Processing device

Abstract

To provide a processing device which inhibits change of a physical relationship between a chuck table and grinding parts regardless of rigidity of the chuck table and the grinding parts.SOLUTION: A processing device 1 includes: a chuck table 12 which rotatably supports a workpiece W having a substantially circular disc shape; an inclination angle adjustment part 80 which supports the chuck table 12 in a manner that an inclination angle of the chuck table 12 may be adjusted; grinding parts 40, 50 which rotatably hold grind stones for grinding the workpiece W; and an inclination angle adjustment part 90 which supports the grinding parts 40, 50 in a manner that inclination angles of the grinding parts 40, 50 may be adjusted. The inclination angle adjustment part 80 and the inclination angle adjustment part 90 are formed so that an attitude change direction of the chuck table 12 and attitude change directions of the grinding parts 40, 50 match with each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for grinding a workpiece such as a semiconductor wafer. [Background technology]

[0002] In the field of semiconductor manufacturing, backside grinding is performed to grind the backside of semiconductor wafers (hereinafter referred to as "wafers") such as silicon wafers to make them thinner. For example, Patent Document 1 discloses an in-feed grinding device that grinds a wafer mounted on a rotatable chuck table using a grinding wheel rotatably arranged above the chuck table. The in-feed grinding device measures the thickness profile of the wafer before grinding, adjusts the tilt amount of the chuck table and the grinding wheel according to the measurement results, and performs grinding by pressing the arc-shaped edge of the grinding wheel against the wafer.

[0003] In the above-mentioned machining apparatus, it is necessary to suppress fluctuations in the posture of the chuck table and grinding unit during machining. To prevent such fluctuations, techniques have been proposed to improve the rigidity of the chuck table and grinding unit. However, there is a limit to how much the rigidity of the chuck table and grinding unit can be increased, and increasing the rigidity also leads to increased costs. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-201422 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention provides a processing device that can suppress fluctuations in the positional relationship between the chuck table and the grinding unit regardless of the rigidity of the chuck table or the grinding unit, thereby achieving even higher processing precision and improving within-plane thickness variation (TTV). [Means for solving the problem]

[0006] The present invention provides a machining apparatus including a chuck table for rotatably supporting a substantially disk-shaped workpiece, a grinding unit for rotatably holding a grinding wheel for grinding the workpiece, a chuck table support mechanism formed by a first support for supporting the chuck table and supporting the chuck table at an adjustable tilt angle, and a grinding unit support mechanism formed by a second support for supporting the grinding unit and supporting the grinding unit at an adjustable tilt angle. The chuck table support mechanism and the grinding unit support mechanism are configured so that the direction of change in attitude of the chuck table coincides with the direction of change in attitude of the grinding unit. [Effects of the Invention]

[0007] According to the present invention, since the orientation change directions of the chuck table and the grinding unit during processing are substantially the same, even if the tilt changes, there is no significant effect on the positional relationship between the grinding unit and the chuck table. Therefore, regardless of the rigidity of the chuck table or grinding unit, fluctuations in the positional relationship between the chuck table and the grinding unit are suppressed, thereby providing a processing device that can achieve even higher processing precision and improved within-plane thickness variation (TTV). [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view illustrating a schematic configuration of a wafer grinding apparatus 1 according to a first embodiment. [Figure 2] 1 is a plan view illustrating the configuration of an index table 11 and a chuck table 12 of a wafer grinding apparatus 1 according to a first embodiment. [Figure 3] 1 is a block diagram illustrating the configuration of a control unit 100 of a wafer grinding processing apparatus 1 according to a first embodiment. [Figure 4] 2 is a schematic perspective view for explaining the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50. FIG. [Figure 5]2 is a schematic plan view illustrating the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50. FIG. [Figure 6] 10A and 10B are schematic diagrams illustrating problems with a processing device according to a comparative example. [Figure 7] 1 is a schematic diagram illustrating advantages of the processing device 1 according to the first embodiment. [Figure 8] FIG. 4 is a schematic diagram illustrating the configuration of a processing device 1 according to a second embodiment. [Figure 9] 10 shows a modified example of the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, the present embodiment will be described with reference to the accompanying drawings. The accompanying drawings illustrate embodiments according to the principles of the present disclosure, but the drawings are for understanding the present disclosure and are not to be used to interpret the present disclosure in a limiting manner. The description in this specification is merely a typical example and does not limit the scope or application of the present disclosure in any way.

