Machining device

Abstract

To provide a machining device that is able to prevent improper machining.SOLUTION: A machining device for machining a workpiece includes: a chuck table configured to hold a workpiece; a machining unit configured to machine the workpiece held by the chuck table; and a controller. The machining unit includes: a spindle; a machining unit connected to the spindle and configured to machine the workpiece; and a fluid passage connected to a liquid supply source or a suction source. The machining unit includes a mount portion to which a machining tool is attached. The mount portion includes a target contact portion with which the machining tool attached to the mount portion is brought into contact. The fluid passage opens at the target contact portion and the controller determines a state of contact between the target contact portion and the processing tool, based on a flow rate of a fluid flowing through the flow passage or a pressure of the fluid passage.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing a workpiece. [Background technology]

[0002] The device chip manufacturing process uses a wafer in which devices are formed in multiple regions defined by multiple streets (planned division lines) arranged in a grid pattern. By dividing this wafer along the streets, device chips equipped with devices are obtained. The device chips are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] When manufacturing device chips from wafers, the wafers are subjected to various processes. Wafer processing involves the use of processing equipment that processes the workpiece with processing tools. For example, wafers are processed by a cutting device that cuts the wafer with an annular cutting blade and then divided into multiple device chips. Before dividing the wafer, the wafer may be ground by a grinding device or polished by a polishing device. For example, a grinding device thins the wafer by grinding it with a processing wheel for rough grinding and a grinding wheel for finish grinding. A polishing device flattens the wafer by polishing it with a disc-shaped polishing pad.

[0004] When various processes are performed on a workpiece such as a wafer as described above, the processing efficiency decreases if each process is performed using a different processing device. Therefore, processing devices capable of performing two types of processes on a workpiece have been proposed. For example, Patent Document 1 discloses a processing device that can mount two types of processing tools on a spindle. By using such a processing device, different types of processes can be continuously performed on the workpiece, improving processing efficiency. Furthermore, since components of the processing device (such as the spindle) can be shared between the two types of processes, the processing device can be made smaller. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-1290 A Summary of the Invention [Problem to be solved by the invention]

[0006] When a workpiece is machined with a processing device, the workpiece is machined with the processing tool while the positional relationship between the workpiece and the processing tool is strictly adjusted. However, there are cases where the processing tool is not positioned appropriately when machining the workpiece due to improper installation of the processing tool or malfunction of the processing device.

[0007] Specifically, the machining tool is mounted on a mount of a machining unit provided in the machining device. If a foreign object unintentionally enters between the mount and the machining tool, the machining tool may not be mounted correctly, resulting in a misalignment or tilt of the machining tool relative to the mount. Even if the machining tool is mounted properly, if an abnormality (such as the entry of a foreign object) occurs in the movement mechanism that moves the machining tool, it may be difficult to position the machining tool in the desired position.

[0008] If such improper mounting or positioning of the machining tools is overlooked, machining of the workpiece may continue without the machining tools properly positioned, which may result in the workpiece not being machined as intended and requiring re-machining, or the workpiece being machined abnormally, resulting in machining defects.

[0009] The present invention has been made in view of the above problem, and has an object to provide a processing device that can prevent inappropriate processing. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece, comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; and a controller, wherein the processing unit comprises a spindle; a processing section connected to the spindle for processing the workpiece; and a fluid path connected to a fluid supply source or a suction source, wherein the processing section comprises a mount section to which a processing tool is attached, and the mount section comprises a contacted section with which the processing tool attached to the mount section comes into contact, the fluid path opens at the contacted section, and the controller determines the contact state between the contacted section and the processing tool based on the flow rate of fluid flowing through the fluid path or the pressure of the fluid path.

[0011] According to another aspect of the present invention, there is provided a processing device for processing a workpiece, the processing device comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; and a controller. The processing unit comprises a spindle; a processing section connected to the spindle for processing the workpiece; and a fluid path connected to a fluid supply source or a suction source. The processing section comprises a first processing section having a first mount portion to which a first processing tool is attached; a second processing section having a second mount portion to which a second processing tool is attached; a moving unit for moving the second processing section relatively to the first processing section; and a workpiece with which the second processing section comes into contact. a contact portion, the fluid path opening at the contacted portion, the moving unit being capable of positioning the second machining portion at a machining position where the second machining tool is positioned closer to the chuck table than the first machining tool, and a retracted position where the second machining tool is positioned farther from the chuck table than the first machining tool, the second machining portion contacting the contacted portion and closing the fluid path when positioned at the machining position or the retracted position, and the controller determining whether the second machining portion is positioned at the machining position or the retracted position based on the flow rate of fluid flowing through the fluid path or the pressure of the fluid path.

[0012] Furthermore, according to another aspect of the present invention, there is provided a processing apparatus for processing a workpiece, comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; and a controller, wherein the processing unit comprises a spindle; a processing section connected to the spindle for processing the workpiece; and first and second fluid paths connected to a fluid supply source or a suction source, wherein the processing section comprises: a first processing section having a first mount portion to which a first processing tool is attached; a second processing section having a second mount portion to which a second processing tool is attached; a movement unit for moving the second processing section relatively to the first processing section; and first and second contacted portions with which the second processing section comes into contact, wherein the first fluid path opens at the first contacted portion and the second fluid path opens at the second contacted portion, The moving unit is capable of positioning the second machining unit at a machining position where the second machining tool is positioned closer to the chuck table than the first machining tool, and at a retracted position where the second machining tool is positioned farther from the chuck table than the first machining tool, the second machining unit contacting the first contacted portion to block the first fluid path when positioned at the machining position, and contacting the second contacted portion to block the second fluid path when positioned at the retracted position, the controller determining whether the second machining unit is positioned at the machining position based on the flow rate of fluid flowing through the first fluid path or the pressure of the first fluid path, and determining whether the second machining unit is positioned at the retracted position based on the flow rate of fluid flowing through the second fluid path or the pressure of the second fluid path.

[0013] Preferably, the machining unit further includes a third fluid path and a fourth fluid path connected to the fluid supply source or the suction source, the first mount portion includes a third contacted portion with which the first machining tool attached to the first mount portion comes into contact, the second mount portion includes a fourth contacted portion with which the second machining tool attached to the second mount portion comes into contact, the third fluid path opens at the third contacted portion and the fourth fluid path opens at the fourth contacted portion, and the controller determines the contact state between the third contacted portion and the first machining tool based on the flow rate of fluid flowing through the third fluid path or the pressure of the third fluid path, and determines the contact state between the fourth contacted portion and the second machining tool based on the flow rate of fluid flowing through the fourth fluid path or the pressure of the fourth fluid path.

[0014] Preferably, the processing apparatus further includes a measuring device that measures the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path, and the controller makes the determination based on the measured values ​​measured by the measuring device. Preferably, the processing apparatus further includes a measuring device that measures the flow rate of the fluid flowing through the first fluid path or the pressure of the first fluid path and the flow rate of the fluid flowing through the second fluid path or the pressure of the second fluid path, and the controller makes the determination based on the measured values ​​measured by the measuring devices. Preferably, the processing apparatus further includes a first measuring device that measures the flow rate of the fluid flowing through the first fluid path or the pressure of the first fluid path, and a second measuring device that measures the flow rate of the fluid flowing through the second fluid path or the pressure of the second fluid path, and the controller makes the determination based on the measured values ​​measured by the first measuring device and the second measuring device.

[0015] Preferably, the processing device further includes a pressure adjusting unit that adjusts the pressure in the fluid path. Preferably, the processing device further includes a pressure adjusting unit that adjusts the pressure in the first fluid path and the second fluid path.

[0016] Preferably, the processing tool is a processing wheel having an annular base and a grindstone fixed to the base. Preferably, the first processing tool and the second processing tool are processing wheels having an annular base and a grindstone fixed to the base. [Effects of the Invention]

[0017] A machining apparatus according to one aspect of the present invention determines the contact state between the contacted portion of the mount and the machining tool based on the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path, thereby making it possible to check whether the machining tool is properly attached to the mount and to prevent machining of the workpiece when the machining tool is improperly attached.

[0018] In addition, a processing device according to another aspect of the present invention determines whether the second processing unit is positioned at the processing position and / or whether the second processing unit is positioned at the retracted position based on the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path, thereby preventing the second processing unit from being positioned in an inappropriate position when processing the workpiece. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. [Figure 2] FIG. [Figure 3] 10 is a partial cross-sectional front view showing the processing device when a processing tool is attached to a mount portion. FIG. [Figure 4] 1 is a partial cross-sectional front view showing the processing device in a state in which a processing tool is attached to a mount portion. FIG. [Figure 5] FIG. 10 is a partial cross-sectional front view showing a processing device according to a first modified example in a state where a second processing unit is positioned at a retracted position. [Figure 6] 10 is a partial cross-sectional front view showing a processing device according to a first modified example in a state where a second processing unit is positioned at a processing position. FIG. [Figure 7]FIG. 10 is a partial cross-sectional front view showing a processing device according to a second modified example in a state where the second processing unit is positioned at a retracted position. [Figure 8] FIG. 10 is a partial cross-sectional front view showing a processing device according to a second modified example in a state where a second processing unit is positioned at a processing position. [Figure 9] FIG. 10 is a partial cross-sectional front view showing a processing device according to a third modified example in a state where the second processing unit is positioned at a retracted position. [Figure 10] FIG. 10 is a partial cross-sectional front view showing a processing device according to a third modified example in a state where a second processing unit is positioned at a processing position. DETAILED DESCRIPTION OF THE INVENTION

[0020] (Embodiment 1) An embodiment according to one aspect of the present invention will be described below with reference to the accompanying drawings. First, an example of the configuration of a processing device according to this embodiment will be described. FIG. 1 is a perspective view showing a processing device 2. The processing device 2 is a grinding device that performs grinding on a workpiece 11. In FIG. 1, the X-axis direction (first horizontal direction, front-to-back direction) and the Y-axis direction (second horizontal direction, left-to-right direction) are perpendicular to each other. Furthermore, the Z-axis direction (height direction, up-down direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0021] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as single crystal silicon, and has a front surface (first surface) 11a and a back surface (second surface) 11b that are generally parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) arranged in a grid pattern so as to intersect with each other. Furthermore, devices (not shown), such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices, are formed on the front surface 11a side of each of the regions divided by the streets.

