Arrangement member and light-emitting device

Abstract

To realize a placement component that takes into consideration ease of mounting.SOLUTION: An arrangement member includes an arrangement surface, a plurality of electrode members provided on the arrangement surface, the electrode members including a first electrode member and a second electrode member spaced apart from each other, and a plurality of identification marks, including a first identification mark provided on the first electrode member side and a second identification mark provided on the second electrode member side, which can identify the first electrode and the second electrode, and which can identify a reference line for alignment, and the first identification mark and the second identification mark have different marking shapes.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to an arrangement member and a light-emitting device. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2009-76524 discloses a light-emitting device including a light-emitting element, a submount on which a convex alignment mark is formed as a reference point, and a wire. In this light-emitting device, a metal member provided on the submount is connected to an electrode of the light-emitting element mounted on the submount by a wire. The submount also serves as a placement member on which the light-emitting element is placed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2009-76524 Summary of the Invention [Problem to be solved by the invention]

[0004] An invention is disclosed that solves the problem of realizing a placement member that takes into consideration convenience when mounting the placement member and light-emitting elements.

[0005] Alternatively, instead of the above-mentioned problem, an invention is disclosed that solves the problem of realizing a light-emitting device that can extract light efficiently.

[0006] This specification also discloses inventions that solve multiple of the above-mentioned problems in a composite manner. [Means for solving the problem]

[0007] The arrangement member disclosed in the embodiment comprises an arrangement surface, a plurality of electrode members provided on the arrangement surface, including a first electrode member and a second electrode member spaced apart from each other, and a plurality of identification marks including a first identification mark provided on the first electrode member side and capable of identifying the first electrode and the second electrode, and a second identification mark provided on the second electrode member side, capable of identifying a reference line for alignment, wherein the first identification mark and the second identification mark have different marking shapes.

[0008] The light emitting device disclosed in the embodiment comprises the above-mentioned placement member, one or more light emitting elements that are placed on the placement surface and electrically connected to the first electrode member and the second electrode member, and a package in which the one or more placement members and the one or more light emitting elements are placed.

[0009] In at least one of one or more inventions disclosed in the embodiments, it is possible to realize a placement member that takes into consideration convenience when mounting the placement member and the light emitting element. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the light emitting device according to the embodiment taken along the line II-II in FIG. [Figure 3] FIG. 3 is a top view of the light emitting device according to the embodiment with the cover removed. [Figure 4] FIG. 4 is a top view of a state in which a submount is disposed on a base body according to the embodiment. [Figure 5] FIG. 5 is a cross-sectional view of a package according to an embodiment. [Figure 6] FIG. 6 is a top view of the base body according to the embodiment. [Figure 7] FIG. 7 is a bottom view of the base body according to the embodiment. [Figure 8] FIG. 8 is a cross-sectional view of the base body according to the embodiment taken along the line VIII-VIII in FIG. [Figure 9] FIG. 9 is a top view of the submount (placement member) according to the embodiment. [Figure 10] FIG. 10 is a top view of a state in which a light emitting element is disposed on a submount according to the embodiment. [Figure 11] FIG. 11 is a side view of the submount according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0012] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0013] Furthermore, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and back (front / rear), front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships during use.

[0014] In the drawings, directions such as the X direction, Y direction, and Z direction may be indicated using arrows. The directions of these arrows are consistent among multiple drawings relating to the same embodiment. In the drawings, the direction of an arrow marked with X, Y, or Z is the positive direction, and the opposite direction is the negative direction. For example, a direction with X at the end of an arrow is the X direction and the positive direction. In this specification, a direction that is the X direction and the positive direction is referred to as the "positive X direction," and the opposite direction is referred to as the "negative X direction." When referring to the "X direction," it is intended to include both the positive and negative directions. The same applies to the Y and Z directions.

[0015] Furthermore, in this specification, when a certain object is described by specifying "one or more," both the form in which there is one object and the form in which there is multiple objects are described together. Therefore, a description specifying "one or more" supports any of embodiments including one or more objects, embodiments including at least one object, and embodiments including multiple objects.

[0016] Furthermore, in this specification, a description of "one or each" object is a description that compiles a description of one object in an embodiment having one object, a description of one object in an embodiment having multiple objects, and a description of each of the objects in an embodiment having multiple objects. Therefore, a description of "one or each" object supports all of the following: in an embodiment having one object, this one object has the explanatory content; in an embodiment having multiple objects, at least one of these objects has the explanatory content; in an embodiment having multiple objects, each of these multiple objects has the explanatory content; and in an embodiment having one or multiple objects, all of the objects have the explanatory content.

[0017] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. A "component" refers to an object that is handled physically as a single unit. An object that is handled physically as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be handled physically as a single unit. For example, the term "part" is used when referring to a portion of a single component, or when referring to multiple components collectively as a single object.

[0018] The distinction between "component" and "part" above does not indicate a conscious intention to limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0019] Furthermore, in this specification or claims, when there are multiple elements of a certain type and they need to be distinguished from one another, the elements may be prefixed with "first" or "second." Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not be the same between the specification and the claims.

