Device interface

Abstract

SOLUTION: There is provided a device interface for an image sensor, comprising: an aperture in which a test component for the image sensor is disposed; and connectors arranged around the aperture. Therein: the connectors can be changed between a loading state of being arranged around the test component disposed in the aperture, and a retreat state of being arranged separated farther away from the test component than in the loading state; the test component may include a light source part for irradiating the image sensor with test light; and the device interface may further comprise connector blocks which surround the aperture and to which the connectors are fixed, and support blocks surrounding the aperture to support the connector blocks.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to device interfaces. [Background technology]

[0002] Patent Document 1 describes an image sensor tester that "takes in image signals output from terminals in contact with the image sensor under test, processes the images, and determines whether the sensor is good or bad" (Claim 1 of Patent Document 1). [Prior art document] [Patent documents] [Patent Document 1] Japanese Patent Application Laid-Open No. 4-3686 Summary of the Invention

[0003] In a first aspect of the present invention, a device interface for an image sensor is provided, which comprises an opening in which a test component for the image sensor is placed, and a connector arranged around the opening, and the connector is changeable between a mounted state in which it is arranged around the test component placed in the opening, and a retracted state in which it is arranged further away from the test component than the mounted state.

[0004] In the above device interface, the test component may have a light source unit that irradiates the image sensor with test light.

[0005] Any of the above device interfaces may further include a connector block that surrounds the opening and to which the connector is fixed, and a support block that surrounds the opening and supports the connector block.

[0006] In the above-described device interface, the connector block may be arranged around the test component placed in the opening in the mounted state, and may be arranged further away from the test component in the retracted state than in the mounted state.

[0007] In any of the above device interfaces, the connector block may be divisible, and in the mounted state, the connector block may be arranged around the test component placed in the opening, and in the retracted state, the connector block may be divided and arranged further away from the test component than in the mounted state.

[0008] In any of the above device interfaces, the connector block and the support block may be ring-shaped and surround the opening.

[0009] In any of the above device interfaces, the connector block may have a positioning protrusion on a contact surface supported by the support block, and the support block may have a positioning hole into which the positioning protrusion of the connector block is inserted in the mounted state.

[0010] In any of the above device interfaces, the connector may have a plurality of inner connectors arranged around the opening and fixed to the inner periphery of the connector block, and a plurality of outer periphery connectors arranged at a position away from the plurality of inner connectors relative to the opening and fixed to the outer periphery of the connector block.

[0011] In the above device interface, the support block may have a recess at a position corresponding to the inner periphery of the connector block, and the inner periphery of the connector block may have a protrusion that is inserted into the recess of the support block.

[0012] Any of the above device interfaces may further include a removable protective cover around the opening to protect the connector.

[0013] The above summary of the invention does not list all of the necessary features of the present invention, and subcombinations of these features may also constitute inventions. [Brief explanation of the drawings]

[0014] [Figure 1] 1 shows the configuration of a test device 10 according to this embodiment. [Figure 2] 1 shows the configuration of a capture module 200 and an image processing device 194 according to this embodiment. [Figure 3] 1 shows a test flow of the test device 10 according to the present embodiment. [Figure 4] 4 shows a schematic top view of a device interface 400 for an image sensor according to an embodiment. [Figure 5] 10 is a schematic perspective view showing an example of a retracted state of the device interface 400 according to the present embodiment. FIG. [Figure 6] In this embodiment, a schematic perspective view of the test component 405 being mounted on the test head 150 is shown. [Figure 7] 1 is a schematic cross-sectional view partially illustrating the device interface 400 in the present embodiment when the connector 430 is in a mounted state. [Figure 8] 1 is a schematic cross-sectional view partially illustrating the device interface 400 in the present embodiment when the connector 430 is in a retracted state. [Figure 9] An example in which a protective cover 700 is used in the device interface 400 of the embodiment is shown. [Figure 10] 1 is a perspective view showing a light-blocking component 800 used in the device interface 400 of the present embodiment. [Figure 11] 10 is a top view showing an example in which a light-shielding component 800 is arranged in the device interface 400 of the present embodiment. FIG. [Figure 12] FIG. 10 is a perspective view showing an air tube 830 and a water-absorbing member 850 used in the device interface 400 of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0016] 1 shows the configuration of a test apparatus 10 according to this embodiment, together with a device under test 20. The device under test 20 includes one or more devices, each of which has a circuit to be tested by the test apparatus 10, formed therein, as a device under test (DUT). The DUT according to this embodiment is a photoelectric conversion device that detects light and converts it into an electrical signal. The DUT may be an imaging device such as a CMOS image sensor or other image sensor that converts an incident optical image into image data.

[0017] The device under test 20 may be a wafer on which a circuit is formed, each IC / LSI chip circuit formed on the wafer, an IC / LSI chip obtained by dividing the wafer, or an IC / LSI package in which IC / LSI chips are packaged. In the example shown in the figure, the test apparatus 10 mounts the device under test 20, which is a wafer on which multiple imaging devices are formed, and tests each imaging device. The test apparatus 10 may test each imaging device one by one, or may test two or more imaging devices simultaneously.

