Workpiece holding apparatus, processing apparatus, and article manufacturing method
The work holding device uses a support member with a shrinkable pad and check valve to create a negative pressure for secure work holding, addressing displacement issues and improving productivity.
Patent Information
- Application Number
- JP2023215053
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2025-07-02
AI Technical Summary
Existing processing devices face challenges in preventing work displacement during reception, which can lead to decreased productivity and complexity due to the need for suction mechanisms.
A work holding device with a support member featuring a shrinkable pad and a pad support portion that includes flow paths and a check valve, allowing air flow in one direction and preventing flow in the opposite direction, to create a negative pressure for secure work holding.
The solution effectively reduces work displacement by creating a suction force that securely holds the workpiece, enhancing productivity and simplifying the device configuration.
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Figure 2025098725000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a work holding device, a processing device, and an article manufacturing method.
Background Art
[0002] A processing device can be configured to receive a work conveyed by a conveying device by a plurality of lift pins. For example, the processing device can be configured to receive a work supported by a hand of the conveying device by a plurality of lift pins. However, the work may be displaced at the moment when the plurality of lift pins come into contact with the work. If the speed at which the plurality of lift pins are raised is reduced so that such displacement does not occur, it may lead to a decrease in productivity. Although Patent Document 1 describes a configuration in which a wafer is held by suction, incorporating such a configuration into a processing device requires a mechanism for controlling suction, and the overall configuration of the processing device may become complicated.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to provide an advantageous technique for reducing or preventing displacement of a work when receiving the work.
Means for Solving the Problems
[0005] One aspect of the present invention relates to a work holding device including a work holding part for holding a work and a support member that moves up and down relative to the work holding part. The support member includes a shrinkable pad having an open end that abuts against the work, and a pad support part for supporting the pad. The pad support part includes a first flow path and a second flow path that connect an internal space and an external space of the pad, and a check valve disposed in the first flow path so as to allow air to flow from the internal space toward the external space through the first flow path and to prevent air from flowing from the external space toward the internal space through the first flow path.
Advantages of the Invention
[0006] According to the present invention, a technique advantageous for reducing or preventing displacement of the work when receiving the work is provided.
Brief Description of the Drawings
[0007]
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Embodiments for Carrying Out the Invention
[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.
[0009] In the accompanying drawings and the following description, directions in a three-dimensional space are described according to the XYZ coordinate system. The X-axis, Y-axis, and Z-axis in the XYZ coordinate system are directions perpendicular to each other. A direction parallel to the X-axis may be expressed as the X direction, a direction parallel to the Y-axis as the Y direction, and a direction parallel to the Z-axis as the Z direction. The Z-axis is typically a direction parallel to the vertical direction.
[0010] FIG. 1 is a cross-sectional view schematically showing the configuration of a work holding device 100 according to an embodiment. FIG. 2 is a plan view schematically showing the configuration of the work holding device 100. FIG. 4 is a plan view showing the configuration of a transfer hand of a transfer mechanism 7. The work holding device 100 can be incorporated into a device that processes a work W. The work holding device 100 can be configured as a device that holds a work W such as a substrate. The work holding device 100 can include a work holding unit (chuck) 6 that holds the work W and one or a plurality of support members SM that move up and down relative to the work holding unit 6. Typically, the work holding device 100 can include a plurality of support members SM, but may also include a single support member SM. In the latter case, other members such as one or more support pins can be used together with the support member SM. Each support member SM can be provided at the tip of a lifting pin 5. The work holding device 100 can further include a lifting mechanism 8 that moves a plurality of lifting pins 5 up and down. The work holding device 100 can be controlled by a control unit CNT. The control unit CNT may be incorporated into a control unit provided in a processing device including the work holding device 100. The control unit CNT can be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose or dedicated computer into which a program is incorporated, or a combination of all or part of these.
