Substrate processing device and substrate processing method

Abstract

To provide a technique of cleaning a lower surface of a substrate suitably after grinding an adsorption surface of a substrate holding part.SOLUTION: A substrate processing device thins a substrate by having a lower surface of a grind stone included in a grinding tool pressed against an upper surface of the substrate. A control circuit of the substrate processing device performs the following controls in this order: a control of holding the substrate adsorbed on an absorption surface with a transport arm, a control of raising the transport arm to a first height, a control of jetting a cleaning liquid from the adsorption surface to the upper side with the transport arm stopped at the first height, thereby cleaning a lower surface of the substrate with the cleaning liquid, and a control of delivering the substrate from the inside to the outside of a housing together with the transport arm. The control circuit performs a control of resetting the first height after the grinding of the adsorption surface so that the gap between the lower surface of the substrate and the adsorption surface at the cleaning of the lower surface of the substrate becomes the same before and after the grinding of the adsorption surface.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 performs the following controls: a control for holding a substrate adsorbed by a substrate adsorption section with a first transport section from the opposite side of the substrate adsorption section; a control for supplying liquid into the inside of the substrate adsorption section; a control for moving the first transport section a set distance to separate the substrate from the substrate adsorption section by a set distance; and a control for sucking any liquid remaining between the substrate adsorption section and the substrate into the inside of the substrate adsorption section while the substrate is separated by the set distance from the substrate adsorption section. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2024 / 009775 Summary of the Invention [Problem to be solved by the invention]

[0004] An embodiment of the present disclosure provides a technique for properly cleaning the underside of a substrate after grinding the suction surface of a substrate holder. [Means for solving the problem]

[0005] A substrate processing apparatus according to an embodiment of the present disclosure thins a substrate by pressing the lower surface of a grinding wheel constituting a grinding tool against the upper surface of the substrate. The substrate processing apparatus includes a substrate holding unit having an upper surface that holds the substrate by suction, a supply unit that supplies cleaning liquid into the substrate holding unit and sprays the cleaning liquid upward from the suction surface, a suction surface height measurement unit that measures the height of the suction surface, a transport unit having a transfer arm that holds the substrate from the side opposite the suction surface, a drive unit that drives the grinding tool, a housing that houses the substrate holding unit and the grinding tool, and a control circuit. The control circuit controls the transfer arm to hold the substrate held by the suction surface, raise the transfer arm to a first height, spray the cleaning liquid upward from the suction surface while the transfer arm is stopped at the first height, and transport the substrate together with the transfer arm from the inside of the housing to the outside, in this order. The control circuit performs control to reset the first height after grinding of the suction surface so that the distance between the underside of the substrate and the suction surface when cleaning the underside of the substrate is the same as the distance before and after grinding of the suction surface. [Effects of the Invention]

[0006] According to an embodiment of the present disclosure, after the suction surface of the substrate holder is ground, the lower surface of the substrate can be properly cleaned. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a side view showing the substrate processing apparatus shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view showing an example of a driving unit. [Figure 4] FIG. 4 is a diagram showing an example of a change in the height of the rotating part over time. [Figure 5] FIG. 5 is a flowchart showing a substrate processing method according to an embodiment. [Figure 6]FIG. 6(A) is a cross-sectional view showing an example of step S104, FIG. 6(B) is a cross-sectional view showing an example of step S106, FIG. 6(C) is a cross-sectional view showing an example of step S107, and FIG. 6(D) is a cross-sectional view showing an example of step S108. [Figure 7] FIG. 7 is a diagram showing an example of setting the first height and the second height. [Figure 8] FIG. 8 is a diagram showing an example of grinding the suction surface. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, identical or similar components are denoted by the same reference numerals, and descriptions thereof may be omitted. In each drawing, the X-axis, Y-axis, and Z-axis directions are perpendicular to each other, the X-axis and Y-axis directions are horizontal, and the Z-axis direction is vertical.

[0009] A substrate processing apparatus 1 according to one embodiment will be described with reference to Figures 1 and 2. As shown in Figure 2, the substrate processing apparatus 1 grinds the substrate W by pressing the lower surface of a grinding wheel T2 constituting a grinding tool T against the upper surface of the substrate W. In this specification, grinding includes polishing.

[0010] 1, the substrate processing apparatus 1 includes four substrate holding units 10A, 10B, 10C, and 10D and two driving units 20A and 20B. Each of the four substrate holding units 10A to 10D holds a substrate W. Each of the two driving units 20A and 20B rotates and raises and lowers a grinding tool T.