[0018] The test apparatus 10 performs an optical input test on the DUT. Alternatively, or in addition, the test apparatus 10 may perform an electrical test on the DUT. In this embodiment, an example will be described in which the test apparatus 10 performs an imaging test on the DUT, which is an imaging device.

[0019] The test apparatus 10 includes a prober apparatus 100, a test head 150, a rotation device 180, and a main frame 190. The prober apparatus 100 includes a stage 102, a probe card 104, and a connection unit 120.

[0020] The stage 102 places the DUT 20 on it. The stage 102 may have a vacuum chuck, an electrostatic chuck, or the like on its upper surface to fix the DUT 20 in place.

[0021] The probe card 104 is provided above the stage 102. The probe card 104 includes one or more probes 106 and a light-shielding unit 108. The one or more probes 106 are provided on the surface of the probe card 104 facing the stage 102, and are connected to respective electrodes of the DUT to be tested on the device under test 20. The probe card 104 includes one or more connectors connected to a connection unit 120 on the surface opposite the stage 102, and each probe 106 is electrically connected to a performance board 130 on the test head 150 side via the corresponding connector and connection unit 120.

[0022] The light blocking unit 108 is disposed in an opening provided in the probe card 104. The light blocking unit 108 has an opening that passes test light to be irradiated onto the DUT, and blocks stray light.

[0023] The connection unit 120 is provided above the probe card 104. The connection unit 120 has an opening that allows the test light to pass through. The connection unit 120 electrically connects one or more connectors of the probe card 104 to the performance board 130 of the test head 150. The probe card 104 and connection unit 120 described above may be interchangeable depending on the type of device under test 20 or DUT, etc.

[0024] The test head 150 tests a DUT on a device under test 20 placed on a stage 102 of the prober apparatus 100. The test head 150 includes a performance board 130, a HiFix 140, one or more test modules 160a-d (also referred to as "test modules 160"), a light source 170, and a lens barrel 175.

[0025] The performance board 130 and the HiFix 140 are provided on the surface of the test head 150 facing the connection unit 120. The performance board 130 and the HiFix 140 have openings that allow test light to pass through. The performance board 130 and the HiFix 140 electrically connect the connection unit 120 and each test module 160, thereby electrically connecting the terminals of each test module 160 to corresponding electrodes of the DUT via the connection unit 120, the probe card 104, and each probe 106. The performance board 130 includes one or more connectors connected to the connection unit 120 and one or more connectors on the HiFix 140 side. The HiFix 140 accommodates cables and the like that connect each of the multiple terminals of the connectors on the HiFix 140 side of the performance board 130 to the terminals of the corresponding test modules 160.

[0026] Each of the one or more test modules 160 is inserted into a slot in the test head 150 and removably connected to the backplane (upper side in the figure) of the test head 150. The test modules 160 may also be referred to as "pin electronics cards" or "tester boards." Each test module 160 is electrically connected to a DUT on the device under test 20 via a HIFIX 140 and a performance board 130 mounted on the test head 150, and a connection unit 120 and a probe card 104 mounted on the prober device 100, or other connection devices. The one or more test modules 160 input and output signals to and from the DUT, and test the DUT by inspecting signals input from the DUT.

[0027] At least one test module 160 exchanges signals with the DUT, which is an imaging device, via electrical signal lines to configure the DUT and capture the image of the test light. At least one test module 160 receives image data of an image captured by the DUT from the DUT and supplies the image data to an image processing device 194 in the mainframe 190. In addition, at least one test module 160 may function as a power supply that supplies power to the DUT.

[0028] The light source 170 is disposed on the surface of the test head 150 opposite to the surface on which the performance board 130 and the HiFix 140 are placed. The light source 170 emits test light to irradiate the DUT. The lens barrel 175 is provided in the range from the light source 170 to the performance board 130, and guides the test light from the light source 170 to the opening of the performance board 130.

[0029] The rotation device 180 holds the test head 150 rotatably around a rotation axis. When testing a DUT, the rotation device 180 rotates the test head 150 to a test position where the performance board 130 of the test head 150 is electrically connected to the connection unit 120 of the prober device 100, as shown in the figure. Furthermore, when installing or replacing the performance board 130 and the HiFix 140, or inserting or removing a test module 160, the rotation device 180 rotates the test head 150 to a maintenance position where the surface of the test head 150 on which the performance board 130 and the HiFix 140 are placed faces upward.

[0030] The mainframe 190 is connected to the prober apparatus 100 and the test head 150. The mainframe 190 has a system controller 192 and an image processing device 194. The system controller 192 is connected to the prober apparatus 100, the test head 150, and the image processing device 194, and controls the testing of the DUT. In response to receiving a signal from the prober apparatus 100 indicating that the DUT of the device under test 20 has been contacted with one or more probes 106, the system controller 192 controls each part of the test head 150, including one or more test modules 160, to test the DUT.

[0031] The system controller 192 may be a personal computer (PC), workstation, server computer, general-purpose computer, or other computer, or may be a computer system in which multiple computers are connected. Such a computer system is also considered a computer in the broad sense. The system controller 192 may also be implemented by one or more virtual computer environments executable within a computer. Alternatively, the system controller 192 may be a dedicated computer designed for test control, or may be dedicated hardware implemented using dedicated circuitry.

