Film forming device, film forming method, and article manufacturing method

Abstract

To provide a technique advantageous for accurately forming a cured film of a composition on a substrate.SOLUTION: A film forming device performs processing of supplying a composition onto a substrate and curing the composition to form a cured film of the composition on the substrate, and comprises: a supply unit that supplies each of a plurality of types of compositions different in cure shrinkage from each other onto the substrate; and a control unit that controls the processing. The substrate has a plurality of areas different in the average surface height per unit area from each other. The control unit makes different, between the plurality of areas, the ratio of the plurality of types of compositions to be supplied onto the substrate by the supply unit in the processing, so that a surface shape of the cured film formed on the substrate through the processing becomes a target shape.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus, a film forming method, and an article manufacturing method. [Background technology]

[0002] As the demand for miniaturization of semiconductor devices continues to grow, attention is being paid to microfabrication techniques (film formation techniques) that form films on substrates with controlled accuracy on the order of a few nanometers, in addition to conventional photolithography techniques. One such microfabrication technique is imprinting. In imprinting, an uncured composition is supplied to a substrate, and the composition is cured while in contact with a mold, and then the mold is separated from the cured composition, thereby forming a cured film of the composition on the substrate.

[0003] Furthermore, in the manufacturing process of semiconductor devices, it is necessary to form a planarized film (i.e., a film having a flat surface) on a substrate having steps. A common planarization technique for forming a planarized film on a substrate involves forming a coated film on the substrate using a coating device such as a spin coater. However, it is difficult to flatten the coated film on the substrate at the nanoscale using a coating device. For this reason, in recent years, a planarization technique has been proposed that applies imprinting technology to planarize a composition on a substrate using a mold with a flat surface (e.g., Patent Document 1). In a planarization technique that applies imprinting technology, a composition supplied to a substrate is cured while being brought into contact with the flat surface of the mold, and the mold is then separated from the cured composition, thereby enabling the composition on the substrate to be precisely planarized. The mold used in such planarization techniques is sometimes called a planar template or superstrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-219679 Summary of the Invention [Problem to be solved by the invention]

[0005] In planarization techniques, the composition supplied to a substrate undergoes a volume reduction, or so-called cure shrinkage, when cured. Therefore, if the substrate has multiple regions with different average surface heights per unit area, it may be difficult to accurately form a cured film of the composition having a desired surface shape on the substrate due to the cure shrinkage of the composition.

[0006] Therefore, an object of the present invention is to provide an advantageous technique for accurately forming a cured film of a composition on a substrate. [Means for solving the problem]

[0007] In order to achieve the above object, one aspect of the present invention provides a film forming apparatus that forms a cured film of a composition on a substrate by supplying a composition onto the substrate and curing the composition, the film forming apparatus comprising: a supply unit that supplies each of multiple types of compositions having different cure shrinkage rates onto the substrate; and a control unit that controls the process, wherein the substrate has multiple regions with different average surface heights per unit area, and the control unit varies the ratio of the multiple types of compositions supplied onto the substrate by the supply unit in the process among the multiple regions so that the surface shape of the cured film formed on the substrate after the process matches a target shape.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide an advantageous technique for forming a cured film of a composition on a substrate with high precision. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing an example of the configuration of a planarization apparatus according to an embodiment of the present invention; [Figure 2] Schematic diagram showing a supplying process according to an embodiment of the present invention. [Figure 3] Schematic diagram showing a planarization process according to an embodiment of the present invention. [Figure 4] FIG. 1 is a diagram illustrating the curing shrinkage of a composition during a baking process. [Figure 5] 1 is a flowchart showing a flattening process according to an embodiment of the present invention; [Figure 6] FIG. 1 is a diagram for explaining an example of determining the ratio of multiple types of compositions on a substrate. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] Unless otherwise specified, in this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which the direction parallel to the surface of the substrate (or the holding surface that holds the substrate) is the XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are referred to as θX, θY, and θZ, respectively. Control or drive about the X, Y, and Z axes refers to control or drive in the direction parallel to the X axis, direction parallel to the Y axis, and direction parallel to the Z axis, respectively. Control or drive about the θX, θY, and θZ axes refers to control or drive in the direction parallel to the X axis, direction parallel to the Y axis, and direction parallel to the Z axis, respectively. Position is information that can be determined based on coordinates of the X, Y, and Z axes, and orientation is information that can be determined by values ​​of the θX, θY, and θZ axes.

[0013] A film-forming apparatus is an apparatus that forms a cured film of a composition on a substrate by supplying the composition onto the substrate and curing the composition. The film-forming apparatus may be, for example, a molding apparatus that performs a molding process (molding process) of a composition on a substrate using a mold. The molding apparatus can form a cured film of the composition on the substrate by bringing the mold and the composition supplied onto the substrate into contact with each other, curing the composition, and then separating the mold from the cured composition. Examples of molding apparatuses include imprinting apparatuses and planarizing apparatuses. An imprinting apparatus is an apparatus that forms (transfers) a pattern on a composition (imprint material) on a substrate by contacting a mold having a concave-convex pattern with the composition. The molding process performed by an imprinting apparatus is sometimes called an imprinting process. A planarizing apparatus is an apparatus that flattens the surface of a composition on a substrate by contacting a mold having a flat surface with the composition. The molding process performed by a planarizing apparatus is sometimes called a planarizing process.

[0014] The film-forming apparatus may also be an apparatus that forms a cured film of the composition on a substrate without using a mold. In this case, the film-forming apparatus can, for example, supply the composition onto the substrate, spread the composition on the substrate to form a liquid film, and then cure the liquid film to form a cured film of the composition on the substrate.

