Substrate treatment apparatus and substrate treatment method

Abstract

To provide a substrate treatment apparatus and a substrate treatment method which can wind a treatment tape around a tape winding reel with appropriate tape tensile force, on the basis of an outer diameter of a wound body of the treatment tape.SOLUTION: A substrate treatment apparatus 1 includes: a substrate holding part 5; a treatment head 10; a tape winding reel 22 for winding a treatment tape 2; a winding reel rotation mechanism 32 for rotating the tape winding reel 22; a tape outer diameter acquisition mechanism 70 for acquiring an outer diameter of a wound body 36 of the treatment tape 2 wound around the tape winding reel 22; a rotation torque calculation part 72 for calculating rotation torque required for winding the treatment tape 2 by the tape winding reel 22 with predetermined tape tensile force, on the basis of the acquired outer diameter; and an operation control part 60 for controlling the operation of the winding reel rotation mechanism 32. The operation control part 60 is configured to rotate the tape winding reel 22 with rotation torque calculated by the winding reel rotation mechanism 32.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a wafer.

Background Art

[0002] From the viewpoint of improving the yield in the manufacture of semiconductor devices, management of the surface state of a substrate has recently attracted attention. In the manufacturing process of semiconductor devices, various materials are deposited on a silicon wafer. For this reason, unnecessary films and surface roughness are formed on the peripheral portion of the substrate. In recent years, a method of transporting a substrate while holding only the peripheral portion of the substrate with an arm has become common. Under such circumstances, the unnecessary film remaining on the peripheral portion peels off while going through various processes and adheres to the device formed on the substrate, resulting in a decrease in yield. Therefore, in order to remove the unnecessary film formed on the peripheral portion of the substrate, the peripheral portion of the substrate is polished using a polishing apparatus.

[0003] This type of polishing apparatus polishes the peripheral portion of the substrate by bringing a polishing tape into sliding contact with the peripheral portion of the substrate. More specifically, the substrate is held by a substrate holding portion and rotated, and the polishing head presses the polishing tape against the peripheral portion of the substrate to polish the peripheral portion of the substrate. During polishing of the substrate, the polishing tape is sent from a tape unwinding reel to a tape winding reel via the polishing head by a processing tape supply mechanism.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] The outer diameter of the roll of the polishing tape wound around the tape take-up reel increases as the amount of the polishing tape used increases. When a polishing tape with a large thickness or a polishing tape with a long overall length is used, the difference in the outer diameter of the roll at the start and the end of winding the polishing tape becomes significantly large.

[0006] Normally, since the tape take-up reel rotates with a constant rotational torque, the tape tension for winding the polishing tape is inversely proportional to the outer diameter of the roll of the wound polishing tape. For this reason, as the outer diameter of the roll of the polishing tape increases, the tape tension decreases, and there are cases where the tape take-up reel cannot wind the polishing tape properly. In order to be able to wind the polishing tape properly when the outer diameter of the roll of the polishing tape has increased, it is also conceivable to rotate the tape take-up reel with a large constant rotational torque. However, with a large rotational torque, an excessive tape tension is applied particularly at the start of winding the polishing tape, so that a load is applied to the polishing tape. As a result, problems such as breakage of the polishing tape and an influence on the feeding speed of the polishing tape may occur.

[0007] Therefore, the present invention provides a substrate processing apparatus and a substrate processing method capable of winding a processing tape around a tape take-up reel with an appropriate tape tension even when the outer diameter of the roll of the processing tape changes greatly.

Means for Solving the Problems

[0008] In one aspect, there is provided a substrate processing apparatus including: a substrate holding unit configured to hold and rotate a substrate; a processing head configured to press a processing tape against the substrate to process the substrate; a tape winding reel configured to wind up the processing tape used for processing the substrate; a winding reel rotation mechanism configured to rotate the tape winding reel; a tape outer diameter acquisition mechanism configured to acquire an outer diameter of a wound body of the processing tape wound around the tape winding reel; a rotation torque calculation unit configured to calculate a rotation torque required for the tape winding reel to wind up the processing tape with a predetermined tape tension based on the acquired outer diameter; and an operation control unit configured to control an operation of the winding reel rotation mechanism, wherein the operation control unit is configured to give a command to the winding reel rotation mechanism to rotate the tape winding reel with the calculated rotation torque.