[0032] The image processing device 194 is connected to the system controller 192 and the test head 150. The image processing device 194 receives, from the test module 160 in the test head 150, image data of an image captured by the DUT capturing test light, or image data of an image captured when the DUT is not receiving light. The image processing device 194 processes the received image data to determine whether the captured image meets the image quality standards of the imaging device as the DUT. Note that the image processing device 194 may be connected to one test head 150 as shown in this figure, or may be connected to multiple test heads 150. When the image processing device 194 is connected to multiple test heads 150, the image processing device 194 receives image data from each DUT being tested in the multiple test heads 150 and inspects the image data.

[0033] The image processing device 194 may be a PC (personal computer), a workstation, a server computer, a general-purpose computer, or any other computer, or may be a computer system in which multiple computers are connected. Such a computer system is also considered a computer in a broad sense. The image processing device 194 may also be implemented as one or more virtual computer environments executable within a computer. Alternatively, the image processing device 194 may be a dedicated computer designed for image processing, or may be dedicated hardware realized by dedicated circuitry.

[0034] 2 shows the configuration of a capture module 200 and an image processing device 194 according to this embodiment. Of the multiple test modules 160 shown in FIG. 1, the capture module 200 functions as a test module 160 (e.g., test module 160c) that captures image data of an image captured by the DUT from the DUT. The test head 150 may be equipped with one or more capture modules 200. Here, the image data of the captured image includes multiple data elements with a predetermined bit width, and is therefore also referred to as an "image data string" or simply a "data string."

[0035] The capture module 200 includes one or more capture blocks 210 (in the example of this figure, "capture blocks 210-1 to 210-4"), one or more signal transmitters 250 (in the example of this figure, "signal transmitters 250-1 to 2"), and a module IF (module interface) 255.

[0036] Each capture block 210 is provided corresponding to one or more DUTs to be tested. The capture block 210 is electrically connected to the DUT to be tested and captures image data streams from the DUT. The capture block 210 includes an image data receiving section 220, a capture unit 230, and one or more memory banks 240a-c (also referred to as "memory banks 240").

[0037] The image data receiving unit 220 is electrically connected to the DUT under test. The image data receiving unit 220 receives a data stream from the DUT. The image data receiving unit 220 may receive multiple data streams, each containing image data captured by the DUT. The image data receiving unit 220 has an image input interface that matches an image output interface implemented in the DUT under test. The image data receiving unit 220 may be a PHY chip or PHY board that complies with a physical layer (PHY) standard such as MIPI (Mobile Industry Processor Interface, registered trademark). In this case, the image data receiving unit 220 can receive an image data stream from a DUT that has an interface that complies with such a PHY standard.

[0038] The capture unit 230 is connected to the image data receiving section 220 and one or more memory banks 240. The capture unit 230 receives a data stream from the image data receiving section 220 and temporarily stores it in one or more memory banks 240. In response to a request from the image processing device 194, the capture unit 230 transmits the data stream stored in the one or more memory banks 240 to the image processing device 194.

[0039] The capture unit 230 may sequentially receive multiple data sequences corresponding to multiple captured images captured by the DUT under the same or different test light. The capture unit 230 may generate a data sequence by aggregating the multiple data sequences through calculations and transmit the resulting data sequence to the image processing device 194 as the data sequence to be inspected. For example, the capture unit 230 may generate the data sequence to be inspected by calculating the sum, average, maximum value, minimum value, or other statistical quantity for each corresponding pixel of the data sequences of the multiple captured images, or by performing a pre-specified filter process on the data sequences of the multiple captured images. The capture unit 230 may temporarily store intermediate data sequences in one or more memory banks 240 while calculating the data sequence to be inspected from the image data sequences of the multiple captured images.

[0040] One or more memory banks 240 are connected to the capture unit 230. Each memory bank 240 may be a memory device or a memory module such as a dynamic random access memory (DRAM) or a static random access memory (SRAM). Each memory bank 240 may be composed of two or more memory devices or memory modules.

[0041] One or more signal transmitters 250 are connected to one or more capture blocks 210. Each signal transmitter 250 may be connected to all capture blocks 210 in the capture module 200, may be connected to two or more capture blocks 210 in the capture module 200, or may be connected to one capture block 210. In the example shown in the figure, the capture module 200 has four capture blocks 210 and two signal transmitters 250, and each signal transmitter 250 is connected to the four capture blocks 210.

[0042] The signal transmitter 250 is connected to a signal transmitter 290 in the oppositely connected image processing device 194 via a communication cable, and transmits and receives signals such as electrical signals or optical signals to and from the signal transmitter 290. As an example, the signal transmitter 250 may be an optical transceiver conforming to the QSFP (Quad Small Form-factor Pluggable) standard or the like. When the signal transmitter 250 is an optical transceiver conforming to the QSFP standard, the signal transmitter 250 is connected to the opposite signal transmitter 290 via a four-lane optical fiber.

[0043] The module IF 255 is connected to each capture block 210 and other circuits in the capture module 200, and to the system controller 192. The module IF 255 relays access from the system controller 192 to each circuit in the capture module 200, thereby enabling the system controller 192 to control each circuit in the capture module 200.

