Laser marking device

Abstract

To provide a technique related to laser marking which can achieve securement of safety, high speed, highly accurate marking, miniaturization, and low price.SOLUTION: A laser marking device 1 includes a mounting part 21 on which a marking object is mounted, a laser irradiation hole 22 formed on the mounting part 21, and a laser irradiation unit 30 for irradiating the marking object mounted on the mounting part 21 with a laser beam from a lower side of the marking object, through the laser irradiation hole 22.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a laser marking device. [Background technology]

[0002] For example, surgical instruments and other steel instruments used in medical institutions are operated through a repeated cycle of cleaning, sterilization, storage, surgery, and collection. For this reason, each steel instrument is given a unique individual identification symbol by so-called direct marking, making each instrument identifiable (see, for example, Non-Patent Document 1).

[0003] One known method for direct marking on surgical instruments is laser marking using laser light (see, for example, Non-Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Non-Patent Document 1] "Standard Guidelines for Two-Dimensional Symbol Labeling of Surgical Instruments (2nd Edition)", Japan Medical Devices Association, published January 15, 2014 [Non-patent document 2] "Direct Marking Operational Guide for Medical Devices, etc. ver. 2.5," GS1 Healthcare Japan Council, Steel Instrument Marking Operational Guide Revision Working Group, September 2023 Summary of the Invention [Problem to be solved by the invention]

[0005] Direct marking on surgical instruments is sometimes performed in medical settings, for example. In such cases, the laser marking device used for direct marking is required to be small and inexpensive, as well as capable of high-speed, high-precision marking. Furthermore, it is necessary to ensure sufficient safety.

[0006] The present invention provides a laser marking technology that can ensure safety, achieve high speed, high precision marking, miniaturization, low cost, etc. [Means for solving the problem]

[0007] According to one aspect of the present invention, a placement section on which an object to be marked is placed; a laser irradiation hole formed in the mounting portion; a laser irradiation unit that irradiates the marking object placed on the placement section with laser light from below the marking object through the laser irradiation hole; A laser marking device is provided, comprising: [Effects of the Invention]

[0008] According to the present invention, it is possible to ensure safety, achieve high speed, high precision marking, miniaturization, low cost, etc. in laser marking. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view showing an example of the external configuration of a laser marking device according to an embodiment of the present invention; [Figure 2] 2 is a perspective view showing an example of the configuration inside the housing of the laser marking device of FIG. 1. FIG. [Figure 3] 2 is a perspective view showing an example of the configuration of a base unit and a marking unit in the laser marking device of FIG. 1. FIG. [Figure 4] 4 is an explanatory diagram showing an enlarged configuration example of the marking unit in FIG. 3. FIG. [Figure 5] 1. FIG. 4 is a perspective view showing another example of the configuration of the marking unit in the laser marking device of FIG. [Figure 6] 6 is an explanatory diagram showing an enlarged configuration example of the marking unit in FIG. 5. [Figure 7]2 is a perspective view showing an example of the configuration of an automatic transport unit in the laser marking device of FIG. 1. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0011] (1) Overview of the laser marking device In this embodiment, the laser marking device is used as an example to perform direct marking on surgical instruments. In other words, in this embodiment, the object to be marked by the laser marking device is a surgical instrument.

[0012] Steel instruments refer to instruments made from materials such as stainless steel, aluminum, copper alloys and titanium that are reused for surgery, treatment, etc. at medical institutions and then regenerated by cleaning, sterilization, etc. Note that instruments used for surgery, treatment, etc. that do not fall under medical procedures may also be included in the term steel instruments here.

[0013] The laser marking device according to this embodiment performs direct marking on surgical instruments to create (draw) a UDI (Unique Device Identification), which identifies each instrument with a unique individual identification symbol. Direct marking is a general term for the technology of marking barcodes, symbols, etc. directly on the instrument body, rather than affixing a display label to each instrument, and the technology of automatically recognizing marked barcodes, symbols, etc. In this embodiment, unlike, for example, when attaching an IC chip (RFID, etc.) to a surgical instrument, this type of direct marking eliminates the risk of gas generation from the adhesive during sterilization or IC chip readability issues, and also eliminates the risk of problems such as the loss of tiny IC chips.

