System having heated valve manifold assembly, and method of manufacture of the system

Abstract

To provide a heated valve manifold assembly, a system having the same, a method of assembling, and a method of repairing.SOLUTION: A system for semiconductor fabrication distributes a fluid to one or more tools and has a heated valve manifold assembly. The heated valve manifold assembly comprises: a heat-conductive plate having a first side and a second side; a heater contacting the heat-conductive plate; a valve manifold comprising a plurality of valves and pipes, the plurality of valves and pipes having a total surface area in which a portion of the surface area of the valves and pipes contacts the heat-conductive plate; and one or more layers of insulation covering (1) a majority portion of the surface area of the plurality of valves and pipes, which contacts the heat-conductive plate, (2) the heater contacting the heat-conductive plate, and (3) a majority portion of the surface area of the heat-conductive plate.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Application No. 63 / 057872, filed July 28, 2020, the entire contents of which are incorporated herein by reference for all possible purposes. [Background technology]

[0002] The present invention relates to a heated valve manifold assembly, a system having the same, a method for assembling the same, and a method for repairing the same.

[0003] It is often necessary to distribute chemicals to a series of points of use located within an industrial facility. For example, in a semiconductor manufacturing facility, liquid chemicals such as photoresist, slurries, hydrofluoric acid, hydrogen peroxide, ammonium hydroxide, etc. are distributed to various tools used in semiconductor manufacturing. Similarly, vapor-phase chemicals such as hydrogen fluoride, nitrogen trifluoride, and anhydrous ammonia may need to be distributed in the same manner. Typically, a source unit, which may be one or more pumps, a chemical container, or a pressure vessel directs fluid flow through a fluid circuit having a series of valve manifolds used to connect a group of tools to the fluid circuit. Often, the fluid circuit is provided with a valve box that encloses the valve manifolds. As a result, any potential leaks from either the pipes or the valve manifolds are deposited in the valve manifold box (VMB), which thereby serves to contain the leak. These boxes can utilize ventilation to provide a means of elimination of or protection from hazardous vapor-phase process materials. Alternatively, if no hazardous materials are present, there may be no enclosed box at all. In this case, the entire assembly is sometimes referred to as a valve manifold panel or VMP.

[0004] Manifolds may also be provided in gas or chemical transport cabinets. Typically, gas transport cabinets deliver gas from a gas-filled supply container to one or more tools in a semiconductor manufacturing facility. Chemical transport cabinets deliver fluids to one or more tools in a semiconductor manufacturing facility. The fluid may be a gas or a liquid when delivered to the tool from a supply container that typically has a solid, liquid, or gas therein. Gas and chemical transport cabinets may be very complex to enable pneumatic actuators and the like to deliver the push or purge gas and / or the solvent wash or gas.

[0005] It may be necessary or advantageous to heat valves and pipes used in a valve manifold, for example, a valve manifold box, a gas transport cabinet, or a chemical transport cabinet, to improve the flow of one or more fluids therein, particularly when the fluid is viscous at low temperatures and / or when room temperature is at or near the temperature at which the fluid changes into (or out of) the desired transport phase of the substance.

[0006] Heat is typically provided to the valves and pipes that make up a manifold by using heat tracing, an electrical resistance heating wire that surrounds each valve and pipe that makes up the manifold and is intended to provide heat to the respective valves and pipes. Typically, one or more layers of insulating tape are wrapped around the wire to prevent heat from radiating to the surrounding environment. Figure 1 shows heat tracing used around pipes in a prior art gas or chemical transport cabinet. When repairs are needed on a valve or pipe, the heat tracing must be unwrapped and removed. While heat tracing is effective and reliable in the absence of interruptions, when the heat trace is removed, the wire often breaks and must be replaced. Heat tracing and the insulating layers attached thereto require significant labor and time to install during original manufacturing, remove for repair, and reinstall after the repair is made. There is a significant drive to maximize the uptime of all tools in a manufacturing facility, including systems that supply gases and chemicals required for manufacturing, and therefore, to increase the uptime of all systems that have manifolds that supply gases and chemicals to the tools. Additionally, there is a drive to reduce the footprint of manifolds and the transport systems in which they are located, resulting in an increase in the number of valves and pipes in a given space, including an increase in the size and number of feeds to containers in gas transport cabinets and chemical transport cabinets. Additionally, there is a need to accelerate the manufacture of these manifolds. The present invention addresses these problems. Summary of the Invention

[0007] In one aspect, the invention provides a system for distributing fluid to one or more tools for semiconductor manufacturing, the system having at least one heated valve manifold assembly, the at least one heated valve manifold assembly comprising: a thermally conductive plate having a total surface area, the thermally conductive plate having a first side and a second side; at least one heater in contact with the at least one thermally conductive plate; a valve manifold comprising a plurality of valves and pipes having a total surface area, the plurality of valves and pipes having a total surface area, a portion of the total surface area of ​​the plurality of valves and pipes in contact with the at least one thermally conductive plate; and one or more layers of thermal insulation material covering (i) a majority of the surface area of ​​the plurality of valves and pipes, the portion of the surface area of ​​the plurality of valves and pipes in contact with the at least one thermally conductive plate, (ii) at least one heater in contact with the at least one thermally conductive plate, and (iii) a majority of the surface area of ​​the at least one thermally conductive plate.