[0011] The workpiece W is conveyed by the conveying mechanism 7 to the space above the workpiece holding device 100 and can be received from the conveying mechanism 7 by a plurality of lifting pins 5 (a plurality of support members SM provided at the respective tips thereof). After the conveying mechanism 7 retracts, the lifting mechanism 8 lowers the plurality of lifting pins 5, whereby the workpiece W is transferred from the plurality of lifting pins 5 (a plurality of support members SM provided at the respective tips thereof) to the workpiece holding portion 6, and the workpiece W can be held by the workpiece holding portion 6. The workpiece W can typically be subjected to a predetermined process while being held by the workpiece holding portion 6. The predetermined process can be, for example, any one of a process of transferring a pattern to the workpiece W, a process of applying a liquid to the workpiece W, a process of forming a film on the workpiece W, an annealing process for the workpiece W, a process of inspecting the workpiece W, etc., but other processes may also be possible. When the workpiece W is conveyed from the workpiece holding portion 6 to another device or position, the workpiece W is supported by the plurality of lifting pins 5 (a plurality of support members SM provided at the respective tips thereof) by the lifting mechanism 8 raising the plurality of lifting pins 5 and can be transferred to the conveying mechanism 7.
[0012] FIG. 3 is a cross-sectional view schematically showing the configuration of the support member SM. The support member SM can include a contractible pad 1 having an open end OP that contacts the workpiece W, and a pad support portion 11 that supports the pad 1. The pad 1 can have, for example, a bellows shape, but other expansion and contraction mechanisms may also be possible. The pad support portion 11 can include a first flow path FP1 and a second flow path FP2 that connect the internal space PIS and the external space OS of the pad 1. Further, the pad support portion 11 can include a check valve 2 disposed in the first flow path FP1. The check valve 2 is disposed in the first flow path FP1 so as to allow air to flow from the internal space PIS to the external space OS through the first flow path FP1 and to prevent air from flowing from the external space OS to the internal space PIS through the first flow path FP1. The pad support portion 11 can further include an orifice 3 disposed in the second flow path FP2. The orifice 3 acts to limit the flow rate of the air flowing through the second flow path FP2. In other words, the orifice 3 can limit the conductance of the second flow path FP2. The function of the orifice 3 may be provided by adjusting the cross-sectional area and length of the second flow path FP2.
[0013] The support member SM may further include a connection portion CP that connects the first flow path FP1 and the second flow path FP2, and a third flow path FP3 that connects the connection portion CP and the internal space PIS of the pad 1. The connection portion CP may be understood, for example, as a portion that connects the orifice 3 and the check valve 2. As illustrated in FIG. 3, the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2 may coincide with each other. Also, as illustrated in FIG. 3, the central axis of the third flow path FP3 may be perpendicular to the straight line including the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2.
[0014] Hereinafter, with reference to FIGS. 5, 6, 7, 8, 9, 10, and 11, the operation of the work holding device 100 will be exemplarily described through the description of the operation of the work holding device 100 receiving the work W from the transfer mechanism 7 and holding it by the work holding portion 6. Note that FIGS. 5(a), 6(a), 7(a), 8(a), 9(a), 10(a), and 11(a) schematically show the state of the work holding device 100. Also, FIGS. 5(b), 6(b), 7(b), 8(b), 9(b), 10(b), and 11(b) schematically show the state of the support member SM. Further, in FIGS. 5(b), 6(b), 7(b), 8(b), 9(b), 10(b), and 11(b), the height H of the lower surface of the work W when the work W is transferred to the work holding device 100 by the transfer mechanism 7 is shown for reference.
[0015] First, as schematically shown in FIG. 5, with a plurality of support members SM not protruding from the upper surface of the work holding portion 6, the work W is transferred by the transfer mechanism 7 to the space above the work holding device 100.
