Testing device and test system

Abstract

To disclose a testing device including a circuit main board, and a test system.SOLUTION: Multiple chip carrier base bodies, a power supply connector, and a signal output connector are provided in one side of a circuit main board. A test object wafer is fixed to a chip carrier board. The chip carrier board is removably installed in the chip carrier base body. An external power supply can supply power to the test object wafer installed in the chip carrier base body through the power supply connector and the circuit main board. Multiple carrier connectors are installed in the other side of the circuit main board. Each signal carrier board is removably installed in the circuit main board through the carrier connectors. A signal input connector into which one end of a signal input line is inserted is provided in each signal carrier board. An external signal input device can input a test signal to the test object wafer through the signal input line, the signal input connector, the signal carrier board, and the circuit main board.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a test device and a test system, and more particularly to a test device and a test system. [Background technology]

[0002] In existing technology, there are no devices or systems specifically designed for MIPI test experiments. When conducting MIPI test experiments, relevant engineers usually use materials on hand or build a platform for conducting the test based on the experience of each laboratory. As a result, relevant engineers have to rebuild the corresponding platform every time they conduct a test, which causes difficulties for the engineers in the test experiment. The platforms built by different experimenters may cause errors in the test results. This poses a major problem for laboratories. Summary of the Invention [Problem to be solved by the invention]

[0003] The main purpose of the present invention is to disclose a test device and a test system to improve the problem that there is no test device or system in the existing technology that allows related experimenters to easily carry out MIPI test experiments. [Means for solving the problem]

[0004] One embodiment disclosed in the present invention is Electronic circuit main board , multiple chip carriers socket , multiple signal output connectors, multiple carrier connectors, multiple signal carriers board and a plurality of signal input connectors. Electronic circuit main board The opposite sides of the arrow are defined as a first side and a second side, respectively. Electronic circuit main board The chip carrier has a plurality of power connectors disposed on a first side thereof. socketis installed on the first side, and each chip carrier socket is a chip carrier board It is used to carry the chip carrier board One side of the test object Tips It is used to fix and install the signal output connectors. Electronic circuit main board Each signal output connector is External signal reader The carrier connectors are used to connect to Electronic circuit main board Each signal carrier is installed on the second side of the board through multiple carrier connectors, Electronic circuit main board Removably installed on the second side of each signal carrier board is a carrier connector and Electronic circuit main board through the first side of the chip carrier socket Test subjects placed in Tips Each signal carrier is electrically connected to board At least one signal input connector is provided on the test object, and the signal input connector is used to insert a connector at one end of a signal input line. Tips is a chip carrier board and Electronic circuit main board power supply provided by an external power source through the corresponding power connector. Tips is a chip carrier board , Electronic circuit main board , signal carrier board and the test signal transmitted from the signal input line is acquired via the signal input connector, and the test object Tips is a chip carrier board , Electronic circuit main board and the signal through the signal output connector. External signal reader Transmit to.

[0005] One embodiment of the present invention discloses a test system comprising a test apparatus and a temperature control device. Electronic circuit main board , multiple chip carriers socket , multiple signal output connectors, multiple carrier connectors, multiple signal carriers board and a plurality of signal input connectors. Electronic circuit main boardThe opposite sides of the arrow are defined as a first side and a second side, respectively. Electronic circuit main board The chip carrier has a plurality of power connectors disposed on a first side thereof. socket is installed on the first side, and each chip carrier socket is a chip carrier board Carrier and chip carrier board One side of the test object Tips It is used to fix and install the signal output connectors. Electronic circuit main board Each signal output connector is External signal reader The carrier connectors are used to connect to Electronic circuit main board Each signal carrier is installed on the second side of the board through multiple carrier connectors, Electronic circuit main board Removably installed on the second side of each signal carrier board is a carrier connector and Electronic circuit main board through the first side of the chip carrier socket Test subjects placed in Tips Each signal carrier is electrically connected to board At least one signal input connector is provided on the test object, and the signal input connector is used to insert a connector at one end of a signal input line. Tips is a chip carrier board and Electronic circuit main board power supply provided by an external power source through the corresponding power connector. Tips is a chip carrier board , Electronic circuit main board , signal carrier board and the test signal transmitted from the signal input line is acquired via the signal input connector, and the test object Tips is a chip carrier board , Electronic circuit main board and the signal through the signal output connector. External signal readerThe temperature control device includes a movable door, at least one chamber, and at least one temperature control device, the movable door being operable to seal the chamber, the temperature control device being used to maintain a temperature within the chamber at a predetermined temperature, and the chamber being capable of housing at least one test device, whereby the housed test device can perform a test at the predetermined temperature.

