Chip holding device, chip holding method, and semiconductor device manufacturing equipment

Abstract

To provide a chip holding device that holds and transports chips in a non-contact manner while suppressing chip misalignment.SOLUTION: A chip holding device 10 comprises: a holding jig 12 having a holding surface 18 that holds a chip 100 in a non-contact manner, and a vibration source 30 that applies ultrasonic vibrations to the holding surface 18 to generate a holding force to hold the chip 100 on the holding surface 18; a moving mechanism 40 that moves the holding surface 18 laterally in a direction that intersects the direction of gravity; and an oscillating mechanism 46 that tilts the holding surface 18 in response to acceleration of the lateral movement of the holding surface 18.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This specification discloses a chip holding device that holds a chip in a non-contact manner, a chip holding method, and a manufacturing device for semiconductor devices.

Background Art

[0002] In recent years, in order to achieve further miniaturization and higher density of semiconductor devices, there has been a demand for a chip holding device that holds a chip in a non-contact manner. In response to such demands, in some cases, a chip holding device that holds a semiconductor chip in a non-contact manner has been proposed. According to such a technique, chipping and contamination of the chip can be prevented.

[0003] For example, Patent Document 1 discloses a chip holding device having a chip holder that holds a chip in a non-contact manner by utilizing the ultrasonic squeeze effect. In Patent Document 1, ultrasonic vibration is applied to the holding surface of the chip holder to form a squeeze film between the holding surface and the chip. Due to the squeeze film, an ultrasonic holding force that tries to stay on the surface of the squeeze film acts on the chip.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, such a chip holding device transports the chip by moving the chip holder while the chip is held. When the chip holder moves laterally in a direction intersecting with gravity, an inertial force due to acceleration (including negative acceleration) acts on the chip held by the chip holder. Then, due to this inertial force, the chip is temporarily displaced with respect to the chip holder.

[0006] Due to such misalignment of the chip, there was a risk that the chip would fall off the holding surface. Also, even if it did not fall off, the chip would vibrate in the plane direction for a certain period of time after the movement stopped, which could cause a delay before proceeding to the next process.

[0007] Therefore, this specification discloses a chip holding device, a chip holding method, and a semiconductor device manufacturing apparatus that hold and transfer the chip non - contact while suppressing misalignment of the chip.

Means for Solving the Problem

[0008] The chip holding device disclosed in this specification includes a holder having a holding surface for holding the chip non - contact, and a vibration source for applying ultrasonic vibration to the holding surface to generate a holding force for holding the chip on the holding surface, a moving mechanism for laterally moving the holding surface in a direction intersecting the gravitational direction, and a swinging mechanism for tilting the holding surface in response to the acceleration of the lateral movement of the holding surface.

[0009] In this case, the swinging mechanism may tilt the holding surface so that the resultant vector of the inertial force acting on the chip due to the acceleration of the lateral movement of the holding surface and the gravitational force acting on the chip is in a direction perpendicular to the holding surface and directed from the chip toward the holding surface.

[0010] Furthermore, a controller may be provided. The swinging mechanism has a power source for outputting power for tilting the holding surface. The controller stores the speed profile of the lateral movement in advance and may perform feed - forward control of the power source based on the speed profile.

[0011] The swinging mechanism may be connected to the holder and include a pendulum that tilts together with the holder.

[0012] In this case, the pendulum has a weight at its end, and the center of gravity of the pendulum may be located on the opposite side of the holding surface across the rotation center of the holding surface.

[0013] Further, a manufacturing apparatus for semiconductor devices may include the above-described chip holding apparatus.

[0014] The chip holding method disclosed in this specification is characterized in that, while the chip is held in a non-contact manner on the holding surface of a holder, the holder is laterally moved in a direction intersecting the gravitational direction, and when the lateral movement is performed, the holding surface is tilted according to the acceleration of the lateral movement so as to suppress the deviation of the chip with respect to the holding surface caused by inertial force.