[0044] The image processing device 194 includes an image processing engine 270 and one or more CAPIFs 280-1 to 280-8 (also referred to as "CAPIF 280"). The image processing engine 270 inspects the image data stream of each DUT received from the capture module 200. The image processing engine 270 may be a computer main body including a CPU, memory, and input / output devices, and may also include an external storage device as needed. The image processing engine 270 may be equipped with one or more image processing accelerators, such as a graphics processing unit (GPU), to speed up image processing. The image processing engine 270 may be equipped with one or more image processing accelerators on a peripheral bus, such as PCI Express (registered trademark). Alternatively, the image processing engine 270 may be a dedicated computer or dedicated circuit designed specifically for image processing of the test apparatus 10.

[0045] The CAPIF (capture interface) 280 is an interface device for communicatively connecting the image processing engine 270 to the capture block 210 in the capture module 200. The CAPIF 280 may be mounted on a peripheral bus such as PCI Express (registered trademark) that the image processing engine 270 has. Each of one or more CAPIFs 280-1 to 280-8 includes one or more signal transmitters 290-1 to 290-8, and communicates with the capture unit 230 in the capture block 210 via the corresponding signal transmitter 290 and the signal transmitter 250 connected opposite to the signal transmitter 290.

[0046] 1 and 2 are merely examples. The test apparatus 10 may have a structure suited to the test method (wafer test, chip test, IC / LSI test, etc.), the type of test (functional test, parametric test, etc.), and the scale of the test. For example, instead of being located within the mainframe 190, the image processing device 194 may be installed in a location remote from the main body of the test apparatus 10 and connected to the main body of the test apparatus 10 via a communications network. The image processing device 194 may be realized by a cloud server capable of communicating with the main body of the test apparatus 10 via the Internet.

[0047] FIG. 3 shows a test flow of the test apparatus 10 according to this embodiment. In step 300 (S300), the test apparatus 10 is configured according to the DUT. Specifically, the rotation device 180 rotates the test head 150 to the maintenance position. The test head 150 is equipped with a light source 170 corresponding to the DUT. Various test modules 160 selected according to the type and number of DUTs are inserted into the test head 150 from the top side in the maintenance position. In addition, a HiFix 140 and a performance board 130 corresponding to the DUT are placed and fixed on the top surface of the test head 150. A probe card 104 and a connection unit 120 corresponding to the DUT are placed on the prober apparatus 100. Once the configuration of the test apparatus 10 is complete, the rotation device 180 rotates the test head 150 to the test position.

[0048] In S310, the prober apparatus 100 connects one or more DUTs to be tested among the DUTs formed on the device under test 20 to the probe card 104 of the test apparatus 10. Specifically, the prober apparatus 100 transports the device under test 20 and places it on the stage 102. The prober apparatus 100 moves the stage 102 in the horizontal direction (also referred to as the "XY direction") to align the DUT to be tested on the device under test 20 with the probe card 104, and then moves the stage 102 upward in the vertical direction (also referred to as the "Z direction") to electrically connect each electrode of the DUT to be tested with each probe 106 of the probe card 104.

[0049] In S320, the light source 170 emits test light under the control of the system controller 192. The test light passes through the lens barrel 175, the HiFix 140, the performance board 130, the connection unit 120, and the probe card 104. In this way, the test apparatus 10 irradiates the test light onto the DUT.

[0050] In S330, the test module 160 used to control the DUT instructs the DUT to set up for imaging and capture the image of the test light under the control of the system controller 192. As a result, the DUT captures an image of the test light.

[0051] In S340, the test module 160 used to control the DUT outputs a data string of captured images from the DUT under the control of the system controller 192. The capture block 210 in the capture module 200 receives and captures the data string of the captured images. When testing a plurality of captured images in a consolidated manner, the test apparatus 10 repeats the processes from S320 to S340 while changing at least one of the light intensity, color, or light emission pattern of the test light as necessary. The capture block 210 in the capture module 200 sequentially receives and consolidates the data strings of each captured image.

[0052] In S350, the image processing device 194 receives the image data sequence captured by the capture module 200 and tests the DUT by inspecting the captured image data sequence or the aggregated result data sequence. Specifically, the image processing device 194 performs image processing on the captured data sequence or the result data sequence according to an algorithm predetermined by a test program or the like, thereby determining whether the captured image satisfies an image quality standard. Note that the test apparatus 10 may also perform an electrical test on the DUT in addition to the optical input test on the DUT.

[0053] In S360, the test apparatus 10 determines whether the test of the DUT under test has been completed. If the test of the DUT has not been completed (NO in S360), the test apparatus 10 proceeds to S320 and performs the test process from S320 to S350 for the next test item. If the test of the DUT has been completed (YES in S360), the test apparatus 10 proceeds to S370.

[0054] In S370, the test apparatus 10 determines whether testing of all DUTs of the device under test 20 has been completed. If testing of all DUTs has not been completed (NO in S370), the test apparatus 10 proceeds to S310 and performs the test processing from S310 to S360. If testing of all DUTs has been completed (YES in S370), the test apparatus 10 ends the test processing of the device under test 20. Note that the prober apparatus 100 may remove the device under test 20 that has been tested and place the next device under test 20 on the stage 102. In response to this, the test apparatus 10 may perform the test processing shown in this figure for the next device under test 20.

