Insert to be inserted to tray for transporting semiconductor products, tray including the same, and semiconductor product test system including insert

Abstract

To provide an insert that allows semiconductor products with terminals located on lateral sides thereof to be applicable to a test tray.SOLUTION: A test tray for testing a semiconductor product according to an embodiment of the present invention may include a tray, and an insert with an accommodating portion configured to accommodate a semiconductor product, the insert being designed to be inserted to the tray.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an insert to be attached to a tray for transporting semiconductor products, a tray including the insert, and a semiconductor product test system including the insert. [Background technology]

[0002] Semiconductor products such as memory modules undergo a series of tests after production to determine their grade before being shipped to the market. Examples of such memory modules include SO-DIMM, R-DIMM, U-DIMM, and LPCAMM. Among these, LPCAMM has terminals located on the side, unlike other common memory modules, which have terminals located at the bottom.

[0003] Regarding memory module testing, this test is conducted before shipment to determine whether the memory module can operate normally in an environment similar to actual use. Specifically, the memory module is inserted into a socket electrically connected to an actual motherboard (mainboard) and the module exchanges electrical signals with the motherboard to determine whether it operates normally. This test of actually inserting the memory module into the socket to determine whether it operates normally is called an on-board test.

[0004] To improve the efficiency of on-board testing, it is necessary to test a large number of memory modules at once. Conventionally, to meet this need, a test tray including a plurality of sockets and supporting memory modules corresponding to the socket arrangement has been used in test equipment. The test tray has a plurality of inserts arranged corresponding to the socket arrangement in order to transport and test a large number of memory modules. The inserts accommodate the memory modules so that their bottom ends are exposed below the test tray. Thus, when the test tray is seated in the test equipment, the memory modules accommodated in each insert can be inserted and attached to the corresponding sockets.

[0005] However, as mentioned above, semiconductor products with terminals on the side, such as LPCAMM, have recently appeared. To efficiently perform on-board testing of such semiconductor products, a test tray is required. However, because the terminals of such semiconductor products are located on the side, when inserted into a conventional insert, the terminals are not exposed toward the socket. Therefore, to use a test tray for on-board testing of semiconductor products with terminals located on the side, a different type of insert is required. Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide an insert that can be applied to a test tray for semiconductor products having terminals formed on the side surfaces.

[0007] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] According to one embodiment of the present invention, there is provided a tray for testing semiconductor products, which includes a tray and a receiving portion for receiving the semiconductor products, and may include an insert attached to the tray.

[0009] The storage section may have a first position at a first angle relative to the tray for storing the semiconductor product, and a second position at a second angle relative to the tray for testing the semiconductor product.

[0010] The insert may further include a mounting portion that is mounted to the tray and supports the receiving portion so that the angle of the receiving portion is adjustable relative to the tray.

[0011] The receiving section may include a mounting slot for receiving the semiconductor product, and a rotating body supported on the receiving section so as to be angle adjustable.

[0012] In the first position, the pivot body may have an entrance of the loading slot exposed to an upper side of the tray, and in the second position, the entrance of the loading slot facing an inner wall of the tray.

[0013] The receiving portion may further include a pushing body that faces the rear surface of the semiconductor product and is formed to be movable relative to the rotating body to selectively support the semiconductor product or move the semiconductor product in one direction.

[0014] The push body may have an end protruding from the rotating body so that it is pressed in one direction by applying an external force from the outside.

[0015] The receiving portion may further include a protrusion-restoring elastic member that provides a restoring force for maintaining the pushing body in a protruding state relative to the rotating body.

[0016] The push body has a recess formed at an end that contacts the rear surface of the semiconductor product, the recess having a shape corresponding to the rear surface of the semiconductor product, and can approach the semiconductor product and receive the semiconductor product in the recess.

[0017] The rotating body may include a shaft that serves as a rotation axis of the rotating body and is inserted into the mounting portion so as to be swingable in the axial direction.

[0018] The pivot body may further include a pair of mounting blocks, each having a mounting slot formed at adjacent ends thereof, the mounting slot having a width corresponding to the thickness of the semiconductor product, and spaced apart from each other by a distance corresponding to the length of the semiconductor product so that the semiconductor product is received in a space between the different mounting slots.

[0019] The mounting block may have an alignment hole extending parallel to a thickness direction of the semiconductor product accommodated therein and recessed therein.

[0020] The receiving portion may further include a position restoring elastic member that provides a restoring force for maintaining the rotating body in the first position or the second position.

[0021] The rotating body may further include a position fixing groove into which an external member is inserted so as to interact with an external member and maintain a position different from the position restored by the position restoring elastic member.

[0022] To solve the above problem, a tray for testing semiconductor products according to one embodiment of the present invention may include a tray having a plurality of grooves and an insert that is attached to the tray so that the semiconductor products are accommodated and positioned in the grooves.

[0023] The semiconductor products may include a first type semiconductor product having terminals located at the bottom end thereof and a second type semiconductor product having terminals located at the side surface thereof.

[0024] The insert may include a first type insert that accommodates the first type semiconductor product and exposes a lower end of the first type semiconductor product below the tray, and a second type insert that accommodates the second type semiconductor product and has a first position in which an entrance through which the second type semiconductor product enters and exits is exposed above the tray, and a second position in which a side surface of the accommodated second type semiconductor product is exposed below the tray.

[0025] The tray may be selectively fitted with the first mold insert or the second mold insert.

[0026] In order to solve the above problem, according to one embodiment of the present invention, an insert to be attached to a tray for transporting semiconductor products may include a receiving portion having a mounting slot formed therein for receiving the semiconductor products, and a mounting portion that supports the receiving portion so that it can be turned around.

[0027] The accommodating portion may have a first position in which an entrance of the mounting slot is exposed to an external space above the mounting portion, and a second position in which the mounting slot is exposed to an external space below the mounting portion.

[0028] To solve the above problem, one embodiment of the present invention provides a semiconductor product test system that may include a tray having a groove, an insert that accommodates a semiconductor product and is attached to the tray so as to be positioned in the groove, and that has a first position that forms a first angle with respect to the tray and a second position that forms a second angle with respect to the tray, and a position changer that applies pressure to one side of the insert to change the angle of the insert, thereby changing the position of the insert.

[0029] Other details of the present invention are included in the detailed description and drawings. [Effects of the Invention]

[0030] According to the embodiment of the present invention, at least the following effects are obtained.

