Vibration-resistant structure for electronic component and heat medium heating device equipped with the same

Abstract

To provide a vibration-resistant structure for an electronic component that improves the vibration resistance and heat dissipation of the electronic component.SOLUTION: A vibration-resistant structure for a capacitor 26 for controlling an electric heater is used in a heat medium heating device 1 having a heat medium flow path formed in flow path parts 6 and 7 of a housing 2 and an electric heater for heating the heat medium flowing through the heat medium flow path, and includes a wall part 51 formed in the housing 2 and surrounding the periphery of the capacitor 26, and a heat dissipation material 52 filled between the wall part 51 and the capacitor 26.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a vibration-resistant structure of an electronic component used in a heat medium heating device that heats a heat medium flowing through a heat medium flow path configured in a housing by an electric heater, and a heat medium heating device including the same.

Background Art

[0002] Conventionally, a heat medium heating device used for vehicle interior air conditioning or the like has a heat medium flow path configured in a housing, and a cylindrical electric heater called a cartridge heater is disposed in the heat medium flow path to heat the heat medium flowing through the heat medium flow path. In this case, for example, two heat medium flow paths are provided in the housing, one ends thereof are communicated by a communication flow path, electric heaters are respectively disposed in the heat medium flow paths, and the heat medium flowing in from a heat medium inflow portion formed at the other end of one heat medium flow path is heated by each electric heater and then discharged from a heat medium outflow portion formed at the other end of the other heat medium flow path (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in this type of heat medium heating device, in recent years, compatibility with high voltage (for example, 800 V or the like) has been required, and a heat medium heating device assuming use in a higher voltage range than before has been desired. For such high voltage compatibility, since the current and voltage applied to electronic components such as IGBTs, capacitors (film capacitors), and coils for controlling the electric heater increase, the corresponding electronic components become larger in size.

[0005] On the one hand, since the heat medium heating device is assumed to be mounted on a vehicle, high vibration resistance is required. However, when the electronic components are enlarged as described above, the height of the electronic components with respect to the control board increases, and the distance from the control board to the center of gravity of the electronic components becomes large, making it easier to vibrate. Therefore, the strength of the joint between the electronic components and the control board becomes an issue.

[0006] Furthermore, as the electronic components increase in size, the amount of heat generated also increases. However, conventionally, heat dissipation was by air, so when the ambient temperature was high, a temperature rise occurred, leading to a problem of destruction.

[0007] The present invention has been made to solve such conventional technical problems, and an object thereof is to provide a vibration-resistant structure for electronic components with improved vibration resistance and heat dissipation of the electronic components, and a heat medium heating device equipped with the same.

Means for Solving the Problems

[0008] The present invention is used in a heat medium heating device including a heat medium flow path formed in a housing and an electric heater that heats the heat medium flowing through the heat medium flow path, and is a vibration-resistant structure for an electronic component for controlling the electric heater, characterized by including a wall portion formed in the housing and surrounding the periphery of the electronic component, and a heat dissipation material filled between the wall portion and the electronic component.

[0009] The vibration-resistant structure of the electronic component according to the invention of claim 2 is characterized in that, in the above invention, the heat dissipation material is a two-component curable resin.

[0010] The vibration-resistant structure of the electronic component according to the invention of claim 3 is characterized in that, in the invention of claim 1, the electronic component is a capacitor.

[0011] The vibration-resistant structure of the electronic component according to the invention of claim 4 is characterized in that, in the invention of claim 1, the electronic component is a coil.

[0012] The heat medium heating device of the invention according to claim 5 includes the vibration-resistant structure of the electronic components of each of the above inventions, at least two heat medium flow paths arranged in parallel in the housing, a communication flow path communicating with one end of each heat medium flow path, a heat medium inflow portion formed at the other end of one heat medium flow path, a heat medium outflow portion formed at the other end of the other heat medium flow path, an electric heater, and a control board provided in the housing on which the electronic components are mounted. Each heat medium flow path is arranged spaced apart from each other, and the electronic components are arranged within the interval between the heat medium flow paths.

[0013] The heat medium heating device of the invention according to claim 6 is characterized in that, in the above invention, the wall portion is capable of heat exchange with the heat medium flowing through each heat medium flow path and the communication flow path.

[0014] The heat medium heating device of the invention according to claim 7 is characterized in that, in the above invention, the housing includes at least two flow path portions in which heat medium flow paths are formed inside, and a communication portion in which a communication flow path is formed inside, and the wall portion is integrally formed with the flow path portion and / or the communication portion.