[0010] Although the present embodiment has been described in sufficient detail to enable those skilled in the art to implement the present disclosure, it should be understood that other implementations and forms are possible, and that changes in configuration and structure and substitutions of various elements are possible without departing from the scope and spirit of the technical ideas of the present disclosure. Therefore, the following description should not be interpreted as being limited thereto.

[0011] In the following description, "upper" and "lower" refer to directions perpendicular to the surface of the base B of the processing device 1, with the side farther from the surface of the base B being called "upper" and the side closer to the surface of the base B being called "lower."

[0012] In the following description, a processing apparatus will be described that processes a substantially disk-shaped semiconductor wafer as a workpiece W to be processed.

[0013] [First embodiment] The schematic configuration of a wafer grinding processing apparatus 1 (hereinafter referred to as processing apparatus 1) according to a first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a perspective view illustrating the overall configuration of processing apparatus 1, and Figure 2 is a plan view illustrating the configuration of index table 11 and chuck table 12. This processing apparatus 1 is roughly composed of a workpiece holding unit 10 and a main unit 20.

[0014] The workpiece holding unit 10 is a part that holds a workpiece W such as a wafer to be processed, and is placed on a base B. The workpiece holding unit 10 includes an index table 11 and a plurality of (for example, three) chuck tables 12.

[0015] 2, index table 11 is connected to a motor (not shown) and is configured to be rotatable around rotation axis C1. Chuck tables 12 are placed on index table 11 at approximately equal intervals (i.e., every 120°) circumferentially, hold workpieces W (objects to be processed) such as wafers, and are rotatable around rotation axis C2. Each chuck table 12 is installed in a fan-shaped space partitioned by partition plates 13 at 120° intervals.

[0016] The three spaces are partitioned for the execution of three stages: alignment stage S1, rough grinding stage S2, and fine grinding stage S3. The alignment stage S1 is a stage where the workpiece W is transported onto the chuck table 12 by a transport device (not shown) or the like and the workpiece W is aligned. The rough grinding stage S2 is a stage where the workpiece W is roughly ground to less than the desired surface roughness, and the fine grinding stage S3 is a stage where the workpiece W is precisely ground to the desired surface roughness.

[0017] The partition plate 13 serves to prevent the machining fluid used in each stage from splashing onto an adjacent stage. The processing apparatus 1 is capable of successively executing stages S1 to S3 and continuously grinding workpieces W placed on multiple chuck tables 12 by rotating the index table 11 around the rotation axis C1 in accordance with the progress of the stages. Wafers serving as workpieces W are, for example, silicon wafers or silicon carbide wafers, but are not limited to these.

[0018] The chuck table 12 has a chuck portion 12c that adsorbs the workpiece W. Although not shown, the chuck portion 12c has an adsorption body made of porous ceramic, and also has a pipe line connected to a vacuum source below the adsorption body. The workpiece W is adsorbed to the chuck table 12 by negative pressure from the pipe line.

