Machining apparatus

Abstract

To provide a machining apparatus capable of preventing contamination from adhering, particularly to the surface of a bellows and / or a water case.SOLUTION: A machining apparatus 1 comprises: a chuck table 10 for holding a workpiece; a cutting unit for cutting the workpiece by means of a cutting blade; a cutting water supply nozzle for supplying cutting water 26 to the cutting blade and the workpiece; an X-axis moving unit for moving the chuck table 10; a bellows 7 that prevents the cutting water 26 from entering the X-axis moving unit; and a water case 50 disposed on an outer periphery of the chuck table 10 to receive the cutting water 26. Surfaces of the bellows 7 and the water case 50 have a first coating layer 81 having a hydrophobic property on an upstream side on which the cutting water 26 flows, and a second coating layer 82 having a hydrophilic property on a downstream side on which the cutting water 26 flows.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Silicon wafers (hereinafter simply referred to as workpieces) have multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) formed on their surface. After the back surface is ground to a predetermined thickness, the wafer is divided into individual devices using a cutting machine and used in electrical equipment such as mobile phones and personal computers.

[0003] A known cutting device is used to divide the workpiece into individual devices. The cutting device includes a chuck table for holding the workpiece, a spindle, a cutting blade attached to the tip of the spindle, and a moving means for moving the chuck table in the X-axis direction. The cutting blade is positioned outside the outer periphery of the workpiece and at a predetermined height from the chuck table, and the cutting blade and the chuck table are moved relative to each other to cut the workpiece. By repeating this process, the workpiece is divided into individual devices (see, for example, Patent Document 1).

[0004] Furthermore, cutting water is supplied to the cutting blade during cutting, and a bellows is provided to prevent the cutting water from entering the X-axis movement mechanism of the cutting device or other parts of the device, and a water case is provided in the movement area of ​​the chuck table to receive the cutting water from the bellows (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 09-139362 [Patent Document 2] Japanese Patent Application Laid-Open No. 2002-103177 Summary of the Invention [Problem to be solved by the invention]

[0006] The cutting water used in cutting processes contains contaminants (also known as grinding chips) from the workpiece. The contaminant-containing cutting water then flows from the bellows into the water case. The contaminants then adhere to and accumulate on the surface of the bellows, the bottom and inner walls of the water case.

[0007] Accumulated contamination can fly off and adhere to the workpiece, so the inside of the water case needs to be cleaned periodically.Until now, the operator has to stop the cutting machine and clean it manually.

[0008] An object of the present invention is to provide a processing device that can prevent contamination from adhering to the surfaces of the bellows and / or water case in particular. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention is a processing apparatus comprising at least a chuck table for holding a workpiece, a spindle, a processing unit for processing the workpiece held on the chuck table by a processing tool attached to the tip of the spindle, a cutting water supply unit for supplying cutting water to the processing tool and the workpiece, a moving unit for moving the chuck table, bellows fixed to both sides in the direction of movement of the chuck table, covering the movement path of the chuck table and preventing the cutting water from entering the moving unit, and a water case arranged on the outer periphery of the chuck table for receiving the cutting water supplied when processing the workpiece, and is characterized in that the surface of the bellows and / or the water case has a first coating layer that is hydrophobic on the upstream side along which the cutting water flows and a second coating layer that is hydrophilic on the downstream side along which the cutting water flows.

[0010] In the processing device, the first coating layer may be formed so that the area of ​​the first coating layer decreases from the upstream side to the downstream side.

[0011] In the processing device, the first coating layer may be formed by a plurality of coating layers. [Effects of the Invention]

[0012] The present invention has the effect of preventing contamination from adhering to the surfaces of the bellows and / or water case in particular. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view schematically showing a chuck table, a partially cutaway water case, a bellows, and the like of the processing apparatus shown in FIG. [Figure 3] FIG. 3 is a plan view schematically showing the chuck table, the water case, the bellows, etc. shown in FIG. [Figure 4] FIG. 4 is a plan view schematically showing the water case and the like shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view schematically showing an example of the configuration of the processing apparatus according to the first embodiment. Fig. 2 is a perspective view schematically showing a chuck table, a partially cutaway water case, a bellows, etc. of the processing apparatus shown in Fig. 1. Fig. 3 is a plan view schematically showing the chuck table, the water case, the bellows, etc. shown in Fig. 2. Fig. 4 is a plan view schematically showing the water case, etc. shown in Fig. 3.

