Imprint device, imprint method, method for manufacturing article, and program

Abstract

To provide an imprint device that can perform imprint processing while correcting impressing force and the inclination of a mold in processing of impressing the mold on an imprint material.SOLUTION: An imprint device forms a pattern on a resin on a substrate by using a mold and has: a detection unit that detects marks provided on the mold and the substrate; an imprint head that drives to press the mold against the substrate, and controls the impressing force of the pressing and the relative inclination between the mold and the substrate; a stage that has a mounting surface for holding the substrate, and moves in a plane parallel to the mounting surface; and a control unit that controls the detection unit, the imprint head, and the stage. The control unit controls the imprint head on the basis of the amount of the relative displacement of the marks on the mold and the substrate in the plane, in a non-contact state and a contact state of the mold and the resin on the substrate, which is obtained on the basis of the result of the detection performed by the detection unit.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an imprint apparatus, an imprint method, a method for manufacturing an article, and a program.

Background Art

[0002] An imprint apparatus forms a pattern identical to that of a mold made of a cured resin on a substrate by curing an imprint material by irradiation with illumination light while the mold having a pattern formed thereon is in contact with the imprint material supplied onto the substrate, and then separating the mold and the substrate.

[0003] In the contact process of the imprint process, if the pressing force with which the mold presses the imprint material on the substrate or the inclination of the mold is displaced from the set value, the imprint material may protrude from the shot area, or the thickness of the resin after film formation may become uneven. Further, due to the deviation of the pressing force or the inclination of the mold, the mold may be deformed during contact, and there is a risk that the horizontal alignment error between the mold and the substrate increases.

[0004] Patent Document 1 describes a technique for reducing the alignment error caused by the pressing force and the inclination of the mold during contact in imprint lithography by measuring several alignment marks.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In order to prevent the imprint material from protruding from the shot area, the film thickness from becoming uneven, or the alignment error between the mold and the substrate from increasing after pressing, it is desirable that the pressing force and the inclination of the mold can be corrected as intended in the contact process.

[0007] There are various methods for adjusting the imprinting force and the inclination of the mold during contact. As one method, there is a method of obtaining it from the overlay data of the mold and the substrate. Using the overlay data, which is the relative displacement amount between the mold and the substrate after the mold contacts the imprint material, and the horizontal deformation amount of the mold after contact due to the change per unit amount of the imprinting force and inclination, the displacement amounts of the imprinting force and inclination are obtained. The obtained displacement amounts of the imprinting force and inclination are applied to the imprinting apparatus as correction values.

[0008] However, the overlay data of the mold and the substrate includes drawing errors with respect to the design coordinates of the patterns of the mold and the substrate respectively, that is, IP (Image Placement) errors. Strictly speaking, errors corresponding to the IP errors are added to the calculated components of the imprinting force and inclination. Even if the displacement amounts of the imprinting force and inclination calculated from the overlay data including the IP errors are corrected, the imprinting result may not be as intended. In addition, since the IP errors vary depending on the individual molds and substrates, there may also be a problem that the calculated displacement amounts of the imprinting force and inclination vary depending on the individual molds and substrates used. Also, in the technique described in Patent Document 1, errors may be added to the correction values of the imprinting force and the inclination of the mold due to the IP errors of the mold and the substrate used. It is an issue to accurately obtain the displacement amounts of the imprinting force and the inclination of the mold in the contact process between the mold and the substrate and to correct the imprinting force and the inclination of the mold as intended.

[0009] An object of the present invention is to provide an imprinting apparatus capable of acquiring the displacement amounts of the imprinting force and the inclination of the mold in the imprinting process of the mold on the imprint material and correcting the imprinting force and the inclination of the mold to perform the imprinting process.

Means for Solving the Problems

[0010] The imprint apparatus of the present invention is an imprint apparatus that forms a pattern on a resin on a substrate using a mold having a pattern formed thereon, and includes a detection unit that detects marks provided on the mold and the substrate, and an imprint head that is driven to press the mold against the substrate and controls the pressing force of the press and the relative inclination between the mold and the substrate. The apparatus further includes a stage having a placement surface for holding the substrate and moving within a plane parallel to the placement surface, and a control unit that controls the detection unit, the imprint head, and the stage. The control unit controls the imprint head based on the relative displacement amounts of the marks of the mold and the substrate in the plane in a non-contact state and a contact state between the mold and the resin on the substrate, which are obtained based on the detection results of the detection unit.

Advantages of the Invention

[0011] According to the present invention, it is possible to provide an imprint apparatus that can acquire the pressing force and the amount of deviation of the inclination of the mold in the pressing process of the mold on the imprint material, correct the pressing force and the inclination of the mold, and perform the imprint process.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiment for Carrying Out the Invention

[0013] The imprint apparatus forms the same pattern as the mold made of a cured resin on the substrate by curing the imprint material by irradiation of illumination light in a state where the mold with the pattern formed thereon is in contact with the imprint material supplied on the substrate, and then separating the mold and the substrate.

[0014] In the contact process of the imprint process, when the imprinting force, which is the force with which the mold presses the imprint material on the substrate, or the inclination of the mold is displaced from the set state, there is a risk that the imprint material may protrude from the shot region or the thickness of the resin after film formation may become non-uniform. Further, due to the deviation of the imprinting force or the inclination of the mold, the mold may be deformed during contact, and there is a risk that the horizontal alignment error between the mold and the substrate may increase.

[0015] In order to reduce the protrusion of the imprint material from the shot region, the non-uniformity of the film thickness, and the increase in the alignment error between the mold and the substrate after the imprint process, it is desirable that in the contact process between the mold and the imprint material, the imprinting force and the inclination of the mold can be corrected so as to approach the set values.

[0016] As one method of adjusting the imprinting force and the inclination of the mold during contact, there is a method of obtaining them from the alignment data between the mold and the substrate. Using the alignment data, which is the relative positional displacement amount between the mold and the substrate after the mold contacts the imprint material, and the data of the horizontal deformation amount of the mold after contact per unit change amount of the imprinting force and the inclination, the deviation amounts of the imprinting force and the inclination are obtained. By applying the thus obtained deviation amounts of the imprinting force and the inclination as correction values to the contact process in the imprint process, imprinting can be performed in a state where the deviation of the imprinting force and the inclination is corrected.

