Semiconductor manufacturing device, motor control device, and semiconductor device manufacturing method

Abstract

To provide a technology capable of reducing the risk of collision between moving bodies.SOLUTION: A semiconductor manufacturing device includes a motor for driving a moving body, an encoder, and a control device for controlling the motor. The control device includes a soft limit that defines a limit value for speed of the motor for each position of the encoder, and is configured to reduce the speed of the motor when the speed of the motor exceeds the limit value.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor manufacturing equipment and is applicable to, for example, a die bonder that uses a motor for a drive shaft. [Background technology]

[0002] One process in the manufacturing process of semiconductor devices is the die bonding process, in which a die is picked up using a pickup head or a bond head and then placed on an intermediate stage or a substrate. Servo motors or linear motors are used for the drive shafts that move the pickup head or bond head horizontally or up and down (for example, JP 2017-69418 A). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-69418 Summary of the Invention [Problem to be solved by the invention]

[0004] If a motor runs out of control due to an abnormality in the system (device), a moving body driven by the drive shaft may not be able to stop within a predetermined range and may collide with other members.

[0005] An object of the present disclosure is to provide a technology capable of reducing the collision risk of moving objects. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the semiconductor manufacturing apparatus includes a motor for driving a moving body, an encoder, and a control device for controlling the motor. The control device includes a soft limit having a limit value for the speed of the motor for each position of the encoder, and is configured to reduce the speed of the motor when the speed of the motor exceeds the limit value.

[0007] According to the present disclosure, it is possible to reduce the collision risk of moving bodies. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 5] FIG. 5 is a diagram for explaining the motor control device and the drive unit shown in FIG. [Figure 6] FIG. 6 is a diagram showing soft limits in the first modified example. [Figure 7] FIG. 7 is a diagram showing soft limits in the second modified example. [Figure 8] FIG. 8 is a diagram showing soft limits in the third modified example. [Figure 9] FIG. 9 is a block diagram illustrating the motor control device and the drive unit in the fourth modified example. [Figure 10] FIG. 10 is a diagram illustrating a soft limit of two-axis interference in the fifth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, in order to clarify the description, the width, thickness, shape, etc. of each part may be shown schematically compared to the actual embodiment. Furthermore, the dimensional relationships, ratios, etc. of each element between multiple drawings do not necessarily match.

[0010] The configuration of a die bonder, which is one embodiment of semiconductor manufacturing equipment, will be described with reference to Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of the die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holder 12, a peeling unit 13, and a wafer recognition camera 14.

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown), which stores multiple wafer rings WR, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] A wafer W is adhered (attached) to a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the die D as the workpiece is a semiconductor chip, a glass chip, or a MEMS (Micro Electro Mechanical Systems). A film-like adhesive material DF called a die attach film (DAF) may be attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0015] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the vertical direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 detects the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0017] The pickup unit 20 has a pickup head 21 as a moving body and a pickup head table 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The pickup head table 23 may also rotate the pickup head 21.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed and a pickup stage on which the die D is picked up.

[0019] The bonding section 40 includes a bond head 41, a bond head table 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds a die D at its tip. The bond head table moves the bond head 41 in the Z1-Z2, Y1-Y2, and X1-X2 directions. The bond head table 43 may also rotate the bond head 41. The substrate recognition camera 44 captures an image of the substrate S and recognizes the bond position. Here, the substrate S may be, for example, a wiring board or a lead frame. The substrate S has multiple product areas (hereinafter referred to as package areas P) that will eventually become a single package formed thereon. The substrate S also has position recognition marks (not shown) for the package areas P formed thereon. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-adsorbing the substrate S, and is capable of fixing the substrate S. The bond stage 46 also has a heating unit (not shown) for heating the substrate S.

[0020] With this configuration, the bond head 41 corrects the pickup position and posture based on the image data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

[0021] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X1 direction by driving a nut (not shown) of the transport claws 51 provided on the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0022] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been carried in by the transport unit 50, in the transport jig.

[0023] Next, the control unit 80 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 1.

