Nozzle, cutting device and method for processing work-piece

Abstract

To suppress cutting liquid from remaining in a groove, in forming the groove in a single-layered or a multi-layed work-piece while supplying the cutting liquid to a processing point.SOLUTION: A nozzle, which is configured to supply fluid to a groove so as to remove cutting liquid remaining in the groove when forming the groove, along a longitudinal direction, in a work-piece by moving the work-piece backward when viewed from a cutting blade, while supplying the cutting liquid to a contact interface between the cutting blade and the work-piece in a state where the rotary annular cutting blade is cut into the work-piece which is either a single-layered work-piece or a multi-layered work-piece, comprises a main body which has a square annular shape in a front view and has a flow path whose lower end acts as an outflow port formed therein. The main body includes a lower surface on which the outflow port is positioned at a center, in a front view and a front surface having a portion extending backward and obliquely upward from a front end of the lower surface, in a side view.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a nozzle for supplying fluid to a groove to remove cutting fluid remaining in the groove when forming a groove in a workpiece, a cutting device equipped with this nozzle, and a method for processing a workpiece by forming a groove in the workpiece. [Background technology]

[0002] Chips for devices such as integrated circuits (ICs) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured by dividing a wafer or package substrate (hereinafter also referred to as a "wafer") on which multiple devices are provided along the boundaries of the multiple devices.

[0003] This division is performed, for example, by a cutting device that includes a holding table for holding the wafer or the like, a cutting unit positioned above the holding table, and a movement mechanism for moving the holding table and the cutting unit relative to each other. The cutting unit also has a spindle with an annular cutting blade attached to its tip for cutting the wafer or the like held on the holding table, and a cutting fluid supply nozzle for supplying cutting fluid to the contact interface (machining point) between the cutting blade and the wafer or the like.

[0004] Cutting fluid is a liquid whose main component is, for example, water, and is generally supplied to a processing point to cool both the wafer and the like that are heated when the cutting blade cuts the wafer, etc., and to wash away the resulting cutting debris. Furthermore, cutting fluids may also contain substances (e.g., organic acids or oxidizing agents) that chemically react with substances contained in the wafer, etc., in order to improve processing accuracy (see, for example, Patent Document 1).

[0005] In the cutting device, the wafer or the like is divided, for example, in the following order: First, the wafer or the like is held by a holding table via a dicing tape attached to one side of the wafer or the like. Next, the relative positions of the cutting blade and the holding table are adjusted so that the cutting blade, which is located rearward from the holding table, penetrates the wafer or the like and its cutting tip (lower end) is positioned at a height corresponding to the dicing tape.

[0006] Next, the cutting blade is rotated together with the spindle, and cutting fluid is supplied to the processing point from the cutting fluid supply nozzle while the holding table is moved backward as viewed from the cutting blade, so that its bottom surface is positioned on the dicing tape and a groove is formed that penetrates the wafer, i.e., the wafer is divided. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2020-27917 Summary of the Invention [Problem to be solved by the invention]

[0008] When a groove is formed in a single layer such as a wafer or a laminate including a wafer and a dicing tape (hereinafter also referred to as a "single-layer or multi-layer workpiece") while supplying cutting fluid to the processing point, the cutting fluid may remain in the groove for a long period of time. If the cutting fluid contains a substance that chemically reacts with a substance contained in the wafer, the chemical reaction between the two substances may occur over a long period of time, which may cause problems such as multiple chips discoloring to an unintended color.

[0009] In view of this, an object of the present invention is to suppress the residue of cutting fluid in a groove when a groove is formed in a single-layer or multi-layer workpiece while supplying cutting fluid to the processing point. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a nozzle for supplying a fluid to a groove so as to remove any cutting fluid remaining in the groove when a groove along a fore-and-aft direction is formed in a workpiece by moving the workpiece rearward as viewed from the cutting blade while a rotating annular cutting blade is cutting into the workpiece, either single-layered or multiple-layered. The nozzle has a main body that has a rectangular ring shape when viewed from the front and has a flow path formed therein, the lower end of which is an outlet, and the main body includes a lower surface in which the outlet is located at the center when viewed from the front, and a front surface that, when viewed from the side, has a portion that extends diagonally upward and rearward from the front end of the lower surface.

[0011] Furthermore, in the nozzle of the present invention, it is preferable that the flow path includes a portion that extends obliquely upward and forward from the outlet.