[0006] In summary, the test apparatus and test system of the present invention are board Removable Electronic circuit main board Chip carrier installed on one side of socket Designed to be fixed to the signal carrier board of Electronic circuit main board This allows the tester to easily install the test object on the other side of the test object. Tips Based on the test requirements of the chip carrier board and signal carriers board By modifying or replacing the above, it is possible to perform testing under conditions that comply with MIPI test requirements.

[0007] In order to better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are provided for reference and explanation only and are not intended to limit the scope of the present invention. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a state in which a chip carrier board is provided in a test apparatus of the present invention; [Figure 2] 10 is a schematic view of the test apparatus of the present invention with a chip carrier board mounted thereon, taken from another angle; FIG. [Figure 3] 2 is an exploded schematic diagram showing the electronic circuit main board and chip carrier board of the test device of the present invention; FIG. [Figure 4]1 is a schematic diagram showing a test device of the present invention connected to an external power supply, an external signal reading device, and an external signal input device; [Figure 5] 2 is an exploded schematic diagram showing the electronic circuit main board and the signal carrier board of the test device of the present invention; FIG. [Figure 6] 2 is a schematic diagram showing a signal carrier board installed on an electronic circuit main board in the test device of the present invention; FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. [Figure 8] FIG. 2 is a plan view of a signal carrier board. [Figure 9] FIG. 9 is a partially enlarged schematic view of FIG. 8. [Figure 10] FIG. 1 is a schematic diagram illustrating a test system of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] In the following description, when a specific drawing is referred to or indicated as a specific drawing, this is to emphasize that the contents mentioned in the following description are mainly shown in that specific drawing, and the following description does not rely solely on that specific drawing. Furthermore, in order to clearly show the components of the present invention, it is clearly stated that the sizes of the components in each drawing are shown for reference only and are not drawn based on their actual size.

[0010] Please refer to Figures 1 to 5. Figures 1 and 2 show the chip carrier in the test device of the present invention. board 3 is a schematic diagram showing the installation of the test device of the present invention from different viewing angles. Electronic circuit main board and chip carrier board FIG. 4 is an exploded schematic diagram showing the test device of the present invention. External signal reader 5 is a schematic diagram showing the test device of the present invention connected to an external signal input device. Electronic circuit main board and signal carrier board FIG.

[0011] The test device 1 of the present invention is Tips B provides quick and easy testing, especially for test subjects Tips It is suitable for MIPI test experiments on B.

[0012] The test device 1 of the present invention comprises: Electronic circuit main board 11. Multiple chip carriers socket (Socket) 12, at least one signal input connector 13, a plurality of carrier connectors 14, a plurality of signal carriers board 15, and a plurality of signal output connectors 16. The test device 1 includes a chip carrier. socket 12, signal input connector 13, carrier connector 14, signal carrier board The number of the chip carriers 15 and the signal output connectors 16 can be selected according to actual needs and is not limited to those shown in the drawings. socket 12, signal input connector 13, and signal carrier board The numbers 15 are the same as each other, but are not limited to this.

[0013] Electronic circuit main board The opposite sides of 11 are defined as a first side 111 and a second side 112, respectively. Electronic circuit main board 11 has a first side 111 on which a plurality of power connectors 113 and a plurality of chip carriers are provided. socket 12 have been installed. Electronic circuit main board the number of power connectors 113 installed in the 11; Electronic circuit main board Chip carrier installed at 11 socket The numbers 12 are basically the same, but not limited to this.

