Inertial force sensor and method for manufacturing inertial force sensor

Abstract

To provide an inertial force sensor comprising a sensor part hermetically sealed in a highly-vacuumed package.SOLUTION: An inertial force sensor comprises: a package comprising an aperture frame; a sensor part arranged inside the package; and a lower lid covering the aperture frame. The inertial force sensor comprises a first joining ring arranged along the aperture frame, comprising a closed ring shape, and joining the aperture frame and the lower lid to each other. The inertial force sensor comprises an upper lid located above the lower lid, and covering the aperture frame. The upper lid overlaps the entirety of the lower lid in top view. The inertial force sensor comprises a second joining ring arranged along the aperture frame, comprising a closed ring shape, and joining the aperture frame and the upper lid to each other. In top view, the second joining ring surrounds the outer periphery of the first joining ring. An intermediate space that is a closed space with maintained air tightness is formed between the lower lid and the upper lid.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present specification relates to an inertial force sensor and a method for manufacturing an inertial force sensor. [Background technology]

[0002] Patent Document 1 discloses an electronic component that includes a first package that airtightly encloses an inertial force sensor, and a second package that airtightly encloses the first package. The double package structure improves the hermetic sealing performance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-257803 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology of Patent Document 1 has a double package structure, which may increase the overall size of the electronic component. [Means for solving the problem]

[0005] The inertial force sensor disclosed in this specification includes a package with an opening frame. The inertial force sensor includes a sensor unit disposed inside the package. The inertial force sensor includes a lower lid covering the opening frame. The inertial force sensor is disposed along the opening frame, includes a first bonding ring having a closed ring shape, and bonds the opening frame and the lower lid. The inertial force sensor is located above the lower lid and includes an upper lid covering the opening frame. The upper lid overlaps the entire lower lid in a top view. The inertial force sensor is disposed along the opening frame, includes a second bonding ring having a closed ring shape, and bonds the opening frame and the upper lid. In a top view, the second bonding ring surrounds the outer periphery of the first bonding ring. An intermediate space, which is an airtight closed space, is formed between the lower lid and the upper lid.

[0006] According to the above structure, the opening frame and lid portion of the package are doubly closed by the lower lid and upper lid. A closed space is formed between the lower lid and the upper lid. Even if gas enters through the joint interface between the outer lid and the opening frame, the intermediate space prevents the gas from entering the internal space of the package. Because the intermediate space can temporarily prevent gas from entering the interior of the package, it is possible to maintain high airtightness inside the package for a long period of time. Furthermore, a double lid structure is provided in which both the lower lid and the upper lid are used for one package to maintain airtightness. Compared to a double package structure using two packages, this structure prevents an increase in size, allowing for a miniaturized inertial force sensor. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a top view of the gyro sensor 1. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 10 is a bottom view of the double lid 130. [Figure 5] 10A and 10B are diagrams showing an example of an integrated joining ring 123. FIG. [Figure 6] FIG. 10 is an exploded perspective view of a double lid 230 according to a second embodiment. [Figure 7] 10 is a diagram showing a lower lid 140 and an upper lid 350 of a third embodiment. FIG. [Figure 8] FIG. 10 is a diagram illustrating a first modified example of the third embodiment. [Figure 9] FIG. 10 is a diagram illustrating a second modified example of the third embodiment. [Figure 10] FIG. 10 is a diagram illustrating a third modified example of the third embodiment. DETAILED DESCRIPTION OF THE INVENTION [Example]

[0008] FIG. 1 shows a top view of the gyro sensor 1 according to this embodiment. For clarity, FIG. 1 shows a state in which the double lid 130 has been removed. FIG. 2 shows a cross-sectional view taken along line II-II in FIG. 1. FIG. 3 shows a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 shows a bottom view of the double lid 130.

[0009] The gyro sensor 1 mainly includes a sensor element 10, a package 100, and a double lid 130. The sensor element 10 is vacuum-tightly sealed in the package 100.

[0010] (Configuration of sensor element 10) The sensor element 10 mainly comprises a base electrode 20, a glass oscillator 30, and paste 40. The base electrode 20 has a structure in which a silicon substrate 22 is laminated on a glass substrate 21.

[0011] The glass substrate 21 is made of a glass material that can be anodically bonded to the silicon substrate 22. An annular ring groove 21r is formed on the surface 21f of the glass substrate 21. A rim portion 30r of the glass vibrator 30 is inserted into the ring groove 21r.