[0019] Next, the main unit 20 will be described. As shown in FIG. 1, the main unit 20 is a portion for holding a grinding unit and the like for grinding the workpiece W above the workpiece holder 10. Specifically, the main unit 20 includes an arch-shaped column 30 formed to straddle the workpiece holder 10, and further includes a rough grinding unit 40 and a fine grinding unit 50 mounted on the column 30. The rough grinding unit 40 is a grinding unit corresponding to the rough grinding stage S2 for performing rough grinding to roughly grind the surface of the workpiece W to a surface roughness less than the desired surface roughness, and the fine grinding unit 50 is a grinding unit corresponding to the fine grinding stage S3 for performing fine grinding to grind the surface of the workpiece W to the desired surface roughness. The rough grinding unit 40 and the fine grinding unit 50 may be collectively referred to as the "grinding unit."

[0020] The column 30 is composed of a base 31 that is roughly E-shaped in plan view, and a support 32 that extends vertically from a base B and is connected to the end of the base 31. A rough grinding section 40 and a fine grinding section 50 are provided in two recesses of the E-shaped base 31 in plan view.

[0021] The rough grinding unit 40 has a rough grinding wheel 41, a grinding mechanism 42 to which the rough grinding wheel 41 is attached at its lower end, and a spindle feed mechanism 43 that raises and lowers the grinding mechanism 42 in the vertical direction V. Similarly, the fine grinding unit 50 has a fine grinding wheel 51, a grinding mechanism 52 to which the fine grinding wheel 51 is attached at its lower end, and a spindle feed mechanism 53 that raises and lowers the grinding mechanism 52 in the vertical direction V. The grinding mechanism 42 and the grinding mechanism 52 are configured to be rotatable by a motor (not shown). The rough grinding wheel 41 and the fine grinding wheel 51 may be collectively referred to simply as "grinding wheels."

[0022] The column 30 is provided with a first guide 60 and a second guide 70 for controlling the elevation of the rough grinding unit 40 and the fine grinding unit 50. The first guide 60 is provided in one of two recesses of the base 31 that is E-shaped in plan view, and has a plurality of guide portions 61 for raising and lowering the rough grinding unit 40, and a rail 62 for sliding the guide portions 61 along the vertical direction V. The second guide 70 is provided in the other of the two recesses of the base 31 that is E-shaped in plan view, and has a plurality of guide portions 71 for raising and lowering the fine grinding unit 50, and a rail 72 for sliding the guide portions 71 along the vertical direction V.

[0023] Each of the three chuck tables 12 is provided with a first tilt angle adjustment unit 80 for adjusting the tilt angle of the chuck table 12 relative to the index table 11. As shown in FIG. 2, the first tilt angle adjustment unit 80 includes, for example, two movable support units 14 and one fixed support unit 15, and is supported on the surface of the index table 11 by a plurality of support units (for example, three points). The first tilt angle adjustment unit 80 constitutes a chuck table support mechanism that supports the check table 12 so that the tilt angle can be adjusted. The movable support unit 14 and the fixed support unit 15 may be collectively referred to as "support units 14, 15."

[0024] The movable support parts 14 raise and lower a tilt table (not shown) in the chuck table 12, and the fixed support parts 15 fix the tilt table in the vertical direction V. Therefore, the chuck table 12 can be tilted relative to the index table 11 according to the amount of expansion and contraction of each of the two movable support parts 14.

[0025] The movable support member 14 may be, for example, a member using a differential screw mechanism and bolts, but is not limited to this. Furthermore, the number of support members 14 and 15 supporting one chuck table 12 is three in the illustrated example, but is not limited to this and may be four (four-point support), five, or more. Furthermore, the number of movable support members 14 supporting one chuck table 12 is two in the above example, but is not limited to this.

[0026] The rough grinding unit 40 and the fine grinding unit 50 each include a second inclination angle adjustment unit 90 for adjusting the inclination angle relative to a reference direction (only the second inclination angle adjustment unit 90 of the rough grinding unit 40 is shown in FIG. 1 ). The second inclination angle adjustment unit 90 includes, for example, two movable support units 91 and one fixed support unit 92. The rough grinding units 40 and 50 are supported by a plurality of support units (e.g., three points) consisting of the two movable support units 91 and one fixed support unit 92 relative to the column 30. In other words, the movable support units 91 and the fixed support units 92 form a grinding unit support mechanism that supports the grinding units 40 and 50. The movable support unit 91 may be, for example, a differential screw mechanism including a slide block, a fixed block, and an adjustment screw. The movable support unit 91 and the fixed support unit 92 may be collectively referred to as the "support units 91, 92."

