Multilayer electronic component

Abstract

To provide a multilayer electronic component that alleviates the phenomenon of stress concentration due to electrostriction at corners where electrode patterns of polarities different from each other overlap in a stacking direction of an internal electrode in an internal electrode structure introducing a floating electrode layer.SOLUTION: A multilayer electronic component includes: an internal electrode layer including a first electrode pattern 11 and a second electrode pattern 12 which are disposed to be spaced apart in a third direction; and a floating electrode layer. The multilayer electronic component may allow an electric field formed in a first direction between the internal electrode layer and the floating electrode layer to also be formed in a second direction or a third direction to offset stress formed in a stress concentration region P, thereby improving reliability, including BDV characteristics, of the multilayer electronic component.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, on-board chargers (OBC) for electric vehicles, and circuits such as DC-DC converters, and plays a role in charging or discharging electricity.

[0003] When a voltage is applied to a multilayer ceramic capacitor, stress is generated inside the multilayer ceramic capacitor due to the electrostriction phenomenon of the dielectric layer, which can cause a decrease in reliability including the BDV characteristics of the multilayer ceramic capacitor.

[0004] Conventionally, attempts have been made to introduce a floating electrode layer structure to mitigate the electrostriction phenomenon.

[0005] However, the internal electrode structure with a general floating electrode layer can achieve the effect of distributing the voltage overall and alleviating stress concentration to a certain extent, but at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes, stress due to electrostriction may concentrate. As a result, even when a floating electrode layer is introduced, the BDV characteristics and reliability may deteriorate, and such a phenomenon may become more severe when operating a multilayer ceramic capacitor under high voltage.

[0006] Therefore, in an internal electrode structure with a floating electrode layer introduced, there is a need for a structural improvement that can alleviate the phenomenon in which stress due to electrostriction concentrates at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes.

Summary of the Invention

Problems to be Solved by the Invention

[0007] The problem to be solved by the present invention is to alleviate the phenomenon in which stress due to electrostriction concentrates at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes in an internal electrode structure with a floating electrode layer introduced.

[0008] However, the problem to be solved by the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0009] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and an internal electrode layer and a floating electrode layer alternately arranged in a first direction with the dielectric layer interposed therebetween. The multilayer electronic component includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction perpendicular to the first direction and the second direction. The multilayer electronic component also includes an external electrode disposed on the body. The internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern connected to the fourth surface and spaced apart from the first electrode pattern in the second direction. The floating electrode layer includes a third electrode pattern spaced apart from the third surface to the sixth surface. The first electrode pattern includes a first main portion and first auxiliary portions disposed on both sides of the first main portion in the third direction and spaced apart from the first main portion in the third direction. The second electrode pattern includes a second main portion and second auxiliary portions disposed on both sides of the second main portion in the third direction and spaced apart from the second main portion in the third direction. The third electrode pattern may include a third main portion and third auxiliary portions disposed on both sides of the third main portion in the third direction and spaced apart from the third main portion in the third direction.

Advantages of the Invention

[0010] One of the various advantages of the present invention is that in a multilayer electronic component including an internal electrode layer and a floating electrode layer, the shapes of the electrode patterns included in the internal electrode layer and the floating electrode layer are adjusted to eliminate stress concentrated at corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes, thereby improving the reliability including the BDV characteristics of the multilayer electronic component.

[0011] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

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Figure 7

DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings can be exaggerated for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for the convenience of description, and thus the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the scope of the same concept, the same reference numerals are used for description. Further, throughout the specification, when a part states that a certain component "includes" something, this means that, unless otherwise stated to the contrary, it does not exclude other components but may further include other components.

[0015] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0016] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention and still another embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1. FIG. 3 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 4 is a cross-sectional view taken along line III-III' of FIG. 1. FIG. 5(a) schematically shows a plan view of an internal electrode layer according to an example. FIG. 5(b) schematically shows a plan view of a floating electrode layer according to an example. FIG. 6(a) shows a region of an electrode pattern where electrostriction stress concentrates in a stacked electronic component according to a comparative example. FIG. 6(b) shows a region of an electrode pattern where electrostriction stress concentrates in a stacked electronic component according to an example. FIG. 7 schematically shows an exploded perspective view of a main body according to an example.