[0012] The silicon substrate 22 includes a ring electrode 22c, multiple segmented electrodes 22d, and an outer peripheral electrode 22o. The ring electrode 22c is disposed on the surface 21f of the glass substrate 21. The ring electrode 22c has a cylindrical shape about a central axis CA and includes a through-hole 22h. The central axis CA passes through the center of the glass substrate 21 and is perpendicular to the surface 21f. The multiple segmented electrodes 22d are disposed rotationally symmetrically on a circle centered on the central axis CA. The multiple segmented electrodes 22d surround the ring electrode 22c. An electrode pad 23 is formed on each of the multiple segmented electrodes 22d. An annular ring-shaped through-hole 22r is formed between the outer periphery of the ring electrode 22c and the inner periphery of the multiple segmented electrodes 22d. A rim portion 30r of the glass vibrator 30 is inserted into the ring-shaped through-hole 22r. The outer peripheral electrode 22o surrounds the periphery of the segmented electrode 22d. The peripheral electrode 22o is connected to the annular electrode 22c by four wires 25. In this embodiment, the wires 25 are made of an Al film. BR pads 24 are disposed at the four corners of the peripheral electrode 22o.

[0013] The glass vibrator 30 includes a pillar portion 30p and a peripheral portion 30c. The pillar portion 30p is a tubular portion having a central axis CA. The peripheral portion 30c is a hollow, approximately hemispherical portion centered on the central axis CA. The cross-sectional shape of the glass vibrator 30 in a plane passing through the central axis CA is approximately M-shaped. The material of the glass vibrator 30 is fused silica (quartz).

[0014] A conductive film (not shown) is formed on the surface of the glass vibrator 30. Various materials can be used for the conductive film. In this example, the conductive film was a TiN film.

[0015] The glass vibrator 30 is fixed to the annular electrode 22c so that the central axis CA of the column portion 30p coincides with the central axis CA of the annular electrode 22c. Specifically, the bottom of the column portion 30p is adhered to the annular electrode 22c by paste 40. The paste 40 is a so-called conductive paste. The material form of the paste 40 is the same as that of the die bond material 50 described below. The paste 40 electrically connects the conductive film on the surface of the glass vibrator 30 to the annular electrode 22c. The annular electrode 22c is connected to the BR pad 24 via the wiring 25 and the peripheral electrode 22o. Therefore, the conductive film on the surface of the glass vibrator 30 and the BR pad 24 are electrically connected.

[0016] A die bond material 50 is disposed between the rear surface 21b of the glass substrate 21 and the mounting surface 101 of the package 100. The die bond material 50 is a conductive material used to bond and fix the glass substrate 21 to the mounting surface 101. Various materials can be used for the die bond material 50. For example, it may be a paste material (Ag paste) in which Ag particles are mixed into an organic binder material.

[0017] (Package 100 configuration) The configuration of the package 100 will be described with reference to Figures 1 and 2. A metal mounting surface 101 is disposed on the bottom surface inside the package 100. The multiple electrodes 102 are arranged to surround the mounting surface 101. The multiple electrode pads 23 of the sensor element 10 are connected to the corresponding electrodes 102 by wires 110. In this embodiment, the wires 110 are Au wires. As shown in FIG. 2, multiple pads 102p are arranged outside the package 100. The multiple pads 102p correspond to the multiple electrodes 102 and are connected to the multiple electrodes 102, respectively. The gyro sensor 1 can be connected to an external control circuit (not shown) via the multiple pads 102p.

[0018] A rectangular frame 103 is disposed around the outer periphery of the multiple electrodes 102. The frame 103 may be made of any insulating material (e.g., ceramic). An opening frame 103a is formed on the upper surface of the frame 103. As shown in FIG. 1, the opening frame 103a has a rectangular shape surrounded by a frame of a certain width.

[0019] (Configuration of double lid 130) The entire periphery of the opening frame 103a is sealed by the double lid 130. The double lid 130 has a structure in which the lower lid 140 and the upper lid 150 are integrated. This is explained below. As shown in FIGS. 2 and 3, the upper lid 150 is located above the lower lid 140 (in the +z direction). In top view, the upper lid 150 and the lower lid 140 have similar rectangular shapes, and their centers coincide. In top view, the upper lid 150 overlaps the entire lower lid 140. In other words, when viewed from the z direction, the entire lower lid 140 is hidden by the upper lid 150.