[0008] In the system, the one or more layers of insulation may include an insulation board, insulation attached to a plastic cover, and / or an insulated jacket, which may be made of a soft insulating material, custom-made to conform to the plurality of valves and pipes, and / or shaped to provide a heated air volume toward the center of a thermally conductive plate, where many of the plurality of pipes and valves are attached to the thermally conductive plate. The one or more layers of insulation in any of the embodiments described herein may be removably attached to the conductive plate using fasteners selected from bolts, screws, clamps, cable ties, magnets, adhesives, zippers, snaps, clasps, bungee cords, hook and eye, or hook and loop strips (e.g., Velcro®), or the like.

[0009] In another aspect of the present invention, alone or in addition to any aspect, a portion of the plurality of valves and pipes contacts a first side of at least one thermally conductive plate; and at least one heater contacts a second side of at least one thermally conductive plate. In a further aspect, alone or in addition to any other aspect, a portion of the plurality of valves and pipes contacts a first side of at least one thermally conductive plate, and one or more heaters contacts a first side of at least one thermally conductive plate. In a further aspect, alone or in addition to any other aspect, a portion of the plurality of valves and pipes contacts a first and / or second side of at least one thermally conductive plate, and one or more heaters contacts a first and / or second side of at least one thermally conductive plate. In any system, the pipes and valves may be attached to the thermally conductive plate, and / or one or more heaters may be attached to the thermally conductive plate. In another aspect, alone or in addition to any other aspect, the assembly includes a first insulator board attached to or covering a first side of the thermally conductive plate and a second insulator board attached to or covering a second side of the thermally conductive plate. In another aspect, alone or in addition to any other aspect, the pipe attached to the thermally conductive plate has a quick-release connector that can be disconnected and reconnected for rapid removal and replacement of the heated valve manifold assembly. In another aspect, alone or in addition to any other aspect, the system of any of the preceding claims further includes a cabinet and at least one fluid container, the cabinet housing the heated valve manifold assembly and the at least one container. In another aspect, alone or in addition to any other aspect, the system of any of the preceding claims further includes a cabinet, the cabinet housing the heated valve manifold assembly.

[0010] In one alternative embodiment, alone or in addition to any other embodiment, the heating valve manifold assembly is attached to a wall or panel using a spacer to prevent contact between the heating valve manifold assembly and the wall or panel. Any system including the heating valve manifold assembly may further include a backup heater, one or more temperature sensors, one or more controllers, and / or controllers for the one or more heaters. Any system may be a gas or chemical transport cabinet, a valve manifold box, or a valve manifold panel. Additionally, any heating valve manifold assembly of any system may have one or more layers of insulator removably attached to a conductive plate using a substantially adhesive-free or adhesive-free fastener. In another aspect, the present invention further provides a method of manufacturing a system of the present invention, comprising the steps of contacting and / or attaching the pipes and valves of a valve manifold to a thermally conductive plate; contacting and / or attaching one or more heaters to the thermally conductive plate; and covering and / or attaching one or more layers of insulation to the one or more heaters, over a majority of the surfaces of the heated pipes and valves, and / or over a majority of the surface area of ​​the thermally conductive plate, to form a heated valve manifold assembly. In another aspect, the method further comprises bonding the pipes and valves of the valve manifold to create a fluid-tight seal at the valve manifold. In one alternative aspect of the method of manufacturing, alone or in conjunction with other aspects, the method of manufacturing includes attaching one or more layers of insulation with mechanical fasteners. In any method, the step of attaching one or more layers of insulation may be substantially free of or free of adhesives. Another aspect, alone or in conjunction with other aspects, is a method of repairing a system, the method including removing one or more layers of insulation to access a valve manifold; repairing a defective valve, pipe, or other component; and reinstalling one or more layers of insulation.In another aspect of the method of repairing, the removing step includes the step of removing one or more mechanical fasteners, and the reinstalling step includes the step of reinstalling one or more mechanical fasteners. In another aspect of the invention, a method of repairing a system may include the steps of removing the heated valve manifold assembly as a single unit from the system and replacing it with a new, pre-assembled heated valve manifold assembly. In another aspect of the method of repairing, the removing step includes the steps of removing one or more mechanical fasteners and opening several quick release connectors, and the replacing step includes the steps of reinstalling one or more mechanical fasteners and closing several quick release connectors.

[0011] The present invention provides for faster manufacture and repair of heated valve manifold assemblies and systems using the same. By removing a small number of fasteners, typically mechanical fasteners such as nuts, bolts, screws, and / or other, and one or more layers of thermal insulation, for example, a defective valve or other defective component can be easily accessed and repaired. The one or more layers of thermal insulation are then reinstalled using one or more fasteners, and the heated valve manifold assembly is ready for reuse, after any necessary purging steps. Preferably, the method for repairing a heated valve manifold assembly includes the steps of closing any valves to the process gas supply and, if necessary due to the nature of the process gas, purging and / or evacuating the heated valve manifold assembly and / or gas cabinet or valve manifold box or valve manifold panel before removing any fasteners and / or insulation layers. The heated valve manifold assembly of the present invention can be manufactured and repaired without the labor-intensive process of surrounding each pipe and valve multiple times with layers of heat trace wire and thermal insulation. Use of the heated valve manifold assembly of the present invention speeds system manufacturing and repair. If a pipe or valve or other component of a heated valve manifold assembly is not operational, the entire heated valve manifold assembly can be removed after unscrewing the pipe connections, unplugging any electrical connections, and removing any mounting fasteners, if any, and then replaced in its entirety with a new heated valve manifold assembly. The removed, inoperable heated valve manifold assembly may then be returned to the factory for curing, quality analysis and testing, and possible later reuse. The present invention allows for maximized uptime of all tools in a facility supplied with gases and chemicals required for manufacturing from a system having a heated valve manifold assembly therein, and increased uptime of the systems of the present invention having a heated valve manifold assembly therein.Additionally, the heated valve manifold assembly of the present invention also maximizes the space available for the pipes and valves in the manifold by eliminating the space required for a layer of thermal insulation around each valve and pipe, thereby allowing for an increased number of valves and pipes and supply containers in the same footprint or cabinet. These and other advantages are provided by the present invention.

