Metal sheet measuring apparatus, measuring method, and metal sheet manufacturing method

Abstract

To provide a measuring apparatus, for a metal sheet, by which the surface shape of the metal sheet can be measured continuously over a wide range.SOLUTION: A metal sheet measuring apparatus includes a conveyance mechanism that conveys a metal sheet in a longitudinal direction D2, a sensor that measures a surface shape of a first surface of the metal sheet, a stage with which a second surface positioned opposite to the first surface of the metal sheet makes contact during measurement by the sensor, and a controller that repeatedly executes a first step, a second step, and a third step. In the first step, the metal sheet is conveyed by the conveyance mechanism in a state where the metal sheet is not in contact with the stage. In the second step, the conveyance of the metal sheet is stopped, and the second surface of the metal sheet whose conveyance is stopped is brought into contact with the stage. In the third step, the surface shape of the first surface of the metal sheet is measured by the sensor in a state where the second surface of the metal sheet is in contact with the stage. The stage has a hole or a groove on the surface with which the metal sheet comes into contact.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a metal plate measuring device, a measuring method, and a metal plate manufacturing method. [Background technology]

[0002] In recent years, display devices used in portable devices such as smartphones and tablet PCs are required to have high definition, for example, a pixel density of 500 ppi or more. There is also a growing demand for portable devices to support ultra-high definition (UHD), and in this case, it is preferable that the pixel density of the display device be, for example, 800 ppi or more.

[0003] Among display devices, organic electroluminescence (EL) display devices have attracted attention due to their excellent response, low power consumption, and high contrast. A known method for forming pixels in an organic EL display device is to use a metal mask with through-holes arranged in a desired pattern to form pixels in the desired pattern. Specifically, the metal mask is first attached to a substrate for the organic EL display device, and then the attached metal mask and the substrate are placed together in a deposition device to perform a deposition process in which an organic material is deposited on the substrate. This allows pixels containing the organic material to be formed on the substrate in a pattern corresponding to the pattern of the through-holes in the metal mask.

[0004] A known method for manufacturing a metal mask is to form through-holes in a metal plate by etching using photolithography. For example, first, a first resist pattern is formed on a first surface of the metal plate by exposure and development, and a second resist pattern is formed on a second surface of the metal plate by exposure and development. Next, areas of the first surface of the metal plate that are not covered by the first resist pattern are etched to form first recesses in the first surface of the metal plate. Thereafter, areas of the second surface of the metal plate that are not covered by the second resist pattern are etched to form second recesses in the second surface of the metal plate. At this time, etching is performed so that the first recesses and the second recesses communicate with each other, thereby forming through-holes that penetrate the metal plate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-148743 Summary of the Invention [Problem to be solved by the invention]

[0006] Metal plates for producing metal masks are produced, for example, by rolling a base material made of an iron alloy containing nickel. The thinner the metal plate is rolled, the more accurate the dimensional and positional accuracy of the pixels in the resulting metal mask. However, rolling also causes some degree of wavy shapes to appear in the metal plate. The appearance of such wavy shapes can reduce the dimensional and positional accuracy of the through holes formed in the metal plate.

[0007] Therefore, evaluation of the waviness of a metal sheet is important from the viewpoint of quality assurance of the metal sheet. The metal sheet obtained by rolling is very long. Therefore, from the viewpoint of quality assurance of the entire metal sheet, it is preferable to evaluate the waviness of the metal sheet over a wider range.

[0008] However, conventional measurement devices for the waviness of metal sheets measure samples cut out from the metal sheet one by one, making it difficult to evaluate the waviness of the metal sheet over a wide range.

[0009] Furthermore, when etching a metal sheet roll using photolithography technology, cutting a measurement sample from the middle of the metal sheet roll would cause the roll itself to be divided, significantly affecting the etching process. Therefore, in this case, the measurement sample is cut from the front end of the metal sheet roll. Therefore, with conventional sheet-feed measuring devices, it has been difficult to evaluate the waviness profile over a wide area, including the middle part of the metal sheet roll.

[0010] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a metal plate measuring device, a measuring method, and a metal plate manufacturing method that can continuously measure the surface shape of a metal plate over a wider range. [Means for solving the problem]

[0011] A metal plate measuring device according to an embodiment of the present disclosure includes: a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; The stage has a hole or a groove on the surface that comes into contact with the metal plate.

[0012] A method for measuring a metal plate according to an embodiment of the present disclosure includes: a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; The stage has a hole or a groove on the surface that comes into contact with the metal plate.

[0013] A method for manufacturing a metal plate used to manufacture a metal mask according to an embodiment of the present disclosure includes the steps of: a rolling step of rolling a base material to obtain the metal plate; an inspection step of inspecting the rolled metal plate, In the inspection step, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; The stage has a hole or a groove on the surface that comes into contact with the metal plate.

[0014] A method for manufacturing a metal mask having a plurality of through holes formed therein according to an embodiment of the present disclosure includes the steps of: providing a metal plate; a resist pattern forming step of forming a resist pattern on the metal plate; an etching step of etching an area of ​​the metal plate that is not covered by the resist pattern to form a recess in the metal plate that will define the through hole; In the step of preparing the metal plate, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; The stage has a hole or a groove on the surface that comes into contact with the metal plate. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a metal plate measuring device, a measuring method, and a metal plate manufacturing method that are capable of continuously measuring the surface shape of a metal plate over a wider range. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a perspective view illustrating an example of a metal plate measuring device according to the present disclosure. [Figure 2A] FIG. 2 is a plan view showing a movement mode of a sensor when the stage is viewed in plan; [Figure 2B] FIG. 2 is a plan view showing a movement mode of a sensor when the stage is viewed in plan; [Figure 2C] FIG. 2 is a plan view showing a movement mode of a sensor when the stage is viewed in plan; [Figure 2D] FIG. 10 is a plan view showing an embodiment in which the surface of a metal plate is measured by a sensor while the metal plate is intermittently moved. [Figure 3A] FIG. 2 is a perspective view showing one aspect of a stage. [Figure 3B] FIG. 2 is a perspective view showing one aspect of a stage. [Figure 3C] FIG. 2 is a perspective view showing one aspect of a stage. [Figure 4A] FIG. 2 is a schematic cross-sectional view showing one embodiment of the first to third steps. [Figure 4B] FIG. 10 is a schematic cross-sectional view showing one embodiment of a second step using a tension adjusting mechanism. [Figure 4C] FIG. 10 is a schematic cross-sectional view showing one embodiment of a second step using a tension adjusting mechanism. [Figure 4D] FIG. 10 is a schematic cross-sectional view showing one embodiment of a second step using a tension adjusting mechanism. [Figure 4E] FIG. 10 is a schematic cross-sectional view showing an embodiment of a second step using a lifting mechanism. [Figure 4F] FIG. 10 is a schematic cross-sectional view showing an embodiment of a second step using a lifting mechanism. [Figure 5] 1 shows a flowchart illustrating one embodiment of a method for measuring a metal plate. [Figure 6A] FIG. 2 is a schematic cross-sectional view showing one embodiment of a rolling step. [Figure 6B] FIG. 2 is a schematic cross-sectional view showing one embodiment of an annealing step. [Figure 7A] 1A to 1C are schematic diagrams illustrating an example of a method for manufacturing a metal mask. [Figure 7B] 1A to 1C are diagrams illustrating an example of a process for forming a resist film on a metal plate. [Figure 7C] 1A to 1C are diagrams illustrating an example of a process for patterning a resist film. [Figure 7D] FIG. 10 is a diagram illustrating an example of a first surface etching step. [Figure 7E] 10A to 10C are diagrams illustrating an example of a second surface etching step. [Figure 8] 1 is a diagram illustrating a metal mask device according to an embodiment of the present disclosure. FIG. [Figure 9] FIG. 1 is a cross-sectional view illustrating a vapor deposition apparatus according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that in the drawings attached to this specification, the scale and aspect ratios may be appropriately changed and exaggerated from those of the actual objects for the sake of convenience in illustration and understanding.