[0024] The control system 8 comprises a control unit (control device) 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly divided into a control and arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 comprises a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0025] The input / output device 83 includes a monitor 83a that displays the device status and other information, a touch panel 83b that inputs operator instructions, a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from the optical system 88. The input / output device 83 also includes a motor control device 83e, an I / O signal control device 83f, and a focus control device 83g. The motor control device 83e controls a drive unit 86 that includes the XY table (not shown) of the wafer supply unit 10, the pickup head table 23, and the drive shaft of the bond head table 43. The I / O signal control device 83f captures or controls signals from a signal unit 87 that includes switches and volumes that control the brightness of various sensors and lighting devices. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 digitize light intensity and color. The control / arithmetic unit 81 takes in necessary data via a bus line 84, performs calculations, controls the pickup head 21 and the like, and sends information to the monitor 83a and the like.

[0026] The control unit 80 stores image data captured by the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 in the storage device 82 via the image capture device 83d. Using software programmed based on the stored image data, the control and calculation device 81 positions the die D and the package area P of the substrate S and inspects the surfaces of the die D and the substrate S. Based on the positions of the package area P of the die D and the substrate S calculated by the control and calculation device 81, the software moves the drive unit 86 via the motor control device 83e. Through this process, the die on the wafer is positioned, and the pickup head table 23 and the bond head table 43 are operated to bond the die D onto the package area P of the substrate S.

[0027] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 4. Fig. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0028] (Wafer loading process: process S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12.

[0029] (Substrate loading process: Process S2) The transport jig storing the substrate S is supplied to the substrate supply unit 60. In the substrate supply unit 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0030] (Pickup process: process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by the photograph. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0031] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0032] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0033] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT following the same procedure.

[0034] (Bond process: Process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0035] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41, which has suctioned the die D from the intermediate stage 31, bonds the die D to a predetermined position on the substrate S supported by the bond stage 46. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by photographing to determine whether the die D has been bonded to the desired position, etc.

[0036] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all the package areas P of the substrate S.

[0037] (Substrate unloading process: Process S5) The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. At the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0038] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0039] An example of the configuration of the motor control device 83e and the drive unit 86 will be described with reference to Fig. 5. Fig. 5 is a diagram for explaining the motor control device and the drive unit shown in Fig. 3.

[0040] The motor control device 83e includes a motion controller (MoC, control device) 110 and a servo driver (SeD, control device) 120, and controls a servo motor (M) 130. In the motor control device 83e, the motion controller 110 and the servo driver 120 are in closed-loop control. Therefore, the motion controller 110 and the servo driver 120 control the operation of the motor using the current command position and the actual position and actual velocity obtained from the servo motor 130. The motion controller 110 is composed of, for example, a CPU (Central Processing Unit) and a memory that stores programs executed by the CPU.

[0041] A target position speed (TPS) is provided to the motion controller 110 from the control and arithmetic device 81. The actual position and actual speed are sequentially input to the motion controller 110 as encoder signals via the servo driver 120 or directly from the servo motor 130. The motion controller 110 generates a speed command value (SC) based on the target position speed (TPS) and the encoder signal (EN) input from the servo motor 130, and outputs it to the servo driver 120.

[0042] The servo driver 120 controls the rotation speed of the servo motor 130 based on a speed command value (SC) input from the motion controller 110 and an encoder signal (EN) input from the servo motor 130.

[0043] The servo motor 130 includes an encoder 130a. The servo motor 130 rotates at a rotation speed according to the rotation speed control input from the servo driver 120, and outputs the actual position and actual speed detected by the encoder 130a as encoder signals to the servo driver 120 and the motion controller 110. Here, the encoder 130a is, for example, an absolute encoder that detects an absolute angle or an incremental encoder.

[0044] The drive shaft 86a included in the drive unit 86 includes, for example, a servo motor 130, a ball screw 140, a bearing unit 150 that receives the ball screw 140, and limit sensors 160a and 160b. The ball screw 140 includes a screw shaft 140a that is connected to the rotating shaft of the servo motor 130 and the bearing unit 150, and a nut 140b to which a moving body 170 such as a bond head 41 is fixed.

