Wiring body and display device

Abstract

To provide a wiring body capable of reducing a transmission loss while suppressing influences upon visibility of a conductive wire, and a display device.SOLUTION: In a tapered part 70, a conductive wire 50 is widened toward one side away from a light transmissible substrate 1. A line of sight from a top face side of a conductor layer 5 is capable of avoiding blockage by side faces 71A and 71B. An expansion part 80 is provided on the top face side of the conductor layer 5. The expansion part 80 includes a portion which is wider than the tapered part 70, protrudes outside in a width direction and is bent, thereby increasing a volume of the conductive wire 50 in the vicinity of the top face of the conductor layer 5. A transmission loss can be reduced in an antenna for high frequencies by a skin effect. The expansion part 80 is disposed on one side of the tapered part 70 in a height direction. The expansion part 80 of a large volume avoids being disposed at a position which is deep from the top face of the conductor layer 5, thereby reducing influences of the expansion part 80 upon visibility.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a wiring body and a display device. [Background technology]

[0002] Conventionally, a wiring body including a substrate, a mesh-shaped conductor pattern provided on the substrate, and a resin layer provided on the substrate has been known (for example, Patent Document 1). Trenches are formed in the resin layer, and conductive lines of the conductor pattern are formed in the trenches. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-163571 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, in the above-described wiring body, when the volume of the conductive wire is reduced in order to suppress the effect on the visibility of the conductive wire, there is a problem that transmission loss occurs when the wiring body is used as an antenna, etc. Therefore, there has been a demand for reducing transmission loss while suppressing the effect on the visibility of the conductive wire.

[0005] Therefore, an object of the present disclosure is to provide a wiring body and a display device that can reduce transmission loss while suppressing the effect on the visibility of conductive lines. [Means for solving the problem]

[0006] A wiring body according to one aspect of the present disclosure comprises a substrate and a conductor layer provided on the substrate and having conductive wires extending linearly in a predetermined extension direction, and in a cross-sectional view cut in a direction perpendicular to the extension direction, the conductive wires have a tapered portion in which the width of the conductive wire increases in the height direction as they move away from the substrate, and an extended portion located on one side of the tapered portion and wider than the tapered portion, and the extended portion includes a portion that protrudes outward in the width direction and curves.

[0007] A display device according to one aspect of the present disclosure includes the wiring body described above. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device that can reduce transmission loss while suppressing the effect on the visibility of conductive lines. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating an embodiment of a conductive film including a wiring body. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 10 is a cross-sectional view showing a conductive film according to a modified example. [Figure 4] 1 is a cross-sectional view showing an embodiment of a display device. [Figure 5] FIG. 2 is a plan view of an antenna including a wiring body. [Figure 6] FIG. 2 is an enlarged cross-sectional view of the wiring body 200. [Figure 7] FIG. 7 is an enlarged cross-sectional view of the expanded portion and the curved surface in FIG. 6. [Figure 8] FIG. 7 is a view in which the resin layer is removed from FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0011] FIG. 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . The conductive film 20 includes an antenna 300, and the antenna 300 includes the wiring body 200. The conductive film 20 shown in FIGS. 1 and 2 includes a film-like light-transmitting substrate 1 (substrate), a conductor layer 5 provided on one main surface 1S of the light-transmitting substrate 1, and a resin layer 7 provided on one main surface 1S of the light-transmitting substrate 1. The conductor layer 5 includes a conductor portion 3 that extends in a direction along the main surface 1S of the light-transmitting substrate 1 and includes a portion having a pattern including multiple openings 3a. The resin layer 7 includes an insulating resin portion 7A that fills the openings 3a of the conductor portion 3 and a light-transmitting resin layer 7B that is provided on the outer periphery of the conductor portion 3. In FIG. 2 , the conductor layer 5 is shown in a deformed state, with the width of the conductor portion 3 emphasized. The thickness of each layer is also shown in a deformed state. 1, the conductor layer 5 is formed near one of the short sides of the conductive film 20, but the position where the conductor layer 5 is formed is not particularly limited, and the conductor layer 5 may be formed near the long side.

[0012] The light-transmitting substrate 1 has a degree of light transparency required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate 1 may be 90 to 100%. The haze of the light-transmitting substrate 1 may be 0 to 5%.