[0022] By dividing the workpiece 11 along the streets, a plurality of device chips each equipped with a device are manufactured. To divide the workpiece 11, a processing device such as a cutting device that cuts the workpiece 11 with an annular cutting blade or a laser processing device that processes the workpiece 11 by irradiating it with a laser beam is used. Furthermore, before dividing the workpiece 11, the back surface 11b side of the workpiece 11 is ground by the processing device 2 to thin the workpiece 11, thereby obtaining thinned device chips.

[0023] However, there are no limitations on the type, material, size, shape, structure, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, resin, metal, etc. Furthermore, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 11 does not necessarily have to have any devices formed thereon.

[0024] Furthermore, the workpiece 11 may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a package substrate is formed by mounting multiple device chips on a predetermined substrate and then covering and sealing the mounted device chips with a resin layer (mold resin). By dividing the package substrate, multiple package devices are manufactured, each including multiple packaged device chips. Furthermore, before dividing the package substrate, the resin layer of the package substrate is ground and thinned using the processing apparatus 2, thereby obtaining a thin package device.

[0025] The processing device 2 includes a base 4 that supports or houses each of the components that make up the processing device 2. A rectangular opening 4a is provided on the top surface of the base 4, with its longitudinal direction aligned with the X-axis direction. Furthermore, a rectangular parallelepiped support structure 6 is provided on the top surface of the rear end of the base 4, aligned with the Z-axis direction.

[0026] A chuck table (holding table) 8 is provided inside the opening 4a to hold the workpiece 11. The upper surface of the chuck table 8 is a flat surface that is roughly parallel to the horizontal plane (XY plane) and constitutes a holding surface 8a that holds the workpiece 11. The holding surface 8a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), and the like provided inside the chuck table 8.

[0027] An X-axis movement unit 10 that moves the chuck table 8 along the X-axis direction is connected to the chuck table 8. The X-axis movement unit 10 is, for example, a ball screw type movement mechanism, and is provided inside the opening 4a. Specifically, the X-axis movement unit 10 includes an X-axis ball screw (not shown) arranged along the X-axis direction, and an X-axis pulse motor (not shown) that rotates the X-axis ball screw.

[0028] The X-axis movement unit 10 also includes a flat table cover 12 that is provided to surround the chuck table 8. Bellows-shaped dust-proof and drip-proof covers 14 that are extendable and contractible along the X-axis direction are provided in front and behind the table cover 12. The table cover 12 and the dust-proof and drip-proof covers 14 are installed so as to cover the components of the X-axis movement unit 10 (such as the X-axis ball screw and X-axis pulse motor) that are housed inside the opening 4a.

[0029] When the X-axis moving unit 10 is operated, the chuck table 8 moves along the X-axis direction together with the table cover 12 and is positioned at the front end (transport area) or rear end (processing area) of the opening 4a. In addition, the chuck table 8 is connected to a rotation drive source (not shown) such as a motor that rotates the chuck table 8 around a rotation axis that is approximately parallel to the Z-axis direction.

[0030] A Z-axis movement unit 16 is provided on the front side of the support structure 6. For example, a ball screw type movement mechanism is installed as the Z-axis movement unit 16. Specifically, the Z-axis movement unit 16 includes a pair of Z-axis guide rails 18 arranged along the Z-axis direction. A flat Z-axis movement plate 20 is attached to the pair of Z-axis guide rails 18 so as to be slidable along the Z-axis guide rails 18.

[0031] A nut portion (not shown) is provided on the back surface (rear surface) of the Z-axis moving plate 20. A Z-axis ball screw 22, which is disposed along the Z-axis direction between a pair of Z-axis guide rails 18, is threadedly engaged with this nut portion. A Z-axis pulse motor 24 that rotates the Z-axis ball screw 22 is connected to the end of the Z-axis ball screw 22. When the Z-axis pulse motor 24 rotates the Z-axis ball screw 22, the Z-axis moving plate 20 moves (up and down) in the Z-axis direction along the Z-axis guide rails 18.

[0032] A support member 26 is fixed to the surface (front surface) side of the Z-axis moving plate 20. The support member 26 supports a processing unit (grinding unit) 28 that performs grinding on the workpiece 11 held by the chuck table 8.

[0033] The machining unit 28 includes a cylindrical housing 30 supported by the support member 26. The housing 30 accommodates a cylindrical spindle 32 arranged along the Z-axis direction. The tip (lower end) of the spindle 32 protrudes downward from the lower surface of the housing 30.

[0034] A rotary drive source 34 (see FIG. 3), such as a motor, that rotates the spindle 32 is provided on the base end (upper end) of the spindle 32. For example, the rotary drive source 34 supports and rotates the spindle 32 by an air bearing. In this case, the spindle 32 and the rotary drive source 34 form an air spindle. However, there is no limitation on the type of rotary drive source 34.

[0035] A processing unit 36 ​​that processes the workpiece 11 is connected to the spindle 32. The processing unit 36 ​​includes a mount 38 that is fixed to the tip of the spindle 32. For example, the mount 38 is configured by a disk-shaped member made of metal or the like.

[0036] A machining tool 40 for machining the workpiece 11 is removably attached to the underside of the mount 38. For example, the machining tool 40 is fixed to the mount 38 by a fastener (not shown) such as a fastening bolt. When the machining tool 40 is attached to the mount 38, the mount 38 and the machining tool 40 are integrated, and the machining tool 40 becomes part of the machining unit 36. The machining tool 40 rotates around a rotation axis that is approximately parallel to the Z-axis direction by power transmitted from the rotation drive source 34 (see FIG. 3) via the spindle 32 and the mount 38.

[0037] 2 is a perspective view showing a processing tool 40. In this embodiment, a case will be described in which the processing tool 40 is a processing wheel (grinding wheel) that performs grinding on a workpiece 11. The processing tool 40 includes an annular base 42 and a plurality of grinding wheels (grinding wheels) 44 fixed to the base 42.

[0038] The base 42 is an annular member made of metal (aluminum alloy, etc.), resin, etc., and is formed to have approximately the same diameter as the mount portion 38 (see FIG. 1). The base 42 also has a first surface 42a and a second surface 42b that are approximately parallel to each other. The first surface 42a corresponds to a fixed end surface that is fixed to the mount portion 38, and the second surface 42b corresponds to a free end surface that is not fixed to the mount portion 38.

[0039] A circular opening 42c is provided in the center of the base 42. The opening 42c is formed so as to extend from the first surface 42a to the second surface 42b and penetrates the base 42 in the thickness direction. For example, the opening 42c is formed in a truncated cone shape whose diameter increases from the first surface 42a toward the second surface 42b. An annular groove 42d is provided on the second surface 42b side of the base 42. The groove 42d is formed concentrically with the opening 42c along the outer periphery of the base 42.

[0040] A plurality of grinding stones 44 are inserted into the grooves 42d and fixed in place with adhesive or the like. Each of the grinding stones 44 is formed, for example, in a rectangular parallelepiped shape, and includes abrasive grains and a bonding material (bond material) that bonds the abrasive grains. Diamond, cBN (cubic boron nitride), or the like can be used as the abrasive grains. Furthermore, a glassy vitrified bond primarily composed of SiO2 or the like, or a resin bond primarily composed of resin, or the like can be used as the bonding material.

[0041] The grinding wheels 44 are arranged in a circular pattern at approximately equal intervals along the groove 42d. A rectangular surface of each grinding wheel 44 exposed on the side opposite to the base 42 constitutes a grinding surface 44a that comes into contact with the workpiece 11 and grinds the workpiece 11.

[0042] The base 42 also has a plurality of machining liquid supply paths 42e that extend from the first surface 42a to the second surface 42b and penetrate the base 42. The machining liquid supply paths 42e are arranged in a ring shape at approximately equal intervals along the circumferential direction of the base 42. One end of each machining liquid supply path 42e opens at the first surface 42a, and the other end of each machining liquid supply path 42e opens in the second surface 42b in a region between the opening 42c and the groove 42d.

[0043] 1, the processing device 2 includes a controller (control unit, control section, control device) 46 that controls the processing device 2. The controller 46 is connected to each component of the processing device 2 (such as the chuck table 8, the X-axis moving unit 10, the Z-axis moving unit 16, and the processing unit 28). The controller 46 controls the operation of the processing device 2 by outputting control signals to each component of the processing device 2.

[0044] For example, the controller 46 is configured by a computer. Specifically, the controller 46 includes a processing unit that performs calculations and the like to operate the processing device 2, and a storage unit that stores various information (data, programs, etc.) used to operate the processing device 2. The processing unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0045] When grinding the workpiece 11 with the processing device 2, a processing tool 40 is attached to the mount 38 of the processing unit 28. The workpiece 11 is held by the chuck table 8. For example, the workpiece 11 is placed on the chuck table 8 so that the front surface 11a faces the holding surface 8a and the back surface 11b (surface to be ground) is exposed upward. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 8a, the workpiece 11 is sucked and held by the chuck table 8.

[0046] Next, the chuck table 8 is moved by the X-axis movement unit 10 and positioned in the machining area below the machining tool 40. Then, the chuck table 8 and the spindle 32 are each rotated in a predetermined direction at a predetermined rotation speed. When the spindle 32 is rotated, the machining tool 40 rotates around the rotation axis of the spindle 32, and the multiple grinding wheels 44 (see FIG. 2) each revolve along a circular revolving path around the rotation axis of the spindle 32.

[0047] The chuck table 8 is positioned so that the center of the workpiece 11 and the swivel path of the grinding wheel 44 overlap in the Z-axis direction. The outer diameter of the swivel path of the grinding wheel 44 is larger than the radius of the workpiece 11. Therefore, the swivel path of the grinding wheel 44 is positioned so as to overlap with an arc-shaped region that passes through the center of the workpiece 11.