[0045] Limit sensors 160a and 160b are sensors that detect limit positions (P+, P-) of movable body 170, and are attached at positions where the movable body will not move any further. Also, light blocking plates corresponding to limit sensors 160a and 160b are provided on the movable body 170 on the bearing unit 150 side and the servo motor 130 side. When movable body 170 reaches the limit positions (P+, P-), a signal (STP) that stops servo motor 130 (moving body 170) is activated and input to servo driver 120. When signal (STP) is activated, servo driver 120 cuts off the drive torque of servo motor 130 regardless of the operating state.

[0046] Normally, moving body 170 moves, for example, as shown by the dashed line in the relationship between position (Po) and velocity (V) in Figure 5. That is, moving body 170 accelerates from the movement start point to a predetermined position at a predetermined acceleration, then moves to a predetermined position at a predetermined velocity, and then decelerates to a predetermined position at a predetermined acceleration and stops. Moving body 170 stops just before the limit positions (P+, P-).

[0047] An abnormality in the device or the like may cause the servo motor 130 to run out of control, causing the movement of the moving body 170 to deviate significantly from the movement indicated by the dashed line. If the distance (d) between the limit sensor 160a and the bearing portion 150 is short, and the speed of the moving body 170 is not reduced at the limit position (P+), there is a risk that the moving body will collide with a member such as the bearing portion 150 due to inertia, even if the drive torque of the servo motor 130 is cut off by the signal (STP).

[0048] Therefore, in this embodiment, a speed limit value is set for each piece of position information obtained by the encoder 130a, as shown by the solid line in the relationship between position and speed in Fig. 5. In this specification, the speed limit information shown in Fig. 5 is referred to as a soft limit (SL) or a speed limit table. The soft limit (SL) information is stored in the motion controller 110, the servo driver 120, or the servo motor 130.

[0049] The motion controller 110 and servo driver 120 control the operation of the motor using soft limit (SL) information and information on the actual position and actual speed based on the encoder signal (EN). In other words, the motor is operated while monitoring position and speed information, and when the speed at a certain position reaches the speed limit value for that position, the motor speed is changed and decelerated in accordance with the soft limit (SL) information. The speed limit value of the soft limit (SL) is set so that it begins to decrease at positions (Pd+, Pd-) a predetermined distance before the limit positions (P+, P-) and reaches zero at the limit positions (P+, P-).

[0050] For example, the soft limit (SL) shown in FIG. 5 has a speed of "0" at the limit position (P-), and the speed changes at a predetermined rate from the limit position (P-) to position (Pd-). The speed increases at a predetermined rate when moving from the limit position (P-) to position (Pd-), and decreases at a predetermined rate when moving from position (Pd-) to limit position (P-). The soft limit (SL) has a predetermined speed (VL) from position (Pd-) to position (Pd+), changes at a predetermined rate from position (Pd+) to limit position (P+), and the speed is "0" at limit position (P+). The speed decreases at a predetermined rate when moving from position (Pd+) to limit position (P+), and increases at a predetermined rate when moving from limit position (P+) to position (Pd+). In this specification, the soft limit (SL) shown in FIG. 5 is referred to as a trapezoidal soft limit. Note that the speed at the limit positions (P+, P-) does not have to be "0." Any speed is acceptable as long as the distance traveled by inertia is short even when the drive torque of the servo motor 130 is cut off.

[0051] The movable body 170 is, for example, the bond head 41, and the drive shaft 86a is a Z drive shaft that drives the bond head 41 in the Z direction. The drive shaft 86a may also be a Y drive shaft that drives the bond head 41 in the Y direction or an X drive shaft that drives the bond head 41 in the X direction. The movable body 170 may also be a pickup head 21 or a preform head.

[0052] According to the embodiment, one or more of the following effects (a) to (f) are achieved.

[0053] (a) It is possible to reduce the maximum speed until reaching the limit positions (P+, P-), which increases the stopping grace period and reduces the risk of collision even when moving by inertia.

[0054] (b) The servo motor 130 can be stopped safely on the servo driver 120 side without causing the moving body 170 to collide with other members.

[0055] (c) It is possible to reduce the distance between the stopping position of the moving body 170 and other members, thereby making it possible to save space.