[0031] This can improve the efficiency of mounting tests on semiconductor products with terminals located on the side.

[0032] The effects of the present invention are not limited to the above-mentioned examples, and a wider variety of effects are included within the present specification. [Brief explanation of the drawings]

[0033] [Figure 1] 1 is a block diagram of a semiconductor product test system according to an embodiment of the present invention; [Figure 2] 1 is a diagram showing a tray for testing semiconductor products according to an embodiment of the present invention; [Figure 3] 1 is a top view of an insert according to an embodiment of the present invention when no external force is applied to the insert. FIG. [Figure 4] 1 is a view of an insert according to an embodiment of the present invention as viewed from below with no external force being applied to the insert. FIG. [Figure 5] 1 is a rear view of an insert according to an embodiment of the present invention in a first position. FIG. [Figure 6] 1 is a front view of an insert according to an embodiment of the present invention in a first position. [Figure 7] FIG. 1 is an exploded perspective view of an insert according to one embodiment of the present invention. [Figure 8] FIG. 2 is a perspective view of a pivot body according to an embodiment of the present invention. [Figure 9] FIG. 2 is a bottom view of a pivot body according to an embodiment of the present invention. [Figure 10] 1 is a diagram showing a push body according to an embodiment of the present invention; [Figure 11] 1 is a view showing a state in which a tray is attached to a posture changer according to an embodiment of the present invention; [Figure 12] FIG. 12 is a view of the attitude changer of FIG. 11 from another angle. [Figure 13] 1 illustrates an insert release module according to one embodiment of the present invention. [Figure 14] FIG. 2 is a side view of an insert release module according to one embodiment of the present invention. [Figure 15] 10A and 10B are diagrams illustrating a state in which a tray comes into contact with a hard stopper according to an embodiment of the present invention. [Figure 16] 10 is a diagram illustrating an insert release module according to an embodiment of the present invention in a state where it is lowered to the maximum extent. [Figure 17] 10 is a diagram illustrating an insert fixing module according to an embodiment of the present invention in a state where the module is raised to the maximum extent; DETAILED DESCRIPTION OF THE INVENTION

[0034] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. However, the present embodiments are provided so that the disclosure of the present invention will be complete and will fully convey the scope of the invention to those skilled in the art. The present invention is defined only by the scope of the claims.

[0035] Furthermore, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal examples of the present invention. Therefore, the shapes of the illustrative views may vary due to manufacturing techniques and / or tolerances. Furthermore, in each drawing shown in the present invention, each component may be slightly enlarged or reduced in size for the convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0036] The semiconductor products referred to below may be memory modules or similar data processing units. Semiconductor products are divided into first-type semiconductor products with terminals located at the bottom and second-type semiconductor products with terminals located on the side. Examples of first-type semiconductor products include SO-DIMM, R-DIMM, and U-DIMM. Examples of second-type semiconductor products include LPCAMM.

[0037] The tray referred to below may be a loading means for loading semiconductor products in a predetermined arrangement. Such trays are divided into user trays and test trays. User trays load a number of semiconductor products in a predetermined arrangement determined for the convenience of user management. For example, a user tray can load the number of semiconductor products to be produced or supplied at one time (hereinafter referred to as 1 lot). In contrast, a test tray can support semiconductor products in accordance with the socket arrangement of a test unit. The test tray has inserts that expose terminal portions of the accommodated semiconductor products on the underside for insertion of the semiconductor products into sockets.

[0038] The directional expressions such as up, down, left, and right mentioned above and below are described by defining one direction as the basis for the remaining directions in order to clarify the understanding of the present invention. Therefore, the up, down, left, and right directions may be changed depending on the actual use or application of the present invention, and the present invention should be construed as including such changed embodiments.

[0039] A semiconductor product test system 1 according to an embodiment of the present invention will now be described with reference to Fig. 1. Fig. 1 is a block diagram of a semiconductor product test system according to an embodiment of the present invention.

[0040] As shown in FIG. 1 , a semiconductor product test system 1 according to one embodiment of the present invention may include a stacker 11, a user tray loader 12, a loading precisor 15, a test tray loader 18, a rack master 20, a test unit 21, a test tray unloader 19, an unloading precisor 17, a user tray unloader 14, a user tray buffer 13, and a test tray buffer 16.

[0041] Hereinafter, the transfer of trays and / or semiconductor products between each component included in the semiconductor product test system 1 according to one embodiment of the present invention can be performed using various transfer units such as conventionally known robotic devices, pick-and-place devices, transfers, etc.

[0042] The stacker 11 provides a space for loading user trays. Although not shown, the stacker 11 is classified into a loading stacker that stores user trays loaded with semiconductor products before testing, and an unloading stacker and / or retest stacker that stores user trays loaded with semiconductor products after testing. The unloading stacker stores user trays loaded with semiconductor products that have been tested and given a grade. The retest stacker stores user trays loaded with semiconductor products that need to be retested. The stacker 11 may be provided with a transfer unit that picks up user trays from the loading stacker and transfers them to the user tray loader 12. The stacker 11 may also be provided with a transfer unit that retrieves user trays from the user tray unloader 14 and places them in the unloading stacker and / or retest stacker.

[0043] The user tray loader 12 provides a stage where a user tray can wait adjacent to the loading precisor 15. A test tray is loaded into the loading precisor 15, which then releases the insert of the loaded test tray. Here, releasing the insert means that the insert is ready to receive a semiconductor product. A semiconductor product transfer unit may be installed between the user tray loader 12 and the loading precisor 15 to pick up a semiconductor product from the user tray and place it in the released insert.

[0044] Once the semiconductor products are placed in the respective inserts in the loading precisor 15, the test tray loader 18 retrieves the test tray and transfers it to the rack master 20. The rack master 20 may be a transfer unit that transfers the test tray transferred from the test tray loader 18 to each test unit 21. The test units 21 are arranged along the length direction around the rack master 20, and may be stacked in the height direction in some cases. The rack master 20 can store or identify the position of each test unit 21 and transfer the test tray to the test unit 21 in the order in which the test tray is to be transferred among the multiple test units 21.

