Contact probe

Abstract

To provide a contact probe securing stable electrical conduction.SOLUTION: A contact probe includes a first terminal part, a second terminal part, and a spring part connecting the first and second terminal parts such that they can move forward and backward. The contact probe is constituted by bending a continuous wire. The spring part has a winding part, a first end part which is an end part in a side of the second terminal part of the winding part, a second end part which is an end part in a side of the first terminal part of the winding part, a first extension part extending from the first end part to the second end part along an axial direction of the contact probe and continuing to the first terminal part, and a second extension part extending from the second end part to the first end part along the axial direction and continuing to the second terminal part. The first extension part is in contact with the second end part. The second extension part is in contact with the first end part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a contact probe. [Background technology]

[0002] Conventionally, when conducting a continuity test or an operating characteristic test of a test object such as a semiconductor integrated circuit or a liquid crystal display device, a conductive contact probe is used to establish an electrical connection between the test object and a signal processing device having a circuit board that outputs a test signal (see, for example, Patent Document 1). The contact probe described in Patent Document 1 includes first and second portions that extend in a flat plate shape, and a third portion that extends in a zigzag shape and connects the first and second portions, and when in use, is folded to bring the first portion and the third portion, and the second portion and the third portion, into contact with each other, thereby shortening the conduction path. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2020-502513 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the contact probe described in Patent Document 1 is folded to conduct signals, the planar structure causes large friction and large load hysteresis, which may result in unstable electrical signal conduction in a contact probe having the configuration described in Patent Document 1.

[0005] The present invention has been made in view of the above, and has an object to provide a contact probe that can ensure stable electrical conduction. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the contact probe according to the present invention is a contact probe that comes into contact with a contact object at each of both longitudinal end sides, and includes a first terminal portion that comes into contact with one of the contact objects, a second terminal portion that comes into contact with the other of the contact objects, and a spring portion that is provided between the first and second terminal portions and connects the first and second terminal portions so that they can move back and forth, and the contact probe is made of a continuous wire that is bent, and the spring portion is a winding portion that is wound at a predetermined interval. a first end which is the end of the winding portion on the second terminal portion side; a second end which is the end of the winding portion on the first terminal portion side; a first extension portion which extends from the first end toward the second end along the axial direction of the contact probe and is connected to the first terminal portion; and a second extension portion which extends from the second end toward the first end along the axial direction and is connected to the second terminal portion, wherein the first extension portion contacts the second end and the second extension portion contacts the first end.

[0007] In addition, the contact probe of the present invention is characterized in that, in the above invention, the first and second ends have a larger diameter of the wire than the spring portion, the first end and the second extension portion are in contact, and the second end and the first extension portion are in contact.

[0008] Further, in the contact probe according to the present invention, in the above invention, the first terminal portion extends from the first extension portion along the axial direction and then bends back toward the spring portion, The second terminal portion extends from the second extension portion along the axial direction and then bends back toward the spring portion.

[0009] Moreover, in the contact probe according to the present invention, in the above invention, the bent portion of the first and / or second terminal portion is arc-shaped.

[0010] Furthermore, in the contact probe according to the present invention, in the above invention, the bent portion of the first and / or second terminal portion has a top portion that forms a sharp tip.

[0011] Moreover, in the contact probe according to the present invention, in the above invention, the bent portion of the first and / or second terminal portion has a flat top portion.

[0012] Furthermore, in the contact probe according to the present invention, in the above invention, the bent portion of the first and / or second terminal portion has a zigzag shape with a plurality of tapered peaks.

