Electronic component, connector unit, connector member, and assembly method for electronic component

Abstract

To provide an electronic component, a connector unit, a connector member, and an assembly method for an electronic component that require less effort when assembling them.SOLUTION: An electronic component includes a substrate having a first circuit portion, a first connector provided on the substrate and having a plurality of first terminals electrically connected to the first circuit portion, and a second connector detachably attached to the first connector and having a plurality of second terminals electrically connectable to the plurality of first terminals, and the second connector has a pin-shaped portion extending in a first direction on each of the plurality of second terminals, and multiple flexible substrates having a second circuit portion are inserted into the pin-shaped portion of at least one of the plurality of second terminals, thereby enabling electrical connection between the pin-shaped portion and the second circuit portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component, a connector unit, a connector member, and a method for assembling an electronic component. [Background technology]

[0002] 2. Description of the Related Art A technique for mounting a plurality of electrical elements in a stack is known as a method for mounting a large number of electrical elements on a limited area of ​​a board of an electronic component.

[0003] For example, Patent Document 1 describes a second semiconductor package configuration in which multiple first semiconductor packages, each having a wiring group on its surface, are stacked on a substrate. In this configuration, the first semiconductor package has a semiconductor element mounted on a flexible substrate that can be bent. Furthermore, the wiring group on the flexible substrate of the first semiconductor package is interconnected with a terminal group formed on the substrate, thereby establishing electrical continuity. Of the stacked first semiconductor packages, the lower package, which is located at the bottom, is electrically connected to the substrate by joining some of the wiring to the terminals arranged in a row on the substrate. Furthermore, by joining the wiring of the lower package to the wiring of the upper package, the upper package is electrically connected to the substrate via the lower package. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-94152 Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration described in Patent Document 1, in order to electrically connect the wiring of the upper package to the board, the wiring of the upper package must be joined to the wiring of the lower package, which is electrically connected to the board. This requires joining the wiring of the upper package and the wiring of the lower package, which is time-consuming during assembly.

[0006] An object of the present disclosure is to provide an electronic component, a connector unit, a connector member, and an assembling method for an electronic component that solves the above-mentioned problems. [Means for solving the problem]

[0007] An electronic component according to one embodiment of the present disclosure comprises a substrate having a first circuit portion, a first connector provided on the substrate and having a plurality of first terminals electrically connected to the first circuit portion, and a second connector detachably attached to the first connector and having a plurality of second terminals electrically connectable to the plurality of first terminals, wherein the second connector has a pin-shaped portion extending in a first direction for each of the plurality of second terminals, and multiple stacked flexible substrates having second circuit portions are inserted into the pin-shaped portion of at least one of the plurality of second terminals, thereby enabling electrical connection between the pin-shaped portion and the second circuit portion.

[0008] A connector unit according to one aspect of the present disclosure comprises a first connector that can be attached to a substrate having a first circuit portion and has a plurality of first terminals that are electrically connected to the first circuit portion, and a second connector that is detachable from the first connector and has a plurality of second terminals that can be electrically connected to the plurality of first terminals, wherein the second connector has a pin-shaped portion extending in a first direction on each of the plurality of second terminals, and multiple flexible substrates having second circuit portions are inserted in a stacked state into the pin-shaped portion of at least one of the plurality of second terminals, thereby enabling electrical connection between the pin-shaped portion and the second circuit portion.

[0009] A connector member according to one aspect of the present disclosure comprises a connector housing that is detachable from another connector provided on another substrate, and a plurality of terminal members that are electrically connectable to a plurality of other terminals provided on the other connector, each of the plurality of terminal members having a pin-shaped portion extending in a first direction, and a flexible substrate having a circuit portion is inserted into the pin-shaped portion of at least one of the plurality of terminal members in a stacked state, thereby electrically connecting the pin-shaped portion to the circuit portion.

