Manufacturing method of transfer medium and transfer material

Abstract

To provide a transfer medium that has a high-precision, fine structure while also responding well to high-speed continuous transfer.SOLUTION: A transfer medium 1 includes: a substrate 10; a release layer 20 provided on the substrate; a fine structure layer 32; a reflection layer 33; an adhesive layer 36; and a transfer portion 30 provided on the release layer with the fine structure layer being positioned on the side of the release layer. The release layer is made of a material with a melting point of 100°C or lower, and the water contact angle on the release layer at 60°C is between 60° or higher and 90° or lower. The water contact angle at 60°C on the surface of the transfer portion in contact with the release layer is between 60° or higher and 100° or lower.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a transfer medium, more particularly to a transfer medium having favorable transferability and a highly accurate microstructure, and also to a method for producing a transfer product using the transfer medium. [Background technology]

[0002] Transfer media with fine structures such as holograms and diffraction gratings can express unique images through the optical effects of the fine structures. These holograms and diffraction gratings require advanced manufacturing technology and are not easily reproducible, so the transfer media are widely used as anti-counterfeiting devices.

[0003] Microstructures such as holograms and diffraction gratings can form images with complex designs by combining the spacing, height, and shape of their concave-convex structures, making them difficult to replicate.

[0004] Holograms and diffraction gratings are often transferred onto various paper documents, such as credit cards, ID cards, gift certificates, checks, stock certificates, and various certificates. Furthermore, due to their unique design properties, they are often used in packaging designs.

[0005] Transfer media are used as a means for easily forming microstructures such as holograms and diffraction gratings on a target. Transfer media are formed by laminating a release protective layer, a microstructure layer on which a hologram or diffraction grating is formed, a reflective layer, an adhesive layer, etc. on a substrate. Common methods for transferring transfer media include thermo-pressure transfer using a heat press and thermal transfer using a heated roll or thermal head.

[0006] Thermal pressure transfer using a heat press involves a mechanism that applies pressure and heat perpendicular to a flat surface, placing a transfer medium between a metal stamp and the object to be transferred, pressing the transfer medium against the object with the stamp, and then peeling off the substrate, allowing for transfer in a short time.

[0007] An example of such a transfer medium is a hologram transfer medium in which a hologram layer having a microstructure imparted to a resin layer is formed on a release protective layer formed on a substrate film, a reflective layer is provided on the hologram layer, and a heat-sensitive adhesive layer is further provided (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-272295 Summary of the Invention [Problem to be solved by the invention]

[0009] In order for the above-mentioned transfer medium to be smoothly transferred to the transferee, it is necessary that the transfer portion on which the hologram layer or the like is provided has good peelability and cuttability from the base film, and that the transfer portion is reliably transferred to the transferee. In addition to the above, there has recently been an increasing demand for high-speed continuous transfer (for example, 60 shots / minute or more) in order to improve productivity, particularly in thermal press transfer methods. When attempts have been made to meet this demand with conventional transfer media, there have been cases of transfer machines automatically stopping, which are thought to be due to insufficient releasability.

[0010] Furthermore, with regard to the anti-counterfeiting effect of microstructures, there is a growing demand for more sophisticated features, such as more easily distinguishable visual effects and structures and materials that are difficult to counterfeit, and there is also a growing demand for precision in the formation of microstructures, which makes the above-mentioned high-speed continuous transfer even more difficult.

[0011] In view of the above circumstances, an object of the present invention is to provide a transfer medium that has a highly accurate microstructure and is also suitable for high-speed continuous transfer. [Means for solving the problem]

[0012] A first aspect of the present invention is a transfer medium having a substrate, a release layer provided on the substrate, a microstructure layer, a reflective layer, and an adhesive layer, and having a transfer section provided on the release layer with the microstructure layer positioned on the release layer side. The release layer is made of a material having a melting point of 100°C or less, and the water contact angle of the release layer at 60°C is 60° or more and 90° or less. The surface of the transfer section that comes into contact with the release layer has a water contact angle at 60° or more and 100° or less at 60°C.