[0013] The light-transmitting substrate 1 may be, for example, a transparent resin film, examples of which include films of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI). Alternatively, the light-transmitting substrate 1 may be a glass substrate.

[0014] For example, as shown in FIG. 3 , the light-transmitting substrate 1 may be a laminate having a light-transmitting support film 11, and an intermediate resin layer 12 and an underlayer 13 provided in this order on the support film 11. The support film 11 may be the transparent resin film described above. The underlayer 13 is a layer provided for forming the conductor portion 3 by electroless plating or the like. When the conductor portion 3 is formed by another method, the underlayer 13 does not necessarily have to be provided. The intermediate resin layer 12 does not have to be provided between the support film 11 and the underlayer 13.

[0015] The thickness of the light-transmitting substrate 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.

[0016] The intermediate resin layer 12 can improve the adhesion between the support film 11 and the underlayer 13. If the underlayer 13 is not provided, the intermediate resin layer 12 can be provided between the support film 11 and the light-transmitting resin layer 7B to improve the adhesion between the support film 11 and the light-transmitting resin layer 7B.

[0017] The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is an acrylic resin. An example of the inorganic filler is silica.

[0018] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0019] The underlayer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of the curable resin contained in the curable resin composition include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo polymerization under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0020] The catalyst contained in the underlayer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be one type alone or a combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0021] The catalyst content in the underlayer 13 may be 3 mass% or more, 4 mass% or more, or 5 mass% or more, based on the total amount of the underlayer 13, and may be 50 mass% or less, 40 mass% or less, or 25 mass% or less.

[0022] The thickness of the underlayer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.

[0023] The light-transmitting substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. By providing the protective layer, scratches on the support film 11 are suppressed. The protective layer may be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, or may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0024] The conductor portion 3 constituting the conductor layer 5 includes a portion having a pattern including openings 3a. The pattern including openings 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear portions intersecting each other. The conductor portion 3 having a mesh-like pattern can function well as, for example, a radiation conductor and a feed line of the antenna 300. The conductor portion 3 may also have a planar pattern without openings 3a that functions as a terminal and a ground pad portion. Details of the pattern configuration of the conductor portion 3 in the conductor layer 5 will be described later.

[0025] The conductor portion 3 may contain a metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, or may contain copper. The conductor portion 3 may be a metal plating formed by a plating method. The conductor portion 3 may further contain a non-metallic element such as phosphorus, as long as appropriate conductivity is maintained.

[0026] The conductor part 3 may be a laminate composed of multiple layers. The conductor part 3 may also have a blackened layer as a surface layer on the side opposite to the light-transmitting substrate 1. The blackened layer can contribute to improving the visibility of a display device incorporating the conductive film.

[0027] The insulating resin portion 7A is made of a light-transmitting resin and is provided so as to fill the opening 3a of the conductor portion 3, and the insulating resin portion 7A and the conductor portion 3 usually form a flat surface.

[0028] The light-transmitting resin layer 7B is formed of a resin having light transparency. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.

[0029] The difference between the refractive index of the light-transmitting substrate 1 (or the refractive index of the support film constituting the light-transmitting substrate 1) and the refractive index of the light-transmitting resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, or 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflectance spectroscopic film thickness meter. From the viewpoint of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.

[0030] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo a polymerization reaction under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0031] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin portion 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the path length of light passing through the conductive film 20 can be further improved. When the resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B are the same, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed collectively, for example, by forming a pattern from a single curable resin layer using an imprinting method or the like.

[0032] The conductive film 20 can be manufactured by a method including pattern formation using, for example, an imprinting method. One example of a method for manufacturing the conductive film 20 includes preparing a light-transmitting substrate 1 having a support film and, on one main surface of the support film, an intermediate resin layer and a catalyst-containing underlayer. Forming a curable resin layer on the main surface 1S of the light-transmitting substrate 1 facing the underlayer. Forming trenches exposing the underlayer by an imprinting method using a mold with protrusions. Forming conductors 3 filling the trenches by electroless plating, growing metal plating from the underlayer. By curing the curable resin layer with the mold pressed into the curable resin layer, an insulating resin portion 7A having a pattern including openings with the inverse shape of the mold's protrusions and a light-transmitting resin layer 7B are simultaneously formed. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to imprinting; any method, such as photolithography, can be used.