[0011] The substrate processing apparatus 1 includes a housing 2. The housing 2 houses four substrate holders 10A to 10D and two grinding tools T. The housing 2 has a loading / unloading opening 2a. A substrate W is loaded from the outside of the housing 2 into the inside thereof or unloaded from the inside of the housing 2 to the outside thereof through the loading / unloading opening 2a.

[0012] As shown in Fig. 2, the substrate processing apparatus 1 includes a nozzle 7. When the substrate W is transferred from the inside of the housing 2 to the outside through the transfer port 2a, the nozzle 7 generates an airflow that flows along the underside of the substrate W toward the inside of the housing 2. The airflow removes the cleaning liquid or grinding liquid adhering to the underside of the substrate W. This prevents the cleaning liquid or grinding liquid from being carried out of the housing 2 together with the substrate W.

[0013] As shown in Fig. 1, the substrate processing apparatus 1 includes a turntable 3. The turntable 3 is rotated around a rotation center line R1. Four substrate holders 10A-10D are provided at intervals around the rotation center line R1 of the turntable 3 and rotate together with the turntable 3. Furthermore, the four substrate holders 10A-10D are rotated independently around their respective rotation center lines R2 (see Fig. 2).

[0014] The two substrate holding units 10A, 10C are arranged symmetrically about the rotation center line R1 of the turntable 3. Each substrate holding unit 10A, 10C moves between a first load / unload position A3, where the transport unit 5 loads and unloads the substrate W, and a first grinding position A1, where the drive unit 20A grinds the substrate W with the grinding tool T. The two substrate holding units 10A, 10C move between the first load / unload position A3 and the first grinding position A1 every time the turntable 3 rotates 180°. At the first grinding position A1, a nozzle 6 (see FIG. 2) supplies a grinding fluid such as water to the upper surface of the substrate W when the substrate W is being ground.

[0015] The other two substrate holding units 10B, 10D are arranged symmetrically about the rotation center line R1 of the turntable 3. Each of the substrate holding units 10B, 10D moves between a second load / unload position A0, where the transport unit 5 loads and unloads the substrate W, and a second grinding position A2, where the drive unit 20B grinds the substrate W with the grinding tool T. The other two substrate holding units 10B, 10D move between the second load / unload position A0 and the second grinding position A2 every time the turntable 3 rotates 180°. At the second grinding position A2, a nozzle (not shown) supplies a grinding fluid such as water to the upper surface of the substrate W when the substrate W is ground.

[0016] When viewed from above, the first loading / unloading position A3, the second loading / unloading position A0, the first grinding position A1, and the second grinding position A2 are arranged in this order in a counterclockwise direction. In this case, when viewed from above, the substrate holding units 10A, 10B, 10C, and 10D are arranged in this order at 90° intervals in a counterclockwise direction.

[0017] The positions of the first loading / unloading position A3 and the second loading / unloading position A0 may be reversed, and the positions of the first grinding position A1 and the second grinding position A2 may also be reversed. That is, when viewed from above, the first loading / unloading position A3, the second loading / unloading position A0, the first grinding position A1, and the second grinding position A2 may be arranged in this order clockwise. In this case, when viewed from above, the substrate holding units 10A, 10B, 10C, and 10D are arranged in this order clockwise at 90° intervals.

[0018] However, the number of substrate holders is not limited to four, and the number of drive units is not limited to two. Also, the turntable 3 may be omitted. Instead of the turntable 3, a slide table may be provided.

[0019] The substrate processing apparatus 1 includes a transfer unit 5. The transfer unit 5 includes a transfer arm 5a that holds the substrate W. The transfer arm 5a includes, for example, a suction pad 5a1. The transfer arm 5a is capable of moving horizontally (in both the X-axis direction and the Y-axis direction) and vertically, and of rotating about a vertical axis. The substrate processing apparatus 1 may also include an inverting unit (not shown) that inverts the substrate W.

[0020] The control circuit 90 is, for example, a computer. The control circuit 90 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the substrate processing apparatus 1. The control circuit 90 controls the operation of the substrate processing apparatus 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0021] The control circuit 90 includes electronic circuits such as a CPU, an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in memory or by being a circuit designed for a specific application.

[0022] 1 and 2 will be described. The following operation is performed under the control of the control circuit 90. First, the transport unit 5 transports the substrate W to a substrate holding unit (e.g., substrate holding unit 10C) located at the first load / unload position A3. The substrate holding unit 10C holds the substrate W with the first main surface of the substrate W facing upward. Thereafter, the turntable 3 is rotated 180°, and the substrate holding unit 10C is moved from the first load / unload position A3 to the first grinding position A1.