[0013] A second aspect of the present invention is a method for producing a transcript. In this manufacturing method, the transfer portion of the transfer medium according to the first embodiment is brought into contact with the object to be transferred, the transfer plate is brought into contact with the transfer medium from the substrate side, and the transfer plate is heated to a temperature between 1.5 and 2.2 times the melting point of the release layer and pressed to transfer the transfer portion to the object to be transferred. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a transfer medium that has a highly accurate microstructure and is also suitable for high-speed continuous transfer. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic cross-sectional view showing a transfer medium according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] An embodiment of the present invention will be described with reference to FIG. 1 is a schematic cross-sectional view of a transfer medium 1 according to this embodiment. The transfer medium 1 has a structure in which a release layer 20, a peeling protective layer 31, a microstructure layer 32, a reflective layer 33, a mask layer 34, an anchor layer 35, and an adhesive layer 36 are sequentially formed on a substrate 10. In the transfer medium 1, the layers from the peeling protective layer 31 to the adhesive layer 36 constitute a transfer section 30 that is transferred to a transfer target object.

[0017] The substrate 10 is required to have heat resistance and strength so that it does not soften or deform due to the heat and pressure during transfer. When the transfer medium 1 is continuously transferred by machine, reading is often performed by a sensor, so the substrate 10 is also required to have a certain degree of light transparency. Considering the above, suitable materials for the substrate 10 include synthetic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cellophane, acetate, polycarbonate, polysulfone, polyimide, polyvinyl alcohol, aromatic polyamide, aramid, and polystyrene, and among these, PET film is superior in terms of physical properties, processability, cost, etc. The substrate 10 may be a single-layer film made of these resins, or may be a laminate made of multiple resin layers.

[0018] The thickness of the substrate 10 can be set in the range of 2 μm to 50 μm, taking into consideration ease of handling and processability. From the viewpoint of transferability and processability, a thickness of approximately 10 μm to 50 μm is preferable. Although it depends on the physical properties of the material constituting the substrate 10, generally, the thinner the substrate 10, the more likely it is that breakage or thermal shrinkage will occur during processing. Furthermore, the thicker the substrate 10, the longer it takes for heat conduction during transfer, making it more likely that the suitability for continuous transfer will decrease.

[0019] Furthermore, in order to adjust the releasability of the layer in contact with the substrate 10 and the retention of the transfer part 30 before use, an adhesive treatment may be applied to one or both surfaces of the substrate 10. Examples of adhesive treatments include known techniques such as corona treatment, flame treatment, ozone treatment, ultraviolet treatment, radiation treatment, roughening treatment, plasma treatment, and primer treatment, and two or more of these may be used in combination.

[0020] The release layer 20 adjusts the ease with which the transfer part 30 can be peeled off from the substrate 10. The release layer 20 according to this embodiment is made of a material with a melting point of 100°C or less, and has a water contact angle of 60 to 90°C at 60°C. The above-described structure of the release layer 20 allows for both stable retention at room temperature and smooth release when heated, thereby achieving favorable suitability for continuous transfer. The release layer 20 is preferably solid at room temperature (25° C.). In this case, the release layer may contain a component that is liquid at room temperature, as long as the release layer as a whole is in a solid state at room temperature.

[0021] Examples of materials for the release layer 20 that can achieve the above-mentioned melting point and water contact angle include, but are not limited to, animal- and plant-based paraffin waxes; crude oil-based and mineral-based natural waxes such as microcrystalline wax; synthetic waxes such as synthetic hydrocarbon waxes, aliphatic alcohol and acid waxes, fatty acid ester and glycerite waxes, synthetic ketone waxes, amine and amide waxes, chlorinated hydrocarbon waxes, and alpha-olefin waxes; and various phosphate esters such as long-chain alkyl phosphate esters, polyoxyalkylene alkylaryl ether phosphate esters, and polyoxyalkylene alkyl ether phosphate esters. The release layer 20 can also be formed by incorporating a plurality of these materials.

