Embedding method and embedded structure for magnetic transformer, electronic apparatus and storage medium

Abstract

To provide an embedding method for a magnetic transformer, which can effectively embed the transformer inside a package substrate to reduce a size of the package substrate.SOLUTION: A method includes the steps of: acquiring a copper-clad substrate and forming a coil on surfaces of the copper-clad substrate by plating; laminating prepregs and copper sheets on the surfaces of the copper-clad substrate to form a first substrate; drilling the first substrate to form first vias and filling a magnetic material in the first vias to form first embedded magnets; drilling the first substrate to form a second via and forming a metal layer on an inner wall of the second via and the surfaces of the first substrate; manufacturing conductive posts and sacrificial blocks on a surface of the metal layer and laminating an insulating layer on the surfaces of the first substrate; etching the sacrificial blocks to form cavities and filling a magnetic material in the cavities to form a second embedded magnet; and manufacturing wiring and a solder resist layer on a surface of the insulating layer to form a package substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the technical field of packaging structures, and more particularly to a method and structure for embedding a magnetic transformer, an electronic device, and a storage medium. [Background technology]

[0002] With the continuous development of electronic technology, the integration level of consumer electronic products such as computers and communication devices is becoming higher and higher. Packaging methods using support frames to realize embedded chips have been greatly developed and applied in actual production, meeting the market needs for smaller, thinner, lighter, and more highly integrated electronic devices.

[0003] In conventional isolated power supply modules or devices, the transformers are relatively large in size due to the relatively large number of windings in the two inductors, the main inductor and the sub-inductor. Currently, transformers are generally fixed to package substrates using surface mounting, and although this type of manufacturing process is relatively mature, the need for secondary surface mounting not only increases the production process and production costs, but also results in a relatively large volume of the packaged product, which does not meet the current market needs for miniaturization, high integration, and high performance. Furthermore, due to the relatively large size of the transformer, conventional embedding processes cannot effectively embed the transformer inside the package substrate. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and therefore proposes a method and structure for embedding a magnetic transformer, an electronic device, and a storage medium, which can effectively embed a transformer inside a package substrate and reduce the size of the package substrate. [Means for solving the problem]

[0005] According to one aspect, a method for embedding a magnetic transformer according to an embodiment of the present invention includes: obtaining a copper clad substrate; forming a coil on the surface of the copper-clad substrate by plating; forming a first substrate by pressing a prepreg and a copper sheet onto a surface of the copper-clad substrate; drilling holes in the first substrate to form a number of first vias penetrating the first substrate, the number of first vias being located inside and outside the coil; filling the first via with a magnetic material to form a first embedded magnet; drilling a hole in the first substrate to form a second via penetrating the first substrate, and forming a metal layer on an inner wall of the second via and on a surface of the first substrate; forming conductive posts and sacrificial blocks on the surface of the metal layer and etching away excess metal layer; pressing an insulating layer onto a surface of the first substrate such that the insulating layer covers the conductive posts and the sacrificial block and is flush with the surfaces of the conductive posts and the sacrificial block; Etching the sacrificial block to form a cavity; a step of filling the cavity with a magnetic material to form a second embedded magnet, wherein the first embedded magnet is connected to the second embedded magnet to form a closed magnetic circuit, and the closed magnetic circuit forms a magnetic transformer together with the coil; and forming wiring and a solder resist layer on the surface of the insulating layer to form a package substrate.

[0006] According to some embodiments of the present invention, the step of forming a coil on the surface of the copper clad substrate by plating specifically includes: Pressing a dry film resist onto the surface of the copper clad substrate; exposing and developing the dry film resist to form some of the required coil openings; plating metal wires into the coil openings, some of the metal wires constituting the coil; and removing the dry film resist and etching the copper foil exposed on the surface of the copper-clad substrate.

[0007] According to some embodiments of the present invention, the step of filling the first via with a magnetic material to form a first embedded magnet specifically includes: attaching a bonding film to the bottom of the first substrate; filling the first via with a magnetic material by silkscreen printing; removing the bonding film and polishing the magnetic material to form a first embedded magnet flush with the surface of the first substrate.