[0033] The conductive film described above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic electroluminescence (EL) display device. FIG. 4 is a cross-sectional view showing an embodiment of a display device incorporating a conductive film. The display device 100 shown in FIG. 4 includes an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device is not limited to the configuration shown in FIG. 4 and can be appropriately modified as needed. For example, the polarizing plate 30 may be provided between the image display unit 10 and the conductive film 20. The image display unit 10 may be, for example, a liquid crystal display unit. The polarizing plate 30 and the cover glass 40 may be those commonly used in display devices. The polarizing plate 30 and the cover glass 40 are not necessarily provided. Light for image display emitted from the image display region 10S of the image display unit 10 passes through a path with a highly uniform optical path length that includes the conductive film 20. This enables a good image display with a high degree of uniformity and suppressed moire.

[0034] Next, the conductor layer 5 and its surrounding structure will be described in more detail with reference to FIG. 5. FIG. 5 is a plan view of an antenna 300 including a wiring body 200. FIG. 5 also shows an enlarged view of a portion of the conductor layer 5. In the following description, XY coordinates are defined relative to a plane parallel to the main surface 1S. The Y-axis direction is a direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to a direction perpendicular to the sides of the conductive film 20. The central side of the conductive film 20 is defined as the positive side in the Y-axis direction, and the outer periphery of the conductive film 20 is defined as the negative side in the Y-axis direction. The X-axis direction is a direction perpendicular to the Y-axis direction along the main surface S1, and in the example shown in FIG. 1, corresponds to the direction in which the sides of the conductive film 20 extend. One side of the conductive film 20 along which the sides extend is defined as the positive side in the X-axis direction, and the other side is defined as the negative side in the X-axis direction. The direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. The side of the light-transmitting substrate 1 on which the resin layer 7 is provided is defined as the positive side in the Z-axis direction.

[0035] As shown in FIG. 5 , the mesh pattern of the conductor layer 5 includes a plurality of first conductive wires 51 and a plurality of second conductive wires 52. The first conductive wires 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged spaced apart from one another in the X-axis direction. The plurality of first conductive wires 51 are arranged spaced apart at an equal pitch. The second conductive wires 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged spaced apart from one another in the Y-axis direction. The plurality of second conductive wires 52 are arranged spaced apart at an equal pitch. The thickness of the conductive wires 51, 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. The pitch of the conductive wires 51, 52 is also not particularly limited, but may be set to, for example, 100 to 300 μm. Note that the first conductive wire 51 does not have to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not have to be parallel to the X-axis direction as long as it extends in the X-axis direction. When the conductive wires 51 and 52 are not to be distinguished from each other, they may be referred to as conductive wire 50.

[0036] The conductor layer 5 has a radiating element portion 5A and a power feeding portion 5B. The radiating element portion 5A is a region that radiates a signal as an antenna. The radiating element portion 5A has a rectangular shape with two sides parallel to the Y-axis direction and two sides parallel to the X-axis direction. The power feeding portion 5B is a region that feeds power to the radiating element portion 5A. The power feeding portion 5B has a strip shape that extends parallel to the Y-axis direction. The power feeding portion 5B is connected to the negative side of the radiating element portion 5A in the Y-axis direction. The power feeding portion 5B is connected to a terminal not shown.

[0037] Next, the configurations of the resin layer 7 and the conductor layer 5 will be described in more detail with reference to FIG. 6 in addition to FIG. 5 . FIG. 6 is a cross-sectional view of the wiring body 200. Note that, in the following description, the terms "upper" and "lower" will be used, but this does not limit the orientation of the wiring body 200 during use. The positive side in the Z-axis direction may be referred to as "upper" and the negative side as "lower." As described above, as shown in FIG. 6 , the resin layer 7 is provided on the light-transmitting substrate 1. The resin layer 7 is provided so as to cover the main surface 1S on the positive side in the Z-axis direction of the light-transmitting substrate 1. The resin layer 7 has an upper surface 7a on the positive side in the Z-axis direction and a lower surface 7b on the negative side. The lower surface 7b on the negative side is provided so as to contact the main surface 1S of the light-transmitting substrate 1.

