Drive device

Abstract

To provide a drive device capable of reducing costs due to breakdowns and increasing the rate of non-defective products.SOLUTION: In a drive device 100, a lead holder 10 has a plurality of high side driving areas 11, at least one low side driving area 13, a plurality of high side switching areas 14 and a plurality of low side switching areas 15, and a plurality of high side driving modules 20 are respectively installed in the plurality of high side driving areas 11, each of the high side driving modules includes an inner package 21, a primary side circuit, a driving side circuit and a bootstrap diode, the inner package packages the primary side circuit, the driving side circuit and the bootstrap diode, the inner package has a bottom surface on which a plurality of pins are installed, and the plurality of pins are electrically connected to the primary side circuit, the driving side circuit and the bootstrap diode.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a drive device, and particularly to a drive device having an inner package.

Background Art

[0002] Power Modules in known drive devices are connected to a three-phase motor to drive the three-phase motor. For example, it is "Semiconductor package" of US Patent No. US11476183B2 published as a US patent. The power module is composed of a plurality of drive circuits 3a, 3b, 3c, 4a, 4b, 4c and a plurality of switch elements 1a, 1b, 1c, 1d, 1e, 1f. Among them, the plurality of drive circuits 3a, 3b, 3c, 4a, 4b, 4c include three high-side drive circuits 3a, 3b, 3c and three low-side drive circuits 4a, 4b, 4c. The plurality of switch elements 1a, 1b, 1c, 1d, 1e, 1f include three high-side switch elements 1a, 1b, 1c and three low-side switch elements 1d, 1e, 1f. By means of a packaging technology of Package in Package (PiP) for packaging, the three high-side drive circuits 3a, 3b, 3c are packaged in an inner package 5 to form a single high-side drive element, and in a form of bonding by a plurality of conducting wires 7a, 7b, 7c, the high-side drive element is connected to the three high-side switch elements 1a, 1b, 1c, and then the power module is packaged with an outer package 8.

[0003] Since the three high-side drive circuits 3a, 3b, and 3c are simultaneously packaged by the inner package 5, although the high-side drive elements previously packaged by the inner package 5 can be inspected, if a failure occurs in any one of the high-side drive circuits 3a, 3b, or 3c among the high-side drive elements and is once detected by inspection, even if the other two high-side drive circuits 3a, 3b, and 3c are normal, it is still necessary to replace and discard the high-side drive elements packaged by the inner package 5 as a whole, and the cost as a whole will increase. In addition, by packaging the three high-side drive circuits 3a, 3b, and 3c together in the high-side drive elements, the yield rate of packaging will be lowered accordingly, and the time required for packaging will also increase.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Therefore, there are areas that need to be improved in the conventional drive device. How to reduce the cost due to failures and increase the yield rate has become a technical issue that has attracted intensive attention in this industry.

Means for Solving the Problems

[0005] In view of this, an object of the present invention is to provide a drive device capable of reducing the cost due to failures and increasing the yield rate.

[0006] To achieve the above object, the drive device provided by the present invention includes a lead holder, a plurality of high-side drive modules, at least one low-side drive module, a plurality of high-side opening and closing modules, a plurality of low-side opening and closing modules, and an outer package. Among them, the lead holder has a plurality of high-side drive regions, at least one low-side drive region, a plurality of high-side opening and closing regions, and a plurality of low-side opening and closing regions. The plurality of high-side drive modules are respectively installed in the plurality of high-side drive regions in the lead holder. Among them, each high-side drive module includes an inner package, a primary-side circuit, a drive-side circuit, and a bootstrap diode, and the inner package packages the primary-side circuit, the drive-side circuit, and the bootstrap diode. The inner package has an upper surface and a lower surface, and a plurality of pins are installed on the lower surface. The plurality of pins are electrically connected to the primary-side circuit, the drive-side circuit, and the bootstrap diode. Among them, the lower surface of each high-side drive module faces each high-side drive region in the lead holder, and the plurality of pins in each high-side drive module are welded to each high-side drive region in the lead holder. The at least one low-side drive module is installed in the at least one low-side drive region in the lead holder. The plurality of high-side opening and closing modules are respectively installed in the plurality of high-side opening and closing regions in the lead holder. Each high-side opening and closing module is electrically connected to each high-side drive module through the lead holder. The plurality of low-side opening and closing modules are respectively installed in the plurality of low-side opening and closing regions in the lead holder. The plurality of low-side opening and closing modules are electrically connected to the at least one low-side drive module through the lead holder. The outer package packages the plurality of high-side drive modules, the at least one low-side drive module, the plurality of high-side opening and closing modules, the plurality of low-side opening and closing modules, and the lead holder.