[0017] However, since the overlay data of the mold and the substrate includes drawing errors (IP errors) with respect to the design coordinates of the patterns of the mold and the substrate respectively, strictly speaking, errors corresponding to the IP errors will be added to the calculated pressing force and inclination. Therefore, even if the deviation amounts of the pressing force and inclination calculated based on the overlay data including IP errors are corrected, there is a possibility that the imprint result will not be as intended. In addition, since the IP errors vary for each mold and substrate, the deviation amounts of the calculated pressing force and inclination vary depending on the mold and substrate used. It is an issue to accurately obtain the deviation amounts of the pressing force and the inclination of the mold in the contact process between the mold and the substrate, and to correct the pressing force and the inclination of the mold as intended.

[0018] Therefore, an object of the present invention is to provide an imprint apparatus capable of obtaining the deviation amounts of the pressing force and the inclination of the mold in the pressing process of the mold against the imprint material, correcting the pressing force and the inclination of the mold, and performing the imprint process.

[0019] Hereinafter, the imprint apparatus according to the embodiment will be described in detail with reference to the accompanying drawings. Note that the drawings shown below may be drawn at scales different from the actual ones in order to facilitate understanding of the embodiment.

[0020] <First Embodiment> FIG. 1 shows a schematic diagram of the configuration of the imprint apparatus 1. In this specification and the accompanying drawings, directions are indicated in the XYZ orthogonal coordinate system with a plane parallel to the surface of the substrate S as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ orthogonal coordinate system are defined as the X-direction, Y-direction, and Z-direction respectively, and the rotations around the X-axis, Y-axis, and Z-axis are denoted as θX, θY, and θZ respectively.

[0021] The imprint apparatus 1 transfers the same pattern as the mold M to the imprint material IM disposed on the substrate S by imprint processing. The imprint processing includes contact processing, alignment processing, curing processing, and mold release processing. The contact processing is a process of bringing the pattern region P of the mold M into contact with the imprint material IM disposed in the shot region (imprint target region) of the substrate S. The alignment processing is a process of aligning the shot region of the substrate S and the pattern region P of the mold M in a state where the mold M and the substrate S are in contact with each other via the imprint material IM. The curing processing is a process of irradiating illumination light UV to cure the imprint material IM. The mold release processing is a process of separating the pattern formed of the cured product of the imprint material IM and the pattern region P of the mold M.

[0022] As the imprint material, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. are used. The electromagnetic waves are, for example, light selected from the range of a wavelength of 10 nm or more and 1 mm or less, for example, infrared rays, visible rays, ultraviolet rays, etc. The curable composition is a composition that cures by irradiation with light or by heating.

[0023] Among these compositions, the photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, etc.

[0024] The imprint material is disposed on the substrate in a droplet shape, or in an island shape or a film shape formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25°C) can be, for example, 1 mPa·s or more and 100 mPa·s or less.

[0025] The imprinting apparatus 1 includes an imprint head IH within a structure ST. The imprint head IH includes a driving unit that moves the mold M in the Z direction during a contact process of bringing the imprint material IM on the substrate S into contact with the mold M and a release process of separating the mold M from the imprint material IM on the substrate S.

[0026] The driving unit of the imprint head IH may be configured to be able to move the mold M not only in the Z direction but also in the X direction and the Y direction. Further, it may be configured to have a tilt function of driving the mold M in the θX and θY directions.

[0027] The imprint head IH may include a mold holding part MCK that holds the mold M. The mold holding part MCK holds the mold M by attracting the outer peripheral region of the contact surface with the mold M by a vacuum suction force or an electrostatic force. Further, the imprint head IH may include a shape correction part MAG.

[0028] The shape correction part MAG is a mold deformation means capable of deforming the shape of the pattern region P of the mold M in the XY direction. The shape correction part MAG can deform the pattern region P, for example, by applying a force to four side surfaces of the mold M.

[0029] The imprint head IH may further include a pressure mechanism that applies pressure to the surface of the pattern region P of the mold M opposite to the contact side with the substrate so that the pattern region P of the mold M deforms into a convex shape toward the substrate during the contact process. Thereby, it becomes possible to contact from the central part of the pattern region P of the mold M, and the imprint material IM can be efficiently filled in the pattern region P of the mold M.

[0030] The imprinting apparatus 1 includes a substrate stage STG within the structure ST. The substrate stage STG includes a driving unit for aligning (alignment) the mold M and the substrate S in an alignment process. The driving unit of the substrate stage STG drives in the X direction, the Y direction, and the θZ direction within the XY plane to position the substrate S with high precision.

[0031] Further, the substrate stage STG may be configured to have a tilt function for driving in the θX and θY directions. The substrate stage STG includes a substrate holding portion SCK having a mounting surface for adsorbing and holding the substrate S.

[0032] The imprint apparatus may include a measurement unit (detection unit) AS. In the alignment process, the measurement unit AS observes the alignment mark MMK of the mold M and the alignment mark SMK of the substrate S, and measures the horizontal superposition error between the two marks. A plurality (for example, four or more) of the measurement units AS may be mounted in order to accurately measure the superposition error between the mold M and the substrate S. Further, the measurement unit AS can be driven in the X and Y directions so as to be able to measure a plurality of alignment marks at different positions.

[0033] The imprint apparatus 1 may include an illumination unit IL. In the curing process, the illumination unit IL cures the imprint material IM by irradiating the imprint material IM with curing illumination light UV in a state where the pattern region P of the mold M is in contact with the imprint material IM disposed on the substrate S. The illumination light UV may be irradiated onto the imprint material IM via a mirror ML.