[0038] The resin layer 7 has mesh-shaped trenches 60 formed therein, penetrating the resin layer 7 in the Z-axis direction (thickness direction). The mesh-shaped trenches 60 extend from the upper surface 7a on the positive side of the resin layer 7 in the Z-axis direction to the lower surface 7b on the negative side. The conductive wires 50 of the conductor layer 5 are disposed in the mesh-shaped trenches 60. As shown in FIG. 5 , the mesh-shaped trenches 60 have first trenches 61 in which the first conductive wires 51 are disposed and second trenches 62 in which the second conductive wires 52 are disposed. The first trenches 61 are disposed at a pitch and width corresponding to the first conductive wires 51 described above. The second trenches 62 are disposed at a pitch and width corresponding to the second conductive wires 52 described above. That is, the first trenches 61 are linear trenches extending parallel to the Y-axis direction. The first trenches 61 are disposed so as to be spaced apart from each other in the X-axis direction. The multiple first trenches 61 are arranged so as to be spaced apart at an equal pitch. The second trenches 62 are linear trenches extending parallel to the X-axis direction. The multiple second trenches 62 are arranged so as to be spaced apart from each other in the Y-axis direction. The multiple second trenches 62 are arranged so as to be spaced apart at an equal pitch.

[0039] With this configuration, the conductor layer 5 penetrates the resin layer 7. That is, the conductive wire 50 extends from the upper surface 7a on the positive side of the resin layer 7 to the lower surface 7b on the negative side. The upper surface 50a of the conductive wire 50 extends to the same position as the upper surface 7a of the resin layer 7 or to a position near the upper surface 7a. The lower surface 50b of the conductive wire 50 contacts the main surface 1S of the light-transmitting substrate 1. Note that the state in which the conductor layer 5 penetrates the resin layer 7 refers to a state in which the conductive wire 50 is disposed in the trench 60 of the resin layer 7 and reaches the main surface 1S of the light-transmitting substrate 1. Therefore, the upper surface 50a of the conductive wire 50 does not have to reach the upper surface 7a of the resin layer 7, and may be disposed on the negative side of the upper surface 7a in the Z-axis direction, as described below.

[0040] The cross-sectional shape of the conductive wire 50 will be described in more detail with reference to Fig. 6. Note that Fig. 6 illustrates the cross section of a first conductive wire 51 extending in the Y-axis direction as the conductive wire 50, but the second conductive wire 52 extending in the X-axis direction and its surroundings also have a similar structure. As shown in Fig. 6, the conductive wire 50 has, in order from the light-transmitting substrate 1 side, a tapered portion 70, an expanded portion 80, and a curved surface 90.

[0041] The tapered portion 70 is a portion of the conductive wire 50 whose width increases in the Z-axis direction (height direction) toward the positive side (one side) away from the light-transmitting substrate 1. The tapered portion 70 of the conductive wire 50 has side surfaces 71A and 71B that face each other in the width direction (here, the X-axis direction). The side surface 71A is located on one side in the width direction (the negative side in the X-axis direction), and the side surface 71B is located on the other side in the width direction (the positive side in the X-axis direction). The width dimension W1 at the end of the tapered portion 70 on the negative side in the Z-axis direction is smaller than the width dimension W2 at the end of the tapered portion 70 on the positive side in the Z-axis direction. The side surfaces 71A and 71B are tapered so that the distance between them in the X-axis direction increases toward one side in the height direction (the positive side in the Z-axis direction). The tapered portion 70 is a portion in which, in a cross-sectional view from the extension direction of the conductive wire 50 (here, the Y-axis direction), the side surfaces 71A and 71B extend in a substantially straight line without being sharply bent or curved, but are inclined toward the Z-axis direction. The inclination angle of the side surfaces 71A and 71B with respect to the Z-axis is not particularly limited, but may be set to 1 to 10°. Between the tapered portion 70 and the light-transmitting substrate 1, a curved surface 73 is formed, in which the lower surface 50b is curved so as to protrude toward the Z-axis direction. This curved surface 73 does not correspond to the tapered portion 70. The tapered portion 70 may include a portion whose width does not change (is not inclined) or whose width narrows in the Z-axis direction. Furthermore, in the tapered portion 70, the width of the conductive wire 50 may be increased by inclining only one of the side surfaces 71A and 71B, or by inclining the side surfaces 71A and 71B at different inclination angles.

