Electronic component suction mechanism, electronic component suction device, and electronic component suction method

Abstract

To provide an electronic component having no suction surface near a center of gravity by a suction nozzle capable of being suctioned in a stable state without generating waste, while suppressing an increase in cost.SOLUTION: An electronic component suction mechanism 200 includes: a frame-shaped frame body part 410 having a side wall part 417 provided along a downward direction, in which both end parts in the downward direction being open; a tongue piece part 460 provided along a direction intersecting the downward direction; an upper main body part 51 and a lower main body part 52; a protruding part 53 protruding downward from the lower main body part 52 and capable of being inserted into the frame body part 410 in the downward direction; a first suction hole 55 opening to a bottom surface 52a intersecting the downward direction and sucking and attracting the tongue piece part 460; and a suction nozzle 50 having a second suction hole 56 that opens to a right side surface 53a intersecting the bottom surface 52a and sucks and attracts the side wall part 417 in a state where the protruding part 53 is inserted into the frame body part 410.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to an electronic component suction mechanism for suctioning electronic components, an electronic component suction device, and an electronic component suction method. [Background technology]

[0002] Conventionally, in mass-production sites of devices, automatic machines are used to mount electronic components such as electrical connectors. Such automatic machines are equipped with suction nozzles that pick up electronic components, and generally use the suction nozzle to pick up the electronic components by suctioning the flat surface of the electronic components. Patent Document 1 discloses a suction mechanism that uses a suction nozzle to pick up a connector placed in a recess in an embossed tape. The suction mechanism of Patent Document 1 picks up the connector from the recess in the embossed tape by using the suction nozzle to suction the inner bottom surface of the recess in the connector.

[0003] In order to stably pick up an electronic component using a suction nozzle, it is desirable to have the suction surface of the suction nozzle located near the center of gravity of the electronic component. However, depending on the configuration of the electronic component, it may be difficult to have the suction surface of the suction nozzle located near the center of gravity. In such cases, conventional electronic component suction mechanisms have been known to attach a tape or cap for suction near the center of gravity of the electronic component, or to provide a suction surface at a position away from the center of gravity of the electronic component. Also known in the past is a configuration in which the electronic component is chucked instead of being sucked. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-326773 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional configurations using suction tape or caps, the tape or cap is discarded after the electronic component is no longer required to be sucked, such as after the electronic component is mounted, resulting in the problem of the tape or cap becoming waste. Furthermore, in conventional configurations in which the suction surface is located away from the center of gravity of the electronic component, the suction surface must be large to stably suck the electronic component, resulting in the problem of the electronic component becoming larger and the electronic component easily falling off the suction nozzle when the suction nozzle is moved at high speed with the electronic component sucked. Furthermore, in conventional configurations for chucking electronic components, the need for additional components for chucking the electronic component results in the problem of increased costs.

[0006] An object of the present invention is to provide an electronic component suction mechanism, an electronic component suction device, and an electronic component suction method that can suppress increases in costs and that can stably pick up electronic components that do not have a suction surface of a suction nozzle near their center of gravity without generating waste. [Means for solving the problem]

[0007] The electronic component suction mechanism of the present invention is an electronic component suction mechanism for suctioning an electronic component, and includes: a frame-shaped frame body portion that is provided on the electronic component and has both ends open in one direction and a first suction target portion that is provided along the one direction; a second suction target portion that is provided on the electronic component and is provided along a direction intersecting the one direction; a main body portion; a protrusion that protrudes from the main body portion in the one direction and is insertable into the frame body portion toward the one direction; a suction nozzle that includes: a first suction hole that opens on a first surface of the main body portion that intersects the one direction and sucks and adsorbs the second suction target portion; and a second suction hole that opens on a second surface of the protrusion that intersects the first surface and sucks and adsorbs the first suction target portion when the protrusion is inserted inside the frame body portion.

[0008] The electronic component suction device of the present invention is an electronic component suction device that suctions electronic components, and includes a suction nozzle that suctions the electronic component, and a negative pressure supply unit that supplies negative pressure to the suction nozzle to cause the suction nozzle to suction the electronic component, wherein the suction nozzle includes a main body, a protrusion that protrudes in one direction from the main body, a first suction hole that opens into a first surface of the main body that intersects with the one direction on the tip side of the one direction and sucks and suctions the electronic component by the negative pressure supplied by the negative pressure supply unit, and a second suction hole that opens into a second surface of the protrusion that intersects with the first surface and sucks and suctions the electronic component by the negative pressure supplied by the negative pressure supply unit.