[0014] Each chip carrier socket 12 is a chip carrier board Used to carry 17. Chip carrier board 17 on one side of the test object TipsEach power connector 113 is used to connect to an external power source C, and the power provided by the external power source C is Electronic circuit main board Multiple chip carriers through 11 socket Chip carrier installed at 12 board 17, each chip carrier board Test subjects on 17 Tips B is used to obtain the power required for operation.

[0015] In a particular embodiment, each power connector 113 is electrically independent, and each power connector 113 is connected to the external power source C. socket Signal carrier 1 above 12 board 15 by providing power to the signal carrier board Test subjects on 15 Tips In an embodiment in which each power connector 113 is independent, an external power source C with a different voltage can supply power through different power connectors 113. Electronic circuit main board 11 different chip carriers socket 12-inch chip carrier board 17, different chip carriers can be transmitted board Test subjects on 17 Tips B can obtain power at a different voltage.

[0016] In certain embodiments, a single power connector 113 allows an external power source C to provide power to two or more chip carriers. socket Signal carrier on 12 board 15, by providing those signal carriers board Test subjects on 15 Tips Also, in certain embodiments, two or more power connectors 113 may cooperate to allow an external power source C to provide power to the chip carrier B. socket Signal carriers on 12 board 15 by providing its signal carrier board Test subjects on 15 TipsB may obtain power.

[0017] Also, in certain modified embodiments, Electronic circuit main board 11 may further include a plurality of power switching modules 114. Each power switching module 114 includes at least one power connector 113 and at least one chip carrier. socket 12, and each power supply switching module 114 can be switched between at least two states by user operation. For example, the power supply switching module 114 can be switched between two states, connection and non-connection, by user operation. Specifically, each power supply switching module 114 is, for example, a switch jumper.

[0018] Electronic circuit main board A plurality of signal output connectors 16 may be further provided on the first side 111 of the 11, and each signal output connector 16 is External signal reader The specific type and location of each signal output connector 16 are as follows: External signal reader It can be designed based on the shape of D. For example, Tips In the example where B is a MIPI Driver IC, External signal reader D may be an oscilloscope.

[0019] Chip Carrier socket Chip carrier installed at 12 board Test subjects on 17 Tips After power is applied to B, the test object Tips The output signal from B is Electronic circuit main board 11 and through one of the signal output connectors 16 External signal reader D.

[0020] In practice, relevant testers Tips B is soldered or otherwise attached to the chip carrier. board The chip carrier may be fixed to the chip carrier 17 first. board17 types can be designed based on actual needs, such as chip carrier board Multiple pins 171 included in 17 and test targets Tips B is a chip carrier board 17 or multiple pins 171 and the test object Tips B is the chip carrier board 17 different sides.

[0021] As shown in Figure 3, in practical applications, each chip carrier socket The chip carrier 12 includes a body 121, which includes a plurality of pin holes 1211 and receiving slots 1212. Each pin hole 1211 penetrates the body 121. The receiving slots 1212 may be, for example, recesses formed by recessing the body 121, or holes penetrating the body 121. board 17 is the chip carrier socket 12, when installed in the chip carrier board A plurality of pins 171 are inserted into the corresponding pin holes 1211, and these pins 171 are Electronic circuit main board 11. In practical applications, the chip carrier socket Each of the 12 pin holes 1211 has an associated conductive structure located therein, and these conductive structures are Electronic circuit main board 11. After each pin 171 is inserted into the pin bore 1211, each pin 171 is connected to the corresponding conductive structure. Electronic circuit main board 11 can be electrically connected.

[0022] If the chip carrier board 17 test subjects Tips If B and multiple pins 171 are located on the same side, the chip carrier board 17 is the chip carrier socket When installed in 12, the test subject Tips B is accommodated in the accommodation slot 1212. Through the design of the accommodation slot 1212, the chip carrier board Multiple pins 171 and test object in 17 TipsChip carriers, whether B is on the same side or on a different side board 17 is the chip carrier socket Can be attached to 12.