Effects of the Invention

[0007] The effect of the present invention is realized in such a form that each of the high-side drive modules includes the inner package, and packages the primary-side circuit, the drive-side circuit, and the bootstrap diode, so that each high-side drive module is formed as a single element. And before packaging by the outer package, each of the high-side drive modules is first inspected and faults are eliminated. Once a fault is detected in any one of the high-side drive modules, the cost due to the fault can be reduced by replacing only the packaged high-side drive module. In addition, since each of the high-side drive modules is formed as a single element, it is possible to improve the problems of a decrease in the yield rate of packaging and an increase in the time for packaging caused by packaging the three high-side drive circuits together in a commonly used power module.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0009] To more clearly explain the present invention, preferred embodiments will be given and described in detail below with reference to the drawings. As shown in FIGS. 1 and 2, a driving device 100 according to a preferred embodiment of the present application includes a lead holder 10, a plurality of high-side driving modules 20, at least one low-side driving module 30, a plurality of high-side opening / closing modules 40, a plurality of low-side opening / closing modules 50, and an out-package 60. In this embodiment, for the plurality of high-side driving modules 20, the plurality of high-side opening / closing modules 40, and the plurality of low-side opening / closing modules 50, taking a motor with a three-phase motor 200 as an example, the number of them is three, but it is not limited thereto.

[0010] The lead holder 10 includes a plurality of high-side driving regions 11, a connection bar 12, at least one low-side driving region 13, a plurality of high-side opening / closing regions 14, and a plurality of low-side opening / closing regions 15. The plurality of high-side driving regions 11 are arranged in parallel with the plurality of high-side opening / closing regions 14, and the at least one low-side driving region 13 is arranged in parallel with the plurality of low-side opening / closing regions 15. In this embodiment, the number of the plurality of high-side driving regions 11 corresponding to the three high-side driving modules 20 is three, and the number of the at least one low-side driving region 13 corresponding to one low-side driving module 30 is one, but it is not limited thereto.

[0011] Each of the high-side driving regions 11 includes a plurality of high-side bars 111, and the plurality of high-side bars 111 are arranged at intervals. Each of the high-side bars 111 has a contact 111a, and the plurality of contacts 111a are located at the terminals of the plurality of high-side bars 111. The connection bar 12 is located between the plurality of high-side driving regions 11 and the plurality of high-side opening / closing regions 14. One of the high-side bars 111 in the plurality of high-side driving regions 11 is connected to the connection bar 12. In this embodiment, each of the high-side opening / closing modules 40 is connected to two high-side bars 111 in each of the high-side driving regions 11 via two high-side metal wires 112, and among them, the plurality of high-side metal wires 112 are connected in the form of wire bonding.

[0012] The low-side driving area 13 includes a plurality of low-side bars 131 and at least one wafer sheet 133. In this embodiment, the number of the at least one wafer sheet 133 is one, but it is not limited thereto. The plurality of low-side bars 131 are arranged at intervals, and the low-side driving module 30 is installed on the wafer sheet 133. The low-side driving module 30 is connected to the plurality of low-side opening and closing modules 50 and the plurality of low-side bars 131 respectively via a plurality of low-side metal wires 132, among which the plurality of low-side metal wires 132 are connected in the form of wire bonding.