Advantages of the Invention

[0015] According to the present invention, in a heat medium heating device including a heat medium flow path formed in a housing and an electric heater for heating the heat medium flowing through the heat medium flow path, in the vibration-resistant structure of the electronic components for controlling the electric heater, a wall portion is formed on the housing so as to surround the periphery of the electronic components, and a heat dissipation material is filled between the wall portion and the electronic components. Therefore, even in the case of large-sized electronic components, the vibration resistance can be improved. As a result, it is also possible to prevent the joint portion between the electronic components and the control board from being damaged due to vibration, and it is extremely suitable for a vehicle-mounted heat medium heating device that requires high vibration resistance.

[0016] In addition, the heat dissipation amount from the electronic components is also ensured by the heat dissipation material filled between the wall portion and the electronic components. Therefore, even when the electronic components are enlarged and the heat dissipation amount increases, it is possible to maintain the appropriate temperature range.

[0017] In this case, as the heat dissipation material, a two-component curable resin with a relatively high thermal conductivity can be adopted as in the invention of claim 2. In particular, by adopting a two-component curable resin, the position adjustment of the electronic component can be easily performed immediately after filling the heat dissipation material, and after curing, it is possible to prevent the joint between the electronic component and the control board from being damaged by vibration. Therefore, the assemblability and vibration resistance can be improved. Also, by using a two-component curable resin, the holding time until curing is shortened, so that the productivity of the device can be improved.

[0018] Also, as the electronic component, for example, a capacitor as in the invention of claim 3 or a coil as in the invention of claim 4 can be cited.

[0019] And the heat medium heating device of the invention of claim 5 includes the vibration-resistant structure of the electronic component of each of the above inventions, at least two heat medium flow paths arranged in parallel in the housing, a communication flow path communicating with one end of each heat medium flow path, a heat medium inflow portion formed at the other end of one heat medium flow path, a heat medium outflow portion formed at the other end of the other heat medium flow path, an electric heater, and a control board provided in the housing on which the electronic component is mounted. Since the heat medium flow paths are arranged apart from each other, heat exchange between the heat medium flowing through the heat medium inflow portion and the heat medium outflow portion can be prevented.

[0020] In particular, since the electronic component is arranged within the interval between the heat medium flow paths, the dead space between the heat medium flow paths can be effectively utilized for the arrangement of the electronic component used for the control of the electric heater, so that the miniaturization of the heat medium heating device can be realized.

[0021] Also, if the wall portion is made heat-exchangeable with the heat medium flowing through each heat medium flow path and the communication flow path as in the invention of claim 6, the electronic component can exchange heat with the heat medium through the heat dissipation material and the wall portion on three sides surrounded by each heat medium flow path and the communication flow path, and the electronic component can be surely cooled to below the allowable temperature.

[0022] In this case, for example, like the invention of claim 7, by integrally forming all of the at least two flow path portions provided in the housing and having a heat medium flow path formed therein, and all of the communication portions having a communication flow path formed therein, or any of them and the wall portion, it is possible to further improve the heat exchange property between the electronic component and the heat medium.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing the appearance of a heat medium heating device 1 according to an embodiment to which the vibration-resistant structure of the electronic component of the present invention is applied, FIG. 2 is a schematic plan sectional view for explaining the flow of the heat medium in the heat medium heating device 1, FIG. 3 is a plan view showing the inside of the main body 3 of the housing 2 with the cover 4 of the heat medium heating device 1 of FIG. 1 removed, FIG. 4 is a view seen through the control board 21 of FIG. 3, FIG. 5 is a longitudinal side view of the heat medium heating device 1, and FIG. 6 is a circuit block diagram of the control device 31.

[0025] (1) Heat medium heating device 1 The heat medium heating device 1 of the embodiment is used for air-conditioning the interior of a vehicle (not shown), and a housing 2 is composed of a metallic main body 3 having a high thermal conductivity such as iron or aluminum, and a also metallic cover 4 attached to the main body 3. In the main body 3 of the housing 2, in the embodiment, two flow path portions 6 and 7 (also made of metal) are provided in a state of being spaced apart from each other by a distance 8, and constitute a part of the main body 3, and heat medium flow paths 9 and 11 are respectively formed inside them. That is, the heat medium flow paths 9 and 11 are arranged side by side in the housing 2 while being spaced apart from each other with a distance 8 therebetween.