[0056] (d) Even if the upper level device, the control and calculation device 81 or the motion controller 110, malfunctions, as long as the servo driver 120 is normal, the servo motor 130 can be stopped safely, thereby reducing the risk of collision of the moving body 170.

[0057] (e) The motion controller 110 and the servo motor 130 can check for errors in the speed command from the host device, making it possible to detect abnormalities in the host device. This can be used to check for errors in the speed control calculation process of the host device.

[0058] (f) Since the servo motor 130 is stopped safely on the servo driver 120 side, it is possible to eliminate the limit sensors 160a and 160b and reduce wiring.

[0059] <Modification> Below, several representative modified examples of the embodiment are given. In the following description of the modified examples, the same reference numerals as those in the above-described embodiment may be used for parts having the same configurations and functions as those described in the above-described embodiment. Furthermore, the description of such parts may be appropriately cited within the scope of not being technically inconsistent. Furthermore, a part of the above-described embodiment and all or part of the multiple modified examples may be appropriately applied in a composite manner within the scope of not being technically inconsistent.

[0060] (First Modification) Fig. 6 is a diagram showing the soft limit in the first modified example, in which the horizontal axis represents the position (Po) and the vertical axis represents the speed limit value (V).

[0061] In the trapezoidal soft limit in the embodiment shown in FIG. 5, the speed limit value is constant between the position (Pd-) and the position (Pd+), but in the first modified example, the speed limit value is set according to the position.

[0062] 6, the speed limit value is a predetermined value (VL) between position (Pd-) and position (P1), increases between position (P1) and position (P2) and returns to the predetermined value (VL), the speed limit value is a predetermined value (VL) between position (P2) and position (P3), and decreases between position (P3) and position (P4) and returns to the predetermined value (VL).

[0063] This makes it possible to change the speed limit value depending on the position by grasping the current position using the encoder 130a (such as an absolute encoder).

[0064] (Second Modification) Fig. 7 is a diagram showing soft limits in the second modified example, in which the horizontal axis represents the position (Po) and the vertical axis represents the speed limit value (V).

[0065] In the second modified example, speed limit values ​​are set in both the positive and negative directions. Here, the positive direction is the direction in which the moving body 170 moves from the servo motor 130 side toward the bearing unit 150 side. The negative direction is the direction in which the moving body 170 moves from the bearing unit 150 side toward the servo motor 130 side.

[0066] The speed limit value in the positive direction is set between the upper limit value (VL+) of the speed limit and the position (Pd+) where deceleration begins from the limit position (P-), and is set so that it begins to decrease at the position (Pd+) and becomes 0 at the limit position (P+).

[0067] The speed limit value in the negative direction is set between the upper limit value (VL-) of the speed limit and the position (Pd-) where deceleration begins from the limit position (P+), and is set so that it begins to decrease at the position (Pd-) and becomes 0 at the limit position (P-).

[0068] It is possible to optimize the operation by maintaining a speed limit table (soft limit) according to the direction of operation.

[0069] (Third Modification) Fig. 8 is a diagram showing soft limits in the third modified example, in which the horizontal axis represents the position (Po) and the vertical axis represents the speed limit value (V).

[0070] 5 is set so that the speed limit value increases at a constant rate from the limit position (P-) to the position (Pd-) and decreases at a constant rate from the position (Pd+) to the limit position (P+). On the other hand, in the third modified example, the rate of increase and decrease of the speed limit value is not constant.

[0071] For example, as shown in Fig. 8, between limit position (P-) and position (Pd-), the rate of increase of the speed limit value is set to an S-shape, with smaller rates on the limit position (P-) side and the position (Pd-) side. Also, between position (Pd+) and limit position (P+), the rate of decrease of the speed limit value is set to an S-shape, with smaller rates on the position (Pd+) side and the limit position (P+) side.

[0072] (Fourth Modification) An example of the configuration of the drive shaft in the fourth modified example will be described with reference to Fig. 9. Fig. 9 is a block configuration diagram for explaining the motor control device and drive unit in the fourth modified example.