[0013] The three high-side driving modules 20 are respectively installed in the plurality of high-side driving areas 11 in the lead holder 10. The three high-side driving modules 20 respectively include an inner package 21, a primary-side circuit 22, a driving-side circuit 23, and a bootstrap diode 24. Among them, the inner package 21 packages the primary-side circuit 22, the driving-side circuit 23, and the bootstrap diode 24. As shown in FIGS. 3 and 4, the inner package 21 has an upper surface 211 and a lower surface 212. A plurality of pins are installed on the lower surface 212, and the plurality of pins 213 are electrically connected to the primary-side circuit 22, the driving-side circuit 23, and the bootstrap diode 24. For each high-side driving module 20, the lower surface 212 faces each high-side driving area 11 in the lead holder 10. The plurality of pins 213 in each high-side driving module 20 are correspondingly welded to each high-side driving area 11 in the lead holder 10, among which the plurality of pins 213 correspond to the contacts 111a on each high-side bar 111. In this embodiment, the primary-side circuit 22 includes a control circuit 221 and a separation circuit 222. The separation circuit 222 is for avoiding the high voltage from the control circuit 221 affecting the driving-side circuit 23 by electrically separating the control circuit 221 and the driving-side circuit 23.

[0014] In this embodiment, the number of the inner packages 21 corresponds to the number of the three high-side driving modules 20. The plurality of pins 213 in each of the inner packages 21 are internal pins, which are located below the packaging and do not extend outside the packaging. However, the types of the plurality of inner packages 21 are not limited to the above. In other embodiments, the types of the plurality of inner packages 21 may be small outline packages (SOP) or the like.

[0015] Referring to FIG. 2 again, the driving device 100 according to this embodiment further includes a plurality of external pins, among which the plurality of external pins include a plurality of external first power pins P1, an external second power pin P2, a plurality of external first ground pins P3, a plurality of external high-side signal input pins P4, a plurality of external connection pins P5, a plurality of external drive output pins P6, and a plurality of external second ground pins P7. Among them, the plurality of external first power pins P1 are connected to the first power supply V1, the external second power pin P2 is connected to the second power supply V2, the plurality of external high-side signal input pins P4 are connected to the microcontroller 70, the plurality of external first ground pins P3 are grounded, each of the external connection pins P5 is electrically connected to the bootstrap capacitor 80, each of the external drive output pins P6 is electrically connected to the bootstrap capacitor 80 and the three-phase motor 200, and the plurality of external second ground pins P7 are grounded. Among them, the number of the plurality of external first power pins P1, the plurality of external first ground pins P3, the plurality of external high-side signal input pins P4, the plurality of external connection pins P5, the plurality of external drive output pins P6, and the plurality of external second ground pins P7 may be changed according to the number of phases of the motor driven by the driving device 100.

[0016] In addition, each of the three high-side drive modules 20 further includes a first wafer 25 and a second wafer 26. Among them, the first wafer 25 has the primary-side circuit 22, and the second wafer 26 has the drive-side circuit 23. The primary-side circuit 22 is electrically connected to the drive-side circuit 23. The anode of the bootstrap diode 24 is electrically connected to the primary-side circuit 22, and the cathode of the bootstrap diode 24 is electrically connected to the drive-side circuit 23.

