Manufacturing method of electronic component

Abstract

To provide a manufacturing method of an electronic component that can form a cutting mark with high precision.SOLUTION: A manufacturing method of a coil component 1 includes the steps of forming a cutting mark 102 by photolithography using a photosensitive paste, forming a laminate 100, integrating the cutting mark 102 with the laminate 100, and cutting the laminate 100 on the basis of the cutting mark 102.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a method for manufacturing electronic components.

Background Art

[0002] As a method for manufacturing electronic components, for example, the method described in Patent Document 1 is known. In the method for manufacturing electronic components described in Patent Document 1, in a manufacturing method including a step of cutting a laminate (laminated block) formed by laminating ceramic green sheets having a plurality of electrodes disposed on the surface at a predetermined position to cut out individual unfired ceramic elements, a step of forming a cutting mark (cut mark) at a predetermined position on the upper surface of the laminate based on a sensing mark exposed on the end surface of the laminate, and a step of cutting the laminate at a predetermined position based on the cutting mark. In this method for manufacturing electronic components, the cutting mark is formed by a method such as making an indentation on the upper surface of the laminate, a method of printing a paint by an inkjet or a dispenser, or a laser marking method of performing marking using a laser.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the manufacturing process of electronic components, displacement of the cutting position of the laminate can affect the characteristics of the electronic components. The accuracy of the cutting position of the laminate may depend on the accuracy of the cutting mark. If the accuracy of the shape and dimensions of the cutting mark is low, the accuracy of the cutting position may also be low. Therefore, in order to improve the accuracy of the cutting position of the laminate, it is necessary to form the cutting mark with high precision.

[0005] One aspect of the present invention aims to provide a method for manufacturing an electronic component capable of forming a cutting mark with high precision.

Means for Solving the Problems

[0006] (1) The method for manufacturing an electronic component according to one aspect of the present invention includes a step of forming a cutting mark by a photolithography method using a photosensitive paste, a step of forming a laminate, a step of integrating the cutting mark and the laminate, and a step of cutting the laminate based on the cutting mark.

[0007] In the method for manufacturing an electronic component according to one aspect of the present invention, the cutting mark is formed by a photolithography method using a photosensitive paste. Thereby, in the method for manufacturing an electronic component, the shape and dimensions of the cutting mark can be formed with high accuracy. Therefore, in the method for manufacturing an electronic component, the cutting mark can be formed with high precision. As a result, the accuracy of the cutting position of the laminate can be improved, and a highly reliable electronic component can be manufactured.

[0008] (2) In the method for manufacturing an electronic component described in (1) above, after forming the laminate, the cutting mark may be transferred to the laminate to integrate the cutting mark and the laminate. In the method of forming the laminate after forming the cutting mark and transferring the cutting mark to the laminate, for example, even when lamination misalignment or the like occurs in the laminate forming step and adjustment of the position of the cutting mark is required, the position of the cutting mark cannot be adjusted. In the above method, since the cutting mark is transferred to the already formed laminate, the position of the cutting mark can be determined according to the state of the laminate, and the cutting mark can be transferred to the laminate. Therefore, the cutting mark can be transferred so as to define the exact cutting position of the laminate.

[0009] (3) In the method for manufacturing an electronic component described in (1) or (2) above, the color tone of the surface of the laminate where the cutting mark is transferred and the cutting mark may be different. In this method, since the laminate and the cutting mark can be distinguished, the cutting mark can be accurately recognized.

[0010] (4) In the method for manufacturing any one of the electronic components (1) to (3) above, in the step of forming a laminate, an insulating layer is formed by a photolithography method using a photosensitive insulating paste, and a plurality of insulating layers are laminated to form a laminate. The material constituting the cutting mark and the material constituting the insulating layer may be the same material. In this method, the cutting mark can be formed by the material for forming the laminate (insulating layer) without separately preparing the material for forming the cutting mark. Therefore, an increase in the cost related to the manufacture of the cutting mark can be avoided.

[0011] (5) In the method for manufacturing any one of the electronic components (1) to (4) above, in the step of forming a cutting mark, a mark layer may be formed and the mark layers may be laminated to form a cutting mark. In this method, by laminating a plurality of mark layers, the thickness of the cutting mark becomes thicker. Thereby, the shade of the color of the cutting mark can be made darker. Therefore, for example, even when the material constituting the cutting mark and the material constituting the insulating layer are the same material, the color tone of the cutting mark and the laminate can be made different.