[0013] Furthermore, the contact probe of the present invention is characterized in that, in the above invention, the first terminal portion extends from the first extension portion along the axial direction and then inclines toward the axial direction, and the second terminal portion extends from the second extension portion along the axial direction and then inclines toward the axial direction. [Effects of the Invention]

[0014] According to the present invention, it is possible to ensure stable electrical conduction. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view showing a configuration of a contact probe according to a first embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged view (part 1) showing a configuration of a part of the contact probe shown in FIG. [Figure 3] FIG. 3 is an enlarged view (part 2) showing the configuration of a portion of the contact probe shown in FIG. [Figure 4] FIG. 4 is a diagram (part 1) for explaining the operation of the contact probe. [Figure 5] FIG. 5 is a diagram (part 2) for explaining the operation of the contact probe. [Figure 6] FIG. 6 is a diagram (part 1) for explaining the conduction path of the contact probe. [Figure 7] FIG. 7 is a diagram (part 2) for explaining the conduction path of the contact probe. [Figure 8] FIG. 8 is a diagram illustrating a tip configuration of a contact probe according to a first modification of the first embodiment of the present invention. [Figure 9] FIG. 9 is a diagram illustrating a tip configuration of a contact probe according to a second modification of the first embodiment of the present invention. [Figure 10] FIG. 10 is a diagram illustrating a tip configuration of a contact probe according to a third modification of the first embodiment of the present invention. [Figure 11] FIG. 11 is a plan view showing a configuration of a contact probe according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. Furthermore, the drawings referred to in the following description merely show the shape, size, and positional relationship of the components to the extent that the contents of the present invention can be understood. In other words, the present invention is not limited to only the shape, size, and positional relationship exemplified in each drawing.

[0017] (Embodiment 1) FIG. 1 is a perspective view showing the configuration of a contact probe according to a first embodiment of the present invention. FIGS. 2 and 3 are enlarged views showing the configuration of a portion of the contact probe shown in FIG. 1. Contact probe 1 is used, for example, when conducting an electrical characteristic test on a semiconductor integrated circuit, which is an object to be tested, and electrically connects the semiconductor integrated circuit to a circuit board that outputs a test signal to the semiconductor integrated circuit. When in use, contact probe 1 is housed, for example, in a probe holder or the like. Hereinafter, contact probe 1 will be simply referred to as probe 1.

[0018] The probe 1 is made by bending a wire made of a conductive material. This wire may be made of a single material, or may be made by connecting parts made of different materials or with different properties, as long as it is a continuous wire.

[0019] Probe 1 includes first terminal 11, which contacts an electrode of a semiconductor integrated circuit when testing the semiconductor integrated circuit; second terminal 12, which contacts an electrode of a circuit board equipped with a test circuit; and spring 13, which is provided between first terminal 11 and second terminal 12 and connects first terminal 11 and second terminal 12 so that they can move back and forth. In FIG. 1 , first terminal 11, second terminal 12, and spring 13, which constitute probe 1, share a common axis. That is, the central axes of first terminal 11, second terminal 12, and spring 13 are aligned on a common line N1. Hereinafter, this line N1 may be referred to as the "axis N1." Note that the "same axis" includes deviations due to distortion of individual components, manufacturing errors, and the like. When probe 1 contacts a semiconductor integrated circuit, spring 13 expands and contracts in the axial direction, thereby cushioning impact on the electrode of the semiconductor integrated circuit and applying a load to the semiconductor integrated circuit and the circuit board.

[0020] The first terminal 11 is formed by folding one end 101 of the wire back in a U-shape. The bent portion of the first terminal 11 formed by folding back has an arc shape, and this bent portion comes into contact with an electrode of the semiconductor integrated circuit.

[0021] The second terminal 12 is formed by folding back the other end 102 of the wire in a U-shape. The bent portion of the second terminal 12 formed by folding back has an arc shape, and this bent portion comes into contact with an electrode on the circuit board.

[0022] The spring portion 13 has a winding portion 130 wound at a predetermined interval, a first end 131 which is the end of the winding portion 130 on the second terminal portion 12 side, a second end 132 which is the end of the winding portion 130 on the first terminal portion 11 side, a first extension portion 133 which extends from the first end 131 toward the second end 132 along the axis N1 direction and is connected to the first terminal portion 11, and a second extension portion 134 which extends from the second end 132 toward the first end 131 along the axis N1 direction and is connected to the second terminal portion 12.