[0008] According to some embodiments of the present invention, the step of forming conductive posts and sacrificial blocks on the surface of the metal layer and etching away excess of the metal layer specifically comprises: pressing a photosensitive film onto the surface of the metal layer; opening windows in the photosensitive film to form conductive post windows and sacrificial block windows; plating the conductive posts within the conductive post windows and plating the sacrificial blocks within the sacrificial block windows; removing the photosensitive film and etching away excess metal layer.

[0009] According to some embodiments of the present invention, the step of etching the sacrificial block to form a cavity specifically comprises: forming a resist layer on the surface of the insulating layer; opening a window in the resist layer to expose the sacrificial block; Etching the sacrificial block to form the cavity; and removing the resist layer.

[0010] According to some embodiments of the present invention, the step of forming wiring and a solder resist layer on the surface of the insulating layer to form a package substrate specifically includes: forming the wiring on the surface of the insulating layer, the wiring being electrically connected to the conductive post and the second embedded magnet; forming a solder resist layer on the surface of the insulating layer, and opening a window in the solder resist layer to form a window to expose the wiring; and performing a surface treatment on the wiring in accordance with the window.

[0011] According to some embodiments of the present invention, the step of forming a metal layer on the inner wall of the second via and on the surface of the first substrate specifically includes: The method includes forming the metal layer on the inner wall of the second via and on the surface of the first substrate by a chemical copper plating process.

[0012] According to another aspect, a magnetic transformer embedding structure according to an embodiment of the present invention is made by the magnetic transformer embedding method described in the embodiment of the above aspect.

[0013] According to another aspect, an electronic device according to an embodiment of the present invention includes: a memory for storing program instructions; a processor for calling the program instructions stored in the memory and executing the magnetic transformer embedding method according to the embodiment of the above aspect in accordance with the obtained program instructions.

[0014] According to another aspect, a storage medium according to an embodiment of the present invention stores computer-executable instructions that cause a computer to perform the magnetic transformer embedding method described in the embodiment of the above aspect. [Effects of the Invention]

[0015] The magnetic transformer embedding method and structure, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: By embedding the transformer coil in the package substrate and adding magnetic material around the coil to form a closed magnetic circuit, the inductance value of the inductor can be significantly improved, the input voltage frequency can be effectively reduced, the number of windings can be reduced, the DC resistance of the coil can be reduced, and the energy loss caused by the transformer can be reduced; at the same time, the size of the transformer can be reduced, the isolated power supply module or device can be made more compact, the requirements for board-level packaging quality of the inductor can be met, costs can be reduced, and efficiency can be improved.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the invention. The above and / or additional aspects and advantages of the present invention will become apparent and will be readily understood from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0017] [Figure 1] 3 is a flowchart showing the steps of a method for embedding a magnetic transformer according to an embodiment of the present invention. [Figure 2] 1 is a structural schematic diagram of a copper-clad substrate according to an embodiment of the present invention; [Figure 3] FIG. 1 is a schematic diagram of the structure when a dry film resist is placed on a copper-clad substrate. [Figure 4] 3 is a structural schematic diagram of a coil opening according to an embodiment of the present invention; FIG. [Figure 5] FIG. 10 is a schematic diagram of the structure when the coil is formed by plating. [Figure 6] This is a schematic diagram of the structure when the dry film resist is removed and the copper foil exposed on the surface of the copper-clad substrate is etched. [Figure 7] FIG. [Figure 8] FIG. 2 is a structural schematic diagram of a first substrate according to an embodiment of the present invention. [Figure 9] FIG. 10 is a schematic diagram of the structure when a hole is drilled in the first substrate and a first via is formed. [Figure 10] FIG. 2 is a plan view of the coil and the first via. [Figure 11] FIG. 10 is a schematic diagram of the structure when a magnetic material is filled in the first via. [Figure 12] 10 is a schematic diagram of the structure when the magnetic material is polished to form a first embedded magnet that is flush with the surface of the first substrate. FIG. [Figure 13] FIG. 2 is a plan view of the coil and the first embedded magnet. [Figure 14] FIG. 10 is a schematic diagram of the structure when a hole is drilled in the first substrate and a second via is formed. [Figure 15] 10 is a schematic diagram of the structure when a metal layer is formed on the inner wall of the second via and on the surface of the first substrate. FIG. [Figure 16] FIG. 10 is a schematic diagram of a structure in which a photosensitive film is pressed onto the surface of a metal layer, and windows are opened in the photosensitive film to form conductive post windows and sacrificial block windows. [Figure 17] FIG. 1 is a schematic diagram of a structure in which conductive posts and sacrificial blocks are formed on the surface of a metal layer. [Figure 18] FIG. 2 is a schematic diagram of the structure when an insulating layer is pressure-bonded to the surface of a first substrate. [Figure 19] FIG. 10 is a schematic diagram of the structure when a sacrificial block is etched to form a cavity. [Figure 20] FIG. 10 is a structural schematic diagram showing how a magnetic material is filled into the cavity to form a second embedded magnet. [Figure 21] FIG. 2 is a plan view of a closed magnetic circuit and a coil. [Figure 22] 1 is a structural schematic diagram of a package substrate according to an embodiment of the present invention; [Figure 23] 1 is a structural schematic diagram of a large-scale substrate-level magnetic transformer embedded product. [Figure 24] 1 is a structural schematic diagram of a single magnetic transformer embedding structure of a large-scale substrate-level magnetic transformer embedding product; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described in detail, and examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout the drawings represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and are used to interpret the present application, but should not be understood as limitations on the present application. The step numbers in the following embodiments are provided for ease of explanation, and the order of the steps is not limited in any way. The order of the steps in the embodiments can be adaptively adjusted based on the understanding of those skilled in the art.

