Adsorption device and grinding device

Abstract

To prevent clogging of the pores of an adsorbent.SOLUTION: In an adsorption device 12, a porous chuck 18 is evacuated via a first suction path 30, and a workpiece W is held by suction on the porous chuck 18, and a spacer ring 22 is evacuated via a second suction path 34, and a dicing frame 46 is held by suction on the spacer ring 22. Therefore, even when grinding chips from the workpiece W enter the second suction path 34, the grinding chips in the second suction path 34 do not reach the porous chuck 18, and clogging of the pores in the porous chuck 18 with the grinding chips can thus be prevented.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a suction device for suctioning a workpiece and a dicing frame, and a grinding machine including the suction device. [Background technology]

[0002] In the grinding device described in Patent Document 1 below, a wafer and a ring frame are attached to the inner and outer circumferential sides of an adhesive tape, respectively, and the wafer holding portion and the ring frame holding portion of the holding means are sucked through a suction path, so that the wafer and the ring frame are adsorbed onto the wafer holding portion and the ring frame holding portion, respectively.

[0003] In this grinding apparatus, the suction passage is connected to the wafer holder and the ring frame holder, so if a foreign object enters the suction passage from the ring frame holder, there is a possibility that the foreign object in the suction passage will reach the wafer holder when suction via the suction passage of the wafer holder is released. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2017-196709 Summary of the Invention [Problem to be solved by the invention]

[0005] In consideration of the above, an object of the present invention is to provide a suction device and a grinding device that can suppress clogging of the holes in the suction body. [Means for solving the problem]

[0006] The suction device of the first aspect of the present invention comprises an adsorption table having an adsorption body and an adsorption section with holes on the inner and outer peripheral sides, respectively, on which a workpiece is placed, with a dicing frame attached to the inner and outer peripheral sides of the dicing tape, respectively; a first suction path connected to the adsorption body, through which the adsorption body is sucked and the workpiece is adsorbed to the adsorption body via the dicing tape; and a second suction path separate from the first suction path and connected to the adsorption section, through which the adsorption section is sucked and the dicing frame is adsorbed to the adsorption section via the dicing tape.

[0007] The second aspect of the suction device of the present invention is the suction device of the first aspect of the present invention, which comprises a first supply path that is connected to the suction body and through which a fluid is supplied to the suction body, thereby releasing the suction of the workpiece to the suction body, and a second supply path that is separate from the first supply path and connected to the suction section, through which a fluid is supplied to the suction section, thereby releasing the suction of the dicing frame to the suction section.

[0008] An adsorption device of a third aspect of the present invention is the adsorption device of the second aspect of the present invention, wherein the adsorbent side of the first suction path from the first suction valve and the adsorbent side of the first supply path from the first supply valve are connected to the same path and are communicated with the adsorbent, and the adsorption unit side of the second suction path from the second suction valve and the adsorption unit side of the second supply path from the second supply valve are connected to the same path and are communicated with the adsorption unit.

[0009] An adsorption device of a fourth aspect of the present invention is an adsorption device of the second or third aspect of the present invention, wherein the suction source side of the first suction path from the first suction valve and the suction source side of the second suction path from the second suction valve are made into the same path and communicated with the suction source, and the supply source side of the first supply path from the first supply valve and the supply source side of the second supply path from the second supply valve are made into the same path and communicated with the fluid supply source.

[0010] An adsorption device according to a fifth aspect of the present invention is the adsorption device according to any one of the first to fourth aspects of the present invention, wherein the holes of the adsorption portion are larger than the holes of the adsorbent.

[0011] An adsorption device according to a sixth aspect of the present invention is the adsorption device according to any one of the first to fifth aspects of the present invention, wherein the upper surface of the adsorption body is arranged above the upper surface of the adsorption part.

