Bonding device and bonding method

Abstract

To provide a bonding device capable of transporting with high efficiency.SOLUTION: A bonding device includes: a board temporary placement area for temporarily placing a board carried into the bonding device; a board transportation unit that receives the board from the board temporary placement area and transports the same; a board holding unit that receives the board from the board transportation unit and holds the same; and a bonding head that bonds a component to the board held by the board holding unit. The board transportation unit includes: a first board transportation unit that receives the board from the board temporary placement area and transports the same; and a second board transportation unit that receives the board from the first board transportation unit and hands over the same to the board holding unit.SELECTED DRAWING: Figure 15B

Description

Technical Field

[0001] The present disclosure relates to a bonding apparatus and a bonding method.

Background Art

[0002] Conventionally, with the high integration of semiconductor devices, a technique for three-dimensionally stacking chips has been proposed. For example, a bonding apparatus for bonding semiconductor wafers on which a plurality of chips are formed has been proposed (see Patent Document 1). In the bonding apparatus of Patent Document 1, a semiconductor wafer is supplied by a transfer device that transfers the semiconductor wafer in a clean environment from which particles are excluded, two semiconductor wafers received from the transfer device are bonded to create a polymerized wafer, and the polymerized wafer is taken out by the transfer device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, semiconductor elements are stacked by bonding semiconductor wafers together, but a method of stacking components (chips) cut out from a semiconductor wafer on a substrate (semiconductor wafer) is also known. In this case, a bonding apparatus that picks up a plurality of components held by a component carrier (for example, a tape frame) and bonds them to a substrate is used. In order to apply such a bonding apparatus to Patent Document 1, the bonding apparatus needs to transfer two different types of objects, namely, a component carrier and a substrate, to and from a transfer device.

[0005] An object of the present disclosure is to provide a bonding apparatus with high transfer efficiency.

[0006] The bonding apparatus according to one aspect of the present disclosure includes a substrate temporary placement unit that temporarily places a substrate carried into the bonding apparatus, a substrate transfer device that receives the substrate from the substrate temporary placement unit and transfers it, a substrate holding unit that receives and holds the substrate from the substrate transfer device, and a bonding head that joins components to the substrate held by the substrate holding unit. The substrate transfer device includes a first substrate transfer device that receives the substrate from the substrate temporary placement unit and transfers it, and a second substrate transfer device that receives the substrate from the first substrate transfer device and transfers it so as to deliver it to the substrate holding unit.

[0007] The bonding method according to one aspect of the present disclosure includes a step of temporarily placing a substrate carried into the bonding apparatus on the substrate temporary placement unit, a step of transferring the substrate between the substrate temporary placement unit and the substrate holding unit, a step of holding the substrate by the substrate holding unit, and a step of joining components to the substrate held by the substrate holding unit. In the transferring step, the first substrate transfer device receives the substrate from the substrate temporary placement unit and transfers it to the second substrate transfer device, and the second substrate transfer device delivers the substrate to the substrate holding unit.

Advantages of the Invention

[0008] According to the present disclosure, it is possible to provide a bonding apparatus with improved transfer efficiency.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] (Embodiment 1) The bonding system 1 according to Embodiment 1 of the present disclosure will be described. FIG. 1 is a schematic plan view showing a simplified bonding system 1 according to Embodiment 1 of the present disclosure.

[0011] [1. Overall Configuration] As shown in FIG. 1, the bonding system 1 is a system for individually bonding a plurality of components (not shown) held by a component carrier C to a substrate S. In the present embodiment, the components are chips formed by singulating a semiconductor wafer, the component carrier C is a tape frame having an adhesive surface for adhesively holding a plurality of components, and the substrate S is a semiconductor wafer. The tape frame may be referred to as a dicing frame or a wafer ring, for example.

[0012] The bonding system 1 shown in FIG. 1 includes a load port 2, a loading module 3, a relay module 4, a transfer module 9, a plurality of surface treatment modules 5, 6, 7, 8, a bonding apparatus 10, and an overall control unit 11. In FIG. 1, the horizontal directions orthogonal to each other are the X-axis direction / Y-axis direction, and the vertical direction orthogonal to both the X-axis direction and the Y-axis direction is the Z-axis direction.

[0013] The load port 2 is a member for supplying the substrate S and the component carrier C to the loading module 3. The load port 2 mounts a sealed container 2A containing a plurality of substrates S and a sealed container 2B containing a plurality of component carriers C.

[0014] The loading module 3 is a module for loading the substrate S and the component carrier C supplied from the load port 2 into the bonding system 1. The loading module 3 may be referred to as an EFEM (Equipment Front End Module).

[0015] The loading module 3 includes a transfer robot 3A and a robot moving table 3B. The transfer robot 3A is a robot for transferring the substrate S and the component carrier C supplied from the load port 2. The transfer robot 3A has arms for holding one substrate S and one component carrier C respectively, and may be referred to as a dual-arm robot. The robot moving table 3B is a drive table for moving the transfer robot 3A. The transfer robot 3A is moved in the Y direction and the Z direction by the robot moving table 3B and rotates about a rotation axis extending in the Z direction.

[0016] The transfer robot 3A accesses each of the sealed containers 2A and 2B mounted on the load port 2 to take out the substrate S or the component carrier C.

[0017] A relay module 4 is connected to the downstream side of the loading module 3. The transfer robot 3A supplies the substrate S or the component carrier C taken out from the load port 2 to the relay module 4.

[0018] A transfer module 9 is connected to the downstream side of the relay module 4. The transfer module 9 is a module for transferring the substrate S and the component carrier C between the relay module 4, a plurality of surface treatment modules 5, 6, 7, 8, and the bonding device 10.

[0019] The transfer module 9 includes a transfer robot 9A and a robot moving table 9B. In Embodiment 1, the transfer robot 9A has the same configuration as the transfer robot 3A, and the robot moving table 9B has the same configuration as the robot moving table 3B. The transfer robot 9A is moved in the X direction by the robot moving table 9B and rotates about a rotation axis extending in the Z direction.

[0020] The transfer module 9 is connected to the surface treatment modules 5, 6, 7, and 8. The surface treatment modules 5, 6, 7, and 8 are modules for performing surface treatment on the substrate S and the component carrier C. The surface treatment of the substrate S and the component carrier C is executed before the bonding process in the bonding apparatus 10. The surface treatment executed by the surface treatment modules 5, 6, 7, and 8 may be any one of cleaning using a predetermined liquid, plasma treatment, and UV irradiation.

[0021] The bonding apparatus 10 is further connected to the transfer module 9. The bonding apparatus 10 is an apparatus for individually picking up (pick-up process) a plurality of components held by the component carrier C and bonding (bonding process) them to the substrate S.

[0022] In Embodiment 1, the bonding apparatus 10 includes a bonding module 20, a component supply module 50, and a control unit 80. The bonding module 20 is a module for receiving the substrate S from the transfer robot 9A. The component supply module 50 is a module for receiving the component carrier C from the transfer robot 9A. The control unit 80 is a member that controls each component of the bonding module 20 and the component supply module 50.

[0023] The bonding module 20 and the component supply module 50 are arranged adjacent to each other in the X direction, which is the moving direction of the transfer robot 9A, and their internal spaces communicate with each other. Therefore, it is easy to transfer the components picked up from the component carrier C in the component supply module 50 from the component supply module 50 to the bonding module 20 and bond them to the substrate S in the bonding module 20.

[0024] Each of the bonding module 20 and the component supply module 50 is provided with connection openings 30A and 60A that communicate with the transfer module 9. The transfer robot 9A carries the substrate S into and out of the bonding module 20 through the connection opening 30A, and carries the component carrier C into and out of the component supply module 50 through the connection opening 60A.

[0025] A shutter for opening and closing the connection openings 30A and 60A is further provided. The connection openings 30A and 60A are closed except when loading and unloading the substrate S or the component carrier C, and the shutter operates only when loading and unloading the substrate S or the component carrier C to open the opening.

[0026] The loading module 3, the relay module 4, and the transfer module 9 are managed so that the number of particles in their internal spaces is reduced. The substrate S and the component carrier C are transferred from the load port 2 to the surface treatment modules 5, 6, 7 and the bonding apparatus 10 in an environment with few particles.

[0027] The control unit 80 is composed of, for example, a microcomputer including a processor and a memory storing a computer program executed by the processor.

[0028] The overall control unit 11 is a member that controls each component of the bonding system 1. The overall control unit 11 controls the control unit 80. The overall control unit 11 is composed of, for example, a microcomputer including a processor and a memory storing a computer program executed by the processor.

[0029] [2. Configuration of Bonding Apparatus] Here, the configuration of the bonding apparatus 10 will be described. FIG. 2 is a plan view of the bonding apparatus 10.

[0030] As shown in FIG. 2, the bonding module 20 has a substrate temporary placement portion 21, a first substrate transfer device 22, a second substrate transfer device 23, a substrate holding table 25, a bonding head 26, a first housing 30, and a first base 39. In FIG. 2, the first substrate transfer device 22 is located below the substrate temporary placement portion 21.

[0031] The substrate temporary placement unit 21 is a member for temporarily placing the substrate S carried in by the transfer robot 9A. The first substrate transfer device 22 is a device for transferring the substrate S placed in the substrate temporary placement unit 21 and delivering the substrate S to the second substrate transfer device 23. The second substrate transfer device 23 is a device for delivering the received substrate S to the substrate holding table 25. The substrate holding table 25 includes a stage 46 and a stage moving device 47. The stage 46 holds the substrate S received from the second substrate transfer device 23 and is a stage for holding the substrate S even during the component bonding process. The stage moving device 47 moves the stage 46 and can move the stage 46 within a range including the receiving position Y1 and the working position Y2.

[0032] The bonding head 26 is a head that receives components from the component supply module 50 and bonds the received components to the substrate S held on the substrate holding table 25.

[0033] The substrate transfer devices 22 and 23 transfer the substrate S for which the bonding process has been completed from the substrate holding table 25 back to the substrate temporary placement unit 21. The substrate S for which the bonding process has been completed is carried out of the bonding module 20 from the substrate temporary placement unit 21 by the transfer robot 9A.

[0034] The substrate S for which the bonding process has been completed means the substrate for which the bonding process of components in a certain layer on the substrate S has been completed, and is not limited to the substrate for which the bonding process of all components has been completed.

[0035] The first housing 30 is a member for housing the substrate temporary placement unit 21, the substrate transfer devices 22 and 23, the substrate holding table 25, and the bonding head 26 and separating them from other modules. The first base 39 is a member for supporting the substrate temporary placement unit 21, the first substrate transfer device 22, the second substrate transfer device 23, the substrate holding table 25, and the bonding head 26 from below.

[0036] The first housing 30 is provided with a connection opening 30A. The connection opening 30A is formed at a position adjacent to the substrate temporary placement portion 21 and opens in a direction (Y direction) intersecting the conveyance path of the transfer robot 9A. In the bonding module 20, the connection opening 30A, the substrate temporary placement portion 21, and the substrate holding table 25 are arranged in this order in the -Y direction. Therefore, the conveyance path along which the substrate S is conveyed within the bonding module 20 is linear in plan view, and the direction in which the conveyance path extends (substrate conveyance direction D1) is along the Y direction. Here, the substrate conveyance direction D1 is due to the conveyance of the substrate S by the substrate conveyance devices 22 and 23 and the conveyance of the substrate S by the movement of the substrate holding table 25 in the Y direction, and does not include the movement of the substrate holding table 25 for alignment in the bonding process.

[0037] The component supply module 50 includes a carrier temporary placement portion 51, a carrier conveyance device 52, a carrier holding table 55, a pickup head 56, a second housing 60, and a second base 69. In FIG. 2, the carrier conveyance device 52 is located below the carrier temporary placement portion 51.

[0038] The carrier temporary placement portion 51 is a member for temporarily placing and temporarily holding the component carrier C carried in by the transfer robot 9A. The carrier conveyance device 52 is a device for conveying the component carrier C arranged in the carrier temporary placement portion 51 and directly delivering the component carrier C to the carrier holding table 55. The carrier holding table 55 is a table for holding the component carrier C received from the carrier conveyance device 52 and holding the component carrier C even during the pickup process of taking out the component to be joined to the substrate S.