[0016] (Workpiece) The processing apparatus 1 according to the first embodiment is a cutting apparatus that cuts a workpiece 200. The workpiece 200 to be processed by the processing apparatus 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, which has a base material such as silicon, gallium arsenide, SiC (silicon carbide), or sapphire. The workpiece 200 has devices 203 formed in areas partitioned in a grid pattern by a plurality of planned dividing lines 202 formed in a grid pattern on a surface 201.

[0017] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), or various types of memory (semiconductor memory device).

[0018] Furthermore, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thin central portion and a thick peripheral portion, or may be a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, a glass substrate, etc. In embodiment 1, the workpiece 200 has an adhesive tape 206 attached to a back surface 204 on the back side of the front surface 201, and is supported by the annular frame 205.

[0019] (Processing equipment) 1 is a cutting device that holds a workpiece 200 on a chuck table 10 and cuts it along a planned division line 202 with a cutting blade 21, which is a processing means. As shown in FIG. 1, the processing device 1 includes the chuck table 10 that holds the workpiece 200 by suction on a holding surface 11, a cutting unit 20 that cuts the workpiece 200 held on the chuck table 10 with the cutting blade 21 while supplying cutting water, an imaging unit 30 that takes an image of the workpiece 200 held on the chuck table 10, and a control unit 100.

[0020] 1, the processing apparatus 1 also includes a moving unit 40 that moves the chuck table 10 and the cutting unit 20 relative to one another. The moving unit 40 includes at least an X-axis moving unit 41 (corresponding to a moving unit) that is a processing feed unit that processes and feeds the chuck table 10 in the X-axis direction, which is a cutting direction parallel to the horizontal direction, a Y-axis moving unit 42 that is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 43 that is a cutting feed unit that cuts and feeds the cutting unit 20 in the Z-axis direction, which is parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction.

[0021] The X-axis moving unit 41 moves the moving plate 4 (shown in FIG. 2) that supports the chuck table 10 and the rotational moving unit 44 in the X-axis direction, which is the processing feed direction, thereby processing-feeding the chuck table 10 and the cutting unit 20 relatively along the X-axis direction. In the first embodiment, the X-axis moving unit 41 is a moving unit that is installed on the device main body 2 and moves the chuck table 10 back and forth in the X-axis direction, which is the cutting direction.

[0022] The Y-axis movement unit 42 is mounted on a support frame 3 erected from the device main body 2, and moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, thereby indexing and feeding the chuck table 10 and the cutting unit 20 relatively along the Y-axis. The Z-axis movement unit 43 is mounted on a second movement plate 5 which is movable in the Y-axis direction by the Y-axis movement unit 42, and moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, thereby feeding the chuck table 10 and the cutting unit 20 relatively along the Z-axis. The rotation movement unit 44 is disposed on the movement plate 4.

[0023] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 each include a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the chuck table 10 or the cutting unit 20 movably in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 44 is installed on the moving plate 4 and includes a well-known motor for rotating the chuck table 10 about its axis.

[0024] The chuck table 10 is disk-shaped, and a holding surface 11 that holds the workpiece 200 is formed from porous ceramic or the like. The chuck table 10 is provided so as to be movable in the X-axis direction by an X-axis movement unit 41, with the movable plate 4 being movable between a processing region below the cutting unit 20 and a carry-in / out region that is spaced from below the cutting unit 20 and through which the workpiece 200 is carried in and out. The chuck table 10 is supported by a rotary movement unit 44, and is provided so as to be rotatable by the rotary movement unit 44 about an axis parallel to the Z-axis direction.