[0026] At one end of the flow path portions 6 and 7, a communication portion 13 in which a communication flow path 12 is formed inside is connected, and it constitutes a part of the main body 3, and one ends of both heat medium flow paths 9 and 11 are communicated by this communication flow path 12. And a heat medium inflow portion 16 communicates with the other end of one heat medium flow path 9, and a heat medium outflow portion 17 communicates with the other end of the other heat medium flow path 11.

[0027] In each figure, 18 and 19 are rod-shaped electric heaters (heating elements) composed of cartridge heaters (cylindrical heaters) in the embodiment. The electric heater (electric heater 1) 18 is inserted and arranged in one heat medium flow path 9 with a space from the inner surface of the flow path portion 6, and the electric heater (electric heater 2) 19 is inserted and arranged in the other heat medium flow path 11 with a space from the inner surface of the flow path portion 7.

[0028] A control board 21 is attached to the position on the cover 4 side of each of the flow path portions 6 and 7 in the main body 3. On this control board 21, a power switching element 22 (IGBT1) for controlling the energization of the electric heater 18, a power switching element 23 (IGBT2) for controlling the energization of the electric heater 19, and a power switching element 24 (IGBT3) for adjusting the overall power of each of the electric heaters 18 and 19 are mounted. Incidentally, the plurality of power switching elements 22 to 24 are constituted by IGBTs in the embodiment.

[0029] In addition, a capacitor 26 (film capacitor) as an electronic component constituting a noise filter 25 and a choke coil 27 as a coil which is also an electronic component are mounted on the control board 21. These capacitor 26 and choke coil 27 are electronic components having larger dimensions than the power switching elements 22 to 24. And a control device 31 (Fig. 6) for controlling the electric heaters 18, 19, etc. of the heat medium heating device 1 is constituted by these power switching elements 22 to 24, capacitor 26, choke coil 27, etc.

[0030] In addition, each of the power switching elements 22 to 24 is mounted on the surface of each flow path portion 6, 7 side of the control board 21 and is attached in a heat exchange manner to the flow path portion 6. Thereby, each of the power switching elements 22 to 24 is arranged in a heat exchange relationship with the heat medium flowing in the heat medium flow path 9. Further, the power switching element 24 (specific power switching element) is arranged upstream with respect to the flow of the refrigerant than the other power switching elements 22, 23 (Fig. 3).

[0031] Furthermore, the capacitor 26 and the choke coil 27 are also mounted on the surfaces of each flow path portion 6, 7 side of the control board 21 and are inserted and arranged within the interval 8 between the flow path portion 6 (heat medium flow path 9) and the flow path portion 7 (heat medium flow path 11) (Figs. 3 to 5).

[0032] (2) Vibration-resistant structure of the capacitor 26 In the case of the embodiment, a wall portion 51 (made of metal) stands up from the main body 3 at a position corresponding to the periphery of the capacitor 26 within the interval 8 as shown in Figs. 3 to 5 and is integrally formed with the main body 3. In the case of the embodiment, this wall portion 51 is composed of a vertical wall 51A on the flow path portion 6 side, a vertical wall 51B on the communication portion 13 side continuous with one end of this vertical wall 51A, a vertical wall 51C on the flow path portion 7 side continuous with one end of this vertical wall 51B, and a vertical wall 51D connecting one end of this vertical wall 51C and the other end of the vertical wall 51A, and the control board 21 side is open.

[0033] Further, the wall portion 51 has an inner dimension sufficient to surround the periphery of the capacitor 26 with a gap therebetween. The outer surface of the vertical wall 51A is in thermally conductive contact with the outer surface of the flow path portion 6 to establish a heat exchange relationship, the outer surface of the vertical wall 51B is in thermally conductive contact with the outer surface of the communication portion 13 to establish a heat exchange relationship, and the vertical wall 51C is in thermally conductive contact with the outer surface of the flow path portion 7 to establish a heat exchange relationship.

[0034] The capacitor 26 is inserted into the wall portion 51 through the opening of the wall portion 51, and a heat dissipation material 52 is filled between the capacitor 26 and the wall portion 51. In this embodiment, the heat dissipation material 52 is made of a two-component curable resin such as an epoxy resin and has a relatively high conductivity.

[0035] When assembling the heat medium heating device 1, first, one liquid (fluidity) of the heat dissipation material 52 is injected into the wall portion 51. Then, when attaching the control board 21 to the main body 3, the capacitor 26 is inserted into the wall portion 51 and immersed in the heat dissipation material 52 injected into the wall portion 51. Next, the other liquid of the heat dissipation material 52 is injected into the wall portion 51 to cure the heat dissipation material 52. As a result, the capacitor 26 is buried in the heat dissipation material 52, and its periphery is surrounded by the heat dissipation material 52 and the wall portion 51.