[0012] While the specification concludes with the claims, which separately point out the subject matter which applicant regards as applicant's invention, it is believed the invention will be better understood when taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a partial front view of the interior of a prior art system showing pipes and valves surrounded by heat tracing and thermal insulation.

[0014] [Figure 2] FIG. 1 is a partial front view of the interior of the system of the present invention showing one embodiment of a heating valve manifold assembly.

[0015] [Figure 3] FIG. 10 is a partial front view of the interior of the system of the present invention showing a second embodiment of a heating valve manifold assembly.

[0016] [Figure 4] FIG. 1 is a front view of a heated valve manifold assembly used in the system of the present invention with the layer of thermal insulation removed.

[0017] [Figure 5] FIG. 2 is a partially exploded view of a portion of a heating valve manifold assembly used in the system of the present invention.

[0018] [Figure 6]FIG. 1 is a rear perspective view of one embodiment of a heating valve manifold assembly used in the system of the present invention.

[0019] [Figure 7] FIG. 2 is a perspective cross-sectional view of another embodiment of the system of the present invention having the heated valve manifold assembly of the present invention therein. DETAILED DESCRIPTION OF THE INVENTION

[0020] Detailed Description of the Invention

[0021] Systems of the present invention include VMBs and VMPs, gas and chemical delivery systems, or any system that delivers fluids to one or more tools in a facility. The description of one type of system is not meant to be limiting. Additionally, as used herein, insulator means thermal insulator and may include heat reflective material if desired.

[0022] 1 shows a number of pipes 12 and valves 14 in a prior art system, each with heat tracing (not shown) thereon and taped insulation 16. As shown, the system may be a gas or chemical supply cabinet having a housing 65, a supply container 83, and a refill container 84. As previously mentioned, while effective, installing, removing, and reinstalling the taped insulation and heat tracing is time-consuming and cumbersome. The layers of heat tracing and insulation take up space, requiring empty space around the pipes and valves for repair personnel to access and / or make repairs.

[0023] 2 and 3 show portions of the same or similar system 100, such as the gas or chemical delivery system shown in FIG. 1, in which the pipes 12 and valves 14 are similarly numbered, but using various embodiments of the heated valve manifold assembly 20 of the present invention. While the pipes leading to and from the manifold assembly 20 in the system can be heated and insulated using heat tracing (not shown) and insulation 16 taped to the pipes, at least a small percentage of the area of ​​the pipes and valves that contact the thermally conductive plate of the heated valve manifold assembly used in the system of the present invention is heated by the thermally conductive plate of the present invention, thereby eliminating the need for heat tracing and overlying wrapped insulation tape. Because the pipes and valves are at least substantially, if not entirely, made of metal, heating the pipes and valves in contact with the thermally conductive plate also heats the fluids, gases, or chemicals in those pipes and valves. Preferably, as previously described, at least a majority or many of the pipes and valves of the valve manifold assembly are in contact with the thermally conductive plate. For most or the remainder of the surface area of ​​the pipes and valves that are part of the valve manifold assembly, at least a portion of that surface is not in contact with the thermally conductive plate of the heated valve manifold assembly, and preferably at least some portion of the surface area of ​​those pipes and valves is preferably in close proximity to the thermally conductive plate. Close proximity is relative to the size of the pipes in the system, but is preferably separated from the thermally conductive plate by a distance less than equal to the diameter of the largest diameter pipe connected to the thermally conductive plate. Alternatively, in some embodiments, close proximity preferably means that, if no portion is in contact with the thermally conductive plate, at least the closest portion of the pipe or valve of the valve manifold assembly is separated from the surface of the thermally conductive plate by less than 10, 5, 4, 2, or 1 centimeter.

[0024] The outer layer of insulation 22, part of the heated valve manifold assembly 20 of the present invention, is shown in FIG. 2 . The outer layer of insulation 22 may comprise one or more pieces of insulation board or insulating foam. The insulation may be a rigid sheet, such as rigid foam or board, cut to cover at least the majority of the valve manifold, including the thermally conductive plate (not shown), heater (not shown), and the pipes and valves in contact with the thermally conductive plate. Furthermore, as known to those skilled in the art, the insulation is cut or shaped to allow passage of valves and pipes through the insulation to make the necessary connections of the manifold to fluid supply pipes entering the manifold (chemical supply lines, purge gas, pneumatic gas lines, tubing, or pipes) or exiting the manifold (fluids supplied to tools, exhaust lines). Alternatively or additionally, the insulation board or foam may be shaped or cut to conform to the shape of at least some of the pipes or valves or other components that are part of the heated valve manifold assembly. For valves and pipes that are not in contact with the plate, have portions that protrude from the plate, or are adjacent (offset) to the thermally conductive plate, an additional layer of insulation may be added over one or more layers of insulation, with at least a portion of the bottommost layer of insulation covering and / or contacting at least a portion of the thermally conductive plate and / or at least a portion of the valve or pipe that is in contact with the thermally conductive plate. The insulation may be cloth, board, or foam, and may be made of polystyrene foam, urethane foam, fiberglass, ceramic wool, cellulose, cork, silicone rubber, perlite, vermiculite, or others known in the art. In FIG. 2, additional (outer) layers of insulation, designated 97 and 98, are shaped to fit valves that protrude from the thermally conductive plate or are offset (or adjacent) from the thermally conductive plate. The insulation layers 97 and 98 are generally rectangular and may be shaped to fit the valves and / or retained by hook-and-loop strips or the like attached below the insulation layer.The term layer, which describes insulation, includes, but is not limited to, pieces or components applied or attached to the valve manifold assembly of the present invention.