[0012] A grinding device according to a seventh aspect of the present invention includes the suction device according to any one of the first to sixth aspects of the present invention, and a grinding mechanism that grinds the workpiece sucked by the suction body. [Effects of the Invention]

[0013] In the suction device of the first aspect of the present invention, an adsorption body and an adsorption section are provided on the inner and outer peripheral sides of the suction table, respectively, and the adsorption body and the adsorption section have holes. Also, a workpiece and a dicing frame are attached to the inner and outer peripheral sides of the dicing tape, respectively, and the workpiece is placed on the suction table.

[0014] Here, a first suction path is connected to the suction body, and the suction body is sucked through the first suction path, so that the workpiece is sucked onto the suction body via the dicing tape. Furthermore, a second suction path is connected to the suction unit, separate from the first suction path, and the suction unit is sucked via the second suction path, so that the dicing frame is sucked onto the suction unit via the dicing tape. Therefore, even if foreign matter enters the second suction path from the suction unit, when suction via the first suction path of the suction body is released, the foreign matter in the second suction path does not reach the suction body, so clogging of the suction body's holes can be prevented.

[0015] In a suction device according to a second aspect of the present invention, a first supply path is connected to the suction body, and a fluid is supplied to the suction body via the first supply path. Furthermore, a second supply path is connected to the suction unit, separate from the first supply path, and a fluid is supplied to the suction unit. Therefore, the suction of the workpiece to the suction body and the suction of the dicing frame to the suction unit can be released.

[0016] In the adsorption device of the third aspect of the present invention, the adsorption body side of the first suction passage from the first suction valve and the adsorption body side of the first supply passage from the first supply valve are connected to the same path and are communicated with the adsorption body. Furthermore, the adsorption unit side of the second suction passage from the second suction valve and the adsorption unit side of the second supply passage from the second supply valve are connected to the same path and are communicated with the adsorption unit. This simplifies the configuration.

[0017] In the adsorption device of the fourth aspect of the present invention, the suction source side of the first suction passage from the first suction valve and the suction source side of the second suction passage from the second suction valve are connected to the same path and are communicated with the suction source. Furthermore, the supply source side of the first supply passage from the first supply valve and the supply source side of the second supply passage from the second supply valve are connected to the same path and are communicated with the supply source. This simplifies the configuration.

[0018] In the suction device according to the fifth aspect of the present invention, the holes in the suction portion are larger than the holes in the suction body, which makes it possible to prevent the holes in the suction portion from being clogged with foreign matter.

[0019] In the suction device according to the sixth aspect of the present invention, the upper surface of the suction body is disposed above the upper surface of the suction part, which makes it possible to prevent foreign matter from reaching the upper surface of the suction body from the upper surface of the suction part.

[0020] A grinding device according to a seventh aspect of the present invention includes the suction device according to any one of the first to sixth aspects of the present invention, and the grinding mechanism grinds the workpiece that is sucked onto the suction body.

[0021] Here, the grinding device according to the seventh aspect of the present invention can also achieve the same effects as the suction device according to the first aspect of the present invention. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a side view showing a main part of a grinding device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a side view showing a suction device of the grinding apparatus according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] Fig. 1 shows a side view of the main parts of a grinding apparatus 10 according to an embodiment of the present invention, and Fig. 2 shows a side view of a suction device 12 of the grinding apparatus 10. In the drawings, the upward direction of the grinding apparatus 10 is indicated by an arrow UP.

[0024] As shown in FIGS. 1 and 2, a grinding device 10 according to this embodiment is provided with a suction device 12.

[0025] The suction device 12 is provided with a disk-shaped chuck base 14, and a cylindrical rotation shaft 14A is coaxially fixed to the lower surface of the chuck base 14. A substantially disk-shaped chuck table 16 serving as a suction stand is coaxially fixed to the upper surface of the chuck base 14.

[0026] A disk-shaped porous chuck 18 serving as an adsorption body is coaxially embedded on the inner periphery of the chuck table 16, with the upper surface of the porous chuck 18 exposed above the chuck table 16 and the peripheral and lower surfaces covered by the chuck table 16. The porous chuck 18 is made of a porous material such as alumina, and has numerous pores (not shown) formed therein.

