Method for peeling resin mask

JP2025132797AActive Publication Date: 2025-09-10KAO CORP
6 Cites 0 Cited by

Patent Information

Application Number
JP2024030593
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-29
Publication Date
2025-09-10
Estimated Expiration
2044-02-29

AI Technical Summary

Technical Problem

Alkaline stripping compositions used for resin mask removal deteriorate due to carbon dioxide, leading to decreased stripping performance, necessitating frequent replenishment or replacement, especially when recycled.

Method used

A stripper composition comprising quaternary ammonium hydroxide, organic amine, alkali metal hydroxide, organic solvent, and water, with specific mass ratios, is used to maintain resin mask removability even in the presence of carbonate ions, suppressing composition deterioration and enhancing stripping efficiency.

Benefits of technology

The method ensures efficient resin mask removal with high-quality electronic component production by maintaining stripping performance despite carbon dioxide presence, reducing the need for frequent replenishment and improving manufacturing yield.

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Abstract

To provide a method for peeling a resin mask which is excellent in resin mask removability even under the presence of carbonate ions.SOLUTION: A method for peeling a resin mask includes a step of peeling a resin mask from a substrate having a resin mask under the presence of carbonate ions, using a peeling agent composition containing the following component A, the following component B, the following component C, the following component D and the following component E. Component A: quaternary ammonium hydroxide. Component B: organic amine. Component C: alkali metal hydroxide. Component D: organic solvent. Component E: water.SELECTED DRAWING: None
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Citation Information

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