[0019] In the description of the present invention, the orientations or positional relationships, such as up, down, front, rear, left, right, etc., are based on the orientations or positional relationships shown in the accompanying drawings, and are merely for the purpose of describing and simplifying the present invention. They do not necessarily indicate or imply that the devices or elements referred to herein necessarily have a specific orientation or must be configured or operated in a specific orientation, and therefore should not be understood as limitations on the present invention.

[0020] In the present specification, claims, and the accompanying drawings, terms such as "first," "second," "third," and "fourth" are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "comprise" and "have" and any variations thereof are intended to cover a non-exclusive "inclusion." For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may also include additional steps or units that are not listed, or may also include other steps or units that are inherent to such process, method, product, or apparatus.

[0021] When referring to an "embodiment" in the present invention, it means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present invention. The appearance of this term in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art will understand, both explicitly and implicitly, that the embodiments described herein may be combined with other embodiments.

[0022] With the continuous development of electronic technology, the integration level of consumer electronic products such as computers and communication devices is becoming higher and higher. Packaging methods using support frames to realize embedded chips have been greatly developed and applied in actual production, meeting the market needs for smaller, thinner, lighter, and more highly integrated electronic devices.

[0023] In conventional isolated power supply modules or devices, the transformers are relatively large in size due to the relatively large number of windings in the two inductors, the main inductor and the sub-inductor. Currently, transformers are generally fixed to package substrates using surface mounting, and although this type of manufacturing process is relatively mature, the need for secondary surface mounting not only increases the production process and production costs, but also results in a relatively large volume of the packaged product, which does not meet the current market needs for miniaturization, high integration, and high performance. Furthermore, due to the relatively large size of the transformer, conventional embedding processes cannot effectively embed the transformer inside the package substrate.

[0024] Therefore, embodiments of the present invention propose a method and structure for embedding a magnetic transformer, an electronic device, and a storage medium. By embedding the transformer coil in a package substrate and adding magnetic material around the coil to form a closed magnetic circuit, the inductance value of the inductor can be greatly improved, the input voltage frequency can be effectively reduced, the number of windings can be reduced, the DC resistance of the coil can be reduced, and the energy loss caused by the transformer can be reduced. At the same time, the size of the transformer can be reduced, thereby realizing the miniaturization of the isolated power supply module or device, which satisfies the requirements for board-level packaging quality of the inductor, reduces costs, and improves efficiency.

[0025] Hereinafter, a method and structure for embedding a magnetic transformer, an electronic device, and a storage medium according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0026] According to one aspect, as shown in FIG. 1, a method for embedding a magnetic transformer according to an embodiment of the present invention includes the following steps S100 to S1100.