[0045] The test unit 21 may include a plurality of sockets arranged in accordance with the arrangement of the inserts in the test tray. A board on which a plurality of sockets are formed in the test unit 21 is called a test board. When the test tray is seated in alignment with the test board, the semiconductor products accommodated in each insert can be electrically connected to the sockets. The sockets may have connecting means for electrically connecting terminals of the semiconductor products to the motherboard. For example, the connecting means may be at least one of various conventional means such as pogo pins, electrode pads, and rubber socket pads.

[0046] After the test has been completed in the test unit 21, the test tray is collected by the rack master 20 and transferred to the test tray unloader 19. The test tray unloader 19 transfers the transferred test tray to the unloading precisor 17. The unloading precisor 17 can release the insert of the transferred test tray.

[0047] Meanwhile, the user tray unloader 14 provides a stage where empty user trays can wait adjacent to the unloading precisor 17. A semiconductor product transfer unit that picks up semiconductor products from an open test tray and loads them onto an empty user tray can be installed between the unloading precisor 17 and the user tray unloader 14. Once the semiconductor products have been loaded onto the user trays, the user trays that were on the user tray unloader 14 can be moved to the unloading stacker and / or retest stacker for storage.

[0048] The user tray buffer 13 can provide temporary storage space for user trays and / or semiconductor products to ensure a smooth flow of user trays. For example, the user tray buffer 13 can be used as a temporary storage location for semiconductor products that have been evaluated as retest grade. The user tray buffer 13 can also be used as a temporary storage location for additional user trays that are transferred when the user tray unloader 14 sorts and unloads semiconductor products by grade. As another example, when only semiconductor products of the same grade are loaded on one user tray, the user tray buffer 13 can be used as a waiting space for user trays that are not yet fully filled until they are fully loaded with semiconductor products.

[0049] The test tray buffer 16 provides a space for test trays that have been unloaded from the unloading precisor 17 to pass through before being transferred to the loading precisor 15. The test trays can be sequentially transferred from the test tray buffer 16 to the loading precisor 15. The loading precisor 15 transfers the test trays loaded with semiconductor products to be tested to the test tray loader 18, and then the test tray buffer 16 receives the empty test trays and releases the inserts.

[0050] Hereinafter, a tray for testing semiconductor products and an insert attached thereto according to an embodiment of the present invention will be described with reference to the above description of the semiconductor product test system 1 according to an embodiment of the present invention. The insert attached to the tray for transporting semiconductor products according to an embodiment of the present invention can be used in the semiconductor product test system 1 according to an embodiment of the present invention by being attached to the test tray.

[0051] 2 is a view showing a tray for testing semiconductor products according to an embodiment of the present invention. At this time, a tray 30 for testing semiconductor products according to an embodiment of the present invention is provided to serve as a test tray 2.

[0052] As shown in FIG. 2, a plurality of inserts 40 are mounted on the tray 30. The inserts 40 are detachably coupled to the tray 30 so as to be positioned in grooves (spaces in the tray where the inserts are located) formed in the tray 30. The structure for coupling the inserts 40 to the tray 30 may adopt any of various conventional coupling structures, and therefore a detailed description thereof will be omitted. Alternatively, the inserts 40 may be loosely coupled to the tray 30 so that the inserts 40 can move to some extent while mounted on the tray 30. In the example of FIG. 2, the inserts 40 are mounted on the tray 30 in two rows of eight inserts in each row, but the number of inserts 40 may be varied.

[0053] Meanwhile, two different types of inserts can be coupled to each groove of the tray 30. To this end, the inserts may include a first type insert (not shown) and a second type insert 40 having the same or similar coupling structure. Therefore, the user can select and mount either the first type insert or the second type insert 40 on the tray 30 as needed.

[0054] The first type insert may be an insert that supports the first type semiconductor product so that the bottom end of the first type semiconductor product is exposed below the tray 30 (toward the bottom in FIG. 2). The first type insert may be provided to have various conventional semiconductor product insert structures designed to support the first type semiconductor product. The first type insert may utilize previously disclosed technology, and therefore detailed description thereof will be omitted.

[0055] Meanwhile, the insert attached to the tray 30 in FIG. 2 may be a second-type insert 40 according to an embodiment of the present invention. The second-type insert 40 may be an insert formed for mounting and testing second-type semiconductor products. The second-type insert 40 is provided so that its angle can be adjusted and its position can be changed between a first position, in which an entrance for the second-type semiconductor products is exposed at the top of the tray 30, and a second position, in which a side surface of the accommodated second-type semiconductor product is exposed at the bottom of the tray 30. Exemplarily, in the first position, the second-type semiconductor product may be at an angle perpendicular to the tray 30 or the grooves in the tray 30. Also, exemplarily, in the second position, the second-type semiconductor product may be parallel to the tray 30 or the grooves in the tray 30. The following description will be given assuming that the angle between the first position and the second position is perpendicular, but the present invention is not limited thereto.

[0056] 2, the inserts 40b arranged in the right row of the tray 30 are in the first position, and the inserts 40a arranged in the left row of the tray 30 are in the second position. The inserts 40 can take either the first position or the second position as their basic position in the absence of external force due to a built-in position-restoring elastic member (described below). For convenience of explanation, the second position will be described as the basic position below, but a person skilled in the art to which the present invention pertains can easily modify the design so that the first position becomes the basic position by referring to the following explanation, and the present invention should be construed as extending its scope to such embodiments.

[0057] The second semiconductor product is vertically lowered from above the second insert 40 in the first position and accommodated in the second insert 40. At this time, the second semiconductor product is attached to the second insert 40 so that the side where the terminals are located is exposed to the front of the second insert 40. As a result, when the second insert 40 is converted to the second position, the terminals of the second semiconductor product can be exposed below the tray 30.

[0058] An insert 40 according to an embodiment of the present invention, which is provided as a second type insert, will be described below with reference to Figures 3 and 4. Figure 3 is a view of the insert according to an embodiment of the present invention as viewed from above with no external force being applied to the insert. In contrast, Figure 4 is a view of the insert according to an embodiment of the present invention as viewed from below with no external force being applied to the insert.

[0059] 3 and 4, the insert 40 according to an embodiment of the present invention can be in the second position as a basic position when no external force is applied. At this time, the portion of the semiconductor product D (second type semiconductor product) where the terminals are located can be exposed to the external space below the insert 40.

[0060] Such an insert 40 may be configured to include a mounting portion 420 and a receiving portion 410. The mounting portion 420 may be a portion that is pivotally coupled to the tray 30 (see FIG. 2). The mounting portion 420 may include a mounting frame 421 and a guide frame 423.