[0018] In this specification and / or drawings, unless otherwise specified, the following interpretations shall be made.

[0019] Terms that refer to a material that is the basis of a certain structure do not necessarily need to be distinguished by differences in name alone. For example, terms such as "substrate," "base material," "plate," "sheet," or "film" fall under the above description.

[0020] Terms and / or numerical values ​​that represent shapes and / or geometric conditions do not need to be bound by strict meanings and may be interpreted as including a range within which similar functions may be expected. For example, "parallel" and / or "orthogonal" fall under the above terms. Also, "length value" and / or "angle value" fall under the above numerical values.

[0021] When a certain configuration is expressed as being "above," "below," "upper," "lower," "above," or "below" another configuration, this may include a configuration in which the certain configuration is in direct contact with the other configuration, and a configuration in which another configuration is included between the certain configuration and the other configuration. In other words, a configuration in which another configuration is included between the certain configuration and the other configuration may be expressed as a configuration indirectly in contact with the other configuration. Furthermore, the expressions "above," "upper side," or "above" are interchangeable with the expressions "below," "lower side," or "below." In other words, the up-down direction may be reversed.

[0022] When the same or similar symbols are used for the same parts and / or parts having similar functions, repeated descriptions may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios. Also, some of the configurations of the embodiments may be omitted from the drawings.

[0023] One or more embodiments may be combined with one or more modified embodiments as long as no contradictions arise. Also, one or more embodiments may be combined with each other as long as no contradictions arise. Also, one or more modified embodiments may be combined with each other as long as no contradictions arise.

[0024] When a plurality of steps are disclosed for a method such as a manufacturing method, other steps that are not disclosed may be performed between the disclosed steps. Furthermore, the order of the steps is not limited to the extent that no contradiction occurs.

[0025] Numerical ranges expressed with the symbols "to" and / or "-" include the numerical values ​​before and after the symbols "to" and / or "-". For example, a numerical range expressed as "34 to 38% by mass" is the same as a numerical range expressed as "34% by mass or more and 38% by mass or less".

[0026] For the numerical values ​​described in this disclosure, a numerical range may be defined by combining any one of a plurality of upper limit candidate values ​​with any one of a plurality of lower limit candidate values. In addition, even if not specifically mentioned, a numerical range may be defined by combining any two of a plurality of upper limit candidate values, or a numerical range may be defined by combining any two of a plurality of lower limit candidate values.

[0027] An embodiment of the present disclosure will be described in the following paragraphs. The embodiment of the present disclosure is an example of an embodiment of the present disclosure. The present disclosure is not construed as being limited to only the embodiment of the present disclosure.

[0028] A first aspect of the present disclosure is a measuring device for a metal plate, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; It is a measuring device.

[0029] A second aspect of the present disclosure is a measuring device according to the first aspect, further comprising a tension adjustment mechanism for adjusting the tension of the metal plate in the longitudinal direction D2, The control unit In the first step, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate does not contact the stage, and the metal plate is transported by the transport mechanism; In the third step, the transportation of the metal plate is stopped, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate contacts the stage, and the sensor is controlled to measure the surface shape of the first surface of the metal plate.

[0030] A third aspect of the present disclosure is the measuring apparatus of the first or second aspect described above, further comprising an elevation mechanism for raising and lowering the transport mechanism relative to the stage, The control unit In the first step, the lifting mechanism adjusts a distance between the metal plate and the stage so that the metal plate and the stage do not come into contact with each other, and the conveying mechanism conveys the metal plate; In the third step, the transportation of the metal plate is stopped, the lifting mechanism adjusts the distance between the metal plate and the stage so that the metal plate and the stage come into contact, and the sensor is controlled to measure the surface shape of the first side of the metal plate.

[0031] A fourth aspect of the present disclosure is a measurement device according to any one of the first to third aspects described above, a tension adjusting mechanism that adjusts the tension of the metal plate in the longitudinal direction D2, and / or a lifting mechanism that moves the transport mechanism up and down relative to the stage, The control unit In the first step, the tension of the metal plate and / or the gap between the metal plate and the stage is adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate does not contact the stage, and the metal plate is transported by the transport mechanism; In the third step, the transportation of the metal plate is stopped, and the tension of the metal plate and / or the distance between the metal plate and the stage is adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate contacts the stage, and control is performed so that the sensor measures the surface shape of the first side of the metal plate.

[0032] A fifth aspect of the present disclosure is the measuring device according to any one of the first to fourth aspects, wherein the metal plate has a thickness of 5 to 100 μm.

[0033] A sixth aspect of the present disclosure is a measuring device according to any one of the first to fifth aspects described above, wherein the contactable area is 80% to 99%.

[0034] A seventh aspect of the present disclosure is the measuring device of any one of the first to sixth aspects described above, wherein the transport mechanism has a first roll that feeds out the metal plate and a second roll that winds up the metal plate.

[0035] An eighth aspect of the present disclosure is A method for measuring a metal plate, comprising: a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; This is a measurement method.

[0036] A ninth aspect of the present disclosure is A method for manufacturing a metal plate used to manufacture a metal mask, comprising: a rolling step of rolling a base material to obtain the metal plate; an inspection step of inspecting the rolled metal plate, In the inspection step, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; A method for manufacturing a metal plate.

[0037] A tenth aspect of the present disclosure is A method for manufacturing a metal mask having a plurality of through holes formed therein, comprising: providing a metal plate; a resist pattern forming step of forming a resist pattern on the metal plate; an etching step of etching an area of ​​the metal plate that is not covered by the resist pattern to form a recess in the metal plate that will define the through hole; In the step of preparing the metal plate, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring the surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism without contacting the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; This is a method for manufacturing a metal mask.

[0038] 1 is a perspective view illustrating an example of a metal plate measuring device according to the present disclosure. The metal plate measuring device 100 according to the present disclosure includes a conveying mechanism 110 that conveys a metal plate 200 in a longitudinal direction D2, a sensor 120 that measures the surface shape of a first surface 210 of the metal plate 200, a stage 130 that comes into contact with a second surface 220 of the metal plate 200 that is positioned opposite the first surface 210 during measurement by the sensor 120, and a control unit 140.

[0039] The control unit 140 controls the transport mechanism 110, the sensor 120, and other components such as the tension adjusting mechanism 150 and the lifting mechanism 160 (described later), thereby repeatedly executing the first step S1, the second step S2, and the third step S3.

[0040] The details of the steps will be described later, but in a first step S1, the metal plate 200 is transported by the transport mechanism 110 without the metal plate 200 contacting the stage 130, in a second step S2, the transport of the metal plate 200 is stopped and the second surface 220 of the metal plate 200 whose transport has been stopped is brought into contact with the stage 130, and in a third step S3, the sensor 120 measures the surface shape of the first surface 210 of the metal plate 200 with the second surface 220 of the metal plate 200 in contact with the stage 130. This makes it possible to continuously measure the surface shape of the metal plate over a wider range.

[0041] The conveying mechanism 110 conveys the metal plate 200 in the longitudinal direction D2. The conveying mechanism 110 may have, for example, a first roll 111 that feeds out the metal plate 200 and a second roll 112 that takes up the metal plate 200. In response to an instruction from the control unit 140, the conveying mechanism 110 can convey the metal plate 200 in the longitudinal direction D2 or stop the conveyance of the metal plate 200 by feeding out the metal plate 200 from the first roll 111 and taking up the metal plate 200 from the second roll 112.

