Multilayer substrate and electronic apparatus

Abstract

To provide a multilayer substrate in which deformation of a step part and a crack in the vicinity of a reinforcement material part are suppressed, and an electronic apparatus comprising the multilayer substrate.SOLUTION: A multilayer substrate 101 comprises a resin laminate 10 configured by laminating a plurality of resin layers including a resin layer in which a conductor pattern is formed. The resin laminate 10 includes a first area A1 and a second area A2, which is continued to the first area A1, as areas of the resin laminate 10 in a layer direction. When a thickness of the resin laminate 10 in the first area A1 is expressed as T1 and a thickness of the resin laminate 10 in the second area A2 is expressed as T2, the thicknesses are in the relation of T1<T2. The multilayer substrate 101 includes: a first reinforcement material part 11 which is continuously joined to a top face of the resin laminate 10 in the first area A1 and a side face of the resin laminate 10 in the second area A2; and a second reinforcement material part 12 which is continuously joined to a top face T2 of the resin laminate 10 in the first area A1 and a surface of the first reinforcement material part 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed, and to an electronic device including the multilayer substrate. [Background technology]

[0002] Patent Document 1 discloses a multilayer substrate having a first region and a second region that have different thicknesses in the stacking direction due to a difference in the number of resin layers stacked.

[0003] In this way, when the number of laminated resin layers differs between the first region and the second region, a step portion is formed at the boundary between the first region and the second region. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-16743 Summary of the Invention [Problem to be solved by the invention]

[0005] In a multilayer board having a resin laminate formed by stacking multiple resin layers, including a resin layer on which a conductor pattern is formed, a multilayer board having a first region and a second region with different thicknesses in the stacking direction is required depending on the positional relationship of each conductor pattern and the usage form.

[0006] If the thin region is referred to as the first region and the thick region as the second region, the step between the first region and the second region becomes more likely to deform.

[0007] By providing a reinforcing resin having a higher Young's modulus than the resin layer at the inner corner of the step, a reinforcing resin portion is formed, thereby suppressing deformation at the step of the multilayer substrate.

[0008] However, due to the deformation of the multilayer substrate, stress concentrates on the reinforcing resin portion, so there is a risk that cracks may mainly occur between the reinforcing resin portion and the resin layer.

[0009] Therefore, an object of the present invention is to provide a multilayer substrate that suppresses deformation of the step portion and cracks in the vicinity of the reinforcing material portion, and an electronic device including the multilayer substrate.

Means for Solving the Problems

[0010] (1) A multilayer substrate as an example of the present disclosure is a multilayer substrate including a resin laminate formed by laminating a plurality of resin layers in which conductor patterns are formed, the resin laminate has a first region and a second region continuous with the first region as layer direction regions of the resin laminate, <​​​​​​​​​​​​​​​​​​a first reinforcing material portion made of a first resin, which fills the third region of the resin laminate and is continuously joined to an upper surface of the first region of the resin laminate and a side surface of the second region of the resin laminate; a second reinforcing material portion made of a second resin and continuously bonded to a surface of the first region of the resin laminate and a surface of the first reinforcing material portion; The present invention is characterized by comprising: [Effects of the Invention]

[0012] According to the present invention, it is possible to obtain a multilayer substrate in which deformation of a step portion and cracks near a reinforcing resin portion are suppressed, and an electronic device including the multilayer substrate. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a partial cross-sectional view of a multilayer substrate 101 according to the first preferred embodiment. [Figure 2] FIG. 2 is a partial plan view of the multilayer substrate 101 according to the first preferred embodiment. [Figure 3] FIG. 3 is a partial cross-sectional view of a multilayer substrate 102 according to the second embodiment. [Figure 4] FIG. 4 is a partial cross-sectional view of a multilayer substrate 103A according to the third preferred embodiment. [Figure 5] FIG. 5 is a partial cross-sectional view of another multilayer substrate 103B according to the third preferred embodiment. [Figure 6] FIG. 6 is a partial cross-sectional view of a multilayer substrate 104 according to the fourth embodiment. [Figure 7] FIG. 7 is a partial cross-sectional view of a multilayer substrate 105A according to the fifth preferred embodiment. [Figure 8] FIG. 8 is a partial cross-sectional view of a multilayer substrate 105B according to the fifth preferred embodiment. [Figure 9] The upper part of Fig. 9 is a cross-sectional view of the multilayer substrate 106 according to the sixth embodiment before bending, and the lower part of Fig. 9 is a cross-sectional view of the multilayer substrate 106 according to the sixth embodiment after bending. [Figure 10] FIG. 10 is a partial cross-sectional view of a multilayer substrate 107 according to the seventh preferred embodiment. [Figure 11] FIG. 11 is a partial cross-sectional view of a multilayer substrate 108 according to the eighth embodiment. [Figure 12] FIG. 12 is a partial cross-sectional view of a multilayer substrate 109 according to the ninth embodiment. Embodiments for Carrying Out the Invention

[0014] Hereinafter, a plurality of embodiments for carrying out the present invention will be shown by giving some specific examples with reference to the drawings. The same reference numerals are assigned to the same parts in each drawing. Considering the explanation of the gist or ease of understanding, the embodiments are shown separately for convenience of explanation in a plurality of embodiments, but partial omission, substitution, or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only the different points will be described. In particular, the same operational effects due to the same configuration will not be sequentially mentioned for each embodiment.