[0016] Next, as schematically shown in FIGS. 6, 7, 8, and 9, the lifting mechanism 8 raises the plurality of support members SM by raising the lifting pins 5. As a result, first, as schematically shown in FIG. 6, the pads 1 of the plurality of support members SM come into contact with the lower surface of the work W. Next, as schematically shown in FIG. 7, the pin 5 continues to rise while the open end OP of the pad 1 is blocked by the work W. On the other hand, since the work W tends to stay in place due to inertia, the pad 1 contracts and the volume of the internal space PIS decreases. At this time, the air in the internal space PIS is discharged through the first flow path FP1 and the second flow path FP2. Next, as schematically shown in FIG. 8, when the pad 1 is completely contracted, the work W rises. Next, as schematically shown in FIG. 9, the work W moves upward while the open end OP of the pad 1 is blocked by the work W. The lifting mechanism 8 can stop the ascent of the plurality of support members SM after the pads 1 contact the work W. However, even if the ascent of the plurality of support members SM is stopped, the work W can still rise slightly due to inertia. When the open end OP of the pad 1 is blocked by the work W and the work W moves upward due to inertia with the ascent of the lifting pin 5 by the lifting mechanism 8 stopped, the pad 1 can expand and the volume of the internal space PIS of the pad 1 can increase. As a result, the internal space PIS of the pad 1 can become negative pressure and an attractive force can act on the work W. In this state, since the internal space PIS is negative pressure, the check valve 2 is in a closed state and the inflow of air from the external space OS into the internal space PIS is blocked.
[0017] Note that the flow resistance of the second flow path FP2 (orifice 3) can be adjusted or configured so that the internal space PIS of the pad 1 becomes negative pressure when the internal space PIS of the pad 1 increases while the work W moves upward. In other words, the flow resistance of the second flow path FP2 (orifice 3) can be adjusted so that the decrease in the pressure of the internal space PIS due to the increase in the internal space PIS is greater than the increase in the air flowing into the internal space PIS through the second flow path FP2. To facilitate such adjustment, a variable orifice may be used as the orifice 3 for releasing the vacuum in the internal space PIS.
[0018] Summarizing the above, when the lifting mechanism 8 raises the support member SM, the pad 1 comes into contact with the workpiece W, and the workpiece W moves upward while the open end OP of the pad 1 is blocked by the workpiece W. Then, as the workpiece W moves upward while the open end OP of the pad 1 is blocked by the workpiece W, the volume of the internal space PIS of the pad 1 increases, whereby the internal space PIS becomes a negative pressure and a suction force acts on the workpiece W. Therefore, the separation of the workpiece W from the pad 1 is suppressed.
[0019] Next, as schematically shown in FIG. 10, the transfer mechanism 7 retracts. Then, the lifting mechanism 8 lowers the plurality of lifting pins 5, causing the plurality of support members SM to lower, and the workpiece W is transferred from the plurality of support members SM to the workpiece holding portion 6, and the pad 1 separates from the workpiece W. At this stage, the negative pressure in the internal space PIS within the plurality of support mechanisms SM has returned to atmospheric pressure due to the inflow of air from the second flow path FP2 into the internal space PIS. Thus, the plurality of support mechanisms SM do not suck the workpiece W, and the workpiece W is held by the workpiece holding portion 6. That is, after the operation in which the lifting mechanism 8 raises the plurality of support members SM and the pad 1 comes into contact with the workpiece W, the workpiece W is supported by the pad 1, and then, when the lifting mechanism 8 lowers the support member SM, the workpiece W is held by the workpiece holding portion 6. The workpiece W can typically be subjected to a predetermined process while being held by the workpiece holding portion 6.
[0020] When the process on the workpiece W is completed, the lifting mechanism 8 raises the plurality of lifting pins 5. As a result, the workpiece W is supported by the plurality of lifting pins 5 (the plurality of support members SM provided at the respective tips thereof), and then, the workpiece W can be transferred to the transfer mechanism 7.
[0021] Note that instead of the lifting mechanism 8 raising and lowering the plurality of lifting pins 5 (and the plurality of support members SM), a lifting mechanism (not shown) may raise and lower the workpiece holding portion 6.
