Manufacturing method of semiconductor device

Abstract

To provide a manufacturing method of a semiconductor device capable of forming large-sized end material chips on both sides of a line to be processed.SOLUTION: In a manufacturing method of a semiconductor device according to the present invention, a workpiece is divided by a first planned processing line, a second planned processing line, and a third planned processing line that are parallel to each other and are set along a surface of the workpiece. An end portion on one side of the first planned processing line is in a region inside an outer edge of the workpiece, an end portion on the other side is in the outer edge of the workpiece, the end portion on one side of the second planned processing line is in the outer edge of the workpiece, and an end portion on the other side is in a region inside the outer edge of the workpiece. The end portion on one side of the third planned processing line is in a region inside the outer edge of the workpiece, and an end portion on the other side is in the outer edge of the workpiece.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a semiconductor device. [Background technology]

[0002] In the manufacturing process of semiconductor devices, a workpiece (a plate-like object such as a semiconductor wafer, an optical device wafer, glass, or various ceramics) may be divided to produce a large number of chips having a predetermined shape and size. Specifically, for example, a processing line is set on the surface of the workpiece according to the shape and size of the desired chip. By cutting the workpiece along this processing line by a method such as cutting, a plurality of chips having the desired shape and size are obtained.

[0003] Depending on the shape of the workpiece and the way the planned processing line is set, chips that do not have the shape or size of the desired chips, called scrap chips, may be generated in the area including the outer edge of the workpiece (peripheral area). Because these scrap chips are generally smaller than the desired chips, the contact area between the scrap chips and the support members, such as the chuck table and dicing tape, that support the workpiece when it is divided is also smaller than that of the desired chips.

[0004] In particular, in the case of scrap chips generated from workpieces having rounded chamfers where the corners of the outer edges have been removed, the contact area between the support member and the scrap chip is further reduced due to the chamfers. When the contact area between the scrap chip and the support member is reduced, the adhesive and suction forces acting on the scrap chip from the support member are weakened.

[0005] As a result, when the workpiece is divided into chips, the probability of off-cut chips coming off the support member and flying off increases. If chips fly off, the flying chips may fall onto the surface of the workpiece, causing scratches on the surface, or may collide with equipment placed around the workpiece, damaging the equipment.

[0006] Therefore, a wafer dividing method has been proposed in which the wafer is divided so that the size of the scrap chips becomes large (for example, Patent Document 1). Specifically, in Patent Document 1, for each of a plurality of adjacent processing lines extending in a first direction, a cutting blade is caused to cut into the wafer from outside the outer edge of the wafer located on one side in the first direction. Furthermore, on the other side in the first direction, which is the cutting end side, the cutting blade is prevented from cutting through the outer edge of the wafer. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-204015 Summary of the Invention [Problem to be solved by the invention]

[0008] However, while the method described in Patent Document 1 can create a large uncut area at the end of the cutting, it still generates small offcut chips on one side of the first direction, which is the start of the cutting, just like in conventional methods. Therefore, this method cannot reduce the probability of chip flying on one side of the planned processing line.

[0009] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method for manufacturing a semiconductor device that is capable of forming large-sized offcut chips on both sides of a processing line. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a method for manufacturing a semiconductor device by dividing a workpiece to manufacture a plurality of semiconductor devices, the method including: a first processing step of processing the workpiece along a first planned processing line set along a surface of the workpiece; a second processing step of processing the workpiece along a second planned processing line set along the surface, parallel to the first planned processing line and adjacent to the first planned processing line; a third processing step of processing the workpiece along a third planned processing line set along the surface, parallel to the first planned processing line and adjacent to the second planned processing line; and a fourth processing step of processing the workpiece along a fourth planned processing line set along the surface, intersecting the first planned processing line, the second planned processing line, and the third planned processing line. and a fourth processing step, wherein an end of the first processing line located on one side along a first direction parallel to the first processing line is in a region inside the outer edge of the workpiece, an end of the first processing line located on the other side along the first direction is at the outer edge, an end of the second processing line located on one side along the first direction is at the outer edge, an end of the second processing line located on the other side along the first direction is in a region inside the outer edge, an end of the third processing line located on one side along the first direction is in a region inside the outer edge, and an end of the third processing line located on the other side along the first direction is at the outer edge.