[0055] FIG. 4 is a schematic top view of a device interface 400 for an image sensor according to this embodiment. The device interface 400 can be used in the test apparatus 10 of FIG. 1 according to this embodiment and is mounted on the test head 150. The device interface 400 may include at least the performance board 130 and the HIFIX 140 shown in FIG. 1. The device interface 400 electrically connects terminals of each test module 160 to corresponding electrodes of the DUT in the test apparatus 10. FIG. 4 shows the device interface 400 in a mounted state, fixed to the test head 150 in the maintenance position. After being set in the mounted state in the maintenance position, the device interface 400 is moved to the test position by the rotation device 180. Here, the mounted state indicates a state in which the connector 430 of the device interface 400 is positioned so that it can be tested.

[0056] The device interface 400 includes an opening 410, a connector block 420, one or more connectors 430, and a top plate 440. A test component 405 for an image sensor is disposed in the opening 410. In this embodiment, the test component 405 may include a light source 170 and a lens barrel 175 that irradiate the image sensor with test light. Hereinafter, at least one of the light source 170 and the lens barrel 175 will also be referred to as the test component 405. The opening 410 penetrates in the vertical direction (Z direction) and may have a shape that can accommodate the test component 405. For example, the opening 410 may have a circular or rectangular shape in a top view. The opening 410 allows the test light from the light source 170 to pass through so that the test light is irradiated onto the DUT.

[0057] The connector block 420 surrounds the opening 410, and one or more connectors 430 are fixed to the connector block 420. The connector block 420 may have a ring shape surrounding the opening 410 in the mounted state shown in FIG. 4 . The connector block 420 may be arranged around the test component 405 placed in the opening 410 in the mounted state. The connector block 420 has, in a top view, a ring-shaped outer peripheral portion 420a formed around the opening 410 and multiple inner peripheral portions 420b formed protruding from a portion of the outer peripheral portion 420a toward the center of the opening 410. Here, the opening 410 may be an area inside the outer peripheral portion 420a or the inner peripheral portion 420b of the connector block 420 in a top view. The connector block 420 may be formed of at least one of metal and resin. Note that a top view refers to a state in which the device interface 400 in the maintenance position is viewed vertically (in the Z direction) from above, and the same applies hereinafter.

[0058] The one or more connectors 430 are electrically connected to the connection unit 120 in a mounted state at the test position. The one or more connectors 430 are arranged around the opening 410. The one or more connectors 430 can be changed between a mounted state in which they are arranged around the test component 405 arranged in the opening 410 and a retracted state in which they are arranged further away from the test component 405 than in the mounted state. FIG. 4 shows the device interface 400 when the connectors 430 are in the mounted state. Each of the one or more connectors 430 has a rectangular shape in a top view, and may be arranged such that the longitudinal axis in the mounted state is radial from the center position of the opening 410 (or the center position of the top surface of the test head 150). This embodiment shows an example in which multiple connectors 430 are arranged. The multiple connectors 430 may be arranged in one row or multiple rows surrounding the opening 410 in a top view. FIG. 4 shows an example in which the multiple connectors 430 are arranged in two rows surrounding the opening 410 in a top view.

[0059] The multiple connectors 430 include multiple inner peripheral connectors 430b and multiple outer peripheral connectors 430a. The multiple inner peripheral connectors 430b may be arranged around the opening 410 and fixed to the upper surface of the inner peripheral portion 420b of the connector block 420. A plurality of inner peripheral connectors 430b are arranged on each of the multiple inner peripheral portions 420b (eight inner peripheral portions 420b in FIG. 4 ) of the connector block 420. The multiple inner peripheral connectors 430b are connectors 430 for high-speed transmission. The inner peripheral connectors 430b are arranged close to the test components 405 arranged in the opening 410, and the wiring distance from the DUT is shorter than that of the outer peripheral connectors 430a, enabling higher-speed signal transmission.

[0060] The plurality of outer circumferential connectors 430a may be arranged at positions farther away from the opening 410 than the plurality of inner circumferential connectors 430b, and may be fixed to the upper surface of the outer circumferential part 420a of the connector block 420. The plurality of outer circumferential connectors 430a may be arranged at positions farther away from the test component 405 arranged in the opening 410 than the inner circumferential connectors 430b, and the number of outer circumferential connectors 430a may be greater than the number of inner circumferential connectors 430b.

[0061] The connector block 420 and the connector 430 may form the performance board 130.

[0062] The top plate 440 may have an opening 450 in a central region in a top view to expose the connector 430 and the test component 405. The opening 450 is, for example, circular in a top view. The top plate 440 covers and protects the region outside the connector 430 (the peripheral connector 430a in FIG. 4) on the top surface of the test head 150. The top plate 440 is, for example, octagonal in a top view. When mounted, the top plate 440 may be fixed to the top surface of the test head 150 with screws or the like. The top plate 440 may be made of at least one of metal and resin.