[0039] The pickup head 56 is a head that picks up components from the component carrier C held by the carrier holding table 55 and delivers the picked-up components to the bonding head 26. In the first embodiment, the pickup head 56 inverts the picked-up components, moves into the bonding module 20, and delivers the components to the bonding head 26 at the delivery position XY2.

[0040] The carrier transfer device 52 transfers the component carrier C for which the pickup process of components has been completed from the carrier holding table 55 back to the carrier temporary placement section 51. The component carrier C for which the pickup process has been completed is carried out of the component supply module 50 from the carrier temporary placement section 51 by the transfer robot 9A.

[0041] The component carrier C for which the pickup process has been completed means a component carrier for which the pickup process of some of the held components has been completed, and is not limited to a component carrier for which the pickup process of all components has been completed. That is, when being carried out of the component supply module 50, components may remain in the component carrier C.

[0042] The second housing 60 is a member that houses the carrier temporary placement section 51, the carrier transfer device 52, and the carrier holding table 55 and separates them from other modules. The second base 69 is a member that supports the carrier temporary placement section 51, the carrier transfer device 52, the carrier holding table 55, and the pickup head 56 from below.

[0043] A connection opening 60A is provided in the second housing 60. The connection opening 60A is formed at a position adjacent to the carrier temporary placement section 51 and opens in a direction (Y direction) intersecting the transfer path of the transfer robot 9A. In the component supply module 50, the connection opening 60A, the carrier temporary placement section 51, and the carrier holding table 55 are arranged in this order in the -Y direction. Therefore, the transfer path along which the component carrier C is transferred in the component supply module 50 is linear in plan view, and the direction (carrier transfer direction D2) in which the transfer path extends is along the Y direction. Here, the carrier transfer direction D2 is due to the transfer of the substrate S by the carrier transfer device 52 and the transfer of the substrate S by the movement of the carrier holding table 55 in the Y direction, and does not include the movement of the carrier holding table 55 for alignment in the pickup process.

[0044] Considering the conveyance direction of the substrate S, the carrier conveyance direction D2 and the substrate conveyance direction D1 are along each other. In Embodiment 1, the carrier conveyance direction D2 and the substrate conveyance direction D1 are parallel to each other and are in the Y direction. Comparing with the case where the conveyance path of the substrate S or the component carrier C is bent, the conveyance time can be shortened.

[0045] The connection opening 30A and the connection opening 60A are separated by a partition wall. In the present embodiment, the partition wall is constituted by a part of the first housing 30 and the second housing 60.

[0046] [2-1. Configuration of Bonding Module] Here, each component of the bonding module 20 will be described in more detail.

[0047] FIGS. 3A and 3B are perspective views of the substrate temporary placement portion 21 viewed from different directions. FIGS. 4A to 4D are front views of the substrate temporary placement portion 21.

[0048] As shown in FIGS. 3A and 3B, the substrate temporary placement portion 21 has two regions for arranging one substrate each. Specifically, the substrate temporary placement portion 21 has two-stage shelves 31A and 31B for arranging one substrate S each.

[0049] In Embodiment 1, the shelves 31A and 31B are arranged in the vertical direction (Z direction). The upper-stage shelf 31A is located above the lower-stage shelf 31B, and when viewed from the Z direction, the upper-stage shelf 31A overlaps the lower-stage shelf 31B.

[0050] The upper-stage shelf 31A is a shelf for temporarily placing the substrate S before the bonding process carried into the bonding module 20. For the upper-stage shelf 31A, the transfer robot 9A of the transfer module 9 carries in the substrate S, and the first substrate transfer device 22 takes out the substrate S. The lower-stage shelf 31B is a shelf for temporarily placing the substrate S for which the bonding process has been completed. For the lower-stage shelf 31B, the first substrate transfer device 22 carries in the substrate S, and the transfer robot 9A takes out the substrate S.

[0051] By arranging the substrate S after the bonding process, which has a relatively high particle retention rate compared to the substrate S before the bonding process, on the lower shelf 31B, it is possible to suppress the adhesion of particles to the substrate S before the bonding process.

[0052] The upper shelf 31A has an entrance 32A (FIG. 3A) for the transfer robot 9A to place the substrate S on the upper shelf 31A and an exit 33A (FIG. 3B) for the first substrate transfer device 22 to take out the substrate S from the upper shelf 31A. The entrance 32A and the exit 33A face each other in the Y direction. In other words, the upper shelf 31A penetrates in the Y direction.

[0053] In the bonding module 20, the exit 33A is located on the -Y side of the entrance 32A. Referring also to FIG. 2, the connection opening 30A, the entrance 32A, the exit 33A, and the substrate holding table 25 are arranged in order in the -Y direction. Therefore, the path through which the substrate S before the bonding process is transferred can be made straight and simple. Specifically, the substrate S before the bonding process is transferred in the -Y direction by the transfer robot 9A through the connection opening 30A to the entrance 32A and then transferred from the exit 33A toward the substrate holding table 25 by the first substrate transfer device 22.

[0054] The lower shelf 31B has an entrance 32B (FIG. 3B) for the first substrate transfer device 22 to place the substrate S on the lower shelf 31B and an exit 33B (FIG. 3A) for the transfer robot 9A to take out the substrate S from the lower shelf 31B. The entrance 32B and the exit 33B face each other in the Y direction. In other words, the lower shelf 31B penetrates in the Y direction.

[0055] When viewed from the Z direction, the exit 33B of the lower shelf 31B overlaps with the entrance 32A of the upper shelf 31A, and the entrance 32B of the lower shelf 31B overlaps with the exit 33A of the upper shelf 31A. That is, the direction from the entrance 32B to the exit 33B and the direction from the entrance 32A to the exit 33A are opposite.

[0056] In the bonding module 20, the outlet 33B is located on the +Y side of the inlet 32B. Referring also to FIG. 2, the substrate holding table 25, the inlet 32B, the outlet 33B, and the connection opening 30A are arranged in order in the +Y direction. Therefore, the path through which the substrate S for which the bonding process has been completed is conveyed can be made straight and simple. Specifically, the substrate S for which the bonding process has been completed is conveyed to the inlet 32B by the first substrate conveying device 22 in the +Y direction, and is conveyed from the outlet 33B through the connection opening 30A by the conveying robot 9A.

[0057] As described above, the direction (-Y direction) in which the substrate S passes through the upper shelf 31A and the direction (+Y direction) in which the substrate S passes through the lower shelf 31B are parallel to each other and opposite.

[0058] The shelves 31A and 31B each have a pair of support portions 34A and 34B that support the substrate S from below. The pair of support portions 34A are two rod-shaped members that extend along the Y direction between the inlet 32A and the outlet 33A and have a spacing W1 in the X direction. The pair of support portions 34B are two rod-shaped members that extend along the Y direction between the inlet 32B and the outlet 33B and have a spacing W2 in the X direction.

[0059] The spacings W1 and W2 between the pair of support portions 34A and 34B are smaller than the diameter of the substrate S. Therefore, the pair of support portions 34A and 34B support both end portions of the substrate S in the X direction from below. When the substrate S is disposed on the pair of support portions 34A and 34B, the lower surface of the substrate S inside both end portions is exposed from the pair of support portions 34A and 34B.

[0060] The spacings W1 and W2 between the pair of support portions 34A and 34B are fixed and are of the same length in the present embodiment. Therefore, the pair of support portions 34A and 34B can support the substrate S.

[0061] In the first embodiment, the pair of support portions 34A are parallel to each other, and the pair of support portions 34B are parallel to each other.

[0062] The substrate temporary placement unit 21 further includes a shelf moving device 35 that moves the shelves 31A and 31B in the Z direction with respect to the first base 39 (see arrow Z10). The shelf moving device 35 moves the shelves 31A and 31B integrally. The shelf moving device 35 is controlled by the control unit 80 shown in FIG. 1.

[0063] As shown in FIGS. 4A to 4D, the shelf moving device 35 moves the shelves 31A and 31B between two different reference heights Z1 and Z2 with respect to the first base 39. The first reference height Z1 is the height at which the transfer robot 9A carries the substrate S in and out of the substrate temporary placement unit 21. The second reference height Z2 is the height at which the first substrate transfer device 22 carries the substrate S in and out of the substrate temporary placement unit 21.

[0064] As shown in FIG. 4A, when the shelf moving device 35 moves the upper shelf 31A to the first reference height Z1, the transfer robot 9A carries the substrate S into the upper shelf 31A. As shown in FIG. 4B, when the shelf moving device 35 moves the lower shelf 31B to the first reference height Z1, the transfer robot 9A carries the substrate S out of the lower shelf 31B.

[0065] Comparing FIGS. 4A and 4B, the substrate temporary placement unit 21 when the transfer robot 9A carries the substrate S into the upper shelf 31A is displaced in the Z direction from the substrate temporary placement unit 21 when the transfer robot 9A carries the substrate S out of the lower shelf 31B. In the first embodiment, the height of the upper shelf 31A when the substrate S is carried into the upper shelf 31A and the height of the lower shelf 31B when the substrate S is carried out of the lower shelf 31B coincide at the first reference height Z1.

[0066] As shown in FIG. 4C, when the shelf moving device 35 moves the upper shelf 31A to the second reference height Z2, the first substrate transfer device 22 carries the substrate S out of the upper shelf 31A. As shown in FIG. 4D, when the shelf moving device 35 moves the lower shelf 31B to the second reference height Z2, the first substrate transfer device 22 carries the substrate S into the lower shelf 31B.

[0067] Comparing FIGS. 4C and 4D, the temporary substrate placement portion 21 when the first substrate transfer device 22 unloads the substrate S from the upper shelf 31A is displaced in the Z direction with respect to the temporary substrate placement portion 21 when the first substrate transfer device 22 loads the substrate S onto the lower shelf 31B. In Embodiment 1, the height of the upper shelf 31A when unloading the substrate S from the upper shelf 31A and the height of the lower shelf 31B when loading the substrate S onto the lower shelf 31B coincide at the second reference height Z2.

[0068] FIGS. 5A and 5B are plan views of the first substrate transfer device 22. FIGS. 6A to 6D are front views of the first substrate transfer device 22 and the temporary substrate placement portion 21.

[0069] As shown in FIGS. 5A and 5B, the first substrate transfer device 22 includes a hand 36, an arm 37, and a base 38. The hand 36 is a member that supports the substrate S from below and is attached to the tip portion of the arm 37. The base end portion of the arm 37 is coupled to the drive shaft 38A (see FIG. 5B) of the base 38. The base 38 is provided with an arm drive mechanism and an arm lifting mechanism (not shown). The arm drive mechanism drives the arm 37 by rotating the drive shaft 38A, and the arm lifting mechanism raises and lowers the arm 37 by raising and lowering the drive shaft 38A.

[0070] The first substrate transfer device 22 is a scalar robot having an arm 37 composed of three links 37A, 37B, and 37C connected by joints. The first substrate transfer device 22 moves the hand 36 horizontally by changing the connection angle between the links by an arm drive mechanism built into the base 38. Further, the first substrate transfer device 22 can move the hand 36 in the vertical direction by raising and lowering the arm 37 by an arm lifting mechanism built into the base 38. By adopting a scalar robot with a simple structure for the first substrate transfer device 22, the cost of the bonding device 10 can be suppressed.

[0071] The hand 36 supports the lower surface of the substrate S inside both end portions of the substrate S in the X direction. Specifically, the hand 36 supports the edge portion of the substrate S inside both end portions of the substrate S in the X direction from below. The width of the hand 36 in the X direction is smaller than the dimension of the substrate S in the X direction. Therefore, when the hand 36 supports the substrate S, both end portions of the substrate S protrude from the hand 36.

[0072] The arm 37 is driven by an arm driving mechanism built in the base 38, so that the hand 36 linearly moves in the Y direction (see arrow Y11). Referring also to FIG. 2, the hand 36 can move in the Y direction between a position overlapping the substrate temporary placement portion 21 and a position overlapping the second substrate transfer device 23 when viewed from the Z direction by the arm 37.

[0073] As shown in FIGS. 6A to 6D, the hand 36 can move up and down in the Z direction with respect to the first base 39 by an arm lifting mechanism built in the base 38 (see arrows Z21, Z22).

[0074] By moving the hand 36 by the arm 37 while the hand 36 supports the substrate S, the first substrate transfer device 22 can automatically transfer the substrate S in the bonding module 20. In Embodiment 1, when the first substrate transfer device 22 is stopped, the hand 36 is located below (directly below) the substrate temporary placement portion 21 (FIG. 6A).

