Element array manufacturing method, element removal method, element array repair method, element removal device, and element array repair device

Abstract

To provide an element array manufacturing method with which it is possible to manufacture an element array that excels in durability, an element removal method used in the manufacturing method, an element array repair method, an element removal device, and an element array repair device.SOLUTION: The element array manufacturing method includes: a step for irradiating, with a first energy line, a specific element 37a as the object to be removed depending on a first condition; and a step for irradiating a region where the specific element has been removed with a second energy line depending on a second condition. The first condition dictates that the specific element 37a be removed from the surface of a substrate 34 and an insulating member 39 in contact with a substrate terminal 38a remain intact. The second condition is different from the first condition, dictating that the insulating member 39 be removed.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing an element array, a method for removing an element, a method for repairing an element array, an element removal apparatus, and an element array repair apparatus. [Background technology]

[0002] In recent years, there has been active development of displays using micro LEDs, which have a chip size of 100 μm or less. For example, Patent Document 1 below discloses a micro LED mounting technology that uses a laser-decomposable adhesive. Because displays using micro LEDs mount a large number of micro LED elements, light emission defects can occur due to defects in the micro LED elements themselves on a single display substrate or defects during mounting.

[0003] On the other hand, in the field of surface mounting technology, a technology has been developed that uses a laser to remove elements such as micro LED elements from a substrate (for example, Patent Document 2). This method involves removing a specific element such as a micro LED element mounted in a chip mounting location on a display substrate, and then remounting a new element in the removed element mounting location.

[0004] When mounting a device on a substrate, an insulating material such as flux may be placed around the terminals on the substrate to connect the device terminals to the terminals on the substrate. In this case, if a specific device to be removed is irradiated with a laser, the device and the insulating material can be removed simultaneously if the laser output is high, but there is a risk of damaging the substrate itself or its components.

[0005] Furthermore, if the laser output is low, some of the elements remain, making it difficult to remount a new element. Even if only a specific element is removed, insulating materials such as flux used when mounting the element may deteriorate due to heat during laser irradiation, and the deteriorated insulating materials may remain on or near the terminals of the board.

[0006] If the deteriorated insulating material is left on or near the terminals of the substrate, there is a risk that a good bond will not be obtained when a new element is remounted. Even if a new element is not mounted, there is a risk that the durability of the element array (e.g., a display) will be reduced if the deteriorated insulating material is left on or near the terminals of the substrate. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] WO2019 / 207920 publication [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-17230 Summary of the Invention [Problem to be solved by the invention]

[0008] The present disclosure has been made in consideration of the above-described situation, and its purpose is to provide a method for manufacturing an element array that can manufacture an element array with excellent durability, a method for removing elements used in the manufacturing method, a method for repairing an element array, an element removal device, and an element array repair device. [Means for solving the problem]

[0009] In order to achieve the above object, a method for manufacturing an element array according to one aspect of the present disclosure includes: A method for manufacturing an element array including a plurality of elements electrically connected via element terminals to substrate terminals provided on a substrate, the method comprising: irradiating a specific element as a removal target with a first energy ray under a first condition; irradiating the area from which the specific element has been removed with a second energy ray under second conditions; the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The second condition is different from the first condition and is a condition under which the insulating member is removed.

[0010] In this element array manufacturing method, first, a specific element to be removed is irradiated with a first energy beam under a first condition to remove the specific element from the surface of the substrate. The first condition is an energy irradiation condition that removes only the specific element, and the insulating member that is at least partially in contact with the substrate terminal that has been disconnected from the element terminal can be left together with the substrate terminal. Therefore, there is little risk of the first energy beam damaging the substrate itself or its constituent members.

[0011] The specific element may be removed from its predetermined position on the substrate by irradiating the specific element with a first energy beam to sublimate the specific element, or by irradiating the specific element with a first energy beam to release the connection between the element terminal and the substrate terminal, thereby flicking the element off and removing it from its predetermined position on the substrate.

[0012] Furthermore, by irradiating the insulating member present on the surface of the substrate at the predetermined position from which the specific element has been removed with a second energy ray under a second condition different from the first condition, the insulating member at the predetermined position can be removed. Therefore, the insulating member deteriorated by heat or the like during irradiation with the first energy ray can be removed by irradiating with the second energy ray.

