Substrate processing device, fluid supply system and substrate processing method

Abstract

To provide a technique capable of making a temperature of a process fluid close to a preset temperature regardless of a state of the process fluid.SOLUTION: A substrate processing device comprises: a processing container in which a substrate is stored; a supply passage which supplies a process fluid into the processing container; a heating mechanism which heats the process fluid circulating in the supply passage; a first temperature sensor which detects a temperature of the process fluid at a downstream side of the heating mechanism; a pressure sensor which detects a pressure of the process fluid at the downstream side of the heating mechanism; and a control section. The control section controls output of the heating mechanism based on the pressure of the process fluid detected by the pressure sensor and the temperature of the process fluid detected by the first temperature sensor.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus, a fluid supply system, and a substrate processing method.

Background Art

[0002] Techniques for drying a substrate using a supercritical fluid are known. Patent Document 1 discloses a configuration in which a heater and two temperature sensors are provided in a supply line for supplying a supercritical fluid to a chamber, and the temperature sensor used for controlling the heater is switched between when the supercritical fluid flows through the supply line and when it does not.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of bringing the temperature of a processing fluid close to a set temperature regardless of the state of the processing fluid.

Means for Solving the Problems

[0005] A substrate processing apparatus according to an aspect of the present disclosure includes a processing container that houses a substrate, a supply flow path that supplies a processing fluid into the processing container, a heating mechanism that heats the processing fluid flowing through the supply flow path, a first temperature sensor that detects the temperature of the processing fluid downstream of the heating mechanism, a pressure sensor that detects the pressure of the processing fluid downstream of the heating mechanism, and a control unit. The control unit controls the output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.

Effects of the Invention

[0006] According to the present disclosure, regardless of the state of the processing fluid, the temperature of the processing fluid can be brought close to the set temperature.

Brief Description of the Drawings

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and duplicate explanations are omitted.

[0009] 〔Substrate Processing Apparatus〕 Referring to FIGS. 1 and 2, the substrate processing apparatus 10 according to the embodiment will be described. FIG. 1 is a diagram showing the substrate processing apparatus 10 according to the embodiment. FIG. 2 is a diagram showing an example of the positional relationship between the heating mechanism HE12 and the temperature sensors (the first temperature sensor T11 and the second temperature sensor T12).

[0010] The substrate processing apparatus 10 includes a processing unit 11, a fluid supply system 12, a discharge unit 13, and a control unit 14.

[0011] The processing unit 11 includes a processing container 111 and a holding unit 112. The processing container 111 is a container having a processing space inside that can accommodate a substrate W with a diameter of, for example, 300 mm. In the processing space, for example, a substrate with a liquid film formed thereon is processed. The substrate W may be, for example, a semiconductor wafer. The holding unit 112 is provided inside the processing container 111. The holding unit 112 holds the substrate W horizontally. The holding unit 112 is, for example, configured integrally with the processing container 111. The holding unit 112 may be a holding plate configured separately from the processing container 111. The processing unit 11 may include a temperature sensor and a pressure sensor.

[0012] The fluid supply system 12 includes a processing fluid supply source S11, an inert gas supply source S12, a circulation flow path L11, a first supply flow path L12, a return flow path L13, a pressure relief flow path L14, and a second supply flow path L15.

[0013] The processing fluid supply source S11 is a supply source of the processing fluid. The processing fluid may be, for example, carbon dioxide (CO2) in a gaseous state or a liquid state.

[0014] The inert gas supply source S12 is a supply source of the inert gas. The inert gas may be, for example, nitrogen (N2) gas.

[0015] The circulation flow path L11 is connected to the processing fluid supply source S11. The circulation flow path L11 circulates the processing fluid. A pump P11 and an on-off valve V11 are provided in the circulation flow path L11. The pump P11 sends out the processing fluid to the downstream side of the circulation flow path L11. The on-off valve V11 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V11 circulates the processing fluid within the circulation flow path L11, and in the closed state, it does not circulate the processing fluid within the circulation flow path L11. An on-off valve, an orifice, a temperature sensor, and a pressure sensor may be further provided at various positions of the circulation flow path L11.

[0016] The first supply flow path L12 connects the circulation flow path L11 downstream of the pump P11 and upstream of the on-off valve V11 and the processing vessel 111. The first supply flow path L12 supplies the processing fluid from the circulation flow path L11 into the processing vessel 111. The first supply flow path L12 includes a pipe L12p (FIG. 2) through which the processing fluid flows. A flow rate adjustment mechanism FC12, a heating mechanism HE12, a second temperature sensor T12, a first temperature sensor T11, a pressure sensor P12, an on-off valve V12, and a filter F12 are provided in the first supply flow path L12 in order from the upstream.

[0017] The flow rate adjustment mechanism FC12 is provided upstream of the heating mechanism HE12. The flow rate adjustment mechanism FC12 has on-off valves V121, V122, V123, V124 and orifices OR122, OR123, OR124.

[0018] The on-off valves V121, V122, V123, and V124 are connected in parallel with each other. The on-off valves V121, V122, V123, and V124 are valves that switch the on and off of the flow of the process fluid. In the open state, the on-off valves V121, V122, V123, and V124 allow the process fluid to flow to the downstream heating mechanism HE12, and in the closed state, they do not allow the process fluid to flow to the downstream heating mechanism HE12.

[0019] The orifice OR122 is connected in series with the on-off valve V122. The orifice OR123 is connected in series with the on-off valve V123. The orifice OR124 is connected in series with the on-off valve V124. The orifices OR122, OR123, and OR124 serve to reduce the flow velocity of the process fluid flowing through the first supply passage L12 and adjust the pressure. The orifices OR122, OR123, and OR124 can allow the process fluid with adjusted pressure to flow to the downstream heating mechanism HE12. Note that an orifice may be connected in series with the on-off valve V121 downstream of the on-off valve V121.

[0020] The heating mechanism HE12 heats the process fluid to a set temperature and supplies the process fluid at the set temperature downstream. The set temperature may be variable. The set temperature includes, for example, a first temperature and a second temperature. The first temperature is 15°C or higher and 100°C or lower, for example, 80°C. The second temperature is a temperature higher than the first temperature. The second temperature is 150°C or lower, for example, 120°C.

[0021] The heating mechanism HE12 is provided outside the pipe L12p. The heating mechanism HE12 heats the pipe L12p and the process fluid flowing through the pipe L12p from the outside of the pipe L12p. The heating mechanism HE12 heats the pipe L12p and the process fluid flowing through the pipe L12p by irradiating light toward the pipe L12p, for example. When using light heating, since the heat capacity is small, the temperature responsiveness is good. The heating mechanism HE12 is, for example, a lamp heater using a halogen lamp, a xenon lamp, or the like. The heating mechanism HE12 may be a heater using a laser, a light-emitting diode (LED), or the like.