[0012] According to another aspect of the present invention, there is provided a cutting device comprising: a holding table for holding a single-layer or multi-layer workpiece; a spindle having an annular cutting blade attached to its tip for cutting the workpiece held on the holding table and extending in the left-right direction; a cutting unit located above the holding table and having a cutting fluid supply nozzle for supplying cutting fluid to a contact interface between the cutting blade and the workpiece; and a movement mechanism for relatively moving the holding table and the cutting unit in the front-to-rear direction, wherein the cutting unit moves the cutting blade, which rotates together with the spindle, cutting into the workpiece held on the holding table, and moves the cutting blade and the workpiece together. A cutting device is provided which further has a fluid supply nozzle for supplying fluid to the groove to remove any cutting fluid remaining in the groove when forming a groove along the fore-and-aft direction in the workpiece by operating the moving mechanism to move the workpiece in a rearward direction as viewed from the cutting blade while supplying the cutting fluid from the cutting fluid supply nozzle to the contact interface, wherein the fluid supply nozzle is located in the rearward direction as viewed from the cutting blade, and has a main body which has a rectangular ring shape when viewed from the front and has a flow path formed therein, the lower end of which becomes an outlet, and the main body includes a lower surface in which the outlet is located at the center when viewed from the front, and a front surface which, when viewed from the side, extends diagonally upward and rearward from the front end of the lower surface.

[0013] Furthermore, in the cutting device of the present invention, it is preferable that the flow path includes a portion that extends obliquely upward and forward from the outlet.

[0014] According to yet another aspect of the present invention, there is provided a method for processing a workpiece to form a groove along the front-to-rear direction in a single-layer or multi-layer workpiece, the method comprising: a positioning step in which the lower end of an annular cutting blade located rearward as viewed from the workpiece is positioned between the upper and lower surfaces of the workpiece; and a processing step in which, after the positioning step, the workpiece is moved rearward as viewed from the cutting blade while rotating the cutting blade to form a groove along the front-to-rear direction in the workpiece, wherein in the processing step, cutting fluid is supplied to the contact interface between the cutting blade and the workpiece, and a fluid is supplied to the groove so as to remove any cutting fluid remaining in the groove.

[0015] Furthermore, in the method for processing a workpiece of the present invention, it is preferable that the fluid flowing obliquely downward and rearward is supplied to the groove. [Effects of the Invention]

[0016] The nozzle of the present invention has a flow path formed therein, the lower end of which serves as an outlet, and a main body including a lower surface with the outlet located in the center when viewed from the front. Therefore, when a groove is formed by moving the workpiece rearward from the cutting blade, the main body can be positioned rearward from the cutting blade and fluid can be supplied from the outlet of the main body, thereby effectively removing cutting fluid that has flowed into the groove.

[0017] Furthermore, the main body has a rectangular ring shape when viewed from the front, i.e., the main body has a through hole formed therein that extends in the front-to-rear direction and includes a front surface having a portion that extends diagonally upward and rearward from the front end of the lower surface of the main body. When the main body has such a shape, when forming the groove as described above, some of the cutting fluid that splashes as the cutting blade rotates is more likely to pass through the through hole formed in the main body and head toward the rear of the nozzle.

[0018] In other words, even when the groove is formed as described above, the splashing cutting fluid is less likely to collide with the front surface of the main body and fall. Therefore, even if the main body is positioned rearward from the cutting blade when forming the groove as described above, the amount of cutting fluid flowing into the groove does not increase excessively. As a result, by using the nozzle of the present invention, it is possible to suppress the residue of cutting fluid in the groove when forming a groove in a single-layer or multi-layer workpiece while supplying cutting fluid to the processing point. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a workpiece. [Figure 2] FIG. 2 is a perspective view schematically illustrating an example of a cutting device. [Figure 3] FIG. 3 is an exploded perspective view schematically showing some exposed components of the cutting unit. [Figure 4] FIG. 4 is a side view schematically showing components of the cutting unit that are provided around the cutting blade. [Figure 5] 5(A) is a front view of the main body of the fluid supply nozzle, FIG. 5(B) is a cross-sectional view of the main body taken along a plane parallel to the X and Z directions and passing through line VB in FIG. 5(A), and FIG. 5(C) is a cross-sectional view of the main body taken along a plane parallel to the X and Z directions and passing through line VC in FIG. 5(A). [Figure 6] FIG. 6 is a flow chart schematically illustrating an example of a method for processing a workpiece by forming grooves along the front-rear direction in the workpiece using a cutting device. DETAILED DESCRIPTION OF THE INVENTION

[0020]

[0023] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a typical example of a workpiece (specifically, a multi-layer workpiece). The workpiece 11 shown in Fig. 1 has a circular front surface 13a and a back surface 13b, and includes a wafer 13 made of a semiconductor such as silicon (Si).