[0061] First, the mounting frame 421 has a structure for being connected to the tray 30 and also has a structure for being seated on the test board. The mounting frame 421 may have a shape similar to the groove formed in the tray 30, but may be slightly smaller in size. For example, the mounting frame 421 may have a square shape with a hole in the center.

[0062] An alignment hole 4211 may be formed in the height direction at the lower end of the mounting frame 421. The alignment hole may be a hole formed to align the position of the component in which the alignment hole is formed by inserting an alignment pin having a corresponding shape. Hereinafter, the alignment hole 4211 formed at the lower end of the mounting frame 421 will be referred to as a seating alignment hole 4211 to distinguish it from other alignment holes formed in the insert 40.

[0063] The seating alignment hole 4211 may be located at the bottom of the insert 40 compared to the other alignment holes. The seating alignment hole 4211 can accommodate an alignment pin protruding from the test board when the tray 30 is seated on the test board. When the alignment pin is accommodated in the seating alignment hole 4211, the insert 40 is swung relative to the tray 30, and when the alignment pin is completely accommodated in the seating alignment hole 4211, the insert 40 can be aligned with the socket.

[0064] The guide frame 423 can be received as a groove formed in the test board when the test board is mounted on the test board. For this purpose, the test board has a recessed groove having a shape corresponding to the guide frame 423. The insert 40 is initially aligned with the socket when the guide frame 423 is mounted on the test board, and the alignment pin is received in the mounting alignment hole 4211, so that the insert 40 can be additionally aligned with the socket.

[0065] In addition, the guide frame 423 can set a lower limit for the lowering of the semiconductor product D. To this end, the guide frame 423 can protrude from the lower end of the mounting frame 421 into the empty space in the center of the mounting frame 421. At this time, the guide frame 423 can protrude into the empty space to an extent that it does not cover the terminals on the side of the semiconductor product D when it is lowered to the maximum.

[0066] The receiving portion 410 may be supported by the mounting portion 420 so that its angle can be adjusted relative to the tray 30, and may be a portion for receiving the semiconductor products D. The receiving portion 410 may be angularly adjusted and converted between the first and second positions relative to the tray 30. When in the first position, the receiving portion 410 forms a first angle relative to the tray 30, and when in the second position, the receiving portion 410 forms a second angle relative to the tray 30. For example, the first angle may be 90 degrees, and the second angle may be 0 degrees or 180 degrees.

[0067] Such a receiving portion 410 may include a pivot body 413 and a push body 411 .

[0068] The pivot body 413 is supported on the mounting frame 421 so that the angle can be adjusted. To this end, shafts 4131 that are inserted into and accommodated in the mounting frame 421 protrude from both ends of the pivot body 413. The pair of shafts 4131 are arranged coaxially with each other and can serve as the rotation axis of the pivot body 413. Each shaft 4131 is inserted into a shaft accommodating groove 4213 formed in the mounting frame 421. The shaft accommodating groove 4213 may be recessed or penetrated from the center of the inner side of the mounting frame 421 to the outer side. However, the present invention is not limited to this embodiment, and according to another embodiment, the shaft accommodating groove 4213 may be formed in the pivot body 413 and the shaft 4131 may protrude from the mounting frame 421.

[0069] The inner diameter of the shaft receiving groove 4213 may be slightly larger than the diameter of the shaft 4131. In addition, the distance from one end to the other end of two opposing shaft receiving grooves 4213 may be longer than the distance between both ends of the pair of shafts 4131. As a result, when the pair of shafts 4131 are inserted into the shaft receiving grooves 4213, the pair of shafts 4131 can be loosely coupled to the mounting frame 421 so as to be able to swing not only in the axial direction but also in the forward / backward / upward / downward directions. The swinging of the pair of shafts 4131 allows the pivoting body 413 to move relative to the mounting frame 421 and be aligned with the socket.

[0070] The receiving part 410 may include a posture restoring elastic member 415 that provides a restoring force to maintain the pivot body 413 in the second posture. Exemplarily, the posture restoring elastic member 415 may be implemented as a coil spring and disposed to wrap around the shaft 4131. One end of the posture restoring elastic member 415 may contact the pivot body 413 to elastically support the pivot body 413 so that the pivot body 413 maintains the second angle. Further description of this will be provided below. At this time, as described above, depending on the embodiment, the posture restoring elastic member 415 may maintain the pivot body 413 at the first angle.

[0071] Meanwhile, the central portion of the pivot body 413 may be vertically perforated. As an example, the pivot body 413 may be provided in a substantially square shape with an open center. The end of the push body 411 is accommodated in the open space inside the pivot body 413. The open space in the center of the pivot body 413 allows the push body 411 to approach the semiconductor product D. The push body 411 may be coupled to the pivot body 413 such that one end is positioned in the open space in the center of the pivot body 413 and the other end protrudes outside the pivot body 413.

[0072] Although not shown, the receiving portion 410 may include a protruding and restoring elastic member that provides a restoring force for maintaining the push body 411 in a protruding state from the pivot body 413 in the absence of an external force. The protruding and restoring elastic member is disposed between the push body 411 and the pivot body 413 and can elastically support the push body 411 relative to the pivot body 413. Such a protruding and restoring elastic member may be any of various elastic members known in the art that can maintain the push body 411 in a protruding state. For example, the protruding and restoring elastic member may be a coil spring.

[0073] A pair of mounting blocks 4137 may be disposed at the end of the pivotable body 413. The mounting blocks 4137 are exposed below the tray 30 (see FIG. 2) when the pivotable body 413 is in the second position. The pair of mounting blocks 4137 are formed with mounting slots 4137b that extend in a direction in which the semiconductor products D are accommodated in the first position. The mounting slots 4137b will be described in detail below with reference to FIG. 8.

[0074] The mounting block 4137 is formed with an alignment hole 4137a extending parallel to the thickness direction of the accommodated semiconductor product D (the direction in which the semiconductor product D is seated on the test board in the second posture; the vertical direction; the direction in which the push body is pressed). To distinguish it from other alignment holes, the alignment hole 4137a formed in the mounting block 4137 is called a fine adjustment alignment hole 4137a. The fine adjustment alignment hole 4137a is formed to interact with an external alignment pin and ultimately align the position of the rotating body 413.