[0023] Next, the drive unit 20A drives the grinding tool T to grind the first main surface of the substrate W. Thereafter, the turntable 3 is rotated 180°, and the substrate holding unit 10C is moved from the first grinding position A1 to the first carry-in / out position A3. Next, the transport unit 5 receives the substrate W from the substrate holding unit 10C located at the first carry-in / out position A3, and removes it from inside the housing 2 to the outside. Thereafter, the inversion unit inverts the substrate W upside down.

[0024] Next, the transport unit 5 transports the substrate W to a substrate holding unit (e.g., substrate holding unit 10D) located at the second load / unload position A0. The substrate holding unit 10D holds the substrate W with the second main surface of the substrate W facing upward. The second main surface faces opposite the first main surface. Thereafter, the turntable 3 is rotated 180°, and the substrate holding unit 10D is moved from the second load / unload position A0 to the second grinding position A2.

[0025] Next, the drive unit 20B drives the grinding tool T to grind the second main surface of the substrate W. Thereafter, the turntable 3 is rotated 180 degrees, and the substrate holding unit 10D is moved from the second grinding position A2 to the second carry-in / out position A0. The transport unit 5 then receives the substrate W from the substrate holding unit 10D located at the second carry-in / out position A0, and transports it from inside the housing 2 to the outside.

[0026] Here, the operation of the substrate processing apparatus 1 has been described with a focus on one substrate W. The substrate processing apparatus 1 may simultaneously perform multiple processes at multiple positions to improve throughput. For example, the substrate processing apparatus 1 simultaneously grinds the substrate W at each of the first grinding position A1 and the second grinding position A2. Meanwhile, the substrate processing apparatus 1 performs, for example, spray cleaning of the substrate W, measurement of the thickness distribution of the substrate W, unloading the substrate W, cleaning of the suction surface of the substrate holder, and loading of the substrate W, in this order, at each of the first load / unload position A3 and the second load / unload position A0.

[0027] Thereafter, the substrate processing apparatus 1 rotates the turntable 3 by 180°. Subsequently, the substrate processing apparatus 1 simultaneously grinds the substrate W again at each of the first grinding position A1 and the second grinding position A2. Meanwhile, the substrate processing apparatus 1 again performs spray cleaning of the substrate W, measurement of the thickness distribution of the substrate W, unloading the substrate W, cleaning the substrate suction surface (upper surface) of the substrate holder, and loading the substrate W, in this order, at each of the first load / unload position A3 and the second load / unload position A0.

[0028] The substrate processing apparatus 1 according to one embodiment will be described again with reference to Fig. 3. The substrate processing apparatus 1 grinds the substrate W by pressing the lower surface of a grinding stone T2 constituting a grinding tool T against the upper surface of the substrate W. The grinding tool T includes, for example, a disk-shaped wheel T1 and a plurality of grinding stones T2 arranged in a ring shape on the lower surface of the wheel T1.

[0029] The substrate processing apparatus 1 includes a substrate holding unit 10A. The substrate holding unit 10A has an adsorption surface 11 on its upper surface that adsorbs the substrate W. The substrate holding unit 10A holds the substrate W from the side opposite to the grinding tool T (i.e., the lower side). The substrate holding unit 10A is, for example, a vacuum chuck, and includes a porous body 12 that forms the adsorption surface 11 and a holder 13 that holds the porous body 12. The adsorption surface 11 may be flat as shown in FIG. 3, or may have a conical surface to adjust the thickness distribution of the substrate W. The configurations of the substrate holding units 10B to 10D shown in FIG. 1 are similar to the configuration of the substrate holding unit 10A shown in FIG. 3, and therefore will not be described here.

[0030] The substrate processing apparatus 1 includes a second rotation unit 15. The second rotation unit 15 rotates the substrate holding unit 10A. The second rotation unit 15 includes, for example, a rotation motor 16 and a vertical rotation shaft 17 that is rotated by the rotation motor 16. The substrate holding unit 10A is provided at the upper end of the rotation shaft 17. The rotation motor 16 rotates the substrate holding unit 10A together with the rotation shaft 17. The rotation shaft 17 may be inclined to adjust the thickness distribution of the substrate W.

[0031] The substrate processing apparatus 1 includes a drive unit 20A. The drive unit 20A drives a grinding tool T. The drive unit 20A has, for example, a rotation unit 30 and a lifting unit 40. The rotation unit 30 holds and rotates the grinding tool T. The lifting unit 40 lifts and lowers the grinding tool T together with the rotation unit 30. The configuration of the drive unit 20B shown in FIG. 1 is the same as the configuration of the drive unit 20A shown in FIG. 3, and therefore a description thereof will be omitted.