[0025] For example, in an alternative embodiment shown in FIG. 3 , one or more layers, or at least the outer layer, of insulation that is part of the heated valve manifold assembly 20 may take the form of a thermal jacket 28 that surrounds and / or covers at least a portion of the valve manifold, one or more thermally conductive plates, and one or more heaters. As shown in FIG. 3 , the thermal jacket is custom-made to fit around the manifold, one or more thermally conductive plates, and one or more heaters, with openings for valves and pipes, if necessary. The thermal jacket is installed using fasteners 27, including any of those mentioned above and others, such as zippers, snaps, clasps, bungee cords, hook-and-eye or hook-and-loop strips (e.g., Velcro®), or the like. In yet other embodiments, other insulating materials, such as insulating fabric, can be used. In still other embodiments, a combination of several materials, or several different layers of materials, can be used. For example, a portion of the manifold, such as the rear side of the manifold assembly, may include (or be covered by) a rigid insulator board, while the front side may be covered by a thermal jacket. (The front side of the heated valve manifold assembly is shown in Figures 2 and 3.) Alternatively and additionally, part or all of the heated valve manifold may be covered by a fitted plastic cover (not shown) to protect the insulation layer underneath. The plastic cover and underlying insulation layer or layers are provided with openings necessary to allow plumbing and electrical connections to the pipes and valves of the heated valve manifold assembly. The plastic cover may have insulation attached to it.

[0026] Preferably, the insulator is sized to cover a majority, 75%, 90%, or 99%, of the exterior (surface area) of one or more thermally conductive plates, all of the exterior (surface area) of pipes and valves in contact with one or more thermally conductive plates, and a majority, 75%, 90%, or 99%, of the exterior (surface area) of one or more heaters in contact with one or more thermally conductive plates or attached to one or more thermally conductive plates (meaning portions of one or more heaters not in contact with the thermally conductive plates). In a more preferred embodiment, the insulator is sized to cover a majority, 75%, 90%, or 99%, of the surface area of ​​one or more thermally conductive plates, all of the exterior (surface area) of pipes and valves in contact with the thermally conductive plates, and a majority, 75%, 90%, or 99%, of the exterior surface area of ​​one or more heaters in contact with one or more thermally conductive plates or attached to one or more thermally conductive plates. The portion of the heated valve manifold assembly that is not covered by one or more layers of insulation is minimized to prevent heat loss to the atmosphere or the rest of the system. In some embodiments, the entire heated valve manifold assembly is covered by thermal insulation. The insulation layer may cover the thermally conductive plate or the pipes or valves attached thereto, but may or may not be in contact with the entire surface of the conductive plate that is not in contact with the heater(s) and the pipes and valves. Additionally, if connections must be made to other valves and pipes, the valve may remain uncovered by insulation, although the uncovered portion of the valve is preferably minimized. Covered by insulation does not necessarily mean in contact with the insulation, although in some embodiments, covered can mean both covered by insulation and in contact with the insulation.

[0027] In some embodiments, insulation may be placed around the edges of the thermally conductive plate, such as with a picture frame or part of a picture frame, using, for example, strips of insulating board, with, for example, two vertical strips and one or two horizontal strips across the top and / or bottom of the thermally conductive plate, and then a second, larger layer of insulating board may be attached to the top of the picture frame. By applying a layer of insulation in this manner, a heating volume 64 (defined by the surface of the thermally conductive plate on one side, the vertical and / or horizontal strips of insulation preferably located around the outer edge of the thermally conductive plate, and the underside of the layer of insulation attached to the vertical and / or horizontal strips of insulation) is created, which allows heat to be retained in the heating volume and provided more uniformly to pipes and valves located in contact with the thermally conductive plate in the heating volume. Typically, the heating volume is an air-filled or inert gas-filled space to be heated.

[0028] The layer or layers of insulation may be held to the thermally conductive plate by any attachment mechanism, such as one or more selected from screws, nuts, bolts, Velcro®, straps, clamps, zippers, cable ties, magnets, or adhesive. In preferred embodiments, the insulation board and strips of insulation board are secured by partially threaded bolts that pass through holes in the thermally conductive plate, washers, and corresponding threaded nuts. In some embodiments, the removable fasteners or attachment mechanisms for the insulation do not include adhesives.