[0015] <<First Embodiment>> In the first embodiment, a multilayer substrate provided with a patch antenna will be exemplified.

[0016] FIG. 1 is a partial cross-sectional view of a multilayer substrate 101 according to the first embodiment. FIG. 2 is a partial plan view of the multilayer substrate 101 according to the first embodiment. FIG. 1 is a partial cross-sectional view taken along the dashed-dotted line in FIG. 2.

[0017] The multilayer substrate 101 includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers in which conductor patterns are formed. In FIG. 1, the interfaces of two resin layers adjacent in the layer direction are not shown. This non-illustration of the layer interfaces is the same in each of the embodiments shown hereinafter.

[0018] The resin laminate 10 has a first region A1 as a layer direction region (region in the stretching direction in which the layer is formed) of the resin layer and a second region A2 continuous with the first region A1. When the thickness of the resin laminate 10 in the first region A1 is represented by T1 and the thickness of the resin laminate 10 in the second region A2 is represented by T2, they are in the relationship of T1 < T2.

[0019] As a result, a step is formed at the boundary between the first region A1 and the second region A2. A first reinforcing material portion 11 is provided at the inner corner of the step. This first reinforcing material portion 11 is continuously bonded to the top surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10. The first reinforcing material portion 11 is made of a first resin.

[0020] A second reinforcing material portion 12 is formed on the upper surface TS of the first region A1 of the resin laminate 10 and on the surface of the first reinforcing material portion 11. This second reinforcing material portion 12 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the surface of the first reinforcing material portion 11. The second reinforcing material portion 12 is made of a second resin.

[0021] If the Young's modulus of the resin layer is represented by E10, the Young's modulus of the first reinforcing material portion 11 is represented by E11, and the Young's modulus of the second reinforcing material portion is represented by E12, then the relationships are E11 > E10 and E11 > E12. For example, the Young's modulus E10 of the resin layer is 4 GPa, the Young's modulus E11 of the first reinforcing material portion 11 is 7 GPa, and the Young's modulus E12 of the second reinforcing material portion 12 is 2.7 GPa. For example, the resin layer is made of a liquid crystal polymer resin, the first reinforcing material portion 11 is made of an epoxy resin, and the second reinforcing material portion 12 is made of a polyimide resin.

[0022] Young's modulus can be determined by conducting a nanoindenter test in accordance with the standards of JIS Z 2255 and ISO 14577. For example, it can be determined from load-displacement data using a KLA Micro Nanoindenter device.

[0023] Here, because of the relationship E11>E10, the inner corner of the step at the boundary between the first region A1 and the second region A2 is reinforced by the first reinforcing material portion 11. This suppresses deformation of the step in the multilayer substrate 101. Furthermore, because of the relationship E11>E12, the base portion 11R1 of the first reinforcing material portion 11 (the end portion of the first reinforcing material portion 11 that joins to the top surface TS of the first region A1 of the resin laminate 10) is reinforced by the second reinforcing material portion 12. This prevents cracks at or near the joining boundary surface between the first reinforcing material portion 11 and the resin laminate 10.

[0024] Furthermore, as described above, the second reinforcing material portion 12 is made of an elastic material such as polyimide resin, which allows the second reinforcing material portion 12 to follow the deformation of the first region A1 of the resin laminate 10 and cover the bonding interface between the first reinforcing material portion 11 and the resin laminate 10, thereby preventing the resin laminate 10 from breaking.

[0025] A radiation electrode RE is formed on the upper surface of the second region A2 of the resin laminate 10. A terminal electrode TE is formed on the upper surface TS of the first region A1 of the resin laminate 10. A ground conductor layer GL is formed on the lower surface BS of the resin laminate 10.

[0026] A signal line conductor pattern SL is formed inside the resin laminate 10. This signal line conductor pattern SL is a conductor pattern formed in one of the multiple resin layers.

[0027] Furthermore, interlayer connection conductors V1 and V2 are formed inside the resin laminate 10. The interlayer connection conductor V1 extends in the stacking direction of the resin layers in the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL to the radiation electrode RE. The interlayer connection conductor V2 extends in the stacking direction and electrically connects the other end of the signal line conductor pattern SL to the terminal electrode TE.

[0028] The signal line conductor pattern SL, the ground conductor layer GL, and the resin layer between the signal line conductor pattern SL and the ground conductor layer GL form a microstrip line, which connects the terminal electrode TE and the radiation electrode RE at high frequency via the microstrip line.

[0029] The radiation electrode RE, the ground conductor layer GL, and the resin laminate 10 form a patch antenna.

[0030] 1, the thickness T1 of the first region A1 of the resin laminate 10 is thinner than the thickness T2 of the second region A2, so the XY plane of the first region A1 can be easily bent around an axis parallel to the Y axis relative to the second region A2. Even if such bending stress is intentionally generated, deformation of the stepped portion of the multilayer substrate 101 and cracks at or near the bonding interface between the first reinforcing material portion 11 and the resin laminate 10 are prevented.

