Measurement method and measuring tool

Abstract

To easily measure the temperature of a workpiece during processing using a device that does not have a temperature sensor.SOLUTION: A measurement method for measuring the temperature of a workpiece held in a holding portion during processing includes a holding step of holding a measuring jig (20) having a housing portion (23) on one surface (21) for housing a temperature sensor (24) that measures temperature in the holding portion (41), a processing step of processing the measuring jig under predetermined processing conditions, and an acquisition step of acquiring the measurement results of the temperature sensor measured in the processing step.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a measuring method and a measuring tool for measuring the temperature when a workpiece is being processed. [Background technology]

[0002] There is a demand for periodically checking the temperature in the processing space while a workpiece is being processed in a processing device. For example, as disclosed in Patent Documents 1 and 2, in processing devices that process workpieces such as wafers using plasma gas, temperature sensors are attached to the outer wall of the chamber or to a holder that holds the workpiece in order to measure the temperature inside the chamber that houses the workpiece during plasma processing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-168422 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-070671 Summary of the Invention [Problem to be solved by the invention]

[0004] In some cases, it is difficult to install a temperature sensor later on in a processing device, or it is desirable to reduce the cost of installing a temperature sensor in the processing device. Therefore, even in processing devices that do not have a temperature sensor, it is desirable to be able to measure the temperature during processing. Furthermore, since the temperature in the processing space during processing is not uniform, there is a desire to measure the temperature as close as possible to the location where the workpiece is being processed in order to obtain highly accurate measurement results.

[0005] An object of the present invention is to provide a measurement method and a measurement tool that can easily measure the temperature of a workpiece during processing even in an apparatus that does not have a temperature sensor. [Means for solving the problem]

[0006] One aspect of the present invention is a measurement method for measuring the temperature during processing in a processing device that processes a workpiece held in a holding section using a processing unit under predetermined processing conditions, and includes a holding step in which a measurement jig having a housing section on one side that houses a temperature sensor that measures temperature is held in the holding section, a processing step in which the measurement jig is processed under the predetermined processing conditions, and an acquisition step in which the measurement results of the temperature sensor measured in the processing step are acquired.

[0007] The accommodating portion is a recess that is recessed from one surface of the measuring jig along a second direction that intersects with a first direction in which the one surface extends, and it is preferable that the temperature sensor has a thickness that does not protrude from the one surface in the second direction.

[0008] The processing device has a transport unit that sucks one side of the workpiece stored in a cassette and transports it in and out of the holding part, the measuring jig is stored in the same or a different cassette as the workpiece, and the transport unit that transports the workpiece sucks the one side of the measuring jig, including the area where the temperature sensor is stored, between the cassette and the holding part and transports it. In such a case, if the temperature sensor is thick enough not to protrude from the one side of the measuring jig, the sucking of the measuring jig by the transport unit is not hindered.

[0009] The temperature sensor is preferably a temperature display member that changes color depending on the temperature, and the acquisition step preferably acquires the measurement result from an image of the temperature sensor taken during or after the processing step is being performed.

[0010] The processing step includes, for example, performing plasma processing on the measurement jig.

[0011] One aspect of the present invention is a measurement tool having, on one surface thereof, a housing portion for housing a temperature sensor that measures temperature.

[0012] The storage portion may include a plurality of recesses having different volumes. [Effects of the Invention]

[0013] According to the above aspect, by using the measuring jig, even an apparatus that does not have a temperature sensor can easily measure the temperature of a workpiece during processing. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. [Figure 2] FIG. [Figure 3] FIG. [Figure 4] FIG. 10 is a diagram showing an example of a temperature display of a temperature sensor provided in the measuring jig. [Figure 5] FIG. 10 is a cross-sectional view of a modified measuring jig. [Figure 6] FIG. 10 is a cross-sectional view of a modified measuring jig. [Figure 7] FIG. 2 is a plan view showing a schematic structure of the processing device. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. 1 illustrates an acquisition step. DETAILED DESCRIPTION OF THE INVENTION

[0015] A measurement method and a measurement jig according to an embodiment of the present invention will be described below with reference to the accompanying drawings. The measurement method and the measurement jig are implemented and used to measure the temperature during processing in a processing device that performs a series of processes, including processing, on a workpiece.

[0016] 1 shows a workpiece 10 to be processed. The workpiece 10 is a disk-shaped semiconductor wafer, optical device wafer, or the like, and is made of a material such as silicon, sapphire, or gallium arsenide. A notch 11 indicating the crystal orientation is formed on the outer periphery of the workpiece 10.

[0017] On the front surface side of the workpiece 10, devices 13 are formed in each region partitioned by grid-like planned dividing lines 12. The devices 13 are, for example, integrated circuits such as ICs (Integrated Circuits) and LSIs (Large Scale Integration), or image sensors such as CCDs (Charge Coupled Devices) and CMOSs ​​(Complementary Metal Oxide Semiconductors). The front surface side of the workpiece 10 on which the devices 13 are formed may be covered with a protective film (not shown).

[0018] 2 and 3 show a measuring jig 20 for measuring the temperature during processing in a processing device 30 (see FIGS. 7 to 10) described below that processes a workpiece 10. The measuring jig 20 is transported to the processing device 30 in the same manner as the workpiece 10, and is installed in place of the workpiece 10 to measure the temperature.

[0019] The measuring jig 20 has a disk shape similar to that of the workpiece 10. The diameter and thickness of the measuring jig 20 are set to be approximately the same as those of the workpiece 10. For example, if the workpiece 10 is a silicon wafer with a diameter of 8 inches and a thickness of 100 μm to 725 μm, it is preferable that the measuring jig 20 have a diameter and thickness similar to those of the workpiece 10. If the shape and dimensions of the measuring jig 20 are approximately the same as those of the workpiece 10, the measuring jig 20 can be transported and installed using a structure for transporting and installing the measuring jig 20 relative to the workpiece 10 in the processing device 30, allowing for efficient temperature measurement. Furthermore, if the shape and dimensions of the measuring jig 20 are approximately the same as those of the workpiece 10, temperature measurement can be performed under conditions similar to those of the processing conditions for the workpiece 10 (such as the processing position), and highly accurate measurement results can be obtained.

[0020] Although the illustrated workpiece 10 and measuring jig 20 are both disk-shaped, the workpiece and measuring jig to which the present invention is applied are not limited to being disk-shaped. For example, the workpiece may be a rectangular package substrate, and the outer shape of the measuring jig may be rectangular correspondingly.