[0015] The composition supplied to the substrate is a curable composition (sometimes referred to as an uncured resin) that cures upon application of curing energy. Examples of the curing energy include electromagnetic waves, heat, and the like. Electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared light, visible light, and ultraviolet light. The curable composition can be a composition that cures upon irradiation with light or heat. Among these, photocurable compositions that cure upon irradiation with light contain at least a polymerizable compound and a photopolymerization initiator and may optionally contain a non-polymerizable compound or a solvent. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal mold release agents, surfactants, antioxidants, and polymer components. The composition is applied to the substrate in the form of a film using a spin coater or slit coater. Alternatively, the composition may be applied to the substrate in the form of droplets, or in the form of islands or a film formed by connecting multiple droplets, using a liquid jet head. The viscosity of the imprint material (at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0016] A film forming apparatus according to one embodiment of the present invention will be described below. In this embodiment, a planarization apparatus will be described as an example of the film forming apparatus, but the configuration and processing of the planarization apparatus can also be applied to other film forming apparatuses such as an imprint apparatus.

[0017] 1 is a schematic diagram showing an example of the configuration of a planarization apparatus 100 of this embodiment. The planarization apparatus 100 is one of lithography apparatuses used in the manufacturing process of semiconductor devices, magnetic storage media, and the like, and forms a composition on a substrate 1 using a mold 2. Specifically, the planarization apparatus 100 hardens the composition while bringing the mold 2 into contact with the composition on the substrate 1, and then separates the mold 2 from the cured composition, thereby forming a cured film (planarization film) of the composition with a planarized surface on the substrate 1.

[0018] Examples of materials that can be used for the substrate 1 include glass, ceramics, metals, semiconductors, and resins. If necessary, a member made of a material different from that of the substrate 1 may be provided on the surface of the substrate 1. Examples of the substrate 1 include silicon wafers, compound semiconductor wafers, and quartz glass. The substrate 1 has a concave-convex structure resulting from a pattern formed in a previous process, and the planarization apparatus 100 can be used to form a planarization film on the substrate 1 that covers the concave-convex structure.

[0019] The mold 2 used in the planarization apparatus 100 has a flat surface 2a as a contact surface (molding surface) that contacts the composition on the substrate 1 and molds the composition, and is sometimes called a superstrate or a planar template. A mold 2 having a flat surface 2a can be defined as one in which 90% or more (preferably 95% or more) of the contact surface that contacts the composition on the substrate 1 is a flat surface.

[0020] As shown in FIG. 1 , the planarization apparatus 100 may include a substrate chuck 3, a substrate stage 4, a substrate driving unit 5, a base plate 6, a support column 7, a top plate 8, a guide bar plate 9, a guide bar 10, a mold driving unit 11, a mold chuck 12, and a mold head 13. The planarization apparatus 100 may also include a supply unit 14, a detection unit 16, a curing unit 17, a mold transport unit 18, a substrate transport unit 19, a baking unit 20, an input unit 21, and a control unit 22. In this embodiment, the substrate chuck 3 and the substrate stage 4 constitute a substrate holding unit that holds the substrate 1, and the mold chuck 12 and the mold head 13 constitute a mold holding unit that holds the mold 2. Here, an XYZ coordinate system is defined such that the horizontal plane is the XY plane and the vertical direction is the Z direction.

[0021] The substrate 1 is carried into the planarization apparatus 100 from outside by a substrate transport unit 19 including a transport hand and the like, and is held by the substrate chuck 3. The substrate stage 4 supports the substrate chuck 3 and is configured to be movable in the X and Y directions on a base surface plate 6 in order to position the substrate 1 held by the substrate chuck 3 at a predetermined position. The substrate drive unit 5 includes, for example, a linear motor or an air cylinder, and drives (moves) the substrate stage 4 in the X and Y directions to drive the substrate 1 in the X and Y directions. The substrate drive unit 5 may have a function to drive the substrate stage 4 (substrate 1) in two or more axial directions (e.g., six axial directions including the X, Y, Z, θX, θY, and θZ directions) in addition to the X and Y directions. For example, the substrate drive unit 5 may have a rotation function to rotate the substrate 1 in the θZ direction by rotationally driving the substrate chuck 3 or the substrate stage 4 in the θZ direction.

[0022] The mold 2 is carried into the planarization apparatus 100 from the outside by a mold transport unit 18 including a transport hand and is held by the mold chuck 12. The mold 2 has, for example, a circular or rectangular outer shape and a flat surface 2a that comes into contact with the composition on the substrate 1 and follows the surface shape of the substrate 1. In this embodiment, the flat surface 2a has dimensions the same as or larger than those of the substrate 1. The mold chuck 12 is supported by a mold head 13. The mold head 13 has the function of correcting the tilt of the mold 2 in the θX direction and the θY direction by driving the mold chuck 12. The mold chuck 12 and the mold head 13 each include an opening (not shown) that allows light (ultraviolet light) emitted from the curing unit 17 to pass through.

[0023] Support columns 7 that support a top plate 8 are arranged on the base surface plate 6. A guide bar 10 penetrates the top plate 8, with one end fixed to a guide bar plate 9 and the other end fixed to a mold head 13. A mold driver 11 drives the mold head 13 in the Z direction via the guide bar 10 so as to bring the mold 2 held by the mold chuck 12 into contact with the composition on the substrate 1 or to separate the mold 2 from the cured composition. A height measurement system (not shown) may be arranged on the top plate 8 to measure the height (flatness) of the substrate 1 held by the substrate chuck 3, for example, by an oblique incidence image shift method.

[0024] Here, in this embodiment, an example will be described in which the mold 2 is brought into contact with the composition on the substrate 1 and the mold 2 is separated from the composition on the substrate 1 by driving the mold 2 in the Z direction by the mold driving unit 11, but the present invention is not limited to this. For example, the contact and separation may be carried out by driving the substrate 1 in the Z direction by the substrate driving unit 5, or by driving the mold 2 and the substrate 1 relatively in the Z direction by the mold driving unit 11 and the substrate driving unit 5. In other words, the mold driving unit 11 and the substrate driving unit 5 can constitute a driving mechanism that drives the mold 2 and the substrate 1 relatively.