[0031] In the example shown in Fig. 2, a plurality of radiating electrodes RE are arranged in an array, and an array antenna is formed from a plurality of patch antennas. The directivity of the antenna is determined by controlling or setting the phase of the transmission signal radiated from each radiating electrode RE or the reception signal received by each radiating electrode RE. Note that the terminal electrode TE shown in Fig. 1 is not shown in Fig. 2.

[0032] According to this embodiment, a multilayer substrate is obtained in which deformation of the step portion and cracks near the reinforcing material portion are suppressed. Furthermore, since the multilayer substrate in this embodiment is provided with the radiating electrode RE, it is possible to suppress changes in the antenna directivity due to displacement of the radiating electrode RE.

[0033] Second Embodiment In the second embodiment, a multilayer substrate having a first region, a second region, and a third region as layer direction regions of a resin laminate will be exemplified.

[0034] FIG. 3 is a partial cross-sectional view of a multilayer substrate 102 according to the second embodiment.

[0035] The multilayer substrate 102 includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer on which a conductor pattern is formed.

[0036] The resin laminate 10 has, as a layer-directional region of the resin laminate 10, a first region A1, a second region A2, and a third region A3 that is a region between the first region A1 and the second region A2. When the thickness of the resin laminate 10 in the first region A1 is represented by T1, the thickness of the resin laminate 10 in the second region A2 is represented by T2, and the thickness of the resin laminate 10 in the third region A3 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.

[0037] As a result, a groove-shaped recess is formed at the boundary between the first region A1 and the second region A2 by the third region A3.

[0038] The multilayer substrate 102 includes a first reinforcing member portion 11 that fills the third region A3 of the resin laminate 10 and is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10. The first reinforcing member portion 11 is made of a first resin.

[0039] A second reinforcing member portion 12 is formed on the upper surface TS of the first region A1 of the resin laminate 10 and the surface of the first reinforcing member portion 11. The second reinforcing member portion 12 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the surface of the first reinforcing member portion 11. The second reinforcing member portion 12 is made of a second resin.

[0040] When the Young's modulus of the resin layer is represented by E10, the Young's modulus of the first reinforcing member portion 11 is represented by E11, and the Young's modulus of the second reinforcing member portion is represented by E12, similar to the example shown in the first embodiment, they are in the relationship of E11 > E10, E11 > E12. For example, the Young's modulus E10 of the resin layer is 4 GPa, the Young's modulus E11 of the first reinforcing member portion 11 is 7 GPa, and the Young's modulus E12 of the second reinforcing member portion 12 is 2.7 GPa. For example, the resin layer is a liquid crystal polymer resin, the first reinforcing member portion 11 is an epoxy resin, and the second reinforcing member portion 12 is a polyimide resin.

[0041] According to this embodiment, the presence of the third region A3 filled with the first reinforcing material portion 11 increases the contact area between the first reinforcing material portion 11 and the resin laminate 10. This makes it easy to increase the adhesion strength between the first reinforcing material portion 11 and the resin laminate 10. Other effects are the same as those described in the first embodiment.

[0042] Third Embodiment In the third embodiment, a multilayer substrate in which the formation region of the second reinforcing material portion is different from the examples shown in the first and second embodiments will be illustrated.

[0043] Fig. 4 is a partial cross-sectional view of a multilayer substrate 103A according to a third embodiment. In the example shown in Fig. 4, the second reinforcing material portion 12 is continuous along the top surface TS of the first region A1 of the resin laminate 10, the surface of the first reinforcing material portion 11, and the side surface SS of the second region A2 of the resin laminate 10.

[0044] Fig. 5 is a partial cross-sectional view of another multilayer substrate 103B according to the third embodiment. In the example shown in Fig. 5, the second reinforcing material portion 12 is continuous along the surface of the first region A1 of the resin laminate 10, the surface of the first reinforcing material portion 11, and the upper surface of the second region A2 of the resin laminate 10.

[0045] 5, the second reinforcing material portion 12 also covers the entire radiation electrode RE, and also covers the periphery of the terminal electrode TE.

[0046] According to this embodiment, not only is the base portion 11R1 of the first reinforcing material portion 11 (the end portion of the first reinforcing material portion 11 joined to the upper surface of the first region A1 of the resin laminate 10) reinforced by the second reinforcing material portion 12, but also the upper end portion 11R2 of the first reinforcing material portion 11 (the end portion joined to the side surface SS of the second region A2 of the resin laminate 10). In addition, the second region A2 of the resin laminate 10 is also reinforced by the second reinforcing material portion 12. This makes it possible to obtain a multilayer substrate in which deformation of the step portion and cracks near the reinforcing material portion are further suppressed. Furthermore, in this embodiment, since the multilayer substrate is formed with a radiating electrode RE, changes in the antenna directivity due to displacement of the radiating electrode RE can be further suppressed.

[0047] Also, in the example shown in FIG. 5, the radiation electrode RE and the terminal electrode TE are also protected from stress from the outside or stress due to bending of the multilayer substrate 103B or the like.

[0048] <<Fourth Embodiment>> In the fourth embodiment, an example of a multilayer substrate in which the first reinforcing material portion and the second reinforcing material portion are present at two (separated) positions in the first region of the resin laminate where the lamination directions of the plurality of resin layers are different will be illustrated.

[0049] FIG. 6 is a partial cross-sectional view of a multilayer substrate 104 according to the fourth embodiment. The multilayer substrate 104 includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers on which conductor patterns are formed.

