Manufacturing apparatus for display panel

Abstract

To enable application of a laser beam accurately only to a micro-LED substantially and increase the uniformity of the applied pressure generated by pressure application of a laser transmission member.SOLUTION: A manufacturing apparatus for a display panel is provided. The manufacturing apparatus for a display panel includes: a support part on which a display substrate is placed; a pressing part including a light-transmission plate disposed on a front surface of the support part, one or more reflection members disposed in the light-transmission plate, and a light absorption member that absorbs the laser light reflected by the reflection member and configured to apply pressure to a plurality of light-emitting elements arranged on the display substrate with the light-transmission plate by moving the light-transmission plate in a display substrate direction; and a laser irradiation part that is disposed on a front surface of the light-transmission plate and irradiates the display substrate with laser light through the light-transmission plate. The reflection member includes a first reflection member that defines a transmission region opening part corresponding to the transmission region of a laser beam, and a second reflection member that guides the light reflected from the first reflection member to the light absorption member.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a display panel manufacturing apparatus. [Background technology]

[0002] Micro LED is an ultra-small inorganic light-emitting material that emits light by itself without a backlight. Specifically, Micro LED is small, with a length that is one-tenth of that of an organic light-emitting diode chip and an area that is one-hundredth of that of an organic light-emitting diode chip. For example, Micro LED refers to an ultra-small LED with a width, length, and height ranging from approximately 10 μm to 100 μm.

[0003] Micro LEDs can be manufactured by growing a large number of chips on a growth substrate such as a wafer through an epitaxial process, etc. The manufactured micro LEDs are usually transferred to an intermediate substrate and then transferred to a target substrate for use in a display module.

[0004] The micro LED transfer process can use a laser transfer method in which a laser beam (sometimes called laser light) is irradiated onto the back of the relay substrate (multiple micro LEDs are arranged on the front of the relay substrate) to transfer the micro LEDs on the relay substrate to the target substrate.

[0005] However, the laser transfer method has a problem in that the laser beam irradiated onto the backside of the relay board passes through the area between the micro LEDs and the outer area of ​​the relay board, so the laser beam is applied to the target board as well as the micro LEDs. When the laser beam is applied to the target board, the temperature of the target board rises, causing damage to the target board. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 10-2020-0128987 [Patent Document 2] Korean Patent Publication No. 10-2021-0062376 [Patent Document 3] Korean Patent Publication No. 10-2016-0057705 Summary of the Invention [Problem to be solved by the invention]

[0007] The problem to be solved by the present invention is to provide a display panel manufacturing device that reflects a laser beam irradiated to a peripheral area other than the micro LED so that the laser beam is applied accurately to almost only the micro LED, thereby improving the uniformity of the pressure force generated by pressing the laser-transmitting member.

[0008] The objectives of the present invention are not limited to those mentioned above, and other technical objectives not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] According to one embodiment of the present invention, an apparatus for manufacturing a display panel includes a support portion on which a display substrate is placed, a light-transmitting plate disposed in front of the support portion, one or more reflecting members disposed within the light-transmitting plate, and a light-absorbing member that absorbs laser light reflected by the reflecting member. The apparatus also includes a pressure unit that moves the light-transmitting plate toward the display substrate and applies pressure to a plurality of light-emitting elements arranged on the display substrate with the light-transmitting plate, and a laser irradiation unit that is disposed in front of the light-transmitting plate and irradiates laser light onto the display substrate through the light-transmitting plate, and the reflecting member may include a first reflecting member that defines a transmission area opening corresponding to a transmission area of ​​the laser beam, and a second reflecting member that guides the light reflected from the first reflecting member to the light-absorbing member.

[0010] In one embodiment, the laser beam source further includes a third reflecting member disposed between the second reflecting member and the light absorbing member, and the third reflecting member may reflect the laser beam reflected from the second reflecting member to the light absorbing member.

[0011] In one embodiment, the first reflective member, the second reflective member, and the third reflective member may be incorporated in an outer region of the light-transmitting plate corresponding to a non-display region, which is an outer region of the display substrate, excluding a display region of the display substrate where the plurality of light-emitting elements are arranged, and may be arranged in order from the inside to the outside of the light-transmitting plate.

[0012] In one embodiment, the first reflecting member has a cross section formed in a triangular mountain shape, and the cross section is formed in at least one of a right triangle, an equilateral triangle, and an isosceles triangle, and any one surface in the front direction of the first reflecting member may have a predetermined inclination toward the direction in which the second reflecting member is disposed.

[0013] In one embodiment, the light-transmitting plate may include a first inner surface and a second inner surface facing the first inner surface, the first reflecting member and the third reflecting member may be disposed on the first inner surface, and the second reflecting member may be disposed on the second inner surface.

[0014] In one embodiment, the light absorbing member may be disposed on a side surface of the light-transmitting plate and disposed on a reflection path of the laser light.

[0015] In one embodiment, the transmissive area opening may be formed in an area corresponding to a non-display area, which is an outer area of ​​the display substrate.

[0016] In an embodiment, the pressure unit may include a plate transport unit connected to the light-transmitting plate and configured to move toward the display substrate or away from the display substrate.

[0017] In one embodiment, the light-transmitting plate is formed as a transparent or translucent flat plate, and allows laser light applied to the front or rear surface to pass through to the front or rear surface in the opposite direction. The light-transmitting plate is moved toward the display substrate or in the opposite direction away from the display substrate by the plate transport unit, and may be moved toward the display substrate by the plate transport unit to pressurize a plurality of light-emitting elements arranged on the display substrate toward the display substrate.

[0018] According to one embodiment, a display panel manufacturing apparatus includes: a support portion on which a display substrate is placed; a light-transmitting plate disposed in front of the support portion; a reflecting member and a light-absorbing member disposed in the light-transmitting plate, the reflecting member absorbing laser light reflected by the reflecting member; a pressurizing portion including a pressurizing member for pressurizing the light-transmitting plate; and a laser irradiation portion disposed in front of the pressurizing portion, the pressurizing member irradiating the display substrate with laser light through the light-transmitting plate, the pressurizing member including a first light-transmitting member and a second light-transmitting member disposed on the light-transmitting plate, and a gas pressure adjusting portion adjusting a gas pressure in an enclosed space formed between the first light-transmitting member and the second light-transmitting member to generate a pressure on the light-transmitting plate.

[0019] In one embodiment, the first transparent member may be made of a rigid material, and the second transparent member may be made of an elastic material.

[0020] In one embodiment, the second translucent member may be disposed to overlap the first translucent member in a thickness direction.

[0021] In an embodiment, the display panel manufacturing apparatus may further include a gas conduit connected between the gas pressure regulator and the sealed space.

[0022] In an embodiment, the display panel manufacturing apparatus may further include a buffer member disposed between the light-transmitting plate and the pressure member.

[0023] In one embodiment, the reflective member may have a cross section formed in a triangular mountain shape, and the cross section may be formed in at least one of a right triangle, an equilateral triangle, and an isosceles triangle, and any one of the faces in the front direction of the reflective member may be formed to be inclined at a predetermined inclination toward the direction in which the light absorbing member is arranged.

[0024] In one embodiment, the reflective member may be attached or mounted to an outer region of the light-transmitting plate corresponding to a non-display region, which is an outer region of the display substrate, except for a display region of the display substrate where the plurality of light-emitting elements are arranged.

[0025] In one embodiment, the light absorbing member may be disposed between the laser irradiation unit and the pressure unit, and may not overlap with the path of light irradiated by the laser irradiation unit.

[0026] In one embodiment, the light absorbing member may be disposed in the sealed space and may not overlap with the path of light irradiated by the laser irradiation unit.

[0027] In one embodiment, the reflecting member includes a first reflecting member defining a transmission area opening corresponding to a transmission area of ​​the laser beam, and a second reflecting member guiding light reflected from the first reflecting member to the light absorbing member, and the light absorbing member may be disposed on a side of the light-transmitting plate.

[0028] According to one embodiment, a display panel manufacturing apparatus includes: a support portion on which a display substrate is placed; a light-transmitting plate disposed in front of the support portion; a light-absorbing member that absorbs laser light; a pressurizing portion including a pressurizing member that presses the light-transmitting plate; and a laser irradiation portion disposed in front of the pressurizing portion and that irradiates the display substrate with laser light through the light-transmitting plate, wherein the pressurizing member may include a first light-transmitting member and a second light-transmitting member disposed on the light-transmitting plate; a reflecting member disposed within the first light-transmitting member that reflects the incident laser light by the light-absorbing member; and a gas pressure adjusting portion that adjusts a gas pressure in an enclosed space formed between the first light-transmitting member and the second light-transmitting member to generate a pressurizing force on the light-transmitting plate.

[0029] In one embodiment, the light absorbing member may be disposed between the laser irradiation unit and the first light transmitting member, and may not overlap with the path of light irradiated by the laser irradiation unit.

[0030] In one embodiment, the first transparent member may be made of a rigid material, and the second transparent member may be made of an elastic material. [Effects of the Invention]

[0031] According to the display panel manufacturing apparatus of the embodiment, the laser beam irradiated on the peripheral area other than the micro LEDs is reflected by the reflective member of the light-transmitting plate, so that the laser beam is applied accurately only to the micro LEDs, and the uniformity of the pressure applied to the micro LEDs is increased, thereby preventing manufacturing defects of the target substrate and the display panel and improving manufacturing efficiency.

[0032] The effects of the embodiments are not limited to the above examples, and a wider variety of effects are included in this specification. [Brief explanation of the drawings]

[0033] [Figure 1] 1 is a plan view of a display device according to an embodiment. [Figure 2] FIG. 2 is a plan view schematically illustrating a light-emitting region of each pixel according to an embodiment. [Figure 3] FIG. 10 is a plan view schematically illustrating a light-emitting region of each pixel according to another embodiment. [Figure 4] 3 is a cross-sectional view according to one embodiment, schematically illustrating the AA' cross section of FIG. 2. FIG. [Figure 5] FIG. 5 is an enlarged view schematically illustrating the first light-emitting region of FIG. 4. [Figure 6] FIG. 6 is a cross-sectional view specifically showing the light-emitting element of FIG. 5. [Figure 7] 1 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to an embodiment. [Figure 8]8 is a front view schematically showing the upper surface of the display panel manufacturing apparatus shown in FIG. 7. [Figure 9] FIG. 9 is a front view showing the arrangement of the first reflecting member and the light absorbing member shown in FIGS. 7 and 8. [Figure 10] 1 is a side cross-sectional view illustrating a method for transferring a micro LED using a manufacturing apparatus according to an embodiment. FIG. [Figure 11] 10 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. [Figure 12] 12 is a front view showing the arrangement of the first reflecting member, the second reflecting member, and the light absorbing member shown in FIG. 11. FIG. [Figure 13] 13 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 12. [Figure 14] 10 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. FIG. [Figure 15] 15 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 14. [Figure 16] 15 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 14. [Figure 17] 15 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 14. [Figure 18] 10 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. FIG. [Figure 19] 19 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 18. [Figure 20] 19 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 18. [Figure 21] 10 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. FIG. [Figure 22] 22 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 21. [Figure 23] 22 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 21. [Figure 24] 10 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. FIG. [Figure 25] 25 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 24. [Figure 26] 25 is a side cross-sectional view showing a method for transferring a micro LED using the manufacturing apparatus of FIG. 24. DETAILED DESCRIPTION OF THE INVENTION

[0034] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the following detailed embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. The present embodiments are provided solely for the purpose of complete disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art to which the present invention pertains. The present invention is defined solely by the scope of the claims.

[0035] When elements or layers are referred to as being "on" other elements or layers, this includes all cases where other layers or elements are directly on or between the other elements. The same reference numerals refer to the same components throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are merely examples, and the present invention is not limited to the details shown in the drawings.

[0036] Although terms such as "first" and "second" are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it is understood that the first component referred to below may be the second component within the technical concept of the present invention.

[0037] The features of the various embodiments of the present invention may be partially or fully combined or combined with each other, and various technical interlocking and driving mechanisms may be possible, and each embodiment may be implemented independently of each other or in conjunction with each other.

[0038] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0039] FIG. 1 is a plan view of a display device according to an embodiment.

[0040] 1, a display device 10 according to an embodiment may be applied to various home appliances or Internet of Things devices such as smartphones, mobile phones, tablet PCs, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), televisions, game consoles, wristwatch-type electronic devices, head-mounted displays, personal computer monitors, notebook computers, automobile navigation systems, vehicle instrument panels, digital cameras, camcorders, exterior billboards, electronic displays, medical devices, testing devices, refrigerators, washing machines, etc. In this specification, a television will be described as an example of a display device, and the TV may have high resolution or ultra-high resolution such as HD, UHD, 4K, or 8K.

[0041] In addition, the display device 10 according to an embodiment can be classified into various types depending on the display method. For example, display devices can be classified into organic light-emitting display devices (OLEDs), inorganic light-emitting display devices (inorganic ELs), quantum dot light-emitting display devices (QEDs), micro-LED displays (micro-LEDs), nano-LED displays (nano-LEDs), plasma display devices (PDPs), field emission displays (FEDs), cathode ray tube displays (CRTs), liquid crystal displays (LCDs), electrophoretic display devices (EPDs), etc. Hereinafter, a micro-LED display device will be described as an example of a display device, and unless otherwise specified, a micro-LED display device applied to the embodiment will be simply referred to as a display device. However, the embodiment is not limited to a micro-LED display device, and other display devices listed above or known in the art may be applied within the scope of sharing the technical concept.

[0042] In the accompanying drawings, the first direction DR1 refers to the horizontal direction of the display device 10, the second direction DR2 refers to the vertical direction of the display device 10, and the third direction DR3 refers to the thickness direction of the display device 10. In this case, "left," "right," "upper," and "lower" refer to directions when the display device 10 is viewed from above. For example, the "right side" refers to one side in the first direction DR1, the "left side" refers to the other side in the first direction DR1, the "upper side" refers to one side in the second direction DR2, and the "lower side" refers to the other side in the second direction DR2. Furthermore, the "upper" and "front" refer to one side in the third direction DR3, and the "lower" and "rear" refer to the other side in the third direction DR3.

[0043] The display device 10 according to an embodiment may have a circular, oval, or square shape in a plan view, for example, a square shape. Furthermore, if the display device 10 is a television, it may have a rectangular shape with its long side oriented horizontally. However, the display device 10 is not limited thereto, and may have its long side oriented vertically or may be rotatably installed so that its long side can be variably oriented horizontally or vertically.