[0010] A method for assembling an electronic component according to one embodiment of the present disclosure includes the steps of: connecting a second connector having a plurality of second terminals electrically connectable to a plurality of first terminals provided on a substrate having a first circuit portion, the first connector having a plurality of first terminals electrically connected to the first circuit portion; and stacking multiple flexible substrates having a second circuit portion through a pin-shaped portion of at least one of the second terminals, thereby electrically connecting the pin-shaped portion to the second circuit portion. [Effects of the Invention]

[0011] According to the above aspect, assembly is less time-consuming. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a cross-sectional view of an electronic component according to the present disclosure. [Figure 2] 10A and 10B are diagrams illustrating an example of the arrangement of a plurality of pin-shaped portions provided in a second connector of an electronic component according to the present disclosure. [Figure 3] FIG. 2 is a plan view showing a portion of a flexible substrate of an electronic component according to the present disclosure. [Figure 4] 1 is a plan view showing an example of the arrangement of multiple flexible substrates in an electronic component according to the present disclosure. [Figure 5] 1 is a flowchart showing the flow of an electronic component assembly method according to the present disclosure. [Figure 6] FIG. 2 is a plan view showing a portion of a flexible substrate of an electronic component according to the present disclosure. [Figure 7] 1 is a plan view showing an example of the arrangement of multiple flexible substrates in an electronic component according to the present disclosure. [Figure 8] FIG. 1 is a cross-sectional view of an electronic component according to the present disclosure. [Figure 9] FIG. 2 is a cross-sectional view of a connector unit according to the present disclosure. [Figure 10] 1 is a cross-sectional view of a connector member according to the present disclosure. [Figure 11] 1 is a flowchart showing the flow of an electronic component assembly method according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, each embodiment will be described with reference to the drawings. In all drawings, the same or corresponding components are denoted by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments.

[0014] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 1, an electronic component 1A includes a substrate 2A, a connector unit 3A, and a plurality of flexible substrates 7A.

[0015] The substrate 2A has a substrate main body 21 and a first circuit portion 22 provided on the substrate main body 21. The substrate main body 21 is a plate-shaped solid substrate (rigid substrate). The substrate main body 21 may be a flexible substrate. The substrate main body 21 is plate-shaped and extends along a plane intersecting the thickness direction of the substrate main body 21. In the following description, the direction along the thickness direction of the substrate body 21 is referred to as the first direction D1, the direction perpendicular to the first direction D1 is referred to as the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2 is referred to as the third direction D3.

[0016] The first circuit portion 22 has a plurality of circuit layers 22s arranged at intervals in the first direction D1. The substrate 2A is a multilayer substrate having a plurality of circuit layers 22s arranged in the first direction D1. The plurality of circuit layers 22s are provided on a surface 21f on one side of the substrate main body 21 in the first direction D1, a surface 21g on the other side of the substrate main body 21 in the first direction D1, and within the substrate main body 21. Each of the plurality of circuit layers 22s is formed in a predetermined pattern along a plane intersecting the first direction D1. The plurality of circuit layers 22s are connected to each other by connection vias (not shown) extending in the first direction D1 as necessary. The first circuit portion 22 may be mounted with a plurality of electrical elements (not shown), such as semiconductor elements. The first circuit portion 22 is also connected to a connection wire 23 that is connected to the first connector 4A. In this embodiment, the connection wire 23 extends from each circuit layer 22s in the substrate main body 21 in the first direction D1 and is exposed on the surface 21f. The connection line 23 includes a signal line and a ground line.

[0017] The connector unit 3A includes a first connector 4A and a second connector (connector member) 5A. The first connector 4A is provided on the substrate 2A. In this embodiment, the first connector 4A is provided on the surface 21f of the substrate 2A. The first connector 4A includes a first housing 41 and a plurality of first terminals 42.

[0018] The first housing 41 is made of an insulating material such as resin. The first housing 41 has a connection opening 41a that opens to one side in the first direction D1 (the side away from the board 2A in the first direction D1). A second housing 51 of the second connector 5A, which will be described later, is detachably connected to the connection opening 41a.

[0019] The plurality of first terminals 42 are formed from a conductive metal material. The plurality of first terminals 42 are held in the first housing 41. In the present embodiment, each of the plurality of first terminals 42 extends in a first direction D1. One end of each of the plurality of first terminals 42 is electrically connected, by soldering or the like, to a connection wire 23 exposed on the surface 21f of the substrate 2A. The other end of each of the plurality of first terminals 42 is exposed within the connection opening 41a of the first housing 41.

[0020] The second connector 5A is detachably attached to the first connector 4A. The second connector 5A includes a second housing (connector housing) 51, a plurality of second terminals (terminal members) 52, and a plate member 53.

[0021] The second housing 51 is made of an insulating material such as resin. The second housing 51 has an insertion portion 51a on the other side in the first direction D1 (the side facing the board 2A in the first direction D1) that can be inserted into the connection opening 41a of the first housing 41. The insertion portion 51a is insertable into and removable from the connection opening 41a along the first direction D1. The second housing 51 may be engageable with the first housing 41 by an engagement claw or the like (not shown) when the insertion portion 51a is inserted into the connection opening 41a.