[0022] The first temperature sensor T11 detects the temperature of the processing fluid downstream of the heating mechanism HE12. The first temperature sensor T11 has a temperature measurement part inserted into the pipe L12p downstream of the heating mechanism HE12 and detects the temperature of the processing fluid flowing through the pipe L12p.

[0023] The second temperature sensor T12 detects the temperature of the processing fluid at the position where the heating mechanism HE12 is provided. The second temperature sensor T12 has a temperature measurement part provided in contact with the outer wall of the pipe L12p at the position where the heating mechanism HE12 is provided and detects the temperature of the pipe L12p.

[0024] The pressure sensor P12 is provided in the first supply flow path L12 between the heating mechanism HE12 and the on-off valve V12. The pressure sensor P12 detects the pressure of the processing fluid flowing through the first supply flow path L12 between the heating mechanism HE12 and the on-off valve V12. The pressure sensor P12 may be provided in the first supply flow path L12 between the on-off valve V12 and the filter F12, or may be provided in the first supply flow path L12 between the filter F12 and the processing container 111.

[0025] The on-off valve V12 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V12 allows the processing fluid to flow to the downstream filter F12, and in the closed state, it does not allow the processing fluid to flow to the downstream filter F12.

[0026] The filter F12 filters the processing fluid flowing through the first supply flow path L12 and removes foreign substances contained in the processing fluid. Thereby, it is possible to suppress the generation of particles on the surface of the substrate W during substrate processing using the processing fluid.

[0027] A line heater may be provided downstream of the heating mechanism HE12 in the first supply flow path L12. The line heater heats the first supply flow path L12 downstream of the heating mechanism. The line heater suppresses a temperature drop when the processing fluid heated to the set temperature by the heating mechanism HE12 flows through the first supply flow path L12. An on-off valve, an orifice, a temperature sensor, and a pressure sensor may be further provided at various positions in the first supply flow path L12.

[0028] The return flow path L13 connects the first supply flow path L12 downstream of the heating mechanism HE12 and upstream of the on-off valve V12 and the circulation flow path L11 downstream of the on-off valve V11. The return flow path L13 returns the processing fluid from the first supply flow path L12 to the circulation flow path L11. An on-off valve V13 is provided in the return flow path L13.

[0029] The on-off valve V13 is a valve that switches the on and off of the flow of the processing fluid. In the open state, the on-off valve V13 allows the processing fluid to flow into the downstream circulation flow path L11, and in the closed state, it does not allow the processing fluid to flow into the downstream circulation flow path L11.

[0030] The pressure relief flow path L14 branches from the return flow path L13 downstream of the branch point from the first supply flow path L12 of the return flow path L13 and upstream of the on-off valve V13. The pressure relief flow path L14 discharges the processing fluid in the return flow path L13. An on-off valve V14 is provided in the pressure relief flow path L14.

[0031] In the open state, the on-off valve V14 allows the processing fluid to flow into the downstream pressure relief flow path L14, and in the closed state, it does not allow the processing fluid to flow into the downstream pressure relief flow path L14.

[0032] The second supply flow path L15 has its upstream connected to the inert gas supply source S12 and its downstream connected to the first supply flow path L12 between the on-off valve V12 and the filter F12. The second supply flow path L15 supplies inert gas to the first supply flow path L12 between the on-off valve V12 and the filter F12. A check valve C15 and an on-off valve V15 are provided in the second supply flow path L15 in order from the upstream.

[0033] The check valve C15 prevents the backflow of the processing fluid from the first supply flow path L12 to the inert gas supply source S12.

[0034] The on-off valve V15 is a valve that switches the on and off of the flow of the inert gas. In the open state, the on-off valve V15 allows the inert gas to flow into the downstream first supply flow path L12, and in the closed state, it does not allow the inert gas to flow into the downstream first supply flow path L12.

[0035] Heating mechanisms, line heaters, on-off valves, orifices, temperature sensors, and pressure sensors may be further provided at various positions of the second supply flow path L15.

[0036] The discharge section 13 has a discharge flow path L18. The discharge flow path L18 is connected to the processing container 111. A pressure sensor P18, a back pressure valve BV18, and an on-off valve V18 are provided in the discharge flow path L18 in this order from upstream.

[0037] The pressure sensor P18 detects the pressure of the fluid flowing through the discharge flow path L18 immediately after the processing container 111. Thereby, the pressure inside the processing container 111 can be detected.

[0038] When the primary side pressure of the discharge flow path L18 exceeds the set pressure, the back pressure valve BV18 adjusts the valve opening degree to allow the fluid to flow to the secondary side, thereby maintaining the primary side pressure at the set pressure. For example, the set pressure of the back pressure valve BV18 is adjusted by the control unit 14.

[0039] The on-off valve V18 is a valve that switches the on and off of the fluid flow. When the on-off valve V18 is in the open state, the fluid flows through the downstream discharge flow path L18, and when it is in the closed state, the fluid does not flow through the downstream discharge flow path L18.

[0040] A line heater may be provided in the discharge flow path L18. The line heater heats the discharge flow path L18. On-off valves, orifices, temperature sensors, and pressure sensors may be further provided at various positions of the discharge flow path L18.

[0041] The control unit 14 is, for example, a computer and includes an arithmetic unit 141 and a storage unit 142. The storage unit 142 stores programs for controlling various processes executed in the substrate processing apparatus 10. The arithmetic unit 141 controls the operation of the substrate processing apparatus 10 by reading and executing the programs stored in the storage unit 142. The programs may have been recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 142 of the control unit 14. Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magneto-optical disks (MO), memory cards, and the like. The control unit 14 may be included in the fluid supply system 12.

[0042] The control unit 14 receives measurement signals from various sensors (such as the first temperature sensor T11, the second temperature sensor T12, and the pressure sensor P18) and transmits control signals to various functional elements. The control signals include, for example, opening / closing signals for the on-off valves V11, V12, V121, V122, V123, V124, V13, V14, V15, V18, a set pressure signal for the back pressure valve BV18, a set temperature signal for the heating mechanism HE12, and a set temperature signal for the line heater.

[0043] The control unit 14 may control the output of the heating mechanism HE12 based on the pressure of the processing fluid detected by the pressure sensor P12, the temperature of the processing fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12.

[0044] The control unit 14 calculates a virtual temperature T, for example, by the calculation formula of Equation (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature T.