[0009] In one aspect, the tape outer diameter acquisition mechanism is an outer diameter measurement device configured to measure the outer diameter of the wound body, and the rotation torque calculation unit is configured to calculate the rotation torque based on the measured outer diameter. In one aspect, the tape outer diameter acquisition mechanism includes a thickness measurement device configured to measure a thickness of the processing tape, and an outer diameter calculation unit configured to calculate the outer diameter of the wound body based on the measured thickness of the processing tape and an amount of use of the processing tape, and the rotation torque calculation unit is configured to calculate the rotation torque based on the calculated outer diameter. In one aspect, the tape outer diameter acquisition mechanism includes an outer diameter calculation unit configured to calculate the outer diameter of the wound body based on the thickness of the processing tape input via an input device and the amount of use of the processing tape, and the rotation torque calculation unit is configured to calculate the rotation torque based on the calculated outer diameter. In one aspect, the processing tape is a polishing tape having a polishing surface, and the processing head is a polishing head configured to press the polishing surface against the substrate to polish the substrate.

[0010] In one aspect, a substrate is held and rotated, a processing tape is pressed against the substrate by a processing head to process the substrate, a tape take-up reel is rotated by a take-up reel rotation mechanism, the processing tape used for processing the substrate is wound onto the tape take-up reel, an outer diameter of a wound body of the processing tape wound onto the tape take-up reel is acquired, based on the acquired outer diameter, a rotational torque required for the tape take-up reel to wind the processing tape with a predetermined tape tensile force is calculated, and the processing tape is wound onto the tape take-up reel by rotating the tape take-up reel with the calculated rotational torque by the take-up reel rotation mechanism. A substrate processing method is provided.

[0011] In one aspect, acquiring the outer diameter of the wound body is measuring the outer diameter of the wound body by an outer diameter measuring device, and calculating the rotational torque is calculating the rotational torque based on the measured outer diameter. In one aspect, acquiring the outer diameter of the wound body is measuring the thickness of the processing tape by a thickness measuring device, and calculating the outer diameter of the wound body based on the measured thickness of the processing tape and the usage amount of the processing tape, and calculating the rotational torque is calculating the rotational torque based on the calculated outer diameter. In one aspect, acquiring the outer diameter of the wound body is calculating the outer diameter of the wound body based on the thickness of the processing tape input via an input device and the usage amount of the processing tape, and calculating the rotational torque is calculating the rotational torque based on the calculated outer diameter. In one aspect, processing the substrate is pressing a polishing surface of a polishing tape against the substrate with a polishing head to polish the substrate.

Advantages of the Invention

[0012] The substrate processing apparatus and the substrate processing method can obtain the outer diameter of the roll of the processing tape wound around the tape take-up reel, and calculate the rotational torque for winding the processing tape with a predetermined appropriate tape tension based on the obtained outer diameter of the roll. As a result, even when the outer diameter of the roll of the processing tape changes significantly, the processing tape can be wound around the tape take-up reel with an appropriate tape tension.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing an embodiment of the substrate processing apparatus 1, and FIG. 2 is a plan view of the substrate processing apparatus 1 shown in FIG. 1. The substrate processing apparatus 1 of the present embodiment is an apparatus for processing the peripheral portion of a substrate W such as a wafer. In this specification, the peripheral portion of the substrate W refers to a region including at least one of the bevel portion, the top edge portion, and the bottom edge portion of the substrate W. In one embodiment, the substrate processing apparatus 1 may be an apparatus for processing the notch of the substrate W or an apparatus for processing the back surface of the substrate W.

[0015] As shown in FIG. 1, the substrate processing apparatus 1 includes a substrate holding unit 5 that holds and rotates a substrate W, a processing head 10 that presses a processing tape 2 against the substrate W to process the substrate W, a processing tape supply mechanism 20 that supplies the processing tape 2 to the processing head 10 and recovers it from the processing head 10, a lower supply nozzle 41, and an upper supply nozzle 42.

