Substrate processing apparatus and abnormality determination method

Abstract

To provide a substrate processing apparatus and an abnormality determination method capable of suppressing damage to a substrate when the substrate is moved with respect to a container.SOLUTION: A substrate processing apparatus 10 includes: a pusher 210; a movement actuator 220; a load sensor 230; and a determination part 182a. The pusher 210 moves a substrate W in a movement direction. The movement actuator 220 moves the pusher 210 so that the substrate W moves between an accommodation position P1 and a non-accommodation position P2. A load sensor 230 detects a load of a component in the movement direction applied to the pusher 210. The determination part 182a determines that an abnormality has occurred when the change in the load detected by the load sensor 230 becomes a predetermined value or more in at least a part of a movement process in which the substrate W moves between the accommodation position P1 and the non-accommodation position P2.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and an abnormality determination method. [Background technology]

[0002] Substrate processing apparatuses for processing substrates are known. Substrate processing apparatuses are preferably used for processing semiconductor substrates. Typically, substrate processing apparatuses process substrates using a processing liquid. One such substrate processing apparatus is known to include an arm that contacts the substrate and moves the substrate relative to a storage container, and a movement actuator that moves the arm relative to the storage container (see, for example, Patent Document 1). Patent Document 1 describes a substrate processing apparatus that includes a storage container mounting section on which a storage container containing substrates is mounted, and a substrate transfer robot. The substrate transfer robot removes unprocessed substrates from the storage container and loads processed substrates into the storage container.

[0003] The storage container as described in Patent Document 1 has guide grooves that extend in the direction of movement of the substrate and support the edges of the substrate. The substrate is moved along the guide grooves to be taken in and out of the storage container. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-252122 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the substrate is carried into the storage container, the substrate may get caught on the edge of the guide groove, placing a load on the substrate. Also, if the guide groove has depressions and / or scratches due to wear, the substrate may get caught on the guide groove and place a load on the substrate when the substrate is put into or taken out of the storage container. When a load is placed on the substrate in this way, the substrate may be damaged.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and an abnormality determination method that can prevent damage to substrates when moving the substrates relative to a storage container. [Means for solving the problem]

[0007] According to one aspect of the present invention, a substrate processing apparatus includes an arm, a movement actuator, a load sensor, and a determination unit. The arm contacts a substrate and moves the substrate in a movement direction relative to a storage container. The movement actuator moves the arm in the movement direction relative to the storage container. The load sensor is connected to the arm. The storage container has a guide groove extending in the movement direction and capable of supporting an edge of the substrate. The movement actuator moves the arm so that the substrate moves in the movement direction between a storage position where the substrate is stored in the storage container and a non-storage position outside the storage container. The load sensor detects a load component of the movement direction acting on the arm. The determination unit monitors the load detected by the load sensor and determines that an abnormality has occurred if a change in the load detected by the load sensor exceeds a predetermined value during at least a portion of the movement process of the substrate between the storage position and the non-storage position.

[0008] In one embodiment, the arm has a contact portion that contacts an edge of the substrate in the movement direction to move the substrate in the movement direction.

[0009] In one embodiment, the substrate has a side edge located in a direction intersecting the movement direction, and the guide groove has an open end located at an end in a direction in which the substrate is carried out from the storage position to the unstorage position. The determination unit determines that an abnormality has occurred when a change in load detected by the load sensor becomes equal to or greater than the predetermined value during a predetermined period of time during the movement process, the period including a period in which the side edge of the substrate passes through the open end of the guide groove.

[0010] In one embodiment, the substrate has a side edge located in a direction intersecting the movement direction. The guide groove has an open end located at an end in a direction in which the substrate is removed from the storage position to the non-storage position. The movement actuator moves the arm at a first speed during a pre-passage period before a passing period in which the side edge of the substrate passes the open end of the guide groove during the movement process. The movement actuator moves the arm at a second speed slower than the first speed during the passing period.

[0011] In one embodiment, the judgment unit judges that an abnormality has occurred when the change in load detected by the load sensor becomes equal to or greater than the predetermined value during at least a portion of the movement process in which the substrate moves from the non-accommodated position to the accommodated position.

[0012] In one embodiment, with a substrate guide capable of receiving the substrate positioned opposite the movement direction relative to the storage container, the movement actuator moves the arm so that the substrate moves from the storage position to the non-storage position where it is received by the substrate guide, and the determination unit determines that an abnormality has occurred if the change in load detected by the load sensor becomes greater than or equal to the predetermined value during at least a portion of the movement process in which the substrate moves from the storage position to the non-storage position.

[0013] In one embodiment, the arm moves the substrate along the guide groove while keeping the substrate in contact with the guide groove.

[0014] According to another aspect of the present invention, a method for determining an abnormality includes a step of moving a substrate in a movement direction between a storage position where the substrate is stored in a storage container and a non-storage position outside the storage container, and a step of monitoring a load component in the movement direction applied to an arm that moves the substrate, and determining that an abnormality has occurred if a change in the load becomes equal to or exceeds a predetermined value during at least a portion of the movement process in which the substrate moves between the storage position and the non-storage position. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a substrate processing apparatus and an abnormality determination method that can prevent damage to a substrate when the substrate is moved relative to a container. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment. [Figure 2] 10 is a cross-sectional view schematically showing the structure of the surroundings of the storage container in the insertion section or the dispensing section. FIG. [Figure 3] FIG. 2 is a perspective view schematically illustrating a structure around a pusher. [Figure 4A] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4B] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4C] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4D] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4E] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4F] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4G]10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 4H] 10A and 10B are schematic diagrams for explaining an operation of replacing substrates with respect to a container by the substrate processing apparatus. [Figure 5] FIG. 2 is a block diagram of the substrate processing apparatus. [Figure 6] 10 is a diagram showing a flow of detecting an abnormality in an operation of replacing substrates with respect to a container by the substrate processing apparatus. FIG. [Figure 7] 10 is a diagram showing the moving speed of the pusher in the vertical movement range. FIG. [Figure 8] 10A and 10B are diagrams illustrating a load applied to a load sensor when a pusher is moved from a reference position to a top position. [Figure 9] 4D is a schematic view showing an example of a pusher and a guide groove of a second modified example, taken along the line 500-500 in FIG. 4B and the line 600-600 in FIG. 4D. FIG. [Figure 10] 4D is a schematic view showing another example of a pusher and a guide groove of the second modified example, taken along the line 500-500 in FIG. 4B and the line 600-600 in FIG. 4D. FIG. [Figure 11] FIG. 10 is a schematic plan view of the periphery of a pusher of the substrate processing apparatus according to the second embodiment, showing a state in which the substrate is placed at the non-accommodation position. [Figure 12] FIG. 10 is a schematic side view of a pusher of the substrate processing apparatus according to the second embodiment. [Figure 13] FIG. 10 is a schematic plan view of the periphery of a pusher of the substrate processing apparatus according to the second embodiment, showing a state in which the substrate is placed in the accommodation position. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of a substrate processing apparatus and an abnormality determination method according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. Typically, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0018] (First embodiment) A substrate processing apparatus 10 according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a schematic plan view of the substrate processing apparatus 10 of the first embodiment.