[0021] Furthermore, if the processing device 30 is capable of transporting and installing workpieces and measuring jigs of different shapes and sizes, the shape and size of the measuring jig may differ from the shape and size of the workpiece. For example, if the workpiece is a rectangular package substrate, it is also possible to measure the temperature using the disk-shaped measuring jig 20 shown in Figure 2.

[0022] The material of the measuring jig 20 may be the same as the material of the workpiece 10, or may be a material different from that of the workpiece 10. However, it is preferable that the measuring jig 20 be made of a material having heat resistance, mechanical properties, chemical properties, etc. similar to those of the workpiece 10 so that deformation or damage to the measuring jig 20 does not occur when temperature measurement is performed using the measuring jig 20 in the processing device 30 under processing conditions similar to those used when processing the workpiece 10.

[0023] The measuring jig 20 has one surface 21 and the other surface 22 on the front and back sides, and has a receiving portion 23 formed therein, which is a recess recessed from the one surface 21. In other words, the receiving portion 23 is a recess recessed from the one surface 21 along a second direction (a direction including a component in the thickness direction of the measuring jig 20) that intersects with a first direction in which the one surface 21 extends. As shown in FIG. 4 , the receiving portion 23 is rectangular in plan view. The receiving portion 23 can be formed, for example, by performing partial cutting, etching, grinding, polishing, or the like on the one surface 21 that is initially flat.

[0024] The temperature sensor 24 is housed inside the housing portion 23. The temperature sensor 24 is a label-like (sheet-like) temperature display member with multiple temperature indicators 241, 242, and 243 arranged on its surface. The temperature sensor 24 has an adhesive layer on its back surface opposite the surface on which the temperature indicators 241, 242, and 243 are provided. The temperature sensor 24 is fixed to the measurement jig 20 by attaching the adhesive layer to the bottom surface of the housing portion 23. The temperature sensor 24 has a rectangular shape similar to that of the housing portion 23 in a plan view, is smaller than the housing portion 23, and fits inside the housing portion 23. The temperature sensor 24 is also set to a thickness such that it does not protrude from the one surface 21 in the second direction. In other words, the thickness of the temperature sensor 24 is equal to or less than the depth of the housing portion 23.

[0025] The temperature sensor 24 is housed within the housing 23 without protruding from the one surface 21, which has the advantage that the temperature sensor 24 does not interfere with external structures or objects when the measuring jig 20 is handled. For example, the transport unit 34 described below in the processing apparatus 30 includes a transport pad 60 (see FIGS. 8 and 10) that is structured to suction-hold the entire front or back surface of the workpiece 10. When the measuring jig 20 is transported by the transport unit 34, the transport pad 60 suction-holds the one surface 21, including the area where the temperature sensor 24 is housed. Since the temperature sensor 24 does not protrude from the one surface 21, the transport pad 60 can suction-hold the one surface 21 without interference from the temperature sensor 24, and the measuring jig 20 can be transported using the transport unit 34, just like the workpiece 10. In particular, from the viewpoint of enabling the transport of the measuring jig 20 using the transport unit 34, it is preferable that the area of ​​the measuring jig 20 around the temperature sensor 24 that comes into contact with the transport pad 60 has at least the same shape as the workpiece 10.

[0026] Note that areas of the measuring jig 20 other than the area that comes into contact with the transport pad 60 may have a different shape from the workpiece 10. For example, even if the outer shape of the measuring jig 20 that the transport pad 60 does not come into contact with is slightly different from the outer shape of the workpiece 10, it is possible to transport the measuring jig 20 using the transport pad 60, and to store the measuring jig 20 in a cassette of the same size as the cassette 37 that stores the workpiece 10.

[0027] The temperature indicators 241, 242, and 243 of the temperature sensor 24 each have a temperature-dependent color development property that changes color at different set temperatures. By observing whether or not the color of each of the temperature indicators 241, 242, and 243 changes, information about the temperature in the environment in which the measuring jig 20 is installed can be obtained. As an example, the color of the temperature indicator 241 changes from its original state when it reaches 100°C, the temperature indicator 242 changes from its original state when it reaches 105°C, and the temperature indicator 243 changes from its original state when it reaches 110°C. In the example shown in FIG. 4, as a result of performing a processing step described below in the processing device 30, the color of the temperature indicators 241 and 242 changes, while the color of the temperature indicator 243 remains unchanged. Based on the display content of the temperature sensor 24 after this color change, it is determined that the temperature near the one surface 21 of the measuring jig 20 during the processing step was equal to or higher than 105°C and lower than 110°C.

[0028] It is preferable that the colors of the temperature indicators 241, 242, and 243 after they have changed are different from one another. Having the temperature indicators 241, 242, and 243 change to different colors after they have changed improves distinguishability, making it easier to determine the temperature that has been reached. However, even if a temperature sensor 24 is used in which the temperature indicators 241, 242, and 243 all change to the same color, it is still possible to distinguish the temperature that has been reached, so it is also possible to use a temperature sensor 24 in which multiple temperature indicators change to the same color.

[0029] The temperature sensor 24 may be either an irreversible color-change type in which the temperature indicators 241, 242, and 243 maintain their color change even after the temperature drops below a set value, or a reversible color-change type in which the temperature indicators 241, 242, and 243 return to their original color after the temperature drops below a set value. The irreversible color-change type temperature sensor 24 is suitable when temperature information is acquired from the temperature sensor 24 after processing, rather than under the temperature environment during processing. On the other hand, when the state of the temperature sensor 24 can be observed in real time, such as by processing while capturing images of the measuring jig 20 under the temperature environment during processing, the reversible color-change type temperature sensor 24 can be used, and information on the temperature change during processing in the measuring jig 20 can be acquired.

[0030] The temperature sensor 24 shown in FIG. 4 indicates three temperature levels in 5°C increments via temperature indicators 241, 242, and 243. However, the number of temperature levels indicated by the temperature sensor and the temperature difference between the levels are not limited to this specific example. The temperature sensor may indicate two or fewer temperature levels, or four or more temperature levels. The temperature differences between the temperature levels indicated by the temperature sensor do not have to be uniform. Furthermore, a temperature sensor having a temperature indicator with a continuous bar-shaped display, rather than a divided arrangement like temperature indicators 241, 242, and 243, may also be used. In other words, the temperature sensor only needs to have the performance to measure the desired temperature change within the desired temperature range corresponding to the processing of the workpiece 10.

[0031] 4 are rectangular in plan view, the shapes of the housing section 23 and the temperature sensor 24 are not limited to this specific example. For example, the shapes of the housing section 23 and the temperature sensor 24 in plan view may be polygonal other than rectangular, circular, or an arc extending in the circumferential direction of the measuring jig 20.