[0023] In actual operation, testers Tips In some cases, only B is received. In this case, the tester Tips B is the chip carrier board In this case, the tester must fix the Tips B is the chip carrier board 17, the side where pin 171 is installed or the side where pin 171 is not installed. However, in different embodiments, the tester Tips Chip carrier with B already installed board Sometimes you receive 17 directly.

[0024] Testers are the test subjects Tips Chip carrier with B already installed board In the example where 17 was received directly, the tester Tips The position of B cannot be changed. board 17 multiple pins 171 are tested Tips If fixed on the same side as B, the chip carrier socket 12 requires the presence of a receiving slot 1212, which allows the chip carrier board 17 chip carrier socket It can be easily attached to the 12.

[0025] Test Subject Tips B is the chip carrier board 17 fixed, chip carrier board 17 is a chip carrier socket 12, so that the relevant test personnel can be different test subject Tips If you want to test B, you need a different chip carrier. board to 17 test subject Tips All you need to do is fix B, and the tester Electronic circuit main board 11 and the associated electronic components installed on it. Tips B is Electronic circuit main board Because it is not fixed to 11, Electronic circuit main board 11 Unless the related wiring on the test subject Tips In the process of testing B Electronic circuit main board There is no need to replace or change 11.

[0026] Also, the test subject Tips B is a chip carrier board 17, so the test subject Tips During the process of testing B, if the test results are clearly outside the expected range, the tester shall board 17 and Electronic circuit main board 11, and can quickly identify the cause of the incorrect test results. For example, the tester can board 17 to another Electronic circuit main board 11 chip carriers socket 12 and retest. If the test is successful, Electronic circuit main board 11 may have been damaged. Or the tester Electronic circuit main board 11 different chip carriers socket 12 chip carriers board 17, and if the test result is normal, socket In practice, testers may damage the chip carrier 12 during the process of performing the above example method. board 17 is the chip carrier socket 12, allowing testers to board Same as 17 Electronic circuit main board 11 different chip carriers socket Can be quickly moved to 12 or another Electronic circuit main board 11-chip carrier socket12, allowing testers to move the chip carrier board Test object already soldered to 17 Tips There is no need to remove B.

[0027] Please refer to Figures 5 to 9. Figure 5 shows the structure of the test device according to the present invention. Electronic circuit main board and signal carrier board FIG. 6 is an exploded schematic diagram showing the test device according to the present invention. Electronic circuit main board Signal carriers installed in board 7 is a schematic cross-sectional view taken along the line VII-VII in FIG. 6, and FIG. 8 is a schematic cross-sectional view of a signal carrier board 9 is a schematic enlarged view of a portion of FIG. 8.

[0028] Electronic circuit main board A plurality of carrier connectors 14 are provided on a second side 112 of the connector 11. Two adjacent carrier connectors 14 are connected to a signal carrier. board 15, a plurality of pluggable connectors 151 can be connected to each other, and each signal carrier board 15 through a plurality of carrier connectors 14 Electronic circuit main board 11 is removably secured to the second side 112 of the signal carrier 11. board The number and arrangement of the plug connectors 151 included in the connector 15 can be changed as needed. In the drawings of this embodiment, each plug connector 151 includes multiple pins, but the configuration of the plug connectors 151 is not limited thereto.

[0029] Signal Carrier board 15 is a connector 151, a carrier connector 14, and Electronic circuit main board 11, a chip carrier mounted on a first side 111 socket Test Subjects in 12 Tips B can be electrically connected to each signal carrier. board 15, a signal input connector 13 is provided, and the signal input connector 13 is used to insert a connector E1 at one end of a signal input line E. For example, the signal input connector 13 is an HDMI (登録商標)The connectors include, but are not limited to, video and audio transmission connectors such as connectors, various signal transmission connectors, and particularly high frequency signal transmitters.