[0029] 4 illustrates a portion of one embodiment of heating manifold assembly 20, shown with the top layer of insulator board removed, revealing valve manifold 33 including multiple valves 14 and pipes 12, and a portion of thermally conductive plate 400 below the top layer of insulator board. Valve manifold 33 may further include electrical components and wires, for example, to a controller and / or sensors (not shown in FIG. 4). As shown, in FIG. 4, heating valve manifold assembly 20 includes thermally conductive plate 400, and the pipes and valves may be in contact with and / or physically attached or located to thermally conductive plate 400 by any number of attachment mechanisms 88. In the embodiment depicted in Figure 5, these mechanisms may include standoffs or Z-blankets secured to either the valve or pipe, screws attached directly to the body of the valve, and / or fasteners securing the valve manifold assembly to the backplate of the VMP or VMB or to the housing (e.g., backwall) of the gas or chemical delivery system via tie-down or anchoring points. In Figure 4, the mounting mechanism is a plurality of brackets 88, preferably constructed of a material with suitable thermal conductivity properties, such as a metal, e.g., aluminum, which may be bolted or screwed to plate 400 or otherwise attached to plate 400. In the embodiment shown in Figure 4, there are two (vertical) strips 29 of insulator board, or the like, covering the vertical edges of thermally conductive plate 400. When the top layer of insulator board (not shown) is attached to the insulator strip 29 (by holes in the top layer of insulator board that allow for attachment of the pipes to the valves), a heated volume 64 for the pipes and valves is created below the top layer of insulator board. Prior to adding the top layer of insulation, if desired, additional insulation may be added to cover the pipes and valves, particularly at or near the top end 75 and / or bottom end 76 of the thermally conductive plate 400.Alternatively, an additional layer of insulation may be added, such as a thermal jacket (not shown in FIG. 4). Bolt holes 81 are shown in FIG. 4 to receive bolts that hold the layer of insulation to the thermally conductive plate 400.

[0030] For the embodiment shown as a chemical transport cabinet, the thermally conductive plate can be one of the walls of the housing 65, such as the back wall, but is preferably a separate thermally conductive plate or plates installed in the cabinet. A wall or panel can also be used as a heating plate for the valve manifold box, valve manifold panel, but it is preferred that a separate thermally conductive plate or plates be used in a system having a heated valve manifold assembly of the present invention. The thermally conductive plate can be a metal plate. Currently preferred metals are aluminum and copper and their alloys, but any metal capable of conducting heat can be used. The thermally conductive plate can be of any shape. The thermally conductive plate is preferably rigid, i.e., it maintains its shape when used in a valve manifold assembly of the present invention. Preferably, the thermally conductive plates are sized so that at least a portion, at least a majority, at least more than 80%, at least more than 90%, or ideally more than 99% of the pipes and valves that are part of the valve manifold assembly 20 and need to be heated are heated by and / or in contact with the one or more thermally conductive plates. (Pipes that are part of a manifold do not include pipes and valves that are outside of a gas or chemical transport cabinet system or VMB or VMP that distribute process gases or chemicals to a tool.) The one or more thermally conductive plates in contact with the manifold pipes and valves are typically generally rectangular in shape, but can be any shape, and are preferably sized to have sufficient surface area for the manifold and a portion of the heater(s) to effectively heat the fluids in the manifold and the manifold pipes and valves. In systems where there is a cabinet, box, or housing into which the heated valve manifold assembly must fit, the thermally conductive plate and heated valve manifold assembly are sized to contact the pipes and valves of the manifold sufficiently to preferably result in at least a 35%, at least a 50%, or at least a 60% reduction in the area of ​​pipes and valves that must be heated by heat tracing and insulated by insulating tape in the system.The thermally conductive plate may be physically strong (having a thickness or other dimension) enough to support the weight of the valves and pipes of the valve manifold 33 and the weight of the one or more heaters, and thus the valves and pipes and one or more heaters may be attached to and / or located on one or more thermally conductive plates. The valve manifold and heaters may contact or be attached to opposite sides of the thermally conductive plate, or the valve manifold and one or more heaters may contact and / or be attached to the same side of the thermally conductive plate. Alternatively, the thermally conductive plate may be physically strong enough to support only the weight of the heaters, and the thermally conductive plate may be in physical contact with the valve manifold (including the pipes and valves) and have the heaters attached to it. The valve manifold may be in contact with a first side of the thermally conductive plate, and the heaters may be in contact with and / or attached to the opposite side, the second side of the thermally conductive plate. In one alternative embodiment, the thermally conductive plate may not be physically strong enough to support the weight of the valves and pipes of the valve manifold 33 or one or more heaters. In that embodiment, the conductive plate may be in pressure contact with one or more heaters on a first side, and the valve manifold may be on the same (first) or opposite (second) side (not shown) of the thermally conductive plate, all of which may be supported by the manifold. Preferably, the thermally conductive plate is physically strong enough to support the weight of the manifold and one or more heaters attached thereto.

[0031] 4 and 5, the heater 410 is on the side of the heat conductor plate 400 opposite the valve manifold 33, although in alternative embodiments not shown, one or more heaters may be on the same side as the valve manifold. In yet other embodiments not shown, the heaters are in contact with or wrapped around the lower edge 76 of the heat conductor plate 400, and / or in still other embodiments, in contact with any portion of the heat conductor plate 400. In embodiments where the valve manifold 33 and heater 410 are on opposite sides of the heat conductor plate 400 and the heating manifold assembly is in a chemical or pneumatic transport cabinet or other cabinet, e.g., for use in a VMB, an access panel is provided on the opposite side of the cabinet or the cabinet has removable walls allowing access to both sides of the heat conductor plate.