[0023] The winding section 130 is formed by winding a wire in a spiral shape around the axis N1. In the first embodiment, the winding section 130 is described as being wound with the wire having a uniform diameter, but this is not limiting, and the diameter of the wire may be partially different within a range that does not contact the first extending section 133 or the second extending section 134.

[0024] The first end 131 extends and curves around the axis N1 so as to have a diameter larger than the diameter of the wire in the wound portion .

[0025] The second end 132 extends and curves around the axis N1 so as to have a diameter larger than the diameter of the wire in the wound portion . The diameters of the wire at first end 131 and second end 132 may be the same or different. In this case, "the same" includes manufacturing errors and the like. In addition, in this embodiment 1, an example is described in which the first end 131 and the second end 132 have a larger diameter than the diameter of the wire in the winding portion 130, but they may also have the same diameter as the diameter of the wire in the winding portion 130.

[0026] Here, the first terminal portion 11 extends from the first extending portion 133 along the axis N1 direction and then bends back toward the spring portion 13. While Fig. 1 shows an example in which one end portion 101 of the first terminal portion 11 extends along the second extending portion 134 and abuts on the spring portion 13, the extension length of the one end portion 101 is not limited to this, and may be, for example, a length in the axis N1 direction that does not reach the second end portion 132.

[0027] Furthermore, the second terminal portion 12 extends from the second extending portion 134 along the axis N1 direction and then bends back toward the spring portion 13. While Fig. 1 shows an example in which the other end portion 102 of the second terminal portion 12 extends along the first extending portion 133 and abuts the spring portion 13, the extension length of the other end portion 102 is not limited to this, and may be, for example, a length in the axis N1 direction that does not reach the first end portion 131.

[0028] In the probe 1, the second end 132 and the first extending portion 133 are in contact with each other, and the first end 131 and the second extending portion 134 are in contact with each other. Specifically, the second end 132 is in contact with the first extending portion 133 (this contact point is referred to as a contact point P C 1), the first end 131 is in contact with the first extension 133 (this contact point is referred to as contact point P C 2). The diameters, angles, etc. of the first end portion 131 and the second end portion 132, as well as the first extension portion 133 and the second extension portion 134, are adjusted so as to achieve point contact regardless of the expansion and contraction of the spring portion 13.

[0029] Figures 4 and 5 are diagrams for explaining the operation of the contact probe. Figure 5 is a diagram of the probe 2 viewed from a different direction than that of Figure 4. Figures 4(a) and 5(a) show the probe 2 in a state where no load other than weight is applied. Figures 4(b) and 5(b) show the probe 2 in a state where a load is applied to the first terminal portion 11 and the second terminal portion 12.

[0030] When a load (see arrows in FIGS. 4A and 5A) is applied to the first terminal 11 and the second terminal 12 in the direction of the axis N1, causing them to move toward each other, in a state where no load other than weight is applied (see FIGS. 4A and 5A), the first terminal 11 and the second terminal 12 move toward each other. At this time, the first end 131 of the spring portion 13 is moved by the first terminal 11 toward the second terminal 12 via the first extension portion 133, and the second end 132 of the spring portion 13 is moved by the second terminal 12 toward the first terminal 11 via the second extension portion 134. As a result, the first end 131 and the second end 132 move away from each other in the direction of the axis N1, and the winding portion 130 expands in the direction of the axis N1 in accordance with this movement. In this way, when a load is applied to the first terminal portion 11 and the second terminal portion 12, the spring portion 13 acts as a tension spring.

[0031] When testing a semiconductor integrated circuit, the spring portion 13 is stretched along the axis N1 due to the contact load from the semiconductor integrated circuit and the circuit board. During testing, a test signal supplied from the circuit board to the semiconductor integrated circuit travels from an electrode on the circuit board to an electrode on the semiconductor integrated circuit via the probe 1. At this time, electricity reaches the other electrode via a path that reduces impedance (resistance in AC current). Specifically, the electricity travels via the contact P rather than via the winding portion 130. C 1. P C The signal flows preferentially through the conductive path that has the shorter path length via 2.