[0020] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked "first" and "third" in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for clarity. In this case, the elements marked "first" and "second" in the claims refer to the elements marked "first" and "third" in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0021] Hereinafter, embodiments for carrying out the present invention will be described. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. Note that the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only embodiments in which the present invention can be realized. Note that the sizes and positional relationships of components shown in each drawing may be exaggerated for ease of understanding.

[0022] <Embodiment> A light emitting device 1 according to an embodiment will be described. FIGS. 1 to 11 are diagrams illustrating an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a cross-sectional view of the light emitting device 1 taken along the line II-II in FIG. 1. FIG. 3 is a top view of the light emitting device 1 with the cover 14 removed. FIG. 4 is a top view of the base 11 with a submount 30 disposed thereon. The imaginary lines L2 and L3 are indicated by dashed lines. FIG. 5 is a cross-sectional view of the package 10 taken along the line II-II in FIG. 1. FIG. 6 is a top view of the base 11. FIG. 7 is a bottom view of the base 11. FIG. 8 is a cross-sectional view of the base 11 taken along the line VIII-VIII in FIG. 6. FIG. 9 is a top view of the submount 30. FIG. 10 is a top view of the submount 30 with a light emitting element 20 disposed thereon. FIG. 11 is a side view of the submount 30.

[0023] The light emitting device 1 includes a plurality of components, including a package 10, one or more light emitting elements 20, one or more submounts 30, and a plurality of wirings 60.

[0024] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the one or more light emitting elements 20. Furthermore, the light emitting device 1 may not include some of the components listed here.

[0025] First, each component will be described.

[0026] (Package 10) The package 10 includes a base 11 and a lid 14. The lid 14 is joined to the base 11 to form the package 10. An internal space is defined in the package 10 in which other components are placed. This internal space is a closed space surrounded by the base 11 and the lid 14. This internal space can also be a space sealed in a vacuum or airtight state.

[0027] When viewed from above, the outer edge of the package 10 has a rectangular shape. This rectangle can have a long side and a short side. In the illustrated package 10, the long side of the rectangle is oriented in the X direction, and the short side is oriented in the Y direction. However, when viewed from above, the outer edge of the package 10 does not have to have a rectangular shape.

[0028] An internal space in which other components are placed is formed in the package 10. The first upper surface 11A of the package 10 is part of the area that defines the internal space. In addition, each of the inner side surfaces 11E and the lower surface 14B of the package 10 is also part of the area that defines the internal space.

[0029] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. The one or more outer surfaces 11D intersect with the second upper surface 11C. The one or more outer surfaces 11D intersect with the lower surface 11B. The one or more inner surfaces 11E intersect with the second upper surface 11C.

[0030] When viewed from above, the outer edge shape of base 11 is rectangular. When viewed from above, the outer edge shape of base 11 is the outer edge shape of package 10. When viewed from above, the outer edge shape of first top surface 11A is rectangular. This rectangle can be a rectangle having long sides and short sides. The long side direction of first top surface 11A and the long side direction of the outer edge shape of base 11 are parallel. Note that when viewed from above, the outer edge shape of first top surface 11A does not have to be rectangular.

[0031] In a top view, first top surface 11A is surrounded by second top surface 11C. Second top surface 11C is an annular surface that surrounds first top surface 11A in a top view. Second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of second top surface 11C is referred to as the inner frame of second top surface 11C, and the frame defined by the outer edge of second top surface 11C is referred to as the outer frame of second top surface 11C.

[0032] The base 11 has a recess surrounded by a frame by the second upper surface 11C. The recess defines a portion of the base 11 that is recessed below the second upper surface 11C. The first upper surface 11A is a part of the recess. One or more inner surfaces 11E are also a part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0033] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, one step portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0034] One or each step portion 11F is provided inside the inner frame of the second upper surface 11C in top view. One or each step portion 11F is formed along part or all of the inner surface 11E in top view. In the base 11, the side surface 11H is an inner surface, but the side surface 11H and the inner surface 11E are different surfaces. One or each inner surface 11E and one or each side surface 11H are perpendicular to the first upper surface 11A. Here, the perpendicular allows for a difference of ±3 degrees.

[0035] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions where their respective side surfaces 11H face each other. The first step portion 11F1 and the second step portion 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0036] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be made of different materials. The base 11 may be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0037] Base portion 11M includes a first upper surface 11A. Frame portion 11N includes a second upper surface 11C. Frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. Frame portion 11N includes one or more step portions 11F.

[0038] The lower surface of base 11M constitutes part or all of the area of ​​lower surface 11B of base body 11. When the lower surface of base 11M constitutes part of the area of ​​lower surface 11B of base body 11, the lower surface of frame 11N constitutes the remaining area of ​​lower surface 11B of the base.

[0039] The base 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more first wiring portions 12A1 disposed in the internal space of the package 10 and one or more second wiring portions 12A2 provided on the outer surface of the package 10.

[0040] One or each first wiring portion 12A1 is provided on the upper surface 11G of the stepped portion 11F. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the first stepped portion 11F1. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the second stepped portion 11F2.