[0032] FIG. 5 shows a partially exploded front view of one embodiment of a portion of a heated valve manifold assembly of the present invention. FIG. 5 shows an insulator layer 22, e.g., an insulator board. The insulator layer is sized to cover a first side 41 of a thermally conductive plate 400. The thermally conductive plate 400 is shown with a valve assembly 33 attached to the first side 41 of the thermally conductive plate 400. One or more heaters 410 are attached to or in contact with a second side (not shown) of the thermally conductive plate 400. The heaters may be resistance wires that can be attached directly to the second side (opposite the first side) of the thermally conductive plate by adhesive tape, or heating mats or pads that are attached directly to the second side of the thermally conductive plate by adhesive, screws, or bolts. Resistance wires and heating mats or pads are commercially available from a number of sources. Alternatively, the heater(s) can utilize other heating means, including induction (the thermally conductive plate can function as a susceptor), radiation, convection, or heat exchange pipes with a heating fluid therein that are in contact with the thermally conductive plate, preferably on one of its sides. Preferably, the heaters are sized to cover much of the surface area of ​​one of the sides, such as the second side (not shown) of the thermally conductive plate. Additionally, as shown in FIG. 5 , the heated valve manifold assembly 20 further includes an insulator layer 420 covering and / or in contact with the side of the heater(s) away from the side of the heater that is in contact with the second side of the thermally conductive plate. Preferably, the insulator 420 is sized to match at least the surface area of ​​the second side (not shown) of the thermally conductive plate 400. Insulation layer 420 may be composed of any number of insulation materials, preferably one or more of which have a controllable shape, such as foam sheets (soft or rigid), silicone rubber, fiberglass, ceramic wool, or "blow-in" foam.The insulator 420 can be attached to the heater 410 and / or the thermally conductive plate 400 by using adhesives, screws, bolts, the above-mentioned fasteners, or any other fasteners. When the insulator is assembled to cover one or more heaters in contact with and / or attached to the thermally conductive plate 400, the insulator 420 can be formed and placed to surround one, more, or all of the edges 75, 76, 77, and 79 of the thermally conductive plate 400. When the insulator 420 surrounds the edges on a portion of the opposite surface of the thermally conductive plate, the insulator 420 can be used to define and form a heating volume, as described in connection with the embodiment shown in FIG. 4.

[0033] FIG. 5 illustrates optional bolt holes 81 and optional bolt holes 82. As shown, bolt holes 81 are used to attach at least some of the insulation layers 22 to thermally conductive plate 400 of the heated valve manifold assembly. Bolt holes 82 can be used to attach the heated valve manifold assembly to the back wall of a chemical or pneumatic transport cabinet, box, or panel, or to the wall of a valve manifold box or panel, or any other system, that includes the heated valve manifold assembly described herein. As shown in FIG. 5, optional spacers 89 (e.g., plastic, wood, ceramic, or rubber washers) can be used to hold the heated valve manifold away from the wall or plate in a cabinet, panel, or box, or any other possible conductive surface, if attached. Alternatively, any mounting mechanism and fasteners can be used to attach and / or hold the layers and individual components of the heated valve manifold assembly in contact, together as a unit, and / or in the correct location in a system that includes the heated valve manifold assembly.

[0034] FIG. 5 further illustrates that the heated valve manifold assembly 20 may include one or more temperature sensors 78 in communication with a controller (not shown) to adjust the heat output from one or more heaters that are part of the heated valve manifold assembly. If the temperature sensor detects a low temperature, the heater increases its heat output; if the temperature sensor detects a high temperature, the heater decreases its heat output. The temperature sensors also communicate heater failures to the controller (not shown). (More preferably, the controller is used to turn the heaters on and off based on the demand for fluid from the system. Electrical wiring from the heaters and sensors is not shown.) In some embodiments, during manufacture, the heated valve manifold assembly may be provided with one or more backup heaters so that if one heater fails, a second heater can be turned on, thereby extending the life of the heated valve manifold assembly and thereby avoiding shutdowns of the heated valve manifold assembly for heater replacement.

[0035] Additionally, in some embodiments, if repairs are needed to any component of the heated valve manifold assembly, the entire heated valve manifold assembly of the present invention can be disconnected, removed, and replaced with a new heated valve manifold assembly manufactured at a remote location, minimizing downtime of the heated valve manifold assembly, even while the system serving one or more tools, such as a valve manifold box, valve panel, gas transfer cabinet, or chemical transfer cabinet, is in use. To facilitate rapid removal of the heated valve manifold assembly, quick-release piping attachments 95 (shown in FIGS. 4 and 6) can be provided around the edge of the thermally conductive plate 400 and on the pipes 12 that are part of the valve manifold 33. Additionally, any electrical wires attached to the thermally conductive plate can also be provided to facilitate disconnecting and reconnecting the electrical connector 96 (shown in FIG. 6).

[0036] FIG. 6 illustrates a rear perspective view of one alternative embodiment of the valve manifold assembly 20 of the present invention, similar to that illustrated in FIG. 5. The same numbers have been used to label parts already described in previous figures. Additionally, FIG. 6 illustrates an electrical wire 94 that facilitates disconnecting and reconnecting the electrical connector 96. As shown in FIG. 6, in some embodiments, the ends 75, 76, 77, and 79 of the heating plate are not covered by one or more layers of insulation, while in other embodiments, insulation is added to cover the entire surface area of ​​the thermally conductive plate (and / or the valve manifold thereon), including the ends of the thermally conductive plate 400.

[0037] FIG. 7 shows a system 100 according to another embodiment of the present invention, including a valve manifold assembly 20 of the present invention. The system 100 shown is a valve manifold box (VMB). The valve manifold box includes a cabinet 72 having two doors, but only one door 71 is shown present with the second door removed, thereby showing the valve manifold assembly behind the doors, including insulator 22, insulator pieces 97 and 98 covering the valves, and further showing, in cutaway view, manifold 33 with pipe 12 and valve 14, and thermally conductive plate 400 behind insulator 22. Not shown are one or more heaters, preferably on the opposite side of thermally conductive plate 400, and one or more additional layers of insulation. As shown, the system includes one or more exhaust pipes 73 (preferably one exhaust pipe for the valve manifold assembly 33 and preferably one exhaust pipe from the manifold for any leaks contained in the cabinet 72), process material supply pipes 66 that provide process material (fluids, liquids, gases) to the valve manifold 33, and one or more process material supply pipes 67, shown with heat tape thereon, that exit the heated valve manifold assembly 20 and supply a process or tool with process material from the VMB. As shown, the system 100 also includes an exhaust outlet 68. Preferably, the system also includes a controller (not shown) and electrical attachments to control the heaters and / or valves in the valve manifolds.