[0019] As shown in FIG. 1, the substrate processing apparatus 10 includes an input section 20, a plurality of storage containers 30, a transfer mechanism 40, a discharge section 50, a buffer unit BU, a transport device CTC, a transport device WTR, two drying devices 60, a plurality of substrate processing units 100, and a control device 180.

[0020] The substrate processing unit 100 processes the substrate W. The substrate processing unit 100 processes the substrate W by performing at least one of etching, surface treatment, oxidation treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0021] The substrate W is thin and plate-shaped. Typically, the substrate W is thin and approximately disk-shaped. Examples of the substrate W include semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0022] The substrate processing unit 100 is a batch-type substrate processing apparatus. The substrate processing unit 100 processes a plurality of substrates W in a batch. Typically, the substrate processing unit 100 processes a plurality of substrates W in lots. For example, one lot consists of 25 or 50 substrates W.

[0023] The plurality of substrate processing units 100 include a substrate processing unit 100A, a substrate processing unit 100B, and a substrate processing unit 100C. The two drying apparatuses 60, the substrate processing unit 100A, the substrate processing unit 100B, and the substrate processing unit 100C are arranged side by side in one direction. For example, the drying apparatus 60, the substrate processing unit 100A, the substrate processing unit 100B, and the substrate processing unit 100C are arranged adjacent to the transport path of the transport apparatus CTC in the following order from closest to the transport path of the transport apparatus CTC: the two drying apparatuses 60, the substrate processing unit 100A, the substrate processing unit 100B, and the substrate processing unit 100C.

[0024] Here, each of the substrate processing units 100A to 100C has a processing tank that stores a chemical liquid and a processing tank that stores a rinse liquid. Note that the substrate processing units 100A to 100C may each receive substrates W that have been subjected to different processes.

[0025] Each of the substrate processing units 100A to 100C includes a first processing bath 110A that stores a chemical liquid, a second processing bath 110B that stores a rinse liquid, and a substrate holding part 120. Here, the substrate holding part 120 included in each of the substrate processing units 100A to 100C may be referred to as substrate holding parts 120A to 120C.

[0026] The substrates W to be processed in the substrate processing unit 100 are loaded through an input section 20. The input section 20 includes a plurality of mounting tables 22. The substrates W processed in the substrate processing unit 100 are unloaded through an output section 50. The output section 50 includes a plurality of mounting tables 52.

[0027] Storage containers 30 containing substrates W are placed on the loading section 20 and the unloading section 50. Specifically, the storage containers 30 include an external storage container 31A for transporting the substrates W between other devices and the substrate processing apparatus 10, and an internal storage container 31B for transporting the substrates W within the substrate processing apparatus 10. The external storage container 31A and the internal storage container 31B are examples of the "storage container" in the present invention. The internal storage container 31B is, for example, a Front Opening Unified Pod (FOUP). In the following description, when it is not necessary to distinguish between the external storage container 31A and the internal storage container 31B, the external storage container 31A and the internal storage container 31B may be referred to as storage containers 30.

[0028] Each of the plurality of storage containers 30 stores a plurality of substrates W. In this embodiment, each substrate W is stored in the storage container 30 in, for example, a vertical position.

[0029] The external storage container 31A placed in the loading part 20 stores substrates W that have not been processed by the substrate processing unit 100. The substrates W in the external storage container 31A are transferred from the external storage container 31A to the internal storage container 31B in the loading part 20.

[0030] The internal storage container 31B placed on the unloading part 50 stores the substrates W processed by the substrate processing unit 100. The substrates W in the internal storage container 31B are transferred from the internal storage container 31B to the external storage container 31A in the unloading part 50. The unloading part 50 stores the processed substrates W in the external storage container 31A and unloads the external storage container 31A.

[0031] The buffer unit BU is disposed adjacent to the loading section 20 and the unloading section 50. The buffer unit BU takes in the intra-apparatus storage container 31B placed in the loading section 20 together with the substrates W, and places the intra-apparatus storage container 31B on a shelf (not shown). The buffer unit BU also receives the processed substrates W and stores them in the intra-apparatus storage container 31B, and places the intra-apparatus storage container 31B on the shelf. A transfer mechanism 40 is disposed within the buffer unit BU.

[0032] The transfer mechanism 40 transfers the intra-apparatus storage containers 31B between the loading section 20 and the unloading section 50 and the shelf. The transfer mechanism 40 also transfers only the substrates W to the transport device CTC. The transfer mechanism 40 also transfers one lot of substrates W to the transport device CTC.

[0033] The transport device CTC receives one lot of unprocessed substrates W from the transfer mechanism 40, and then passes the substrates W to the transport device WTR. Also, the transport device CTC receives one lot of processed substrates W from the transport device WTR, and then passes the substrates W to the transfer mechanism 40. Note that the transport device CTC may not be provided, and the transfer mechanism 40 and the transport device WTR may directly transfer the substrates W.

[0034] The transport device WTR is movable from the drying device 60 to the substrate processing unit 100C along the longitudinal direction of the substrate processing apparatus 10. The transport device WTR can transport one lot of substrates W into and out of the drying device 60, the substrate processing unit 100A, the substrate processing unit 100B, and the substrate processing unit 100C.

[0035] The control device 180 controls various operations of the substrate processing apparatus 10. The control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 has a processor. The control unit 182 has, for example, a central processing unit. Alternatively, the control unit 182 may have a general-purpose computer.

[0036] The storage unit 184 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0037] The storage unit 184 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 184 may also include removable media. The storage unit 184 corresponds to an example of a non-transitory computer-readable storage medium.