[0016] Specific examples of the substrate processing apparatus 1 include a polishing apparatus that polishes the substrate W and a cleaning apparatus that cleans the substrate W. When the substrate processing apparatus 1 is a polishing apparatus, the processing tape 2 is a polishing tape having a polishing surface to which abrasive grains are fixed, and the processing head 10 is a polishing head that presses the polishing tape against the substrate W to polish the substrate W. When the substrate processing apparatus 1 is a cleaning apparatus, the processing tape 2 is a cleaning tape composed of a non-woven fabric, a woven fabric, a knitted fabric, etc., and the processing head 10 is a cleaning head that presses the cleaning tape against the substrate W to clean the substrate W.

[0017] In the present embodiment, the substrate processing apparatus 1 includes one processing head 10. However, in one embodiment, the substrate processing apparatus 1 may include two or more processing heads.

[0018] The substrate holding unit 5 includes a holding stage 7 that holds the substrate W by vacuum suction, a shaft 8 connected to the central portion of the holding stage 7, and a holding stage drive mechanism 9 that rotates and vertically moves the holding stage 7. The holding stage drive mechanism 9 is configured to rotate the holding stage 7 around the rotation axis Cr and move it vertically along the rotation axis Cr. The axis passing through the center O1 of the substrate W and the rotation axis Cr of the holding stage 7 coincide.

[0019] The processing tape supply mechanism 20 includes a tape pay - out reel 21 that supplies the processing tape 2 to the processing head 10, a tape take - up reel 22 that winds up the processing tape 2 used for processing the substrate W, and a plurality of guide rollers 24, 25, 26, 27. The tape pay - out reel 21, the tape take - up reel 22, and the plurality of guide rollers 24, 25, 26, 27 are fixed to the reel base 28.

[0020] The roll 35 of the processing tape 2 before being used for processing the substrate W is attached to the tape pay - out reel 21. The processing tape 2 is sent from the tape pay - out reel 21 via the processing head 10 to the tape take - up reel 22. The traveling direction of the processing tape 2 is guided by the guide rollers 24, 25, 26, 27. The processing tape 2 used for processing the substrate W is wound up by the tape take - up reel 22 to form a roll 36.

[0021] The processing tape supply mechanism 20 further includes a pay - out reel rotation mechanism 31 and a take - up reel rotation mechanism 32. The pay - out reel rotation mechanism 31 is connected to the tape pay - out reel 21, and the take - up reel rotation mechanism 32 is connected to the tape take - up reel 22. The pay - out reel rotation mechanism 31 is configured to apply a rotational torque to the tape pay - out reel 21 to rotate the tape pay - out reel 21. The take - up reel rotation mechanism 32 is configured to apply a rotational torque to the tape take - up reel 22 to rotate the tape take - up reel 22.

[0022] In one embodiment, each of the pay - out reel rotation mechanism 31 and the take - up reel rotation mechanism 32 is a combination of a motor and a motor driver that applies a voltage to the motor. The rotational torque of the motor can be changed by the voltage applied from the motor driver to the motor.

[0023] As shown by the arrows in FIG. 1, the unwind reel rotation mechanism 31 and the take-up reel rotation mechanism 32 can apply a predetermined tension to the processing tape 2 by rotating the tape unwind reel 21 and the tape take-up reel 22 in opposite directions. The processing tape 2 is fed at a predetermined speed by a tape feed mechanism 18 provided in the processing head 10.

[0024] The lower supply nozzle 41 is configured to supply liquid to the lower surface of the substrate W. The upper supply nozzle 42 is configured to supply liquid to the upper surface of the substrate W. An example of the liquid supplied to the substrate W is pure water. During the processing of the substrate W, liquid is supplied from the lower supply nozzle 41 to the lower surface of the substrate W and liquid is supplied from the upper supply nozzle 42 to the upper surface of the substrate W.

[0025] The processing head 10 includes a pressing member 12 that presses the processing tape 2 against the peripheral edge of the substrate W, and an air cylinder (drive mechanism) 15 that moves the pressing member 12 toward the peripheral edge of the substrate W. By controlling the air pressure supplied to the air cylinder 15, the pressing force of the processing tape 2 against the substrate W is adjusted. The pressing member 12 is disposed on the back surface side of the processing tape 2. As a drive mechanism for moving the pressing member 12 toward the peripheral edge of the substrate W, an electric actuator may be used instead of the air cylinder 15.