[0038] One advantage of the present invention is reduced manufacturing time and reduced repair time for systems having heated pipes and valves therein. In conventional manifolds, when the pipes and valves of a valve manifold need to be heated, the pipes and valves are carefully surrounded with resistance wire (heat trace) and then carefully surrounded with a second layer of adhesive insulation. When repairs are needed, the insulation and heat trace must be removed from the affected valve or pipe, and the heat trace and insulation must then be reinstalled on the repaired pipe and / or valve. Furthermore, if defective or broken heat trace is the problem, the heat trace and insulation must be removed from the entire valve manifold, replaced with new heat trace, and surrounded with insulation. Installing, removing, and reinstalling heat trace and insulation in conventional systems is a time-consuming task.

[0039] By using the system of the present invention, manufacturing and repair times can be significantly reduced. A method of manufacturing a system having a heated valve manifold assembly includes the steps of contacting and / or attaching the pipes and valves of the manifold to a thermally conductive plate; contacting and / or attaching one or more heaters to one or more side surfaces of the thermally conductive plate; and covering, contacting, and / or attaching one or more layers of insulation to the one or more heaters, over a majority of the surface area of ​​the pipes and valves heated by or in contact with the thermally conductive plate, and / or over a majority of the surface area of ​​the thermally conductive plate. More preferably, the step of covering, contacting, and / or attaching one or more layers of insulation covers more than 75%, 90%, or 99% of the surface area of ​​the one or more thermally conductive plates, a majority, 75%, 90%, or 99% of all surface areas of the pipes and valves in contact with the thermally conductive plates, and a majority, 75%, 90%, or 99% of the external surface area of ​​the one or more heaters in contact with or attached to the one or more thermally conductive plates. The manufacturing method may further include attaching, screwing, soldering, or otherwise joining the pipes and valves of the valve manifold to create the valve manifold. Some or all of the manifold components may be first connected together to create the valve manifold, and the valve manifold may then be attached to or contacted with the thermally conductive plates. Alternatively, the components of the valve manifold may be attached to the thermally conductive plate and connected to each other in separate steps to form the manifold to the thermally conductive plate in a multi-step process, or in one alternative embodiment, the valves and portions of the pipes may be connected to each other in separate steps and then attached to the thermally conductive plate in separate steps, ultimately resulting in a valve manifold attached to the thermally conductive plate.In another embodiment, the thermally conductive plate may be attached to the system first, and the valve manifold may be manufactured separately and attached to the thermally conductive plate in a single step, or some of the components of the valve manifold may be attached to each other and to the thermally conductive plate in successive steps, ultimately resulting in a valve manifold attached to the thermally conductive plate, or the components of the manifold may be attached to each other and to the thermally conductive plate simultaneously. The manufacturing process may further include one or more steps of adding insulation, which may be performed in any order. For example, one or more layers of insulation may be attached to one or more heaters after the one or more heaters are attached to the thermally conductive plate, and one or more layers of insulation covering the valve manifold may be attached to or contacted with the thermally conductive plate after attachment of the valve manifold to the thermally conductive plate.

[0040] In one embodiment, a method of repairing a system including a heated valve manifold assembly of the present invention includes the steps of removing one or more layers of insulation by removing one or more fasteners (which may be mechanical fasteners such as screws, nuts, bolts, washers, zippers, hook-and-loop strips, etc.) to access a plurality of pipes and valves that are heated by, contacting, and / or attached to the thermally conductive plate; repairing or replacing defective valves or pipes that are heated by, contacting, and / or attached to the thermally conductive plate; and reinstalling the one or more layers of insulation using the one or more fasteners.

[0041] Also contemplated by the present invention is a method of manufacturing or repairing a system having a heated valve manifold assembly therein by separately manufacturing the heated valve manifold assembly and then connecting the heated valve manifold assembly's piping to containing piping, if not present in the system, by connecting the heated valve manifold assembly to a box, cabinet, or panel having piping prepared to receive the piping that is part of the heated valve manifold assembly, by connecting the piping of the heated valve manifold assembly to containing piping, if not present in the system, via corresponding connectors provided on the piping of the heated valve manifold assembly and the containing piping in the system. Reusable quick-connect connectors, such as the VCR coupling manufactured by Swagelok Company, can be utilized to provide a repeatable means of joining two sections of fluid piping together in ultra-high purity applications, such as those commonly found in the semiconductor industry. When repair is needed, a defective heat valve manifold assembly in the aforementioned system can be removed by disconnecting the quick-connect connectors and removing the entire heat valve manifold assembly, and a new or refurbished heat valve manifold assembly is reconnected with the same mating connectors, preferably with the same pipe and valve layout that was already in place when the heat valve manifold assembly was replaced. If there are electrical components as part of the heat valve manifold assembly, quick-release electrical connectors that function similarly to quick-connect pipe connectors can also be provided as part of the heat manifold assembly.