[0013] If the deteriorated insulating material is left on or near the terminals of the substrate, there is a risk that a good connection between the terminals of the new element and the substrate element may not be achieved when a new element is mounted. However, by removing the deteriorated insulating material, a new insulating material can be formed in the removed area. Therefore, even if a new element is not mounted, the durability of the element array (e.g., a display) can be improved. Furthermore, by connecting the element terminals of the new element to the substrate terminals of the substrate after installing the new insulating material, the connection state is maintained good, and in this case, the durability of the element array (e.g., a display) can also be improved.

[0014] Preferably, the output of the first energy ray is higher than the output of the second energy ray, for example, the output of the first energy ray may be at least two times, at least five times, or at least ten times the output of the second energy ray.

[0015] Preferably, the number of shots of the second energy ray is greater than the number of shots of the first energy ray. For example, the number of shots of the first energy ray, although depending on the output of the first energy ray, is preferably as small as possible, for example, 3 shots or less, 2 shots or less, 1 shot, etc. It is preferable that only specific elements can be removed with a small number of shots.

[0016] Furthermore, the number of shots of the second energy ray is preferably, for example, 2 or more, 3 or more, 4 or more, etc., and is preferably a number sufficient to sufficiently remove the insulating material located around the substrate terminal on the surface of the substrate corresponding to the position where the specific element was removed.

[0017] Preferably, the first energy beam is irradiated onto the specific element in a first irradiation range that is smaller than the planar area of ​​the specific element. By irradiating the first energy beam in such an irradiation range, there is little risk of deterioration of the substrate and its accessories (such as a cavity frame) located around the specific element.

[0018] The second energy beam may be irradiated to the insulating member in a second irradiation range that can remove the insulating member located around the substrate terminal on the surface of the substrate corresponding to the position where the specific element was removed, and the irradiation range is not particularly limited. However, if the specific element and the insulating member are disposed in the cavity of the cavity frame, it is preferable that the second irradiation range is a range that does not irradiate the cavity frame, in order to prevent deterioration of the cavity frame.

[0019] The method for connecting the substrate terminals and the element terminals is not particularly limited, but the above-mentioned method is particularly effective when the substrate terminals and the element terminals are metallically bonded.

[0020] Each of the elements may be disposed within a cavity of a cavity frame provided on the surface of the substrate, and it is preferable that an insulating member be interposed within the cavity around the element terminals and substrate terminals. This configuration facilitates regular element arrangement and also facilitates the removal of specific elements. The cavity frame may be provided on the surface of the substrate by preparing a cavity frame separately from the substrate and attaching the cavity frame to the substrate, or by integrally forming the cavity frame on the surface of the substrate itself.

[0021] The method for manufacturing the element array described above includes the steps of: providing a new insulating member on the surface portion of the substrate from which the insulating member has been removed; The method may further include the step of connecting an element terminal of a new element to the substrate terminal located on the surface portion of the substrate to which the new insulating member is supplied.

[0022] A method for removing an element according to an aspect of the present disclosure includes: irradiating a specific element as a removal target with a first energy ray under a first condition; irradiating the area from which the specific element has been removed with a second energy ray under second conditions; the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The second condition is different from the first condition and is a condition under which the insulating member is removed.

[0023] By using this element removal method, the above-mentioned element array manufacturing method can be easily realized.

[0024] A method for repairing an element array according to one aspect of the present disclosure includes: a step of supplying a new insulating member to the surface portion of the substrate from which the insulating member has been removed, after removing the specific element and the insulating member by the element removal method described above; a step of transporting a new element to the surface portion of the substrate on which the new insulating member has been provided; and connecting the element terminal of the new element to the substrate terminal located on the surface portion of the substrate on which the new insulating member has been provided.

[0025] Using this element array repair method, the above-described element array manufacturing method can be easily realized.

[0026] An apparatus for removing an element according to one aspect of the present disclosure includes: a substrate support for holding a substrate; an energy irradiation device that irradiates energy rays; a first control unit that controls the energy irradiation device so that a specific element to be removed among a plurality of elements having element terminals connected to substrate terminals provided on the surface of the substrate is irradiated with the energy beam under a first condition; a second control unit that controls the energy beam irradiated from the energy irradiation device under a second condition to the insulating member present on the surface of the substrate from which the specific element has been removed, the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The second condition is different from the first condition and is a condition under which the insulating member is removed.

[0027] By using this element removal device, the above-described method for manufacturing an element array can be carried out efficiently.