[0032] A signal supplied to the first terminal 11 reaches the second terminal 12 via two paths. Figures 6 and 7 are diagrams for explaining the conduction paths of the contact probe. Figure 7 is a view of the probe 2 seen from a different direction than that of Figure 6.

[0033] In the first path C1, a signal supplied to the first terminal portion 11 passes through the first extension portion 133 and reaches a contact point P C 1 and then reaches the first end 131 and contacts the contact point P C 2 and reaches the second terminal portion 12.

[0034] In the second path C2, the signal supplied to the first terminal portion 11 passes through the contact point P C 1, and then passes through the second end portion 132, the second extension portion 134, and reaches the second terminal portion 12.

[0035] In this way, in the probe 2, the contact P C 1 or contact P C 2, a signal is transmitted to the other terminal portion via the first extension portion 133 or the second extension portion 134. For this reason, a conductive path that does not pass through the winding portion 130 around which the wire is wound, which has high resistance for high-frequency signals, is selected as the signal path, and the signal is transmitted via a path that is shorter than the overall length of the wire of the probe 2.

[0036] According to the above-described first embodiment, the end of the spring portion 13 and the extension portion of the probe 2 are in point contact, and even when the probe 2 is deformed by a load, the contact position merely moves, and the point contact is maintained. At this time, unlike the surface contact with relatively high friction as in the patent documents, a signal supplied to one terminal portion is transmitted via a path that is short relative to the overall length of the wire via a point contact, so that friction at the contact portion is small and load hysteresis is small, thereby ensuring stable electrical conduction.

[0037] (Variation 1) Next, a first variation of the first embodiment of the present invention will be described with reference to Fig. 8. Fig. 8 is a diagram illustrating the tip configuration of a contact probe according to the first variation of the first embodiment of the present invention. This first variation has a first terminal portion 11A instead of the first terminal portion 11 of the probe 1 according to the first embodiment described above. Note that the components of the probe according to this first variation, other than the first terminal portion 11A, are the same as those of the probe 1 according to the first embodiment described above, and therefore description thereof will be omitted.

[0038] The first terminal 11A is formed by folding one end of a wire in a V-shape. Therefore, the first terminal 11A has a sharp top portion. The top portion of the first terminal 11A comes into contact with an electrode of the semiconductor integrated circuit.

[0039] According to the present first modification, stable electrical conduction can be ensured, similarly to the first embodiment described above.

[0040] Furthermore, in this modification 1, the first terminal portion 11A is tapered, so that even if an oxide film is formed on the surface of the connection electrode, the oxide film can be broken through and the first terminal portion 11A can be brought into direct contact with the connection electrode.

[0041] (Variation 2) Next, a second modification of the first embodiment of the present invention will be described with reference to Fig. 9. Fig. 9 is a diagram illustrating the tip configuration of a contact probe according to the second modification of the first embodiment of the present invention. The second modification includes a first terminal portion 11B instead of the first terminal portion 11 of the probe 1 according to the first embodiment described above. Note that the components of the probe according to the second modification, other than the first terminal portion 11B, are the same as those of the probe 1 according to the first embodiment described above, and therefore description thereof will be omitted.

[0042] The first terminal 11B is formed by folding one end of the wire back into a trapezoidal shape. Therefore, the first terminal 11B has a flat top. The top or a corner of the first terminal 11B comes into contact with an electrode of the semiconductor integrated circuit.

[0043] According to the present modified example 2, stable electrical conduction can be ensured, similarly to the above-described first embodiment.

[0044] Furthermore, in this second modification, when contacting a flat electrode, for example, the electrode and the flat portion of the top of the head come into line contact, thereby preventing the probe from tilting when contacting.

[0045] (Variation 3) Next, a third variation of the first embodiment of the present invention will be described with reference to Fig. 10. Fig. 10 is a diagram illustrating the tip configuration of a contact probe according to the third variation of the first embodiment of the present invention. The third variation includes a first terminal portion 11C instead of the first terminal portion 11 of the probe 1 according to the first embodiment described above. Note that the components of the probe according to the third variation, other than the first terminal portion 11C, are the same as those of the probe 1 according to the first embodiment described above, and therefore description thereof will be omitted.

