Inductor component

By designing inductor components with thinner outer coil wiring layers and thicker insulating layers, current concentration is minimized, enhancing the Q value and reducing loss.

JP2025172944APending Publication Date: 2025-11-26MURATA MFG CO LTD
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Patent Information

Application Number
JP2025148531
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-08
Publication Date
2025-11-26

AI Technical Summary

Technical Problem

Conventional inductor components face a challenge where increasing the thickness of coil wiring layers to reduce Rdc leads to current concentration, resulting in loss and a decrease in the Q value.

Method used

The inductor component design features outer coil wiring layers with reduced thickness compared to inner layers, accompanied by thicker insulating layers between them, dispersing current and reducing concentration to enhance the Q value.

Benefits of technology

This configuration effectively reduces current loss and improves the Q value of the inductor component.

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Abstract

To provide an inductor component that improves the Q value.SOLUTION: An inductor component 1 includes an element body 10, a coil 20 disposed within the element body and wound around an axis AX, a first external electrode, and a second external electrode, the element body is made of an insulator. The coil includes a first outer coil wiring layer 201 located outermost on one axial side, a second outer coil wiring layer 202 disposed one layer inward from the first outer coil wiring layer, a third outer coil wiring layer 210 located outermost on the other axial side, a fourth outer coil wiring layer 209 disposed one layer inward from the third outer coil wiring layer, and at least one inner coil wiring layer 203 to 208 located between the second outer coil wiring layer and the fourth outer coil wiring layer, and the thickness of each of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer, and the fourth outer coil wiring layer is smaller than the thickness of each of all the inner coil wiring layers.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] A conventional inductor component is described in Japanese Patent Application Laid-Open No. 2021-27251 (Reference 1). This inductor component has an element body and a coil disposed within the element body and wound along an axis. The coil has multiple coil wiring layers stacked along the axis. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-27251 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional inductor components, all coil wiring layers have the same thickness. However, if an attempt is made to increase the thickness of the coil wiring layers in order to reduce Rdc, current may concentrate in some of the coil wiring layers, resulting in loss and a decrease in the Q value of the inductor component.

[0005] Therefore, one object of the present invention is to provide an inductor component that can improve the Q value. [Means for solving the problem]

[0006] In order to solve the above problem, according to one aspect of the present disclosure, The base body and a coil disposed within the element body and wound around an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face facing each other, a first side face and a second side face facing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face facing the bottom face, the element body is made of an insulator, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface, The coil has a first outer coil wiring layer located outermost on one side in the axial direction, a second outer coil wiring layer provided one layer inward from the first outer coil wiring layer, a third outer coil wiring layer located outermost on the other side in the axial direction, a fourth outer coil wiring layer provided one layer inward from the third outer coil wiring layer, and at least one inner coil wiring layer located between the second outer coil wiring layer and the fourth outer coil wiring layer, The object of the present invention is to provide an inductor component in which the thickness of each of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer and the fourth outer coil wiring layer is smaller than the thickness of each of all the inner coil wiring layers. The "thickness of the coil wiring layer" refers to measuring the maximum dimension of the coil wiring layer in the direction along the axis at four cross sections including the axis, and then measuring the average of these maximum values. Here, the four cross sections include, for example, a cross section that is perpendicular to the top and bottom surfaces and includes the axis, a cross section that is perpendicular to the first end surface and the second end surface and includes the axis, a cross section that passes through the intersection line between the top surface and the first end surface and the intersection line between the bottom surface and the second end surface and includes the axis, and a cross section that passes through the intersection line between the top surface and the second end surface and the intersection line between the bottom surface and the first end surface and includes the axis.

[0007] The above-described embodiment allows the current to be dispersed more effectively and current concentration to be suppressed, thereby reducing current loss and improving the Q value of the inductor component. [Effects of the Invention]

[0008] According to the present disclosure, an inductor component capable of improving the Q value can be provided. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective view of the inductor component of the first embodiment. [Figure 2] FIG. 2 is a perspective front view of the inductor component of FIG. [Figure 3] 3 is a cross-sectional view of the inductor component of FIG. 2 taken along line III-III. [Figure 4A] FIG. 2 is an exploded view of the inductor component of FIG. [Figure 4B] FIG. 2 is an exploded view of the inductor component of FIG. [Figure 5] FIG. 3 is a simulation diagram of the inductor component of the first embodiment. [Figure 6] FIG. 10 is a cross-sectional view of an inductor component according to a second embodiment. [Figure 7] FIG. 10 is a cross-sectional view of an inductor component according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an inductor component according to one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0011] First Embodiment Fig. 1 is a perspective view showing a first embodiment of the inductor component. Fig. 2 is a perspective front view of the inductor component of Fig. 1. Fig. 3 is a cross-sectional view taken along III-III in Fig. 2. Figs. 4A and 4B are exploded views of the inductor component of Fig. 1. For convenience, Fig. 2 depicts the inductor component as transparent so that the structure can be easily understood, but it may also be translucent or opaque.