[0038] The storage unit 184 stores a computer program with predetermined procedures. The substrate processing unit 100 operates according to the procedures defined in the computer program. The control unit 182 executes the computer program stored in the storage unit 184 to perform substrate processing operations and a substrate replacement operation (described later). The processor of the control unit 182 executes the computer program stored in the storage unit 184 to control each part of the substrate processing apparatus 10.

[0039] Next, the insertion unit 20 and the dispensing unit 50 will be described with reference to Figures 2, 3, and 4A to 4H. Figure 2 is a cross-sectional view that schematically shows the structure around the storage container 30 in the insertion unit 20 or the dispensing unit 50. Note that the insertion unit 20 and the dispensing unit 50 have the same configuration, and therefore the insertion unit 20 and the dispensing unit 50 are depicted in a single drawing in Figure 2.

[0040] 2, the insertion unit 20 has a pusher 210, a movement actuator 220, and a load sensor 230. The pusher 210 is an example of the "arm" of the present invention.

[0041] The pusher 210 comes into contact with the substrate W to move the substrate W relative to the storage container 30. Specifically, the pusher 210 comes into contact with the periphery of the substrate W to move the substrate W relative to the storage container 30. In this embodiment, the pusher 210 moves the substrate W in the vertical direction. Note that in this embodiment, the vertical direction is an example of the "movement direction" of the present invention. The pusher 210 also supports the substrate W and moves it between a storage position P1 in which the substrate W is stored in the storage container 30 and a non-storage position P2 outside the storage container 30. In this embodiment, the non-storage position P2 is a position above the storage container 30 and above the storage position P1.

[0042] Further, a contact portion 211 that contacts the peripheral edge of the substrate W is provided at the tip of the pusher 210. The contact portion 211 contacts the vertical edge (here, downward) of the substrate W to move the substrate W in the vertical direction. The contact portion 211 is formed with a plurality of grooves 211a that extend in the Y direction and into which the edge of the substrate W is inserted.

[0043] The movement actuator 220 moves the pusher 210 relative to the storage container 30. In this embodiment, the movement actuator 220 moves the pusher 210 in the vertical direction. The movement actuator 220 also moves the pusher 210 so that the substrate W moves in the vertical direction between a storage position P1 where the substrate W is stored in the storage container 30 and a non-storage position P2 outside the storage container 30. In this embodiment, the movement actuator 220 moves the pusher 210 at a substantially constant speed.

[0044] The movement actuator 220 has a drive source and a moving member, and the drive source drives the moving member to move the pusher 210. The drive source includes, for example, a stepping motor. The moving member includes, for example, a rack and pinion or a ball screw.

[0045] 3 is a perspective view schematically showing the structure around the pusher 210. As shown in FIG. 3, the movement actuator 220 is connected to the pusher 210. Specifically, the pusher 210 has the above-mentioned contact portion 211 and shaft 212. The contact portion 211 extends in the arrangement direction of the plurality of substrates W (here, the X direction) and abuts against the plurality of substrates W. The shaft 212 extends in a direction intersecting the contact portion 211 (here, the vertical direction). The lower end of the shaft 212 is connected to the movement actuator 220.

[0046] The load sensor 230 is connected to the pusher 210. In this embodiment, the load sensor 230 is disposed between the contact portion 211 and the shaft 212 of the pusher 210. Alternatively, the contact portion 211 and the shaft 212 of the pusher 210 may be directly connected, and the load sensor 230 may be connected to the lower end of the shaft 212, for example.

[0047] Load sensor 230 detects the load component in the vertical direction (the direction of movement of pusher 210) applied to pusher 210. Load sensor 230 transmits the detection result to control unit 182. The type of load sensor 230 is not particularly limited, and for example, a strain gauge type, hydraulic type, or pneumatic type load cell can be used.

[0048] Continuing to refer to Fig. 2, the insertion unit 20 will be further described. As shown in Fig. 2, the movement actuator 220 is disposed below the mounting table 22. A through-hole 22a that penetrates the mounting table 22 in the vertical direction is formed at a position directly above the movement actuator 220.

[0049] When the movement actuator 220 moves the pusher 210 to the reference position (the position in FIG. 2), the contact portion 211 of the pusher 210 is positioned below the upper surface of the mounting table 22. The reference position is, for example, the lowest position within the movement range of the pusher 210.

[0050] On the other hand, when the movement actuator 220 moves the pusher 210 upward, the contact portion 211 of the pusher 210 protrudes upward from the through-hole 22a.

[0051] Next, the storage container 30 will be further described. The storage container 30 has four wall portions 31 that form a storage space for storing the substrates W, and a bottom portion 32 that connects the four wall portions 31. An opening for loading and unloading the substrates W is formed in the upper portion of the storage container 30. Of the four wall portions 31, two wall portions 31 that face each other in a direction (here, the Y direction) that intersects with the arrangement direction of the substrates W (here, the X direction) are formed on their inner surfaces with a plurality of guide grooves 311 that extend in the direction for loading and unloading the substrates W (here, the vertical direction). The guide grooves 311 have open ends 311a located at the end in the upward direction from the storage position P1 toward the non-storage position P2. The upward direction is an example of the "unloading direction" in the present invention. In addition, a restricting portion that restricts downward movement of the substrates W is provided at the lower end of the guide grooves 311.

[0052] The side edge Wa of the substrate W is inserted into the guide groove 311. The side edge Wa is a portion of the edge (periphery) of the substrate W that is located in a horizontal direction (here, the Y direction) that intersects the vertical direction. The horizontal direction is an example of the "intersecting direction" in the present invention. The guide groove 311 is capable of supporting the side edge Wa of the substrate W in the thickness direction of the substrate W. The guide groove 311 is also capable of supporting the side edge Wa of the substrate W in a direction (here, the Y direction) that intersects the vertical direction and the thickness direction. The multiple guide grooves 311 are formed at equal intervals along the arrangement direction of the substrates W (here, the X direction).

[0053] A through-hole 32a is formed in the center of the bottom 32. The through-hole 32a is located above the through-hole 22a of the mounting table 22. Therefore, when the movement actuator 220 moves the pusher 210 upward while the substrate W is accommodated in the storage container 30, the abutment portion 211 of the pusher 210 protrudes upward from the through-hole 22a and the through-hole 32a and can abut against the substrate W.