[0050] The resin laminate 10 has a first region A1 and a second region A2 continuous with the first region A1 as layer direction regions of the resin laminate 10. When the thickness in the first region A1 of the resin laminate 10 is represented by T1 and the thickness in the second region A2 of the resin laminate 10 is represented by T2, these thicknesses are in the relationship of T1 < T2.

[0051] Two stepped portions are formed at the boundary between the first region A1 and the second region A2. Reinforcing material portions 11A and 11B are provided at the inner corner portions of the stepped portions, respectively. The first reinforcing material portion 11A is continuously joined to the upper surface TS1 of the first region A1 of the resin laminate 10 and the side surface SS1 of the second region A2 of the resin laminate 10. Similarly, the first reinforcing material portion 11B is continuously joined to the lower surface TS2 of the first region A1 of the resin laminate 10 and the side surface SS2 of the second region A2 of the resin laminate 10.

[0052] A second reinforcing material portion 12A is formed on the upper surface TS1 of the first region A1 of the resin laminate 10 and on the surface of the first reinforcing material portion 11A. This second reinforcing material portion 12A is continuously bonded to the upper surface TS1 of the first region A1 of the resin laminate 10 and the surface of the first reinforcing material portion 11A. Similarly, a second reinforcing material portion 12B is formed on the lower surface TS2 of the first region A1 of the resin laminate 10 and on the surface of the first reinforcing material portion 11B. This second reinforcing material portion 12B is continuously bonded to the lower surface TS2 of the first region A1 of the resin laminate 10 and the surface of the first reinforcing material portion 11B.

[0053] A radiating electrode RE1 is formed on the upper surface of the second region A2 of the resin laminate 10. A radiating electrode RE2 is formed on the lower surface of the second region A2 of the resin laminate 10. A ground conductor layer GL is formed in the center of the resin laminate 10. Furthermore, signal line conductor patterns SL1 and SL2 are formed inside the resin laminate 10.

[0054] Furthermore, interlayer connection conductors V1A and V1B are formed inside the resin laminate 10. The interlayer connection conductor V1A extends in the stacking direction of the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL1 to the radiating electrode RE1. Similarly, the interlayer connection conductor V1B extends in the stacking direction of the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL2 to the radiating electrode RE2.

[0055] A microstrip line is formed by the signal line conductor pattern SL1, the ground conductor layer GL, and a resin layer between the signal line conductor pattern SL1 and the ground conductor layer GL. Similarly, a microstrip line is formed by the signal line conductor pattern SL2, the ground conductor layer GL, and a resin layer between the signal line conductor pattern SL2 and the ground conductor layer GL.

[0056] According to this embodiment, when the antenna is incorporated into the housing of an electronic device, it can be mounted in a limited space, thereby increasing the degree of freedom in placement. In addition, since the antenna is provided with radiation electrodes RE1 and RE2 which have different directions, it can be used as a wide-directivity or bidirectional antenna.

[0057] Other configurations and their effects are as shown in the first embodiment.

[0058] 《Fifth Embodiment》 In the fifth embodiment, a multilayer substrate with a configuration of the ground conductor layer different from the examples shown so far will be exemplified.

[0059] FIG. 7 is a partial cross-sectional view of a multilayer substrate 105A according to the fifth embodiment. The multilayer substrate 105A includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers on which conductor patterns are formed.

[0060] The resin laminate 10 has a first region A1 and a second region A2 continuous with the first region A1 as layer direction regions of the resin laminate 10. When the thickness of the resin laminate 10 in the first region A1 is represented by T1 and the thickness of the resin laminate 10 in the second region A2 is represented by T2, these thicknesses are in the relationship of T1 < T2.

[0061] As a result, a stepped portion is formed at the boundary between the first region A1 and the second region A2. A reinforcing member portion 11 is provided at the inner corner portion of the stepped portion. This reinforcing member portion 11 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10.

[0062] A second reinforcing member portion 12 is formed on the surface of the first region A1 of the resin laminate 10 and the surface of the first reinforcing member portion 11. This second reinforcing member portion 12 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the surface of the first reinforcing member portion 11.

[0063] A radiation electrode RE is formed on the upper surface of the second region A2 of the resin laminate 10. A ground conductor layer GL0 is formed on the lower surface BS of the resin laminate 10. A ground conductor layer GL1 is formed on the upper surface of the first region A1 of the resin laminate 10.

[0064] A signal line conductor pattern SL is formed inside the resin laminate 10. An interlayer connection conductor V1 is also formed inside the resin laminate 10. The interlayer connection conductor V1 extends in the stacking direction of the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL to the radiation electrode RE.

[0065] A strip line is formed by the signal line conductor pattern SL, the ground conductor layers GL0 and GL1, and the resin layer between the signal line conductor pattern SL and the ground conductor layers GL0 and GL1. That is, the strip line is connected to the radiation electrode RE via the interlayer connection conductor V1. The other structure and the resulting effects are the same as those described in the first embodiment.

[0066] 7, the ground conductor layer GL1 is present between the first reinforcing material portion 11 and the signal line conductor pattern SL, and therefore there is no influence from the dielectric constant and dielectric loss tangent of the first reinforcing material portion 11, which is a dielectric. Therefore, there is no unnecessary change in the characteristic impedance of the strip line due to the provision of the first reinforcing material portion 11. In addition, an increase in transmission loss is prevented.