[0042] Although the present invention has been described with reference to preferred embodiments, many modifications, additions, and omissions may be made therein without departing from the spirit and scope of the invention, as will be appreciated by those skilled in the art. The use of "comprising" includes the narrower "consisting essentially of" and "consisting of."

Claims

1. 1. A system for distributing fluid to one or more tools for semiconductor manufacturing, comprising: at least one heated valve manifold assembly, the at least one heated valve manifold assembly comprising: a thermally conductive plate having a total surface area, the thermally conductive plate having a first side and a second side; at least one heater in contact with the at least one thermally conductive plate; a valve manifold comprising a plurality of valves and pipes, the plurality of valves and pipes having a total surface area, a portion of the surface area of ​​the plurality of valves and pipes in contact with the at least one thermally conductive plate; and One or more layers of insulation covering: (i) a majority of the surface area of ​​the plurality of bulbs and pipes, the portion of which is in contact with the at least one thermally conductive plate; (ii) the at least one heater in contact with the at least one thermally conductive plate; and (iii) a majority of the surface area of ​​the at least one thermally conductive plate. A system comprising:

2. The system of claim 1 , wherein the one or more layers of insulation comprise an insulation board.

3. The system of claim 1 or 2, wherein the one or more layers of insulation include insulation attached to a plastic cover.

4. The system of any one of claims 1 to 3, wherein the one or more layers of insulation include an insulating jacket made of a soft insulating material.

5. 5. The system of claim 1, wherein the one or more layers of insulator are removably attached to the conductive plate using fasteners selected from bolts, screws, clamps, zippers, Velcro, cable ties, magnets, adhesives, snaps, clasps, bungee cords, and hook-and-eyes.

6. The system of any one of claims 1 to 5, wherein the one or more layers of insulation are made to specifications to fit the plurality of valves and pipes.

7. 7. The system of claim 1, wherein the one or more layers of insulation are shaped to provide a heated air volume when the plurality of pipes and valves are attached to the thermally conductive plate.

8. 8. The system of claim 1, wherein a portion of the plurality of valves and pipes are in contact with a first side of the at least one thermally conductive plate; and the at least one heater is in contact with a second side of the at least one thermally conductive plate.

9. 9. The system of claim 1, wherein a portion of the plurality of valves and pipes are in contact with a first side of the at least one thermally conductive plate; and the one or more heaters are in contact with a first side of the at least one thermally conductive plate.

10. The system according to any one of claims 1 to 9, wherein the pipes and valves are attached to the thermally conductive plate.

11. The system of any one of claims 1 to 10, wherein the one or more heaters are attached to the thermally conductive plate.

12. 12. The system of claim 1, wherein the assembly comprises a first insulator board attached to or covering a first side of the thermally conductive plate, and a second insulator board attached to or covering a second side of the thermally conductive plate.

13. 13. The system of any one of claims 1 to 12, wherein pipes attached to the thermally conductive plate have quick release connectors that can be disconnected and reconnected for rapid removal and replacement of the heating valve manifold assembly.

14. The system of any one of claims 1 to 13, further comprising at least one container of said fluid and a cabinet, said cabinet housing said heated valve manifold assembly and said at least one container.

15. 15. The system of any one of claims 1 to 14, wherein the heating valve manifold assembly is attached to a wall or panel using spacers to prevent contact between the heating valve manifold assembly and the wall or panel.

16. The system of any one of claims 1 to 15, further comprising a backup heater.

17. The system of any preceding claim, further comprising one or more temperature sensors.

18. The system of any preceding claim, further comprising one or more controllers.

19. The system of any preceding claim, further comprising a controller for the one or more heaters.

20. The system of any one of claims 1 to 19, which is a gas or chemical transport cabinet.

21. A system according to any preceding claim, which is a valve manifold box.

22. The system of any one of claims 1 to 21, which is a valve manifold panel.

23. 23. The system of any one of claims 1 to 22, wherein the one or more layers of insulator are removably attached to the conductive plate using adhesive-free fasteners.

24. A method for producing a system according to any one of claims 1 to 23, comprising the steps of: contacting and / or attaching the pipes and valves of the valve manifold to the thermally conductive plate; contacting and / or attaching one or more heaters to the thermally conductive plate; providing one or more layers of insulation covering and / or contacting the one or more heaters, the majority of the surface area of ​​the pipes and valves heated by or in contact with the thermally conductive plate, and / or the majority of the surface area of ​​the thermally conductive plate; A manufacturing method comprising:

25. 25. The method of claim 24, further comprising joining pipes and valves of the valve manifold to create a fluid-tight seal in the valve manifold.

26. 26. The method of claim 24 or 25, wherein the method of attaching the one or more layers of insulation comprises mechanical fasteners.

27. The method of any one of claims 24 to 26, wherein the method of attaching the layer or layers of insulation does not involve adhesives.

28. 24. A method of repairing the system of claims 1-23, comprising the steps of removing one or more layers of insulation to access the valve manifold; repairing a defective valve, pipe or other component; and reinstalling one or more layers of insulation.

29. 30. The method of repairing a system of claim 27, wherein the removing step is preceded by the step of removing one or more mechanical fasteners, and wherein the reinstalling step includes the step of reinstalling the one or more mechanical fasteners.

30. 24. A method of repairing the system of any preceding claim, comprising removing the heated valve manifold assembly from the system and replacing it with a new heated valve manifold assembly.

31. 30. A method for repairing a system as described in claim 29, wherein the removing step includes the step of removing one or more mechanical fasteners and opening several quick release connectors; and the replacing step includes the step of reinstalling the one or more mechanical fasteners and closing several quick release connectors.

Images