[0027] Step S100: A copper-clad substrate 100 is obtained.

[0028] As shown in FIG. 2, in this example, a double-sided copper-clad substrate 100 is used as a carrier for the package structure.

[0029] Step S200: The coil 200 is formed on the surface of the copper-clad substrate 100 by plating.

[0030] Specifically, as shown in FIGS. 3 to 7, in this example, in order to form the coil 200 on the surface of the copper-clad substrate 100 by plating, the above step S200 includes the following four sub-steps.

[0031] 1. A dry film resist 110 is pressure-bonded to the surface of a copper-clad substrate 100. 2. The dry film resist 110 is exposed and developed to form some of the required coil openings 120. 3. Metal conductors are plated into the coil opening 120, and some of the metal conductors form the coil 200. 4. The dry film resist 110 is removed, and the copper foil exposed on the surface of the copper-clad substrate 100 is etched.

[0032] As shown in Fig. 3, first, dry film resist 110 is pressed onto the top and bottom surfaces of copper-clad substrate 100, then, as shown in Fig. 4, the necessary coil openings 120 are formed in dry film resist 110 by exposure and development, and as shown in Fig. 5, metal conductors are formed in each coil opening 120 by plating, and finally, as shown in Fig. 6, dry film resist 110 is removed, and the surface of copper-clad substrate 100 is etched to remove excess copper foil, leaving only coil 200 and the copper foil at the bottom of coil 200. Fig. 7 shows a plan view of coil 200 on copper-clad substrate 100.

[0033] Step S300: A prepreg 300 and a copper sheet 400 are pressure-bonded to the surface of the copper-clad substrate 100 to form a first substrate 500.

[0034] 8, in this example, a prepreg 300 (PP sheet) and a copper sheet 400 are sequentially placed on the upper and lower surfaces of a copper-clad substrate 100, and then the copper sheet 400, the prepreg 300, and the copper-clad substrate 100 are pressure-bonded to form a first substrate 500. Here, the coil 200 is covered with the prepreg 300.

[0035] Step S400: Drill holes in the first substrate 500 to form a number of first vias 510 penetrating the first substrate 500, and the number of first vias 510 are located inside and outside the coil 200.

[0036] Specifically, as shown in Figure 9, holes may be drilled, such as by mechanical milling or laser cutting, to form a number of first vias 510 that pass through the first substrate 500. Figure 10 shows a plan view of the coil 200 and the first vias 510.

[0037] Step S500: A magnetic material is filled into the first via 510 to form the first embedded magnet 600.

[0038] As shown in FIGS. 11 to 13, the above step S500 specifically includes the following three sub-steps.

[0039] 1. A bonding film 540 is attached to the bottom of the first substrate 500. 2. Fill the first via 510 with magnetic material by silkscreen printing. 3. The bonding film 540 is removed, and the magnetic material is polished to form the first embedded magnet 600 flush with the surface of the first substrate 500.

[0040] By temporarily attaching the bonding film 540 to the bottom of the first substrate 500, it is possible to prevent the magnetic material from spilling out of the bottom of the first via 510 when filling the first via 510 with the magnetic material. Then, the magnetic material is filled into the first via 510 by silkscreen printing, thereby achieving the magnet structure required for the transformer. Finally, the bonding film 540 is removed, and excess magnetic material on the surface is removed by a method such as mechanical polishing, and the surface is made flush with the surface of the first substrate 500, thereby forming the first embedded magnet 600. FIG. 13 shows a plan view of the first embedded magnet 600 and the coil 200.

[0041] Step S600: A hole is drilled in the first substrate 500 to form a second via 520 penetrating the first substrate 500, and a metal layer 530 is formed on the inner wall of the second via 520 and on the surface of the first substrate 500.

[0042] 14, a second via 520 can be formed by mechanical drilling or laser drilling depending on the thickness of the first substrate 500 to serve as an interlayer via of the first substrate 500. Then, as shown in FIG. 15, a metal layer 530 is formed on the hole wall of the second via 520 and on the surface of the first substrate 500 by a chemical copper plating process to achieve interlayer conductivity.