[0036] As another assembling method, for example, the heat dissipation material 52 in a state where two liquids are mixed may be injected into the wall portion 51, and the capacitor 26 may be inserted into the wall portion 51 and buried in the heat dissipation material 52 before curing.

[0037] By using a two-component curable resin as the heat dissipation material 52 in this way, it becomes possible to cure it in a short time even at room temperature compared to a single-component resin. That is, by adopting a two-component curable resin as the heat dissipation material 52, the position adjustment of the capacitor 26 can be easily performed immediately after filling the heat dissipation material 52, and after curing, the joint portion between the capacitor 26 and the control board 21 can be prevented from being damaged by vibration. Therefore, the assemblability and vibration resistance can be improved. Also, by using a two-component curable resin, the holding time until curing is shortened, so that the productivity of the heat medium heating device 1 can be improved.

[0038] (3) Control device 31 Next, FIG. 6 shows the circuit block of the control device 31. The noise filter 25 described above is connected to a vehicle battery (DC power source) not shown. The power switching element 22 and the electric heater 18 are connected in series, and the power switching element 23 and the electric heater 19 are connected in series, and these two series circuits are connected in parallel. The power switching element 24 is connected in series to these parallel circuits, and a current sensor 32 is connected in series to the power switching element 24.

[0039] And the power switching elements 22 and 23 are connected to the positive electrode side of the noise filter 25, and the current sensor 32 is connected to the negative electrode side. As a result, the current flowing through the two power switching elements 22 and 23 merges and flows through the power switching element 24.

[0040] In FIG. 6, 36 is a control unit composed of a microcomputer, and drivers 37, 38, and 39 are connected to the output of this control unit 36. The driver 37 is connected to the gate of the power switching element 22, and the driver 38 is connected to the gate of the power switching element 23. Also, the driver 39 is connected to the gate of the power switching element 24.

[0041] The output of the current sensor 32 described above is input to the input of the control unit 36, and the outputs of the inlet temperature sensor 41 and the outlet temperature sensor 42 are also input. This inlet temperature sensor 41 detects the temperature of the heat medium flowing into the heat medium flow path 9 from the heat medium inlet portion 16, and the outlet temperature sensor 42 detects the temperature of the heat medium flowing out from the heat medium outlet portion 17. In the present application, the heat medium flowing in from the heat medium inlet portion 16 means the heat medium immediately before or immediately after entering the heat medium inlet portion 16, and the heat medium flowing out from the heat medium outlet portion 17 means the heat medium immediately before or immediately after exiting the heat medium outlet portion 17.

[0042] (4) Operation of the heat medium heating device 1 With the above configuration, the operation of the heat medium heating device 1 will be described below. The heat medium inlet portion 16 is connected to a heat medium circuit (not shown), and a heat medium (water in the embodiment) flows into the heat medium flow path 9 from the heat medium inlet portion 16 by a pump (not shown). The heat medium that has flowed into the heat medium flow path 9 flows into the heat medium flow path 11 through the communication flow path 12, and flows out from the heat medium outlet portion 17 to the aforementioned heat medium circuit.

[0043] On the other hand, the control unit 36 of the control device 31 switches and controls each of the power switching elements 22 to 24 by each driver 37 to 39 based on the outputs of the inlet temperature sensor 41, the outlet temperature sensor 42, and the current sensor 32. As a result, each of the electric heaters 18 and 19 is energized, and the electric heaters 18 and 19 generate heat. Therefore, the heat medium that has flowed into the heat medium flow path 9 is heated in the process of passing around the electric heater 18, and is further heated in the process of entering the heat medium flow path 11 and passing around the electric heater 19.

[0044] A heater core disposed in the HV unit of the vehicle is connected to the aforementioned heat medium circuit, and the heat medium heated by the heat medium heating device 1 is circulated to this heater core. Since the air supplied to the vehicle interior passes through the heater core, the vehicle interior is thereby heated.

[0045] The control unit 36 switches and controls the power switching elements 22 and 23 based on the temperature of the inflowing heat medium detected by the inlet temperature sensor 41 and the temperature of the outflowing heat medium detected by the outlet temperature sensor 42, and controls the energization of each of the electric heaters 18 and 19. The currents flowing through these power switching elements 22 and 23 (electric heaters 18 and 19) merge and flow to the power switching element (a specific power switching element) 24. The control unit 36 switches and controls the power switching element 24 based on this merged current value detected by the current sensor 32 to adjust the power of the entire electric heaters 18 and 19.