[0044] The display device 10 may include a display area DPA and a non-display area NDA. The display area DPA may be an active area where an image is displayed. The display area DPA may have a square shape in a plan view similar to the general shape of the display device 10, but is not limited to this and may also have a circular or elliptical shape.

[0045] The display area DPA may include a plurality of pixels PX. The plurality of pixels PX are arranged in rows and columns. The shape of each pixel PX may be, but is not limited to, a rectangle or a square in plan view, and may also be a rhombus with each side tilted relative to one side of the display device 10. The plurality of pixels PX may include a plurality of color pixels PX. For example, but is not limited to, the plurality of pixels PX may include a first color pixel PX of red, a second color pixel PX of green, and a third color pixel PX of blue. The color pixels PX may be arranged alternately in a stripe or pen-tile pattern.

[0046] A non-display area NDA may be disposed around the display area DPA. The non-display area NDA may completely or partially surround the display area DPA. The display area DPA may have various shapes, such as a circle or a square. The non-display area NDA may be formed in a shape that surrounds the periphery of the display area DPA. The non-display area NDA may be formed as a bezel of the display device 10.

[0047] In the non-display area NDA, a driving circuit or driving element for driving the display area DPA may be disposed. In one embodiment, a pad unit may be provided on a display substrate of the display device 10 in the non-display area NDA disposed adjacent to a first side (e.g., the bottom side in FIG. 1) of the display device 10, and an external device EXD may be mounted on a pad electrode of the pad unit. Examples of the external device EXD include a connecting film, a printed circuit board, a driving chip DIC, a connector, a wiring connecting film, etc. In the non-display area NDA disposed adjacent to a second side (e.g., the left side in FIG. 1) of the display device 10, a scan driver SDR formed directly on the display substrate of the display device 10 may be disposed.

[0048] FIG. 2 is a plan view schematically illustrating a light-emitting region of each pixel according to an embodiment.

[0049] 2, the pixels PX are arranged in rows and columns and are divided into red, green, and blue pixels PX, and may further include a white, fourth-color pixel PX.

[0050] The pixel electrode of the first color pixel PX is located in the first light-emitting area EA1 and may extend at least partially into the non-light-emitting area NEA. The pixel electrode of the second color pixel PX is located in the second light-emitting area EA2 and may extend at least partially into the non-light-emitting area NEA. The pixel electrode of the third color pixel PX is located in the third light-emitting area EA3 and may extend at least partially into the non-light-emitting area NEA. The pixel electrode of each pixel PX may be connected to one transistor (switching element) included in the corresponding pixel circuit through at least one insulating layer.

[0051] A plurality of light-emitting elements LE are disposed on the pixel electrodes of the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3. Each light-emitting element LE may be formed of a micro LED. The light-emitting elements LE are disposed in the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3, respectively. A first red color filter, a second green color filter, and a third blue color filter may be disposed on the first light-emitting area EA1, the second light-emitting area EA2, and the third light-emitting area EA3, respectively, where the plurality of light-emitting elements LE are disposed. A first organic layer FOL may be disposed in the non-light-emitting area NEA.

[0052] FIG. 3 is a plan view schematically showing a light-emitting region of each pixel according to another embodiment.

[0053] 3, the shape of each pixel PX is not limited to a rectangle or a square in a plan view, but may be a diamond shape with each side inclined relative to one side of the display device 10 to form a pentile structure. Therefore, in each pixel PX of the pentile structure, the first light-emitting region EA1 of the first color pixel PX, the second light-emitting region EA2 of the second color pixel PX, the third light-emitting region EA3 of the third color pixel PX, and the fourth light-emitting region EA4 of any one of the first to third color pixels PX may each be formed in a diamond shape.

[0054] The first to fourth light emitting regions EA1 to EA4 of each pixel PX may have the same or different sizes or planar areas, and the number of light emitting elements LE formed in each of the first to fourth light emitting regions EA1 to EA4 may be the same or different.

[0055] The areas of the first light-emitting region EA1, the second light-emitting region EA2, the third light-emitting region EA3, and the fourth light-emitting region EA4 may be substantially the same, but are not limited to this and may be different from one another. The distance between the adjacent first light-emitting region EA1 and the second light-emitting region EA2, the distance between the adjacent second light-emitting region EA2 and the third light-emitting region EA3, the distance between the adjacent first light-emitting region EA1 and the third light-emitting region EA3, and the distance between the adjacent third light-emitting region EA3 and the fourth light-emitting region EA4 may be substantially the same, but may be different from one another. The embodiments of the present specification are not limited to this.

[0056] The first light-emitting region EA1 may emit the first light, the second light-emitting region EA2 may emit the second light, and the third light-emitting region EA3 and the fourth light-emitting region EA4 may emit the third light, but the embodiments of the present specification are not limited thereto. For example, the first light-emitting region EA1 may emit the second light, the second light-emitting region EA2 may emit the first light, and the third and fourth light-emitting regions EA3 and EA4 may emit the third light. Alternatively, the first light-emitting region EA1 may emit the third light, the second light-emitting region EA2 may emit the second light, and the third and fourth light-emitting regions EA3 and EA4 may emit the first light. Alternatively, at least one of the first to fourth light-emitting regions EA1 to EA4 may emit the fourth light. The fourth light may be light in the yellow wavelength band. That is, the main peak wavelength of the fourth light may be approximately 550 nm to 600 nm, but the embodiments of the present specification are not limited thereto.

[0057] Fig. 4 is a cross-sectional view according to one embodiment, schematically showing the A-A' cross section in Fig. 2. Fig. 5 is an enlarged view schematically showing the first light-emitting region in Fig. 4, and Fig. 6 is a cross-sectional view specifically showing the light-emitting device in Fig. 5. Note that the barrier film BR is omitted in Fig. 5. Also, in Fig. 5, the gate insulating layer 130, insulating film 140, first planarization film 160, and second planarization film 180 in Fig. 4 are collectively shown as an insulating layer 135.

[0058] 4 to 6, the display panel of the display device 10 may include a display substrate 20 and a wavelength conversion unit 30 disposed on the display substrate 20.

[0059] A barrier film BR may be disposed on the first substrate 110 of the display substrate 20. The first substrate 110 may be made of an insulating material such as a polymer resin. For example, the first substrate 110 may be made of polyimide. The first substrate 110 may be a flexible substrate that allows bending, folding, rolling, and the like.

[0060] The barrier film BR is a film for protecting the thin film transistors T1, T2, and T3 and the light emitting element LEP from moisture that may penetrate through the first substrate 110, which is susceptible to moisture permeation. The barrier film BR is made of a plurality of inorganic films that are alternately stacked. For example, the barrier film BR may be formed of a multi-layer structure in which one or more inorganic films selected from the group consisting of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are alternately stacked.

[0061] The transistors T1, T2, and T3 may be disposed on the barrier film BR. The thin-film transistor T1 includes an active layer ACT1, a gate electrode G1, a source electrode S1, and a drain electrode D1. The thin-film transistor T2 includes an active layer ACT2, a gate electrode G2, a source electrode S2, and a drain electrode D2. The thin-film transistor T3 includes an active layer ACT3, a gate electrode G3, a source electrode S3, and a drain electrode D3.

[0062] Active layers ACT1, ACT2, and ACT3, source electrodes S1, S2, and S3, and drain electrodes D1, D2, and D3 of thin-film transistors T1, T2, and T3 may be disposed on the barrier film BR. The active layers ACT1, ACT2, and ACT3 of thin-film transistors T1, T2, and T3 may include polycrystalline silicon, single-crystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. The active layers ACT1, ACT2, and ACT3 overlapping with the gate electrodes G1, G2, and G3, respectively, in the third direction (Z-axis direction), which is the thickness direction of the first substrate 110, may be defined as channel regions. The source electrodes S1, S2, and S3 and the drain electrodes D1, D2, and D3, respectively, are regions that do not overlap with the gate electrodes G1, G2, and G3, respectively, in the third direction (Z-axis direction), and may be conductive due to ions or impurities being doped into silicon semiconductors or oxide semiconductors.

[0063] A gate insulating layer 130 may be disposed on the active layers ACT1, ACT2, and ACT3, the source electrodes S1, S2, and S3, and the drain electrodes D1, D2, and D3 of the thin film transistors T1, T2, and T3. The gate insulating layer 130 may be formed of an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0064] Gate electrodes G1, G2, and G3 of the thin film transistors T1, T2, and T3 may be disposed on the gate insulating layer 130. The gate electrodes G1, G2, and G3 may overlap with the active layers ACT1, ACT2, and ACT3, respectively, in the third direction (Z-axis direction). The gate electrodes G1, G2, and G3 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0065] A first interlayer insulating film 141 (a lower insulating film among the insulating films 140) may be disposed on the gate electrodes G1, G2, and G3 of the thin film transistors T1, T2, and T3, respectively. The first interlayer insulating film 141 may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film 141 may be formed of a plurality of inorganic films.

[0066] A capacitor electrode CAE may be disposed on the first interlayer insulating film 141. The capacitor electrode CAE may overlap with the gate electrodes G1, G2, and G3 of the thin film transistors T1, T2, and T3 in the third direction (Z-axis direction). Because the first interlayer insulating film 141 has a predetermined dielectric constant, a capacitor may be formed by the capacitor electrode CAE, the gate electrode G1, and the first interlayer insulating film 141 disposed therebetween. Similarly, a capacitor may be formed by the capacitor electrode CAE, the gate electrode G2, and the first interlayer insulating film 141 disposed therebetween. Similarly, a capacitor may be formed by the capacitor electrode CAE, the gate electrode G3, and the first interlayer insulating film 141 disposed therebetween. The capacitor electrode CAE may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0067] A second interlayer insulating film 142 (the upper insulating film of the insulating films 140) may be disposed on the capacitor electrode CAE. The second interlayer insulating film 142 may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film 142 may be formed of a plurality of inorganic films.

[0068] A first anode connecting electrode ANDE1 may be disposed on the second interlayer insulating film 142. The first anode connecting electrode ANDE1 may be connected to the drain electrode D1 of the thin film transistor T1 through a first connecting contact hole ANCT1 penetrating the gate insulating layer 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first anode connecting electrode ANDE1 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0069] A first planarization film 160 for planarizing steps caused by the thin film transistors T1, T2, and T3 may be disposed on the first anode connecting electrode ANDE1. The first planarization film 160 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0070] A second anode connecting electrode ANDE2 may be disposed on the first planarization film 160. The second anode connecting electrode ANDE2 may be connected to the first anode connecting electrode ANDE1 through a second connecting contact hole ANCT2 penetrating the first planarization film 160. The second anode connecting electrode ANDE2 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0071] A second planarization layer 180 may be disposed on the second anode connecting electrode ANDE2. The second planarization layer 180 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0072] The light emitting element unit LEP may be formed on the second planarization layer 180. The light emitting element unit LEP may include a plurality of pixel electrodes PE1, PE2, and PE3, a plurality of light emitting elements LE, and a common electrode CE.

[0073] The pixel electrodes PE1, PE2, and PE3 may include a first pixel electrode PE1, a second pixel electrode PE2, and a third pixel electrode PE3. The first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may serve as first electrodes of the light-emitting element LE and may be anode electrodes or cathode electrodes. The first pixel electrode PE1 is located in the first light-emitting area EA1 and may extend at least partially into the non-light-emitting area NEA. The second pixel electrode PE2 is located in the second light-emitting area EA2 and may extend at least partially into the non-light-emitting area NEA. The third pixel electrode PE3 is located in the third light-emitting area EA3 and may extend at least partially into the non-light-emitting area NEA. The first pixel electrode PE1 may be connected to the first thin film transistor (first switching element) T1 through the insulating layer 135 (the gate insulating layer 130, the insulating film 140, the first planarization film 160, and the second planarization film 180 in FIG. 4), the second pixel electrode PE2 may be connected to the second thin film transistor (second switching element) T2 through the insulating layer 135, and the third pixel electrode PE3 may be connected to the third thin film transistor (third switching element) T3 through the insulating layer 135.

[0074] The first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may be reflective electrodes. The first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may be made of Ti (Titanium), copper (Cu), or an alloy of Ti (Titanium) and copper (Cu). They may also have a stacked film structure of Ti (Titanium) and copper (Cu). In addition, the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may have a stacked film structure in which a high work function material layer, such as titanium oxide (TiO2), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or magnesium oxide (MgO), and a reflective material layer, such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), titanium (Ti), copper (Cu), or a mixture thereof, are stacked. The high work function material layer may be disposed above the reflective material layer and be closer to the light emitting element LE. The first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may have a multilayer structure such as, but not limited to, ITO / Mg, ITO / MgF, ITO / Ag, or ITO / Ag / ITO.

[0075] A bank BNL may be located on the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3. The bank BNL may include an opening exposing the first pixel electrode PE1, an opening exposing the second pixel electrode PE2, and an opening exposing the third pixel electrode PE3, and may define a first light-emitting region EA1, a second light-emitting region EA2, a third light-emitting region EA3, and a non-light-emitting region NEA. That is, the exposed region of the first pixel electrode PE1 that is not covered by the bank BNL may be the first light-emitting region EA1. The exposed region of the second pixel electrode PE2 that is not covered by the bank BNL may be the second light-emitting region EA2. The exposed region of the third pixel electrode PE3 that is not covered by the bank BNL may be the third light-emitting region EA3. In addition, the region where the bank BNL is located may be the non-light-emitting region NEA.

[0076] The bank BNL may include an organic insulating material, such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylene sulfide resin, or benzocyclobutene (BCB).

[0077] In one embodiment, the bank BNL may overlap the color filters CF1, CF2, and CF3 and the light blocking member BK of the wavelength converting unit 30, which will be described later. In an exemplary embodiment, the bank BNL may completely overlap the light blocking member BK. Also, the bank BNL may overlap the first color filter CF1, the second color filter CF2, and the third color filter CF3.

[0078] A plurality of light-emitting elements LE may be arranged on the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3.

[0079] As shown in Figures 5 and 6, the light-emitting element LE may be disposed in each of the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3. The light-emitting element LE may be a vertical light-emitting diode element extending in the third direction DR3. That is, the length of the light-emitting element LE in the third direction DR3 may be longer than the length in the horizontal direction. The horizontal length refers to the length in the first direction DR1 or the length in the second direction DR2. For example, the length of the light-emitting element LE in the third direction DR3 may be approximately 1 to 5 μm.