[0017] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component 100 according to an embodiment of the present invention and various examples thereof will be described in detail. Further, as an example of a stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto and can also be applied to various stacked electronic components using a ceramic material, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0018] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, and internal electrode layers 121 and floating electrode layers 122 that are alternately arranged in a first direction with the dielectric layer interposed therebetween. The stacked electronic component 100 includes a first surface 1 and a second surface 2 that face each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface and the second surface and face each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface to the fourth surface and face each other in a third direction perpendicular to the first direction and the second direction. The stacked electronic component 100 also includes external electrodes 130 and 140 disposed on the main body. The internal electrode layer 121 includes a first electrode pattern 11 connected to the third surface, and a second electrode pattern 12 connected to the fourth surface and spaced apart from the first electrode pattern in the second direction. The floating electrode layer 122 includes a third electrode pattern 13 disposed spaced apart from the third surface to the sixth surface. The first electrode pattern includes a first main portion 11a and first auxiliary portions 11b disposed on both sides of the first main portion in the third direction and spaced apart from the first main portion in the third direction. The second electrode pattern includes a second main portion 12a and second auxiliary portions 12b disposed on both sides of the second main portion in the third direction and spaced apart from the second main portion in the third direction. The third electrode pattern may include a third main portion 13a and third auxiliary portions 13b disposed on both sides of the third main portion in the third direction and spaced apart from the third main portion in the third direction.

[0019] The main body 110 may include a dielectric layer 111, internal electrode layers 121, and floating electrode layers 122.

[0020] More specifically, the main body 110 may include a dielectric layer 111, and internal electrode layers 121 and floating electrode layers 122 that are alternately arranged in a first direction with the dielectric layer interposed therebetween.

[0021] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0022] The main body 110 can include a first surface and a second surface 1 and 2 facing each other in a first direction, a third surface and a fourth surface 3 and 4 facing each other in a second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in a third direction and connected to the first surface to the fourth surface.

[0023] In the present invention, the first direction can mean the direction in which the internal electrode layer 121 and the floating electrode layer 122 are arranged with the dielectric layer 111 interposed therebetween, that is, the stacking direction of the internal electrode layer 121, the floating electrode layer 122, and the dielectric layer 111. Further, the second direction means a direction perpendicular to the first direction, and the third direction can mean a direction perpendicular to both the first direction and the second direction.

[0024] On the other hand, when a margin region where no electrode pattern is arranged overlaps on the dielectric layer 111, a step due to the thickness of the internal electrode layer may occur. As a result, the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the center side of the main body 110 in the first direction when viewed with respect to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the center side of the main body 110 in the first direction when viewed with respect to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces can have a rounded form.

[0025] The dielectric layers 111 forming the body 110 can be formed in plurality, and the plurality of dielectric layers 111 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 does not particularly need to be limited, and can be determined in consideration of the size of the multilayer electronic component. For example, the body can be formed by stacking 400 or more dielectric layers.

[0026] The dielectric layer 111 can be formed by producing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0027] On the other hand, when barium titanate (BaTiO3)-based powder is used as the raw material for forming the dielectric layer 111, the fired dielectric layer 111 can contain Ba and Ti.

[0028] The average thickness of the dielectric layer 111 is not particularly limited.

[0029] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the dielectric layer 111 may be 0.35 μm or less. In order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness of the dielectric layer 111 may be 20 μm or more.

[0030] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0031] For example, the average thickness of the dielectric layer 111 is such that, among the dielectric layers extracted from an image scanned with a scanning electron microscope (SEM) of the length and thickness (L-T) cross-section cut at the central portion in the width direction of the main body 110, for a total of five dielectric layers including two upper layers and two lower layers with reference to one dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, after determining five points, two on the left and two on the right, at equal intervals around one reference point with reference to the point where the central line in the length direction of the main body and the central line in the thickness direction meet, the thickness at each point is measured and the average value can be measured.

[0032] When a voltage is applied to the multilayer electronic component 100, deformation such as contraction and expansion may occur in the multilayer electronic component 100 due to the electrostriction phenomenon of the dielectric layer. Such an electrostriction phenomenon may become more intense when a high voltage is applied to the multilayer electronic component 100 or when BaTiO3 is used as the material of the dielectric layer.

[0033] On the other hand, when a voltage is applied to the multilayer electronic component 100 and an electric field is formed in the first direction, the multilayer electronic component 100 may expand in the first direction and contract in the second and third directions. And the stress due to such deformation of the multilayer electronic component 100 concentrates at the boundary between the region where capacitance is formed and the region where capacitance is not formed, which may act as a cause for generating cracks in the multilayer electronic component 100.