[0041] One or each second wiring portion 12A2 is provided on the lower surface 11B of package 10. One or each second wiring portion 12A2 is provided on the lower surface of frame portion 11N. Note that second wiring portion 12A2 may be provided on an outer surface of package 10 different from lower surface 11B.

[0042] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the first step portion 11F1 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the first step portion 11F1 and is parallel to this side surface 11H.

[0043] When viewed from above, the base 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base 11 in the region that includes the upper surface 11G of the second step portion 11F2 when the base 11 is divided into two regions by a virtual line that passes through the side surface 11H of the second step portion 11F2 and is parallel to this side surface 11H.

[0044] In the base 11, one or each first wiring portion 12A1 is electrically connected to a second wiring portion 12A2. One or more first wiring portions 12A1 are electrically connected to different second wiring portions 12A2.

[0045] The base 11 has a bonding pattern 13A. The bonding pattern 13A is provided on the second upper surface 11C. The bonding pattern 13A is provided in a ring shape. The bonding pattern 13A is provided in a rectangular ring shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0046] The base 11 can be formed, for example, using ceramic as the main material. Examples of ceramic that can be the main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0047] Here, the term "main material" refers to the material that accounts for the largest proportion by mass or volume of the target structure. Note that when the target structure is formed from a single material, that material is the main material. In other words, when a material is the main material, it means that the proportion of that material can be 100%.

[0048] The base 11 may be formed using a base member and a frame member that are made of different main materials. The base member can be made of, for example, a material with excellent heat dissipation properties, such as a metal or a metal-containing composite, graphite, or diamond, as its main material. Examples of metals that can be used as the main material of the base member include copper, aluminum, and iron. Examples of metal-containing composites that can be used as the main material of the base member include copper-molybdenum and copper-tungsten. The frame member can be made of, for example, the ceramics listed above as the main material of the base 11.

[0049] The wiring portion 12A can be formed, for example, using a metal material as the main material. Examples of the metal material that is the main material of the wiring portion 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, and alloys containing these metals. The wiring portion 12A can be configured, for example, with one or more metal layers.

[0050] The bonding pattern 13A can be formed, for example, using a metal material as the main material. Examples of the metal material that is the main material of the bonding pattern 13A include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 13A can be formed, for example, by one or more metal layers.

[0051] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is configured in the shape of a rectangular parallelepiped flat plate. However, the shape of the lid 14 does not have to be a rectangular parallelepiped.

[0052] The lid 14 is bonded to the base 11. The lower surface 14B of the lid 14 is bonded to the second upper surface 11C of the base 11. The lid 14 is bonded to the bonding pattern 13A of the base 11. The lid 14 is bonded to the base 11 via an adhesive.

[0053] The lid body 14 has a translucent property that allows light to pass through. Here, translucency means that the transmittance of light incident on the lid body 14 is 80% or more. Note that the lid body 14 may have a non-translucent region (a region that does not have translucency) in part.

[0054] The lid 14 can be formed, for example, using glass as the main material, or can be formed, for example, using sapphire as the main material.

[0055] (Light emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is rectangular. The outer shape of the light-emitting element 20 when viewed from above is also rectangular. This rectangle has long sides and short sides. However, the shape of the upper surface 21A and the outer shape of the light-emitting element 20 when viewed from above are not limited to this.

[0056] The light-emitting element 20 has a light-emitting surface 22 that emits light. The light-emitting element 20 has one or more light-emitting surfaces 22. The top surface 21A can serve as the light-emitting surface 22. Alternatively, multiple side surfaces 21C can serve as the light-emitting surfaces 22. When multiple surfaces serve as the light-emitting surfaces 22, the top surface 21A can serve as the light-emitting surface 22 that is the main light-emitting surface.

[0057] The light emitting element 20 emits ultraviolet light having an emission peak wavelength in the range of 200 nm to 410 nm. Note that the light emitted from the light emitting element 20 is not limited to the above wavelength range.

[0058] For example, a light emitting diode can be used as the light emitting element 20. Alternatively, for example, a vertical cavity surface emitting laser (VCSEL) can be used as the light emitting element 20.

[0059] (Submount 30) The submount 30 is a mounting member on which other components are mounted. The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered a mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A can have short sides and long sides. However, the shape of the upper surface 31A does not have to be rectangular.

[0060] The outer shape of the submount 30 when viewed from above is rectangular. This rectangle of the submount 30 may have short sides and long sides. However, the outer shape of the submount 30 when viewed from above does not have to be rectangular. When viewed from above, the submount 30 may have an outer shape in which the length in one direction (hereinafter, this direction will be referred to as the short-side direction of the submount 30) is shorter than the length in the direction perpendicular to this (hereinafter, this direction will be referred to as the long-side direction of the submount 30). In the illustrated submount 30, the short-side direction is the same as the X direction, and the long-side direction is the same as the Y direction.

[0061] The submount 30 is configured to include a substrate 32A and an upper metal member 32B. The submount is configured to include multiple upper metal members 32B. The submount 30 may also be configured to include a lower metal member 32C. The upper metal member 32B is provided on the upper surface of the substrate 32A. The upper surface of the substrate 32A can be referred to as the placement surface 39 on which the upper metal member 32B is placed. The lower metal member 32C is provided on the lower surface of the substrate 32A.