[0032] By making the housing portion 23 and the temperature sensor 24 similar in shape, the size of the housing portion 23 for accommodating the temperature sensor 24 can be minimized, and it is possible to efficiently produce the measuring jig 20 including the housing portion 23. However, this does not exclude the possibility of setting the housing portion 23 and the temperature sensor 24 to shapes that are not similar.

[0033] 2, the housing portion 23 and the temperature sensor 24 are arranged at a position eccentric to the center of the measuring jig 20 and closer to the outer periphery, but the arrangement of the housing portion and the temperature sensor is not limited to this specific example. For example, the housing portion and the temperature sensor may be arranged at a position closer to the center of the measuring jig 20 than the position shown in FIG. 2 (or at the center of the measuring jig 20).

[0034] The measuring jig 20 shown in Figure 2 each has one storage section 23 and one temperature sensor 24, but it may also have multiple storage sections 23 and multiple temperature sensors 24, as in the modified measuring jig 20 shown in Figures 5 and 6.

[0035] 5 includes three storage sections 23 with the same depth and three temperature sensors 24 with the same thickness, with each storage section 23 housing one of the temperature sensors 24. That is, the measurement jig 20 includes multiple storage sections 23 with the same volume so as to house multiple temperature sensors 24 with the same dimensions (thickness) in a second direction that intersects with a first direction in which one surface 21 extends.

[0036] 6 includes three storage sections 23 with gradually varying depths and three temperature sensors 24 with gradually varying thicknesses, and the depth order of the three storage sections 23 corresponds to the thickness order of the three temperature sensors 24, with each temperature sensor 24 stored in each storage section 23. In other words, the measurement jig 20 includes multiple storage sections 23 with different volumes in order to store multiple temperature sensors 24 with different dimensions (thicknesses) in a second direction that intersects with a first direction in which one surface 21 extends.

[0037] The multiple temperature sensors 24 provided in the measurement jig 20 of FIG. 5 and the multiple temperature sensors 24 provided in the measurement jig 20 of FIG. 6 may each be temperature sensors with different specifications that measure different temperature ranges or different temperature differences, or they may each be temperature sensors with the same specifications that measure the same temperature range or the same temperature difference. By using multiple temperature sensors 24 with different specifications, it is possible to widen the measurable temperature range and measure temperatures in finer increments. By using multiple temperature sensors 24 with the same specifications, it is possible to measure temperature differences between locations on the measurement jig 20 and to compare the measurement results of the multiple temperature sensors 24 to correct for variations in measurement results due to individual differences between the temperature sensors 24.

[0038] In the measuring jig 20 of Figure 6, the volumes of the multiple storage sections 23 are different due to differences in depth, but the volumes of the multiple storage sections 23 may also be different due to differences in shape or area in a plan view. Also, the multiple temperature sensors 24 may differ from each other not only in thickness but also in shape or area in a plan view. By changing the shape or area of ​​the temperature sensor 24 in a plan view, the number of temperature indicators (241, 242, 243) that can be stored can be adjusted.

[0039] Furthermore, when the measurement jig 20 has multiple storage sections 23 of different volumes, rather than placing temperature sensors 24 in all of the storage sections 23 as shown in Figure 6, it is possible to select a storage section 23 with a volume suitable for the temperature sensor 24 to be used (differences in thickness, area, etc.) and store the temperature sensor 24 therein, while leaving the other storage sections 23 empty without storing a temperature sensor 24, and then store a new temperature sensor 24 in the empty storage section 23 at the time of the next measurement, thereby performing multiple temperature measurements using the same measurement jig 20.

[0040] 5 and 6 includes a plurality of accommodation sections 23 in a number corresponding to the plurality of temperature sensors 24, but one accommodation section 23 may be configured to accommodate a plurality of temperature sensors 24. For example, one accommodation section 23 having an elongated shape may be formed to accommodate three temperature sensors 24. Furthermore, when accommodating a plurality of temperature sensors 24 with different thicknesses as shown in FIG. 6, one accommodation section 23 may be formed in which the height of the bottom surface changes in a stepped manner.

[0041] When the measurement jig 20 includes multiple storage sections 23 and multiple temperature sensors 24, they may be arranged adjacent to each other in a relatively close positional relationship as shown in Figures 5 and 6, or they may be arranged at a distance from each other. For example, in a disk-shaped measurement jig 20, multiple storage sections 23 and multiple temperature sensors 24 may be arranged at equal intervals in the circumferential direction. Alternatively, in a disk-shaped measurement jig 20, multiple storage sections 23 and multiple temperature sensors 24 may be arranged with their positions shifted in the radial direction.

[0042] Next, the processing apparatus 30 will be described with reference to Fig. 7 to Fig. 10. As shown in Fig. 7, which is a plan view of the apparatus, the processing apparatus 30 includes a cassette installation section 31, a processing unit 32, a processing unit 33, and a transport unit 34. The processing apparatus 30 is an apparatus that performs predetermined processing and predetermined treatment on the workpiece 10, and in this embodiment, the processing unit 32 performs plasma processing (plasma etching) using a gas in a plasma state, and the treatment unit 33 performs cleaning. In addition, a measuring jig 20 is used to measure the temperature of the workpiece 10 during processing in the processing apparatus 30.

[0043] The control unit 35 provided in the processing device 30 has a memory that stores a program for operating the processing device 30 and a processor that executes the program, and transmits control signals from the control unit 35 to each part of the processing device 30 to cause it to operate. The operation of each step in the processing device 30, which will be described later, is executed under the control of the control unit 35.

[0044] In addition, in the processing device 30, all operations, including the transportation of the workpiece 10, can be performed fully automatically under the control of the control unit 35, but it is also possible to apply this to a processing device in which some processes, such as the transportation and installation of the workpiece 10, are performed manually by an operator.

[0045] The processing device 30 is equipped with a notification unit 36 ​​for notifying the operator of various information such as the device's operation settings and operating status. The notification unit 36 ​​is a touch panel display device that also serves as an operation input unit, an indicator lamp that lights up or flashes in multiple different colors, a speaker that emits sound, etc. The notification unit 36 ​​also includes a transmission unit that transmits a notification signal from the processing device 30 to an external device (such as a computer, a server, or a mobile information terminal).

[0046] 7, a box-shaped cassette 37 that houses the workpieces 10 and measuring jigs 20 is placed on the cassette installation section 31. A plurality of workpieces 10 and measuring jigs 20 can be housed inside the cassette 37, and the workpieces 10 and measuring jigs 20 can be carried in and out of the cassette 37 through openings (not shown) provided on the side of the cassette 37.