[0075] When the rotating body 413 is in the second posture, the pushing body 411 protruding upward from the rotating body 413 can be pressed downward by an external pressure module. For example, such a pressure module may be installed above the test board in the test unit 21 (see FIG. 1).

[0076] When the push body 411 is fully lowered, it can contact the surface of the semiconductor product D opposite to the surface that is in close contact with the socket (the side where the terminals are located). As an example, the push body 411 can simply support the back surface of the semiconductor product D so that the semiconductor product D remains open during a mounting test. In this case, the mounting block 4137 can simply hold the semiconductor product D in its original position.

[0077] As another example, the push body 411 can apply pressure to the rear surface of the semiconductor product D and move the semiconductor product D in the direction of pressure applied by the pressure module. In this case, the mounting block 4137 can be movably coupled to a frame 413a (see FIG. 7) that forms the framework of the pivot body 413 so as to be able to move along the pressure direction. For ease of explanation, the following description will be given taking as an example a case in which the push body 411 simply contacts the rear surface of the semiconductor product D to maintain the semiconductor product D in an open state.

[0078] Meanwhile, an upper align hole 4133 exposed to the upper side in the first position and a lower align hole 4135 exposed to the lower side are formed through the rotating body 413 in the height direction. At this time, the upper align hole 4133 is used to interact with an align pin formed on an external pressure module to align the rotating body 413. On the other hand, the lower align hole 4135 is used to interact with an align pin formed on a test board to align the rotating body 413.

[0079] The first position of the insert 40 according to one embodiment of the present invention will be described below with reference to Figures 5 and 6. Figure 5 is a rear view of the insert 40 according to one embodiment of the present invention in the first position. In contrast, Figure 6 is a front view of the insert 40 according to one embodiment of the present invention in the first position.

[0080] 5 and 6 may be states in which the pivot body 413 is rotated vertically by an external factor, overcoming the elastic force of the posture restoring elastic member 415. When the pivot body 413 is pressed by an external force and rotated 90 degrees clockwise, it may be in the states shown in FIGS.

[0081] More specifically, when an external force acts on the rotating body 413 to rotate it counterclockwise, the elastic member support blocks 4139, which are located at both ends of the rotating body 413 and house the ends of the posture restoration elastic member 415, apply pressure to the ends of the posture restoration elastic member 415, compressing the posture restoration elastic member in the counterclockwise direction.

[0082] Regarding the elastic member support block 4139, a pair of elastic member support blocks 4139 may be provided, each located at both ends of the rotating body 413 adjacent to the shaft 4131. A linearly recessed elastic member accommodating groove 4139a is formed in the elastic member support block 4139. Here, the posture restoring elastic member 415 formed in the form of a coil spring has a linear protruding end portion that is accommodated in the elastic member accommodating groove 4139a. The posture restoring elastic member 415 can provide a counterclockwise elastic force to the elastic member support block 4139 via the protruding end portion that contacts the elastic member support block 4139.

[0083] 5 and 6, when the pivotable body 413 is converted to the first position, the entrance of the mounting slot 4137b is exposed to the external space above the insert 40. At this time, the semiconductor product D moves downward in the mounting direction (MA) from the upper side of the space between the pair of mounting blocks 4137 and can be accommodated between the mounting blocks 4137. Thereafter, when the external force on the pivotable body 413 is removed, the pivotable body 413 with the semiconductor product D accommodated therein is rotated clockwise by the position restoring elastic member 415 and can be converted to the second position.

[0084] The coupling relationship between the components of the insert 40 according to one embodiment of the present invention will be described below with reference to Fig. 7. Fig. 7 is an exploded perspective view of the insert according to one embodiment of the present invention.

[0085] As shown in FIG. 7, in an insert 40 according to one embodiment of the present invention, the push body 411, the pivot body 413 and / or the mounting frame 421 may be coupled together such that the push body 411 is accommodated in a push body accommodating space 4132 formed inside the pivot body 413, and the pivot body 413 is accommodated in a pivot body accommodating space 4232 formed inside the mounting frame 421.

[0086] The push body accommodating space 4132 may be slightly larger than the push body 411 so that the push body 411 is coupled to the pivot body 413 with some play. The push body accommodating space 4132 may be provided as an inner space of a pivot frame 413a that forms the main frame of the pivot body 413.

[0087] The pivoting frame 413a has a square shape with an open interior, and a support step 413b protrudes from the bottom end toward the inner space. The support step 413b may be a frame protruding from the inner wall on both sides of the pivoting frame 413a to limit the movement distance of the push body 411. When pressed by an external force, the push body 411 descends until it contacts the support step 413b inside the push body accommodating space 4132. At this time, a protruding elastic member may be disposed between the support step 413b and the push body 411. The support step 413b may have a recessed support groove 413c formed therein to prevent the protruding elastic member from interfering with the maximum downward movement of the push body 411. The support groove 413c can accommodate a portion of the protruding elastic member when there is no external force, and can accommodate all of the protruding elastic member compressed when the push body 411 is at its maximum downward movement.

[0088] Meanwhile, the pivot body accommodating space 4232 has a width that prevents the pivot body 413 from contacting the mounting frame 421 between the first and second positions. The shafts 4131 may be respectively coupled to the shaft accommodating grooves 4211 exposed in the pivot body accommodating space 4232. At this time, a posture restoring elastic member 415 may be attached to at least one of the pair of shafts 4131.

[0089] Hereinafter, a rotating body 413 according to an embodiment of the present invention will be described in detail with reference to Figures 8 and 9. Figure 8 is a perspective view of the rotating body according to an embodiment of the present invention, while Figure 9 is a bottom view of the rotating body according to an embodiment of the present invention.

[0090] For convenience of explanation, when describing in relation to Figures 8 and 9, the part of the rotating body 413 where the mounting block 4137 is located will be referred to as the front of the rotating body 413, and the direction in which the front of the rotating body 413 is viewed will be referred to as the forward direction.

[0091] 8, a guide frame receiving groove 413d is formed at the upper end of the front surface of the pivoting frame 413a. The guide frame receiving groove 413d may receive the upper end of the guide frame 423 when the pivoting frame 413a is in the second position. According to an embodiment, in the second position, the guide frame 423 may come into contact with the front surface of the pivoting frame 413a. In this case, the guide frame 423 serves as a stopper that limits the rotation angle of the pivoting body 413 to 90 degrees.