Advantages of the Invention

[0015] According to the technology disclosed in this specification, by tilting the holding surface during acceleration, the positional deviation due to inertial force can be suppressed by gravity. As a result, while suppressing the positional deviation of the chip, the chip can be held and transported in a non-contact manner.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0017] The configuration of the chip holding device 10 will be described below with reference to the drawings. FIG. 1 is a diagram showing the configuration of the chip holding device 10. This chip holding device 10 is a device that holds and conveys the semiconductor chip 100 in a non-contact manner, and is incorporated into, for example, a manufacturing device or an inspection device of a semiconductor device.

[0018] As shown in FIG. 1, the chip holding device 10 includes a chip holder 12, a moving mechanism 40, a swinging mechanism 46, a vibration source 30, a suction source 36, and a controller 50. The chip holder 12 holds the semiconductor chip 100 in a non-contact manner. The chip holder 12 has a substantially plate-shaped holding plate 16 and a main body 14. The end face of the holding plate 16 functions as a holding surface 18 for holding the semiconductor chip 100. A suction hole 22 communicating with the suction source 36 described later is formed at the center of the holding surface 18. The main body 14 extends axially from the holding plate 16. A suction path 24 communicating the suction hole 22 and the suction source 36 is formed in the main body 14. Further, the vibration source 30 is incorporated in the main body 14. The main body 14 may function as a horn that amplifies the ultrasonic vibration generated by the vibration source 30 and transmits it to the holding surface 18.

[0019] The position and posture of the chip holder 12 are appropriately changed by the moving mechanism 40 and the swinging mechanism 46. The moving mechanism 40 has a power source 42 and is an actuator that moves the chip holder 12 at least in a direction intersecting the gravitational direction. In this example, the moving mechanism 40 moves the chip holder 12 in a total of three axial directions: the x-axis direction, the y-axis direction, and the z-axis direction. Note that the x-axis and the y-axis are horizontal axes, and the z-axis is a vertical axis. Hereinafter, the movement in a direction intersecting the gravitational direction (that is, the movement in the x-axis direction and the y-axis direction) will be referred to as "lateral movement". The power source 42 is, for example, a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination thereof. The moving mechanism 40 is electrically controlled by the controller 50 described later.

[0020] The swing mechanism 46 is an actuator that swings the chip holder 12 around a swing axis 20 extending in the horizontal direction and tilts the holding surface 18. In FIG. 1, one swing axis 20 is shown, but the swing axes 20 may be provided one by one in a direction orthogonal to each of the horizontal movement axes of the movement mechanism 40. For example, the swing mechanism 46 may have a swing axis 20 parallel to the y-axis and a swing axis 20 parallel to the x-axis. The swing mechanism 46 has a power source 48. The power source 48 is, for example, a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination thereof. The swing mechanism 46 is electrically controlled by a controller 50.

[0021] The vibration source 30 generates ultrasonic vibrations and has, for example, an ultrasonic vibration element 32 and an AC power source 34. The ultrasonic vibration element 32 generates longitudinal vibrations upon receiving a drive signal that is a voltage signal. This ultrasonic vibration element 32 has, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage, and is a bolt-clamped Langevin type vibrator (commonly known as BLT or BL vibrator) in which the PZT is sandwiched between metal blocks and clamping pressure is applied with bolts. The AC power source 34 applies an alternating voltage having a frequency corresponding to a predetermined resonance frequency to the ultrasonic vibration element 32.

[0022] By driving the vibration source 30, the holding surface 18 vibrates ultrasonically in the axial direction. Then, due to the ultrasonic vibration of the holding surface 18, an ultrasonic squeeze effect occurs between the holding surface 18 and a plane (for example, the end face of the semiconductor chip 100) that is close to and faces the holding surface 18. And due to this ultrasonic squeeze effect, the semiconductor chip 100 is held on the holding surface 18 while being in a state separated from the holding surface 18, which will be described later.

[0023] The suction source 36 generates a negative pressure and has, for example, an air pump or the like. The suction source 36 communicates with the suction path 24, and when the suction source 36 is driven, a negative pressure acts on the suction holes 22, generating a suction force that attracts the semiconductor chip 100 to the holding surface 18.

