of the substrate supported above the first lower chill plate 404a and the second lower chill plate 404b.

[0042] The load lock device 500 further includes an intermediate chill plate 506. As shown in FIG. 5, the intermediate chill plate 506 is fixed to the intermediate accessory seat 140 and covers the intermediate accessory opening 130. The intermediate chill plate 506 functions in a manner similar to the lower chill plate 404. In a specific example, the intermediate chill plate 506 may be a first intermediate chill plate 506a that covers the first intermediate accessory opening 130a with a first intermediate accessory seat 140a. The intermediate chill plate 506 may further include a second intermediate chill plate 506b that covers the second intermediate accessory opening 130b with a second intermediate accessory seat 140b. The second intermediate chill plate 506b may be similar to the first intermediate chill plate 506a. According to a specific example, the second intermediate accessory seat 140b (and the second intermediate chill plate 506b) is laterally separated from the first intermediate accessory seat 140a (and the first intermediate chill plate 506a), and uses the fluid flowing out from the first intermediate chill plate 506a and the second intermediate chill plate 506b to provide symmetrical cooling of the substrate supported above the first intermediate chill plate 506a and the second intermediate chill plate 506b.

[0043] In certain examples, the load lock device 500 further includes an upper chill plate 508. As shown in FIG. 5, the upper chill plate 508 is fixed to the upper accessory seat 144 and covers the intermediate accessory opening 132. The upper chill plate 508 functions in a manner similar to the lower chill plate 404. In certain examples, the upper chill plate 508 may be a first upper chill plate 508a that covers the first upper accessory opening 134a with a first upper accessory seat 144a. The upper chill plate 508 may further include a second upper chill plate 508b that covers the second upper accessory opening 134b with a second upper accessory seat 144b. The second upper chill plate 508b may be similar to the first upper chill plate 508a. According to certain examples, the second upper accessory seat 144b (and the second upper chill plate 508b) is laterally separated from the first upper accessory seat 144a (and the first upper chill plate 508a) and uses the fluid flowing out from the first upper chill plate 508a and the second upper chill plate 508b to provide symmetrical cooling of the substrate supported above the first upper chill plate 508a and the second upper chill plate 508b.

[0044] As shown in FIG. 5, the intermediate accessory openings 130a and 130b are covered by fixing the intermediate chill plates 506a and 506b to the intermediate accessory seats 140a and 140b, respectively. The upper accessory openings 134a and 134b are covered by fixing the upper chill plates 508a and 508b to the upper accessory seats 144a and 144b, respectively. The lower accessory openings 136a and 136b are covered by fixing the lower chill plates 404a and 404b to the lower accessory seats 146a and 146b, respectively. As a result, as shown in FIG. 5, at least two upper chambers 160a and 160b, and at least two lower chambers 162a and 162b are formed within the load lock chamber body 150. Thus, the load lock device 500 meets the requirements for substrate cooling within the upper chambers 160a and 160b, and the lower chambers 162a and 162b.

[0045] In one alternative exemplary embodiment, the load lock device 500 can include intermediate chill plates 506a and 506b fixed to the intermediate accessory seats 140a and 140b, lower chill plates 404a and 404b fixed to the lower accessory seats 146a and 146b respectively, and blanking plates 304a and 304b (shown in FIG. 3) fixed to the upper accessory seats 144a and 144b respectively. Such an alternative load lock device 500 also meets the requirements for substrate cooling in the upper chambers 160a and 160b, and the lower chambers 162a and 162b.

[0046] In another alternative exemplary embodiment, the load lock device 500 can include upper chill plates 508a and 508b fixed to the upper accessory seats 144a and 144b, lower chill plates 404a and 404b fixed to the lower accessory seats 146a and 146b respectively, and blanking plates 304a and 304b (shown in FIG. 3) fixed to the intermediate accessory seats 140a and 140b respectively. Such an alternative load lock device 500 also meets the requirements for substrate cooling in the upper chambers 160a and 160b, and the lower chambers 162a and 162b.