[0025] The supply unit 14 supplies each of multiple types of compositions, each with a different cure shrinkage rate, onto the substrate 1. The supply unit 14 of this embodiment may include a first discharge head 14a (first dispenser) that discharges a first composition stored in a first tank 15a, and a second discharge head 14b (second dispenser) that discharges a second composition stored in a second tank 15b. Each of the discharge heads 14a-14b employs, for example, a piezo-jet system or a microsolenoid system, and can discharge a minute volume of composition, on the order of 1 pL (picoliter), as droplets. The number of discharge holes in each of the discharge heads 14a-14b is not limited and may be one (single nozzle) or more than 100 (i.e., a linear nozzle array or a combination of multiple linear nozzle arrays).

[0026] The first composition and the second composition have different cure shrinkage rates. The cure shrinkage rate is the ratio of the volume reduction of a composition when the composition is cured by applying energy such as light or heat (i.e., the ratio of the volume after curing to the volume before curing). In this embodiment, the first composition discharged from the first discharge head 14a has a relatively small cure shrinkage rate (smaller than that of the second composition), such as 0.95 times. The second composition discharged from the second discharge head 14b has a relatively large cure shrinkage rate (larger than that of the first composition), such as 0.8 times.

[0027] The detection unit 16 includes an off-axis (OA) scope and is supported by the top plate 8. The detection unit 16 is used in a global alignment process that detects alignment marks provided in each of a plurality of shot areas on the substrate 1 and determines the position of each shot area. By performing the global alignment process using the detection unit 16, it is possible to determine the positional relationship between a pattern formed on the substrate 1 by a previous lithography process or the like and the supply unit 14 (each of the ejection heads 14a to 14b).

[0028] The curing unit 17 applies a first energy to the composition on the substrate 1 via the mold 2, thereby curing the composition. The curing unit 17 applies the first energy to the composition while the mold 2 and the composition on the substrate 1 are in contact with each other. In this embodiment, the first energy is light (e.g., ultraviolet light). In this case, the curing unit 17 has a light source, and cures the composition by irradiating the composition with light while the mold 2 and the composition on the substrate 1 are in contact with each other. The first energy may be energy other than light, such as heat.

[0029] The bake unit 20 (heating unit) further hardens the composition on the substrate 1 after it has been hardened by the curing unit 17 and the mold 2 has been separated by applying a second energy to the composition. In this embodiment, the second energy is heat. In this case, the bake unit 20 includes a substrate holder that holds the substrate 1 and a heat radiation source such as a heater, and further hardens the composition on the substrate 1 that has been hardened by the curing unit 17 by heating the composition at a high temperature, such as 400°C. The high-temperature heating process decomposes the photopolymerization initiator and solvent remaining in the composition on the substrate 1 and induces a polymerization reaction of unpolymerized monomers, thereby completing the hardening reaction of the composition on the substrate 1. Note that the substrate holder of the bake unit 20 may be a substrate holder consisting of a substrate chuck 3 and a substrate stage 4.

[0030] The control unit 22 may be configured by a computer (information processing device) having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. The control unit 22 controls the planarization process by comprehensively controlling each unit of the planarization apparatus 100 based on input information from the input unit 21 serving as a user interface. The control unit 22 may be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose computer with a built-in program, or a combination of all or part of these.

[0031] The planarization process is a series of steps for forming a planarization film on the substrate 1, and may include a supplying step, a contacting step, a curing step, a demolding step, and a heating step. The supplying step is a step of supplying a composition onto the substrate 1 using the supply unit 14 (each of the ejection heads 14a-14b). The contacting step is a step of bringing the composition on the substrate 1 into contact with the mold 2 by driving the mold 2 and the substrate 1 relatively in the Z direction to narrow the gap between them. The curing step is a step (first curing step) of curing the composition using the curing unit 17 while the composition on the substrate 1 is in contact with the mold 2. The demolding step is a step (second curing step) of separating the mold 2 from the composition cured in the curing step by driving the mold 2 and the substrate 1 relatively in the Z direction to widen the gap between them. The baking step is a step (after the demolding step) of further curing the composition on the substrate 1 by heating the composition using the baking unit 20. The planarization process may further include transport of the mold 2 to the mold chuck 12 by the mold transport unit 18, transport of the substrate 1 to the substrate chuck 3 by the substrate transport unit 19, and global alignment processing by the detection unit 16.

[0032] In a planarization process, if the substrate 1 has multiple regions with different average surface heights per unit area, it may be difficult to accurately form a cured film (planarized film) having a desired surface shape on the substrate due to cure shrinkage of the composition during the curing and baking processes. Therefore, in the planarization apparatus 100 of this embodiment, the supply unit 14 has a first discharge head 14a that discharges a first composition and a second head 14b that discharges a second composition, and is configured to supply multiple types of compositions with different cure shrinkage rates onto the substrate 1. The control unit 22 then varies the ratio of the multiple types of compositions supplied onto the substrate 1 by the supply unit 14 among the multiple regions with different average surface heights per unit area so that the surface shape of the cured film (planarized film) formed on the substrate after the planarization process will have a target shape. In other words, the control unit 22 varies the ratio among the multiple regions so that the difference in surface height between the multiple regions of the cured film (planarized film) formed on the substrate after the planarization process falls within an acceptable range. Here, the average surface height per unit area is defined as the value obtained by averaging the surface height of the substrate 1 over a unit area, and may be simply referred to as "average surface height" below.