Advantages of the Invention

[0012] According to one aspect of the present invention, a cutting mark can be formed with high precision.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

[0015] FIG. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to an embodiment. As shown in FIG. 1, a coil component (electronic component) 1 includes a rectangular parallelepiped body 2 and a pair of terminal electrodes 4 and 5. The pair of terminal electrodes 4 and 5 are respectively disposed at both ends of the body 2. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and ridge lines are chamfered, and a rectangular parallelepiped shape in which the corners and ridge lines are rounded.

[0016] The body 2 has a pair of end faces 2a and 2b facing each other, a pair of main faces 2c and 2d facing each other, and a pair of side faces 2e and 2f facing each other. The direction in which the pair of main faces 2c and 2d face each other, that is, the direction parallel to the end faces 2a and 2b, is the first direction D1. The direction in which the pair of end faces 2a and 2b face each other, that is, the direction parallel to the main faces 2c and 2d, is the second direction D2. The direction in which the pair of side faces 2e and 2f face each other is the third direction D3. In the present embodiment, the first direction D1 is the height direction of the body 2. The second direction D2 is the longitudinal direction of the body 2 and is orthogonal to the first direction D1. The third direction D3 is the width direction of the body 2 and is orthogonal to the first direction D1 and the second direction D2.

[0017] The pair of end faces 2a, 2b extend in the first direction D1 so as to connect between the pair of main faces 2c, 2d. The pair of end faces 2a, 2b also extend in the third direction D3, i.e., the short side direction of the pair of main faces 2c, 2d. The pair of side faces 2e, 2f extend in the first direction D1 so as to connect between the pair of main faces 2c, 2d. The pair of side faces 2e, 2f also extend in the second direction D2, i.e., the long side direction of the pair of end faces 2a, 2b. The coil component 1 is, for example, soldered to an electronic device (e.g., a circuit board or an electronic component). In the coil component 1, the main face 2c constitutes a mounting face facing the electronic device.

[0018] As shown in FIG. 2, the base body 2 is formed by laminating a plurality of insulator layers 6 in the third direction D3. The base body 2 has a plurality of insulator layers 6 laminated thereon. In the base body 2, the direction in which the plurality of insulator layers 6 are laminated coincides with the third direction D3. In the actual base body 2, each insulator layer 6 is integrated to such an extent that the boundary between each insulator layer 6 is not visible.

[0019] Each insulator layer 6 is formed of a dielectric material containing a glass component. That is, the base body 2 contains a dielectric material containing a glass component as a compound of the elements constituting the base body 2. The glass component is, for example, borosilicate glass or the like. The dielectric material is, for example, a dielectric ceramic such as a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. Each insulator layer 6 is composed of a sintered body of a ceramic green sheet containing a glass ceramic material.

[0020] As shown in FIG. 3, the base body 2 has recesses 7 and 8. The recess 7 is provided on the end face 2a side of the base body 2. The recess 7 is a space that is recessed inward from the outer surface of the base body 2. The recess 7 has a shape corresponding to the shape of the terminal electrode 4. In the present embodiment, the recess 7 has an L shape when viewed from the third direction D3. The recess 8 is provided on the end face 2b side of the base body 2. The recess 8 is a space that is recessed inward from the outer surface of the base body 2. The recess 8 has a shape corresponding to the shape of the terminal electrode 5. In the present embodiment, the recess 8 has an L shape when viewed from the third direction D3.

[0021] As shown in FIG. 3, each of the terminal electrodes 4 and 5 is embedded in the base body 2. The terminal electrode 4 is disposed on the end face 2a side of the base body 2. The terminal electrode 4 is disposed in the recess 7 of the base body 2. The terminal electrode 5 is disposed on the end face 2b side of the base body 2. The terminal electrode 5 is disposed in the recess 8 of the base body 2.

[0022] The terminal electrode 4 is disposed across the end face 2a and the main face 2d. The terminal electrode 5 is disposed across the end face 2b and the main face 2d. In the present embodiment, the surface of the terminal electrode 4 is substantially flush with each of the end face 2a and the main face 2d. The surface of the terminal electrode 5 is substantially flush with each of the end face 2b and the main face 2d.