[0048] Then, while the chuck table 8 and the machining tool 40 are being rotated, the machining tool 40 is lowered at a predetermined speed by the Z-axis movement unit 16. As a result, the workpiece 11 and the machining tool 40 move relatively (grinding feed) at a predetermined speed (grinding feed speed) along the Z-axis direction, and the machining tool 40 approaches the workpiece 11. Then, when the grinding surface 44a (see FIG. 2) of the grinding wheel 44 comes into contact with the back surface 11b of the workpiece 11, the back surface 11b of the workpiece 11 is scraped off, and the workpiece 11 is ground and thinned.

[0049] During grinding of the workpiece 11, a liquid (working fluid) such as pure water supplied to the working fluid supply path 42e (see FIG. 2) is supplied to the workpiece 11 and the grinding wheel 44. This cools the workpiece 11 and the grinding wheel 44, and also washes away chips (processing chips) generated by grinding the workpiece 11.

[0050] When machining the workpiece 11 with the machining device 2 as described above, if the machining tool 40 is not properly attached to the mount 38, the workpiece 11 cannot be machined properly. For example, if a foreign object unintentionally gets between the mount 38 and the machining tool 40 when the machining tool 40 is attached to the mount 38, the machining tool 40 may become misaligned or tilted relative to the mount 38. If machining of the workpiece 11 continues in this state, the machining tool 40 may not be positioned at the appropriate position or angle, which could result in machining defects.

[0051] Therefore, the processing device 2 according to this embodiment checks whether the processing tool 40 is properly attached to the mount 38 by determining the contact state between the mount 38 and the processing tool 40. This makes it possible to avoid continuing processing of the workpiece 11 with the processing tool 40 improperly attached, thereby preventing improper processing of the workpiece 11. The configuration and operation of the processing device 2 that determines the contact state between the mount 38 and the processing tool 40 will be described in detail below.

[0052] Fig. 3 is a partial cross-sectional front view showing the processing device 2 when the processing tool 40 is attached to the mount portion 38. Note that Fig. 3 illustrates some of the components of the processing device 2 and the functional configuration of the controller 46 in blocks (the same applies to Fig. 4 and subsequent figures).

[0053] The mount 38 has a contacted portion 38a that comes into contact with the machining tool 40 attached to the mount 38. Specifically, when the machining tool 40 is attached to the mount 38, a first surface 42a of an annular base 42 provided on the machining tool 40 comes into contact with the underside of the mount 38. The annular region of the underside of the mount 38 that comes into contact with the base 42 corresponds to the contacted portion 38a.

[0054] The machining unit 28 also includes a fluid path 50 through which a fluid can flow. For example, the fluid path 50 is formed inside the spindle 32 and the mount portion 38, and one end (tip) of the fluid path 50 is open and exposed at the contacted portion 38a of the mount portion 38. Note that the fluid path 50 may branch into multiple fluid paths and open at multiple locations on the contacted portion 38a.

[0055] 4 is a partial cross-sectional front view showing the processing device 2 with the processing tool 40 attached to the mount portion 38. The processing tool 40 is fixed to the mount portion 38 by a fastener (not shown) such as a fastening bolt with the first surface 42a of the base 42 in contact with the contacted portion 38a. As a result, the fluid path 50 opening in the contacted portion 38a is covered and closed by the processing tool 40.

[0056] The machining tool 40 may be provided with a replaceable seal member that closes the fluid path 50. For example, a seal member made of a flexible resin such as rubber is provided in an area of ​​the first surface 42a of the base 42 that corresponds to the fluid path 50. When the machining tool 40 is attached to the mount 38, the seal member enters the tip of the fluid path 50 and seals the fluid path 50. This makes it less likely that fluid will leak from the tip of the fluid path 50.

[0057] A fluid supply source 52 that supplies fluid to the fluid path 50 is connected to the other end (upper end) of the fluid path 50. For example, the fluid supply source 52 is connected to the fluid path 50 via a rotary joint, and supplies a gas such as air or nitrogen gas to the fluid path 50 at a predetermined flow rate.

[0058] A pressure adjustment unit 54 that adjusts the pressure of the fluid path 50 is connected to the fluid path 50. For example, the pressure adjustment unit 54 is configured with piping such as a tube or pipe that allows the fluid to flow out of the fluid path 50. One end of the pressure adjustment unit 54 is connected to the fluid path 50, and the other end is open to the atmosphere. A portion of the fluid supplied from the fluid supply source 52 to the fluid path 50 flows out to the pressure adjustment unit 54, thereby maintaining the pressure of the fluid path 50 within a predetermined range and preventing an excessive increase in pressure. However, there are no limitations on the configuration of the pressure adjustment unit 54 as long as it is possible to adjust the pressure of the fluid path 50. For example, a pressure regulator may be connected to the fluid path 50 as the pressure adjustment unit 54.

[0059] Furthermore, a measuring device 56 that measures the flow rate of the fluid flowing through the fluid path 50 is connected to the fluid path 50. That is, the measuring device 56 is a flow meter (flow rate sensor) that measures the flow rate of the fluid. The measuring device 56 measures the flow rate of the fluid flowing inside the fluid path 50 and outputs the measured value to the controller 46.

[0060] The controller 46 determines the contact state between the contacted portion 38a of the mount portion 38 and the machining tool 40 based on the flow rate of the fluid flowing through the fluid path 50. Specifically, the controller 46 includes a determination unit 46a that performs the determination, and a storage unit (memory) 46b that stores various information (data, programs, etc.) used for the determination by the determination unit 46a.

[0061] When determining the contact state between the contacted portion 38a and the machining tool 40, a fluid is supplied at a predetermined flow rate from the fluid supply source 52 to the fluid path 50. In addition, a measuring device 56 (flow meter) measures the flow path of the fluid flowing through the fluid path 50 and outputs the result to a determining unit 46a of the controller 46.

[0062] When the machining tool 40 is not attached to the mount 38 (see FIG. 3), the fluid path 50 is not blocked by the machining tool 40 at the contacted portion 38a of the mount 38, and therefore the fluid flows out of the fluid path 50. Therefore, in the fluid path 50, the fluid flows smoothly from the fluid supply source 52 toward the contacted portion 38a, and the flow rate of the fluid measured by the measuring device 56 increases.

[0063] On the other hand, when the machining tool 40 is attached to the mount 38 (see FIG. 4), the fluid path 50 is blocked by the machining tool 40 at the contacted portion 38a of the mount 38, restricting the outflow of fluid from the fluid path 50. This causes the flow of fluid inside the fluid path 50 to stagnate, reducing the flow rate of fluid measured by the measuring device 56. A pressure adjusting unit 54 is connected to the fluid path 50, and the fluid supplied to the fluid path 50 flows out to the pressure adjusting unit 54. Therefore, even if the fluid path 50 is blocked by the machining tool 40, the pressure in the fluid path 50 does not rise excessively.

[0064] However, if the machining tool 40 is improperly attached to the mount 38, the machining tool 40 will not completely block the fluid path 50. For example, if there is a foreign object between the mount 38 and the machining tool 40, or if the machining tool 40 is not properly fixed to the mount 38, the fluid path 50 will not be completely blocked, and fluid will leak from the fluid path 50 at the contacted portion 38a. As a result, the flow rate of the fluid measured by the measuring device 56 will be higher than when the fluid path 50 is completely blocked.

[0065] Therefore, the controller 46 judges the contact state between the contacted portion 38a and the machining tool 40 based on the measurement value measured by the measuring device 56. Specifically, the flow rate Q of the fluid measured by the measuring device 56 is input to the judging unit 46a. In addition, the memory unit 46b stores a reference value Q of the flow rate that serves as a criterion for judgment. ref is stored in advance. Reference value Q refis set to a value higher than the flow rate of the fluid flowing through the fluid path 50 when the machining tool 40 is properly attached to the mount portion 38 (see Figure 4), i.e., when the fluid path 50 is blocked by the machining tool 40.

[0066] Then, the determination unit 46a calculates the flow rate Q and the reference value Q ref By comparing the flow rate Q with the reference value Q, the contact state between the contacted portion 38a and the processing tool 40 is determined. ref If the flow rate Q is less than the reference value Q, the determining unit 46a determines that the contacted portion 38a and the machining tool 40 are in proper contact with each other and that the machining tool 40 is properly attached to the mount portion 38. ref If the above is the case, the determining unit 46a determines that the contacted portion 38a and the machining tool 40 are not in proper contact with each other and that the machining tool 40 is not properly attached to the mount unit 38.

[0067] The timing at which the above determination is made can be set appropriately depending on the operating status of the processing device 2. For example, the above determination is made immediately after the processing tool 40 is attached to the mount portion 38 or immediately before the processing of the workpiece 11 by the processing tool 40 starts.

[0068] The result of the determination by the determination unit 46a is notified to the operator. For example, the processing device 2 is equipped with a display unit (display unit, display device) configured by a display. The controller 46 outputs a control signal to the display unit to cause the display unit to display the result of the determination by the determination unit 46a. The controller 46 may also transmit the result of the determination to a communication device provided outside the processing device 2.

[0069] If it is determined that the contact state between the contacted portion 38a and the machining tool 40 is abnormal, the operation of the machining device 2 is suspended. Then, after the operator is notified of the determination result and takes appropriate measures (such as reattaching the machining tool 40), the operation of the machining device 2 is resumed. Note that after the operator takes the measures, the contact state between the contacted portion 38a and the machining tool 40 may be determined again before the machining device 2 is restarted.

[0070] As described above, the processing device 2 according to this embodiment determines the contact state between the contacted portion 38a of the mount portion 38 and the processing tool 40 based on the flow rate of the fluid flowing through the fluid path 50. This makes it possible to inspect whether the processing tool 40 is properly attached to the mount portion 38, and prevents the workpiece 11 from being processed when the processing tool 40 is improperly attached.

[0071] In the above description, the controller 46 determines the contact state between the contacted portion 38a and the machining tool 40 based on the flow rate of the fluid flowing through the fluid path 50. However, the controller 46 may also determine the contact state between the contacted portion 38a and the machining tool 40 based on the pressure in the fluid path 50.