[0045] T = αT1 + βT2 ··· (1) In Equation (1), T is the virtual temperature, T1 is the temperature of the process fluid detected by the first temperature sensor T11, and T2 is the temperature of the pipe L12p detected by the second temperature sensor T12. α is the first weighting coefficient associated with the pressure of the process fluid detected by the pressure sensor P12. β is the second weighting coefficient associated with the pressure of the process fluid detected by the pressure sensor P12. The value obtained by adding α and β is always 1 (α + β = 1). αT1 is the first calculated temperature obtained by multiplying the temperature T1 detected by the first temperature sensor T11 by the first weighting coefficient α. βT2 is the second calculated temperature obtained by multiplying the temperature T2 detected by the second temperature sensor T12 by the second weighting coefficient β.

[0046] For example, when the first weighting coefficient α is relatively large (the second weighting coefficient β is relatively small), the first calculated temperature αT1 becomes relatively large, and the contribution degree of the temperature of the process fluid detected by the first temperature sensor T11 becomes high. For example, when the first weighting coefficient α is relatively small (the second weighting coefficient β is relatively large), the second calculated temperature βT2 becomes relatively large, and the contribution degree of the temperature of the pipe L12p detected by the second temperature sensor T12 becomes high.

[0047] The control unit 14 may set the first weighting coefficient α when the pressure of the process fluid detected by the pressure sensor P12 is the first pressure to a value smaller than the first weighting coefficient α when the pressure of the process fluid detected by the pressure sensor P12 is the second pressure higher than the first pressure. When the pressure detected by the pressure sensor P12 is small, the response speed of the first temperature sensor T11 is slow. Therefore, by relatively reducing the first weighting coefficient α (relatively increasing the second weighting coefficient β) to increase the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0048] When no process fluid is flowing in the pipe L12p, the control unit 14 may set the second weighting coefficient β to a value larger than the first weighting coefficient α (α < β). When no process fluid is flowing in the pipe L12p, the response speed of the first temperature sensor T11 is very slow. Therefore, by reducing the contribution degree of the first temperature sensor T11 and increasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0049] When the processing fluid in a gaseous state is flowing through the pipe L12p, the control unit 14 may set the second weighting coefficient β to a value larger than the first weighting coefficient α (α < β), and may set the first weighting coefficient α to a value larger than when the processing fluid is not flowing through the pipe L12p. When the processing fluid in a gaseous state is flowing through the pipe L12p, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution degree of the first temperature sensor T11 and increasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved. However, when the processing fluid in a gaseous state is flowing through the pipe L12p, the response speed of the first temperature sensor T11 is faster than when the processing fluid is not flowing through the pipe L12p. Therefore, the first weighting coefficient α when the processing fluid in a gaseous state is flowing through the pipe L12p may be set to a value larger than the first weighting coefficient α when the processing fluid is not flowing through the pipe L12p.

[0050] When the processing fluid in a supercritical state is flowing through the pipe L12p, the control unit 14 may set the first weighting coefficient α to a value larger than the second weighting coefficient β (α > β). When the processing fluid in a supercritical state is flowing through the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution degree of the first temperature sensor T11 and reducing the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0051] For example, while supplying the processing fluid into the processing vessel 111, the control unit 14 may control the output of the heating mechanism HE12. In the case of the heating mechanism HE12 using light heating, since the heat capacity is small, the temperature responsiveness is good. Therefore, the temperature of the processing fluid can be changed in a short time.

[0052] For example, while discharging the processing fluid in the processing vessel 111 from the discharge flow path L18 without supplying the processing fluid into the processing vessel 111, the control unit 14 may circulate the processing fluid among the circulation flow path L11, the first supply flow path L12, and the return flow path L13. In this case, the discharge of the processing fluid from the processing vessel 111 and the preparation of the processing fluid used for the next processing of the substrate W can be carried out in parallel. Therefore, the processing time in continuous processing can be shortened.

[0053] For example, the control unit 14 may circulate the processing fluid between the circulation channel L11, the first supply channel L12, and the return channel L13 until the virtual temperature reaches the set temperature. In this case, the processing fluid at the set temperature is supplied into the processing vessel 111 immediately after the on-off valve V12 is opened. Therefore, it is possible to suppress fluctuations in temperature immediately after the supply of the processing fluid.

[0054] For example, before supplying the processing fluid into the processing vessel 111, the control unit 14 may control the on-off valve V14 to discharge the processing fluid in the return channel L13 from the pressure release channel L14. In this case, it is possible to prevent the high-pressure processing fluid from being supplied into the processing vessel 111 immediately after the on-off valve V12 is opened. As a result, the supply of the processing fluid to the substrate W at high speed is suppressed, and pattern collapse can be suppressed.

[0055] For example, the control unit 14 may increase the pressure inside the processing vessel 111 with the supply flow rate of the processing fluid supplied into the processing vessel 111 being the first flow rate until the pressure inside the processing vessel 111 reaches the first pressure. Further, when the pressure inside the processing vessel 111 reaches the first pressure, the control unit 14 may further increase the pressure inside the processing vessel 111 with the supply flow rate being the second flow rate greater than the first flow rate. In this case, the supply of the processing fluid to the substrate W at high speed in the initial stage is suppressed, and pattern collapse can be suppressed.

[0056] In the substrate processing apparatus 10 according to the embodiment, the control unit 14 controls the output of the heating mechanism HE12 based on the pressure of the processing fluid detected by the pressure sensor P12, the temperature of the processing fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12. In this case, according to the state of the processing fluid, a virtual temperature is calculated based on the temperature of the processing fluid detected by the first temperature sensor T11 and the temperature of the pipe L12p detected by the second temperature sensor T12, and the output of the heating mechanism HE12 can be controlled based on the calculated virtual temperature. Therefore, regardless of the state of the processing fluid, the temperature of the processing fluid can be brought close to the set temperature.

[0057] 〔Substrate processing method〕 Referring to FIGS. 3 to 14, a substrate processing method executed using the substrate processing apparatus 10 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 142.

[0058] FIG. 3 is a flowchart showing the substrate processing method according to the embodiment. FIG. 4 is a diagram showing the pressure change in the processing container 111 in the substrate processing method of FIG. 3. FIG. 5 is a diagram showing an example of the virtual temperature. FIGS. 6 to 14 are diagrams showing the substrate processing method according to the embodiment. In FIGS. 6 to 14, the open / close valve in the open state is shown in black, and the open / close valve in the closed state is shown in white. In FIGS. 6 to 14, the flow path through which the fluid flows is shown by a thick solid line.