[0046] Here, since the currents flowing through each of the power switching elements 22 and 23 merge and flow through the power switching element 24 (a specific power switching element), the power switching element 24 generates more heat than these power switching elements 22 and 23, and has the largest amount of heat generation. However, since the power switching element 24 is arranged upstream of the other power switching elements 22 and 23 with respect to the flow of the heat medium, it exchanges heat with the heat medium having the lowest temperature that has flowed into the heat medium flow path 9.

[0047] As a result, the heat of the power switching element 24, which has the largest amount of heat generation, is smoothly transferred to the heat medium. The power switching element 24 is effectively cooled, and the temperature of the heat medium is efficiently increased by the heat of the power switching element 24. Incidentally, the heat generated by the power switching elements 22 and 23 is also transferred to the heat medium downstream of the power switching element 24, so that the power switching elements 22 and 23 are also cooled, and the temperature of the heat medium further increases.

[0048] (5) Effects of the heat medium flow paths 9 and 11 and the arrangement of the power switching elements 22 to 24 As described above, the heat medium can be efficiently heated, all of the power switching elements 22 to 24 can be maintained in an appropriate temperature range, and failures of the power switching elements 22 to 24 can be avoided.

[0049] That is, by arranging the power switching elements 22 to 24 in a heat exchange relationship with the heat medium, the heat medium can be heated by the heat generated by the power switching elements 22 to 24, and the power switching elements 22 to 24 themselves can be cooled.

[0050] Also, as described above, since the heat medium heating device 1 arranges the respective heat medium flow paths 9 and 11 so as to be spaced apart from each other, heat exchange between the two heat medium flow paths 9 and 11 is prevented. Even when detecting the temperature of the heat medium flowing in from the heat medium inlet portion 16 with the inlet temperature sensor 41 and controlling the electric heaters 18 and 19 based on the detected temperature as in the embodiment, it is possible to avoid the inconvenience of detecting an incorrect temperature.

[0051] Also, even when the electric heaters 18 and 19 are respectively arranged in the respective heat medium flow paths 9 and 11 to heat the heat medium flowing in from the heat medium inlet portion 16 and cause it to flow out from the heat medium outlet portion 17 as in the embodiment, it is possible to avoid the inconvenience of the outflowing refrigerant being cooled by the inflowing refrigerant.

[0052] (6) Effects of the Arrangement of the Capacitor 26 and the Vibration-Resistant Structure Further, a control board 21 on which electronic components constituting a control device 31 for controlling the electric heaters 18 and 19 are mounted is provided in the housing 2, and a capacitor 26 and a choke coil 27, which are electronic components constituting the noise filter 25 of the control board 21, are arranged within the interval 8 between the respective heat medium flow paths 9 and 11. Therefore, the dead space (interval 8) between the respective heat medium flow paths 9 and 11 can be effectively utilized for arranging the electronic components, and the heat medium heating device 1 can be miniaturized.

[0053] Furthermore, in the embodiment, since the capacitor 26 and the choke coil 27, which are electronic components having larger dimensions than the power switching elements 22 to 24, are arranged within the interval 8, the entire device can be effectively miniaturized. Also, even when it becomes necessary to change the capacitor 26 and the choke coil 27 according to the required specifications, they can be accommodated within the interval 8 without increasing the size of the heat medium heating device 1, thus increasing the degree of freedom in design.

[0054] Particularly in the present invention, a wall portion 51 is formed in the housing 2 so as to surround the periphery of a capacitor 26 which is an example of an electronic component, and a heat dissipation material 52 is filled between the wall portion 51 and the capacitor 26. Therefore, even in the case of a large-sized capacitor 26, the vibration resistance can be improved. As a result, it is also possible to prevent the joint portion between the capacitor 26 and the control board 21 from being damaged due to vibration, and it is extremely suitable for the vehicle-mounted type heat medium heating device 1 which requires high vibration resistance.

[0055] In addition, the heat dissipation material 52 filled between the wall portion 51 and the capacitor 26 ensures the amount of heat dissipated from the capacitor 26. Therefore, even when the capacitor 26 is enlarged and the amount of heat dissipated increases, it can be maintained in an appropriate temperature range.