[0028] An element array repair apparatus according to an aspect of the present disclosure includes: The above-described device for removing elements; an insulating material supplying device that supplies new insulating material to the surface portion of the substrate from which the insulating material has been removed; a transport device that transports a new element to the surface portion of the substrate on which the new insulating member has been supplied; and an element connecting device that connects element terminals of a new element to the substrate terminals located on the surface portion of the substrate to which the new insulating member has been supplied.

[0029] By using this element array repair device, the above-described element array manufacturing method can be carried out efficiently. [Brief explanation of the drawings]

[0030] [Figure 1A] FIG. 1A is a schematic diagram showing a schematic configuration of an energy irradiation device used in a method for manufacturing an element array according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B is a schematic diagram showing a conveying device used in a method for manufacturing an element array according to an embodiment of the present disclosure. [Figure 1C] FIG. 1C is a schematic diagram showing a flux printing device used in a method for manufacturing an element array according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view of a main part of the element array parallel to a plane including the X-axis and Z-axis shown in FIG. 1A. [Figure 3] FIG. 3 is an enlarged cross-sectional view of a main part showing a method for removing some specific elements among the elements shown in FIG. [Figure 4] FIG. 4 is an enlarged cross-sectional view of a main part showing a step subsequent to the step shown in FIG. [Figure 5] FIG. 5 is an enlarged cross-sectional view of a main part showing a step subsequent to the step shown in FIG. [Figure 6] FIG. 6 is an enlarged cross-sectional view of a main part showing a step subsequent to the step shown in FIG. [Figure 7] FIG. 7 is an enlarged cross-sectional view of a main part showing a step subsequent to the step shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0031] The following describes the embodiments.

[0032] First, the element array 33 shown in Figures 1A and 2 will be described. The element array 33 of this embodiment is used, for example, as a display device, and has a plurality of elements 37 mounted in a matrix along the X-axis and Y-axis on the surface of a substrate 34. In the figures, the X-axis, Y-axis, and Z-axis are perpendicular to each other, and in this embodiment, the plane of the substrate 34 is parallel to the X-axis and Y-axis.

[0033] The element 37 is not particularly limited, but may be, for example, a display element. Note that the display element is not limited to an element for displaying a screen, but may also be an element for providing illumination, such as a light-emitting element (micro LED element), a fluorescent element, etc.

[0034] In this embodiment, the elements 37 are, for example, micro light-emitting elements (micro LED elements), and their planar shape has a size of, for example, 5 μm×5 μm to 200 μm×300 μm. The spacing δ (see FIG. 2) between the elements 37 (or 37a, hereinafter the same unless otherwise specified) is, for example, about 5 to 500 μm.

[0035] Each element 37 is housed inside each cavity 36a (see Figure 2) formed in a matrix in a cavity frame 36 fixed to the surface of the substrate 34, and the element terminal 38b of the element 37 is electrically connected to the substrate terminal 38a formed on the surface of the substrate 34.

[0036] The substrate 34 is not particularly limited and may be a wiring substrate on which wiring connected to the substrate terminals 38a is formed, and may be transparent or translucent and flexible. The cavity frame 36 is preferably made of, for example, plastic, but may also be made of other insulating materials. The size of each cavity 36a formed in the cavity frame 36 is set to a size that allows the element 37 to fit inside. The cavity frame 36 having the cavity 36a can be formed, for example, by photolithography, and may be made of UV resin or the like.

[0037] Although not particularly limited, substrate terminal 38a may have a connection layer containing Sn or a Sn alloy (for example, an alloy containing Sn with Ag and / or Cu, or a Sn-In alloy) on the surface that contacts element terminal 38a. Furthermore, substrate terminal 38a may have an underlayer, for example, on the side closer to substrate 34, that is made of a metal (including an alloy) different from the connection layer. Examples of the underlayer include a Ni or Ni alloy layer, but it may also be made of other metals. Furthermore, the connection layer may also be made of a metal other than Sn or a Sn alloy.

[0038] The element terminal 38b is not particularly limited, but is made of, for example, Au or an Au alloy.

[0039] Inside each cavity 36a, flux 39 serving as an insulating material is filled between the element 37 and the substrate 34. The flux 39 functions to prevent oxidation of the surface of the substrate terminal 38a before connection with the element terminal 37b, and also functions to protect the element terminal 37b and the substrate terminal 37a after connection. The flux 39 also functions to temporarily secure the element 37 to the substrate 34 inside the cavity 36a before connection between the element terminal 37b and the substrate terminal 38a. The flux 39 is not particularly limited, but examples include a resin-based flux whose main component is a resin such as rosin or modified rosin, an organic flux, and an inorganic flux.