[0025] The chuck table 10 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suck and hold the workpiece 200 placed on the holding surface 11. In the first embodiment, the chuck table 10 sucks and holds the back surface 204 of the workpiece 200 via adhesive tape 206. Also, as shown in FIG. 1, a plurality of clamp units 12 that clamp an annular frame 205 are provided around the periphery of the chuck table 10. Note that in the present invention, the adhesive tape 206 does not have to be attached to the workpiece 200, and the workpiece 200 may be held directly by the chuck table 10, and the chuck table 10 does not have to be disk-shaped.

[0026] The cutting unit 20 is a processing unit that cuts a workpiece 200 held on the chuck table 10 using a spindle 22 and a cutting blade 21, which is a processing tool attached to the tip of the spindle 22. The cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis moving unit 42 relative to the workpiece 200 held on the chuck table 10, and is also provided so as to be movable in the Z-axis direction by a Z-axis moving unit 43.

[0027] 1, the cutting unit 20 is mounted on a support frame 3 that stands upright on the device main body 2 via a Y-axis moving unit 42, a Z-axis moving unit 43, etc. The cutting unit 20 is capable of positioning the cutting blade 21 at any position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0028] The cutting unit 20 comprises a cutting blade 21, a spindle 22 to which the cutting blade 21 is attached at its tip, a spindle housing 23 that is movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 42 and a Z-axis moving unit 43, and a blade cover 24 that is attached to the tip of the spindle housing 23 and covers the outer periphery of the cutting blade 21.

[0029] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. In the first embodiment, the cutting blade 21 is a so-called hub blade that includes an annular circular base and an annular cutting edge that is disposed on the outer periphery of the circular base and cuts the workpiece 200. The cutting edge is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. The cutting edge of the cutting blade 21 wears when cutting the workpiece 200. Note that in the present invention, the cutting blade 21 may be a so-called washer blade that is composed only of a cutting edge.

[0030] The spindle 22 rotates about its axis by a spindle motor provided in a spindle housing 23, thereby rotating the cutting blade 21. The spindle housing 23 supports the spindle 22 so that it can rotate about its axis, and incorporates a spindle motor (not shown) that rotates the spindle 22 about its axis.

[0031] The axes of the cutting blade 21 and spindle 22 of the cutting unit 20 are set parallel to the Y-axis direction. The cutting unit 20 cuts the workpiece 200 with the cutting blade 21 fixed to the tip of the spindle 22, which rotates around its axis.

[0032] The processing device 1 also includes a cutting water supply nozzle 25, which is a cutting water supply unit that supplies cutting water 26 (shown in FIG. 3) to the cutting blade 21 and the workpiece 200 held on the chuck table 10. The cutting water supply nozzle 25 is attached to the blade cover 24 described above, and supplies cutting water 26 from a cutting water supply source to the lower end of the cutting edge of the cutting blade 21, thereby supplying cutting water 26 to the cutting blade 21 and the workpiece 200.

[0033] The imaging unit 30 is fixed to the spindle housing 23 of the cutting unit 20 so as to move integrally with the cutting unit 20. The imaging unit 30 is equipped with an imaging element that captures an image of an area to be divided of the workpiece 200 held on the chuck table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the workpiece 200 held on the chuck table 10 to obtain an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0034] The machining apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit may be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the chuck table 10 in the X-axis direction and the position of the lower end of the cutting blade of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100.

[0035] In the first embodiment, the positions of the chuck table 10 and cutting unit 20 of the processing device 1 in the X-axis direction, Y-axis direction, and Z-axis direction are determined based on a predetermined reference position (not shown). In the first embodiment, the reference position of the cutting unit 20 in the Z-axis direction is the position where the holding surface 11 of the chuck table 10 and the lower end of the cutting edge of the cutting blade 21 are located on the same plane.