[0054] In this embodiment, a substrate holding guide 70 capable of receiving a substrate W is disposed at a position vertically opposite the storage container 30. Specifically, the substrate holding guide 70 that holds the substrate W is disposed above the storage container 30. The substrate processing apparatus 10 is equipped with a guide actuator 80 (see FIG. 5) that moves and drives the substrate holding guide 70. The guide actuator 80 has a drive source and a moving member, and the drive source drives the moving member to drive the substrate holding guide 70. The drive source includes, for example, a stepping motor. The moving member includes, for example, a rack and pinion or a ball screw. The substrate holding guide 70 is an example of a "substrate guide" in the present invention.

[0055] The substrate holding guide 70 holds a plurality of substrates W that have been moved upward from the storage container 30. Specifically, the substrate holding guide 70 has at least two wall portions 71. In this embodiment, the substrate holding guide 70 has two wall portions 71 and a lid portion 72 that connects the two wall portions 71. The two wall portions 71 and the lid portion 72 form a storage space that stores the substrates W.

[0056] The two wall portions 71 face each other in a direction (here, the Y direction) intersecting the arrangement direction of the substrates W. A plurality of guide grooves 711 extending in the direction (here, the vertical direction) in which the substrates W are inserted and removed are formed on the inner surfaces of the two wall portions 71. Each guide groove 711 has an open end 711a located at the end in the downward direction.

[0057] The side end portion Wa of the substrate W is inserted into the guide groove 711. The guide groove 711 is capable of supporting the side end portion Wa of the substrate W in the thickness direction of the substrate W. The guide groove 711 is also capable of supporting the side end portion Wa of the substrate W in the vertical direction and in a direction intersecting the thickness direction (here, the Y direction). The multiple guide grooves 711 are formed at equal intervals along the arrangement direction of the substrates W. The multiple guide grooves 711 are also formed at the same intervals as the multiple guide grooves 311. The multiple guide grooves 711 are also located directly above the multiple guide grooves 311.

[0058] The substrate holding guide 70 also has a support shaft 73 capable of supporting a lower portion of the substrate W. The support shaft 73 is driven by a guide actuator 80 to be movable between a retracted position P11, where the support shaft 73 is retracted from below the substrate W, and a support position P12, where the support shaft 73 is positioned below the substrate W and supports the substrate W. Note that in FIG. 2, the retracted position P11 of the support shaft 73 is depicted outward in the +Y direction relative to the wall 71, but the retracted position P11 may be, for example, a position inside a shaft accommodating recess (not shown) of the wall 71, or may be a position shifted in the X direction relative to the support position P12.

[0059] The substrate processing apparatus 10 also includes an exchange robot that exchanges the container 30 on the mounting table 22 .

[0060] Similar to the insertion unit 20, the dispensing unit 50 has a pusher 210, a moving actuator 220, and a load sensor 230. The moving actuator 220 is disposed below the mounting table 52. A through-hole 52a is formed in the mounting table 52 at a position directly above the moving actuator 220. The other configuration of the dispensing unit 50 is similar to that of the insertion unit 20, and therefore description thereof will be omitted.

[0061] Next, a method for transferring the substrates W from the external storage container 31A to the internal storage container 31B in the loading unit 20 will be described with reference to Figures 4A to 4H. Figures 4A to 4H are schematic diagrams for explaining the operation of transferring the substrates W to the storage container 30 by the substrate processing apparatus 10. Note that, for ease of understanding, the wall 31 extending in the Y direction of the storage container 30 is omitted in Figures 4A to 4H.

[0062] As shown in Fig. 4A, the mounting table 22 supports an external storage container 31A that stores a plurality of unprocessed substrates W. The guide actuator 80 (see Fig. 5) moves the substrate holding guide 70 above the external storage container 31A. At this time, the pusher 210 is located at the reference position (the position in Fig. 4A).

[0063] 4B, the movement actuator 220 (see FIG. 2) moves the pusher 210 upward from the reference position. As a result, the pusher 210 comes into contact with the lower end of the substrate W.

[0064] 4C, when the movement actuator 220 moves the pusher 210 further upward, the substrate W moves upward along the guide groove 311. Then, the side edge Wa of the substrate W reaches the open end 311a of the guide groove 311 and the open end 711a of the guide groove 711.

[0065] 4D, when the movement actuator 220 moves the pusher 210 further upward, the substrate W moves upward along the guide groove 711. Then, the substrate W reaches the non-accommodation position P2. Then, the movement actuator 220 stops the movement of the pusher 210. Note that the non-accommodation position P2 is a position within the substrate holding guide 70.

[0066] 4E, the guide actuator 80 moves the support shaft 73 from the retracted position P11 to the support position P12. As a result, the substrate W is supported by the support shaft 73, and the downward movement of the substrate W is restricted by the support shaft 73.

[0067] 4F, the movement actuator 220 moves the pusher 210 to the reference position. An exchange robot (not shown) exchanges the external storage container 31A on the mounting table 22 with an internal storage container 31B. Specifically, the exchange robot moves the external storage container 31A, from which the substrates W have been removed by the pusher 210, from the mounting table 22 to another shelf or the like. Then, the exchange robot places the internal storage container 31B, which does not store the substrates W, on the mounting table 22.

[0068] 4G, with the substrate W supported by the support shaft 73, the movement actuator 220 moves the pusher 210 upward from the reference position. As a result, the abutment portion 211 of the pusher 210 abuts against the substrate W and supports the substrate W. Then, the guide actuator 80 moves the support shaft 73 from the support position P12 to the retracted position P11.

[0069] As shown in Fig. 4H, the movement actuator 220 moves the pusher 210 to the reference position. As a result, the substrate W moves from the non-accommodation position P2 to the accommodation position P1. Specifically, the substrate W moves downward along the guide groove 711 of the substrate holding guide 70, and then moves downward along the guide groove 311 of the intra-apparatus accommodation container 31B. Then, after the substrate W reaches the accommodation position P1, the pusher 210 moves to the reference position.

[0070] In this way, the transfer of the substrates W from the external storage container 31A to the internal storage container 31B is completed. Note that the operation of transferring the substrates W from the internal storage container 31B to the external storage container 31A in the discharging unit 50 is the same as that described above, and therefore description thereof will be omitted.

[0071] Next, the substrate processing apparatus 10 will be further described with reference to Fig. 5. Fig. 5 is a block diagram of the substrate processing apparatus 10. A control unit 182 of the control device 180 controls the delivery mechanism 40, the transport device CTC, the transport device WTR, the drying device 60, the substrate processing unit 100, the movement actuator 220, the guide actuator 80, and the exchange robot (not shown).