[0009] The method for suctioning an electronic component according to the present invention is a method for suctioning an electronic component using a suction mechanism having: a frame-shaped frame body portion that is attached to the electronic component and has both ends open in one direction and a first suction target portion that is arranged along the one direction; a second suction target portion that is attached to the electronic component and arranged along a direction intersecting the one direction; a main body portion; a protrusion that protrudes from the main body portion in the one direction, a first suction hole that opens into a first surface of the main body portion that intersects the one direction, and a second suction hole that opens into a second surface of the protrusion that intersects the first surface, and the method comprises the steps of inserting the protrusion into the frame body portion in the one direction; and sucking and suctioning the second suction target portion through the first suction hole, and sucking and suctioning the first suction target portion through the second suction hole.

[0010] The electronic component is sucked and adsorbed from two different directions at two locations: a first suction hole that opens on a first surface of the main body, and a second suction hole that opens on a second surface that intersects with the first surface of the protrusion. [Effects of the Invention]

[0011] According to the present invention, it is possible to suppress increases in costs and to stably pick up electronic components that do not have a suction surface of the suction nozzle near their center of gravity without generating waste. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a diagram showing a configuration of an electronic component suction device according to an embodiment of the present invention; [Figure 2] 1 is a perspective view of a suction nozzle of an electronic component suction device according to an embodiment of the present invention, as viewed from the front side; [Figure 3] 1 is a perspective view of a suction nozzle of an electronic component suction device according to an embodiment of the present invention, as viewed from the rear side. [Figure 4] FIG. 2 is a bottom view of the suction nozzle of the electronic component suction device according to the embodiment of the present invention. [Figure 5] 1 is a side view of a suction nozzle of an electronic component suction device according to an embodiment of the present invention; [Figure 6] 6 is a cross-sectional view taken along the line AA in FIG. 5. [Figure 7] 1 is a perspective view of an electrical connector to be sucked by an electronic component suction device according to an embodiment of the present invention; [Figure 8] 1 is a plan view of an electrical connector to be sucked by an electronic component suction device according to an embodiment of the present invention; [Figure 9] 9 is a cross-sectional view of FIG. 8 taken along line B-B. [Figure 10] FIG. 2 is a perspective view of the electronic component suction mechanism according to the embodiment of the present invention, as viewed from the rear side. [Figure 11] FIG. 2 is a front view of the suction mechanism for an electronic component according to the embodiment of the present invention. [Figure 12] FIG. 2 is a side view of the suction mechanism for an electronic component according to the embodiment of the present invention. [Figure 13] 13 is a cross-sectional view taken along CC in FIG. 12. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an electronic component suction mechanism and an electronic component suction device according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the drawings, the x-axis, y-axis, and z-axis form a three-axis Cartesian coordinate system, with the positive direction of the y-axis representing the forward direction, the negative direction of the y-axis representing the backward direction, the positive direction of the x-axis representing the rightward direction, the negative direction of the x-axis representing the leftward direction, the positive direction of the z-axis representing the upward direction, and the negative direction of the z-axis representing the downward direction.

[0014] <Configuration of the electronic component suction device> The configuration of an electronic component suction device 1 according to an embodiment of the present invention will be described in detail below with reference to FIG.

[0015] The electronic component suction device 1 includes a control unit 2, a drive unit 3, a negative pressure supply unit 4, a positive pressure supply unit 5, a switching unit 6, and a suction nozzle 50.

[0016] The control unit 2 is equipped with a calculation processing unit such as a CPU and a memory, neither of which are shown, and the calculation processing unit controls the operation of the drive unit 3, negative pressure supply unit 4, positive pressure supply unit 5 and switching unit 6 by executing a computer program stored in the memory.

[0017] The driving unit 3 is driven under the control of the control unit 2 to move the suction nozzle 50 up and down, left and right, or back and forth.

[0018] The negative pressure supply unit 4 includes a vacuum pump (not shown), and is driven under the control of the control unit 2 to supply negative pressure to the switching unit 6 .

[0019] The positive pressure supply unit 5 includes a pressure pump (not shown), and is driven under the control of the control unit 2 to supply positive pressure to the switching unit 6 .