[0036] As shown in FIG. 3, the processing apparatus 1 also includes a water case 50 disposed on the outer periphery of the chuck table 10 in the X-axis direction movement region of the chuck table 10. The water case 50 receives the cutting water 26 used when cutting the workpiece 200. As shown in FIG. 2, the water case 50 is disposed on the X-axis movement unit 41 installed on the apparatus main body 2 so as to surround the periphery of the X-axis direction movement path of the chuck table 10, and is formed in a frame shape with its longitudinal direction parallel to the X-axis direction. Because the water case 50 is formed in a frame shape, an opening 55 is formed inside. The X-axis movement unit 41 is disposed below the inside of the opening 55, and the chuck table 10, including the rotational movement unit 44, is disposed within the opening 55 for free movement. Note that FIG. 2 shows a cutaway portion of the water case 50 on the front side of the drawing.

[0037] The water case 50 is formed in a gutter shape and includes a frame-shaped bottom wall 56 having an opening 55 formed on the inside and a longitudinal direction parallel to the X-axis direction, an inner wall 57 erected from the inner edge of the bottom wall 56, and an outer wall 58 erected from the outer edge of the bottom wall 56. The water case 50 receives contamination and cutting water 26 generated during cutting between the bottom wall 56, the inner wall 57, and the outer wall 58.

[0038] The water case 50 also has a pair of long portions 51 parallel to the X-axis direction, which is the cutting direction (also the movement direction) of the chuck table 10, and short portions 52 connecting both ends of the long portions 51. The long portions 51 of the water case 50 are arranged at both ends in the Y-axis direction of the movement path along which the chuck table 10 moves in the X-axis direction, and the short portions 52 are arranged at both ends in the X-axis direction of the movement path along which the chuck table 10 moves in the X-axis direction. The long portions 51 are composed of a bottom wall 56, an inner wall 57, and an outer wall 58.

[0039] The short side 52 at the rear side in Figure 2, i.e., the processing area side, is composed only of outer walls 58 connecting the inner walls 57 and the outer walls 58 of the long parts 51, while the short side 52 at the front side in Figure 2, i.e., the loading / unloading area side, is composed of a bottom wall 56 connecting the bottom walls 56 of the long parts 51, an inner wall 57 connecting the inner walls 57 of the long parts 51, and an outer wall 58 connecting the outer walls 58 of the long parts 51.

[0040] The water case 50 is also provided with a drain outlet 53 (shown in FIG. 2) for discharging the received cutting water 26 to the outside. In the first embodiment, the drain outlet 53 is provided at the end of the water case 50 near the loading / unloading area in the X-axis direction and at the end of one of the long sides 51, and is connected to a waste liquid tank (not shown) for discharging the cutting water 26 received in the waste liquid tank.

[0041] In the first embodiment, the water case 50 having the above-described configuration flows the received cutting water 26 along the X-axis direction on the bottom wall 56 of the long portion 51, in the direction of arrow 301 in Fig. 2, from the machining area toward the loading / unloading area. In the first embodiment, the water case 50 having the above-described configuration flows the received cutting water 26 along the Y-axis direction on the bottom wall 56 of the short portion 52 on the front side in Fig. 2, i.e., the loading / unloading area side, in the direction of arrow 302, in the direction toward the drain outlet 53. Hereinafter, the arrows 301 and 302 will be referred to as the flow direction of the cutting water 26.

[0042] As shown in Figure 2, the processing device 1 also includes a table cover 6 attached to the outer peripheral surface of the rotational movement unit 44 and covering the periphery of the chuck table 10, and a pair of bellows 7 attached to the table cover 6 and the outer wall 58 of the short portion 52 at the rear side of the water case 50 in Figure 2 and the inner wall 57 of the short portion 52 at the front side in Figure 2, thereby blocking the inner opening 55 of the water case 50 and arranged parallel to the X-axis direction.

[0043] Each bellows 7 is expandable and contractible in the X-axis direction, with one end attached to the table cover 6 and an outer wall 58 of the short side 52 at the rear side of the water case 50 in Figure 2, and the other end attached to the table cover 6 and an inner wall 57 of the short side 52 at the front side of the water case 50 in Figure 2, so that the bellows 7 are disposed on both sides in the X-axis direction of the chuck table 10. In this way, the bellows 7 are fixed to both sides in the X-axis direction, which is the direction of movement of the chuck table 10.