[0033] Next, an example of the planarization method (film formation method) of this embodiment will be described in detail. Fig. 2 is a schematic diagram showing a supplying step in this embodiment in which multiple types of compositions are supplied onto the substrate 1 by the discharge heads 14a-14b. The following description will be given taking as an example a substrate 1 having three types of regions 1a-1c with different average surface heights. Region 1a is a region in which no concave-convex pattern or the like is formed. Region 1b is a region in which a concave-convex pattern is formed. Region 1c is a region in which a concave-convex pattern recess (hereinafter sometimes referred to as a bathtub portion) wider than the concave recess of the concave-convex pattern of region 1b is formed.

[0034] As shown in FIG. 2, the control unit 22 controls the supply unit 14 (discharge heads 14a-14b) to discharge multiple types of compositions 25a-25b while moving the substrate 1 and the supply unit 14 relative to one another in one direction. Specifically, the substrate stage 4 is driven by the substrate drive unit 5, causing the substrate 1 on the substrate stage 4 to scan below the discharge heads 14a-14b. The first discharge head 14a discharges multiple droplets of the first composition 25a. The second discharge head 14b discharges multiple droplets of the second composition 25b, which has a cure shrinkage rate different from that of the first composition 25a. The control unit 22 appropriately controls the discharge amounts and discharge timings of the compositions 25a-25b from each of the discharge heads 14a-14b based on information about the relative positions of the substrate 1 and the substrate stage 4, information about the position of the substrate stage 4, and information about the supply pattern. This allows the multiple types of compositions 25a-25b to be supplied to desired positions on the substrate 1. In the following description, the multiple types of compositions 25a to 25b may be collectively referred to as "composition 25."

[0035] Here, the relative position information can be obtained by measuring the relative position (coordinates) between the pattern on the substrate 1 and the substrate stage 4 using the detection unit 16. The supply pattern information may be understood as information indicating the distribution of the composition arranged as droplets on the substrate 1, and can be generated (calculated) in advance so that the surface shape of the planarized film (cured film) formed on the substrate 1 after the planarization process will be a target shape. The target shape is a flat shape in the planarization apparatus 100 (planarization process).

[0036] FIG. 3 is a schematic diagram illustrating the planarization process of this embodiment. FIG. 3 illustrates the steps performed after the supplying step. After the supplying step, as shown in FIG. 3(a), the mold driving unit 11 drives the mold 2 in the −Z direction, thereby bringing the mold 2 into contact with the liquid composition 25 supplied onto the substrate 1 (contacting step). As a result, as shown in FIG. 3(b), a layer (liquid film) of the liquid composition 25 is formed between the substrate 1 and the mold 2. Thereafter, as shown in FIG. 3(c), the curing unit 17 irradiates the composition 25 on the substrate 1 with light 17a (ultraviolet light) through the mold 2, thereby curing the composition 25 (curing step). During this curing step, the composition 25 may shrink upon curing.

[0037] After the curing step, as shown in FIG. 3(d), the mold driving unit 11 drives the mold 2 in the +Z direction to separate the mold 2 from the cured composition 25 on the substrate 1 (mold release step). After the separation step, the substrate 1 is transported to the baking unit 20 by driving the substrate stage 4 or by the substrate transport unit 19. In the baking unit 20, the substrate 1 and the composition 25 on the substrate 1 are subjected to a heat treatment at a high temperature of, for example, 400°C (baking step), as shown in FIG. 3(e). In the baking step, as in the curing step, cure shrinkage of the composition 25 may occur, as shown in FIG. 3(f). Through these steps, a planarizing film is formed on the substrate 1.

[0038] Next, the cure shrinkage of the composition 25 in the bake step will be described with reference to FIG. 4. In the planarization process, cure shrinkage of the composition 25 on the substrate 1 occurs not only in the curing step by light irradiation but also in the bake step in which heat treatment is performed. In the bake step, the composition 25 on the substrate 1 is heated at a high temperature, which causes the polymerization reaction of the composition 25 that was unreacted in the curing step by light irradiation to progress, as well as decomposition and volatilization of the solvent and decomposition of the polymerization initiator, resulting in cure shrinkage of the composition 25. The cure shrinkage rate varies depending on the type of monomer material, the degree of progress of the photopolymerization reaction, and the composition ratio of the solvent and photopolymerization initiator, but is generally 0.95 times or less in volume (shrinkage rate of 5%) compared to before baking.

[0039] 4(a) is a schematic diagram showing the cure shrinkage of composition 25 when a film is formed from a single type of composition 25 on substrate 1 having regions 1a to 1c. Since the film thickness of composition 25 is thicker in region 1b having the concave-convex pattern and region 1c having the bathtub portion than in region 1a not having the concave-convex pattern or bathtub portion, the amount of cure shrinkage of composition 25 is greater. As a result, the flatness of the cured film (flattened film) of composition 25 formed on substrate 1 after the baking step may be reduced.

[0040] 4(b) is a schematic diagram showing the cure shrinkage of the composition 25 when the cure shrinkage rate of the composition 25 in each of the regions 1a to 1c is appropriately adjusted. In the example of FIG. 4(b), the ratios of the multiple types of compositions 25 are varied among the multiple regions 1a to 1c depending on the average surface height (average depth) so that the amount of cure shrinkage of the composition 25 is constant across the entire substrate 1. By appropriately adjusting the cure shrinkage rate of the composition 25 depending on the average surface height in this way, the amount of cure shrinkage can be made constant across the entire substrate 1, and the flatness of the cured film (flattened film) of the composition 25 formed on the substrate 1 after the baking step can be improved.

[0041] Here, the cure shrinkage of the composition 25 in the region 1b where a relatively fine concave-convex pattern of 10 nm to 2000 nm is formed is such that the shape of the concave-convex pattern is not directly reflected on the upper surface of the composition 25 due to internal flow of the composition 25. In other words, the composition 25 on the region 1b having the concave-convex pattern undergoes cure shrinkage according to the average surface height (average depth) of the concave-convex pattern. Therefore, in this embodiment, regions 1a to 1c are set in which the ratio of the multiple types of compositions 25a to 25b is changed according to the average surface height.