[0012] 1, 2, and 3, inductor component 1 is electrically connected to wiring on a circuit board (not shown) via first and second external electrodes 30, 40. Inductor component 1 is used, for example, as an impedance matching coil (matching coil) for high-frequency circuits, and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, and medical and industrial machinery. However, the uses of inductor component 1 are not limited to this, and it can also be used, for example, in tuning circuits, filter circuits, rectifying and smoothing circuits, and the like.

[0013] The element body 10 is formed in a substantially rectangular parallelepiped shape. The surfaces of the element body 10 include a first end face 15 and a second end face 16 that face each other, a first side face 13 and a second side face 14 that face each other, a bottom face 17 that is connected between the first end face 15 and the second end face 16 and between the first side face 13 and the second side face 14, and a top face 18 that faces the bottom face 17. The bottom face 17 is the face that faces the mounting board (not shown) when the inductor component 1 is mounted on the mounting board. As shown in the figure, the X direction is perpendicular to the first end face 15 and the second end face 16 and is the direction from the first end face 15 to the second end face 16. The Y direction is perpendicular to the first side face 13 and the second side face 14 and is the direction from the second side face 14 to the first side face 13. The Z direction is perpendicular to the bottom face 17 and the top face 18 and is the direction from the bottom face 17 to the top face 18. The X direction is also referred to as the length direction of the element body 10, the Y direction is also referred to as the width direction of the element body 10, and the Z direction is also referred to as the height direction of the element body 10. The X direction, Y direction, and Z direction are perpendicular to each other and, when arranged in the order X, Y, Z, form a left-handed system.

[0014] The first external electrode 30 and the second external electrode 40 are made of a conductive material such as Ag, Cu, Au, or an alloy containing any of these as a main component. The first external electrode 30 and the second external electrode 40 may have a Ni plating layer and a Sn plating layer, in that order, on an underlayer of the above-mentioned conductive material (e.g., Ag, Cu, or Au). In this case, the Ni plating layer and the Sn plating layer may protrude from the surface of the element body 10 so as to cover the underlayer. The first external electrode 30 is L-shaped and extends from the first end face 15 to the bottom face 17. The first external electrode 30 is embedded in the element body 10 so as to be exposed from the first end face 15 and the bottom face 17. The second external electrode 40 is L-shaped and extends from the second end face 16 to the bottom face 17. The second external electrode 40 is embedded in the element body 10 so as to be exposed from the second end face 16 and the bottom face 17. In the first embodiment, the first external electrode 30 and the second external electrode 40 have an L-shape, but they may have other shapes, for example, a shape in which they are provided only on the bottom surface.

[0015] The first external electrode 30 and the second external electrode 40 have a configuration in which a plurality of first external electrode conductor layers 33 and second external electrode conductor layers 43 embedded in the element body 10 are stacked. The first external electrode conductor layer 33 extends along the first end face 15 and the bottom face 17, and the second external electrode conductor layer 43 extends along the second end face 16 and the bottom face 17. This allows the first and second external electrodes 30, 40 to be embedded in the element body 10, thereby enabling the inductor component to be more compact than a configuration in which external electrodes are externally attached to the element body 10. Furthermore, the coil 20 and the first and second external electrodes 30, 40 can be formed in the same process, reducing variation in the positional relationship between the coil 20 and the first and second external electrodes 30, 40, and thereby reducing variation in the electrical characteristics of the inductor component 1.

[0016] The coil 20 is made of, for example, the same conductive material as the first and second external electrodes 30, 40. A first end of the coil 20 is connected to the first external electrode 30, and a second end of the coil 20 is connected to the second external electrode 40. In this embodiment, the coil 20 and the first and second external electrodes 30, 40 are integrated and no clear boundary exists between them, but this is not limiting, and a boundary may exist between them by forming the coil and the external electrodes using different materials or different manufacturing methods.