[0023] The terminal electrode 4 has an L shape when viewed from the third direction D3. The terminal electrode 4 has a plurality of electrode portions 4a and 4b. In the present embodiment, the terminal electrode 4 has a pair of electrode portions 4a and 4b. The electrode portion 4a and the electrode portion 4b are connected at the ridge line portion of the base body 2 and are electrically connected to each other. In the present embodiment, the electrode portion 4a and the electrode portion 4b are integrally formed. The electrode portion 4a extends along the first direction D1. The electrode portion 4a has a rectangular shape when viewed from the second direction D2. The electrode portion 4b extends along the second direction D2. The electrode portion 4b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 4a and 4b extends along the third direction D3.

[0024] 2, the terminal electrode 4 is configured by stacking a plurality of electrode layers 10 and a plurality of electrode layers 11. In this embodiment, the number of electrode layers 10 is "2", and the number of electrode layers 11 is "4". The electrode layers 10 are disposed at positions sandwiching the electrode layer 11 in the third direction D3.

[0025] Each electrode layer 10 is provided in a defect portion formed in the corresponding insulator layer 6. The defect portion constitutes a recess 7. The electrode layer 10 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, for example, Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements constituting the element body 2, and may be the same component as the glass component contained in the element body 2. The content of the glass component may be appropriately set. Each electrode layer 10 has an L-shape when viewed from the third direction D3. The electrode layer 10 has layer portions 10a and 10b. The layer portion 10a extends along the first direction D1. The layer portion 10b extends along the second direction D2.

[0026] Each electrode layer 11 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 7. The electrode layer 11 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 11 has an L-shape when viewed from the third direction D3. The electrode layer 11 has layer portions 11a and 11b. The layer portion 11a extends along the first direction D1. The layer portion 11b extends along the second direction D2.

[0027] The electrode portion 4a is formed by stacking the layer portions 10a, 11a of the electrode layers 10, 11. In the electrode portion 4a, the layer portions 10a, 11a are integrated to such an extent that the boundary between the layer portions 10a, 11a is not visible. The electrode portion 4b is formed by stacking the layer portions 10b, 11b of the electrode layers 10, 11. In the electrode portion 4b, the layer portions 10b, 11b are integrated to such an extent that the boundary between the layer portions 10b, 11b is not visible.

[0028] As shown in FIG. 3, the terminal electrode 5 has an L-shape when viewed from the third direction D3. The terminal electrode 5 has a plurality of electrode portions 5a, 5b. In this embodiment, the terminal electrode 5 has a pair of electrode portions 5a, 5b. The electrode portion 5a and the electrode portion 5b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 5a and the electrode portion 5b are integrally formed. The electrode portion 5a extends along the first direction D1. The electrode portion 5a has a rectangular shape when viewed from the second direction D2. The electrode portion 5b extends along the second direction D2. The electrode portion 5b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 5a, 5b extends along the third direction D3.

[0029] 2, the terminal electrode 5 is configured by stacking a plurality of electrode layers 12 and a plurality of electrode layers 13. In this embodiment, the number of electrode layers 12 is "2", and the number of electrode layers 13 is "4". The electrode layers 12 are disposed at positions sandwiching the electrode layer 13 in the third direction D3.

[0030] Each electrode layer 12 is provided in a defect portion formed in the corresponding insulator layer 6. The defect portion forms a recess 8. The electrode layer 12 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, for example, Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements that constitute the element body 2, and may be the same component as the glass component contained in the element body 2. Each electrode layer 12 has an L-shape when viewed from the third direction D3. The electrode layer 12 has layer portions 12a and 12b. The layer portion 12a extends along the first direction D1. The layer portion 12b extends along the second direction D2.

[0031] Each electrode layer 13 is provided in a defect formed in the corresponding insulator layer 6. The defect constitutes a recess 8. The electrode layer 13 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 13 has an L-shape when viewed from the third direction D3. The electrode layer 13 has layer portions 13a and 13b. The layer portion 13a extends along the first direction D1. The layer portion 13b extends along the second direction D2.

[0032] The electrode portion 5a is formed by stacking the layer portions 12a and 13a of the electrode layers 12 and 13. In the electrode portion 5a, the layer portions 12a and 13a are integrated to such an extent that the boundary between the layer portions 12a and 13a is not visible. The electrode portion 5b is formed by stacking the layer portions 12b and 13b of the electrode layers 12 and 13. In the electrode portion 5b, the layer portions 12b and 13b are integrated to such an extent that the boundary between the layer portions 12b and 13b is not visible.