[0040] Next, a repair apparatus 1 for an element array 33 shown in Fig. 1A will be described. The repair apparatus 1 of this embodiment includes an element removal device 2a shown in Fig. 1A, a control device 2b, a transport device 4 shown in Fig. 1B, a flux supply device (for example, a flux printing device 5 shown in Fig. 1C) as an insulating material supply device, and an element connection device (not shown).

[0041] The flux supply device may be a flux applicator mounted on the transport head 42 of the transport device 4 instead of mounting the stamp tool 44 on the transport head 42. The transport head 42 equipped with the flux applicator is preferably a separate transport head from the transport head that holds the stamp tool 44. The flux applicator is not particularly limited, but may be, for example, a flux transfer device (such as a pin transfer device) or a flux printing device 5 shown in FIG. 1C.

[0042] As shown in FIG. 1C, the flux printing device 5 includes a metal mask 52 with a predetermined pattern of holes 54, a holder (not shown) for holding the metal mask 52, and a squeegee 56. The metal mask 52 has the predetermined pattern of holes 54 formed therein, and the X-axis and Y-axis positions of the metal mask 52 are controlled so that the holes 54 shown in FIG. 1C are aligned with positions corresponding to specific cavities 36a shown in FIG. 7. In this state, the squeegee 56 is moved parallel to the metal mask 52 while being pressed against the flux 39 from one end of the top of the metal mask 5 to the other end. As a result, the flux 39 is deposited through the holes 54 into the specific cavities corresponding to the holes 54.

[0043] As shown in FIG. 1A, the element removal device 2 has a substrate support 3 that holds a substrate 34. The substrate support 3 has a pedestal 32. A substrate 34 of an element array 33 is detachably fixed to the upper surface of the pedestal 32 along the Z axis. A cavity frame 36 is installed and fixed (or may be molded integrally with the substrate 34) on the upper surface of the substrate 34 of the element array 33 in this embodiment, and elements 37 are arranged in cavities 36a of the cavity frame 36. A method for manufacturing the element array 33 will be described later.

[0044] A laser irradiation device 2a is located above the element array 33 along the Z axis as the element removal device 2. The laser irradiation device 2a is arranged so as to be movable relative to the pedestal 32 along the X and Y axes. If necessary, the laser irradiation device 2a may be arranged so as to be movable relative to the pedestal 32 along the Z axis. Specific examples of the laser irradiation device 2a that can be used include a YAG laser, a carbon dioxide laser, an excimer laser, and a UV laser. Considering the laser wavelength and the energy required for removal, a YAG laser is preferred.

[0045] The control device 2b has at least a first control unit 2b1 and a second control unit 2b2 for controlling the laser output from the laser emission unit 22 of the laser irradiation device 2a and the number of shots. The control device 2b can control a movement mechanism that moves the laser irradiation device 2a relative to the base 32, as well as a movement mechanism that moves the transport head 42 of the transport device 4 shown in FIG. 1B relative to the base 32. The control device 2b may be provided in the laser irradiation device 2a, or may be located in a position separate from the laser irradiation device 2a, and may be configured to communicate with the laser irradiation device 2a via wire or wirelessly. Furthermore, the laser irradiation device 2a itself may have a laser irradiation condition setting function equivalent to that of the control device 2b, in which case the control device 2b may be omitted.

[0046] The first control unit 2b1 controls the laser irradiation device 2a to irradiate the laser light Lt under a first condition onto a specific element 37a to be removed, among a plurality of elements 37, 37a each having element terminals 38b connected to a plurality of substrate terminals 38a provided on the surface of the substrate 34 shown in Fig. 2. The laser light Lt emitted from the laser emission unit 22 of the laser irradiation device 2a is irradiated only onto the specific element 37a, as shown in Fig. 3.

[0047] Preferably, the first controller 2b1 controls the laser beam Lt so that it irradiates the specific element 37a in a first irradiation range (including a spot diameter or a laser scanning range) that is smaller than the entire area of ​​the planar shape of the specific element 37a. Irradiating the first energy ray in such an irradiation range reduces the risk of deteriorating the substrate 34 and its accessories (such as the cavity frame 36) located around the specific element 37a. Note that the laser irradiation device 2a may have an irradiation mask for directly irradiating only the surface of the specific element 37a with the laser beam Lt in an irradiation range having a rectangular spot shape that matches the planar shape of the specific element 37a.