[0032] The rotating unit 30 has, for example, a rotary motor 31, a vertical spindle shaft 32 rotated by the rotary motor 31, and a flange 33 provided at the lower end of the spindle shaft 32. The flange 33 is disposed horizontally, and a grinding tool T is attached to its lower surface. The rotary motor 31 rotates the spindle shaft 32, thereby rotating the grinding tool T attached to the lower surface of the flange 33.

[0033] Elevating unit 40 has, for example, a vertical Z-axis guide 41, a Z-axis slider 42 that moves along Z-axis guide 41, and an elevating motor 43 that moves Z-axis slider 42. Rotary motor 31 is fixed to Z-axis slider 42 via a motor holder 44. Elevating unit 40 has a ball screw (not shown) that converts the rotational motion of elevating motor 43 into linear motion of Z-axis slider 42.

[0034] The substrate processing apparatus 1 includes a first measuring unit 51. The first measuring unit 51 measures the thickness of the substrate W held by the substrate holding unit 10A. The first measuring unit 51 includes, for example, a first displacement meter 51a that measures the height of the upper surface of the substrate W, and a second displacement meter 51b that measures the height of the suction surface 11 of the substrate holding unit 10A. The difference in height between the upper surface of the substrate W and the suction surface 11 of the substrate holding unit 10A is the thickness of the substrate W. The first measuring unit 51 transmits a signal indicating the thickness of the substrate W to the control circuit 90. The second displacement meter 51b is an example of a suction surface height measuring unit.

[0035] Although the first measuring unit 51 is of a contact type in this embodiment, it may be of a non-contact type. For example, a laser displacement meter is used as the non-contact type first measuring unit 51. The laser displacement meter is of a spectroscopic interference type, for example, and measures the thickness of the substrate W by irradiating light from above the substrate W and measuring the phase difference between the light reflected from the upper surface of the substrate W and the light reflected from the lower surface of the substrate W.

[0036] The substrate processing apparatus 1 includes a second measuring unit 52. The second measuring unit 52 measures the height of the rotating unit 30. The height of the rotating unit 30 is the position of the rotating unit 30 in the Z-axis direction. The second measuring unit 52 is, for example, a rotary encoder, and measures the height of the rotating unit 30 by measuring the rotation of the lifting motor 43. The second measuring unit 52 transmits a signal indicating the height of the rotating unit 30 to the control circuit 90. The height of the rotating unit 30 can be said to be the height of the grinding tool T.

[0037] It should be noted that second measuring unit 52 is not limited to a rotary encoder. Second measuring unit 52 may be a linear encoder, and may have a scale installed along Z-axis guide 41 and a read head mounted on Z-axis slider 42. The read head reads the graduations on the scale.

[0038] The substrate processing apparatus 1 may include a third measurement unit 53. The third measurement unit 53 measures the torque of the lift motor 43. The torque can be measured by a servo amplifier of the lift motor 43. The third measurement unit 53 may measure the load current instead of the torque. Since there is a one-to-one correspondence between the torque and the load current, it is also possible to calculate the load current from the torque.

[0039] The substrate processing apparatus 1 may include a fourth measurement unit 54. The fourth measurement unit 54 measures the load current of the rotary motor 31. The load current can be measured using the output current of the inverter. The fourth measurement unit 54 may measure torque instead of the load current. Since the load current and torque correspond one-to-one, it is also possible to calculate the torque from the load current.

[0040] An example of the change in height of the rotating unit 30 over time will be described with reference to FIG. 4. The height of the rotating unit 30 is controlled by the control circuit 90. The control circuit 90 starts lowering the rotating unit 30 at time t0. The control circuit 90 lowers the rotating unit 30 from the standby position Z0 to the air-cut position Zair at a first speed V1. At this time, the control circuit 90 rotates the grinding tool T at a preset rotation speed. The control circuit 90 may also rotate the substrate W together with the substrate holder 10A at a preset rotation speed. Note that the rotation start time of at least one of the grinding tool T and the substrate W may be time t1, which will be described later, instead of time t0.

[0041] When the second measuring unit 52 measures that the rotating part 30 has reached the air cut position Zair at time t1, the control circuit 90 decelerates the descending speed of the rotating part 30 from the first speed V1 to a second speed V2 (V2 < V1) which is smaller than the first speed V1. The air cut position Zair is the position where the descending speed of the rotating part 30 is decelerated immediately before the grinding wheel T2 hits the substrate W. The air cut position Zair is set at a position shifted upward by a set amount from the setup position Zset.