[0022] The second terminals 52 are made of a conductive metal material. The second terminals 52 are held in the second housing 51. In this embodiment, each of the second terminals 52 extends in the first direction D1. One end of each of the second terminals 52 is electrically connected to the other end of each of the first terminals 42 when the insertion portion 51a is inserted into the connection opening 41a. The other end of each of the second terminals 52 is formed with a pin-shaped portion 52p extending in the first direction D1. A base end of the pin-shaped portion 52p is held in the second housing 51. The pin-shaped portion 52p protrudes from the second housing 51 in the first direction D1.

[0023] As shown in FIG. 2 , in this embodiment, the second terminals 52 are arranged at equal intervals in the second direction D2 and the third direction D3 as viewed from the first direction D1. In this embodiment, the second terminals 52 are arranged in a grid pattern, with five in the second direction D2 and five in the third direction D3, for a total of 25 terminals. The second terminals 52 include a signal terminal 52s and a ground terminal 52g. The signal terminal 52s is electrically connected to a signal line of the connecting wires 23 of the first circuit section 22. The ground terminal 52g is electrically connected to a ground line of the connecting wires 23 of the first circuit section 22. In this embodiment, the signal terminals 52s and the ground terminals 52g are arranged alternately in the second direction D2 and the third direction D3. The number, arrangement, and layout of the second terminals 52 can be changed as appropriate.

[0024] As shown in FIG. 1 , the plate member 53 has a plate shape extending along a plane intersecting the first direction D1. The plate member 53 is made of an insulating material such as resin. The plate member 53 is detachably attached to the tip portions of the pin-shaped portions 52p of the multiple second terminals 52. In this embodiment, the plate member 53 has multiple holes formed therein into which the tip portions of the pin-shaped portions 52p of the multiple second terminals 52 are inserted. The plate member 53 may be joined to the tip portions of the pin-shaped portions 52p of the multiple second terminals 52 or the second housing 51 by adhesive bonding, welding, engagement using engagement claws, or the like, with the tip portions of the pin-shaped portions 52p of the multiple second terminals 52 inserted into the multiple holes. The plate member 53 sandwiches the stacked flexible boards 7A between the plate member 53 and the second housing 51.

[0025] A plurality of flexible substrates 7A can be attached in a stacked state to the pin-shaped portions 52p of the second terminals 52 of the second connector 5A. Each of the flexible substrates 7A is provided so as to extend along a plane parallel to the surface 21f of the substrate 2A. As shown in FIG. 3 , the flexible substrate 7A integrally includes a substrate main body 71 and a substrate connecting portion 72. The substrate connecting portion 72 is formed on a portion of the outer peripheral edge of the substrate main body 71. The substrate connecting portion 72 may be formed so as to protrude outward from a portion of the outer peripheral edge of the substrate main body 71. Each flexible substrate 7A includes a second circuit portion 73. The second circuit portion 73 is formed in a predetermined pattern across the substrate main body 71 and the substrate connecting portion 72. The substrate connecting portion 72 is formed with a plurality of insertion holes 72h into which the pin-shaped portions 52p of the plurality of second terminals 52 can be inserted. In this embodiment, for example, three insertion holes 72h are arranged in series. The number and arrangement of the insertion holes 72h formed in the substrate connecting portion 72 can be changed as appropriate. Each insertion hole 72h is formed penetrating the substrate connecting portion 72 in the first direction D1. A partial pattern of the second circuit portion 73 is formed around the insertion hole 72h.

[0026] As shown in FIG. 1 , each flexible substrate 7A has a substrate connecting portion 72 in which the pin-shaped portions 52p of the second terminals 52 of the second connector 5A are inserted into the respective insertion holes 72h. The pin-shaped portions 52p of each second terminal 52 are electrically connected by soldering or the like to the second circuit portion 73 surrounding the insertion hole 72h through which the pin-shaped portions 52p are inserted. As shown in FIG. 3 , in this embodiment, each flexible substrate 7A is connected to, for example, two ground terminals 52g and one signal terminal 52s. Specifically, the substrate connecting portion 72 of each flexible substrate 7A has three insertion holes 72h, and the pin-shaped portions 52p of the ground terminals 52g are inserted into two insertion holes 72h located at both ends, and the pin-shaped portion 52p of the signal terminal 52s is inserted into the insertion hole 72h located in the middle of the three insertion holes 72h, thereby providing electrical connections.