[0047] 8 and 9, the processing unit 32 has a holding table 41, which is a holding section that holds the workpiece 10 and the measuring jig 20, inside a box-shaped chamber 40. A loading / unloading port 42 that connects the inside and outside of the chamber 40 is formed in the side wall of the chamber 40, and the workpiece 10 and the measuring jig 20 are loaded and unloaded from the holding table 41 through the loading / unloading port 42.

[0048] An opening / closing door 43 is provided to open and close the loading / unloading entrance 42, and the opening / closing door 43 is opened and closed by a door opening / closing mechanism (not shown). The door opening / closing mechanism may be configured to rotate the opening / closing door 43 supported by a hinge using a motor or the like, or to move the opening / closing door 43 supported so that it can slide vertically and horizontally using a feed screw mechanism or air cylinder or the like. When the opening / closing door 43 is closed, the inside of the chamber 40 becomes an airtight structure that is sealed off from the outside air.

[0049] The upper surface of the holding table 41 is a flat holding surface that holds the workpiece 10. An electrode 44 is provided inside the holding table 41. When power is supplied to the electrode 44 from a DC power supply 45, an electrostatic attraction force is generated between the holding surface of the holding table 41 and the workpiece 10, and the workpiece 10 is attracted and held on the holding surface of the holding table 41. Similarly, the measuring jig 20 can be attracted and held on the holding surface of the holding table 41.

[0050] In addition, as a structure for adsorbing and holding the workpiece 10 and the measuring jig 20 on the holding table 41, a number of suction holes may be formed on the upper surface of the holding table 41, and air may be sucked in through the suction holes using a suction source to hold the workpiece 10 and the measuring jig 20 by negative pressure.

[0051] The apparatus includes a pressure reducing unit 46 that reduces the pressure in the internal space of the chamber 40. The pressure reducing unit 46 has a pressure reducing flow path 461 that connects to the chamber 40, a pressure reducing pump 462 to which the pressure reducing flow path 461 is connected, and an on-off valve 463 that is provided midway along the pressure reducing flow path 461. The pressure reducing unit 46 reduces the pressure in the internal space of the chamber 40 by opening the on-off valve 463 and operating the pressure reducing pump 462 while the loading / unloading port 42 is closed by the on-off door 43.

[0052] The processing unit 32 has a gas supply unit 47 outside the chamber 40. The gas supply unit 47 has an introduction tube 471 connected to the top of the chamber 40, and a pair of plasma electrodes 472 are provided facing each other on both sides of the introduction tube 471. High-frequency AC power is supplied to the pair of plasma electrodes 472 from a high-frequency power source 473.

[0053] A gas supply source 474 is connected to the introduction tube 471 via a gas flow path 475 and an on-off valve 476. The gas supply source 474 stores a gas for plasma processing the workpiece 10. The gas for plasma processing is, for example, sulfur hexafluoride (SF6) gas.

[0054] When processing the workpiece 10 in the processing unit 32, the workpiece 10 is held by suction on the holding surface of the holding table 41, the loading / unloading port 42 is closed by the opening / closing door 43, and the pressure inside the chamber 40 is reduced using the pressure reducing unit 46. The opening / closing valve 476 is opened, and gas for plasma processing supplied from the gas supply source 474 is sent to the introduction tube 471 via the gas flow path 475. By applying high-frequency AC power from the high-frequency power supply 473 to the pair of plasma generation electrodes 472, the gas passing inside the introduction tube 471 is radicalized and ionized to become plasma.

[0055] Plasma gas generated by gas supply unit 47 flows from introduction tube 471 into the internal space of chamber 40, which is in a reduced pressure state. Gas diffusion member 48 is provided inside chamber 40, and the flowing plasma gas is diffused by gas diffusion member 48 and advances toward holding table 41. Then, workpiece 10 held on holding table 41 is processed by the action of the plasma gas. For example, a process of plasma etching the back surface of workpiece 10 or a process of forming grooves or cracks that will serve as division starting points along planned division lines 12 is performed.

[0056] In addition, the processing unit 32 in this embodiment is a remote plasma type plasma processing unit in which plasma gas is flowed into the internal space of the chamber 40 from a gas supply unit 47 provided outside the chamber 40, but it may also be a plasma processing unit of a type in which a plasma processing electrode is placed inside the chamber 40 and the etching gas is turned into plasma in the internal space of the chamber 40.

[0057] As shown in Figures 7 and 10, the processing unit 33 includes a holding table 50 that holds the workpiece 10 and the measuring jig 20, and a cleaning nozzle 51 that sprays cleaning liquid and air toward the holding table 50.

[0058] The upper surface of the holding table 50 is a flat holding surface that holds the workpiece 10 and the measuring jig 20. A large number of suction holes are formed in the holding surface of the holding table 50, and a suction source 52 (see FIG. 7) is provided to suck air through the suction holes of the holding table 50. By sucking air with the suction source 52, the workpiece 10 and the measuring jig 20 can be sucked and held onto the holding surface of the holding table 50.

[0059] The holding table 50 is rotated around an axis extending in the vertical direction by a rotation mechanism 53 (see FIG. 7). The rotation mechanism 53 is configured to transmit the force of a drive source such as a motor to a base that supports the holding table 50, thereby rotating the holding table 50.

[0060] 7, the cleaning nozzle 51 is connected to flow paths extending from a cleaning liquid supply source 54 and an air supply source 55. By operating on-off valves 56 and 57, it is possible to switch between a state in which cleaning liquid is supplied to the cleaning nozzle 51 from the cleaning liquid supply source 54 and a state in which air is supplied to the cleaning nozzle 51 from the air supply source 55.

[0061] In the processing unit 33, the workpiece 10 is held by suction on the holding surface of the holding table 50, and the holding table 50 is rotated by the rotation mechanism 53, and a cleaning liquid is sprayed from the cleaning nozzle 51 toward the workpiece 10, thereby cleaning the workpiece 10. This cleaning removes processing debris generated during plasma etching in the processing unit 32 and removes a protective film covering the surface side of the workpiece 10. In addition, air is sprayed from the cleaning nozzle 51 to dry the workpiece 10 after cleaning.

[0062] The cleaning nozzle 51 is supported so as to be rotatable (pivotable) about an axis extending in the vertical direction. When spraying cleaning liquid or air from the cleaning nozzle 51 toward the workpiece 10 on the holding table 50, the cleaning nozzle 51 is positioned above the holding table 50 as shown in Fig. 7. When the workpiece 10 or the measuring jig 20 is loaded or unloaded onto or from the holding table 50, the cleaning nozzle 51 is rotated so as to move away from above the holding table 50 so as not to interfere with the loading and unloading operation.