[0042] The setup position Zset is the reference position when setting the air cut position Zair. The setup position Zset is the height of the rotating part 30 at which it is estimated that the grinding wheel T2 hits the adsorption surface 11 of the substrate holding part 10A. The grinding wheel T2 wears during the thinning of the substrate W. The height of the rotating part 30 at which it is estimated that the grinding wheel T2 with the same thickness as just before the thinning of the substrate W hits the adsorption surface 11 of the substrate holding part 10A is the setup position Zset.

[0043] As described above, the air cut position Zair is set at a position shifted upward by a set amount from the setup position Zset. The height difference between the setup position Zset and the air cut position Zair is equal to the sum of the thickness of the substrate W before thinning and the set value of the air cut amount ΔZ. The air cut amount ΔZ is the size of the gap formed between the grinding tool T and the substrate W at time t1.

[0044] As described above, since the control circuit 90 lowers the rotating part 30 at high speed from time t0 to time t1, it can suppress the decrease in throughput. Also, since the control circuit 90 lowers the rotating part 30 at low speed after time t1, it can reduce the impact when the grinding wheel T2 contacts the substrate W, and suppress the breakage of the substrate W and the breakage of the grinding tool T. The grinding wheel T2 contacts the substrate W at time t2. Time t2 can be detected from the load current (or torque) of the rotation motor 31.

[0045] The control circuit 90 continues to lower the rotating unit 30 even after time t2. The lower surface of the grindstone T2 is pressed against the upper surface of the substrate W, thinning the substrate W. In this embodiment, the control circuit 90 sets the lowering speed of the rotating unit 30 to the second speed V2 even after time t2, but may further reduce the speed to a third speed that is lower than the second speed V2.

[0046] At time t3, when the first measuring unit 51 measures that the thickness of the substrate W has reached the set value, the control circuit 90 stops the lowering of the rotating unit 30. Thereafter, the control circuit 90 may rotate the grinding tool T and the substrate W for a set time Δt while stopping the raising and lowering of the rotating unit 30.

[0047] At time t4, when the elapsed time from time t3 reaches the set time Δt, the control circuit 90 starts raising the rotating unit 30. Note that the control circuit 90 may also start raising the rotating unit 30 at time t3. The control circuit 90 raises the rotating unit 30 to the standby position Z0. After the grinding tool T and the substrate W are separated, the control circuit 90 stops the rotation of the grinding tool T and the rotation of the substrate holding unit 10A.

[0048] Thereafter, while the rotating unit 30 is waiting at the waiting position Z0, the substrate W is replaced, the thinned substrate W is unloaded, and the unthinned substrate W is loaded. The waiting position Z0 is set at a position above the air cut position Zair so that the grinding tool T does not interfere with the loading and unloading of the substrate W. After the substrate W is replaced, thinning of the substrate W is performed again.

[0049] 3 again, an example of the suction unit 61 and the supply unit 62 will be described. The suction unit 61 sucks fluid from inside the substrate holding unit 10A. The suction unit 61 sucks gas from inside the porous body 12, for example. This reduces the pressure in the porous body 12 to a pressure lower than atmospheric pressure, causing the porous body 12 to vacuum-suck the substrate W. Thereafter, the suction unit 61 stops sucking gas, and when the pressure in the porous body 12 returns to atmospheric pressure, the vacuum suction force disappears.

[0050] The supply unit 62 supplies a cleaning liquid into the inside of the substrate holding unit 10A. After the substrate W has been ground, the supply unit 62 supplies the cleaning liquid into the inside of the substrate holding unit 10A and pushes the substrate W with the pressure of the cleaning liquid in order to remove the substrate W. The cleaning liquid is, for example, water. The supply unit 62 may supply a mixed fluid of the cleaning liquid and gas into the inside of the substrate holding unit 10A, and may push the substrate W with the pressure of the mixed fluid. The gas is, for example, air.

[0051] A substrate processing method according to one embodiment will be described with reference to Figures 5 and 6. Steps S101 to S109 shown in Figure 5 are performed under the control of the control circuit 90. Processing of the substrate W held by the substrate holding part 10A will be described below. Processing of the substrates W held by the remaining substrate holding parts 10B, 10C, and 10D is performed in the same manner as the processing of the substrate W held by the substrate holding part 10A, and therefore will not be described here.