[0042] 5 is a flowchart showing the flattening process of this embodiment. Each step of the flowchart shown in FIG.

[0043] In step S101, the control unit 22 acquires information indicating the surface shape of the substrate 1 to be subjected to the planarization process (hereinafter, this information may be referred to as substrate information). The substrate information is information indicating the coordinates and / or depth (surface height) of the uneven pattern and bathtub portion on the substrate 1. For example, the control unit 22 can acquire the substrate information based on information input via the input unit 21. The control unit 22 can also acquire the substrate information based on the results of measuring the uneven pattern and bathtub portion formed on the substrate 1, or based on mask design information (CAD data) from a previous lithography process and information from an etching process.

[0044] In step S102, the control unit 22 calculates an average surface height based on the substrate information acquired in step S101, and sets a plurality of regions on the substrate 1 in which the ratios of the plurality of types of compositions 25 are varied based on the average surface height. FIGS. 6(a) and 6(b) are diagrams for explaining an example of a method for setting a plurality of regions on the substrate 1 based on the average surface height. As shown in FIG. 6(a), it is assumed that a concave-convex pattern and a bathtub portion are formed on the substrate 1. Then, the control unit 22 calculates the average surface height for each unit area as shown in FIG. 6(b). Specifically, when the average surface height of the portion where the concave-convex pattern and the bathtub portion do not exist is set to "0 (reference surface)", the average surface height of the portion where the concave-convex pattern is formed is set to "t b ” and the average surface height of the bathtub part is calculated as “t c ". As a result, the control unit 22 separates the area 1a (most convex area) where the average surface height is the height of the reference surface from the area 1b (most convex area) where the average surface height is "t b " and the area 1b where the average surface height is "t c " and an area 1c (the most concave area) where " is the most concave area.

[0045] In step S103, the control unit 22 determines (calculates) the ratio of the multiple types of compositions 25 to be supplied to each of the regions 1a to 1c of the substrate 1. Here, an example will be described in which the multiple types of compositions 25 include a first composition 25a discharged from the first discharge head 14a and a second composition 25b discharged from the second discharge head 14b. In this case, the ratio of the multiple types of compositions 25 is the ratio of the first composition 25a to the second composition 25b. This ratio includes cases in which one type of composition among the multiple types of compositions 25 is 100%. For example, this ratio may include cases in which the first composition 25a is 100% and the second composition 25b is 0%, and cases in which the first composition 25a is 0% and the second composition 25b is 100%.

[0046] FIG. 6(c) is a diagram illustrating definitions in an example of a method for determining the ratio of the multiple types of compositions 25. In determining the ratio of the multiple types of compositions 25, the height of the reference surface of the substrate 1 is defined as "0," and the target surface height of the planarization film (i.e., the planarization film after curing) to be formed on the substrate 1 by planarization processing is defined as "t." The target surface height t is a process parameter determined by a step performed after the planarization processing, and is generally considered to be preferably 25 nm to 200 nm. Furthermore, the volume ratio of the first composition 25a before and after curing (i.e., the ratio of the volume after curing to the volume before curing) is defined as "s1," and the volume ratio of the first composition 25a to the total volume of the multiple types of compositions 25a-25b supplied to each of the regions 1a-1c is defined as "p1." Similarly, the volume ratio of the second composition 25b before and after curing (i.e., the ratio of the volume after curing to the volume before curing) is defined as "s2," and the volume ratio of the second composition 25b to the total volume of the multiple types of compositions 25a-25b supplied to each of the regions 1a-1c is defined as "p2." Here, s1 > s2. Furthermore, the surface height of the composition 25 (liquid film) before curing is defined as "t0." In this embodiment, to minimize the amount of cure shrinkage of the composition, only the first composition 25a is supplied to the region 1c, which is the most recessed region, and the ratio and supply amount of the first composition 25a and the second composition 25b are adjusted in the other regions 1b-1c.

[0047] For the region 1a, which is the most convex region, simultaneous equations relating the surface height t0 of the composition 25 before hardening, the volume ratio p1 of the first composition 25a, and the volume ratio p2 of the second composition 25b are derived as follows. In the simultaneous equations below, the volume ratio p1 of the first composition 25a in the region 1a is defined as "p 1a " and the volume ratio p2 of the second composition 25b in the region 1a is expressed as "p 2a " is expressed as follows. JPEG2025136569000002.jpg20170

[0048] By solving the above simultaneous equations, the surface height t0 of the composition 25 before curing and the volume ratio p of the first composition 25a for achieving the target surface height t after curing can be calculated for the region 1a of the substrate 1. 1a , and the volume ratio p of the second composition 25b 2a can be obtained. JPEG2025136569000003.jpg16170

[0049] For the region 1b located between the most convex region and the most concave region, simultaneous equations relating the surface height t0 of the composition 25 before hardening, the volume ratio p1 of the first composition 25a, and the volume ratio p2 of the second composition 25b are derived as follows. In the simultaneous equations below, the thickness of the composition 25 in the region 1b before hardening is defined as "t 0b ". The volume ratio p1 of the first composition 25a in the region 1b is set to "p 1b " and the volume ratio p2 of the second composition 25b in the region 1b is expressed as "p 2b " is expressed as follows. JPEG2025136569000004.jpg30170

[0050] By solving the above simultaneous equations, the volume ratio p of the first composition 25a for realizing the target surface height t after curing for the region 1b of the substrate 1 is determined. 1b , and the volume ratio p of the second composition 25b 2b can be obtained. JPEG2025136569000005.jpg16170JPEG2025136569000006.jpg16170JPEG2025136569000007.jpg15170

[0051] In this way, the ratio of the multiple types of compositions 25a to 25b to be applied to each of the regions 1a to 1c can be calculated to obtain a flat surface on the surface of the composition after curing. An example of calculation is shown below. Let t = 50 nm, s1 = 0.95, and s2 = 0.8, and the average surface height t of the region 1b on the substrate 1 is b 50 nm, and the average surface height t c By substituting this parameter value into the above simultaneous equations, t0 = 57.9 nm, p 1a =0.42, p 2a =0.58, p 1b =0.85, p 2b =0.15 can be obtained.