[0030] As shown in Figures 6 and 7, the signal carrier board 15 may further have an escape hole 152. The escape hole 152 is for signal carriers. board 15, and the avoidance hole 152 is used to accommodate the connector E1 of the signal input line E. Due to the design of the avoidance hole 152, when the connector E1 of the signal input line E is inserted into the signal input connector 13, the connector E1 of the signal input line E can be accommodated in the avoidance hole 152, and the connector E1 can be inserted into the signal carrier board The other end of the signal input line E is connected to an external signal input device F.

[0031] Signal Carrier board 15 is Electronic circuit main board 11 detachably connected, testers can choose different signal carriers based on actual needs board Test subject by replacing 15 Tips B. Also, testers can select different signal carriers based on the test requirements. board 15 wiring and other design changes can be made to the signal carrier to suit specific test requirements. board For example, if the signal input connector 13 is an HDMI (登録商標) Connector and subject to testing Tips If B is a MIPI Driver IC, the test object Tips To perform MIPI test experiments on B, the tester must board Wiring in 15, especially HDMI (登録商標) Specially designed wiring to connect to the connector allows for signal carrier board 15 can be adjusted to meet the high frequency impedance matching requirements. Tips B can perform RA HTOL test in Video Mode. Of course, the chip carrier socket 12 and Electronic circuit main board The associated wiring 11 is also designed to support high frequency impedance matching.

[0032] For example, as shown in FIGS. 8 and 9, the signal carrier board 15 signal input connector 13 is HDMI (登録商標) In the connector example, the signal carrier board A ground wiring 154 may be arranged on both sides of each signal wiring 153 connected to the signal input connector 13 in 15, and each signal wiring 153 is located between two ground wirings 154. With this design, the signal carrier board 15 can effectively meet the requirement of high frequency impedance matching, thereby making the high frequency signal transmitted through the signal line 153 less susceptible to interference from external signals.

[0033] In other words, the signal carrier board 15 is Electronic circuit main board The design allows the tester to removably mount the signal carrier to the second side 112 of the signal carrier. board 15. Through the change or replacement of the external signal input device F to the signal carrier board The signal input via 15 is tested under the required high frequency transmission conditions. Tips It can be guaranteed that B is entered.

[0034] Existing related test equipment and test systems have signal carriers board 15 is Electronic circuit main board Since there is no design that can be removed from the 11, testers Tips When performing high-frequency signal testing on B, losses often occur during the signal transmission process, resulting in inaccurate transmission of high-frequency signals, or testers may only be able to input down-frequency signals, making it impossible to test with the high-frequency signals used in actual applications.

[0035] In summary, the test device 1 of the present invention is board 17 chip carrier socket 12, a design for removably fastening to the first side 111 of the signal carrier board 15 Electronic circuit main board 11, and the signal input connector 13 is removably fixed to the second side 112 of the signal carrier 11. board 15, the tester can easily see the test object. Tips B. Based on the required test, easy chip carrier board 17 and signal carriers board By changing at least one of the 15 Tips It is possible to test B under conditions that match the requirements. For example, Tips If you need MIPI testing of high frequency signals for B, Electronic circuit main board If the 11 wiring meets the high-frequency transmission requirements, the tester board 17 and signal carriers board 15. Just ensure that the wiring above meets the high-frequency transmission requirements. Tips B can perform high frequency signal testing.

[0036] It should also be emphasized that the power connector 113 and the signal input connector 13 Electronic circuit main board The design of arranging the signals on the opposite sides of the signal input connector 11 can effectively reduce the problem of interference of the signals input from the signal input connector 13.

[0037] Also, signal carriers board 15 is Electronic circuit main board 11. Detachable connection design allows users to connect different signal carriers board Simply replace the 15 signal carrier board 15 through different signal input connectors 13 Tips A signal can be input to B. Electronic circuit main board 11 and chip carrier board 17 does not need to be redesigned, making the test apparatus 1 more overall cost-effective and more flexible in its application.