[0092] In addition, the guide frame 423 can prevent the semiconductor product D from being completely separated from the insert 40 even if the semiconductor product D is released from the mounting slot 4137b during the process of the rotation frame 413a from the second position rotating to the first position. More specifically, the guide frame 423 can protrude from below the semiconductor product D in the first position toward the push body receiving space 4132 to restrict downward movement of the semiconductor product D. As a result, the guide frame 423 can prevent the semiconductor product D from being completely separated, thereby preventing damage to the semiconductor product D due to release of the semiconductor product D.

[0093] In addition, the guide frame 423 may guide the position of the semiconductor product D when the semiconductor product D is inserted into the mounting slot 4137b in the second position. More specifically, the semiconductor product D contacts the guide frame 423 protruding toward the push body receiving space 4132, thereby limiting its downward height. In addition, in some cases, the guide frame 423 may have an inclined surface formed at a portion that contacts the semiconductor product D to guide the semiconductor product D as it moves downward. In this case, the semiconductor product D may descend along the inclined surface and be mounted in place on the insert 40.

[0094] Meanwhile, a pair of mounting blocks 4137 may be symmetrically arranged facing each other on the front surface of the pivot frame 413a. The mounting slots 4137b may be formed at the end of each mounting block 4137 adjacent to another mounting block 4137 (the surface facing the other mounting block). The width of the mounting slots 4137b may correspond to the thickness of the semiconductor products so as to accommodate the semiconductor products.

[0095] The opening of the mounting slot 4137b may be exposed to the upper side of the tray in the first position and may be laterally oriented toward the inner wall of the tray in the second position. More specifically, the upper end of the mounting slot 4137b may extend to the upper end of the mounting block 4137 to form an opening, and the lower end may extend vertically downward and be positioned higher than the lower end of the mounting block 4137. Therefore, the mounting slot 4137b may have an open upper end and a closed lower end.

[0096] The opening of the mounting slot 4137b is wider than the other portions and narrows downward until it reaches its minimum width, at which point it can be extended to the bottom while maintaining the minimum width. The minimum width may be equal to or slightly larger than the thickness of the semiconductor device. Because the opening of the mounting slot 4137b is widest at the top and gradually narrows, even if the semiconductor device is loaded into the mounting slot 4137b slightly misaligned, the semiconductor device can slide along the inner wall of the mounting block 4137 during insertion and be aligned with the mounting slot 4137b.

[0097] The maximum distance between the mounting slots 4137b formed in each mounting block 4137 corresponds to the length of the side of the semiconductor product. This spacing is necessary to ensure a space between the mounting blocks 4137 in which the semiconductor product can be accommodated.

[0098] 9, a posture fixing groove 4138 may be formed in the bottom surface of the pivoting frame 413a, extending toward the upper end. The posture fixing groove 4138 is a groove into which an external object is inserted to maintain the pivoting frame 413a in the first posture. When the external object is inserted into the posture fixing groove 4138, the pivoting body 413 is supported by the external object and can maintain the first posture by overcoming the elastic force of the posture restoring elastic member 415. Here, in an embodiment in which the second posture is the basic posture, unlike this embodiment, the posture fixing groove 4138 can be used to maintain the pivoting body 413 in the second posture.

[0099] Hereinafter, the push body 411 according to an embodiment of the present invention will be further described with reference to Fig. 10. Fig. 10 is a view showing the push body according to an embodiment of the present invention.

[0100] 10, a push body 411 according to an embodiment of the present invention may include a base block 411a and a push block 411b. One end of the base block 411a is accommodated in the push body accommodating space 4132 (see FIG. 7), and the other end protrudes outside the push body accommodating space 4132. One end of the base block 411a may be formed to a size corresponding to the push body accommodating space 4132, and the other end may be formed to accommodate an external pressure module.

[0101] Meanwhile, an elastic member groove 411c may be formed at one end of the base block 411a at a position adjacent to the push block 411b, recessed toward the other end. The elastic member groove 411c may face the support groove 413c (see FIG. 7) when the push body 411 is accommodated in the push body accommodating space 4132. When the elastic member groove 411c is provided, a portion of the protruding and restoring elastic member is accommodated in the support groove 413c and another portion is accommodated in the elastic member groove 411c when it is maximally compressed.

[0102] The push block 411b may extend from the center of one end of the base block 411a, and may have a recess 411d formed at one end that is recessed to correspond to the side shape of the semiconductor product. When the recess 411d is formed, at least a portion of the semiconductor product may be accommodated in the recess 411d when the push body 411 is under maximum pressure. The push block 411b may support the semiconductor product by having the surface having the recess 411d contact the back surface of the semiconductor product. The recess 411d has the effect of finally aligning the semiconductor product accommodated in the mounting slot 4137b (see FIG. 8).

[0103] Based on the above description, a position changer 50 that can be used in a semiconductor product test system according to an embodiment of the present invention will now be described with reference to Figures 11 to 17. The position changer 50 according to an embodiment of the present invention may be installed to perform an operation of releasing the insert 40 in the loading precisor 15 (see Figure 1) and / or the unloading precisor 17 (see Figure 1). For example, the position changer 50 can adjust the angle of the insert 40 to change the position of the insert 40 from the second position to the first position.

[0104] First, Fig. 11 is a view showing a state in which a tray is attached to a tilting device according to an embodiment of the present invention, while Fig. 12 is a view of the tilting device of Fig. 11 seen from another angle.

[0105] As shown in FIGS. 11 and 12, a position converter 50 according to an embodiment of the present invention may include a hard stopper 51, an insert release module 52, a tray lift module 53, and an insert fixing module .

[0106] First, the tray 30 can be loaded and / or attached to the attitude converter 50 between the hard stopper 51 and the tray lifting module 53. The hard stopper 51 may be a linear frame fixed directly above the front and rear ends of the loaded tray 30. The tray lifting module 53 provides a stage on which the tray 30 is seated and has a cylinder for lifting the stage. The tray lifting module 53 initially waits in a fully lowered state and can be lifted after the tray 30 is loaded onto the stage.

[0107] The insert opening modules 52 are provided in pairs, each of which operates to open one row of inserts 40. However, the number of insert opening modules 52 does not necessarily have to be two, and the number of insert opening modules 52 may be the same as the number of rows of inserts 40 formed in the tray 30. Each insert opening module 52 is provided above the hard stopper 51 so as to be able to independently move up and down. For example, the insert opening modules 52 can be connected to a cylinder so as to be able to perform the lifting and lowering operation.