[0034] Referring to FIG. 5(a), the internal electrode layer 121 can include a first electrode pattern 11 connected to the third surface 3 and a second electrode pattern 12 connected to the fourth surface 4 and spaced apart from the first electrode pattern 11 in the second direction.

[0035] Referring to FIG. 6(b), the floating electrode layer 122 can include a third electrode pattern 13 disposed spaced apart from the third to sixth surfaces 3, 4, 5, and 6.

[0036] Accordingly, as shown in FIG. 2, the main body 110 can include capacitance forming portions Ac1 and Ac2 which are regions where the internal electrode layer 121 and the floating electrode layer 122 overlap in the first direction. The capacitance forming portions Ac1 and Ac2 can include a first capacitance forming portion Ac1 which is a region where the first electrode pattern 11 and the third electrode pattern 13 overlap in the first direction, and a second capacitance forming portion Ac1 which is a region where the second electrode pattern 12 and the third electrode pattern 13 overlap in the first direction. At this time, since the first electrode pattern 11 and the second electrode pattern 12 are spaced apart from each other in the second direction, the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 can be spaced apart from each other.

[0037] Such a structure corresponds to a structure in which a plurality of capacitors are connected in series and then connected in parallel again as a whole, so that an effect of distributing voltage can be obtained, thereby relaxing the electrostriction phenomenon of the multilayer electronic component.

[0038] Referring to FIG. 7, the main body 110 can be formed by repeatedly laminating the internal electrode layer and the floating electrode layer in the first direction with the dielectric layer 111 interposed therebetween. Cover portions 112 and 113 can be disposed on the upper and lower surfaces in the first direction of the region where the internal electrode layer and the floating electrode layer are repeatedly laminated in the first direction with the dielectric layer 111 interposed therebetween.

[0039] The materials for forming the internal electrode layer 121 and the floating electrode layer 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrode layer 121 and the floating electrode layer 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0040] The internal electrode layer 121 and the floating electrode layer 122 can be formed by printing a conductive paste on a ceramic green sheet, respectively. As the printing method, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0041] The thicknesses of the internal electrode layer and the floating electrode layer are not particularly limited.

[0042] When aiming at miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the internal electrode layer and the floating electrode layer may be 0.35 μm or less. When aiming at improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness of the internal electrode layer and the floating electrode layer may be 3 μm or more.

[0043] The method for measuring the average thickness of the internal electrode layer and the floating electrode layer is not particularly limited. For example, the average thickness of the internal electrode layer is extracted from an image scanned by a scanning electron microscope (SEM) of the width cut at the central portion in the length direction of the main body 110 and the cross section (W-T cross section) in the thickness direction. Among the internal electrode layers, for a total of five internal electrode layers, including two upper layers and two lower layers, based on one internal electrode layer at the point where the central line in the length direction and the central line in the thickness direction of each capacitance forming portion Ac1 and Ac2 meet. After determining five points, two points on the left side and two points on the right side at equal intervals with the above reference point as the center, the thickness of each point can be measured and the average value can be measured.

[0044] Referring to FIG. 2, the main body 110 can include cover portions 112 and 113 disposed at the upper and lower portions in the first direction of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0045] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2, respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0046] The cover portions 112 and 113 do not include an electrode pattern and can include a dielectric layer 111 and a dielectric material. That is, the cover portions 112 and 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0047] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. For example, the average thickness of the cover portions 112 and 113 may be 10 to 300 μm. The average thickness of the cover portions 112 and 113 can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points at the upper or lower portion of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0048] Margin portions 114 and 115 can be disposed on the side surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0049] Referring to FIG. 4, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the main body 110.

[0050] As shown in FIGS. 3 and 4, the margin portions 114 and 115 can mean the regions between the boundary surfaces of the main body 110 and both ends in the third direction of the first and second main portions 11a and 12a or the regions between the boundary surfaces of the main body 110 and both ends in the third direction of the third main portion 13a in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0051] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0052] The margin portions 114 and 115 can be formed by applying a conductive paste to form the main portions of the first to third electrode patterns except for the locations where the margin portions are formed on the ceramic green sheet, and forming auxiliary portions in the regions where the margin portions are formed.

[0053] On the other hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the widths of the margin portions 114 and 115 may be 5 μm or more, and when the multilayer electronic component is 3225 size or more, the widths of the margin portions 114 and 115 may be 300 μm or more.

