Laminated type capacitor

Abstract

To provide a laminated type capacitor which can achieve thinning of an electrode and improves electric characteristics.SOLUTION: A laminated type capacitor includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode arranged outside the capacitor body, wherein the internal electrode contains a compound represented by the following chemical formula 1. [Chemical formula 1]: Mn+1Xn. In the chemical formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y or combinations thereof, X includes C, N or combinations thereof, and 1≤n≤2 is satisfied.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer capacitor.

Background Art

[0002] Recently, with the rapid progress of the multifunctionalization and miniaturization of electronic devices, the miniaturization and performance improvement of electronic components have also been rapidly advanced. In addition, the requirements for the high reliability of electrical devices used in automobiles or network devices, and electronic components for industrial use have also increased significantly.

[0003]

[0004] To meet such market requirements, the competition in the technological development of passive components such as inductors, capacitors, or resistors has been accelerating. In particular, many efforts are required to preempt the market in the development of various products of multilayer ceramic capacitors (MLCCs), which are passive components with continuously increasing applications and usage amounts.

[0005] In addition, a multilayer capacitor is a capacitor manufactured in a form in which dielectric layers and internal electrodes are stacked, and is used in various electronic devices such as mobile phones, notebook computers, and LCD (liquid crystal) TVs.

[0006] Recently, with the development of technology, multilayer capacitors have been required to be miniaturized and have a higher capacitance, and for this purpose, it is known that thinning of the internal electrodes is essential.

Summary of the Invention

Problems to be Solved by the Invention

[0007] ​One aspect of the embodiment provides a multilayer capacitor capable of realizing thinning of electrodes and having improved electrical characteristics.

[0008] However, the problems to be solved by the embodiments are not limited to the above-described problems, and can be variously extended within the scope of the technical idea included in the embodiments. **Means for Solving the Problems**

[0009] A multilayer capacitor according to an embodiment of the present invention includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body. The internal electrode contains a compound represented by the following Chemical Formula 1.

[0010] [Chemical Formula 1] M n+1 X n In Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or a combination thereof, X includes C, N, or a combination thereof, and 1 ≤ n ≤ 2.

[0011] The compound represented by Chemical Formula 1 is a plate-like unit Mxene layer, and the internal electrode can include a Mxene laminate in which one or more of the unit Mxene layers are laminated. 2-y Nb y )C, (V 2-y Nb y )C, (Ti 2-y V y )C, W 1.33 C, Nb 1.33 C, Mo 1.33 C, Mo 1.33 Y 0.67 C, or a combination thereof (0 < y < 2).

[0012] The compound represented by Chemical Formula 1 is a plate-like (plate) unit Mxene layer, and the internal electrode can include a Mxene laminate in which one or more of the unit Mxene layers are laminated.

[0013] The internal electrode can include a MAX phase laminate in which the unit MAX phase layer is laminated in 1 to 500 layers.

[0014] The average thickness of the internal electrode can be 0.002 μm to 2.5 μm.

[0015] The average thickness of the dielectric layer can be 0.5 μm to 3 μm.

[0016] The dielectric layer mainly contains a barium titanate-based compound. The barium titanate-based compound is Ba m TiO3 (0.995 ≤ m ≤ 1.010), (Ba 1-x Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba m (Ti 1-x Zr x )O3 (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba 1-x Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof.

[0017] The dielectric layer further contains a sub-component. The sub-components may include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or combinations thereof.

[0018] A multilayer capacitor according to another embodiment includes a capacitor body including a dielectric layer and internal electrodes, and external electrodes disposed outside the capacitor body. The internal electrodes include a compound represented by the following Chemical Formula 1. The average thickness of the internal electrodes is from 0.002 μm to 2.5 μm.

[0019] [Chemical Formula 1] M n+1 X n In Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or combinations thereof. X includes C, N, or combinations thereof, and 1 ≤ n ≤ 2.

[0020] The compound represented by Chemical Formula 1 is Ti2C, V2C, Nb2C, Mo2C, Mo2N, Ti2N, (Ti 2-y Nb y )C, (V 2-y Nb y )C, (Ti 2-y V y )C, W 1.33 C, Nb 1.33 C, Mo 1.33 C, Mo 1.33 Y 0.67It can include C, or a combination thereof (0 < y < 2).

[0021] The compound represented by Chemical Formula 1 is a plate-shaped unit Mxene layer, and the internal electrode can include a Mxene laminate in which one or more unit Mxene layers are laminated.

[0022] The internal electrode can include a Mxene laminate in which the unit Mxene layers are laminated in 1 to 500 layers.

[0023] The average thickness of the dielectric layer can be 0.5 μm to 3 μm.

[0024] The dielectric layer mainly contains a barium titanate-based compound. The barium titanate-based compound is Ba m TiO3 (0.995 ≤ m ≤ 1.010), (Ba 1-x Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba m (Ti 1-x Zr x )O3 (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba 1-x Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof.

[0025] The dielectric layer further contains a secondary component. The sub-components may include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or combinations thereof.

Advantages of the Invention

[0026] According to the multilayer capacitor according to an embodiment of the present invention, it is possible to achieve thinning of the electrodes, and there is an advantage that the electrical characteristics can be improved.

[0027] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and should be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0029] Hereinafter, embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it with reference to the attached drawings. In order to clearly explain the present invention in the drawings, parts unnecessary for the explanation are omitted, and the same reference numerals are given to the same or similar components throughout the specification. Also, the attached drawings are merely for facilitating the understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings, and it must be understood that all changes, equivalents, or alternatives included in the idea and technical scope of the present invention are included.