[0017] The coil 20 has an axis AX that is parallel to the bottom surface 17 and intersects the first side surface 13 and the second side surface 14. The coil 20 is wound along the axis AX. The axis AX of the coil 20 coincides with the Y direction. The axis AX of the coil 20 refers to the central axis of the spiral shape of the coil 20.

[0018] Coil 20 has a winding portion 23, a first lead portion 21 connected between a first end of winding portion 23 and first external electrode 30, and a second lead portion 22 connected between a second end of winding portion 23 and second external electrode 40. In this embodiment, winding portion 23 and first and second lead portions 21, 22 are integrated and no clear boundary exists, but this is not limited thereto, and a boundary may exist when the winding portion and the lead portions are formed using different materials or different manufacturing methods.

[0019] The winding portion 23 is wound in a spiral shape along the axis AX. In other words, the winding portion 23 refers to the portion of the coils 20 wound in a spiral shape where they overlap each other when viewed in a direction parallel to the axis AX. The first and second lead-out portions 21, 22 refer to the portions outside the overlapping portions. The winding portion 23 is formed in a substantially rectangular shape when viewed in the direction of the axis AX, but is not limited to this shape. The shape of the winding portion 23 may be, for example, a circle, an ellipse, or another polygon.

[0020] The element body 10 is made of an insulator 50, which has multiple laminated insulating layers. Specifically, the element body 10 is configured by laminating first to twenty-first insulating layers 501 to 521 in order from the second side surface 14 to the first side surface 13. These first to twenty-first insulating layers 501 to 521 are made of, for example, a material mainly composed of borosilicate glass, ferrite, resin, or other material. The lamination direction of the first to twenty-first insulating layers 501 to 521 is a direction (Y direction) parallel to the first and second end surfaces 15, 16 and the bottom surface 17 of the element body 10 and coincides with the axis AX of the coil 20. In other words, the first to twenty-first insulating layers 501 to 521 are layered and extend across the XZ plane. In this specification, "parallel" is not limited to a strict parallel relationship but also includes a substantial parallel relationship, taking into account a realistic range of variation. In element body 10, the interfaces between first to twenty-first insulating layers 501 to 521 may not be clear due to firing or the like.

[0021] The first insulating layer 501 (hereinafter also referred to as the first outermost insulating layer 501) has a second side surface 14 which is the surface opposite to the second insulating layer 502. The twenty-first insulating layer 521 (hereinafter also referred to as the second outermost insulating layer 521) has a first side surface 13 which is the surface opposite to the twentieth insulating layer 520. Note that, hereinafter, the third insulating layer 503 will also be referred to as the first outer insulating layer 503, the fifth insulating layer 505 will also be referred to as the second outer insulating layer 505, the seventeenth insulating layer 517 will also be referred to as the fourth outer insulating layer 517, and the nineteenth insulating layer 519 will also be referred to as the third outer insulating layer 519. The seventh insulating layer 507 is also called the first inner insulating layer 507, the ninth insulating layer 509 is also called the second inner insulating layer 509, the eleventh insulating layer 511 is also called the third inner insulating layer 511, the thirteenth insulating layer 513 is also called the fourth inner insulating layer 513, and the fifteenth insulating layer 515 is also called the fifth inner insulating layer 515.

[0022] 3, 4A, and 4B, the coil 20 has a plurality of coil wiring layers 201-210 stacked along the axis AX, and a via wiring layer 29 extending along the axis AX to connect the coil wiring layers adjacent in the direction of the axis AX. In FIGS. 4A and 4B, the direction from the upper left to the lower right is defined as the stacking direction (Y direction).

[0023] The multiple coil wiring layers 201-210 penetrate the insulating layers in the thickness direction (Y direction). Adjacent coil wiring layers in the stacking direction are electrically connected in series via via wiring layers 29. In this manner, the multiple coil wiring layers 201-210 form a spiral while being electrically connected in series with each other. Note that in the above embodiment, the via wiring layer 29 has an arc shape or a linear shape as shown in FIGS. 4A and 4B, but it may have another shape, for example, a circular shape.