[0017] Referring to FIG. 1 again, in this embodiment, the three high-side drive modules 20 have the same configuration and function. For the sake of convenience of description, one high-side drive module 20 will be described as an example. The number of the plurality of pins 213 in the inner package 21 is six, but it is not limited thereto. The six pins 213 are respectively an internal first power pin 213a, an internal high-side signal input pin 213b, an internal first ground pin 213c, an internal second power pin 213d, an internal high-side signal output pin 213e, and an internal second ground pin 213f. The internal first power pin 213a is electrically connected to the primary-side circuit 22 and the anode of the bootstrap diode 24, and the internal first power pin 213a is directly connected to the external first power pin P1 through the corresponding high-side bar 111. The internal high-side signal input pin 213b is electrically connected to the primary-side circuit 22. More specifically, the internal high-side signal input pin 213b is electrically connected to the control circuit 221 in the primary-side circuit 22, and the internal high-side signal input pin 213b is directly connected to the external high-side signal input pin P4 through the corresponding high-side bar 111. The internal first ground pin 213c is electrically connected to the primary-side circuit 22, and the internal first ground pin 213c is directly connected to the external first ground pin P3 through the corresponding high-side bar 111. Among them, the internal first ground pin 213c is connected to the other internal first ground pins 213c in such a form that it is connected to the connection bar 12 through the corresponding high-side bar 111. The internal second power pin 213d is electrically connected to the cathode of the bootstrap diode 24 and the external connection pin P5. The internal high-side signal output pin 213e is electrically connected to the drive-side circuit 23 and the corresponding high-side on-off module 40. In addition, the drive device 100 according to this embodiment further includes a plurality of external high-side signal output pins PO1 and a plurality of external fourth ground pins PO2. Each internal high-side signal output pin 213e is connected to each external high-side signal output pin PO1 through the corresponding high-side bar 111 to detect the output signal from each high-side drive module 20.The internal second ground pin 213f is electrically connected to the drive-side circuit 23, the corresponding high-side switching module 40, the low-side switching module 50, and the external drive output pin P6. Also, each of the internal second ground pins 213f is connected to each of the external fourth ground pins PO2 via the corresponding high-side bar 111 to detect the output signal from each of the high-side drive modules 20. Among them, the plurality of external pins are connected to the corresponding plurality of high-side bars 111 in a form of being integrally connected. In this embodiment, the boost diode 24 and the boost capacitor 80 can increase the voltage when switching the phase of the three-phase motor 200 and achieve the purpose of quickly switching the phase of the three-phase motor 200.

[0018] In addition, the drive device 100 according to this embodiment further includes an external third power supply pin P8, three external low-side signal input pins P9, and an external third ground pin P10. Among them, the external third power supply pin P8 is connected to the third power supply V3, the plurality of external low-side signal input pins P9 are connected to the microcontroller 70, and the external third ground pin P10 is grounded. In this embodiment, the number of the plurality of external low-side signal input pins P9 corresponds to the number of phases of the motor driven by the drive device 100.

[0019] In this embodiment, the number of the at least one low-side drive module 30 is one, but it is not limited thereto. The low-side drive module 30 is installed in the low-side drive area 13 in the lead holder 10. The low-side drive module 30 includes an internal power contact 31, three internal low-side signal input contacts 32, an internal ground contact 33, and a plurality of internal low-side signal output contacts 34. The internal power contact 31 is connected to the external third power pin P8 via the corresponding low-side bar 131. The three internal low-side signal input contacts 32 are connected to the plurality of external low-side signal input pins P9 via the corresponding plurality of low-side bars 131. The internal ground contact 33 is connected to the external third ground pin P10 via the corresponding one low-side bar 131. The plurality of internal low-side signal output contacts 34 are electrically connected to the corresponding plurality of low-side opening and closing modules 50. Among them, the number of the three internal low-side signal input contacts 32 and the plurality of internal low-side signal output contacts 34 respectively corresponds to the number of phases of the motor to be driven.

[0020] In addition, the drive device 100 according to this embodiment further includes a plurality of external low-side signal output pins PO3. Each of the external low-side signal output pins PO3 is connected to each of the low-side bars 131 of the corresponding internal low-side signal output contact 34 to detect the output signal from the low-side drive module 30. Among them, the plurality of external low-side signal output pins PO3 are connected to the corresponding plurality of low-side bars 131 in an integrated connection form.