[0022] The release layer 20 can be formed by, for example, applying a coating liquid in which the above-mentioned materials are dissolved or dispersed in a solvent onto the substrate 10 and drying it. The coating liquid may be an emulsion in which the above-mentioned materials are dispersed in an aqueous solvent. When an emulsion is used, the particle size of the dispersed material is small (for example, on the order of several tens to several μm), and therefore the total surface area is large, so the formed release layer 20 is in the form of a quasi-continuous film made of small-diameter material particles. As a result, it is easier to control the release properties of the release layer 20, which is preferable.

[0023] The amount of coating liquid applied is, for example, 0.001 g / m 2 ~0.2g / m 2 If the amount of application is too small, sufficient releasability may not be obtained. Furthermore, a portion of the release layer 200 may be transferred to the microstructure layer 400 during transfer. If the amount of application is too large, the amount transferred to the transfer section 30 may become too large, which may inhibit the optical effect of the transfer section 30.

[0024] The peelable protective layer 31 protects the fine structure and image of the transfer portion 30 after transfer, and also controls the releasability of the transfer portion 30 from the substrate 10 . Due to the above-mentioned functions, the release protective layer 31 is required to be robust. In order to achieve the desired robustness, the release protective layer 31 may be composed of multiple layers made of different materials. Furthermore, if the microstructure layer 32 is sufficiently robust, it may be omitted.

[0025] The peel-off protective layer 31 can be formed by applying and drying a coating liquid for forming the layer, similar to the release layer 20. This coating liquid can be prepared by blending, for example, a functional additive that imparts robustness to the binder, a curing agent, a solvent, and the like. Resins are typically used as binders. Examples of synthetic resins include styrene-based resins such as polystyrene and poly-α-methylstyrene; acrylic resins such as polymethyl methacrylate and polyethyl acrylate; vinyl resins such as polyvinyl chloride, polyvinyl acetate, vinyl chloride-vinyl acetate copolymers, polyvinyl butyral, and polyvinyl acetal; polyester resins, polyamide resins, epoxy resins, polyurethane resins, petroleum resins, ionomers, ethylene-acrylic acid copolymers, and ethylene-acrylic acid ester copolymers. Examples of natural resins include cellulose derivatives such as nitrocellulose, ethyl cellulose, and cellulose acetate propionate; rosin, rosin-modified maleic acid resins, ester gum, polyisobutylene rubber, butyl rubber, styrene-butadiene rubber, butadiene-acrylonitrile rubber, and polychlorinated olefins. Synthetic rubber derivatives can also be used. Since aromatic compounds have a small expansion coefficient and therefore have difficulty in exhibiting releasability due to internal strain, it is preferable that the binder does not contain aromatic compounds. Examples of functional additives include surface conditioners and antifoaming agents. Examples of curing agents include photopolymerization initiators, heat curing agents, and humidity curing agents. Examples of solvents include ketone-based solvents, ester-based solvents, alcohol-based solvents, and aromatic solvents.

[0026] The microstructure layer 32 is preferably formed from a photocurable resin and has a microstructure in one or both thickness directions. The microstructure in the microstructure layer 32 has concave or convex portions, or concave and convex portions. The microstructure has optical properties such as diffraction, anti-reflection, isotropic or anisotropic scattering, reflection, polarization selectivity, and wavelength selectivity. The optical effects of the microstructure can be detected visually or mechanically. This optical effect creates complex visual expressions, providing anti-counterfeiting effects and improving design. A variety of optical effects can be achieved by combining microstructures with one or more optical effects to form the microstructure layer 32. The thickness of the microstructure layer 32 can be in the range of 0.5 μm to 10 μm, for example.