[0011] Preferably, the method further includes a fifth processing step in which the workpiece is processed along a fifth processing line set along the surface, parallel to the fourth processing line, and adjacent to the fourth processing line, and a sixth processing step in which the workpiece is processed along a sixth processing line set along the surface, parallel to the fifth processing line, and adjacent to the fifth processing line, wherein an end of the fourth processing line located on one side along a second direction parallel to the fourth processing line is in an area inside the outer edge, an end of the fourth processing line located on the other side along the second direction is at the outer edge, an end of the fifth processing line located on one side along the second direction is at the outer edge, an end of the fifth processing line located on the other side along the second direction is in an area inside the outer edge, an end of the sixth processing line located on one side along the second direction is in an area inside the outer edge, and an end of the sixth processing line located on the other side along the second direction is at the outer edge.

[0012] Preferably, the workpiece is divided into a plurality of planned division sections by an intermediate surplus area, and the first planned processing line, the second planned processing line, the third planned processing line, and the fourth planned processing line are set along the boundary between the intermediate surplus area and the planned division sections.

[0013] Preferably, in the first processing step, the second processing step, and the third processing step, the workpiece is cut by rotating an annular cutting blade and cutting the first processing line, the second processing line, and the third processing line into the workpiece, respectively.

[0014] Preferably, in the first processing step, the cutting blade cuts the workpiece along the first planned processing line by cutting into the workpiece from the end of the first planned processing line located on the other side along the first direction, in the second processing step, the cutting blade cuts the workpiece along the second planned processing line by cutting into the workpiece from the end of the second planned processing line located on one side along the first direction, and in the third processing step, the cutting blade cuts the workpiece along the third planned processing line by cutting into the workpiece from the end of the third planned processing line located on the other side along the first direction.

[0015] Preferably, in the first processing step, the second processing step, and the third processing step, a laser beam is irradiated onto the first processing line, the second processing line, and the third processing line of the workpiece, respectively. [Effects of the Invention]

[0016] In the method for manufacturing a semiconductor device according to the present invention, a plurality of processing lines are set, each having an end in a region inside the outer edge of the workpiece and an end at the outer edge of the workpiece, and parallel to each other. In any two adjacent processing lines, the end inside the outer edge and the end at the outer edge are not located on the same side.

[0017] For example, if the end portion on the inside of the outer edge and the end portion of the outer edge of two adjacent processing lines are located on the same side, it is not possible to increase the size of the scrap chips on one side of these processing lines. In contrast, according to the semiconductor device manufacturing method of the present invention, the end portion on the inside of the outer edge and the end portion of the outer edge of any two adjacent processing lines are not located on the same side, so it is possible to form large scrap chips on both sides of the processing lines. [Brief explanation of the drawings]