[0067] 8 is a partial cross-sectional view of a multilayer substrate 105B according to the fifth embodiment. The multilayer substrate 105B includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer on which a conductor pattern is formed.

[0068] A radiation electrode RE is formed on the upper surface of the second region A2 of the resin laminate 10. A ground conductor layer GL0 is formed on the lower surface BS of the resin laminate 10. A ground conductor layer GL2 is formed on the upper surface of the first region A1 of the resin laminate 10. Furthermore, a ground conductor layer GL1 and a signal line conductor pattern SL are formed inside the resin laminate 10.

[0069] The ground conductor layer GL1 is partially disposed between the first reinforcing member portion 11 and the conductor pattern SL for signal lines. Similarly, the ground conductor layer GL2 is partially disposed between the first reinforcing member portion 11 and the conductor pattern SL for signal lines. By these ground conductor layers GL1 and GL2, the conductor pattern SL for signal lines is shielded electromagnetically from the first reinforcing member portion 11.

[0070] According to the structure shown in FIG. 8, since the ground conductor layers GL1 and GL2 exist between the first reinforcing member portion 11 and the conductor pattern SL for signal lines, it is not affected by the dielectric constant and dielectric tangent of the first reinforcing member portion 11 which is a dielectric. Therefore, there is no useless change in the characteristic impedance of the strip line due to the provision of the first reinforcing member portion 11. Also, an increase in transmission loss is prevented.

[0071] 《Sixth Embodiment》 In the sixth embodiment, a multilayer substrate bent at a predetermined location is exemplified.

[0072] The upper part of FIG. 9 is a cross-sectional view of the multilayer substrate 106 according to the sixth embodiment in a state before bending (before refraction). The lower part of FIG. 9 is a cross-sectional view of the multilayer substrate 106 according to the sixth embodiment in a state after bending.

[0073] As shown in the upper part of FIG. 9, the multilayer substrate 106 includes a resin laminate 10 formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed. The resin laminate 10 has one first region A1 as a layer direction region of the resin laminate 10 and two second regions A2 each continuous with the first region A1. When the thickness in the first region A1 of the resin laminate 10 is represented by T1 and the thickness in the second region A2 of the resin laminate 10 is represented by T2, those thicknesses are in the relationship of T1 < T2.

[0074] As a result, a step portion is formed at the boundary between the first region A1 and the second region A2. Reinforcing member portions 11A and 11B are provided at the inner corner portions of the step portion. These reinforcing member portions 11A and 11B are continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10, respectively.

[0075] A second reinforcing material portion 12 is formed on the upper surface TS of the first region A1 of the resin laminate 10 and on the surfaces of the first reinforcing material portions 11A, 11B. This second reinforcing material portion 12 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the surfaces of the first reinforcing material portions 11A, 11B.

[0076] Radiation electrodes RE1 and RE2 are formed on the upper surface of the second region A2 of the resin laminate 10. A ground conductor layer GL is formed on the lower surface BS of the resin laminate 10.

[0077] A signal line conductor pattern SL is formed inside the resin laminate 10. Furthermore, interlayer connection conductors V1A and V1B are formed inside the resin laminate 10. The interlayer connection conductors V1A and V1B extend in the stacking direction of the resin laminate 10, electrically connecting one end of the signal line conductor pattern SL to the radiating electrode RE1, and electrically connecting the other end of the signal line conductor pattern SL to the radiating electrode RE2. A signal line conductor pattern (not shown) that is connected to an input / output circuit for the antenna is connected to the signal line conductor pattern SL.

[0078] As shown in the lower part of FIG. 9, when the multilayer substrate 106 is bent by 90 degrees around an axis along the Y axis in the center of the first region A1, the radiation electrodes RE1 and RE2 are arranged so that their orientations differ by 90 degrees.

[0079] According to this embodiment, when the antenna is incorporated into the housing of an electronic device, it can be mounted in a limited space, thereby increasing the degree of freedom in placement. In addition, since the antenna is provided with radiation electrodes RE1 and RE2 that have different directions, it can be used as an antenna with wide directivity.

[0080] Seventh Embodiment In the seventh embodiment, a multilayer substrate is illustrated that includes a third reinforcing material part that is bonded to a part of the surface of the second reinforcing material part and to the side surface of the second region.

[0081] FIG. 10 is a partial cross-sectional view of a multilayer substrate 107 according to the seventh preferred embodiment.

[0082] The multilayer substrate 107 includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer on which a conductor pattern is formed.

[0083] The resin laminate 10 has a first region A1, a second region A2, and a third region A3 which is a region between the first region A1 and the second region A2 as layer direction regions of the resin laminate 10. The structure having these three regions is the same as the example shown in FIG.

[0084] The multilayer substrate 107 includes a first reinforcing material portion 11 that fills the third region A3 of the resin laminate 10 and is continuously joined to the top surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10. The first reinforcing material portion 11 is made of a first resin.

[0085] A second reinforcing material portion 12 is formed on the upper surface TS of the first region A1 of the resin laminate 10 and on the surface of the first reinforcing material portion 11. This second reinforcing material portion 12 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the surface of the first reinforcing material portion 11. The second reinforcing material portion 12 is made of a second resin.