[0024] The controller 50 controls the driving of the electrical elements of the chip holding device 10. Physically, this controller 50 is a computer having a processor 52 and a memory 54. In FIG. 1, the controller 50 is illustrated as a single computer, but the controller 50 may be configured by combining a plurality of physically separated computers.

[0025] This controller 50 controls the driving of the vibration source 30 and the suction source 36 so that the holding surface 18 can hold the semiconductor chip 100 in a non-contact manner. This will be described with reference to FIG. 2. FIG. 2 is a schematic diagram showing the principle of holding the semiconductor chip 100 in a non-contact manner.

[0026] As described above, when an alternating voltage is applied to the ultrasonic vibration element 32, the holding surface 18 vibrates ultrasonically. In a state where this ultrasonic vibration occurs, when the semiconductor chip 100 is brought close to the holding surface 18, an ultrasonic squeeze effect occurs between the holding surface 18 and the semiconductor chip 100. The ultrasonic squeeze effect is an effect in which when one of two flat plates facing each other through a minute gap is vibrated, a pressure higher than the outside is generated in the gap due to the influence of the viscosity in the gap. When this ultrasonic squeeze effect occurs, a squeeze film Sf is formed.

[0027] Due to the pressure difference, a force acts on the semiconductor chip 100 to try to stay on the surface of this squeeze film Sf. The force generated by this squeeze film Sf becomes the holding force for holding the semiconductor chip 100. Hereinafter, the holding force caused by the squeeze film Sf is referred to as the "ultrasonic holding force". The ultrasonic holding force occurs in both the direction perpendicular to and parallel to the holding surface 18 (i.e., the plane direction). That is, when the squeeze film Sf is formed, a force acts on the semiconductor chip 100 to move away from the holding surface 18 in the thickness direction, that is, a force in the direction of floating from the holding surface 18. Also, when the squeeze film Sf is formed, the semiconductor chip 100 tries to stay within the vibration plane. Therefore, as shown in the lower figure of FIG. 2, even if the semiconductor chip 100 is temporarily displaced in the plane direction under an external force, the semiconductor chip 100 moves in the plane direction so that its entire body is positioned within the vibration plane and tries to return to a state facing the holding surface 18.

[0028] In this example, in order to assist such an ultrasonic holding force, a suction force due to negative pressure is further generated on the holding surface 18. The controller 50 controls the driving of the suction source 36 and the vibration source 30 so that the suction force, the ultrasonic holding force, and the gravitational force acting on the semiconductor chip 100 are balanced in a state where the semiconductor chip 100 floats from the holding surface 18.

[0029] The controller 50 transports the semiconductor chip 100 by moving the chip holder 12 that holds the semiconductor chip 100. With the movement of this chip holder 12, the position of the semiconductor chip 100 with respect to the holding surface 18 may shift. This will be described with reference to FIG. 3. FIG. 3 is a diagram showing the state of the positional deviation of the semiconductor chip 100 due to inertial force. The graph shown in FIG. 3 is the velocity profile when the chip holder 12 moves horizontally.

[0030] In the example of FIG. 3, the states of the chip holder 12 transition in the order of the stop state S1, the acceleration state S2, the constant speed state S3, the deceleration state S4, and the stop state S5. In the stop state S1, the semiconductor chip 100 faces the holding surface 18 by ultrasonic holding force. Then, when the chip holder 12 moves horizontally while accelerating in the horizontal direction, an inertial force Fi in the direction opposite to the direction of the horizontal movement (the right direction of the paper surface in the case of FIG. 3) is generated on the semiconductor chip 100. Receiving this inertial force Fi, the semiconductor chip 100 is temporarily displaced in the plane direction with respect to the holding surface 18.

[0031] After that, when the constant speed state S3 is reached and the inertial force Fi disappears, the semiconductor chip 100 returns to the position facing the holding surface 18 by ultrasonic holding force. Subsequently, when the deceleration state S4 is reached, again, the inertial force Fi acts on the semiconductor chip 100, and the semiconductor chip 100 is displaced in the plane direction with respect to the holding surface 18. In this case, the inertial force Fi is in the same direction as the horizontal movement direction. When the chip holder 12 reaches the complete stop state S5, the inertial force disappears, and the semiconductor chip 100 returns to the position facing the holding surface 18 by ultrasonic holding force.