[0014] The laser marking device according to this embodiment uses laser light to perform direct marking on surgical instruments. Therefore, unlike dot pin marking, for example, marking does not take a long time and there is no need to worry about dot pin wear, making it extremely advantageous for achieving high-speed, high-precision marking.

[0015] (2) Configuration of laser marking device Next, the specific configuration of the laser marking device according to this embodiment will be described.

[0016] (Overall composition) 1 and 2, the laser marking device 1 according to this embodiment is broadly composed of a housing frame 10, a base unit 20 arranged above the housing frame 10, a laser irradiation unit 30 built into the housing frame 10, and a marking unit 40 attached to the top surface of the base unit 20. Each of these units will be described below in order.

[0017] (Housing frame) The housing frame 10 constitutes the housing of the laser marking device 1. The shape, constituent members, etc. of the housing frame 10 are not particularly limited as long as it functions as a housing.

[0018] (base unit) As shown in Figures 1 to 4, the base unit 20 functions as a platform on which the steel instruments 2 (see Figure 4), which are the objects to be marked, are placed above the housing frame 10. To this end, the base unit 20 has a platform 21 made up of a flat surface on which the steel instruments 2 can be placed.

[0019] A laser irradiation hole 22 is formed in part of the flat surface of the mounting section 21 where a surgical instrument can be placed. The laser irradiation hole 22 is an opening with a larger area than the UDI to be marked on the surgical instrument 2 on the mounting section 21, and is through which the laser light irradiated from the laser irradiation unit 30 passes, as will be described later. In other words, the laser irradiation hole 22 is made up of an opening formed in the mounting section 21.

[0020] The laser irradiation hole 22 may be provided with a shutter mechanism (not shown) that switches the laser irradiation hole 22 between an open state and a closed state. The shutter mechanism is not limited to a specific structure as long as it can open and close the laser irradiation hole 22, and may be configured using known technology. The shutter mechanism may be located anywhere between the main body 31 of the laser irradiation unit 30 (described later) and the laser irradiation hole 22.

[0021] In a base unit 20 having such a mounting part 21 and laser irradiation hole 22, a holding member 23 for supporting a steel instrument 2 may be placed near said mounting part 21. The holding member 23 is formed from an elastic material such as a sponge material or low-hardness rubber material, and has a support surface located at the same height as the flat surface of the mounting part 21, and is configured to support the steel instrument 2 by means of this support surface.

[0022] The base unit 20 may also be provided with a hinge support portion 24 and an interlock hole portion 25 for mounting the marking unit 40. Details of each of these portions will be described later.

[0023] (Laser irradiation unit) The laser irradiation unit 30 irradiates a surgical instrument placed on the mounting section 21 of the base unit 20 with a laser beam for laser marking. To this end, as shown in Figure 2, the laser irradiation unit 30 is configured to comprise at least a main body section 31 that emits the laser beam, a scanning mechanism section 32 such as a galvanometer mirror that scans the laser beam, and an optical system 33 such as an F-θ lens that focuses the laser beam. The laser irradiation unit 30 is also provided with a mechanical shutter mechanism (not shown) to ensure safety, and is configured to normally block the laser beam. Furthermore, the laser irradiation unit 30 is equipped with a control board 34 that controls the operation of the main body section 31, scanning mechanism section 32, etc.

[0024] All of these components are built into the housing frame 10. Therefore, when the main body 31 emits laser light, the laser light passes through the scanning mechanism 32 and optical system 33 before being directed towards the base unit 20 located above the housing frame 10. The laser light then passes through a laser irradiation hole 22 formed in the mounting section 21 of the base unit 20 and reaches the surgical instruments placed on said mounting section 21. In other words, the laser irradiation unit 30 is configured to irradiate the surgical instruments placed on the mounting section 21 with laser light from below the surgical instruments, through the laser irradiation hole 22.