[0027] The multiple flexible substrates 7A are stacked and inserted into the pin-shaped portions 52p of the same second terminal 52. Here, the pin-shaped portions 52p of the same second terminal 52 of one flexible substrate 7A and the other flexible substrates 7A are inserted into at least one insertion hole 72h of the multiple insertion holes 72h of the one flexible substrate 7A and at least one insertion hole 72h of the multiple insertion holes 72h of the other flexible substrates 7A.

[0028] Specifically, one flexible substrate 7A and another flexible substrate 7A may be arranged such that all of the insertion holes 72h of the first flexible substrate 7A overlap with all of the insertion holes 72h of the other flexible substrate 7A. In this case, the insertion holes 72h of the first flexible substrate 7A communicate with the insertion holes 72h of the other flexible substrate 7A in the first direction D1. In this embodiment, the pin-shaped portions 52p of the three second terminals 52 are inserted into the three insertion holes 72h of the first flexible substrate 7A and the three insertion holes 72h of the other flexible substrate 7A. The pin-shaped portions 52p of the same second terminal 52 may be inserted into, for example, one insertion hole 72h of the multiple insertion holes 72h of one flexible substrate 7A and, for example, one insertion hole 72h of the multiple insertion holes 72h of another flexible substrate 7A. Furthermore, the pin-shaped portions 52p of the same second terminal 52 may be inserted into, for example, two insertion holes 72h of the multiple insertion holes 72h of one flexible substrate 7A and, for example, two insertion holes 72h of the multiple insertion holes 72h of the other flexible substrate 7A. In these cases, the pin-shaped portions 52p of different second terminals 52 are inserted into the other insertion holes 72h of the multiple insertion holes 72h of the one flexible substrate 7A and the other insertion holes 72h of the multiple insertion holes 72h of the other flexible substrate 7A.

[0029] Here, the number of flexible substrates 7A that are stacked and inserted into the pin-shaped portion 52p of one second terminal 52 is not limited to two, and may be three or more. Furthermore, all of the multiple flexible substrates 7A are not necessarily inserted and connected to the pin-shaped portion 52p of the same second terminal. Furthermore, it is sufficient that the multiple overlapping flexible substrates 7A are connected to at least one of the signal terminal 52s and the ground terminal 52g. Furthermore, multiple flexible substrates 7A connected to the pin-shaped portion 52p of the same second terminal 52 may have the substrate main body portion 71 extending in different directions from the pin-shaped portion 52p relative to the substrate connection portion 72 within a plane intersecting the first direction D1.

[0030] As shown in FIG. 4, flexible substrates 7A1 and 7A2 are connected to the pin-shaped portion 52p of a single ground terminal 52g1 in an overlapping manner. Flexible substrates 7A2 and 7A3 are connected to the pin-shaped portion 52p of a single ground terminal 52g2 in an overlapping manner. Furthermore, the substrate main bodies 71 of flexible substrates 7A2 and 7A3 extend in different directions relative to the substrate connection portion 72. Flexible substrates 7A3 and 7A4 are connected to the pin-shaped portion 52p of a single ground terminal 52g3 in an overlapping manner. Flexible substrates 7A4 and 7A5 are connected to the pin-shaped portion 52p of a single ground terminal 52g4 in an overlapping manner. Furthermore, the substrate main bodies 71 of flexible substrates 7A4 and 7A5 extend in different directions relative to the substrate connection portion 72.

[0031] The flexible substrates 7A5 and 7A6 are connected to the pin-shaped portion 52p of one ground terminal 52g5 in an overlapping manner. The flexible substrates 7A6 and 7A7 are connected to the pin-shaped portion 52p of one ground terminal 52g6 in an overlapping manner. Furthermore, the substrate main bodies 71 of the flexible substrates 7A6 and 7A7 extend in different directions relative to the substrate connection portion 72. The flexible substrates 7A7 and 7A8 are connected to the pin-shaped portion 52p of one ground terminal 52g7 in an overlapping manner. The flexible substrates 7A8 and 7A1 are connected to the pin-shaped portion 52p of one ground terminal 52g8 in an overlapping manner. Furthermore, the substrate main bodies 71 of the flexible substrates 7A8 and 7A1 extend in different directions relative to the substrate connection portion 72.