[0080] Each light emitting element LE may be a micro LED (micro light emitting diode). The light emitting element LE may include a connecting electrode 125, a first semiconductor layer SEM1, an electron blocking layer EBL, an active layer MQW, a superlattice layer SLT, a second semiconductor layer SEM2, and a third semiconductor layer SEM3 in the thickness direction of the display substrate 20, i.e., in the third direction DR3. The connecting electrode 125, the first semiconductor layer SEM1, the electron blocking layer EBL, the active layer MQW, the superlattice layer SLT, the second semiconductor layer SEM2, and the third semiconductor layer SEM3 may be sequentially stacked in the third direction DR3.

[0081] The light emitting device LE may have a cylindrical, disc, bridge, or rod shape in which the width is longer than the height, but is not limited thereto, and may have various shapes such as a rod, wire, tube, or the like, a polygonal prism shape such as a regular cube, a rectangular parallelepiped, or a hexagonal prism, or a shape extending in one direction with a partially inclined outer surface.

[0082] The connecting electrode 125 may be disposed on each of the pixel electrodes PE1, PE2, and PE3. In the following description, the light emitting element LE disposed on the first pixel electrode PE1 will be taken as an example.

[0083] The connecting electrode 125 is attached to the first pixel electrode PE1 and may serve to apply an emission signal to the light emitting element LE. The connecting electrode 125 may be an ohmic connecting electrode, but is not limited thereto, and may also be a Schottky connecting electrode. The light emitting element LE may include at least one connecting electrode 125. Although FIGS. 7 and 8 show the light emitting element LE including one connecting electrode 125, the light emitting element LE is not limited thereto. Depending on the circumstances, the light emitting element LE may include more or no connecting electrodes 125. The description of the light emitting element LE described below may be equally applied even if the number of connecting electrodes 125 is changed or if other structures are further included.

[0084] When the light emitting element LE is electrically connected to the first pixel electrode PE1 in the display device 10 according to an embodiment, the connecting electrode 125 can reduce the resistance between the light emitting element LE and the first pixel electrode PE1 and improve adhesion. The connecting electrode 125 may include a conductive metal oxide. For example, the connecting electrode 125 may be made of ITO. The connecting electrode 125 is connected to the underlying first pixel electrode PE1 by being in direct contact therewith, and therefore is made of the same material as the first pixel electrode PE1. The connecting electrode 125 may also optionally further include a reflective electrode made of a metal material with high reflectivity, such as aluminum (Al), or a diffusion barrier layer containing nickel (Ni). This improves adhesion between the connecting electrode 125 and the first pixel electrode PE1, thereby improving contact characteristics.

[0085] 6, in an exemplary embodiment, the first pixel electrode PE1 may include a lower electrode layer P1, a reflective layer P2, and an upper electrode layer P3. The lower electrode layer P1 may be disposed at the bottom of the first pixel electrode PE1 and electrically connected to a thin film transistor (switching element). The lower electrode layer P1 may include a metal oxide, such as titanium oxide (TiO2), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or magnesium oxide (MgO).

[0086] The reflective layer P2 is disposed on the lower electrode layer P1 and can reflect light emitted from the light-emitting element LE upward. The reflective layer P2 can include a metal with high reflectivity, such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or a mixture thereof.

[0087] The upper electrode layer P3 is disposed on the reflective layer P2 and may be in direct contact with the light-emitting element LE. The upper electrode layer P3 is disposed between the reflective layer P2 and the connecting electrode 125 of the light-emitting element LE and may be in direct contact with the connecting electrode 125. As described above, the connecting electrode 125 is made of a metal oxide, and the upper electrode layer P3 is also made of a metal oxide, just like the connecting electrode 125.

[0088] The upper electrode layer P3 may be formed of titanium (Ti), copper (Cu), or an alloy of titanium and copper (Cu). It may also have a stacked film structure of titanium and copper (Cu). The upper electrode layer P3 may also include titanium oxide (TiO2), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or magnesium oxide (MgO). In an exemplary embodiment, when the connecting electrode 125 is made of ITO, the first pixel electrode PE1 has a multi-layer structure of ITO / Ag / ITO.

[0089] The first semiconductor layer SEM1 may be disposed on the connecting electrode 125. The first semiconductor layer SEM1 may be a p-type semiconductor and may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1). For example, the first semiconductor layer SEM1 may be one or more of p-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The first semiconductor layer SEM1 is doped with a p-type dopant, and the p-type dopant may be Mg, Zn, Ca, Se, Ba, or the like. For example, the first semiconductor layer SEM1 may be p-GaN doped with p-type Mg. The thickness of the first semiconductor layer SEM1 may be in the range of 30 nm to 200 nm, but is not limited thereto.

[0090] The electron blocking layer EBL may be disposed on the first semiconductor layer SEM1. The electron blocking layer EBL may be a layer for suppressing or preventing excessive electrons from flowing into the active layer MQW. For example, the electron blocking layer EBL may be p-AlGaN doped with p-type Mg. The thickness of the electron blocking layer EBL may be in the range of 10 nm to 50 nm, but is not limited thereto. Alternatively, the electron blocking layer EBL may be omitted.

[0091] The active layer MQW can be disposed on the electron blocking layer EBL. The active layer MQW can emit light by recombination of electron-hole pairs in response to an electrical signal applied via the first semiconductor layer SEM1 and the second semiconductor layer SEM2.

[0092] The active layer MQW may include a material with a single or multiple quantum well structure. When the active layer MQW includes a material with a multiple quantum well structure, it may have a structure in which multiple well layers and barrier layers are alternately stacked. In this case, the well layers may be made of InGaN, and the barrier layers may be made of GaN or AlGaN, but are not limited thereto. The thickness of the well layers may be approximately 1 to 4 nm, and the thickness of the barrier layers may be 3 to 10 nm.

[0093] Alternatively, the active layer MQW may have a structure in which semiconductor materials with large band gap energy and semiconductor materials with small band gap energy are alternately stacked, and may include different Group III to V semiconductor materials depending on the wavelength band of the emitted light. The light emitted by the active layer MQW is not limited to the first light, and may also emit the second light (light in the green wavelength band) or the third light (light in the red wavelength band) depending on the case.

[0094] Specifically, the color of light emitted by the MQW active layer can change depending on the indium (In) content. For example, as the indium (In) content decreases, the wavelength band of the light emitted by the active layer shifts toward the red wavelength band, and as the indium (In) content increases, the wavelength band of the light emitted shifts toward the blue wavelength band. For example, when the indium (In) content is 15% or less, the active layer MQW can emit first light in the red wavelength band with a main peak wavelength ranging from approximately 600 nm to 750 nm. Alternatively, when the indium (In) content is 25%, the active layer MQW can emit second light in the green wavelength band with a main peak wavelength ranging from approximately 480 nm to 560 nm. Furthermore, when the indium (In) content is 35% or more, the active layer MQW can emit third light in the blue wavelength band with a main peak wavelength ranging from approximately 370 nm to 460 nm. An example in which the active layer MQW emits light in the blue wavelength band having a main peak wavelength in the range of approximately 370 nm to 460 nm will be described with reference to FIG.

[0095] A superlattice layer SLT may be disposed on the active layer MQW. The superlattice layer SLT may be a layer for relieving stress between the second semiconductor layer SEM2 and the active layer MQW. For example, the superlattice layer SLT may be formed of InGaN or GaN. The thickness of the superlattice layer SLT may be approximately 50 to 200 nm. The superlattice layer SLT may be omitted.

[0096] The second semiconductor layer SEM2 may be disposed on the superlattice layer SLT. The second semiconductor layer SEM2 may be an n-type semiconductor. The second semiconductor layer SEM2 may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1). For example, the second semiconductor layer SEM2 may be one or more of n-type doped AlGaInN, GaN, AlGaN, InGaN, AlN, and InN. The second semiconductor layer SEM2 is doped with an n-type dopant, and the n-type dopant may be Si, Ge, Sn, or the like. For example, the second semiconductor layer SEM2 may be n-GaN doped with n-type Si. The thickness of the second semiconductor layer SEM2 may be in the range of 2 μm to 4 μm, but is not limited thereto.

[0097] The third semiconductor layer SEM3 may be disposed on the second semiconductor layer SEM2. The third semiconductor layer SEM3 may be disposed between the second semiconductor layer SEM2 and the common electrode CE. The third semiconductor layer SEM3 may be an undoped semiconductor. The third semiconductor layer SEM3 may include the same material as the second semiconductor layer SEM2 and may be a material that is not doped with an n-type or p-type dopant. In an exemplary embodiment, the third semiconductor layer SEM3 may be at least one of undoped InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, but is not limited thereto.

[0098] A planarization layer PLL may be disposed on the bank BNL and the plurality of pixel electrodes PE1, PE2, and PE3. The planarization layer PLL may planarize a lower step so that a common electrode CE (described later) may be formed. The planarization layer PLL may be formed to a predetermined height so that at least a portion, for example, an upper portion, of the plurality of light-emitting elements LE may protrude above the planarization layer PLL. That is, the height of the planarization layer PLL based on the top surface of the first pixel electrode PE1 may be smaller than the height of the light-emitting elements LE.

[0099] The planarization layer PLL may include an organic material to planarize the lower step. For example, the planarization layer PLL may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylene sulfide resin, or benzocyclobutene (BCB).

[0100] A common electrode CE may be disposed on the planarization layer PLL and the plurality of light emitting elements LE. Specifically, the common electrode CE may be disposed on one surface of the first substrate 110 on which the light emitting elements LE are formed, and may be disposed across the display area DA and the non-display area NDA. The common electrode CE is disposed to overlap each of the light emitting areas EA1, EA2, and EA3 in the display area DA, and has a thin thickness to allow light to be emitted.

[0101] The common electrode CE may be disposed directly on the top and side surfaces of the light-emitting elements LE. The common electrode CE may be in direct contact with the second semiconductor layer SEM2 and the third semiconductor layer SEM3 on the side surfaces of the light-emitting elements LE. As shown in FIG. 6, the common electrode CE may be a common layer that covers the light-emitting elements LE and commonly connects the light-emitting elements LE. Since the conductive second semiconductor layer SEM2 has a pattern structure that is unique to each light-emitting element LE, the common electrode CE may be in direct contact with the side surfaces of the second semiconductor layer SEM2 of each light-emitting element LE so that a common voltage is applied to each light-emitting element LE.

[0102] The common electrode CE is disposed over the entire first substrate 110 and receives a common voltage, and therefore may include a material having low resistance. The common electrode CE may be formed to a thin thickness to facilitate light transmission. For example, the common electrode CE may include a material having low resistance, such as aluminum (Al), silver (Ag), or copper (Cu). The common electrode CE may be formed of a transparent conductive oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0103] The thickness of the common electrode CE may be approximately 10 Å to 200 Å, but is not limited thereto.

[0104] The light emitting element LE may receive a pixel voltage or an anode voltage from the pixel electrode via the connecting electrode 125, and may receive a common voltage via the common electrode CE. The light emitting element LE may emit light at a predetermined brightness according to the voltage difference between the pixel voltage and the common voltage.

[0105] In this embodiment, by arranging multiple light-emitting elements LE, i.e., inorganic light-emitting diodes, on the pixel electrodes PE1, PE2, and PE3, the drawback of organic light-emitting diodes, which are vulnerable to external moisture and oxygen, can be eliminated, thereby improving the lifespan and reliability.

[0106] In addition, a first organic layer FOL can be disposed on the bank BNL disposed in the non-light-emitting area NEA.

[0107] The first organic layer FOL may be arranged to overlap the non-emitting area NEA but not overlap the emitting areas EA1, EA2, and EA3. The first organic layer FOL may be arranged directly on the bank BNL and spaced apart from the adjacent pixel electrodes PE1, PE2, and PE3. The first organic layer FOL may be arranged entirely on the first substrate 110 and surround the emitting areas EA1, EA2, and EA3. The first organic layer FOL may be arranged in a lattice pattern overall.

[0108] As will be described later in the manufacturing process, the first organic layer FOL can serve to attach and detach the plurality of light emitting elements LE that are in contact with the first organic layer FOL, which is the non-light emitting area NEA. When the first organic layer FOL is irradiated with laser light, it absorbs energy, causing an instantaneous increase in temperature and ablation. Therefore, the plurality of light emitting elements LE that are in contact with the upper surface of the first organic layer FOL can be detached from the upper surface of the first organic layer FOL.

[0109] The first organic layer FOL may include a polyimide-based compound. The polyimide-based compound of the first organic layer FOL may include a cyano group to absorb light with a wavelength of 308 nm, e.g., laser light. In an exemplary embodiment, the first organic layer FOL and the bank BNL may each include a polyimide-based compound, or may include different polyimide-based compounds. For example, the bank BNL may be made of a polyimide-based compound that does not include a cyano group, and the first organic layer FOL may be made of a polyimide-based compound that includes a cyano group. The transmittance of the first organic layer FOL to 308 nm laser light may be less than that of the bank BNL. The transmittance of the bank BNL may be about 60% or more, and the transmittance of the first organic layer FOL may be 0%. Alternatively, the absorption of the first organic layer FOL to 308 nm laser light may be 100%. The first organic layer FOL may have a thickness ranging from about 2 Å to 10 μm. When the thickness of the first organic layer FOL is 2 Å or more, the absorptivity of the laser light with a wavelength of 308 nm can be improved.When the thickness of the first organic layer FOL is 10 μm or less, the step between the first organic layer FOL and the first pixel electrode PE1 can be prevented from becoming large, and the light-emitting element LE can be easily bonded to the pixel electrode in the process described below.

[0110] 4, the wavelength converting section 30 may be disposed on the light-emitting element section LEP. The wavelength converting section 30 may include a partition wall PW, a wavelength converting layer QDL (QDL1 and QDL2 in FIG. 4, QDL1 in FIG. 5), color filters CF1, CF2, and CF3, a light-shielding member BK, and a protective layer PTL.

[0111] The partition walls PW are arranged on the common electrode CE in the display area DPA and, together with the banks BNL, can partition a plurality of light-emitting areas EA1, EA2, and EA3. The partition walls PW are arranged to extend in the first direction DR1 and the second direction DR2, and form a grid pattern across the entire display area DA. The partition walls PW do not overlap with the plurality of light-emitting areas EA1, EA2, and EA3, but can overlap with the non-light-emitting area NEA.

[0112] The partition wall PW may include a plurality of openings OP1, OP2, and OP3 exposing the underlying common electrode CE. The openings OP1, OP2, and OP3 may include a first opening OP1 overlapping the first light-emitting region EA1, a second opening OP2 overlapping the second light-emitting region EA2, and a third opening OP3 overlapping the third light-emitting region EA3. Here, the openings OP1, OP2, and OP3 correspond to the light-emitting regions EA1, EA2, and EA3. That is, the first opening OP1 corresponds to the first light-emitting region EA1, the second opening OP2 corresponds to the second light-emitting region EA2, and the third opening OP3 corresponds to the third light-emitting region EA3.