[0034] The imprint apparatus 1 may include a dispenser DSP. The dispenser DSP disposes the imprint material IM in the shot region of the substrate S. The disposition of the imprint material IM in the shot region of the substrate S is performed by the dispenser DSP discharging the imprint material IM in synchronization with the driving of the substrate S by the substrate stage STG while the substrate S is being driven.

[0035] The imprint apparatus 1 includes a control unit CTL. The control unit CTL controls an imprint head IH, a substrate stage STG, a measurement unit AS, an illumination unit IL, and a dispenser DSP. The control unit CTL can be configured by, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose computer (including a CPU and a memory) in which a program is incorporated, or a combination of all or part of these. The control unit CTL may be provided inside the imprint apparatus 1, or may be installed at a location separate from the imprint apparatus 1 and controlled remotely.

Example

[0036] An example of the imprint processing method in the imprint apparatus of the present invention will be described in detail with reference to the flowchart of FIG. 2.

[0037] In step S1 (bringing the mold and the substrate closer), the imprint head IH is driven in the Z direction to bring the mold M and the substrate S closer. As the gap between the mold M and the substrate S becomes smaller, the intensity of the signal detected by the measurement unit AS from the alignment marks MMK and SMK increases, so that the measurement accuracy of the superposition error between the mold M and the substrate S is improved. Also, in the non-contact state between the mold M and the substrate S in the next step S2, in order for the measurement unit AS to be able to measure the superposition error between the mold M and the substrate S with sufficient accuracy, the gap between the mold M and the substrate S is desirably 10 μm or less.

[0038] In step S2 (measurement process 1), the measurement unit AS measures the superposition error between the mold M and the substrate S in the non-contact state between the mold M and the substrate S. The superposition error between a plurality of alignment marks MMK arranged in the pattern region P of the mold M and a plurality of alignment marks SMK arranged in the shot region of the substrate S paired with it is measured.

[0039] At this time, the imprint head IH and the substrate stage STG are not strictly in a stationary state. For example, since they are vibrating in the X direction, Y direction, and θZ direction, the relative position between the mold M and the substrate S may not be constant. Therefore, it is necessary to perform a process of removing the influence of vibration from the measurement values of the measurement unit AS.

[0040] Referring to FIG. 3, a method for removing the influence of vibration will be described in a state where four measurement units LB, RB, RF, and LF that can be measured simultaneously are mounted on the imprint apparatus 1 as the measurement unit AS. Among the four measurement units AS, the measurement units LB, RB, and RF always measure the same measurement points, and the remaining measurement unit LF moves to sequentially measure other measurement points.

[0041] For example, in FIG. 3, (a1) and (b1) show how the measurement unit AS measures the overlay error between the alignment marks MMK of a plurality of molds M and the alignment marks SMK of the substrate S at different times t1 and t2. In (b1), among the measurement units AS, three of the measurement units LB, RB, and RF measure the same alignment marks as (a1), and only the measurement unit LF measures alignment marks different from (a1).

[0042] The arrows in FIG. 3 indicate the relative displacement amount between the alignment marks of the mold M and the substrate S at that position. The measurement value (a1) (detection result) includes the component of the shift amount (a2) as the influence of vibration during measurement in the X direction and Y direction of the imprint head IH and the substrate stage STG. From the data of the measurement value (a1), the component of the shift amount (a2) as the influence of vibration at time t1 is obtained and subtracted from the measurement value (a1), which is (a3) (non-contact displacement amount). The shift amount (a2) as the influence of vibration at time t1 can be obtained, for example, by averaging the displacements of each measurement point of the measurement value (a1) as the relative movement amount between the mold M and the substrate S.

[0043] Similarly, in FIG. 3, a shift amount (b2) as a vibration influence component is obtained based on a measured value (b1) (detection result) measured at a time different from the measured value (a1), and the result of subtracting the shift amount (b2) from the measured value (b1) is (b3) (non-contact displacement amount). In (a3) and (b3), the displacement amount between the mold M and the substrate S in the measurement units LB, RB, and RF is the same.

[0044] In this way, by sequentially changing the measurement target of the measurement unit LF among the four measurement points of the measurement unit AS and integrating the data after subtracting the vibration components, the result of FIG. 3(c) is finally obtained.

[0045] At the time of step S2, since the mold M and the substrate S are in a non-contact state (before contact), the result of FIG. 3(c) obtained is not affected by the deformation of the mold M due to contact. Therefore, in FIG. 3(c), only the displacement amounts from the design coordinates of the alignment mark MMK of the mold M and the alignment mark SMK of the substrate S, that is, only the IP error, appears as a relative difference.

[0046] The control unit CTL stores the data of FIG. 3(c) as the measurement result of step S2. In this way, among the plurality of marks provided on the mold and the substrate, a plurality of detections are performed in which at least one of the marks to be detected is different for each detection. If the measurement accuracy is insufficient and the displacement amounts between the measurement units LB, RB, and RF do not match between (a2) and (b2), the number of measurements may be increased, and the displacement amounts obtained by the same measurement unit may be averaged to determine the displacement amount for each measurement unit.

[0047] In step S3 (supply of imprint material), the control unit CTL controls the dispenser DSP to supply the imprint material IM onto the shot area of the substrate S. In accordance with the timing when the substrate stage STG scans and moves under the dispenser DSP, the dispenser DSP discharges the imprint material IM onto the substrate S. Note that a material for enhancing the adhesion to the imprint material IM is applied to the surface of the substrate S, which plays a role of retaining the imprint material IM on the substrate S side in a later step S10 (release process).

[0048] In step S4 (contact process), the control unit CTL controls the imprint head IH to bring the mold M into contact with the substrate S through the imprint material. That is, the mold M is pressed against the imprint material IM disposed on the substrate S. At this time, pressure may be applied to the surface of the pattern area P of the mold M on the side opposite to the substrate S so as to contact from the center of the pattern area P of the mold M with respect to the imprint material IM on the substrate S, and the pattern area P may be bulged into a convex shape toward the substrate S. The contact state between the mold M and the substrate S is maintained until the imprint material IM supplied onto the shot area of the substrate S spreads sufficiently between the mold M and the substrate S.