[0075] The arm driving mechanism and the arm lifting mechanism provided in the base 38 are controlled by the control unit 80 shown in FIG. 1. That is, the first substrate transfer device 22 is controlled by the control unit 80.

[0076] A method for receiving the substrate S from the substrate temporary placement portion 21 by the first substrate transfer device 22 having the above configuration will be described. The first substrate transfer device 22 receives the substrate S from the upper shelf 31A of the substrate temporary placement portion 21.

[0077] As shown in FIG. 6A, in the initial state, the hand 36 does not support the substrate S. The hand 36 is moved by the arm 37 to below the substrate S disposed on the substrate temporary placement portion 21. The dimension of the hand 36 in the X direction is smaller than the intervals W1 and W2 between the pair of support portions 34A and 34B of the substrate temporary placement portion 21. Therefore, the hand 36 rises (see arrow Z21) and enters between the pair of support portions 34B. As shown in FIG. 6B, by raising the hand 36 higher than the pair of support portions 34A, the hand 36 receives the substrate S from the pair of support portions 34A. The hand 36 transports the received substrate S out of the outlet 33A (FIG. 3B) of the upper shelf 31A by the arm 37.

[0078] Subsequently, a method for transferring the substrate S to the substrate temporary placement portion 21 by the first substrate transfer device 22 will be described. The first substrate transfer device 22 transfers the substrate S to the lower shelf 31B of the substrate temporary placement portion 21.

[0079] As shown in FIG. 6C, in the initial state, the hand 36 supports the substrate S. The hand 36 enters from the inlet 32B (FIG. 3B) of the lower shelf 31B by the arm 37 and moves above the pair of support portions 34B. The hand 36 descends (see arrow Z22) and passes between the pair of support portions 34B. As shown in FIG. 6D, by lowering the hand 36 lower than the pair of support portions 34B, the hand 36 transfers the substrate S to the pair of support portions 34B.

[0080] Returning to FIG. 2, the bonding module 20 is provided with a second substrate transfer device 23 as a member separate from the first substrate transfer device 22.

[0081] While the hand 36 of the first substrate transfer device 22 supports the substrate S inside both ends, since the substrate holding table 25 supports the whole of the substrate S except both ends, it is difficult for the first substrate transfer device 22 to directly transfer the substrate S to the substrate holding table 25. Therefore, a second substrate transfer device 23 is provided between the first substrate transfer device 22 and the substrate holding table 25 as a relay station for the substrate S. The second substrate transfer device 23 supports both ends of the substrate S that are not supported by the substrate holding table 25 from below.

[0082] FIG. 7A is a perspective view of the second substrate transfer device 23. FIGS. 7B and 7C are front views of the first substrate transfer device 22 and the second substrate transfer device 23.

[0083] As shown in FIG. 7A, the second substrate transfer device 23 includes a pair of support arms 24, two columns 27, a slide portion 28, a column 29, and a drive box 45.

[0084] The pair of support arms 24 are members that support the substrate S from below. The pair of support arms 24 are two rod-shaped members that extend along the Y direction and are spaced apart in the X direction. Therefore, the pair of support arms 24 support both end portions of the substrate S in the X direction from below. In Embodiment 1, the pair of support arms 24 are parallel to each other.

[0085] The pair of support arms 24 have recesses 41 that are recessed outward at opposing positions on the opposing side surfaces. When viewed from the Z direction, the inner surfaces 42 and 43 that define the recess 41 are curved in an arc shape. The inner surface 43 is located below the inner surface 42 and protrudes inward more than the inner surface 42.

[0086] The inner surface 42 and the inner surface 43 are connected by a support surface 44 that extends in the X direction (extends in the XY plane). The support surface 44 is a plane that supports both end portions of the substrate S from below. When the support surface 44 supports the substrate S, the inner surface 43 is located inside both end portions of the substrate S, and the inner surface 42 is along the outer periphery of the substrate S outside both end portions of the substrate S. The lower surface of the substrate S that is more inward than the inner surface 43 is exposed from the pair of support arms 24.

[0087] The pair of support arms 24 have a different shape from the pair of support portions 34A and 34B. In Embodiment 1, the area of the support surface 44, that is, the area of the portion of the pair of support arms 24 that contacts the substrate S, is smaller than the area of the portion of the pair of support portions 34A and 34B of the substrate temporary placement portion 21 that contacts the substrate S.

[0088] The pair of support parts 34A and 34B transfer the substrate S to and from a device (conveying module 9) outside the bonding module 20, and thus positional deviation of the substrate S is likely to occur with respect to the pair of support parts 34A and 34B. Since the pair of support parts 34A and 34B have a larger contact area than the pair of support arms 24, the transfer of the substrate S can be performed more reliably. On the other hand, the pair of support arms 24 transfer the substrate S to and from the first substrate conveying device 22 within the bonding module 20. Therefore, positional deviation of the substrate S is less likely to occur with respect to the pair of support arms 24 compared to the case of transferring to and from a device outside the module. Thus, compared with the case where the shape of the pair of support arms 24 is the same as that of the pair of support parts 34A and 34B, the contact area with the substrate S is reduced, facilitating miniaturization of the pair of support arms 24.

[0089] The two columns 27 are members that support one support arm 24 from below.

[0090] The slide part 28 supports the two columns 27 from below and moves the two columns 27 along the slide part 28 by a built-in actuator. Thereby, the pair of support arms 24 supported by the two columns 27 can slide in the X direction so as to move away from each other and approach each other (see arrow X11). Therefore, the distance between the columns 27, that is, the distance between the pair of support arms 24 is variable. The distance between the pair of support arms 24 is changed between a first distance G1 (see FIG. 9A) when supporting the substrate S and a second distance G2 (see FIG. 9C) when the substrate holding table 25 moves away from the support arms 24 in the Y direction.

[0091] When the distance between the pair of support arms 24 is the first distance G1, the support surfaces 44 of the pair of support arms 24 can support both end portions of the substrate S from below.

[0092] When the distance between the pair of support arms 24 is the second distance G2, the pair of support arms 24 can open the substrate S.

[0093] The support column 29 is a member that supports the slide portion 28 from below. The drive box 45 is a box incorporating a drive unit for raising and lowering the support column 29, and the support column 29 can be raised and lowered by the drive box 45 (see arrow Z12). Therefore, the height of the slide portion 28, that is, the height of the pair of support arms 24 is variable. The height of the pair of support arms 24 is variable between a third height Z3 (see FIG. 9A) at which the substrate S is lifted from the substrate holding table 25 and a fourth height Z4 (see FIG. 9B) at which the substrate S is lowered onto the substrate holding table 25. The height of one support arm 24 changes in the same manner as the height of the other support arm 24.

[0094] The slide portion 28 and the drive box 45 are controlled by the control unit 80 shown in FIG. 1. In the first embodiment, the drive box 45 does not have a function of moving the second substrate transfer device 23 in the Y direction. Note that the drive box 45 may have a function of moving the second substrate transfer device 23 in the Y direction.

[0095] Here, a method of transferring the substrate S by the first substrate transfer device 22 to the second substrate transfer device 23 having the above configuration will be described.

[0096] As shown in FIG. 7B, the hand 36 of the first substrate transfer device 22 supports the substrate S. At this time, the inner surfaces 43 of the pair of support arms 24 face each other at an interval smaller than the diameter of the substrate S, and the interval between the pair of support arms 24 is a first interval G1. The hand 36 is moved above the pair of support arms 24 by the arm 37. The dimension of the hand 36 in the X direction is smaller than the first interval G1 between the pair of support arms 24. Therefore, as shown in FIG. 7C, the hand 36 descends and passes through the space between the pair of support arms 24 (see arrow Z13). By lowering the hand 36 below the support surface 44 of the pair of support arms 24, the hand 36 transfers the substrate S to the support surface 44.

[0097] Subsequently, a method of receiving the substrate S by the first substrate transfer device 22 from the second substrate transfer device 23 will be described.

[0098] As shown in FIG. 7C, the distance between the pair of support arms 24 is the first distance G1, and the support surface 44 supports the substrate S. The hand 36 of the first substrate transfer device 22 does not support the substrate S. The hand 36 is moved by the arm 37 below the substrate S supported by the second substrate transfer device 23. As shown in FIG. 7B, the hand 36 rises and enters the space between the pair of support arms 24 (see arrow Z13). By raising the hand 36 higher than the support surface 44 of the pair of support arms 24, the hand 36 receives the substrate S from the support surface 44.

[0099] FIG. 8 is a perspective view of the substrate holding table 25. As shown in FIG. 2, the substrate holding table 25 has a stage 46 and a stage moving device 47.

[0100] The stage 46 is a member that supports the substrate S from below. The stage 46 has a support surface 48 that supports the substrate S from below, and steps 49 that are recessed downward with respect to the support surface 48 on both sides of the support surface 48 in the X direction. The stage 46 incorporates a heater for heating the supported substrate S in the bonding process.

[0101] The support surface 48 supports the lower surface of the substrate S inside both ends of the substrate S in the X direction. Specifically, the support surface 48 supports the central portion of the substrate S. When the support surface 48 supports the substrate S, both ends of the substrate S protrude from the support surface 48.

[0102] When viewed from the Z direction, the support surface 48 has a shape in which a part of the outer periphery on the step 49 side in a rectangle bulges in an arc shape. The maximum dimension W4 in the X direction of the arc-shaped bulging portion of the support surface 48 is smaller than the distance between the inner surfaces 43 of the pair of support arms 24. For this reason, when the substrate S is arranged at the center of the support surface 48, both ends of the substrate S in the X direction protrude from the support surface 48 toward the step 49 side. The pair of support arms 24 lift both ends protruding from the support surface 48 of the substrate S from below with the support surface 44.

[0103] The stage moving device 47 (see FIG. 2) is a device that moves the stage 46, and is configured by combining, for example, an XY table and a θ table. The stage moving device 47 is controlled by the control unit 80 shown in FIG. 1.

[0104] In the conveyance of the substrate S, the stage moving device 47 moves the stage 46 in the Y direction between the receiving position Y1 and the working position Y2 (see FIGS. 9A to 9D). Also referring to FIG. 2, the receiving position Y1 is a position that overlaps with the second substrate conveyance device 23 when viewed from the Z direction, and is a position where the substrate holding table 25 receives the substrate S from the second substrate conveyance device 23. The working position Y2 is a position moved in the -Y direction with respect to the receiving position Y1, and is a position where components are joined to the substrate S. At both the receiving position Y1 and the working position Y2, the substrate holding table 25 is separated from the substrate temporary placement portion 21 in the -Y direction.

[0105] In the component joining process, the stage moving device 47 moves the stage 46 in the X and Y directions and rotates it around the Z axis for alignment between the component and the substrate S.

[0106] Here, a method of transferring the substrate S from the second substrate conveyance device 23 to the substrate holding table 25 having the above configuration will be described with reference to FIGS. 9A to 9D. FIGS. 9A to 9D are perspective views of the second substrate conveyance device 23 and the substrate holding table 25.

[0107] As shown in FIG. 9A, in the initial state, the pair of support arms 24 of the second substrate conveyance device 23 support the substrate S, the interval between the pair of support arms 24 is the first interval G1, and the height of the pair of support arms 24 is the third height Z3. The lower end surfaces of the pair of support arms 24 are located above the height Z5 of the support surface 48 of the stage 46. The stage 46 does not support the substrate S and is located at the working position Y2.

[0108] The stage 46 of the substrate holding table 25 is moved by the stage moving device 47 from the working position Y2 to the receiving position Y1 below the pair of support arms 24 (see arrow Y12).

[0109] When viewed from the Z direction, the outer periphery of the support surface 48 is located inside the pair of support arms 24. The outwardly bulging arc-shaped portion on the outer periphery of the support surface 48 is located inside the inner surface 43 (FIG. 7A) of the pair of support arms 24.

[0110] As shown in FIG. 9B, the pair of support arms 24 is lowered by the drive box 45 from the third height Z3 to the fourth height Z4 (see arrow Z14). When the pair of support arms 24 is at the fourth height Z4, the lower surfaces of the pair of support arms 24 approach the step 49. The height from the lower surface of the pair of support arms 24 to the support surface 44 (FIG. 7A) is smaller than the height from the step 49 to the support surface 48, and at the fourth height Z4, the support surface 44 is lower than the height Z5 of the support surface 48. By lowering the support surface 44 below the height Z5 of the support surface 48, the pair of support arms 24 transfers the substrate S to the support surface 48.