[0113] The partition walls PW may provide a space for the first and second wavelength conversion layers QDL1 and QDL2 to be formed. To this end, the partition walls PW may have a predetermined thickness, e.g., a thickness of 1 μm to 10 μm. The partition walls PW may include an organic insulating material to achieve the predetermined thickness. The organic insulating material may include, for example, an epoxy resin, an acrylic resin, a cardo resin, or an imide resin.

[0114] The first wavelength-converting layer QDL1 may be disposed within each of the first openings OP1. The first wavelength-converting layer QDL1 may have a dot-shaped island pattern spaced apart from each other. The first wavelength-converting layer QDL1 may include a first base resin BRS1 and first wavelength-converting particles WCP1. The first base resin BRS1 may include a light-transmitting organic material. For example, the first base resin BRS1 may include an epoxy-based resin, an acrylic-based resin, a cardo-based resin, or an imide-based resin. The first wavelength-converting particles WCP1 may be quantum dots (QDs), quantum rods, fluorescent materials, or phosphorescent materials. For example, quantum dots may be particulate materials that emit a specific color as electrons transition from the conduction band to the valence band.

[0115] The quantum dots may be semiconductor nanocrystals. The quantum dots have a specific band gap depending on their composition and size, and can absorb light and then emit light with a specific wavelength. Examples of the quantum dot semiconductor nanocrystals include group IV nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals, or combinations thereof.

[0116] The first wavelength conversion layer QDL1 may be formed in the first opening OP1 of the first light-emitting area EA1. The first wavelength conversion layer QDL1 may convert or shift the peak wavelength of incident light to light with another specific peak wavelength and then emit the light. For example, the first wavelength conversion layer QDL1 may convert a portion of the blue light emitted from the light-emitting element LE into light similar to red, which is the first light. The first wavelength conversion layer QDL1 may emit light similar to red, which may be converted into the first light, red, via the first color filter CF1.

[0117] The second wavelength conversion layer QDL2 may be disposed within each second opening OP2. The second wavelength conversion layer QDL2 may have a dot-shaped island pattern spaced apart from each other. For example, the second wavelength conversion layer QDL2 may be disposed overlapping the second light-emitting region EA2. The second wavelength conversion layer QDL2 may include a second base resin BRS2 (not shown, which may correspond to the first base resin BRS1 in FIG. 5) and second wavelength conversion particles WCP2 (not shown, which may correspond to the first wavelength conversion particles WCP1 in FIG. 5). The second base resin BRS2 may include a translucent organic material. Therefore, the second wavelength conversion layer QDL2 can convert or shift the peak wavelength of incident light to light with another specific peak wavelength and emit the light. For example, the second wavelength conversion layer QDL2 can convert a portion of the blue light emitted from the light-emitting element LE to light similar to green, which is the second light. The second wavelength conversion layer QDL2 can emit light similar to green, which can then be converted into red, which is the first light, via the second color filter CF2.

[0118] In the third light-emitting area EA3, only a transparent light-transmitting organic material is disposed within the third opening OP3, allowing the blue light emitted from the light-emitting element LE to be directly emitted through the third color filter CF3.

[0119] The color filters CF1, CF2, and CF3 may be disposed on the partition walls PW, the first and second wavelength conversion layers QDL1 and QDL2, and the light-transmitting organic material. The color filters CF1, CF2, and CF3 may be disposed overlapping the openings OP1, OP2, and OP3, the first and second wavelength conversion layers QDL1 and QDL2, and the light-transmitting organic material. The color filters CF1, CF2, and CF3 may include a first color filter CF1, a second color filter CF2, and a third color filter CF3. Specifically, in the examples of FIGS. 4 and 5 , the color filter CF1 may overlap an edge of an adjacent light-blocking member BK on the adjacent partition wall PW and may overlap the first wavelength conversion layer QDL1 in the opening OP1. The color filter CF2 may overlap an edge of an adjacent light-blocking member BK on the adjacent partition wall PW and may overlap the second wavelength conversion layer QDL2 in the opening OP2. The color filter CF3 can be arranged so as to overlap the edge of the adjacent light-shielding member BK on the adjacent partition wall PW, and also so as to overlap the light-transmitting organic material in the opening OP1.

[0120] The first color filter CF1 may be disposed overlapping the first light-emitting area EA1. The first color filter CF1 may also be disposed overlapping the first opening OP1 of the partition wall PW. The first color filter CF1 transmits the first light emitted from the light-emitting element LE and absorbs or blocks the second and third lights. For example, the first color filter CF1 may transmit light in the blue wavelength band and absorb or block light in other wavelength bands such as green and red.

[0121] The second color filter CF2 may be disposed overlapping the second light-emitting area EA2. The second color filter CF2 may also be disposed overlapping the second opening OP2 of the partition wall PW. The second color filter CF2 may transmit the second light and absorb or block the first and third lights. For example, the second color filter CF2 may transmit light in the green wavelength band and absorb or block light in other wavelength bands such as blue and red.

[0122] The third color filter CF3 may be disposed overlapping the third light-emitting area EA3. The third color filter CF3 may also be disposed over the third opening OP3 of the partition wall PW. The third color filter CF3 may transmit the third light and absorb or block the first and second lights. For example, the third color filter CF3 may transmit light in the red wavelength band and absorb or block light in other wavelength bands such as blue and green.

[0123] The planar area of ​​each of the color filters CF1, CF2, and CF3 may be larger than the planar area of ​​each of the light-emitting regions EA1, EA2, and EA3. For example, the first color filter CF1 may be larger than the planar area of ​​the first light-emitting region EA1. The second color filter CF2 may be larger than the planar area of ​​the second light-emitting region EA2. The third color filter CF3 may be larger than the planar area of ​​the third light-emitting region EA3. However, without being limited thereto, the planar area of ​​each of the color filters CF1, CF2, and CF3 may be approximately the same as the planar area of ​​each of the light-emitting regions EA1, EA2, and EA3.

[0124] Referring to FIG. 5, a light-shielding member BK may be disposed on the partition wall PW. The light-shielding member BK may overlap the non-light-emitting area NEA to block light transmission. The light-shielding member BK may be disposed in a generally lattice pattern on a plane, similar to the banks BNL or the partition wall PW. The light-shielding member BK may be disposed to overlap the banks BNL, the first organic layer FOL, and the partition wall PW, but may not overlap the light-emitting areas EA1, EA2, and EA3.

[0125] In one embodiment, the light blocking member BK may include an organic light blocking material and may be formed by coating the organic light blocking material and exposing it to light. The light blocking member BK may include a dye or pigment having light blocking properties and may be a black matrix. At least a portion of the light blocking member BK may overlap the adjacent color filters CF1, CF2, and CF3, and the color filters CF1, CF2, and CF3 may be disposed on at least a portion of the light blocking member BK.

[0126] A protective layer PTL may be disposed on the color filters CF1, CF2, and CF3 and the light blocking member BK. The protective layer PTL is disposed at the top of the display device 10 and can protect the underlying color filters CF1, CF2, and CF3 and the light blocking member BK. One surface of the protective layer PTL, for example, the lower surface, may be in contact with the upper surfaces of the color filters CF1, CF2, and CF3 and the light blocking member BK, respectively.

[0127] The protective layer PTL may include an inorganic insulating material to protect the color filters CF1, CF2, and CF3 and the light blocking member BK. For example, the protective layer PTL may include, but is not limited to, silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlxOy), aluminum nitride (AlN), etc. The protective layer PTL has a predetermined thickness, for example, but not limited to, a thickness in the range of 0.01 to 1 μm.

[0128] 5 and 6, the light emitting element LE is illustrated as a vertical light emitting element LE, but is not limited thereto, and the light emitting element LE may be a flip type light emitting element.

[0129] Hereinafter, a display panel manufacturing apparatus that presses and attaches a plurality of light emitting elements LE, i.e., micro LEDs, arranged on the pixel electrodes PE1, PE2, and PE3 of the display substrate 20 will be specifically described.

[0130] 7 is a side cross-sectional view schematically illustrating an apparatus for manufacturing a display panel according to an embodiment, and FIG. 8 is a front view schematically illustrating an upper surface of the apparatus for manufacturing a display panel shown in FIG.

[0131] 7 and 8, a display panel manufacturing apparatus may bond two or more bonding targets to each other using a laser beam. The bonding targets may be bonded to each other and electrically connected. The bonding targets may be a substrate, a film, a display panel, a touch panel, a printed circuit board, a flexible circuit board, or a semiconductor element such as a light-emitting element. In the following, an example will be described in which the first bonding target is a display substrate 20 and the second bonding target is a light-emitting element LE.

[0132] The display panel manufacturing apparatus may include a support unit 200, a pressure unit 300, and a laser irradiation unit 500. The display panel manufacturing apparatus may further include a mounting member 400.

[0133] The support portion 200 has an upper surface parallel to a plane defined by a first direction DR1 and a second direction DR2 perpendicular to each other, and the display substrate 20 having a plurality of light emitting elements LE arranged thereon is placed on the upper surface.

[0134] The support member 200 may be a load plate, and may be formed in a polygonal flat plate shape, such as a square or a rectangle, in a plan view. The support member 200 may also be formed in a flat plate shape, such as a circle or an oval. Hereinafter, an example in which the support member 200 is formed in a square flat plate shape will be described. In this example, the display substrate 20, the light-transmitting plate 310, the laser irradiation unit 500, etc. are also formed in a square flat plate shape in a plan view. In one embodiment, the support member 200 can fix the display substrate 20.

[0135] The laser irradiation unit 500 is disposed to face the front surface of a light-transmitting plate 310 (the upper surface in the third direction DR3 in the example of FIG. 7 ), which will be described later, and irradiates the display substrate 20 with laser light via the light-transmitting plate 310. The laser irradiation unit 500 may be disposed on the uppermost surface of the manufacturing apparatus (the upper side in the third direction DR3 in the example of FIG. 7 ). The laser irradiation unit 500 irradiates laser light in the direction of the support unit 200 on the lower surface (the lower side in the third direction DR3 in the example of FIG. 7 ), and the light irradiated from the laser irradiation unit 500 is applied to a plurality of light-emitting elements LE arranged on the display substrate 20.

[0136] The laser irradiation unit 500 may include a laser light source 510 and an optical system 530 .

[0137] The laser light source 510 is a device capable of generating laser light using externally supplied energy, and can be configured to generate laser light from solid-state lasers such as YAG lasers, ruby ​​lasers, glass lasers, YVO4 lasers, LD lasers, and fiber lasers, liquid lasers such as dye lasers, CO2 lasers, excimer lasers (ArF lasers, KrF lasers, XeCl lasers, XeF lasers, etc.), gas lasers such as Ar lasers and He-Ne lasers, semiconductor lasers, and free electron lasers.

[0138] The optical system 530 may include a plurality of lenses, and may receive the laser beam in the form of a beam from the laser light source 510 and perform optical dispersion to enable area heating for a predetermined area.

[0139] The laser light emitted from the optical system 530 can be irradiated onto the light emitting elements LE arranged on the display substrate 20 mounted on the support 200, and can heat a predetermined region of the light emitting elements LE.

[0140] The pressure unit 300 may be spaced apart from the support unit 200 in the third direction DR3 and disposed to face the front surface of the support unit 200. The pressure unit 300 may apply pressure to the display substrate 20 and the light emitting element LE disposed on the support unit 200.

[0141] The pressure applying unit 300 may include a light-transmitting plate 310 , a plate transferring member 320 , a reflecting member 330 , and a light-absorbing member 340 .

[0142] The light-transmitting plate 310 transmits the laser light to the front or rear surface, which is the opposite direction to the direction of irradiation of the laser light. The light-transmitting plate 310 is formed as a transparent or translucent flat plate containing at least one transparent material such as glass, quartz, or silicon.

[0143] The plate transport member 320 is attached (bonded) to the light-transmitting plate 310 so as to be located on a side of a portion of at least one of the outer surfaces of the front and back surfaces of the light-transmitting plate 310. In the examples of Figures 7 and 8, in a plan view, the plate transport member 320 is attached to the outermost peripheral portion of the front surface of the light-transmitting plate 310, and the entire front surface of the light-transmitting plate 310 except for the outermost peripheral portion is exposed to the front side and surrounded by the plate transport member 320. In the examples of Figures 7 and 8, the plate transport member 320 is formed in a square ring shape in a plan view to match the square flat plate shapes of the display substrate 20, the light-transmitting plate 310, the laser irradiation unit 500, etc.

[0144] The plate moving member 320 may fix the light-transmitting plate 310 and may be movable in the third direction DR3. Thus, the light-transmitting plate 310 may be moved by the plate moving member 320 toward the display substrate 20 or in the opposite direction away from the display substrate 20. The light-transmitting plate 310 may be moved by the plate moving member 320 toward the display substrate 20 and pressurize the plurality of light-emitting elements LE arranged on the display substrate 20 toward the display substrate 20.

[0145] The plate transport member 320 is arranged on at least one surface of the light-transmitting plate 310 in a lateral direction of the surface, and is connected to stand outward from the front surface of the light-transmitting plate 310 or to stand outward from the back surface of the light-transmitting plate 310.

[0146] The plate transfer member 320 includes at least one transfer module, and can be moved in a direction toward the support unit 200 or in a reverse direction away from the support unit 200 by the at least one transfer module. To this end, the plate transfer member 320 is connected to a light-transmitting plate 310 disposed in front of the support unit 200 and can move the light-transmitting plate 310 in a direction toward the display substrate 20 or in a reverse direction away from the display substrate 20. The plate transfer member 320 moves the light-transmitting plate 310 toward the display substrate 20, and the light-transmitting plate 310 can press the light-emitting elements LE arranged on the display substrate 20 against the display substrate 20. The transfer module of the plate transfer member 320 may include at least one conveyor, motor, chain, roller, gear, etc.

[0147] The reflective member 330 is disposed within the light-transmitting plate 310 and changes the reflection path of the laser light applied from the laser irradiation unit 500. For example, the reflective member 330 may be incorporated in an outer region of the light-transmitting plate 310 corresponding to the non-display area NDA, which is an outer region of the display substrate 20, except for the display area DPA of the display substrate 20 where the plurality of light-emitting elements LE are arranged.

[0148] In one embodiment, the reflecting member 330 may be built into the light-transmitting plate 310 and formed integrally with the light-transmitting plate 310. The reflecting member 330 may include one or more mirrors. The mirrors may have a predetermined inclination in the direction in which the light-absorbing member 340 is disposed.