[0059] As shown in FIG. 3, the substrate processing method according to the embodiment includes a standby step ST11, a pressure increasing step ST12, a circulation step ST13, and a pressure reducing step ST14. Hereinafter, it will be described on the assumption that the substrate W has been previously loaded into the processing container 111 prior to the standby step ST11. The substrate W has been subjected to a cleaning process and is placed on the holding unit 112 in a state where the concave portions of the surface pattern are filled with isopropyl alcohol (IPA).

[0060] <Standby Step ST11> First, as shown in FIG. 6, when the set temperature of the heating mechanism HE12 is set to the first temperature, for example, 80° C., the on-off valves V121, V13, V15, and V18 are opened, and the on-off valves V11, V12, V122, V123, V124, and V14 are closed. As a result, the processing fluid from the processing fluid supply source S11 circulates through the circulation flow path L11, the first supply flow path L12, the return flow path L13, and the circulation flow path L11 in this order. The processing fluid is heated to the first temperature by the heating mechanism HE12 in the first supply flow path L12. As the processing fluid circulates through the circulation flow path L11, the first supply flow path L12, the return flow path L13, and the circulation flow path L11 in this order, each flow path approaches the first temperature. In the standby step ST11, the processing fluid may be circulated between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 until the virtual temperature reaches the first temperature. In this case, the processing fluid at the first temperature is supplied into the processing container 111 immediately after the on-off valve V12 is opened. Therefore, it is possible to suppress fluctuations in temperature immediately after supplying the processing fluid. Further, the inert gas from the inert gas supply source S12 is supplied into the processing container 111 through the second supply flow path L15 and the first supply flow path L12, and is discharged through the discharge flow path L18.

[0061] Next, as shown in FIG. 7, the on-off valves V13 and V121 are switched from the open state to the closed state, and the on-off valves V11 and V14 are switched from the closed state to the open state. As a result, the circulation of the processing fluid between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 is stopped. Further, the processing fluid in the first supply flow path L12 between the flow rate adjustment mechanism FC12 and the on-off valve V12 and the processing fluid in the return flow path L13 between the on-off valve V12 and the on-off valve V13 are discharged from the pressure relief flow path L14. Therefore, the pressure in the first supply flow path L12 between the flow rate adjustment mechanism FC12 and the on-off valve V12 and the pressure in the return flow path L13 between the on-off valve V12 and the on-off valve V13 decrease. In this case, it is possible to prevent the high-pressure processing fluid from being supplied into the processing container 111 immediately after the on-off valve V12 is opened. As a result, it is possible to suppress the supply of the processing fluid to the substrate W at high speed and suppress pattern collapse. Further, the on-off valve V15 is switched from the open state to the closed state. As a result, the inert gas in the processing container 111 is discharged from the discharge flow path L18.

[0062] Next, as shown in FIG. 8, the on-off valve V18 is switched from the open state to the closed state, and the on-off valve V12 is switched from the closed state to the open state.

[0063] During this series of operations, the control unit 14 receives the outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates the virtual temperature by the calculation formula of Equation (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0064] In the standby step ST11, no processing fluid is flowing in the pipe L12p, or a gaseous processing fluid is flowing in the pipe L12p. Therefore, the control unit 14 sets the second weight coefficient β to a value larger than the first weight coefficient α. As shown in FIG. 5, for example, the control unit 14 sets the first weight coefficient α in the range of 0 < α ≤ 0.1, and sets the second weight coefficient β in the range of 0.9 ≤ β < 1. When no processing fluid is flowing in the pipe L12p and when the pipe L12p is filled with a gaseous processing fluid, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution degree of the first temperature sensor T11 and increasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved. The control unit 14 determines, based on, for example, the pressure of the processing fluid detected by the pressure sensor P12, which state among a plurality of states the state in the pipe L12p is. The plurality of states may include a state where no processing fluid is flowing in the pipe L12p, a state where a gaseous processing fluid is flowing in the pipe L12p, and a state where a supercritical processing fluid is flowing in the pipe L12p.

[0065] <Pressure increasing step ST12> The pressure increasing step ST12 is performed after the standby step ST11. In the pressure increasing step ST12, first, the pressure inside the processing container 111 is increased by supplying the processing fluid at the first flow rate and the first temperature (the first pressure increasing step). Next, the pressure inside the processing container 111 is increased by supplying the processing fluid at the second flow rate and the first temperature (the second pressure increasing step). Next, the pressure inside the processing container 111 is increased by supplying the processing fluid at the third flow rate and the first temperature (the third pressure increasing step). Next, the pressure inside the processing container 111 is increased by supplying the processing fluid at the third flow rate and the second temperature, for example, 120°C (the fourth pressure increasing step). The magnitude relationship among the first flow rate, the second flow rate, and the third flow rate is the first flow rate < the second flow rate < the third flow rate. The second temperature is higher than the first temperature.

[0066] In the first pressure increasing step, as shown in FIG. 9, the on-off valve V122 is switched from the closed state to the open state. Thereby, the processing fluid from the processing fluid supply source S11 is supplied into the processing container 111 via the circulation flow path L11 and the first supply flow path L12. At this time, the processing fluid is adjusted to the first flow rate by passing through the orifice OR122 and is adjusted to the first temperature by passing through the heating mechanism HE12. Therefore, the processing fluid at the first flow rate and the first temperature is supplied into the processing container 111. In the first pressure increasing step, since the on-off valve V18 is in the closed state, the processing fluid does not flow out from the processing container 111. Therefore, the pressure inside the processing container 111 gradually increases. As a result, pattern collapse can be suppressed.

[0067] During the first pressure increasing step, the pressure inside the processing container 111 is detected by the pressure sensor P18, and the pressure increasing at the first flow rate is continued until the pressure inside the processing container 111 reaches the first pressure Y1 (see FIG. 4). When the pressure inside the processing container 111 reaches the first pressure Y1, the first pressure increasing step is terminated and the process proceeds to the second pressure increasing step.

[0068] In the second pressure boosting step, as shown in FIG. 10, the on-off valve V123 is switched from the closed state to the open state. As a result, the processing fluid from the processing fluid supply source S11 is adjusted to the second flow rate by passing through the orifices OR122 and OR123, and is adjusted to the first temperature by passing through the heating mechanism HE12. Therefore, the processing fluid at the second flow rate and the first temperature is supplied into the processing vessel 111. In the second pressure boosting step, since the on-off valve V18 is in the closed state, the processing fluid does not flow out from the processing vessel 111. Therefore, the pressure in the processing vessel 111 gradually increases. In the second pressure boosting step, since the pressure is boosted with a processing fluid having a larger flow rate than in the first pressure boosting step, the pressure boosting speed can be increased.