[0026] As shown in FIG. 2, the substrate processing apparatus 1 further includes a tilt mechanism 50 that tilts the processing head 10 with respect to the substrate holding surface 7a of the holding stage 7. The tilt mechanism 50 is connected to the processing head 10. The tilt mechanism 50 includes a tilt arm 52 connected to the processing head 10 and an arm rotating device 53 that rotates the tilt arm 52. One end of the tilt arm 52 is located at the same height as the substrate holding surface 7a of the holding stage 7 and is connected to the arm rotating device 53. The other end of the tilt arm 52 is connected to the processing head 10.

[0027] When the arm rotating device 53 of the tilt mechanism 50 rotates the tilt arm 52, the entire processing head 10 can be tilted with respect to the substrate W on the substrate holding surface 7a of the holding stage 7 at a predetermined tilting speed. Further, the tilt mechanism 50 is configured to be able to maintain the processing head 10 at a predetermined tilt angle. Note that as long as the processing head 10 can be tilted with respect to the substrate holding surface 7a of the holding stage 7 and the substrate W, the specific configuration of the tilt mechanism 50 is not limited to this embodiment.

[0028] The holding stage drive mechanism 9 of the substrate holding unit 5, the air cylinder 15 and the tape feeding mechanism 18 of the processing head 10, the unwinding reel rotation mechanism 31 and the winding reel rotation mechanism 32 of the processing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, and the arm rotation device 53 of the tilt mechanism 50 are electrically connected to the operation control unit 60. The operations of the holding stage drive mechanism 9 of the substrate holding unit 5, the air cylinder 15 and the tape feeding mechanism 18 of the processing head 10, the unwinding reel rotation mechanism 31 and the winding reel rotation mechanism 32 of the processing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, and the arm rotation device 53 of the tilt mechanism 50 are controlled by the operation control unit 60.

[0029] The operation control unit 60 includes at least one computer. The operation control unit 60 includes a storage device 60a in which programs and the like are stored, and an arithmetic device 60b that executes arithmetic operations according to instructions included in the program. The storage device 60a includes a main storage device such as a random access memory (RAM), and auxiliary storage devices such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 60b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 60 is not limited to these examples.

[0030] The processing of the peripheral portion of the substrate W is performed as follows. The substrate W to be processed is placed on the substrate holding surface 7a of the holding stage 7 of the substrate holding unit 5 and held by vacuum suction. The substrate holding unit 5 lowers the substrate W to the processing position and rotates the holding stage 7. Further, liquid is supplied from the lower supply nozzle 41 and the upper supply nozzle 42. Next, the air cylinder 15 of the processing head 10 is driven, and the pressing member 12 presses the processing tape 2 against the peripheral portion of the substrate W, whereby the peripheral portion of the substrate W is processed. During the processing of the substrate W, the tilt mechanism 50 tilts the processing head 10 with respect to the substrate holding surface 7a of the holding stage 7 at a predetermined tilting speed. Alternatively, the tilt mechanism 50 maintains the processing head 10 at a predetermined tilt angle with respect to the substrate holding surface 7a of the holding stage 7.

[0031] The substrate processing apparatus 1 further includes a tape outer diameter acquisition mechanism that acquires the outer diameter of the wound body 36 of the processing tape 2 wound around the tape winding reel 22. As shown in FIG. 1, in the present embodiment, the tape outer diameter acquisition mechanism is an outer diameter measuring device 70 that measures the outer diameter of the wound body 36 of the processing tape 2 wound around the tape winding reel 22.

[0032] FIG. 3 is a schematic diagram showing the processing tape supply mechanism 20 according to the present embodiment and the outer diameter measuring device 70 as the tape outer diameter acquisition mechanism. As shown in FIG. 3, the outer diameter measuring device 70 as the tape outer diameter acquisition mechanism is disposed on the radially outer side of the wound body 36 of the processing tape 2 wound around the tape winding reel 22. The outer diameter measuring device 70 is configured to measure the outer diameter D of the wound body 36 based on the distance to the surface of the wound body 36 of the processing tape 2. In one embodiment, the outer diameter measuring device 70 includes a non-contact or contact displacement sensor and a signal processing unit that detects the outer diameter D of the wound body 36 based on the signal output by the displacement sensor.