[0020] The switching unit 6 is an electric switching valve or the like, and switches between supplying negative pressure supplied from the negative pressure supply unit 4 to the suction nozzle 50 and supplying positive pressure supplied from the positive pressure supply unit 5 to the suction nozzle 50 under the control of the control unit 2. Note that the switching unit 6 may switch between supplying negative pressure and positive pressure to the suction nozzle 50, and may also switch between supplying atmospheric pressure taken in from outside to the suction nozzle 50.

[0021] The suction nozzle 50 is driven by the drive unit 3 to move up and down, left and right, or front and back by the drive unit 3. The suction nozzle 50 sucks and holds an electronic component when negative pressure is supplied from the negative pressure supply unit 4 via the switch unit 6, and releases the suction and holding of the electronic component when positive pressure is supplied from the positive pressure supply unit 5 via the switch unit 6.

[0022] <Configuration of suction nozzle> The configuration of the suction nozzle 50 of the electronic component suction device 1 according to the embodiment of the present invention will be described in detail below with reference to FIGS. 2 to 6. FIG.

[0023] The suction nozzle 50 includes an upper body portion 51, a lower body portion 52, a protruding portion 53, a pressing portion 54, a first suction hole 55, a second suction hole 56, a first transmission path 57, a second transmission path 58, a third transmission path 59, and a communication hole 60. The upper body portion 51 and the lower body portion 52 constitute a main body portion.

[0024] The upper main body portion 51 is rectangular, with its left-right width being the same as that of the lower main body portion 52, and its front-to-rear length being greater than that of the lower main body portion 52.

[0025] The lower main body portion 52 is provided below the upper main body portion 51.

[0026] The protruding portion 53 protrudes downward from the lower main body portion 52 at the right end portion of the lower main body portion 52. The protruding portion 53 protrudes downward from the pressing portion .

[0027] The pressing portion 54 protrudes downward from the lower main body portion 52 and is adjacent to the protruding portion 53 in the left-right direction.

[0028] The first suction hole 55 opens to the bottom surface 52a, which is the first surface perpendicular to the downward direction, at the downward tip side of the lower main body portion 52, and connects the second transmission path 58 to the outside as shown in Figure 6.

[0029] The second suction hole 56 opens to a right side surface 53a serving as a second surface perpendicular to the bottom surface 52a of the protruding portion 53, and communicates the third transmission path 59 with the outside as shown in FIG.

[0030] The first transmission path 57 includes a large diameter portion 571 and a small diameter portion 572 that communicates with the large diameter portion 571 and has a smaller diameter than the large diameter portion 571 .

[0031] The second transmission path 58 connects the first transmission path 57 to the outside via the first suction hole 55 .

[0032] The third transmission path 59 connects the first transmission path 57 to the outside via the second suction hole 56 .

[0033] The communication hole 60 opens to the upper surface 51a of the upper body portion 51, and connects the first transmission path 57 to the outside.

[0034] <Connector configuration> The configuration of a connector 100 to be sucked by an electronic component suction device 1 according to an embodiment of the present invention will be described in detail below with reference to FIGS.

[0035] Connector 100 as an electronic component is integrally formed from a metal plate, and has a frame portion 410, a connecting portion 420, a fixing portion 430, a floating portion 440, a restricting portion 450, and a tongue portion 460.

[0036] Here, the suction mechanism 200 for electronic components is made up of at least the above-mentioned suction nozzle 50, the frame body portion 410, and the tongue portion 460.

[0037] The frame body 410 is frame-shaped and rectangular when viewed from the top-bottom direction. The frame body 410 includes an upper opening 413 that opens upward at its upper end, a lower opening 414 that opens downward at its lower end, an upper opening edge 411 that is provided around the upper opening 413, and a lower opening edge 412 that is provided around the lower opening 414, and is open at both ends in one direction (the downward direction). The frame body 410 also includes side wall portions 416 that serve as a pair of first side wall portions that are provided along the downward direction and face each other in the front-to-rear direction perpendicular to the downward direction, and side wall portions 417 that serve as a pair of second side wall portions that are adjacent to the pair of side wall portions 416 and connect the pair of side wall portions 416, and that are provided along the downward direction and face each other in the left-to-right direction perpendicular to the downward direction. At least one of the pair of side wall portions 417 is a first portion to be attracted to be attracted by the second suction hole 56.