[0048] The laser irradiation device 2a may also include an imaging device. Alternatively, the device 2 may include an imaging device as a separate device. The imaging device is capable of imaging the elements 37 or 37a of the element array 33. The imaging device may perform a visual inspection of each element 37, 37a, and may control the relative movement of the laser irradiation device 2a or the base 32 so that only specific elements 37a determined to be defective in the visual inspection are irradiated with the laser light Lt. The imaging device may be installed in the same drive system as the laser irradiation device 2a to reduce the device configuration. The imaging device may also be used to determine the presence or absence and position of the element 37 in addition to determining whether the element is defective. Even when used for this purpose, the imaging device may be supported and driven by a support mechanism or drive mechanism separate from the laser irradiation device 2a. The image captured by the imaging device may be processed by the control device 2b shown in FIG. 1A or another control device.

[0049] Further, the second control unit 2b2 controls the laser irradiation device 2a under a second condition different from the first condition so as to irradiate the flux 39 as an insulating member present on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed with the laser light Lt as the second energy ray, as shown in Fig. 4. Here, the conditions to be controlled include the output of the laser light, the irradiation range (including the spot diameter or the laser scanning range), etc.

[0050] 1A may be configured as dedicated circuits in the control device 2b, or may be configured as programs executed by a computer, etc. Other control units in the control device 2b may also be configured as dedicated circuits, or may be configured as programs executed by a computer, etc.

[0051] 1B has a transport head 42, and a stamp tool 44 is detachably attached to the lower end of the transport head 42. The stamp tool 44 of this embodiment is provided with a stamp convex portion 46, and a new element 37b is detachably attached to the stamp convex portion 46. The new element 37b is an element similar to the element 37, and is an element that is newly attached to the portion from which the specific element 37a has been removed, and is transported to a predetermined position by the transport device 4. A plurality of stamp convex portions may be provided.

[0052] The material of the stamp protrusions 46 is not particularly limited, but examples include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicon compounds, and polyether rubber. The stamp protrusions 46 are formed on the surface (lower surface) of the stamp layer, and the stamp layer may be made of the same material as the protrusions 46. However, it is preferable that the surface of the stamp layer other than the protrusions 46 does not have adhesiveness. It is preferable that elements are not picked up by adhesive force other than at the protrusions 46.

[0053] Next, a method for manufacturing the element array 33, in particular a method for manufacturing a light emitting element (micro LED element) array, will be described.

[0054] First, an element array (e.g., an arrangement of elements 37 of a single light-emitting color), in which elements 37 of a specific light-emitting color, such as LED elements, are arranged in a matrix, is fabricated on the surface of an element-forming substrate. The element-forming substrate may be a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, or the like, depending on the type of elements 37 (e.g., blue light-emitting elements, red light-emitting elements, green light-emitting elements, etc.).

[0055] After forming an array of elements 37 on the surface of the element formation substrate, only the elements 37 are peeled off from the substrate on which the elements 37 are formed by a method such as a laser lift-off method and transferred into the cavity 36a of the cavity frame 36 of the substrate 34 (for mounting) shown in Fig. 1A. These steps are repeated for elements 37 emitting different RGB light colors to produce an element array 33 having RGB elements 37.

[0056] 2, each cavity 36a of the cavity frame 36 provided on the substrate 34 is filled in advance with flux 39 using an application nozzle or the like, and the periphery of the substrate terminal 38a of the substrate 34 is filled with flux 39. The connection between the element terminal 38b of the element 37 (37a) and the substrate terminal 38a is not particularly limited, but in this embodiment, they are joined by metal bonding using a bonding device (not shown).

[0057] Once the element array 33 is formed in this manner, the method for manufacturing an element array of this embodiment then performs an appearance inspection or light emission inspection on each of the elements 37 (37a) arranged in the array shown in Figure 1A, for example, to identify specific elements 37a that need to be removed for some reason, such as due to poor appearance or poor light emission. Furthermore, the method for manufacturing an element array of this embodiment then performs a method for removing specific elements 37a, as described below, and then performs a method for repairing the element array 33.

[0058] 1A, the controller 2b controls the relative movement of either or both of the pedestal 32 and the laser irradiation device 2a along the X-axis and Y-axis so that the laser light Lt from the laser irradiation device 2a is irradiated only onto the specific element 37a within a predetermined irradiation range. Furthermore, the controller 2b controls the relative distance between the pedestal 32 and the laser irradiation device 2a along the Z-axis, as necessary. These controls are performed by the controller 2b controlling the movement mechanisms of either or both of the pedestal 32 and the laser irradiation device 2a.