[0033] The specific configuration of the outer diameter measuring device 70 is not limited to the above-described embodiment as long as it can measure the outer diameter of the wound body 36 of the processing tape 2 wound around the tape take-up reel 22. For example, the outer diameter measuring device 70 may include an image generation device that generates an image of the wound body 36 of the processing tape 2, and may be configured to detect the outer diameter D of the wound body 36 based on the generated image of the wound body 36 of the processing tape 2.

[0034] The substrate processing apparatus 1 further includes a rotational torque calculation unit 72 that calculates the rotational torque required for the tape take-up reel 22 to wind up the processing tape 2 with a predetermined tape tensile force based on the outer diameter D of the wound body 36 of the processing tape 2 acquired by the tape outer diameter acquisition mechanism. In the present embodiment, the rotational torque calculation unit 72 is configured to calculate the rotational torque required for the tape take-up reel 22 to wind up the processing tape 2 with a predetermined tape tensile force based on the outer diameter D of the wound body 36 of the processing tape 2 measured by the outer diameter measuring device 70.

[0035] The rotational torque calculation unit 72 is electrically connected to the tape outer diameter acquisition mechanism, and the outer diameter D of the wound body 36 of the processing tape 2 acquired by the tape outer diameter acquisition mechanism is sent to the rotational torque calculation unit 72. In the present embodiment, the rotational torque calculation unit 72 is electrically connected to the outer diameter measuring device 70, and the outer diameter D of the wound body 36 of the processing tape 2 measured by the outer diameter measuring device 70 is sent to the rotational torque calculation unit 72.

[0036] FIG. 4 is a schematic diagram showing how the processing tape 2 is wound around the tape take-up reel 22. By rotating the tape take-up reel 22 with a rotational torque T by the reel rotation mechanism 32, the processing tape 2 is wound around the tape take-up reel 22 with a tape tensile force F. The relationship between this rotational torque T, the tape tensile force F, and the outer diameter D of the wound body 36 of the processing tape 2 wound around the tape take-up reel 22 is expressed by the following formula (1). F = 2T / D (1)

[0037] The rotational torque calculation unit 72 calculates the rotational torque T from the outer diameter D of the winding body 36 of the processing tape 2 measured by the outer diameter measuring device 70 and a predetermined tape tensile force F using the above formula (1). The tape tensile force F is predetermined to be an appropriate value for normally winding the processing tape 2 around the tape take-up reel 22. During the processing of the substrate W, the tape tensile force F is constant. In one embodiment, the tape tensile force F is constant from the start of use of the processing tape 2 until the entire processing tape 2 is wound around the tape take-up reel 22.

[0038] The rotational torque calculation unit 72 is electrically connected to the operation control unit 60, and the rotational torque T calculated by the rotational torque calculation unit 72 is sent to the operation control unit 60. The operation control unit 60 is configured to give a command to the take-up reel rotation mechanism 32 to rotate the tape take-up reel 22 with the calculated rotational torque T.

[0039] The rotational torque calculation unit 72 includes at least one computer. The rotational torque calculation unit 72 includes a storage device 72a in which a program and the like are stored, and an arithmetic device 72b that executes arithmetic operations according to instructions included in the program. The storage device 72a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 72b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the rotational torque calculation unit 72 is not limited to these examples. In one embodiment, the rotational torque calculation unit 72 may be integrally configured with the operation control unit 60.

[0040] The acquisition of the outer diameter D of the reel 36 of the processing tape 2 by the tape outer diameter acquisition mechanism (in this embodiment, the measurement of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter measuring device 70), and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed during the processing of the substrate W. Alternatively, the acquisition of the outer diameter D of the reel 36 of the processing tape 2 by the tape outer diameter acquisition mechanism (in this embodiment, the measurement of the outer diameter D of the reel 36 of the processing tape 2 by the outer diameter measuring device 70), and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed every time the processing of one or a predetermined number of substrates is completed.