[0062] The upper metal member 32B and the lower metal member 32C have higher thermal conductivity than the substrate 32A. By providing metal members on the top and bottom, the heat dissipation performance of the submount 30 can be improved.

[0063] The submount 30 further has a plurality of wiring layers 33. The plurality of wiring layers 33 are provided on the upper metal member 32B. The wiring layers 33 are electrically connected to other components arranged on the submount 30. The wiring layers 33 are connected to electrodes of the other components. The upper metal member 32B is connected to electrodes of the other components via the wiring layers 33. The wiring layers 33 and the upper metal member 32B can be referred to as electrode members 34. The electrode members 34 are provided on the placement surface 39.

[0064] The submount 30 has a plurality of electrode members 34. The plurality of electrode members 34 are spaced apart from one another. The plurality of upper metal members 32B are spaced apart from one another in a top view.

[0065] The plurality of electrode members 34 include a first electrode member 34A and a second electrode member 34B. The plurality of electrode members 34 also include one or more third electrode members 34C. The first electrode member 34A has one wiring layer 33. The second electrode member 34B has one wiring layer 33. The third electrode member 34C has one wiring layer 33.

[0066] The multiple electrode members 34 are aligned in the longitudinal direction of the submount 30. Of the multiple electrode members 34, the two electrode members 34 located at both ends in the longitudinal direction are the first electrode member 34A and the second electrode member 34B. In other words, the first electrode member 34A is provided at one of the ends, and the second electrode member 34B is provided at the other end. The first electrode member 34A and the second electrode member 34B are aligned in the longitudinal direction of the submount 30. One or more third electrode members 34C are provided between the first electrode member 34A and the second electrode member 34B in top view.

[0067] The width of the first electrode member 34A in the longitudinal direction of the submount 30 is smaller than the width of the third electrode member 34C. In the same direction, the width of the first electrode member 34A is 55% to 90% of the width of the third electrode member 34C. This allows the width of the submount 30 in the longitudinal direction to be reduced.

[0068] The width of the second electrode member 34B in the longitudinal direction of the submount 30 is smaller than the width of the third electrode member 34C. In the same direction, the width of the second electrode member 34B is 55% to 90% of the width of the third electrode member 34C. This allows the width of the submount 30 in the longitudinal direction to be reduced.

[0069] In the longitudinal direction of the submount 30, the width of the first electrode member 34A is the same as the width of the second electrode member 34B. Note that "same" here includes a difference of 10% or less. This allows the width of the submount 30 in the longitudinal direction to be reduced.

[0070] The first electrode member 34A, the second electrode member 34B, and the third electrode member 34C have the same width in the short-side direction of the submount 30. The multiple electrode members 34 have the same width in the short-side direction of the submount 30. Note that "same" here includes a difference of 10% or less. This allows the width of the submount 30 in the short-side direction to be reduced.

[0071] The outer shape of the first electrode member 34A is rectangular when viewed from above. The outer shape of the second electrode member 34B is rectangular when viewed from above. The outer shape of the third electrode member 34C is rectangular when viewed from above. The width of each of the first electrode member 34A and the second electrode member 34B in the longitudinal direction of the submount 30 is smaller than the width of the submount 30 in the lateral direction. By giving the first electrode member 34A and the second electrode member 34B such shapes, the width of the submount 30 in the longitudinal direction can be reduced.

[0072] The submount 30 has one or more identification marks 35. The submount 30 has a first identification mark 35A and a second identification mark 35B, which are both identification marks 35. In other words, the submount 30 has a plurality of identification marks 35 including the first identification mark 35A and the second identification mark 35B.

[0073] An alignment reference line L1 can be identified by the multiple identification marks 35. For example, the alignment reference line L1 can be a straight line connecting two identification marks 35. Alternatively, it can be a straight line connecting two points identified based on the multiple identification marks 35. The reference line L1 can be identified based on the first identification mark 35A and the second identification mark 35B.

[0074] For example, the alignment reference line L1 can be used to determine the mounting position of other components to be mounted on the submount 30. Also, for example, the alignment reference line L1 can be used to determine the mounting position of the submount 30 when mounting the submount 30 on other components.

[0075] The first identification mark 35A and the second identification mark 35B have different marking shapes. By using different marking shapes, the first identification mark 35A and the second identification mark 35B can be distinguished from each other. This makes it possible to identify the mark based on whether it is the first identification mark 35A or the second identification mark 35B.

[0076] For example, it is possible to identify the orientation of the submount 30. It is also possible to identify which of the electrode members 34 arranged on both ends is the first electrode member 34A, and to connect the first electrode member 34A to an appropriate electrode of another component. In other words, it is possible to identify the first electrode and the second electrode connected to the first electrode member 34A and the second electrode member 34B of the submount 30.

[0077] The marking shape of the first identification mark 35A is composed of one mark. The marking shape of the second identification mark 35B is composed of multiple marks. The number of marks that make up the marking shape of the second identification mark 35B is greater than the number of marks that make up the marking shape of the first identification mark 35A. The first identification mark 35A and the second identification mark 35B can be distinguished from each other by the difference in the number of marks.