[0042] The transport mechanism 110 may have a first auxiliary roll 151 and a second auxiliary roll 152 between the first roll 111 and the second roll 112. The first auxiliary roll 151 and the second auxiliary roll 152 may support the metal sheet 200 between the first roll 111 and the second roll 112, or may assist in transporting the metal sheet 200 by sending it out or winding it up. Furthermore, the transport mechanism 110 is not limited to the rolls shown in FIG. 1 and may have other rolls that contribute to transport.

[0043] The sensor 120 measures the surface shape of the first surface 210 of the metal plate 200. The surface condition measured by the sensor 120 may include information about the height of the surface of the first surface 210 of the metal plate 200. The information about the height is also called a height profile. This height profile may be data that represents the surface shape of the first surface 210 of the metal plate 200 in three dimensions, and may include, for example, information about each position on a plane of the width direction D1 and the length direction D2 of the metal plate 200 and information about the height of the surface of the metal plate 200 in the height direction D3 corresponding to each position, in association with each other.

[0044] The height profile acquired by the sensor 120 in this way can represent the waviness shape on the surface of the first face 210. Furthermore, based on such a height profile, it is also possible to calculate the steepness or differential elongation rate in the width direction D1, the longitudinal direction D2, or any other direction.

[0045] The sensor 120 is not particularly limited as long as it can measure the surface shape of the first surface 210 of the metal plate 200, and examples thereof include an optical displacement meter and a pressure-type displacement meter. By measuring the distance between the sensor 120 and the first surface 210, the height profile can be measured.

[0046] As the optical system displacement meter, conventionally known ones can be used, but examples include a triangular distance method in which light with different focal positions for each wavelength is irradiated onto an object and the height of the object is measured based on the imaging position of the reflected light of the light irradiated onto the object, and a white coaxial confocal method in which the height of the object is measured by detecting the wavelength position of the maximum light intensity from the received light spectrum.

[0047] At least one of the sensor 120 and the stage 130 may be configured to be movable relative to each other. In the device configuration shown in FIG. 1, the stage 130 is stationary, and the sensor 120 is configured to be movable relative to the stage 130. Specifically, the sensor 120 may be configured to be movable in the width direction D1 by a first moving mechanism 121. The first moving mechanism 121 may also be configured to be movable in the longitudinal direction D2 by a second moving mechanism 122. This allows the sensor 120 to move in a plane defined by the width direction D1 and the longitudinal direction D2. In this case, the first moving mechanism 121 and the second moving mechanism 122 may each have a mechanism for acquiring coordinates in the width direction D1 and the longitudinal direction D2. This allows the sensor 120 to measure information related to height and record the height value in association with the coordinates on the plane defined by the width direction D1 and the longitudinal direction D2. The mechanism for acquiring the coordinates is not particularly limited, but examples thereof include an encoder and a laser interferometer. In addition, the first moving mechanism 121 may be configured to move the sensor 120 in the height direction D3. This allows the sensor 120 to move in the height direction D3 in addition to the planar direction. Alternatively, the sensor 120 may be fixed and the stage 130 may be configured to be movable.

[0048] Furthermore, by moving the stage 130 in the width direction D1 and the longitudinal direction D2, the sensor 120 and the metal plate 200 may be moved relatively in the width direction D1 and the longitudinal direction D2, while measuring information relating to the surface height of the first surface 210 of the metal plate 200. In this case, the measuring device 100 may have a mechanism for driving and controlling the stage 130 while acquiring coordinates in the width direction D1 and the longitudinal direction D2. This allows the coordinates in the D1 and D2 directions of the position where the height measurement is performed by the sensor 120 to be recorded. Here, the mechanism for acquiring the coordinates is not particularly limited, but examples thereof include an encoder and a laser interferometer.

[0049] 2A to 2C show examples of movement modes of the sensor 120 when the stage 130 is viewed from above. In FIGS. 2A to 2C, the arrow indicates the direction in which the sensor 120 scans while measuring the surface shape of the first surface 210. FIGS. 2A to 2C do not show the path along which the sensor 120 moves when not measuring. FIGS. 2A and 2B show modes in which the sensor 120 scans in one direction, in the width direction D1 or the longitudinal direction D2, while measuring the surface shape of the first surface 210. FIG. 2C also shows a mode in which the sensor 120 moves by repeatedly scanning in both directions in the width direction D1. The movement mode of the sensor 120 is not limited to the above.

[0050] As described above, while the sensor 120 and the stage 130 are moved relatively, planar coordinates in the width direction D1 and the longitudinal direction D2 and information about the height of the metal plate 200 at each coordinate position can be measured and recorded in association with each other. As illustrated in Figures 2A to 2C, measurements are repeated at regular intervals in a predetermined area of ​​the metal plate 200 on the stage 130, and the metal plate 200 is moved intermittently to repeat measurements in the length direction of the metal plate 200 as shown in Figure 5, which will be described later, so that a three-dimensional profile, which is the surface shape, can be obtained over most of the roll of the metal plate 200.

[0051] A schematic diagram of this is shown in Figure 2D. Figure 2D shows an embodiment in which the sensor 120 is moved to measure the surface shape of the first surface 210 for each measurement region R, and the metal plate 200 is intermittently moved by a distance L to sequentially move the measurement target region R, thereby measuring a three-dimensional profile, which is the surface shape, over most of the roll of the metal plate 200. The arrows shown in region R indicate that the sensor 120 is scanned in the longitudinal direction D2 as shown in Figure 2A to measure the three-dimensional profile for each measurement region R.

[0052] The stage 130 is a portion that is in contact with the second surface 220 of the metal plate 200, which is positioned opposite the first surface 210, during measurement by the sensor 120. The metal plate 200 is a metal plate with a thickness of, for example, about 20 μm. From the viewpoint of accurately measuring the surface shape of such a metal plate 200, in the present disclosure, the second surface 220 of the metal plate 200 whose transportation has stopped is brought into contact with the stage 130 (second step S2), and in a state in which the second surface 220 of the metal plate 200 is in contact with the stage 130, the surface shape of the first surface 210 of the metal plate 200 is measured by the sensor 120 (third step S3).

[0053] As an example, the metal plate 200 is large, thin, and light, with a width of approximately 500 mm and a thickness of approximately 20 μm. Therefore, when the second surface 220 of the metal plate 200 is brought into contact with the stage 130 after the transport of the metal plate 200 has stopped, the weight of the metal plate 200 may make it difficult to displace the air between the stage 130 and the metal plate 200. Air between the stage 130 and the metal plate 200 can result in inaccurate measurement of the surface shape of the first surface 210. Therefore, it is necessary to wait for the air to escape before measuring the surface shape of the first surface 210. However, a short waiting time is preferable in terms of improving measurement speed and measuring the metal plate 200 over a wider area.

[0054] Therefore, the stage 130 may have holes or grooves on the surface that comes into contact with the metal plate 200. The holes or grooves can function as passages for air to escape between the stage 130 and the metal plate 200. This can further improve the measurement speed. Furthermore, by having holes or grooves, vibrations of the metal plate 200 when the stage 130 and the metal plate 200 come into contact with each other can be more easily suppressed, which tends to further improve the measurement accuracy.

[0055] The shape of the holes is not particularly limited and may be, for example, circular or polygonal. The cross-sectional shape of the holes or grooves is also not particularly limited and may have a substantially uniform width in cross section, or may be V-shaped and widen toward the surface that contacts the metal plate, or may narrow toward the surface that contacts the metal plate. The holes or grooves may or may not penetrate the stage.

[0056] The contactable area of ​​the stage 130 is preferably 80% to 99%, or may be 85% to 99%, or 90% to 98%. When the contactable area is within the above range, vibration of the metal plate 200 when the stage 130 and the metal plate 200 come into contact with each other is easily suppressed, which tends to further improve the measurement accuracy and also the measurement speed.