[0111] As shown in FIG. 9C, the interval between the pair of support arms 24 is widened from the first interval G1 to the second interval G2 by the slide portion 28 (FIG. 7A) (see arrow X12). The pair of support arms 24 moves away from the stage 46 in the X direction.

[0112] As shown in FIG. 9D, the stage 46 of the substrate holding table 25 is moved by the stage moving device 47 from the receiving position Y1 to the working position Y2 (see arrow Y13). At this time, since the pair of support arms 24 is widened to the second interval G2, it does not interfere with the stage 46.

[0113] Subsequently, a method for receiving the substrate S from the substrate holding table 25 having the above configuration by the second substrate transfer device 23 will be described.

[0114] As shown in FIG. 9D, in the initial state, the stage 46 holds the substrate S and is positioned at the working position Y2. The pair of support arms 24 of the second substrate transfer device 23 do not support the substrate S, the interval between the pair of support arms 24 is the second interval G2, and the height of the pair of support arms 24 is the fourth height Z4.

[0115] The stage 46 is moved from the working position Y2 to the receiving position Y1 by the stage moving device 47. Next, the interval between the pair of support arms 24 is narrowed from the second interval G2 to the first interval G1 by the slide portion 28. The pair of support arms 24 are raised from the fourth height Z4 to the third height Z3 by the drive box 45. As a result, the support surface 44 becomes higher than the support surface 48. By raising the support surface 44 higher than the support surface 48, the pair of support arms 24 lift and receive the substrate S from the support surface 48. The stage 46 is moved from the receiving position Y1 to the working position Y2 by the stage moving device 47.

[0116] As described above, the drive box 45 of the second substrate transfer device 23 operates when transferring the substrate S between the second substrate transfer device 23 and the substrate holding table 25. On the other hand, the drive box 45 stops when transferring the substrate S between the first substrate transfer device 22 and the second substrate transfer device 23.

[0117] [2-2. Configuration of Component Supply Module] Subsequently, each component of the component supply module 50 will be described in more detail.

[0118] FIGS. 10A and 10B are perspective views of the carrier temporary placement portion 51 viewed from different directions. FIGS. 11A to 11D are front views of the carrier temporary placement portion 51.

[0119] As shown in FIGS. 10A and 10B, the carrier temporary placement portion 51 has two regions in which one component carrier C can be arranged respectively. Specifically, the carrier temporary placement portion 51 has two-stage shelves 61A and 61B for arranging one component carrier C each.

[0120] In Embodiment 1, the carrier temporary placement unit 51 has a configuration common to or similar to that of the substrate temporary placement unit 21. The carrier temporary placement unit 51 is different from the substrate temporary placement unit 21 in that the carrier temporary placement unit 51 corresponds to the component carrier C. The dimensions and shape of the carrier temporary placement unit 51 may be changed with respect to the substrate temporary placement unit 21 according to the structure of the component carrier C.

[0121] The upper shelf 61A is a shelf for temporarily placing the component carrier C before pick-up processing that has been carried into the component supply module 50. For the upper shelf 61A, the transfer robot 9A of the transfer module 9 carries in the component carrier C, and the carrier transfer device 52 takes out the component carrier C. The lower shelf 61B is a shelf for temporarily placing the component carrier C for which the pick-up processing has been completed. For the lower shelf 61B, the carrier transfer device 52 carries in the component carrier C, and the transfer robot 9A takes out the component carrier C.

[0122] By arranging the component carrier C after pick-up processing, which has a relatively high particle retention rate compared to the component carrier C before pick-up processing, on the lower shelf 61B, it is possible to suppress particles from adhering to the component carrier C before pick-up processing.

[0123] The upper shelf 61A has an entrance 62A (FIG. 10A) for the transfer robot 9A to put the component carrier C on the upper shelf 61A and an exit 63A (FIG. 10B) for the carrier transfer device 52 to take out the component carrier C from the upper shelf 61A. The connection opening 60A, the entrance 62A, the exit 63A, and the carrier holding table 55 are arranged in order in the -Y direction.

[0124] The lower shelf 61B has an entrance 62B (FIG. 10B) for the carrier transfer device 52 to put the component carrier C on the lower shelf 61B and an exit 63B (FIG. 10A) for the transfer robot 9A to take out the component carrier C from the lower shelf 61B. The carrier holding table 55, the entrance 62B, the exit 63B, and the connection opening 60A are arranged in order in the +Y direction.

[0125] Similar to the shelves 31A and 31B, the shelves 61A and 61B each have a pair of support portions 64A and 64B that support both end portions of the component carrier C from below.

[0126] The carrier temporary placement portion 51 further has a shelf moving device 65 that moves the shelves 61A and 61B in the Z direction with respect to the second base 69 (FIG. 2) (see arrow Z15).

[0127] As shown in FIGS. 11A to 11D, the shelf moving device 65 moves the shelves 61A and 61B between two different reference heights Z31 and Z32 with respect to the second base 69. The third reference height Z31 is the height at which the transfer robot 9A performs the loading and unloading of the component carrier C with respect to the carrier temporary placement portion 51. The fourth reference height Z32 is the height at which the carrier transfer device 52 performs the loading and unloading of the component carrier C with respect to the carrier temporary placement portion 51.

[0128] As shown in FIG. 11A, when the shelf moving device 65 moves the upper shelf 61A to the third reference height Z31, the transfer robot 9A loads the component carrier C onto the upper shelf 61A. As shown in FIG. 11B, when the shelf moving device 65 moves the lower shelf 61B to the third reference height Z31, the transfer robot 9A unloads the component carrier C from the lower shelf 61B.

[0129] As shown in FIG. 11C, when the shelf moving device 65 moves the upper shelf 61A to the fourth reference height Z32, the carrier transfer device 52 unloads the component carrier C from the upper shelf 61A. As shown in FIG. 11D, when the shelf moving device 65 moves the lower shelf 61B to the fourth reference height Z32, the carrier transfer device 52 loads the component carrier C onto the lower shelf 61B.

[0130] FIGS. 12A and 12B are plan views of the carrier transfer device 52.

[0131] As shown in FIGS. 12A and 12B, the carrier transfer device 52 includes a hand 66, an arm 67, and a base 68. The hand 66 is a member that supports the component carrier C from below and is attached to the tip portion of the arm 67. The base end portion of the arm 67 is coupled to the drive shaft 68A (see FIG. 6B) of the base 68. The base 68 is provided with an arm drive mechanism and an arm lifting mechanism (not shown). The arm drive mechanism drives the arm 67 by rotating the drive shaft 68A, and the arm lifting mechanism raises and lowers the arm 67 by raising and lowering the drive shaft 68A.

[0132] The carrier transfer device 52 is a scalar robot having an arm 67 composed of three links 67A, 67B, and 67C connected by joints. The arm 67 and the base 68 have the same or similar configurations as the arm 37 and the base 38 of the first substrate transfer device 22.

[0133] The hand 66 supports the lower surface of the component carrier C inside the both end portions of the component carrier C in the X direction. Specifically, the hand 66 supports the edge portions of the component carrier C inside the both end portions of the component carrier C in the X direction from below. The width of the hand 66 in the X direction is smaller than the dimension of the component carrier C in the X direction. Therefore, when the hand 66 supports the component carrier C, both end portions of the component carrier C protrude from the hand 66. The hand 66 has a shape suitable for supporting the component carrier C.

[0134] When the arm 67 is driven by the arm drive mechanism built in the base 68, the hand 66 moves linearly in the Y direction (see arrow Y14). Referring also to FIG. 2, the hand 66 can move in the Y direction between a position overlapping the carrier temporary placement portion 51 and a position on the -Y side of the carrier temporary placement portion 51 when viewed from the Z direction by the arm 67.

[0135] The hand 66 can be raised and lowered in the Z direction with respect to the second base 69 (see FIG. 2) by the arm lifting mechanism built in the base 68.

[0136] With the hand 66 supporting the component carrier C, the carrier transfer device 52 can automatically transfer the component carrier C within the component supply module 50 by moving the hand 66 with the arm 67. In the first embodiment, when the carrier transfer device 52 is stopped, the hand 66 is positioned below the carrier temporary placement unit 51.

[0137] The arm drive mechanism and the arm lifting mechanism provided on the base 68 are controlled by the control unit 80 shown in FIG. 1. That is, the carrier transfer device 52 is controlled by the control unit 80.

[0138] The method of receiving the component carrier C from the carrier temporary placement unit 51 by the carrier transfer device 52 having the above configuration is the same as the method of receiving the substrate S from the substrate temporary placement unit 21 by the first substrate transfer device 22. Specifically, the carrier transfer device 52 rises the space between the pair of support portions 64A of the upper shelf 61A in the carrier temporary placement unit 51 that supports the component carrier C, and receives the component carrier C.

[0139] Also, the method of delivering the component carrier C to the carrier temporary placement unit 51 by the carrier transfer device 52 is the same as the method of delivering the substrate S to the substrate temporary placement unit 21 by the first substrate transfer device 22. Specifically, the carrier transfer device 52 that supports the component carrier C descends the space between the pair of support portions 64B of the lower shelf 61B in the carrier temporary placement unit 51, and delivers the component carrier C.

[0140] Returning to FIG. 2, a carrier holding table 55 is provided in the component supply module 50 as a member separate from the carrier transfer device 52.

[0141] FIG. 13 is a perspective view of the carrier holding table 55. As shown in FIG. 13, the carrier holding table 55 includes a pair of carrier frame guides 100, a carrier frame retainer 102, a plurality of columns 104, a drive box 106, a sheet expansion ring 108, and an ejector 110.

[0142] A pair of carrier frame guides 100 are members that support the carrier frame 112 of the component carrier C from below. The component carrier C has an outer carrier frame 112 and an inner adhesive sheet 114, and a plurality of components (not shown) are held on the adhesive sheet 114. A carrier transfer device 52 (Figs. 12A and 12B) transfers the component carrier C to the carrier frame guide 100, and the carrier frame guide 100 supports the carrier frame 112 of the component carrier C.

[0143] The pair of carrier frame guides 100 are members that extend along the Y direction and have a spacing in the X direction. Since the spacing between the pair of carrier frame guides 100 is smaller than the diameter of the component carrier C, the carrier frame guides 100 support both end portions of the carrier frame 112 in the X direction from below. The lower surface of the component carrier C inside both end portions of the carrier frame 112 is exposed from the pair of carrier frame guides 100.

[0144] On the other hand, since the spacing between the pair of carrier frame guides 100 is larger than the dimension of the hand 66 of the carrier transfer device 52 in the X direction, the hand 66 enters the space between the pair of carrier frame guides 100.

[0145] Since the hand 66 supports the carrier frame 112 of the component carrier C and the pair of carrier frame guides 100 support both end portions of the carrier frame 112 protruding from the hand 66, the carrier transfer device 52 directly transfers the component carrier C to the carrier holding table 55. Therefore, an additional transfer device such as that of the bonding module 20 can be omitted.

[0146] The carrier frame retainer 102 is a member for pressing the carrier frame 112 of the component carrier C from above. The carrier frame retainer 102 has a ring shape with an opening at the center.

[0147] The support column 104 is a member that supports the carrier frame retainer 102 from below, and a plurality of them are provided. The support column 104 is configured to be movable up and down by a drive box 106. By the drive box 106 moving the support column 104 up and down, the carrier frame guide 100, the carrier frame retainer 102, and the support column 104 move up and down integrally (arrow Z17). The carrier frame guide 100, the carrier frame retainer 102, and the support column 104 constitute the lifting part 101.

[0148] The drive box 106 is a box that incorporates a drive part for moving the lifting part 101 up and down and is movable in the Y direction. The drive box 106 is controlled by the control part 80 shown in FIG. 1.

[0149] Returning to FIG. 2, the drive box 106 is installed on the carrier holding table moving device 58. The carrier holding table moving device 58 moves the drive box 106, that is, the carrier holding table 55, within a range including the receiving position Y3 and the working position Y4. The receiving position Y3 is a position on the -Y side with respect to the carrier temporary placement part 51 when viewed from the Z direction, and is the position where the carrier holding table 55 receives the component carrier C from the carrier transfer device 52. The working position Y4 is a position moved in the -Y direction with respect to the receiving position Y3, and is the position where components are taken out from the component carrier C. At either the receiving position Y3 or the working position Y4, the carrier holding table 55 is separated from the carrier temporary placement part 51 in the -Y direction.