[0030] Terms including ordinal numbers such as first and second can be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

[0031] When a certain component is referred to as being "connected" or "joined" to another component, it should be understood that it may be directly connected or joined to the other component, or may be opposite thereto, but there may also be other components in between. On the contrary, when a certain component is referred to as being "directly connected" or "directly joined" to another component, it should be understood that there are no other components in between.

[0032] Throughout the specification, terms such as "including" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it should not be understood that the presence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof are precluded in advance. Therefore, when a certain part "includes" a certain component, this means that it can further include other components rather than excluding other components unless otherwise stated to the contrary.

[0033] FIG. 1 is a perspective view showing a multilayer capacitor 100 according to an embodiment, FIG. 2 is a cross-sectional view of the multilayer capacitor 100 cut along line I-I' of FIG. 1, and FIG. 3 is an exploded perspective view showing the stacked structure of internal electrodes in the capacitor body 110 of FIG. 1.

[0034] If directions are defined to clearly explain this embodiment, the L-axis, W-axis, and T-axis shown in the drawings indicate the length direction, width direction, and thickness direction of the capacitor body 110, respectively. Here, the thickness direction (T-axis direction) may be a direction perpendicular to the wide surface (main surface) of the sheet-shaped component, and as an example, it can be used as the same concept as the stacking direction in which the dielectric layer 111 is stacked. The length direction (L-axis direction) may be a direction that extends parallel to the wide surface (main surface) of the sheet-shaped component and is substantially perpendicular to the thickness direction (T-axis direction), and as an example, it may be the direction in which the first external electrode 131 and the second external electrode 132 are located on both sides. The width direction (W-axis direction) may be a direction that extends parallel to the wide surface (main surface) of the sheet-shaped component and is substantially perpendicular to the thickness direction (T-axis direction) and the length direction (L-axis direction), and the length in the length direction (L-axis direction) of the sheet-shaped component may be even longer than the length in the width direction (W-axis direction).

[0035] Referring to FIGS. 1 to 3, a multilayer capacitor 100 according to an embodiment may include a capacitor body 110 and first and second external electrodes 131 and 132 disposed at both ends facing the length direction (L-axis direction) of the capacitor body 110.

[0036] The capacitor body 110 may be, as an example, a substantially hexahedral shape.

[0037] In this embodiment, for convenience of explanation, both surfaces of the capacitor body 110 that face each other in the thickness direction (T-axis direction) are defined as the first surface and the second surface, both surfaces that are connected to the first surface and the second surface and face each other in the length direction (L-axis direction) are defined as the third surface and the fourth surface, and both surfaces that are connected to the first surface and the second surface and are connected to the third surface and the fourth surface and face each other in the width direction (W-axis direction) are defined as the fifth surface and the sixth surface.

[0038] As an example, the first surface, which is the lower surface, can be the surface facing the mounting direction. Also, the first surface to the sixth surface may be flat, but the present embodiment is not limited thereto. For example, the first surface to the sixth surface may be curved surfaces with a convex central portion, and the corners that are the boundaries of each surface may be rounded.

[0039] The shape, dimensions, and number of stacked dielectric layers 111 of the capacitor body 110 are not limited to those shown in the drawings of the present embodiment.

[0040] The capacitor body 110 is formed by stacking a plurality of dielectric layers 111 in the thickness direction (T-axis direction) and then firing, and includes a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the thickness direction (T-axis direction) with the plurality of dielectric layers 111 interposed therebetween.

[0041] At this time, the boundaries between the respective adjacent dielectric layers 111 of the capacitor body 110 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0042] Also, the capacitor body 110 can include an active region and cover regions 112 and 113.

[0043] The active region is a portion that contributes to the formation of the capacitance of the multilayer capacitor 100. As an example, the active region may be a region where the first internal electrode 121 or the second internal electrode 122 stacked along the thickness direction (T-axis direction) overlaps.

[0044] The cover regions 112 and 113 are margin portions in the thickness direction and can be respectively arranged on the first surface and the second surface sides of the active region in the thickness direction (T-axis direction). Such cover regions 112 and 113 may be a single dielectric layer 111 or two or more dielectric layers 111 laminated on the upper surface and the lower surface of the active region respectively.

[0045] Also, the capacitor body 110 can further include side cover regions. The side cover regions are margin portions in the width direction and can be respectively arranged on the fifth surface and the sixth surface sides of the active region in the width direction (W-axis direction). Such side cover regions can be formed by applying a conductive paste layer for forming an internal electrode only on a partial region of the surface of the dielectric green sheet when applying the conductive paste layer on the surface of the dielectric green sheet, laminating dielectric green sheets on both side surfaces of the surface of the dielectric green sheet where the conductive paste layer is not applied, and then firing.

[0046] The cover regions 112 and 113 and the side cover regions serve to prevent damage to the first internal electrode 121 and the second internal electrode 122 due to physical or chemical stress.

[0047] The multilayer capacitor 100 according to one embodiment includes a capacitor body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132 arranged outside the capacitor body 110.

[0048] Hereinafter, the multilayer capacitor 100 will be described in detail with reference to the drawings.

[0049] Internal electrode The first internal electrode 121 and the second internal electrode 122 are electrodes having different polarities from each other, and are alternately arranged so as to face each other along the T-axis direction with the dielectric layer 111 interposed therebetween, and one end of each is exposed through the third surface and the fourth surface of the capacitor body 110.