[0059] Next, the laser beam Lt is irradiated from the laser emission unit 22 of the laser irradiation device 2a onto the specific element 37a, and the first control unit 2b1 of the control device 2b controls the laser irradiation device 2a so that only the specific element 37a is removed. That is, the first control unit 2b1 of the control device 2b controls the laser beam Lt to a first condition. As shown in FIGS. 3 and 4 , the first condition is a condition under which the specific element 37a is removed together with the element terminals 38b from the surface of the substrate 34 by irradiating a first irradiation range of the specific element 37a with the laser beam Lt as a first energy ray. The first condition is also a condition under which the flux 39, at least a portion of which is in contact with the substrate terminals 38a, remains together with the substrate terminals 38a.

[0060] Specifically, under the first condition, the wavelength of the laser light Lt emitted from the laser emission part 22 is not particularly limited, but is preferably 532 nm or less, and more preferably 266 nm or less. Also, under the first condition, the output of the laser light Lt is preferably an output that can remove the element 37a by sublimation (including ablation) or by flicking it off within three shots, preferably one shot, and although it depends on the size and material of the element 37a, is, for example, 10 to 100 mJ / cm. 2 The fewer the number of shots, the less damage there is to the substrate terminals 38a, and the less likely there is to damage the substrate 34 or the cavity frame 36.

[0061] Furthermore, the irradiation range of the laser beam Lt (including the spot diameter or laser scanning range) is preferably smaller than the size of the element 37a along the X-axis and Y-axis, and the laser beam Lt is preferably not irradiated onto the cavity frame 36. By irradiating the laser beam Lt in this manner, as shown in FIG. 4, it is possible to remove only the specific element 37a from the substrate 34 and leave the flux 39, at least a portion of which is in contact with the substrate terminal 38a, together with the substrate terminal 38a.

[0062] As shown in Fig. 4, after only the specific element 37a is removed from the substrate 34, the second control unit 2b2 of the control device 2b shown in Fig. 1A controls the laser light Lt from the laser emission unit 22 of the laser irradiation device 2a under a second condition different from the first condition. The second condition, as shown in Figs. 4 and 5, is a condition in which the flux 39 is removed from the specific cavity 36a by irradiating the flux present on the surface of the substrate 34 corresponding to the position where the specific element 37a has been removed with the laser light Lt as a second energy ray. Note that the specific cavity 36a is the cavity 36a from which the specific element 37a has been removed.

[0063] Specifically, under the second condition, the wavelength of the laser light Lt emitted from the laser emission part 22 is not particularly limited, but is preferably 532 nm or less, and more preferably 266 nm or less. The wavelength of the laser light Lt under the second condition may be the same as or different from the wavelength of the laser light Lt under the first condition. Furthermore, under the second condition, the output of the laser light Lt is preferably smaller than the output of the laser light Lt under the first condition. Preferably, the output of the laser light Lt under the second condition may be ½ or less, more preferably ⅓ or less, ¼ or less, ⅕ or less, or 1 / 10 or less of the output of the laser light Lt under the first condition.

[0064] The number of shots of the laser light Lt under the second condition is preferably greater than the number of shots of the laser light Lt under the second condition, and may be preferably 4 or more, 5 or more, or 10 or more. The number of shots of the laser light Lt under the second condition is preferably a number that removes most of the flux 39 from the specific cavity 36a, as shown in Fig. 5. Note that it is not necessary to completely remove the flux 39 from the specific cavity 36a, and it is preferable that at least the flux in contact with the substrate terminals 38a is removed.

[0065] By irradiating the laser beam Lt under the second condition, the flux 39 present in the specific cavity 36a is sublimated and removed. Also, due to the heat generated during irradiation of the laser beam Lt under the second condition, the surface of the substrate terminal 38a (for example, the surface of the Sn layer) becomes flat or rounded in a convex shape, eliminating the unevenness (see FIG. 4) caused by the connection marks with the element terminal 38b shown in FIG. 3, as shown in FIG. 5.

[0066] Note that the irradiation range of the laser beam Lt under the second condition is preferably a range within the specific cavity 36a where the flux 39 shown in Fig. 4 is irradiated with the laser beam Lt but the cavity frame 36 is not irradiated with the laser beam Lt. Note that the laser beam Lt may also be irradiated onto the surface of the substrate terminal 38a.