[0057] Here, the "contactable area" refers to the ratio of the area of ​​the stage 130 that can come into contact with the metal plate 200, excluding holes and grooves, to the entire surface of the stage 130 when viewed from above. 2 In stage 130, a total of 500cm 2 If holes or grooves are formed, the contactable area will be 80% ((2500-500) / 2500×100).

[0058] From the viewpoint of measurement accuracy, the stage 130 should have a high degree of flatness, and examples of materials include glass, resin, and ceramic. However, a stone surface plate is preferable because it changes shape little over time and is scratch-resistant, and it is more preferable to use a flatness that meets JIS B 7513 class 0 or 00. Here, class 0 refers to a surface having a flatness tolerance of 5 μm or less over the entire surface when the working surface dimensions are 630 mm x 630 mm, and class 00 refers to a surface having a flatness tolerance of 2.5 μm or less over the entire surface when the working surface dimensions are 630 mm x 630 mm.

[0059] 3A to 3C show perspective views of the stage 130. FIG. 3A shows a perspective view of a stage having grooves in the width direction D1 and the longitudinal direction D2. FIG. 3B shows a perspective view of a stage having grooves in the longitudinal direction D2. Alternatively, a stage having grooves in the width direction D1 may be used. Furthermore, FIG. 3C shows a perspective view of a stage having holes arranged in the width direction D1 and the longitudinal direction D2. Configuration examples of the holes and grooves are not limited to those described above, and holes and grooves may be used in combination.

[0060] The groove width or hole diameter may preferably be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, 0.5 mm or more, or 0.6 mm or more. The groove width or hole diameter may preferably be 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 2 mm or less. The groove width or hole diameter may be determined by combining any one of the above-mentioned multiple lower limit candidate values ​​with any one of the above-mentioned multiple upper limit candidate values. For example, the groove width or hole diameter may preferably be 0.1 to 30 mm or less, 0.2 to 20 mm or less, 0.3 to 10 mm or less, 0.4 to 5 mm or less, or 0.5 to 3 mm or less.

[0061] The groove width or hole diameter is preferably shorter than the measurement pitch described below. The ratio of the groove width or hole diameter to the measurement pitch may preferably be 0.1 or more, 0.2 or more, 0.3 or more, or 0.4 or more. The ratio of the groove width or hole diameter to the measurement pitch may preferably be less than 1.0, 0.9 or less, 0.8 or less, or 0.7 or less. The ratio of the groove width or hole diameter to the measurement pitch may be determined by combining any one of the multiple lower limit candidate values ​​described above with any one of the multiple upper limit candidate values ​​described above. For example, the ratio of the groove width or hole diameter to the measurement pitch may be 0.1 to 0.9, 0.2 to 0.8, or 0.3 to 0.7.

[0062] The depth of the groove or hole may preferably be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, 0.5 mm or more, or 0.6 mm or more. The width of the groove or the diameter of the hole may preferably be 30 mm or less, 20 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 2 mm or less. The depth of the groove or hole may be determined by combining any one of the above-mentioned multiple lower limit candidate values ​​with any one of the above-mentioned multiple upper limit candidate values. For example, the depth of the groove or hole may preferably be 0.1 to 30 mm or less, 0.2 to 20 mm or less, 0.3 to 10 mm or less, 0.4 to 5 mm or less, or 0.5 to 3 mm or less.

[0063] The groove pitch or the distance between adjacent holes may preferably be 1 mm or more, 5 mm or more, 10 mm or more, 20 mm or more, 30 mm or more, or 40 mm or more. The groove pitch or the distance between adjacent holes may preferably be 200 mm or less, 175 mm or less, 150 mm or less, 125 mm or less, 100 mm or less, or 75 mm or less. The groove pitch or the distance between adjacent holes may be determined by combining any one of the above-mentioned multiple lower limit candidate values ​​with any one of the above-mentioned multiple upper limit candidate values. For example, the groove pitch or the distance between adjacent holes may preferably be 1 to 200 mm or less, 5 to 150 mm or less, or 10 to 100 mm or less.

[0064] The control unit 140 repeatedly executes the first step S1, the second step S2, and the third step S3. Fig. 4A shows one example of the flow of the first step S1, the second step S2, and the third step S3. Fig. 4A is a schematic cross-sectional view taken along a plane of the longitudinal direction D2 and the height direction D3.

[0065] 4A, in a first step S1, the control unit 140 controls the driving of the conveying mechanism 110 so as to convey the metal plate 200 without the metal plate 200 coming into contact with the stage 130. Specifically, the control unit 140 rotates a first roll 111 that feeds out the metal plate 200 and a second roll 112 that winds up the metal plate 200 in a feed direction F1. As a result, the metal plate 200 is conveyed in a longitudinal direction D2.

[0066] 4A, the control unit 140 may rotate a first auxiliary roll 151 and a second auxiliary roll 152, which assist in the transport of the metal plate 200, in the feed direction F1. In the example shown in FIG. 4A, the first auxiliary roll 151 and the second auxiliary roll 152 are rolls that constitute the transport mechanism 110, and also rolls that constitute the tension adjustment mechanism 150, which will be described later.

[0067] In the first step S1, the control unit 140 may control the rotation speeds of the first roll 111 and the second roll 112 to adjust the tension applied to the metal plate 200 between the first roll 111 and the second roll 112, thereby controlling the metal plate 200 to avoid bending and contacting the stage 130.

[0068] In the second step S2, the control unit 140 stops the transport of the metal plate 200 by the transport mechanism 110, and causes the second surface 220 of the metal plate 200, whose transport has been stopped, to contact the stage 130. Specifically, after stopping the transport of the metal plate 200, the control unit 140 may cause the tension adjustment mechanism 150, which will be described later, to reduce the tension of the metal plate 200, thereby bending the metal plate 200, and the bent metal plate 200 may contact the stage 130.

[0069] Alternatively or additionally, the metal plate 200 and the stage 130 may be moved relatively up and down in the height direction D3 by the lifting mechanism 160 so that the bent metal plate 200 comes into contact with the stage 130.

[0070] In a third step S3, the sensor 120 measures the surface shape of the first surface 210 of the metal plate 200 while the second surface 220 of the metal plate 200 is in contact with the stage 130. Specifically, the control unit 140 may drive and control the first movement mechanism 121 and the second movement mechanism 122 to move the sensor 120 to any position within the plane in the longitudinal direction D2 and the width direction D1. As the sensor 120 moves, it may measure the height of the metal plate 200 at each location within the plane in the longitudinal direction D2 and the width direction D1 to obtain a height profile.

[0071] Next, we will describe the hardware configuration of the control unit 140. The control unit 140 may be configured as a microcontroller (MCU), or may be configured as a general-purpose computer further equipped with an input device such as a keyboard and an output device such as a display. When the control unit 140 is a microcontroller, an information input / output device may further be connected to the input / output interface of the microcontroller.

[0072] In particular, the control unit 140 may be electrically connected to the transport mechanism 110, the sensor 120, the first movement mechanism 121, the second movement mechanism 122, the tension adjustment mechanism 150, and the lifting mechanism 160. For clarity, FIG. 1 omits connections between the control unit 140 and the rolls constituting the transport mechanism 110, the first movement mechanism 121, and the second movement mechanism 122. However, because the control unit 140 controls the measuring device 100, all electrically controlled components of the measuring device 100 may be connected to the control unit 140 by wire or wirelessly, even if not specifically shown. For example, although the connection between the sensor 120 and the control unit 140 is not shown in the example of FIG. 1 , it can be understood that the sensor 120 and the control unit 140 are connected via the first movement mechanism 121 and the second movement mechanism 122.