[0050] The first internal electrode 121 and the second internal electrode 122 can be electrically insulated from each other by a dielectric layer 111 disposed therebetween.

[0051] The ends of the first internal electrode 121 and the second internal electrode 122 that are alternately exposed through the third and fourth surfaces of the capacitor body 110 can be connected to the first external electrode 131 and the second external electrode 132, respectively, and electrically connected.

[0052] In one embodiment, the internal electrodes 121, 122 include a first compound represented by the following Chemical Formula 1.

[0053] [Chemical Formula 1] M n+1 X n In Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or a combination thereof, X includes C, N, or a combination thereof, and 1 ≤ n ≤ 2.

[0054] As an example, the compound represented by Chemical Formula 1 may include Ti2C, V2C, Nb2C, Mo2C, Mo2N, Ti2N, (Ti 2-y Nb y )C, (V 2-y Nb y )C, (Ti 2-y V y )C, W 1.33 C, Nb 1.33 C, Mo 1.33 C, Mo 1.33 Y 0.67 C, or a combination thereof (0 < y < 2).

[0055] As an example, the compound represented by Chemical Formula 1 may be a MAX phase (Mxene) compound. The MAX phase compound is a two-dimensional material and can be a non-magnetic compound with excellent electrical conductivity and strength.

[0056] Since the Maxine (Mxene) compound is a non-magnetic material with a low magnetic permeability, when it is applied to the internal electrodes 121 and 122, the equivalent series inductance (ESL) of the multilayer capacitor 100 can be reduced, and the impedance characteristics in the high-frequency region can be improved.

[0057] In addition, the Maxine (Mxene) compound has a very thin unit thickness at the nanometer level (for example, a level of 2 nm or less) and is a two-dimensional material. Therefore, during the firing process, the shrinkage in the T-axis direction can be activated more than in the L-axis and W-axis directions. As a result, when the Maxine (Mxene) compound is applied to the internal electrodes 121 and 122, thinning of the electrodes can be achieved. Therefore, the degree of freedom in capacitor design can be ensured, and the multilayer capacitor 100 that is ultra-small and has a high capacitance can be realized.

[0058] As an example, the Maxine (Mxene) compound represented by Chemical Formula 1 may be a compound obtained from a MAX phase compound represented by the following Chemical Formula 2.

[0059] [Chemical Formula 2] M n+1 AX n In Chemical Formula 2, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or a combination thereof, A includes Al, Ga, In, Tl, Si, Ge, Sn, Pb, Zn, Cd, P, As, S, Cu, Au, or a combination thereof, X includes C, N, or a combination thereof, n is an integer from 1 to 4.

[0060] The MAX phase compound is a compound having all the characteristics of metals and ceramics, and is characterized by very excellent thermal conductivity and electrical conductivity, high strength, and high modulus.

[0061] The MAX phase compound represented by the chemical formula 2 may include Ti2AlC, V2AlC, Cr2AlC, Nb2AlC, Ta2AlC, Zr2AlC, Ti2AlN, Ti3AlC2, V3AlC2, Ta3AlC2, Zr3AlC2, Ti4AlN3, V4AlC3, Nb4AlC3, Ta4AlC3, (Mo,V)4AlC3, Mo4VAlC4, Ti3SiC2, Ti4SiC3, Ti2CdC, Sc2InC, Sc2SnC, Ti2GaC, Ti2InC, Ti2TlC, V2GaC, Cr2GaC, Ti2GaN, Ti2InN, V2GaN, Cr2GaN, Ti2GeC, Ti2SnC, Ti2PbC, V2GeC, Cr2GeC, V2PC, V2AsC, Ti2SC, Zr2InC, Zr2TlC, Nb2GaC, Nb2InC, Mo2GaC, Zr2InN, Zr2TlN, Zr2SnC, Zr2PbC, Nb2SnC, Nb2PC, Nb2AsC, Zr2SC, Nb2SC, Hf2InC, Hf2TlC, Ta2GaC, Hf2SnC, Hf2PbC, Hf2SnN, Hf2SC, Ti2ZnC, Ti2ZnN, V2ZnC, Nb2CuC, Mn2GaC, Mo2AuC, Ti2AuN, Ti3GaC2, Ti3InC2, Ti3GeC2, Ti3SnC2, Ti3ZnC2, Ti4GaC3, Ti4GeC3, or a combination thereof.

[0062] As an example, the internal electrodes 121 and 122 may further include a conductive metal, and the conductive metal may further include metals such as Ni, Cu, Ag, Pd, or Au, and alloys thereof, such as an Ag-Pd alloy.

[0063] Also, the first internal electrode 121 and the second internal electrode 122 may include dielectric particles of the same composition system as the ceramic material contained in the dielectric layer 111.

[0064] FIG. 4 is a schematic diagram showing a part of the cross section of the multilayer capacitor 100 according to an embodiment.

[0065] Referring to FIG. 4, the compound represented by the chemical formula 1 may have a layered structure and may be laminated in one or more layers to form the internal electrodes 121 and 122.

[0066] As an example, the compound represented by the chemical formula 1 may be a plate-shaped unit maxine layer, and the internal electrodes 121 and 122 may include a maxine laminate in which one or more unit maxine layers are laminated. The unit maxine is laminated in the T-axis direction of the capacitor body 110, and the overlapping areas between the respective unit maxine layers may be laminated unevenly. As an example, the unit maxine layers may be continuously or discontinuously connected in the L-axis direction of the capacitor body 110.