[0027] A recess 20 having a circular shape in top view is coaxially formed on the outer periphery of the chuck table 16. The recess 20 has a rectangular cross section and is open upward. A spacer ring 22 having a circular plate shape as an adsorption part is fitted into and fixed in the recess 20. The spacer ring 22 abuts against the lower surface of the recess 20, and its upper surface is disposed below the upper surface of the porous chuck 18. A plurality of small holes 22A are formed through the spacer ring 22, and the plurality of small holes 22A are spaced apart in the circumferential direction of the spacer ring 22. The small holes 22A are larger than the pores of the porous chuck 18.

[0028] An output shaft 24A of a motor 24 is connected to the rotary shaft 14A of the chuck base 14 via an endless belt 26. When the motor 24 is operated, the output shaft 24A rotates, which in turn rotates the belt 26, causing the rotary shaft 14A, chuck base 14, and chuck table 16 to rotate integrally. A columnar rotary joint 28 is coaxially connected to the lower side of the rotary shaft 14A.

[0029] A first suction passage 30 (first suction line) is connected to the underside of the porous chuck 18, and passes through the chuck table 16, the chuck base 14, and the rotary joint 28. The first suction passage 30 is piped outside the rotary joint 28, and is connected to a vacuum source 32 as a suction source. A first suction valve 30A is provided in the first suction passage 30 between the rotary joint 28 and the vacuum source 32, and the first suction valve 30A is capable of opening and closing the first suction passage 30.

[0030] A second suction passage 34 (second suction line) is connected to the underside of the spacer ring 22, and passes through the chuck table 16, the chuck base 14, and the rotary joint 28. The second suction passage 34 is piped outside the rotary joint 28, and is connected to the vacuum source 32 via the same path as the portion of the first suction passage 30 closer to the vacuum source 32 than the first suction valve 30A. A second suction valve 34A is provided in the second suction passage 34 between the rotary joint 28 and the first suction passage 30, and the second suction valve 34A is capable of opening and closing the second suction passage 34.

[0031] A first supply passage 36 (first supply line) is connected to the underside of the porous chuck 18, and the first supply passage 36 is the same as the portion of the first suction passage 30 on the porous chuck 18 side of the first suction valve 30A, and passes through the chuck table 16, the chuck base 14, and the rotary joint 28. The first supply passage 36 is piped outside the rotary joint 28, and is connected to a pure water source 38 as a supply source. A first supply valve 36A is provided in the first supply passage 36 between the first suction passage 30 and the pure water source 38, and the first supply valve 36A is capable of opening and closing the first supply passage 36.

[0032] A second supply passage 40 (second supply line) is connected to the underside of the spacer ring 22, and the second supply passage 40 is the same as the portion of the second suction passage 34 on the spacer ring 22 side of the second suction valve 34A, and passes through the chuck table 16, the chuck base 14, and the rotary joint 28. The second supply passage 40 is piped outside the rotary joint 28, and is the same as the portion of the first supply passage 36 on the pure water source 38 side of the first supply valve 36A, and is connected to the pure water source 38. A second supply valve 40A is provided in the second supply passage 40 between the second suction passage 34 and the first supply passage 36, and the second supply valve 40A is capable of opening and closing the second supply passage 40.

[0033] A workpiece 42 is transported by a transport device (not shown) and placed above the chuck table 16. A substantially circular dicing tape 44 is provided on the workpiece 42. A disk-shaped workpiece W, which is a semiconductor wafer such as a silicon wafer, is attached to the inner periphery and upper side of the dicing tape 44, and the workpiece W is coaxially arranged above the porous chuck 18 of the chuck table 16. A substantially circular annular dicing frame 46 is attached to the outer periphery and upper side of the dicing tape 44, and the dicing frame 46 is arranged above the spacer ring 22 of the chuck table 16.

[0034] The grinding device 10 is provided with a grinding mechanism 48. The grinding mechanism 48 is provided with a disk-shaped grinding wheel 48A, which is arranged horizontally above the chuck table 16. When the grinding mechanism 48 is operated, the grinding wheel 48A is transported onto the workpiece W above the chuck table 16 and rotated.