[0149] In one embodiment, the reflective member 330 is made of a light-reflecting material (e.g., aluminum) and may include a first reflective member 331, a second reflective member 332, and a third reflective member 333. The first reflective member 331, the second reflective member 332, and the third reflective member 333 may be sequentially arranged from the inside to the outside on a plane including the first direction DR1 and the second direction DR2 of the light-transmitting plate 310. For example, the third reflective member 333 may be arranged outermost on the plane of the light-transmitting plate 310. In the example of FIGS. 7 and 8 , the innermost portion of the first reflective member 331, the innermost portion of the second reflective member 332, and the innermost portion of the third reflective member 333 are sequentially positioned from the inside to the outside on the plane. 7 and 8, the first reflecting member 331, the second reflecting member 332, and the third reflecting member 333 are each formed in a square ring shape in plan view to match the square planar plate shapes of the display substrate 20, the light-transmitting plate 310, the laser irradiation unit 500, etc. Furthermore, the first reflecting member 331, the second reflecting member 332, and the third reflecting member 333 may partially overlap each other in plan view.

[0150] The first reflecting member 331 defines one transmission area opening corresponding to the transmission area LTE of the laser beam, and the transmission area of ​​the laser beam corresponds to the display area DPA.

[0151] Here, the light emitted from the laser irradiation unit 500 passes through one transmission area opening corresponding to the display area DPA of the display substrate 20 and is applied to a plurality of light emitting elements LE arranged on the display substrate 20 .

[0152] In the example of FIG. 7 , the first reflecting member 331 may have a triangular cross section. Here, the cross section of the first reflecting member 331 may be formed into at least one of a right-angled triangle, an equilateral triangle, and an isosceles triangle, and one of the surfaces facing the front surface of the first reflecting member 331 is formed to be inclined at a predetermined angle toward the direction in which the second reflecting member 332 adjacent to the first reflecting member 331 is disposed. In the example of FIG. 7 , the first reflecting member 331 has a right-angled triangular shape in cross section, with a surface that is approximately perpendicular to the first inner surface 310a, and the inclined surface of the right-angled triangle faces outward and faces the second reflecting member 332. Of the laser light irradiated from the laser irradiation unit 500, the laser light that is incident on this inclined surface of the first reflecting member 331 is reflected toward the second reflecting member 332. Note that the laser light that is not reflected by the first reflecting member 331 is transmitted toward the display substrate 20. That is, the first reflecting member 331 defines the transmissive region opening. Specifically, in the example of Fig. 7, the transmissive region opening is defined by the innermost portion of the first reflecting member 331. In particular, in the example of Fig. 7, the vertical surface of the innermost portion of the first reflecting member 331 is approximately perpendicular to the first inner side surface 310a, so that in the transmissive region opening, the laser light can travel approximately straight toward the light-emitting element LE of the display substrate 20, and the laser light can be aimed at the light-emitting element LE and irradiated approximately accurately.

[0153] Second reflecting member 332 may be arranged outside first reflecting member 331, and third reflecting member 333 may be arranged to face second reflecting member 332 and outside second reflecting member 332. In this case, first, second and third reflecting members 331 to 333 are arranged to reflect the laser light reflected by first reflecting member 331 outward.

[0154] In the example of FIG. 7 , the first, second, and third reflecting members 331-333 are formed integrally with the light-transmitting plate 310 within the light-transmitting plate 310. For example, as shown in FIG. 7 , the light-transmitting plate 310 may include first to fourth inner surfaces 310a, 310b, 310c, and 310d in a cross-sectional view, and the respective surfaces may be perpendicularly connected at the respective corners. The first reflecting member 331 may be disposed on the first inner surface 310a, and the second reflecting member 332 may be disposed on the second inner surface 310b opposite the first inner surface 310a. The third reflecting member 333 may be disposed on the first inner surface 310a and may be disposed outward of the first reflecting member 331. The second reflecting member 332 and the third reflecting member 333 may partially overlap in the thickness direction of the light-transmitting plate 310. 7, the first reflecting member 331 may be disposed so as to be substantially flush with the first inner surface 310a so that the base of the right triangle is along the first inner surface 310a in a cross-sectional view, and so as to have a vertical surface substantially perpendicular to the first inner surface 310a, and so as to be inclined with respect to the first inner surface 310a so that the height of the inclined surface in the third direction DR3 decreases from the inside to the outside. The second reflecting member 332 may be disposed so as to be rectangular parallelepiped in a cross-sectional view, and so as to have an upper surface substantially flush with the second inner surface 310b so as to be along the second inner surface 310b, and so as to have a lower surface within the light-transmitting plate 310 so as to be able to reflect the laser light reflected by the first reflecting member 331 to the outside. In addition, the third reflecting member 333 has a rectangular parallelepiped shape when viewed in cross section, and its lower surface is arranged approximately flush with the first inner surface 310a so as to follow the first inner surface 310a, and its upper surface can be arranged within the light-transmitting plate 310 so as to follow the first inner surface 310a and be able to reflect the laser light reflected by the second reflecting member 332 to the outside.

[0155] In this manner, the first reflecting member 331 defines a transmission area LTE of the laser beam on the display substrate 20, and the second reflecting member 332 and the third reflecting member 333 can act as light guides that guide the path of the light reflected by the first reflecting member 331.

[0156] Light absorbing member 340 may be disposed on the reflection path of the laser light, and may absorb the laser light reflected from reflecting member 330. For example, light absorbing member 340 may be disposed at a position closer to third reflecting member 333 than to first reflecting member 331.

[0157] The light absorbing member 340 is disposed on one side of the plate transport member 320 by a mounting member 400 connected to the plate transport member 320, and can be moved simultaneously in the same direction as the plate transport member 320. In the example of Figures 7 and 8, the light absorbing member 340 is formed in a square ring shape corresponding to the periphery of the plate transport member 320 and the light-transmitting plate 310 in accordance with the square planar plate shapes of the display substrate 20, the light-transmitting plate 310, the laser irradiation unit 500, etc. Here, the light absorbing member 340 is divided into four members corresponding to the four sides of the square, and the four mounting members 400 are arranged so as to correspond to the four sides of the square.

[0158] The light absorbing member 340 may be disposed on one side of the light transmitting plate 310 by the mounting member 400 on the reflection path of the laser light.

[0159] According to one embodiment, laser light incident on the first reflecting member 331 of the light-transmitting plate 310 is reflected according to the inclination of the first reflecting member 331 (the inclination of the inclined surface in the example of FIG. 7 ) and travels in the direction of the second reflecting member 332, the laser light that has traveled to the second reflecting member 332 is reflected by the second reflecting member 332 and travels to the third reflecting member 333, and the laser light that has traveled to the third reflecting member 333 is reflected by the third reflecting member 333 and travels in the direction of the light-absorbing member 340. Therefore, the laser light irradiated from the laser irradiation unit 500 can be transmitted through the transmission area opening of the first reflecting member 331 and applied to the plurality of light-emitting elements LE arranged on the display substrate 20. That is, the laser light that has traveled through the transmission area opening of the first reflecting member 331 can be applied almost selectively to the plurality of light-emitting elements LE arranged on the display substrate 20. By appropriately adjusting the transmission and reflection of the laser light by the first to third reflecting members 331 to 333, it is possible to apply, to the plurality of light-emitting elements LE arranged on the display substrate 20, substantially only the laser light that passes through the transmissive region opening. Similarly, in the various embodiments described below, by appropriately adjusting the transmission and reflection of the laser light by the reflecting members, it is possible to apply, to the plurality of light-emitting elements LE, substantially only the laser light that passes through the transmissive region opening.

[0160] The length of the outer region of the light-transmitting plate 310 can be reduced by using multiple reflective members (second reflective member 332, third reflective member 333) that act as light guides. The outer region of the light-transmitting plate 310 may be the distance between the display substrate 20 and the plate transfer member 320 on the same plane. That is, the outer region of the light-transmitting plate 310 may be, for example, a portion corresponding to the region between the outer periphery of the display substrate 20 and the outer periphery of the plate transfer member 320 in a planar view. Furthermore, the outer region of the light-transmitting plate 310 may be, for example, a portion corresponding to the region between the outer end face of the outermost light-emitting element LE and the outer periphery of the plate transfer member 320.

[0161] When the outer portion of the light-transmitting plate 310 is shortened, it is possible to minimize the possibility of deformation, such as bending, of the light-transmitting plate 310 when pressure is applied, thereby increasing the uniformity of the pressure applied to the display substrate 20.

[0162] FIG. 9 is a front view showing the arrangement of the first reflecting member and the light absorbing member shown in FIGS.

[0163] 9, the first reflecting member 331 is embedded in the outer region of the light-transmitting plate 310. The outer region of the light-transmitting plate 310 corresponds to the non-display area NDA, which is the outer region of the display substrate 20 shown in FIGS.

[0164] The first reflecting member 331 may be embedded in an outer region of the transparent plate 310 corresponding to the non-display area NDA, which is an outer region of the display substrate 20, except for the display area DPA of the display substrate 20 where the light emitting elements LE are arranged.

[0165] The first reflecting member 331 may include a transmission area opening corresponding to the transmission area LTE of the laser beam on the display substrate 20 .

[0166] The light absorbing members 340 are disposed at a distance from the light-transmitting plate 310 and may be disposed on each side of the light-transmitting plate 310. The light absorbing members 340 may be disposed so as to surround the first reflecting member 331. In the example of FIG. 9, the first reflecting member 331 is formed in a square ring shape, and four light absorbing members 340 are disposed so as to correspond to the four sides of the square of the first reflecting member 331.

[0167] FIG. 10 is a side cross-sectional view illustrating a method for transferring a micro LED using a manufacturing apparatus according to an embodiment.

[0168] Referring to FIG. 10, the plate transport member 320 is connected to the light-transmitting plate 310 disposed in front of the support part 200 and can move the light-transmitting plate 310 toward the display substrate 20 .

[0169] The plate transfer member 320 moves the light-transmitting plate 310 toward the display substrate 20, and the light-transmitting plate 310 can pressurize the plurality of light-emitting elements LE arranged on the display substrate 20 against the display substrate 20. In this manner, the plurality of light-emitting elements LE arranged on the display substrate 20 are pressed toward the display substrate 20 by being subjected to pressure.

[0170] Thereafter, the plate transport member 320 can move the light-transmitting plate 310 in the opposite direction, away from the display substrate 20 .

[0171] The laser irradiation unit 500 irradiates the display substrate 20 with laser light via the light-transmitting plate 310. In particular, the laser irradiation unit 500 irradiates the laser light in the direction of the support unit 200 on the lower surface, and the light irradiated from the laser irradiation unit 500 passes through the transparent region opening of the first reflecting member 331 and is applied to the plurality of light-emitting elements LE arranged on the display substrate 20. Therefore, by pressing the plurality of light-emitting elements LE onto the display substrate 20 with the light-transmitting plate 310 and irradiating the plurality of light-emitting elements LE with laser light, the plurality of light-emitting elements LE can be transferred onto the display substrate 20 with substantial accuracy.

[0172] In contrast, the laser light applied to the first reflecting member 331 of the light-transmitting plate 310 is reflected in the direction of the second reflecting member 332 due to the inclination of the first reflecting member 331 (the inclination of the inclined surface in the example of FIG. 7). The light incident on the second reflecting member 332 is reflected by the second reflecting member 332 and reflected in the direction of the third reflecting member 333 arranged opposite to it. The light incident on the third reflecting member 333 is reflected by the third reflecting member 333 and reflected in the direction of the light-absorbing member 340.

[0173] Therefore, generally, only the light that passes through the transmission area opening of the first reflecting member 331 out of the laser light irradiated from the laser irradiating unit 500 can be applied to the plurality of light emitting elements LE arranged on the display substrate 20. In contrast, the laser light reflected by the second reflecting member 332 and the third reflecting member 333 proceeds to the light absorbing member 340 and is absorbed by the light absorbing member 340. Note that the reflecting members 330 reflect the laser beam irradiated onto the outer region other than the plurality of light-emitting elements LE so that it is not irradiated onto the outer region, so that the laser beam is accurately applied to approximately only the plurality of light-emitting elements LE, and the uniformity of the pressure force generated by pressing the light-transmitting plate 310 can be improved. The arrangement position, shape, number, and the like of each reflecting member 330 are not limited to the above-described embodiment. For example, the first reflecting member 331 may be disposed between the first inner surface 310a and the second inner surface 310b, rather than on the first inner surface 310a. Furthermore, although the first reflecting member 331 has a roughly right-angled triangular shape having a surface perpendicular to the first inner surface 310a in the cross-sectional view described above, the first reflecting member 331 may be formed of a plate-like member capable of reflecting laser light and attached to the light-transmitting plate 310 in an inclined state with respect to the first inner surface 310a so as to reflect the laser light toward the second reflecting member 332. Similarly, as long as the above-mentioned effects can be obtained, the arrangement position, shape, etc. of the other reflecting members 332 and 333 are not limited to those described above. Furthermore, although the number of reflecting members 330 is three in the above description, that is, first reflecting member 331, second reflecting member 332, and third reflecting member 333, the number of reflecting members 330 may be one, or four or more, as long as the above-mentioned effects can be obtained.

[0174] FIG. 11 is a side cross-sectional view that schematically shows a display panel manufacturing apparatus according to another embodiment, and FIG. 12 is a front view that shows the arrangement of the first reflecting member, the second reflecting member, and the light absorbing member shown in FIG.

[0175] 11 and 12, the direction of the inclined surface of the first reflecting member 331 and the number of reflecting members are different from those in the display panel manufacturing apparatus described with reference to Figures 7 to 10. Descriptions that overlap with the embodiment of Figures 7 to 10 will be omitted.

[0176] 11, the reflective member 330 is disposed within the light-transmitting plate 310 to change the reflection path of the laser light applied from the laser irradiation unit 500. For example, the reflective member 330 may be incorporated in an outer region of the light-transmitting plate 310 corresponding to the non-display area NDA, which is an outer region of the display substrate 20, except for the display area DPA of the display substrate 20 where the plurality of light-emitting elements LE are arranged.

[0177] In one embodiment, the reflecting member 330 may be built into the light-transmitting plate 310 and formed integrally with the light-transmitting plate 310. The reflecting member 330 may include one or more mirrors. The mirrors may have a predetermined inclination in the direction in which the light-absorbing member 340 is disposed.