[0067] As an example, the compound (unit maxine layer) represented by the chemical formula 1 can be laminated in one layer (single layer) or more. For example, it can be laminated in two or more layers, ten or more layers, twenty or more layers, one hundred or more layers, or three hundred and fifty or more layers. The upper limit of the number of laminated layers is not particularly limited, but for example, it can be laminated in five hundred layers or less.

[0068] As an example, the average thickness of the internal electrodes 121 and 122 is 0.002 μm or more, 0.01 μm or more, 0.05 μm or more, 0.1 μm or more, or 0.5 μm or more, and can be 2.5 μm or less, 2 μm or less, 1.5 μm or less, or 1 μm or less. As described above, by applying the maxine (Mxene) compound, which is the compound represented by the chemical formula 1, to the internal electrodes 121 and 122, thinning of the internal electrodes 121 and 122 can be realized.

[0069] The average thickness of the internal electrodes 121 and 122 can be measured by the following method.

[0070] First, after placing the multilayer capacitor 100 in an epoxy mixture and curing it, the side surfaces of the capacitor body 110 in the L-axis direction and the T-axis direction are polished to the 1 / 2 point in the W-axis direction, fixed, and maintained in a vacuum atmosphere chamber. A cross-sectional sample (hereinafter referred to as the "cross-sectional sample") cut from the center of the capacitor body 110 in the W-axis direction in the L-axis direction and the T-axis direction is prepared.

[0071] Thereafter, in the scanning electron microscope (SEM) image of the cross-sectional sample, taking the central point in the L-axis direction or the W-axis direction of the first internal electrode 121 or the second internal electrode 122 as a reference point, the arithmetic mean value of the thicknesses of the internal electrodes 121 and 122 at 10 points separated from the reference point by a predetermined interval can be obtained, and the average thickness of the internal electrode can be obtained.

[0072] The interval between the 10 points can be adjusted according to the scale of the scanning electron microscope (SEM) image. At this time, all 10 points must be located within the first internal electrode 121 or the second internal electrode 122. If all 10 points are not located within the first internal electrode 121 or the second internal electrode 122, the position of the reference point can be changed, or the interval between the 10 points can be adjusted.

[0073] The laminated structure and constituent elements of the internal electrodes 121 and 122 containing the compound represented by Chemical Formula 1 described above can be confirmed by the following method.

[0074] In the scanning electron microscope (SEM) image of the cross-sectional sample, the internal electrodes 121 and 122 in the form of plate-shaped unit maxine layers laminated in a plate shape can be confirmed.

[0075] Also, by SEM-EDS analysis, it can be confirmed that the elements constituting the internal electrodes 121 and 122 are the elements constituting the maxine compound (for example, Ti, C, etc.).

[0076] Dielectric layer The dielectric layer 111 contains a dielectric, and the dielectric can include a main component and a sub-component.

[0077] The main component is the base material of the dielectric, has a high dielectric constant, and contributes to the formation of the dielectric constant of the multilayer capacitor 100.

[0078] As an example, the main component includes a barium titanate-based compound, and the barium titanate-based compound is Ba mTiO3 (0.995 ≤ m ≤ 1.010), (Ba 1-x Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba m (Ti 1-x Zr x )O3 (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba 1-x Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a dielectric material containing a combination thereof may be used.

[0079] As an example, the main component may include BaTiO3, Ba(Ti,Zr)O3, Ba(Ti,Sn)O3, (Ba,Ca)TiO3, (Ba,Ca)(Ti,Zr)O3, (Ba,Ca)(Ti,Sn)O3, (Ba,Sr)TiO3, (Ba,Sr)(Ti,Zr)O3, (Ba,Sr)(Ti,Sn)O3, or a combination thereof.

[0080] As an example, the sub-components may include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof.

[0081] The dielectric can further contain a ceramic additive, an organic solvent, a binder, a dispersant, or a combination thereof.

[0082] As an example, the average thickness of the dielectric layer 111 is 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, and can be 3 μm or less, 2.9 μm or less, 2.8 μm or less, or 2.7 μm.

[0083] During the firing process of the capacitor body, the shrinkage of the Maxin compound contained in the internal electrodes 121 and 122 in the T-axis direction can be activated while suppressing the shrinkage in the L-axis direction and the W-axis direction. As a result, the shrinkage of the dielectric layer 111 in the L-axis direction and the W-axis direction can also be suppressed. Therefore, there is an advantage that the thickness of the dielectric layer 111 can be thinned while the shrinkage of the dielectric layer 111 in the T-axis direction is activated.

[0084] The average thickness of the dielectric layer 111 can be measured by the following method.

[0085] First, prepare a scanning electron microscope image obtained by observing a cross-sectional sample with a scanning electron microscope (SEM).

[0086] In the scanning electron microscope (SEM) image of the cross-sectional sample, it can be the arithmetic mean value of the thickness of the dielectric layer 111 at 10 points separated by a predetermined interval from a reference point, with the reference point being the central point in the length direction (L-axis direction) or the width direction (W-axis direction) of the dielectric layer 111.

[0087] The interval between the 10 points can be adjusted according to the scale of the scanning electron microscope (SEM) image. At this time, all 10 points must be located within the dielectric layer 111. If all 10 points are not located within the dielectric layer 111, the position of the reference point can be changed, or the interval between the 10 points can be adjusted.

[0088] External electrode The first external electrode 131 and the second external electrode 132 are provided with voltages of different polarities, and are respectively connected to the exposed portions of the first internal electrode 121 and the second internal electrode 122 so as to be electrically connected.