[0072] The control unit 182 has a determination unit 182a. The determination unit 182a monitors the load detected by the load sensor 230. The determination unit 182a also determines whether or not an abnormality has occurred during at least a portion of the movement process in which the substrate W moves between the accommodation position P1 and the non-accommodation position P2. Specifically, the determination unit 182a determines that an abnormality has occurred when a change in the load detected by the load sensor 230 exceeds a predetermined value. In this embodiment, the determination unit 182a determines whether or not an abnormality has occurred during the entire period of the movement process.

[0073] The predetermined value may or may not be constant. The predetermined value may be set, for example, based on the number of substrates W moved by the pusher 210, the material, diameter, and thickness of the substrates W. The predetermined value may be set, for example, based on the initial load when the pusher 210 supports the substrates W.

[0074] When the control unit 182 determines that an abnormality has occurred, it stops the movement of the pusher 210 by the movement actuator 220. In addition to stopping the movement of the pusher 210 by the movement actuator 220, the control unit 182 may also notify the occurrence of the abnormality by an alarm unit (not shown) such as a display panel, speaker, or lamp.

[0075] Next, referring to Fig. 6, an abnormality detection flow in the operation of the substrate processing apparatus 10 to replace the substrate W with respect to the storage container 30 will be described. Fig. 6 is a diagram showing an abnormality detection flow in the operation of the substrate processing apparatus 10 to replace the substrate W with respect to the storage container 30. Here, an abnormality detection flow in the operation of replacing the substrate W at the loading part 20 will be described. Note that, in the abnormality detection flow, parts that overlap with the content explained using Figs. 4A to 4H may be omitted from the explanation. Steps S1 and S5 are examples of the "moving step" of the present invention. Steps S2 and S6 are examples of the "determining step" of the present invention.

[0076] As shown in FIG. 6, in step S1, the control unit 182 controls the movement actuator 220 to start moving the pusher 210 upward.

[0077] In step S2, the determination unit 182a of the control unit 182 determines whether or not the change in the load detected by the load sensor 230 has reached a predetermined value or more. In other words, the determination unit 182a determines whether or not an abnormality has occurred.

[0078] In step S2, if the change in the load detected by the load sensor 230 becomes equal to or greater than a predetermined value, the determination unit 182a determines that an abnormality has occurred. Specifically, if the substrate W gets caught in the guide groove 311 of the storage container 30 or the guide groove 711 of the substrate holding guide 70, the load detected by the load sensor 230 changes significantly. If the change in the load detected by the load sensor 230 becomes equal to or greater than a predetermined value, the determination unit 182a determines that an abnormality has occurred. Then, the process proceeds to step S20.

[0079] In step S20, the control unit 182 controls the movement actuator 220 to stop the movement of the pusher 210.

[0080] On the other hand, if the change in the load detected by the load sensor 230 is less than the predetermined value in step S2, the pusher 210 continues to move until the substrate W reaches the non-accommodation position P2.

[0081] In step S3, the control unit 182 controls the movement actuator 220 to stop the upward movement of the pusher 210.

[0082] Next, in step S4, the control unit 182 controls an exchange robot (not shown) to exchange the external storage container 31A with the internal storage container 31B.

[0083] Next, in step S5, the control unit 182 controls the movement actuator 220 to start the downward movement of the pusher 210 supporting the substrate W. Specifically, first, the control unit 182 controls the movement actuator 220 to move the pusher 210 upward to support the substrate W. Thereafter, the control unit 182 controls the movement actuator 220 to start the downward movement of the pusher 210.

[0084] In step S6, the determination unit 182a of the control unit 182 determines whether the change in the load detected by the load sensor 230 has reached or exceeded a predetermined value.

[0085] In step S6, if the change in the load detected by the load sensor 230 is equal to or greater than a predetermined value, the determination unit 182a determines that an abnormality has occurred. If the change in the load detected by the load sensor 230 is equal to or greater than a predetermined value, the determination unit 182a determines that an abnormality has occurred. Then, the process proceeds to step S20.

[0086] On the other hand, if the change in the load detected by the load sensor 230 is less than the predetermined value in step S6, the pusher 210 continues to move until the substrate W reaches the accommodation position P1.

[0087] In step S7, the control unit 182 controls the movement actuator 220 to stop the downward movement of the pusher 210.

[0088] The abnormality detection flow in the substrate W replacement operation in the dispensing section 50 is the same as that described above, and therefore will not be described here.

[0089] In this embodiment, as described above, the load sensor 230 detects the component of the load applied to the pusher 210 in the movement direction (vertical direction). The determination unit 182a determines that an abnormality has occurred if the change in the load detected by the load sensor 230 becomes equal to or greater than a predetermined value during the movement process of the substrate W between the accommodation position P1 and the non-accommodation position P2. Therefore, if the substrate W gets caught on an end or recess of the guide groove 311 when the substrate W is put into or taken out of the accommodation container 30, the load sensor 230 detects the load applied to the substrate W, and the determination unit 182a can determine that an abnormality has occurred based on the detection result of the load sensor 230. This makes it possible to prevent the substrate W from being damaged.

[0090] Specifically, as described above, for example, when the determination unit 182a determines that an abnormality has occurred, the movement of the pusher 210 is stopped, thereby preventing damage to the substrate W during movement. Furthermore, for example, when the determination unit 182a determines that an abnormality has occurred, the occurrence of the abnormality is notified to the user, so that even if the substrate W is not damaged this time, the user can know that an abnormality has occurred in the substrate processing apparatus 10 and can inspect the apparatus. This makes it possible to prevent abnormalities from occurring in the next and subsequent times. Therefore, it is possible to prevent damage to the substrate W in the next and subsequent times.

[0091] Furthermore, as described above, the pusher 210 has the abutment portion 211 that abuts against the edge of the substrate W in the vertical direction (movement direction) to move the substrate W in the vertical direction. Therefore, the abutment portion 211 makes it possible to easily move the substrate W in the vertical direction.

[0092] Furthermore, as described above, the determination unit 182a determines that an abnormality has occurred when the change in load detected by the load sensor 230 becomes equal to or greater than a predetermined value during the movement process of the substrate W from the non-accommodation position P2 to the accommodation position P1. When the substrate W is moved from the non-accommodation position P2 to the accommodation position P1, the substrate W is likely to get caught on the open end 311a of the guide groove 311. For this reason, it is particularly effective to determine whether or not an abnormality has occurred when the substrate W is moved from the non-accommodation position P2 to the accommodation position P1.