[0024] Specifically, the first to tenth coil wiring layers 201-210 are stacked in order along the axis AX direction (Y direction). An end of the first coil wiring layer 201 is electrically connected to the first external electrode conductor layer 33 of the first external electrode 30. An end of the tenth coil wiring layer 210 is electrically connected to the second external electrode conductor layer 43 of the second external electrode 40. The first external electrode conductor layer 33 is provided on the second to twentieth insulating layers 502 to 520 from the first end face 15 to the bottom face 17. The second external electrode conductor layer 43 is provided on the second to twentieth insulating layers 502 to 520 from the second end face 16 to the bottom face 17. The first coil wiring layer 201 is located at the outermost position on one side in the axial AX direction (i.e., the second side surface 14 side), and hereinafter also referred to as the first outer coil wiring layer 201. The second coil wiring layer 202 is provided one layer inward in the axial AX direction from the first outer coil wiring layer 201, and hereinafter also referred to as the second outer coil wiring layer 202. The tenth coil wiring layer 210 is located at the outermost position on the other side in the axial AX direction (i.e., the first side surface 13 side), and hereinafter also referred to as the third outer coil wiring layer 210. The ninth coil wiring layer 209 is provided one layer inward in the axial AX direction from the third outer coil wiring layer 210, and hereinafter also referred to as the fourth outer coil wiring layer 209. The third coil wiring layer 203, the fourth coil wiring layer 204, the fifth coil wiring layer 205, the sixth coil wiring layer 206, the seventh coil wiring layer 207 and the eighth coil wiring layer 208 are located between the second outer coil wiring layer 202 and the fourth outer coil wiring layer 209, and hereinafter are also referred to as the first inner coil wiring layer 203, the second inner coil wiring layer 204, the third inner coil wiring layer 205, the fourth inner coil wiring layer 206, the fifth inner coil wiring layer 207 and the sixth inner coil wiring layer 208. The first to tenth coil wiring layers 201-210 are each wound along a plane. The number of turns of the first to tenth coil wiring layers 201-210 is less than one turn, but may be one or more turns. In the above embodiment, six layers of the first to sixth inner coil wiring layers 203-208 are described, but the number of inner coil wiring layers is not particularly limited, and may be one or more layers.

[0025] The first outermost insulating layer 501 has a second side surface 14 of the element body 10 and is in contact with the second insulating layer 502 on the surface opposite to the second side surface 14. The first outer coil wiring layer 201 is provided on the second insulating layer 502 (XZ plane) perpendicular to the axial AX direction and connected to the first external electrode conductor layer 33 via the first lead-out portion 21. The first outer insulating layer 503 has a via wiring layer 29, which is connected to the first outer coil wiring layer 201. The second outer coil wiring layer 202 is provided on a fourth insulating layer 504 perpendicular to the axial AX direction and connected to the via wiring layer 29 of the first outer insulating layer 503. The second outer insulating layer 505 has a via wiring layer 29, which is connected to the second outer coil wiring layer 202. The first inner coil wiring layer 203 is provided on a sixth insulating layer 506 perpendicular to the axial AX direction and connected to the via wiring layer 29 of the second outer insulating layer 505. The first inner insulating layer 507 has a via wiring layer 29, and the via wiring layer 29 is connected to the first inner coil wiring layer 203. The second inner coil wiring layer 204 is provided on an eighth insulating layer 508 perpendicular to the axial AX direction, and connected to the via wiring layer 29 of the first inner insulating layer 507. The second inner insulating layer 509 has a via wiring layer 29, and the via wiring layer 29 is connected to the second inner coil wiring layer 204. The third inner coil wiring layer 205 is provided on a tenth insulating layer 510 perpendicular to the axial AX direction, and connected to the via wiring layer 29 of the second inner insulating layer 509. The third inner insulating layer 511 has a via wiring layer 29, and the via wiring layer 29 is connected to the third inner coil wiring layer 205. The fourth inner coil wiring layer 206 is provided on a twelfth insulating layer 512 perpendicular to the axial AX direction, and connected to the via wiring layer 29 of the third inner insulating layer 511. The fourth inner insulating layer 513 has a via wiring layer 29, and the via wiring layer 29 is connected to the fourth inner coil wiring layer 206. The fifth inner coil wiring layer 207 is provided on a fourteenth insulating layer 514 perpendicular to the axis AX direction, and is connected to the via wiring layer 29 of the fourth inner insulating layer 513. The fifth inner insulating layer 515 has a via wiring layer 29, and the via wiring layer 29 is connected to the fifth inner coil wiring layer 207. The sixth inner coil wiring layer 208 is provided on a sixteenth insulating layer 516 perpendicular to the axis AX direction, and is connected to the via wiring layer 29 of the fifth inner insulating layer 515. The fourth outer insulating layer 517 has a via wiring layer 29, and the via wiring layer 29 is connected to the sixth inner coil wiring layer 208.The fourth outer coil wiring layer 209 is provided on an eighteenth insulating layer 518 perpendicular to the axial AX direction, and is connected to the via wiring layer 29 of the fourth outer insulating layer 517. The third outer insulating layer 519 has a via wiring layer 29, and the via wiring layer 29 is connected to the fourth outer coil wiring layer 209. The third outer coil wiring layer 210 is provided on a twentieth insulating layer 520 perpendicular to the axial AX direction, and is connected to the via wiring layer 29 of the third outer insulating layer 519, and is connected to the second outer electrode conductor layer 43 via the second lead-out portion 22. The second outermost insulating layer 521 is in contact with the twentieth insulating layer 520, and has the first side surface 13 of the element body 10 on the surface opposite to the twentieth insulating layer 520.