[0032] The flexible substrates 7A11 to 7A14 do not overlap with the flexible substrates 7A1 to 7A8 and are connected to different second terminals 52. The flexible substrates 7A11 and 7A12 are connected to the pin-shaped portion 52p of a single ground terminal 52g11 in an overlapping manner. The substrate main bodies 71 of the flexible substrates 7A11 and 7A12 extend in different directions relative to the substrate connection portion 72. The flexible substrates 7A12 and 7A13 are connected to the pin-shaped portion 52p of a single ground terminal 52g12 in an overlapping manner. The substrate main bodies 71 of the flexible substrates 7A12 and 7A13 extend in different directions relative to the substrate connection portion 72. The flexible substrates 7A13 and 7A14 are connected to the pin-shaped portion 52p of the single ground terminal 52g13 in an overlapping manner. The substrate main bodies 71 of the flexible substrates 7A13 and 7A14 extend in different directions relative to the substrate connection portion 72. The flexible substrates 7A14 and 7A11 are connected to the pin-shaped portion 52p of the single ground terminal 52g14 in an overlapping manner. The substrate main bodies 71 of the flexible substrates 7A14 and 7A11 extend in different directions relative to the substrate connection portion 72.

[0033] As shown in FIG. 1, the plurality of flexible substrates 7A are sandwiched between a second housing 51 and a plate member 53.

[0034] As shown in FIG. 5, the method for assembling the electronic component 1A described above includes a step S11 of connecting the second connector 5A to the first connector 4A, and a step S12 of inserting multiple stacked flexible substrates 7A into the pin-shaped portions 52p of the second terminals 52.

[0035] In step S11 of connecting the second connector 5A to the first connector 4A, the insertion portion 51a of the second connector 5A is inserted into the connection opening 41a of the first connector 4A provided on the substrate 2A, thereby electrically connecting the first terminal 42 and the second terminal 52.

[0036] In step S12 of inserting a plurality of stacked flexible substrates 7A onto the pin-shaped portions 52p of the second terminals 52, a plurality of flexible substrates 7A are stacked one on top of the other by inserting the flexible substrates 7A into the pin-shaped portion 52p of at least one of the plurality of second terminals 52. The pin-shaped portion 52p is then electrically connected to the second circuit portions 73 of the plurality of flexible substrates 7A inserted into the pin-shaped portions 52p by soldering or the like. Thereafter, the plate member 53 is attached to the tips of the pin-shaped portions 52p of the plurality of second terminals 52. In addition, the order of step S11 of connecting the second connector 5A to the first connector 4A and step S12 of inserting multiple stacked flexible substrates 7A into the pin-shaped portions 52p of the second terminals 52 may be reversed.

[0037] In the present embodiment, the electronic component 1A, connector unit 3A, second connector 5A (connector member), and method for assembling the electronic component 1A involve inserting multiple stacked flexible substrates 7A into the pin-shaped portions 52p of the second terminals 52, electrically connecting the pin-shaped portions 52p to the second circuit portions 73 of the flexible substrates 7A. This eliminates the need to separately connect the multiple flexible substrates 7A together. This reduces the time and effort required for assembling the electronic component 1A.

[0038] (Modification of the first embodiment) In the first embodiment, the configuration and arrangement of the multiple flexible substrates 7A are illustrated, but this is merely an example. For example, as shown in FIG. 6, in an electronic component 1B of the present disclosure, multiple flexible substrates 7B may have insertion holes 72h arranged in two rows of five, for example, for a total of ten holes.

[0039] 7, in this modification, the multiple flexible substrates 7B1 to 7B3 and 7B4 to 7B6 are stacked and inserted into the pin-shaped portions 52p of the same second terminal 52. Specifically, all of the insertion holes 72h of the flexible substrates 7B1 to 7B3 are connected in the first direction D1, and the pin-shaped portions 52p of the ten second terminals 52 are inserted into each of the insertion holes 72h. Furthermore, the multiple flexible boards 7B1 to 7B3 and another flexible board 7B7 are inserted onto the pin-shaped portions 52p of the five second terminals 52 in an overlapping manner.

[0040] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 8, an electronic component 1C includes a substrate 2C, a first connector 4C, and a second connector 5C.

[0041] The substrate 2C has a first circuit portion 22. The first connector 4C is provided on the substrate 2C. The first connector 4C has a plurality of first terminals 42 electrically connected to the first circuit portion 22. The second connector 5C is detachably attached to the first connector 4C. The second connector 5C has a plurality of second terminals 52 electrically connectable to the plurality of first terminals 42. The second connector 5C has a pin-shaped portion 52p extending in the first direction D1 on each of the plurality of second terminals 52. In the second connector 5C, a plurality of flexible substrates 7C having a second circuit portion 73 are inserted in a stacked state into the pin-shaped portion 52p of at least one second terminal 52 among the plurality of second terminals 52, so that the pin-shaped portion 52p and the second circuit portion 73 are electrically connectable.