[0073] The measuring device 100 of the present disclosure may further include a tension adjustment mechanism 150. The tension adjustment mechanism 150 is not particularly limited as long as it adjusts the tension of the metal plate 200 in the longitudinal direction D2. In this case, in the first step S1, the control unit 140 may use the tension adjustment mechanism 150 to adjust the tension of the metal plate 200 so that the metal plate 200 does not contact the stage 130, and then transport the metal plate 200 using the transport mechanism 110. Alternatively, the control unit 140 may stop the transport of the metal plate 200, and use the tension adjustment mechanism 150 to adjust the tension of the metal plate 200 so that the metal plate 200 contacts the stage 130.

[0074] 4A to 4D show an embodiment of the tension adjustment mechanism 150 in which a first auxiliary roll 151 and a second auxiliary roll 152 are used. In the second step S2, the control unit 140 stops the transport of the metal plate 200 by the transport mechanism 110, and brings the second surface 220 of the metal plate 200, whose transport has been stopped, into contact with the stage 130.

[0075] 4A, after stopping the conveying mechanism 110, the control unit 140 rotates the first roll 111 and the first auxiliary roll 151 of the tension adjustment mechanism 150 slightly in the feed direction F1 and then stops them. At this time, the control unit 140 fixes the second auxiliary roll 152 so that it does not rotate. As a result, the metal plate 200 between the first auxiliary roll 151 and the second auxiliary roll 152 bends by the length fed by the first auxiliary roll 151. The second surface 220 of the bent metal plate 200 comes into contact with the stage 130.

[0076] 4B , after stopping the conveying mechanism 110, the control unit 140 rotates the first roll 111 and the first auxiliary roll 151 of the tension adjustment mechanism 150 slightly in the feed direction F1 and stops them. The control unit 140 also rotates the second roll 112 and the second auxiliary roll 152 of the tension adjustment mechanism 150 slightly in the return direction F2 and stops them. This causes the metal plate 200 between the first auxiliary roll 151 and the second auxiliary roll 152 to bend by the length fed by the first auxiliary roll 151 and the second auxiliary roll 152. The second surface 220 of the bent metal plate 200 comes into contact with the stage 130.

[0077] 4C , after stopping the conveying mechanism 110, the control unit 140 rotates the second roll 112 and the second auxiliary roll 152 of the tension adjustment mechanism 150 slightly in the return direction F2 and then stops them. At this time, the control unit 140 fixes the first auxiliary roll 151 so that it does not rotate. As a result, the metal plate 200 between the first auxiliary roll 151 and the second auxiliary roll 152 is bent by the length fed by the second auxiliary roll 152. The second surface 220 of the bent metal plate 200 comes into contact with the stage 130.

[0078] In the embodiment shown in FIG. 4D , the distance between the first auxiliary roll 151 and the second auxiliary roll 152 is shortened to deflect the metal plate 200 between the first auxiliary roll 151 and the second auxiliary roll 152. At this time, the first auxiliary roll 151 and the second auxiliary roll 152 may be moved closer to each other in the direction F3, or one of the first auxiliary roll 151 and the second auxiliary roll 152 may be moved closer to the other. Note that when the distance between the first auxiliary roll 151 and the second auxiliary roll 152 is shortened, the first roll and the first auxiliary roll 151 are separated from each other. Also, when the distance between the second auxiliary roll 152 and the first auxiliary roll 151 is shortened, the first roll and the first auxiliary roll 151 are separated from each other. Therefore, the first roll and the second roll may be fed out separately. As a result, the second surface 220 of the metal plate 200 deflected between the first auxiliary roll 151 and the second auxiliary roll 152 comes into contact with the stage 130.

[0079] In any of the embodiments of Figures 4A to 4D, when transporting the metal plate 200 again after the third step S3, the control unit 140 may use the tension adjustment mechanism 150 to readjust the tension of the metal plate 200 so that the metal plate 200 does not contact the stage 130, and then transport the metal plate 200 using the transport mechanism 110.

[0080] The metal plate measuring device 100 of the present disclosure may further include a lifting mechanism 160. The lifting mechanism 160 is not particularly limited as long as it lifts and lowers the transport mechanism 110 relative to the stage 130. Specific examples of such a lifting mechanism 160 include a mechanism that lifts and lowers the stage 130.

[0081] At this time, in the first step S1, the control unit 140 may use the lifting mechanism 160 to adjust the distance between the metal plate 200 and the transport mechanism 110 in the height direction D3 so that the metal plate 200 does not contact the stage 130, and transport the metal plate 200 using the transport mechanism 110. Alternatively, the control unit 140 may stop the transport of the metal plate 200, and use the lifting mechanism 160 to adjust the positions of the metal plate 200 and the transport mechanism 110 in the height direction D3 so that the metal plate 200 contacts the stage 130.

[0082] 4E shows an embodiment in which an elevator 161 of the stage 130 is used as one embodiment of the lifting mechanism 160. In the embodiment shown in FIG. 4E, in a first step S1, the control unit 140 controls the transfer mechanism 110 to transfer the metal plate 200 in a bent state. Then, in a second step S2, the control unit 140 stops the transfer of the metal plate 200 by the transfer mechanism 110 and moves the metal plate 200 and the transfer mechanism 110 upward in a height direction D3 in a direction F4 so that the metal plate 200 contacts the stage 130. As a result, the bent metal plate 200 and the stage 130 come into contact with each other.

[0083] 4F shows an example of the lifting mechanism 160 in which lifting rollers 162 are provided on the side of the stage 130. In the example shown in FIG. 4F, in a first step S1, the control unit 140 controls the transport mechanism 110 to transport the metal plate 200 with the lifting rollers 162 positioned vertically upward. Then, in a second step S2, the control unit 140 stops the transport of the metal plate 200 by the transport mechanism 110 and lowers the lifting rollers 162 vertically downward (F4'). As a result, the metal plate 200 bends by the amount that the lifting rollers 162 are lowered, and comes into contact with the stage 130.

[0084] Furthermore, the tension adjustment mechanism 150 and the lifting mechanism 160 may be used in combination, and for example, the measuring device 100 of the present disclosure may have at least one of the tension adjustment mechanism 150 and the lifting mechanism 160. In this case, the control unit 140 may perform control such that, in a first step S1, the tension adjustment mechanism 150 and / or the lifting mechanism 160 adjusts the tension of the metal plate 200 and / or the gap between the metal plate 200 and the stage 130 so that the metal plate 200 does not contact the stage 130, and the conveying mechanism 110 conveys the metal plate 200; and, in a third step S3, the conveying of the metal plate 200 is stopped, and the tension adjustment mechanism 150 and / or the lifting mechanism 160 adjusts the tension of the metal plate 200 and / or the gap between the metal plate 200 and the stage 130 so that the metal plate 200 contacts the stage 130, and the sensor 120 measures the surface shape of the first surface 210 of the metal plate 200.

[0085] Next, a method for measuring a metal plate will be described. The method for measuring a metal plate of the present disclosure uses the above-described measuring device to repeatedly perform the first step S1, the second step S2, and the third step S3. This allows the surface shape of the metal plate to be continuously measured over a wider range. Furthermore, since there is no need to measure measurement samples cut from the metal plate one by one as in the conventional method, the influence of distortion of the metal plate due to cutting can also be eliminated.

[0086] Hereinafter, the operation of repeatedly conveying and stopping the metal plate 200 will also be referred to as intermittent operation.

[0087] A flowchart showing one embodiment of the metal plate measurement method is shown in Fig. 5. As shown in Fig. 5, in the metal plate measurement method of the present disclosure, in a first step S1, the metal plate 200 is transported by the transport mechanism 110 without contacting the metal plate 200 with the stage 130.

[0088] At this time, the transport mechanism 110 may perform an intermittent operation to transport the metal plate 200 in the longitudinal direction D2 by a distance equal to or less than the length of one stage 130. This makes it possible to measure the surface shape of a continuous range in the longitudinal direction D2.