[0063] 7 and 10, the processing unit 33 includes an imaging unit 59 disposed above the holding table 50. The imaging unit 59 is capable of capturing an image of the space below the holding table 50. An image signal acquired by imaging with the imaging unit 59 is sent to the control unit 35 and processed by an image processing unit included in the control unit 35 to generate image data in a predetermined format.

[0064] As shown in Figures 7, 8, and 10, the transport unit 34 is equipped with a transport pad 60 that can suction-hold the upper surface of the workpiece 10 or measuring jig 20. A porous plate 61 made of a porous material is provided on the underside of the transport pad 60, and a suction force can be applied to the underside of the transport pad 60 by sucking air from the porous plate 61 using a suction source 62. Since the workpiece 10 to be plasma processed is thin and prone to cracking, the transport unit 34 is equipped with a transport pad 60 that can suction-hold the entire surface. One end of a transport arm 63 is connected to the transport pad 60.

[0065] The transport unit 34 includes an elevator 64 that moves the transport pad 60 up and down, and a horizontal movement unit 65 that moves the transport pad 60 horizontally. The elevator 64 is connected to the other end of the transport arm 63, and is moved up and down by a feed screw mechanism, air cylinder, or the like. The horizontal movement unit 65 supports the elevator 64 and is configured to be capable of rotation about an axis extending in the vertical direction and linear movement in the horizontal direction. The rotation of the horizontal movement unit 65 is performed by a rotation mechanism equipped with a motor. The linear movement of the horizontal movement unit 65 is performed by a feed screw mechanism, air cylinder, or the like.

[0066] The position of the transport pad 60 changes horizontally and vertically depending on the operation of the lifting unit 64 and the horizontal moving unit 65. The position of the transport pad 60 shown in Fig. 7 is a position where it is retracted from the cassette installation unit 31, the processing unit 32, and the treatment unit 33, and this position of the transport pad 60 is the standby position.

[0067] A brief description will be given of a series of processes and treatments that the processing device 30 performs on the workpiece 10. The following operations related to the processing and treatment of the workpiece 10 are performed under the control of the control unit 35.

[0068] A cassette 37 containing workpieces 10 is placed on the cassette installation section 31. The upper surface of the workpiece 10 in the cassette 37 is suction-held by the transport pad 60, and the lifting section 64 and horizontal movement section 65 of the transport unit 34 are operated to move the transport pad 60 to the processing unit 32. The transport pad 60, holding the workpieces 10, is then introduced into the chamber 40 through the loading / unloading entrance 42 with the opening / closing door 43 open. Inside the chamber 40, the transport pad 60 is brought close to the holding table 41, and the workpieces 10 are placed on the holding surface of the transport pad 60. After the workpieces 10 are delivered to the holding table 41, the transport pad 60 is returned to its standby position. With the workpiece 10 held by suction on the holding surface of the transport pad 60, the opening / closing door 43 is closed, the pressure inside the chamber 40 is reduced by the pressure reducing section 46, and plasma gas is supplied from the gas supply section 47 to the internal space of the chamber 40, and the workpiece 10 is plasma processed (plasma etched).

[0069] After plasma processing, the open / close door 43 is opened, the transport pad 60 enters the chamber 40, and the transport pad 60 suction-holds the upper surface of the workpiece 10. The lifting unit 64 and horizontal movement unit 65 are operated to move the transport pad 60 to the processing unit 33, and the workpiece 10 is placed on the holding surface of the holding table 50. After the workpiece 10 is transferred to the holding table 50, the transport pad 60 is returned to its standby position. With the workpiece 10 suction-held on the holding surface of the holding table 50, the rotation mechanism 53 rotates the holding table 50, and a cleaning liquid is sprayed from the cleaning nozzle 51 to clean the workpiece 10. After cleaning, air is sprayed from the cleaning nozzle 51 to dry the workpiece 10.

[0070] After cleaning, the upper surface of the workpiece 10 is suction-held by the transport pad 60, and the lifting unit 64 and horizontal moving unit 65 are operated to move the transport pad 60 to the cassette installation unit 31, and the workpiece 10 is placed inside the cassette 37. Once the workpiece 10 has been placed in the cassette 37, the transport pad 60 is returned to the standby position. Note that the cassette 37 that contains the workpiece 10 before processing and the cassette 37 that contains the workpiece 10 after processing may be the same or different.

[0071] Next, a measurement method for measuring the temperature during processing using the measuring jig 20 in the processing apparatus 30 will be described. The following operations related to the measuring jig 20 are controlled by the control unit 35. Temperature measurement using the measuring jig 20 proceeds in a flow similar to the above-described series of operations and processes performed by the processing apparatus 30 on the workpiece 10, except for the processing content (such as the acquisition step described below) performed by the processing unit 33. Therefore, in the processing steps described below, processing can be performed on the measuring jig 20 in the processing unit 32 under the same processing conditions as the actual processing conditions (processing recipe) performed on the workpiece 10. Alternatively, a processing recipe for temperature measurement (maintenance) may be set separately from the processing recipe for the workpiece 10, and the processing step may be performed. In particular, when the conditions for temperature measurement differ from the conditions for processing, such as when the materials of the workpiece 10 and the measuring jig 20 are different, it is preferable to use a processing recipe for temperature measurement that takes these differences into account.

[0072] The measuring jig 20 is transported to the processing device 30 while being accommodated in a cassette 37. The measuring jig 20 may be accommodated together with the workpiece 10 in the same cassette 37. Alternatively, the workpiece 10 and the measuring jig 20 may be accommodated in separate cassettes 37, and the cassette 37 accommodating the measuring jig 20 may be installed in the processing device 30 when measuring the temperature. Alternatively, a separate cassette (which may be a drawer provided in the main body of the processing device 30) accommodating the measuring jig 20 may be installed below the cassette 37 accommodating the workpiece 10, and the measuring jig 20 may be loaded and unloaded from the separate cassette. When the measuring jig 20 is transported in the cassette 37 before being installed in the processing device 30, the measuring jig 20 is accommodated in the cassette 37 so that the one surface 21 on which the temperature sensor 24 is provided faces upward. The following steps are performed with the temperature sensor 24 positioned on the upper surface of the measuring jig 20.