[0049] In step S5 (measurement process 2), with the mold M and the substrate S in contact through the imprint material IM, the superposition error between the mold M and the substrate S is measured in the same manner as in step S2. If the pressing force with which the imprint head IH presses the mold M against the substrate S or the inclination of the mold M as the attitude of the imprint head IH in the θX direction and the θY direction deviates from the set state, deformation of the mold M occurs. Therefore, in the contact process of step S4, the amount of deformation of the mold M caused by the contact may be included in the superposition error between the mold M and the substrate S measured by the measurement unit AS.

[0050] FIG. 4 shows the superposition error between the mold M and the substrate S obtained by subtracting the component of the vibration influence from the detection result which is a measured value, in the same manner as the method of obtaining the deviation amount obtained by eliminating the component of the vibration influence in (c) with reference to FIG. 3. FIG. 4 exemplifies the superposition error including an error generated due to the deviation of the pressing force at the time of contact. The control unit CTL stores the data in FIG. 4 as the measurement result in step S5.

[0051] In step S6 (calculation of pressing force and inclination deviation), the control unit CTL obtains the deviation amounts of the pressing force and the inclination generated during the contact process in step S4. This derivation is performed based on the two deviation amount data acquired and recorded in steps S2 and S5, and the deformation amounts in the X and Y directions of the mold M at the time of contact (hereinafter referred to as sensitivity data) due to the change per unit amount of the pressing force and the inclination of the mold M.

[0052] The sensitivity data of the pressing force and the inclination of the mold M are obtained in advance by experiments, simulations, etc. As a method for obtaining in experiments, for example, from the superposition result of the mold and the substrate when imprinting is performed with a plurality of conditions (such as -10 N, 0 N, +10 N, etc. with respect to a predetermined pressing force) for the set value of the pressing force, a method of using the change amount of the superposition error per unit change amount (1 N) of the pressing force as the sensitivity data can be mentioned.

[0053] As a method for obtaining in simulations, for example, the finite element method can be mentioned. FIG. 5(a) is the superposition error between the mold M and the substrate S before the mold M and the substrate S come into contact, acquired and recorded in step S2, and is the same as the data shown in (c) of FIG. 3. FIG. 5(b) is the deviation amount data measured after the mold M and the substrate S come into contact, acquired and recorded in step S5, and is the same as the data shown in FIG. 4.

[0054] Figure 5(c) is obtained by subtracting Figure 5(b) from Figure 5(a), and shows the pure deformation amount (displacement amount) of mold M due to contact, with the IP errors of mold M and substrate S removed. Here, it represents the horizontal deformation amount of mold M generated by the deviation of the pressing force. Figure 5(d) is the sensitivity data of the deformation amount of mold M with respect to the pressing force. From the data in Figure 5(c) and Figure 5(d), the deviation amount of the pressing force in the contact process of step S4 is calculated. Here, the fact that the deviation of the pressing force is zero means that the Z-direction force balance between mold M and substrate S at the time of contact is achieved, and no deformation of mold M occurs.

[0055] Conventionally, based on the data corresponding to Figure 5(b) including the IP errors of mold M and substrate S and the sensitivity data of Figure 5(d), the pressing force deviation has been obtained. Therefore, an error has been included in the calculated deviation amount of the pressing force by the amount of IP error included in Figure 5(b).

[0056] However, in this embodiment, in order to obtain the pressing force deviation based on Figure 5(c) with the IP errors removed and the sensitivity data of Figure 5(d) instead of Figure 5(b), the deviation amounts of the pressing force and the inclination can be accurately obtained. In the examples of Figures 2 to 5, the pressing force is shown as an example. Similarly, the deformation amounts (sensitivity data) of mold M in the X and Y directions at the time of contact per unit change amount of the inclination of mold M may be obtained in advance, and the inclination of mold M may be obtained.

[0057] In step S7 (pressing force and inclination deviation correction), the control unit CTL controls the imprint head IH based on the deviation amounts of the pressing force and the inclination calculated in step S6, and corrects the pressing force and the inclination by driving the driving unit included in the imprint head IH. Then, it may return to step S5 and step S6 again, re-measure the deviation amounts of the pressing force and the inclination, and regard the completion of the correction when the deviation amount falls within a predetermined threshold.

[0058] By the process of step S7, it is possible to adjust to a predetermined set state with an intended pressing force or inclination. Here, the intended state, that is, the adjustment target values of the pressing force and inclination deviation do not necessarily have to be zero. For example, when it is desired to strongly press the mold M to improve the filling property of the imprint material IM, the adjustment target value of the pressing force may be deliberately shifted.

[0059] In step S8 (alignment process), the control unit CTL aligns the shot region of the substrate S and the pattern region P of the mold M based on the overlapping error between the alignment marks SMK and MMK of the substrate S and the mold M detected by the measurement unit AS. The overlapping error corrected by alignment can be, for example, a translation component, a rotation component, a magnification component, and a distortion component (for example, components such as a rhombus, a trapezoid, or higher-order components).

[0060] Based on the overlapping error calculated by the control unit CTL, the translation and rotation component overlapping errors are reduced by the substrate stage STG. Also, the overlapping errors of the magnification and distortion components are reduced by driving the shape correction unit MAG. When correcting the distortion component, in combination with driving the shape correction unit MAG, light that does not cure the imprint material of a certain intensity may be irradiated at a predetermined position on the substrate S to locally thermally expand the substrate S and change the shape of the shot region of the substrate S.

[0061] In step S9 (curing process), the control unit CTL controls the illumination unit IL to irradiate the imprint material IM on the substrate S with illumination light UV. By the irradiation, the imprint material IM cures.

[0062] In step S10 (release process), the control unit CTL controls the imprint head IH to separate the cured imprint material IM disposed on the substrate S from the pattern region P of the mold M.

[0063] The processing from step S1 to step S10 described above may be performed in all shot regions included in the substrate S, or may be performed only in one shot region or a plurality of shot regions instead of all shot regions, and correction values may be applied to all shot regions. When it is performed in a plurality of shot regions that are not all shot regions, the distribution of the correction values for all shot regions included in the substrate S may be obtained by operations such as interpolation or extrapolation based on the correction values of the plurality of shot regions.