[0021] The plurality of high-side opening and closing modules 40 are respectively installed in the plurality of high-side opening and closing areas 14 in the lead holder 10. In this embodiment, the three high-side opening and closing modules 40 have the same configuration and function. That is. For the sake of convenience in explanation, one high-side opening / closing module 40 will be described as an example. The high-side opening / closing module 40 includes a first transistor 41 and a first diode 42. Among them, the first transistor 41 has a first end 411, a second end 412, and a third end 413. The first end 411 is electrically connected to the external second power supply pin P2 and the cathode of the first diode 42. The second end 412 is electrically connected to the corresponding high-side bar 111 in the lead holder 10, and the high-side metal wire 112 is electrically connected to the internal high-side signal output pin 213e. The third end 413 is electrically connected to the anode of the first diode 42, the corresponding external drive output pin P6, and the corresponding high-side bar 111 via the lead holder 10, and the high-side metal wire 112 is electrically connected to the internal second ground pin 213f. In this embodiment, the plurality of first transistors 41 are insulated gate bipolar transistors, the first end 411 is the collector of the insulated gate bipolar transistor, the second end 412 is the gate of the insulated gate bipolar transistor, and the third end 413 is the emitter of the insulated gate bipolar transistor. In other embodiments, the plurality of first transistors 41 may be switch elements such as bipolar transistors or metal oxide semiconductor field effect transistors.

[0022] The three low-side opening / closing modules 50 are respectively installed in the plurality of low-side opening / closing regions 15 in the lead holder 10. In this embodiment, the three low-side opening / closing modules 50 have the same configuration and function. For the sake of convenience of explanation, one low-side opening / closing module 50 will be described as an example. The low-side opening / closing module 50 includes a second transistor 51 and a second diode 52. Among them, the second transistor 51 has a fourth terminal 511, a fifth terminal 512, and a sixth terminal 513. The fourth terminal 511 is electrically connected to the third terminal 413 of the first transistor 41, the cathode of the second diode 52, and the corresponding external drive output pin P6. The fifth terminal 512 is electrically connected to the corresponding internal low-side signal output contact 34 through the corresponding low-side bar 131 and the low-side metal wire 132 in the lead holder 10. The sixth terminal 513 is electrically connected to the anode of the second diode 52 and the corresponding external second ground pin P7. In this embodiment, the plurality of second transistors 51 are insulated gate bipolar transistors, the fourth terminal 511 is the collector of the insulated gate bipolar transistor, the fifth terminal 512 is the gate of the insulated gate bipolar transistor, and the sixth terminal 513 is the emitter of the insulated gate bipolar transistor. In other embodiments, the plurality of second transistors 51 may be switch elements such as bipolar transistors or metal oxide semiconductor field effect transistors.

[0023] The outer package 60 packages the plurality of high-side drive modules 20, the low-side drive module 30, the plurality of high-side opening / closing modules 40, the plurality of low-side opening / closing modules 50, and the lead holder 10.

[0024] In other embodiments, regarding the number of the at least one low-side driving module 30, after being adjusted to three without matching according to needs, the number of the at least one low-side driving region 13 may be adjusted accordingly, as long as it can correspond to the number of phases of the motor driven by the driving device 100. Actually, the number of the external second grounding pins P7 may also be at least one. The at least one external second grounding pin P7 is connected to the plurality of second transistors 51 and the plurality of second diodes 52 via a plurality of metal wires.

[0025] As described above, the driving device 100 according to the present application includes the inner package 21 in each of the high-side driving modules 20, and realizes forming each high-side driving module 20 as a single element in the form of packaging the primary-side circuit 22, the driving-side circuit 23, and the bootstrap diode 24. Before packaging the outer package 60, each of the high-side driving modules 20 is first inspected to eliminate faults. Once a fault is detected in any one of the high-side driving modules 20, only one packaged high-side driving module 20 is replaced to reduce the cost caused by the fault. Moreover, since each of the high-side driving modules 20 is formed as a single element, it is possible to improve the problems of the decrease in the yield rate of packaging and the increase in the time for packaging due to packaging three high-side driving circuits together in a commonly used power module.