[0026] Here, the inventors of the present application conducted experiments by reducing the thicknesses of the first outer coil wiring layer 201 and the third outer coil wiring layer 210, but found that the Q value could not be sufficiently increased even if the thicknesses of the first and third outer coil wiring layers 201, 210 were reduced. In contrast, it was found from Fig. 5 and other figures that the Q value increases when the thicknesses of the first to fourth outer coil wiring layers 201, 202, 210, 209 are reduced. In other words, the thicknesses of the first outer coil wiring layer 201, the second outer coil wiring layer 202, the third outer coil wiring layer 210, and the fourth outer coil wiring layer 209 are each smaller than the thicknesses of the first to sixth inner coil wiring layers 203-208. The "thickness of the coil wiring layer" refers to measuring the maximum dimension of the coil wiring layer in the direction along the axis AX in four cross sections including the axis AX, and measuring the average of these maximum dimensions. Here, the four cross sections include, for example, a cross section that is perpendicular to the top surface 18 and the bottom surface 17 and includes the axis AX, a cross section that is perpendicular to the first end surface 15 and the second end surface 16 and includes the axis AX, a cross section that passes through the intersection line between the top surface 18 and the first end surface 15 and the intersection line between the bottom surface 17 and the second end surface 16 and includes the axis AX, and a cross section that passes through the intersection line between the top surface 18 and the second end surface 16 and the intersection line between the bottom surface 17 and the first end surface 15 and includes the axis AX.

[0027] The relationship between the thickness of the inner coil wiring layer and the Q value of the inductor component 1 will be described with reference to Fig. 5. In Fig. 5, the X-axis represents the thickness (µm) of the inner coil wiring layer, and the Y-axis represents the Q value at 2 GHz. That is, in Fig. 5, the solid line represents the relationship between the thickness of each of the first to sixth inner coil wiring layers 203-208 and the corresponding Q value. In this case, the average thickness of each of the first to fourth outer coil wiring layers 201, 202, 210, and 209 is smaller than the average thickness of each of the first to sixth inner coil wiring layers 203-208. The first to fourth outer coil wiring layers 201, 202, 210, and 209 have the same thickness, and the first to sixth inner coil wiring layers 203-208 have the same thickness. The thickness of the first to fourth outer coil wiring layers 201, 202, 210, and 209 is fixed at 8 μm, and the thickness of the first to sixth inner coil wiring layers 203-208 is varied between 9 and 15 μm. In Fig. 5, the dotted line indicates the Q value when the coil wiring layers for comparison all have the same thickness. From Fig. 5, it can be seen that when the first to fourth outer coil wiring layers 201, 202, 210, and 209 are smaller in thickness (solid line), a higher Q value is exhibited than when they all have the same thickness (dotted line). The measurement in Figure 5 was performed using the electromagnetic field simulator HFSS (a 3D electromagnetic field simulator for RF / wireless design) to simulate the Q value. The simulation was performed with a frequency of 2 GHz, dimensions of the element body 10 of 4 mm x 2 mm x 2 mm, a line width of the coil wiring layer of 10 μm, number of coil turns of 8.5, number of coil wiring layers of 10, and coil length thickness of 175 μm. The coil length is the thickness of the element body 10 excluding the first outermost insulating layer 501 and the second outermost insulating layer 521 when viewed from a direction perpendicular to the axis AX, i.e., the thickness from the surface of the second insulating layer 502 facing the first outermost insulating layer 501 to the surface of the twentieth insulating layer 520 facing the second outermost insulating layer 521. The first to fifth inner insulating layers 507, 509, 511, 513, 515 each have a uniform thickness, and is a value calculated based on (175 μm - thickness of the first to sixth inner coil wiring layers 203-208 x 10) / 9. The first to fourth outer insulating layers 503, 505, 519, and 517 each have a uniform thickness, which is calculated based on (175 μm - thickness of first to sixth inner coil wiring layers 203-208 x 6 - thickness of first to fifth inner insulating layers 507, 509, 511, 513, and 515 x 5 - thickness of first to fourth outer coil wiring layers 201, 202, 210, and 209 x 4) / 4. The insulating layer thickness of the coil wiring layer used for comparison is calculated based on (175 μm - thickness of coil wiring layer x 10) / 9.