[0086] This multilayer substrate 107 includes a third reinforcing material portion 13 that is bonded to part of the surface of the second reinforcing material portion 12 and to the side surface SS of the second region A2. The third reinforcing material portion 13 is made of a third resin.

[0087] The end of the third reinforcing material portion 13 in contact with the side surface SS of the second region A2 is located closer to the radiation electrode RE than the end of the first reinforcing material portion 11 in contact with the side surface SS of the second region A2.

[0088] By covering the end of the second reinforcing material part 12 with the third reinforcing material part 13 in this way, peeling of the second reinforcing material part 12 from the first reinforcing material part 11 is suppressed.

[0089] Also, when the thixotropy ratio (the degree of thixotropy) of the first resin is represented by TR1 and the thixotropy ratio (the degree of thixotropy) of the third resin is represented by TR3, they are in the relationship of TR1 < TR3. Due to this, it is possible to make the first resin spread without gaps in the groove portion of the first resin laminate 10. On the other hand, since the third resin is difficult to spread, it is possible to form the third reinforcing material portion 13 limitedly at a desired location.

[0090] Note that the third resin may be the same resin as the first resin or the second resin.

[0091] 《Eighth Embodiment》 In the eighth embodiment, the relationship between the height and width of the first reinforcing material portion is particularly exemplified.

[0092] FIG. 11 is a partial cross-sectional view of a multilayer substrate 108 according to the eighth embodiment.

[0093] The resin laminate 10 has a first region A1 and a second region A2. A step portion is formed at the boundary between the first region A1 and the second region A2. A first reinforcing material portion 11 is provided at the inner corner portion of the step portion. This first reinforcing material portion 11 is continuously joined to the upper surface TS of the first region A1 of the resin laminate 10 and the side surface SS of the second region A2 of the resin laminate 10.

[0094] When the height of the first reinforcing material portion 11 along the side surface SS of the second region A2 of the resin laminate 10 is represented by L1 and the length of the first reinforcing material portion 11 along the direction away from the second region A2 in the first region A1 of the resin laminate is represented by L2, they are in the relationship of L1 > L2. Other configurations are as shown in the first embodiment.

[0095] According to the eighth embodiment, the width L2 of the first reinforcing material portion 11 in contact with the top surface TS of the first region A1 is smaller than the length (height) L1 of the first reinforcing material portion 11 in contact with the side surface SS of the second region A2, so the presence of the first reinforcing material portion 11 does not significantly impair the flexibility of the first region A1 of the resin laminate 10. For example, the flexible region of the first region A1 is not narrowed. In other words, the flexibility of the first region A1 can be ensured while the first reinforcing material portion 11 and the second reinforcing material portion 12 reinforce the interface between the first region A1 and the second region A2 of the resin laminate 10 and reinforce the joint interface between the first reinforcing material portion 11 and the resin laminate 10.

[0096] Ninth Embodiment In the ninth embodiment, a multilayer substrate in which the configuration of the first region and the second region is different from the examples shown so far will be illustrated.

[0097] 12 is a cross-sectional view of a multilayer substrate 109 according to the ninth embodiment. This multilayer substrate 109 includes a substrate portion 109S and a mounting portion 109E mounted thereon. The substrate portion 109S and the mounting portion 109E form a second area A2. The substrate portion 109S other than the mounting area of ​​the mounting portion 109E forms a first area A1.

[0098] The substrate portion 109S and the mounting portion 109E include a plurality of resin layers, and conductive layers and interlayer connection conductors attached to predetermined resin layers among the plurality of resin layers. The conductive layers and interlayer connection conductors are conductors whose main components are, for example, Cu or Ag.

[0099] A connection conductor BM is applied to the opening of the uppermost resin layer of the substrate portion 109S. The connection conductor BM is, for example, a heat-melting metal such as solder. A multilayer substrate portion side pad electrode 2 is formed below the connection conductor BM. The pad electrode 2 and one end of the signal line conductor pattern SL are connected in the stacking direction by a conductor layer 5 and an interlayer connection conductor 4. The terminal electrode TE and the other end of the signal line conductor pattern SL are also connected in the stacking direction by the conductor layer 5 and the interlayer connection conductor 4.

[0100] A radiation electrode RE is formed on the upper part of the mounting portion 109E. A terminal electrode 6 is formed on the mounting surface (lower surface) of the mounting portion 109E. The terminal electrode 6 and the radiation electrode RE are electrically connected via an interlayer connection conductor 4 and a conductor layer 5.

[0101] The terminal electrodes 6 of the mounting portion 109E are electrically connected to the pad electrodes 2 formed on the substrate portion 109S.

[0102] In this way, the resin laminate may be formed by the substrate portion 109S and the mounting portion 109E. The other configurations are the same as those of the embodiments shown so far, such as the first embodiment.

[0103] The resin laminate may be formed entirely from the first region A1 to the second region A2 using the same type of resin material, or the second region A2 may be formed by bonding a different type of substrate onto the resin substrate that constitutes the first region A1. That is, the resin portion of the substrate portion 109S and the resin portion of the mounting portion 109E may be made of different types of resin materials. However, if the resin portion of the substrate portion 109S and the resin portion of the mounting portion 109E are made of the same type of resin material, a high bonding strength can be obtained because an interface between different materials is not formed.