[0052] First, the transfer unit 5, together with the transfer arm 5a, transfers the substrate W from the outside to the inside of the housing 2 (step S101). Next, at the first transfer position A3, the transfer unit 5 places the substrate W on the substrate holder 10A, and the substrate holder 10A adsorbs the substrate W (step S102). After that, the transfer unit 5 retracts the transfer arm 5a from the inside of the housing 2 to the outside. Then, the turntable 3 is rotated 180°, and the substrate W, together with the substrate holder 10A, is moved from the first transfer position A3 to the first grinding position A1. Next, the drive unit 20A grinds the substrate W with the grinding tool T (step S103). Then, the turntable 3 is rotated 180°, and the substrate W, together with the substrate holder 10A, is moved from the first grinding position A1 to the first transfer position A3.

[0053] Next, the transfer unit 5 moves the transfer arm 5a from the outside to the inside of the housing 2, and at the first transfer position A3, the transfer arm 5a holds the substrate W from the opposite side (e.g., the upper side) to the substrate holding unit 10A, as shown in FIG. 6(A) (step S104). At this time, the substrate holding unit 10A adsorbs the substrate W to prevent the substrate W from shifting. Both the substrate holding unit 10A and the transfer arm 5a adsorb the substrate W. Thereafter, the suction unit 61 stops suctioning the gas, and the substrate holding unit 10A stops adsorbing the substrate W. Then, only the transfer arm 5a adsorbs the substrate W.

[0054] When the transport arm 5a suctions the substrate W, the control circuit 90 determines whether the substrate W is being held by the transport arm 5a (step S105). When the transport arm 5a vacuum-sucks the substrate W, the pressure sensor 5b detects a pressure that represents the vacuum suction force. The control circuit 90 makes a determination based on the detection value of the pressure sensor 5b. If the substrate W is vacuum-sucked to the transport arm 5a and there is no vacuum leak, the pressure will be below the threshold value.

[0055] If it is determined in step S105 that the substrate W is not held by the transport arm 5a, the processes from step S104 onward are performed again, for example. Alternatively, the processing of the substrate W may be interrupted and maintenance of the substrate processing apparatus 1 may be performed.

[0056] 6(B), the supply unit 62 supplies cleaning liquid L into the substrate holding unit 10A, and the pressure of the cleaning liquid L pushes the substrate W upward (step S106). At this time, the transport arm 5a presses the substrate W from the side opposite the substrate holding unit 10A to prevent the substrate W from being blown away. The cleaning liquid L leaks out sideways from between the substrate holding unit 10A and the substrate W.

[0057] Simultaneously with or after step S106, the transfer unit 5 raises the transfer arm 5a to a first height H1, as shown in FIG. 6(C). The first height H1 is a height at which the substrate W is separated by a set distance D0 from the suction surface 11 together with the transfer arm 5a. With the transfer unit 5 stopping the transfer arm 5a at the first height H1, the supply unit 62 sprays cleaning liquid L upward from the suction surface 11 to clean the underside of the substrate W with the cleaning liquid L (step S107). In step S107, it is preferable to clean the underside of the substrate W with the cleaning liquid L while rotating the substrate holder 10A.

[0058] Next, the supply unit 62 stops the supply of the cleaning liquid L (step S108). Because the transport arm 5a holds the substrate W, the substrate W will not fall due to the halt in the supply of the cleaning liquid L. Thereafter, the suction unit 61 may suck the cleaning liquid from inside the substrate holder 10A to remove the cleaning liquid adhering to the underside of the substrate W.

[0059] Finally, the transport unit 5 moves the substrate W together with the transport arm 5a in the horizontal direction, and together with the transport arm 5a, the substrate W is transported from the inside of the housing 2 to the outside (step S109). At this time, the height of the transport arm 5a is controlled to a second height H2. The second height H2 is a height that allows the transport arm 5a to pass through the load / unload opening 2a of the housing 2.

[0060] An example of setting the first height H1 and the second height H2 will be described with reference to FIG. 7. When the suction surface 11 deteriorates, the control circuit 90 controls grinding of the suction surface 11 with a grinding wheel T2. The height H0 of the suction surface 11 after grinding is lower than the height H0 of the suction surface 11 before grinding. In FIG. 7, ΔH is the height difference between the suction surface 11 after grinding and the suction surface 11 before grinding. H0 and ΔH0 can be measured, for example, by the first measurement unit 51.

[0061] As described above, the height H0 of the suction surface 11 after grinding is lower than the height H0 of the suction surface 11 before grinding. Therefore, if the first height H1 remains the same after grinding of the suction surface 11 as before grinding, the gap between the suction surface 11 and the substrate W in step S107 after grinding will be too large to clean the underside of the substrate W, which could cause problems with cleaning.