[0108] 12, the tray lifting module 53 raises the tray 30, the left insert opening module 52 is at its lowest position, and the right insert opening module 52 is at its highest position. Although FIG. 12 shows two insert opening modules 52 operating separately to illustrate the range of movement of the insert opening modules 52, the pair of insert opening modules 52 can be set to operate together or independently as needed by the user.

[0109] The insert fixing modules 54 are provided in the same number as the insert releasing modules 52 and can rise and fall together with the stage of the tray lifting module 53. Like the insert releasing modules 52, the insert fixing modules 54 may be provided to interact with any one row of inserts 40. The insert fixing modules 54 can initially wait in a fully lowered state. The insert fixing modules 54 can rise after the insert releasing modules 52 located directly above them have lowered to their fullest extent and released the inserts 40. When the insert fixing modules 54 are fully raised, the inserts 40 can be fixed in an open state.

[0110] The insert opening module 52 of the present invention will be described in detail below with reference to Figures 13 and 14. Figure 13 is a diagram showing an insert opening module according to one embodiment of the present invention, while Figure 14 is a side view of the insert opening module according to one embodiment of the present invention.

[0111] As shown in FIGS. 13-14, an insert opening module 52 according to one embodiment of the present invention may include an opening module frame 52a, opening module legs 52b, and a pressure wheel 52c.

[0112] The open module frame 52a may be a frame having a length corresponding to the length of the tray 30 and a width corresponding to the width of any one row of inserts 40. The open module frame 52a can be raised and lowered by an external drive unit. An opening 52d is formed through the open module frame 52a at a position directly above the insert 40 attached to the tray 30. The opening 52d may be formed so that semiconductor products can be attached to or removed from the insert that has been converted to the first position and opened.

[0113] Open module legs 52b extend downward from both sides of the opening 52d. The open module legs 52b are positioned eccentrically toward the front or rear of the center of the opening 52d. A pressure wheel 52c can be rotatably attached to the lower end of the open module legs 52b. The pressure wheel 52c may be a roller that descends along the open module legs 52b and applies pressure to the insert 40.

[0114] Hereinafter, the insert releasing operation of the attitude changer 50 according to one embodiment of the present invention will be described with reference to FIGS.

[0115] 15 is a diagram illustrating a state in which a tray contacts a hard stopper according to one embodiment of the present invention. When a test tray 2 is loaded onto the posture converter 50, the tray lifting module 53 (see FIG. 12) can perform an upward movement to raise the tray 30. The upward movement by the tray lifting module 53 continues until the upper end of the tray 30 contacts the hard stopper 51. When the tray lifting module 53 reaches its maximum elevation, the tray 30 comes into close contact with the hard stopper 51 and its posture is fixed. At this time, the insert 40 maintains its second posture, and the insert releasing module 52 waits above the hard stopper 51 and / or the insert 40.

[0116] Continuing with the description, FIG. 16 is a diagram illustrating a state in which the insert release module 52 according to one embodiment of the present invention is fully lowered. As shown in FIG. 16, when the insert release module 52 is fully lowered, the insert 40 is converted to the first position.

[0117] This is because the opening module leg 52b is positioned eccentrically with respect to the opening 52d (see FIG. 13), and the pressure wheel 41c applies pressure to a position eccentric from the center of the pivot body 413. As a result, the pressure wheel 52c can apply torque to the pivot body 413 in the opposite direction to the elastic force of the posture recovery elastic member 415 (see FIG. 3). Referring again to FIG. 3, the pressure wheel 52c can apply pressure to the upper surface of the pivot body 413 that does not face the guide frame 423. For example, assuming that the guide frame 423 is located in front of the mounting part 420, the pressure wheel 52c can descend from a position rearward of the shaft 4131 to apply pressure to the pivot body 413.

[0118] At this time, the pressure wheel 52c presses the rotating body 413 and rotates in the opposite direction to the rotating body 413. Therefore, according to one embodiment of the present invention, the rotating body 413 can smoothly change its position during the process of being pressed by the pressure wheel 52c, thereby minimizing damage to the insert 40 due to pressure.

[0119] Meanwhile, when the insert 40 is converted to the first position, the fixing rod 54a of the insert fixing module 54 may be located directly below the insert 40. The fixing rod 54a may be a shaft-shaped member protruding upward at a position facing the position fixing groove 4138 (see FIG. 17) of the insert 40 converted to the first position by the insert releasing module 52.

[0120] The operation of the insert fixing module 54 to fix the insert 40 will be described with reference to Figure 17. Figure 17 is a view illustrating a state in which the insert fixing module according to one embodiment of the present invention is fully raised. As shown in Figure 17, when the insert fixing module 54 is fully raised, the fixing rod 54a can be inserted into the posture fixing groove 4138.

[0121] The fixing rod 54a is inserted into the position fixing groove 4138 to stably maintain the insert 40 in the first position and prevent the insert 40 from rotating. After the insert 40 is fixed by the insert fixing module 54, the insert releasing module 52 is again raised, and then the semiconductor product D is attached to or removed from the insert 40, depending on the embodiment. Alternatively, the insert releasing module 52 may not be raised, and the semiconductor product D may be attached to or removed from the insert 40 through the opening 52d (see FIG. 13).

[0122] Meanwhile, although the above description exemplifies the insert opening module 52 being located at the top of the tray 30 and the insert securing module 54 being located at the bottom of the tray 30, these positions may be changed depending on the embodiment. For example, the insert opening module 52 could rotate the insert 40 at the bottom of the tray 30, and the insert securing module 54 could secure the insert 40 at the top of the tray 30. Alternatively, both the insert opening module 52 and the insert securing module 54 could operate above or below the tray 30.

[0123] In addition, although the pushing body 411 has been described above as a component of the insert 40, in some cases the pushing body 411 may be installed in an external pressure module rather than in the insert 40. In this case, the pushing body 411 is lowered by the external pressure module and selectively inserted into the rotating body 413 to pressurize the semiconductor product D.

[0124] Meanwhile, in the semiconductor product test system 1 according to an embodiment of the present invention, the tray 30 and / or the insert 40 may have an anti-static (ESD; electrostatic discharge) material and / or coating applied to the portions that come into direct contact with the semiconductor product D. For example, the anti-static material and / or coating may be made of a non-metallic material having a surface resistance of 5 to 8. For example, such a non-metallic material may be a material such as MCNYLON, PEEK, POM, or a similar plastic material.