[0047] Accordingly, the load lock device 500 enables easy conversion of the illustrated exemplary load lock device 500 into any desired device based on the processing operations of the process module(s) 12. Such a device further fixes a blanking plate to the upper accessory sheets (144a, 144b) and a heater to the intermediate accessory sheets (140a, 140b), facilitating conversion to a device where substrate heating may be required in the upper chambers (160a, 160b) but not in the lower chambers (162a, 162b), or vice versa. Similarly, such a device also fixes a blanking plate to the lower accessory sheets (146a, 146b) and a heater to the intermediate accessory sheets (140a, 140b), facilitating conversion to a device where substrate heating may be required in the lower chambers (162a, 162b) but not in the upper chambers (160a, 160b), or vice versa.

[0048] Referring now to FIG. 6, a cross-sectional view of a load lock device 600 for accommodating a plurality of wafer substrates at one time is shown. As shown in FIG. 6, the load lock device 600 includes a load lock chamber body 150 (as discussed in FIGS. 1-5). However, instead of the substrate support plate 302 (illustrated in FIG. 3), the load lock chamber body 150 is configured to accommodate a plurality of wafer substrates.

[0049] The load lock device 600 includes an upper lid 608 and a lower lid 604. The upper lid 608 and the lower lid 604 are configured to hold a quartz boat 615 within the load lock chamber opening 102. As shown in FIG. 6, the upper lid 608 covers the upper accessory opening 134 and is fixed to the upper accessory sheet 144a, and the lower lid 604 covers the lower accessory opening 136 and is fixed to the lower accessory sheet 146a. The upper lid 608 and the lower lid 604 hold the quartz boat 615 such that it is positioned within the chamber defined by the opening 102 through the load lock chamber body 150. The quartz boat 615 includes a plurality of slots 612, and each of the slots 612 is configured to hold one wafer substrate. Thus, one quartz boat 615 can hold a plurality of wafer substrates. In one exemplary embodiment, the quartz boat 615 is configured to hold 25 wafer substrates. Thus, the load lock device 600 enables the load lock chamber body 150 to accommodate a plurality of wafer substrates at once. Such a device can be advantageous in time management when a large number of wafers need to be processed.

[0050] Referring to FIG. 7, a method 700 for fabricating a load lock device for a semiconductor processing system, such as the load lock device 500 (illustrated in FIGS. 2a - 2b), is shown. Step 702 of method 700 includes forming a load lock chamber body, such as the load lock chamber body 150 (illustrated in FIGS. 2a - 2b). Step 704 of method 700 includes determining the processing operations of the process module. Step 706 of method 700 includes determining whether substrate cooling is required within the chamber of the load lock chamber body. If it is determined that substrate cooling is required within one of the chambers of the load lock chamber body, step 708 of method 700 includes fixing a chill plate, such as the chill plate 508, to at least one of an upper accessory sheet, such as the upper accessory sheet 144, a lower accessory sheet, such as the lower accessory sheet 146, and an intermediate accessory sheet, such as the intermediate accessory sheet 140.

[0051] In an exemplary embodiment of method 700, when substrate cooling is required, step 206 further includes determining a chamber that requires substrate cooling. For example, if substrate cooling is required in an upper chamber, such as upper chamber 160 (illustrated in FIG. 5) of the load lock body, method 700 further includes fixing a chill plate, such as chill plate 508, to one of the upper accessory sheet and the intermediate accessory sheet. For example, if substrate cooling is required in a lower chamber, such as lower chamber 162 (illustrated in FIG. 5) of the load lock chamber body, method 700 further includes fixing a chill plate, such as chill plate 404, to one of the lower accessory sheet and the intermediate accessory sheet.