[0042] In the electronic component 1C of this embodiment, multiple stacked flexible substrates 7C are inserted into the pin-shaped portions 52p of the second terminals 52 of the second connector 5C, and the pin-shaped portions 52p are electrically connected to the second circuit portions 73 of the flexible substrates 7C. This eliminates the need to separately connect the multiple flexible substrates 7C together. This reduces the time and effort required to assemble the electronic component 1C.

[0043] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 9, the connector unit 3D includes a first connector 4D and a second connector 5D.

[0044] The first connector 4D can be attached to a substrate 2D having a first circuit portion 22. The first connector 4D has a plurality of first terminals 42 electrically connected to the first circuit portion 22.

[0045] The second connector 5D is detachably attached to the first connector 4D. The second connector 5D has a plurality of second terminals 52 electrically connectable to the plurality of first terminals 42. Each of the plurality of second terminals 52 has a pin-shaped portion 52p extending in the first direction D1. The second connector 5D is configured such that a plurality of flexible substrates 7D, each having a second circuit portion 73, are inserted into the pin-shaped portion 52p of at least one of the plurality of second terminals 52. The pin-shaped portion 52p and the second circuit portion 73 are electrically connectable.

[0046] In the connector unit 3D of this embodiment, multiple stacked flexible substrates 7D are inserted into the pin-shaped portions 52p of the second terminals 52, and the pin-shaped portions 52p are electrically connected to the second circuit portions 73 of the flexible substrates 7D. This eliminates the need to separately connect the multiple flexible substrates 7D to each other. This reduces the time and effort required when assembling electronic components using the connector unit 3D.

[0047] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 10, the connector member 5E includes a connector housing 51E and a plurality of terminal members 52E.

[0048] The connector housing 51E is detachably attachable to another connector 4E provided on another board 2E. The multiple terminal members 52E are electrically connectable to multiple other terminals 42E provided on the other connector 4E.

[0049] Each of the plurality of terminal members 52E has a pin-shaped portion 52p extending in the first direction D1. A plurality of stacked flexible substrates 7E are inserted into the pin-shaped portion 52p of at least one of the plurality of terminal members 52E. The flexible substrate 7E has a circuit portion 73E. The pin-shaped portion 52p and the circuit portion 73E are electrically connectable.

[0050] In the connector member 5E of this embodiment, multiple stacked flexible substrates 7E are inserted into the pin-shaped portions 52p of the terminal member 52E, and the pin-shaped portions 52p are electrically connected to the circuit portion 73E of the flexible substrates 7E. Therefore, there is no need to separately connect the multiple flexible substrates 7E to each other. Therefore, assembling electronic components using the connector member 5E is less time-consuming.

[0051] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 11, the method for assembling an electronic component includes a step S21 of connecting a second connector to a first connector, and a step S22 of inserting and stacking a plurality of flexible substrates.

[0052] In step S21 of connecting the second connector to the first connector, the second connector is connected to the first connector provided on the substrate having the first circuit portion. The first connector has a plurality of first terminals electrically connected to the first circuit portion. The second connector has a plurality of second terminals electrically connectable to the plurality of first terminals.

[0053] In step S22 of stacking multiple flexible substrates by inserting them, a flexible substrate having a second circuit portion is inserted into the pin-shaped portion of at least one second terminal among the multiple second terminals, and multiple flexible substrates are stacked. In step S22 of stacking multiple flexible substrates by inserting them into the pin-shaped portion of the second terminal, the pin-shaped portion and the second circuit portion are electrically connected.

[0054] In the method for assembling an electronic component according to this embodiment, multiple flexible substrates are stacked on top of each other, with the pin-shaped portions of the second terminals being inserted through the flexible substrates, and the pin-shaped portions are electrically connected to the second circuit portions of the flexible substrates. This eliminates the need to separately connect the multiple flexible substrates together, thereby reducing the time and effort required for assembling the electronic component.