[0069] During the second pressure boosting step, the pressure in the processing vessel 111 is detected by the pressure sensor P18, and the pressure boosting at the second flow rate continues until the pressure in the processing vessel 111 reaches the second pressure Y2 (see FIG. 4). When the pressure in the processing vessel 111 reaches the second pressure Y2, the second pressure boosting step is terminated and the process proceeds to the third pressure boosting step.

[0070] In the third pressure boosting step, as shown in FIG. 11, the on-off valve V124 is switched from the closed state to the open state. As a result, the processing fluid from the processing fluid supply source S11 is adjusted to the third flow rate by passing through the orifices OR122, OR123, and OR124, and is adjusted to the first temperature by passing through the heating mechanism HE12. Therefore, the processing fluid at the third flow rate and the first temperature is supplied into the processing vessel 111. In the third pressure boosting step, since the on-off valve V18 is in the closed state, the processing fluid does not flow out from the processing vessel 111. Therefore, the pressure in the processing vessel 111 gradually increases. In the third pressure boosting step, since the pressure is boosted with a processing fluid having a larger flow rate than in the second pressure boosting step, the pressure boosting speed can be further increased.

[0071] In the pressure increase at the third flow rate, the pressure of the processing fluid supplied into the processing vessel 111 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 111 in the state of a gas. Thereafter, as the filling of the processing fluid into the processing vessel 111 progresses, the pressure in the processing vessel 111 increases. When the pressure in the processing vessel 111 exceeds the critical pressure, the processing fluid existing in the processing vessel 111 becomes a supercritical state.

[0072] During the third pressure increase step, the pressure in the processing vessel 111 is detected by the pressure sensor P18, and the pressure increase at the third flow rate is continued until the pressure in the processing vessel 111 reaches the third pressure Y3 (see FIG. 4). When the pressure in the processing vessel 111 reaches the third pressure Y3, the third pressure increase step is terminated and the process proceeds to the fourth pressure increase step.

[0073] In the fourth pressure increase step, as shown in FIG. 12, the set temperature of the heating mechanism HE12 is changed from the first temperature to the second temperature. Thereby, the processing fluid from the processing fluid supply source S11 is adjusted to the second temperature by passing through the heating mechanism HE12. Therefore, the processing fluid at the third flow rate and the second temperature is supplied into the processing vessel 111. In this way, while supplying the processing fluid into the processing vessel 111, the heating mechanism HE12 is controlled to raise the temperature of the processing fluid from the first temperature to the second temperature. In the case of the heating mechanism HE12 using light heating, since the heat capacity is small, the temperature responsiveness is good. Therefore, the temperature of the processing fluid can be raised from the first temperature to the second temperature in a short time. In the fourth pressure increase step, since the on-off valve V18 is in the closed state, the processing fluid does not flow out from the processing vessel 111. Therefore, the pressure in the processing vessel 111 gradually rises.

[0074] During the fourth pressure increase step, the pressure in the processing vessel 111 is detected by the pressure sensor P18, and the fourth pressure increase step is continued until the pressure in the processing vessel 111 reaches the fourth pressure Y4 (see FIG. 4). When the pressure in the processing vessel 111 reaches the fourth pressure Y4, the fourth pressure increase step is terminated and the process proceeds to the circulation step.

[0075] As described above, in the pressure boosting process, the pressure boosting speed is increased in the order of the first pressure boosting process, the second pressure boosting process, and the third pressure boosting process. In this case, it is possible to suppress the supply of the processing fluid to the substrate W at a high speed in the initial stage, and to suppress pattern collapse.

[0076] During this series of operations, the control unit 14 receives the outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates the virtual temperature by the calculation formula of Equation (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0077] In the pressure boosting process ST12, during the period from immediately after the start to midway through the pressure boosting, the processing fluid in a gaseous state flows through the pipe L12p. Therefore, the control unit 14 sets the second weighting coefficient β to a value larger than the first weighting coefficient α. As shown in FIG. 5, for example, the control unit 14 sets the first weighting coefficient α in the range of 0 < α ≤ 0.5, and sets the second weighting coefficient β in the range of 0.5 ≤ β < 1. When the processing fluid in a gaseous state flows through the pipe L12p, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution degree of the first temperature sensor T11 and increasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0078] In the pressure boosting process ST12, during the period from midway through the pressure boosting to the end of the pressure boosting, the processing fluid in a supercritical state flows through the pipe L12p. Therefore, the control unit 14 sets the first weighting coefficient α to a value larger than the second weighting coefficient β. As shown in FIG. 5, for example, the control unit 14 sets the first weighting coefficient α in the range of 0.9 ≤ α < 1, and sets the second weighting coefficient β in the range of 0 < β ≤ 0.1. When the processing fluid in a supercritical state flows through the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution degree of the first temperature sensor T11 and reducing the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0079] The control unit 14 may determine, for example, based on the pressure of the processing fluid detected by the pressure sensor P12, which state among a plurality of states the state in the pipe L12p is.

[0080] <Circulation Process ST13> Circulation Process ST13 is performed after Pressure Increase Process ST12. In Circulation Process ST13, a processing fluid at a third flow rate and a second temperature is supplied from the processing fluid supply source S11 into the processing vessel 111, and replacement from IPA to the processing fluid is performed in the recesses of the pattern on the substrate W in the processing vessel 111. Specifically, as shown in FIG. 13, the on-off valve V18 is switched from the closed state to the open state. Thereby, the processing fluid of the processing fluid supply source S11 is supplied into the processing vessel 111 via the circulation flow path L11 and the first supply flow path L12, and is discharged from the processing vessel 111 via the discharge flow path L18. For this reason, the pressure in the processing vessel 111 is maintained at the fourth pressure Y4 (see FIG. 4). By performing Circulation Process ST13, replacement from IPA to the processing fluid is promoted in the recesses of the pattern of the substrate W.

[0081] When the replacement from IPA to the processing fluid is completed in the recesses of the pattern, Circulation Process ST13 ends and the process proceeds to Pressure Reduction Process ST14.

[0082] During this series of operations, the control unit 14 receives the outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates the virtual temperature by the calculation formula of Equation (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0083] In Circulation Process ST13, a processing fluid in a supercritical state flows in the pipe L12p. Therefore, the control unit 14 sets the first weighting coefficient α to a value larger than the second weighting coefficient β. As shown in FIG. 5, for example, the control unit 14 sets the first weighting coefficient α in the range of 0.9 ≦ α < 1 and the second weighting coefficient β in the range of 0 < β ≦ 0.1. When a processing fluid in a supercritical state flows in the pipe L12p, the response speed of the first temperature sensor T11 is fast. Therefore, by increasing the contribution degree of the first temperature sensor T11 and decreasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved.