[0033] 3, the coil component 1 includes a coil 9 disposed in the body 2. A coil axis AX of the coil 9 extends along a third direction D3.

[0034] As shown in FIG. 2, the coil 9 has a first coil conductor 22, a second coil conductor 23, a third coil conductor 24, and a fourth coil conductor 25. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are arranged in this order of the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 along the third direction D3. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 substantially exhibit a shape in which a part of the loop is interrupted, and have one end and the other end. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are formed with a predetermined width.

[0035] The first coil conductor 22 is located in the same layer as one electrode layer 11 and one electrode layer 13. The first coil conductor 22 is connected to the electrode layer 13 via a connection conductor 26. The connection conductor 26 is located in the same layer as the first coil conductor 22. One end of the first coil conductor 22 is connected to the connection conductor 26. The connection conductor 26 is connected to the layer portion 13a. The connection conductor 26 connects the first coil conductor 22 and the electrode layer 13. The connection conductor 26 may be connected to the layer portion 13b. The first coil conductor 22 is separated from the electrode layer 11 located in the same layer. In the present embodiment, the first coil conductor 22, the connection conductor 26, and the electrode layer 13 are integrally formed.

[0036] The second coil conductor 23 is located in the same layer as one electrode layer 11 and one electrode layer 13. The second coil conductor 23 is separated from the electrode layers 11 and 13 located in the same layer. The first coil conductor 22 and the second coil conductor 23 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the first coil conductor 22 and one end of the second coil conductor 23 overlap each other.

[0037] The third coil conductor 24 is located in the same layer as one electrode layer 11 and one electrode layer 13. The third coil conductor 24 is spaced apart from the electrode layers 11, 13 located in the same layer. The second coil conductor 23 and the third coil conductor 24 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the second coil conductor 23 and one end of the third coil conductor 24 overlap each other.

[0038] The fourth coil conductor 25 is located in the same layer as one electrode layer 11 and one electrode layer 13. The fourth coil conductor 25 is connected to the electrode layer 11 via the connection conductor 27. The connection conductor 27 is located in the same layer as the fourth coil conductor 25. The other end of the fourth coil conductor 25 is connected to the connection conductor 27. The connection conductor 27 is connected to the layer portion 11a. The connection conductor 27 connects the fourth coil conductor 25 and the electrode layer 11. The connection conductor 27 may be connected to the layer portion 11b. The fourth coil conductor 25 is spaced apart from the electrode layer 13 located in the same layer. In the present embodiment, the fourth coil conductor 25, the connection conductor 27, and the electrode layer 11 are integrally formed.

[0039] The third coil conductor 24 and the fourth coil conductor 25 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the third coil conductor 24 and one end of the fourth coil conductor 25 overlap each other.

[0040] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are electrically connected. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 constitute the coil 9. The coil 9 is electrically connected to the terminal electrode 5 through the connection conductor 26. The coil 9 is electrically connected to the terminal electrode 4 through the connection conductor 27.

[0041] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 contain a conductive material. The conductive material contains Ag or Pd. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 are configured as a sintered body of a conductive paste containing conductive material powder. The conductive material powder contains, for example, Ag powder or Pd powder.

[0042] In the present embodiment, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26, 27 contain the same conductive material as each of the terminal electrodes 4, 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26, 27 may contain a different conductive material from each of the terminal electrodes 4, 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 are provided in the defective portions formed in the corresponding insulator layers 6.

[0043] Subsequently, a method for manufacturing the coil component 1 will be described. FIG. 4 is a flowchart showing a method for manufacturing the coil component 1.

[0044] As shown in FIG. 4, first, a green sheet is formed (step S01). The green sheet is formed by applying a base paste (photosensitive insulating paste) containing a constituent material of the insulator layer 6 and a photosensitive material onto a base material (for example, a PET film). The photosensitive material contained in the base paste may be either a negative type or a positive type, and known ones can be used. Subsequently, the base forming layer is exposed and developed by, for example, a photolithography method using a Cr mask, and a base pattern in which a shape corresponding to the shape of the conductor forming layer described later is removed is formed on the base material. The base pattern is a layer that becomes the insulator layer 6 after heat treatment. Note that the "photolithography method" in the present embodiment may be any method that processes a layer to be processed containing a photosensitive material into a desired pattern by exposure and development, and the type of mask and the like are not limited.