[0032] Here, when the inertial force Fi is large, during the horizontal movement, the positional displacement of the semiconductor chip 100 becomes large, and there is a risk that the semiconductor chip 100 may fall off the chip holder 12. Therefore, there is a problem that the acceleration of the horizontal movement cannot be increased, and it takes time for the movement of the semiconductor chip 100.

[0033] Even when the semiconductor chip 100 does not fall off, if the semiconductor chip 100 is misaligned, it will cause an increase in processing time. For example, consider the case of moving the semiconductor chip 100 held by the chip holder 12 to a predetermined inspection position (such as directly above the inspection camera). In this case, the chip holder 12 moves to the inspection position and stops. Immediately after this stop, the semiconductor chip 100 vibrates in the plane direction until the inertial force Fi is consumed. Therefore, the inspection process cannot be started until the vibration of the semiconductor chip 100 in the plane direction stops, and the time required for the inspection becomes longer. Also, as another form, consider the case of delivering the semiconductor chip 100 held by the chip holder 12 to a bonding tool. In this case as well, after the chip holder 12 moves to the delivery position, the semiconductor chip 100 cannot be delivered to the bonding tool until the vibration of the semiconductor chip 100 in the plane direction stops. As a result, in the manufacture of semiconductor devices, it causes an increase in lead time.

[0034] Therefore, in order to suppress such misalignment of the semiconductor chip 100, in this example, the holding surface 18 is tilted according to the acceleration of the lateral movement of the holding surface 18 (including negative acceleration). This will be described with reference to FIG. 4. FIG. 4 is a schematic diagram showing the state of swinging of the chip holder 12. The graph in FIG. 4 is the same as the graph in FIG. 3 and is the speed profile when the chip holder 12 moves horizontally. Also, in FIG. 4, the state of the chip holder 12 transitions in the order of the stop state S1, the acceleration state S2, the constant speed state S3, the deceleration state S4, and the stop state S5.

[0035] As is clear from FIG. 4, in this example, when the chip holder 12 is in the acceleration state S2 and the deceleration state S4, the chip holder 12 is swung by the swinging mechanism 46 according to the acceleration force, and the holding surface 18 is tilted.

[0036] At this time, the controller 50 causes the inclination angle θ such that the resultant vector Fc of the inertial force Fi and the gravitational force Fg acting on the semiconductor chip 100 is perpendicular to the holding surface 18 and is directed from the semiconductor chip 100 toward the holding surface 18 as shown in FIG. 4. With such a configuration, a force directed toward the holding surface 18 acts on the semiconductor chip 100, so that positional deviation due to the inertial force Fi can be effectively prevented. As a result, the acceleration of the lateral movement of the chip holder 12 can be increased, and immediately after the lateral movement stops, the next process can proceed. As a result, the processing time for the semiconductor chip 100 can be shortened.

[0037] Note that when the semiconductor chip 100 is the same, the magnitude and direction of the gravitational force Fg acting on the semiconductor chip 100 are unchanged. Therefore, in order to obtain the resultant vector Fc in an appropriate direction, the larger the inertial force Fi (that is, the larger the absolute value of the acceleration), the larger the inclination angle θ should be.

[0038] The controller 50 may store in advance the velocity profile of the chip holder 12 and the change profile of the inclination angle θ corresponding to the velocity profile, and control the driving of the swing mechanism 46 according to the change profile of the inclination angle θ. Alternatively, the controller 50 may calculate in real time the acceleration of the lateral movement of the chip holder 12 and the inclination angle θ corresponding to the acceleration, and control the driving of the swing mechanism 46. The acceleration may be calculated, for example, by detecting the moving position of the chip holder 12 with a sensor or the like and based on the obtained moving position.

[0039] In any case, by tilting the holding surface 18 according to the acceleration of the chip holder 12, and thus the inertial force Fi acting on the semiconductor chip 100, positional deviation of the semiconductor chip 100 with respect to the holding surface 18 can be effectively prevented.