[0021] Furthermore, a plurality of devices 15 arranged in a matrix are formed on the front surface 13a of the wafer 13. In other words, the boundaries of the plurality of devices 15 extend in a lattice pattern on the wafer 13. Each of the plurality of linear portions included in the boundaries is also called a division line.

[0022] Furthermore, the back surface 13b of the wafer 13 is attached to the central region of a disk-shaped dicing tape 17 whose diameter is larger than that of the wafer 13. This dicing tape 17 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one surface of the base layer (the surface on the wafer 13 side).

[0023] Specifically, the base layer is made of polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), etc. The adhesive layer is made of ultraviolet-curing silicone rubber, acrylic material, epoxy material, etc.

[0024] The outer peripheral region of the dicing tape 17 is attached to an annular frame 19 having a circular opening 19a formed therein, the opening 19a having a diameter larger than that of the wafer 13. The frame 19 is made of a metal material such as aluminum or stainless steel.

[0025] Fig. 2 is a perspective view schematically showing an example of a cutting device. Note that the direction indicated by arrow X in Fig. 2 (X direction) is the forward direction, the direction indicated by arrow Y (Y direction) is the leftward direction, and the direction indicated by arrow Z (Z direction) is the upward direction.

[0026] 2 includes a base 4 that supports each of the components. A recess 4a extending along the X direction is formed on the top surface of the base 4. Inside the recess 4a, a flat table cover 6 and a bellows-like dust-proof and drip-proof cover 8 that expands and contracts as the table cover 6 moves in the X direction or the opposite direction are provided.

[0027] A holding table 10 is provided above the table cover 6. The holding table 10 has a disk-shaped frame 10a made of ceramics or the like. The frame 10a has a disk-shaped bottom wall and cylindrical side walls extending from the outer periphery of the bottom wall. A disk-shaped porous plate 10b made of, for example, porous ceramics is fixed to a recess defined by the bottom wall and side walls of the frame 10a.

[0028] The porous plate 10b has a diameter approximately equal to the inner diameter of the side wall of the frame 10a. Furthermore, the porous plate 10b communicates with a suction source (not shown), such as an ejector, provided inside the recess 4a via a through-hole or the like formed in the bottom wall of the frame 10a. The upper surfaces of the side walls of the frame 10a and the upper surface of the porous plate 10b are parallel to the X and Y directions, respectively, and function as the holding surface of the holding table 10 when holding the workpiece 11.

[0029] Specifically, when the workpiece 11 is carried into the cutting device 2, the wafer 13 is placed on the holding table 10 via the dicing tape 17. Then, when the suction source communicating with the porous plate 10b is operated in this state, a suction force acts on the wafer 13 via the dicing tape 17. As a result, the wafer 13 is held on the holding surface of the holding table 10 via the dicing tape 17.

[0030] Additionally, a plurality of clamps 12 are provided around the holding table 10. The clamps 12 are provided at approximately equal angular intervals along the circumferential direction of the holding table 10. When the workpiece 11 is carried into the cutting device 2, the clamps 12 grip the frame 19 at a position lower than the upper surface of the holding table 10.

[0031] The holding table 10 and the multiple clamps 12 are connected to an X-direction movement mechanism (not shown) provided inside the recess 4a. This X-direction movement mechanism includes, for example, a ball screw and a motor for rotating the screw shaft of the ball screw. When this X-direction movement mechanism is operated, the holding table 10 and the multiple clamps 12 move in the X direction or the opposite direction. Furthermore, in conjunction with this movement, the table cover 6 moves in the X direction or the opposite direction, and the dust-proof and drip-proof cover 8 expands and contracts.

[0032] The holding table 10 and the multiple clamps 12 are connected to a rotational drive source (not shown) provided inside the recess 4a. This rotational drive source includes, for example, a shaft, a pulley connected to the shaft, and a motor for rotating the pulley. When the rotational drive source is operated, the holding table 10 and the multiple clamps 12 rotate around a rotation axis that passes through the center of the holding surface of the holding table 10 and is aligned in the Z direction.