[0054] The average width of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be a value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0055] The external electrodes 130 and 140 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0056] The external electrodes 130 and 140 can be disposed on the third and fourth surfaces 3 and 4 of the main body 110 respectively, and include first and second external electrodes 130 and 140 respectively connected to the first and second electrode patterns 121 and 122. Specifically, the first external electrode 130 can be disposed on the third surface 3 and connected to the first electrode pattern 121, and the second external electrode 140 can be disposed on the fourth surface 4 and connected to the second electrode pattern 122.

[0057] In this embodiment, the structure in which the stacked electronic component 100 has two external electrodes 130 and 140 is described. However, the number and shape of the external electrodes 130 and 140 can be changed according to the form of the internal electrode layer and other purposes.

[0058] On the other hand, the external electrodes 130 and 140 can be formed of any material as long as it has electrical conductivity, such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc., and it may further have a multilayer structure.

[0059] For example, the external electrodes 130 and 140 can include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0060] To give a more specific example of the electrode layer, the electrode layer may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0061] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode. Also, the electrode layer may be formed of a plating layer, or may be a layer formed using a vapor deposition method such as a sputtering method or ALD (Atomic layer deposition).

[0062] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0063] The plating layer plays a role in improving the mounting characteristics. The type of the plating layer is not particularly limited, and it may be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, or may be formed of a plurality of layers.

[0064] More specific examples of the plating layer are as follows. The plating layer may be a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Also, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0065] The size of the multilayer electronic component 100 does not need to be particularly limited. According to the present invention, since it is advantageous for miniaturization and high capacity, it can also be applied to the size of IT products with a small size, and since high reliability can be ensured in various environments, it can also be applied to the size of automotive electrical components that require high reliability.

[0066] Referring to FIG. 6(a), the internal electrode layer and the floating electrode layer of the multilayer electronic component according to the comparative example include electrode patterns 11', 12', 13' that only include the main part without separately arranged auxiliary parts.

[0067] In this case, when a voltage is applied, stress can concentrate at the corners where the internal electrode patterns with different polarities overlap each other, and the region where such stress concentrates is represented by P in FIG. 6(a).

[0068] When a voltage is applied to the multilayer electronic component according to the comparative example, an electric field is formed in the first direction in a region where the first pattern 11' and the third pattern 13' overlap in the first direction, and an electric field is formed in the first direction in a region where the second pattern 12' and the third pattern 13' overlap in the first direction. As a result, the stress concentration region P in the multilayer electronic component can be concentrated and formed at the interface between the capacitance forming portion and the margin portion, and at the interface between the capacitance forming portion and the non-capacitance forming portion.

[0069] Referring to FIG. 6(b), the multilayer electronic component according to the embodiment includes an internal electrode layer including a first electrode pattern 11 and a second electrode pattern 12 arranged apart from each other in the third direction, and a floating electrode layer 122. In FIG. 5(b), illustration of the dielectric layer disposed between the internal electrode layer and the floating electrode layer is omitted.

[0070] In FIG. 6(b), the stress concentration region is denoted by P. The multilayer electronic component 100 according to an embodiment of the present invention can cancel the stress acting on the stress concentration region P shown in FIG. 6(b) by forming an electric field formed in the first direction between the internal electrode layer 121 and the floating electrode layer 122 also in the second direction or the third direction.

[0071] Specifically, referring to FIG. 6(b), the first electrode pattern 11 included in the internal electrode layer of the stacked electronic component 100 according to an embodiment of the present invention includes a first main portion 11a and first auxiliary portions 11b spaced apart from the first main portion 11a in the third direction on both sides of the first main portion 11a in the third direction. The second electrode pattern 12 includes a second main portion 12a and second auxiliary portions 12b spaced apart from the second main portion 12a in the third direction on both sides of the second main portion 12a in the third direction. The third electrode pattern includes a third main portion 13a and third auxiliary portions 13b spaced apart from the third main portion 13a on both sides of the third main portion 13a in the third direction. By doing so, an electric field with components in the second and third directions can be formed in the stress concentration region P. As a result, compared with the conventional case where tensile stress is concentrated in the first direction and compressive stress is concentrated in the second and third directions, compressive stress can be partially generated in the first direction, and tensile stress can be partially generated in the second and third directions. Therefore, by canceling out the stress acting on the stress concentration region P shown in FIG. 6(b), the reliability including the BDV characteristics of the stacked electronic component 100 can be improved.