[0040] Incidentally, in the above description, the inclination of the holding surface 18 is electrically controlled by the controller 50. However, the inclination of the holding surface 18 may be controlled by a mechanical mechanism. For example, as shown in FIG. 5, a pendulum 60 may be connected to the chip holder 12, and the inclination of the holding surface 18 may be controlled by the pendulum 60. In this case, the pendulum 60 is attached to the opposite side of the holding surface 18 with the swing axis 20 interposed therebetween. A weight 62 is attached to the end of the pendulum 60, and the center of gravity 64 of the pendulum 60 is located below the swing axis 20. When the chip holder 12 moves laterally while accelerating, the weight 62 of the pendulum 60 swings in the direction opposite to the acceleration direction. Due to the influence of this pendulum 60, the chip holder 12 swings about the swing axis 20 in the direction opposite to the weight 62. As a result, the holding surface 18 inclines according to the acceleration, and the positional deviation of the semiconductor chip 100 with respect to the holding surface 18 is prevented.

[0041] Furthermore, heretofore, the holding surface 18 has been described as having a substantially flat shape. However, if the semiconductor chip 100 can be held in a non-contact manner, the form of the holding surface 18 may be appropriately changed. For example, as shown in FIG. 6, a positioning recess 28 and an air flow forming groove 26 may be provided on the holding surface 18. FIG. 6 is an axial view of the holding surface 18. In FIG. 6, the diagonally hatched portion indicates a recess that does not penetrate the holding plate 16, and the cross-hatched portion indicates a hole that penetrates the holding plate 16.

[0042] The positioning recess 28 has substantially the same shape as the outer shape of the semiconductor chip 100. In the example of FIG. 6, since the semiconductor chip 100 is a square with one side of about L1, the shape of the inner peripheral edge of the positioning recess 28 is also a square with one side of about L1.

[0043] The operation of such positioning recesses 28 will be described with reference to FIG. 7. FIG. 7 is an image diagram showing the operation of the positioning recesses 28. Note that in FIG. 7, the illustration of the airflow forming grooves 26 is omitted. When the positioning recesses 28 are formed, the positioning accuracy of the semiconductor chip 100 in the plane direction is improved compared to the case where they are not formed. The principle by which such an effect is obtained is presumably that the amplitude of the ultrasonic vibration changes abruptly with the positioning recesses 28 as the boundary.

[0044] That is, when the positioning recesses 28 are present, it is presumed that the amplitude of the ultrasonic vibration generated on the holding surface 18 changes abruptly with the positioning recesses 28 as the boundary. As a result, the ultrasonic holding force generated due to the ultrasonic vibration also changes abruptly with the positioning recesses 28 as the boundary. In such a case, as shown in FIG. 7, when the semiconductor chip 100 is displaced in the plane direction with respect to the holding surface 18, the ultrasonic holding force acting on the semiconductor chip 100 becomes unbalanced left and right. The semiconductor chip 100 moves in the plane direction in order to eliminate this force imbalance, so that the displacement of the semiconductor chip 100 in the plane direction is automatically corrected, that is, self-aligned. As a result, by providing the positioning recesses 28, the positioning accuracy of the semiconductor chip 100 can be improved.

[0045] Next, the airflow forming grooves 26 will be described. The airflow forming grooves 26 are grooves connected to the suction source 36. The shape of the airflow forming grooves 26 is not particularly limited as long as it is connected to the suction holes 22. In this example, the airflow forming grooves 26 include four lines extending radially or in a cross shape from the suction holes 22 and a substantially rectangular line surrounding the four lines.

[0046] The operation of such airflow forming grooves 26 will be described with reference to FIG. 8. FIG. 8 is an image diagram showing the operation of the airflow forming grooves 26. Note that in FIG. 8, the illustration of the positioning recesses 28 is omitted. When the airflow forming grooves 26 are formed, the airflow in the plane direction flowing between the semiconductor chip 100 and the holding surface 18 accelerates and stabilizes.