[0089] With the above configuration, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, charges are accumulated between the first internal electrode 121 and the second internal electrode 122 facing each other. At this time, the capacitance of the multilayer capacitor 100 is proportional to the overlapping area of the first internal electrode 121 and the second internal electrode 122 that overlap each other along the T-axis direction in the active region.

[0090] The first external electrode 131 and the second external electrode 132 are respectively disposed on the third surface and the fourth surface of the capacitor body 110, and include a first connection portion and a second connection portion connected to the first internal electrode 121 and the second internal electrode 122, the third surface and the fourth surface of the capacitor body 110, and a first band portion and a second band portion disposed at the corners where the first surface and the second surface or the fifth surface and the sixth surface are in contact.

[0091] The first band portion and the second band portion are respectively extended from the first connection portion and the second connection portion to a part of the first surface and the second surface or the fifth surface and the sixth surface of the capacitor body 110. The first band portion and the second band portion serve to improve the fixing strength of the first external electrode 131 and the second external electrode 132.

[0092] As an example, the first external electrode 131 and the second external electrode 132 may each include a sintered metal layer in contact with the capacitor body 110, a conductive resin layer disposed so as to cover the sintered metal layer, and a plating layer disposed so as to cover the conductive resin layer.

[0093] The sintered metal layer may include a conductive metal and glass.

[0094] As an example, the sintered metal layer can include copper (Cu), nickel (Ni), silver (Ag), palladium (Pd), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), lead (Pb), alloys thereof, or combinations thereof as the conductive metal. For example, copper (Cu) can include a copper (Cu) alloy. When the conductive metal contains copper, the metal other than copper may be contained in an amount of 5 mol parts or less with respect to 100 mol parts of copper.

[0095] As an example, the sintered metal layer can include a composition in which an oxide is mixed as glass. For example, it may be one or more selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, and alkaline earth metal oxide. The transition metal is selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni), the alkali metal is selected from the group consisting of lithium (Li), sodium (Na), and potassium (K), and the alkaline earth metal may be one or more selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0096] Optionally, the conductive resin layer is formed on the sintered metal layer. For example, it can be formed in a form that completely covers the sintered metal layer. On the other hand, the first external electrode 131 and the second external electrode 132 may not include the sintered metal layer. In this case, the conductive resin layer may be in direct contact with the capacitor body 110.

[0097] The conductive resin layer extends to the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110. The length of the region (i.e., the band portion) where the conductive resin layer extends and is disposed on the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110 may be longer than the length of the region (i.e., the band portion) where the sintered metal layer extends and is disposed on the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110. That is, the conductive resin layer is formed on the sintered metal layer and can be formed in a form that completely covers the sintered metal layer.

[0098] The conductive resin layer contains a resin and a conductive metal.

[0099] The resin contained in the conductive resin layer has bonding properties and shock absorbency, and is not particularly limited as long as it can be mixed with the conductive metal powder to form a paste. For example, it can contain a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin.

[0100] The conductive metal contained in the conductive resin layer serves to be electrically connected to the first internal electrode 121 and the second internal electrode 122 or the sintered metal layer.

[0101] The conductive metal contained in the conductive resin layer can have a spherical, flake-shaped, or a combination of these forms. That is, the conductive metal may consist only of flake-shaped, or only of spherical, or may be a form in which flakes and spheres are mixed.

[0102] Here, the spherical shape can also include a shape that is not a perfect sphere. For example, it can include a shape in which the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-shaped powder means a powder having a flat and elongated shape, and is not particularly limited. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be 1.95 or more.

[0103] The first external electrode 131 and the second external electrode 132 can further include a plating layer disposed outside the conductive resin layer.

[0104] The plating layer can include nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), etc. alone or alloys thereof. As an example, the plating layer may be a nickel (Ni) plating layer or a tin (Sn) plating layer, or may be in a form in which a nickel (Ni) plating layer and a tin (Sn) plating layer are sequentially laminated, or may be in a form in which a tin (Sn) plating layer, a nickel (Ni) plating layer, and a tin (Sn) plating layer are sequentially laminated. Also, the plating layer can include a plurality of nickel (Ni) plating layers and / or a plurality of tin (Sn) plating layers.

[0105] The plating layer can improve the mountability with the substrate of the multilayer capacitor 100, the structural reliability, the durability against the outside, the heat resistance, and the equivalent series resistance (ESR).

[0106] Manufacturing method of multilayer capacitor The manufacturing method of the multilayer capacitor according to another embodiment includes a step of manufacturing a capacitor body including a dielectric layer and an internal electrode, and a step of forming an external electrode outside the capacitor body.

[0107] First, the manufacturing of the capacitor body will be described.

[0108] In the manufacturing process of the capacitor body, a dielectric paste that becomes a dielectric layer after firing and a conductive paste that becomes an internal electrode after firing are prepared.

[0109] The dielectric paste is manufactured, for example, by the following method. The dielectric powder is uniformly mixed by means such as wet mixing, dried, and then heat-treated under predetermined conditions to obtain a plastic powder. An organic vehicle or an aqueous vehicle is added to the obtained plastic powder and kneaded to prepare a dielectric paste.

[0110] The obtained dielectric paste is formed into a sheet by a technique such as the doctor blade method to obtain a dielectric green sheet. Further, the dielectric paste may contain additives selected from various dispersants, plasticizers, dielectrics, sub-component compounds, or glass as needed.