[0093] Furthermore, as described above, with the substrate holding guide 70 capable of receiving the substrate W positioned facing the storage container 30 in the vertical direction (movement direction), the movement actuator 220 moves the pusher 210 so as to move the substrate W from the storage position P1 to the non-storage position P2 where the substrate W is received by the substrate holding guide 70. Therefore, the determination unit 182a can determine whether or not the substrate W has become caught (an abnormality has occurred) in the guide groove 311 of the storage container 30 and / or the guide groove 711 of the substrate holding guide 70.

[0094] (First Modification) Next, a substrate processing apparatus 10 according to a first modified example of the first embodiment will be described with reference to Fig. 7. Unlike the first embodiment, the first modified example describes an example in which the movement speed of the pusher 210 caused by the movement actuator 220 is changed during the process of moving the substrate W. Fig. 7 is a diagram showing the movement speed of the pusher 210 within its movement range in the up and down direction.

[0095] 7, the pusher 210 is moved at the fastest speed between the reference position (the position in FIG. 4A) and the contact position (the position in FIG. 4B). For example, when the pusher 210 moves from the reference position to the contact position, the movement speed of the pusher 210 increases from zero to the maximum speed and then to a first speed that is slower than the maximum speed.

[0096] The pusher 210 is then moved at a first speed between the contact position (position in FIG. 4B ) and the substrate transfer area. The substrate transfer area is the height range of the pusher 210 when the side end Wa of the substrate W is transferred between the storage container 30 and the substrate holding guide 70. The substrate transfer area is also the height range of the pusher 210 when, for example, the side end Wa of the substrate W overlaps with the open end 311 a of the guide groove 311 or the open end 711 a of the guide groove 711. For example, when the pusher 210 moves from the contact position to the substrate transfer area, the movement speed of the pusher 210 is maintained at the first speed and then decelerated just before the substrate transfer area to a second speed slower than the first speed.

[0097] That is, the substrate transfer area corresponds to a period (hereinafter sometimes referred to as a passing period) in which the side edge Wa of the substrate W passes through the open end 311a of the guide groove 311 and the open end 711a of the guide groove 711. The movement actuator 220 moves the pusher 210 at a first speed in a pre-passing period (between the contact position and the substrate transfer area) before the passing period.

[0098] Thereafter, the pusher 210 is moved through the substrate transfer area at a second speed. That is, the movement actuator 220 moves the pusher 210 at a second speed slower than the first speed during the passing period.

[0099] The pusher 210 is then moved at a first speed between the substrate transfer area and the uppermost position (the position in FIG. 4D ). The uppermost position is the highest position within the movement range of the pusher 210. For example, when the pusher 210 moves from the substrate transfer area to the uppermost position, the movement speed of the pusher 210 changes from the second speed to the first speed, maintains the first speed, and then decelerates to zero just before the uppermost position.

[0100] In the first modified example, unlike the first embodiment, the determination unit 182a determines whether or not an abnormality has occurred during a portion of the movement process of the substrate W. Specifically, the determination unit 182a determines whether or not a change in the load detected by the load sensor 230 has reached a predetermined value or more during a predetermined period of time, including a period during which the side end Wa of the substrate W passes through the open end 311a of the guide groove 311 during the movement process. The predetermined period is, for example, a period from a certain point in time during which the side end Wa of the substrate W is moving along the guide groove 311 to a certain point in time during which the side end Wa of the substrate W is moving along the guide groove 711. The determination unit 182a determines that an abnormality has occurred when a change in the load detected by the load sensor 230 has reached a predetermined value or more during the predetermined period of time.

[0101] The pusher 210 may also be moved at the moving speed shown in FIG. 7 when moving from the uppermost position to the lowermost position.

[0102] Next, the load detected by the load sensor 230 will be described with reference to Fig. 8. Here, the case where the pusher 210 moves from the reference position to the uppermost position will be described. Fig. 8 is a diagram showing the load applied to the load sensor 230 when the pusher 210 is moved from the reference position to the uppermost position.

[0103] 8, the pusher 210 starts moving upward from the reference position, and at time t1, the pusher 210 reaches the contact position and comes into contact with the substrate W. When the pusher 210 comes into contact with the substrate W, the load sensor 230 receives a reaction force from the substrate W and detects a load Q1.

[0104] Thereafter, as the substrate W moves linearly at a constant speed, the load sensor 230 is subjected to a load of approximately the same magnitude as the gravity acting on the substrate W. Therefore, the load sensor 230 detects a substantially constant load Q2 that is smaller than the load Q1.

[0105] After the pusher 210 reaches the uppermost position, the support shaft 73 of the substrate holding guide 70 supports the substrate W, and the detection value of the load sensor 230 becomes zero.

[0106] In the first modified example, the predetermined value used by the determining unit 182a to determine whether or not an abnormality has occurred is not particularly limited, but is, for example, a value smaller than Q1-Q2.

[0107] In the first modified example, as described above, the determination unit 182a determines that an abnormality has occurred when the change in the load detected by the load sensor 230 exceeds a predetermined value during a predetermined period of the movement process, including the passing period. Therefore, the determination unit 182a can determine whether an abnormality has occurred during the period excluding the period during which the load sensor 230 detects the load Q1. This makes it possible to easily improve the accuracy of the determination by the determination unit 182a.

[0108] Furthermore, as described above, the movement actuator 220 moves the pusher 210 at a first speed during the pre-passage period before the passing period during the movement process, and moves the pusher 210 at a second speed slower than the first speed during the passing period. In the substrate transfer area corresponding to the passing period, for example, the substrate W is likely to get caught on the open end 711a of the guide groove 711. Therefore, by slowing down the movement speed during the passing period, it is possible to reduce the load on the substrate W and shorten the time from when an abnormality is determined until the pusher 210 stops.

[0109] The other configurations and other effects of the first modified example are similar to those of the first embodiment.

[0110] (Second Modification) Next, a substrate processing apparatus 10 according to a second modified example of the first embodiment will be described with reference to Figures 9 and 10. Unlike the first embodiment and the first modified example, the second modified example describes an example in which the substrate W is moved while being in contact with the guide grooves 311 and 711.

[0111] In the second modified example, the pusher 210 moves the substrate W while keeping it in contact with the guide groove 311 of the storage container 30 and the guide groove 711 of the substrate holding guide 70. At this time, the pusher 210 moves the substrate W while keeping it in contact with the guide groove 311 throughout the entire period that the substrate W moves along the guide groove 311. Furthermore, the pusher 210 moves the substrate W while keeping it in contact with the guide groove 711 throughout the entire period that the substrate W moves along the guide groove 711.