[0042] The expansion portion 80 is located on the positive side of the tapered portion 70 in the Z-axis direction and is wider than the tapered portion 70. The expansion portion 80 is provided at a position adjacent to the tapered portion 70 on the positive side of the Z-axis direction. The expansion portion 80 has side surfaces 81A and 81B facing each other in the width direction (here, the X-axis direction). The side surface 81A is located on one side in the width direction (the negative side in the X-axis direction), and the side surface 81B is located on the other side in the width direction (the positive side in the X-axis direction). The expansion portion 80 includes a portion that protrudes outward in the width direction and curves. Specifically, the side surfaces 81A and 81B of the expansion portion 80 may have a shape that extends along the Z-axis and curves to protrude outward in the width direction. The side surface 81A of the expansion portion 80 includes a portion that protrudes and curves to the negative side in the X-axis direction (outward in the width direction). The side surface 81B of the expansion portion 80 includes a portion that protrudes and curves to the positive side in the X-axis direction (outward in the width direction). However, each side surface 81A, 81B of the extension portion 80 does not need to be curved over the entire area in the Z-axis direction, and may include portions where the width does not change or where the width narrows in the Z-axis direction. Also, for the sake of convenience in explanation, FIG. 6 illustrates an example in which the side surfaces 81A and 81B are symmetrical, but they do not need to be symmetrical. The details of the range of the extension portion 80 will be described later. The width dimension of any point in the Z-axis direction of the extension portion 80 may be larger than the width dimension W2 of the tapered portion 70. The maximum width dimension of the extension portion 80 is defined as width dimension W3.

[0043] The curved surface 90 is the upper surface 50a of the conductive wire 50 on the positive side in the Z-axis direction, and is a surface that curves so as to protrude toward the positive side in the Z-axis direction. The curved surface 90 is provided in an area on the positive side in the Z-axis direction relative to the extension portion 80.

[0044] Here, the relationship between the protruding height of the curved surface 90 and the protruding height of the extension portion 80 will be described with reference to Fig. 7. Fig. 7 is an enlarged cross-sectional view of the extension portion 80 and the curved surface 90 in Fig. 6.

[0045] First, the protrusion height PH1 of the extension section 80 will be described. A boundary point P1 is set at the end of the extension section 80 on the negative side in the Z-axis direction. A reference line STL1 is set that passes through the boundary point P1 and extends in the Z-axis direction at the inclination angle of the tapered section 70. As also shown in FIG. 6, the reference line STL1 is set by a straight line connecting the lower end and upper end of each side surface 71A, 71B. As shown in FIG. 7, a vertex P2 is set at a position of the extension section 80 that is located at the outermost position in the width direction (here, on the positive side in the X-axis direction). At this time, the distance between the vertex P2 and the reference line STL1 in a direction perpendicular to the reference line STL1 is set as the protrusion height PH1 of the extension section 80.

[0046] Next, the protrusion height PH2 of the curved surface 90 will be described. In a cross-sectional view seen from the extension direction of the conductive wire 50 (here, the Y-axis direction), a boundary point P3 is set as the end of the extension portion 80 on the positive side of the Z-axis direction of the extension portion 80, at a position on the positive side of the Z-axis direction from the vertex P2 of the extension portion 80, where the boundary point P3 intersects with the reference line STL1. A reference line STL2 is set that passes through the boundary point P3 and is parallel to the X-axis direction. A vertex P4 is set at a position on the curved surface 90 that is located furthest to the positive side of the Z-axis direction. At this time, the distance in the Z-axis direction between the vertex P4 and the reference line STL2 is set as the protrusion height PH2 of the curved surface 90. The protrusion height PH1 of the extension portion 80 is smaller than the protrusion height PH2 of the curved surface 90. Although not particularly limited, the protrusion height PH1 of the extension portion 80 is set in the range of 0.05 to 0.25 μm. The protrusion height PH2 of the curved surface 90 is set in the range of 0.15 to 0.35 μm.