[0025] The laser irradiation unit 30 may be equipped with an imaging camera 35 built into the housing frame 10. The imaging camera 35 may be a CCD (Charge Coupled Device) camera or a CMOS (Complementary Metal Oxide Semiconductor) camera, and is positioned so as to capture an image of the surgical instrument placed on the mounting section 21 from below through the laser irradiation hole 22. Furthermore, when the imaging camera 35 is provided, the laser irradiation unit 30 is configured to determine the irradiation position of the laser light based on the image capture results by the imaging camera 35. Note that a light (not shown) that illuminates the area imaged by the imaging camera 35 may be provided inside the housing frame 10 in association with the imaging camera 35.

[0026] (marking unit) As shown in Figures 1 to 3, the marking unit 40 is a lid-like unit that covers the upper side of the mounting section 21 of the base unit 20. More specifically, the marking unit 40 is arranged on the upper side of the base unit 20 so as to cover the position where the surgical instrument is mounted on the mounting section 21, including at least the position where the laser irradiation hole 22 is formed.

[0027] It is preferable that such a marking unit 40 is configured to be replaceable with respect to the base unit 20. If the marking unit 40 is replaceable, it becomes possible to prepare a plurality of types of marking units 40 in advance and attach any one of the plurality of types of marking units 40 to the base unit 20, or to remove the attached marking unit 40 and replace it with another type of marking unit 40.

[0028] Examples of the multiple types of marking units 40 prepared in advance include a marking unit configured to comply with Class 1 of the laser safety standard (hereinafter also referred to as a "Class 1 marking unit"), a marking unit configured to comply with Class 4 of the laser safety standard (hereinafter also referred to as a "Class 4 marking unit"), etc. However, it goes without saying that marking units 40 other than these may also be prepared.

[0029] In the following description, an example will be given in which the marking unit 40 attached to the base unit 20 is a Class 1 marking unit. The Class 1 marking unit 40 is used, for example, when the main body 31 of the laser irradiation unit 30 emits a low-power laser beam. Specifically, to ensure a minimum level of safety, it is formed in the shape of a small, lightweight lid that covers the upper side of the base unit 20.

[0030] The Class 1 marking unit 40 attached to the base unit 20 is formed with a supported portion 41 that engages with the hinge support portion 24 of the base unit 20. The Class 1 marking unit 40 is attached to the base unit 20 so that it can be opened and closed using the engagement point between the hinge support portion 24 and the supported portion 41 as a fulcrum. Because the Class 1 marking unit 40 can be opened and closed in this way, surgical instruments can be placed on the mounting portion 21 of the base unit 20 in the open state, while ensuring safety during laser irradiation in the closed state. Furthermore, in terms of ensuring safety, this can be doubled as it is combined with the shutter mechanism in the laser irradiation unit 30, and it can also be made possible to prevent small parts and the like from falling into the optical system 33 through the laser irradiation hole 22.

[0031] The class 1 marking unit 40 is also formed with a fixing mechanism 42 for maintaining the class 1 marking unit 40 in an arranged state on the base unit 20. The fixing mechanism 42 functions as a so-called latch mechanism, and is configured to include, for example, a fixing claw 42a that engages with the interlock hole 25 of the base unit 20, and a release button 42b for releasing the engagement by the fixing claw 42a. Details of the latch mechanism may be any known technology, and will not be described here.

[0032] The fixing mechanism 42 may be configured to operate in conjunction with the shutter mechanism of the base unit 20. In this case, the shutter mechanism switches the laser irradiation hole 22 between the open state and the closed state in conjunction with the fixing mechanism 42.

[0033] The Class 1 marking unit 40 may also be provided with a pressing member 43 that presses down on the surgical instruments placed on the mounting section 21. The pressing member 43 is formed from an elastic member such as a sponge member or low-hardness rubber member, and is arranged so as to press down on the surgical instruments on the mounting section 21 from above when the Class 1 marking unit 40 is in the closed state.

[0034] (3) Example of processing operation in laser marking equipment Next, an example of the processing operation in the laser marking device 1 having the above-described configuration will be described.

[0035] When laser marking a surgical instrument using the laser marking device 1, first the marking unit 40 is opened. Then the surgical instrument to be marked is placed on the mounting section 21 of the base unit 20. At this time, the surgical instrument is placed on the mounting section 21 so that the UDI marking position on the surgical instrument faces the laser irradiation hole 22.