[0072] Specifically, instead of or in addition to the fluid supply source 52, a suction source such as an ejector is connected to the fluid path 50. When the suction source is activated, the fluid in the fluid path 50 is sucked in by the suction source. In addition, a pressure gauge (pressure sensor) that measures the pressure inside the fluid path 50 is connected to the fluid path 50 as the measuring device 56.

[0073] If the machining tool 40 is not attached to the mount portion 38 (see FIG. 3), or if the machining tool 40 is improperly attached, the fluid path 50 is not blocked by the machining tool 40. Therefore, when the suction source sucks the fluid in the fluid path 50, the fluid (outside air) flows into the fluid path 50 at the contacted portion 38a, making it difficult for the pressure in the fluid path 50 to decrease. As a result, the pressure in the fluid path 50 measured by the measuring device 56 becomes relatively high.

[0074] On the other hand, when the machining tool 40 is properly attached to the mount 38 (see FIG. 4), the fluid path 50 is blocked by the machining tool 40, and the only path for the fluid (outside air) to flow into the fluid path 50 is through the pressure adjustment unit 54. Therefore, when the fluid in the fluid path 50 is sucked by the suction source, the pressure in the fluid path 50 is likely to drop. As a result, the pressure in the fluid path 50 measured by the measuring device 56 is lower than when the fluid path 50 is not blocked.

[0075] Therefore, the controller 46 judges the contact state between the contacted portion 38a and the machining tool 40 based on the measurement value measured by the measuring device 56. Specifically, the pressure P of the fluid path 50 measured by the measuring device 56 is input to the judging unit 46a. In addition, the memory unit 46b stores a reference value P of the pressure that serves as a criterion for judgment. ref is stored in advance. ref is set to a value higher than the pressure in the fluid path 50 when the machining tool 40 is properly attached to the mount portion 38 (see FIG. 4), i.e., when the fluid path 50 is properly blocked.

[0076] The determination unit 46a then calculates the pressure P and the reference value P ref By comparing the pressure P with the reference value P, the contact state between the contacted portion 38a and the processing tool 40 is determined. ref If the pressure P is less than the reference value P, the determining unit 46a determines that the contacted portion 38a and the machining tool 40 are in proper contact with each other and that the machining tool 40 is properly attached to the mount portion 38. ref If the above is the case, the determining unit 46a determines that the contacted portion 38a and the machining tool 40 are not in proper contact with each other and that the machining tool 40 is not properly attached to the mount unit 38.

[0077] It is also possible to measure the pressure in the fluid path 50 using a measuring device 56 (pressure gauge) while supplying fluid from the fluid supply source 52 to the fluid path 50, and determine the contact state between the contacted portion 38a and the machining tool 40 based on the pressure in the fluid path 50. It is also possible to measure the flow rate of the fluid flowing through the fluid path 50 using a measuring device 56 (flow meter) while sucking the fluid in the fluid path 50 using a suction source, and determine the contact state between the contacted portion 38a and the machining tool 40 based on the flow rate of the fluid flowing through the fluid path 50.

[0078] In addition, in this embodiment, the present invention has been described as being applied to the processing device 2. However, the present invention can also be applied to other types of processing devices that process a workpiece with a processing tool. Examples of other processing devices include cutting devices and polishing devices.

[0079] The cutting device is equipped with a chuck table that holds the workpiece and a processing unit (cutting unit) that cuts the workpiece. The cutting unit has a spindle, and an annular cutting blade is attached to the tip of the spindle as a processing tool. The workpiece is held by the chuck table, and the cutting blade is rotated and cuts into the workpiece, thereby performing a cutting process on the workpiece.

[0080] The polishing device includes a chuck table that holds the workpiece and a processing unit (polishing unit) that polishes the workpiece. The polishing unit includes a spindle, the tip of which is fitted with a disc-shaped polishing pad as a processing tool. The workpiece is held by the chuck table, and the polishing process is carried out by rotating the chuck table and the polishing pad while bringing the polishing pad into contact with the workpiece.

[0081] By applying the present invention to a cutting device, a cutting device capable of determining the attachment state of a cutting blade can be configured, and by applying the present invention to a polishing device, a polishing device capable of determining the attachment state of a polishing pad can be configured.

[0082] In addition, the configuration, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, the configuration, method, etc. according to this embodiment can be appropriately combined with other embodiments.

[0083] (Embodiment 2) In the first embodiment, a processing device capable of determining whether a processing tool is properly attached to a mount of a processing unit has been described. However, even if the processing tool is properly attached to the mount, if the processing part is not positioned in an appropriate position when processing the workpiece, there is a risk of interference with the processing of the workpiece. Therefore, in this embodiment, a processing device capable of determining whether the processing part is positioned in a predetermined position will be described.

[0084] 5 and 6 show a processing device 2A corresponding to a first modified example of the processing device 2. Fig. 5 is a partial cross-sectional front view showing the processing device 2A in a state where a second processing unit 70 (described later) is positioned at a retracted position, and Fig. 6 is a partial cross-sectional front view showing the processing device 2A in a state where the second processing unit 70 is positioned at a processing position. The configuration and functions of the processing device 2A are the same as those of the processing device 2 (see embodiment 1), except for the matters described below.

[0085] The processing device 2A includes a processing unit 28A. The processing unit 28A includes a housing 30A, a spindle 32A, and a rotary drive source 34A. The configurations and functions of the housing 30A, spindle 32A, and rotary drive source 34A are similar to those of the housing 30, spindle 32, and rotary drive source 34 of the processing unit 28 (see FIGS. 3 and 4), respectively.

[0086] A processing unit 36A that processes the workpiece 11 is connected to the spindle 32A. The processing unit 36A includes a first processing unit 60 and a second processing unit 70 that can perform the same or different types of processing on the workpiece 11.

[0087] The first processing unit 60 includes a first mount unit 62 to which a first processing tool 64 is attached. The first mount unit 62 is configured from a disk-shaped member made of metal or the like, and is fixed to the tip of the spindle 32. The configuration and function of the first mount unit 62 are similar to those of the mount unit 38 of the processing device 2 (see FIGS. 3 and 4).

[0088] For example, the first processing tool 64 is a processing wheel (grinding wheel) that performs grinding on the workpiece 11, and includes an annular base 66 and a plurality of grinding wheels (grinding wheels) 68 fixed to the base 66. The configuration and function of the first processing tool 64 are similar to those of the processing tool 40 (see FIG. 2). When the first processing tool 64 is attached to the first mount portion 62, the first mount portion 62 and the first processing tool 64 are integrated, and the first processing tool 64 becomes a part of the first processing unit 60.

[0089] The second processing unit 70 includes a second mount unit 72 to which a second processing tool 74 is attached. The second mount unit 72 is configured from an annular member made of metal or the like, and is disposed so as to surround the tip of the spindle 32A. A cylindrical opening (accommodation portion) 72a capable of accommodating all or part of the first mount unit 62 and the first processing tool 64 is provided on the underside of the center of the second mount unit 72.

[0090] A second machining tool 74 for machining the workpiece 11 is detachably attached to the underside of the outer periphery of the second mount portion 72. For example, the second machining tool 74 is fixed to the second mount portion 72 by a fastener (not shown) such as a fastening bolt. When the second machining tool 74 is attached to the second mount portion 72, the second mount portion 72 and the second machining tool 74 are integrated, and the second machining tool 74 becomes part of the second machining portion 70.

[0091] For example, the second processing tool 74 is a processing wheel (grinding wheel) that performs grinding on the workpiece 11, and includes an annular base 76 and a plurality of grinding wheels (grinding wheels) 78 fixed to the base 76. The base 76 and the grinding wheels 78 can be configured similarly to the base 66 and the grinding wheels 68 of the first processing tool 64, respectively. However, the diameter of the second processing tool 74 (diameter of the base 76) is larger than the diameter of the first processing tool 64 (diameter of the base 66). In other words, the first processing tool 64 and the second processing tool 74 are processing wheels with different diameters.

[0092] The first processing tool 64 and the second processing tool 74 can perform different processes on the workpiece 11. For example, the first processing tool 64 is a processing wheel for rough grinding, and the second processing tool 74 is a processing wheel for finish grinding. In this case, the average particle size of the abrasive grains contained in the grinding wheel 68 is larger than the average particle size of the abrasive grains contained in the grinding wheel 78. The average particle size of the abrasive grains corresponds to the particle size at 50% cumulative of the particle size distribution (median diameter, d50, 50% diameter) measured by, for example, laser diffraction / scattering method.

[0093] The first mount portion 62 and the second mount portion 72 are arranged concentrically. Therefore, when the first processing tool 64 and the second processing tool 74 are attached to the first mount portion 62 and the second mount portion 72, respectively, the first processing tool 64 and the second processing tool 74 are also arranged concentrically, and the first processing tool 64 is positioned inside the second processing tool 74 in a plan view.

[0094] The processing section 36A also includes a moving unit (moving mechanism) 80 that moves the second processing section 70 relative to the first processing section 60. The moving unit 80 is fixed to the spindle 32A, and the second processing section 70 is fixed to the moving unit 80.

[0095] The moving unit 80 is a linear actuator that moves (lifts and lowers) the second processing unit 70 along the rotation axis direction (Z-axis direction) of the spindle 32A independently of the first processing unit 60. For example, the moving unit 80 is configured by an air cylinder.

[0096] Specifically, the moving unit 80 includes an annular cylinder 82. The cylinder 82 is disposed so as to surround the spindle 32A, and is fixed to the spindle 32A directly or via another fixing member (not shown). An annular internal space (chamber) 84 is formed in the circumferential direction of the cylinder 82 within the cylinder 82. An annular piston 86 is housed in the internal space 84 so as to surround the spindle 32A. The piston 86 divides the internal space 84 into a first chamber 84a below the piston 86 (see FIG. 5) and a second chamber 84b above the piston 86 (see FIG. 6).