[0027] The index table 11 rotates in 120° increments in accordance with the stages S1 to S3, allowing the workpiece W to be moved in sequence to the alignment stage S1, the rough grinding stage S2, and the fine grinding stage S3. The chuck table 12 of the alignment stage S1 is exposed on the side opposite the two recessed portions of the base 31 as the index table 11 rotates. On the other hand, the chuck tables 12 of the rough grinding stage S2 and the fine grinding stage S3 are moved to below the two recessed portions of the base 31 as the index table 11 rotates.

[0028] After the workpiece W has been aligned with the chuck table 12 in the alignment stage S1, the index table 11 rotates 120° to move the workpiece W below the rough grinding section 40 and transition to the rough grinding stage S2. After the rough grinding stage S2 is completed, the index table 11 rotates another 120°, and the workpiece W moves below the fine grinding section 50 and transitions to the fine grinding stage S3.

[0029] When the fine grinding stage S3 is finished, the index table 11 rotates further, and the workpiece W moves again to the alignment stage S1, where it is moved from the chuck table 12 to a rack or the like (not shown) by a transport device or the like (not shown). It is also possible to divide the index table 11 into four sections at 90° and to provide a polishing stage for polishing the workpiece W after fine grinding.

[0030] 1 will be described with reference to Fig. 3. As described above, the processing apparatus 1 processes the workpiece W by the index table 11, chuck table 12, rough grinding unit 40, and fine grinding unit 50 performing rotational operations, tilt angle adjustment operations, and parallel movement operations. The control unit 100 controls the various operations of the index table 11, chuck table 12, rough grinding unit 40, and fine grinding unit 50.

[0031] The control unit 100 includes, for example, a CPU 101, a memory 102, and a memory 103, and is connected to a first sensor 104 and a second sensor 105 located externally. The CPU 101 operates according to a control program stored in the memory 102, and stores various calculation results in the memory 103. The memory 103 may also store a data map as an analysis result of acquired data.

[0032] The first sensor 104 and the second sensor 105 are disposed near the workpiece W and output measurement signals indicating the surface shape of the workpiece W to the control unit 100. The control unit 100 outputs the measurement signals to an index table control unit 106, a chuck table control unit 107, a grindstone rotation drive control unit 108, and a tilt control unit 109.

[0033] The index table control unit 106 controls the rotational drive of the index table 11 in accordance with commands from the control program. Furthermore, the chuck table control unit 107 controls the suction operation and rotational drive of the chuck table 12 in accordance with commands from the control program. Furthermore, the grinding wheel rotational drive control unit 108 controls the rotational drive of the grinding wheels 41, 51 of the rough grinding unit 40 and the fine grinding unit 50. The tilt control unit 109 controls the movable support unit 14 and the movable support unit 91 in accordance with measurement signals from the first sensor 104 and the second sensor 105 to control the tilt angles of the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50.

[0034] Next, with reference to FIGS. 4 and 5, the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in the machining apparatus 1 of the first embodiment will be described in detail. The chuck unit 12c of the chuck table 12 is disposed on the index table 11 so as to rotate about a rotation axis C2 by a motor (not shown). The chuck table 12 is supported at three points on the index table 11 by three support units, namely, the movable support unit 14 and the fixed support unit 15, which constitute the first tilt angle adjustment unit 80. Here, the three support units formed by the movable support unit 14 and the fixed support unit 15 are an example of a first support unit, and the three support units constitute a first support. In the configuration example shown in FIG. 5, the rotation axis C2 of the chuck unit 12c is positioned eccentrically (at a different position) with respect to the point of application of the resultant force of the support reaction forces from the three support units. However, this is just an example, and the point of application may coincide with the rotation axis C2.