[0073] The drive shaft 86b in the fourth modified example has the same configuration as the drive shaft 86a in the embodiment, except for the encoder 130b and the origin sensor 160c. The encoder 130b is an incremental encoder. An incremental encoder is an encoder that can obtain information on an increase or decrease in position only when a positional displacement occurs. Therefore, the drive shaft 86b is equipped with an origin sensor 160c to obtain information on the actual position. The origin sensor 160c is a sensor for detecting the origin that serves as the reference for operation. The origin sensor 160c sends a signal (OP) to the servo driver 120 indicating that the moving body 170 is located at the origin.

[0074] The motion controller 110 and the servo driver 120 control the operation of the motor based on the soft limit (SL) information and the encoder signal (EN). Here, the encoder signal (EN) includes position information acquired by the encoder 130b based on the origin information acquired by the signal (OP). The encoder signal (EN) includes information on the actual position and actual speed.

[0075] In the incremental encoder, by managing the distance to the limit position based on the position of the origin sensor, it is possible to realize a speed limiting function similar to that of the absolute encoder of the embodiment.

[0076] (Fifth Modification) The soft limits in the fifth modified example will be described with reference to Fig. 10. Fig. 10 is a diagram illustrating the soft limits for two-axis interference in the fifth modified example. Fig. 10 shows trapezoidal soft limits when the Y axis and Z axis interfere. The trapezoidal soft limit in the Y axis direction is the same as the soft limit in the embodiment shown in Fig. 5, and the trapezoidal soft limit in the Z axis direction is the same as the soft limit in the embodiment shown in Fig. 5.

[0077] For example, there is a case where the moving body 170 is driven in the Y-axis direction by the Y drive axis and also driven in the Z-axis direction by the Z drive axis. In this case, if interference occurs depending on the positions of the two axes (Y axis and Z axis), a spatial speed limit (upper limit) range is set as shown in FIG.

[0078] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples, but it goes without saying that the present disclosure is not limited to the above embodiments and modified examples, and various modifications are possible.

[0079] In the embodiment, a combination of a servo motor, which is a rotary motor, and an absolute encoder has been described, and in the modified example, a combination of a servo motor and an incremental encoder has been described, but the present invention is also applicable to combinations of other motors and other encoders.

[0080] For example, the combination may be a rotary motor and an absolute linear encoder (linear scale), a rotary motor and an incremental encoder (linear scale), a linear motor and an absolute linear encoder (linear scale), or a linear motor and an incremental linear encoder (linear scale).

[0081] In the embodiment, an example using a die attach film has been described, but a preform unit that applies adhesive to the substrate may be provided, eliminating the need for a die attach film. The preform unit includes a preform head that applies the paste adhesive and a preform table that drives the preform head in vertical and horizontal directions. The preform table may be configured in the same manner as in the embodiment.

[0082] In the embodiment, a die bonder has been described in which a die is picked up from a wafer supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate by a bond head. However, the present invention is not limited to this and can be applied to any die bonding apparatus that picks up a die from a wafer supply unit.

[0083] For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pick-up head and that bonds a die from a wafer supply unit to a substrate with a bond head.

[0084] It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply unit, rotates the die pickup head upward, and delivers the die to the bond head, which then bonds the die to a substrate. [Explanation of symbols]

[0085] 1. Die bonder (semiconductor manufacturing equipment) 110 Motion controller (control device) 120 Servo driver (control device) 130 Servo motor (motor) 130a, 130b Encoder

Claims

1. a motor that drives the moving body; An encoder; a control device for controlling the motor; Equipped with The control device is configured to have a soft limit having a limit value of the motor speed for each position of the encoder, and to reduce the motor speed if the motor speed exceeds the limit value.

2. 2. The semiconductor manufacturing apparatus of claim 1, The control device is a servo driver that drives the motor in the semiconductor manufacturing device.

3. 2. The semiconductor manufacturing apparatus of claim 1, The control device is a semiconductor manufacturing device that is a motion controller that generates a speed command value based on a target position speed and an encoder signal input from the motor.