[0064] When the pressing force and inclination can be accurately corrected as in this embodiment, the film thickness of the imprint material can be controlled as intended, and the overlay error between the mold and the substrate can be reduced, thus improving productivity. Also, problems caused by different correction values due to different IP errors for each mold M and substrate S used can be solved.

Example

[0065] A second embodiment of the present invention will be described with reference to FIG. 6. When sequentially replacing substrates with the same imprint apparatus and performing imprint processing on a plurality of substrates in time series, the overlay error can be corrected after grasping a certain trend from the past history of the overlay error for each substrate. Thereby, changes over time in the imprint apparatus and individual differences in the substrates can be effectively corrected. In this embodiment, a case where a plurality of substrates are processed is assumed, and a case where no correction is made during the imprint processing of one substrate and correction values are applied before the imprint processing of an arbitrary substrate will be described.

[0066] FIG. 6 shows the time-dependent changes in the misalignment error between the mold M and the substrate S due to IP errors and the misalignment error between the mold M and the substrate S due to the deviation of the pressing force. The values measured for each substrate are plotted against the order of the imprint process. The history of data such as the misalignment error due to these IP errors and the misalignment error due to the deviation of the pressing force may be stored by the control unit CTL or may be stored by an external device. The misalignment error between the mold M and the substrate S due to IP errors corresponds to that shown in FIG. 5(a) of Example 1, and the misalignment error between the mold M and the substrate S due to the deviation of the pressing force corresponds to that shown in FIG. 5(c) of Example 1.

[0067] These measured values for each substrate S may be the average value of the measured values of all shot areas included in the substrate S or a plurality of shot areas that are not all shot areas, or the measured value of one shot area. FIG. 6(a) shows that with an increase in the number of substrate processing times, the misalignment error between the mold M and the substrate S due to IP errors does not change, but the misalignment error between the mold M and the substrate S due to the deviation of the pressing force increases. Since the control unit CTL can determine from the measurement results of the plurality of substrates shown in FIG. 6(a) that the amount of deviation of the pressing force is changing, the correction value of the pressing force can be changed before executing the imprint process for the next substrate.

[0068] On the other hand, FIG. 6(b) shows that with an increase in the number of substrate processing times, the misalignment error between the mold M and the substrate S due to the deviation of the pressing force does not change, but the misalignment error between the mold M and the substrate S due to IP errors increases. Since the mold M used in the imprint process is commonly used, it can be determined that the drift of the misalignment error due to this IP error is due to the drift of the IP error for each individual substrate S.

[0069] When the control unit CTL determines from the measurement results of a plurality of substrates that the IP error has changed, it can change the correction value of the strain component before performing the imprint process on the next substrate S. Specifically, like the process in step S8 of FIG. 2, for example, in conjunction with the driving of the shape correction unit MAG, the substrate S may be deformed by locally heating the substrate S by the substrate deformation means for correction.

[0070] In this way, in the processing of a plurality of substrates S, by trend-managing the time-dependent changes of the error caused by the imprinting force or the deviation of the inclination of the mold M and the IP error respectively, it is possible to distinguish whether the drift is caused by the imprinting apparatus or by the substrate. By this distinction, the correction method of the imprinting apparatus can be appropriately selected.

[0071] Here, as an example where the correction method cannot be appropriately selected, consider the case of trend-managing only the data in which the IP error and the error of the imprinting force as shown in FIG. 5(b) are not separately evaluated. In this case, although the IP error for each substrate is actually changing in the same way as the deformation caused by the imprinting force, the control unit CTL may determine that the imprinting force has changed. On the other hand, if it is dealt with by changing the imprinting force, although the imprinting force was in an appropriate state, due to the change, a change in the filling state of the imprinting material IM into the pattern of the mold M such as protruding from the shot region may occur. In this case, correction by the shape correction unit MAG or the like is appropriate rather than correction by the imprinting force.

[0072] Conversely, although the deviation of the imprinting force is actually drifting, since it is not recognized that the IP error has not changed, there is a possibility of selecting to deal with it by changing the correction value of the shape correction unit MAG or the like. The deviation of the imprinting force is not corrected and the imprinting process continues with the deviation remaining, and there is also a possibility that the filling state of the imprinting material IM into the pattern of the mold M will change.

[0073] As in this embodiment, by trend-managing the temporal changes of both IP errors and errors in pressing force and inclination, and appropriately selecting a correction method for the apparatus based on the results, these risks can be avoided. Note that in FIG. 6, an example where the temporal data of the overlay error for each substrate drifts is shown, but it is not necessary to limit the change trend to drift.

[0074] <Embodiment related to an article manufacturing method> The method for manufacturing an article according to this embodiment is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The method for manufacturing an article of this embodiment includes a step of forming a pattern (a step of processing a substrate) on a composition applied to a substrate using the imprint apparatus 1 described above, and a step of processing the substrate on which the pattern has been formed in such a step. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, composition peeling, dicing, bonding, packaging, etc.). The method for manufacturing an article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0075] The pattern of the cured product formed using the above-described imprint apparatus (molding apparatus) is used permanently for at least a part of various articles, or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold, etc. Examples of the electric circuit element include a volatile or non-volatile semiconductor memory such as DRAM, SRAM, flash memory, MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for substrate processing such as imprint.

[0076] The pattern of the cured product is used as it is as at least a part of the constituent members of the above-described article, or temporarily used as a composition mask. After etching or ion implantation or the like is performed in the substrate processing step, the composition mask is removed.

[0077] Next, a specific manufacturing method of an article when using an imprint method as a forming method will be described with reference to FIG. 7. As shown in FIG. 7(a), a substrate 1z such as a silicon substrate having a workpiece 2z such as an insulator formed on its surface is prepared, and subsequently, a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where the composition 3z in a plurality of droplet shapes is applied on the substrate 1z is shown.