[0084] The control unit 14 may determine which state among a plurality of states the state in the pipe L12p is based on, for example, the pressure of the processing fluid detected by the pressure sensor P12.

[0085] <Vacuum reduction step ST14> The vacuum reduction step ST14 is performed after the circulation step ST13. In the vacuum reduction step ST14, the processing fluid is discharged from the processing vessel 111. Specifically, as shown in FIG. 14, the on-off valve V12 is switched from the open state to the closed state. Thereby, the processing fluid remaining in the processing vessel 111 is discharged from the discharge flow path L18. When the pressure in the processing vessel 111 becomes lower than the critical pressure of the processing fluid by the vacuum reduction step ST14, the supercritical state processing fluid vaporizes and detaches from the concave portion of the pattern. Thereby, the drying process for one substrate W is completed.

[0086] In the vacuum reduction step ST14, as shown in FIG. 14, the set temperature of the heating mechanism HE12 is changed from the second temperature to the first temperature, the on-off valves V11, V122, V123, V124 are switched from the open state to the closed state, and the on-off valves V121, V13 are switched from the closed state to the open state. Thereby, the processing fluid of the processing fluid supply source S11 circulates between the circulation flow path L11, the first supply flow path L12, and the return flow path L13 and is cooled from the second temperature to the first temperature. In this case, the discharge of the processing fluid from the processing vessel 111 and the preparation of the processing fluid used for the next processing of the substrate W can be performed in parallel. Therefore, the processing time in the continuous processing can be shortened.

[0087] In the vacuum reduction step ST14, the on-off valves V122, V123, V124 may be switched from the open state to the closed state, the on-off valve V11 may maintain the open state, and the on-off valves V121, V13 may maintain the closed state. In this case, the processing fluid of the processing fluid supply source S11 circulates in the circulation flow path L11.

[0088] During this series of operations, the control unit 14 receives the outputs from the pressure sensor P12, the first temperature sensor T11, and the second temperature sensor T12, calculates the virtual temperature by the calculation formula of Equation (1), and controls the output of the heating mechanism HE12 based on the calculated virtual temperature.

[0089] In the depressurization step ST14, no processing fluid is flowing in the pipe L12p, or a gaseous processing fluid is flowing in the pipe L12p. Therefore, the control unit 14 sets the second weight coefficient β to a value larger than the first weight coefficient α. In the depressurization step ST14, since the temperature change due to the volume expansion of the processing fluid during depressurization is large, the temperature detected by the first temperature sensor T11 is likely to fluctuate. Therefore, the control unit 14 sets the second weight coefficient β to a value larger than the second weight coefficient β in the standby step ST11. As shown in FIG. 5, the control unit 14 sets the first weight coefficient α in the range of 0 < α ≤ 0.1 and the second weight coefficient β in the range of 0.9 ≤ β < 1, for example. When no processing fluid is flowing in the pipe L12p and when the pipe L12p is filled with a gaseous processing fluid, the response speed of the first temperature sensor T11 is slow. Therefore, by reducing the contribution degree of the first temperature sensor T11 and increasing the contribution degree of the second temperature sensor T12, the temperature controllability is improved. The control unit 14 determines which state among a plurality of states the state in the pipe L12p is based on, for example, the pressure of the processing fluid detected by the pressure sensor P12.

[0090] After the depressurization step ST14, the process proceeds to the standby step ST11. The unloading of the processed substrate W from the processing chamber 111 is performed, for example, after the process proceeds to the standby step ST11. Specifically, after the depressurization step ST14, the supply of the inert gas into the processing chamber 111 is started via the second supply channel L15. Next, with the inert gas being supplied into the processing chamber 111, the substrate W is unloaded from the processing chamber 111. Even after the substrate W is unloaded from the processing chamber 111, the supply of the inert gas into the processing chamber 111 is continued. In this way, when the substrate W is unloaded from the processing chamber 111 with the inert gas being supplied into the processing chamber 111, the inside of the processing chamber 111 becomes a positive pressure, so that a gas flow is formed from the inside to the outside of the processing chamber 111 when the inside of the processing chamber 111 is opened. Therefore, the residue in the processing chamber 111 can be discharged to the outside of the processing chamber 111 and removed. However, when the substrate W is unloaded from the processing chamber 111, the supply of the inert gas into the processing chamber 111 may be stopped.

[0091] In the substrate processing method according to the embodiment described above, the case where the heating mechanism HE12 is controlled in the boosting step ST12 to raise the temperature of the processing fluid from the first temperature to the second temperature has been described, but the present invention is not limited thereto. For example, the heating mechanism HE12 may be controlled in the circulation step ST13 to raise the temperature of the processing fluid from the first temperature to the second temperature. For example, in the standby step ST11, the boosting step ST12, the circulation step ST13, and the depressurization step ST14, the set temperature of the heating mechanism HE12 may be fixed at a constant value.

[0092] 〔Temperature control〕 With reference to FIG. 15, the temperature control in the case where the output of the heating mechanism HE12 is controlled based only on the temperature detected by the first temperature sensor T11 will be described. FIG. 15 is a diagram showing the temperature change in the case where the heating mechanism HE12 is controlled based only on the temperature detected by the first temperature sensor T11. In FIG. 15, the thin solid line indicates the temperature detected by the first temperature sensor T11, the thick solid line indicates the temperature detected by the second temperature sensor T12, and the dashed-dotted line indicates the set temperature.

[0093] When controlling the output of the heating mechanism HE12 based only on the temperature detected by the first temperature sensor T11, in the standby step ST11, the temperature detected by the second temperature sensor T12 becomes higher than the set temperature. That is, the temperature of the pipe L12p becomes higher than the set temperature. Immediately after shifting from the standby step ST11 to the pressure boosting step ST12, since the processing fluid flows through the pipe L12p heated to a temperature higher than the set temperature, the temperature of the processing fluid is heated to a temperature higher than the set temperature. For this reason, the temperature detected by the first temperature sensor T11 becomes higher than the set temperature immediately after shifting from the standby step ST11 to the pressure boosting step ST12, and changes so as to approach the set temperature as time passes. That is, in the pressure boosting step ST12 and the flow-through step ST13, the temperature of the processing fluid supplied into the processing container 111 is not stable. In the pressure reducing step ST14, due to the volume expansion in the pipe L12p, the temperature in the pipe L12p rapidly decreases, and the temperature detected by the first temperature sensor T11 becomes significantly lower than the set temperature. Although the output of the heating mechanism HE12 is controlled so that the temperature detected by the first temperature sensor T11 becomes the set temperature, the temperature in the pipe L12p rapidly rises and overshoot is likely to occur.