[0043] Step S700: Conductive posts 700 and sacrificial blocks 800 are formed on the surface of the metal layer 530, and excess metal layer 530 is etched away.

[0044] As shown in FIGS. 16 and 17, the above step S700 specifically includes the following four sub-steps:

[0045] 1. A photosensitive film 550 is pressed onto the surface of the metal layer 530. 2. Opening the photosensitive film 550 to form conductive post windows 560 and sacrificial block windows 570. 3. Plating conductive posts 700 into the conductive post windows 560 and plating sacrificial blocks 800 into the sacrificial block windows 570. 4. Remove the photosensitive film 550 and etch away the excess metal layer 530.

[0046] As shown in FIG. 16, a photosensitive film 550 is formed on the surface of the metal layer 530 by compression bonding, and then a conductive post window 560 and a sacrificial block window 570 are formed as needed. As shown in FIG. 17, a plating+ashing+etching process is used to form conductive posts 700 in the conductive post window 560 by plating, and a sacrificial block 800 in the sacrificial block window 570 by plating. Thereafter, the photosensitive film 550 is removed by ashing, and the excess metal layer 530 is etched away.

[0047] Step S800: The insulating layer 900 is pressed onto the surface of the first substrate 500 so that the insulating layer 900 covers the conductive posts 700 and the sacrificial blocks 800 and is flush with the surfaces of the conductive posts 700 and the sacrificial blocks 800.

[0048] As shown in FIG. 18, an insulating layer 900 is formed on the upper and lower surfaces of a first substrate 500 by compression bonding and thinning. The insulating layer 900 can be made of a resin film or PP307 containing glass fiber.

[0049] As shown in FIG. 19, step S900: etch the sacrificial block 800 to form a cavity 810.

[0050] Specifically, in this example, the above step S900 includes the following four sub-steps:

[0051] 1. A resist layer (not shown) is formed on the surface of the first substrate 500. 2. Open a window in the resist layer to expose the sacrificial block 800. 3. Etch the sacrificial block 800 to form a cavity 810. 4. Remove the resist layer.

[0052] Here, the resist layer may be a photosensitive dry film or the like. The resist layer is opened by exposure and development to expose the sacrificial block 800 and protect other portions of the surface of the insulating layer 900. Thereafter, the sacrificial block 800 is etched to form the cavity 810, and the resist layer is removed.

[0053] Step S1000: Fill cavity 810 with magnetic material to form second embedded magnet 1000. First embedded magnet 600 is connected to second embedded magnet 1000 to form a closed magnetic circuit, and the closed magnetic circuit and coil 200 form a magnetic transformer. A plan view of the magnetic transformer is shown in FIG.

[0054] As shown in Figure 20, after filling the cavity 810 with magnetic material, the surface of the magnetic material is flattened by mechanical thinning, making it flush with the surface of the insulating layer 900, forming a closed magnetic circuit, and a magnetic transformer is formed by a coil 200 consisting of a small amount of metal wire in the center of the closed magnetic circuit.

[0055] As shown in FIG. 22, step S1100: wiring 1100 and solder resist layer 1200 are formed on the surface of insulating layer 900, and package substrate 1300 is formed.

[0056] In this example, the above step S1100 specifically includes the following three steps.

[0057] 1. Wiring 1100 that is electrically connected to the conductive post 700 and the second embedded magnet 1000 is formed on the surface of the insulating layer 900. 2. A solder resist layer 1200 is formed on the surface of the insulating layer 900, and windows are opened in the solder resist layer 1200 to form windows and expose the wiring 1100. 3. Apply surface treatment to the wiring 1100 according to the window.

[0058] Here, by applying a photosensitive dry film, exposing it to light, developing it, plating it, and ashing it, wiring 1100 is formed on the surface of insulating layer 900 by plating, and wiring 1100 can be electrically connected to conductive post 700 and second embedded magnet 1000. After that, solder resist layer 1200 is formed on the surface of insulating layer 900, and windows are opened in solder resist layer 1200 to expose wiring 1100 and facilitate connection of wiring 1100 with external electronic elements. Finally, surface treatment is performed on the surface of wiring 1100, which serves to protect wiring 1100.