[0045] Next, a conductor pattern is formed (step S02). The conductor pattern is formed by applying a conductor paste containing the constituent materials of the electrode layers 10, 11, 12, 13, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connection conductors 26, 27, and a photosensitive material onto a base material (e.g., a PET film) to form a conductor material layer. The photosensitive material contained in the conductive paste may be either a negative type or a positive type, and known materials can be used. Next, using a mask corresponding to the missing portion, the conductor material layer is exposed and developed by photolithography to form a conductor pattern corresponding to the shape of the missing portion on the base material.

[0046] Subsequently, a laminate 100 (see FIG. 7) is formed (step S03). The laminate 100 is formed by repeatedly transferring the element pattern and the conductor pattern onto a support to laminate the conductor pattern and the element pattern. Specifically, first, the conductor pattern is transferred from the base material onto the element formation layer. Next, the element pattern is transferred from the base material onto the element formation layer. The conductor pattern is combined with the missing portion of the element pattern, and the element pattern and the conductor pattern become the same layer on the element formation layer. Further, the transfer process of the conductor pattern and the element pattern is repeatedly performed to laminate the conductor pattern and the element pattern in a combined state with each other. Thereby, the laminate 100 is formed.

[0047] Also, a cutting mark 102 (see FIG. 6(a)) is formed (step S04). The cutting mark 102 is formed by applying a mark paste (photosensitive paste) containing the constituent material of the cutting mark 102 and a photosensitive material onto a base material (e.g., a PET film) to form a mark formation layer. In this embodiment, the constituent material contained in the mark paste is the same as the constituent material contained in the element paste. The photosensitive material contained in the mark paste may be either a negative type or a positive type, and known materials can be used. Subsequently, the mark formation layer is exposed and developed by photolithography using, for example, a Cr mask to form a mark layer M (see FIG. 5(a)) on the base material.

[0048] FIG. 5(a) is a front view of a single mark layer, and FIG. 5(b) is a side view of a single mark layer. As shown in FIG. 5(a), in the present embodiment, the mark layer M has, for example, a cross shape. The mark layer M may have a predetermined color. As shown in FIG. 5(b), the mark layer M has a predetermined thickness.

[0049] Subsequently, by transferring a plurality of mark layers M, the plurality of mark layers M are laminated to form a cutting mark 102. In the present embodiment, for example, two mark layers M are laminated to form a cutting mark 102. FIG. 6(a) is a front view of the cutting mark, and FIG. 6(b) is a side view of the cutting mark. As shown in FIG. 6(a), the color (shading) of the cutting mark 102 is darker (lower in brightness) than that of a single mark layer M. The cutting mark 102 becomes darker in shading than a single mark layer M due to the lamination of a plurality of mark layers M. The shading of the cutting mark 102 can be made darker by increasing the number of laminated mark layers M. As shown in FIG. 6(b), the cutting mark 102 is formed by laminating two mark layers M. Thereby, the cutting mark 102 is formed.

[0050] Subsequently, as shown in FIG. 4, the cutting mark 102 is transferred to the laminate 100 (step S05), and the cutting mark 102 and the laminate 100 are integrated. FIG. 7 is a view of the laminate 100 with the cutting mark 102 disposed thereon as seen from above. As shown in FIG. 7, the cutting mark 102 is transferred to the outer surface 100S (upper surface) of the laminate 100. The cutting mark 102 is disposed on the outer surface 100S of the laminate 100 based on the cutting position. The outer surface 100S of the laminate 100 where the cutting mark 102 is transferred and the cutting mark 102 have different color tones (brightness, chroma). The color of the cutting mark 102 is a color that can be distinguished from the color of the outer surface 100S of the laminate 100. In the example shown in FIG. 7, the color of the cutting mark 102 is darker than the color of the outer surface 100S of the laminate 100.

[0051] Subsequently, as shown in FIG. 4, the laminate 100 is cut (step S06). In the present embodiment, the laminate 100 is cut by a cutting machine (for example, a dicing blade). Specifically, the laminate 100 is cut based on the cutting marks 102 provided on the laminate 100. Thereby, a plurality of green chips having a predetermined size are obtained.