[0089] Furthermore, the transport mechanism 110 may perform an intermittent operation to transport the metal plate 200 in the longitudinal direction D2 a distance greater than the length of one stage 130. This makes it possible to measure the surface shape of a discontinuous range in the longitudinal direction D2. For example, by performing an intermittent operation in which transport and stopping are repeated every 5 m, the surface shape of the long metal plate 200 can be measured every 5 m.

[0090] In the metal plate measurement method of the present disclosure, in the second step S2, the transport of the metal plate 200 is stopped, and the second surface 220 of the metal plate 200 whose transport has been stopped is brought into contact with the stage 130.

[0091] At this time, the second surface 220 of the metal plate 200 is brought into contact with the stage 130 using the tension adjustment mechanism 150 and the lifting mechanism 160 as described above (see FIGS. 4A to 4E). In the present disclosure, it is preferable to measure the surface shape of the metal plate 200 in a state where no tension is applied to the metal plate 200. This makes it possible to eliminate the influence of the tension of the conveying mechanism 110 on the measurement of the surface shape. Therefore, in the second step S2, it is preferable to bring the second surface 220 of the metal plate 200 in a bent state into contact with the stage 130.

[0092] In a third step S3, the sensor 120 measures the surface shape of the first surface 210 of the metal plate 200 while the second surface 220 of the metal plate 200 is in contact with the stage 130. The measurement pitch in the longitudinal direction D2 and width direction D1 is not particularly limited and can be determined appropriately depending on the desired measurement accuracy, and may be, for example, 1 to 50 mm, 1 to 40 mm, 1 to 30 mm, or 1 to 20 mm.

[0093] In the fourth step S4, the control unit 140 checks whether the preset range has been measured, and if the measurement of the preset range has been completed, the control unit 140 ends the measurement operation, and if not, the control unit 140 may further repeat the first step S1 to the third step S3.

[0094] Next, a method for manufacturing a metal plate used to manufacture a metal mask will be described. The method for manufacturing a metal plate of the present disclosure includes a rolling step in which a base material is rolled to obtain a metal plate, and an inspection step in which the metal plate obtained by rolling is inspected. In the inspection step, a first step S1, a second step S2, and a third step S3 are repeatedly performed using the above-mentioned measuring device.

[0095] Furthermore, after the rolling step and before the inspection step, the metal plate manufacturing method of the present disclosure may further include a slitting step for cutting off the widthwise edges of the metal plate obtained by rolling, and an annealing step for annealing the metal plate obtained by rolling.

[0096] 6A is a schematic cross-sectional view showing one embodiment of the rolling process. In the rolling process, a base material 55 is rolled to obtain a metal plate having a desired thickness. The base material 55 may be made of, for example, Invar material.

[0097] In the rolling process, the base material 55 is transported along the transport direction indicated by arrow F5 toward a rolling device 56 including a pair of rolls 56a, 56b. The base material 55 that arrives between the pair of rolls 56a, 56b is rolled by the pair of rolls 56a, 56b, resulting in a reduction in thickness of the base material 55 and an elongated metal plate 200 having a certain thickness. As shown in FIG. 6A, the metal plate 200 may be wound around a core 61 to form a wound body 62.

[0098] The thickness of the metal plate 200 may be, for example, 5 μm or more, 10 μm or more, 15 μm or more, 20 μm or more, or 25 μm or more. The thickness of the metal plate 200 may be, for example, 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, or 40 μm or less. The thickness of the metal plate 200 may be, for example, 5 to 100 μm, 10 to 80 μm, 15 to 60 μm, 20 to 50 μm, or 25 to 40 μm.

[0099] The weight of the metal plate 200 is preferably 0.005 g / cm 2 or more, 0.010 g / cm 2 or more, and 0.015 g / cm 2 or more, 0.020 g / cm 2 or more, 0.025 g / cm 2 or more, 0.030 g / cm 2 The weight of the metal plate 200 is preferably 0.070 g / cm 2 is less than or equal to 0.060 g / cm 2 less than or equal to 0.050 g / cm 2 It may be the following:

[0100] The thinner the thickness of the metal plate 200, the lighter the weight per unit area of ​​the metal plate 200. Therefore, when the stage 130 and the metal plate 200 come into contact with each other, air tends to be less likely to escape between them. Therefore, when the thickness of the metal plate 200 is within the above range, it is preferable that the stage 130 has holes or grooves on the surface that comes into contact with the metal plate.

[0101] 6A merely shows an outline of the rolling process, and the specific configuration and procedure for carrying out the rolling process are not particularly limited. For example, the rolling process may be a hot rolling process in which the base material is processed at a temperature equal to or higher than the recrystallization temperature of the Invar material constituting the base material 55, or a rolling process in which the base material is processed at a temperature equal to or higher than the recrystallization temperature of the Invar material. This may include a cold rolling step in which the base material is worked under pressure.

[0102] The slitting process is a process of cutting off the widthwise edges of the metal plate obtained by rolling. By cutting off both ends of the metal plate 200 in the width direction D1 in this slitting process, it is possible to remove cracks that may occur at both ends. This further suppresses breakage of the metal plate 200 due to cracks. The cut-off range is not particularly limited, but may be, for example, within a range of 3 to 5 mm.

[0103] FIG. 6B is a schematic cross-sectional view showing one embodiment of the annealing step. In the annealing step, the metal plate obtained by rolling is annealed. This can remove residual stress accumulated in the metal plate 200. In the annealing step, as shown in FIG. 6B, the metal plate 200 may be continuously annealed while being transported in the direction F5. Alternatively, batch annealing may be used. The treatment conditions for the annealing step can be set appropriately depending on the thickness of the metal plate 200, the rolling ratio, etc. For example, the treatment conditions for the annealing step may be 500°C and 60 seconds.

[0104] The rolling, slitting, and annealing steps may be repeated multiple times to obtain a metal plate 200 with a desired thickness.

[0105] In the inspection step, the metal plate obtained by rolling is inspected. The metal plate 200 inspected in the inspection step may be one that has undergone the rolling step, the slitting step, and the annealing step once or multiple times. The inspection method in the inspection step is substantially the same as the measurement method for the metal plate described above, so details will be omitted.

[0106] The method for manufacturing a metal mask disclosed herein comprises a step of preparing a metal plate, a resist pattern formation step of forming a resist pattern on the metal plate, and an etching step of etching areas of the metal plate that are not covered by the resist pattern to form recesses in the metal plate that will define through holes, thereby manufacturing a metal mask having a plurality of through holes formed therein.

[0107] The metal mask of the present disclosure can be used for a variety of applications. For example, but not limited to, the metal mask of the present disclosure can be used as a metal mask used to pattern an organic material into a desired pattern on a substrate in the manufacture of an organic electroluminescent (EL) display device. The metal mask of the present disclosure can enable high-pixel-density patterning. Organic EL display devices that can be manufactured include displays for smartphones, televisions, and the like, as well as devices for displaying or projecting images and videos to express virtual reality (VR) and augmented reality (AR).

[0108] Unless otherwise specified in this specification and drawings, an example of a metal mask used in manufacturing an organic EL display device and a manufacturing method thereof will be described as one embodiment of the present invention.

[0109] A method for manufacturing a metal mask according to one embodiment of the present disclosure includes a preparation step of preparing a metal plate 200 having a first surface 210 and a second surface 220 located opposite the first surface 210, and an etching step of forming the metal mask 20 by etching the metal plate 200.

[0110] In the following, a method for manufacturing the metal mask 20 by etching will be described, but the metal mask 20 may be formed by etching or by laser processing.