[0097] The moving unit 80 also includes a plurality of rods 88 formed in a columnar shape. The base ends (upper ends) of the rods 88 are connected to the lower surface of the piston 86, and the tip ends (lower ends) of the rods 88 protrude downward from the lower end of the cylinder 82. For example, three or more rods 88 are arranged at approximately equal intervals along the circumferential direction of the cylinder 82. The upper surface side of the second mount portion 72 of the second processing unit 70 is fixed to the tip ends of the plurality of rods 88.

[0098] The cylinder 82 is provided with a first air supply port (not shown) connected to the first chamber 84a and a second air supply port (not shown) connected to the second chamber 84b. The first air supply port and the second air supply port are connected to an air supply source (not shown) via a valve such as a pressure regulator.

[0099] When air is supplied at a predetermined pressure from the first air supply port to the first chamber 84a while the second air supply port is open to the atmosphere, the rod 88 moves (rises) in the direction of being housed in the cylinder 82. As a result, the second processing unit 70 fixed to the multiple rods 88 rises along the Z-axis direction and is positioned at the retracted position (see FIG. 5).

[0100] When the second processing unit 70 is placed in the retracted position, the second processing tool 74 is placed at a position farther from the chuck table 8 in the Z-axis direction than the first processing tool 64. As a result, the height position H2 of the grinding surface of the grinding wheel 78 of the second processing tool 74 is positioned higher (on the opposite side to the chuck table 8) than the height position H1 of the grinding surface of the grinding wheel 68 of the first processing tool 64.

[0101] On the other hand, when air is supplied at a predetermined pressure from the second air supply port to the second chamber 84b while the first air supply port is open to the atmosphere, the rod 88 moves (descends) in the direction of injection from the cylinder 82. As a result, the second processing unit 70 fixed to the multiple rods 88 descends along the Z-axis direction and is positioned at the processing position (see FIG. 6).

[0102] However, there are no limitations on the configuration of the moving unit 80 as long as it is capable of moving the second processing unit 70. For example, the moving unit 80 may be configured with a plurality of air cylinders each equipped with a rod. In this case, a plurality of air cylinders are fixed to the spindle 32A at predetermined intervals along the circumferential direction of the spindle 32A.

[0103] When the second processing unit 70 is placed in the processing position, the second processing tool 74 is placed in a position closer to the chuck table 8 in the Z-axis direction than the first processing tool 64. As a result, the height position H2 of the grinding surface of the grinding wheel 78 of the second processing tool 74 is positioned lower (toward the chuck table 8) than the height position H1 of the grinding surface of the grinding wheel 68 of the first processing tool 64.

[0104] When the rotation drive source 34A is operated, the spindle 32A rotates around a rotation axis that is roughly parallel to the Z-axis direction. As a result, the first processing unit 60 connected to the lower end of the spindle 32A and the second processing unit 70 connected to the spindle 32A via the moving unit 80 each rotate around the rotation axis of the spindle 32A.

[0105] When the workpiece 11 is machined by the first machining tool 64, the second machining unit 70 is disposed at the retracted position (see FIG. 5). This allows the grinding wheel 78 of the first machining tool 64 to grind the workpiece 11 without contacting the grinding wheel 78 of the second machining tool 74 with the workpiece 11. On the other hand, when the workpiece 11 is machined by the second machining tool 74, the second machining unit 70 is disposed at the machining position (see FIG. 6). This allows the grinding wheel 78 of the second machining tool 74 to grind the workpiece 11 without contacting the grinding wheel 68 of the first machining tool 64 with the workpiece 11. The procedures for grinding the workpiece 11 by the first machining tool 64 and the second machining tool 74 are the same as those for grinding the workpiece 11 by the machining tool 40 (see embodiment 1).

[0106] The processed portion 36A includes a contact portion 90A provided on the second processed portion 70 and a contacted portion 92A with which the contact portion 90A comes into contact. For example, a protrusion (convex portion) provided on the bottom of the opening 72a of the second mount portion 72 corresponds to the contact portion 90A. However, the contact portion 90A does not necessarily have to be a protrusion, and for example, a part of the flat bottom surface of the opening 72a may function as the contact portion 90A.

[0107] 5 and 6 show a case where a part of the upper surface of the first mount portion 62 is the contacted portion 92A. However, the contacted portion 92A may be provided on a member other than the first processed portion 60.

[0108] The machining unit 28A also includes a fluid path 94A through which a fluid can flow. For example, the fluid path 94A is formed inside the spindle 32A and the first mount portion 62, and one end (tip) of the fluid path 94A is open and exposed at the contacted portion 92A. The other end (upper end) of the fluid path 94A is connected to the fluid supply source 52, the pressure adjustment unit 54, and the measuring device 56. The configurations, functions, etc. of the fluid supply source 52, the pressure adjustment unit 54, and the measuring device 56 are the same as those described in the first embodiment.

[0109] When the second processing unit 70 is positioned at the processing position (see FIG. 6), the contacting portion 90A comes into contact with the contacted portion 92A and closes the fluid path 94A that opens in the contacted portion 92A. The contacting portion 90A may be provided with a replaceable sealing member that closes the fluid path 94A. For example, all or part of the contacting portion 90A (the portion that comes into contact with the contacted portion 92A) is made of a sealing member made of a resin such as flexible rubber.

[0110] The processing unit 36A may be provided with a plurality of contacting portions 90A and a plurality of contacted portions 92A. In this case, the fluid path 94A branches into a plurality of fluid paths, which open at the plurality of contacted portions 92A. When the second processing unit 70 is positioned at the processing position, the plurality of contacting portions 90A come into contact with the plurality of contacted portions 92A, and the fluid paths 94A that open at the plurality of contacted portions 92A are closed.

[0111] When the workpiece 11 is machined with the second machining tool 74, a control signal is output from the controller 46 to the moving unit 80, and the moving unit 80 operates to position the second machining section 70 at the machining position. However, due to malfunction of the moving unit 80 or the like, the second machining section 70 may not be positioned appropriately at the machining position. In this case, even if machining is performed, the grinding wheel 78 of the second machining tool 74 does not properly contact the workpiece 11, and the intended machining is not performed on the workpiece 11.

[0112] Therefore, the controller 46 determines whether the second processing unit 70 is positioned at the processing position based on the flow rate of the fluid flowing through the fluid path 94A. Specifically, the fluid is supplied from the fluid supply source 52 to the fluid path 94A at a predetermined flow rate. In addition, the measuring device 56 (flow meter) measures the flow path of the fluid flowing through the fluid path 94A and outputs the result to the determining unit 46a of the controller 46.

[0113] When the second processing unit 70 is appropriately positioned at the processing position, the fluid path 94A is blocked by the contacting portion 90A at the contacted portion 92A, restricting the outflow of fluid from the fluid path 94A. This causes the fluid to flow sluggishly through the fluid path 94A, resulting in a decrease in the fluid flow rate measured by the measuring device 56. On the other hand, when the second processing unit 70 is not appropriately positioned at the processing position, the fluid path 94A is not blocked by the contacting portion 90A at the contacted portion 92A, causing the fluid to flow out of the fluid path 94A. This allows the fluid to flow smoothly from the fluid supply source 52 toward the contacted portion 92A within the fluid path 94A, resulting in a higher fluid flow rate measured by the measuring device 56.

[0114] Therefore, the controller 46 determines whether the second processing unit 70 is positioned at the processing position based on the measurement value measured by the measuring device 56. Specifically, the flow rate Q of the fluid measured by the measuring device 56 is input to the determining unit 46a. In addition, the memory unit 46b stores a reference value Q of the flow rate that serves as a basis for determination. ref is stored in advance. Reference value Q refis set to a value higher than the flow rate of the fluid flowing through the fluid path 94A when the second processing unit 70 is positioned at the processing position (see FIG. 6), i.e., when the fluid path 94A is properly blocked.

[0115] Then, the determination unit 46a calculates the flow rate Q and the reference value Q ref For example, when the flow rate Q is compared with the reference value Q, it is determined whether the second processing unit 70 is positioned at the processing position. ref If the flow rate Q is less than the reference value Q, the determining unit 46a determines that the contacting portion 90A is in proper contact with the contacted portion 92A and that the second processing unit 70 is positioned at the processing position. ref If the above is true, the determining unit 46a determines that the contacting portion 90A is not in proper contact with the contacted portion 92A, and that the second processing unit 70 is not positioned at the processing position.

[0116] The timing at which the above-mentioned determination is made can be set appropriately depending on the operating status of the processing device 2, etc. For example, the above-mentioned determination is made immediately before the second processing unit 70 starts processing the workpiece 11. Then, the result of the determination by the determining unit 46a is notified to the operator. A specific example of the method of notifying the operator is as described in the first embodiment.

[0117] When the determination result that the second processing unit 70 is not positioned at the processing position is notified, the operation of the processing device 2 is suspended. Then, after the operator who has been notified of the determination result takes appropriate measures (repairing or replacing the moving unit 80, etc.), the operation of the processing device 2 is resumed. Note that after the operator takes measures, a determination as to whether the second processing unit 70 is positioned at the processing position may be made again before the processing device 2 is restarted.

[0118] As described above, the processing device 2A according to this embodiment determines whether the second processing unit 70 is positioned at the processing position based on the flow rate of the fluid flowing through the fluid path 94A. This prevents the workpiece 11 from being processed when the second processing unit 70 is positioned in an inappropriate position.

[0119] In the above description, the controller 46 determines whether the second processing unit 70 is positioned at the processing position based on the flow rate of the fluid flowing through the fluid path 94A. However, the controller 46 may also determine whether the second processing unit 70 is positioned at the processing position based on the pressure in the fluid path 94A.

[0120] Specifically, a suction source such as an ejector is connected to the fluid path 94A instead of or in addition to the fluid supply source 52. When the suction source is activated, the fluid in the fluid path 94A is sucked in by the suction source. Also, a pressure gauge (pressure sensor) that measures the pressure inside the fluid path 94A is connected to the fluid path 94A as the measuring device 56.