[0062] Therefore, it is preferable that the control circuit 90 perform control to reset the first height H1 after grinding the suction surface 11 so that the distance between the underside of the substrate W and the suction surface 11 when cleaning the underside of the substrate W is the same before and after grinding the suction surface 11. The first height H1 after grinding can be set to be lower by ΔH0 than the first height H1 before grinding. Even after grinding the suction surface 11, the underside of the substrate W can be properly cleaned, and the quality of the substrate W can be stabilized.

[0063] The control circuit 90 controls the substrate W to be unloaded from inside the housing 2 to the outside at the same second height H2 before and after grinding of the suction surface 11. The control circuit 90 does not change the second height H2 before and after grinding of the suction surface 11. This is because the height of the load / unload opening 2a of the housing 2 does not change before and after grinding of the suction surface 11. Furthermore, when the substrate W is unloaded from inside the housing 2 to the outside through the load / unload opening 2a, if the nozzle 7 forms an airflow along the underside of the substrate W toward the inside of the housing 2, the distance between the nozzle 7 and the substrate W can always be kept the same, and cleaning liquid or grinding liquid adhering to the underside of the substrate W can be stably removed.

[0064] The substrate processing apparatus 1 includes multiple substrate holding parts 10A and 10C, and sequentially grinds the substrate W held by the substrate holding part 10A and the substrate W held by the substrate holding part 10C with the same grinding tool T. Hereinafter, as shown in Fig. 8, the suction surface 11 of the substrate holding part 10A may be referred to as a first suction surface 11A. Also, the suction surface 11 of the substrate holding part 10C may be referred to as a second suction surface 11C.

[0065] The heights of the first suction surface 11A and the second suction surface 11C may differ. Therefore, it is preferable that the control circuit 90 performs control to set the first height H1 separately for the first suction surface 11A and the second suction surface 11C so that the distances from the underside of the substrate W during cleaning are the same for the first suction surface 11A and the second suction surface 11C. This can stabilize the quality of the substrate W.

[0066] The control circuit 90 may successively grind the first suction surface 11A and the second suction surface 11C without grinding the substrate W in between. For example, when both the first suction surface 11A and the second suction surface 11C are deteriorated, the control circuit 90 successively grinds the first suction surface 11A and the second suction surface 11C without grinding the substrate W in between.

[0067] When the control circuit 90 performs control to grind the first attraction surface 11A with the grindstone T2, the height of the first attraction surface 11A decreases. AC is the height difference between the first suction surface 11A and the second suction surface 11C when grinding of the first suction surface 11A is completed. A is the height of the first adsorption surface 11A, and H C is the height of the second adsorption surface 11C. A , H C and ΔH AC (ΔH AC =H C -H A ) can be measured by the first measuring unit 51.

[0068] Furthermore, when the control circuit 90 performs control to grind the first attraction surface 11A with the grindstone T2, the grindstone T2 wears and the thickness of the grindstone T2 decreases. In Fig. 8, Z1 is the height of the rotating part 30 when grinding of the first attraction surface 11A is completed. Z1 can be measured by the second measuring part 52.

[0069] The control circuit 90 calculates Z1 and ΔH when grinding of the first suction surface 11A is completed. AC Based on this, control is performed to estimate the height Z2 of the rotating part 30 when the grindstone T2 hits the second attraction surface 11C. Z2 is calculated by the ratio of Z1 to ΔH AC is equal to the sum of (Z2=Z1+ΔH AC ) Note that although Z2 is higher than Z1 in Figure 8, it can also be lower than Z1. In the latter case, Z2 is also calculated as follows: (Z2 = Z1 + ΔH AC (ΔH AC =H C -H A )) can be calculated from the formula.

[0070] By estimating Z2, the control circuit 90 can appropriately set the air cut position when grinding the second suction surface 11C. The air cut position is set to a position shifted upward from Z2 by a set amount (for example, a set value of the air cut amount). The air cut amount can be reduced to the minimum necessary, improving throughput.

[0071] Although the embodiments of the substrate processing apparatus and substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0072] 1. Substrate processing equipment 2. Case 5. Conveyor 5a Transfer arm 10A, 10B, 10C, 10D Board holder 11 Adsorption surface 20A, 20B drive unit 51 First Measurement Section 62 Supply section T grinding tool T2 grinding stone W substrate