[0150] The working position Y4 of the carrier holding table 55 and the working position Y2 of the substrate holding table 25 in the bonding module 20 are aligned in the X direction. In other words, when viewed from the X direction, the carrier holding table 55 at the working position Y4 and the substrate holding table 25 at the working position Y2 overlap. With such a configuration, the transfer of components from the component carrier C to the substrate S in the bonding module 20 becomes easy.

[0151] The receiving position Y3 of the carrier holding table 55 is aligned in the X direction with the receiving position Y1 of the substrate holding table 25 in the bonding module 20. With such a configuration, it becomes easier to make the strokes of the carrier transfer device 52 and the first substrate transfer device 22 common, and it becomes easier to make the structures of the arms common. Compared with the case where each arm is designed dedicatedly, the structure of the bonding device 10 becomes simpler, and the manufacturing cost can be suppressed.

[0152] Returning to FIG. 13, the sheet expansion ring 108 is a member for supporting the adhesive sheet 114 inside the component carrier C from below and expanding it outward. When the component carrier C supported by the carrier frame guide 100 descends, the adhesive sheet 114 of the component carrier C comes into contact with and is supported by the sheet expansion ring 108. The sheet expansion ring 108 has a cylindrical shape extending in the Z-axis direction, and the ring portion at the upper end supports the adhesive sheet 114.

[0153] The ejector 110 abuts against the adhesive sheet 114 supported by the sheet expansion ring 108 from below, and pushes up the components on the adhesive sheet 114 with the built-in pushing member to assist the pickup of the components by the pickup head 56. The ejector 110 is fixed to the second base 69 by a fixture (not shown) and is always located at the working position Y4. It also moves up and down by an ejector lifting device (not shown). The ejector 110 and the ejector lifting device are controlled by the control unit 80.

[0154] A method for holding the component carrier C by the carrier holding table 55 having the above configuration will be described with reference to FIGS. 14A to 14D. FIGS. 14A to 14D are cross-sectional views along the Y direction schematically showing the method for holding the component carrier C by the carrier holding table 55.

[0155] As shown in FIG. 14A, a transfer device (not shown) transfers the component carrier C, and the carrier frame 112 of the component carrier C is supported by the carrier frame guide 100.

[0156] As shown in Fig. 14B, lower the elevating unit 101 (arrow Z18). As a result, the component carrier C supported by the carrier frame guide 100 and the elevating unit 101 descend integrally, and the adhesive sheet 114 of the component carrier C contacts the upper end of the sheet expansion ring 108. When the elevating unit 101 is further lowered from this state, the carrier frame 112 of the component carrier C separates from the carrier frame guide 100, and the lowered carrier frame retainer 102 contacts the carrier frame 112.

[0157] As shown in Fig. 14C, the carrier frame retainer 102 pushes down the carrier frame 112 downward (arrow Z19). As a result, the adhesive sheet 114 is expanded radially outward, and the interval between the plurality of components P held by the adhesive sheet 114 is widened.

[0158] As shown in Fig. 14D, thereafter, the ejector 110 rises (arrow Z20), contacts the lower surface of the adhesive sheet 114, and waits.

[0159] [3. Operation of Bonding Device] Here, the operation of the bonding device 10 will be described.

[0160] [3-1. Loading / Unloading of Substrate to / from Bonding Device] First, the loading and unloading of the substrate S in the bonding module 20 will be described. The loading and unloading of the substrate can be executed individually, but the following will describe the case where the loading of the substrate S and the unloading of the substrate S0 are performed continuously as an example.

[0161] Figs. 15A to 15F are schematic views of the bonding module 20 in the conveyance operation of the substrate S. In Figs. 15A to 15F, for clarity of explanation, the shelves 31A and 31B of the substrate temporary placement unit 21 are shown adjacent to each other, but in terms of structure, the shelves 31A and 31B are arranged vertically.

[0162] As shown in FIG. 15A, within the bonding module 20, the second substrate transfer device 23 is waiting while holding the substrate S0 for which the component bonding process has been completed. Also, the transfer robot 9A holds the substrate S1 before the bonding process in which components are to be bonded, and is waiting in front of the connection opening 30A of the bonding module 20. When the transfer robot 9A holding the substrate S1 arrives in front of the connection opening 30A, a substrate loading request is made from the overall control unit 11 to the control unit 80. When the bonding module 20 receives the request, it checks whether it can permit substrate loading. The bonding module 20 determines that substrate loading is possible if there is no substrate S on both the upper shelf 31A and the lower shelf 31B, and if the upper shelf 31A is positioned at the first reference height Z1, and opens the shutter of the connection opening 30A. When the shutter opens, the control unit 80 notifies the transfer module 9 via the overall control unit 11 that the preparation for substrate loading is complete, and waits until it receives a substrate loading completion notification from the transfer module 9.

[0163] Upon receiving the notification, the transfer module 9 activates the transfer robot 9A and places the substrate S1 on the upper shelf 31A of the substrate temporary placement section 21 through the connection opening 30A. Then, the transfer module 9 notifies the control unit 80 of the bonding apparatus 10 via the overall control unit 11 of the completion of substrate loading.

[0164] Upon receiving the substrate loading completion notification, the control unit 80 controls the first substrate transfer device 22 to transfer the substrate S0 from the second substrate transfer device 23 to the lower shelf 31B of the substrate temporary placement unit 21 (arrow B12). First, the control unit 80 controls the shelf moving device 35 to move the lower shelf 31B to the second reference height Z2 (Fig. 4D). Thereafter, the control unit 80 controls the first substrate transfer device 22 to raise the hand 36 between the pair of support arms 24 of the second substrate transfer device 23 and receive the substrate S0 from the second substrate transfer device 23. Thereafter, the control unit 80 controls the first substrate transfer device 22 to lower the hand 36 between the pair of support portions 34B of the lower shelf 31B and deliver the substrate S0 to the lower shelf 31B. Thereafter, the control unit 80 controls the shelf moving device 35 to move the lower shelf 31B to the first reference height Z1 (Fig. 4B). When the preparation for unloading the substrate S0 is complete, the control unit 80 notifies the transfer module 9 to that effect via the overall control unit 11 and waits until it receives a substrate unloading completion notification from the transfer module 9.

[0165] As shown in Fig. 15B, the transfer robot 9A that has received a notification that the preparation for unloading the substrate S0 is complete accesses the lower shelf 31B of the substrate temporary placement unit 21 through the connection opening 30A, accesses the lower shelf 31B of the substrate temporary placement unit 21, and unloads the substrate S0 placed thereon from the bonding module 20 (arrow B13). Then, the transfer module 9 notifies the control unit 80 of the bonding device 10 of the substrate unloading completion notification via the overall control unit 11.

[0166] The control unit 80 that has received the substrate unloading completion notification closes the shutter of the connection opening 30A. Thus, the loading and unloading of the substrate are completed.

[0167] [3-2. Substrate Transfer within the Bonding Device] Next, the conveyance of the substrate S inside the bonding apparatus 10 will be described. First, the operation of conveying the substrate S1 from the upper shelf 31A of the substrate temporary placement unit 21 to the stage 46 of the substrate holding table 25 will be described. As shown in FIG. 15B, the control unit 80 controls the first substrate conveyance device 22 to convey the substrate S1 from the upper shelf 31A to the second substrate conveyance device 23 (arrow B14). First, the control unit 80 controls the shelf moving device 35 to move the upper shelf 31A of the substrate temporary placement unit 21 to the second reference height Z2 (FIG. 4C). Thereafter, the control unit 80 controls the first substrate conveyance device 22 to raise the hand 36 between the pair of support portions 34A of the upper shelf 31A and receive the substrate S1 from the upper shelf 31A. Thereafter, the control unit 80 controls the first substrate conveyance device 22 to lower the hand 36 between the pair of support arms 24 of the second substrate conveyance device 23 and deliver the substrate S0 to the second substrate conveyance device 23.

[0168] Subsequently, as shown in FIG. 15C, the control unit 80 controls the substrate holding table 25 and the second substrate conveyance device 23 to convey the substrate S1 from the second substrate conveyance device 23 to the substrate holding table 25. First, the control unit 80 controls the stage moving device 47 to move the stage 46 of the substrate holding table 25 from the working position Y2 to the receiving position Y1 (arrow B15). Thereafter, the control unit 80 controls the drive box 45 to lower the pair of support arms 24 of the second substrate conveyance device 23 from the third height Z3 to the fourth height Z4. The control unit 80 controls the slide portion 28 to widen the interval between the pair of support arms 24 from the first interval G1 to the second interval G2 (arrow B16). By such an operation, the second substrate conveyance device 23 delivers the substrate S1 to the substrate holding table 25.

[0169] Subsequently, as shown in FIG. 15D, the control unit 80 controls the stage moving device 47 to move the stage 46 of the substrate holding table 25 to the working position Y2 (arrow B17).

[0170] Next, the operation of conveying the substrate S1 to which the component P has been bonded from the stage 46 of the substrate holding table 25 to the second substrate conveyance device 23 will be described.

[0171] As shown in FIG. 15E, the second substrate transfer device 23 is waiting in a state where the distance between the pair of support arms 24 is widened to the second distance G2 and is positioned at the fourth height Z4. The control unit 80 controls the substrate holding table 25 and the second substrate transfer device 23 to transfer the substrate S1 from the substrate holding table 25 to the second substrate transfer device 23. First, the control unit 80 controls the stage moving device 47 to move the stage 46 of the substrate holding table 25 from the working position Y2 to the receiving position Y1 (arrow B18). Then, the control unit 80 controls the slide unit 28 to narrow the distance between the pair of support arms 24 of the second substrate transfer device 23 from the second distance G2 to the first distance G1 (arrow B19). The control unit 80 controls the drive box 45 to raise the pair of support arms 24 from the fourth height Z4 to the third height Z3. By such an operation, the second substrate transfer device 23 scoops up the substrate S1 from the substrate holding table 25.

[0172] Subsequently, the control unit 80 controls the stage moving device 47 to return the stage 46 of the substrate holding table 25 to the working position Y2 (arrow B20).

[0173] Note that, regardless of the series of transfer operations in the loading and unloading of the substrate described above, the first substrate transfer device 22 may transfer the substrate S1 of the second substrate transfer device 23 to the lower shelf 31B of the substrate temporary placement unit 21. The transfer operation in this case is as follows. The control unit 80 controls the shelf moving device 35 to move the lower shelf 31B to the second reference height Z2 (FIG. 4D). Then, the control unit 80 controls the first substrate transfer device 22 to raise the hand 36 between the pair of support arms 24 of the second substrate transfer device 23 to receive the substrate S1 from the second substrate transfer device 23. Then, the control unit 80 controls the first substrate transfer device 22 to lower the hand 36 between the pair of support portions 34B of the lower shelf 31B to deliver the substrate S0 to the lower shelf 31B.

[0174] [3-3. Carrier Transfer Operation] Next, the transfer operation of the component carrier C in the component supply module 50 will be described.

[0175] The loading and unloading of the component carrier C can be performed individually. However, the following will explain the case where the loading of the component carrier C and the unloading of the substrate S0 are performed continuously. FIGS. 16A to 16C are schematic diagrams of the component supply module 50 in the conveying operation of the component carrier C. In FIGS. 16A to 16C, for clarity of explanation, the shelves 61A and 61B of the carrier temporary placement section 51 are shown adjacent to each other, but in terms of structure, the shelves 61A and 61B are arranged vertically.

[0176] As shown in FIG. 16A, within the component supply module 50, the carrier holding table 55 is waiting in a state of holding the component carrier C0 for which the component pickup process has been completed. The transfer robot 9A holds the component carrier C1 before the pickup process and waits in front of the connection opening 60A of the component supply module 50. When the transfer robot 9A holding the component carrier C0 arrives in front of the connection opening 60A, a request for loading the component carrier is made from the overall control unit 11 to the control unit 80. When the component supply module 50 receives the request, it checks whether it can permit the loading of the component carrier. The component supply module 50 determines that the component carrier can be loaded if there is no component carrier C on both the upper shelf 61A and the lower shelf 61B, and the upper shelf 61A is located at the third reference height Z31, and opens the shutter of the connection opening 60A. When the shutter opens, the control unit 80 notifies the transfer module 9 via the overall control unit 11 that the preparation for loading the component carrier is complete and waits until it receives a notification of the completion of loading the component carrier from the transfer module 9.