[0059] In the method for embedding a magnetic transformer according to the embodiment of the present invention, the coil 200 of the transformer is embedded in the package substrate 1300, and a magnetic material is added around the coil 200 to form a closed magnetic circuit, thereby significantly improving the inductance value of the inductance, effectively reducing the frequency of the input voltage, the number of windings, the DC resistance of the coil, and the energy loss caused by the transformer. At the same time, the size of the transformer can be reduced, thereby realizing the miniaturization of the isolated power supply module or device, thereby meeting the requirements for board-level packaging quality of the inductance, reducing costs, and improving efficiency.

[0060] Note that magnetic embedded transformer products are generally manufactured at the large substrate level, as shown in FIG. 23, but the above-mentioned method for embedding a magnetic transformer will only explain one of the magnetic transformer embedding structures when manufactured at the large substrate level.

[0061] According to another aspect, an embodiment of the present invention further proposes a magnetic transformer embedding structure, which is as shown in FIG. 22, and which is fabricated by the above magnetic transformer embedding method.

[0062] In addition, the contents of the above method embodiments are all applied to this embodiment, the functions specifically realized by this embodiment are the same as those of the above method embodiments, and the beneficial effects obtained are the same as those obtained by the above method embodiments.

[0063] According to another aspect, an embodiment of the present invention comprises: a memory for storing program instructions; We further propose an electronic device including: a processor for calling program instructions stored in the memory and executing the magnetic transformer embedding method described in the embodiment of any one of the above aspects according to the obtained program instructions.

[0064] In addition, the contents of the above method embodiments are all applied to the embodiments of the present electronic device, the functions specifically realized by the embodiments of the present electronic device are the same as those of the above method embodiments, and the beneficial effects obtained are the same as those obtained by the above method embodiments.

[0065] Although specific implementations have been described herein, those skilled in the art will appreciate that many other modifications or alternative implementations are also within the scope of the present disclosure. For example, any one of the functions and / or processing capabilities described in connection with a particular device or component may be performed by any other device or component. Also, while various exemplary specific implementations and architectures have been described in accordance with embodiments of the present disclosure, those skilled in the art will appreciate that many other modifications to the exemplary specific implementations and architectures described herein are also within the scope of the present disclosure.

[0066] The foregoing describes some aspects of the present disclosure with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to example embodiments. One or more blocks in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, respectively, may be implemented by executing computer-executable program instructions. Similarly, according to some implementations, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not need to be executed at all. Also, additional components and / or operations other than those illustrated in the blocks in the block diagrams and flowcharts may be present in some implementations.

[0067] Therefore, the blocks in the block diagrams and flowcharts support combinations of apparatus for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction apparatus for performing the specified functions. Note that each block in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, may be realized by a dedicated hardware computer system or a combination of dedicated hardware and computer instructions that performs the particular functions, elements, or steps.

[0068] Program modules, application programs, etc. described herein may include one or more software components including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, when executed, cause the computer to perform at least a portion of the functionality described herein (e.g., one or more operations of the example methods described herein).

[0069] A software component may be programmed in any one of a variety of programming languages. An exemplary programming language may be a low-level programming language, such as assembly language, associated with a particular hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted from an assembler program into executable machine code before being executed by the hardware architecture and / or platform. Another exemplary programming language may be a high-level programming language that is portable across multiple architectures. Software components including higher-level programming languages ​​may need to be converted into an intermediate representation by an interpreter or compiler before being executed. Other examples of programming languages ​​include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or retrieval languages, or report writing languages. In one or more exemplary embodiments, a software component including instructions from one of the above example programming languages ​​may be executed directly by an operating system or other software component without being converted into another format.

[0070] Software components may be stored as files or other data storage structures. Software components of similar type or related functionality may be stored together, for example, in a particular directory, folder, or library. Software components may be static (e.g., pre-configured or fixed) or dynamic (e.g., created or modified at run time).