[0046] The first terminal 11C is formed by folding back one end of a wire, and the bent portion forms a zigzag shape. Therefore, the first terminal 11C has a plurality of tapered peaks. The peaks or corners of the first terminal 11C come into contact with electrodes of a semiconductor integrated circuit. Note that while FIG. 10 shows an example in which the first terminal 11C forms a zigzag shape with folding positions (heights) that vary, it may also be a zigzag shape with folding positions that are the same height.

[0047] According to the third modification, stable electrical conduction can be ensured, similarly to the first embodiment described above.

[0048] In addition, in the present modification 3, since the first terminal 11A has multiple tapered peaks, even if an oxide film is formed on the surface of the connection electrode, contact with any of the peaks breaks through the oxide film, allowing the first terminal 11C to come into direct contact with the connection electrode. Furthermore, when the first terminal 11A comes into contact with a hemispherical electrode, the first terminal 11A can make stable contact.

[0049] The terminal portion according to the first embodiment can combine the shapes of the modifications 1 to 3. In this case, the first terminal portion and the second terminal portion may have the same shape or different shapes.

[0050] (Embodiment 2) Next, a second embodiment of the present invention will be described with reference to Fig. 11. Fig. 11 is a plan view showing the configuration of a contact probe according to the second embodiment of the present invention. Note that the same components as those described above in Fig. 1 etc. are assigned the same reference numerals.

[0051] Probe 1A according to the second embodiment is formed by bending a wire made of a conductive material. Probe 1A includes first terminal 11D, which contacts an electrode of a semiconductor integrated circuit when testing the semiconductor integrated circuit; second terminal 12A, which contacts an electrode of a circuit board including a test circuit; and spring 13, which is provided between first terminal 11D and second terminal 12A and connects first terminal 11 and second terminal 12 so that they can move back and forth. In probe 1A, an axis N2 is defined as an axis that coincides with the central axis of spring 13 (the winding axis of the wire). When probe 1A is brought into contact with a semiconductor integrated circuit, spring 13 expands and contracts in the axial direction, thereby cushioning impact on the electrode of the semiconductor integrated circuit and applying a load to the semiconductor integrated circuit and the circuit board.

[0052] The first terminal 11D is formed by bending and extending a portion of one end 103 of the wire. The first terminal 11D extends from the first extending portion 133 along the axis N2 and then tilts toward the axis N2, with the tip located on the axis N2. This tip comes into contact with an electrode of the semiconductor integrated circuit.

[0053] The second terminal 12A is formed by bending and extending a portion of the other end 104 of the wire. The second terminal 12A extends from the second extending portion 134 along the axis N2 and then tilts toward the axis N2, with the tip located on the axis N2. This tip comes into contact with an electrode on the circuit board.

[0054] In the probe 1A, the first terminal portion 11D is connected to the first extending portion 133, and the second terminal portion 12A is connected to the second extending portion .

[0055] A signal supplied to the first terminal 11D reaches the second terminal 12A via two paths.

[0056] In the first path C3, a signal supplied to the first terminal portion 11D reaches the first end portion 131 via the first extension portion 133 and then reaches the contact point P C 2 and reaches the second terminal portion 12A.

[0057] In the second path C4, the signal supplied to the first terminal portion 11D is transmitted to the contact point P C 1, and then passes through the second end portion 132 and the second extension portion 134 to reach the second terminal portion 12A.

[0058] In this way, in the probe 1A, the contact P C 1 or contact P C 2. A signal is transmitted to the other terminal portion via the first extension portion 133 or the second extension portion 134. Therefore, the signal is transmitted through a path that is shorter than the overall length of the wire of the probe 1A.

[0059] According to the above-described second embodiment, as in the first embodiment, in probe 1A, the terminal portion and spring portion 13 are in point contact, and even when the probe is deformed by a load, the contact position merely moves, and the point contact is maintained. At this time, a signal supplied to one of the terminal portions is transmitted via a path that is shorter than the entire length of the wire via the point contact, so that friction at the contact portion is small and load hysteresis is small, thereby ensuring stable electrical conduction.