[0047] Next, the appearance of the conductive wire 50 as viewed from the width direction will be described with reference to FIG. 8. FIG. 8 is a view in which the resin layer 7 has been removed from FIG. 6. FIG. 8 shows the side surface 71A of the tapered portion 70 of the second conductive wire 52, which extends in the X-axis direction, and the side surface 81A of the extended portion 80. Here, the boundary between the tapered portion 70 and the extended portion 80 is referred to as the boundary portion 75. The boundary portion 75 is the position of the end portion on the negative side in the Z-axis direction of the extended portion 80 (the other side opposite to the one side), and corresponds to the location where the boundary point P1 is set in FIG. 7. The height position of the boundary portion 75 of the second conductive wire 52 is not constant at each position in the X-axis direction, which is the extension direction of the second conductive wire 52, but changes randomly. As a result, the position of the boundary portion 75, which is the end portion on the negative side in the Z-axis direction, of the extended portion 80 changes along the extension direction of the conductive wire 50. At this time, the height dimension of the extended portion 80 changes along the extension direction of the conductive wire 50. The same relationship holds true for the first conductive line 51 extending in the Y-axis direction.

[0048] As shown in FIG. 6 , the trench 60 has inner surfaces 60a and 60b that face each other in the width direction. The side surfaces 56A and 56B, 76A and 76B, and 81A and 81B of the conductive wire 50, and (parts of) the curved surface 90, are in surface contact with the inner surfaces 60a and 60b of the trench 60. The resin layer 7 has raised portions 66A and 66B that protrude from both sides of the trench 60 toward one side in the height direction (the positive side in the Z-axis direction) from the upper surface 7a of the resin layer 7. The raised portions 66A and 66B are raised portions of the resin layer 7 on both sides of the curved surface 90 in the width direction so as to be higher toward one side in the height direction than the upper surface 7a of the resin layer 7. The height relationship between the vertex P4 of the curved surface 90 of the conductive wire 50 and the upper end portions of the upper surface 7a of the resin layer 7 and the raised portions 66A and 66B is not particularly limited. The raised portions 66A, 66B are covered by the inner peripheral edge 66a at a portion of both ends in the width direction of the curved surface 90. With this structure, the extended portion 80 is at least partially covered with the resin layer 7 when viewed from a direction (Z-axis direction) perpendicular to the main surface 1S of the light-transmitting substrate 1. In this embodiment, at least the curved shape near the side surfaces 81A, 81B is covered with the resin layer 7.

[0049] Next, the dimensional relationship of the conductive wire 50 will be described with reference to FIG. 6. The height H1 of the conductive wire 50 and the thickness T1 (height dimension) of the resin layer 7 may be 1.5 to 5.0 μm. In this embodiment, the height H1 (height dimension) of the conductive wire 50 is greater than the width (dimension in the X-axis direction) of the conductive wire 50. The conductive wire 50 is configured such that the aspect ratio (height / width) obtained by dividing the height H1 by the width is greater than 1. The aspect ratio may be 2 or greater. The width dimension used to determine this aspect ratio is the largest width dimension W3 of the conductive wire 50. The width dimension W3 is set to approximately 0.5 to 2.0 μm. The largest width dimension W3 of the conductive wire 50 may be 120 to 160% larger than the width dimension W2 of the tapered portion 70. The largest width dimension W2 of the tapered portion 70 may be 140 to 180% larger than the width dimension W1 on the lower surface 50b side.

[0050] The height dimension H3 of the expansion portion 80 may be smaller than the height dimension H2 of the tapered portion 70. For example, the height dimension H3 of the expansion portion 80 may be 35 to 75% of the height dimension H2 of the tapered portion 70. Furthermore, the aspect ratio obtained by dividing the height dimension H3 of the expansion portion 80 by the width dimension W3 may be smaller than 1. Furthermore, the aspect ratio may be smaller than 0.85.

[0051] Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

[0052] The wiring body 200 of this embodiment comprises a light-transmitting substrate 1 and a conductor layer 5 provided on the light-transmitting substrate 1 and having conductive wires 50 extending linearly in a predetermined extension direction, and in a cross-sectional view cut in a direction perpendicular to the extension direction, the conductive wires 50 have a tapered portion 70 in which the width of the conductive wire 50 increases in the height direction as it moves toward one side away from the light-transmitting substrate 1, and an extended portion 80 located on one side of the tapered portion 70 and wider than the tapered portion 70, and the extended portion 80 includes a portion that protrudes outward in the width direction and is curved.