[0033] A support structure 14 is provided in an area of ​​the upper surface of the base 4 that is located in the Y direction when viewed from the recess 4a. This support structure 14 has an upright portion 14a that stands upright from the upper surface of the base 4, and an arm portion 14b that extends from an upper portion of the upright portion 14a in the opposite direction to the Y direction (to the right) so as to cross the recess 4a. A Y-direction movement mechanism 16 is provided on the front side of the arm portion 14b.

[0034] The Y-direction movement mechanism 16 is fixed to the front surface of the arm portion 14b and has a pair of guide rails 18 extending along the Y direction. A moving plate 20 is connected to the front surfaces of the pair of guide rails 18 in a manner that allows it to slide along the pair of guide rails 18.

[0035] A screw shaft 22 extending along the Y direction is disposed between the pair of guide rails 18. A motor (not shown) for rotating the screw shaft 22 is connected to the left end of the screw shaft 22. A nut (not shown) that houses a large number of balls that roll on the surface of the rotating screw shaft 22 is provided on the surface of the screw shaft 22 on which a spiral groove is formed, thereby constituting a ball screw.

[0036] That is, when the screw shaft 22 rotates, a large number of balls circulate inside the nut, causing the nut to move in the Y direction or the opposite direction. The nut is fixed to the rear side of the moving plate 20. Therefore, when the screw shaft 22 is rotated by a motor connected to the left end of the screw shaft 22, the moving plate 20 moves together with the nut in the Y direction or the opposite direction.

[0037] A Z-direction movement mechanism 24 is provided on the front side of the movable plate 20. This Z-direction movement mechanism 24 is fixed to the front side of the movable plate 20 and has a pair of guide rails 26 extending along the Z direction. A movable plate 28 is connected to the front sides of the pair of guide rails 26 in a manner that allows it to slide along the pair of guide rails 26.

[0038] A screw shaft 30 extending along the Z direction is disposed between the pair of guide rails 26. A motor 32 for rotating the screw shaft 30 is connected to the upper end of the screw shaft 30. A nut (not shown) that houses a large number of balls that roll on the surface of the rotating screw shaft 30 is provided on the surface of the screw shaft 30 on which a spiral groove is formed, thereby forming a ball screw.

[0039] That is, when the screw shaft 30 rotates, a large number of balls circulate inside the nut, causing the nut to move in the Z direction or the opposite direction. The nut is fixed to the rear side of the movable plate 28. Therefore, when the screw shaft 30 is rotated by the motor 32, the movable plate 28 moves together with the nut in the Z direction or the opposite direction.

[0040] A cylindrical housing 34 is fixed to the lower part of the moving plate 28. A cutting unit 36 ​​is partially housed in the housing 34. Some components of the cutting unit 36 ​​are not housed in the housing 34, but are exposed to the right side thereof.

[0041] 3 is an exploded perspective view showing a schematic view of some of the components of the cutting unit 36 ​​that are exposed and not housed in the housing 34. The cutting unit 36 ​​has a spindle 38 that extends in the left-right direction so that its tip end (right end) protrudes from the housing 34 and the remaining portion is housed in the housing 34.

[0042] The spindle 38 is supported by the housing 34 in a manner that allows it to rotate around a straight line along the Y direction. The base end (left end) of the spindle 38 is connected to a motor (not shown) for rotating the spindle 38. This motor is accommodated in the housing 34.

[0043] A mounter 42, on which the cutting blade 40 is attached, is attached to the tip of the spindle 38. An opening 38a is formed at the tip of the spindle 38, and a thread groove is formed on an inner wall surface 38b of this opening 38a. The mounter 42 has a flange portion 44 extending radially outward and a boss portion 46 protruding from the surface of the flange portion 44.

[0044] An opening 44a is formed in the center of the flange portion 44, penetrating the flange portion 44. A fitting portion (not shown) into which the tip of the spindle 38 can be fitted is formed on the back side of the flange portion 44. This fitting portion is provided at a position corresponding to the opening 44a.

[0045] Then, when the tip of the spindle 38 is fitted into a fitting portion formed in the flange portion 44 of the mounter 42, the mounter fixing bolt 48 is attached to the mounter 42 and the spindle 38. Specifically, a thread is provided on an outer wall surface 48a of the mounter fixing bolt 48, and the mounter fixing bolt 48 is attached to the mounter 42 and the spindle 38 by screwing the thread into a thread groove formed in the inner wall surface 38b of the opening 38a of the spindle 38.

[0046] The surface of the flange portion 44 forms an abutment surface 44b that abuts against the back surface of the cutting blade 40. This abutment surface 44b has a ring-like shape with its center on the straight line that is the rotation axis of the spindle 38. The boss portion 46 is formed in a cylindrical shape, and its outer wall surface 46a is provided with a screw thread. An opening 40a through which the boss portion 46 is inserted is formed in the center of the cutting blade 40.