[0038] The connection portion 420 extends from the upper opening edge 411 of each of the pair of side wall portions 416 toward the inside of the frame body portion 410 and toward the lower opening edge 412. The lower end 421 of the connection portion 420 is located higher than the lower opening edge 412 of the frame body portion 410 (see FIG. 9). The connection portion 420 connects to a plug (not shown) serving as a mating connector. When not connected to a plug, there is a gap between the lower end 421 of the connection portion 420 and the frame body portion 410.

[0039] The connecting portion 420 is composed of a pair of connecting portions 420a and 420b facing each other. The connecting portions 420a and 420b are provided with abutting portions 423 that protrude inward so as to be close to each other inside the frame body portion 410 and come into contact with a plug (not shown).

[0040] The fixing portion 430 is located below the restricting portion 450. The fixing portion 430 is fixed and connected to the circuit board by reflow soldering. Note that the fixing and connection of the fixing portion 430 to the circuit board is not limited to the case where it is fixed and connected by reflow soldering, and it may be fixed and connected by a method other than reflow soldering, such as flow soldering.

[0041] The fixed portion 430 is made up of a pair of fixed portions 430a and 430b. The fixed portions 430a are provided on the left and right sides of the connecting portion 420a. The fixed portions 430b are provided on the left and right sides of the connecting portion 420b.

[0042] The floating portion 440 connects the frame body portion 410 and the fixed portion 430. The floating portion 440 extends left and right from the lower end opening edge portion 412, and is curved in a zigzag and S-shape on the same plane as the side wall portion 416 of the frame body portion 410. The floating portion 440 elastically deforms to support the frame body portion 410 so that it can move along the circuit board.

[0043] The floating portion 440 is composed of a pair of floating portions 440a and 440b. The floating portions 440a are provided on the left and right of the connecting portion 420a, and connect the bottom opening edge 412 of the frame body portion 410 to the fixed portion 430a, respectively. The floating portions 440b are provided on the left and right of the connecting portion 420b, and connect the bottom opening edge 412 of the frame body portion 410 to the fixed portion 430b, respectively.

[0044] The restricting portions 450 are provided on the frame body portion 410, and have a gap between them and the circuit board on which the connector 100 is mounted when the connector 100 is mounted on the circuit board and a plug is not connected to the connecting portion 420. When the connector 100 is mounted on the circuit board, the restricting portions 450 come into contact with the circuit board when the frame body portion 410 moves downward, thereby restricting movement of the frame body portion 410 in the downward direction, which is the mounting direction of the connector 100 on the circuit board. The restricting portions 450 are provided on a pair of opposing side wall portions 417 that are different from a pair of opposing side wall portions 416 on which the connecting portion 420 and the floating portion 440 of the rectangular frame body portion 410 are provided.

[0045] The restricting portion 450 is composed of a pair of restricting portions 450a and 450b. The restricting portion 450a is formed by bending the upper opening edge 411 of the frame body portion 410 approximately 90 degrees to the left. The restricting portion 450b is formed by bending the upper opening edge 411 of the frame body portion 410 approximately 90 degrees to the right. The restricting portions 450b are provided in pair across a seam (not shown) of the metal plate formed when the metal plate is bent to form the connector 100.

[0046] The tongue portion 460 serving as the second adsorbed portion is bent approximately 90 degrees to the left from the upper opening edge 411 of the left side wall portion 417 and extends toward the left side. The tongue portion 460 is flat in the front-rear and left-right directions. As shown in FIG. 9 , the tongue portion 460 is provided above the upper opening edge 411.

[0047] <Operation of the electronic component suction device> The operation of the electronic component suction device 1 according to the embodiment of the present invention will be described in detail below with reference to FIGS.

[0048] The electronic component suction device 1 is provided in a mounting machine (not shown) that executes a mounting process of mounting a connector 100 on a circuit board (not shown). The connector 100 is supplied to the electronic component suction device 1 by a component supply device in a state where it is attached to a tape such as an embossed tape (not shown) and wound on a reel, or in a state where it is placed on a tray.

[0049] The electronic component suction device 1 is supplied with power from a power source (not shown) and starts operating when the main power supply is turned on.