[0178] In one embodiment, the reflective member 330 is formed of a light-reflecting material (e.g., aluminum) and may include a first reflective member 331 and a second reflective member 332. The first reflective member 331 and the second reflective member 332 may be sequentially arranged from the inside to the outside in a plane including the first direction DR1 and the second direction DR2 of the light-transmitting plate 310. For example, the third reflective member 333 may be arranged outermost in the plane of the light-transmitting plate 310. In the example of FIGS. 11 and 12, the innermost portion of the first reflective member 331 and the innermost portion of the second reflective member 332 are sequentially positioned from the inside to the outside in the plane. In the example of FIGS. 11 and 12, the first reflective member 331 and the second reflective member 332 are each formed in a square ring shape in a plan view to match the square flat plate shape of the display substrate 20 or the like.

[0179] The first reflecting member 331 defines one transmission area opening corresponding to the transmission area LTE of the laser beam, and the transmission area LTE of the laser beam corresponds to the display area DPA.

[0180] Here, the light emitted from the laser irradiation unit 500 passes through one transmission area opening corresponding to the display area DPA of the display substrate 20 and is applied to a plurality of light emitting elements LE arranged on the display substrate 20 .

[0181] In the examples of FIGS. 11 and 12 , the first reflecting member 331 may have a cross section formed in a triangular mountain shape. Here, the cross section of the first reflecting member 331 may be formed in at least one of a right triangle, an equilateral triangle, and an isosceles triangle, and any one surface of the first reflecting member 331 facing the front surface direction is formed to be inclined at a predetermined inclination toward the direction in which the second reflecting member 332 is disposed. For example, the first reflecting member 331 may be approximately a right triangle in cross section, and may be disposed so that its hypotenuse faces the center of the light-transmitting plate 310. In the example of FIG. 11 , the first reflecting member 331 has an approximately right-angled triangular shape in cross section, having a surface that is perpendicular to the bottom surface of the light-transmitting plate 310 (the first inner surface 310a shown in FIG. 11 ), and the inclined surface of the right triangle faces inward. Of the laser beams irradiated from the laser irradiation unit 500, those incident on the inclined surface of the first reflecting member 331 are reflected toward the second reflecting member 332, which is positioned in a direction opposite the inclined surface, as shown in FIG. 13. In FIG. 13, the first and second reflecting members 331, 332, which are in a relationship in which the laser beam is reflected, are arranged such that the first reflecting member 331 is positioned on one side of a pair of opposing sides, and the second reflecting member 332 is positioned on the other side. Note that the laser beam not reflected by the first reflecting member 331 is transmitted toward the display substrate 20. In other words, the first reflecting member 331 defines a transmission area opening. Specifically, in the example of FIG. 11, the transmission area opening is defined by the innermost portion of the inclined surface of the first reflecting member 331. In this transmission area opening, the laser beam can travel generally straight toward the light-emitting element LE of the display substrate 20, and the laser beam can be irradiated generally accurately by aiming at the light-emitting element LE.

[0182] 7 to 11 is disposed so that the inclined surface of the first reflecting member 331 faces the outside of the light-transmitting plate 310, whereas the inclined surface of the first reflecting member 331 described with reference to Fig. 12 is disposed so that it faces the inside of the light-transmitting plate 310. The second reflecting member 332 may be disposed outside the first reflecting member 331. In this case, the first and second reflecting members 331, 332 are disposed so as to reflect the laser light reflected by the first reflecting member 331 outward.

[0183] In the example of Fig. 7, the first and second reflecting members 331 and 332 are formed integrally with the light-transmitting plate 310. For example, the light-transmitting plate 310 may include first to fourth inner surfaces 310a, 310b, 310c, and 310d in a cross-sectional view, similar to Fig. 7, and each of the surfaces may be perpendicularly connected at each corner. The first reflecting member 331 may be disposed on the first inner surface 310a, and the second reflecting member 332 may be disposed on the second inner surface 310b opposite the first inner surface 310a. 11 , the first reflecting member 331 may be disposed approximately flush with the first inner surface 310a so that the base of the approximately right-angled triangle is along the first inner surface 310a in a cross-sectional view, and the vertical surface may be disposed approximately perpendicular to the first inner surface 310a, and the inclined surface may be disposed at an angle with respect to the first inner surface 310a so that the height of the inclined surface in the third direction DR3 increases from the inside to the outside. The second reflecting member 332 may be disposed in a rectangular parallelepiped shape in a cross-sectional view, and may be disposed such that the upper surface is disposed approximately flush with the second inner surface 310b so as to be along the second inner surface 310b, and the lower surface is disposed within the light-transmitting plate 310 so as to be able to reflect to the outside the laser light reflected by the first reflecting member 331 disposed in the paired direction.

[0184] In this manner, the first reflecting member 331 defines a transmission area LTE of the laser beam on the display substrate 20, and the second reflecting member 332 can act as a light guide that guides the path of the light reflected by the first reflecting member 331.

[0185] Light absorbing member 340 does not overlap the path of light irradiated by laser irradiation unit 500, but is arranged on the reflection path of the laser light, and absorbs the laser light reflected from reflecting member 330. For example, light absorbing member 340 can be arranged at a position closer to second reflecting member 332 than to first reflecting member 331.

[0186] The light absorbing member 340 is disposed on one side of the plate transferring member 320 by a mounting member 400 connected to the plate transferring member 320, and can be moved simultaneously in the same direction as the plate transferring member 320. In the examples of Figures 11 and 12, similar to the examples of Figures 7 and 8, the light absorbing member 340 is formed in a square ring shape corresponding to the periphery of the plate transferring member 320 and the light transmitting plate 310.

[0187] The light absorbing member 340 is disposed on the reflection path of the laser light by the mounting member 400 and can be disposed on one side of the light transmitting plate 310 .

[0188] According to one embodiment, the laser light incident on the first reflecting member 331 of the light-transmitting plate 310 is reflected according to the inclination of the first reflecting member 331 (the inclination of the inclined surface in the example of FIG. 11 ) and travels in the direction of the second reflecting member 332 located in the direction opposite to the inclined surface. The laser light that has traveled to the second reflecting member 332 is reflected by the second reflecting member 332 and travels in the direction of the light-absorbing member 340. Therefore, the laser light irradiated from the laser irradiation unit 500 can pass through the transmissive area opening of the first reflecting member 331 and be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. In other words, generally, only the laser light that has passed through the transmissive area opening of the first reflecting member 331 is applied to the plurality of light-emitting elements LE arranged on the display substrate 20.

[0189] The second reflecting member 332, which acts as a light guide, can reduce the length of the outer region of the light-transmitting plate 310. The outer region of the light-transmitting plate 310 may be the distance between the display substrate 20 and the plate transport member 320 on the same plane.

[0190] When the outer region of the light-transmitting plate 310 is shortened, it is possible to minimize the possibility of deformation, such as bending, of the light-transmitting plate 310 when pressure is applied, thereby increasing the uniformity of the pressure applied to the display substrate 20.

[0191] FIG. 13 is a side cross-sectional view showing a transfer method of a micro LED using the manufacturing apparatus of FIG.

[0192] Referring to FIG. 13, the plate transport member 320 is connected to the light-transmitting plate 310 disposed in front of the support part 200 and can move the light-transmitting plate 310 toward the display substrate 20 .

[0193] The plate transfer member 320 moves the light-transmitting plate 310 toward the display substrate 20, and the light-transmitting plate 310 can pressurize the plurality of light-emitting elements LE arranged on the display substrate 20 against the display substrate 20. In this manner, the plurality of light-emitting elements LE arranged on the display substrate 20 are pressed toward the display substrate 20 by being subjected to pressure.

[0194] Thereafter, the plate transport member 320 can move the light-transmitting plate 310 in the opposite direction away from the display substrate 20 .

[0195] The laser irradiation unit 500 irradiates the display substrate 20 with laser light through the light-transmitting plate 310. In particular, the laser irradiation unit 500 irradiates the laser light in the direction of the support unit 200 on the lower surface, and the light irradiated from the laser irradiation unit 500 passes through the transparent region opening of the first reflecting member 331 and is applied to the plurality of light-emitting elements LE arranged on the display substrate 20. Therefore, in this embodiment, the light-emitting elements LE are pressed onto the display substrate 20 by the light-transmitting plate 310, and laser light is irradiated onto the plurality of light-emitting elements LE, thereby enabling the plurality of light-emitting elements LE to be accurately transferred onto the display substrate 20.

[0196] In contrast, the laser light applied to the first reflecting member 331 of the light-transmitting plate 310 is reflected in the direction of the second reflecting member 332 located opposite the inclined surface due to the inclination of the first reflecting member 331 (the inclination of the inclined surface in the example of Figure 13).

[0197] Since the first reflecting member 331 is disposed so that its inclined surface faces the inside of the light-transmitting plate 310, the light reflected by the first reflecting member 331 passes through the light-transmitting region LTZ of the laser beam and is incident on the second reflecting member 332 located in the direction opposite to the inclined surface. The light incident on the second reflecting member 332 is reflected by the second reflecting member 332 and reflected in the direction of the light-absorbing member 340. In the case of FIG. 13 , the laser beam reflected by the second reflecting member 332 is reflected in the direction of the light-absorbing member 340 adjacent to the second reflecting member 332.

[0198] Therefore, generally, only the light that passes through the transmission area opening of the first reflecting member 331 out of the laser light irradiated from the laser irradiating unit 500 can be applied to the plurality of light emitting elements LE arranged on the display substrate 20. In contrast, the laser light reflected by the second reflecting member 332 proceeds to the light absorbing member 340 and is absorbed by the light absorbing member 340.

[0199] Generally, only the light that has passed through one transmission region opening corresponding to the display region DPA of the display substrate 20 out of the laser light irradiated from the laser irradiation unit 500 can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. That is, generally, only the laser light that has passed through the transmission region opening corresponding to the display region DPA can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. The reflecting members 330 may be configured to reflect the laser beam irradiated onto the outer region other than the light-emitting elements LE, preventing it from being irradiated onto the outer region, thereby accurately applying the laser beam to only the light-emitting elements LE, and improving the uniformity of the pressure generated by pressing the light-transmitting plate 310. The position, shape, and number of the reflecting members 330 are not limited to the above. For example, the first reflecting member 331 may be positioned within the light-transmitting plate 310 at a position other than the first inner surface 310a. The first reflecting member 331 may be formed from a plate-like member capable of reflecting laser light and may be attached to the light-transmitting plate 310 at an angle relative to the first inner surface 310a so as to reflect the laser light toward the second reflecting member 332. Similarly, the position and shape of the second reflecting member 332 are not limited to the above as long as the above-described effects can be achieved. The number of reflecting members 330 may also be varied.

[0200] FIG. 14 is a side cross-sectional view schematically showing a display panel manufacturing apparatus according to still another embodiment.

[0201] 14 differs from the display panel manufacturing apparatus described with reference to FIGS. 7 to 10 in that the pressure unit 300 further includes a pressure member 350 and a buffer member 360, and a light absorbing member 340 is disposed on a plate transferring member 320. Descriptions that overlap with the embodiment of FIGS. 7 to 10 will be omitted.

[0202] 14, the display panel manufacturing apparatus may include a support unit 200, a pressure unit 300, and a laser irradiation unit 500. The display panel manufacturing apparatus may further include a mounting member 400.

[0203] The pressure unit 300 includes a light-transmitting plate 310 , a plate-transferring member 320 , a reflecting member 330 , and a light-absorbing member 340 , and may also include a pressure member 350 and a buffer member 360 .

[0204] The light-transmitting plate 310 allows the laser light to pass through its front or back surface, which is opposite to the direction of the laser light irradiation. The light-transmitting plate 310 is formed as a transparent or translucent flat plate made of at least one transparent material such as glass, quartz, or silicon.

[0205] The light-transmitting plate 310 has a plate transport member 320 attached (connected) to a side of at least one of the outer surfaces of the front and rear surfaces of the light-transmitting plate 310 .

[0206] The plate transfer member 320 can fix the light-transmitting plate 310 and can move in a third direction DR3. Therefore, the light-transmitting plate 310 can be moved toward the display substrate 20 or in the opposite direction away from the display substrate 20 by the plate transfer member 320. The light-transmitting plate 310 can be moved toward the display substrate 20 by the plate transfer member 320 and press the light-emitting elements LE arranged on the display substrate 20 toward the display substrate 20.

[0207] The plate transfer member 320 may be connected to the outside of the front surface of the light-transmitting plate 310 via a buffer member 360. In the example of Fig. 15, the plate transfer member 320 is connected to the light-transmitting plate 310 while being spaced apart from the light-transmitting plate 310 via the buffer member 360.

[0208] The buffer member 360 is a component that acts as a buffer to apply pressure in the opposite direction to offset the weight of the pressure member 350, and can be realized by an air cylinder or an elastic spring, for example. Therefore, after the buffer member 360 offsets the basic weight of the pressure member 350 to zero (0), the pressure member 350 enters a standby state, waiting to be pressurized.

[0209] The plate transfer member 320 includes at least one transfer module, and can be moved in a direction toward the support unit 200 or in a reverse direction away from the support unit 200 by the at least one transfer module. The plate transfer member 320 is connected to the light-transmitting plate 310 disposed in front of the support unit 200, and can move the light-transmitting plate 310 toward the display substrate 20 or in a reverse direction away from the display substrate 20. The plate transfer member 320 moves the light-transmitting plate 310 toward the display substrate 20, and the light-transmitting plate 310 can press the light-emitting elements LE arranged on the display substrate 20 against the display substrate 20. The transfer module of the plate transfer member 320 may include at least one conveyor, motor, chain, roller, gear, etc.

[0210] The reflective member 330 is disposed within the light-transmitting plate 310 and changes the reflection path of the laser light applied from the laser irradiation unit 500. For example, the reflective member 330 may be incorporated in an outer region of the light-transmitting plate 310 corresponding to the non-display area NDA, which is an outer region of the display substrate 20, except for the display area DPA of the display substrate 20 where the plurality of light-emitting elements LE are arranged.