[0060] In the above-mentioned embodiment 2, an example was described in which the tip ends of the first terminal portion 11D and the second terminal portion 12A are located on the axis N2, but the tip positions can be appropriately changed in design.

[0061] Although the embodiments for carrying out the present invention have been described above, the present invention should not be limited to only the above-described embodiments. In the above-described embodiments, an example has been described in which the first extension portion 133 and the second extension portion 134 contact the ends (first end 131 and second end 132) of the wound portion (wound portion 130, first end 131 and second end 132) of the spring portion 13, respectively. However, it is sufficient that the first extension portion 133 contacts the second end 132 and the second extension portion 134 contacts the first end 131. Furthermore, the contacts are not limited to the ends of the wound portion, but may be made with a part of the wound portion. Specifically, the first extension portion 133 contacts the second end portion 132 and also contacts any portion of the winding portion 130 and the first end portion 131, and the second extension portion 134 contacts the first end portion 131 and also contacts any portion of the winding portion 130 and the second end portion 132 that is different from the portion that the first extension portion 133 contacts. When the first extension portion 133 and the second extension portion 134 each contact the alert portion 130, the first extension portion 133 and the second extension portion 134 contact different portions of the winding portion. In this case, the contact positions of the first extension portion 133 and the second extension portion 134 on the winding portion 130 are preferably within the range of one turn of the wire. Furthermore, the contact portion of the wound portion with the extending portion may have a diameter equal to or larger than that of the other portions, or a portion of the first extending portion 133 and the second extending portion 134 may be bent toward the wound portion, and the bent portion may be brought into contact with the wound portion.

[0062] As described above, the contact probe according to the present invention is useful for ensuring stable electrical conduction. [Explanation of symbols]

[0063] 1. 1A contact probe (probe) 11, 11A~11D 1st terminal section 12, 12A 2nd terminal section 13 Spring section 130 Winding section 131 First end 132 Second end 133 1st extension part 134 Second extension part

Claims

1. A contact probe that contacts a contact object at both ends in the longitudinal direction, a first terminal portion that contacts one of the contact objects; a second terminal portion that contacts the other contact object; a spring portion provided between the first and second terminal portions and connecting the first and second terminal portions so as to be movable forward and backward; Equipped with The contact probe is made by bending a continuous wire rod, The spring portion is a winding portion wound at predetermined intervals; a first end portion of the winding portion that is an end portion of the winding portion on the second terminal portion side; a second end portion of the winding portion that is an end portion of the winding portion on the first terminal portion side; a first extension portion that extends from the first end toward the second end along the axial direction of the contact probe and is connected to the first terminal portion; a second extension portion extending from the second end portion toward the first end portion along the axial direction and connected to the second terminal portion; and the first extension portion contacts the second end portion; The second extension portion contacts the first end portion. A contact probe characterized by:

2. The first and second ends have a larger diameter than the spring portion, the first end and the second extension portion are in contact with each other, The second end and the first extension portion are in contact with each other. The contact probe according to claim 1 .

3. the first terminal portion extends from the first extension portion along the axial direction and then bends back toward the spring portion, The second terminal portion extends from the second extension portion along the axial direction and then bends back toward the spring portion. The contact probe according to claim 1 .

4. The bent portion of the first and / or second terminal portion is arc-shaped. The contact probe according to claim 3 .

5. The bent portion of the first and / or second terminal has a top portion having a sharp tip shape. The contact probe according to claim 3 .

6. The bent portion of the first and / or second terminal has a flat top portion. The contact probe according to claim 3 .

7. The bent portion of the first and / or second terminal has a zigzag shape with a plurality of tapered peaks. The contact probe according to claim 3 .

8. the first terminal portion extends from the first extension portion along the axial direction and then inclines toward the axial direction, The second terminal portion extends from the second extension portion along the axial direction and then inclines toward the axial direction. The contact probe according to claim 1 .

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