[0111] A method for manufacturing a metal mask 20 according to an embodiment of the present disclosure will be described mainly with reference to FIGS. 7A to 7F. FIG. 7A is a schematic diagram showing a manufacturing apparatus 70 that manufactures a metal mask 20 using a metal sheet 200, along with the processing sequence. FIG. 7A shows an example in which the metal sheet 200 is continuously supplied from a resist film forming apparatus 71 to a stripping apparatus 74. However, the method for manufacturing a metal mask 20 according to the present disclosure is not limited to this. For example, the metal sheet 200 may be wound into a roll after each process in each apparatus. Furthermore, when supplying the metal sheet 200 to each apparatus, the metal sheet 200 may be unwound from the roll.

[0112] Each step of the method for manufacturing the metal mask 20 will be described in detail below.

[0113] First, a metal plate 200 having a desired thickness is prepared (preparation step). The metal plate 200 may be in the form of a wound body 50. The method for producing the metal plate 200 having a desired thickness is not particularly limited, but examples thereof include the above-mentioned rolling method and plating film formation method.

[0114] In the method for manufacturing a metal mask according to the present disclosure, the surface shape of the first surface of the metal plate is measured in the step of preparing the metal plate. The measurement method is substantially the same as the above-described method for measuring the metal plate, and therefore details thereof are omitted.

[0115] Next, resist films 53a and 53b are formed on the first surface 210 and the second surface 220 of the metal plate 200 using a resist film forming apparatus 71 (FIG. 7B). Specifically, the resist films 53a and 53b may be formed by attaching a dry film resist to the first surface 210 and the second surface 220. Alternatively, the resist films 53a and 53b may be formed by applying a coating liquid containing a photosensitive resist material to the first surface 210 and the second surface 220 and drying the coating liquid.

[0116] The dry film resist and coating liquid are not particularly limited, and conventionally known ones can be used. The resist films 53a and 53b thus formed may be either negative resist or positive resist. Of these, negative resists are preferably used.

[0117] The thickness of the resist films 53a, 53b may be 15 μm or less, 10 μm or less, 6 μm or less, or 4 μm or less. The thickness of the resist films 53a, 53b may be 1 μm or more, 3 μm or more, 5 μm or more, or 7 μm or more. The range of the thickness of the resist films 53a, 53b may be determined by combining any one of the above-mentioned multiple upper limit candidate values ​​with any one of the above-mentioned multiple lower limit candidate values.

[0118] Next, resist films 53a and 53b are exposed and developed using exposure / development apparatus 72. As a result, as shown in Fig. 7C, a first resist pattern 53c is formed on first surface 210, and a second resist pattern 53d is formed on second surface 220. For example, when a negative resist film is used, a photomask that blocks light from passing through the region of the resist film that is to be removed may be placed on the resist film, the resist film may be exposed through the photomask, and the resist film may then be developed.

[0119] Subsequently, the metal plate 200 is etched using the etching device 73 with the first resist pattern 53c and the second resist pattern 53d as a mask (etching step). The etching step may include a first-side etching step and a second-side etching step.

[0120] 7D is a schematic diagram illustrating an example of the first-surface etching step for the perforated region 22. In the first-surface etching step, the region of the first surface 210 that is not covered by the first resist pattern 53c is etched using an etching solution. At this time, the second surface 220 may be covered with a resin or the like that is resistant to the etching solution.

[0121] The etching solution erodes the first surface 210 that is not covered by the first resist pattern 53c (FIG. 7D). This forms a large number of first recesses 30 on the first surface 210. Note that etching of the metal plate 200 can proceed isotropically in various directions from the holes in the resist pattern. Therefore, the cross-sectional areas of the first recesses 30 and second recesses 35 at each position along the thickness direction of the metal mask 20 gradually decrease as they progress from the surface in the thickness direction.

[0122] 7E is a schematic diagram illustrating an example of the second-side etching step in the perforated region 22. In the second-side etching step, the region of the second side 220 that is not covered by the second resist pattern 53d is etched using an etching solution. At this time, a film or the like that covered the second side 220 in the first-side etching step may be peeled off beforehand. Furthermore, the first side 210 may be covered with a resin 54 or the like that is resistant to the etching solution.

[0123] The etching solution erodes the second surface 220 that is not covered with the second resist pattern 53d (FIG. 7E). As a result, a second recess 35 is formed on the second surface 220. The first recess 30 and the second recess 35 then communicate with each other, thereby forming a through hole 25.

[0124] The etching solution is not particularly limited as long as it is a conventionally known solution, and examples thereof include those containing ferric chloride solution and hydrochloric acid.

[0125] In the second surface etching step, etching may be continued until adjacent second recesses 35 are connected, as shown in FIG. 7E. At the points where adjacent second recesses 35 are connected, the adjacent second recesses 35 join together to form ridge lines 36. Furthermore, the ridge lines 36 are separated from the second resist pattern 53d, and erosion by etching also progresses in the thickness direction of the metal plate 200 at the tops of the ridge lines 36. This causes the second resist pattern 53d to peel off from the metal plate 200. Note that the second surface 220 may partially remain between adjacent second recesses 35.

[0126] Furthermore, a peeling device 74 is used to peel off the resist pattern, the resin 54 that is resistant to the etching solution, and the like from the metal plate 200. Then, a separation device 75 is used to cut the long metal plate 200, thereby performing a separation step in which the metal mask 20 made of a sheet-like metal plate is separated from the metal plate 200. In this manner, the metal mask 20 is obtained.

[0127] A metal mask apparatus 10 according to an embodiment of the present disclosure includes a frame 15 and the above-described metal mask 20 placed on the frame 15. The metal mask 20 may be placed on the frame 15 with the second surface 20b in contact with the frame 15. FIG. 8 shows a plan view of the metal mask apparatus 10 as viewed from the first surface 20a side of the metal mask 20. FIG. 9 shows a cross-sectional view of the vapor deposition apparatus.

[0128] In the metal mask device 10 of the present disclosure, multiple metal masks 20 may be attached to one frame (FIG. 8). In this case, the multiple metal masks 20 may be arranged in a width direction that intersects with the longitudinal direction of the metal masks 20. Furthermore, each metal mask 20 may be fixed to the frame 15 at both ends 23a of the metal mask 20 in the longitudinal direction.

[0129] The method of fixing to the frame 15 is not particularly limited, but may be, for example, welding.

[0130] The metal mask device 10 may include a member that is fixed to the frame 15 and that partially overlaps the metal mask 20 in the thickness direction of the metal mask 20. Examples of such a member are not particularly limited, but include a member that extends in a direction intersecting the longitudinal direction of the metal mask 20 and supports the metal mask 20, and a member that overlaps the gap between two adjacent metal masks.

[0131] Next, a method for manufacturing an organic EL display device using the metal mask 20 according to the present disclosure will be described with reference to Fig. 9. The organic EL display device may include a substrate 92 and a deposition layer including a deposition material 98 provided in a pattern, stacked together.

[0132] The method for manufacturing an organic EL display device according to an embodiment of the present disclosure is not particularly limited, but includes, for example, a vapor deposition step of depositing a vapor deposition material 98 on a substrate such as the substrate 92 using a metal mask 20.

[0133] In the vapor deposition process, first, the metal mask device 10 is positioned so that the metal mask 20 faces the substrate 92. At this time, as shown in Fig. 9, the first surface 20a of the metal mask 20 may face the substrate 92. Here, the substrate 92 is a deposition target such as a glass substrate.

[0134] 9, when the metal mask device 10 is housed in the vapor deposition device 90, the surface of the metal mask 20 facing the substrate 92 is the first surface 20a, and the surface of the metal mask 20 facing the crucible 94 holding the vapor deposition material 98 is the second surface 20b. Inside the vapor deposition device 90, the metal mask 20 is placed on the surface of the substrate 92 facing the crucible 94. Here, the metal mask 20 and the substrate 92 may be brought into close contact with each other by magnetic force.