[0036] After the surgical instrument has been placed, the marking unit 40 is closed. When the marking unit 40 is closed, the fixing claws 42a of the fixing mechanism 42 engage with the interlock hole 25 of the marking unit 40, and the latching action of the fixing mechanism 42 comes into play. This causes the marking unit 40 to remain closed (i.e., positioned on the base unit 20 covering the laser irradiation hole 22).

[0037] Furthermore, when the marking unit 40 is closed, the pressing member 43 provided on the marking unit 40 presses down from above the surgical instruments on the mounting section 21. This fixes the surgical instruments on the mounting section 21 so that they do not shift position, and the UDI marking position will not deviate from the laser irradiation hole 22.

[0038] If a shutter mechanism that opens and closes the laser irradiation hole 22 is provided, the shutter mechanism can be configured to switch the laser irradiation hole 22 between open and closed states in conjunction with the fixing mechanism 42. Specifically, when the marking unit 40 is in the open state, the shutter mechanism closes the laser irradiation hole 22, but when the marking unit 40 is in the closed state and the latch action of the fixing mechanism 42 operates, the shutter mechanism opens the laser irradiation hole 22 in conjunction with this. In this way, if the shutter mechanism is configured to open and close the laser irradiation hole 22 in conjunction with the fixing mechanism 42, this is very preferable in terms of ensuring safety against laser light, even if the marking unit 40 covering the upper side of the laser irradiation hole 22 is configured to open and close.

[0039] Thereafter, laser marking by the laser irradiation unit 30 begins on the surgical instruments on the mounting section 21. Laser marking is performed in the following procedure.

[0040] For example, when a predetermined operation (such as pressing the start button) is performed on the operation panel (not shown) of the laser marking device 1, the main body 31 of the laser irradiation unit 30 emits laser light under operational control of the control board 34. The wavelength and other factors of the emitted laser light are set in advance. For example, when cold marking (marking in which the passive film on the stainless steel surface self-regenerates) is performed on a stainless steel tool or the like, the main body 31 emits UV laser light with a wavelength of 355 nm.

[0041] The laser light emitted by the main body 31 passes through the scanning mechanism 32 and optical system 33, and then reaches the surgical instrument on the mounting section 21 through the laser irradiation hole 22. At this time, the scanning mechanism 32 performs high-speed scanning using, for example, galvanometer mirrors on the X and Y axes, while following the operational control of the control board 34. This allows the laser light to be irradiated through the laser irradiation hole 22 onto the UDI marking position on the surgical instrument on the mounting section 21, and a UDI with the desired two-dimensional pattern can be created (drawn) at the marking position with high speed and precision.

[0042] If an imaging camera 35 is placed inside the housing frame 10, the UDI marking position on the surgical instrument on the mounting section 21 can be recognized based on the image captured by the imaging camera 35, and the UDI can be created (drawn) by irradiating the targeted part of the marking position with laser light. In this way, it becomes possible to easily perform laser marking on the targeted part, which is very preferable for achieving high precision in the laser marking.

[0043] Regarding the laser marking procedure as described above, the laser marking device 1 according to this embodiment performs the laser marking by irradiating the surgical instruments on the mounting section 21 with laser light from below through the laser irradiation hole 22.

[0044] By irradiating the laser beam from below in this way, even when there are multiple types of steel instruments to be marked, laser marking can be performed appropriately on each type of steel instrument without complicating the device configuration. Each type of steel instrument is likely to have different thickness dimensions. In such cases, for example, if laser marking is performed by irradiating the steel instrument from above, it becomes necessary to adjust the focal position of the laser beam according to the thickness dimension of each type. In contrast, by irradiating the laser beam from below, as in the laser marking device 1 of this embodiment, the UDI marking position is located on the flat surface that constitutes the mounting section 21 regardless of the type of steel instrument, eliminating the need to adjust the focal position of the laser beam for each type. In other words, by laser marking the bottom surface of the steel instrument to be marked, the bottom surface position remains constant even if the thickness dimension of the steel instrument changes, so laser marking can be performed appropriately on the steel instrument without the need for an expensive three-dimensional focal position adjustment mechanism.