[0104] Whether or not the resin materials are the same can be confirmed by a Fourier transform infrared spectrophotometer (FT-IR). That is, a spectrum is obtained by a Fourier transform infrared spectrophotometer (FT-IR), and if the peaks of the spectrum are the same for mounting portion 109E and substrate portion 109S, it can be confirmed that they are the same type of resin materials.

[0105] In addition, if the resin is a thermoplastic resin, the difference in melting point between the same type of resin material is small. Whether the resin portion of substrate portion 109S and the resin portion of mounting portion 109E are made of the same type of resin material can be confirmed by the endothermic peak of differential scanning calorimetry (DSC). Specifically, using a Rigaku DSC8230, the two resins are heated at a rate of 10°C / min, melted, cooled, and then heated again at 10°C / min. If the difference in melting point between the two resins is within 5°C, they can be considered to be the same type of resin material.

[0106] Tenth Embodiment In the tenth embodiment, an electronic device according to the present invention will be illustrated.

[0107] An electronic device according to the present invention includes any one of the multilayer substrates described in the first to seventh embodiments and electronic components mounted on the multilayer substrate, such as a chip capacitor for impedance matching of a signal transmission line connected to a patch antenna, a power amplifier IC for outputting a transmission signal to the patch antenna, and a signal amplifier IC for amplifying a signal received by the patch antenna.

[0108] Various embodiments of the present invention have been presented so far, but these are all examples and are not intended to limit the scope of the present invention. Various omissions, substitutions, and modifications can be made to the embodiments of the present invention without departing from the spirit of the invention. Embodiments with such omissions, substitutions, and modifications are included within the scope and spirit of the present invention, and are also included in the scope of the invention and its equivalents as set forth in the claims of this application.

[0109] For example, in each embodiment, an example has been shown in which a radiation electrode is formed in the second region A2 of the resin laminate 10, but the electrode formed in the second region A2 is not limited to a radiation electrode.

[0110] Furthermore, in each embodiment, an example in which interlayer connection conductors are formed in the first region A1 and the second region A2 has been shown, but these interlayer connection conductors are not essential.

[0111] In each embodiment, a signal line conductor pattern SL and a ground conductor layer GL are formed to configure a microstrip line or a triplate type strip line, but the present invention is not limited to those having such a transmission line portion.

[0112] Furthermore, in each embodiment, an example has been shown in which the conductor patterns are exposed on the outer surface of the resin laminate, but the present invention also includes cases in which each conductor pattern is formed inside (inner layer) of the resin laminate.

[0113] The multilayer substrate and electronic device of the present invention may be provided in the following aspects.

[0114] <1> A multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer in which a conductor pattern is formed, The resin laminate has a first region and a second region continuous with the first region as layer direction regions of the resin laminate, When the thickness of the resin laminate in the first region is represented by T1 and the thickness of the resin laminate in the second region is represented by T2, these thicknesses are in the relationship of T1 < T2, A first reinforcing member portion made of a first resin that is continuously joined to the upper surface of the first region of the resin laminate and the side surface of the second region of the resin laminate; A second reinforcing member portion made of a second resin that is continuously joined to the surface of the first region of the resin laminate and the surface of the first reinforcing member portion; A multilayer substrate comprising.

[0115] <2> A multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer in which a conductor pattern is formed, The resin laminate has a first region, a second region, and a third region that is a region between the first region and the second region as layer direction regions, When the thickness of the resin laminate in the first region is represented by T1, the thickness of the resin laminate in the second region is represented by T2, and the thickness of the resin laminate in the third region is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2, A first reinforcing member portion made of a first resin that fills the third region of the resin laminate and is continuously joined to the upper surface of the first region of the resin laminate and the side surface of the second region of the resin laminate; A second reinforcing member portion made of a second resin that is continuously joined to the surface of the first region of the resin laminate and the surface of the first reinforcing member portion; A multilayer substrate comprising.

[0116] <3> When the Young's modulus of the resin layer is represented by E10, the Young's modulus of the first reinforcing material portion is represented by E11, and the Young's modulus of the second reinforcing material portion is represented by E12, The relationship is E11>E10, E11>E12. <1> or <2> The multilayer substrate according to claim 1.

[0117] <4> where L1 represents a height of the first reinforcing material portion along a side surface of the second region of the resin laminate, and L2 represents a length of the first reinforcing material portion along a direction away from the second region in the first region of the resin laminate, and L1>L2 holds true. <1> from <3> 10. The multilayer substrate according to claim 9, wherein

[0118] <5> the second reinforcing material portion is continuous along a surface of the first region of the resin laminate, a surface of the first reinforcing material portion, and a side surface of the second region of the resin laminate; <1> from <4> 10. The multilayer substrate according to claim 9, wherein

[0119] <6> a signal line conductor pattern formed in an inner layer of the resin laminate; and a ground conductor layer formed on the lower surface or an inner layer of the resin laminate, wherein a strip line is formed by at least the signal line conductor pattern, the ground conductor layer, and the first region of the resin laminate; a ground conductor layer is formed between the first reinforcing material portion and the signal line conductor pattern; <1> from <5> 10. The multilayer substrate according to claim 9, wherein