[0027] The microstructure layer 32 can be formed by applying a coating liquid for formation, drying it to form a coating film, and then pressing a plate against it to harden it, or by pouring the coating liquid between the adjacent layer and the plate and hardening it. When the microstructure layer 32 is formed from a photocurable resin, the binder of the coating liquid contains a photocurable resin, which can be hardened by exposure to light, making it easy to form the microstructure layer 32. The exposure can be ultraviolet light exposure. The light source for ultraviolet light exposure can be an LED, a low-pressure mercury lamp, a high-pressure long arc lamp, an ultra-high-pressure short arc lamp, etc. Examples of photocurable resins include compounds or mixtures of compounds having one or more ethylenically unsaturated double bonds in the molecule, compounds or mixtures of compounds having one or more cationically polymerizable groups in the molecule, etc. More specific examples include unsaturated polyester resins, polyester polyacrylate resins, polyester polymethacrylate resins, epoxy polyacrylate resins, epoxy polymethacrylate resins, urethane polyacrylate resins, urethane polymethacrylate resins, acrylic polyacrylate resins, acrylic polymethacrylate resins, etc. The adhesiveness of the coating liquid may be adjusted by mixing the above-mentioned resin with saturated acrylic resin, saturated polyester resin, polyurethane resin, polyallyl phthalate resin, cellulose resin, butyral resin, synthetic rubber, polystyrene resin, styrene-maleic acid resin, ethylene-vinyl acetate copolymer resin, or the like.

[0028] The photocurable resin is preferably a radical polymerization resin. Radical polymerization resins have a high cure shrinkage rate, which makes it easy to improve peelability due to internal stress, and they have the advantage of being easy to control the degree of cure by the exposure dose. The exposure dose is 10 mJ / cm. 2 More than 1J / cm 2 The following can be given as an example. The photocurable resin is preferably tack-free, i.e., dry to the touch at room temperature. Being tack-free has the advantages of facilitating control of the film thickness and improving workability during production.

[0029] When the fine-structure layer 32 is formed of a photocurable resin, the coating liquid for forming the fine-structure layer 32 may contain various additives related to the photocuring reaction, such as a photopolymerization initiator and a stabilizer. Furthermore, the coating liquid may contain additives related to visibility, such as a pigment and a dye. These additives can be appropriately selected from known additives.

[0030] The reflective layer 33 has the function of making it easy to observe the optical effect produced in the microstructure layer 32. The reflective layer 33 is formed so as to cover part or all of the microstructure layer 32. A configuration in which the reflective layer 33 covers part of the microstructure layer 32 requires more advanced processing technology, and the design of the transfer portion 30 becomes more precise, thereby achieving higher anti-counterfeiting effects and designability. Examples of materials constituting the reflective layer 33 include simple metals or silicon, alloys, or compounds thereof. Examples of metals include Al, Sn, Cr, Ni, Cu, and Ag, and a combination of multiple metals or a combination of silicon and a metal may also be used.

[0031] The reflective layer 33 can be formed by depositing the above-mentioned materials under reduced pressure, using methods such as vacuum deposition, sputtering, and CVD. The reflective layer 33 can be a single layer or a multilayer. Examples of a multilayer reflective layer include an alternate layer of metal simple substances and metal compounds, an alternate layer of different metal simple substances, and an alternate layer of different metal compounds. The thickness of the reflective layer 33 can be set in the range of 10 to 600 nm, for example.

[0032] The mask layer 34 is not an essential layer, and is formed so as to cover part or all of the reflective layer 33. The mask layer 34 is typically a layer made of resist, and contributes to selectively removing the reflective layer 33 that is not covered by the mask layer. Furthermore, depending on the material, the mask layer 34 may also exhibit a function of assisting robustness such as chemical resistance.