[0018] [Figure 1]FIG. 1 is a perspective view of a cutting device used in the method for manufacturing a semiconductor device according to the first embodiment. [Figure 2] FIG. 2 is a top view of a workpiece on which a plurality of planned processing lines are set. [Figure 3] FIG. 3 is a flowchart showing a part of the procedure for processing a workpiece in the method for manufacturing a semiconductor device according to the first embodiment. [Figure 4] FIG. 10 is a top view of the workpiece after the first group of processing lines have been cut and processing marks have been formed. [Figure 5] FIG. 10 is a top view of the workpiece after the second group of processing lines have been cut and processing marks have been formed. [Figure 6] FIG. 10 is a top view of the workpiece after the third group of processing lines have been cut and processing marks have been formed. [Figure 7] FIG. 10 is a top view of the workpiece after the fourth group of processing lines have been cut and processing marks have been formed. [Figure 8] FIG. 8 is a top view of the workpiece after the planned processing line according to the comparative example has been cut and processing marks have been formed. [Figure 9] FIG. 9 is a perspective view of a laser irradiation apparatus used in the semiconductor manufacturing method according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, the configuration of a cutting device used in a semiconductor manufacturing method according to this embodiment will be described. FIG. 1 is a perspective view of a cutting device 2 used in a semiconductor device manufacturing method according to a first embodiment. Note that in FIG. 1, some of the components are expressed as functional blocks. Furthermore, the X1 axis (processing feed axis), Y1 axis (indexing feed axis), and Z1 axis (vertical axis) used in the following description are perpendicular to one another.

[0020] As shown in Fig. 1, the cutting device 2 includes a base 4 that supports various components. An opening 4a is formed in a corner of the top surface of the base 4, and a cassette table 6 that is raised and lowered by a lifting mechanism (not shown) is disposed within this opening 4a. A cassette 8 that can accommodate workpieces 11 to be machined by the cutting device 2 is placed on the top surface of the cassette table 6. For ease of explanation, only the outline of the cassette 8 is shown in Fig. 1.

[0021] 1, a rectangular opening 4b is formed adjacent to the cassette table 6 along the Y1 axis, with its long side aligned with the X1 axis. A ball screw type chuck table moving mechanism (processing feed mechanism) 10 is disposed within the opening 4b. The chuck table moving mechanism 10 includes a rotational drive source (not shown) such as a motor connected to the end of a ball screw, and an X1-axis moving table (not shown) having a nut portion coupled to the ball screw, and moves the X1-axis moving table along the X1 axis.

[0022] The top of the X1-axis moving table is covered by a table cover 10a. In addition, accordion-shaped dustproof and drip-proof covers 10b that expand and contract in accordance with the movement of the X1-axis moving table and table cover 10a are attached to both ends of the table cover 10a in the direction along the X1 axis.

[0023] A disk-shaped table base (not shown) is disposed above the X1-axis moving table via a bearing (not shown), etc. A chuck table 12 that holds a workpiece 11 (see FIG. 2) to be cut by the cutting device 2 is disposed on the top surface of the table base in a manner that it is exposed from the table cover 10a.

[0024] The workpiece 11 is configured in a plate shape having a first surface (front surface) 11a and a second surface (back surface) 11b opposite to the first surface 11a. The first surface 11a and the second surface 11b have a rectangular shape, for example, with a vertical length of 195 mm and a horizontal length of 72 mm. The thickness of the workpiece 11 is, for example, 1.0 mm. However, the material, shape, and size of the workpiece 11 are not limited to these. Details of the workpiece 11 will be described later.

[0025] The chuck table 12 includes a disk-shaped frame 14 made of a metal such as stainless steel. A recess with a circular opening at the top end is formed on the top surface of the frame 14. A disk-shaped holding plate 16 that matches the shape of the recess is fitted into the recess. In addition, a plurality of clamps 18 are arranged around the periphery of the chuck table 12 to grip and secure a frame, which will be described later.

[0026] The holding plate 16 is made of a porous plate-like material such as ceramics, and its upper surface (holding surface) 16a holds the workpiece 11. The upper surface 16a of the holding plate 16 is configured to be approximately parallel to the X1-axis and Y1-axis when the holding plate 16 is fitted into the recess.

[0027] A suction source (not shown) is connected to the bottom of the recess in the frame 14 via a flow path (not shown) provided inside the frame 14 or a valve (not shown) located outside the frame 14. Therefore, when the valve is opened, negative pressure from the suction source acts on the upper surface 16a of the holding plate 16 through the flow path or the like. As the suction source, for example, a vacuum pump combining an air supply source and an ejector is used. However, a rotary pump or the like may also be used as the suction source.