[0038] Please refer to Figures 1, 2, 4 and 10. Figure 10 is a schematic diagram showing a test system A of the present invention. The test system A of the present invention includes a temperature control device 2 and at least one test apparatus 1 of the present invention. Please refer to the above description of the test apparatus 1, and the description will not be repeated here.

[0039] The temperature control device 2 includes a movable door 21, at least one chamber 22, and at least one temperature controller 23. The number of chambers 22 included in the temperature control device 2 can be changed as needed. The temperature controller 23 mainly controls the temperature of each chamber 22 and maintains the temperature of each chamber 22 at a predetermined low or high temperature. The movable door 21 can be operated to seal the chamber 22, and the temperature controller 23 is used to maintain the temperature inside the chamber 22 at a predetermined temperature.

[0040] In real applications, the tester Tips When it is desired to test B at a specific temperature, the test device 1 is placed in the chamber 22, the connecting wire connected to the test device 1 is pulled out from the temperature control device 2, and an external power supply C located outside the chamber 22 is connected to the test device 1. External signal reader It can be connected to an external power supply C, D (e.g., oscilloscope), and an external signal input device F. External signal reader There is no limitation here on how the associated connecting wires for connecting with D and the external signal input device F are led out of the chamber 22 .

[0041] Of course, in different variants, the temperature control device 2 may also be connected to an external power source C, which the test device 1 needs to connect to. External signal reader The test device 1 can be integrated with the external signal input device D and the external signal input device F, and the relevant connecting lines are installed in the chamber 22. After placing the test device 1 in the chamber 22, the connecting lines in the chamber 22 need to be connected to the test device 1.

[0042] In summary, the test system A of the present invention allows a tester to TipsIt is designed to make B easy to test, especially for Tips It is suitable for MIPI RA HTOL test experiment scenarios for B.

[0043] The above disclosure is merely a preferred embodiment of the present invention, and does not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and accompanying drawings of the present invention shall be included in the scope of the claims of the present invention. [Explanation of symbols]

[0044] A Test System 1 Test equipment 11 Electronic circuit main board 111 First Aspect 112 The Second Aspect 113 Power Connector 114 Power Switching Module 12 Chip Carrier socket 121 Main Unit 1211 Pin drilling 1212 accommodation slots 13 Signal input connector 14 Carrier Connector 15 Signal Carrier board 151 Insertion Connector 152 Avoidance Hole 153 Signal wiring 154 Ground wiring 16 Signal output connector 17 Chip Carrier board 171 pins 2. Temperature control device 21 Movable Door 22 Chambers 23 Temperature control device B. Test Subject Tips C External power supply D External signal reader E signal input line E1 Connector F External signal input device

Claims

1. a circuit main board having opposite sides defined as a first side and a second side, and a plurality of power connectors disposed on the first side; a plurality of chip carrier base bodies disposed on the first side, each of which is used to support a chip carrier substrate having a wafer to be tested fixedly disposed on one side; a plurality of signal output connectors, each of which is installed on the circuit main board and is used to connect with an external signal reader device; a plurality of carrier connectors disposed on the second side surface of the circuit main board; a plurality of signal carrier substrates, each of which is detachably installed on the second side surface of the circuit main board via a plurality of the carrier connectors, and which are electrically connected to the test target wafer on the chip carrier base body installed on the first side surface via the carrier connectors and the circuit main board; a plurality of signal input connectors, at least one of which is provided on each of the signal carrier boards, for inserting connectors at one ends of signal input lines; Equipped with the wafer under test obtains power provided by an external power source through the chip carrier substrate and the circuit main board from the corresponding power connector, and the wafer under test obtains a test signal transmitted through the signal input line through the chip carrier substrate, the circuit main board, the signal carrier substrate and the signal input connector, and the wafer under test transmits a signal to an external signal reader device through the chip carrier substrate, the circuit main board and the signal output connector; A test device characterized in that:

2. 2. The testing device of claim 1, wherein the chip carrier base body includes a main body, the main body includes a plurality of pin holes and accommodating slots, each of the pin holes is disposed through the main body, a plurality of pins are disposed on one side of the chip carrier substrate, the wafer to be tested and the plurality of pins are disposed on the same side or different sides of the chip carrier substrate, when the chip carrier substrate is disposed on the chip carrier base body, the plurality of pins are disposed through a corresponding plurality of the pin holes, and the accommodating slots are used to accommodate the wafer to be tested on the chip carrier substrate disposed on the chip carrier base body.