[0028] The thickness of each of the first outer coil wiring layer 201, the second outer coil wiring layer 202, the third outer coil wiring layer 210, and the fourth outer coil wiring layer 209 is smaller than the thickness of each of the first to sixth inner coil wiring layers 203 to 208. The above configuration reduces the cross-sectional area of ​​the first to fourth outer coil wiring layers 201, 202, 210, and 209. This allows current to be dispersed and current concentration to be suppressed. As a result, current loss can be reduced and the Q value of the inductor component can be improved. In this embodiment, the thicknesses of the first outer coil wiring layer 201, the second outer coil wiring layer 202, the third outer coil wiring layer 210, and the fourth outer coil wiring layer 209 are equal to each other, but may be different from each other. The thicknesses of the first to sixth inner coil wiring layers 203 to 208 are equal to each other, but may be different from each other.

[0029] Preferably, the thicknesses of the first outer insulating layer 503 between the first outer coil wiring layer 201 and the second outer coil wiring layer 202, the second outer insulating layer 505 between the second outer coil wiring layer 202 and the first inner coil wiring layer 203, the third outer insulating layer 519 between the third outer coil wiring layer 210 and the fourth outer coil wiring layer 209, and the fourth outer insulating layer 517 between the fourth outer coil wiring layer 209 and the sixth inner coil wiring layer 208 are greater than the thicknesses of the first to fifth inner insulating layers 507, 509, 511, 513, and 515 between the first to sixth inner coil wiring layers 203-208 adjacent to each other in the axial direction AX. This configuration allows current to be dispersed and current concentration to be suppressed. As a result, current loss can be reduced and the Q value of the inductor component can be improved. In this embodiment, the first outer insulating layer 503, the second outer insulating layer 505, the third outer insulating layer 519, and the fourth outer insulating layer 517 have the same thickness, but may have different thicknesses. Also, the first to fifth inner insulating layers 507, 509, 511, 513, and 515 have the same thickness, but may have different thicknesses. The "thickness of the insulating layer" refers to the average of the minimum distances between the coil wiring layers in the direction along the axis AX measured at four cross sections including the axis AX. Here, the four cross sections include, for example, a cross section perpendicular to the top surface 18 and the bottom surface 17 and including the axis AX, a cross section perpendicular to the first end surface 15 and the second end surface 16 and including the axis AX, a cross section passing through the intersection line between the top surface 18 and the first end surface 15 and the intersection line between the bottom surface 17 and the second end surface 16 and including the axis AX, and a cross section passing through the intersection line between the top surface 18 and the second end surface 16 and the intersection line between the bottom surface 17 and the first end surface 15 and including the axis AX.

[0030] Preferably, the average thickness of the first to sixth inner coil wiring layers 203 to 208 is in the range of 120% to 175% of the average thickness of the first outer coil wiring layer 201, the second outer coil wiring layer 202, the third outer coil wiring layer 210, and the fourth outer coil wiring layer 209. This configuration ensures that current can be dispersed and current concentration can be suppressed. As a result, current loss can be further reduced, and the Q value of the inductor component can be further improved.