[0028] The chuck table 12 is connected to a rotary drive source (not shown) such as a motor disposed below the bearing, and rotates around a rotation axis generally parallel to the Z1 axis. The chuck table 12 is also moved along the X1 axis together with the X1-axis moving table by the chuck table moving mechanism 10 (processing feed).

[0029] Above the opening 4b, one or more transport mechanisms (not shown) capable of transporting the above-mentioned workpiece 11 to the chuck table 12 or the like are disposed. For example, the workpiece 11 transported by the transport mechanism is placed on the upper surface 16a of the chuck table 12 so that the first surface 11a is exposed upward. The workpiece 11 may be transported to the chuck table 12 manually by an operator. In this case, the transport mechanism for transporting the workpiece 11 can be omitted.

[0030] A gate-shaped support structure 20 is provided on the upper surface of the base 4, spanning the opening 4b along the Y1 axis. A pair of cutting unit movement mechanisms (indexing feed mechanism, cutting feed mechanism) 22a, 22b are arranged above the support structure 20. The pair of cutting unit movement mechanisms 22a, 22b are substantially identical except that they are configured to be symmetrical (mirror image) with respect to a plane parallel to the X1 axis and the Z1 axis. The same and corresponding components of the pair of cutting unit movement mechanisms 22a, 22b are designated by the same reference numerals, and redundant explanations will be omitted.

[0031] Each cutting unit moving mechanism 22a, 22b shares a pair of Y1-axis guide rails 24 that are fixed to the front (surface) of the support structure 20 and are generally parallel to the Y1 axis. A Y1-axis moving plate 26 provided in each cutting unit moving mechanism 22 is attached to the pair of Y1-axis guide rails 24 in a manner that allows it to slide along the Y1 axis. A nut portion (not shown) that forms a ball screw is provided on the rear side (back side) of each Y1-axis moving plate 26, and a screw shaft 28 that is generally parallel to the Y1-axis guide rails 24 is rotatably connected to each nut portion.

[0032] A rotary drive source 30 such as a motor is connected to one end of each screw shaft 28. When each screw shaft 28 is rotated by each rotary drive source 30, the Y1-axis moving plate 26 connected to the screw shaft 28 moves along the Y1-axis guide rail 24.

[0033] A pair of Z1-axis guide rails 32, which are generally parallel to the Z1 axis, are fixed to the front (surface) of each Y1-axis moving plate 26. A Z1-axis moving plate 34 is attached to the pair of Z1-axis guide rails 32 fixed to each Y1-axis moving plate 26 in a manner that allows it to slide along the Z1 axis.

[0034] A rotary drive source 38 such as a motor is connected to one end of each screw shaft 36. When each screw shaft 36 is rotated by each rotary drive source 38, the Z1-axis moving plate 34 moves along the Z1-axis guide rail 32.

[0035] A cutting unit 40a is fixed to the lower part of the Z1-axis moving plate 34 that constitutes the cutting unit moving mechanism 22a. The cutting unit 40a is equipped with a cylindrical spindle housing 42. This spindle housing 42 accommodates a spindle (not shown) whose axis is generally parallel to the Y1 axis. A cutting blade 44 is attached to one end (tip) of the spindle, and a motor (not shown) that serves as a rotational drive source for the spindle is connected to the other end of the spindle.

[0036] The cutting blade 44 is an annular member in which abrasive grains made of, for example, diamond or the like are dispersed and fixed by a binder such as metal, resin, or ceramic, and is formed with a width (length and thickness along the Y1 axis) of 0.05 mm to 3 mm.

[0037] 1, a cover 46 capable of partially covering a cutting blade 44 attached to the spindle is provided at the end of the spindle housing constituting the cutting unit 40a on the opening 4b side. A pair of nozzles 48 capable of supplying a processing liquid (processing fluid) such as pure water to the cutting blade 44 are arranged below the cover 46 so as to sandwich the cutting blade 44 therebetween.