[0047] The cutting blade 40 is attached to the mounter 42 by inserting the boss portion 46 into the opening 40a. Once the cutting blade 40 is attached to the mounter 42, an annular flange 50 is attached to the surface side of the cutting blade 40. Specifically, an opening 50a is formed in the center of the flange 50, and the boss portion 46 of the mounter 42 is fitted into this opening 50a.

[0048] The back surface of the flange 50 serves as an abutment surface (not shown) that abuts against the surface of the cutting blade 40. This abutment surface has a ring-like shape that corresponds to the abutment surface 44b of the flange portion 44 of the mounter 42. Once the flange 50 is positioned in a position where it and the mounter 42 sandwich the cutting blade 40, a flange fixing nut 52 is attached to the tip of the boss portion 46.

[0049] Specifically, an opening 52a is formed in the flange fixing nut 52, and a thread groove is formed on an inner wall surface 52b of the opening 52a. The flange fixing nut 52 is attached to the boss portion 46 by screwing this thread groove into a thread provided on the outer wall surface 46a of the boss portion 46.

[0050] As a result, the flange 50 is pressed toward the mounter 42, with the front surface of the cutting blade 40 abutting against the abutment surface of the flange 50, and the back surface abutting against the abutment surface 44b of the flange portion 44 of the mounter 42. As a result, the cutting blade 40 is sandwiched between the mounter 42 and the flange 50.

[0051] 4 is a side view schematically showing components of the cutting unit 36 ​​that are provided around the cutting blade 40 sandwiched between the mounter 42 and the flange 50. Specifically, a blade cover 54 is provided around the cutting blade 40 so as to surround the cutting blade 40 except for the lower part and the lower half of the rear part in a side view.

[0052] The upper portions of a pair of pipe-shaped cutting fluid supply nozzles 56, which are spaced apart in the Y direction, are housed inside the rear portion of the blade cover 54. The upper portion of each cutting fluid supply nozzle 56 extends along the Z direction, and its upper end is fixed to a connecting portion 58 provided on the blade cover 54.

[0053] Furthermore, the connecting part 58 is connected to a cutting fluid supply source (not shown) via a pipe 60 and a valve (not shown) connected to the pipe 60. This cutting fluid supply source supplies cutting fluid that contains, for example, water as a main component and also contains a substance (for example, an organic acid or an oxidizing agent) for improving the machining accuracy of the workpiece 11.

[0054] Each cutting fluid supply nozzle 56 includes an intermediate portion extending obliquely downward and forward from the lower end of its upper portion, and a lower portion extending in the X direction from the lower end of the intermediate portion. The lower portion of the cutting blade 40 is located between the lower portions of the pair of cutting fluid supply nozzles 56. That is, the lower portion of one of the pair of cutting fluid supply nozzles 56 is located to the right when viewed from the lower portion of the cutting blade 40, and the lower portion of the other is located to the left when viewed from the lower portion of the cutting blade 40.

[0055] Furthermore, a plurality of slits (not shown) are formed on the left side of the lower portion of one of the pair of cutting fluid supply nozzles 56 and on the right side of the lower portion of the other of the pair of cutting fluid supply nozzles 56. When a valve provided between each cutting fluid supply nozzle 56 and a cutting fluid supply source is opened, cutting fluid is supplied from the cutting fluid supply source through the piping 60 and the connecting portion 58 to the lower portion of the cutting blade 40 through the plurality of slits formed in the lower portion of each cutting fluid supply nozzle 56.

[0056] A pipe-shaped cutting fluid supply nozzle 62 is housed inside the front part of the blade cover 54 and is located in the X direction when viewed from the cutting blade 40. The portion of the cutting fluid supply nozzle 62 other than the lower part (the other portion) extends along the Z direction, and its upper end is fixed to a connecting part 64 provided on the blade cover 54. Furthermore, the connecting part 64 is connected to the cutting fluid supply source (not shown) via a pipe 66 and a valve (not shown) connected to the pipe 66, etc.

[0057] The lower part of the cutting fluid supply nozzle 62 extends diagonally downward and rearward from the lower end of the other part, and an opening is formed in the lower end surface. When a valve provided between the cutting fluid supply nozzle 62 and the cutting fluid supply source is opened, cutting fluid is supplied from the cutting fluid supply source through the piping 66 and the connecting part 64 and from the opening formed in the lower end surface of the cutting fluid supply nozzle 62 toward the space located below the cutting blade 40.