[0035] The rotation axes C3 of the grinding wheels 41, 51 of the rough grinding unit 40 and the fine grinding unit 50 are controlled by the second tilt angle adjustment unit 90 so that they have a slight tilt angle with respect to the rotation axis C2 of the workpiece W (chuck table 12) during machining, and are controlled so that they come into contact with the workpiece W at an arc-shaped portion AC as shown in Fig. 5 during machining. The arc-shaped portion AC is adjusted to pass through the rotation axis C2.

[0036] To suppress fluctuations in the positional relationship between the chuck table 12 and each grinding unit (rough grinding unit 40 and fine grinding unit 50) and thereby further increase the precision of processing and improve the in-plane thickness variation (TTV), in this embodiment, the positions and support rigidity of the three support units (first support units), namely, the movable support unit 14 and the fixed support unit 15, are set so that the attitude change direction (tilt direction) of the chuck table 12 and the attitude change direction of the grinding unit 40 or 50 are approximately aligned, and the positions and support rigidity of the support units, namely, the movable support unit 91 and the fixed support unit 92, are also set (having such positions and support rigidity). Here, the three support units formed by the movable support unit 91 and the fixed support unit 92 are an example of a second support unit, and the three second support units form a second support unit.

[0037] 6 shows an example of the arrangement of the rough grinding unit 40 and the fine grinding unit 50 in a processing apparatus according to a comparative example. As shown in FIG. 6(a), in the rough grinding unit 40 and the fine grinding unit 50, the direction of attitude change D2 (the direction in which the grinding unit tilts is indicated by symbols I1 and I2 in FIG. 6) is determined by the positions and support rigidity of the support parts of the movable support part 91 and the fixed support part 92. Similarly, as shown in FIG. 6(b), the direction of attitude change D1 (the direction in which the chuck table 12 tilts is indicated by symbols I3 and I4 in FIG. 6) is determined by the positions and support rigidity of the support parts of the movable support part 14 and the fixed support part 15. If the attitude change directions D1 and D2 are different directions, when a load due to grinding is applied between the grinding unit 40 or 50 and the chuck table 20, the two will tilt in the different directions D1 and D2 (as shown by arrows A1 and A2 in Figure 6(c)), which will cause a large change in the positional relationship between the two and the grinding state, making it difficult to achieve high-precision processing and improvement of the total thickness variation (TTV).

[0038] 7 shows an example of the arrangement of the rough grinding unit 40 and the fine grinding unit 50 in the processing apparatus 1 according to the first embodiment. As shown in Fig. 7(a), in the rough grinding unit 40 and the fine grinding unit 50, the attitude fluctuation direction D2 is determined depending on the positions and support rigidity of the support parts of the movable support part 91 and the fixed support part 92, and as shown in Fig. 7(b), the attitude fluctuation direction D1 in the chuck table 12 is also determined depending on the positions and support rigidity of the support parts of the movable support part 14 and the fixed support part 15.

[0039] As shown in Figures 7(a) and 7(b), in the processing apparatus 1 of the first embodiment, the position and support stiffness of each support part are determined so that the attitude change direction D1 and the attitude change direction D2 are substantially aligned (i.e., substantially the same direction) (indicated by arrows A1 and A2 in Figure 7(c)). The support stiffness of each support part may vary depending on the structure, material, dimensions, position, and other physical properties of the support part. Here, the attitude change directions D1 and D2 being "substantially aligned" does not only mean that they are completely aligned, but also means that the difference in angle between the two directions is less than 10°.