[0073] [Hold Step] First, a holding step is performed in which the measuring jig 20 is held on the holding surface of the holding table 41 provided in the processing unit 32. FIG. 8 shows the final stage of the holding step. When performing the holding step, the control unit 35 operates the door opening / closing mechanism (not shown) to open the opening / closing door 43. The control unit 35 controls the transport unit 34 to move the transport pad 60 from the standby position to the cassette installation unit 31, so that the upper surface of the measuring jig 20 housed in the cassette 37 is suction-held by the transport pad 60, and then the lifting / lowering unit 64 and the horizontal moving unit 65 move the transport pad 60 from the cassette 37 to the processing unit 32. When the transport pad 60 moves and passes through the carry-in / out opening 42 and reaches above the holding table 41, the lifting / lowering unit 64 lowers the transport pad 60, so that the other surface 22 of the measuring jig 20 is placed on the holding surface of the holding table 41, as shown in FIG. 8. Power is supplied from DC power supply 45 to electrode 44, and measuring jig 20 is held by suction on the holding surface of holding table 41. After measuring jig 20 is handed over to holding table 41, transport pad 60 is removed outside chamber 40 and returned to the standby position.

[0074] Because the shape and dimensions of the measuring jig 20 are substantially the same as those of the workpiece 10, the transport of the measuring jig 20 in the holding step can be performed using the same structure and operation as the transport of the workpiece 10. In particular, because the temperature sensor 24 housed in the housing portion 23 does not protrude from the one surface 21, the transport pad 60 can adsorb and transport the one surface 21 side, including the area where the temperature sensor 24 is housed.

[0075] [Processing step] Once the holding step is complete, the process proceeds to the processing step (see FIG. 9) in which the measuring jig 20 is processed under predetermined processing conditions. The predetermined processing conditions in the processing step may be the same processing conditions as those used when performing plasma processing on the workpiece 10, as described above, or may be unique processing conditions set for temperature measurement. As shown in FIG. 9, in the processing step, the control unit 35 closes the loading / unloading port 42 with the opening / closing door 43, reduces the pressure in the internal space of the chamber 40 using the pressure reducing unit 46, and supplies plasma gas from the gas supply unit 47 to the internal space of the chamber 40.

[0076] In the processing step, the temperature of the internal space of the chamber 40 is measured by the temperature sensor 24 provided in the measuring jig 20. In the case of the temperature sensor 24 shown in FIG. 4, none of the temperature indicators 241, 242, and 243 change color at temperatures below 100°C, the temperature indicator 241 changes color between 100°C and 105°C, the temperature indicators 241 and 242 change color between 105°C and 110°C, and above 110°C, the temperature indicators 241, 242, and 243 all change color. This temperature range for measurement is an example, and a temperature sensor 24 measuring a different temperature range may be used. Based on the processing conditions for the workpiece 10, the temperature sensor 24 provided in the measuring jig 20 is pre-selected to be capable of measuring temperature changes in a temperature range expected to be reached near one surface 21 of the measuring jig 20 in the processing step.

[0077] The processing device 30 acquires the temperature information measured by the temperature sensor 24 by capturing an image with the imaging unit 59 after the material is transported from the processing unit 32 to the processing unit 33, rather than during processing in the processing unit 32. For this reason, an irreversible color-changing type temperature sensor 24 is used, which maintains the color change state even after the temperature drops below the set temperature.

[0078] [Acquisition step] Once the processing step is completed, the process proceeds to an acquisition step in which the measurement results of the temperature sensor 24 of the measuring jig 20 measured in the processing step are acquired. Figure 10 shows the flow of operations from the processing step to the acquisition step in three stages, with the operations progressing in the order of the upper diagram, middle diagram, and lower diagram. Note that Figure 10 shows a simplified configuration of the processing unit 32, omitting illustrations of the chamber 40, gas supply unit 47, etc.

[0079] After the processing step, control unit 35 opens opening door 43 and controls transport unit 34 to move transport pad 60 from its standby position and enter chamber 40 through transfer port 42, where one surface 21 of measuring jig 20 is held by suction on transport pad 60. The top diagram in Figure 10 shows the state in which one surface 21 of measuring jig 20 is held by suction on transport pad 60 inside chamber 40.

[0080] The control unit 35 controls the transport unit 34 to move the transport pad 60 from the machining unit 32 to the processing unit 33 by operating the lifting unit 64 and horizontal movement unit 65, and place the other surface 22 of the measuring jig 20 on the holding surface of the holding table 50. The suction source 52 is operated to suction-hold the measuring jig 20 on the holding surface of the holding table 50. The middle diagram in FIG. 10 shows the state in which the measuring jig 20 has been transferred from the transport pad 60 to the holding table 50 and the holding surface of the holding table 50 has suction-held the measuring jig 20. Once the transfer of the measuring jig 20 to the holding table 50 is complete, the control unit 35 operates the lifting unit 64 and horizontal movement unit 65 to move the transport pad 60 to a standby position.

[0081] Since the shape and dimensions of the measuring jig 20 are approximately the same as those of the workpiece 10, and the temperature sensor 24 is housed in the housing section 23 and does not protrude from one side 21, the measuring jig 20 can be transported to the processing unit 33 (holding table 50) after the processing step by adsorbing and holding one side 21 with the transport pad 60, using the same structure and operation as the transport of the workpiece 10.

[0082] At this stage, the state shown in the lower diagram of Fig. 10 is reached. That is, the measuring jig 20 is held on the holding surface of the holding table 50 with one surface 21 facing upward, and the imaging unit 59 is positioned above the measuring jig 20. In this state, the control unit 35 causes the imaging unit 59, which is positioned above the holding table 50, to capture an image of the measuring jig 20 held on the holding table 50. The measuring jig 20 is held on the holding table 50 with the one surface 21, on which the temperature sensor 24 is provided, facing upward, and the imaging unit 59 can capture an image of the temperature sensor 24.

[0083] The imaging by the imaging unit 59 is performed so that at least the temperature sensor 24 is included in the imaging range (the angle of view of the optical system provided in the imaging unit 59). If the temperature sensor 24 is not included in the imaging range of the imaging unit 59, the control unit 35 controls the rotation mechanism 53 to rotate the holding table 50 and adjust the imaging range so that the temperature sensor 24 is included in the imaging range. The imaging range of the imaging unit 59 may be a wide angle that includes the entire one surface 21 of the measuring jig 20.

[0084] The image signal obtained by imaging by imaging unit 59 is sent to control unit 35, and processed by an image processing unit included in control unit 35 to generate image data. Control unit 35 acquires the temperature measurement results from temperature sensor 24 from the image of the generated image data. The acquired measurement results are output by any method.

[0085] For example, an image captured by the temperature sensor 24 is displayed on a display device (a touch panel display device constituting the notification unit 36) provided in the processing device 30. In another embodiment, image data is transmitted from a transmission unit of the processing device 30, and the image is displayed on an external terminal such as a smartphone or tablet computer, or the image is printed by a printer. In either embodiment, the temperature measurement result can be identified by visual inspection by an operator based on the image displayed on the screen or the printed image.