[0050] First, the drive unit 3 is driven under the control of the control unit 2 to move the suction nozzle 50 over the connector 100 supplied by the component supply device, and bring the suction nozzle 50 close to and into contact with the connector 100. The negative pressure supply unit 4 supplies negative pressure to the suction nozzle 50 via the switching unit 6, which is switched under the control of the control unit 2. As a result, negative pressure is supplied to the suction nozzle 50 from the negative pressure supply unit 4 via the switching unit 6 and the communication hole 60. The negative pressure supplied to the suction nozzle 50 is then supplied to the first suction hole 55 via the first transmission path 57 and the second transmission path 58, and is also supplied to the second suction hole 56 via the first transmission path 57 and the third transmission path 59. At this time, the negative pressure supply unit 4 supplies negative pressure to the first transmission path 57, thereby allowing negative pressure to be supplied to both the first suction hole 55 and the second suction hole 56 simultaneously.

[0051] Next, the suction nozzle 50 sucks and adsorbs the connector 100 by the negative pressure supplied from the negative pressure supply unit 4 to the first suction hole 55 and the second suction hole 56 .

[0052] Next, the driving unit 3 is driven under the control of the control unit 2 to move the suction nozzle 50 that has sucked the connector 100 onto a circuit board (not shown).

[0053] Next, after the suction nozzle 50, which has sucked the connector 100, moves to a predetermined position on the circuit board, the positive pressure supply unit 5 supplies positive pressure to the suction nozzle 50 via the switching unit 6, which is switched under the control of the control unit 2. As a result, positive pressure is supplied to the suction nozzle 50 from the positive pressure supply unit 5 via the switching unit 6 and the communication hole 60. The positive pressure supplied to the suction nozzle 50 is then supplied to the first suction hole 55 via the first transmission path 57 and the second transmission path 58, and is also supplied to the second suction hole 56 via the first transmission path 57 and the third transmission path 59. At this time, the positive pressure supply unit 5 supplies positive pressure to the first transmission path 57, thereby being able to supply positive pressure to both the first suction hole 55 and the second suction hole 56 simultaneously.

[0054] Next, the suction nozzle 50 releases the suction of the connector 100 by the positive pressure supplied to the first suction hole 55 and the second suction hole 56 from the positive pressure supply unit 5, and mounts the connector 100 at a predetermined position on the circuit board.

[0055] Next, the driving unit 3 is driven under the control of the control unit 2 to move the suction nozzle 50 onto the connector 100 that is to be next supplied by the component supply device.

[0056] The electronic component suction device 1 repeats the above operation a predetermined number of times until a predetermined number of connectors 100 have been mounted on the circuit board, and then ends the operation.

[0057] <Operation of the electronic component suction mechanism> The operation of the electronic component suction mechanism 200 according to the embodiment of the present invention will be described in detail below with reference to FIGS.

[0058] The electronic component suction mechanism 200 starts operating when the main power supply of the electronic component suction device 1 is turned on.

[0059] First, the protrusion 53 of the suction nozzle 50 is inserted from above into the interior of the frame body 410 of the connector 100. As a result, the bottom surface 52a of the lower body 52 of the suction nozzle 50 faces the tongue portion 460 of the connector 100. In addition, the right side surface 53a of the protrusion 53 of the suction nozzle 50 faces the side wall 417 of the connector 100.

[0060] Next, the first suction hole 55 sucks and adsorbs the tongue portion 460 facing the bottom surface 52a upward, and the second suction hole 56 sucks and adsorbs the side wall portion 417 of the connector 100 facing the right side surface 53a leftward from inside the frame body portion 410.

[0061] When the connector 100 is held by the suction nozzle 50, the upper end opening edge 411 abuts against the pressing portion 54 and has a gap between it and the bottom surface 52a of the lower main body portion 52, as shown in FIG.

[0062] With the protrusion 53 inserted inside the frame body 410, the pressing portion 54 can abut against the upper end opening edge 411 of the frame body 410 and press the connector 100 downward. Thus, when the suction nozzle 50 mounts the connector 100 on a circuit board in a suctioned state, the pressing portion 54 can press the connector 100 downward, which is the mounting direction of the connector 100, via the frame body 410. Furthermore, when the suction nozzle 50 mounts the connector 100 on a circuit board in a suctioned state, the lower main body 52 of the suction nozzle 50 can press the connector 100 downward via the tongue portion 460 with the bottom surface 52a of the lower main body 52.

[0063] The suction nozzle 50 sucks and adheres the connector 100 at two locations, the first suction hole 55 and the second suction hole 56, thereby increasing the suction force on the connector 100 and stabilizing the posture of the connector 100 when it is adsorbed, thereby enabling the connector 100 to be mounted on the circuit board at high speed.