[0020] The lower lid 140 has a flat plate shape. The upper lid 150 has a flat plate portion 150p and a side wall portion 150w. The flat plate portion 150p is a portion having a flat plate shape. The side wall portion 150w protrudes downward (in the -z direction) from the outer periphery of the flat plate portion 150p and has a closed ring shape. A rectangular ring-shaped contact surface 150c is formed on the lower surface of the side wall portion 150w.

[0021] The lower lid 140 and the upper lid 150 may be made of various materials. For example, a material called borosilicate glass may be used. Alternatively, for example, a metal material based on nickel or Kovar may be used. The thickness of the lower lid 140 and the upper lid 150 may be adjusted as needed.

[0022] The first bonding ring 121 and the second bonding ring 122 are arranged along the entire circumference of the opening frame 103a. The first bonding ring 121 and the second bonding ring 122 have a closed ring shape. In a top view, the second bonding ring 122 surrounds the outer periphery of the first bonding ring 121. The first bonding ring 121 bonds the opening frame 103a and the lower lid 140 together. This forms an internal space IS surrounded by the inside of the package 100, the lower lid 140, and the first bonding ring 121. The sensor element 10 is stored in the internal space IS.

[0023] The second bonding ring 122 bonds the opening frame 103a and the contact surface 150c of the upper lid 150 together. As a result, an intermediate space MS, which is an airtight closed space, is formed between the lower lid 140 and the upper lid 150. The height of the intermediate space MS in the z direction can be determined by the height H1 of the side wall portion 150w. In other words, the volume of the intermediate space MS can be adjusted by the height H1 of the side wall portion 150w.

[0024] The first bonding ring 121 and the second bonding ring 122 may be independent components separate from the lower lid 140 and the upper lid 150. The first bonding ring 121 and the second bonding ring 122 may be made of various materials and may have a laminated structure. For example, AuSn with an Au / Ti laminated film disposed on the surface may be used. The thickness of the first bonding ring 121 and the second bonding ring 122 may be adjusted as appropriate.

[0025] As shown in FIG. 4, a ring-shaped outer peripheral region OR exists between the first bonding ring 121 and the second bonding ring 122. A plurality of first connecting portions CP1 are arranged in a portion of the outer peripheral region OR. Specifically, a total of eight first connecting portions CP1 are arranged at four corners and at the midpoints of the sides connecting the corners. In FIG. 4, the first connecting portions CP1 hidden under the lower lid 140 are indicated by dotted lines. FIG. 3 also shows a cross-sectional view passing through the first connecting portion CP1 (see line III-III in FIG. 4). As shown in FIG. 3, the first connecting portion CP1 connects the upper surface 140t of the lower lid 140 and the lower surface 150u of the upper lid 150. The lower lid 140 and the upper lid 150 are integrated by the first connecting portion CP1.

[0026] A communication portion HP is formed in a portion of the outer peripheral region OR where the first connecting portion CP1 is not disposed. In FIG. 4, the communication portion HP is shaded gray for ease of understanding. FIG. 2 shows a cross-sectional view passing through the communication portion HP (see line II-II in FIG. 4). As shown in FIG. 2, the communication portion HP communicates between the second joining ring 122 and the intermediate space MS (see arrow Y1).

[0027] The vacuum hermetic sealing process will be described. The first and second bonding rings 121 and 122 are placed on the opening frame 103a. The double lid 130 is placed on the first and second bonding rings 121 and 122 while being aligned. While the entire assembly is heated in a vacuum atmosphere, the bonding portions are pressed with a jig (not shown). This results in AuSn eutectic bonding. As a result, the lower lid 140 is bonded to the opening frame 103a via the first bonding ring 121. Furthermore, the upper lid 150 is bonded to the opening frame 103a via the second bonding ring 122. As a result, the interior of the package 100 can be vacuum hermetically sealed.

[0028] (Gyro sensor 1 operation) A capacitor is formed between each of the multiple split electrodes 22d and the glass vibrator 30. An electrical signal is applied to the multiple split electrodes 22d from an external control circuit (not shown) via the multiple pads 102p. By generating an electrostatic attraction between the glass vibrator 30 and the multiple split electrodes 22d, the glass vibrator 30 is excited in wine-glass mode at the resonant frequency. When an angular velocity ωz is applied around the z-axis in this state, a Coriolis force is generated. An amplitude corresponding to the generated Coriolis force is then generated in the detection direction. The generated amplitude can be detected by a change in capacitance of a capacitor formed between the split electrode 22d and the glass vibrator 30. As described above, gyro sensor 1, which is an inertial force sensor, functions.