[0086] Alternatively, the control unit 35 or an external terminal may perform image analysis of an image captured of the temperature sensor 24 and identify the temperature information of the measurement result based on the color information of the temperature indicators 241, 242, and 243 of the temperature sensor 24. In this case, instead of an image displaying the temperature sensor 24, the temperature information of the measurement result may be converted into information in a different form, such as text data or a graph, and the measurement result may be output.

[0087] Furthermore, the control unit 35 or an external terminal may evaluate the temperature information, which is the measurement result, and determine whether the temperature measured using the measuring jig 20 is appropriate for the processing conditions of the workpiece 10. If it is determined that the temperature is not appropriate, an error state can be reported. For example, the control unit 35 of the processing device 30 evaluates the measurement result, and if it determines that the temperature is not appropriate, the notification unit 36 ​​of the processing device 30 issues a notification. The notification by the notification unit 36 ​​can be, for example, displaying text or image information on a display device, turning on an indicator lamp, or making a sound from a speaker. Alternatively, a notification signal can be transmitted from the transmission unit of the processing device 30, and an external terminal can be used to issue a notification.

[0088] After the acquisition step, the control unit 35 controls the transport unit 34 to suck and hold the measuring jig 20 on the holding table 50 with the transport pad 60, and operates the lifting unit 64 and the horizontal moving unit 65 to move the transport pad 60 to the cassette installation unit 31, and store the measuring jig 20 in the cassette 37. Note that before the measuring jig 20 is transported out of the processing unit 33, the measuring jig 20 may be cleaned in the processing unit 33.

[0089] After being used for temperature measurement, the measurement jig 20 can be reused by replacing (replacing) the temperature sensor 24 with a new one. By replacing only the temperature sensor 24 and reusing it, operating costs can be reduced.

[0090] Furthermore, when the measurement jig 20 has multiple storage sections 23, such as the modified example shown in Figures 5 and 6, it is possible to use the measurement jig 20 multiple times by attaching a new temperature sensor 24 to an unused storage section 23 after each use.

[0091] As described above, by using the measuring jig 20 that houses the temperature sensor 24, it is possible to easily measure the temperature of the workpiece 10 during processing (strictly speaking, the temperature under the same processing conditions as when the workpiece 10 is processed). Even when processing is performed using a processing unit 32 that does not have a temperature sensor, it is possible to measure the temperature during processing, so it is possible to measure the temperature in various processing devices without being restricted by the device configuration.

[0092] In particular, since the processing unit 32 for plasma processing requires airtightness inside the chamber 40, it would be time-consuming and costly to later install a temperature sensor that measures temperature changes inside the chamber 40 and wiring that connects to the temperature sensor without compromising the airtightness.In contrast, the measuring jig 20 is independent of the structure of the processing unit 32 and is transported to the processing unit 32 using the transport unit 34 or the like, just like the workpiece 10, so it has the advantage of being able to be operated without the need for time-consuming and cost-intensive work of installing a temperature sensor in the device.

[0093] Temperature measurement using the measuring jig 20 is performed by holding the measuring jig 20 on the same holding table 41 that holds the workpiece 10 during processing, and measuring the state of the workpiece 10 at the same position as the workpiece 10 and processed under processing conditions corresponding to the processing of the workpiece 10, so it is possible to perform highly accurate temperature measurement that accurately reflects the environment when processing the workpiece 10. As a comparative example, a temperature sensor installed on the wall surface of the chamber 40 or on the holding table 41 measures the temperature at a position distant from the workpiece 10, so if the purpose is to measure the temperature of the workpiece 10 during processing, it is difficult to perform highly accurate temperature measurement like that using the measuring jig 20.

[0094] Furthermore, by making the material of the measurement jig 20 the same as that of the workpiece 10, the temperature difference caused by the difference in material in the plasma processing environment is eliminated, and measurement results that are closer to those obtained when actually processing the workpiece 10 can be obtained.

[0095] The measuring jig 20 has a simple structure in which a label-like temperature sensor 24 with a temperature indicating function is attached to the accommodation portion 23, thereby reducing the introduction cost. Furthermore, the accommodation portion 23 is configured as a recess that is recessed from one surface 21, and the temperature sensor 24 accommodated in the accommodation portion 23 is set to a thickness that does not protrude from the one surface 21. This prevents the temperature sensor 24 from interfering with the transport pad 60 when the measuring jig 20 is transported. Therefore, the measuring jig 20 can be transported using the transport unit 34 in the same way as when transporting the workpiece 10, and no special modifications to the transport unit 34 are required when operating the measuring jig 20.

[0096] In the processing apparatus 30, the processing unit 33 is provided with an imaging unit 59 used to acquire measurement results by the temperature sensor 24 after the processing step. The processing unit 33 has a simpler configuration than the processing unit 32, and there are fewer restrictions on the structure around the holding table 50, such as the space surrounding the holding table 50 not being required to be airtight, making it easier to install the imaging unit 59. In addition, the imaging unit 59 is disposed above and apart from the holding table 50, so it does not affect the function or performance of the processing unit 33 for cleaning the workpiece 10.

[0097] Instead of providing the imaging unit 59 in the processing unit 33, it is also possible to provide a separate unit for acquiring measurement results that includes an imaging unit in the processing device 30. In this case, the acquisition step is performed by holding the measuring jig 20 not on the holding table 50 of the processing unit 33 but on a holding table arranged in the unit for acquiring measurement results.

[0098] Furthermore, the processing unit equipped with the imaging unit may be a processing unit other than a cleaning unit. For example, in a case where a transport unit is used that uses a positioning mechanism to position the processed workpiece 10 or measuring jig 20, and then grasps the outer edge of the workpiece 10 or measuring jig 20 and pushes it into the cassette 37 to accommodate it, the imaging unit can be disposed above the positioning mechanism, and temperature information from the temperature sensor 24 can be obtained using the imaging unit when the positioning mechanism positions the measuring jig 20. Alternatively, the imaging unit can be disposed above the cassette installation section 31, and an image of the temperature sensor 24 can be taken of the measuring jig 20 in operation as it is pushed into the cassette 37.

[0099] Furthermore, instead of providing the imaging unit 59 in the processing unit 33, it is also possible to configure the imaging unit to be disposed in the processing unit 32. In this case, the imaging unit is attached, for example, to the inner surface of the chamber 40 (at a position where imaging is not obstructed by the gas diffusion member 48 or the like). The temperature sensor 24 provided in the measuring jig 20 is imaged by the imaging unit to obtain the temperature measurement results, so the temperature at the position where the workpiece 10 is processed can be measured more accurately than when measuring the temperature with a temperature sensor attached to the chamber 40 or the holding table 41.