[0040] Since the orientation change directions D1 and D2 are substantially aligned, even if the chuck table 12 tilts in the orientation change direction D1 due to the load of the grinding wheel 41 or 51, the grinding unit 40 or 50 also tilts in the substantially same orientation change direction D2. This allows grinding to be continued without significantly changing the contact relationship between the grinding wheel 41 or 51 and the workpiece W, achieving high-precision processing and improved total thickness variation (TTV). Note that, when the load of the grinding units 40 and 50 on the workpiece W is large, the amount of tilt of the grinding units 40 and 50 also increases. Therefore, the positions and support rigidities of the support units of the first tilt angle adjustment unit 80 and the second tilt angle adjustment unit 90 can be set taking into account the magnitude of the load on the workpiece W by the grinding units 40 and 50. Furthermore, in the configuration of the processing apparatus shown in FIG. 6 , it is also within the scope of the present application to set or adjust the support rigidity, length, and other shapes of the support units 14 and 15 so that the orientation change directions D1 and D2 are substantially aligned. According to this configuration, the effects of this embodiment can be obtained without changing the arrangement of the support portions 14 and 15 or the shape of the chuck table 12.

[0041] [Second embodiment] Next, a processing apparatus 1 according to a second embodiment will be described with reference to Fig. 8. The processing apparatus 1 according to the second embodiment has the same overall configuration (Figs. 1 to 3) as that of the first embodiment, so a duplicated description will be omitted. Fig. 8 is a schematic diagram illustrating the positional relationship between the chuck table 12 and the grinding unit 40 or 50 according to the second embodiment.

[0042] In the chuck table 12 and each grinding unit of the second embodiment, the position and support rigidity of each support unit are set so that the attitude change directions D1 and D2 are substantially the same, as in the first embodiment. In addition, the processing apparatus 1 of the second embodiment has the following features.

[0043] The chuck table 12 of the second embodiment is supported at three points on the index table 11 by three support parts, namely, the movable support part 14 and the fixed support part 15. When the action point SC of the resultant force of the support reaction forces from the three support parts is considered, the rotation axis C2 of the chuck part 12c is positioned eccentrically with respect to the action point SC.

[0044] When the support stiffness of the three support parts 14, 15 is the same, the point of application SC coincides with the center of gravity of the triangle connecting the three points. When the support stiffness of the three support parts 14, 15 is different, the point of application SC may be at a position different from the center of gravity. The three support parts 14, 15 may be arranged in an equilateral triangle as shown in FIG. 8, but may be arranged in a shape other than an equilateral triangle (for example, an isosceles triangle with one side shorter) depending on the difference in support stiffness of each support part 14, 15 and other factors. In the case of four-point support, the arrangement may be in a square shape, but may also be a shape other than a square (such as a rectangle, parallelogram, or trapezoid) depending on the difference in support stiffness and other determining factors.

[0045] During machining, the grinding wheels 41, 51 are controlled so that they contact the workpiece W at the arc-shaped portion AC as shown in FIG. 8. The arc-shaped portion AC is adjusted to pass through the rotation axis C2, and the positions of the rough grinding unit 40 and the fine grinding unit 50 are adjusted so that the aforementioned point of application SC is included at least near the middle of the machining area AR surrounding the arc-shaped portion AC (in other words, the portion excluding both ends of the machining area AR). In FIG. 8, the point of application SC coincides with the midpoint ACC of the arc-shaped portion AC, but this is just an example, and it is sufficient for the point of application SC to be included near the middle of the machining area AR. Although it is sufficient for the point of application SC to be included near the middle of the machining area AR, it is preferable for it to be located near the midpoint ACC of the arc-shaped portion AC. The "machining area AR" may be defined as a rectangular area that contacts both ends and vertices of the arc-shaped portion AC, or it may be a slightly larger area. Furthermore, "near the middle of the machining area AR" means to the extent that both ends of the machining area AR in the longitudinal direction are excluded, and does not mean only the vicinity of the midpoint ACC. For example, the area occupying about 50% of the arc-shaped portion AC, centered on the midpoint ACC, can be defined as the vicinity of the center of the machining area.