[0072] In one embodiment, the first auxiliary portion 11b can be connected to the third surface 3, and the second auxiliary portion 12b can be connected to the fourth surface 4. As a result, an electric field in the second direction can also be formed between the first auxiliary portion 11b and the second auxiliary portion 12b, so that the effect of canceling out the stress acting on the stress concentration region can be further improved.

[0073] In one embodiment, the distance WS by which the first main portion 11a and the first auxiliary portion 11b are spaced apart in the third direction, the distance by which the second main portion 12a and the second auxiliary portion 12b are spaced apart in the third direction, and the distance by which the third main portion 13a and the third auxiliary portion 13b are spaced apart in the third direction may each be 100 μm or more and 200 μm or less.

[0074] When the distances by which the first main part 11a and the first auxiliary part 11b are separated in the third direction, the distances by which the second main part 12a and the second auxiliary part 12b are separated in the third direction, and the distances by which the third main part 13a and the third auxiliary part 13b are separated in the third direction are each less than 100 μm, there may occur a problem that the auxiliary part and the main part overlap due to printing bleeding. When the distances by which the first main part 11a and the first auxiliary part 11b are separated in the third direction, the distances by which the second main part 12a and the second auxiliary part 12b are separated in the third direction, and the distances by which the third main part 13a and the third auxiliary part 13b are separated in the third direction are each more than 200 μm, there may occur a problem that the capacitance decreases.

[0075] Therefore, in one embodiment, by adjusting the distances WS by which the first main part 11a and the first auxiliary part 11b are separated in the third direction, the distances by which the second main part 12a and the second auxiliary part 12b are separated in the third direction, and the distances by which the third main part 13a and the third auxiliary part 13b are separated in the third direction to be each 100 μm or more and 200 μm or less, it is possible to prevent the problem that the capacitance of the multilayer electronic component 100 decreases and the problem that the auxiliary part and the main part overlap.

[0076] On the other hand, in one embodiment, the ratio of the widths WA in the third direction of the first and second auxiliary parts 11b, 12b to the widths WM in the third direction between the ends in the third direction of the first and second main parts 11a, 12a and the fifth and sixth surfaces 5, 6 can satisfy 1 / 8 or more and 1 / 3 or less.

[0077] Also, in one embodiment, the first auxiliary part 11b and the second auxiliary part 12b can be arranged to be separated in the second direction, whereby the first auxiliary part 11b and the second auxiliary part 12b can be electrically insulated from each other.

[0078] In one embodiment, the length LA by which the first auxiliary part 11b and the second auxiliary part 12b are separated in the second direction may be substantially the same as the length FG by which the first main part 11a and the second main part 12a are separated in the second direction.

[0079] On the one hand, when the length FG at which the first main part 11a and the second main part 12a are separated in the second direction is excessively short, the stress cancellation effect according to the present invention may decrease. Therefore, the length FG at which the first main part 11a and the second main part 12a are separated in the second direction and the distance LM at which the third main part 13a is separated from the third surface 3 or the fourth surface 4 can satisfy LM > 0.35FG.

[0080] When the third auxiliary part 13b is not separated from the third surface 3 and the fourth surface 4, the first external electrode 130 disposed on the third surface 3 and the second external electrode 140 disposed on the fourth surface 4 can be electrically connected. Therefore, in one embodiment, by arranging the third auxiliary part 13b so as to be separated from the third surface 3 and the fourth surface 4, it is possible to prevent the first external electrode 130 and the second external electrode 140 from being electrically connected.

[0081] In one embodiment, the first auxiliary part 11b, the second auxiliary part 12b, and the third auxiliary part 13b can be arranged so as to be separated from the fifth surface 5 and the sixth surface 6. Thereby, by blocking the path through which moisture from the outside can penetrate into the electrode layer 121 and the floating electrode layer 122, the moisture resistance reliability of the laminated electronic component 100 can be improved.

[0082] In one embodiment, the corners of the first main part 11a, the corners of the second main part 12a, and the corners of the third main part 13a may have a rounded shape. Thereby, the phenomenon in which stress concentrates at a specific position of the electrode pattern can be alleviated, and the effect of improving the reliability including the BDV characteristics of the laminated electronic component 100 can be further improved.