[0053] In the wiring body 200, the conductive wire 50 has a tapered portion 70 and an extended portion 80 in a cross-sectional view taken in a direction perpendicular to the extension direction. The tapered portion 70, located on the light-transmitting substrate 1 side of the conductor layer 5, has a width that increases in the height direction as it moves away from the light-transmitting substrate 1. This shape prevents the line of sight from being blocked by the side surfaces 71A and 71B from the top surface of the conductor layer 5, compared to when the side surfaces 71A and 71B are parallel to the Z-axis direction. Meanwhile, an extended portion 80 is provided on the top surface of the conductor layer 5. The extended portion 80 is wider than the tapered portion 70 and includes a curved portion that protrudes outward in the width direction, thereby increasing the volume of the conductive wire 50 near the top surface of the conductor layer 5. This reduces transmission loss due to the skin effect, particularly in high-frequency antennas. The extended portion 80 is also located on one side of the tapered portion 70 in the height direction. Therefore, the influence of the extension portion 80 on visibility can be reduced by avoiding placing the extension portion 80, which has a large volume, at a position deep from the upper surface of the conductor layer 5. As described above, it is possible to reduce transmission loss while suppressing the influence on visibility of the conductive wires.

[0054] The upper surface 50a on one side in the height direction of the conductive wire 50 is a curved surface 90 that protrudes to one side, and the protruding height PH1 of the extension portion 80 may be smaller than the protruding height PH2 of the curved surface 90. In this case, if the line of sight is incident near the upper surface 50a of the conductive wire 50 at a large incident angle, the line of sight would be blocked by the edge in the width direction if the upper surface 50a were flat. However, with the curved surface 90, the edge in the width direction is lowered, so the line of sight is not blocked. Therefore, the impact on visibility can be suppressed. Furthermore, the protruding height PH1 of the extension portion 80 is kept from becoming excessively large. Therefore, the extension portion 80 can suppress the impact on visibility while reducing transmission loss.

[0055] The wiring body 200 further includes a resin layer 7 provided on the light-transmitting substrate 1, and the resin layer 7 may have a trench 60 in which the conductive wire 50 is disposed. In this case, the adhesion of the conductive wire 50 to the light-transmitting substrate 1 can be ensured.

[0056] The position of the end of the extension portion 80 on the opposite side from one side (i.e., the boundary portion 75) may vary along the extension direction of the conductive wire 50. In this case, the boundary portion 75 has a shape that varies randomly, so that it can penetrate into the resin layer 7 and provide an anchor effect. Therefore, the adhesiveness of the conductive wire 50 to the resin layer 7 on the light-transmitting substrate 1 can be ensured.

[0057] When viewed from a direction perpendicular to the main surface 1S of the light-transmitting substrate 1, at least a portion of the extension portion 80 may be covered with the resin layer 7. In this case, the influence on visibility from an oblique direction can be reduced compared to when the entire extension portion 80 is not covered with the resin layer 7 when viewed from a direction perpendicular to the main surface 1S of the light-transmitting substrate 1.

[0058] The aspect ratio of the conductive wire 50, which is the height dimension divided by the width dimension, may be greater than 1. In this case, increasing the visibility of the conductor portion by thinning the conductive wire 50 is suppressed, and increasing the aspect ratio increases the conductor cross-sectional area, thereby decreasing the resistance value, thereby enabling a reduction in transmission loss.

[0059] The height dimension H3 of the extension portion 80 may be smaller than the height dimension H2 of the tapered portion 70. In this case, by preventing the extension portion 80 from becoming too large in the height direction (Z-axis direction), the impact on the visibility of the conductive wire 50 can be suppressed.

[0060] The aspect ratio of the extension 80 obtained by dividing the height dimension by the width dimension may be smaller than 1. In this case, by ensuring a sufficient width dimension for the extension 80, transmission loss can be reduced.

[0061] A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.

[0062] According to the display device 100 described above, the same functions and effects as those of the wiring body 200 described above can be obtained.