[0177] Upon receiving the notification, the transfer module 9 activates the transfer robot 9A and places the component carrier C1 on the upper shelf 61A of the carrier temporary placement section 51 through the connection opening 60A. Then, the transfer module 9 notifies the control unit 80 of the bonding apparatus 10 via the overall control unit 11 of the completion of loading the component carrier.

[0178] Upon receiving the component carrier loading completion notification, the control unit 80 controls the carrier transport device 52 to transport the component carrier C0 from the carrier holding table 55 to the lower shelf 61B of the carrier temporary placement section 51 (arrow E12). First, the control unit 80 controls the shelf moving device 65 to move the lower shelf 61B to the fourth reference height Z32 (Fig. 11D). After that, the control unit 80 controls the carrier transport device 52 to raise the hand 66 between the pair of carrier frame guides 100 of the carrier holding table 55 to receive the component carrier C0 from the carrier holding table 55. Then, the control unit 80 controls the carrier transport device 52 to lower the hand 66 between the pair of support portions 64B of the lower shelf 61B to transfer the component carrier C0 to the lower shelf 61B. After that, the control unit 80 controls the shelf moving device 65 to move the lower shelf 61B to the third reference height Z31 (Fig. 11B). When the preparation for unloading the component carrier C0 is complete, the control unit 80 notifies the transport module 9 to that effect via the overall control unit 11 and waits until it receives the component carrier unloading completion notification from the transport module 9.

[0179] As shown in Fig. 16B, upon receiving the notification that the preparation for unloading the component carrier C0 is complete, the transport robot 9A accesses the lower shelf 61B of the carrier temporary placement section 51 through the connection opening 60A and unloads the component carrier C0 placed thereon from the component supply module 50 (arrow E13). Then, the transport module 9 notifies the control unit 80 of the bonding device 10 of the component carrier unloading completion notification via the overall control unit 11.

[0180] Subsequently, the control unit 80 controls the carrier transfer device 52 to transfer the component carrier C1 from the upper shelf 61A to the carrier holding table 55 (S24, arrow E14). First, the control unit 80 controls the shelf moving device 65 to move the upper shelf 61A of the carrier temporary placement unit 51 to the fourth reference height Z32 (Fig. 11C). After that, the control unit 80 controls the carrier transfer device 52 to raise the hand 66 between the pair of support portions 64B of the lower shelf 61B to receive the component carrier C1 from the lower shelf 61B. Then, the control unit 80 controls the arm 67 and the base 68 to lower the hand 66 between the pair of carrier frame guides 100 of the carrier holding table 55 to transfer the component carrier C1 to the carrier holding table 55. Next, the control unit 80 controls the drive box 106 to hold the component carrier C in the manner shown in Figs. 14A to 14D.

[0181] Subsequently, as shown in Fig. 16C, the control unit 80 controls the carrier holding table moving device 58 to move the carrier holding table 55 to the working position Y4 (arrow E15). The control unit 80 controls an ejector lifting device (not shown) to raise the ejector 110 to bring it into contact with the lower surface of the adhesive sheet 114 (Fig. 14D).

[0182] [3-4. Bonding Operation] Subsequently, the bonding operation of individually bonding the plurality of components P held on the component carrier C to the substrate S will be described with reference to Figs. 17A and 17B. Figs. 17A and 17B are cross-sectional views along the X direction schematically showing the method of bonding the component P held on the component carrier C to the substrate S.

[0183] As shown in FIG. 17A, the XY coordinate position of the substrate holding table 25 is adjusted so that the substrate S is positioned at a predetermined bonding operation position XY1. Also, the XY coordinate position of the carrier holding table 55 is adjusted so that the component P1 is positioned at a predetermined pickup operation position XY3. In the component carrier C held by the carrier holding table 55, the pickup head 56 descends (arrow A12) and picks up the component P1 positioned at the pickup operation position XY3. At this time, the ejector 110 pushes up the component P1 positioned at the pickup operation position XY3 to assist the pickup of the component P by the pickup head 56.

[0184] The pickup head 56 that has picked up the component P1 moves horizontally (arrow A13) from the pickup operation position XY3 toward the component delivery position XY2 and inverts during that process (arrow R5). Thereby, the component P1 is oriented upward.

[0185] At the component delivery position XY2, the bonding head 26 is arranged. At the component delivery position XY2, the bonding head 26 positioned above the pickup head 56 descends (arrow A14) and adsorbs and holds the component P1 held by the pickup head 56. Thereby, the component P1 is transferred from the pickup head 56 to the bonding head 26. Thereby, the pickup process of the component P1 is completed.

[0186] The bonding head 26 that has received the component P1 moves from the component delivery position XY2 to the bonding operation position XY1 (arrow A15).

[0187] The bonding head 26 that has moved to the bonding operation position XY1 descends (arrow A16) toward the substrate S held by the substrate holding table 25 as shown in FIG. 17B and bonds the component P1 to the substrate S at a position corresponding to the bonding operation position XY1. Thereby, the bonding process of the component P1 is completed.

[0188] While the bonding head 26 mounts the component P1 onto the substrate S, the pickup head 56 performs the operation of picking up the next component P2. To align the next component P2 to the pickup operation position XY3, the carrier holding table 55 is moved in the XY direction. At this time, the ejector 110 does not have the function of moving in the XY direction and does not move from the pickup operation position XY3.

[0189] By repeatedly executing the operations shown in FIGS. 17A and 17B, a plurality of components P held by the component carrier C can be individually bonded to one substrate S.

[0190] In the bonding system 1 of the present embodiment, when bonding the component P to the substrate S, hybrid bonding is performed in which the electrodes are directly bonded without using a bonding auxiliary member such as solder. In order to perform the hybrid bonding with high precision, surface treatment is performed on the surfaces of the substrate S and the component P before they are loaded into the bonding apparatus 10.

[0191] [Summary] Summarizing the above description, the features of the present disclosure will be described.

[0192] In the bonding apparatus 10 according to Embodiment 1, the bonding module 20 and the component supply module 50 each have a transfer device within the module. Therefore, in the bonding apparatus 10, automatic transfer of each of the substrate S and the component carrier C is possible. Specifically, the substrate transfer devices 22 and 23 perform automatic transfer of the substrate S, and the carrier transfer device 52 performs automatic transfer of the component carrier C. Therefore, the transfer efficiency of the substrate S and the component carrier C in the bonding apparatus 10 is improved.

[0193] Since the automatic transfer of the substrate S and the automatic transfer of the component carrier C are independently performed by different transfer devices, it is not necessary to match the transfer timings of the substrate S and the component carrier C, and the occurrence of the time when the transfer device is waiting can be suppressed. Therefore, the transfer efficiency of the substrate S and the component carrier C in the bonding apparatus 10 is further improved.

[0194] By providing a transfer device in each module, the cost of the bonding device 10 can be reduced as compared with the case where a transfer robot having a long stroke reaching the working positions Y2 and Y4 in each module is provided outside the bonding device 10.

[0195] Since the bonding module 20 and the component supply module 50 each have a transfer device in the module, a transfer device suitable for each module can be adopted. Focusing on the bonding module 20, the bonding module 20 has two substrate transfer devices 22 and 23. By providing the second substrate transfer device 23 that supports both ends of the substrate S, the transfer of the substrate S to the substrate holding table 25 that supports the substrate S on a surface near the center becomes easy. Therefore, in the bonding module 20, the transfer efficiency of the substrate S is improved.

[0196] The second substrate transfer device 23 is provided as a separate member from the substrate holding table 25. By providing the second substrate transfer device 23 separated from the substrate holding table 25, the structure of the substrate holding table 25 becomes simple and the rigidity of the substrate holding table 25 is improved. Therefore, the accuracy of movement of the substrate holding table 25 is improved and the bonding accuracy of components is improved.

[0197] Further, the bonding module 20 has a substrate temporary placement portion 21, and the component supply module 50 has a carrier temporary placement portion 51. Since the substrate S and the component carrier C can be temporarily placed, the occurrence of the time when the transfer robot 9A outside the module waits for the arrival of the transfer device in the module can be suppressed as compared with the case where the transfer robot 9A outside the module directly communicates with the transfer device in the module. Therefore, it becomes easy to combine the bonding device 10 with an external transfer device that carries in and out the component carrier C and the substrate S in a clean environment such as the transfer module 9.

[0198] [Effect 1] According to the bonding apparatus 10 according to Embodiment 1, the following effects can be achieved.

[0199] The bonding apparatus 10 according to Embodiment 1 takes out the components held by the component carrier C and bonds them to the substrate S. The bonding apparatus 10 includes a substrate temporary placement unit 21, a carrier temporary placement unit 51, a substrate holding unit (substrate holding table 25), a carrier holding unit (carrier holding table 55), a bonding head 26, substrate transfer devices 22 and 23, and a carrier transfer device 52. The substrate temporary placement unit 21 is a member that temporarily places the substrate S carried into the bonding apparatus 10. The carrier temporary placement unit 51 is a member that temporarily places the component carrier C carried into the bonding apparatus 10. The substrate holding table 25 holds the substrate S at a position away from the substrate temporary placement unit 21. The carrier holding table 55 holds the component carrier C at a position away from the carrier temporary placement unit 51. The bonding head 26 bonds the components taken out from the component carrier C held by the carrier holding table 55 to the substrate S held by the substrate holding table 25. The substrate transfer devices 22 and 23 transfer the substrate S between the substrate temporary placement unit 21 and the substrate holding table 25. The carrier transfer device 52 transfers the component carrier C between the carrier temporary placement unit 51 and the carrier holding table 55.

[0200] With such a configuration, automatic transfer of the substrate S and the component carrier C within the bonding apparatus 10 becomes possible. Therefore, it becomes easy to combine the bonding apparatus 10 with an external transfer module 9. The component carrier C and the substrate S can be transferred between the bonding apparatus 10 and the transfer module 9 that transfers the component carrier C and the substrate S in a clean environment. In addition, the transfer efficiency of the substrate S and the component carrier C in the bonding apparatus 10 is improved, and the processing efficiency of the bonding apparatus 10 is improved.

[0201] In the bonding apparatus 10 of Embodiment 1, the substrate temporary placement unit 21 has a pair of substrate support parts (a pair of support parts 34A and 34B) that support both end portions of the substrate S from below. The substrate transfer devices 22 and 23 have a first substrate transfer device 22 that receives the substrate S by ascending through the space between the pair of support parts 34A and 34B.

[0202] With such a configuration, the reception and delivery of the substrate S between the substrate temporary placement unit 21 and the first substrate transfer device 22 become easy. The processing efficiency of the bonding apparatus 10 is further improved.

[0203] In the bonding apparatus 10 of Embodiment 1, the substrate temporary placement unit 21 and the substrate holding table 25 are arranged in the first direction (Y direction). The pair of support parts 34A and 34B are provided at intervals in a direction (X direction) intersecting the Y direction.

[0204] With such a configuration, it becomes difficult for the pair of support parts 34A and 34B to obstruct the transfer of the substrate S between the substrate temporary placement unit 21 and the substrate holding table 25.

[0205] In the bonding apparatus 10 of Embodiment 1, the substrate transfer devices 22 and 23 have a second substrate transfer device 23 that receives the substrate S from the first substrate transfer device 22 and transfers it to the substrate holding table 25. The second substrate transfer device 23 has a pair of arms (a pair of support arms 24) that support both end portions of the substrate S from below. The substrate holding table 25 has a support surface 48 that supports the substrate S from below at a position inside both end portions of the substrate S.

[0206] With such a configuration, the reception and delivery of the substrate S between the first substrate transfer device 22 and the second substrate transfer device 23 become easy. The processing efficiency of the bonding apparatus 10 is further improved.

[0207] In the bonding apparatus 10 according to Embodiment 1, the carrier temporary placement unit 51 has a pair of carrier support parts (a pair of support parts 64A and 64B) that support both end parts of the component carrier C from below. The carrier transfer device 52 receives the component carrier C by ascending through the space between the pair of support parts 64A and 64B, and transfers it to the carrier holding table 55.