[0044] Bellows 7 covers opening 55 inside water case 50 and covers the movement path of chuck table 10. Bellows 7 prevents cutting water 26 from entering opening 55 inside water case 50, which is inside the device, and prevents cutting water 26 from entering X-axis movement unit 41. Bellows 7 is flexible and bendable, and bends as chuck table 10 moves, allowing chuck table 10 to move in the X-axis direction.

[0045] In the first embodiment, the bellows 7 having the above-described configuration causes the cutting water 26 on the surface to flow along the above-described direction 302 in which the cutting water 26 flows.

[0046] The bellows 7 has a base material made of a resin such as polycarbonate, and is formed by alternately folding back peaks 71 and valleys 72, with inclined surfaces 73 (corresponding to surfaces) inclined with respect to the Z-axis direction formed between them. The peaks 71 and valleys 72 extend linearly parallel to the Y-axis direction. In the first embodiment, as shown in FIGS. 2 and 3 , the bellows 7 has a film-like second coating layer 82 laminated on the inclined surfaces 73. The second coating layer 82 has higher hydrophilicity with respect to cutting water than a first coating layer 81 (described later). The second coating layer 82 is laminated on the entire surfaces of all of the inclined surfaces 73 of the bellows 7.

[0047] In addition, in the first embodiment, the bellows 7 has a first coating layer 81 in the form of a film that is more hydrophobic to the cutting water 26 than the second coating layer 82 laminated on the second coating layer 82 on the inclined surface 73. The first coating layer 81 is formed on a part of each inclined surface 73, and is formed so that its width gradually narrows from the upstream side to the downstream side in the direction 302 in which the cutting water 26 flows on each inclined surface 73.

[0048] In this way, the first coating layer 81 is formed so that the area of ​​the first coating layer 81 gradually decreases from the upstream side to the downstream side in the direction 302 in which the cutting water 26 flows on each inclined surface 73. Furthermore, the first coating layer 81 is formed on a part of each inclined surface 73, so that a plurality of first coating layers 81 are formed on the bellows 7.

[0049] 3, the first coating layer 81 is provided over the entire length of the inclined surface 73 in the X-axis direction at the upstream end of each inclined surface 73 in the direction 302 in which the cutting water 26 flows, and has a triangular planar shape such that the width in the X-axis direction gradually narrows toward the downstream side in the direction 302 in which the cutting water 26 flows. Also, in the first embodiment, the first coating layer 81 is formed from the upstream end of each inclined surface 73 in the direction 302 in which the cutting water 26 flows to the center of the direction 302 in which the cutting water 26 flows, and is not formed at the downstream end of each inclined surface 73 in the direction 302 in which the cutting water 26 flows. Thus, in embodiment 1, the processing device 1 has, on the inclined surface 73 of the bellows 7, a first coating layer 81 that is hydrophobic with respect to the cutting water 26 on the upstream side of the direction 302 in which the cutting water 26 flows, and a second coating layer 82 that is hydrophilic with respect to the cutting water 26 on the downstream side of the direction 302 in which the cutting water 26 flows.

[0050] 4, in the water case 50 of the first embodiment, a film-like second coating layer 82 that is more hydrophilic with respect to cutting water than a first coating layer 81 (described later) is laminated on a surface 561 of the bottom wall 56 of the longitudinal portion 51. The second coating layer 82 is laminated over the entire surface 561 of the bottom wall 56 of the longitudinal portion 51.

[0051] In the first embodiment, the water case 50 has a first coating layer 81 in the form of a film that is more hydrophobic to cutting water than the second coating layer 82 laminated on the second coating layer 82 on the surface 561 of the bottom wall 56 of the longitudinal portion 51. The first coating layer 81 is formed on part of the surface 561 of the bottom wall 56 of the longitudinal portion 51, and is formed so that its width gradually narrows from the upstream side to the downstream side on the surface 561 of the bottom wall 56 of the longitudinal portion 51 in the direction 301 in which the cutting water 26 flows.