[0029] (effect) The problem will be explained. A double package structure is known in which a first package is airtightly enclosed by a second package to improve airtightness. However, a double package structure has the risk of increasing the overall size. Therefore, the technology of this specification provides a double lid structure in which a single package is maintained airtight using two lids, a lower lid 140 and an upper lid 150. An intermediate space MS is provided between the lower lid 140 and the upper lid 150. This allows the internal space IS in which the sensor element 10 is housed to be airtightly sealed by the lower lid 140. Furthermore, the intermediate space MS between the lower lid 140 and the upper lid 150 can be airtightly sealed by the upper lid 150. Therefore, even if gas enters through the second bonding ring 122 that bonds the upper lid 150, the intermediate space MS can prevent the gas from entering the internal space IS. Since the intrusion of gas into the package 100 can be temporarily stopped by the intermediate space MS, it is possible to maintain high airtightness for a long period of time inside the package 100. Furthermore, since the increase in size can be suppressed compared to a double package structure, it is possible to miniaturize the gyro sensor 1.

[0030] The double lid 130 of this specification has a structure in which the lower lid 140 and the upper lid 150 are integrated by a plurality of first connecting portions CP1. This allows the double lid structure to be realized as a single component. This improves the ease of assembly of the gyro sensor 1 and the ease of handling of the lid. The double lid 130 of this specification also has a communication portion HP. This allows gas that has entered through the bonding interface of the second bonding ring 122 to be reliably introduced into the intermediate space MS (see arrow Y1).

[0031] (Modification of Example 1) The joining ring may take various forms. For example, the first joining ring and the second joining ring may be integral. FIG. 5 shows an example of an integral joining ring 123. FIG. 5 is a cross-sectional view similar to FIG. 2. For clarity, reference numerals for the sensor element 10 are omitted in FIG. 5. The joining ring 123 is disposed along the entire circumference of the opening frame 103a and has a closed ring shape. The opening frame 103a and the lower lid 140 are joined by an inner peripheral end surface 123i of the joining ring 123. The opening frame 103a and the contact surface 150c of the upper lid 150 are joined by an outer peripheral end surface 123o of the joining ring 123.

[0032] Even if a leak path occurs in the joining ring 123 due to a crack or the like, the leak path will communicate with the communication portion HP, allowing outside air to be introduced into the intermediate space MS (see arrow Y2). Since the intrusion of gas can be temporarily stopped in the intermediate space MS, it is possible to maintain high airtightness inside the package 100 for a long period of time. Furthermore, the width of the integrated joining ring 123 (FIG. 5) can be made larger than the combined width of the first joining ring 121 and the second joining ring 122 (FIG. 2). In other words, the width of the area sealing between the outside and the internal space IS can be enlarged. This makes it difficult for a leak path progressing in the width direction to reach the internal space IS. This makes it possible to improve the airtightness of the internal space IS. [Example]

[0033] In Example 2, another embodiment of the double lid will be described. Components common to Examples 1 and 2 will be given the same reference numerals and descriptions thereof will be omitted. Fig. 6 shows an exploded perspective view of the double lid 230 of Example 2. Fig. 6 is a view of the double lid 230 looking up from diagonally below.

[0034] The double lid 230 of the second embodiment (FIG. 6) differs from the double lid 130 of the first embodiment (FIGS. 2-4) in that it includes a second connecting portion CP2. The second connecting portion CP2 is disposed on the lower surface 150u of the upper lid 150. The second connecting portion CP2 has a cross shape that connects the midpoints of the sides of the upper lid 150. The second connecting portion CP2 includes the center point CE of the upper lid 150.

[0035] The contact surface 150c protrudes from the lower surface 150u by a height H11. The second connecting portion CP2 protrudes from the lower surface 150u by a height H12. The lower lid 140 has a thickness T1. The height H12 is smaller than the height H11 by the thickness T1. As a result, four steps ST corresponding to the thickness T1 are formed at the boundary between the contact surface 150c and the second connecting portion CP2.