[0112] FIG. 9 is a schematic diagram showing an example of pusher 210, guide groove 311, and guide groove 711 of the second modified example, taken along line 500-500 in FIG. 4B and line 600-600 in FIG. 4D. FIG. 10 is a schematic diagram showing another example of pusher 210, guide groove 311, and guide groove 711 of the second modified example, taken along line 500-500 in FIG. 4B and line 600-600 in FIG. 4D. Note that guide groove 311 and guide groove 711 have similar structures, and therefore guide groove 311 and guide groove 711 are shown in a single diagram in FIGS. 9 and 10. While the relationship between pusher 210 and guide groove 311 will be described below, the same applies to the relationship between pusher 210 and guide groove 711.

[0113] 9, the pusher 210 may be positioned so that the center of the groove 211a in the X direction is shifted in the +X direction from the center of the guide groove 311 in the X direction. With this configuration, the substrate W tilts upward in the -X direction. The side edge Wa of the substrate W comes into contact with the inner surface S311 of the guide groove 311 in the -X direction.

[0114] 10, the groove 211a of the pusher 210 may have a pair of inner surfaces S21 facing each other in the X direction, and the pair of inner surfaces S21 may be inclined upward in the −X direction. With this configuration, the substrate W is inclined upward in the −X direction. The side edge Wa of the substrate W comes into contact with the inner surface S311 of the guide groove 311 facing the −X direction.

[0115] In the second modified example, as described above, the pusher 210 moves the substrate W along the guide grooves 311 and 711 while bringing the substrate W into contact with the guide grooves 311 and 711. Therefore, the load that the substrate W receives from the guide grooves 311 and 711 can be kept substantially constant. Specifically, for example, compared to when the substrate W repeatedly comes into contact with and separates from the guide grooves 311 and 711, the change in the load that the substrate W receives from the guide grooves 311 and 711 can be made smaller. This can improve the accuracy of the determination by the determination unit 182a.

[0116] The other configurations and other effects of the second modified example are similar to those of the first embodiment and the first modified example.

[0117] (Second embodiment) Next, a substrate processing apparatus 10 according to a second embodiment of the present invention will be described with reference to FIGS. 11 to 13. In the second embodiment, unlike the first embodiment, the first modified example, and the second modified example, an example will be described in which the substrate W is moved in a horizontal direction. Note that in this embodiment, the substrate processing apparatus 10 is a single-sheet type substrate processing apparatus. FIG. 11 is a schematic plan view of the periphery of a pusher 210 of the substrate processing apparatus 10 of the second embodiment, showing a state in which the substrate W is arranged at the non-accommodation position P2. FIG. 12 is a schematic side view of the pusher 210 of the substrate processing apparatus 10 of the second embodiment. FIG. 13 is a schematic plan view of the periphery of the pusher 210 of the substrate processing apparatus 10 of the second embodiment, showing a state in which the substrate W is arranged at the accommodation position P1.

[0118] 11, in the second embodiment, the substrate W is arranged in a horizontal position. In the second embodiment, the storage container 30 stores the substrate W in a horizontal position. Note that in this embodiment, a substrate holding guide 70 for holding the substrate W is not provided.

[0119] The pusher 210 supports the substrate W in a horizontal position and moves the substrate W in the horizontal direction. In this embodiment, the pusher 210 comes into contact with the lower surface of the substrate W and moves the substrate W in the horizontal direction relative to the storage container 30. In this embodiment, the pusher 210 moves the substrates W one by one.

[0120] 11 and 12, the contact portion 211 of the pusher 210 has a generally plate-like shape. The contact portion 211 has an upper surface 211b facing the lower surface of the substrate W, and support protrusions 211c protruding upward from the upper surface 211b. For example, a plurality of support protrusions 211c (three in this example) are provided, and support the lower surface of the substrate W.

[0121] The contact portion 211 also has a restricting portion 211d and a restricting portion 211e that protrude upward beyond the support protrusion 211c. The restricting portion 211d is provided at the tip end of the contact portion 211, and the restricting portion 211e is provided at the base end of the contact portion 211. The restricting portion 211d and the restricting portion 211e are provided at a predetermined distance from each other in the movement direction of the substrate W (here, the X direction). The predetermined distance is a distance slightly larger than the diameter of the substrate W.

[0122] The restricting portions 211d and 211e are positioned to sandwich the substrate W in the movement direction of the substrate W. The restricting portions 211d and 211e come into contact with the edges of the substrate W and restrict movement of the substrate W relative to the pusher 210 in the X direction.

[0123] In the second embodiment, the opening of the container 30 for inserting and removing the substrate W faces the horizontal direction (here, the -X direction). The guide grooves 311 extend in the movement direction of the substrate W (here, the X direction). In the second modified example, the X direction is an example of the "movement direction" in the present invention.

[0124] For example, in this embodiment, with the pusher 210 supporting the substrate W (the state in FIG. 11), the movement actuator 220 moves the pusher 210 in the horizontal direction (here, the +X direction) from the reference position (the position in FIG. 11). As a result, the abutment portion 211 of the pusher 210 moves the substrate W from the non-accommodation position P2 to the accommodation position P1 (see FIG. 13). At this time, the substrate W is moved from the opening of the accommodation container 30 into the interior of the accommodation container 30, and then moves horizontally along the guide groove 311.

[0125] Then, the movement actuator 220 slightly moves the pusher 210 downward (-Z direction). As a result, the substrate W changes from being supported by the pusher 210 to being supported by the guide groove 311. In addition, the restricting portions 211d and 211e are moved to a height lower than the lower surface of the substrate W.

[0126] Thereafter, the movement actuator 220 moves the pusher 210 to the outside of the storage container 30. As a result, the pusher 210 returns to the reference position.

[0127] In this manner, the substrate W is accommodated in the accommodation container 30. When the substrate W is to be removed from the accommodation container 30, the pusher 210 is operated in the reverse order to the above-described operation.

[0128] Other configurations of the second embodiment are similar to those of the first embodiment, the first modified example, and the second modified example.

[0129] In the second embodiment, as described above, the substrate W is moved in the horizontal direction. In this case, too, the load sensor 230 detects the load component in the movement direction (here, the X direction) applied to the pusher 210, and the determination unit 182a determines whether or not an abnormality has occurred, thereby detecting the occurrence of an abnormality. Therefore, damage to the substrate W can be prevented.