4. 2. The semiconductor manufacturing apparatus of claim 1, The soft limit is When the encoder is at a first position, the limit value is 0; When the position of the encoder is from the first position to the second position, the limit value increases; the limit value is a predetermined value when the position of the encoder is between the second position and a third position, the limit value is decreased when the position of the encoder is from the third position to the fourth position, The semiconductor manufacturing device is configured so that the limit value is set to 0 when the encoder is in the fourth position.

5. 5. The semiconductor manufacturing apparatus according to claim 4, The soft limit is the limit value increases at a predetermined rate when the position of the encoder is from the first position to the second position, the limit value decreases at a predetermined rate when the position of the encoder is from the third position to the fourth position, The semiconductor manufacturing device is configured such that the limit value is set to 0 when the encoder is at the first position and the fourth position.

6. 2. The semiconductor manufacturing apparatus of claim 1, The soft limit is When the encoder is at a first position, the limit value is 0; When the position of the encoder is from the first position to the second position, the limit value increases at a predetermined rate; a portion where the limit value is a predetermined value when the position of the encoder is between the second position and the third position, and a portion where the limit value is a value larger or smaller than the predetermined value; When the position of the encoder is from the third position to the fourth position, the limit value is decreased at a predetermined rate, The semiconductor manufacturing device is configured so that the limit value is set to 0 when the encoder is in the fourth position.

7. 2. The semiconductor manufacturing apparatus of claim 1, The soft limit is set to, when the moving body moves in a first direction, the limit value is a predetermined value when the encoder is positioned between a first position and a third position, When the position of the encoder is between the third position and the fourth position, the limit value decreases at a predetermined rate, the limit value is set to 0 when the encoder is in the fourth position; The soft limit is set when the moving body moves in a second direction opposite to the first direction. When the encoder is at the first position, the limit value is 0; the limit value increases at a predetermined rate when the encoder is positioned between the first position and the second position; The semiconductor manufacturing device is configured so that the limit value is a predetermined value when the encoder is positioned between the second position and the fourth position.

8. 8. The semiconductor manufacturing apparatus according to claim 1, The semiconductor manufacturing device, wherein the encoder is an absolute encoder.

9. 8. The semiconductor manufacturing apparatus according to claim 1, Furthermore, an origin sensor is provided to detect the origin that serves as the reference for operation. the encoder is an incremental encoder; The soft limit is set based on position information of the incremental encoder with reference to a signal from the origin sensor indicating that the moving body is positioned at the origin.

10. 3. The semiconductor manufacturing apparatus according to claim 2, Further, a limit sensor is provided for detecting the moving body at a position where the moving body is to be forcibly stopped, The semiconductor manufacturing apparatus is configured such that the servo driver cuts off the driving torque of the motor based on a signal indicating that the limit sensor has detected the moving object.

11. The semiconductor manufacturing apparatus according to any one of claims 1 to 7, Further, a host control device that controls the control device is provided, The host control device is a semiconductor manufacturing device that includes the soft limit.

12. The semiconductor manufacturing apparatus according to any one of claims 1 to 7, Further, a ball screw having a screw shaft and a nut is provided, The moving body is fixed to the nut, The semiconductor manufacturing device, wherein the motor is a rotary motor.

13. 8. The semiconductor manufacturing apparatus according to claim 1, The semiconductor manufacturing device, wherein the motor is a linear motor.

14. 8. The semiconductor manufacturing apparatus according to claim 1, The moving body is a pick-up head that picks up a die held on a wafer holder or a bond head that bonds the picked-up die to a substrate.

15. A motor control device that controls a drive shaft that includes a motor and an encoder for driving a moving body, a control device for controlling the motor; the control device is provided with a soft limit having a limit value of the speed of the motor for each position of the encoder; The motor controller is configured to reduce the speed of the motor if the speed of the motor exceeds the limit.

16. carrying a substrate into a semiconductor manufacturing apparatus including a motor for driving a moving body, an encoder, and a control device for controlling the motor, the control device having a soft limit having a limit value of the speed of the motor for each position of the encoder, and configured to reduce the speed of the motor when the speed of the motor exceeds the limit value; bonding a die to the substrate; A method for manufacturing a semiconductor device comprising:

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