[0067] 1C, new flux 39 is injected into the specific cavity 36a as shown in FIG. 6. The new flux 39 is preferably made of the same material as the removed flux 39 before it was degraded by heat such as laser light irradiation, but it does not necessarily have to be the same flux. The new flux 39 removes oxide films and other materials formed on the surfaces of the substrate terminals 38a, facilitating bonding to the element terminals 38b.

[0068] Next, using the stamp tool 44 of the conveying device 4 shown in Figure 1B, a new element 37b is conveyed to a position corresponding to a specific cavity 36a, as shown in Figure 7, and the element 37b is mounted inside the cavity 36a so that the element terminal 38b of the new element 37b contacts the substrate terminal 38a.

[0069] The element terminals 38b of the elements 37b may be connected to the substrate terminals 38a by an element connecting device (not shown) or by a conveying device 42. In either case, the elements 37b are pressed against the substrate 34 with a predetermined pressure to form at least a partial metal bond between the element terminals 38a and the substrate terminals 38a. At this time, the element terminals 38a may be pressed into the surfaces of the substrate terminals 38a while applying heat (e.g., 40°C or higher) to the substrate terminals 38a. In this manner, the element array 33 is manufactured.

[0070] As described above, in the manufacturing method of the element array 33 of this embodiment (the same applies to the element removal method and the element array repair method), first, as shown in FIG. 3, laser light Lt is irradiated under a first condition onto the specific element 37a to be removed, and the specific element 37a is removed from the surface of the substrate 34 as shown in FIG. 4. The first condition is an energy irradiation condition that removes only the specific element 37a, and allows the flux 39, at least a portion of which is in contact with the substrate terminal 38a that has been disconnected from the element terminal 38b, to remain together with the substrate terminal 38a. Therefore, there is little risk of damaging the substrate 34 itself or the cavity frame 36 provided on the substrate 34.

[0071] Furthermore, in the method of the present embodiment, by irradiating the flux 39 present on the surface of the substrate 34 belonging to the predetermined position from which the specific element 37a has been removed with laser light under second conditions different from the first conditions, it is possible to remove the flux 39 belonging to the predetermined position. Therefore, the flux deteriorated by heat or the like during irradiation with the laser light Lt under the first conditions can be removed by irradiating with the laser light Lt under the second conditions.

[0072] If the deteriorated flux 39 is left on or near the substrate terminals 38a, there is a risk that a good connection between the element terminals 38b of the new element 37b and the substrate element 38a may not be achieved when a new element 37b is reinstalled. However, by removing the deteriorated flux 39, new flux 39 can be reinstalled. Therefore, even if a new element 37b is not installed, the durability of the element array (e.g., a display) can be improved. Furthermore, by connecting the element terminals 38b of the new element 37b to the substrate terminals 38a of the substrate 34 after reinstalling the new flux mass 39, a good connection state is maintained, and in this case, the durability of the element array (e.g., a display) 33 can also be improved.

[0073] In this embodiment, each of the elements 37 (including 37a and 37b) is disposed in a cavity 36a of a cavity frame 36 provided on the surface of the substrate 34, and flux 39 is disposed around the element terminals 38b and the substrate terminals 38a in the cavity 36a. This configuration makes it easy to arrange the elements 37 (including 37a and 37b) regularly and also to remove a specific element 37a.

[0074] In this embodiment, a display device (including a lighting device) having an element array may be used without replacing a non-defective new element 37b at the position where the specific element 37a was removed. For example, if the size of the elements 37 is small, even if one specific element 37a among two or more arrays of elements 37 is missing, there may be no problem as a whole with the display device (including a lighting device) having an element array.

[0075] Furthermore, with the element removal device 2 of this embodiment, even if the elements 37 arranged in a predetermined array are small, such as 5 μm x 5 μm or less, it is easy to remove only the specific elements 37a, and an element array from which the specific elements 37a have been removed can be easily manufactured.

[0076] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0077] For example, in the above-described embodiment, the cavity frame 36 is provided on the surface of the substrate 34, but the element array 33 does not necessarily need to have the cavity frame 36.

[0078] The specific element 37a to be removed may be an element that is defective, has a misaligned connection position, or is unnecessary in the layout.

[0079] Furthermore, in the above-described embodiment, the method of connecting the substrate terminals 38a and the element terminals 38b is not particularly limited, but the method of the above-described embodiment is particularly effective when the substrate terminals 38a and the element terminals 38b are directly connected by metal bonding, etc. Other examples of connection methods include connection using ACF (conductive adhesive), solder bonding, BGA, conductive paste bonding, and curable insulating resin bonding.