[0094] Referring to FIG. 16, the temperature control when controlling the output of the heating mechanism HE12 based only on the temperature detected by the second temperature sensor T12 will be described. FIG. 16 is a diagram showing temperature changes when controlling the heating mechanism HE12 based only on the temperature detected by the second temperature sensor T12. In FIG. 16, the thin solid line indicates the temperature detected by the first temperature sensor T11, the thick solid line indicates the temperature detected by the second temperature sensor T12, and the one-dot chain line indicates the set temperature.

[0095] When controlling the heating mechanism HE12 based only on the temperature detected by the second temperature sensor T12, in the pressure boosting step ST12 and the flow-through step ST13, the temperature detected by the first temperature sensor T11 becomes lower than the set temperature. The temperature of the processing fluid supplied into the processing container 111 is approximately equal to the temperature detected by the first temperature sensor T11. For this reason, in the pressure boosting step ST12 and the flow-through step ST13, the processing fluid at a temperature lower than the set temperature is supplied into the processing container 111.

[0096] Referring to FIG. 17, the temperature control when controlling the output of the heating mechanism HE12 based on the virtual temperature calculated by the calculation formula of Equation (1) will be described. FIG. 17 is a diagram showing the temperature change when controlling the heating mechanism HE12 based on the virtual temperature. In FIG. 17, the thin solid line indicates the temperature detected by the first temperature sensor T11, the thick solid line indicates the temperature detected by the second temperature sensor T12, and the dashed-dotted line indicates the set temperature.

[0097] When controlling the output of the heating mechanism HE12 based on the virtual temperature, the ratio of the contribution degree of the first temperature sensor T11 and the contribution degree of the second temperature sensor T12 can be changed according to the pressure in the pipe L12p.

[0098] In the standby process ST11, the second weighting coefficient β is set to a value larger than the first weighting coefficient α. For example, the first weighting coefficient α is set to 0.1, and the second weighting coefficient β is set to 0.9. In this case, the contribution degree of the second temperature sensor T12 becomes higher than the contribution degree of the first temperature sensor T11. Therefore, in the standby process ST11, the temperature detected by the second temperature sensor T12 becomes almost the same as the set temperature.

[0099] Immediately after shifting from the standby process ST11 to the pressure boosting process ST12, since the processing fluid passes through the pipe L12p heated to a temperature almost the same as the set temperature, the temperature of the processing fluid becomes almost the same as the set temperature. Therefore, the temperature detected by the first temperature sensor T11 hardly changes immediately after shifting from the standby process ST11 to the pressure boosting process ST12. In the pressure boosting process ST12, the first weighting coefficient α during the period when the gaseous processing fluid flows through the pipe L12p is set to a value larger than the first weighting coefficient α in the standby process ST11. For example, the first weighting coefficient α is set to 0.3, and the second weighting coefficient β is set to 0.7. In the pressure boosting process ST12, during the period when the supercritical processing fluid flows through the pipe L12p and in the circulation process ST13, the first weighting coefficient α is set to a value larger than the second weighting coefficient β. For example, the first weighting coefficient α is set to 0.99, and the second weighting coefficient β is set to 0.01. In this case, in the pressure boosting process ST12 and the circulation process ST13, the temperature detected by the first temperature sensor T11 is maintained at almost the same temperature as the set temperature. Therefore, in the pressure boosting process ST12 and the circulation process ST13, the processing fluid at almost the same temperature as the set temperature is supplied into the processing container 111. That is, regardless of the state of the processing fluid, the temperature of the processing fluid can be brought close to the set temperature.

[0100] In the pressure reducing process ST14, the second weighting coefficient β is set to a value larger than the first weighting coefficient α. For example, the first weighting coefficient α is set to 0.01, and the second weighting coefficient β is set to 0.99. In this case, the contribution degree of the second temperature sensor T12 becomes higher than the contribution degree of the first temperature sensor T11. In the pressure reducing process ST14, due to the volume expansion in the pipe L12p, the temperature in the pipe L12p drops rapidly, and the temperature detected by the first temperature sensor T11 becomes significantly lower than the set temperature. At this time, the output of the heating mechanism HE12 is controlled so that the temperature detected mainly by the second temperature sensor T12 becomes the set temperature. The temperature detected by the second temperature sensor T12 becomes closer to the set temperature than the temperature detected by the first temperature sensor T11. Therefore, compared with the case where the output of the heating mechanism HE12 is controlled so that the temperature detected by the first temperature sensor T11 becomes the set temperature, the rapid rise in the temperature in the pipe L12p is suppressed, and overshoot can be suppressed.

[0101] The embodiments disclosed this time should be considered illustrative in all respects and not restrictive. The above embodiments may be omitted, substituted, or changed in various forms without departing from the scope and spirit of the appended claims.

[0102] In the above embodiment, the case where the output of the heating mechanism HE12 is controlled based on the pressure of the process fluid detected by the pressure sensor P12, the temperature of the process fluid detected by the first temperature sensor T11, and the temperature of the pipe L12p detected by the second temperature sensor T12 was described. However, the present disclosure is not limited to this. For example, instead of the pressure of the process fluid detected by the pressure sensor P12, the pressure of the process fluid detected by the pressure sensor P18 may be used. For example, instead of the temperature of the pipe L12p detected by the second temperature sensor T12, a set temperature may be used.

[0103] In the above embodiment, the case where the heating mechanism HE12 is provided outside the pipe L12p and the process fluid flowing through the pipe L12p is heated by irradiating light from the outside of the pipe L12p toward the pipe L12p was described, but the present disclosure is not limited to this.

[0104] FIG. 18 is a diagram showing a heating mechanism HE12 according to the first modification. As shown in FIG. 18, the heating mechanism HE12 includes a spiral tube HE121 and a heater HE122. The spiral tube HE121 is provided spirally around the heater HE122. A processing fluid flows through the inside of the spiral tube HE121. The spiral tube HE121 is formed of, for example, stainless steel. The heater HE122 is provided inside the spiral of the spiral tube HE121. The heater HE122 has a rod shape. The heater HE122 heats the spiral tube HE121 and the processing fluid flowing through the inside of the spiral tube HE121 by irradiating light from the inside of the spiral of the spiral tube HE121 toward the spiral tube HE121. In the example of FIG. 18, the first temperature sensor T11 has a temperature measuring portion inserted into the spiral tube HE121 near the outlet of the spiral tube HE121 to detect the temperature of the processing fluid flowing through the inside of the spiral tube HE121. The second temperature sensor T12 has a temperature measuring portion provided in contact with the outer wall of the spiral tube HE121 to detect the temperature of the spiral tube HE121.