[0078] In the illustrated example of the submount 30, the first identification mark 35A has a marking shape consisting of one circular mark when viewed from above, and the second identification mark 35B has a marking shape consisting of two circular marks lined up when viewed from above. The two circles that make up the marking shape of the second identification mark 35B are arranged side by side in the longitudinal direction of the submount 30.

[0079] In a top view, the reference line L1 passes through one mark that constitutes the marking shape of the first identification mark 35A and multiple marks that constitute the marking shape of the second identification mark 35B. These marks are provided at positions where the reference line L1 passes. This allows the reference line L1 to be derived with high accuracy.

[0080] The width of the marking shape of the second identification mark 35B is larger than the width of the marking shape of the first identification mark 35A in the longitudinal direction of the submount 30. This may increase the longitudinal width of the submount 30, but on the other hand, it allows the reference line L1 to be derived with high accuracy.

[0081] The first identification mark 35A is provided on the first electrode member 34A side, and the second identification mark 35B is provided on the second electrode member 34B side. In the illustrated specific example, the first identification mark 35A is provided on the first electrode member 34A, and the second identification mark 35B is provided on the second electrode member 34B. Note that the identification marks 35A do not have to be provided on the electrode members 34A.

[0082] Examples of methods for providing the identification mark 35 on the electrode member 34 include a method of further placing the identification mark 35 on the electrode member 34, and a method of forming the identification mark 35 at the same time as forming the electrode member 34. Examples of methods for forming the identification mark 35 at the same time as forming the electrode member 34 include a method of forming a depression in the electrode member 34 that has a circular shape when viewed from above.

[0083] In top view, the wiring layer 33 of the first electrode member 34A is located closer to the second electrode member 34B than the first identification mark 35A. In top view, the wiring layer 33 of the second electrode member 34B is located closer to the first electrode member 34A than the second identification mark 35B.

[0084] The first identification mark 35A and the second identification mark 35B are provided in regions near both ends of the submount 30 in the longitudinal direction when viewed from above. The first identification mark 35A is provided at a position near the end of the first electrode member 34A in the longitudinal direction of the submount 30 that is farther from the second electrode member 34B. The second identification mark 35B is provided at a position near the end of the second electrode member 34B in the longitudinal direction of the submount 30 that is farther from the first electrode member 34A.

[0085] The wiring layer 33 is disposed between the first identification mark and the second identification mark 35B in the longitudinal direction of the submount 30. One or more third electrode members 34C are disposed between the first identification mark and the second identification mark 35B in the longitudinal direction of the submount 30.

[0086] The substrate 32A has insulating properties. The substrate 32A is formed of, for example, silicon nitride, aluminum nitride, or silicon carbide. It is preferable to select ceramic, which has relatively good heat dissipation properties (high thermal conductivity), as the main material of the substrate 32A.

[0087] The upper metal member 32B is primarily made of a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers made primarily of different metals.

[0088] The lower metal member 32C is primarily made of a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers made primarily of different metals.

[0089] The wiring layer 33 can be formed using a metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0090] For example, the length of the short side or lateral direction of the submount 30 is 500 μm or more and 1500 μm or less. Also, the length of the long side or longitudinal direction of the submount 30 is 1000 μm or more and 3000 μm or less. Also, the difference between the length of the long side and the length of the lateral direction of the submount 30 is 500 μm or more and 2500 μm or less.

[0091] For example, the thickness of the submount 30 (width in the direction perpendicular to the upper surface 31A) is 100 μm or more and 1000 μm or less. Also, for example, the thickness of the substrate 32A is 100 μm or more and 1000 μm or less. Also, for example, the thickness of the upper metal member 32B is 25 μm or more and 150 μm or less. Also, for example, the thickness of the lower metal member 32C is 25 μm or more and 150 μm or less. Also, for example, the thickness of the wiring layer 33 is 0.1 μm or more and 10 μm or less.

[0092] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0093] Next, the light emitting device 1 will be described.

[0094] (Light-emitting device 1) In the light emitting device 1, one or more light emitting elements 20 are disposed in the internal space of the package 10. The one or more light emitting elements 20 are disposed on the base 11. The one or more light emitting elements 20 are disposed on the first upper surface 11A.

[0095] The one or more light-emitting elements 20 can be configured as a plurality of light-emitting elements 20 arranged in a matrix. The light-emitting device 1 can be arranged in a matrix with multiple rows and multiple columns. In the illustrated light-emitting device 1, the row direction in this matrix arrangement is the same as the X direction, and the column direction is the same as the Y direction.

[0096] In the light emitting device 1, the plurality of light emitting elements 20 are arranged in a matrix at short intervals. The interval between adjacent light emitting elements 20 is 50 μm or more and 500 μm or less. The interval between adjacent light emitting elements 20 in the row direction can be greater than the interval between adjacent light emitting elements 20 in the column direction. The difference between the interval between adjacent light emitting elements 20 in the row direction and the interval between adjacent light emitting elements 20 in the column direction can be 0 μm or more and 450 μm or less.