[0035] Next, the operation of this embodiment will be described.

[0036] In the grinding apparatus 10 configured as described above, the workpiece 42 is transported by the transport device and placed on the upper side of the chuck table 16 of the suction device 12. Therefore, the workpiece W above the dicing tape 44 of the workpiece 42 is placed above the porous chuck 18 of the chuck table 16, and the dicing frame 46 above the dicing tape 44 of the workpiece 42 is placed above the spacer ring 22 of the chuck table 16.

[0037] Then, in the suction device 12, the first suction valve 30A of the first suction path 30 and the second suction valve 34A of the second suction path 34 are opened, and the vacuum source 32 is activated. As a result, air is sucked into the vacuum source 32 through the pores of the porous chuck 18 and the first suction path 30, generating a negative pressure between the porous chuck 18 and the workpiece W, and the workpiece W is suctioned and held on the upper surface of the porous chuck 18 via the dicing tape 44. Furthermore, air is sucked into the vacuum source 32 through the small holes 22A of the spacer ring 22 and the second suction path 34, generating a negative pressure between the spacer ring 22 and the dicing frame 46, and the dicing frame 46 is suctioned and held on the upper surface of the spacer ring 22 via the dicing tape 44.

[0038] Next, the motor 24 is operated to rotate the chuck table 16. Furthermore, the grinding mechanism 48 is operated to transport the grinding wheel 48A onto the workpiece W and rotate the grinding wheel 48A. As a result, the workpiece W is ground by the grinding wheel 48A.

[0039] Thereafter, in the suction device 12, the first suction valve 30A and the second suction valve 34A are closed, and the vacuum source 32 is stopped. Then, the first supply valve 36A of the first supply path 36 and the second supply valve 40A of the second supply path 40 are opened for a predetermined time, and the pure water source 38 is operated. As a result, pure water as a fluid is supplied from the pure water source 38 through the first supply path 36 and the pores of the porous chuck 18 between the porous chuck 18 and the workpiece W, thereby releasing the suction-holding of the workpiece W onto the upper surface of the porous chuck 18. Furthermore, pure water is supplied from the pure water source 38 through the second suction path 34 and the small holes 22A of the spacer ring 22 between the spacer ring 22 and the dicing frame 46, thereby releasing the suction-holding of the dicing frame 46 onto the upper surface of the spacer ring 22.

[0040] Incidentally, when the workpiece W is ground by the grinding wheel 48A, grinding chips (sludge, foreign matter) of the workpiece W are generated, and there is a possibility that the grinding chips may invade the spacer ring 22 side through the outside of the outer periphery of the workpiece body 42 (dicing frame 46). Therefore, when air is subsequently sucked into the second suction path 34 through the small holes 22A of the spacer ring 22, there is a possibility that the grinding chips around the spacer ring 22 may be sucked into the second suction path 34 and invade.

[0041] Here, a first suction passage 30 is connected to the porous chuck 18, and a second suction passage 34 is connected to the spacer ring 22, so that the first suction passage 30 and the second suction passage 34 are separate. Therefore, even if grinding chips around the spacer ring 22 enter the second suction passage 34, when pure water is supplied from the first supply passage 36 to the porous chuck 18 (when suction via the first suction passage 30 of the porous chuck 18 is released), the grinding chips in the second suction passage 34 do not reach the porous chuck 18, thereby preventing the pores of the porous chuck 18 from being clogged with grinding chips from below the porous chuck 18.

[0042] Furthermore, the small holes 22A of the spacer ring 22 are made larger than the pores of the porous chuck 18. This makes it possible to prevent the small holes 22A of the spacer ring 22 from being clogged with grinding debris.

[0043] Furthermore, the upper surface of the porous chuck 18 is disposed above the upper surface of the spacer ring 22. This prevents grinding chips from reaching the upper surface of the porous chuck 18 from the upper surface of the spacer ring 22.