[0055] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0056] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0057] (Appendix 1) a substrate having a first circuit portion; a first connector provided on the substrate and having a plurality of first terminals electrically connected to the first circuit portion; a second connector that is detachable from the first connector and has a plurality of second terminals that are electrically connectable to the plurality of first terminals; The second connector is Each of the second terminals has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a second circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the second terminals, so that the pin-shaped portion and the second circuit portion can be electrically connected to each other; Electronic components.

[0058] (Appendix 2) The first connector a first housing formed from an insulating material and holding a plurality of the first terminals; The second connector is a second housing formed from an insulating material and detachable from the first housing, the second housing holding base ends of the pin-shaped portions of the second terminals; a plate member having a plate shape extending along a plane intersecting the first direction and sandwiching the flexible substrates in a stacked state between the plate member and the second housing; 1. An electronic component as described in Appendix 1.

[0059] (Appendix 3) the plate member is detachably provided on tip ends of the pin-shaped portions of the second terminals protruding from the second housing in the first direction; 1. An electronic component as described in Appendix 2.

[0060] (Appendix 4) The device further includes a plurality of flexible substrates, each of which has an insertion hole into which the pin-shaped portion is inserted. 4. An electronic component according to any one of appendices 1 to 3.

[0061] (Appendix 5) the flexible substrate has a plurality of the insertion holes, The one flexible substrate and the other flexible substrate are the pin-shaped portion of the same second terminal is inserted into at least one of the plurality of insertion holes of one of the flexible substrates and at least one of the plurality of insertion holes of the other of the flexible substrates, the pin-shaped portions of different second terminals are inserted into another of the plurality of insertion holes of one of the flexible substrates and another of the plurality of insertion holes of the other of the flexible substrates, 1. An electronic component as described in Appendix 4.

[0062] (Appendix 6) The plurality of second terminals include a signal terminal electrically connected to the signal line of the first circuit portion; a ground terminal electrically connected to the ground portion of the first circuit portion, The flexible substrates in a stacked state are connected to at least one of the signal terminals and the ground terminals. 6. An electronic component according to claim 4 or 5.

[0063] (Appendix 7) the signal terminals and the ground terminals are alternately arranged in a direction intersecting the first direction; 1. An electronic component as described in Appendix 6.

[0064] (Appendix 8) the first connector is provided on a surface of the substrate extending along a plane intersecting the first direction; Each of the plurality of flexible substrates is provided so as to extend along a plane parallel to the surface of the substrate. 8. An electronic component according to any one of appendixes 4 to 7.

[0065] (Appendix 9) The flexible substrates connected to the pin-shaped portion of the same second terminal extend in different directions from the pin-shaped portion in a plane intersecting the first direction. 9. An electronic component according to any one of appendixes 4 to 8.

[0066] (Appendix 10) The second terminals are arranged at intervals in a second direction intersecting the first direction and in a third direction intersecting the first direction and the second direction. 10. An electronic component according to any one of appendices 1 to 9.

[0067] (Appendix 11) The substrate is a multilayer substrate including a plurality of circuit layers that form the first circuit portion and are spaced apart in the first direction. 11. An electronic component according to any one of appendices 1 to 10.

[0068] (Appendix 12) a first connector mountable to a substrate having a first circuit portion and having a plurality of first terminals electrically connected to the first circuit portion; a second connector that is detachable from the first connector and has a plurality of second terminals that are electrically connectable to the plurality of first terminals; The second connector is Each of the second terminals has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a second circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the second terminals, so that the pin-shaped portion and the second circuit portion can be electrically connected to each other; Connector unit.

[0069] (Appendix 13) a connector housing that is detachably attached to another connector provided on another board; a plurality of terminal members electrically connectable to a plurality of other terminals provided on the other connector; Each of the plurality of terminal members has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the plurality of terminal members, thereby enabling electrical connection between the pin-shaped portion and the second circuit portion; Connector parts.

[0070] (Appendix 14) a step of connecting a second connector, which is provided on a substrate having a first circuit portion and has a plurality of first terminals electrically connected to the first circuit portion, to the first connector, which has a plurality of second terminals electrically connectable to the plurality of first terminals; and a step of stacking a plurality of flexible substrates each having a second circuit portion through a pin-shaped portion of at least one of the second terminals, thereby electrically connecting the pin-shaped portion and the second circuit portion. How to assemble electronic components.