[0121] The controller 46 then determines whether the second processing unit 70 is positioned at the processing position based on the measurement value measured by the measuring device 56. Specifically, the pressure P of the fluid path 94A measured by the measuring device 56 is input to the determining unit 46a. The memory unit 46b also stores a reference value P of pressure, which serves as a basis for determination. ref is stored in advance. ref is set to a value higher than the pressure in the fluid path 94A when the second processing unit 70 is positioned at the processing position (see FIG. 6), i.e., when the fluid path 94A is properly blocked by the contact portion 90A.

[0122] The determination unit 46a determines the pressure P and the reference value P ref For example, when the pressure P is compared with the reference value P ref If the pressure P is less than the reference value P, the determining unit 46a determines that the contacting portion 90A is in proper contact with the contacted portion 92A and that the second processing unit 70 is positioned at the processing position. ref If the above is true, the determining unit 46a determines that the contacting portion 90A is not in proper contact with the contacted portion 92A, and that the second processing unit 70 is not positioned at the processing position.

[0123] It is also possible to measure the pressure in the fluid path 94A with the measuring device 56 (pressure gauge) while supplying fluid from the fluid supply source 52 to the fluid path 94A, and determine whether or not the second processing unit 70 is positioned at the processing position based on the pressure in the fluid path 94A. Also, it is also possible to measure the flow rate of the fluid flowing through the fluid path 94A with the measuring device 56 (flow meter) while sucking the fluid in the fluid path 94A with the suction source, and determine whether or not the second processing unit 70 is positioned at the processing position based on the flow rate of the fluid flowing through the fluid path 50.

[0124] Furthermore, in the present embodiment, the first processing tool 64 and the second processing tool 74 are described as grinding wheels equipped with grindstones, but there are no limitations on the types of the first processing tool 64 and the second processing tool 74. For example, the first processing tool 64 and the second processing tool 74 may each be an annular polishing pad that polishes the workpiece 11, an annular turning wheel that performs turning cutting on the workpiece 11, or the like. Furthermore, the first processing tool 64 and the second processing tool 74 may be the same type of processing tool or different types of processing tools.

[0125] In addition, the configuration, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, the configuration, method, etc. according to this embodiment can be appropriately combined with other embodiments.

[0126] (Embodiment 3) In the second embodiment, the processing device 2A that determines whether or not the second processing unit 70 is positioned at the processing position has been described. In the present embodiment, the processing device 2B that determines whether or not the second processing unit 70 is positioned at the retracted position will be described.

[0127] 7 and 8 show a processing device 2B corresponding to a second modified example of the processing device 2. Fig. 7 is a partial cross-sectional front view showing the processing device 2B with the second processing unit 70 positioned at the retracted position, and Fig. 8 is a partial cross-sectional front view showing the processing device 2B with the second processing unit 70 positioned at the processing position. The configuration, functions, etc. of the processing device 2B are the same as those of the processing device 2A (see Figs. 5 and 6) except for the points described below.

[0128] The processing device 2B includes a processing unit 28B, which includes a processing section 36B. The configuration of the processing unit 28B is similar to that of the processing unit 28A (see FIGS. 5 and 6), except that the processing unit 28B includes a processing section 36B and a fluid path 94B instead of the processing section 36A and the fluid path 94A. The configuration of the processing section 36B is similar to that of the processing section 36A (see FIGS. 5 and 6), except that the processing section 36B includes a contact section 90B and a contacted section 92B instead of the contact section 90A and the contacted section 92A.

[0129] The processing section 36B includes a contacting section 90B provided on the second processing section 70 and a contacted section 92B with which the contacting section 90B comes into contact. For example, a protrusion (convex section) provided on the upper surface of the second mount section 72 corresponds to the contacting section 90B. However, the contacting section 90B does not necessarily have to be a protrusion, and for example, a part of the flat upper surface of the second mount section 72 may function as the contacting section 90B.

[0130] 7 and 8 show a case where a part of the lower surface of the cylinder is the contacted part 92B. However, the contacted part 92B may be provided on a member other than the moving unit 80.

[0131] The machining unit 28B also includes a fluid path 94B through which a fluid can flow. For example, the fluid path 94B is formed inside the spindle 32A and the moving unit 80 (cylinder 82), and one end (tip) of the fluid path 94B is open and exposed at the contacted portion 92B. The other end (upper end) of the fluid path 94B is connected to the fluid supply source 52, the pressure adjusting unit 54, and the measuring device 56. The configurations, functions, and other details of the fluid supply source 52, the pressure adjusting unit 54, and the measuring device 56 are as described in the first embodiment.

[0132] When the workpiece 11 is machined by the first machining tool 64, the second machining section 70 is placed in the retracted position by the moving unit 80 (see FIG. 7). On the other hand, when the workpiece 11 is machined by the second machining tool 74, the second machining section 70 is placed in the machining position by the moving unit 80 (see FIG. 8). The specific operation of the moving unit 80 when the second machining section 70 is positioned in the retracted position or the machining position is as described in the second embodiment.

[0133] When the second processing unit 70 is positioned at the retracted position (see FIG. 7), the contacting portion 90B comes into contact with the contacted portion 92B and closes the fluid path 94B that opens in the contacted portion 92B. The contacting portion 90B may be provided with a replaceable sealing member that closes the fluid path 94B. For example, all or part of the contacting portion 90B (the portion that comes into contact with the contacted portion 92B) is made of a sealing member made of a resin such as flexible rubber.

[0134] The processing unit 36B may be provided with a plurality of contact portions 90B and a plurality of contacted portions 92B. In this case, the fluid path 94B branches into a plurality of fluid paths, which open at the plurality of contacted portions 92B. When the second processing unit 70 is positioned at the retracted position, the plurality of contact portions 90B come into contact with the plurality of contacted portions 92B, and the fluid paths 94B that open at the plurality of contacted portions 92B are closed.

[0135] When the workpiece 11 is machined with the first machining tool 64, a control signal is output from the controller 46 to the moving unit 80, and the moving unit 80 operates to position the second machining section 70 at the retracted position. However, due to malfunction of the moving unit 80 or the like, the second machining section 70 may not be properly positioned at the retracted position. If machining of the workpiece 11 continues with the first machining tool 64 in this state, the second machining tool 74 may unintentionally come into contact with the workpiece 11, which may result in machining defects.

[0136] Therefore, the controller 46 determines whether the second processing unit 70 is positioned at the retracted position based on the flow rate of the fluid flowing through the fluid path 94B. Specifically, the fluid is supplied from the fluid supply source 52 to the fluid path 94B at a predetermined flow rate. In addition, the measuring device 56 (flow meter) measures the flow path of the fluid flowing through the fluid path 94B and outputs the result to the determining unit 46a of the controller 46.

[0137] When the second processing unit 70 is appropriately positioned in the retracted position, the fluid path 94B is blocked by the contacting portion 90B at the contacted portion 92B, restricting the outflow of fluid from the fluid path 94B. This causes the flow of fluid inside the fluid path 94B to be stagnant, and the fluid flow rate measured by the measuring device 56 is reduced. On the other hand, when the second processing unit 70 is not appropriately positioned in the retracted position, the fluid path 94B is not blocked by the contacting portion 90B at the contacted portion 92B, and the fluid flows out of the fluid path 94B. This allows the fluid to flow smoothly from the fluid supply source 52 toward the contacted portion 92B within the fluid path 94B, and the fluid flow rate measured by the measuring device 56 is increased.

[0138] Therefore, the controller 46 determines whether the second processing unit 70 is positioned at the retracted position based on the measurement value measured by the measuring device 56. Specifically, the flow rate Q of the fluid measured by the measuring device 56 is input to the determining unit 46a. In addition, the memory unit 46b stores a reference value Q of the flow rate that serves as a basis for determination. ref is stored in advance. Reference value Q refis set to a value higher than the flow rate of the fluid flowing through the fluid path 94B when the second processing unit 70 is positioned at the retracted position (see FIG. 7), i.e., when the fluid path 94B is properly blocked.

[0139] Then, the determination unit 46a calculates the flow rate Q and the reference value Q ref For example, when the flow rate Q is compared with the reference value Q, it is determined whether the second processing unit 70 is positioned at the retracted position. ref If the flow rate Q is less than the reference value Q, the determining unit 46a determines that the contacting portion 90B is in proper contact with the contacted portion 92B and that the second processing unit 70 is positioned at the retracted position. ref If this is the case, the determining unit 46a determines that the contacting portion 90B is not in proper contact with the contacted portion 92B, and that the second processing unit 70 is not positioned at the retracted position.

[0140] The timing at which the above-mentioned determination is made can be set appropriately depending on the operating status of the processing device 2, etc. For example, the above-mentioned determination is made immediately before the first processing unit 60 starts processing the workpiece 11. Then, the result of the determination by the determining unit 46a is notified to the operator. A specific example of the method of notifying the operator is as described in the first embodiment.

[0141] When the determination result that the second processing unit 70 is not positioned at the retracted position is notified, the operation of the processing device 2 is suspended. Then, after the operator who has been notified of the determination result takes appropriate measures (repairing or replacing the moving unit 80, etc.), the operation of the processing device 2 is resumed. Note that after the operator takes measures, a determination as to whether the second processing unit 70 is positioned at the retracted position may be made again before the processing device 2 is restarted.

[0142] As described above, the processing device 2B according to this embodiment determines whether the second processing unit 70 is positioned at the retracted position based on the flow rate of the fluid flowing through the fluid path 94B. This prevents the workpiece 11 from being processed with the second processing unit 70 positioned in an inappropriate position.

[0143] In the above description, the controller 46 determines whether the second processing unit 70 is positioned at the retracted position based on the flow rate of the fluid flowing through the fluid path 94B. However, the controller 46 may also determine whether the second processing unit 70 is positioned at the retracted position based on the pressure in the fluid path 94B.

[0144] Specifically, a suction source such as an ejector is connected to the fluid path 94B instead of or in addition to the fluid supply source 52. When the suction source is activated, the fluid in the fluid path 94B is sucked in by the suction source. In addition, a pressure gauge (pressure sensor) that measures the pressure inside the fluid path 94B is connected to the fluid path 94B as the measuring device 56.