[0063] 5 is a schematic perspective view showing an example of a retracted state of the device interface 400 according to this embodiment. FIG. 5 shows an example of the device interface 400 in a retracted state of the connector 430. Here, the retracted state indicates a state in which the connector 430 is positioned further away from the center position of the test component 405 or the opening 410 than in the mounted state, and is an arrangement for mounting the test component 405 on the test head 150. In the device interface 400, after the top plate 440 is removed and the connector 430 is changed to the retracted state, the test component 405 is inserted into the opening 410 and fixed to the test head 150, and the connector 430 is changed to the mounted state.

[0064] The device interface 400 further includes a support block 500. The support block 500 surrounds the opening 410 and supports the connector block 420 in the mounted state. The support block 500 may have a shape corresponding to the connector block 420, for example, a ring shape surrounding the opening 410. The support block 500 may have a recess 510 at a position corresponding to the inner periphery 420b of the connector block 420. The support block 500 has a ring-shaped inner wall 520 surrounding the opening 410 in a top view, and may support the connector block 420 at the upper end of the inner wall 520 in the mounted state. The inner wall 520 of the support block 500 may have a recess 510 recessed in the Z direction below the inner periphery 420b of the connector block 420. The support block 500 may have multiple recesses 510 at positions corresponding to the multiple inner peripheries 420b of the connector block 420, respectively. 5, the support block 500 may have eight recesses 510 at positions corresponding to the eight inner peripheral portions 420b of the connector block 420. The support block 500 is fixed to the test head 150 in the mounted state and the retracted state. In the mounted state, the support block 500 is in contact with the connector block 420 and removably fixed thereto. Here, the openings 410 may be an area inside the inner wall portions 520 of the support block 500 in a top view.

[0065] The support block 500 may constitute the HiFix 140.

[0066] In the retracted state, the connector block 420 may be positioned further away from the test component 405 than in the mounted state. The connector block 420 may be changed to the retracted state by being positioned further away from the mounted state in a radial direction from the center position of the opening 410 (or the test component 405) in a top view. The connector block 420 may be changed to the retracted state manually or mechanically (via a motor, etc.).

[0067] The connector block 420 may be separable at multiple locations. In the retracted state, the connector block 420 may be separated and positioned farther from the test component 405 than in the mounted state. In the embodiment of FIG. 5, the connector block 420 is equally divided into four parts when viewed from above. However, this is not limited thereto, and the connector block 420 may be divided into two, three, five or more parts. Furthermore, the connector block 420 does not have to be separable, and may be changeable between the retracted state and the mounted state by expanding or contracting at least one portion in the horizontal direction (X and Y directions). For example, the connector block 420 may be changed to the retracted state by expanding in the X and Y directions at multiple locations, and may be changed to the mounted state by contracting in the X and Y directions at multiple locations.

[0068] The inner periphery 420b of the connector block 420 may have a protrusion 530 that is inserted into the recess 510 of the support block 500. The connector block 420 has an inner wall 525 that extends downward from the lower surface of the inner periphery 420b (for example, the lower surface at the boundary between the inner periphery 420b and the outer periphery 420a) so as to surround at least a portion of the opening 410 along the arranged multiple connectors 430. The inner periphery 420b of the connector block 420 is disposed closer to the center of the opening 410 than the inner wall 525 in a top view. The inner wall 525 of the connector block 420 may be formed at a position that corresponds to the inner wall 520 of the support block 500 in the mounted state, and may be supported by contacting the inner wall 520 of the support block 500. The connector block 420 may have a protrusion 530 formed by at least a part of the inner wall portion 525 at the position where the inner periphery 420b is formed protruding downward in the Z direction. The protrusion 530 of the connector block 420 is inserted into and supported by the recess 510 of the support block 500 in the mounted state.

[0069] The connector 430 is fixed to the connector block 420, and is set to the retracted state by setting the connector block 420 to the retracted state. When the connector block 420 is set to the retracted state, the connector 430 may be set to the retracted state by being positioned away from the mounted state in a radial direction from the center position of the opening 410 (or the test component 405) in a top view.

[0070] FIG. 6 is a perspective view showing the mounting of a test component 405 on the test head 150 in this embodiment. The lens barrel 175, which is the test component 405, is inserted into the opening 410 from above after the connector 430 has been changed to a retracted state. FIG. 6 shows the lens barrel 175 during insertion. The lens barrel 175 may be fixed to the test head 150 when its upper end is inserted in the Z direction to a position substantially flush with or below the connector 430. After the lens barrel 175 is fixed, the connector 430 is changed to a mounted state, and then the top plate 440 is fixed.

[0071] FIG. 7 is a schematic cross-sectional view partially illustrating the device interface 400 when the connector 430 is in a mounted state in this embodiment. The connector block 420 may have one or more positioning protrusions 600 on a contact surface supported by the support block 500. The positioning protrusions 600 may protrude from the contact surface of the connector block 420 that contacts the support block 500 in a mounted state. The positioning protrusions 600 may be formed to protrude from the lower surface of the outer periphery 420a of the connector block 420. The multiple positioning protrusions 600 may be arranged along the outer periphery 420a of the connector block 420 to surround the opening 410. The positioning protrusions 600 may be arranged in multiple rows (two rows in the example of FIG. 7).