[0111] The conductive paste for the internal electrode can be prepared by containing the maxine compound represented by the above chemical formula 1. Since the maxine compound represented by the chemical formula 1 has been described above, the description is omitted here.

[0112] As an example, the conductive paste for the internal electrode can be applied in a predetermined pattern on the surface of the dielectric green sheet by various printing methods such as screen printing or transfer methods. As another example, the conductive paste for the internal electrode can be applied on the surface of the dielectric green sheet by a coating process such as spin coating or spray coating.

[0113] Then, after laminating the dielectric green sheets with the internal electrode patterns formed thereon over a plurality of layers, the dielectric green sheet laminate is obtained by pressing in the lamination direction. At this time, the dielectric green sheet and the internal electrode pattern can be laminated so that the dielectric green sheets are positioned on the upper and lower surfaces in the lamination direction of the dielectric green sheet laminate.

[0114] Optionally, the obtained dielectric green sheet laminate can be cut into a predetermined size by dicing or the like.

[0115] Further, the dielectric green sheet laminate can be solidified and dried to remove a plasticizer or the like as necessary, and can be barrel-polished using a horizontal centrifugal barrel polishing machine or the like after solidification and drying. In barrel polishing, the dielectric green sheet laminate is put into a barrel container together with media and a polishing liquid, and rotational motion, vibration, or the like is applied to the barrel container to polish unnecessary portions such as burrs generated during cutting. Further, after barrel polishing, the dielectric green sheet laminate can be washed with a cleaning liquid such as water and dried.

[0116] The dielectric green sheet laminate is subjected to a debinding process and a firing process to obtain a capacitor body.

[0117] The conditions of the debinding process can be appropriately adjusted according to the main component composition of the dielectric layer and the main component composition of the internal electrode. For example, the heating rate during the debinding process may be 5°C / hour to 300°C / hour, the holding temperature may be 180°C to 400°C, and the temperature holding time may be 0.5 hour to 24 hours. The debinding atmosphere may be air or a reducing atmosphere.

[0118] The conditions of the firing process can be appropriately adjusted according to the main component composition of the dielectric layer and the main component composition of the internal electrode. For example, the temperature during firing may be 1200°C to 1350°C, or 1220°C to 1300°C, and the time may be 0.5 hour to 8 hours, or 1 hour to 3 hours. The firing atmosphere may be a reducing atmosphere, for example, an atmosphere in which a mixed gas of nitrogen gas (N2) and hydrogen gas (H2) is humidified.

[0119] After the firing process, annealing can be performed as necessary. Annealing is a process for re-oxidizing the dielectric layer, and can be performed when the firing process is carried out in a reducing atmosphere. The conditions of the annealing process can also be appropriately adjusted according to the main component composition of the dielectric layer, etc. For example, the temperature during annealing may be 950°C to 1150°C, the time may be 0 hours to 20 hours, and the heating rate may be 50°C / hour to 500°C / hour. The annealing atmosphere may be a humidified nitrogen gas (N2) atmosphere, and the oxygen partial pressure may be 1.0×10 -9 MPa to 1.0×10 -5 MPa.

[0120] In the debinding process, firing process, or annealing process, in order to humidify nitrogen gas, mixed gas, etc., a wetter, etc. can be used, and in this case, the water temperature may be 5°C to 75°C. The debinding process, firing process, and annealing process can be carried out continuously or independently.

[0121] Optionally, surface treatment such as sandblasting, laser irradiation, or barrel polishing can be performed on the third and fourth surfaces of the obtained capacitor body. By performing such surface treatment, the ends of the first internal electrode and the second internal electrode are exposed on the outermost surfaces of the third and fourth surfaces, whereby the electrical connection between the first external electrode and the second external electrode and the first internal electrode and the second internal electrode becomes good, and an alloy part can be easily formed.

[0122] Thereafter, a sintered metal layer forming paste can be applied to the outer surface of the obtained capacitor body and then sintered to form a sintered metal layer.

[0123] The paste for forming a sintered metal layer can contain a conductive metal and glass. Since the descriptions of the conductive metal and glass are as described above, repetitive explanations are omitted. Further, the paste for forming a sintered metal layer can selectively contain sub-components such as a binder, a solvent, a dispersant, a plasticizer, or oxide powder. For example, ethyl cellulose, acrylic, or butyral can be used as the binder, and organic solvents such as terpineol, butyl carbitol, alcohol, methyl ethyl ketone, acetone, or toluene, or aqueous solvents can be used as the solvent.

[0124] As a method of applying the paste for forming a sintered metal layer to the outer surface of the capacitor body, a dipping method, various printing methods such as screen printing, an application method using a dispenser, or a spraying method using a spray can be used. The paste for the sintered metal layer is applied to at least the third and fourth surfaces of the capacitor body, and can also be applied selectively to a part of the first surface, the second surface, the fifth surface, or the sixth surface where the band portions of the first external electrode and the second external electrode are formed.

[0125] Thereafter, the capacitor body coated with the paste for forming a sintered metal layer is dried and sintered at a temperature of 700 °C to 1000 °C for 0.1 hour to 3 hours to form a sintered metal layer.

[0126] Optionally, a conductive resin layer can be formed by applying a paste for forming a conductive resin layer to the outer surface of the obtained capacitor body and then curing it.