[0052] In step S104, control unit 22 supplies multiple types of compositions 25a-25b onto substrate 1 using supply unit 14 based on the ratio of multiple types of compositions 25a-25b determined for each of regions 1a-1c in step S103 (supply step). In this embodiment, as described above, supply unit 14 has first discharge head 14a that discharges first composition 25a and second discharge head 14b that discharges second composition 25b. While substrate 1 and supply unit 14 are moving relatively in one direction, control unit 22 controls the discharge of compositions from each of discharge heads 14a-14b so that first composition 25a and second composition 25b are supplied to each of regions 1a-1c at the ratio determined in step S103.

[0053] In step S105, the control unit 22 performs the contacting step described above with reference to Figures 3(a) and 3(b). In step S106, the control unit 22 performs the curing step described above with reference to Figure 3(c). In step S107, the control unit 22 performs the demolding step described with reference to Figure 3(d). Next, in step S108, the control unit 22 performs the baking step described with reference to Figure 3(e).

[0054] Next, an example of a method for correcting a planarization error will be described. A planarization error can be defined as a film thickness error and / or a flatness error in a planarization film (cured film) formed on the substrate 1 by a planarization process. A film thickness error may be understood as a deviation from a target film thickness, and a flatness error may be understood as a deviation from a target flatness.

[0055] In an actual planarization process, due to factors such as volatilization of the compositions 25a to 25b, flatness error of the substrate chuck 3, and flatness error of the mold 2, planarization errors specific to the apparatus may occur in the planarization film formed on the substrate 1 by the planarization process. Such planarization errors can be corrected, for example, by the following method.

[0056] First, an example of a method for determining (correcting) the ratios of the multiple types of compositions 25a-25b based on information indicating the measurement results of a cured film formed in a previous planarization process will be described. In this case, the ratios (i.e., supply pattern) of the multiple types of compositions 25a-25b for each of the regions 1a-1c of the substrate 1 are determined using the calculation method described above, and the compositions 25a-25b are actually supplied onto the substrate 1 based on these ratios to perform the planarization process. The film thickness distribution and / or flatness of the planarization film (cured film) formed on the substrate 1 by this planarization process are measured. For example, an ellipsometer or an atomic force microscope (AFM) can be used to measure the film thickness distribution and / or flatness of the planarization film.

[0057] Based on the measurement results of the film thickness distribution and / or flatness of the planarization film, the control unit 22 again determines (calculates) the ratios of the multiple types of compositions 25a to 25b for each of the regions 1a to 1c of the substrate 1. That is, based on the measurement results of the film thickness distribution and / or flatness of the planarization film formed in the previous planarization process, the control unit 22 determines (calculates) the ratios of the multiple types of compositions 25a to 25b to be supplied onto the substrate in the subsequent planarization process.

[0058] For example, the target surface height (height from the reference height) of the planarization film to be formed on the substrate by the planarization process is set to "t." Then, the average surface height calculated from the substrate information for a certain region d of the substrate is set to "t d " and the surface height actually measured for the planarization film formed on region d after the planarization process is "t'". In this case, the actual film thickness of the planarization film formed on region d is "t' + t d " and the target film thickness is "t+t d " and the film thickness ratio is "(t'+t d ) / (t+t d )" This film thickness ratio is the film thickness error of the planarization film. The film thickness error is calculated by changing only the supply amounts of the compositions 25a to 25b without changing the ratio between the first composition 25a and the second composition 25b, to the reciprocal of the film thickness ratio, "(t'+t d ) / (t+t d )" for example, if t = 50 nm, td = 100 nm, and t' = 40 nm, the reciprocal of the film thickness ratio, "(t' + t d ) / (t+t d )" is expressed to three significant figures as "1.07." That is, by making the total amount of first composition 25a and second composition 25b supplied to region d 1.15 times the supply amount determined based on the substrate information, the planarization error can be corrected.

[0059] In the above example, the planarization error was corrected by adjusting only the supply amounts of the first composition 25a and the second composition 25b without changing the ratio between the first composition 25a and the second composition 25b. However, this is not a limitation. It is also possible to correct errors in the planarization film finally formed on the substrate by adjusting the ratio between the first composition 25a and the second composition 25b without changing the supply amounts of the first composition 25a and the second composition 25b. In this case, an appropriate ratio can be obtained by adding the planarization error "t - t'" to the target surface height t of the planarization film in the simultaneous equations used to calculate the ratio between the first composition 25a and the second composition 25b. In other words, "2t - t'" can be used as the target surface height of the planarization film.

[0060] Next, an example of a method for determining (correcting) the ratio of the multiple types of compositions 25a to 25b based on information on the subsequent process will be described. The information on the subsequent process can be information indicating the characteristics of a lithography apparatus that forms a pattern on the substrate 1 after a planarization process to form a planarized film (cured film) on the substrate 1.