[0100] When an imaging unit capable of imaging the inside of the chamber 40 is used, the processing step and the acquisition step can be performed in parallel. Furthermore, continuous imaging can be performed during the processing step, allowing the temperature rise during the processing step to be captured at multiple points in time. This type of acquisition step has the advantage of being able to acquire multifaceted information, including not only the final maximum temperature reached but also the temperature rise over time. When the processing step and the acquisition step are performed in parallel using an imaging unit capable of imaging the inside of the chamber 40, it is not necessary to acquire temperature information after the processing step. Therefore, it is possible to use a reversible color-changing temperature sensor 24 in which the temperature indicator changes color and then returns to its original color when the temperature drops below a set temperature. This has the advantage of allowing the same temperature sensor to be used repeatedly.

[0101] In the processing device 30 of this embodiment, an image is captured by the imaging unit 59 when acquiring the measurement results of the temperature sensor 24, but instead of the imaging unit 59, another sensor such as an optical sensor may be used to detect the state of the temperature indicator and acquire the measurement results. In other words, the method of acquiring the measurement results of the temperature sensor 24 in the acquisition step is not limited to imaging.

[0102] The measuring jig 20 can be set to a shape and dimensions that match the workpiece 10, but it differs from the configuration of the workpiece 10 in that it has a housing portion 23 and a temperature sensor 24 on one side 21. Therefore, in the case of contact-type processing in which a processing tool is mechanically brought into contact with an area including the housing portion 23 and the temperature sensor 24, it is difficult to measure the temperature under conditions equivalent to the processing conditions of the workpiece 10. Specifically, in polishing processing using a polishing pad or grinding processing using a grinding wheel, it is difficult to measure the temperature at the temperature sensor 24, which is the temperature measurement location, in a way that reproduces the temperature conditions during processing of the workpiece 10.

[0103] Therefore, the measurement method and measurement jig to which the present invention is applied are suitable for temperature measurement in non-contact processing that does not involve mechanical contact with a processing tool, such as plasma processing performed by the above-mentioned processing apparatus 30. Note that non-contact processing is not limited to plasma processing. For example, the measurement method and measurement jig to which the present invention is applied are also useful in laser processing, in which a laser is irradiated onto the workpiece 10. In the case of laser processing, if the laser is irradiated from the side of one surface 21 having the temperature sensor 24, the temperature sensor 24 will interfere and prevent the appropriate temperature from being measured during processing. Therefore, it is preferable to irradiate the laser from the side of the other surface 21 and perform processing at a position closest to the temperature sensor 24 in the thickness direction of the measurement jig 20.

[0104] Although the accommodation section 23 in the measuring jig 20 is a recess with a bottom, a through-hole that penetrates the measuring jig 20 in the thickness direction may also be used as the accommodation section as long as it has a configuration that can support the temperature sensor 24 without dropping it off (for example, a support sheet is attached). Alternatively, the accommodation section may have a configuration in which a groove is provided inside the through-hole into which the edge of the temperature sensor 24 can be inserted and held.

[0105] Alternatively, instead of a recess that is recessed from one surface 21 of the measuring jig 20, the accommodation portion can be formed by a convex portion that is convex relative to one surface 21. As an example, a space capable of accommodating the temperature sensor 24 is provided inside the convex portion, and a window through which the temperature sensor 24 can be observed is formed on the upper surface of the convex portion. If a transport unit that transports the measuring jig 20 can hold the measuring jig 20 while avoiding the convex portion, the measuring jig 20 can be transported and installed even with this configuration.

[0106] In this embodiment, the temperature sensor 24 provided in the measuring jig 20 is in the form of a thin label, but the form of the temperature sensor is not limited to this and may be a seal member or a plate-like member. Furthermore, instead of a temperature sensor having a temperature indicator on a single flat surface, the temperature sensor may have a three-dimensional structure, and multiple temperature indicators may be arranged in different orientations. Furthermore, multiple separate temperature indicators may be individually attached to the measuring jig, and the temperature sensor may be composed of the multiple temperature indicators in the attached state.

[0107] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0108] As described above, the measurement method and measurement tool of the present invention make it possible to easily measure the temperature of a workpiece during processing, and enables highly accurate temperature control even in devices that do not have temperature sensors. [Explanation of symbols]

[0109] 10: Workpiece 12: Planned division line 13: Device 20: Measuring jig 21: One side 22: The other side 23: Storage section (recess) 24: Temperature sensor 30: Processing equipment 31: Cassette installation section 32: Processing unit 33: Processing unit 34: Transport unit 35: Control section 36: Information Department 37: Cassette 40: Chamber 41: Holding table (holding part) 47: Gas supply unit 50: Holding table 51: Cleaning nozzle 59: Imaging unit 60: Transport pad 241: Temperature indicator 242: Temperature indicator 243: Temperature indicator

Claims

1. A method for measuring a temperature during processing in a processing device that processes a workpiece held in a holder under predetermined processing conditions using a processing unit, comprising: a holding step of holding, by the holding part, a measuring jig having an accommodation part for accommodating a temperature sensor that measures temperature on one surface of the measuring jig; a processing step of processing the measuring jig under the predetermined processing conditions; an acquisition step of acquiring a measurement result of the temperature sensor measured in the processing step; A measurement method comprising:

2. The storage section is a recess that is recessed from one surface of the measuring jig along a second direction that intersects with a first direction in which the one surface extends, The measurement method according to claim 1 , wherein the temperature sensor has a thickness in the second direction such that it does not protrude from the one surface.

3. The processing device a conveying unit that sucks one surface of the workpiece accommodated in the cassette and conveys it into and out of the holding part; The measuring jig is accommodated in the same or a different cassette as the workpiece, The measurement method according to claim 2, wherein the transport unit transporting the workpiece transports the one surface side of the measuring jig by suction between the cassette and the holding part, including the area in which the temperature sensor is housed.

4. The temperature sensor is a temperature indicating member that changes color depending on the temperature, The measurement method according to claim 1 , wherein the obtaining step obtains the measurement result from an image of the temperature sensor taken during or after the processing step is performed.

5. The measuring method according to claim 1 , wherein the processing step performs plasma processing on the measuring jig.

6. A measuring jig having a housing portion on one side for housing a temperature sensor that measures temperature.

7. The storage section is a recess that is recessed from one surface of the measuring jig along a second direction that intersects with a first direction in which the one surface extends, The measuring tool according to claim 6 , wherein the temperature sensor has a thickness in the second direction such that the temperature sensor does not protrude from the one surface.

8. The measuring jig according to claim 7 , wherein the accommodation portion includes a plurality of the recesses having different volumes.

Images