[0052] In this way, the first coating layer 81 is formed on the surface 561 of the bottom wall 56 of the longitudinal portion 51 so that the area of ​​the first coating layer 81 gradually decreases from the upstream side to the downstream side in the flow direction 301 of the cutting water 26. Furthermore, in the first embodiment, the first coating layer 81 is formed on the surface 561 of the bottom wall 56 of the longitudinal portion 51 in multiple lines (three lines in the first embodiment) with the longitudinal direction parallel to the X-axis direction.

[0053] 4, in the first embodiment, the first coating layer 81 is provided over the entire length of the surface 561 of the bottom wall 56 of each long portion 51 in the Y-axis direction at the upstream end of the surface 561 of the bottom wall 56 of each long portion 51 in the direction 301 in which the cutting water 26 flows, with multiple first coating layers 81 combined to form a triangular planar shape so that the width in the Y-axis direction gradually narrows toward the downstream side in the direction 301 in which the cutting water 26 flows. Also, in the first embodiment, the first coating layer 81 is formed from the upstream end of the surface 561 of the bottom wall 56 of each long portion 51 in the direction 301 in which the cutting water 26 flows to the center of the direction 301 in which the cutting water 26 flows, but is not formed at the downstream end of the surface 561 of the bottom wall 56 of each long portion 51 in the direction 301 in which the cutting water 26 flows.

[0054] Thus, in the first embodiment, the processing device 1 has a first coating layer 81 that is hydrophobic with respect to the cutting water 26 on the upstream side of the direction 301 in which the cutting water 26 flows, and a second coating layer 82 that is hydrophilic with respect to the cutting water 26 on the downstream side of the direction 301 in which the cutting water 26 flows, on the surface 561 of the bottom wall 56 of the long portion 51 of the water case 50. Note that the coating layers 81, 82 on the surface 561 of the bottom wall 56 of the long portion 51 of the water case 50 are omitted in Figures 2 and 3.

[0055] The control unit 100 controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0056] The control unit 100 is connected to a display unit (not shown) configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit (not shown) that an operator uses to register machining conditions, etc. The input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

[0057] (Machining operation) When starting the processing operation of the processing device 1, the operator registers the processing conditions in the control unit 100 and places the workpiece 200 before cutting on the holding surface 11 of the chuck table 10 in the carry-in / out area. Thereafter, the processing device 1 starts the processing operation when the control unit 100 receives an instruction to start the processing operation from the operator. When starting the processing operation, the processing device 1 suction-holds the back surface 204 side to the holding surface 11 of the chuck table 10 via the adhesive tape 206, and clamps the annular frame 205 with the clamp unit 12.

[0058] In the machining operation, the X-axis moving unit 41 of the machining device 1 moves the chuck table 10 toward the machining area, the imaging unit 30 photographs the workpiece 200, and alignment is performed based on the image captured by the imaging unit 30. The machining device 1 moves the workpiece 200 and the cutting unit 20 relatively along the planned division lines 202 while rotating the cutting blade 21 around its axis, and cuts the cutting blade 21 into each planned division line 202 while supplying cutting water 26 from the cutting water supply nozzle 25, thereby dividing the workpiece 200 into individual devices 203.

[0059] The processing device 1 receives contamination, cutting water 26, and the like generated by the cutting process in a water case 50. After cutting all of the planned division lines 202 of the workpiece 200 and dividing the workpiece 200 into individual devices 203, the processing device 1 moves the workpiece 200 divided into individual devices 203 toward the loading / unloading area, and releases the suction holding of the holding surface 11 and the clamping of the clamping unit 12 in the loading / unloading area, thereby completing the processing operation.