[0125] Also, for example, antistatic materials and / or coatings can be applied to the guide frame 423, the push body 411, and / or the mounting block 4137. Therefore, according to one embodiment of the present invention, antistatic materials are applied to the parts that come into direct contact with the semiconductor products D to prevent static electricity from being generated during loading, unloading, and / or contacting of the semiconductor products D, thereby preventing damage to the semiconductor products D due to static electricity.

[0126] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of the present invention is defined by the claims that follow rather than the above detailed description, and all modifications and variations that fall within the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present invention. [Explanation of symbols]

[0127] 1: Semiconductor product test system 2: Test tray 11: Stacker 12: User tray loader 13: User tray buffer 14: User tray unloader 15: Loading Precisor 16: Test tray buffer 17: Unloading Precisor 18: Test tray loader 19: Test tray unloader 20: Rack Master 21: Test unit 30: Tray 40: Insert 410: Storage unit 411: Push body 411a: Base Block 411b: Push Block 411c: Elastic member groove 411d: Recess 413: Rotating body 413a: Rotating frame 413b: Support step 413c: Support groove 413d: Guide frame accommodation groove 4131: Shaft 4132: Push body storage space 4133: Upper Align Hole 4135: Lower Align Hole 4137: Mounting block 4137a: Fine adjustment align hole 4137b: Mounting slot 4138: Posture fixing groove 4139: Elastic member support block 4139a: Elastic member accommodation groove 415: Posture recovery elastic member 420: Mounting part 421: Mounting frame 4211: Safe and secure alignment hall 4213: Shaft accommodation groove 423: Guide frame 4232: Rotating body storage space 50: Attitude change device 51: Hard Stopper 52: Insert release module 52a: Open module frame 52b: Open module legs 52c: Pressure wheel 52d:Aperture 53: Tray lifting module 54: Insert fixing module 54a: Fixed rod D: Semiconductor products

Claims

1. tray; and an insert attached to the tray, the insert including a receiving portion for receiving a semiconductor product; The storage section is A tray for testing semiconductor products, having a first position that forms a first angle with respect to the tray for receiving the semiconductor products, and a second position that forms a second angle with respect to the tray for testing the semiconductor products.

2. The insert is 2. The tray for testing semiconductor products according to claim 1, further comprising a mounting portion mounted on said tray for supporting said receiving portion so that said receiving portion is angularly adjustable relative to said tray.

3. The storage section is 3. The tray for testing semiconductor products according to claim 2, further comprising: a rotating body formed with mounting slots for accommodating the semiconductor products and supported on the mounting portion so as to be angle-adjustable.

4. The rotating body is 4. The tray for testing semiconductor products according to claim 3, wherein in said first position, the entrance of said mounting slot is exposed to an upper side of said tray, and in said second position, the entrance of said mounting slot faces an inner wall of said tray.

5. The storage section is 4. The tray for testing semiconductor products according to claim 3, further comprising a push body facing the back surface of the semiconductor product and formed movably relative to the rotating body to selectively support the semiconductor product or move the semiconductor product in one direction.

6. The push body is 6. The tray for testing semiconductor products as claimed in claim 5, wherein an end protrudes from the pivot body so as to be pressed in one direction by applying an external force from the outside.

7. The storage section is 7. The tray for testing semiconductor products according to claim 6, further comprising a protruding and restoring elastic member for providing a restoring force for maintaining said push body in a protruding state relative to said pivot body.

8. The push body is 6. The tray for testing semiconductor products according to claim 5, wherein a recess having a shape corresponding to the back surface of the semiconductor product is formed at an end that contacts the back surface of the semiconductor product, and the tray approaches the semiconductor product and accommodates the semiconductor product in the recess.

9. The rotating body is 4. The tray for testing semiconductor products according to claim 3, further comprising a shaft which serves as a rotation axis of said rotating body and is inserted into said mounting portion so as to be swingable in the axial direction.

10. The rotating body is 10. The tray for testing semiconductor products according to claim 9, further comprising a pair of mounting blocks, each having a mounting slot formed at adjacent ends thereof, the mounting slot having a width corresponding to the thickness of the semiconductor product, the mounting blocks being spaced apart from each other by a distance corresponding to the length of the semiconductor product so that the semiconductor product is accommodated in a space between the different mounting slots.

11. The mounting block is 11. The tray for testing semiconductor products according to claim 10, further comprising align holes extending parallel to the thickness direction of the semiconductor products accommodated therein.

12. The storage section is 4. The tray for testing semiconductor products according to claim 3, further comprising a posture restoring elastic member for providing a restoring force for maintaining the pivot body in the first posture or the second posture.

13. The rotating body is 13. The tray for testing semiconductor products according to claim 12, further comprising a posture fixing groove into which an external member is inserted so as to interact with the external member and maintain a posture different from the posture restored by the posture restoring elastic member.

14. a tray having a plurality of grooves; and an insert that accommodates a semiconductor product and is attached to the tray so as to be positioned in the groove; The semiconductor product is The semiconductor device includes a first type semiconductor product having terminals located at its bottom end and a second type semiconductor product having terminals located at its side, The insert is a first-type insert that accommodates the first-type semiconductor product and exposes a lower end of the first-type semiconductor product below the tray; a second-type insert for accommodating the second-type semiconductor products and having a first position in which an entrance for the second-type semiconductor products to enter and exit is exposed on an upper side of the tray and a second position in which a side surface of the accommodated second-type semiconductor products is exposed below the tray; The tray includes: A tray for testing semiconductor products, on which the first type insert or the second type insert is selectively mounted.

15. a receiving portion having a mounting slot formed therein for receiving a semiconductor product; and a mounting portion that supports the storage portion so that the storage portion can be changed in position; The storage section is An insert to be mounted on a tray for transporting semiconductor products, having a first position in which the entrance of the mounting slot is exposed to the upper external space of the mounting part, and a second position in which the mounting slot is exposed to the lower external space of the mounting part.

16. a tray having grooves; an insert for receiving a semiconductor product, the insert being attached to the tray so as to be positioned in the groove, the insert having a first orientation that forms a first angle with respect to the tray and a second orientation that forms a second angle with respect to the tray; and a position changer that changes the position of the insert by applying pressure to one side of the insert so that the angle of the insert changes.

Images