[0071] The above describes in detail the embodiments of the present invention with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various modifications can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. [Explanation of symbols]

[0072] 100 Copper-clad board 110 Dry Film Resist 120 Coil opening 200 coils 300 prepreg 400 Copper Sheet 500 First board 510 First Via 520 2nd via 530 Metal layer 540 Bonding Film 550 Photosensitive film 560 Conductive Post Window 570 Sacrificial Block Window 600 First embedded magnet 700 Conductive Post 800 Sacrifice Block 810 cavity 900 Insulation Layer 1000 Second embedded magnet 1100 Wiring 1200 solder resist layer 1300 package substrate

Claims

1. obtaining a copper clad substrate; forming a coil on the surface of the copper-clad substrate by plating; forming a first substrate by pressing a prepreg and a copper sheet onto a surface of the copper-clad substrate; drilling holes in the first substrate to form a number of first vias penetrating the first substrate, the number of first vias being located inside and outside the coil; filling the first via with a magnetic material to form a first embedded magnet; drilling a hole in the first substrate to form a second via penetrating the first substrate, and forming a metal layer on an inner wall of the second via and on a surface of the first substrate; forming conductive posts and sacrificial blocks on the surface of the metal layer and etching away excess metal layer; pressing an insulating layer onto a surface of the first substrate such that the insulating layer covers the conductive posts and the sacrificial block and is flush with the surfaces of the conductive posts and the sacrificial block; Etching the sacrificial block to form a cavity; a step of filling the cavity with a magnetic material to form a second embedded magnet, the first embedded magnet being connected to the second embedded magnet to form a closed magnetic circuit, the closed magnetic circuit forming a magnetic transformer together with the coil; forming wiring and a solder resist layer on the surface of the insulating layer to form a package substrate.

2. The step of forming a coil on the surface of the copper-clad substrate by plating specifically includes: Pressing a dry film resist onto the surface of the copper clad substrate; exposing and developing the dry film resist to form some of the required coil openings; plating metal wires into the coil openings, some of the metal wires constituting the coil; 2. The method for embedding a magnetic transformer according to claim 1, further comprising the step of removing the dry film resist and etching the copper foil exposed on the surface of the copper-clad substrate.

3. Specifically, the step of filling the first via with a magnetic material to form a first embedded magnet includes: attaching a bonding film to the bottom of the first substrate; filling the first via with a magnetic material by silkscreen printing; 2. The method of embedding a magnetic transformer as claimed in claim 1, further comprising the steps of removing the bonding film, polishing the magnetic material, and forming a first embedded magnet flush with the surface of the first substrate.

4. The step of forming conductive posts and sacrificial blocks on the surface of the metal layer and etching away excess metal layer specifically includes: pressing a photosensitive film onto the surface of the metal layer; opening windows in the photosensitive film to form conductive post windows and sacrificial block windows; plating the conductive posts within the conductive post windows and plating the sacrificial blocks within the sacrificial block windows; 2. The method for embedding a magnetic transformer according to claim 1, further comprising the steps of: removing said photosensitive film and etching away excess of said metal layer.

5. The step of etching the sacrificial block to form a cavity specifically includes: forming a resist layer on the surface of the insulating layer; opening a window in the resist layer to expose the sacrificial block; Etching the sacrificial block to form the cavity; 2. The method for embedding a magnetic transformer according to claim 1, further comprising the step of: removing said resist layer.

6. The step of forming wiring and a solder resist layer on the surface of the insulating layer to form a package substrate specifically includes: forming the wiring on the surface of the insulating layer, the wiring being electrically connected to the conductive post and the second embedded magnet; forming a solder resist layer on the surface of the insulating layer, and opening a window in the solder resist layer to form a window to expose the wiring; 2. The method for embedding a magnetic transformer according to claim 1, further comprising the step of: performing a surface treatment on the wiring in accordance with the window.

7. Specifically, the step of forming a metal layer on the inner wall of the second via and the surface of the first substrate includes:

2. The method for embedding a magnetic transformer according to claim 1, further comprising the step of forming the metal layer on the inner wall of the second via and on the surface of the first substrate by a chemical copper plating process.

8. a memory for storing program instructions; a processor for calling the program instructions stored in the memory and executing the method for embedding a magnetic transformer according to any one of claims 1 to 7 in accordance with the obtained program instructions.

9. A storage medium having stored thereon computer-executable instructions for causing a computer to execute the method for embedding a magnetic transformer according to any one of claims 1 to 7.

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