[0130] Other effects of the second embodiment are similar to those of the first embodiment, the first modified example, and the second modified example.

[0131] The embodiments and modifications of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and modifications, and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments and modifications. For example, some components may be omitted from all components shown in the embodiments and modifications. Furthermore, components from different embodiments and modifications may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each illustrated component may differ from the actual components due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments and modifications are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0132] For example, in the first modified example, an example has been described in which the movement speed of the pusher 210 is changed and the presence or absence of an abnormality is determined during part of the movement process of the substrate W, but the present invention is not limited to this. For example, the movement speed of the pusher 210 may be changed and the presence or absence of an abnormality may be determined during the entire period of the movement process of the substrate W. Alternatively, the movement speed of the pusher 210 may be kept constant and the presence or absence of an abnormality may be determined during part of the movement process of the substrate W.

[0133] Furthermore, for example, in the first modified example, an example was described in which the predetermined value as a threshold value was set to a constant value, but the present invention is not limited to this. For example, the predetermined value may be set to a value greater than the load Q1 during the period in which the load sensor 230 detects the load Q1. In other words, the predetermined value may be changed depending on the position of the pusher 210. For example, when determining whether or not an abnormality has occurred during the entire period of the movement process, as in the first embodiment, changing the predetermined value depending on the position of the pusher 210 is particularly effective.

[0134] In the above embodiment, an example has been described in which a load cell is used as a load sensor, but the present invention is not limited to this. For example, a piezoelectric type, a capacitance type, or a film laminate type load sensor may be used.

[0135] 9 and 10 are used to describe two methods for moving the substrate W while keeping it in contact with the guide grooves 311 and 711. However, the present invention is not limited to these. The substrate W may be moved while keeping it in contact with the guide grooves 311 and 711 by a method other than those shown in FIGS. 9 and 10.

[0136] In the above embodiment and modified examples, an example of an arm has been described in which the pusher 210 having the abutment portion 211 that abuts against the edge of the substrate W in the movement direction is used, but the present invention is not limited to this. For example, when moving the substrate W in the horizontal direction, a plate-shaped arm that moves the substrate W by adsorbing the lower surface of the substrate W may be used.

[0137] Furthermore, in the above embodiment and modified example, an example has been described in which it is determined that an abnormality has occurred when the change in load detected by the load sensor 230 exceeds a predetermined value. However, the present invention is not limited to this. For example, the determination unit 182a may further determine whether the cumulative value of the load detected by the load sensor 230 and / or the cumulative value of the change in load detected by the load sensor 230 exceeds a predetermined value. This configuration makes it possible to detect the progression of wear in the guide groove 311 or the guide groove 711. In other words, it is possible to replace the storage container 30 or the substrate holding guide 70 before depressions and / or scratches caused by wear in the guide groove 311 or the guide groove 711 become larger. [Industrial Applicability]

[0138] The present invention is suitably used in a substrate processing apparatus and an abnormality determination method. [Explanation of symbols]

[0139] 10: Substrate processing equipment 30: Storage container 31A: External storage container (storage container) 31B: Storage container in the device (storage container) 70: PCB holding guide (PCB guide) 182a: Judgment section 210: Pusher (arm) 211: Contact part 220: Moving actuator 230: Load sensor 311: Guide groove 311a: Open end P1: Storage position P2: Uncontained position S1, S5: Step (moving process) S2, S6: Steps (judging process) W: Substrate Wa: Side edge

Claims

1. an arm that contacts the substrate and moves the substrate in a movement direction relative to the container; a movement actuator that moves the arm in the movement direction relative to the container; a load sensor connected to the arm; Judgment section and Equipped with the container has a guide groove that extends in the movement direction and is capable of supporting an end of the substrate; the movement actuator moves the arm so that the substrate moves in the movement direction between a storage position where the substrate is stored in the storage container and a non-storage position outside the storage container; the load sensor detects a component of a load applied to the arm in the movement direction; The determination unit monitors the load detected by the load sensor, and determines that an abnormality has occurred if the change in the load detected by the load sensor exceeds a predetermined value during at least a portion of the movement process in which the substrate moves between the accommodation position and the non-accommodation position.

2. The substrate processing apparatus according to claim 1 , wherein the arm has a contact portion that contacts an edge of the substrate in the movement direction to move the substrate in the movement direction.

3. the substrate has a side edge located in a direction intersecting the moving direction, the guide groove has an open end located at an end in a conveying direction from the storage position toward the non-storage position, 3. The substrate processing apparatus according to claim 1, wherein the determination unit determines that an abnormality has occurred when a change in the load detected by the load sensor becomes equal to or greater than the predetermined value during a predetermined period of the movement process, the period including a passing period during which the side end of the substrate passes through the open end of the guide groove.

4. the substrate has a side edge located in a direction intersecting the moving direction, the guide groove has an open end located at an end in a conveying direction from the storage position toward the non-storage position, The movement actuator is During the movement process, the arm is moved at a first speed in a pre-passing period before a passing period in which the side edge of the substrate passes through the open end of the guide groove; 3. The substrate processing apparatus according to claim 1, wherein the arm is moved at a second speed slower than the first speed during the passing period.

5. 3. The substrate processing apparatus according to claim 1, wherein the determination unit determines that an abnormality has occurred when a change in load detected by the load sensor becomes equal to or greater than the predetermined value during at least a portion of the movement process in which the substrate moves from the non-accommodation position to the accommodation position.

6. a substrate guide capable of receiving the substrate is disposed opposite the container in the movement direction; the movement actuator moves the arm so that the substrate moves from the storage position to the non-storage position received by the substrate guide; 3. The substrate processing apparatus according to claim 1, wherein the determination unit determines that an abnormality has occurred when a change in load detected by the load sensor becomes equal to or greater than the predetermined value during at least a portion of the movement process in which the substrate moves from the accommodation position to the non-accommodation position.

7. 3. The substrate processing apparatus according to claim 1, wherein the arm moves the substrate along the guide groove while keeping the substrate in contact with the guide groove.

8. a step of moving the substrate in a movement direction between a storage position where the substrate is stored in a storage container and a non-storage position outside the storage container; monitoring a load component in the movement direction applied to an arm that moves the substrate, and determining that an abnormality has occurred when a change in the load exceeds a predetermined value during at least a part of the movement process in which the substrate moves between the accommodation position and the non-accommodation position; An abnormality determination method comprising:

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