[0072] The support block 500 may have one or more positioning holes 610 into which the positioning protrusions 600 of the connector block 420 are inserted in the mounted state. The support block 500 may have recessed positioning holes 610 on its top surface at positions corresponding to the positioning protrusions 600 of the connector block 420 in the mounted state. The support block 500 may have the same number of positioning holes 610 as the number of positioning protrusions 600. The device interface 400 according to this embodiment can determine the relative positions between the connector block 420 and the support block 500 in the mounted state by inserting the positioning protrusions 600 into the positioning holes 610.

[0073] The connector block 420 further includes an outer wall portion 620 and one or more first cable housing portions 630. The outer wall portion 620 extends downward from the lower surface of the outer periphery portion 420a. The outer wall portion 620 may be disposed so as to surround the opening 410 along the outer periphery portion 420a in a top view. The outer wall portion 620 may extend from the lower surface of the outer periphery portion 420a to the upper surface of the support block 500 and be supported by the support block 500.

[0074] One or more first cable housings 630 house cables 605 that connect each of the multiple terminals of the connector 430 to a corresponding terminal of the test module 160. The connector block 420 has an inner first cable housing 630b that houses and passes downward the cable 605b extending from below the inner connector 430b, and an outer first cable housing 630a that houses and passes downward the cable 605a extending from below the outer connector 430a. The first cable housing 630 has an opening that allows the cable 605 to pass downward. The inner first cable housing 630b is located closer to the center of the opening 410 than the convex portion 530 of the inner wall portion 525 of the connector block 420 in a top view, and allows the cable 605b to pass closer to the center of the opening 410 than the convex portion 530 of the inner wall portion 525 of the connector block 420. The first cable housing portion 630a on the outer periphery side may be a hollow portion between the inner wall portion 525 and the outer wall portion 620 of the connector block 420 and below the outer periphery portion 420a.

[0075] The support block 500 further has one or more second cable housings 640. The one or more second cable housings 640 house, below the first cable housing 630a on the outer periphery side, cables 605a that connect each of the multiple terminals of the outer periphery connector 430a to the corresponding terminals of the test module 160. The second cable housing 640 allows the cables 605a to pass downward.

[0076] FIG. 8 is a schematic cross-sectional view partially illustrating the device interface 400 when the connector 430 is in the retracted state in this embodiment. The connector block 420 is changed to the retracted state by removing the positioning protrusions 600 from the positioning holes 610 and positioning the connector block 420 away from the center of the opening 410 in a top view. As the connector 430 moves, the cable 605 connected to the connector 430 also moves. When the retracted state is changed, the cable 605b connected to the inner connector 430b may come close to the inner wall portion 520 of the support block 500. However, because the inner wall portion 520 of the support block 500 has the recess 510 at a position corresponding to the inner wall portion 420b of the connector block 420, the cable 605b connected to the inner connector 430b can be efficiently prevented from coming into contact with the inner wall portion 520 of the support block 500 and being damaged. In addition, the inner wall portion 525 of the connector block 420 has a protrusion 530 that is inserted into the recess 510 of the support block 500, thereby ensuring a sufficient contact area with the inner wall portion 520 of the support block 500 and ensuring reliable support by the support block 500.

[0077] FIG. 9 shows an example in which a protective cover 700 is used in the device interface 400 of this embodiment. The device interface 400 may further include the protective cover 700. The protective cover 700 is detachable around the opening 410 to protect the connector 430. The protective cover 700 may be attached to the connector block 420 to cover the connector 430 when switching between the mounted state and the retracted state. The protective cover 700 may be fixed to the connector block 420 during the retracted state and removed after the connector block 420 is in the mounted state. Multiple protective covers 700 may be fixed to the divided connector block 420, respectively. In the example of FIG. 9, four protective covers 700a, 700b, 700c, and 700d are fixed to the four-divided connector block 420, respectively.

[0078] FIG. 10 is a schematic perspective view showing a light-shielding component 800 used in the device interface 400 of this embodiment. The device interface 400 may further include the light-shielding component 800. FIG. 10 is a perspective view showing the light-shielding component 800 attached to the retracted state. The light-shielding component 800 may be disposed in the opening 410. The light-shielding component 800 may have an opening 810 that allows test light from the light source 170 to pass through and a light-shielding wall 820 that is disposed to surround the periphery of the opening 410. The light-shielding wall 820 blocks stray light from entering the inside of the support block 500, the connector block 420, or the like. The light-shielding wall 820 may have a shape that surrounds the test component 405. The opening 810 may have a shape that follows the outer shape of the test component 405 (e.g., the upper end of the lens barrel 175) in a top view. In FIG. 10, the opening 810 is rectangular in a top view, as an example.

[0079] FIG. 11 is a top view showing an example in which the light-blocking component 800 is arranged in the device interface 400 of this embodiment. FIG. 11 shows an example in which the light-blocking component 800 is arranged in the opening 410 in the retracted state. The light-blocking component 800 may be fixed to the support block 500, for example, so that its upper surface is positioned lower than the upper surface of the connector block 420. In the mounted state, the light-blocking component 800 may be fixed so that its upper surface is flush with the upper end of the test component 405 or so that its upper surface is positioned higher than the upper end of the test component 405. After the light-blocking component 800 is fixed as shown in FIG. 11 , the test component 405 may be inserted and arranged in the opening 810 of the light-blocking component 800, and then the connector 430 may be changed to the mounted state.