[0038] A camera 50a capable of capturing images of the workpiece 11 held on the chuck table 12 is disposed adjacent to the cutting unit 40a along the X1 axis. Similar to the cutting unit 40a, the camera 50a is fixed to the lower part of the Z1-axis moving plate 34 that constitutes the cutting unit moving mechanism 22a.

[0039] Therefore, when the cutting unit moving mechanism 22a moves the Y1-axis moving plate 26 provided in the cutting unit moving mechanism 22a along the Y1 axis, the cutting unit 40a and the camera 50a move along the Y1 axis (indexing feed).Furthermore, when the cutting unit moving mechanism 22a moves the Z1-axis moving plate 34 provided in the cutting unit moving mechanism 22a along the Z1 axis, the cutting unit 40a and the camera 50a move along the Z1 axis (cutting feed).

[0040] A cutting unit 40b having the same configuration and function as the cutting unit 40a is fixed to the lower part of the Z1-axis moving plate 34 that constitutes the other cutting unit moving mechanism 22. A camera 50b is disposed adjacent to the cutting unit 40b along the X1 axis. The cutting unit 40b and the camera 50b are substantially the same as the cutting unit 40a and the camera 50a, except that they are configured to be symmetrical (mirror images) with respect to a plane parallel to the X1 axis and the Z1 axis.

[0041] 1, opening 4c is formed at a position opposite opening 4a with respect to opening 4b. A cleaning unit 52 for cleaning workpiece 11 and the like after processing is disposed within opening 4c. For example, cleaning unit 52 includes a spinner table that holds and rotates workpiece 11 and the like, and a nozzle that supplies a liquid (cleaning liquid) such as pure water to workpiece 11 and the like held by the spinner table.

[0042] A controller 54 is connected to the various components of the cutting device 2 described above. The operation of each component is controlled by this controller 54. The controller 54 is configured by a computer including, for example, a processing device 54a such as a CPU (Central Processing Unit) and a storage device 54b equipped with a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive or flash memory.

[0043] The processing device 54a operates in accordance with a program (software) stored in the storage device 54b, thereby realizing the functions of the controller 54. However, the controller 54 may also be realized by hardware alone.

[0044] Next, the workpiece 11 to be processed in the semiconductor device manufacturing method according to this embodiment will be described in detail. Fig. 2 is a top view of the workpiece 11 on which a plurality of processing lines 13 are set. The workpiece 11 according to this embodiment is, for example, a semiconductor wafer having a plate shape. In this case, the material of the workpiece 11 is, for example, a semiconductor material such as silicon (Si) or silicon carbide (SiC).

[0045] However, the workpiece 11 is not limited to a semiconductor wafer. The workpiece 11 may be an optical device wafer made of sapphire or the like, or a substrate made of glass or various ceramics. The workpiece 11 may also be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a package substrate is obtained by sealing multiple device chips mounted on a mounting substrate with a resin layer (mold resin).

[0046] 2, the first surface 11a of the workpiece 11 is made up of a plurality of chip compartments 15 and a surplus area 19 other than the plurality of chip compartments 15. In other words, as shown in FIG. 2, the first surface 11a of the workpiece 11 is partitioned into a plurality of chip compartments 15 by the surplus area 19.

[0047] Each of the multiple chip sections 15 is an area that will become the desired chip after the workpiece 11 is divided. Therefore, the chip sections 15 are set to the same size as the desired chips. The chip sections 15 are configured, for example, in a square shape with a vertical length of 6 mm and a horizontal length of 6 mm. A device 17 such as an IC (Integrated Circuit) is formed in each chip section 15. However, the device 17 does not have to be formed in each chip section 15.