[0208] With such a configuration, the receiving and transferring of the component carrier C between the carrier temporary placement unit 51 and the carrier transfer device 52 become easy. The processing efficiency of the bonding apparatus 10 is further improved.

[0209] In the bonding apparatus 10 according to Embodiment 1, the carrier holding table 55 supports both end parts of the component carrier C from below.

[0210] With such a configuration, the receiving and transferring of the component carrier C between the carrier transfer device 52 and the carrier holding table 55 become easy. The processing efficiency of the bonding apparatus 10 is further improved.

[0211] In the bonding apparatus 10 according to Embodiment 1, the first direction (Y direction) in which the substrate temporary placement unit 21 and the substrate holding table 25 are arranged is along the second direction (Y direction) in which the carrier temporary placement unit 51 and the carrier holding table 55 are arranged.

[0212] With such a configuration, it becomes easy to arrange the bonding module 20 and the component supply module 50 side by side, and it becomes easy to reduce the space occupied by the bonding apparatus 10.

[0213] The bonding apparatus 10 according to Embodiment 1 further includes housings 30 and 60 that accommodate the substrate temporary placement unit 21, the carrier temporary placement unit 51, the substrate holding table 25, and the carrier holding table 55. The housings 30 and 60 have a first opening (connection opening 30A) at a position adjacent to the substrate temporary placement unit 21, and have a second opening (connection opening 60A) at a position adjacent to the carrier temporary placement unit 51.

[0214] With such a configuration, the external transfer module 9 can easily transfer the substrate S to the substrate temporary placement portion 21 and the component carrier C to the carrier temporary placement portion 51 through the respective connection openings 30A and 60A. Through the substrate temporary placement portion 21 and the carrier temporary placement portion 51, the transfer of the substrate S and the component carrier C between the external transfer module 9, the first substrate transfer device 22, and the carrier transfer device 52 becomes easy. Therefore, it becomes easy to combine the bonding device 10 with the external transfer module 9.

[0215] In the bonding device 10 of Embodiment 1, the housing has a partition wall 30B between the connection opening 30A and the connection opening 60A.

[0216] With such a configuration, compared with the case where one opening including the connection opening 30A and the connection opening 60A is formed, the opening area can be reduced, and the inflow and outflow of particles into the bonding device 10 can be suppressed.

[0217] The bonding method of Embodiment 1 is a method executed by the bonding device 10 having the substrate transfer devices 22 and 23 and the carrier transfer device 52. The bonding method includes a step of temporarily arranging the substrate S carried into the bonding device 10 on the substrate temporary placement portion 21, and a step of temporarily arranging the component carrier C carried into the bonding device 10 on the carrier temporary placement portion 51. The bonding method includes a step of transferring the substrate S between the substrate temporary placement portion 21 and the substrate holding table 25, and a step of transferring the component carrier C between the carrier temporary placement portion 51 and the carrier holding table 55. The bonding method includes a step of holding the substrate S by the substrate holding table 25, and a step of holding the component carrier C by the carrier holding table 55. The bonding method includes a step of taking out the component P from the component carrier C held by the carrier holding table 55 and bonding it to the substrate S held by the substrate holding table 25.

[0218] With such a configuration, the substrate S and the component carrier C can be automatically transported within the bonding apparatus 10. Therefore, the component carrier C and the substrate S can be transferred between the bonding apparatus 10 and the transfer module 9 that transfers the component carrier C and the substrate S in a clean environment.

[0219] [Effect 2] According to the bonding module 20 according to the first embodiment, the following effects can be achieved.

[0220] The processing module (bonding module 20) of the first embodiment includes a first temporary placement unit (upper shelf 31A), a transfer device (substrate transfer devices 22, 23), a holding unit (substrate holding table 25), a processing unit (bonding head 26), and a second temporary placement unit (lower shelf 31B). The upper shelf 31A is a member that temporarily places the object (substrate S) carried into the bonding module 20. The substrate transfer devices 22, 23 receive and transfer the substrate S from the upper shelf 31A. The substrate holding table 25 receives and holds the substrate S from the substrate transfer devices 22, 23. The bonding head 26 performs processing on the substrate S held by the substrate holding table 25. The lower shelf 31B is a member that temporarily places the substrate S received and transferred by the substrate transfer devices 22, 23 from the substrate holding table 25 before the substrate S is carried out of the bonding module 20.

[0221] With such a configuration, by providing two shelves 31A and 31B, the conveyance path when loading into the bonding module 20 and the conveyance path when unloading from the bonding module 20 can be separated. Therefore, compared with the case where only one shelf is provided, the waiting time of the conveyance device until the conveyance device loads the substrate S into the temporary placement section, it is taken out, and the substrate S scheduled to be unloaded is supplied can be shortened. Thus, it becomes easier to combine the bonding module 20 with an external conveyance module 9. The substrate S can be transferred between the bonding device 10 and the conveyance module 9 that conveys the substrate S in a clean environment. Also, the conveyance efficiency of the substrate S in the bonding module 20 is improved, and the processing efficiency of the bonding device 10 is improved.

[0222] In the bonding module 20 of Embodiment 1, the upper shelf 31A has a first inlet (inlet 32A) for loading the substrate S and a first outlet (outlet 33A) for taking out the substrate S. The lower shelf 31B has a second inlet (inlet 32B) for loading the substrate S and a second outlet (outlet 33B) for taking out the substrate S. The inlet 32A and the outlet 33A face each other in the first direction (-Y direction), and the inlet 32B and the outlet 33B face each other in the second direction (+Y direction).

[0223] With such a configuration, in the shelves 31A and 31B of the substrate temporary placement section 21, by separating the inlet and outlet of the substrate S, it becomes easy to put in and take out the substrate S from the shelves 31A and 31B. Therefore, it becomes even easier to combine the bonding module 20 with an external conveyance module 9.

[0224] In the bonding module 20 of Embodiment 1, the first direction and the second direction are parallel and opposite to each other.

[0225] With such a configuration, it becomes easy to reduce the space occupied by the bonding module 20.

[0226] In the bonding device 10 of Embodiment 1, the upper shelf 31A and the lower shelf 31B are arranged side by side in the vertical direction (Z direction).

[0227] With such a configuration, it becomes even easier to save space in the bonding module 20.

[0228] In the bonding module 20 of Embodiment 1, the upper shelf 31A is disposed above the lower shelf 31B.

[0229] With such a configuration, by disposing the upper shelf 31A on which the substrate S before the bonding process is placed upward, foreign matters and dirt that have fallen from the substrate S after the bonding process disposed on the lower shelf 31B are less likely to adhere to the substrate S before the bonding process disposed on the upper shelf 31A.

[0230] In the bonding module 20 of Embodiment 1, the upper shelf 31A and the lower shelf 31B constitute a temporary placement portion (substrate temporary placement portion 21) that can be integrally moved in the vertical direction. The bonding module 20 further includes a control unit 80. When carrying out the substrate S from the lower shelf 31B, the control unit 80 displaces the substrate temporary placement portion 21 in the vertical direction with respect to the substrate temporary placement portion 21 when carrying the substrate S into the upper shelf 31A.

[0231] With such a configuration, the substrate temporary placement portion 21 can be moved between a height suitable for carrying the substrate S into the upper shelf 31A and a height suitable for carrying out the substrate S from the lower shelf 31B. Therefore, the loading and unloading of the substrate S with respect to the substrate temporary placement portion 21 becomes easy.

[0232] In the bonding module 20 of Embodiment 1, when carrying out the substrate S from the lower shelf 31B, the control unit 80 displaces the substrate temporary placement portion 21 in the vertical direction so that the height of the lower shelf 31B approaches the height of the upper shelf 31A when carrying the substrate S into the upper shelf 31A.

[0233] With such a configuration, when loading and unloading the substrate S with respect to the substrate temporary placement portion 21, the variation in the vertical movement amount of the transfer robot 9A of the external transfer module 9 can be reduced.

[0234] In the bonding module 20 of Embodiment 1, the upper shelf 31A has a pair of first support portions (a pair of support portions 34A) that support both end portions of the substrate S from below. The pair of support portions 34A extend along the first direction. The lower shelf 31B has a pair of second support portions (a pair of support portions 34B) that support both end portions of the substrate S from below. The pair of support portions 34B extend along the second direction.

[0235] With such a configuration, it is difficult for the pair of support portions 34A and 34B to interfere with the conveyance of the substrate S by the first substrate conveyance device 22.

[0236] The bonding system 1 of Embodiment 1 includes a bonding module 20 and a conveyance module 9 that conveys the substrate S onto the upper shelf 31A and conveys the substrate S out from the lower shelf 31B.

[0237] With such a configuration, a bonding system 1 with improved processing efficiency can be provided.

[0238] The bonding method of Embodiment 1 includes a step of temporarily arranging the substrate S carried into the bonding module 20 on the upper shelf 31A, a step of receiving the substrate S from the upper shelf 31A and conveying it to the substrate holding table 25. The bonding method includes a step of holding the substrate S on the substrate holding table 25 and a step of performing processing on the substrate S held on the substrate holding table 25. The bonding method includes a step of receiving the processed substrate S from the substrate holding table 25, conveying it to the lower shelf 31B, and temporarily arranging it, and a step of conveying out the substrate S on the lower shelf 31B from the bonding module 20.

[0239] With such a configuration, by providing the two shelves 31A and 31B, the conveyance path when carrying into the bonding module 20 and the conveyance path when carrying out from the bonding module 20 can be separated.

[0240] [Effect 3] According to the bonding apparatus 10 according to Embodiment 1, the following effects can be achieved.

[0241] The bonding apparatus 10 according to Embodiment 1 includes a substrate temporary placement unit 21, substrate transfer devices 22 and 23, a substrate holding unit (substrate holding table 25), a bonding head 26, and a carrier transfer device 52. The substrate temporary placement unit 21 is a member that temporarily places the substrate S carried into the bonding apparatus 10. The substrate transfer devices 22 and 23 receive the substrate S from the substrate temporary placement unit 21 and transfer it. The substrate holding table 25 receives the substrate S from the substrate transfer devices 22 and 23 and holds it. The bonding head 26 joins components to the substrate S held by the substrate holding table 25. The substrate transfer devices 22 and 23 include a first substrate transfer device 22 that receives the substrate S from the substrate temporary placement unit 21 and transfers it, and a second substrate transfer device 23 that receives the substrate S from the first substrate transfer device 22 and transfers it so as to deliver it to the substrate holding table 25.

[0242] With such a configuration, by providing the first substrate transfer device 22 and the second substrate transfer device 23, the transfer efficiency of the substrate S in the bonding apparatus 10 is improved, and the processing efficiency of the bonding apparatus 10 is improved.

[0243] In the bonding module 20 according to Embodiment 1, the substrate temporary placement unit 21 has a pair of substrate support portions (a pair of support portions 34A and 34B) that support both end portions of the substrate S from below. The first substrate transfer device 22 has a first support arm (hand 36 and arm 37) that supports the substrate S from below at a position inside both end portions of the substrate S. The second substrate transfer device 23 has a pair of second support arms (a pair of support arms 24) that support both end portions of the substrate S from below. The substrate holding table 25 has a support surface 48 that supports the substrate S from below at a position inside both end portions of the substrate S.

[0244] With such a configuration, it becomes easy to receive and transfer the substrate S between the substrate temporary placement unit 21 and the first substrate transfer device 22, between the first substrate transfer device 22 and the second substrate transfer device 23, and between the second substrate transfer device 23 and the substrate holding table 25. The transfer efficiency of the bonding device 10 is further improved. Further, since the substrate holding table 25 supports the substrate S on the support surface 48, the substrate holding table 25 can stably support the substrate S even in the bonding process where a force is applied to the substrate S.

[0245] In the bonding module 20 of the first embodiment, the pair of support portions 34A and 34B are provided with a first interval (intervals W1 and W2) in a direction (X direction) intersecting the conveyance direction (Y direction) of the substrate S by the first substrate transfer device 22. The pair of support arms 24 are provided with a second interval G2 in a direction (X direction) intersecting the conveyance direction.

[0246] With such a configuration, since the pair of support portions 34A and 34B and the pair of support arms 24 do not exist in the direction intersecting the conveyance direction, the pair of support portions 34A and 34B and the pair of support arms 24 are less likely to interfere with the conveyance of the substrate S.