[0045] Furthermore, by irradiating the laser light from below, most of the laser light reflected by the steel instrument to be marked returns through the laser irradiation hole 22 to the inside of the housing frame 10, which is covered by a cover. For example, if laser marking is performed by irradiating the marking object with laser light from above, the reflected light from the marking object will diffuse into the surrounding area. If the diffused light is too large to comply with laser safety standards, safety measures such as providing a shield such as a cover or requiring the worker to wear safety glasses to prevent accidents from the laser light will be necessary. In contrast, if the laser light is irradiated from below, as in the laser marking device 1 according to this embodiment, most of the reflected light will return into the housing frame 10, and a structure will be created in which leaked laser light does not diffuse to the outside. This is highly preferable for ensuring sufficient safety against laser light without complicating the device configuration.

[0046] Furthermore, in the laser marking device 1 according to this embodiment, the marking unit 40 is positioned so as to cover the upper side of the mounting section 21 on which the steel instruments to be marked are placed. Therefore, even if leakage laser light diffuses above the steel instruments, this leakage laser light is blocked by the marking unit 40, ensuring safety against laser light.

[0047] After laser marking has been performed on the surgical instruments on the mounting section 21 and a UDI has been created (drawn) at the marking position on the surgical instrument, for example, by pressing the release button 42b of the fixing mechanism 42 in the marking unit 40, the locking claw 42a of the fixing mechanism 42 is released from the interlock hole 25 of the base unit 20. This makes it possible to open the marking unit 40, and after opening the marking unit 40, the surgical instrument on the mounting section 21 (i.e. the one with the UDI created) can be removed from the mounting section 21.

[0048] If a shutter mechanism that opens and closes the laser irradiation hole 22 is provided, the shutter mechanism can be configured to switch the laser irradiation hole 22 between the open and closed states in conjunction with the fixing mechanism 42. Specifically, when the fixing mechanism 42 is released from its locked position, the shutter mechanism closes the laser irradiation hole 22 in conjunction with this. In this way, if the shutter mechanism is configured to open and close the laser irradiation hole 22 in conjunction with the fixing mechanism 42, this is very preferable in terms of ensuring safety against laser light, even if the marking unit 40 covering the upper side of the laser irradiation hole 22 is configured to open and close.

[0049] After the surgical instrument with a UDI created has been removed from the mounting section 21, the laser marking device 1 can be used to create (draw) a UDI by laser marking on another surgical instrument using the series of steps described above.

[0050] (4) Effects of this embodiment According to this embodiment, one or more of the following effects can be obtained.

[0051] (a) In this embodiment, when laser marking is performed, the steel instrument to be marked placed on the mounting section 21 is irradiated with laser light from below the steel instrument through the laser irradiation hole 22. By irradiating the laser beam from below in this way, even if there are multiple types of surgical instruments to be marked, there is no need to adjust the focal position of the laser beam for each type, and laser marking can be performed appropriately for each type of surgical instrument, without making the device configuration more complicated.As a result, it is possible to easily realize a small, low-cost laser marking device 1 without compromising the characteristics of laser marking, which are that it can perform marking at high speed and with high precision. Furthermore, by irradiating the laser light from below, most of the laser light reflected by the steel instrument that is the marking object returns to inside the housing frame 10, resulting in a structure that prevents leakage of laser light from diffusing to the outside, which is extremely preferable in terms of ensuring sufficient safety against laser light without complicating the device configuration, etc. As described above, the laser marking device 1 according to this embodiment can ensure safety, achieve high speed, high precision marking, miniaturization, low cost, and the like.

[0052] (b) In this embodiment, the object to be marked is a steel instrument. In other words, direct marking of steel instruments in a medical setting is envisaged. Even in this case, the laser marking device 1 according to this embodiment not only enables high-speed, high-precision marking, but also makes the laser marking device 1 small and inexpensive, and furthermore, ensures sufficient safety. Therefore, the laser marking device 1 according to this embodiment is highly suitable for use in a medical setting and is highly convenient for the user.