[0047] That is, when the suction force by the suction source 36 is generated while the semiconductor chip 100 is levitated by the ultrasonic squeeze effect, an airflow in the plane direction and toward the center is generated in the levitation gap. Here, when there is no airflow formation groove 26, the airflow in the plane direction toward the center is affected by fluid viscosity, has a low speed, and is likely to become unstable. Further, the suction force acts locally only in the vicinity of the suction hole 22. In this case, even if the semiconductor chip 100 has a displacement in the plane direction, it is difficult for the semiconductor chip 100 to move in the plane direction, and it is difficult to self-correct the displacement.

[0048] On the other hand, as shown in FIG. 8, when the airflow formation groove 26 is formed, in the vicinity of the airflow formation groove 26, the thickness of the gap between the semiconductor chip 100 and the holding surface 18 increases, and the influence of the fluid viscosity acting on the entire airflow decreases. As a result, the speed of the airflow in the plane direction increases, and the airflow in the plane direction becomes stable. Such a stable airflow in the plane direction applies a force to the semiconductor chip 100 such that the center of the semiconductor chip 100 approaches the suction hole 22 (and thus the center of the holding surface 18). Thereby, the semiconductor chip 100 is automatically positioned with respect to the holding surface 18. Further, by forming the airflow formation groove 26, the peak of the suction force generated in the vicinity of the suction hole 22 can be reduced, and the suction force can be dispersed in the plane direction. Thereby, the semiconductor chip 100 becomes easy to move in the plane direction, and it becomes easy to self-correct the displacement in the plane direction. Note that the forms of the positioning recess 28 and the airflow formation groove 26 described here are examples and may be changed as appropriate.

[0049] Next, a manufacturing apparatus 70 of a semiconductor device having such a chip holding device 10 will be described. FIG. 9 is a diagram showing an example of the manufacturing apparatus 70 having the chip holding device 10. The manufacturing apparatus 70 in FIG. 9 is an apparatus for manufacturing a semiconductor device by bonding one or more semiconductor chips 100 to a substrate 110.

[0050] This manufacturing apparatus 70 has a chip supply source 72, a pickup section 76, and a bonding section 80. The chip supply source 72 is provided with semiconductor chips 100 attached to a dicing tape 74. The pickup section 76 has a push-up pin that pushes up the semiconductor chips 100 attached to the dicing tape 74 from below, and a pickup collet 78 that picks up the pushed-up semiconductor chips 100. In this example, the above-described chip holding device 10 is used as this pickup collet 78.

[0051] The semiconductor chips 100 are attached to the dicing tape 74 in a posture in which the surface to be joined to the substrate 110, that is, the joining surface (thick line portion in FIG. 9), faces upward. The chip holder 12 of the pickup collet 78 non-contactly holds this joining surface with the holding surface 18.

[0052] When the pickup collet 78 receives the semiconductor chips 100 from the dicing tape 74, it rotates 180 degrees about a specified rotation axis. As a result, the holding surface 18 changes from a downward state to an upward state. Also during this rotational movement, the controller 50 increases at least one of ultrasonic energy or suction force during the rotational movement more than when stationary so that the semiconductor chips 100 can be appropriately held.

[0053] After rotating 180 degrees, the pickup collet 78 moves laterally to a predetermined transfer position. During this lateral movement, the controller 50 swings the pickup collet 78 according to the acceleration and tilts the holding surface 18.

[0054] The bonding section 80 has a stage 82 on which the substrate 110 is placed, and a bonding head 84 that holds and transports the semiconductor chips 100. The bonding head 84 has a bonding tool 86. The bonding tool 86 sucks and holds the semiconductor chips 100 at its end face and transports the semiconductor chips 100. The above-described chip holding device 10 may be used as this bonding head 84.

[0055] As shown in FIG. 9, the bonding tool 86 receives the semiconductor chip 100 from the pickup collet 78 in the upward posture, and sucks and holds the surface of the semiconductor chip 100 opposite to the bonding surface. Further, after receiving the semiconductor chip 100 from the pickup collet 78, the bonding tool 86 laterally moves to directly above a predetermined bonding position. At this time, the controller 50 may swing the bonding tool 86 according to the acceleration of the bonding tool 86. Thereafter, the bonding tool 86 presses the semiconductor chip 100 against the substrate 110 and bonds the semiconductor chip 100 to the substrate 110. By bonding the required number of semiconductor chips 100 to one substrate 110, a semiconductor device is manufactured.