[0127] The paste for forming a conductive resin layer can contain a resin and optionally a conductive metal or a non-conductive filler. Since the explanations regarding the conductive metal and the resin are as described above, repetitive explanations are omitted. Also, the paste for forming a conductive resin layer can optionally contain sub-components such as a binder, a solvent, a dispersant, a plasticizer, or oxide powder. For example, as the binder, ethyl cellulose, acrylic, or butyral can be used, and as the solvent, organic solvents such as terpineol, butyl carbitol, alcohol, methyl ethyl ketone, acetone, or toluene, or aqueous solvents can be used.

[0128] As an example, the method for forming a conductive resin layer can be to dip the capacitor body 110 into the paste for forming a conductive resin layer and then cure it, or to print the paste for forming a conductive resin layer on the surface of the capacitor body 110 by a screen printing method or a gravure printing method, or to apply the paste for forming a conductive resin layer on the surface of the capacitor body 110 and then cure it to form.

[0129] Thereafter, a plating layer is formed outside the conductive resin layer.

[0130] As an example, the plating layer can be formed by a plating method, and can also be formed by sputtering or electric deposition.

[0131] Hereinafter, specific embodiments of the invention will be presented. However, the embodiments described below are merely for specifically exemplifying or explaining the invention, and the scope of the invention should not be limited thereby.

Example

[0132] Example 1 A slurry for a dielectric containing BaTiO3 was produced, and the slurry for the dielectric was coated using an on-roll coater of a head discharge method to produce a dielectric green sheet with a thickness of 4 μm. Thereafter, a conductive paste for an internal electrode containing Ti2C was prepared.

[0133] The conductive paste was printed on the surface of the dielectric green sheet with a thickness of 2 μm (350 layers of Ti2C), and the dielectric green sheet with the conductive paste layer formed was laminated and pressed to produce a laminated body of dielectric green sheets.

[0134] The laminated body of dielectric green sheets was subjected to a plasticizing process in a nitrogen atmosphere at 400 °C or lower and then fired under the conditions of a firing temperature of 1300 °C or lower and a hydrogen concentration of 1.0% H2 or lower to produce a laminated capacitor according to Example 1.

[0135] Example 2 A laminated capacitor according to Example 2 was produced in the same manner as in Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet with a thickness of 1 μm (145 layers of Ti2C).

[0136] Example 3 A laminated capacitor according to Example 3 was produced in the same manner as in Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet with a thickness of 0.2 μm (24 layers of Ti2C).

[0137] Example 4 A laminated capacitor according to Example 4 was produced in the same manner as in Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet with a thickness of 0.005 μm (1 layer of Ti2C).

[0138] Comparative Example 1 A slurry for a dielectric containing BaTiO3 was produced, and a 4-μm-thick dielectric green sheet was produced using the slurry for the dielectric with an on-roll coater of the head discharge method. Thereafter, a conductive paste for an internal electrode containing Ni was prepared.

[0139] The conductive paste was printed on the surface of the dielectric green sheet to a thickness of 4 μm, and the dielectric green sheet with a conductive paste layer formed thereon was laminated and pressed to produce a laminated body of dielectric green sheets.

[0140] The laminated body of dielectric green sheets was subjected to a plasticizing process in a nitrogen atmosphere at 400°C or lower and then fired under conditions of a firing temperature of 1300°C or lower and a hydrogen concentration of 1.0% H2 or lower to produce a laminated capacitor according to Comparative Example 1.

[0141] Comparative Example 2 A laminated capacitor according to Comparative Example 2 was produced in the same manner as in Comparative Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet to a thickness of 3 μm.

[0142] Comparative Example 3 A laminated capacitor according to Comparative Example 3 was produced in the same manner as in Comparative Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet to a thickness of 2 μm.

[0143] Comparative Example 4 A laminated capacitor according to Comparative Example 4 was produced in the same manner as in Comparative Example 1, except that the conductive paste was printed on the surface of the dielectric green sheet to a thickness of 1 μm.

[0144] (Evaluation Example) Evaluation Example 1: Thickness Evaluation of Internal Electrode and Dielectric Layer In the laminated capacitors according to Example 1 and Comparative Example 1, the thicknesses of the internal electrode and the dielectric layer are measured by the following method.

[0145] First, after placing the multilayer capacitor in an epoxy mixture and curing it, the side surfaces of the capacitor body in the L-axis direction and the T-axis direction are polished to the 1 / 2 point in the W-axis direction. After fixing, it is maintained in a vacuum atmosphere chamber, and a cross-sectional sample (hereinafter referred to as the "cross-sectional sample") cut from the center of the capacitor body in the W-axis direction in the L-axis direction and the T-axis direction is prepared.

[0146] After that, in the scanning electron microscope (SEM) image of the cross-sectional sample, taking the central point of the internal electrode in the L-axis direction or the W-axis direction as the reference point, the arithmetic mean value of the thickness of the internal electrode at 10 points separated from the reference point by a predetermined interval is obtained to obtain the average thickness of the internal electrode.

[0147] Also, in the scanning electron microscope (SEM) image of the cross-sectional sample, taking the central point of the dielectric layer in the L-axis direction or the W-axis direction as the reference point, the arithmetic mean value of the thickness of the dielectric layer at 10 points separated from the reference point by a predetermined interval is obtained to obtain the average thickness of the dielectric layer.

[0148]

Table 1

[0149] Referring to Table 1, in the case of the multilayer capacitors according to Examples 1 to 4, it can be confirmed that by applying Ti2C, which is a maxine compound, to the internal electrodes, the thickness of the internal electrodes is very thin compared to Comparative Examples 1 to 4.