[0058] In addition, a fluid supply nozzle 68 is provided behind the blade cover 54. This fluid supply nozzle 68 has a main body 70 located in the opposite direction (rear direction) of the X direction as viewed from the cutting blade 40. Fig. 5(A) is a front view of this main body 70. Fig. 5(B) is a cross-sectional view of the main body 70 taken along a plane parallel to the X and Z directions and passing through line VB in Fig. 5(A), and Fig. 5(C) is a cross-sectional view of the main body 70 taken along a plane parallel to the X and Z directions and passing through line VC in Fig. 5(A).

[0059] The main body 70 has a rectangular ring shape when viewed from the front. That is, the main body 70 has a through-hole 72 extending in the front-rear direction. A flow path 74 is formed inside the main body 70, and the lower end of the flow path 74 serves as an outlet 74a. The outlet 74a is located at the center of the lower surface 70a of the main body 70 when viewed from the front.

[0060] The flow path 74 is divided into a lower portion 74b, a first intermediate portion 74c, two second intermediate portions 74d, and two upper portions 74e. Specifically, the lower portion 74b extends obliquely upward and forward from the outlet 74a to a position short of the lower end of the through-hole 72.

[0061] The first intermediate portion 74c extends in the Y direction such that the upper end of the lower portion 74b is located at its center and its width (length along the Y direction) is longer than the width of the through-hole 72 and shorter than the width of the lower surface 70a of the main body 70. One of the two second intermediate portions 74d extends obliquely upward and rearward from the left end of the first intermediate portion 74c, and the other extends obliquely upward and rearward from the right end of the first intermediate portion 74c.

[0062] One of the two upper portions 74e extends in the Z direction from the upper end of one of the two second intermediate portions 74d to the upper surface 70b of the main body 70, and the other end extends in the Z direction from the upper end of the other of the two second intermediate portions 74d to the upper surface 70b of the main body 70. The upper ends of the two upper portions 74e are located near the left end or the right end of the upper surface 70b of the main body 70 in a front view, respectively, and form inlets 74f.

[0063] Furthermore, the front surface 70c of the main body 70 includes a lower portion 70d extending obliquely upward and rearward from the front end of the lower surface 70a, and an upper portion 70e extending in the Z direction from the upper end of the lower portion 70d to the front end of the upper surface 70b. Furthermore, the rear surface 70f of the main body 70 includes an upper portion 70g extending in the opposite direction (downward) to the Z direction from the rear end of the upper surface 70b, and a lower portion 70h extending obliquely downward and frontward from the lower end of the upper portion 70g to the rear end of the lower surface 70a.

[0064] In addition, a connecting portion 76 that communicates with the flow path 74 is provided on the upper surface 70b of the main body 70 (see FIG. 4). The connecting portion 76 is connected to a fluid supply source (not shown) via a pipe 78 and a valve (not shown) connected to the pipe 78. The fluid supply source supplies a fluid such as a liquid (e.g., water) or a gas (e.g., air) that does not substantially contain any substance that chemically reacts with the substance contained in the workpiece 11.

[0065] When the valve provided between the main body 70 and the fluid supply source is opened, fluid is supplied from the fluid supply source via the piping 78, the connecting portion 76, and the flow path 74, flowing diagonally downward and rearward from the outlet 74a formed on the underside 70a of the main body 70.

[0066] 6 is a flowchart schematically illustrating an example of a method for processing a workpiece 11 by using the cutting device 2 to form grooves along the front-rear direction in the workpiece 11. In this method, first, the lower end of the cutting blade 40 is positioned between the upper surface (i.e., the surface 13a of the wafer 13) and the lower surface (the lower surface of the dicing tape 17) of the workpiece 11 (positioning step S1). This positioning step S1 is performed, for example, in the following order:

[0067] First, a suction source communicating with the porous plate 10b of the holding table 10 is operated so that the wafer 13 is held on the holding surface of the holding table 10 via the dicing tape 17, and the frame 19 is gripped by the multiple clamps 12. Next, a rotation drive source provided in the recess 4a is operated so that some of the multiple planned dividing lines set on the wafer 13 of the workpiece 11 become parallel to the X direction.