[0078] As shown in FIG. 7(b), the mold 4z is opposed with the side on which the concavo-convex pattern is formed (contact region) facing the composition 3z on the substrate 1z. As shown in FIG. 7(c), the substrate 1z to which the composition 3z is applied and the mold 4z are brought into contact with each other and pressure is applied (contact step). The composition 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the composition 3z cures (curing step). At this time, in this embodiment, based on the spectral sensitivity characteristics acquired in the apparatus, it is possible to irradiate the composition with an irradiation amount that gives an optimal degree of photopolymerization.

[0079] As shown in FIG. 7(d), after curing the composition 3z, when the mold 4z and the substrate 1z are separated, a pattern of the cured product of the composition 3z is formed on the substrate 1z (pattern forming step, forming step). The pattern of this cured product has a shape in which the concave portion of the mold 4z corresponds to the convex portion of the cured product and the convex portion of the mold 4z corresponds to the concave portion of the cured product, that is, the concavo-convex pattern of the mold 4z is transferred to the composition 3z.

[0080] As shown in FIG. 7(e), when etching is performed using the pattern of the cured product as an etching mask, portions of the surface of the workpiece 2z where no cured product remains or where the cured product remains thinly are removed, resulting in grooves 5z. As shown in FIG. 7(f), when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed after processing and may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a constituent member of the article.

[0081] <Embodiment of planarization processing> The mold type may be a mold (flat template) 170 having a flat surface without an uneven pattern as a contact surface (contact area). The flat template 170 is used in a flattening device (molding device) that performs a flattening process (molding process) of molding the composition on the substrate to be flattened by the flat surface. The flattening process includes a step of curing the curable composition by irradiating light in a state where the flat surface (contact surface) 170a of the flat template 170 is in contact with the curable composition 150a supplied onto the substrate 180. Thus, the present embodiment can be applied to a molding device that molds the composition 150a on the substrate 180 using the flat template 170.

[0082] The underlying pattern on the substrate 180 has an uneven profile due to the pattern formed in the previous process. In particular, with the multi-layer structuring of recent memory elements, the substrate (process wafer) 180 may have a step of around 100 nm. The step caused by the gentle undulation of the entire substrate can be corrected by the focus tracking function of the exposure apparatus (scanner) used in the photolithography process. However, the fine unevenness with a pitch that fits within the exposure slit area of the exposure apparatus consumes the depth of focus (DOF: Depth Of Focus) of the exposure apparatus as it is. As a conventional technique for flattening the underlying pattern of the substrate, techniques for forming a flattening layer such as SOC (Spin On Carbon) and CMP (Chemical Mechanical Polishing) are used.

[0083] FIG. 8(a) shows a state before the flat template 170 is brought into contact after applying the composition (resist) 150a for forming the flattening layer 150b to the substrate 180 on which the underlying pattern 180a is formed. FIG. 8(a) shows a state where the composition 150a is applied by an inkjet dispenser, but a spin coater may be used for applying the composition 150a. In other words, the imprint apparatus is applicable as long as it includes a step of pressing and flattening the flat template 170 against the pre-applied uncured composition 150a.

[0084] ​ Figure 8(b) shows a state in which the composition 150a on the substrate 180 and the flat portion 170a of the planar template 170 are in complete contact with each other, and the flat portion 170a of the planar template 170 follows the surface shape of the substrate 180. The planar template 170 is made of glass or quartz that transmits ultraviolet rays, and the composition 150a is cured by irradiation with ultraviolet rays from a light source. The planar template 170 follows the profile of the substrate 180 surface for the gentle unevenness of the entire substrate 180. Then, as shown in Figure 8(c), after irradiating the composition 150a on the substrate 180 with light through the planar template 170 from a light source to cure the composition 150a, the planar template 170 is separated from the flattened layer (flattened film) 150b of the cured composition on the substrate 180, and a state where a flattened layer 150b of the composition with a uniform thickness is formed over the entire surface of the substrate 180 can be obtained.

[0085] By applying the method for correcting the pressing force and the inclination of the mold in the imprint processes of Examples 1 and 2, even in the flattening process using a mold having a flat surface without an uneven pattern as a contact surface, a flattened layer 150b of the composition with a more uniform thickness can be obtained.

[0086] As described above, the preferred embodiments of the present invention have been explained. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof. Also, the above-described embodiments may be combined and implemented.

[0087] Also, a part or all of the control in each of the above-described embodiments may be supplied to the imprint apparatus 1 or the like via a network or various storage media by a computer program that realizes the functions of each of the above-described embodiments. Then, a computer (or CPU, MPU, etc.) in the imprint apparatus 1 or the like may read and execute the program. In that case, the program and the storage medium storing the program will constitute the present invention.