[0150] Also, in the case of the examples, since the shrinkage of the internal electrode and the dielectric layer in the T-axis direction is activated, even if a dielectric green sheet having the same thickness as that of the comparative example is fired, it can be confirmed that the average thickness of the dielectric layer is relatively thin after firing.

[0151] Evaluation Example 2: Evaluation of High-Frequency Region Impedance Characteristics The impedance characteristics in the high-frequency region were evaluated for the multilayer capacitors according to Example 1 and Comparative Example 3, and the results are shown in FIG. 5.

[0152] In the case of the multilayer capacitor according to Comparative Example 3, it can be confirmed that due to the high magnetic permeability of Ni used for the internal electrode, the ESL value is large and the resonance frequency is measured to be low.

[0153] On the other hand, in the case of the multilayer capacitor according to Example 1, it can be confirmed that due to the low magnetic permeability of the Maxin compound used for the internal electrode, the ESL value is reduced and the impedance characteristics in the high-frequency region are improved.

[0154] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited thereto, and various modifications can be made and implemented within the scope of the claims, the detailed description of the invention, and the attached drawings, and it is natural that this also belongs to the scope of the present invention.

Explanation of Reference Numerals

[0155] 100: Multilayer capacitor 110: Capacitor body 111: Dielectric layer 112, 113: Cover region 121: First internal electrode 122: Second internal electrode 131: First external electrode 132: Second external electrode

Claims

1. A multilayer capacitor including a capacitor body including a dielectric layer and internal electrodes, and external electrodes disposed outside the capacitor body, wherein the internal electrodes include a compound represented by the following Chemical Formula 1: 【Chemical Formula 1】 M ｎ＋１ X ｎ In Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or a combination thereof, X includes C, N, or a combination thereof, and 1 ≤ n ≤ 2.

2. The compound represented by the chemical formula 1 contains Ti ２ C, V ２ C, Nb ２ C, Mo ２ C, Mo ２ N, Ti ２ N, (Ti ２－ｙ Nb ｙ ), C, (V ２－ｙ Nb ｙ ), C, (Ti ２－ｙ V ｙ ), C, W １．３３ C, Nb １．３３ C, Mo １．３３ C, Mo １．３３ Y ０．６７ C, or a combination thereof (0 < y < 2), the multilayer capacitor according to claim 1.

3. The compound represented by Chemical Formula 1 is a plate-shaped unit Mxene layer, and the internal electrodes include a Mxene laminate in which one or more unit Mxene layers are laminated. The multilayer capacitor according to claim 1.

4. The internal electrodes include a Mxene laminate in which 1 to 500 unit Mxene layers are laminated. The multilayer capacitor according to claim 3.

5. The average thickness of the internal electrodes is 0.002 μm to 2.5 μm. The multilayer capacitor according to claim 1.

6. The average thickness of the dielectric layer is 0.5 μm to 3 μm. The multilayer capacitor according to claim 1.

7. The dielectric layer mainly includes a barium titanate-based compound, The barium titanate-based compound is Ba ｍ TiO ３ (0.995 ≤ m ≤ 1.010), (Ba １－ｘ Ca ｘ ). ｍ (Ti １－ｙ Zr ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba ｍ (Ti １－ｘ Zr ｘ )O ３ (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba １－ｘ Ca ｘ ). ｍ (Ti １－ｙ Sn ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof, the multilayer capacitor according to claim 1.

8. The dielectric layer further includes a sub-component, and the sub-component includes dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof. The multilayer capacitor according to claim 7.

9. A multilayer capacitor including a capacitor body including a dielectric layer and internal electrodes, and external electrodes disposed outside the capacitor body, wherein the internal electrodes include a compound represented by the following Chemical Formula 1, and the average thickness of the internal electrodes is 0.002 μm to 2.5 μm: 【Chemical Formula 1】 M ｎ＋１ X ｎ In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, W, Y, or a combination thereof, X includes C, N, or a combination thereof, and 1 ≤ n ≤ 2.

10. The compound represented by the chemical formula 1 contains Ti ２ C, V ２ C, Nb ２ C, Mo ２ C, Mo ２ N, Ti ２ N, (Ti ２－ｙ Nb ｙ ), C, (V ２－ｙ Nb ｙ ), C, (Ti ２－ｙ V ｙ ), C, W １．３３ C, Nb １．３３ C, Mo １．３３ C, Mo １．３３ Y ０．６７ The multilayer capacitor according to claim 9, comprising C, or a combination thereof (0 < y < 2).

11. The compound represented by the above Chemical Formula 1 is a plate-shaped unit Mxene layer, The internal electrode includes a Mxene laminate in which one or more layers of the unit Mxene layer are laminated, and the multilayer capacitor according to Claim 9.

12. The internal electrode includes a Mxene laminate in which 1 to 500 layers of the unit Mxene layer are laminated, and the multilayer capacitor according to Claim 11.

13. The average thickness of the dielectric layer is 0.5 μm to 3 μm, and the multilayer capacitor according to Claim 9.

14. The dielectric layer mainly contains a barium titanate-based compound, The barium titanate compound is Ba ｍ TiO ３ (0.995 ≤ m ≤ 1.010), (Ba １－ｘ Ca ｘ ) ｍ (Ti １－ｙ Zr ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba ｍ (Ti １－ｘ Zr ｘ )O ３ (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba １－ｘ Ca ｘ ) ｍ (Ti １－ｙ Sn ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof, the multilayer capacitor according to claim 9.

15. The dielectric layer further contains a sub-component, The sub-component includes dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof, and the multilayer capacitor according to Claim 14.

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