[0068] Next, the X-direction movement mechanism and Y-direction movement mechanism 16 provided in the recess 4a are operated so that the cutting blade is positioned in the direction opposite to the X-direction (rearward) when viewed from one of the multiple planned dividing lines that is parallel to the X-direction in a plan view. Next, the Z-direction movement mechanism 24 is operated so that the lower end of the cutting blade 40 is positioned at a height corresponding to the portion of the dicing tape 17 that is located between the holding table 10 and the wafer 13, that is, above the holding surface of the holding table 10 and below the back surface 13b of the wafer 13.

[0069] After the positioning step S1, the workpiece 11 is moved rearward from the cutting blade 40 while rotating the cutting blade 40, thereby forming a groove along the front-to-rear direction in the workpiece 11 (processing step S2). This processing step S2 is performed, for example, in the following order.

[0070] First, the motor connected to the base end of the spindle 38 is operated to rotate the cutting blade 40. Next, while the cutting blade 40 is still rotating, the X-direction movement mechanism provided in the recess 4a is operated to move the holding table 10 and the multiple clamps 12 in the direction opposite to the X-direction (rearward) until the cutting blade 40 cuts into the workpiece 11.

[0071] Furthermore, the supply of the cutting fluid and the fluid is started immediately before the cutting blade 40 comes into contact with the workpiece 11. Specifically, the valves provided between the cutting fluid supply nozzles 56, 62 and the cutting fluid supply source are opened and the cutting fluid supply source is operated, and the valves provided between the main body 70 and the fluid supply source are opened and the fluid supply source is operated.

[0072] As a result, a groove is formed in the workpiece 11 along the front-to-rear direction with cutting fluid being supplied to the contact interface between the cutting blade 40 and the workpiece 11. The rotation of the cutting blade 40, the rearward movement of the holding table 10 and the multiple clamps 12, and the respective supplies of cutting fluid and fluid are continued until the workpiece 11 is positioned behind the cutting blade 40 in a plan view.

[0073] Here, the fluid supply nozzle 68 has a flow path 74 formed therein, the lower end of which is an outlet 74a, and a main body 70 including a lower surface 70a in which the outlet 74a is located at the center when viewed from the front. Therefore, when a groove is formed by moving the workpiece 11 in the direction opposite to the X direction (rearward) as viewed from the cutting blade 40, the main body 70 is positioned in the rearward direction as viewed from the cutting blade 40, and the cutting fluid that has flowed into the groove can be effectively removed by supplying fluid from the outlet 74a of the main body 70.

[0074] Furthermore, the main body 70 has a rectangular ring shape when viewed from the front, i.e., the main body 70 has a through hole 72 extending in the front-rear direction formed therein, and includes a front surface 70c having a lower portion 70d extending obliquely upward and rearward from the front end of the lower surface 70a. When forming the groove as described above, some of the cutting fluid that splashes as the cutting blade 40 rotates tends to pass through the through hole 72 formed in the main body 70 and head toward the rear of the fluid supply nozzle 68.

[0075] In other words, even if a groove is formed as described above, the scattering cutting fluid is less likely to collide with the front surface 70c of the main body 70 and fall. Therefore, when forming a groove as described above, even if the main body 70 is positioned rearward as viewed from the cutting blade 40, the amount of cutting fluid flowing into the groove does not increase excessively. As a result, by using the fluid supply nozzle 68, when forming a groove in the workpiece 11 while supplying cutting fluid to the processing point, it is possible to prevent cutting fluid from remaining in the groove.

[0076] It should be noted that the above content is one embodiment of the present invention, and the present invention is not limited to the above content. For example, the workpiece in the present invention is not limited to the workpiece 11, but may be a single wafer 13 or the like. That is, in the present invention, the workpiece 11 is not limited to a multi-layer including the wafer 13 and the dicing tape 17, etc., but may be a single layer such as the wafer 13.

[0077] Furthermore, the movement mechanisms provided in the cutting apparatus of the present invention are not limited to the X-direction movement mechanism, Y-direction movement mechanism 16, and Z-direction movement mechanism 24 provided in the recess 4a formed in the upper surface of the base 4. For example, the cutting apparatus of the present invention may be provided with an X-direction movement mechanism for moving the cutting unit 36 ​​in the X direction or the opposite direction, instead of or in addition to the X-direction movement mechanism. Similarly, the cutting apparatus of the present invention may be provided with a Y-direction movement mechanism for moving the multiple clamps 12 in the Y direction or the opposite direction and / or a Z-direction movement mechanism for moving the holding table 10 in the Z direction or the opposite direction, instead of or in addition to the Y-direction movement mechanism 16 and / or the Z-direction movement mechanism 24.