[0036] The lower lid 140 is integrated with the upper lid 150 so as to fit into the four steps ST. Therefore, the contact surface 150c and the lower surface 140u of the lower lid 140 are in the same plane. Furthermore, the upper surface 140t of the lower lid 140 and the second connecting portion CP2 are in close contact with each other. This allows the second connecting portion CP2 to divide the intermediate space formed between the lower lid 140 and the upper lid 150 into four intermediate spaces MS1-MS4. The intermediate spaces MS1-MS4 can be mutually maintained airtight.

[0037] (effect) When an intermediate space MS in a high vacuum state is present, the upper lid 150 is pressed by the external air pressure and deforms into a concave shape toward the inside of the package 100. This reduces the volume of the intermediate space MS from its initial state, thereby reducing the allowable amount of gas that can infiltrate from the outside. Therefore, the double lid 230 of the second embodiment is provided with a second connecting portion CP2 on the lower surface 150u of the upper lid 150. By supporting the lower surface 150u with the second connecting portion CP2, deformation of the upper lid 150 can be suppressed. Since the allowable amount of gas that can infiltrate can be guaranteed, it is possible to maintain the internal space IS in a vacuum state with higher reliability.

[0038] The amount of deformation of the upper lid 150 is greatest near the center point CE. Therefore, in the double lid 230 of the second embodiment, the second connecting portion CP2 is positioned so as to include the center point CE. This suppresses deformation at the center point CE, thereby preventing a decrease in the volume of the intermediate space MS.

[0039] The double lid 230 of the second embodiment forms intermediate spaces MS1-MS4 that are airtightly separated from each other. This prevents an abnormality (e.g., gas intrusion) that occurs in one intermediate space from affecting the other intermediate spaces. This makes it possible to improve the reliability of the double lid 230.

[0040] (Modification of Example 2) The shape of the second connecting portion CP2 is not limited to a shape connecting the sides of the upper lid 150, and may be various. For example, it may be a closed ring shape centered on a center point CE. In this form, the inside and outside of the ring can be airtightly separated from each other. Regardless of the shape of the second connecting portion CP2, as long as the second connecting portion CP2 includes the center point CE, deformation of the upper lid 150 can be effectively suppressed. [Example]

[0041] In Example 3, a separate double lid will be described. Components common to Examples 1 and 3 are given the same reference numerals and descriptions thereof will be omitted. Fig. 7 shows a lower lid 140 and an upper lid 350 of Example 3. Fig. 7 is a cross-sectional view similar to Fig. 2. In Fig. 7, reference numerals related to the sensor element 10 are omitted for clarity.

[0042] The opening frame 303a includes an inner peripheral frame 303a1 and an outer peripheral frame 303a2. The outer peripheral frame 303a2 surrounds the inner peripheral frame 303a1 and is located above the inner peripheral frame 303a1. The inner peripheral frame 303a1 is located on a first plane PL1. The outer peripheral frame 303a2 is located on a second plane PL2. The first plane PL1 and the second plane PL2 are parallel to each other. The second plane PL2 is located a distance D1 above the first plane PL1. A staircase-shaped step is formed between the inner peripheral frame 303a1 and the outer peripheral frame 303a2.

[0043] The lower lid 140 is joined to the inner peripheral frame 303a1 by a first joining ring 121. The upper lid 350 is connected to the outer peripheral frame 303a2 by a second joining ring 122. The upper lid 350 has a flat plate shape like the lower lid 140 and does not have a sidewall portion. The height of the intermediate space MS in the z direction is determined by the distance D1 between the inner peripheral frame 303a1 and the outer peripheral frame 303a2. In other words, the volume of the intermediate space MS can be adjusted by the distance D1.

[0044] A spacer 360 is disposed in the intermediate space MS. The spacer 360 is fixed to the lower surface 350u of the upper lid 350. The spacer 360 includes the center point CE of the upper lid 350. The spacer 360 can suppress deformation of the upper lid 150 in the vicinity of the center point CE. The shape and arrangement of the spacer 360 may vary. For example, the spacer 360 may be fixed to the upper surface 140t of the lower lid 140. The spacer 360 may be formed integrally with the upper lid 350 or the lower lid 140.

[0045] (effect) The separate double lid of Example 3 can simplify the lid structure compared to the integrated double lids of Examples 1 and 2. This makes it possible to reduce the manufacturing cost of the gyro sensor 1.