[0033] The above-mentioned resist layer can be formed by applying a coating liquid, drying the coating, and then patterning the resulting coating by photolithography. Resins that are resistant to etching solutions can be used as binders for the coating liquid. More specifically, examples include vinyl resins, polystyrene resins, acrylic resins, polyurethane resins, polyamide resins, polyimide resins, copolymer resins thereof, composite resins thereof, and composite resins of copolymer resins thereof. In addition, thermosetting resins such as urethane resins and epoxy resins, and ultraviolet-curing resins such as acrylate resins can also be used. The coating liquid may contain various additives, hardeners, solvents, inorganic materials, and the like in addition to the binder. The thickness of the mask layer 34 can be set in the range of 0.1 μm to 5 μm, for example.

[0034] The anchor layer 35 is not an essential layer, and is formed as needed between the reflective layer 33 or mask layer 34 and the adhesive layer 36. The anchor layer 35 increases the adhesion between the layers, and when the transfer target is permeable to liquids, it provides robustness to the transfer part 30 when used in combination with the adhesive layer 36.

[0035] The anchor layer 35 can be formed by applying a coating liquid for forming the anchor layer 35 and drying it. The coating liquid can be prepared by blending a functional additive, a curing agent, a solvent, etc. with a binder, for example. Examples of binders include various resins such as vinyl chloride-vinyl acetate copolymer, acrylic resin, urethane resin, epoxy resin, and polyester resin. The thickness of the anchor layer 35 can be set in the range of 0.1 μm to 5 μm, for example. Examples of functional additives that impart fastness include the various curing agents mentioned above.

[0036] The adhesive layer 36 firmly adheres to the transfer object to hold the transfer part 30 on the transfer object, and also provides durability to the transfer part 30 when the transfer object is permeable to liquids.

[0037] The adhesive layer 36 can be formed by applying and drying a coating liquid for forming the adhesive layer 36. The coating liquid can be prepared by blending a functional additive, a curing agent, a solvent, etc. with a binder, for example. Examples of binders include acrylic resins such as polymethyl methacrylate; vinyl resins such as vinyl chloride, polyvinylidene chloride, and polyvinyl alcohol; polystyrene resins such as polystyrene, styrene-acrylonitrile copolymer, polyethylene, and ethylene-vinyl acetate copolymer; polyurethane resins; and resins obtained by copolymerizing two or more of these. The resins described above may contain ester bonds, urethane bonds, ether bonds, amine bonds, silanol bonds, etc., and the chemical structures of two or more resins having functional groups involved in these bonds may be partially crosslinked. These bonds can adjust the molecular weight, softening temperature, viscoelasticity, solvent resistance, etc. When a thermoplastic resin is used as a binder, it may be a copolymer or may be modified. The thickness of the adhesive layer 36 can be set in the range of 2 μm to 10 μm, for example.

[0038] The operation of the transfer medium 1 according to this embodiment configured as above when in use will be described. In the transfer medium 1, the release layer 20 has a melting point of 100°C or less, which allows the release layer 20 to soften and melt well in high-temperature environments such as during transfer. As a result, the releasability between the transfer unit 30 and the substrate 10 is improved. This effect is particularly pronounced when the surface temperature of the transfer plate used for transfer is 1.5 to 2.2 times the melting point. Furthermore, because the release layer 20 has a water contact angle of 60 to 90° at 60°C, the contact angle during transfer is close to that of typical materials used in the substrate 10 and adjacent layers of the transfer unit 30, ensuring both good release during transfer and stability during transportation and processing. When the release layer contains multiple materials, the melting point of the material with the greatest mass or the highest melting point of the multiple melting points may satisfy the above condition.

[0039] In the transfer medium 1, the water contact angle at 60°C of the surfaces of the transfer part 30, such as the microstructure layer 32 and the peel-off protective layer 31, that come into contact with the release layer 20 is 60 to 100°. As a result, heating during transfer increases the releasability at the interface between the transfer part 30 and the release layer 20, allowing the transfer part 30 to be smoothly transferred to the transfer recipient even during high-speed continuous transfer.