[0048] As part of the method for manufacturing a semiconductor device according to this embodiment, a plurality of processing lines 13 are set at the boundaries between the chip sections 15 and the excess area 19 on the first surface 11a of the workpiece 11. When the workpiece 11 is cut along the processing lines 13 by cutting using a cutting blade or laser processing using a laser beam, the workpiece 11 is divided into a plurality of chips.

[0049] 2, the multiple processing lines 13 include processing lines 13a, 13b, 13c, 13d, 13e, and 13f that are parallel to the first direction (the direction of the a-axis in FIG. 2) and arranged in order along the second direction (the direction of the b-axis in FIG. 2). That is, the processing lines 13a and 13b are adjacent to each other, the processing lines 13b and 13c are adjacent to each other, the processing lines 13c and 13d are adjacent to each other, the processing lines 13d and 13e are adjacent to each other, and the processing lines 13e and 13f are adjacent to each other.

[0050] The multiple processing lines 13 also include processing lines 13g, 13h, 13i, 13j, 13k, and 13l that are parallel to the second direction and arranged in order along the first direction. That is, the processing lines 13g and 13h are adjacent to each other, the processing lines 13h and 13i are adjacent to each other, the processing lines 13i and 13j are adjacent to each other, the processing lines 13j and 13k are adjacent to each other, and the processing lines 13k and 13l are adjacent to each other.

[0051] In the processing lines 13a, 13c, and 13e parallel to the first direction, the ends located on one side along the first direction (the ends on one side, the upper ends in FIG. 2) are on the outer edge of the workpiece 11. In addition, in the processing lines 13a, 13c, and 13e, the ends located on the other side along the first direction (the ends on the other side, the lower ends in FIG. 2) are in an area more inward than the outer edge of the workpiece 11.

[0052] In this embodiment, the planned processing lines 13a, 13c, and 13e extend along the first direction from the edge of the first surface 11a located on the upper side in Fig. 2 to a position slightly below the edge of the chip section 15 that is closest to the edge of the first surface 11a located on the lower side in Fig. 2. This is because, when cutting a predetermined depth to the edge of the chip section 15 that is closest to the edge of the first surface 11a located on the lower side in Fig. 2 using the annular cutting blade 44, it is necessary to cut slightly below the edge of the chip section 15. However, the positions of the other end portions of the planned processing lines 13a, 13c, and 13e can be freely set as long as they are in an area inside the outer edge of the workpiece 11.

[0053] In the processing lines 13b, 13d, and 13f adjacent to any of the processing lines 13a, 13c, and 13e, the end portion located on one side along the first direction (the end portion on one side, the end portion on the upper side in FIG. 2) is in a region inside the outer edge of the workpiece 11. In addition, in the processing lines 13b, 13d, and 13f, the end portion located on the other side along the first direction (the end portion on the other side, the end portion on the lower side in FIG. 2) is in the outer edge of the workpiece 11.

[0054] In this embodiment, the lines to be processed 13b, 13d, and 13f extend along the first direction from the edge of the first surface 11a located on the lower side in Fig. 2 to a position slightly above the edge of the chip section 15 that is closest to the edge of the first surface 11a located on the upper side in Fig. 2. This is because, when cutting a predetermined depth to the edge of the chip section 15 that is closest to the edge of the first surface 11a located on the upper side in Fig. 2 using the annular cutting blade 44, it is necessary to cut slightly above the edge of the chip section 15. However, the position of one end of the lines to be processed 13b, 13d, and 13f can be freely set as long as it is in an area inside the outer edge of the workpiece 11.

[0055] In the processing lines 13h, 13j, and 13l parallel to the second direction, the ends located on one side along the second direction (the ends on one side, the ends on the left side in FIG. 2) are on the outer edge of the workpiece 11. In addition, in the processing lines 13h, 13j, and 13l, the ends located on the other side along the second direction (the ends on the other side, the ends on the right side in FIG. 2) are in an area more inward than the outer edge of the workpiece 11.