[0105] FIG. 19 is a diagram showing a heating mechanism HE12 according to a second modification. As shown in FIG. 19, the heating mechanism HE12 includes a tank HE125, a heater HE126, and a heater HE127. The tank HE125 stores a processing fluid. The tank HE125 is formed of, for example, stainless steel. The heater HE126 is embedded in the wall of the tank HE125. The heater HE127 is provided inside the tank HE125. The heater HE126 and the heater HE127 heat the tank HE125 and the processing fluid stored in the tank HE125. The tank HE125 is provided with a first connection port HE128 and a second connection port HE129. Inside the tank HE125, the processing fluid is supplied into the tank HE125 through the first connection port HE128, and the processing fluid is discharged from the tank HE125 through the second connection port HE129. In the example of FIG. 19, the first temperature sensor T11 has a temperature measurement part inserted into the second connection port HE129 and detects the temperature of the processing fluid flowing through the second connection port HE129. The second temperature sensor T12 has a temperature measurement part provided in contact with the outer wall of the tank HE125 and detects the temperature of the tank HE125.

Explanation of Signs

[0106] 10 Substrate processing apparatus 14 Control unit 111 Processing container HE12 Heating mechanism L12 First supply flow path T11 First temperature sensor T12 Second temperature sensor P12 Pressure sensor

Claims

1. A processing container for accommodating a substrate, A supply channel for supplying a processing fluid into the processing container, A heating mechanism for heating the processing fluid flowing through the supply channel, A first temperature sensor for detecting the temperature of the processing fluid downstream of the heating mechanism, A pressure sensor for detecting the pressure of the processing fluid downstream of the heating mechanism, A control unit, comprising, The control unit executes controlling the output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor. A substrate processing apparatus.

2. Controlling the output of the heating mechanism includes calculating a first calculated temperature by multiplying the temperature of the processing fluid detected by the first temperature sensor by a first weighting coefficient, controlling the output of the heating mechanism based on the first calculated temperature, having, The first weighting coefficient is a value associated with the pressure of the processing fluid detected by the pressure sensor. The substrate processing apparatus according to Claim 1.

3. When the pressure of the processing fluid is a first pressure, the first weighting coefficient is a value smaller than the first weighting coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure. The substrate processing apparatus according to Claim 2.

4. Further comprising a second temperature sensor for detecting the temperature of the supply channel heated by the heating mechanism, Controlling the output of the heating mechanism includes calculating a second calculated temperature by multiplying the temperature of the supply channel detected by the second temperature sensor by a second weighting coefficient, controlling the output of the heating mechanism based on the first calculated temperature and the second calculated temperature, having the second weighting coefficient is a value associated with the pressure of the processing fluid detected by the pressure sensor The substrate processing apparatus according to claim 2.

5. The second weighting coefficient when the pressure of the processing fluid is the first pressure is a value larger than the second weighting coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure. The substrate processing apparatus according to claim 4.

6. When the processing fluid flowing through the supply channel is in a supercritical state, the control unit sets the first weighting coefficient to a value larger than the second weighting coefficient. The substrate processing apparatus according to claim 4.

7. When the processing fluid flowing through the supply channel is in a gaseous state, the control unit sets the first weighting coefficient to a value smaller than the second weighting coefficient. The substrate processing apparatus according to claim 4.

8. When the processing fluid is not flowing through the supply channel, the control unit sets the first weighting coefficient to a value smaller than the second weighting coefficient. The substrate processing apparatus according to claim 4.

9. While flowing the processing fluid from the supply channel into the processing container, the control unit controls the output of the heating mechanism. The substrate processing apparatus according to any one of claims 1 to 8.

10. The heating mechanism includes a lamp heater. The substrate processing apparatus according to any one of claims 1 to 8.

11. A supply channel for supplying a processing fluid into a processing container, A heating mechanism for heating the processing fluid flowing through the supply channel, A first temperature sensor for detecting the temperature of the processing fluid downstream of the heating mechanism, A pressure sensor that detects the pressure of the processing fluid downstream of the heating mechanism, A control unit, and is provided with, Based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor, the control unit executes controlling the output of the heating mechanism. A fluid supply system.

12. A substrate processing method using a substrate processing apparatus, comprising: The substrate processing apparatus includes A processing container for accommodating a substrate, A supply flow path for supplying a processing fluid into the processing container, A heating mechanism for heating the processing fluid flowing through the supply flow path, A first temperature sensor that detects the temperature of the processing fluid downstream of the heating mechanism, A pressure sensor that detects the pressure of the processing fluid downstream of the heating mechanism, and is provided with, Based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor, controlling the output of the heating mechanism. A substrate processing method.

13. Controlling the output of the heating mechanism includes Calculating a first calculated temperature by multiplying the temperature of the processing fluid detected by the first temperature sensor by a first weighting coefficient, Controlling the output of the heating mechanism based on the first calculated temperature, and has, The first weighting coefficient is a value associated with the pressure of the processing fluid detected by the pressure sensor. The substrate processing method according to claim 12.

14. When the pressure of the processing fluid is the first pressure, the first weighting coefficient is a value smaller than the first weighting coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure. The substrate processing method according to claim 13.

15. The substrate processing apparatus further includes a second temperature sensor that detects the temperature of the supply flow path heated by the heating mechanism, Controlling the output of the heating mechanism includes: Calculating a second calculated temperature by multiplying the temperature of the supply flow path detected by the second temperature sensor by a second weighting coefficient; Controlling the output of the heating mechanism based on the first calculated temperature and the second calculated temperature; and The second weighting coefficient is a value associated with the pressure of the processing fluid detected by the pressure sensor. The substrate processing method according to claim 13.

16. When the pressure of the processing fluid is the first pressure, the second weighting coefficient is a value larger than the second weighting coefficient when the pressure of the processing fluid is a second pressure higher than the first pressure. The substrate processing method according to claim 15.

17. When the processing fluid flowing through the supply flow path is in a supercritical state, the first weighting coefficient is set to a value larger than the second weighting coefficient. The substrate processing method according to claim 15.

18. When the processing fluid flowing through the supply flow path is in a gaseous state, the first weighting coefficient is set to a value smaller than the second weighting coefficient. The substrate processing method according to claim 15.

19. When the processing fluid is not flowing through the supply flow path, the first weighting coefficient is set to a value smaller than the second weighting coefficient. The substrate processing method according to claim 15.

20. Controlling the output of the heating mechanism includes controlling the output of the heating mechanism while flowing the processing fluid from the supply flow path into the processing container. The substrate processing method according to any one of claims 12 to 19.

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