[0056] Here, as is clear from the above description, the pickup collet 78 and the bonding tool 86 swing according to the acceleration when moving laterally. Thereby, the positional deviation of the semiconductor chip 100 with respect to the holding surface 18 is effectively prevented, and the dropping and vibration of the semiconductor chip 100 are effectively prevented. As a result, the acceleration of the lateral movement of the semiconductor chip 100 can be increased, and since the next process can be immediately advanced after the lateral movement, the lead time for manufacturing the semiconductor device can be shortened.

[0057] Note that the configuration described so far is an example, and other configurations may be appropriately changed as long as the configuration described in claim 1 is provided. For example, in the above description, the chip holding device 10 holds the semiconductor chip 100 using both ultrasonic holding force and suction force. However, the chip holding device 10 may be configured to hold the semiconductor chip 100 only by ultrasonic holding force without having the suction source 36. Further, as long as the positional deviation in the plane direction of the semiconductor chip 100 can be suppressed, the resultant vector Fc does not necessarily have to be orthogonal to the holding surface 18. Further, as long as the moving direction of the chip holder intersects the direction of gravity, it does not necessarily have to be horizontal.

Explanation of Reference Numerals

[0058] 10 Chip holding device, 12 Chip holder, 14 Main body, 16 Holding plate, 18 Holding surface, 20 Oscillation axis, 22 Suction hole, 24 Suction path, 26 Airflow forming groove, 28 Positioning recess, 30 Vibration source, 32 Ultrasonic vibration element, 34 AC power supply, 36 Suction source, 40 Moving mechanism, 42 Power source, 46 Oscillation mechanism, 48 Power source, 50 Controller, 52 Processor, 54 Memory, 60 Pendulum, 62 Weight, 64 Center of gravity, 70 Manufacturing device, 72 Chip supply source, 74 Dicing tape, 76 Pickup section, 78 Pickup collet, 80 Bonding section, 82 Stage, 84 Bonding head, 86 Bonding tool, 100 Semiconductor chip, 110 Substrate.

Claims

1. A holder having a holding surface for holding a chip in a non-contact manner, and a vibration source for applying ultrasonic vibration to the holding surface to generate a holding force for holding the chip on the holding surface; A moving mechanism for laterally moving the holding surface in a direction intersecting the direction of gravity; A rocking mechanism for tilting the holding surface in accordance with the acceleration of the lateral movement of the holding surface; A chip holding device comprising the above.

2. The chip holding device according to Claim 1, wherein the rocking mechanism tilts the holding surface such that the resultant vector of the inertial force acting on the chip due to the acceleration of the lateral movement of the holding surface and the gravitational force acting on the chip is in a direction perpendicular to the holding surface and directed from the chip toward the holding surface.

3. The chip holding device according to Claim 2, further comprising a controller, wherein the rocking mechanism has a power source for outputting power for tilting the holding surface, and the controller stores the velocity profile of the lateral movement in advance and performs feedforward control of the power source based on the velocity profile. The chip holding device is characterized by the above.

4. The chip holding device according to Claim 2, wherein the rocking mechanism is connected to the holder and includes a pendulum that tilts together with the holder.

5. The chip holding device according to Claim 4, wherein the pendulum has a weight at its end, and the center of gravity of the pendulum is located on the opposite side of the holding surface with respect to the rotation center of the holding surface.

6. A manufacturing apparatus for a semiconductor device comprising the chip holding device according to any one of Claims 1 to 5.

7. While holding the chip in a non-contact manner on the holding surface of the holder, the holder is laterally moved in a direction intersecting the direction of gravity, and when performing the lateral movement, the holding surface is tilted in accordance with the acceleration of the lateral movement so as to suppress the deviation of the chip with respect to the holding surface due to the inertial force. A chip holding method characterized by the above.

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