[0097] In the light emitting device 1, one or more light emitting elements 20 are disposed on one or more submounts 30. One or each light emitting element 20 is disposed on the first upper surface 11A via the submount 30. One or more light emitting elements 20 are disposed on one or each submount 30.

[0098] One or each light emitting element 20 is connected to an electrode member 34 of the submount 30. A first electrode member 34A of the submount 30 is connected to a first electrode of the light emitting element 20. A second electrode member 34B of the submount 30 is connected to a second electrode of the light emitting element 20. When multiple light emitting elements 20 are arranged on the submount 30, the light emitting elements 20 different from the light emitting elements 20 connected to the first electrode member 34A are connected to the second electrode member 34B.

[0099] The first electrode of the light-emitting element 20 is connected to the wiring layer 33 of the first electrode member 34A, and the first identification mark 35A does not overlap the light-emitting element 20 in top view. The second electrode of the light-emitting element 20 is connected to the wiring layer 33 of the second electrode member 34B, and the second identification mark 35B does not overlap the light-emitting element 20 in top view. When one or more light-emitting elements 20 are arranged on the submount 30, the first identification mark 35A and the second identification mark 35B do not overlap the one or more light-emitting elements 20 in top view.

[0100] The one or more light-emitting elements 20 include one or more first light-emitting elements 20A connected to the first electrode member 34A and one or more second light-emitting elements 20B connected to the second electrode member 34B. In the light-emitting device 1, the number of first light-emitting elements 20A is equal to the number of submounts 30. In the light-emitting device 1, the number of second light-emitting elements 20B is equal to the number of submounts 30.

[0101] One or each first light-emitting element 20A is connected to the first electrode member 34A and the third electrode member 34C. One or each second light-emitting element 20B is connected to the third electrode member 34C and the second electrode member 34B. When two light-emitting elements 20 are arranged on the submount 30, the second light-emitting element 20B is connected to the third electrode member 34C to which the first light-emitting element 20A is connected. In this case, the second electrode of the first light-emitting element 20A and the first electrode of the second light-emitting element 20B are connected to the third electrode member 34C.

[0102] The reference line L1 can be used when arranging one or more light-emitting elements 20 on the submount 30. In top view, the side surface 21C of the light-emitting element 20 arranged on the submount 30 is parallel or perpendicular to the reference line L1. In top view, the center of the width of the light-emitting element 20 in the direction perpendicular to the reference line L1 passes through the reference line L1.

[0103] By connecting the first electrode of the light-emitting element 20 to the first electrode member 34A and connecting the second electrode of the light-emitting element 20 to the second electrode member 34B, it can be determined that the first electrode is positioned on the side of the first identification mark 35A and the second electrode is positioned on the side of the second identification mark 35B.

[0104] In this way, the multiple identification marks 35 provided on the submount 30 enable alignment during mounting and identification of the electrodes, thereby realizing a submount 30 that is convenient when mounting the submount 30 and light-emitting element 20.

[0105] One or more light emitting elements 20 arranged on the submount 30 are electrically connected to the first electrode member 34A and the second electrode member 34B.

[0106] In the light emitting device 1, one or more submounts 30 are disposed in the internal space of the package 10. The one or more submounts 30 are disposed on the base 11. The one or more submounts 30 are disposed on the first upper surface 11A.

[0107] The submount 30 is disposed on the first upper surface 11A so that the first electrode member 34A and the second electrode member 34B are aligned in a first direction. In the illustrated light emitting device 1, the first direction is the same as the positive Y direction. The submount 30 is disposed so that the longitudinal direction of the submount 30 is parallel to the lateral direction of the package 10.

[0108] The one or more submounts 30 may be configured as a plurality of submounts 30 arranged side by side in a second direction perpendicular to the first direction in a top view. In the illustrated light emitting device 1, the second direction is the same as the X direction.

[0109] In the light emitting device 1, the number of submounts 30 aligned in the first direction is smaller than the number of submounts 30 aligned in the second direction. In the illustrated example of the light emitting device 1, the number of submounts 30 aligned in the first direction is one, and the number of submounts 30 aligned in the second direction is four.

[0110] In the light emitting device 1, the number of light emitting elements 20 aligned in the first direction is smaller than the number of light emitting elements 20 aligned in the second direction. The difference between the number of light emitting elements 20 aligned in the first direction and the number of light emitting elements 20 aligned in the second direction is smaller than the difference between the number of submounts 30 aligned in the first direction and the number of submounts 30 aligned in the second direction.

[0111] In the light emitting device 1, the number of submounts 30 arranged in the second direction is greater than the number of light emitting elements 20 arranged in the first direction. The first upper surface 11A has a width in the second direction greater than the width in the first direction, so that the light emitting elements 20 can be arranged by effectively utilizing the first upper surface 11A.