[0078] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0079] 2:Cutting device 4: Base (4a: recess) 6: Table cover 8: Dustproof and water-resistant cover 10: Holding table (10a: frame, 10b: porous plate) 11: Workpiece 12: Clamp 13: Wafer (13a: front surface, 13b: back surface) 14: Support structure (14a: standing part, 14b: arm part) 15: Device 16:Y direction movement mechanism 17: Dicing tape 18: Guide rail 19: Frame (19a: Opening) 20: Moving plate 22: Screw shaft 24:Z direction movement mechanism 26: Guide rail 28: Moving plate 30:Screw shaft 32: Motor 34: Housing 36: Cutting unit 38: Spindle (38a: opening, 38b: inner wall surface) 40: cutting blade (40a: opening) 42: Mounter 44: flange portion (44a: opening, 44b: contact surface) 46: Boss part (46a: outer wall surface) 48: Mounter fixing bolt (48a: outer wall surface) 50: flange (50a: opening) 52: Flange fixing nut (52a: opening, 52b: inner wall surface) 54: Blade cover 56: Cutting fluid supply nozzle 58: Connection part 60: Piping 62: Cutting fluid supply nozzle 64:Connection part 66: Piping 68: Fluid supply nozzle 70: Main body (70a: bottom surface, 70b: top surface) (70c:Front (70d:Bottom, 70e:Top)) (70f: Rear (70g: Upper, 70h: Lower)) 72:Through hole 74: flow path (74a: outlet, 74b: lower part) (74c: 1st middle part, 74d: 2nd middle part) (74e: Upper, 74f: Inlet) 76:Connection part 78: Piping

Claims

1. A nozzle for supplying a fluid to a groove so as to remove cutting fluid remaining in the groove when a groove is formed in a workpiece along a front-to-rear direction by moving the workpiece in a rearward direction as viewed from the cutting blade while supplying cutting fluid to a contact interface between the cutting blade and the workpiece in a state in which a rotating annular cutting blade is cut into the workpiece, the nozzle comprising: a main body having a rectangular ring shape in a front view and a flow path formed therein, the lower end of which serves as an outlet; The main body is a lower surface having the outlet located at its center when viewed from the front; a front surface having a portion extending obliquely upward and rearward from a front end of the lower surface in a side view.

2. The nozzle according to claim 1 , wherein the flow path includes a portion extending obliquely upward and forward from the outlet.

3. a holding table for holding a single-layer or multi-layer workpiece; a cutting unit located above the holding table, the cutting unit having a spindle extending in the left-right direction and having an annular cutting blade attached to the tip thereof for cutting the workpiece held on the holding table, and a cutting fluid supply nozzle for supplying cutting fluid to a contact interface between the cutting blade and the workpiece; a moving mechanism for relatively moving the holding table and the cutting unit along a front-rear direction, the cutting unit further includes a fluid supply nozzle for supplying fluid to the groove so as to remove the cutting fluid remaining in the groove when forming a groove along the front-to-rear direction in the workpiece by operating the moving mechanism to move the workpiece in a rearward direction as viewed from the cutting blade while supplying the cutting fluid from the cutting fluid supply nozzle to the contact interface between the cutting blade and the workpiece in a state in which the cutting blade, which rotates together with the spindle, is caused to cut into the workpiece held on the holding table; the fluid supply nozzle is located in the rear direction as viewed from the cutting blade, has a square ring shape as viewed from the front, and has a main body formed therein with a flow path whose lower end serves as an outlet; The main body is a lower surface having the outlet located at its center when viewed from the front; a front surface having a portion extending diagonally upward and rearward from a front end of the lower surface in a side view.

4. The cutting device according to claim 3 , wherein the flow path includes a portion extending obliquely upward and forward from the outlet.

5. A method for processing a workpiece by forming a groove along a front-to-rear direction in a single-layer or multi-layer workpiece, a positioning step of positioning a lower end of an annular cutting blade located rearward as viewed from the workpiece between an upper surface and a lower surface of the workpiece; a processing step of, after the positioning step, moving the workpiece in the rear direction as viewed from the cutting blade while rotating the cutting blade, thereby forming a groove in the workpiece along the front-to-rear direction, In the machining step, cutting fluid is supplied to the contact interface between the cutting blade and the workpiece, and fluid is supplied to the groove so as to remove the cutting fluid remaining in the groove.

6. 6. The method for processing a workpiece according to claim 5, wherein the fluid flowing obliquely downward and rearward is supplied to the groove.

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