[0071] Furthermore, some or all of the configurations described in Supplementary Notes 2 to 11, which are dependent on Supplementary Note 1, may also be dependent on Supplementary Notes 12, 13, and 14 in the same dependent relationship as Supplementary Notes 2 to 11. Furthermore, not limited to Supplementary Notes 1, 12, 13, and 14, some or all of the configurations described as Supplements may be similarly made dependent on various parts, units, members, or assembly methods within the scope of the above-described embodiments. [Explanation of symbols]

[0072] 1A~1C...Electronic components 2A, 2C, 2D, 2E…board 21f…Surface 22…First circuit section 3A, 3D... Connector unit 4A, 4C, 4D...First connector 4E…Connector 41...First Housing 42...First terminal 42E...Terminal 5A, 5C, 5D...Second connector 5E...Connector parts 51...Second housing 51E...Connector housing 52…Second terminal 52E...Terminal material 52g, 52g1~52g8, 52g11~52g14...Ground terminal 52s…Signal terminal 52p...Pin-shaped part 53...Plate member 7A, 7A1 to 7A8, 7A11 to 7A14... Flexible board 7B, 7B1 to 7B7... Flexible board 7C...Flexible board 7D...Flexible board 7E...Flexible board 72h...insertion hole 73...Second circuit section 73E...Circuit section D1…first direction

Claims

1. a substrate having a first circuit portion; a first connector provided on the substrate and having a plurality of first terminals electrically connected to the first circuit portion; a second connector that is detachable from the first connector and has a plurality of second terminals that are electrically connectable to the plurality of first terminals; The second connector is Each of the second terminals has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a second circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the second terminals, so that the pin-shaped portion and the second circuit portion can be electrically connected to each other; Electronic components.

2. The first connector a first housing formed from an insulating material and holding a plurality of the first terminals; The second connector is a second housing formed from an insulating material and detachable from the first housing, the second housing holding base ends of the pin-shaped portions of the second terminals; a plate member having a plate shape extending along a plane intersecting the first direction and sandwiching the flexible substrates in a stacked state between the plate member and the second housing; The electronic component according to claim 1 .

3. The device further includes a plurality of flexible substrates, each of which has an insertion hole into which the pin-shaped portion is inserted. The electronic component according to claim 1 or 2.

4. the flexible substrate has a plurality of the insertion holes, The one flexible substrate and the other flexible substrate are the pin-shaped portion of the same second terminal is inserted into at least one of the plurality of insertion holes of one of the flexible substrates and at least one of the plurality of insertion holes of the other of the flexible substrates, the pin-shaped portions of different second terminals are inserted into another of the plurality of insertion holes of one of the flexible substrates and another of the plurality of insertion holes of the other of the flexible substrates, The electronic component according to claim 3 .

5. The plurality of second terminals include a signal terminal electrically connected to the signal line of the first circuit portion; a ground terminal electrically connected to the ground portion of the first circuit portion, The flexible substrates in a stacked state are connected to at least one of the signal terminals and the ground terminals. The electronic component according to claim 3 .

6. the first connector is provided on a surface of the substrate extending along a plane intersecting the first direction; Each of the plurality of flexible substrates is provided so as to extend along a plane parallel to the surface of the substrate. The electronic component according to claim 3 .

7. The flexible substrates connected to the pin-shaped portion of the same second terminal extend in different directions from the pin-shaped portion in a plane intersecting the first direction. The electronic component according to claim 1 or 2.

8. a first connector mountable to a substrate having a first circuit portion and having a plurality of first terminals electrically connected to the first circuit portion; a second connector that is detachable from the first connector and has a plurality of second terminals that are electrically connectable to the plurality of first terminals; The second connector is Each of the second terminals has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a second circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the second terminals, so that the pin-shaped portion and the second circuit portion can be electrically connected to each other; Connector unit.

9. a connector housing that is detachably attached to another connector provided on another board; a plurality of terminal members electrically connectable to a plurality of other terminals provided on the other connector; Each of the plurality of terminal members has a pin-shaped portion extending in a first direction, a plurality of flexible substrates each having a circuit portion are inserted in a stacked state into the pin-shaped portion of at least one of the plurality of terminal members, thereby enabling electrical connection between the pin-shaped portion and the circuit portion; Connector parts.

10. a step of connecting a second connector, which is provided on a substrate having a first circuit portion and has a plurality of first terminals electrically connected to the first circuit portion, to the first connector, which has a plurality of second terminals electrically connectable to the plurality of first terminals; and a step of stacking a plurality of flexible substrates each having a second circuit portion through a pin-shaped portion of at least one of the second terminals, thereby electrically connecting the pin-shaped portion and the second circuit portion. How to assemble electronic components.

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