[0145] The controller 46 then determines whether the second processing unit 70 is positioned at the retracted position based on the measurement value measured by the measuring device 56. Specifically, the pressure P of the fluid path 94B measured by the measuring device 56 is input to the determining unit 46a. The memory unit 46b also stores a pressure reference value P, which is used as a basis for determination. ref is stored in advance. ref is set to a value higher than the pressure in the fluid path 94B when the second processing part 70 is positioned in the retracted position (see FIG. 7), i.e., when the fluid path 94B is properly blocked by the contact part 90B.

[0146] The determination unit 46a determines the pressure P and the reference value P ref For example, when the pressure P is compared with the reference value P ref If the pressure P is less than the reference value P, the determining unit 46a determines that the contacting portion 90B is in proper contact with the contacted portion 92B and that the second processing unit 70 is positioned at the retracted position. ref If this is the case, the determining unit 46a determines that the contacting portion 90B is not in proper contact with the contacted portion 92B, and that the second processing unit 70 is not positioned at the retracted position.

[0147] It is also possible to measure the pressure in the fluid path 94B with the measuring device 56 (pressure gauge) while supplying fluid from the fluid supply source 52 to the fluid path 94B, and determine whether the second processing unit 70 is positioned at the retracted position based on the pressure in the fluid path 94B. It is also possible to measure the flow rate of the fluid flowing through the fluid path 94B with the measuring device 56 (flow meter) while sucking the fluid in the fluid path 94B with the suction source, and determine whether the second processing unit 70 is positioned at the retracted position based on the flow rate of the fluid flowing through the fluid path 94B.

[0148] In addition, the configuration, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, the configuration, method, etc. according to this embodiment can be appropriately combined with other embodiments.

[0149] (Embodiment 4) In the second embodiment, the processing device 2A that determines whether or not the second processing unit 70 is positioned at the processing position has been described, and in the third embodiment, the processing device 2B that determines whether or not the second processing unit 70 is positioned at the retracted position has been described. In the present embodiment, the processing device 2C that can determine whether or not the second processing unit 70 is positioned at the processing position and whether or not the second processing unit 70 is positioned at the retracted position will be described.

[0150] 9 and 10 show a processing device 2C corresponding to a third modified example of the processing device 2. Fig. 9 is a partial cross-sectional front view showing the processing device 2C in a state where the second processing unit 70 is positioned at the retracted position, and Fig. 10 is a partial cross-sectional front view showing the processing device 2C in a state where the second processing unit 70 is positioned at the processing position. The configuration and functions of the processing device 2C are the same as those of the processing devices 2A and 2B (see Figs. 5 to 8) except for the points described below.

[0151] The processing device 2C includes a processing unit 28C, which includes a processing section 36C. The configuration of the processing unit 28C is similar to that of the processing units 28A and 28B (see FIGS. 5 to 8), except that the processing unit 28C includes a processing section 36C, a first fluid path 94C, and a second fluid path 94D instead of the processing sections 36A and 36B and the fluid paths 94A and 94B. The configuration of the processing section 36C is similar to that of the processing sections 36A and 36B (see FIGS. 5 to 8), except that the processing section 36C includes a first contact section 90C, a second contact section 90D, a first contacted section 92C, and a second contacted section 92D instead of the contact sections 90A and 90B and the contacted sections 92A and 92B.

[0152] The processed portion 36C includes a first contact portion 90C and a second contact portion 90D provided on the second processed portion 70, a first contacted portion 92C with which the first contact portion 90C comes into contact, and a second contacted portion 92D with which the second contact portion 90D comes into contact. The configurations of the first contact portion 90C and the first contacted portion 92C are similar to those of the contact portion 90A and the contacted portion 92A (see FIGS. 5 and 6), respectively. The configurations of the second contact portion 90D and the second contacted portion 92D are similar to those of the contact portion 90B and the contacted portion 92B (see FIGS. 7 and 8), respectively.

[0153] The machining unit 28C also includes a first fluid path 94C and a second fluid path 94D through which a fluid can flow. For example, the first fluid path 94C is formed inside the spindle 32A and the first mount portion 62, and one end (tip) of the first fluid path 94C is open and exposed at the first contacted portion 92C. On the other hand, the second fluid path 94D is formed inside the spindle 32A and the moving unit 80 (cylinder 82), and one end (tip) of the second fluid path 94D is open and exposed at the second contacted portion 92D.

[0154] The other ends (upper ends) of the first fluid path 94C and the second fluid path 94D are connected to a fluid supply source 52 and a pressure adjustment unit 54. A first measuring device 56A is connected to the first fluid path 94C, and a second measuring device 56B is connected to the second fluid path 94D. The configurations, functions, etc. of the fluid supply source 52 and the pressure adjustment unit 54 are as described in the first embodiment. The configurations, functions, etc. of the first measuring device 56A and the second measuring device 56B are similar to those of the measuring device 56 (see FIGS. 3 to 8).

[0155] When the workpiece 11 is machined by the first machining tool 64, the second machining section 70 is placed in the retracted position by the moving unit 80 (see FIG. 9). On the other hand, when the workpiece 11 is machined by the second machining tool 74, the second machining section 70 is placed in the machining position by the moving unit 80 (see FIG. 10). The specific operation of the moving unit 80 when the second machining section 70 is positioned in the retracted position or the machining position is as described in the second embodiment.

[0156] When the second processing unit 70 is positioned at the processing position (see FIG. 10), the first contact portion 90C comes into contact with the first contacted portion 92C and blocks the first fluid path 94C that opens in the first contacted portion 92C. On the other hand, when the second processing unit 70 is positioned at the retracted position (see FIG. 9), the second contact portion 90D comes into contact with the second contacted portion 92D and blocks the second fluid path 94D that opens in the second contacted portion 92D.

[0157] The processing unit 36C may be provided with a plurality of first contact portions 90C and a plurality of first contacted portions 92C. In this case, the first fluid path 94C branches into a plurality of fluid paths, which open at the plurality of first contacted portions 92C. When the second processing unit 70 is positioned at the processing position, the plurality of first contact portions 90C come into contact with the plurality of first contacted portions 92C, and the first fluid paths 94C that open at the plurality of first contacted portions 92C are closed.

[0158] Furthermore, the processing unit 36C may be provided with a plurality of second contact portions 90D and a plurality of second contacted portions 92D. In this case, the second fluid path 94D branches into a plurality of fluid paths, which open at the plurality of second contacted portions 92D. When the second processing unit 70 is positioned at the retracted position, the plurality of second contact portions 90D come into contact with the plurality of second contacted portions 92D, and the second fluid path 94D that opens at the plurality of second contacted portions 92D is closed.

[0159] The controller 46 determines whether the second processing unit 70 is positioned at the processing position based on the flow rate of the fluid flowing through the first fluid path 94C. The controller 46 also determines whether the second processing unit 70 is positioned at the retracted position based on the flow rate of the fluid flowing through the second fluid path 94D. Specifically, fluid is supplied from the fluid supply source 52 to the first fluid path 94C and the second fluid path 94D at a predetermined flow rate. The first measuring device 56A (flow meter) measures the flow rate of the fluid flowing through the first fluid path 94C and outputs the result to the determining unit 46a of the controller 46, and the second measuring device 56B (flow meter) measures the flow rate of the fluid flowing through the second fluid path 94D and outputs the result to the determining unit 46a of the controller 46.

[0160] The determination unit 46a then determines whether the second processing unit 70 is positioned at the processing position based on the measurement value (flow rate) measured by the first measuring device 56A. The specific processing content executed by the determination unit 46a at this time is as described in the second embodiment. The determination unit 46a also determines whether the second processing unit 70 is positioned at the retracted position based on the measurement value (flow rate) measured by the second measuring device 56B. The specific processing content executed by the determination unit 46a at this time is as described in the third embodiment.

[0161] As described above, the processing device 2C according to this embodiment determines whether the second processing unit 70 is positioned at the processing position and whether the second processing unit 70 is positioned at the retracted position based on the flow rates of the fluids flowing through the first fluid path 94C and the second fluid path 94D. This prevents the workpiece 11 from being processed when the second processing unit 70 is positioned in an inappropriate position.

[0162] In the above description, the controller 46 determines the position of the second processing unit 70 based on the flow rates of the fluids flowing through the first fluid path 94C and the second fluid path 94D. However, the controller 46 may determine the position of the second processing unit 70 based on the pressures in the first fluid path 94C and the second fluid path 94D.

[0163] Specifically, a suction source such as an ejector is connected to the first fluid path 94C and the second fluid path 94D instead of or in addition to the fluid supply source 52. Furthermore, as the first measuring device 56A, a pressure gauge (pressure sensor) that measures the pressure inside the first fluid path 94C is connected to the first fluid path 94C, and as the second measuring device 56B, a pressure gauge (pressure sensor) that measures the pressure inside the second fluid path 94D is connected to the second fluid path 94D.

[0164] Then, the controller 46 determines whether the second processing unit 70 is positioned at the processing position and whether the second processing unit 70 is positioned at the retracted position based on the measurements taken by the first measuring device 56A and the second measuring device 56B. The specific contents of the processing executed by the controller 46 at this time are as described in the second and third embodiments.

[0165] Alternatively, the first measuring device 56A and the second measuring device 56B (pressure gauges) may measure the pressures of the first fluid path 94C and the second fluid path 94D while supplying fluid from the fluid supply source 52 to the first fluid path 94C and the second fluid path 94D. In this case, it is determined whether the second processing unit 70 is positioned at the processing position and whether the second processing unit 70 is positioned at the retracted position based on the pressures of the first fluid path 94C and the second fluid path 94D. Alternatively, the first measuring device 56A and the second measuring device 56B (flowmeters) may measure the flow rates of the fluid flowing through the first fluid path 94C and the second fluid path 94D while the suction source is sucking the fluid in the first fluid path 94C and the second fluid path 94D. In this case, it is determined whether the second processing unit 70 is positioned at the processing position and whether the second processing unit 70 is positioned at the retracted position based on the flow rates of the fluid flowing through the first fluid path 94C and the second fluid path 94D.