[0022] FIG. 12 illustrates an example configuration of an exposure apparatus EXP as a processing apparatus incorporating a work holding device 100. The exposure apparatus EXP may include a projection optical system PO that projects the pattern of the reticle R onto the work W so that the work W held by the work holding device 100 is exposed. The exposure apparatus EXP may also include a reticle holding mechanism RS that holds the reticle R, and an illumination optical system IL that illuminates the reticle R. The exposure apparatus EXP may also include a drive mechanism WDM that drives the work holding device 100.
[0023] The processing apparatus may be configured to perform other processes. For example, the processing apparatus may be a coating apparatus that applies a liquid to a work, a developing apparatus that develops a work on which a pattern has been transferred by an exposure apparatus, a film forming apparatus that forms a film on a work, an annealing apparatus that performs an annealing process on a work, or an inspection apparatus that inspects a work. The film forming apparatus may be, for example, an imprint apparatus, a CVD apparatus, a sputtering apparatus, a planarization apparatus, or a vapor deposition apparatus (e.g., a vapor deposition apparatus for manufacturing an OLED).
[0024] The article manufacturing method using the above processing apparatus may include a first processing step of processing a work by the processing apparatus, and a second processing step of further processing the work that has undergone the first processing step to obtain an article. For example, when the processing apparatus is configured as an exposure apparatus, the article manufacturing method may include an exposure step of exposing a work by the exposure apparatus, a developing step of developing the work exposed in the exposure step, and a processing step of processing the work that has undergone the developing step to obtain an article.
[0025] This specification and the accompanying drawings include the following disclosures. (Item 1) A work holding device including a work holding portion that holds a work and a support member that moves up and down relative to the work holding portion, The support member includes a contractible pad having an open end that contacts the work, and a pad support portion that supports the pad, The pad support portion, a first flow path and a second flow path that connect an internal space and an external space of the pad, A check valve disposed in the first flow path to allow air to flow from the internal space toward the external space through the first flow path and to prevent air from flowing from the external space toward the internal space through the first flow path, characterized by a work holding device. (Item 2) The pad support portion further includes an orifice disposed in the second flow path. The work holding device according to item 1, characterized by the above. (Item 3) The pad has a bellows shape. The work holding device according to item 1, characterized by the above. (Item 4) The work holding device further includes a lifting mechanism for raising and lowering the support member. When the lifting mechanism raises the support member, the pad abuts against the work, and the work moves upward while the open end of the pad is blocked by the work. When the work moves upward while the open end of the pad is blocked by the work, the volume of the internal space increases, thereby causing the internal space to have a negative pressure and an attractive force to act on the work. The work holding device according to item 1, characterized by the above. (Item 5) The work is suppressed from separating from the pad by the attractive force acting on the work. The work holding device according to item 4, characterized by the above. (Item 6) The lifting mechanism stops raising the support member after the pad abuts against the work. The work holding device according to item 4 or 5, characterized by the above. (Item 7) After the lifting mechanism raises the support member and the pad abuts against the work, the work is supported by the pad. Then, when the lifting mechanism lowers the support member, the work is held by the work holding portion. The work holding device according to any one of Items 4 to 6, characterized in that... (Item 8) The support member further includes a connection portion connecting the first flow path and the second flow path, and a third flow path connecting the connection portion and the internal space of the pad. The work holding device according to any one of Items 1 to 7, characterized in that... (Item 9) The central axis of the first flow path coincides with the central axis of the second flow path. The work holding device according to Item 8, characterized in that... (Item 10) The central axis of the third flow path is perpendicular to the straight line including the central axis of the first flow path and the central axis of the second flow path. The work holding device according to Item 9, characterized in that... (Item 11) A processing device for processing a work, characterized in that it comprises the work holding device according to any one of Items 1 to 10, which is arranged to hold the work. The processing device according to Item 11, further comprising a projection optical system that projects the pattern of the original plate onto the work so that the work held by the work holding device is exposed. (Item 12) The processing device according to Item 11, further comprising a projection optical system that projects the pattern of the original plate onto the work so that the work held by the work holding device is exposed. The processing device according to Item 11, characterized in that... (Item 13) A first processing step of processing a work by the processing device according to Item 11, and a second processing step of further processing the work that has undergone the first processing step to obtain an article. The article manufacturing method characterized by including... A first processing step of processing a work by the processing device according to Item 11, and a second processing step of further processing the work that has undergone the first processing step to obtain an article. (Item 14) An exposure step of exposing a work by the processing device according to Item 12, a development step of developing the work exposed in the exposure step, and a processing step of processing the work that has undergone the development step to obtain an article. The article manufacturing method characterized by including... An exposure step of exposing a work by the processing device according to Item 12, a development step of developing the work exposed in the exposure step, and a processing step of processing the work that has undergone the development step to obtain an article. The article manufacturing method characterized by including...