3. 3. The test device according to claim 2, wherein the signal carrier board has ground wiring on both sides of each signal wiring for connecting to the signal input connector, and each of the signal wirings is located between two of the ground wirings.

4. 2. The test device according to claim 1, wherein a plurality of power supply switching modules are installed on the circuit main board, and each of the power supply switching modules is installed between at least one of the power supply connectors and at least one of the circuits of the chip carrier base body.

5. 2. The test device of claim 1, wherein the signal carrier substrate has an avoidance hole, the avoidance hole penetrates the signal carrier substrate, the signal input connector is used to insert a connector at one end of a signal input line, and the avoidance hole is used to accommodate the connector of the signal input line.

6. A test system comprising a test fixture and a temperature control device, The test device comprises: a circuit main board having opposite sides defined as a first side and a second side, and a plurality of power connectors disposed on the first side; a plurality of chip carrier base bodies disposed on the first side, each of which is used to support a chip carrier substrate having a wafer to be tested fixedly disposed on one side; a plurality of signal output connectors, each of which is installed on the circuit main board and is used to connect with an external signal reader device; a plurality of carrier connectors disposed on the second side surface of the circuit main board; a plurality of signal carrier substrates, each of which is detachably installed on the second side surface of the circuit main board via a plurality of the carrier connectors, and which are electrically connected to the test target wafer on the chip carrier base body installed on the first side surface via the carrier connectors and the circuit main board; a plurality of signal input connectors, at least one of which is provided on each of the signal carrier boards, for inserting connectors at one ends of signal input lines; Equipped with the wafer under test obtains power provided by an external power source through the chip carrier substrate and the circuit main board from the corresponding power connector, and the wafer under test obtains a test signal transmitted through the signal input line through the chip carrier substrate, the circuit main board, the signal carrier substrate and the signal input connector, and the wafer under test transmits a signal to an external signal reader device through the chip carrier substrate, the circuit main board and the signal output connector; the temperature control device includes a movable door, at least one chamber, and at least one temperature control device, the movable door being operable to seal the chamber, the temperature control device being used to maintain a temperature within the chamber at a predetermined temperature, and the chamber housing at least one test apparatus such that the test apparatus can perform a test at the predetermined temperature; A test system comprising:

7. 7. The test system of claim 6, wherein the chip carrier base body includes a main body, the main body includes a plurality of pin holes and accommodating slots, each of the pin holes is disposed through the main body, a plurality of pins are disposed on one side of the chip carrier substrate, the wafer to be tested and the plurality of pins are disposed on the same side or different sides of the chip carrier substrate, when the chip carrier substrate is disposed on the chip carrier base body, the plurality of pins are disposed through a corresponding plurality of the pin holes, and the accommodating slots are used to accommodate the wafer to be tested on the chip carrier substrate disposed on the chip carrier base body.

8. 8. The test system according to claim 7, wherein the signal carrier board has ground wiring on both sides of each signal wiring for connecting to the signal input connector, and each of the signal wirings is located between two of the ground wirings.

9. 7. The test system of claim 6, wherein a plurality of power supply switching modules are installed on the circuit main board, and each of the power supply switching modules is installed between at least one of the power supply connectors and at least one of the circuits of the chip carrier base body.

10. 7. The test system of claim 6, wherein the signal carrier substrate has an avoidance hole, the avoidance hole penetrates the signal carrier substrate, the signal input connector is used to insert a connector at one end of a signal input line, and the avoidance hole is used to accommodate the connector of the signal input line.

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