[0053] (c) In this embodiment, a marking unit 40 is placed above the mounting section 21 on which the surgical instruments to be marked are placed. Therefore, even if leakage laser light diffuses above the surgical instruments, this leakage laser light is blocked by the marking unit 40, ensuring safety against laser light. Furthermore, as explained in this embodiment, if the marking unit 40 can be opened and closed, it becomes possible to place surgical instruments on the mounting section 21 in the open state, while ensuring safety during laser irradiation in the closed state. In other words, convenience for the user is not compromised while safety from laser light is fully ensured.

[0054] (d) As explained in this embodiment, if a shutter mechanism is provided that switches the laser irradiation hole 22 between an open state and a closed state, this is extremely preferable in terms of ensuring sufficient safety against laser irradiation, even when laser irradiation is performed on surgical instruments through the laser irradiation hole 22. In particular, as explained in this embodiment, if the shutter mechanism switches between the open and closed states of the laser irradiation hole 22 in conjunction with the fixing mechanism 42, this is extremely preferable in terms of ensuring safety against laser light, even if the marking unit 40 that covers the upper side of the laser irradiation hole 22 is configured to open and close. Moreover, because the shutter mechanism is linked with the fixing mechanism 42, there is no need to separately open and close the shutter mechanism, and convenience for the user is not impaired.

[0055] (e) As explained in this embodiment, if the marking unit 40 is provided with a retaining member 43, closing the marking unit 40 will fix the surgical instruments on the mounting section 21 so that they do not shift position. This prevents the UDI marking position on the surgical instruments on the mounting section 21 from deviating from the laser irradiation hole 22, which is extremely preferable for performing highly accurate marking. Furthermore, because the surgical instruments on the mounting section 21 are fixed when the marking unit 40 is closed, convenience for the user is not compromised.

[0056] (f) In this embodiment, the laser irradiation unit 30 comprises a main body 31 that emits laser light, a scanning mechanism 32 such as a galvanometer mirror that scans the laser light, and an optical system 33 such as an F-θ lens that focuses the laser light, and the operations of these components are controlled by a control board 34. The laser irradiation unit 30 configured in this way does not require a complex three-dimensional focal position adjustment mechanism or the like, and can therefore be housed within the compact housing frame 10, which is extremely advantageous in terms of realizing a smaller size and lower cost of the laser marking device 1.

[0057] (g) As explained in this embodiment, if the laser irradiation unit 30 is configured to determine the irradiation position of the laser light based on the image capture results by the imaging camera 35, it becomes possible to easily perform laser marking on the targeted area, which is very preferable in terms of achieving high precision in the laser marking.

[0058] (5) Modifications, etc. Although one embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present invention.

[0059] For example, in the above embodiment, the marking unit 40 covering the upper side of the mounting portion 21 is a class 1 marking unit configured to comply with class 1 of the laser safety standard.

[0060] However, the marking unit 40 is not limited to a Class 1 marking unit, and may be of another type. Here, a Class 4 marking unit configured to comply with Class 4 of the laser safety standard will be taken as an example of another type of marking unit 40, and a brief description of this Class 4 marking unit will be given.

[0061] The class 4 marking unit 40 is configured to comply with class 4 of the laser safety standard.

[0062] More specifically, as shown in FIG. 5, the Class 4 marking unit 40 is arranged above the base unit 20 and secured in place by fasteners 44, such as mounting screws. It is preferable that the fasteners 44 be shared with other types of marking units 40, in order to facilitate unit replacement. The same applies to reference position specifying members (not shown), such as positioning pins. Furthermore, the Class 4 marking unit 40 is equipped with a key 45 for management in accordance with laser safety regulations, a stop switch 46 for emergency shutdown of the device, and other features to comply with the Class 4 laser safety standard.

[0063] Furthermore, the Class 4 marking unit 40 is configured with a laser irradiation hole 22 provided on a mounting base 47 that protrudes, for example, in a pyramidal shape, and a movably supported weight member 48 that covers the upper side of the laser irradiation hole 22. In this configuration, the marking target is placed on the mounting base 47, and the weight member 48 covers the upper side of the marking target so as to press down on it. In this case, the pyramidal shape of the mounting base 47 makes it possible to easily and flexibly accommodate marking targets of various shapes. Moreover, if the weight member 48 has a certain weight, it can reliably fix the marking target in place by pressing down. Note that the contact surface of the weight member 48 that contacts the marking target is preferably formed of an elastic material, such as a sponge material or a low-hardness rubber material.