[0211] In one embodiment, the reflective member 330 may be embedded in the light-transmitting plate 310 and formed integrally therewith. The reflective member 330 may be formed of a light-reflecting material (e.g., aluminum). The reflective member 330 may have a triangular cross section. Here, the cross section of the reflective member 330 may be formed into at least one of a right triangle, an equilateral triangle, and an isosceles triangle, and one of the surfaces facing the front surface of the reflective member is formed to be inclined at a predetermined angle toward the direction in which the light-absorbing member 340 is disposed. In the example of FIG. 14 , the reflective member 330 may be disposed inwardly relative to the light-absorbing member 340. Specifically, in the example of FIG. 14 , the innermost portion of the reflective member 330 is positioned more inward than the innermost portion of the light-absorbing member 340. In addition, the reflective member 330 has a generally right-angled triangular shape in a cross-sectional view, with a surface that is generally perpendicular to the lower surface of the light-transmitting plate 310 (corresponding to the first inner surface 310a in FIG. 7). In the reflective member 330, the inclined surface of the right-angled triangle faces outward and opposes the light-absorbing member 340 located above the side on which the reflective member 330 is disposed. Of the laser light irradiated from the laser irradiation unit 500, the laser light that is incident on this inclined surface of the reflective member 330 is reflected toward the light-absorbing member 340. Note that the laser light that is not reflected by the reflective member 330 is transmitted toward the display substrate 20. In other words, the reflective member 330 defines a transmissive region opening. Specifically, in the example of FIG. 14, the transmissive region opening is defined by the innermost portion of the reflective member 330. In particular, in the example of Figure 14, the vertical surface of the innermost part of the reflective member 330 is approximately perpendicular to the underside of the light-transmitting plate 310 (corresponding to the first inner surface 310a in Figure 7), so that at the transparent area opening, the laser light can travel approximately straight toward the light-emitting element LE of the display substrate 20, and the laser light can be aimed at the light-emitting element LE and irradiated approximately accurately.

[0212] The reflective member 330 may be embedded in the outer region of the light-transmitting plate 310 corresponding to the non-display area NDA, which is the outer region of the display substrate 20 .

[0213] The reflective member 330 defines one transmission area opening corresponding to the transmission area LTE of the laser beam, and the transmission area LTE of the laser beam corresponds to the display area DPA.

[0214] Here, the light emitted from the laser irradiation unit 500 passes through one transmission area opening corresponding to the display area DPA of the display substrate 20 and is applied to a plurality of light emitting elements LE arranged on the display substrate 20 .

[0215] The light absorbing member 340 is disposed on the reflection path of the laser light, and absorbs the laser light reflected from the reflecting member 330 .

[0216] The light absorbing member 340 is disposed on one side of the plate transferring member 320 by a mounting member 400 connected to the plate transferring member 320 and can be moved in the same direction as the plate transferring member 320 at the same time.

[0217] The mounting member 400 may be disposed at a position farther from the support unit 200 than the plate transfer member 320. For example, the mounting member 400 may be connected to the upper surface, which is the front surface, of the plate transfer member 320. This allows the light absorbing member 340 to be disposed on the first light transmitting member 351.

[0218] The light absorbing member 340 can be disposed by the mounting member 400 on the side where the reflecting member 330 is disposed, and can be disposed at a preset inclination so as to face the direction in which the reflecting member 330 is disposed. In the example of FIG. 14 , the inclined surface of the reflecting member 330 and the opposing surface of the light absorbing member 340 disposed above the reflecting member 330 face each other. As a result, the laser light reflected by the inclined surface of the reflecting member 330 travels toward the opposing surface of the light absorbing member 340. In the example of FIG. 14 , the opposing surface of the light absorbing member 340 is inclined with respect to a plane along the lower surface, upper surface, etc. of the light-transmitting plate 310.

[0219] The pressure applying member 350 may include a first light transmitting member 351 , a second light transmitting member 352 , a gas pressure adjusting member 353 and a gas conduit 354 .

[0220] The pressure member 350 may include a sealed space 350-S between the first light-transmitting member 351 and the second light-transmitting member 352.

[0221] The first light-transmitting member 351 and the second light-transmitting member 352 can be arranged in a straight line so as to overlap in the thickness direction. In the example of Fig. 14, the first light-transmitting member 351 is located above the second light-transmitting member 352, and the first light-transmitting member 351 and the second light-transmitting member 352 are arranged substantially parallel to each other.

[0222] The pressure member 350 is connected to the plate transfer member 320 and can move toward the display substrate 20 or away from the display substrate 20 .

[0223] The first transparent member 351 may be formed as a rectangular plane having a long side in a first direction and a short side in a second direction intersecting the first direction. A corner where the long side in the first direction and the short side in the second direction intersect may be formed at a right angle. The planar shapes of the first transparent member 351 and the second transparent member 352 are not limited to a rectangle, and may be formed as other polygons, circles, or ellipses.

[0224] The first light-transmitting member 351 is formed of a rigid light-transmitting material and is capable of transmitting the laser light emitted from the laser irradiation unit 500. Here, light-transmitting property can be defined as transmitting 80% or more of the optical energy of the laser light emitted from the laser irradiation unit 500. For example, the first light-transmitting member 351 is made of a material that exhibits a light transmittance of about 80% or more for light in a wavelength range of about 250 nm to 5 μm, but is not limited thereto.

[0225] The first light-transmitting member 351 may be made of any material that can withstand the internal pressure of the sealed space 350-S, for example, a gauge pressure of about 0.1 MPa to about 5 MPa. The first light-transmitting member 351 may be made of a material such as tempered glass, quartz, acrylic, metal oxide, or semi-metal oxide, such as silicon oxide or aluminum oxide, but is not limited thereto. The sealed space 350-S may be formed between the first light-transmitting member 351 and the second light-transmitting member 352, and the shape of the sealed space 350-S is not limited thereto. In the example of FIG. 14 , the sealed space 350-S is formed by a space surrounded by the first light-transmitting member 351, the second light-transmitting member 352, and the plate transfer member 320.

[0226] The second light-transmitting member 352 is formed of a light-transmitting material having elasticity, and can transmit the laser light emitted from the laser irradiation unit 500. For example, the second light-transmitting member 352 may be formed of a silicon multi-layer, a silicon-PET (polyethylene terephthalate) laminated layer, etc., but is not limited thereto.

[0227] The second light-transmitting member 352 is bent downward, that is, toward the light-transmitting plate 310, by the internal pressure caused by the expansion of the sealed space 350-S, generating a pressure force in the downward direction.

[0228] The gas pressure adjusting member 353 supplies gas to the sealed space 350-S between the first light-transmitting member 351 and the second light-transmitting member 352 to expand the sealed space 350-S and cause the second light-transmitting member 352 to bend downward, thereby generating a downward pressure force from the second light-transmitting member 352.

[0229] The gas pressure adjusting member 353 supplies a gas that is inert or has very low chemical reactivity and is transparent to the laser beam, such as nitrogen (N2), helium (He), neon (Ne), argon (Ar), carbon dioxide (CO2), or a mixture thereof, to the sealed space 350-S. Hereinafter, such a gas that is inert or has very low chemical reactivity will be referred to as a neutral gas.

[0230] The gas pressure adjusting member 353 may include a reservoir for storing gas, a gas pump for pressurizing and supplying the gas, and a gas valve for adjusting the flow of the gas. The gas pump may be configured to supply the gas into the enclosed space 350-S at a pressure increased compared to the pressure outside the enclosed space 350-S.

[0231] When the internal pressure of the sealed space 350-S is sufficiently high, the gas valve can interrupt the gas supply and close the sealed space 350-S so that the internal pressure of the sealed space 350-S is maintained. The gas valve can be, for example, but is not limited to, a ball valve, a globe valve, a gate valve, a control valve, or the like.

[0232] The gas conduit 354 connects the gas pressure adjusting member 353 and the sealed space 350-S, and provides a path for gas to travel between the gas pressure adjusting member 353 and the sealed space 350-S.

[0233] 15 to 17 are side cross-sectional views showing a transfer method of a micro LED using the manufacturing apparatus of FIG.

[0234] Referring to FIG. 15, the plate transport member 320 is connected to the light-transmitting plate 310 disposed in front of the support part 200 and can move the light-transmitting plate 310 toward the display substrate 20 .

[0235] The gas pressure adjusting member 353 opens the gas valve and fills the sealed space 350-S between the first translucent member 351 and the second translucent member 352 with gas through the gas conduit 354. As the gas is filled into the sealed space 350-S, the internal pressure of the sealed space 350-S increases, causing the sealed space 350-S to expand downward, i.e., toward the display substrate 20, generating a downward pressure.

[0236] When the sealed space 350-S is filled with gas, the sealed space 350-S presses the second translucent member 352 downward. The second translucent member 352 is deflected downward by the sealed space 350-S. At this time, it is preferable that the second translucent member 352 bends so as to evenly press the upper surface of the translucent plate 310. The deflection force of the second translucent member 352 presses the translucent plate 310 downward, and the translucent plate 310 applies a uniform pressure P to the surface of the light-emitting element LE on the display substrate 20.

[0237] 16, the laser irradiation unit 500 irradiates laser light toward the light-transmitting plate 310 on the lower surface. The light irradiated from the laser irradiation unit 500 passes through one of the transparent area openings corresponding to the display area DPA of the display substrate 20 and is applied to the plurality of light-emitting elements LE arranged on the display substrate 20. Therefore, by pressing the plurality of light-emitting elements LE onto the display substrate 20 using the light-transmitting plate 310 and irradiating the plurality of light-emitting elements LE with laser light, the plurality of light-emitting elements LE can be transferred onto the display substrate 20 with high accuracy.

[0238] In contrast, the laser light applied to the reflective member 330 corresponding to the non-display area NDA of the display substrate 20 is reflected toward the light absorbing member 340 due to the inclination of the reflective member 330 (the inclination of the inclined surface in the example of FIG. 15 ). Therefore, generally, only the light that has passed through one transmissive area opening corresponding to the display area DPA of the display substrate 20 out of the laser light irradiated from the laser irradiation unit 500 can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. In other words, generally, only the laser light that has passed through the transmissive area opening corresponding to the display area DPA can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20.

[0239] 17, when the laser irradiation unit 500 completes laser irradiation, the gas pressure adjusting member 353 can exhaust the gas in the sealed space 350-S to reduce the pressure in the sealed space 350-S. When the pressure in the sealed space 350-S is reduced, the sealed space 350-S contracts and returns to its original size, eliminating the pressure from the sealed space 350-S to the second light-transmitting member 352. As a result, the second light-transmitting member 352 returns from its downwardly bent state to its original shape generally aligned in the planar direction. Therefore, the pressure from the second light-transmitting member 352 to the light-transmitting plate 310 is reduced or eliminated. Therefore, the pressure from the light-transmitting plate 310 to the light-emitting element LE on the display substrate 20 is also reduced or eliminated.

[0240] Thereafter, the plate transport member 320 can move the light-transmitting plate 310 in a direction away from the display substrate 20 .

[0241] According to the embodiment described with reference to FIGS. 14 to 17, the first light-transmitting member 351 may be thermally deformed on its surface due to temperature changes. Even in such a case, the second light-transmitting member 352 can apply uniform pressure downward.

[0242] According to one embodiment, even in the case of a display substrate 20 with a large surface area, uniform pressure distribution is possible during laser bonding of the light-emitting elements LE on the display substrate 20. As described above, the position, shape, number, and the like of the reflecting member 330 are not limited to the above-described embodiment, as long as the laser beam can be applied accurately to approximately only a plurality of light-emitting elements LE and the effect of improving the uniformity of the pressure on the light-transmitting plate 310 can be obtained. For example, the reflecting member 330 may be configured by appropriately arranging a plate-like member as long as it is possible to reflect the laser light in the direction of the light-absorbing member 340.

[0243] FIG. 18 is a side cross-sectional view schematically showing a display panel manufacturing apparatus according to still another embodiment.

[0244] 18, this embodiment differs from the display panel manufacturing apparatus described with reference to FIGS. 14 to 17 in that the mounting member 400 and the light absorbing member 340 are disposed in the sealed space 350-S between the first light-transmitting member 351 and the second light-transmitting member 352. Descriptions that overlap with the embodiment of FIGS. 14 to 17 will be omitted.

[0245] Referring to FIG. 18, the mounting member 400 is connected to the side of the plate transport member 320 that faces the sealed space 350-S, and is disposed between the first light-transmitting member 351 and the second light-transmitting member 352.

[0246] The light absorbing member 340 is disposed on the reflection path of the laser light, and can absorb the laser light reflected from the reflecting member 330 .

[0247] The light absorbing member 340 is disposed on one side of the plate transferring member 320 by a mounting member 400 connected to the plate transferring member 320 and can be moved in the same direction as the plate transferring member 320 at the same time.

[0248] The light-absorbing member 340 may be disposed by the mounting member 400 on the side where the reflecting member 330 is disposed, and may be disposed at a predetermined inclination so as to face the direction in which the reflecting member 330 is disposed. In the example of FIG. 18 , the reflecting member 330 may be disposed inward relative to the light-absorbing member 340. Specifically, the innermost portion of the reflecting member 330 is positioned more inward than the innermost portion of the light-absorbing member 340. Furthermore, the inclined surface of the reflecting member 330 and the opposing surface of the light-absorbing member 340 disposed above the reflecting member 330 face each other. As a result, the laser light reflected by the inclined surface of the reflecting member 330 travels toward the opposing surface of the light-absorbing member 340. In the example of FIG. 18 , the opposing surface of the light-absorbing member 340 is inclined with respect to a plane along the upper and lower surfaces of the light-transmitting plate 310.

[0249] 19 and 20 are side cross-sectional views showing a transfer method of a micro LED using the manufacturing apparatus of FIG.

[0250] Referring to FIG. 19, the plate transport member 320 is connected to the light-transmitting plate 310 disposed in front of the support part 200, and can move the light-transmitting plate 310 toward the display substrate 20 and in the opposite direction.

[0251] The gas pressure adjusting member 353 opens the gas valve and fills the sealed space 350-S between the first translucent member 351 and the second translucent member 352 with gas through the gas conduit 354. As the gas is filled into the sealed space 350-S, the internal pressure of the sealed space 350-S increases, causing the sealed space 350-S to expand downward, i.e., toward the display substrate 20, generating a downward pressure.

[0252] When the sealed space 350-S is filled with gas, the sealed space 350-S presses the second translucent member 352 downward. The second translucent member 352 is bent downward by the sealed space 350-S. The bending force of the second translucent member 352 presses the translucent plate 310 downward, and uniform pressure is applied to the surface of the light-emitting element LE on the display substrate 20.

[0253] 20, the laser irradiation unit 500 irradiates laser light in the direction of the light-transmitting plate 310 on the lower surface. The light irradiated from the laser irradiation unit 500 passes through one of the transparent area openings corresponding to the display area DPA of the display substrate 20 and is applied to the plurality of light-emitting elements LE arranged on the display substrate 20. Therefore, by pressing the plurality of light-emitting elements LE onto the display substrate 20 using the light-transmitting plate 310 and irradiating the plurality of light-emitting elements LE with laser light, the plurality of light-emitting elements LE can be transferred onto the display substrate 20 with high accuracy.