[0080] 12 is a perspective view showing the air tube 830 and the water-absorbing member 850 used in the device interface 400 of this embodiment. The device interface 400 may have one or more air tubes 830 and a water-absorbing member 850.

[0081] The air tube 830 may be arranged along the edge of the top plate 440. In the embodiment shown in FIG. 12, two air tubes 830 are arranged along one end and the other end of the top plate 440. The air tube 830 may be connected to an external air pump via a connector 840 such as a one-touch coupling. The air tube 830 may be connected to at least one of the opening 410, the interior of the support block 500, the interior of the connector block 420, or the opening of the light-blocking part 800. The air tube 830 supplies dry air from the external air pump to the inside of the device interface 400 (e.g., at least one of the opening 410, the interior of the support block 500, the interior of the connector block 420, or the opening of the light-blocking part 800) when the top plate 440 is placed on the device interface 400. This makes it possible to easily adjust the humidity inside the device interface 400.

[0082] The water-absorbing member 850 is fixed to the top plate 440 so as to surround the opening 450. The water-absorbing member 850 may be fixed to the edge of the top plate 440 surrounding the opening 450 with anti-detachment screws. One example of the water-absorbing member 850 is a sponge. The water-absorbing member 850 may supply moisture that is generated by condensation on the device interface 400. The water-absorbing member 850 may be divisible into multiple pieces (for example, four pieces in the embodiment shown in FIG. 12).

[0083] The device interface 400 according to this embodiment allows the connector 430 to be retracted, thereby facilitating the attachment of the test component 405 to the opening 410. As a result, the device interface 400 according to this embodiment allows for an increase in the size of the light source 170 to increase the number of simultaneous measurements, the number of pins, and the number of pixels per chip, and also allows for the addition of an inner peripheral connector 430b for high-speed transmission.

[0084] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0085] It should be noted that the execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order. [Explanation of symbols]

[0086] 10 Test equipment 20 Test Subject 100 prober device 102 Stages 104 Probe Card 106 Probe 108 Light blocking unit 120 connection unit 130 Performance Board 140 HiFix 150 test heads 160a~d Test Module 170 light source 175 Telescope 180 Rotating Device 190 Mainframe 192 System Controller 194 Image Processing Device 200 Capture Module 210-1~4 Capture Block 220 Image data receiving unit 230 Capture Unit 240a~c Memory Bank 250-1~2 Signal Transmitter 255 module IF 270 Image Processing Engine 280-1~8 CAPIF 290-1~8 Signal Transmitters 400 Device Interface 405 Test Parts 410 Opening 420 Connector Block 420a Outer periphery 420b Inner circumference 430 Connector 430a Peripheral Connector 430b inner connector 440 Top Plate 450 aperture 500 support blocks 510 recess 520 Inner wall 525 Inner wall 530 Convex 600 Positioning protrusion 605 Cable 610 Positioning hole 620 Exterior wall 630 First cable housing 640 Second cable housing 700 Protective Cover 800 Light-shielding parts 810 Aperture 820 Blackout Wall 830 Air Tube 840 Connection 850 Water-absorbing material

Claims

1. 1. A device interface for an image sensor, comprising: an opening in which a test part for the image sensor is placed; a connector disposed around the opening, The connector comprises: a mounting state disposed around the test component disposed in the opening; The mounted state can be changed to a retracted state in which the test component is placed away from the mounted state. Device interface.

2. The test component has a light source unit that irradiates the image sensor with test light. The device interface of claim 1 .

3. a connector block that surrounds the opening and to which the connector is fixed; a support block surrounding the opening and supporting the connector block. The device interface of claim 1 .

4. In the mounted state, the connector block is disposed around the test component disposed in the opening, and in the retracted state, the connector block is disposed farther away from the test component than in the mounted state. The device interface of claim 3 .

5. The connector block is separable; In the mounted state, the connector block is arranged around the test component placed in the opening, and in the retracted state, the connector block is divided and arranged further away from the test component than in the mounted state. The device interface of claim 3 .

6. The connector block and the support block are ring-shaped and surround the opening. The device interface of claim 3 .

7. the connector block has a positioning protrusion on a contact surface supported by the support block; The support block has a positioning hole into which the positioning protrusion of the connector block is inserted in the mounted state. The device interface of claim 3 .

8. The connector comprises: a plurality of inner peripheral connectors disposed around the opening and secured to an inner peripheral portion of the connector block; a plurality of outer peripheral connectors that are disposed at positions apart from the plurality of inner peripheral connectors with respect to the opening and are fixed to an outer peripheral portion of the connector block; The device interface of claim 3 .

9. the support block has a recess at a position corresponding to the inner periphery of the connector block; The inner periphery of the connector block has a protrusion that is inserted into the recess of the support block. The device interface of claim 8 .

10. A removable protective cover is further provided around the opening to protect the connector. The device interface of claim 1 .

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