[0120] <7> a patch antenna including a radiation electrode formed on an upper surface of the second region of the resin laminate and a ground conductor layer formed on a lower surface or an inner layer of at least the second region of the resin laminate; <1> from <6> 10. The multilayer substrate according to claim 9, wherein

[0121] <8> the first reinforcing material portion and the second reinforcing material portion are present at two locations in the first region of the resin laminate that are different positions in the stacking direction of the plurality of resin layers, <1> from <7> 10. The multilayer substrate according to claim 9, wherein

[0122] <9> the first reinforcing material portion and the second reinforcing material portion are present in two locations that are different in the layer direction of the plurality of resin layers in the first region of the resin laminate; <1> from <7> 10. The multilayer substrate according to claim 9, wherein

[0123] <10> a third reinforcing material portion joined to a part of the surface of the second reinforcing material portion and a side surface of the second region; <1> from <9> 10. The multilayer substrate according to claim 9, wherein

[0124] <11> <1> from <10> and an electronic component mounted on the multilayer substrate. [Explanation of symbols]

[0125] A1…First area A2…Second area A3…Third area BM...connecting conductor BS…Bottom side GL, GL0, GL1, GL2...Ground conductor layers RE,RE1,RE2…Radiation electrode SL, SL1, SL2...Signal line conductor patterns SS,SS1,SS2…side T1, T2...Thickness TE...Terminal electrode TS,TS1…Top surface TS2...Bottom side V1, V2...Interlayer connecting conductor V1A, V1B...Interlayer connecting conductors 2...Pad electrode 4...Interlayer connecting conductor 5...Conductor layer 6...Terminal electrode 10...Resin laminate 11,11A,11B...First reinforcement part 11R1: root portion of first reinforcing material portion 11 11R2: Upper end of the first reinforcing member portion 11 12, 12A, 12B...Second reinforcement part 13...Third reinforcement part 101,102,103A,103B,104,105A,105B,106,107,108,109...Multilayer board 109E...Installation section 109S...Substrate part

Claims

1. A multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed, the resin laminate has, as layer direction regions of the resin laminate, a first region and a second region continuous with the first region, When a thickness of the resin laminate in the first region is represented by T1 and a thickness of the resin laminate in the second region is represented by T2, the thicknesses have a relationship of T1<T2, a first reinforcing material portion made of a first resin and continuously bonded to an upper surface of the first region of the resin laminate and a side surface of the second region of the resin laminate; a second reinforcing material portion made of a second resin and continuously bonded to a surface of the first region of the resin laminate and a surface of the first reinforcing material portion; A multilayer substrate comprising:

2. A multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed, The resin laminate has, as layer direction regions, a first region, a second region, and a third region which is a region between the first region and the second region, when a thickness of the first region of the resin laminate is represented by T1, a thickness of the second region of the resin laminate is represented by T2, and a thickness of the third region of the resin laminate is represented by T3, the thicknesses satisfy a relationship of T3<T1<T2, a first reinforcing material portion made of a first resin, which fills the third region of the resin laminate and is continuously joined to an upper surface of the first region of the resin laminate and a side surface of the second region of the resin laminate; a second reinforcing material portion made of a second resin and continuously bonded to a surface of the first region of the resin laminate and a surface of the first reinforcing material portion; A multilayer substrate comprising:

3. When the Young's modulus of the resin layer is represented by E10, the Young's modulus of the first reinforcing material portion is represented by E11, and the Young's modulus of the second reinforcing material portion is represented by E12, The relationship is E11>E10, E11>E12. The multilayer substrate according to claim 1 or 2.

4. a height of the first reinforcing material portion along a side surface of the second region of the resin laminate is represented by L1, and a length of the first reinforcing material portion along a direction away from the second region in the first region of the resin laminate is represented by L2, where L1 > L2. The multilayer substrate according to claim 1 or 2.

5. the second reinforcing material portion is continuous along a surface of the first region of the resin laminate, a surface of the first reinforcing material portion, and a side surface of the second region of the resin laminate. The multilayer substrate according to claim 1 or 2.

6. a signal line conductor pattern formed in an inner layer of the resin laminate; and a ground conductor layer formed on a lower surface or an inner layer of the resin laminate, wherein a strip line is formed by at least the signal line conductor pattern, the ground conductor layer, and the first region of the resin laminate; a ground conductor layer is formed between the first reinforcing material portion and the signal line conductor pattern; The multilayer substrate according to claim 1 or 2.

7. a patch antenna including a radiation electrode formed on an upper surface of the second region of the resin laminate and a ground conductor layer formed on a lower surface or an inner layer of at least the second region of the resin laminate; The multilayer substrate according to claim 1 or 2.

8. the first reinforcing material portion and the second reinforcing material portion are present at two locations in the first region of the resin laminate that are different positions in the stacking direction of the plurality of resin layers, The multilayer substrate according to claim 1 or 2.

9. the first reinforcing material portion and the second reinforcing material portion are present at two different positions in the layer direction of the plurality of resin layers in the first region of the resin laminate; The multilayer substrate according to claim 1 or 2.

10. a third reinforcing material portion joined to a part of the surface of the second reinforcing material portion and a side surface of the second region; The multilayer substrate according to claim 1 or 2.

11. 3. An electronic device comprising the multilayer substrate according to claim 1 or 2 and an electronic component mounted on the multilayer substrate.

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