[0247] Since the interval between the pair of support arms 24 is variable, the state of the pair of support arms 24 can be changed between a state of supporting the substrate S and a state of releasing the substrate S. Therefore, the second substrate transfer device 23 can easily transfer the substrate S to the substrate holding table 25.

[0248] In the bonding module 20 of the first embodiment, the first substrate transfer device 22 relatively raises the hand 36 and the arm 37 with respect to the substrate S supported by the pair of support portions 34A and 34B to receive the substrate S.

[0249] With such a configuration, the first substrate transfer device 22 can easily receive the substrate S from the substrate temporary placement unit 21.

[0250] In the bonding module 20 of Embodiment 1, the first substrate transfer device 22 relatively lowers the hand 36 and the arm 37 that support the substrate S and transfers the substrate to the pair of support arms 24.

[0251] With such a configuration, the first substrate transfer device 22 can easily transfer the substrate S to the second substrate transfer device 23.

[0252] In the bonding module 20 of Embodiment 1, the second substrate transfer device 23 relatively lowers the pair of support arms 24 that support the substrate S and transfers the substrate S to the support surface 48 of the substrate holding table 25.

[0253] With such a configuration, the second substrate transfer device 23 can easily transfer the substrate S to the substrate holding table 25. Then, by widening the interval between the pair of support arms 24, it is possible to prevent the pair of support arms 24 and the substrate holding table 25 from interfering when the substrate holding table 25 moves away from the second substrate transfer device 23 in the Y direction.

[0254] In the bonding module 20 of Embodiment 1, the pair of support portions 34A and 34B and the pair of support arms 24 have different shapes from each other.

[0255] With such a configuration, the pair of support portions 34A and 34B can be formed into a shape (linear shape) suitable for receiving the substrate S from the transfer module 9 outside the bonding device 10. The pair of support arms 24 can be formed into a shape (arc shape) suitable for transferring the substrate S to the substrate holding table 25.

[0256] The bonding method of Embodiment 1 includes the steps of temporarily placing the substrate S carried into the bonding apparatus 10 on the substrate temporary placement portion 21, and transporting the substrate S between the substrate temporary placement portion 21 and the substrate holding table 25. The bonding method includes the steps of holding the substrate S by the substrate holding table 25, and bonding the component P to the substrate S held by the substrate holding table 25. In the transporting step, the first substrate transporting device 22 receives the substrate S from the substrate temporary placement portion 21 and transports it to the second substrate transporting device 23, and the second substrate transporting device 23 delivers the substrate S to the substrate holding table 25.

[0257] With such a configuration, by providing the first substrate transporting device 22 and the second substrate transporting device 23, the transporting efficiency of the substrate S in the bonding apparatus 10 is improved, and the processing efficiency of the bonding apparatus 10 is improved.

[0258] Note that the present disclosure is not limited to the above-described embodiment, and can be implemented in various other modes.

[0259] Note that, although the bonding module 20 has been described as an example of the processing module, it is not limited thereto. The processing module may be a component supply module 50. In this case, the processing module has a pickup head 56 as a processing unit, and the object is a component carrier C.

[0260] Note that, although an example in which the bonding apparatus 10 has a pickup head 56 for inverting components has been described, it is not limited thereto. The pickup head 56 may be omitted from the bonding apparatus 10. In this case, the bonding head 26 may move to the information of the component carrier C and directly take out the component from the component carrier C.

[0261] Note that, although an example in which the substrate transport direction and the carrier transport direction are in the Y direction and parallel to each other has been described, it is not limited thereto.

[0262] Although an example in which the shelves 31A, 31B and the shelves 61A, 61B are arranged vertically has been described, the present invention is not limited to this. For example, the shelves 31A, 31B and the shelves 61A, 61B may be arranged in the width direction (X direction). On the other hand, when the shelves 31A, 31B and the shelves 61A, 61B are arranged vertically, the space saving of the bonding apparatus 10 becomes easy.

[0263] In addition, the penetration direction of the upper shelf 31A may be different from the penetration direction of the lower shelf 31B, and the penetration direction of the upper shelf 61A may be different from the penetration direction of the lower shelf 61B.

[0264] Although an example in which the bonding module 20 has two substrate transfer devices 22, 23 has been described, the present invention is not limited to this. The bonding module 20 may have one substrate transfer device that transfers the substrate S from the substrate temporary placement unit 21 to the substrate holding table 25.

[0265] In addition, although an example in which the first substrate transfer device 22 moves up and down with respect to the substrate temporary placement unit 21 when receiving or delivering the substrate has been described, the present invention is not limited to this. The substrate temporary placement unit 21 may move up and down with respect to the first substrate transfer device 22. That is, relative movement may occur between the first substrate transfer device 22 and the substrate temporary placement unit 21 when receiving or delivering the substrate.

[0266] Similarly, when receiving or delivering the substrate, relative movement may occur between the first substrate transfer device 22 and the second substrate transfer device 23, and between the second substrate transfer device 23 and the substrate holding table 25.

[0267] In addition, although an example in which the carrier transfer device 52 moves up and down with respect to the carrier holding table 55 when receiving or delivering the component carrier C has been described, the present invention is not limited to this. The carrier holding table 55 may move up and down with respect to the carrier transfer device 52. That is, relative movement may occur between the carrier transfer device 52 and the carrier holding table 55 when receiving or delivering the component carrier C.

[0268] Note that although it has been described that the height of the upper shelf 31A when loading the substrate onto the upper shelf 31A is the same as the height of the lower shelf 31B when unloading the substrate from the lower shelf 31B, it is not limited to this. When unloading the substrate from the lower shelf 31B, the substrate temporary placement portion 21 may be displaced in the vertical direction so that the height of the lower shelf 31B approaches the height of the upper shelf 31A when loading the substrate onto the upper shelf 31A. Also, although it has been described that the height of the upper shelf 31A when unloading the substrate from the upper shelf 31A is the same as the height of the lower shelf 31B when loading the substrate onto the lower shelf 31B, it is not limited to this. When loading the substrate onto the lower shelf 31B, the substrate temporary placement portion 21 may be displaced in the vertical direction so that the height of the lower shelf 31B approaches the height of the upper shelf 31A when unloading the substrate from the upper shelf 31A.

[0269] The bonding apparatus according to the first aspect includes a substrate temporary placement portion for temporarily placing the substrate loaded into the bonding apparatus, a substrate transfer apparatus for receiving and transferring the substrate from the substrate temporary placement portion, a substrate holding portion for receiving and holding the substrate from the substrate transfer apparatus, and a bonding head for bonding components to the substrate held by the substrate holding portion. The substrate transfer apparatus includes a first substrate transfer apparatus for receiving and transferring the substrate from the substrate temporary placement portion, and a second substrate transfer apparatus for receiving the substrate from the first substrate transfer apparatus and transferring it so as to deliver it to the substrate holding portion.

[0270] As the bonding apparatus according to the second aspect, in the bonding apparatus according to the first aspect, the substrate temporary placement portion has a pair of substrate support portions for supporting both ends of the substrate from below, the first substrate transfer apparatus has a first support arm for supporting the substrate from below at a position inside both ends of the substrate, the second substrate transfer apparatus has a pair of second support arms for supporting both ends of the substrate from below, and the substrate holding portion has a support surface for supporting the substrate from below at a position inside both ends of the substrate.

[0271] As a bonding apparatus in the third aspect, in the bonding apparatus in the second aspect, a pair of substrate support portions are provided with a first interval in a direction intersecting the conveyance direction of the substrate by the first substrate conveyance apparatus, and a pair of second support arms are provided with a second interval in a direction intersecting the conveyance direction.

[0272] As a bonding apparatus in the fourth aspect, in the bonding apparatus in the third aspect, the first interval is fixed and the second interval is variable.

[0273] As a bonding apparatus in the fifth aspect, in the bonding apparatus in any one of the second to fourth aspects, the first substrate conveyance apparatus relatively raises the first support arm with respect to the substrate supported by the pair of substrate support portions to receive the substrate.

[0274] As a bonding apparatus in the sixth aspect, in the bonding apparatus in any one of the second to fifth aspects, the first substrate conveyance apparatus relatively lowers the first support arm supporting the substrate to transfer the substrate to the pair of second support arms.

[0275] As a bonding apparatus in the seventh aspect, in the bonding apparatus in the fourth aspect, the second substrate conveyance apparatus relatively lowers the pair of second support arms supporting the substrate to widen the second interval and transfer the substrate to the support surface of the substrate holding portion.

[0276] As a bonding apparatus in the eighth aspect, in the bonding apparatus in any one of the second to seventh aspects, the pair of substrate support portions and the pair of second support arms have different shapes from each other.

[0277] The bonding method in the ninth aspect includes the steps of temporarily placing a substrate carried into a bonding apparatus on a substrate temporary placement portion, transporting the substrate between the substrate temporary placement portion and a substrate holding portion, holding the substrate by the substrate holding portion, and bonding components to the substrate held by the substrate holding portion. In the transporting step, a first substrate transport device receives the substrate from the substrate temporary placement portion and transports it to a second substrate transport device, and the second substrate transport device delivers the substrate to the substrate holding portion.

[0278] This disclosure is fully described in connection with preferred embodiments with reference to the accompanying drawings, but various modifications and variations will be apparent to those skilled in the art. Such modifications and variations are to be understood as being included therein as long as they do not depart from the scope of the present invention as defined by the appended claims.

Industrial Applicability

[0279] This disclosure is applicable to a bonding apparatus that individually bonds a plurality of components held by a component carrier to a substrate and a processing module within the bonding apparatus.

Explanation of Reference Numerals

[0280] 1 Bonding system 10 Bonding apparatus 11 Overall control unit 20 Bonding module 21 Substrate temporary placement portion 22 First substrate transport device 23 Second substrate transport device 24 Support arm 25 Substrate holding table 26 Bonding head 31A Upper shelf 31B Lower shelf 34A Support portion 34B Support portion 48 Support surface 50 Component supply module 51 Carrier temporary placement portion 52 Carrier transport device 55 Carrier holding table 56 Pickup head 100 Carrier frame guide

Claims

1. A substrate temporary placement unit for temporarily placing a substrate carried into a bonding apparatus; A substrate transfer device that receives and transfers the substrate from the substrate temporary placement unit; A substrate holding unit that receives and holds the substrate from the substrate transfer device; A bonding head that bonds components to the substrate held by the substrate holding unit, and comprising: The substrate transfer device has a first substrate transfer device that receives and transfers the substrate from the substrate temporary placement unit, and a second substrate transfer device that receives the substrate from the first substrate transfer device and transfers it so as to deliver it to the substrate holding unit. Bonding apparatus.

2. The substrate temporary placement unit has a pair of substrate support portions that support both ends of the substrate from below, The first substrate transfer device has a first support arm that supports the substrate from below at a position inside both ends of the substrate, The second substrate transfer device has a pair of second support arms that support both ends of the substrate from below, The substrate holding unit has a support surface that supports the substrate from below at a position inside both ends of the substrate. The bonding apparatus according to claim 1.

3. The pair of substrate support portions are provided with a first interval in a direction intersecting the substrate transfer direction by the first substrate transfer device. The pair of second support arms are provided with a second interval in a direction intersecting the transfer direction. The bonding apparatus according to claim 2.

4. The first interval is fixed, The second interval is variable. The bonding apparatus according to claim 3.

5. The first substrate transfer device relatively raises the first support arm with respect to the substrate supported by the pair of substrate support portions to receive the substrate. The bonding apparatus according to claim 2.

6. The first substrate transfer device relatively lowers the first support arm that supports the substrate and delivers the substrate to the pair of second support arms. The bonding apparatus according to claim 2.

7. The second substrate transfer device relatively lowers the pair of second support arms that support the substrate, widens the second interval, and delivers the substrate to the support surface of the substrate holding unit. The bonding apparatus according to claim 4.

8. The pair of substrate support portions and the pair of second support arms have different shapes from each other. The bonding apparatus according to any one of claims 2 to 7.

9. A step of temporarily placing a substrate carried into a bonding apparatus on a substrate temporary placement unit; A step of conveying a substrate between the substrate temporary placement portion and the substrate holding portion; A step of holding the substrate by the substrate holding portion; A step of joining components to the substrate held by the substrate holding portion, and includes: In the step of conveying, a first substrate conveying device receives the substrate from the substrate temporary placement portion and conveys it to a second substrate conveying device, and the second substrate conveying device delivers the substrate to the substrate holding portion. Bonding method.

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