[0060] Furthermore, in the machining operation, because the aforementioned coating layers 81, 82 are formed on the inclined surface 73 of the bellows 7, the cutting water 26 containing contaminants on the bellows 7 flows along the flow direction 302 of the cutting water 26 toward the long portion 51 of the water case 50 in which the drain outlet 53 is provided, as shown in Fig. 3, and is received by the long portion 51 of the water case 50 in which the drain outlet 53 is provided. In the machining operation, because the aforementioned coating layers 81, 82 are formed on the surface 561 of the bottom wall 56 of the long portion 51, the cutting water 26 containing contaminants received in the long portion 51 of the water case 50 flows along the flow direction 301 of the cutting water 26 toward the drain outlet 53, as shown in Fig. 4, and also flows from the long portion 51 on the front side in Fig. 2 through the short portion 52 on the front side in Fig. 2 toward the drain outlet 53. The processing device 1 discharges the contaminant-containing cutting water 26 received in the water case 50 from the drain outlet 53 into a waste liquid tank.

[0061] As described above, the processing apparatus 1 of embodiment 1 forms coating layers 81, 82 as described above on the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the longitudinal portion 51 of the water case 50, making it easier for the cutting water 26 to flow along the inclined surface 73 of the bellows 7 in the flow direction 302, and also easier for the cutting water 26 to flow along the surface 561 of the bottom wall 56 of the longitudinal portion 51 in the flow direction 301.

[0062] For this reason, in the processing apparatus 1 of embodiment 1, the cutting water 26 containing contamination is more likely to flow toward the drain outlet 53, rather than remaining on the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the longitudinal part 51 of the water case 50, and as a result, adhesion of contamination to the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the longitudinal part 51 of the water case 50 can be suppressed.

[0063] As a result, the processing apparatus 1 according to the first embodiment has the effect of preventing contamination from adhering particularly to the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the longitudinal portion 51 of the water case 50.

[0064] The present invention is not limited to the above-described embodiment. That is, various modifications can be made without departing from the gist of the present invention. In the present invention, the processing device 1 is not limited to a cutting device that cuts the workpiece 200, but may also be a grinding device that grinds the workpiece 200, a polishing device that polishes the workpiece 200, or a tool cutting device that cuts the workpiece 200 with a tool. In this case, the processing tool is a grinding wheel, a polishing wheel, or a tool cutting tool.

[0065] Furthermore, in the first embodiment, the processing device 1 forms coating layers 81, 82 on both the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the long portion 51 of the water case 50. However, in the present invention, it is sufficient for the processing device 1 to form coating layers 81, 82 on at least one of the inclined surface 73 of the bellows 7 and the surface 561 of the bottom wall 56 of the long portion 51 of the water case 50. [Explanation of symbols]

[0066] 1 Processing equipment 7. Bellows 10 Chuck table 20 Cutting unit (processing unit) 21 Cutting blade (processing tool) 22 Spindle 25 Cutting water supply nozzle (cutting water supply unit) 26 Cutting water 41 X-axis moving unit (moving unit) 50 Water Case 73 Inclined surface (surface) 81 First coating layer 82 Second Coating Layer 200 Workpiece 561 Surface

Claims

1. A processing device, a chuck table for holding the workpiece; a spindle; and a processing unit that processes the workpiece held on the chuck table by a processing tool attached to the tip of the spindle; a cutting water supply unit for supplying cutting water to the machining tool and the workpiece; a moving unit that moves the chuck table; bellows fixed to both sides of the chuck table in the moving direction, covering the moving path of the chuck table and preventing the cutting water from entering the moving unit; a water case disposed on the outer periphery of the chuck table for receiving the cutting water supplied when the workpiece is machined; At least The bellows and / or the water case have a first coating layer having hydrophobic properties on the upstream side where the cutting water flows, and a second coating layer having hydrophilic properties on the downstream side where the cutting water flows. A processing device having the above structure.

2. The first coating layer is formed so that the area of ​​the first coating layer decreases from the upstream side to the downstream side. The processing device according to claim 1.

3. The first coating layer is formed by a plurality of coating layers.

3. The processing device according to claim 1 or 2.

Images