[0026] The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.
Explanation of Reference Numerals
[0027] 1: Pad, 2: Check valve, 3: Orifice, : Lifting pin, 6: Work holding part, 7: Conveying mechanism, 8: Lifting mechanism, 11: Pad support part, 100: Work holding device, W: Work, SM: Support member, CNT: Control part, FP1: First flow path, FP2: Second flow path, FP3: Third flow path
Claims
1. A work holding device comprising a work holding part for holding a work and a support member that moves up and down relative to the work holding part, wherein the support member includes a shrinkable pad having an open end that abuts against the work, and a pad support part for supporting the pad, the pad support part, a first flow path and a second flow path that connect the internal space and the external space of the pad, a check valve disposed in the first flow path that allows air to flow from the internal space to the external space through the first flow path and prevents air from flowing from the external space to the internal space through the first flow path, characterized in that it is a work holding device.
2. The pad support part further includes an orifice disposed in the second flow path, characterized in that it is the work holding device according to Claim 1.
3. The pad has a bellows shape, characterized in that it is the work holding device according to Claim 1.
4. further comprising a lifting mechanism for lifting and lowering the support member, wherein when the lifting mechanism raises the support member, the pad abuts against the work, and the work moves upward while the open end of the pad is blocked by the work, when the work moves upward while the open end of the pad is blocked by the work, the volume of the internal space increases, whereby the internal space becomes a negative pressure and a suction force acts on the work, characterized in that it is the work holding device according to Claim 1.
5. the work is suppressed from separating from the pad by the action of the suction force on the work, characterized in that it is the work holding device according to Claim 4.
6. the lifting mechanism stops the upward movement of the support member after the pad abuts against the work, characterized in that it is the work holding device according to Claim 4.
7. after the lifting mechanism raises the support member and the pad abuts against the work, the work is supported by the pad, and then, when the lifting mechanism lowers the support member, the work is held by the work holding part, characterized in that it is the work holding device according to Claim 4.
8. the support member further includes a connecting part that connects the first flow path and the second flow path, and a third flow path that connects the connecting part and the internal space of the pad, The work holding device according to claim 1, characterized in that...
9. The central axis of the first flow path and the central axis of the second flow path coincide with each other. The work holding device according to claim 8, characterized in that...
10. The central axis of the third flow path is perpendicular to the straight line including the central axis of the first flow path and the central axis of the second flow path. The work holding device according to claim 9, characterized in that...
11. A processing device for processing a work, The processing device is characterized by comprising the work holding device according to any one of claims 1 to 10, which is arranged to hold the work.
12. The processing device further comprises a projection optical system that projects the pattern of the original plate onto the work so that the work held by the work holding device is exposed. The processing device according to claim 11, characterized in that...
13. A first processing step of processing a work by the processing device according to claim 11, A second processing step of further processing the work that has undergone the first processing step to obtain an article. An article manufacturing method characterized by including the above.
14. An exposure step of exposing a work by the processing device according to claim 12, A development step of developing the work exposed in the exposure step, A processing step of processing the work that has undergone the development step to obtain an article. An article manufacturing method characterized by including the above.
Citation Information
Patent Citations
Wafer suction jig
JP1994029142U