[0088] The disclosure of this embodiment includes the following configurations, methods, and programs. (Configuration 1) An imprint apparatus for forming a pattern on a resin on a substrate using a mold having a pattern formed thereon, a detection unit that detects marks provided on the mold and the substrate, an imprint head that is driven to press the mold against the substrate and controls the pressing force and the relative inclination between the mold and the substrate, a stage having a placement surface for holding the substrate and moving in a plane parallel to the placement surface, and a control unit that controls the detection unit, the imprint head, and the stage, wherein the control unit controls the imprint head based on the relative displacement amount of the marks of the mold and the substrate in the plane in a non-contact state and a contact state between the mold and the resin on the substrate, obtained based on the detection result of the detection unit. The imprint apparatus is characterized by this. (Configuration 2) The control unit acquires the displacement amount based on the relative shift amount between the mold and the substrate in the plane in each of the non-contact state and the contact state, obtained based on the detection result of the detection unit. The imprint apparatus according to Configuration 1 is characterized by this. (Configuration 3) The marks include a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, the detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks, and the control unit acquires the shift amount based on the detection results for the plurality of mold marks and the plurality of substrate marks simultaneously acquired by the detection unit. The imprint apparatus according to Configuration 2 is characterized by this. (Configuration 4) The marks include a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, the detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks, The control unit acquires a relative first shift amount in the plane between the mold and the substrate based on a first detection result for the plurality of mold marks and the plurality of substrate marks simultaneously acquired by the detection unit, and acquires the displacement amount based on the first detection result and the first shift amount. The imprint apparatus according to Configuration 1, characterized in that. (Configuration 5) The control unit controls the imprint head to correct at least one of the pressing force and the inclination based on a difference in the displacement amount acquired in the non-contact state and the contact state. The imprint apparatus according to Configuration 3 or 4, characterized in that. (Configuration 6) The control unit controls the imprint head to correct at least one of the pressing force and the inclination based on first data that is a relative displacement amount in the plane of the mark with respect to a unit change amount of the pressing force, second data that is a relative displacement amount in the plane of the mark with respect to a unit change amount of the inclination, and the displacement amount. The imprint apparatus according to any one of Configurations 1 to 5, characterized in that. (Configuration 7) The control unit holds the first data and the second data. The imprint apparatus according to Configuration 6, characterized in that. (Configuration 8) The first shift amount is acquired as an average of detection results for the plurality of marks included in the first detection result. The imprint apparatus according to Configuration 4, characterized in that. (Configuration 9) The mark includes a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate. The detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks. The control unit acquires a relative first shift amount in the plane between the mold and the substrate based on a first detection result simultaneously acquired by the detection unit for the plurality of mold marks and the plurality of substrate marks, and acquires a first displacement amount based on the first detection result and the first shift amount. The control unit acquires a plurality of the first displacement amounts based on a plurality of detections by the detection unit, and acquires the displacement amount based on the plurality of first displacement amounts. The imprint apparatus according to Configuration 1, characterized by acquiring the displacement amount. (Configuration 10) The control unit acquires the plurality of first displacement amounts based on a plurality of detections by the detection unit performed with at least one different mark to be detected. The imprint apparatus according to Configuration 9, characterized by acquiring the plurality of first displacement amounts. (Configuration 11) Based on a history of the difference between the displacement amount before contact and the displacement amount after contact, the control unit determines whether the displacement amount is due to relative deformation between the mold and the substrate or due to pressing by the imprint head. The imprint apparatus according to any one of Configurations 1 to 10, characterized by determining whether the displacement amount is due to relative deformation between the mold and the substrate or due to pressing by the imprint head. (Configuration 12) Having mold deformation means for deforming the mold, The control unit controls the mold deformation means based on the history. The imprint apparatus according to Configuration 11, characterized by controlling the mold deformation means based on the history. (Configuration 13) Having substrate deformation means for deforming the substrate, The control unit controls the substrate deformation means based on the history. The imprint apparatus according to Configuration 11 or 12, characterized by controlling the substrate deformation means based on the history. (Configuration 14) The substrate deformation means is means for deforming the substrate by applying heat to the substrate. The imprint apparatus according to Configuration 13, characterized by deforming the substrate by applying heat to the substrate. (Configuration 15) The control unit stores a history of the difference between the displacement amount in the non-contact state and the displacement amount in the contact state. The imprint apparatus according to any one of Configurations 1 to 14, characterized by storing a history of the difference between the displacement amount in the non-contact state and the displacement amount in the contact state. (Method 1) An imprint method for transferring a pattern to a resin on a substrate using a mold having a pattern formed thereon, A step of obtaining a non-contact displacement amount, which is a relative displacement amount between a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, in a plane parallel to the placement surface that holds the substrate in the non-contact state; A step of obtaining a contact displacement amount, which is a relative displacement amount between the plurality of mold marks and the plurality of substrate marks in the plane in the contact state; A step of correcting at least one of a pressing force for pressing the mold against the substrate and a relative inclination between the mold and the substrate based on the non-contact displacement amount and the contact displacement amount, characterized by an imprint method. (Method 2) The correcting step corrects at least one of the pressing force and the inclination based on a difference between the non-contact displacement amount and the contact displacement amount, first data which is a relative displacement amount in the plane between the plurality of mold marks and the plurality of substrate marks with respect to a unit change amount of the pressing force, and second data which is a relative displacement amount in the plane between the plurality of mold marks and the plurality of substrate marks with respect to a unit change amount of the inclination, according to the imprint method described in Method 1. (Method 3) Each of the step of obtaining the non-contact displacement amount and the step of obtaining the contact displacement amount includes a step of simultaneously detecting the plurality of mold marks and the plurality of substrate marks to obtain a first detection result; a step of obtaining a first shift amount in the plane between the mold and the substrate based on the first detection result; and a step of obtaining the displacement amount based on the first detection result and the first shift amount, according to the imprint method described in Method 1 or 2. (Method 4) Each of the step of obtaining the non-contact displacement amount and the step of obtaining the contact displacement amount performs a plurality of detections in which at least one of the mold marks and the substrate marks to be detected is different each time of detection among the plurality of mold marks and the plurality of substrate marks; In each of the multiple detections, simultaneously detecting the plurality of type marks and the plurality of substrate marks to obtain a first detection result; In each of the multiple detections, obtaining the first relative shift amount in the plane between the mold and the substrate based on the first detection result; In each of the multiple detections, obtaining a first displacement amount based on the first detection result and the first shift amount; Obtaining the displacement amount based on the obtained multiple first displacement amounts; The imprint method according to Method 1 or 2, characterized by including the above steps. (Method 5) Forming a pattern on a substrate using the imprint apparatus according to any one of Configurations 1 to 15; Processing the substrate using the pattern on the substrate; A method for manufacturing an article having the above steps. (Program) A program for causing a computer to execute the imprint method according to any one of Methods 1 to 4.