[0056] In this case, in the embodiment, the vertical walls 51A, 51C, 51B constituting the wall portion 51 are in a heat exchange relationship with the flow path portions 6, 7, and the communication portion 13, and are configured to be able to exchange heat with the heat medium flowing through their heat medium flow paths 9, 11, and the communication flow path 12. As a result, in the three sides surrounded by the respective heat medium flow paths 9, 11 and the communication flow path 12, the capacitor 26 can exchange heat with the heat medium through the heat dissipation material 52 and the wall portion 51, and the capacitor 26 can be surely cooled to below the allowable temperature.

[0057] In the embodiment, the capacitor 26 is taken as an example of the electronic component. However, the present invention is not limited thereto, and the vibration resistance structure of the present invention is also effective for the choke coil 27 (electronic component).

[0058] In the embodiment, the wall portion 51 is formed integrally with the main body 3. However, the present invention is not limited thereto, and the vertical wall 51A of the wall portion 51 may be integrally formed with the flow path portion 6, the vertical wall 51B with the communication portion 13, and the vertical wall 51C with the flow path portion 7, respectively. According to such a configuration, it is possible to further improve the heat exchange property between the capacitor 26 and the heat medium.

[0059] In the embodiment, the capacitor 26 and the choke coil 27 are arranged within the interval 8. However, only the capacitor 26 may be used, or only the choke coil 27 may be used when an anti-vibration structure is applied to the choke coil 27. Furthermore, in the embodiment, the inlet temperature sensor 41 and the outlet temperature sensor 42 are provided to control the energization of the electric heaters 18 and 19. However, the control may be performed using only the inlet temperature sensor 41 or only the outlet temperature sensor 42.

[0060] Furthermore, in the embodiment, an example having two heat medium flow paths 9 and 11 has been described. However, the present invention is also effective when more heat medium flow paths are configured and arranged apart from each other. Also, in the embodiment, the power switching elements 22 to 24 are constituted by IGBTs, but they may be constituted by MOSFETs or the like.

[0061] In the embodiment, a heat medium heating device used for vehicle air conditioning has been taken as an example for description. However, the present invention is not limited thereto, and the anti-vibration structure of the present invention is effective for heat medium heating devices in various heating systems.

Explanation of Reference Numerals

[0062] 1 Heat medium heating device 2 Housing 8 Interval 9, 11 Heat medium flow paths 12 Communication flow path 16 Heat medium inlet portion 17 Heat medium outlet portion 18, 19 Electric heaters 21 Control board 22~24 Power switching elements 25 Noise filter 26 Capacitor (electronic component) 27 Choke coil (electronic component) 31 Control device 32 Current sensor 36 Control unit 41 Inlet temperature sensor 42 Outlet temperature sensor 51 Wall portion 51A~51D Vertical walls 52 Heat dissipation material

Claims

1. A vibration-resistant structure for electronic components used in a heat medium heating device including a heat medium flow path formed in a housing and an electric heater for heating a heat medium flowing through the heat medium flow path, the vibration-resistant structure being for controlling the electric heater, a wall portion formed in the housing and surrounding the periphery of the electronic components, and a heat dissipation material filled between the wall portion and the electronic components, wherein the vibration-resistant structure of the electronic components is characterized by including the above.

2. The vibration-resistant structure of the electronic components according to claim 1, wherein the heat dissipation material is a two-component curable resin.

3. The vibration-resistant structure of the electronic components according to claim 1, wherein the electronic component is a capacitor.

4. The vibration-resistant structure of the electronic components according to claim 1, wherein the electronic component is a coil.

5. At least two of the heat medium flow paths arranged in parallel in the housing, a communication flow path communicating one end portion of each heat medium flow path, a heat medium inflow portion formed at the other end portion of one of the heat medium flow paths, a heat medium outflow portion formed at the other end portion of the other heat medium flow path, the electric heater, and a control board provided in the housing on which the electronic components are mounted, wherein the heat medium flow paths are arranged spaced apart from each other, and the heat medium heating device includes the vibration-resistant structure of the electronic components according to any one of claims 1 to 4, wherein the electronic components are arranged within the interval between the heat medium flow paths.

6. The heat medium heating device according to claim 5, wherein the wall portion is capable of heat exchange with the heat medium flowing through the heat medium flow paths and the communication flow path.

7. The housing includes at least two flow path portions in which the heat medium flow path is formed inside, and a communication portion in which the communication flow path is formed inside, and the heat medium heating device according to claim 6, wherein the wall portion is integrally formed with the flow path portion and / or the communication portion.

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