[0112] The one or more submounts 30 include a first submount 30A and a second submount 30B arranged adjacent to each other. In the first submount 30A, the first electrode member 34A is arranged at a position further in the first direction from the second electrode member 34B, and in the second submount 30B, the second electrode member 34B is arranged at a position further in the first direction from the first electrode member 34A. In the adjacent submounts 30, the positions of the first identification mark 35A and the second identification mark 35B are 180 degrees apart from each other in a top view. This arrangement facilitates connection of wiring 60, which will be described later.

[0113] In the light emitting device 1, the thickness (vertical width) of the light emitting element 20 is greater than the height from the first top surface 11A of the package 10 to the top surface 11G of the stepped portion 11F. In other words, even if the light emitting element 20 is directly disposed on the first top surface 11A without the submount 30, the top surface 21A of the light emitting element 20 is located higher than the top surface 11G. Therefore, if the top surface 21A of the light emitting element 20 is the main light emitting surface, the stepped portion 11F does not interfere with the light emitted from the main light emitting surface. However, in the light emitting device 1, the light emitting element 20 is disposed on the first top surface 11A via the submount 30, which brings the top surface 21A of the light emitting element 20 closer to the top surface 14A of the package. This allows light emitted from the side surface 11H of the light emitting element 20 to be efficiently emitted from the top surface 14A of the light emitting device 1, thereby enabling efficient light extraction.

[0114] In the light emitting device 1, the thickness (width in the vertical direction) of the submount 30 is smaller than the height from the first upper surface 11A of the package 10 to the upper surface 11G of the stepped portion 11F. The thicker the submount 30, the longer the heat dissipation path for transmitting the heat generated in the light emitting element 20 from the first upper surface 11A to the package 10. Therefore, in consideration of heat dissipation, it is better that the submount 30 is not too thick.

[0115] When mounting multiple submounts 30 side by side, a reference line L1 determined from the submounts 30 can be used. The submounts 30 are mounted on the package 10 so that the reference line L1 is parallel to the short side direction of the package 10. The multiple submounts 30 are mounted on the first upper surface 11A so that the reference lines L1 determined from the respective submounts 30 are parallel to each other.

[0116] In top view, an imaginary line L2 connecting one mark constituting the first identification mark 35A of the two first submounts 30A arranged on both sides of the second submount 30B does not pass through either of the two marks constituting the second identification mark 35B of this second submount 30B. Note that it does not matter if either mark constituting the second identification mark 35B passes through this imaginary line L2.

[0117] When viewed from above, an imaginary straight line L3 connecting one mark constituting the first identification mark 35A of two second submounts 30B arranged on either side of the first submount 30A does not pass through either of the two marks constituting the second identification mark 35B of this first submount 30A.

[0118] In the light emitting device 1, a plurality of wirings 60 are provided to electrically connect one or a plurality of light emitting elements 20 to the package 10. The plurality of wirings 60 includes a wiring 60 joined to the first wiring portion 12A1 and the first electrode member 34A. The plurality of wirings 60 includes a wiring 60 joined to the first wiring portion 12A1 and the second electrode member 34B.

[0119] The plurality of wirings 60 includes a first wiring portion 12A1 provided in the first step portion 11F1 and a wiring 60 joined to the submount 30. The plurality of wirings 60 includes a first wiring portion 12A1 provided in the second step portion 11F2 and a wiring 60 joined to the submount 30.

[0120] In the illustrated example of the light emitting device 1, the multiple wirings 60 include a first wiring portion 12A1 provided in the first step portion 11F1, wiring 60 joined to the second electrode member 34B of the submount 30, and a first wiring portion 12A1 provided in the second step portion 11F2, wiring 60 joined to the first electrode member 34A of the submount 30.

[0121] The multiple wirings 60 include wirings 60 bonded to the first submount 30A and the second submount 30B. The multiple wirings 60 include wirings 60 bonded to the first electrode member 34A and the second electrode member 34B of different submounts 30. By bonding the wirings 60 in this manner, the multiple light-emitting elements 20 arranged on the two submounts 30 can be electrically connected in series. One or more light-emitting elements 20 included in the light-emitting device 1 are electrically connected in series.

[0122] Although the embodiments of the present invention have been described above, the placement member and light-emitting device according to the present invention are not strictly limited to the placement member and light-emitting device of each embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the placement member and light-emitting device disclosed in each embodiment. The present invention can be applied without necessarily including all components. For example, if the claims do not recite some of the components of the placement member or light-emitting device disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and change of material, and specify that the invention described in the claims applies.