Explanation of Reference Numerals

[0089] 1 Imprint apparatus M Mold S Substrate AS Detection unit IH Imprint head STG Substrate stage CTL Control unit

Claims

1. An imprint apparatus for forming a pattern on a resin on a substrate using a mold having a pattern formed thereon, comprising: a detection unit that detects marks provided on the mold and the substrate; an imprint head that is driven to press the mold against the substrate and controls the pressing force and the relative inclination between the mold and the substrate; a stage having a placement surface for holding the substrate and moving in a plane parallel to the placement surface; a control unit that controls the detection unit, the imprint head, and the stage; wherein the control unit controls the imprint head based on the relative displacement amount of the marks of the mold and the substrate in the plane in a non-contact state and a contact state between the mold and the resin on the substrate, obtained based on the detection result of the detection unit. The imprint apparatus is characterized by this.

2. The imprint apparatus according to claim 1, wherein the control unit acquires the displacement amount based on the relative shift amount of the mold and the substrate in the plane in each of the non-contact state and the contact state, obtained based on the detection result of the detection unit.

3. The marks include a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, the detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks, The imprint apparatus according to claim 2, wherein the control unit acquires the shift amount based on the detection results for the plurality of mold marks and the plurality of substrate marks simultaneously acquired by the detection unit.

4. The marks include a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, the detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks, The control unit acquires a relative first shift amount in the plane between the mold and the substrate based on a first detection result for the plurality of mold marks and the plurality of substrate marks simultaneously acquired by the detection unit, and acquires the displacement amount based on the first detection result and the first shift amount. The imprint apparatus according to claim 1, characterized in that.

5. The control unit controls the imprint head so as to correct at least one of the pressing force and the inclination based on a difference in the displacement amount acquired in the non-contact state and the contact state. The imprint apparatus according to claim 3, characterized in that.

6. The control unit controls the imprint head so as to correct at least one of the pressing force and the inclination based on first data that is a relative displacement amount in the plane of the mark with respect to a unit change amount of the pressing force, second data that is a relative displacement amount in the plane of the mark with respect to a unit change amount of the inclination, and the displacement amount. The imprint apparatus according to claim 1, characterized in that.

7. The control unit holds the first data and the second data. The imprint apparatus according to claim 6, characterized in that.

8. The first shift amount is acquired as an average of detection results for the plurality of marks included in the first detection result. The imprint apparatus according to claim 4, characterized in that.

9. The mark includes a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, The detection unit includes a plurality of sensors that simultaneously detect the plurality of mold marks and the plurality of substrate marks, The control unit acquires a relative first shift amount in the plane between the mold and the substrate based on a first detection result simultaneously acquired by the detection unit for the plurality of mold marks and the plurality of substrate marks, and acquires a first displacement amount based on the first detection result and the first shift amount. The control unit acquires a plurality of the first displacement amounts based on a plurality of detections by the detection unit, and acquires the displacement amount based on the plurality of first displacement amounts. The imprint apparatus according to claim 1, characterized in that it acquires.

10. The control unit acquires the plurality of first displacement amounts based on a plurality of detections by the detection unit performed with at least one of the marks to be detected being different. The imprint apparatus according to claim 9, characterized in that it does so.

11. Based on the history of the difference between the displacement amount before contact and the displacement amount after contact, the control unit determines whether the displacement amount is due to relative deformation between the mold and the substrate or due to pressing by the imprint head. The imprint apparatus according to claim 1, characterized in that it does so.

12. It has mold deformation means for deforming the mold, The control unit controls the mold deformation means based on the history. The imprint apparatus according to claim 11, characterized in that it does so.

13. It has substrate deformation means for deforming the substrate, The control unit controls the substrate deformation means based on the history. The imprint apparatus according to claim 11, characterized in that it does so.

14. The substrate deformation means is means for deforming the substrate by applying heat to the substrate. The imprint apparatus according to claim 13, characterized in that it is so.

15. The control unit stores the history of the difference between the displacement amount in the non-contact state and the displacement amount in the contact state. The imprint apparatus according to claim 1, characterized in that it does so.

16. An imprint method for transferring a pattern to a resin on a substrate using a mold on which a pattern is formed, In the non-contact state, obtaining a non-contact displacement amount, which is a relative displacement amount between a plurality of mold marks provided on the mold and a plurality of substrate marks provided on the substrate, in a plane parallel to the placement surface that holds the substrate; In the contact state, obtaining a contact displacement amount, which is a relative displacement amount between the plurality of mold marks and the plurality of substrate marks in the plane; And correcting at least one of a pressing force for pressing the mold against the substrate and a relative inclination between the mold and the substrate based on the non-contact displacement amount and the contact displacement amount. A method for imprinting characterized by this.

17. The correcting step corrects at least one of the pressing force and the inclination based on a difference between the non-contact displacement amount and the contact displacement amount, first data which is a relative displacement amount in the plane between the plurality of mold marks and the plurality of substrate marks with respect to a unit change amount of the pressing force, and second data which is a relative displacement amount in the plane between the plurality of mold marks and the plurality of substrate marks with respect to a unit change amount of the inclination. The imprinting method according to claim 16, characterized by this.

18. Each of the step of obtaining the non-contact displacement amount and the step of obtaining the contact displacement amount includes obtaining a first detection result by simultaneously detecting the plurality of mold marks and the plurality of substrate marks; obtaining a first shift amount in the plane between the mold and the substrate based on the first detection result; and obtaining the displacement amount based on the first detection result and the first shift amount. The imprinting method according to claim 16, characterized by this.

19. Each of the step of obtaining the non-contact displacement amount and the step of obtaining the contact displacement amount performs a plurality of detections in which at least one of the mold marks and the substrate marks to be detected is different each time of detection, among the plurality of mold marks and the plurality of substrate marks. In each of the multiple detections, simultaneously detecting the plurality of type marks and the plurality of substrate marks to obtain a first detection result; In each of the multiple detections, obtaining the first shift amount in the plane between the mold and the substrate based on the first detection result; In each of the multiple detections, obtaining a first displacement amount based on the first detection result and the first shift amount; Obtaining the displacement amount based on the obtained multiple first displacement amounts; The imprint method according to claim 16, comprising the above steps.

20. A step of forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 15; A step of processing the substrate using the pattern on the substrate; A method for manufacturing an article having the above steps.

21. A program characterized by causing a computer to execute the imprint method according to any one of claims 16 to 19.

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