[0064] Furthermore, the right side wall portion 417, which is one of a pair of side wall portions 417 opposing each other in the left-right direction perpendicular to the downward direction, is sucked and adsorbed by the second suction hole 56 of the suction nozzle 50, and the tongue portion 460 extending toward the left from the left side wall portion 417, which is the other of the pair of side wall portions 417, is sucked and adsorbed by the first suction hole 55 of the suction nozzle 50, thereby adsorbing two points near both ends of the connector 100 in the left-right direction, and therefore the connector 100 can be adsorbed in a stable state.

[0065] Furthermore, by sucking and adhering the side wall portion 417 using the second suction hole 56 of the suction nozzle 50, rather than the side wall portion 416 having the connection portion 420 protruding into the inside of the frame body portion 410, the frame body portion 410 can be adsorbed by the second suction hole 56 without interfering with the connection portion 420.

[0066] With conventional suction nozzles, both downward ends of the rectangular frame body 410 are open, so that it is not possible to suction the connector 100 near its center of gravity, and therefore it is not possible to stably suction the connector 100. In contrast, the suction nozzle 50 of this embodiment can stably suction the connector 100, which does not have a suction surface near its center of gravity.

[0067] As described above, according to this embodiment, there is provided a frame-shaped frame body part 410 that is provided in the connector 100 and has both ends in the downward direction that are open and that has side wall parts 417 that are provided along the downward direction, a tongue part 460 that is provided in the connector 100 and that is provided along a direction perpendicular to the downward direction, an upper body part 51 and a lower body part 52, a protrusion part 53 that protrudes downward from the lower body part 52 and can be inserted into the frame body part 410 in the downward direction, and a bottom surface 52a of the lower body part 52 that is open to the bottom surface 52a that is perpendicular to the downward direction and has a side wall part 417 that is provided along the downward direction. In addition, the suction nozzle 50 has a first suction hole 55 that sucks and adheres the tongue portion 460, and a second suction hole 56 that opens to the right side surface 53a perpendicular to the bottom surface 52a of the protrusion 53 and that sucks and adheres the side wall portion 417 when the protrusion 53 is inserted inside the frame body portion 410, thereby making it possible to suppress increases in costs and to stably adsorb a connector 100 that does not have an adsorption surface by the suction nozzle 50 near the center of gravity without generating waste.

[0068] The present invention is not limited to the above-described embodiments in terms of the types, arrangements, numbers, etc. of components, and can of course be modified as appropriate within the scope of the gist of the invention, such as by appropriately replacing the components with components that have equivalent effects.

[0069] Specifically, in the above embodiment, the connector 100 is suctioned by the suction nozzle 50, but this is not limited to this, and electronic components other than the connector 100 that have a configuration similar to the frame body portion 410 and the tongue portion 460 may also be suctioned by the suction nozzle 50.

[0070] In addition, in the above embodiment, the first transmission path 57 is branched into two transmission paths, the second transmission path 58 and the third transmission path 59, but this is not limiting, and the first transmission path 57 may be branched into three or more transmission paths depending on the configuration of the connector 100. In this case, suction holes that suck and hold the connector 100 can be provided in the number corresponding to the number of branched transmission paths.

[0071] Furthermore, in the above embodiment, the first transmission path 57 is branched downward by the second transmission path 58 and branched to the right by the third transmission path 59, but this is not limited to this, and the first transmission path 57 can be branched in any direction, such as right and left, downward and forward, or downward and backward, depending on the configuration of the connector 100.

[0072] In the above embodiment, only one of the pair of side wall portions 417 is sucked by the suction nozzle 50, but this is not limiting, and both of the pair of side wall portions 417 may be sucked by the suction nozzle.

[0073] In addition, in the above embodiment, the side wall portion 417 and the tongue portion 460, the bottom surface 52a and the right side surface 53a, and the side wall portion 416 and the side wall portion 417 are perpendicular to each other, but this is not limited to this, and they do not necessarily have to be perpendicular to each other as long as they intersect at a predetermined angle. [Industrial Applicability]

[0074] The electronic component suction mechanism, electronic component suction device, and electronic component suction method according to the present invention are suitable for suctioning electronic components. [Explanation of symbols]