[0040] Furthermore, since the microstructure layer 32 is made of a photocurable resin, the internal stress caused by cure shrinkage can improve the releasability of the transfer part 30 from the substrate 10. This makes it easy to set the water contact angle at 60°C of the surface of the transfer part 30 that comes into contact with the release layer 20 within a predetermined range when the transfer part 30 is configured without a release protection layer. Furthermore, since the photocurable resin has high moldability, it is possible to obtain effects such as an improvement in the precision of the provided microstructure and an increase in the film strength, thereby improving the robustness of the microstructure layer 32.

[0041] The transfer medium according to this embodiment will be described in more detail using examples. The technical scope of the present invention is not limited solely by the specific content of each example. In the following description, "parts" means parts by mass unless otherwise specified.

[0042] Example 1 A PET film having a thickness of 38 μm was prepared as the substrate 10, and a release layer coating solution 1 having the composition shown below was applied to one side of the film by gravure coating so that the coating amount after drying was 0.1 g / m 2 The release layer 20 was formed by applying and drying the solution so that the release layer 20 ·Release layer coating liquid 1 Paraffin wax emulsion (solid content 35%), melting point 90°C, 0.1 part Water 3.0 parts IPA (isopropyl alcohol) 3.0 parts

[0043] Next, a release protective layer coating solution 1 having the composition shown below was applied onto the release layer 20 by gravure coating and dried to a coating thickness of 1 μm after drying, thereby forming a release protective layer 31. Peel-off protective layer coating solution 1 Acrylic resin 1.0 parts Toluene 2.0 parts MEK (methyl ethyl ketone) 2.0 parts

[0044] Next, a microstructure layer coating solution 1 having the composition shown below was applied and dried onto the peelable protective layer 31 using a gravure coating method so that the coating film thickness after drying would be 1.5 μm, and a metal plate with a microstructure formed on it was pressed against the coating and exposed to ultraviolet light to form a microstructure layer 32. Microstructure layer coating solution 1 Acrylic UV-curable resin (solid content 35%) 5.0 parts Photoradical initiator 0.1 parts Silane coupling agent 0.4 parts Fluorine-based release agent (solid content 10%) 0.2 parts MEK 1.5 parts

[0045] Subsequently, a reflective layer 33 made of aluminum and having a thickness of 600 Å was formed on the microstructure layer 32 by vapor deposition. Finally, adhesive layer coating solution 1 having the composition shown below was applied onto reflective layer 33 by gravure coating and dried so that the coating film thickness after drying would be 3 μm, thereby forming adhesive layer 36 . Adhesive layer coating solution 1 Vinyl chloride-vinyl acetate copolymer 1.0 parts Toluene 1.5 parts MEK 1.5 parts In this way, the transfer medium according to Example 1 was produced.

[0046] Example 2 A transfer medium according to Example 2 was produced in the same manner as in Example 1, except that the release protective layer coating solution 1 was replaced with the release protective layer coating solution 2 having the composition shown below. Peel-off protective layer coating solution 2 Cellulose acetate propionate resin 1.0 part Toluene 2.0 parts MEK 4.0 part

[0047] Example 3 A transfer medium according to Example 3 was produced in the same manner as in Example 1, except that release layer coating liquid 2 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 2 Paraffin wax emulsion (50% solids), melting point 60°C, 0.1 parts 4.1 parts water IPA 4.1 Division

[0048] Example 4 A transfer medium according to Example 4 was produced in the same manner as in Example 1, except that release layer coating liquid 3 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 3 Carnauba wax dispersion (solid content 11%), melting point 85°C, 0.5 parts 4.3 parts water IPA 4.3 parts

[0049] Example 5 A transfer medium according to Example 5 was produced in the same manner as in Example 1, except that release layer coating liquid 4 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 4 Paraffin wax emulsion (solid content 35%), melting point 90°C, 0.1 part Phosphate ester (solid content 100%) Melting point 15°C 0.002 parts Water 3.0 parts IPA 3.0

[0050] Example 6 A transfer medium according to Example 6 was produced in the same manner as in Example 1, except that the release protective layer coating solution 1 was replaced with the release protective layer coating solution 3 having the following composition. Peel-off protective layer coating solution 3 Polyamide-imide resin (25% solids) 1.0 part THF (tetrahydrofuran) 1.0 parts

[0051] Example 7 A transfer medium according to Example 7 was produced in the same manner as in Example 1, except that the release protective layer 31 was not formed.