Claims

1. A substrate processing apparatus that thins a substrate by pressing a lower surface of a grinding wheel that constitutes a grinding tool against an upper surface of the substrate, a substrate holder having an upper surface that is an adsorption surface for adsorbing the substrate; a supply unit that supplies a cleaning liquid into the substrate holding unit, thereby spraying the cleaning liquid upward from the suction surface; an adsorption surface height measuring unit that measures the height of the adsorption surface; a transport unit having a transport arm that holds the substrate from the side opposite to the suction surface; a drive unit that drives the grinding tool; a housing that accommodates the substrate holder and the grinding tool therein; a control circuit; Equipped with the control circuit performs the following control operations in this order: control for the transfer arm to hold the substrate adsorbed on the suction surface; control for the transfer arm to rise to a first height; control for the transfer arm to stop at the first height and to spray the cleaning liquid upward from the suction surface to clean the underside of the substrate with the cleaning liquid; and control for the substrate to be transferred from the inside of the housing to the outside together with the transfer arm; the control circuit performs control to reset the first height after grinding of the suction surface so that a distance between the underside of the substrate and the suction surface during cleaning of the underside of the substrate is the same as a distance before and after grinding of the suction surface.

2. The substrate processing apparatus according to claim 1 , wherein the control circuit performs control to transport the substrate from inside the housing to outside the housing at a second height that is the same before and after grinding of the suction surface.

3. the substrate processing apparatus includes a plurality of the substrate holding units, one of the substrate holding units having a first suction surface that is the suction surface, and another of the substrate holding units having a second suction surface that is the suction surface; 3. The substrate processing apparatus according to claim 1, wherein the control circuit controls to set the first height separately for the first suction surface and the second suction surface so that the distance between the first suction surface and the underside of the substrate during cleaning is the same for the first suction surface and the second suction surface.

4. the substrate processing apparatus includes a plurality of the substrate holding units, one of the substrate holding units having a first suction surface that is the suction surface, and another of the substrate holding units having a second suction surface that is the suction surface; the drive unit includes a rotation unit that holds and rotates the grinding tool, and an elevation unit that elevates the rotation unit, the substrate processing apparatus includes a second measurement unit that measures a height of the rotation unit, 3. The substrate processing apparatus of claim 1, wherein the control circuit performs control to estimate the height of the rotating part when the grinding wheel hits the second suction surface based on the height difference between the first suction surface and the second suction surface when grinding of the first suction surface is completed and the height of the rotating part when grinding of the first suction surface is completed.

5. A substrate processing method using a substrate processing apparatus, the method comprising: pressing a lower surface of a grinding wheel constituting a grinding tool against an upper surface of a substrate to thin the substrate; the substrate processing apparatus includes a substrate holding unit having an upper surface that is an adsorption surface for adsorbing the substrate, a supply unit that supplies a cleaning liquid into the substrate holding unit and thereby sprays the cleaning liquid upward from the adsorption surface, an adsorption surface height measurement unit that measures the height of the adsorption surface, a transport unit that has a transport arm that holds the substrate from the side opposite to the adsorption surface, a drive unit that drives the grinding tool, and a housing that houses the substrate holding unit and the grinding tool inside, The substrate processing method includes: the substrate is held by the suction surface with the transport arm; the transport arm is raised to a first height; the cleaning liquid is sprayed upward from the suction surface while the transport arm is stopped at the first height, thereby cleaning the underside of the substrate with the cleaning liquid; and the substrate is transported from the inside of the housing to the outside together with the transport arm, in this order; and resetting the first height after grinding the suction surface so that a distance between the underside of the substrate and the suction surface during cleaning of the underside of the substrate is the same before and after grinding the suction surface.

6. The substrate processing method according to claim 5 , further comprising unloading the substrate from inside the housing to outside the housing at a second height that is the same before and after grinding the suction surface.

7. In the substrate processing apparatus, one of the substrate holding parts has a first suction surface that is the suction surface, and another of the substrate holding parts has a second suction surface that is the suction surface, 7. The substrate processing method according to claim 5, further comprising setting the first height separately for the first suction surface and the second suction surface so that a distance from the underside of the substrate during cleaning of the underside of the substrate is the same for the first suction surface and the second suction surface.

8. the substrate processing apparatus includes a plurality of the substrate holding units, one of the substrate holding units having a first suction surface that is the suction surface, and another of the substrate holding units having a second suction surface that is the suction surface; the drive unit includes a rotation unit that holds and rotates the grinding tool, and an elevation unit that elevates the rotation unit, the substrate processing apparatus includes a second measurement unit that measures a height of the rotation unit, The substrate processing method includes: grinding the first suction surface with the grindstone; estimating the height of the rotating part when the grinding wheel comes into contact with the second attraction surface based on a height difference between the first attraction surface and the second attraction surface when grinding of the first attraction surface is completed and a height of the rotating part when grinding of the first attraction surface is completed; The substrate processing method according to claim 5 or 6, comprising:

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