[0044] Furthermore, the porous chuck 18 side of the first suction passage 30 relative to the first suction valve 30A and the porous chuck 18 side of the first supply passage 36 relative to the first supply valve 36A are connected to the same passage and communicated with the porous chuck 18. Therefore, unlike when the first suction passage 30 and the first supply passage 36 are separately connected to the porous chuck 18, the configuration can be simplified.

[0045] Furthermore, the spacer ring 22 side of the second suction passage 34 from the second suction valve 34A and the spacer ring 22 side of the second supply passage 40 from the second supply valve 40A are connected together as a single passage and communicate with the spacer ring 22. This simplifies the configuration, unlike when the second suction passage 34 and the second supply passage 40 are separately connected to the spacer ring 22.

[0046] Furthermore, the vacuum source 32 side of the first suction valve 30A of the first suction path 30 and the vacuum source 32 side of the second suction path 34 of the second suction path 34A are connected to the same path and are communicated with the vacuum source 32. Therefore, unlike when the first suction path 30 and the second suction path 34 are separately connected to the vacuum source 32, the configuration can be simplified.

[0047] Furthermore, the pure water source 38 side of the first supply line 36 from the first supply valve 36A and the pure water source 38 side of the second supply line 40 from the second supply valve 40A are connected to the same line and are connected to the pure water source 38. This simplifies the configuration, unlike when the first supply line 36 and the second supply line 40 are connected to the pure water source 38 separately.

[0048] In this embodiment, the pure water source 38 (supply source) supplies pure water to the first supply path 36 and the second supply path 40. However, the supply source may be a compressed air source, and the compressed air source may supply compressed air to the first supply path 36 and the second supply path 40. [Explanation of symbols]

[0049] 10 Grinding equipment 12 Adsorption device 16 Chuck table (suction table) 18 Porous chuck (adsorbent) 22 Spacer ring (adsorption part) 22A Small hole (hole) 30 1st suction path 30A First Suction Valve 32 Vacuum source (suction source) 34 2nd suction path 34A Second suction valve 36 1st supply route 36A First supply valve 38 Pure water source (supply source) 40 2nd supply route 40A Second Supply Valve 42 Workpiece 44 Dicing Tape 46 Dicing Frame 48 Grinding mechanism double work

Claims

1. a suction table provided with an adsorption body and an adsorption portion having holes on the inner and outer circumferential sides, respectively, on which a workpiece is placed, and on which a dicing frame is attached to the inner and outer circumferential sides of the dicing tape; a first suction path that is connected to the suction body, and through which the suction body is sucked and the workpiece is sucked onto the suction body via the dicing tape; a second suction path that is separate from the first suction path and communicates with the suction unit, and that causes the suction unit to be sucked so that the dicing frame is sucked by the suction unit via the dicing tape; An adsorption device comprising:

2. a first supply path that is in communication with the adsorbent and through which a fluid is supplied to the adsorbent; a second supply path that is separate from the first supply path and communicates with the adsorption unit, and through which a fluid is supplied to the adsorption unit; The adsorption device according to claim 1 , comprising:

3. 3. The adsorption device according to claim 2, wherein the adsorbent side of the first suction path from the first suction valve and the adsorbent side of the first supply path from the first supply valve are connected to the same path and are communicated with the adsorbent, and the adsorption unit side of the second suction path from the second suction valve and the adsorption unit side of the second supply path from the second supply valve are connected to the same path and are communicated with the adsorption unit.

4. 3. The suction device according to claim 2, wherein the suction source side of the first suction passage and the suction source side of the second suction passage are connected to the same path and communicated with the suction source, and the supply source side of the first supply passage and the supply source side of the second supply passage are connected to the same path and communicated with the supply source.

5. 2. The adsorption device according to claim 1, wherein the pores of the adsorption portion are larger than the pores of the adsorbent.

6. The adsorption device according to claim 1 , wherein the upper surface of the adsorption body is disposed above the upper surface of the adsorption portion.

7. The adsorption device according to claim 1; a grinding mechanism that grinds the workpiece attracted to the attracting body; A grinding device comprising:

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