[0052] Subsequently, the green chips are fired (step S07). Then, a plating layer is formed on the surfaces of the respective terminal electrodes 4 and 5 (step S08). The plating layer is formed, for example, by electroplating or electroless plating. The plating layer contains, for example, Ni, Sn, or Au. Thus, the coil component 1 is obtained.

[0053] As described above, in the method for manufacturing the coil component 1 according to the present embodiment, the cutting marks 102 are formed by a photolithography method using a photosensitive paste. Thereby, in the method for manufacturing the coil component 1, the shape and dimensions of the cutting marks 102 can be formed with high accuracy. Therefore, the cutting marks 102 can be formed with high precision. As a result, the accuracy of the cutting position of the laminate 100 can be improved, and a highly reliable coil component 1 can be manufactured.

[0054] When the cutting marks 102 are directly formed on the laminate 100 by a photolithography method, the cutting marks 102 may not be formed accurately due to the influence of the material of the outer surface 100S of the laminate 100 in the formation of the cutting marks 102. In order to avoid this, it is necessary to perform a treatment on the outer surface 100S of the laminate 100 in order to form the cutting marks 102, which complicates the process. In the method for manufacturing the coil component 1 according to the present embodiment, the cutting marks 102 are transferred to the laminate 100. Therefore, complication of the process can be avoided.

[0055] In the manufacturing method of the coil component 1 according to this embodiment, after forming the laminate 100, the cutting mark 102 is transferred to the laminate 100. In the method of forming the laminate 100 with respect to the cutting mark 102 after forming the cutting mark 102 to transfer the cutting mark 102 to the laminate 100, for example, even when lamination misalignment or the like occurs in the process of forming the laminate 100 and adjustment of the position of the cutting mark 102 is required, the position of the cutting mark 102 cannot be adjusted. In the manufacturing method of the coil component 1 according to this embodiment, since the cutting mark 102 is transferred to the already formed laminate 100, the position of the cutting mark 102 can be determined according to the state of the laminate 100, and the cutting mark 102 can be transferred to the laminate 100. Therefore, the cutting mark 102 can be transferred so as to define the accurate cutting position of the laminate 100.

[0056] In the manufacturing method of the coil component 1 according to this embodiment, the color tone of the outer surface 100S of the laminate 100 where the cutting mark 102 is transferred and the cutting mark 102 is different. In this method, since the laminate 100 and the cutting mark 102 can be distinguished, the cutting mark 102 can be accurately recognized in the cutting process.

[0057] In the manufacturing method of the coil component 1 according to this embodiment, the material constituting the cutting mark 102 and the material constituting the insulator layer 6 are the same material. In this method, the cutting mark 102 can be formed by the material for forming the laminate 100 (insulator layer 6) without separately preparing the material for forming the cutting mark 102. Therefore, an increase in the cost related to the manufacture of the cutting mark 102 can be avoided.

[0058] In the manufacturing method of the coil component 1 according to this embodiment, in the step of forming the cutting mark 102, while forming the mark layer M, the mark layer M is laminated to form the cutting mark 102. In this method, by laminating a plurality of mark layers M, the thickness of the cutting mark 102 becomes thicker. As a result, the shade of the color of the cutting mark 102 can be made darker. Therefore, even when the material constituting the cutting mark 102 and the material constituting the insulator layer 6 are the same material, the color tones of the cutting mark 102 and the laminate 100 can be made different.

[0059] As described above, the embodiments of the present invention have been described. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

[0060] In the above embodiment, the form in which the electronic component is a coil component has been described as an example. However, the electronic component manufactured by the manufacturing method of the electronic component according to the present invention may be a capacitor component or the like.

[0061] In the above embodiment, the form in which the cutting mark 102 is constituted by laminating two mark layers M has been described as an example. However, the cutting mark 102 may be constituted by one mark layer M, or may be constituted by laminating three or more mark layers M.

[0062] In the above embodiment, the form in which the cutting mark 102 is formed (step S04 in FIG. 4) after forming the laminate 100 (step S03 in FIG. 4) has been described as an example. However, the formation of the cutting mark 102 may be formed at the same timing as other steps, or may be formed in advance. The cutting mark 102 may be formed until it is transferred to the laminate 100.