[0064] Furthermore, with such a Class 4 marking unit 40, it is also possible to perform laser marking by stably holding the marking object 2 over the laser irradiation hole 22 of the mounting table 47 using a holder attached to the tip of an accu-stand, as shown in Figure 6, for example.

[0065] The marking unit 40 is not limited to a class 1 marking unit or a class 4 marking unit, but may be of a type other than these. Furthermore, it is preferable that each type of marking unit 40 is configured to be replaceable with respect to the base unit 20. If the marking units 40 are replaceable, it becomes possible to replace the marking units 40 as needed, which is highly desirable in terms of increasing the versatility of the laser marking device 1 and also provides excellent convenience for users of the laser marking device 1.

[0066] Furthermore, for example, in the above embodiment, an example was given of a case in which the steel instrument to be marked is placed on the mounting section 21 for laser marking, but this is not necessarily limited to such an embodiment, and it is also possible to make it possible to accommodate automatic transport of the marking object.

[0067] 7, an example of an automatic transport unit 50 for marking objects is one in which the marking object set in a predetermined jig (not shown) is transported together with the jig using a transport jig guide 51, a jig drive gear 52, etc., the marking object is stopped over the laser irradiation hole 22 and laser marking is performed, and after laser marking is completed, the jig is transported and the next marking object is moved to the laser irradiation hole 22. In an automatic transport unit 50 configured in this way, since there may be multiple types of marking objects set, it is conceivable that the jig is driven by a gear, belt, etc.

[0068] By using such an automatic transport unit 50 for marking objects, when laser marking needs to be performed on each of multiple marking objects, the laser marking can be performed very efficiently, making it extremely convenient for users of the laser marking device 1.

[0069] Furthermore, for example, in the above embodiment, the case where the marking object is a surgical instrument has been described as an example, but this is not necessarily limited to this, and other mechanical parts may also be used as the marking object. In that case, for example, it is possible to mount the mechanical part on a dedicated jig, transport the jig using automatic transport unit 50, and move the mechanical part to laser irradiation hole 22, thereby performing laser marking on the mechanical part. [Explanation of symbols]

[0070] 1...laser marking device, 10...casing frame, 20...base unit, 21...mounting portion, 22...laser irradiation hole, 23...holding member, 24...hinge support portion, 25...interlock hole portion, 30...laser irradiation unit, 31...main body portion, 32...scanning mechanism portion, 33...optical system, 34...control board, 35...imaging camera, 40...marking unit, 41...supported portion, 42...fixing mechanism portion, 42a...fixing claw portion, 42b...release button, 43...holding member

Claims

1. a placement section on which an object to be marked is placed; a laser irradiation hole formed in the mounting portion; a laser irradiation unit that irradiates the marking object placed on the placement section with laser light from below the marking object through the laser irradiation hole; A laser marking device comprising:

2. The marking object is a surgical instrument. The laser marking device according to claim 1.

3. a marking unit disposed above the placement unit; The laser marking device according to claim 1 or 2, comprising:

4. A pressing member is provided to press down the marking object placed on the placing section. The laser marking device according to claim 3.

5. The marking unit is configured to be replaceable. The laser marking device according to claim 3.

6. The marking unit is configured to comply with laser safety standard Class 1. The laser marking device according to claim 5.

7. The marking unit is configured to comply with laser safety standard Class 4. The laser marking device according to claim 5.

8. The laser irradiation unit is configured to include at least a main body that emits the laser light, a scanning mechanism that scans the laser light, and an optical system that focuses the laser light. The laser marking device according to claim 1.

9. an imaging camera that images the marking object from below through the laser irradiation hole; The laser irradiation unit is configured to determine the irradiation position of the laser light based on the image pickup result by the image pickup camera. The laser marking device according to claim 1.

Images