[0046] In the embodiments in which the volume of the intermediate space MS is adjusted by the height H1 of the side wall portion 150w, as in the first and second embodiments, the height H1 is limited because the strength of the side wall must be ensured. On the other hand, in the embodiment in which the volume of the intermediate space MS is adjusted by the distance D1 between the inner peripheral frame 303a1 and the outer peripheral frame 303a2, the strength of the outer peripheral frame 303a2 can be sufficiently ensured, thereby increasing the degree of freedom in the distance D1. Since the volume of the intermediate space MS can be increased, it is possible to increase the allowable amount of outside air flowing in through the leak path.

[0047] (First Modification of the Third Embodiment) The inner and outer peripheral frames can have various structures. For example, as shown in the example of Figure 8, the opening frame 303a may have a tapered surface TS that decreases in height toward the center of the opening frame. The inner and outer peripheral frames 303a1 and 303a2 are located on the tapered surface TS. The outer peripheral frame 303a2 is located higher than the inner peripheral frame 303a1.

[0048] In this embodiment as well, an intermediate space MS can be formed between the lower lid 140 and the upper lid 350. Furthermore, by providing the tapered surfaces TS, the lower lid 140 and the upper lid 350 can be brought into close contact with the inner peripheral frame 303a1 and the outer peripheral frame 303a2 in a self-aligning manner, thereby further improving airtightness.

[0049] (Second Modification of the Third Embodiment) 9, the inner peripheral frame 303a1 and the outer peripheral frame 303a2 may be located on the same plane PL0. That is, there may be no difference in height between the inner peripheral frame 303a1 and the outer peripheral frame 303a2. The upper lid 350 may also include a flat plate portion 350p and a side wall portion 350w. In this embodiment, an intermediate space MS can be formed between the lower lid 140 and the upper lid 350.

[0050] (Third Modification of the Third Embodiment) 10, the inner peripheral frame 303a1 may be located higher than the outer peripheral frame 303a2. The upper lid 350 may include a flat plate portion 350p and a side wall portion 350w. In this embodiment, an intermediate space MS can be formed between the lower lid 140 and the upper lid 350.

[0051] Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings can achieve multiple objectives simultaneously, and achieving one of these objectives itself has technical utility.

[0052] (Other variations) The widths of the first bonding ring 121 and the second bonding ring 122 can be set in various ways. For example, the width of the second bonding ring 122 located on the outside may be wider than the width of the first bonding ring 121 located on the inside. The effect will be explained below. The pressure difference between the outside and the intermediate space MS is greater than the pressure difference between the intermediate space MS and the internal space IS. Therefore, the second bonding ring 122 is subjected to a larger pressure difference than the first bonding ring 121. Therefore, by increasing the width of the second bonding ring 122, it is possible to appropriately improve the sealing performance of the second bonding ring 122.

[0053] A triple- or more-lid structure is also possible. For example, to achieve a triple-lid structure, an intermediate lid is placed between the lower lid and the upper lid, which further improves airtightness.