[0052] Step 710 of method 700 includes determining whether substrate heating is required within a chamber of the load lock chamber body. If it is determined that substrate heating is required within one of the chambers of the load lock chamber body, step 712 of method 700 includes fixing a heater plate to at least one of the upper accessory sheet, the lower accessory sheet, and the intermediate accessory sheet of the load lock chamber. For example, if heating is required within the upper chamber of the load lock chamber body, method 700 includes fixing a heater plate to at least one of the upper accessory sheet and the intermediate accessory sheet to supply heat to the upper chamber. If heating is required within the lower chamber of the load lock chamber body, method 700 includes fixing a heater plate to at least one of the intermediate accessory sheet and the lower accessory sheet to supply heat to the lower chamber.

[0053] In an exemplary embodiment, method 700 further includes securing a substrate support plate to an upper accessory sheet. In some exemplary embodiments, method 700 further includes securing an upper lid to an upper accessory plate and securing a lower lid to a lower accessory plate. The upper accessory plate and the lower accessory plate are joined together to hold a quartz boat, such as quartz boat 615 (see FIG. 6), configured to hold a plurality of substrates at once. In an exemplary embodiment, when neither heating nor cooling is required, method 700 includes securing a blanking plate to at least one of the upper accessory sheet, the lower accessory sheet, and the intermediate accessory sheet.

[0054] Although the present disclosure has been provided in the context of certain specific embodiments and examples, it is to be understood by those skilled in the art that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses thereof and obvious modifications and equivalents thereof. In addition, while some variations of the embodiments of the present disclosure have been shown and described in detail, other changes within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. Various combinations or sub - combinations of the specific features and aspects of the embodiments may be made and are still intended to be within the scope of the present disclosure. It should be understood that the various features and aspects of the disclosed embodiments may be combined with or replaced by one another to form various modes of the embodiments of the present disclosure. Accordingly, it is intended that the scope of the present disclosure should not be limited by the specific embodiments described above.

[0055] The headings (if any) provided herein are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A load lock apparatus comprising: A load lock body, comprising: an upper plate having an upper accessory sheet opening and defining an upper accessory sheet in the upper accessory sheet opening; an intermediate plate spaced from the top plate having an intermediate accessory sheet opening and defining an intermediate accessory sheet in the intermediate accessory sheet opening; a lower plate having a lower accessory sheet opening and separated from the upper plate by the intermediate plate defining a lower accessory sheet in the lower accessory sheet opening; a first accessory plate fixed to the upper accessory sheet; a second accessory plate secured to the lower accessory sheet; A loadlock apparatus comprising: a loadlock body, the upper accessory sheet opening, the middle accessory sheet opening, and the lower accessory sheet opening being vertically aligned to form a loadlock body opening.

2. The load lock apparatus of claim 1 , wherein at least one of the first accessory plate and the second accessory plate is a blanking plate.

3. The load lock apparatus of claim 2 , wherein the first accessory plate is a substrate support plate and the second accessory plate is a blanking plate.

4. The load lock apparatus of claim 1 , wherein at least one of the first accessory plate and the second accessory plate is a chill plate.

5. The load lock apparatus of claim 4 , wherein the first accessory plate is a substrate support plate and the second accessory plate is a chill plate.

6. The load lock apparatus of claim 1 , further comprising a third accessory plate secured to the intermediate accessory seat.

7. The load lock apparatus of claim 6 , wherein the third accessory plate is at least one of a blanking plate and a chill plate.

8. the second accessory plate is a chill plate; The load lock apparatus of claim 6 , wherein at least one of the first accessory plate and the third accessory plate is a chill plate.

9. the second accessory plate is a chill plate; when the first accessory plate is a blanking plate, the third accessory plate is a chill plate; The load lock apparatus of claim 7 , wherein when the first accessory plate is a chill plate, the third accessory plate is a blanking plate.

10. the first accessory plate is a top lid; the second accessory plate is a bottom lid; the top lid and the bottom lid are coupled together such that they hold a quartz boat within the load lock body opening; The load lock apparatus of claim 1 , wherein the quartz boat is configured to hold a plurality of substrates.