[0080] Furthermore, in the above-described embodiment, the laser irradiation device 2a is used as the energy beam irradiation device, but the energy beam irradiation device is not limited to the laser irradiation device 2a.

[0081] In addition to the flux 39, examples of insulating materials used in the element array 33 include underfill agents, potting agents, and fillers.

[0082] The element 37 is not limited to a display element, but may be any of various electronic component elements such as a ceramic capacitor, a chip inductor, a piezoelectric element, a magnetostrictive element, a chip resistor, a tantalum electrolytic capacitor, an IC, or a semiconductor element.

[0083] The transport device may be a transport device that uses the stamp tool 44, or a transport device that has a suction transport unit. [Explanation of symbols]

[0084] 1...Element array repair device 2...Element removal device 2a...Laser irradiation device (energy irradiation device) 2b...Control device 2b1...First control section 2b2...Second control section 22...Laser emission part 3...Substrate support part 32...Base 33...Element array 34...Platform 36...Cavity frame 36a...cavity 37...Element 37a...Specific element 37b...New element 38a...Board terminal 38b...Element terminal 39...Flux (insulating material) 4...Transportation device 42...Transport head 44...Stamp tool 46…Stamp convex part 5...Flux printing device 52...Metal Mask 54...hole 56...Squeegee

Claims

1. A method for manufacturing an element array including a plurality of elements electrically connected via element terminals to substrate terminals provided on a substrate, the method comprising: irradiating a specific element as a removal target with a first energy ray under a first condition; irradiating the area from which the specific element has been removed with a second energy ray under second conditions; the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The second condition is different from the first condition and is a condition under which the insulating member is removed.

2. The method for manufacturing an element array according to claim 1 , wherein the output of the first energy beam is higher than the output of the second energy beam.

3. The method for manufacturing an element array according to claim 1 , wherein the number of shots of the second energy beam is greater than the number of shots of the first energy beam.

4. The method for manufacturing an element array according to claim 1 , wherein the first energy beam is irradiated onto the specific element in a first irradiation range that is smaller than a planar area of ​​the specific element.

5. 2. The method for manufacturing an element array according to claim 1, wherein the second energy rays are irradiated onto the specific element in a second irradiation range capable of removing the insulating material located around the substrate terminal present on the surface of the substrate corresponding to the position where the specific element is removed.

6. A method for manufacturing an element array described in any one of claims 1 to 5, wherein each of the elements is arranged in a respective cavity of a cavity frame provided on the surface of the substrate, and the insulating member is interposed around the element terminals and substrate terminals within the cavity.

7. providing a new insulating member on the surface portion of the substrate from which the insulating member has been removed; 6. The method for manufacturing an element array according to claim 1, further comprising the step of connecting an element terminal of a new element to the substrate terminal located on the surface portion of the substrate on which the new insulating member is provided.

8. irradiating a specific element as a removal target with a first energy ray under a first condition; irradiating the area from which the specific element has been removed with a second energy ray under second conditions; the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The element removal method, wherein the second condition is different from the first condition and is a condition under which the insulating member is removed.

9. a step of supplying a new insulating member to the surface portion of the substrate from which the insulating member has been removed, after removing the specific element and the insulating member by the element removal method according to claim 8; a step of transporting a new element to the surface portion of the substrate on which the new insulating member has been provided; and connecting element terminals of new elements to the substrate terminals located on the surface portion of the substrate on which the new insulating member has been provided.

10. a substrate support for holding a substrate; an energy irradiation device that irradiates energy rays; a first control unit that controls the energy irradiation device so that a specific element to be removed among a plurality of elements having element terminals connected to substrate terminals provided on the surface of the substrate is irradiated with the energy beam under a first condition; a second control unit that controls the energy beam irradiated from the energy irradiation device under a second condition to the insulating member present on the surface of the substrate from which the specific element has been removed, the first condition is a condition in which the insulating member in contact with the substrate terminal remains while the specific element is removed from the surface of the substrate; The device for removing an element, wherein the second condition is different from the first condition and is a condition under which the insulating member is removed.

11. The element removal device according to claim 10; an insulating material supplying device that supplies new insulating material to the surface portion of the substrate from which the insulating material has been removed; a transport device that transports a new element to the surface portion of the substrate on which the new insulating member has been supplied; and an element connecting device that connects element terminals of the new elements to the substrate terminals located on the surface portion of the substrate to which the new insulating member has been supplied.

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