[0063] In the above-described embodiment, after forming the laminate 100 (step S03 in FIG. 4), the cutting mark 102 is transferred to the laminate 100 (step S05 in FIG. 4), and an example of the form in which the cutting mark 102 and the laminate 100 are integrated is described. However, after forming the cutting mark 102, the laminate 100 may be formed, and the cutting mark 102 and the laminate 100 may be integrated. Specifically, after transferring the cutting mark 102 onto the support, the base pattern and the conductor pattern may be repeatedly transferred onto the cutting mark 102 on the support. Thereby, the cutting mark 102 and the laminate 100 are integrated.

[0064] In the above-described embodiment, an example of the form in which the color of the cutting mark 102 is darker than the outer surface 100S of the laminate 100 is described. However, as shown in FIG. 8, the color of the cutting mark 102 may be lighter than the color of the outer surface 100S of the laminate 100. It is only necessary that the color tone of the outer surface 100S of the laminate 100 where the cutting mark 102 is transferred and the cutting mark 102 are different.

[0065] In the above-described embodiment, an example of the form in which the shading of the cutting mark 102 is adjusted (darkened) by laminating a plurality of mark layers M is described. However, the color of the cutting mark 102 may be adjusted by other methods. For example, the cutting mark 102 may be colored with a coloring agent or the like. Thereby, the color tone of the outer surface 100S of the laminate 100 where the cutting mark 102 is transferred and the cutting mark 102 can be made different.

[0066] In the above-described embodiment, an example of the form in which the color tone of the outer surface 100S of the laminate 100 where the cutting mark 102 is transferred and the cutting mark 102 is made different by adjusting the color of the cutting mark 102 is described. However, the color of the outer surface 100S of the laminate 100 may be adjusted. For example, the color of the outer surface 100S may be adjusted by coloring the base body forming layer constituting the outer surface 100S of the laminate 100. Also, for example, the color of the outer surface 100S may be adjusted by making the material of the base body forming layer constituting the outer surface 100S different from the materials of other base body forming layers.

[0067] In the above embodiment, a form in which the shape of the cutting mark 102 is cross-shaped was described as an example. However, the shape of the cutting mark 102 is not limited to this, and various shapes can be adopted.

[0068] In the above embodiment, a form in which the constituent material of the insulator layer 6 and the constituent material of the cutting mark 102 are the same material was described as an example. However, the constituent material of the insulator layer 6 and the constituent material of the cutting mark 102 may be different materials.

[0069] In the above embodiment, in the step of forming the conductor pattern (step S02 in FIG. 4), a form in which the conductor patterns of the electrode layers 10, 11, 12, 13 constituting the terminal electrodes 4, 5 were formed was described as an example. However, depending on the configuration of the terminal electrodes, the terminal electrodes may be formed after firing of the green chip.

[0070] In the above embodiment, after the step of firing the green chip (step S07 in FIG. 4), a form in which a plating layer is formed on the surfaces of the respective terminal electrodes 4, 5 (step S08 in FIG. 4) was described as an example. However, it is not necessary to form a plating layer on the surfaces of the terminal electrodes 4, 5.

[0071] In the above embodiment, the shapes of the terminal electrodes 4, 5 can be appropriately changed according to the design. Also, the shape of the coil 9 and the number of coil conductors can be appropriately changed according to the design.

Explanation of Reference Numerals

[0072] 1... coil component (electronic component), 6... insulator layer, 100... laminate, 102... cutting mark, M... mark layer.

Claims

1. A step of forming a cutting mark by a photolithography method using a photosensitive paste; A step of forming a laminate; A step of integrating the cutting mark and the laminate; A method for manufacturing an electronic component, comprising a step of cutting the laminate based on the cutting mark.

2. The method for manufacturing an electronic component according to claim 1, wherein after forming the laminate, the cutting mark is transferred to the laminate, and the cutting mark and the laminate are integrated.

3. The method for manufacturing an electronic component according to claim 1 or 2, wherein the color tone of the surface of the laminate on which the cutting mark is transferred is different from that of the cutting mark.

4. In the step of forming the laminate, an insulator layer is formed by a photolithography method using a photosensitive insulating paste, and a plurality of the insulator layers are laminated to form the laminate. The method for manufacturing an electronic component according to claim 1 or 2, wherein the material constituting the cutting mark is the same as the material constituting the insulator layer.

5. The method for manufacturing an electronic component according to claim 1 or 2, wherein in the step of forming the cutting mark, a mark layer is formed and a plurality of the mark layers are laminated to form the cutting mark.

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