[0075] 1. Electronic component suction device 2. Control section 3 Drive unit 4 Negative pressure supply section 5 Positive pressure supply section 6 Switching section 50 suction nozzle 51 Upper body part 51a Top side 52 Lower body part 52a bottom 53 Protrusion 53a Right side 54 Pressing section 55 First suction hole 56 Second suction hole 57 First Transmission Path 58 Second Transmission Path 59 Third Transmission Path 60 Communication hole 100 Connectors 200 Electronic component suction mechanism 410 Frame body part 411 Upper opening edge 412 Lower opening edge 413 Upper opening 414 Lower opening 416 Side wall 417 Side wall 420 Connection 420a connection 420b connection 421 Lower end 423 Contact part 430 Fixed part 430a Fixed part 430b Fixed part 440 Floating section 440a Floating part 440b floating part 450 Regulatory Department 450a Regulation Department 450b Regulatory Department 460 Tongue piece 571 Large diameter section 572 Small diameter section

Claims

1. An electronic component suction mechanism for suctioning an electronic component, a frame-shaped frame body portion provided on the electronic component, the frame body portion having openings at both ends in one direction and including a first adsorbed portion provided along the one direction; a second attracted portion provided on the electronic component and extending in a direction intersecting the one direction; a suction nozzle including: a main body; a protruding portion that protrudes from the main body in the one direction and is insertable into the frame body toward the one direction; a first suction hole that opens in a first surface of the main body that intersects with the one direction and sucks and adheres the second adhered portion; and a second suction hole that opens in a second surface that intersects with the first surface of the protruding portion and sucks and adheres the first adhered portion with the protruding portion inserted into the frame body; An electronic component suction mechanism comprising:

2. The frame portion is a pair of first side wall portions opposed to each other in a direction intersecting the one direction, and a pair of second side wall portions connecting the pair of first side wall portions and opposed to each other in the direction intersecting the one direction, The first adsorbed portion is one of the pair of second side wall portions, The second adsorbed portion is the second side wall portion is provided along a direction intersecting the one direction from the other of the pair of second side wall portions, 2. The suction mechanism for electronic components according to claim 1.

3. a connecting portion provided on the connector, which is the electronic component; The frame portion is a pair of first side wall portions opposed to each other in a direction intersecting the one direction, and a pair of second side wall portions connecting the pair of first side wall portions and opposed to each other in the direction intersecting the one direction, The connection portion is a pair of first sidewall portions projecting into the frame portion and connected to a mating connector inserted into the frame portion; The first adsorbed portion is At least one of the pair of second side wall portions, 2. The suction mechanism for electronic components according to claim 1.

4. The suction nozzle is a pressing portion that protrudes from the main body portion in the one direction and is capable of pressing the electronic component in the one direction by contacting the frame portion when the protruding portion is inserted into the frame portion; 4. The suction mechanism for an electronic component according to claim 1.

5. An electronic component suction device for suctioning an electronic component, a suction nozzle for suctioning the electronic component; a negative pressure supply unit that supplies negative pressure to the suction nozzle to suck the electronic component onto the suction nozzle; and The suction nozzle is a main body; a protruding portion protruding in one direction from the main body; a first suction hole opening in a first surface of the main body at a tip end side in the one direction and intersecting with the one direction, and sucking and adsorbing the electronic component by negative pressure supplied from the negative pressure supply portion; and a second suction hole opening in a second surface intersecting with the first surface of the protruding portion, and sucking and adsorbing the electronic component by negative pressure supplied from the negative pressure supply portion.

1. A suction device for electronic components.

6. The suction nozzle is a first transmission path to which negative pressure is supplied from the negative pressure supply unit, a second transmission path that supplies the negative pressure supplied from the negative pressure supply unit to the first transmission path to the first suction hole, and a third transmission path that supplies the negative pressure supplied from the negative pressure supply unit to the first transmission path to the second suction hole, 6. The electronic component suction device according to claim 5.

7. a frame-shaped frame body portion provided on the electronic component, having both ends open in one direction, and including a first adsorbed portion provided along the one direction; a second attracted portion provided on the electronic component and extending in a direction intersecting the one direction; a suction nozzle including a main body, a protruding portion protruding from the main body in the one direction, a first suction hole opening in a first surface of the main body intersecting with the one direction, and a second suction hole opening in a second surface of the protruding portion intersecting with the first surface; A method for suctioning an electronic component by a suction mechanism for an electronic component, comprising: inserting the protrusion into the frame body in the one direction; a step of sucking and adsorbing the second adsorbed portion through the first suction hole and sucking and adsorbing the first adsorbed portion through the second suction hole; 1. A method for suction of electronic components, comprising:

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