[0041] According to this embodiment, the substrate processing apparatus 1 can acquire the outer diameter D of the reel 36 of the processing tape 2 wound around the tape take-up reel 22, and calculate the rotational torque T for winding the processing tape 2 with a predetermined appropriate tape tension F based on the acquired outer diameter D of the reel 36. As a result, even when the outer diameter D of the reel 36 of the processing tape 2 changes significantly, the processing tape 2 can be wound around the tape take-up reel 22 with an appropriate tape tension F.

[0042] FIG. 5 is a schematic diagram showing another embodiment of the tape outer diameter acquisition mechanism. The configuration and operation of this embodiment that are not particularly described are the same as those of the above-described embodiment, and thus the overlapping description thereof is omitted. The tape outer diameter acquisition mechanism of this embodiment includes a thickness measuring device 75 that measures the thickness of the processing tape 2, and an outer diameter calculation unit 76 that calculates the outer diameter D of the reel 36 based on the thickness of the processing tape 2 measured by the thickness measuring device 75 and the usage amount of the processing tape 2, instead of the outer diameter measuring device 70.

[0043] As shown in FIG. 5, the thickness measuring device 75 of the present embodiment includes two distance measuring devices 75a and 75b disposed on both sides of the processing tape 2 in the thickness direction of the processing tape 2, and a signal processing unit 75c electrically connected to the distance measuring devices 75a and 75b. The two distance measuring devices 75a and 75b measure the distances to the surfaces of the processing tape 2 respectively. The signal processing unit 75c is configured to detect the thickness of the processing tape 2 based on the distances to the surfaces of the processing tape 2 measured by the distance measuring devices 75a and 75b. Examples of the two distance measuring devices 75a and 75b include non-contact or contact displacement sensors.

[0044] The two distance measuring devices 75a and 75b of the present embodiment are disposed on both sides of the processing tape 2 extending between the tape unwinding reel 21 and the processing head 10. However, in one embodiment, the two distance measuring devices 75a and 75b may be disposed on both sides of the processing tape 2 extending between the processing head 10 and the tape winding reel 22.

[0045] The specific configuration of the thickness measuring device 75 is not limited to the present embodiment as long as it can measure the thickness of the processing tape 2. For example, the thickness measuring device 75 may include a fixed wall having a support surface along which the processing tape 2 is arranged, and one distance measuring device, and is configured to measure the difference between the distance to the support surface of the fixed wall and the distance to the surface of the processing tape 2 on the support surface as the thickness of the processing tape 2.

[0046] The outer diameter calculation unit 76 is electrically connected to the thickness measuring device 75, and the thickness of the processing tape 2 measured by the thickness measuring device 75 is sent to the outer diameter calculation unit 76. The outer diameter calculation unit 76 is configured to calculate the outer diameter D of the wound body 36 based on the thickness of the processing tape 2 measured by the thickness measuring device 75 and the usage amount of the processing tape 2. The usage amount of the processing tape 2 is calculated based on the rotation speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2. In this specification, the "usage amount of the processing tape 2" is the cumulative value of the usage amount of the processing tape 2 from the time when the use of the unused processing tape 2 is started.

[0047] The rotational speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2 are stored in the storage device 60a of the operation control unit 60. Specifically, the motor rotational speed of the tape feeding device 18 is stored in the storage device 60a as a predetermined processing recipe. The feeding time of the processing tape 2 is measured as the cumulative value of the operation time of the motor of the tape feeding device 18 from the time when the use of the unused processing tape 2 is started, and is stored in the storage device 60a. The outer diameter calculation unit 76 is electrically connected to the operation control unit 60, and the rotational speed of the motor of the tape feeding device 18 and the feeding time of the processing tape 2 are sent to the outer diameter calculation unit 76.

[0048] FIG. 6 is a diagram for explaining a method of calculating the outer diameter D of the wound body 36 based on the thickness Y of the processing tape 2 measured by the outer diameter calculation unit 76. The product S1 of the thickness Y of the processing tape 2 measured by the thickness measuring device 75 and the usage amount L of the processing tape is equal to the area S2 of the wound body 36 of the processing tape 2 when viewed from the axial direction of the tape winding reel 22.