11. the top plate further comprises a second upper accessory sheet opening defining a second upper accessory sheet in the second upper accessory sheet opening; the intermediate plate further comprises a second intermediate accessory sheet opening defined as a second intermediate accessory sheet in the second intermediate accessory sheet opening; the lower plate further comprises a second lower accessory sheet opening defining a second lower accessory sheet in the second lower accessory sheet opening; The load lock body includes: a fourth accessory plate secured to the second upper accessory sheet; and a fifth accessory plate secured to the second lower accessory sheet; 2. The load lock apparatus of claim 1, wherein the second upper accessory sheet opening, the second middle accessory sheet opening and the second lower accessory sheet opening are vertically aligned and form a second load lock body opening.

12. the fourth accessory plate is the same type of plate as the first accessory plate; The load lock apparatus of claim 11 , wherein the fifth accessory plate is the same type of plate as the second accessory plate.

13. 13. The load lock apparatus of claim 12, further comprising a partition vertically coupled to the upper plate and the lower plate such that the load lock body is divided into a first chamber having the upper accessory sheet and the lower accessory sheet and a second chamber having the second upper accessory sheet and the second lower accessory sheet.

14. 1. A method of making a load lock apparatus, comprising the steps of: a load lock chamber body having an upper plate having an upper accessory sheet opening and defining an upper accessory sheet at the upper accessory sheet opening, an intermediate plate spaced apart from the upper plate having an intermediate accessory sheet opening and defining an intermediate accessory sheet at the intermediate accessory sheet opening, and a lower plate separated from the upper plate by the intermediate plate having a lower accessory sheet opening and defining a lower accessory sheet at the lower accessory sheet opening; determining a processing operation for a process module, the process module is coupled to a back-end transfer module; determining that the back end transfer module is coupled to the load lock chamber body; when it is determined that the processing operation requires substrate cooling in at least one chamber of the load lock chamber body, securing a chill plate to at least one of the upper accessory sheet, the lower accessory sheet, and the intermediate accessory sheet; and when it is determined that the processing operation requires substrate heating within at least one chamber of the load lock chamber body, securing a heater plate to at least one of the upper accessory sheet, the lower accessory sheet, and the intermediate accessory sheet.

15. The method of claim 14, further comprising: securing a blanking plate to at least one of the upper accessory sheet, the lower accessory sheet, and the middle accessory sheet.

16. The method of claim 14 , further comprising fastening the substrate support plate to an upper accessory sheet.

17. fastening a top lid to a top accessory plate; fastening the lower lid to a lower accessory plate such that the upper lid is coupled to a lower lid to retain a quartz boat within the load lock chamber body; 15. The method of claim 14, further comprising: clamping, wherein the quartz boat is configured to hold a plurality of substrates.

18. A process module; a back-end transport module connected to the process module and housing a back-end substrate transport robot; a load lock apparatus connected to the back end transport module and further connected to an equipment front end module housing a front end substrate transport robot, The load lock device comprises: an upper plate having an upper accessory sheet opening and defining an upper accessory sheet in the upper accessory sheet opening; an intermediate plate spaced from the top plate having an intermediate accessory sheet opening and defining an intermediate accessory sheet in the intermediate accessory sheet opening; a lower plate separated from the upper plate by the intermediate plate, the lower plate having a lower accessory sheet opening and defining a lower accessory sheet in the lower accessory sheet opening; a first accessory plate fixed to the upper accessory sheet; a second accessory plate secured to the lower accessory sheet; the upper accessory seat opening, the middle accessory seat opening, and the lower accessory seat opening are vertically aligned to form a load lock body opening; The semiconductor processing system, wherein the front end substrate transport robot and the back end substrate transport robot are configured to transport substrates between the equipment front end module and the process module through the load lock chamber body.

19. 20. The semiconductor processing system of claim 18, wherein at least one of the first accessory plate and the second accessory plate are configured to hold a single substrate within a single chamber of the load lock chamber body.

20. the first accessory plate and the second accessory plate are coupled together and are further configured to hold a quartz boat; 20. The semiconductor processing system of claim 18, wherein the quartz boat is configured to hold multiple substrates within a single chamber of the load lock chamber body.

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