[0052] Example 8 A transfer medium according to Example 8 was produced in the same manner as in Example 1, except that fine-structure layer coating liquid 2 having the composition shown below was used instead of fine-structure layer coating liquid 1. Microstructure layer coating solution 2 Epoxy UV-curable resin (50% solids) 5.0 parts Silane coupling agent 0.3 parts MEK 3.0 parts

[0053] Example 9 A transfer medium according to Example 9 was produced in the same manner as in Example 2, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1. Example 10 A transfer medium according to Example 10 was produced in the same manner as in Example 3, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1. Example 11 A transfer medium according to Example 11 was produced in the same manner as in Example 4, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1. Example 12 A transfer medium according to Example 12 was produced in the same manner as in Example 5, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1. Example 13 A transfer medium according to Example 13 was produced in the same manner as in Example 6, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1. Example 14 A transfer medium according to Example 13 was produced in the same manner as in Example 7, except that the fine-structure layer coating liquid 2 was used instead of the fine-structure layer coating liquid 1.

[0054] (Comparative Example 1) A transfer medium according to Comparative Example 1 was produced in the same manner as in Example 9, except that the release layer and the protective peeling layer were not provided.

[0055] (Comparative Example 2) A transfer medium according to Comparative Example 2 was produced in the same manner as in Example 1, except that no release layer was provided.

[0056] (Comparative Example 3) A transfer medium according to Comparative Example 3 was produced in the same manner as in Example 1, except that release layer coating liquid 5 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 5 Paraffin wax emulsion (solid content 30%), melting point 110°C, 0.1 part 2.5 parts water 2.5 parts IPA

[0057] Comparative Example 4 A transfer medium according to Comparative Example 4 was produced in the same manner as in Example 1, except that release layer coating liquid 6 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 6 Vinyl acetate copolymer wax emulsion (solid content 30%), melting point 105°C, 0.1 part 2.5 parts water 2.5 parts IPA

[0058] (Comparative Example 5) A transfer medium according to Comparative Example 5 was produced in the same manner as in Example 1, except that release layer coating liquid 7 having the composition shown below was used instead of release layer coating liquid 1. ·Release layer coating liquid 7 Modified polyethylene wax (solid content 35%), melting point 105°C, 0.1 part Water 2.9 parts 2.9 parts IPA

[0059] (Comparative Example 6) A transfer medium according to Comparative Example 6 was produced in the same manner as in Example 1, except that the release protective layer coating solution 1 was replaced with the release protective layer coating solution 4 having the composition shown below. Peel-off protective layer coating solution 4 Acrylic resin 1.0 parts Silicone oil 0.03 parts Toluene 2.0 parts MEK 2.0 part

[0060] (Comparative Example 7) A transfer medium according to Comparative Example 7 was produced in the same manner as in Example 1, except that the release protective layer coating liquid 1 was replaced with release protective layer coating liquid 5 having the following composition. Peel-off protective layer coating solution 5 Acrylic resin 1.0 parts Quaternary ammonium salt (50% solids) 0.1 parts Toluene 2.0 parts MEK 2.0 part

[0061] (Comparative Example 8) A transfer medium according to Comparative Example 8 was produced in the same manner as in Example 1, except that the release layer coating liquid 1 was replaced with the release layer coating liquid 10 having the composition shown below. ·Release layer coating liquid 10 Paraffin wax emulsion (solid content 35%), melting point 90°C, 0.1 part Phosphate ester (solid content 100%), melting point 15°C, 0.003 parts Water 3.0 parts IPA 3.0

[0062] The transfer medium according to each example was evaluated as follows. (Water contact angle measurement) Using pure water, the coating film in the state where each layer was formed on a hot plate at 60°C was measured with a contact angle meter, and the angle after 10 seconds was taken as the water contact angle. The measurement targets were the release layer of each example and the layer in contact with the release layer on the opposite side of the substrate in each example (hereinafter referred to as the "adjacent layer"), and the measurement was performed immediately after the target layer was formed.