[0049] The area S2 of the wound body 36 of the processing tape 2 when viewed from the axial direction of the tape winding reel 22 is represented by the following formula (2). S2 = π / 4(D 2 -E 2 ) (2) Here, D is the outer diameter of the wound body 36, and E is the outer diameter of the core 22a of the tape winding reel 22. Therefore, the equation of the following formula (3) holds, and the outer diameter D of the wound body 36 is represented by the following formula (4). Y × L = π / 4(D 2 -E 2 ) (3) D = √(Y × L × 4 / π + E 2 ) (4)

[0050] The outer diameter calculation unit 76 calculates the outer diameter D of the wound body 36 from the thickness Y of the processing tape 2, the usage amount of the processing tape 2, and the outer diameter E of the core 22a of the tape winding reel 22 using the above formula (4). The outer diameter E of the core 22a of the tape winding reel 22 is stored in advance in the storage device 76a of the outer diameter calculation unit 76 described later.

[0051] As shown in FIG. 5, in the present embodiment, the rotational torque calculation unit 72 is electrically connected to the outer diameter calculation unit 76, and the outer diameter D of the winding body 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 is sent to the rotational torque calculation unit 72. The rotational torque calculation unit 72 calculates the rotational torque T from the outer diameter D of the winding body 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 and a predetermined tape tensile force F using the above-described formula (1).

[0052] The outer diameter calculation unit 76 includes at least one computer. The outer diameter calculation unit 76 includes a storage device 76a in which a program and the like are stored, and an arithmetic device 76b that executes arithmetic operations according to instructions included in the program. The storage device 76a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 76b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the outer diameter calculation unit 76 is not limited to these examples. In one embodiment, the outer diameter calculation unit 76 may be integrally configured with the rotational torque calculation unit 72 and / or the operation control unit 60.

[0053] The thickness of the processing tape 2 is measured by the thickness measuring device 75 at least every time a processing tape 2 having a different thickness is attached to the tape pay-out reel 21. The calculation of the outer diameter D of the winding body 36 of the processing tape 2 by the outer diameter calculation unit 76 and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed during the processing of the substrate W. Alternatively, the calculation of the outer diameter D of the winding body 36 of the processing tape 2 by the outer diameter calculation unit 76 and the calculation of the rotational torque T by the rotational torque calculation unit 72 may be performed every time the processing of one or a predetermined number of substrates is completed.

[0054] FIG. 7 is a schematic diagram showing yet another embodiment of the tape outer diameter acquisition mechanism. The configuration and operation of this embodiment that are not particularly described are the same as those of the embodiment described with reference to FIGS. 5 and 6, and thus the overlapping description thereof is omitted. In this embodiment, the outer diameter calculation unit 76 is configured to calculate the outer diameter of the winding body 36 based on the thickness of the processing tape 2 input via the input device 80 and the usage amount of the processing tape 2. The specific numerical value of the thickness of the processing tape 2 can be obtained from the specification data of the processing tape 2 provided by the manufacturer of the processing tape 2.

[0055] The input device 80 is electrically connected to the outer diameter calculation unit 76, and the thickness of the processing tape 2 input to the input device 80 is sent to the outer diameter calculation unit 76. The input device 80 may be a device included in the substrate processing apparatus 1 or a device provided outside the substrate processing apparatus 1. The thickness of the processing tape 2 is input via the input device 80 each time at least a processing tape 2 having a different thickness is attached to the tape unwinding reel 21.

[0056] The outer diameter calculation unit 76 uses the above-described formula (4) to calculate the outer diameter D of the winding body 36 from the thickness of the processing tape 2 input via the input device 80, the usage amount of the processing tape 2, and the outer diameter E of the core 22a of the tape winding reel 22. The outer diameter D of the winding body 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 is sent to the rotational torque calculation unit 72. The rotational torque calculation unit 72 calculates the rotational torque T using the above-described formula (1) from the outer diameter D of the winding body 36 of the processing tape 2 calculated by the outer diameter calculation unit 76 and a predetermined tape tensile force F.