[0083] In one embodiment, the dielectric layer 111 can contain Ba and Ti. When the dielectric layer 111 is formed of a normal dielectric corresponding to EIA Class 1, the electrostriction phenomenon occurs slightly or hardly at all even when a voltage is applied, whereas when the dielectric layer 111 is formed of a ferroelectric dielectric corresponding to EIA Class 2, for example, when the dielectric layer 111 contains Ba and Ti, deformation due to the electrostriction phenomenon may occur to a measurable extent, and such deformation can cause stress to occur inside the multilayer electronic component 100.

[0084] On the other hand, according to one embodiment of the present invention, even when the dielectric layer 111 contains Ba and Ti, the stress applied to the region where stress concentrates can be offset. That is, when the dielectric layer 111 contains Ba and Ti, the effect of improving reliability including the BDV characteristics according to one embodiment of the present invention can be further improved.

[0085] As described above, the embodiments of the present invention have been described in detail, but the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art without departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

[0086] Also, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the one embodiment presented above does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as related to the description of the other one embodiment as long as there is no description contrary to or conflicting with that matter in the other one embodiment.

[0087] The terms used in this disclosure are merely used to describe an embodiment and are not intended to limit this disclosure. At this time, singular expressions include plural expressions unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0088] 100: Multilayer electronic component 110: Body 111: Dielectric layer 121: Internal electrode layer 122: Floating electrode layer 11: First electrode pattern 12: Second electrode pattern 13: Third electrode pattern 130, 140: External electrodes 112, 113: Cover portions 114, 115: Margin portions

Claims

1. A main body including a dielectric layer, and an internal electrode layer and a floating electrode layer alternately arranged in a first direction with the dielectric layer therebetween, the main body including a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction; an external electrode disposed on the main body. The internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern connected to the fourth surface and spaced apart from the first electrode pattern in the second direction. The floating electrode layer includes a third electrode pattern spaced apart from the third surface to the sixth surface. The first electrode pattern includes a first main portion and first auxiliary portions disposed on both sides of the first main portion in the third direction and spaced apart from the first main portion in the third direction. The second electrode pattern includes a second main portion and second auxiliary portions disposed on both sides of the second main portion in the third direction and spaced apart from the second main portion in the third direction. The third electrode pattern includes a third main portion and third auxiliary portions disposed on both sides of the third main portion in the third direction and spaced apart from the third main portion in the third direction, the multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the first auxiliary portion is connected to the third surface, and the second auxiliary portion is connected to the fourth surface.

3. The multilayer electronic component according to claim 1, wherein the first auxiliary portion and the second auxiliary portion are spaced apart from each other in the second direction.

4. The multilayer electronic component according to claim 1, wherein the third auxiliary portion is spaced apart from the third surface and the fourth surface.

5. The multilayer electronic component according to claim 1, wherein the first auxiliary portion, the second auxiliary portion, and the third auxiliary portion are spaced apart from the fifth surface and the sixth surface.

6. The multilayer electronic component according to claim 1, wherein the main body includes a first capacitance forming portion where the first electrode pattern and the third electrode pattern overlap each other in the first direction, and a second capacitance forming portion where the second electrode pattern and the third electrode pattern overlap each other in the first direction.

7. The multilayer electronic component according to claim 6, wherein the first capacitance forming portion and the second capacitance forming portion are spaced apart from each other in the second direction.

8. The distance between the first main portion and the first auxiliary portion spaced apart from each other in the third direction is 100 μm or more and 200 μm or less. The distance by which the second main part and the second auxiliary part are separated in the third direction is 100 μm or more and 200 μm or less, The distance by which the third main part and the third auxiliary part are separated in the third direction is 100 μm or more and 200 μm or less. The multilayer electronic component according to claim 1.

9. The ratio of the width in the third direction of the first and second auxiliary parts to the width in the third direction between the end portions in the third direction of the first and second main parts and the fifth or sixth surface satisfies 1 / 8 or more and 1 / 3 or less. The multilayer electronic component according to claim 1.

10. When the length by which the first main part and the second main part are separated in the second direction is FG and the distance by which the third main part is separated from the third or fourth surface is LM, The multilayer electronic component according to claim 1, which satisfies LM > 0.35FG.

11. The corners of the first main part, the corners of the second main part, and the corners of the third main part have a rounded shape. The multilayer electronic component according to claim 1.

12. The dielectric layer contains Ba and Ti. The multilayer electronic component according to claim 1.

13. The average thickness of the dielectric layer is 20 μm or more. The multilayer electronic component according to claim 1.

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