[0031] (Manufacturing method of inductor component 1) 4A, from top to bottom, a first outer coil wiring layer 201 is provided on a first outermost insulating layer 501, and a plurality of via wiring layers 29, a second outer coil wiring layer 202, a first inner coil wiring layer 203, a second inner coil wiring layer 204, and a third inner coil wiring layer 205 are alternately laminated. Subsequently, as shown in FIG. 4B, from top to bottom, a fourth inner coil wiring layer 206, a fifth inner coil wiring layer 207, a sixth inner coil wiring layer 208, a fourth outer coil wiring layer 209, and a third outer coil wiring layer 210 are alternately provided with a plurality of via wiring layers 29, and further a second outermost insulating layer 521 is laminated on the third outer coil wiring layer 210. The via wiring layers 29 are provided to connect the first and second outer coil wiring layers 201, 202, the first to sixth inner coil wiring layers 203 to 208, and the fourth and third outer coil wiring layers 209, 210, respectively. In this way, the inductor component 1 is manufactured. The first and second outer coil wiring layers 201, 202, the first to sixth inner coil wiring layers 203-208, and the fourth and third outer coil wiring layers 209, 210 are provided on the insulating layer by, for example, screen printing. Openings are provided in the insulating layer by, for example, photolithography or laser processing, and the via wiring layer 29 is provided in the openings of the insulating layer by, for example, screen printing.

[0032] Second Embodiment 6 is a cross-sectional view of the inductor component 1A. The second embodiment differs from the first embodiment in the thickness of the insulating layer. This difference in configuration will be described below. The other configurations are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0033] The thickness of the first outer insulating layer 503 between the first outer coil wiring layer 201 and the second outer coil wiring layer 202, the thickness of the second outer insulating layer 505 between the second outer coil wiring layer 202 and the first inner coil wiring layer 203, the thickness of the third outer insulating layer 519 between the third outer coil wiring layer 210 and the fourth outer coil wiring layer 209, the thickness of the fourth outer insulating layer 517 between the fourth outer coil wiring layer 209 and the sixth inner coil wiring layer 208, and the thicknesses of the first to fifth inner insulating layers 507, 509, 511, 513, and 515 between the axially adjacent first to sixth inner coil wiring layers 203-208 are all the same. This configuration allows for better current dispersion and suppression of current concentration. As a result, current loss can be further reduced, and the Q value of the inductor component can be further improved. Furthermore, the insulating layers can be easily installed.

[0034] Third Embodiment FIG. 7 is a cross-sectional view of inductor component 1B. The third embodiment is a cross-sectional view of inductor component 1B. The third embodiment differs from the first embodiment in the thickness of the insulating layer. This different configuration will be described below. The other configurations are the same as those of the first embodiment, and the description thereof will be omitted.

[0035] The thickness of the first outer coil wiring layer 201 is smaller than the thickness of the second outer coil wiring layer 202. This configuration ensures that the current can be dispersed and current concentration can be suppressed. As a result, the current loss can be further reduced and the Q value of the inductor component can be improved.

[0036] Preferably, the thickness of the third outer coil wiring layer 210 is smaller than the thickness of the fourth outer coil wiring layer 209. With this configuration, current can be reliably dispersed and current concentration can be suppressed. As a result, current loss can be further reduced and the Q value of the inductor component can be further improved. The thicknesses of the first outer coil wiring layer 201 and the third outer coil wiring layer 210 may be different from each other. The thicknesses of the second outer coil wiring layer 202 and the fourth outer coil wiring layer 209 may be different from each other. The thicknesses of the first to sixth inner coil wiring layers 203 to 208 may be different from each other.

[0037] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the spirit of the present disclosure. For example, the features of the first to third embodiments may be combined in various ways.