[0046] As described above, in the second embodiment, the position and support rigidity of each support part are set so that the attitude change directions D1 and D2 are substantially aligned, and the positional relationship of the rough grinding part 40 and the fine grinding part 50 with respect to the chuck table 12 is set so that the point of application SC is included in the machining area AR. This makes it possible to suppress fluctuations in the tilt angle of the chuck table 12 even if a large external force is applied to the workpiece W from the rough grinding part 40 and the fine grinding part 50.

[0047] The present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.

[0048] Furthermore, in the above embodiment, the first tilt angle adjustment mechanism 80 has been described as having a configuration in which the movable support member 14 and the fixed support member 15 are supported at multiple points, but the present invention is not limited to this. For example, as shown in Fig. 9, the chuck table 12 can also be supported by a first tilt angle adjustment mechanism 80A (chuck table support mechanism) which is a first support member that has an inclined surface on its upper surface and is rotatable relative to the chuck table 12. By appropriately rotating the first tilt angle adjustment mechanism 80A relative to the chuck table 12, the tilt angle of the chuck table 12 can be appropriately adjusted, and the tilt direction can also be appropriately adjusted.

[0049] Furthermore, in the above example, the first tilt angle adjustment mechanisms 80, 80A are configured to be able to adjust the tilt angle of the chuck table 12, but the tilt angle adjustment function of the first tilt angle adjustment mechanisms (chuck table support mechanisms) 80, 80A may be omitted, and only the tilt angle of the grinding units 40, 50 may be adjustable by the second tilt angle adjustment unit 90. [Explanation of symbols]

[0050] 1...Wafer grinding equipment 10...Work holding part 11...Index table 12...Chuck table 12c...Zucker part 13...Partition board 14...Movable support part 15...Fixed support part 20...Main unit 30...Column 31...Base 32…post 40...Rough grinding section 41...Rough grinding wheel 42, 52...Grinding mechanism 43, 53...Spindle feed mechanism 50…Precision grinding section 51...Precision grinding wheel 60...First Guide 61, 71...Guide section 62, 72...rail 70...Second Guide 80...1st tilt angle adjustment section 90…Second tilt angle adjustment section 91...Movable support part 92...Fixed support part 100...Control unit 102, 103...Memory 104, 105...Sensor 106...Index table control unit 107...Chuck table control unit 108... Grindstone rotation drive control unit 109...Tilt control unit B...bass C1~C3...Rotation axis V: vertical direction W…Work

Claims

1. a chuck table that rotatably supports a substantially disk-shaped workpiece; a grinding unit that rotatably holds a grinding wheel that grinds the workpiece; a chuck table support mechanism that is configured to support the chuck table and that supports the chuck table so that the tilt angle of the chuck table can be adjusted; a grinding unit support mechanism that is configured as a second support body that supports the grinding unit and supports the grinding unit so that the inclination angle of the grinding unit can be adjusted; Equipped with a processing apparatus in which the chuck table support mechanism and the grinding unit support mechanism are configured so that a direction of change in posture of the chuck table coincides with a direction of change in posture of the grinding unit;

2. the first support has a plurality of first support portions; The processing apparatus according to claim 1 , wherein a point of action of a resultant force of the support reaction forces of the plurality of first support portions is eccentric with respect to a rotation center of the chuck table.

3. The processing device according to claim 2, wherein the grinding unit and the chuck table are configured so that a point of action of the resultant force of the support reaction forces of the multiple support units is included in a portion of the processing area excluding both ends of the processing area including the arc-shaped portion where the grinding wheel contacts the workpiece.

4. the first support body has a plurality of first support portions, the second support member has a plurality of second support portions, The chuck table support mechanism and the grinding unit support mechanism are 2. The processing device according to claim 1, wherein the positions and support rigidity of the plurality of first support parts and the position and support rigidity of the second support parts are such that the attitude change direction of the chuck table coincides with the attitude change direction of the grinding part.

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