[0254] In contrast, the laser light applied to the reflective member 330 corresponding to the non-display area NDA of the display substrate 20 is reflected toward the light absorbing member 340 due to the inclination of the reflective member 330 (the inclination of the inclined surface in the example of FIG. 19 ). Therefore, generally, of the laser light irradiated from the laser irradiation unit 500, only the light that has passed through one transmissive area opening corresponding to the display area DPA of the display substrate 20 can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. In other words, generally, only the laser light that has passed through the transmissive area opening corresponding to the display area DPA can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20.

[0255] FIG. 21 is a side cross-sectional view schematically showing a display panel manufacturing apparatus according to still another embodiment.

[0256] 21, the display panel manufacturing apparatus differs from that described with reference to FIGS. 14 to 17 in that a reflective member 330 is built into a first light-transmitting member 351. Descriptions that overlap with the embodiment of FIGS. 14 to 17 will be omitted.

[0257] 21, the reflective member 330 is disposed within the first light-transmitting member 351 and changes the reflection path of the laser light applied from the laser irradiation unit 500. For example, the reflective member 330 may be incorporated in an outer region of the first light-transmitting member 351 corresponding to the non-display area NDA, which is an outer region of the display substrate 20, except for the display area DPA of the display substrate 20 where the plurality of light-emitting elements LE are arranged.

[0258] In one embodiment, the reflecting member 330 may be built into the first translucent member 351 and formed integrally therewith. The reflecting member 330 may include one or more mirrors. The mirrors may have a predetermined inclination in the direction in which the light-absorbing member 340 is disposed. In the example of FIG. 21 , the reflecting member 330 may be disposed inward relative to the light-absorbing member 340. Specifically, the innermost portion of the reflecting member 330 is positioned more inward than the innermost portion of the light-absorbing member 340. The inclined surface of the reflecting member 330 and the opposing surface of the light-absorbing member 340 disposed above the reflecting member 330 face each other. As a result, the laser light reflected by the inclined surface of the reflecting member 330 travels toward the opposing surface of the light-absorbing member 340. In the example of FIG. 21 , the opposing surface of the light-absorbing member 340 is inclined relative to a plane along the top and bottom surfaces of the translucent plate 310.

[0259] 22 and 23 are side cross-sectional views showing a transfer method of a micro LED using the manufacturing apparatus of FIG.

[0260] Referring to FIG. 22, the plate transport member 320 is connected to the light-transmitting plate 310 arranged on the front surface of the support part 200, and can move the light-transmitting plate 310 in the direction of the display substrate 20 approaching the display substrate 20 and in the opposite direction.

[0261] The gas pressure adjusting member 353 opens the gas valve and fills the sealed space 350-S between the first translucent member 351 and the second translucent member 352 with gas through the gas conduit 354. As the gas is filled into the sealed space 350-S, the internal pressure of the sealed space 350-S increases, causing the sealed space 350-S to expand downward, i.e., toward the display substrate 20, generating a downward pressure.

[0262] When the sealed space 350-S is filled with gas, the sealed space 350-S presses the second translucent member 352 downward. The second translucent member 352 is bent downward by the sealed space 350-S. The bending force of the second translucent member 352 presses the translucent plate 310 downward, and uniform pressure is applied to the surface of the light-emitting element LE on the display substrate 20.

[0263] 23, the laser irradiation unit 500 irradiates laser light in the direction of the light-transmitting plate 310 on the lower surface. The light irradiated from the laser irradiation unit 500 passes through one of the transparent area openings corresponding to the display area DPA of the display substrate 20 and is applied to the plurality of light-emitting elements LE arranged on the display substrate 20. Therefore, by pressing the plurality of light-emitting elements LE onto the display substrate 20 using the light-transmitting plate 310 and irradiating the plurality of light-emitting elements LE with laser light, the plurality of light-emitting elements LE can be transferred onto the display substrate 20 with high accuracy.

[0264] In contrast, the laser light applied to the reflective member 330 corresponding to the non-display area NDA of the display substrate 20 is reflected toward the light absorbing member 340 due to the inclination of the reflective member 330. Therefore, generally, only the light that has passed through one transmissive area opening corresponding to the display area DPA of the display substrate 20 out of the laser light irradiated from the laser irradiation unit 500 can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. In other words, generally, only the laser light that has passed through the transmissive area opening corresponding to the display area DPA can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20.

[0265] 24 is a side cross-sectional view schematically illustrating a display panel manufacturing apparatus according to another embodiment. 25 and 26 are side cross-sectional views illustrating a micro LED transfer method using the manufacturing apparatus of FIG.

[0266] The display panel manufacturing apparatus in Figure 24 differs from the display panel manufacturing apparatus described with reference to Figures 14 to 17 in that the reflective member 330 includes a plurality of reflective members 331, 332, and the arrangement of these members is similar to the arrangement in Figure 11. Duplicate descriptions of the plurality of reflective members 331, 332 in Figures 11 to 13 and descriptions that overlap with the embodiment in Figures 14 to 17 will be omitted.

[0267] The reflecting member 330 may include a first reflecting member 331 and a second reflecting member 332 built into the light-transmitting plate 310. The positions, arrangement, and laser light reflection of the first reflecting member 331 and the second reflecting member 332 built into the light-transmitting plate 310 refer to the embodiments shown in FIGS. 11 to 14 . Briefly, in FIG. 24 and other figures, similar to FIG. 11 and other figures, the innermost portion of the first reflecting member 331 and the innermost portion of the second reflecting member 332 are positioned in that order from the inside to the outside in a plan view. Also, similar to FIG. 11 and other figures, in FIG. 24 and other figures, the first reflecting member 331 has a roughly right-angled triangular shape in a cross-sectional view, with a surface perpendicular to the bottom surface of the light-transmitting plate 310, and the inclined surface of the right-angled triangle faces inward. Of the laser light irradiated from laser irradiation unit 500, the laser light that is incident on this inclined surface of first reflecting member 331 is reflected toward second reflecting member 332 located in a direction opposite to the inclined surface, as shown in Fig. 26. Note that the laser light that is not reflected by first reflecting member 331 is transmitted toward display substrate 20 through the transmission area opening defined by first reflecting member 331.

[0268] The second reflecting member 332 and the light absorbing member 340 do not overlap with the path of the laser light irradiated by the laser irradiating unit 500 .

[0269] 25, the plate transfer member 320 is connected to the light-transmitting plate 310 disposed on the front surface of the support member 200 and can move the light-transmitting plate 310 toward the display substrate 20 and in the opposite direction. Briefly, when the sealed space 350-S is filled with gas, the sealed space 350-S presses the second light-transmitting member 352 downward, thereby pressing the light-transmitting plate 310 downward, and uniform pressure is applied to the surface of the light-emitting element LE on the display substrate 20. The movement of the plate transfer member 320 has been described in detail with reference to FIGS. 15 and 17, so further redundant description will be omitted.

[0270] 26, the laser irradiation unit 500 irradiates the display substrate 20 with laser light via the light-transmitting plate 310. Generally, only the light that passes through the transmission area opening of the first reflecting member 331 out of the laser light irradiated from the laser irradiation unit 500 can be applied to the plurality of light-emitting elements LE arranged on the display substrate 20. In contrast, the laser light reflected by the second reflecting member 332 travels to the light-absorbing member 340 and is absorbed by the light-absorbing member 340. Therefore, by pressing the plurality of light-emitting elements LE onto the display substrate 20 with the light-transmitting plate 310 and irradiating the plurality of light-emitting elements LE with laser light, the plurality of light-emitting elements LE can be transferred onto the display substrate 20 with high accuracy.

[0271] According to the display panel manufacturing apparatus of the embodiment, the laser beam irradiated on the peripheral area other than the micro LEDs is reflected by the reflective member of the light-transmitting plate, so that the laser beam is applied accurately only to the micro LEDs, and the uniformity of the pressure applied to the micro LEDs is increased, thereby preventing manufacturing defects of the target substrate and the display panel and improving manufacturing efficiency.

[0272] Although the present invention has been described above with reference to the accompanying drawings, those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the above-described embodiment is illustrative in all respects and is not limiting. [Explanation of symbols]

[0273] 10 Display device 20 Display board 200 Support part 300 Pressure unit 310 Translucent plate 320 Plate transfer member 330 Reflective material 340 Light-absorbing material 400 Mounting member 500 Laser irradiation unit

Claims

1. a support portion on which the display substrate is placed; a pressing unit including a light-transmitting plate disposed on a front surface of the support unit, one or more reflecting members disposed in the light-transmitting plate, and a light-absorbing member that absorbs the laser light reflected by the reflecting members, the pressing unit moving the light-transmitting plate toward the display substrate and pressing a plurality of light-emitting elements arranged on the display substrate with the light-transmitting plate; and a laser irradiation unit disposed on a front surface of the light-transmitting plate and configured to irradiate the display substrate with laser light through the light-transmitting plate; The display panel manufacturing apparatus, wherein the reflecting member includes a first reflecting member that defines a transmission area opening corresponding to a transmission area of ​​the laser beam, and a second reflecting member that guides light reflected from the first reflecting member to the light absorbing member.

2. the reflecting member further includes a third reflecting member disposed between the second reflecting member and the light absorbing member, 2. The display panel manufacturing apparatus according to claim 1, wherein the third reflecting member reflects the laser light reflected from the second reflecting member to the light absorbing member.

3. 3. The display panel manufacturing apparatus of claim 2, wherein the first reflective member, the second reflective member, and the third reflective member are incorporated in outer regions of the light-transmitting plate corresponding to a non-display region that is an outer region of the display substrate, excluding a display region of the display substrate in which the plurality of light-emitting elements are arranged, and are arranged in order from the inside to the outside of the light-transmitting plate.

4. The first reflecting member has a cross section formed in a triangular mountain shape, and the cross section is formed in at least one of a right triangle, an equilateral triangle, and an isosceles triangle, The display panel manufacturing apparatus of claim 1 , wherein one of the surfaces of the first reflecting member in the front direction has a predetermined inclination toward a direction in which the second reflecting member is disposed.

5. the light-transmitting plate includes a first inner surface and a second inner surface opposite to the first inner surface, The display panel manufacturing apparatus according to claim 2 , wherein the first reflecting member and the third reflecting member are disposed on the first inner surface, and the second reflecting member is disposed on the second inner surface.

6. 2. The display panel manufacturing apparatus according to claim 1, wherein the light absorbing member is disposed on a side surface of the light transmitting plate and on a reflection path of the laser light.

7. 2. The display panel manufacturing apparatus according to claim 1, wherein the transmissive area opening is formed in an area corresponding to a non-display area that is an outer area of ​​the display substrate.

8. The pressure applying unit is 2. The display panel manufacturing apparatus of claim 1, further comprising a plate transporter connected to the light-transmitting plate and adapted to move toward the display substrate or away from the display substrate.

9. The light-transmitting plate is It is formed as a transparent or semi-transparent flat plate, and transmits laser light applied to the front or back surface in the opposite direction to the front or back surface. the plate is moved toward the display substrate or away from the display substrate by the plate transport unit; The display panel manufacturing apparatus of claim 8 , wherein the plate conveying unit moves toward the display substrate and presses the light emitting elements arranged on the display substrate toward the display substrate.

10. a support portion on which the display substrate is placed; a pressure unit including a light-transmitting plate disposed on the front surface of the support unit, a reflecting member disposed in the light-transmitting plate and a light-absorbing member that absorbs the laser light reflected by the reflecting member, and a pressure member that applies pressure to the light-transmitting plate; and a laser irradiation unit disposed in front of the pressure unit and configured to irradiate the display substrate with laser light through the light-transmitting plate; The pressure member is a first light-transmitting member and a second light-transmitting member disposed on the light-transmitting plate; and a gas pressure adjusting unit that adjusts a gas pressure in a sealed space formed between the first light-transmitting member and the second light-transmitting member to generate a pressure force on the light-transmitting plate;

11. The first transparent member is made of a rigid material, The display panel manufacturing apparatus of claim 10 , wherein the second light-transmitting member is made of an elastic material.

12. The display panel manufacturing apparatus according to claim 10 , wherein the second light-transmitting member is disposed so as to overlap the first light-transmitting member in a thickness direction.

13. The display panel manufacturing apparatus of claim 10 , further comprising a gas pipe connected between the gas pressure regulator and the sealed space.

14. The display panel manufacturing apparatus according to claim 10 , further comprising a buffer member disposed between the light-transmitting plate and the pressure member.

15. The reflection member has a cross section formed in a triangular mountain shape, and the cross section is formed in at least one of a right triangle, an equilateral triangle, and an isosceles triangle, The display panel manufacturing apparatus of claim 10 , wherein any one of the surfaces of the reflecting member in the front direction is formed to be inclined at a predetermined inclination toward the light absorbing member.

16. The reflecting member is 11. The display panel manufacturing apparatus of claim 10, wherein the light-transmitting plate is attached or mounted to an outer region of the light-transmitting plate corresponding to a non-display region, which is an outer region of the display substrate, except for a display region of the display substrate where the plurality of light-emitting elements are arranged.

17. 11. The display panel manufacturing apparatus according to claim 10, wherein the light absorbing member is disposed between the laser irradiation unit and the pressure unit and does not overlap with a path of light irradiated by the laser irradiation unit.

18. The display panel manufacturing apparatus according to claim 10 , wherein the light absorbing member is disposed in the sealed space and does not overlap with a path of light irradiated by the laser irradiation unit.

19. 12. The display panel manufacturing apparatus of claim 11, wherein the reflecting member includes a first reflecting member that defines a transmission area opening corresponding to a transmission area of ​​the laser beam, and a second reflecting member that guides light reflected from the first reflecting member to the light absorbing member.

20. a support portion on which the display substrate is placed; a pressure unit including a light-transmitting plate disposed on the front surface of the support unit, a light-absorbing member that absorbs laser light, and a pressure member that applies pressure to the light-transmitting plate; and a laser irradiation unit disposed in front of the pressure unit and configured to irradiate the display substrate with laser light through the light-transmitting plate; The pressure member is a first light-transmitting member and a second light-transmitting member disposed on the light-transmitting plate; a reflecting member disposed within the first light-transmitting member and reflecting incident laser light to the light-absorbing member; and a gas pressure adjusting unit that adjusts a gas pressure in a sealed space formed between the first light-transmitting member and the second light-transmitting member to generate a pressure force on the light-transmitting plate;

21. 21. The display panel manufacturing apparatus according to claim 20, wherein the light absorbing member is disposed between the laser irradiation unit and the first light transmitting member and does not overlap with a path of light irradiated by the laser irradiation unit.

22. The first transparent member is made of a rigid material, The display panel manufacturing apparatus of claim 20 , wherein the second light-transmitting member is made of an elastic material.

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