[0026] The above are only preferred feasible embodiments of the present invention. Any equivalent substitutions based on the description and claims of the present invention should be included in the patent scope of the present invention.

Description of Reference Numerals

[0027] 100 Driving device 10 Lead holder 11 High-side driving region 111 High-side bar 111a Contact 112 High-side metal wire 12 Connection bar 13 Low-side drive area 131 Low-side bar 132 Low-side metal wire 133 Wafer sheet 14 High-side opening / closing area 15 Low-side opening / closing area 20 High-side drive module 21 Inner package 211 Upper surface 212 Lower surface 213 Pin 213a Internal first power pin 213b Internal high-side signal input pin 213c Internal first ground pin 213d Internal second power pin 213e Internal high-side signal output pin 213f Internal second ground pin 22 Primary-side circuit 221 Control circuit 222 Isolation circuit 23 Drive-side circuit 24 Bootstrap diode 25 First wafer 26 Second wafer 30 Low-side drive module 31 Internal power contact 32 Internal low-side signal input contact 33 Internal ground contact 34 Internal low-side signal output contact 40 High-side opening / closing module 41 First transistor 411 First terminal 412 Second terminal 413 Third terminal 42 First diode 50 Low-side opening / closing module 51 Second transistor 511 Fourth terminal 512 Fifth terminal 513 Sixth terminal 52 Second diode 60 Outer package 70 Microcontroller 80 Bootstrap Capacitor 200 Three-phase Motor P1 External First Power Pin P2 External Second Power Pin P3 External First Ground Pin P4 External High-side Signal Input Pin P5 External Connection Pin P6 External Drive Output Pin P7 External Second Ground Pin P8 External Third Power Pin P9 External Low-side Signal Input Pin P10 External Third Ground Pin PO1 External High-side Signal Output Pin PO2 External Fourth Ground Pin PO3 External Low-side Signal Output Pin V1 First Power Supply V2 Second Power Supply V3 Third Power Supply

Claims

1. a lead holder including a plurality of high side drive areas, at least one low side drive area, a plurality of high side opening areas, and a plurality of low side opening areas; a plurality of high-side driving modules, each of which is mounted on the plurality of high-side driving areas of the lead holder, each of the high-side driving modules including an inner package, a primary side circuit, a driving side circuit, and a bootstrapped diode, the inner package packaging the primary side circuit, the driving side circuit, and the bootstrapped diode, the inner package having an upper surface and a lower surface, the lower surface having a plurality of pins, the plurality of pins being electrically connected to the primary side circuit, the driving side circuit, and the bootstrapped diode, the lower surface of each of the high-side driving modules facing the respective high-side driving areas of the lead holder, and the plurality of pins of each of the high-side driving modules being welded to the respective high-side driving areas of the lead holder; at least one lower drive module disposed in the at least one lower drive area of ​​the lead holder; a plurality of high side switching modules, each of which is disposed in the plurality of high side switching regions of the lead holder and electrically connected to each of the high side drive modules via the lead holder; a plurality of lower side switching modules, each of which is disposed in the lower side switching regions of the lead holder and electrically connected to the at least one lower side driving module via the lead holder; a drive device comprising: an outer package that packages the plurality of high-side driving modules, the at least one low-side driving module, the plurality of high-side opening and closing modules, the plurality of low-side opening and closing modules, and the lead holder.

2. Each of the high drive regions includes a plurality of spaced apart high bars; 2. The drive arrangement of claim 1, wherein each said high side bar has a contact, and each said pin in each said high side drive module is a contact welded to each said high side bar.