[0061] A substrate 1 with a planarization film formed thereon typically has a resist coated on top of the planarization film and is used as a reference surface in the lithography process. In recent lithography processes using extreme ultraviolet (EUV) light, the depth of focus permitted for forming an image has been decreasing year by year due to shorter wavelengths of exposure light and higher numerical apertures of exposure optical systems. The lithography equipment used in the lithography process has its own characteristic focus error (image height difference) due to optical system errors, measurement system errors, and substrate chuck flatness errors. These lithography equipment-specific focus errors (image plane height errors) are measured in advance, and the target surface height of the planarization film formed in the planarization process is adjusted to match the focus error of the lithography equipment used in the subsequent process. This reduces the impact of the lithography equipment-specific focus error.

[0062] For example, the average surface height calculated from the substrate information for a certain region e of the substrate 1 is expressed as "t e ” and the focus error of the subsequent lithography equipment in that region is “t e Here, the focus error t e The positive value of ' is in the direction away from the surface of the substrate 1. In addition, the target surface height of the planarization film when focus error is not taken into consideration is "t" as already defined. When the above definition is used, the ideal film thickness of the planarization film in region e when focus error is taken into consideration is "t + t e When calculating the ratio of the first composition 25a and the second composition 25b to be supplied to the region e, a new target value "t+t" is used instead of the target surface height t of the planarization film when the focus error is not taken into consideration. e This allows determining the ratio of the first composition 25a to the second composition 25b that can reduce the influence of focus errors in subsequent processes.

[0063] Next, a preferred example will be described regarding the constitution (composition) of each of the compositions 25a to 25b used in this embodiment. The substrate 1 on which the planarization film is formed is generally processed by etching and chemical mechanical polishing (CMP) processes after undergoing resist coating and lithography. Fluctuations in the processing rate during the etching and chemical mechanical polishing (CMP) processes are undesirable because they lead to variations in the formed pattern. Therefore, it is preferable that the planarization film formed on the substrate 1 after the planarization process of this embodiment has uniform chemical and mechanical properties, regardless of the ratio of the multiple types of compositions 25a to 25b.

[0064] This characteristic can be achieved by each of the multiple compositions 25a-25b containing a monomer and a polymerization initiator (e.g., a photopolymerization initiator), with the multiple compositions 25a-25b containing the same type of monomer but with different compositional ratios of the polymerization initiator. The photopolymerization initiator decomposes and volatilizes during the photocuring process and the heating process during the baking process, causing the composition 25 to shrink upon curing. This allows the curing shrinkage rate to be appropriately adjusted while maintaining the same chemical and mechanical properties of the final planarization film. This characteristic can also be achieved by each of the multiple compositions 25a-25b containing a monomer, a polymerization initiator, and a solvent, with the multiple compositions 25a-25b containing the same type of monomer and polymerization initiator but with different compositional ratios of the solvent.

[0065] As described above, in the planarization apparatus 100 of this embodiment, the supply unit 14 is configured to supply multiple types of compositions 25a-25b, each having a different cure shrinkage rate, onto the substrate 1. The control unit 22 then varies the ratio of the multiple types of compositions 25a-25b supplied onto the substrate 1 by the supply unit 14 across multiple regions having different average surface heights per unit area, so that the surface shape of the planarization film formed on the substrate through the planarization process matches the target shape. This allows a planarization film (cured film) having a desired surface shape to be formed on the substrate with high precision. While the present embodiment has been described with reference to an example in which the control unit 22 determines (calculates) the ratio of the multiple types of compositions 25a-25b, this is not limiting and the ratio may be determined (calculated) by an external device (information processing device) of the planarization apparatus 100. In this case, the planarization apparatus 100 can perform the supplying step based on the ratio determined by the external device.

[0066] <Embodiment of an article manufacturing method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method of this embodiment includes a formation step of forming a cured film of a composition on a substrate using the above-described film formation method, a processing step of processing the substrate that has undergone the formation step, and a manufacturing step of manufacturing an article from the substrate that has undergone the processing step. Furthermore, such a manufacturing method includes other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0067] <Summary of the embodiment> The disclosure of the present specification includes at least the following film forming apparatus, film forming method, and article manufacturing method. (Item 1) 1. A film forming apparatus that supplies a composition onto a substrate and performs a process of curing the composition to form a cured film of the composition on the substrate, comprising: a supply unit that supplies each of a plurality of types of compositions having different cure shrinkage rates onto the substrate; a control unit that controls the processing; Equipped with the substrate has a plurality of regions having different average surface heights per unit area; the control unit varies the ratios of the multiple types of compositions supplied by the supply unit onto the substrate in the processing among the multiple regions so that the surface shape of the cured film formed on the substrate after the processing becomes a target shape. (Item 2) 2. The film forming apparatus according to item 1, wherein the control unit determines the ratio for each of the plurality of regions on the substrate based on information indicating the surface shape of the substrate. (Item 3) 3. The film forming apparatus according to item 1 or 2, wherein the control unit causes the supply unit to discharge each of the plurality of compositions while the supply unit and the substrate are relatively moved in one direction. (Item 4) 4. The film forming apparatus according to any one of items 1 to 3, wherein the supply unit includes a first ejection head that ejects a first composition, and a second ejection head that ejects a second composition having a cure shrinkage rate different from that of the first composition. (Item 5) the target shape is a flat shape, 5. The film forming apparatus according to any one of items 1 to 4, wherein the control unit varies the ratio among the plurality of regions so that a difference in surface height of the cured film formed on the substrate after the processing among the plurality of regions falls within an allowable range. (Item 6) 6. The film forming apparatus according to any one of items 1 to 5, wherein the treatment includes a first curing step of applying a first energy to the composition on the substrate to cure the composition, and a second curing step of applying a second energy to the composition on the substrate after the first curing step to further cure the composition. (Item 7) 7. The film forming apparatus according to item 6, wherein the first energy is light and the second energy is heat. (Item 8) 8. The film forming apparatus according to any one of items 1 to 7, wherein the treatment includes curing the composition while the mold and the composition on the substrate are in contact with each other. (Item 9) 9. The film-forming apparatus according to item 8, wherein the mold has a flat surface that contacts the composition on the substrate. (Item 10) 10. The film forming apparatus according to any one of items 1 to 9, wherein the control unit determines a ratio of the plurality of types of compositions to be supplied onto the substrate by the supply unit in the process based on information indicating a measurement result of a film thickness of a cured film formed in the previous process. (Item 11) 11. The film forming apparatus according to any one of items 1 to 10, wherein the control unit determines a ratio of the plurality of types of compositions to be supplied onto the substrate by the supply unit in the processing based on information indicating characteristics of a lithography apparatus that forms a pattern on the substrate after the cured film has been formed on the substrate through the processing. (Item 12) each of the plurality of compositions contains a monomer and a polymerization initiator; 12. The film forming apparatus according to any one of items 1 to 11, wherein the monomers in the plurality of compositions are the same type, and the composition ratios of the polymerization initiators are different from one another. (Item 13) each of the plurality of compositions contains a monomer, a polymerization initiator, and a solvent; 12. The film forming apparatus according to any one of items 1 to 11, wherein the monomers and the polymerization initiators in the plurality of compositions are the same, and the composition ratios of the solvents are different from each other. (Item 14) A film forming method for forming a cured film of a composition on a substrate, comprising: a supplying step of supplying each of a plurality of types of compositions having different cure shrinkage rates onto the substrate; a curing step of curing the composition supplied onto the substrate in the supplying step; Including, the substrate has a plurality of regions having different average surface heights per unit area; a supplying step of supplying the plurality of types of compositions onto the substrate at different ratios in the plurality of regions so that the surface shape of the cured film formed on the substrate after the curing step is a target shape. (Item 15) A forming step of forming a cured film of the composition on a substrate using the film forming method according to item 14; a processing step of processing the substrate that has undergone the forming step; a manufacturing process for manufacturing an article from the substrate that has undergone the processing process; A method for manufacturing an article, comprising:

[0068] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0069] 1: substrate, 2: mold, 14: supply unit, 14a: first discharge head, 14b: second discharge head, 17: curing unit, 20: baking unit, 22: control unit, 25a: first composition, 25b: second composition, 100: flattening device (film forming device)

Claims

1. 1. A film forming apparatus that supplies a composition onto a substrate and performs a process of curing the composition to form a cured film of the composition on the substrate, comprising: a supply unit that supplies each of a plurality of types of compositions having different cure shrinkage rates onto the substrate; a control unit that controls the processing; Equipped with the substrate has a plurality of regions having different average surface heights per unit area; the control unit varies the ratios of the multiple types of compositions supplied by the supply unit onto the substrate in the processing among the multiple regions so that the surface shape of the cured film formed on the substrate after the processing becomes a target shape.

2. 2. The film forming apparatus according to claim 1, wherein the control unit determines the ratio for each of the plurality of regions on the substrate based on information indicating a surface shape of the substrate.

3. 3. The film forming apparatus according to claim 1, wherein the control unit causes the supply unit to eject each of the plurality of compositions while the supply unit and the substrate are moving relatively in one direction.

4. 3. The film forming apparatus according to claim 1, wherein the supply unit includes a first ejection head that ejects a first composition, and a second ejection head that ejects a second composition having a cure shrinkage rate different from that of the first composition.

5. the target shape is a flat shape, The film forming apparatus according to claim 1 or 2, characterized in that the control unit varies the ratio among the multiple regions so that the difference in surface height of the cured film formed on the substrate after the processing between the multiple regions falls within an acceptable range.

6. 3. The film forming apparatus according to claim 1, wherein the processing includes a first curing step of applying a first energy to the composition on the substrate to cure the composition, and a second curing step of applying a second energy to the composition on the substrate after the first curing step to further cure the composition.

7. 7. The film forming apparatus according to claim 6, wherein the first energy is light and the second energy is heat.

8. 3. The film-forming apparatus according to claim 1, wherein the treatment includes curing the composition on the substrate while the mold is in contact with the composition.

9. 9. The film-forming apparatus according to claim 8, wherein the mold has a flat surface that contacts the composition on the substrate.

10. 3. The film forming apparatus according to claim 1, wherein the control unit determines a ratio of the plurality of types of compositions to be supplied onto the substrate by the supply unit in the process based on information indicating measurement results of film thicknesses of cured films formed in the past processes.

11. 3. The film forming apparatus according to claim 1, wherein the control unit determines a ratio of the plurality of types of compositions to be supplied onto the substrate by the supply unit during the process based on information indicating characteristics of a lithography apparatus that forms a pattern on the substrate after the cured film has been formed on the substrate through the process.

12. each of the plurality of compositions contains a monomer and a polymerization initiator; 3. The film forming apparatus according to claim 1, wherein the plurality of types of compositions contain the same type of monomers but differ from one another in composition ratio of the polymerization initiator.

13. each of the plurality of compositions contains a monomer, a polymerization initiator, and a solvent; 3. The film forming apparatus according to claim 1, wherein the monomers and the polymerization initiators in the plurality of compositions are the same, and the composition ratios of the solvents are different from one another.

14. A film forming method for forming a cured film of a composition on a substrate, comprising: a supplying step of supplying each of a plurality of types of compositions having different cure shrinkage rates onto the substrate; a curing step of curing the composition supplied onto the substrate in the supplying step; Including, the substrate has a plurality of regions having different average surface heights per unit area; a supplying step of supplying the plurality of types of compositions onto the substrate at different ratios in the plurality of regions so that the surface shape of the cured film formed on the substrate after the curing step is a target shape.

15. a forming step of forming a cured film of the composition on a substrate using the film forming method according to claim 14; a processing step of processing the substrate that has undergone the forming step; a manufacturing process for manufacturing an article from the substrate that has undergone the processing process; A method for manufacturing an article, comprising:

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