[0057] The above-described embodiments are described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to implement the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0058] 1 Substrate processing apparatus 2 Processing tape 5 Substrate holding unit 7 Holding stage 7a Substrate holding surface 8 Shaft 9 Holding stage drive mechanism 10 Processing head 12 Pressing member 15 Air cylinder (drive mechanism) 18 Tape feeding mechanism 20 Processing tape supply mechanism 21 Tape unwinding reel 22 Tape winding reel 24, 25, 26, 27 Guide rollers 28 Reel base 31 Unwinding reel rotation mechanism 32 Winding reel rotation mechanism 35, 36 Coils 41 Lower supply nozzle 42 Upper supply nozzle 50 Tilt mechanism 52 Tilt arm 53 Arm rotating device 60 Operation control unit 60a Storage device 60b Arithmetic unit 70 Outer diameter measuring device 72 Rotational torque calculation unit 72a Storage device 72b Arithmetic unit 75 Thickness measuring device 75a, 75b Distance measuring instruments 75c Signal processing unit 76 Outer diameter calculation unit 76a Storage device 76b Arithmetic unit 80 Input device

Claims

1. a substrate holding unit that holds and rotates a substrate; a processing head that presses a processing tape against the substrate to process the substrate; a tape winding reel that winds up the processing tape used for processing the substrate; a winding reel rotation mechanism that rotates the tape winding reel; a tape outer diameter acquisition mechanism that acquires the outer diameter of the wound body of the processing tape wound around the tape winding reel; a rotational torque calculation unit that calculates the rotational torque required for the tape winding reel to wind up the processing tape with a predetermined tape tension based on the acquired outer diameter; comprising an operation control unit that controls the operation of the winding reel rotation mechanism; The operation control unit is configured to give a command to the winding reel rotation mechanism to rotate the tape winding reel with the calculated rotational torque. A substrate processing apparatus.

2. The tape outer diameter acquisition mechanism is an outer diameter measuring device that measures the outer diameter of the wound body, The rotational torque calculation unit is configured to calculate the rotational torque based on the measured outer diameter. The substrate processing apparatus according to claim 1.

3. The tape outer diameter acquisition mechanism is a thickness measuring device that measures the thickness of the processing tape, comprising an outer diameter calculation unit that calculates the outer diameter of the wound body based on the measured thickness of the processing tape and the usage amount of the processing tape, The rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter. The substrate processing apparatus according to claim 1.

4. The tape outer diameter acquisition mechanism is comprising an outer diameter calculation unit that calculates the outer diameter of the wound body based on the thickness of the processing tape input via an input device and the usage amount of the processing tape, The rotational torque calculation unit is configured to calculate the rotational torque based on the calculated outer diameter. The substrate processing apparatus according to claim 1.

5. The processing tape is a polishing tape having a polishing surface, The processing head is a polishing head that presses the polishing surface against the substrate to polish the substrate. The substrate processing apparatus according to any one of claims 1 to 4.

6. Holding and rotating a substrate, pressing a processing tape against the substrate with a processing head to process the substrate, The tape take-up reel is rotated by a take-up reel rotation mechanism to wind the processing tape used for processing the substrate onto the tape take-up reel. The outer diameter of the wound body of the processing tape wound on the tape take-up reel is obtained. Based on the obtained outer diameter, the rotational torque required for the tape take-up reel to wind the processing tape with a predetermined tape tension is calculated. A substrate processing method in which the processing tape is wound onto the tape take-up reel by rotating the tape take-up reel with the calculated rotational torque by the take-up reel rotation mechanism.

7. Obtaining the outer diameter of the wound body is to measure the outer diameter of the wound body with an outer diameter measuring device. Calculating the rotational torque is to calculate the rotational torque based on the measured outer diameter, according to the substrate processing method described in Claim 6.

8. Obtaining the outer diameter of the wound body is to measure the thickness of the processing tape with a thickness measuring device, and calculate the outer diameter of the wound body based on the measured thickness of the processing tape and the usage amount of the processing tape. Calculating the rotational torque is to calculate the rotational torque based on the calculated outer diameter, according to the substrate processing method described in Claim 6.

9. Obtaining the outer diameter of the wound body is to calculate the outer diameter of the wound body based on the thickness of the processing tape input via an input device and the usage amount of the processing tape. Calculating the rotational torque is to calculate the rotational torque based on the calculated outer diameter, according to the substrate processing method described in Claim 6.

10. Processing the substrate is to press the polishing surface of the polishing tape against the substrate with a polishing head to polish the substrate, according to the substrate processing method described in any one of Claims 6 to 9.

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