[0123] Through the contents described so far in this specification, the following technical matters are disclosed. (Section 1) The placement surface and a plurality of electrode members provided on the placement surface and including a first electrode member and a second electrode member spaced apart from each other; a plurality of identification marks, including a first identification mark provided on the first electrode member side and a second identification mark provided on the second electrode member side, which can identify the first electrode and the second electrode, and which can identify a reference line for alignment; The first identification mark and the second identification mark have different marking shapes. (Section 2) Item 2. The arrangement member according to item 1, wherein the reference line can be identified based on the first identification mark and the second identification mark. (Section 3) the first identification mark is provided on the first electrode member, Item 3. The arrangement member according to item 1 or 2, wherein the second identification mark is provided on the second electrode member. (Section 4) the marking shape of the first identification mark is composed of one mark, 4. The arrangement member according to any one of items 1 to 3, wherein the marking shape of the second identification mark is composed of a plurality of marks. (Section 5) Item 5. The arrangement member according to item 4, wherein the one mark constituting the marking shape of the first identification mark and the plurality of marks constituting the marking shape of the second identification mark are provided at a position where the reference line passes when viewed from above. (Section 6) the first electrode member and the second electrode member are arranged side by side in a first direction, the first identification mark is provided at a position close to one of both ends of the first electrode member in the first direction that is farther from the second electrode member, 6. The arrangement member according to any one of items 1 to 5, wherein the second identification mark is provided at a position near one of both ends of the second electrode member in the first direction that is farther from the first electrode member. (Section 7) the plurality of electrode members further include one or more third electrode members provided between the first electrode member and the second electrode member; Item 7. The arrangement member according to item 6, wherein the arrangement member has a width in the first direction greater than a width in a direction perpendicular to the first direction in a top view. (Section 8) One or more placement members according to any one of items 1 to 7; one or more light emitting elements electrically connected to the first electrode member and the second electrode member; a package in which the one or more placement members and the one or more light emitting elements are placed; A light emitting device comprising: (Section 9) The one or more placement members include a first placement member that is the placement member described in item 7, the one or more light-emitting elements include a first light-emitting element connected to the first electrode member and the third electrode member of the first arrangement member, and a second light-emitting element connected to the third electrode member and the second electrode member, Item 9. The light emitting device according to item 8, wherein the first light emitting element and the second light emitting element are arranged at positions where a line segment connecting the first identification mark and the second identification mark passes when viewed from above. [Industrial Applicability]

[0124] The light-emitting device described in the embodiment can be used in a sterilization device. In other words, a sterilization device can be considered one application form to which the present invention can be applied. However, the present invention is not limited to this, and can be used in various applications such as an exposure device, a processing device, paint curing, water sterilization, air sterilization, and semiconductor manufacturing. [Explanation of symbols]

[0125] 1. Light-emitting device 10 packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11D External surface 11E Inside surface 11F step 11F1 First step 11F2 Second step 11G top surface 11H side 11M Base 11N frame 12A wiring section 12A1 1st wiring section 12A2 2nd wiring section 13A joint pattern 14 Lid 14A Top 14B Bottom 14C side 20 Light-emitting element 20A First light-emitting element 20B Second light-emitting element 21A Top 21B Bottom surface 21C side 22 Light exit surface 23A 1st electrode 23B 2nd electrode 30 Submount 30A 1st submount 30B Second submount 31A Top 31B Bottom surface 31C side 32A board 32B Upper metal member 32C Lower metal member 33 Wiring layer 34 Electrode material 34A first electrode member 34B second electrode member 34C Third electrode member 35 Identification Mark 35A First Identification Mark 35B Second Identification Mark 39 Placement plane 60 Wiring

Claims

1. The placement surface and a plurality of electrode members provided on the placement surface and including a first electrode member and a second electrode member spaced apart from each other; a plurality of identification marks, including a first identification mark provided on the first electrode member side and a second identification mark provided on the second electrode member side, which can identify the first electrode and the second electrode, and which can specify a reference line for alignment; The first identification mark and the second identification mark have different marking shapes.

2. The arrangement member according to claim 1 , wherein the reference line can be identified based on the first identification mark and the second identification mark.

3. the first identification mark is provided on the first electrode member, The arrangement member according to claim 1 , wherein the second identification mark is provided on the second electrode member.

4. the marking shape of the first identification mark is configured by one mark, The arrangement member according to claim 1 , wherein the marking shape of the second identification mark is made up of a plurality of marks.

5. 5. The arrangement member according to claim 4, wherein the one mark constituting the marking shape of the first identification mark and the plurality of marks constituting the marking shape of the second identification mark are provided at positions through which the reference line passes when viewed from above.

6. the first electrode member and the second electrode member are arranged side by side in a first direction, the first identification mark is provided at a position close to one of both ends of the first electrode member in the first direction that is farther from the second electrode member, The arrangement member according to claim 1 , wherein the second identification mark is provided at a position close to one of both ends of the second electrode member in the first direction that is farther from the first electrode member.

7. the plurality of electrode members further include one or more third electrode members provided between the first electrode member and the second electrode member; The arrangement member according to claim 6 , wherein the arrangement member has a width in the first direction greater than a width in a direction perpendicular to the first direction in a top view.

8. One or more placement elements according to any one of claims 1 to 7; one or more light-emitting elements electrically connected to the first electrode member and the second electrode member; a package in which the one or more placement members and the one or more light emitting elements are placed; A light emitting device comprising:

9. the one or more placement members include a first placement member that is the placement member described in claim 7; the one or more light-emitting elements include a first light-emitting element connected to the first electrode member and the third electrode member of the first arrangement member, and a second light-emitting element connected to the third electrode member and the second electrode member, The light emitting device according to claim 8 , wherein the first light emitting element and the second light emitting element are arranged at positions where a line segment connecting the first identification mark and the second identification mark passes when viewed from above.

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