[0063] (High-speed continuous transfer) Using a transfer machine, the transfer target material has a basis weight of 81.4 g / m 2 100 shots (100 transfer points) were transferred onto high-quality paper at a plate temperature of 130°C. Three speeds were used: 60 shots / min, 70 shots / min, and 80 shots / min, all of which are considered high speeds. If the transfer machine stopped automatically before all transfers were completed, it was marked as × (BAD), and if it completed without stopping, it was marked as ○ (GOOD). If at least one of the criteria was marked as ○, it was evaluated as being capable of high-speed continuous transfer and was considered to have passed.

[0064] (Moldability of microstructure) The intensity of the laser light incident from above at a 45° angle to the transfer part of the transfer product, in which the transfer part has been transferred to the transferee, is I0, and the intensity of the diffracted light when the laser light is incident on the evaluation diffraction grating from 45° and diffracted in the 90° direction is I. The diffraction efficiency was calculated as I / I0 × 100 (%) and evaluated based on the difference from the design value. The results are shown in Table 1.

[0065] [Table 1]

[0066] In all of the examples, the release layer satisfied the specified conditions, and therefore it was possible to adapt to high-speed continuous transfer at at least 60 shots / min. In some examples, it was possible to adapt to even higher speeds of 80 shots / min, which was thought to be partly due to the fact that the microstructure layer was a radical polymerization type. On the other hand, none of the comparative examples were suitable for high-speed continuous transfer. In comparative examples 1 and 2, the cause was thought to be the absence of a release layer. In comparative examples 3 to 5, the cause was thought to be an excessively high melting point of the release layer. In comparative examples 6 and 7, the cause was thought to be the water contact angle of the adjacent layer being outside the specified range. In comparative example 8, the cause was thought to be the water contact angle of the release layer being outside the specified range.

[0067] The present invention has been described above using embodiments and examples, but the specific configuration is not limited to these embodiments, and configuration changes and combinations within the scope that do not deviate from the gist of the present invention are also included. [Explanation of symbols]

[0068] 1 Transfer medium 10 Base material 20 Release layer 30 Transfer unit 31 Peelable protective layer 32 Microstructure layer 33 Reflective layer 36 Adhesive layer

Claims

1. A substrate; a release layer provided on the substrate; a transfer section having a fine structure layer, a reflective layer, and an adhesive layer, the transfer section being provided on the release layer with the fine structure layer positioned on the release layer side; Equipped with the release layer is made of a material having a melting point of 100°C or less, the release layer has a water contact angle of 60° or more and 90° or less at 60°C; the surface of the transfer portion in contact with the release layer has a water contact angle at 60° or more and 100° or less at 60°; Transcription medium.

2. The microstructure layer is formed of a photocurable resin. The transfer medium according to claim 1 .

3. the release layer contains at least one of a wax having a melting point of 100°C or less and a phosphate ester having a melting point of 100°C or less; The transfer medium according to claim 1 .

4. The transfer unit has a release protection layer provided on the microstructure layer. The transfer medium according to claim 1 .

5. the release layer is in the form of a pseudo-film in which particulate wax or phosphate ester is disposed; The transfer medium according to claim 3 .

6. the peelable protective layer is a layer containing no aromatic compound; The transfer medium according to claim 4 .

7. The transfer portion of the transfer medium according to any one of claims 1 to 6 is brought into contact with a transfer target, A transfer plate is brought into contact with the transfer medium from the substrate side; the transfer plate is heated to a temperature that is 1.5 times or more and 2.2 times or less the melting point of the release layer, and pressed against the transfer plate to transfer the transfer portion to the transfer-receiving object; Methods for producing transcripts.

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