[0135] A crucible 94 containing a deposition material 98 and a heater 96 for heating the crucible 94 may be disposed below the metal mask device 10 within the deposition device 90. Here, the deposition material 98 may be, for example, an organic light-emitting material. The deposition material 98 in the crucible 94 is vaporized or sublimated by the heat from the heater 96. The vaporized or sublimated deposition material 98 adheres to the substrate 92 through the through-holes 25 of the metal mask 20. As a result, the deposition material 98 is formed into a film on the surface of the substrate 92 in a desired pattern corresponding to the positions of the through-holes 25 of the metal mask 20. Note that the interior of the deposition device 90 may be a vacuum atmosphere during the deposition process.

[0136] When it is desired to deposit different types of deposition materials according to pixels such as RGB, the deposition materials 98 may be formed on the surface of the substrate 92 using different metal masks 20 according to the colors of the deposition materials 98. For example, the red deposition material 98, the green deposition material 98, and the blue deposition material 98 may be deposited in this order on the substrate 92. Alternatively, the red deposition material 98, the green deposition material 98, and the blue deposition material 98 may be deposited in this order by gradually moving the metal mask 20 (metal mask device 10) and the substrate 92 relative to each other along the arrangement direction of the through holes 25 (the aforementioned one direction).

[0137] The method for manufacturing an organic EL display device may include various processes other than the vapor deposition process of depositing a vapor deposition material 98 on a substrate such as the substrate 92 using the metal mask 20. For example, the method for manufacturing an organic EL display device may include a process of forming a first electrode on the substrate. A vapor deposition layer is formed on the first electrode. The method for manufacturing an organic EL display device may also include a process of forming a second electrode on the vapor deposition layer. The method for manufacturing an organic EL display device may also include a sealing process of sealing the first electrode, the vapor deposition layer, and the second electrode provided on the substrate 92.

[0138] The deposition layer formed on a substrate such as the substrate 92 using the metal mask 20 is not limited to the light-emitting layer formed by depositing the organic light-emitting material described above, and may include other layers. For example, the deposition layer may include, in order from the first electrode side, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, etc. In this case, a deposition process using a metal mask 20 corresponding to each layer may be performed.

[0139] While the method for continuously measuring the surface shape of a long metal plate over a wide area has been described above, as a modification, the metal plate measuring device according to an embodiment of the present disclosure may be used for measuring sheet-by-sheet metal plates. In this case, the metal plate measuring device may be configured in the same manner as described above, except that it does not have a conveying mechanism.

[0140] Specifically, the sheet-fed metal plate measuring device has a sensor that measures the surface shape of the first side of the metal plate, a stage with which the second side of the metal plate, which is located opposite the first side, comes into contact during measurement by the sensor, and a control unit that executes a measurement process corresponding to the third process, in which the measurement process is a process in which the sensor measures the surface shape of the first side of the metal plate while the second side of the metal plate is in contact with the stage, and the stage has a hole or groove on the surface with which the metal plate comes into contact.

[0141] In the case of sheet-fed metal plates, as described above, if the stage 130 has holes or grooves, vibration of the metal plate 200 when the stage 130 comes into contact with the metal plate 200 is more easily suppressed, which tends to further improve measurement accuracy. [Industrial Applicability]

[0142] The present invention has industrial applicability as an apparatus used for inspecting metal plates used for manufacturing metal masks. [Explanation of symbols]

[0143] 10...metal mask device, 15...frame, 20...metal mask, 20a...first surface, 20b...second surface, 22...perforated area, 23a...both ends, 25...through hole, 30...first recess, 35...second recess, 36...ridge line, 50...wound body, 53a...resist film, 53b...resist film, 53c...first resist pattern, 53d...second resist pattern, 54...resin, 55...base material, 56...rolling device, 56a...rolling roll, 56b...rolling roll, 61...core, 62...body, 70...manufacturing device, 71...resist film forming device, 72... Exposure / development device, 73...etching device, 74...peeling device, 75...separating device, 90...evaporation device, 92...substrate, 96...heater, 98...evaporation material, 100...measuring device, 110...transport mechanism, 111...first roll, 112...second roll, 120...sensor, 121...first moving mechanism, 122...second moving mechanism, 130...stage, 140...control unit, 150...tension adjustment mechanism, 151...first auxiliary roll, 152...second auxiliary roll, 160...elevating mechanism, 161...elevator, 200...metal plate, 210...first surface, 220...second surface

Claims

1. A measuring device for a metal plate, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring a surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism in a state where the metal plate is not in contact with the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; Measuring equipment.

2. a tension adjusting mechanism for adjusting the tension of the metal plate in the longitudinal direction D2, The control unit In the first step, the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate does not contact the stage, and the metal plate is transported by the transport mechanism; In the third step, the conveyance of the metal plate is stopped, and the tension of the metal plate is adjusted by the tension adjustment mechanism so that the metal plate contacts the stage, and the surface shape of the first surface of the metal plate is measured by the sensor. The measuring device according to claim 1 .

3. a lifting mechanism for lifting the transport mechanism relative to the stage; The control unit In the first step, the lifting mechanism adjusts a distance between the metal plate and the stage so that the metal plate and the stage do not come into contact with each other, and the conveying mechanism conveys the metal plate; In the third step, the conveyance of the metal plate is stopped, and the lifting mechanism adjusts the distance between the metal plate and the stage so that the metal plate and the stage come into contact with each other, and the sensor is controlled to measure the surface shape of the first surface of the metal plate. The measuring device according to claim 1 .

4. a tension adjusting mechanism that adjusts the tension of the metal plate in the longitudinal direction D2, and / or a lifting mechanism that moves the transport mechanism up and down relative to the stage, The control unit In the first step, the tension of the metal plate and / or the distance between the metal plate and the stage is adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate does not contact the stage, and the metal plate is transported by the transport mechanism; In the third step, the conveyance of the metal plate is stopped, and the tension of the metal plate and / or the gap between the metal plate and the stage is adjusted by the tension adjustment mechanism and / or the lifting mechanism so that the metal plate contacts the stage, and control is performed so that the sensor measures the surface shape of the first surface of the metal plate. The measuring device according to claim 1 .

5. The thickness of the metal plate is 5 to 100 μm. The measuring device according to claim 1 .

6. The contactable area is 80% to 99%. The measuring device according to claim 1 .

7. the conveying mechanism has a first roll that feeds out the metal plate and a second roll that winds up the metal plate; The measuring device according to claim 1 .

8. A method for measuring a metal plate, comprising: a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring a surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism in a state where the metal plate is not in contact with the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; Measurement method.

9. A method for manufacturing a metal plate used to manufacture a metal mask, comprising: a rolling step of rolling a base material to obtain the metal plate; an inspection step of inspecting the rolled metal plate, In the inspection step, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring a surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism in a state where the metal plate is not in contact with the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; Method for manufacturing metal plates.

10. A method for manufacturing a metal mask having a plurality of through holes formed therein, comprising: providing a metal plate; a resist pattern forming step of forming a resist pattern on the metal plate; an etching step of etching an area of ​​the metal plate that is not covered by the resist pattern to form a recess in the metal plate that will define the through hole; In the step of preparing the metal plate, a conveying mechanism that conveys the metal plate in a longitudinal direction D2; a sensor for measuring a surface shape of the first surface of the metal plate; a stage with which a second surface of the metal plate, which is positioned opposite to the first surface, comes into contact when the sensor measures the metal plate; a control unit that repeatedly executes the first step, the second step, and the third step; In the first step, the metal plate is transported by the transport mechanism in a state where the metal plate is not in contact with the stage; In the second step, the transportation of the metal plate is stopped, and the second surface of the metal plate whose transportation has been stopped is brought into contact with the stage; In the third step, the surface shape of the first surface of the metal plate is measured by the sensor while the second surface of the metal plate is in contact with the stage; the stage has a hole or a groove on a surface with which the metal plate comes into contact; A method for manufacturing metal masks.

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