[0166] 9 and 10, a first measuring device 56A is connected to the first fluid path 94C, and a second measuring device 56B is connected to the second fluid path 94D. However, a single measuring device (flow meter) capable of measuring the flow rate of the fluid flowing through the first fluid path 94C and the flow rate of the fluid flowing through the second fluid path 94D may be connected to the first fluid path 94C and the second fluid path 94D. Also, a single measuring device (pressure meter) capable of measuring the pressure of the first fluid path 94C and the pressure of the second fluid path 94D may be connected to the first fluid path 94C and the second fluid path 94D. In this way, by using a common measuring device connected to the first fluid path 94C and the second fluid path 94D, the processing apparatus 2C can be made smaller.

[0167] In addition, the configuration, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, the configuration, method, etc. according to this embodiment can be appropriately combined with other embodiments.

[0168] (Embodiment 5) The processing devices 2A to 2C described in the second to fourth embodiments can each be equipped with a function for determining the mounting state of the processing tools (see the first embodiment). As an example, the following describes a case where the processing device 2C (see FIGS. 9 and 10) also has a function for determining the mounting state of the first processing tool 64 and the second processing tool 74.

[0169] 9 and 10, a portion of the lower surface of the first mount portion 62 corresponds to a third contacted portion that comes into contact with the first machining tool 64. Furthermore, a portion of the lower surface of the second mount portion 72 corresponds to a fourth contacted portion that comes into contact with the second machining tool 74. The machining unit 28 is provided with a third fluid path and a fourth fluid path in addition to the first fluid path 94C and the second fluid path 94D. The third fluid path and the fourth fluid path are fluid paths that correspond to the fluid path 50 (see FIGS. 3 and 4) provided in the machining device 2.

[0170] The third fluid path is formed so that one end side opens and is exposed at the third contacted portion of the first mount portion 62. Furthermore, the fourth fluid path is formed so that one end side opens and is exposed at the fourth contacted portion of the second mount portion 72. The other ends of the third fluid path and the fourth fluid path are connected to the fluid supply source 52 and the pressure adjustment unit 54. Furthermore, measuring devices 56 (flow meters) are connected to the third fluid path and the fourth fluid path, respectively.

[0171] The controller 46 then determines the contact state between the third contacted part and the first machining tool 64 based on the flow rate of the fluid flowing through the third fluid path, and determines the contact state between the fourth contacted part and the second machining tool 74 based on the flow rate of the fluid flowing through the fourth fluid path. This makes it possible to determine whether the first machining tool 64 and the second machining tool 74 are properly attached. The specific processing executed by the controller 46 when determining the attachment state of the first machining tool 64 and the second machining tool 74 is as described in the first embodiment.

[0172] The controller 46 may determine the contact state between the third contacted part and the first machining tool 64 based on the pressure in the third fluid path, or may determine the contact state between the fourth contacted part and the second machining tool 74 based on the pressure in the fourth fluid path. In this case, a suction source is connected to the other end of the third fluid path and the fourth fluid path. Also, a pressure gauge is connected to each of the third fluid path and the fourth fluid path as the measuring device 56. Then, the controller 46 determines the contact state between the third contacted part and the first machining tool 64 and the contact state between the fourth contacted part and the second machining tool 74 based on the values ​​measured by the pressure gauge.

[0173] The configuration, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, the configuration, method, etc. according to this embodiment can be appropriately combined with other embodiments. [Explanation of symbols]

[0174] 11 Workpiece 11a Surface (first side) 11b Back side (2nd side) 2,2A,2B,2C processing equipment 4 Foundation 4a aperture 6 Support structure 8 Chuck table (holding table) 8a Holding surface 10 X-axis moving unit 12 Table Cover 14 Dustproof and water-resistant cover 16 Z-axis movement unit 18 Z-axis guide rail 20 Z-axis moving plate 22 Z-axis ball screw 24 Z-axis pulse motor 26 Support member 28 Processing unit (grinding unit) 30,30A housing 32,32A spindle 34, 34A Rotation drive source 36,36A,36B,36C Processing section 38 Mounting section 38a Contacted part 40 Processing tools 42 Foundation 42a 1st page 42b 2nd side 42c aperture 42d groove 42e Machining fluid supply path 44 Grinding wheel 44a Grinding surface 46 Controller (control unit, control section, control device) 46a Judgment part 46b Memory 50 Fluid path 52 Fluid supply source 54 Pressure adjustment section 56 Measuring instruments 56A 1st measuring device 56B 2nd measuring device 60 1st processing section 62 First mount part 64 1st processing tool 66 Foundation 68 Grinding wheel 70 2nd processing section 72 Second mount 72a Opening (receiving section) 74 2nd processing tool 76 Foundation 78 Grinding wheel 80 Mobile unit (mobile mechanism) 82 cylinders 84 Internal space (chamber) 84a Room 1 84b Room 2 86 Piston 88 Rod 90A,90B contact part 90C 1st contact part 90D 2nd contact part 92A,92B Contacted part 92C 1st contacted part 92D 2nd contacted part 94A,94B Fluid path 94C 1st fluid path 94D 2nd fluid path

Claims

1. A processing device for processing a workpiece, a chuck table for holding the workpiece; a processing unit that processes the workpiece held by the chuck table; a controller; The processing unit includes a spindle, a processing part connected to the spindle and configured to process the workpiece, and a fluid path connected to a fluid supply source or a suction source; The processing unit includes a mount unit to which a processing tool is attached, the mount portion includes a contacted portion with which the machining tool attached to the mount portion comes into contact, the fluid path opens at the contacted portion, The controller determines the contact state between the contacted part and the machining tool based on the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path.

2. A processing device for processing a workpiece, a chuck table for holding the workpiece; a processing unit that processes the workpiece held by the chuck table; a controller; The processing unit includes a spindle, a processing part connected to the spindle and configured to process the workpiece, and a fluid path connected to a fluid supply source or a suction source; The processing section includes a first processing section having a first mount section to which a first processing tool is attached, a second processing section having a second mount section to which a second processing tool is attached, a moving unit that moves the second processing section relative to the first processing section, and a contacted section with which the second processing section comes into contact, the fluid path opens at the contacted portion, the moving unit is capable of positioning the second machining portion at a machining position where the second machining tool is disposed at a position closer to the chuck table than the first machining tool, and at a retracted position where the second machining tool is disposed at a position farther from the chuck table than the first machining tool, When the second processing portion is positioned at the processing position or the retracted position, the second processing portion comes into contact with the contacted portion to block the fluid path, The controller determines whether the second machining unit is positioned at the machining position or the retracted position based on the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path.

3. A processing device for processing a workpiece, a chuck table for holding the workpiece; a processing unit that processes the workpiece held by the chuck table; a controller; The processing unit includes a spindle, a processing section connected to the spindle for processing the workpiece, and a first fluid path and a second fluid path connected to a fluid supply source or a suction source; The processing section includes a first processing section having a first mount section to which a first processing tool is attached, a second processing section having a second mount section to which a second processing tool is attached, a moving unit that moves the second processing section relative to the first processing section, and a first contacted section and a second contacted section that come into contact with the second processing section, the first fluid path opens at the first contacted portion, the second fluid path opens at the second contacted portion, the moving unit is capable of positioning the second machining portion at a machining position where the second machining tool is disposed at a position closer to the chuck table than the first machining tool, and at a retracted position where the second machining tool is disposed at a position farther from the chuck table than the first machining tool, when positioned at the processing position, the second processing portion comes into contact with the first contacted portion to block the first fluid path, and when positioned at the retracted position, the second processing portion comes into contact with the second contacted portion to block the second fluid path; The controller determines whether the second processing unit is positioned at the processing position based on the flow rate of the fluid flowing through the first fluid path or the pressure of the first fluid path, and determines whether the second processing unit is positioned at the retracted position based on the flow rate of the fluid flowing through the second fluid path or the pressure of the second fluid path.

4. the processing unit further includes a third fluid path and a fourth fluid path connected to the fluid supply source or the suction source; the first mount portion includes a third contacted portion with which the first machining tool attached to the first mount portion comes into contact; the second mount portion includes a fourth contacted portion with which the second machining tool attached to the second mount portion comes into contact, the third fluid path opens at the third contacted portion, the fourth fluid path opens at the fourth contacted portion, The processing device described in claim 3, wherein the controller determines the contact state between the third contacted portion and the first processing tool based on the flow rate of fluid flowing through the third fluid path or the pressure of the third fluid path, and determines the contact state between the fourth contacted portion and the second processing tool based on the flow rate of fluid flowing through the fourth fluid path or the pressure of the fourth fluid path.

5. Further provided is a measuring device for measuring the flow rate of the fluid flowing through the fluid path or the pressure of the fluid path, The processing apparatus according to claim 1 or 2, wherein the controller makes the determination based on a measurement value measured by the measuring device.

6. a measuring device for measuring a flow rate of a fluid flowing through the first fluid path or a pressure of the first fluid path, and a flow rate of a fluid flowing through the second fluid path or a pressure of the second fluid path; The processing device according to claim 3 , wherein the controller makes the determination based on a measurement value measured by the measuring device.

7. The fluid supply system further includes a first measuring device that measures the flow rate of a fluid flowing through the first fluid path or the pressure of the first fluid path, and a second measuring device that measures the flow rate of a fluid flowing through the second fluid path or the pressure of the second fluid path, The processing apparatus according to claim 3 , wherein the controller makes the determination based on measurements taken by the first measuring device and the second measuring device.

8. The processing apparatus according to claim 1 or 2, further comprising a pressure adjusting unit that adjusts the pressure of the fluid path.

9. The processing apparatus according to claim 3 , further comprising a pressure adjusting unit that adjusts the pressure of the first fluid path and the second fluid path.

10. The processing device according to claim 1 , wherein the processing tool is a processing wheel having an annular base and a grinding wheel fixed to the base.

11. 4. The processing device according to claim 2, wherein the first processing tool and the second processing tool are processing wheels each including an annular base and a grinding wheel fixed to the base.

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