[0063] The present disclosure is not limited to the above-described embodiments.

[0064] For example, the shapes of the conductive wire 50 and the resin layer 7 are not limited to those shown in Fig. 6 and can be changed as appropriate without departing from the spirit of the present disclosure. The height dimensions of each part, the relationship between the width dimensions, and the relationship between the aspect ratios are also not limited to the above-described embodiment and can be changed as appropriate. In particular, the shapes of the extension portion 80 and the vicinity of the curved surface 90 can be changed as appropriate.

[0065] [Form 1] A substrate; a conductor layer provided on the substrate and having conductive lines extending linearly in a predetermined extension direction; In a cross-sectional view taken in a direction perpendicular to the extending direction, the conductive wire has a tapered portion in which the width of the conductive line increases toward one side away from the base material in a height direction; an extension portion that is disposed on the one side of the tapered portion and has a width greater than that of the tapered portion, The wiring body, wherein the extension portion includes a portion that protrudes outward in the width direction and is curved. [Form 2] the surface of the conductive wire on the one side in the height direction is a curved surface that protrudes to the one side, The wiring body according to embodiment 1, wherein the extension portion has a protruding height smaller than that of the curved surface. [Form 3] Further comprising a resin layer provided on the substrate, 3. The wiring body according to claim 1, wherein the resin layer has a trench in which the conductive line is disposed. [Form 4] The wiring body according to any one of the first to third embodiments, wherein the position of the end of the extension portion on the other side opposite to the one side changes along the extending direction of the conductive wire. [Form 5] 5. The wiring body according to any one of embodiments 1 to 4, wherein the extension portion is at least partially covered with the resin layer when viewed from a direction perpendicular to the main surface of the base. [Form 6] 6. The wiring body according to any one of embodiments 1 to 5, wherein an aspect ratio obtained by dividing the height dimension of the conductive wire by the width dimension thereof is greater than 1. [Form 7] 7. The wiring body according to any one of the first to sixth embodiments, wherein the height of the expanded portion is smaller than the height of the tapered portion. [Form 8] 8. The wiring body according to any one of embodiments 1 to 7, wherein the aspect ratio of the extension portion obtained by dividing the height dimension by the width dimension is smaller than 1. [Form 9] A display device comprising the wiring body according to any one of the first to eighth aspects. [Explanation of symbols]

[0066] 1...light-transmitting substrate (substrate), 7...resin layer, 5...conductor layer, 50...conductive wire, 60...trench, 70...tapered portion, 80...extended portion, 90...curved surface, 100...display device, 200...wiring body.

Claims

1. A substrate; a conductor layer provided on the substrate and having conductive lines extending linearly in a predetermined extension direction; In a cross-sectional view taken in a direction perpendicular to the extending direction, the conductive wire has a tapered portion in which the width of the conductive line increases toward one side away from the base material in a height direction; an extension portion that is disposed on the one side of the tapered portion and has a width greater than that of the tapered portion, The wiring body, wherein the extension portion includes a portion that protrudes outward in the width direction and is curved.

2. the surface of the conductive wire on the one side in the height direction is a curved surface that protrudes to the one side, The wiring body according to claim 1 , wherein a protruding height of the extension portion is smaller than a protruding height of the curved surface.

3. Further comprising a resin layer provided on the substrate, The wiring body according to claim 1 , wherein the resin layer has a trench in which the conductive line is disposed.

4. The wiring body according to claim 1 , wherein the position of the end of the extension portion on the other side opposite to the one side changes along the extending direction of the conductive wire.

5. The wiring body according to claim 1 , wherein the extension portion is at least partially covered with the resin layer when viewed in a direction perpendicular to the main surface of the base material.

6. The wiring body according to claim 1 , wherein an aspect ratio obtained by dividing the height dimension of the conductive line by the width dimension thereof is greater than 1.

7. The wiring body according to claim 1 , wherein a height dimension of the expanded portion is smaller than a height dimension of the tapered portion.

8. The wiring body according to claim 1 , wherein an aspect ratio obtained by dividing the height dimension of the extension portion by the width dimension thereof is less than 1.

9. A display device comprising the wiring body according to any one of claims 1 to 8.

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