3. 3. The drive device of claim 2, wherein each of the high-side switching modules is connected to a plurality of the high-side bars in each of the high-side driving regions via a plurality of high-side metal wires.

4. the at least one lower side driving region includes a plurality of lower side bars and at least one wafer sheet, the plurality of lower side bars being spaced apart from one another, the at least one lower side driving module being mounted on the at least one wafer sheet; The drive device of claim 1, characterized in that the at least one low-side drive module is connected to the plurality of low-side switching modules and the plurality of low-side bars via a plurality of low-side metal wires, respectively.

5. 2. The drive arrangement of claim 1, wherein each of the high side drive modules comprises a first wafer and a second wafer, the first wafer comprising the primary side circuitry, the second wafer comprising the drive side circuitry, the primary side circuitry electrically connected to the drive side circuitry, and the bootstrapped diode electrically connected to the primary side circuitry and the drive side circuitry.

6. a plurality of external pins including a plurality of external first power supply pins, a plurality of external high side signal input pins, and a plurality of external first ground pins; the lead holder includes a connecting bar, the connecting bar being connected to one of the high bars in each of the high drive regions; The plurality of pins in each of the high-side driving modules include an internal first power supply pin, an internal high-side signal input pin, and an internal first ground pin, each of the internal first power supply pins is electrically connected to the primary side circuit, and each of the internal first power supply pins is connected to each of the external first power supply pins via a corresponding one of the high-side bars; each said internal high side signal input pin is electrically connected to said primary side circuit and connected to each said external high side signal input pin via a corresponding said high side bar; Each of the internal first ground pins is electrically connected to the primary side circuit and is connected to each of the external first ground pins via a corresponding high side bar; 3. The drive device of claim 2, wherein the internal first ground pin in each of the high-side drive modules is electrically connected to the connection bars via the corresponding high-side bar.

7. a plurality of external pins including a plurality of external connection pins, each of the external connection pins being for connecting a bootstrap capacitor; 3. The drive arrangement of claim 2, wherein the plurality of pins in each of the high-side drive modules includes an internal second power supply pin, each of the internal second power supply pins being electrically connected to a respective one of the bootstrapped diodes and connected to a respective one of the external connection pins via a corresponding one of the high-side bars.

8. the plurality of external pins include an external second power supply pin and a plurality of external driving output pins; the plurality of pins on each of the high side driver modules includes an internal high side signal output pin; Each of the high-side switching modules includes a first transistor and a first diode, the first transistor has a first end, a second end and a third end, the first end is electrically connected to the external second power supply pin and the first diode, the second end is electrically connected to the internal high-side signal output pin via a high-side metal line and the high-side bar, and the third end is electrically connected to the first diode and the external drive output pin; 8. The drive device according to claim 7, wherein both ends of each of the bootstrap capacitors are electrically connected to each of the external connection pins and each of the external drive output pins.

9. the plurality of external pins includes at least one external second ground pin; the at least one low side driver module having a plurality of internal low side signal output contacts; 9. The drive device of claim 8, wherein each of the low-side switching modules includes a second transistor and a second diode, the second transistor having a fourth end, a fifth end and a sixth end, the fourth end electrically connected to the third end of the corresponding first transistor, the second diode and each of the external drive output pins, the fifth end electrically connected to the internal low-side signal output contact, and the sixth end electrically connected to the second diode and the at least one external second ground pin.

10. the plurality of pins in each of the high side driving modules includes an internal second ground pin electrically connected to the driving side circuitry; 10. The drive device of claim 9, wherein each of the internal second ground pins is electrically connected to a third end of each of the first transistors via a corresponding one of the high side bars and a high side metal line.

11. the plurality of external pins includes a plurality of external output pins; The driving device of claim 10, wherein the internal high-side signal output pin and the internal second ground pin in each of the high-side driving modules are respectively connected to two of the external output pins via two corresponding high-side bars.

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