[0038] The present disclosure includes the following aspects. <1> The base body and a coil disposed within the element body and wound around an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end face and a second end face facing each other, a first side face and a second side face facing each other, a bottom face connected between the first end face and the second end face and between the first side face and the second side face, and a top face facing the bottom face, the element body is made of an insulator, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface, The coil has a first outer coil wiring layer located outermost on one side in the axial direction, a second outer coil wiring layer provided one layer inward from the first outer coil wiring layer, a third outer coil wiring layer located outermost on the other side in the axial direction, a fourth outer coil wiring layer provided one layer inward from the third outer coil wiring layer, and at least one inner coil wiring layer located between the second outer coil wiring layer and the fourth outer coil wiring layer, an inductor component, wherein the thickness of each of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer, and the fourth outer coil wiring layer is smaller than the thickness of each of all the inner coil wiring layers. <2> The insulator has a plurality of stacked insulating layers, the thickness of each of the insulating layer between the first outer coil wiring layer and the second outer coil wiring layer, the insulating layer between the second outer coil wiring layer and the inner coil wiring layer, the insulating layer between the third outer coil wiring layer and the fourth outer coil wiring layer, and the insulating layer between the fourth outer coil wiring layer and the inner coil wiring layer is greater than the thickness of the insulating layer between the inner coil wiring layers adjacent in the axial direction; <1> The inductor component according to claim 1. <3> The insulator has a plurality of stacked insulating layers, the thickness of the insulating layer between the first outer coil wiring layer and the second outer coil wiring layer, the thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer, the thickness of the insulating layer between the third outer coil wiring layer and the fourth outer coil wiring layer, the thickness of the insulating layer between the fourth outer coil wiring layer and the inner coil wiring layer, and the thickness of the insulating layer between the axially adjacent inner coil wiring layers are all the same; <1> The inductor component according to claim 1. <4> the thickness of the inner coil wiring layer is in the range of 120% to 175% of the average value of the thicknesses of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer, and the fourth outer coil wiring layer; <1> ~ <3> 10. An inductor component according to any one of claims 1 to 9. <5> The thickness of the first outer coil wiring layer is smaller than the thickness of the second outer coil wiring layer. <1> ~ <4> 10. An inductor component according to any one of claims 1 to 9. <6> The thickness of the third outer coil wiring layer is smaller than the thickness of the fourth outer coil wiring layer. <1> ~ <5> 10. An inductor component according to any one of claims 1 to 9. [Explanation of symbols]

[0039] 1,1A,1B inductor components 10 Base 13 First aspect 14 Second aspect 15 First end surface 16 Second end face 17 Bottom 18 Top 20 coils 21 1st drawer 22 Second drawer 23 Winding section 29 Via wiring layer 30 1st external electrode 33 First external electrode conductor layer 40 2nd external electrode 43 Second external electrode conductor layer 201~210 Coil wiring layer 50 Insulator 501~521 Insulation layer AX axis

Claims

1. The base body and a coil disposed within the element body and wound around an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil; Equipped with the element body includes a first end surface and a second end surface facing each other, a first side surface and a second side surface facing each other, a bottom surface connected between the first end surface and the second end surface and between the first side surface and the second side surface, and a top surface facing the bottom surface, the element body is made of an insulator, the axis is parallel to the bottom surface and intersects the first side surface and the second side surface, The coil has a first outer coil wiring layer located outermost on one side in the axial direction, a second outer coil wiring layer provided one layer inward from the first outer coil wiring layer, a third outer coil wiring layer located outermost on the other side in the axial direction, a fourth outer coil wiring layer provided one layer inward from the third outer coil wiring layer, and at least one inner coil wiring layer located between the second outer coil wiring layer and the fourth outer coil wiring layer, an inductor component, wherein the thickness of each of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer, and the fourth outer coil wiring layer is smaller than the thickness of each of all of the inner coil wiring layers.

2. The insulator has a plurality of stacked insulating layers, 2. The inductor component according to claim 1, wherein the thickness of each of the insulating layer between the first outer coil wiring layer and the second outer coil wiring layer, the insulating layer between the second outer coil wiring layer and the inner coil wiring layer, the insulating layer between the third outer coil wiring layer and the fourth outer coil wiring layer, and the insulating layer between the fourth outer coil wiring layer and the inner coil wiring layer is greater than the thickness of the insulating layer between axially adjacent inner coil wiring layers.

3. The insulator has a plurality of stacked insulating layers, 2. The inductor component according to claim 1, wherein the thickness of the insulating layer between the first outer coil wiring layer and the second outer coil wiring layer, the thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer, the thickness of the insulating layer between the third outer coil wiring layer and the fourth outer coil wiring layer, the thickness of the insulating layer between the fourth outer coil wiring layer and the inner coil wiring layer, and the thickness of the insulating layer between axially adjacent inner coil wiring layers are all the same.

4. 2. The inductor component of claim 1, wherein the thickness of the inner coil wiring layer is in the range of 120% to 175% of the average value of the thicknesses of the first outer coil wiring layer, the second outer coil wiring layer, the third outer coil wiring layer, and the fourth outer coil wiring layer.

5. The inductor component according to claim 1 , wherein the thickness of the first outer coil wiring layer is smaller than the thickness of the second outer coil wiring layer.

6. The inductor component according to claim 1 , wherein the thickness of the third outer coil wiring layer is smaller than the thickness of the fourth outer coil wiring layer.

Citation Information

Patent Citations

  • Inductor component

    JP2021027251A