[0054] Aspects of the present technology are listed below. [Aspect 1] a package having an opening frame; a sensor unit disposed inside the package; a lower lid covering the opening frame; a first joining ring disposed along the opening frame, having a closed ring shape, and joining the opening frame and the lower lid together; an upper lid located above the lower lid, covering the opening frame, and overlapping the entire lower lid in a top view; a second joining ring disposed along the opening frame, having a closed ring shape, and joining the opening frame and the upper lid together; An inertial force sensor comprising: When viewed from above, the second joining ring surrounds the outer periphery of the first joining ring, An intermediate space, which is an airtight closed space, is formed between the lower lid and the upper lid. Inertial force sensor. [Aspect 2] a connecting portion connecting an upper surface of the lower lid and a lower surface of the upper lid, 2. The inertial force sensor according to aspect 1, wherein the connecting portion includes a center point of the upper lid when viewed from above. [Aspect 3] The intermediate space is divided into a plurality of spaces by the connecting portion, 3. The inertial force sensor according to aspect 2, wherein the divided spaces are kept airtight from one another. [Aspect 4] a ring-shaped outer peripheral region is present between the first joining ring and the second joining ring when viewed from above; 2. The inertial force sensor according to aspect 1, wherein the inertial force sensor is disposed in the outer circumferential region, and further includes a connecting portion connecting an upper surface of the lower lid and a lower surface of the upper lid. [Aspect 5] the connecting portion is disposed in a part of the outer circumferential region, 5. The inertial force sensor according to aspect 4, wherein a communication portion that communicates between the second joining ring and the intermediate space is formed in a portion of the outer circumferential region where the coupling portion is not arranged. [Aspect 6] the opening frame includes an inner peripheral frame and an outer peripheral frame that surrounds the inner peripheral frame and is positioned above the inner peripheral frame, the lower lid is joined to the inner peripheral frame by the first joining ring, 2. The inertial force sensor according to aspect 1, wherein the upper lid is joined to the outer periphery frame by the second joining ring. [Aspect 7] a spacer disposed in a space between the lower lid and the upper lid; 7. The inertial force sensor according to embodiment 6, wherein the spacer includes a center point of the upper lid in a top view. [Aspect 8] the inner peripheral frame is located on a first plane, the outer periphery frame is located on a second plane, the first plane and the second plane are parallel to each other, 8. The inertial force sensor according to embodiment 6 or 7, wherein the second plane is located above the first plane. [Aspect 9] The opening frame has a tapered surface whose height decreases toward the center of the opening frame, the inner peripheral frame and the outer peripheral frame are located on the tapered surface, The inertial force sensor according to any one of aspects 6 to 8, wherein the outer peripheral frame is positioned higher than the inner peripheral frame. [Aspect 10] the upper lid has a sidewall portion that protrudes downward from the upper lid and has a closed ring shape; The inertial force sensor according to any one of aspects 1 to 9, wherein the second bonding ring is disposed on a lower surface of the side wall portion. [Explanation of symbols]

[0055] 1: Gyro sensor 10: Sensor element 100: Package 121: First joining ring 122: Second joining ring 140: Lower lid 150: Upper lid MS: Intermediate space

Claims

1. a package having an opening frame; a sensor unit disposed inside the package; a lower lid covering the opening frame; a first joining ring disposed along the opening frame, having a closed ring shape, and joining the opening frame and the lower lid together; an upper lid located above the lower lid, covering the opening frame, and overlapping the entire lower lid in a top view; a second joining ring disposed along the opening frame, having a closed ring shape, and joining the opening frame and the upper lid together; An inertial force sensor comprising: When viewed from above, the second joining ring surrounds an outer periphery of the first joining ring, An intermediate space, which is an airtight closed space, is formed between the lower lid and the upper lid. Inertial force sensor.

2. a connecting portion connecting an upper surface of the lower lid and a lower surface of the upper lid, The inertial force sensor according to claim 1 , wherein the connecting portion includes a center point of the upper lid when viewed from above.

3. The intermediate space is divided into a plurality of spaces by the connecting portion, The inertial force sensor according to claim 2 , wherein the plurality of divided spaces are kept airtight from one another.

4. a ring-shaped outer peripheral region is present between the first joining ring and the second joining ring when viewed from above, 2. The inertial force sensor according to claim 1, further comprising a connecting portion that is disposed in the outer periphery region and connects an upper surface of the lower lid and a lower surface of the upper lid.

5. the connecting portion is disposed in a part of the outer circumferential region, The inertial force sensor according to claim 4 , wherein a communication portion that communicates the second joining ring with the intermediate space is formed in a portion of the outer circumferential region where the connecting portion is not arranged.

6. the opening frame includes an inner peripheral frame and an outer peripheral frame that surrounds the inner peripheral frame and is positioned above the inner peripheral frame, the lower lid is joined to the inner peripheral frame by the first joining ring, The inertial force sensor according to claim 1 , wherein the upper lid is joined to the outer periphery frame by the second joining ring.

7. a spacer disposed in a space between the lower lid and the upper lid; The inertial force sensor according to claim 6 , wherein the spacer includes a center point of the upper lid when viewed from above.

8. the inner peripheral frame is located on a first plane, the outer peripheral frame is located on a second plane, the first plane and the second plane are parallel to each other, The inertial force sensor according to claim 6 , wherein the second plane is located above the first plane.

9. The opening frame has a tapered surface whose height decreases toward the center of the opening frame, the inner peripheral frame and the outer peripheral frame are located on the tapered surface, The inertial force sensor according to claim 6 , wherein the outer peripheral frame is located higher than the inner peripheral frame.

10. the upper lid has a sidewall portion that protrudes downward from the upper lid and has a closed ring shape; The inertial force sensor according to claim 1 , wherein the second joining ring is disposed on a lower surface of the side wall portion.

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