[0056] In this embodiment, the lines to be processed 13h, 13j, and 13l extend along the second direction from the side of the first surface 11a located on the left side in Fig. 2 to a position slightly to the right of the side of the chip section 15 that is closest to the side of the first surface 11a located on the right side in Fig. 2. This is because, when cutting a predetermined depth to the side of the chip section 15 that is closest to the side of the first surface 11a located on the right side in Fig. 2 using the annular cutting blade 44, it is necessary to cut slightly to the right of the side of the chip section 15. However, the positions of the other ends of the lines to be processed 13h, 13j, and 13l can be freely set as long as they are in an area inside the outer edge of the workpiece 11.

[0057] In the processing lines 13g, 13i, and 13k adjacent to any of the processing lines 13h, 13j, and 13l, the end portion located on one side along the second direction (the end portion on the left side in FIG. 2) is in a region inside the outer edge of the workpiece 11. In addition, in the processing lines 13g, 13i, and 13k, the end portion located on the other side along the second direction (the end portion on the right side in FIG. 2) is in the outer edge of the workpiece 11.

[0058] In this embodiment, the lines to be processed 13g, 13i, and 13k extend along the second direction from the edge of the first surface 11a located on the right side in Fig. 2 to a position slightly to the left of the edge of the chip section 15 that is closest to the edge of the workpiece 11 located on the left side in Fig. 2. This is because, when cutting a predetermined depth to the edge of the chip section 15 that is closest to the edge of the first surface 11a located on the left side in Fig. 2 using the annular cutting blade 44, it is necessary to cut slightly to the left of the edge of the chip section 15. However, the position of one end of the lines to be processed 13g, 13i, and 13k can be freely set as long as it is in an area inside the outer edge of the workpiece 11.

[0059] In the following, taking into consideration the order of cutting processing, etc., the processing lines 13a, 13c, and 13e will be referred to as the first group, the processing lines 13h, 13j, and 13l as the second group, the processing lines 13b, 13d, and 13f as the third group, and the processing lines 13g, 13i, and 13k as the fourth group.

[0060] As described above, each of the planned processing lines 13 has an end portion at the outer edge of the workpiece 11 and an end portion in a region more inward than the outer edge of the workpiece 11. Looking at two adjacent parallel processing lines 13, the end portion at the outer edge of the workpiece 11 of one of the two planned processing lines 13 and the end portion at the outer edge of the workpiece 11 of the other planned processing line 13 are located at opposite positions along the planned processing lines 13.

[0061] Therefore, when looking at the first group of lines to be processed 13a, 13c, 13e and the third group of lines to be processed 13b, 13d, 13f parallel to the first direction, the ends of the lines to be processed 13 at the outer edge of the workpiece 11 are alternately arranged on opposite sides along the second direction. Also, the ends of the lines to be processed 13 in the region inside the outer edge of the workpiece 11 are alternately arranged on opposite sides along the second direction.

[0062] Similarly, looking at the second group of lines to be processed 13h, 13j, 13l and the fourth group of lines to be processed 13g, 13i, 13k parallel to the second direction, the ends of the lines to be processed 13 at the outer edge of the workpiece 11 are alternately arranged on opposite sides along the first direction. Also, the ends of the lines to be processed 13 in the region inside the outer edge of the workpiece 11 are alternately arranged on opposite sides along the first direction.

[0063] The workpiece 11 is supported by an annular frame (not shown) via a tape (not shown) for ease of handling (transportation, holding, etc.). The frame is made of a metal such as SUS (stainless steel), and a circular opening is provided in the center of the frame, penetrating the frame in the thickness direction. The diameter of the opening is larger than the width of the workpiece 11 (typically, the diagonal line between the first surface 11a and the second surface 11b).

[0064] A circular tape is fixed to the workpiece 11 and the frame. For example, the tape includes a film-like substrate and an adhesive layer (glue layer) provided on the substrate. The substrate is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive. The adhesive layer may be made of an ultraviolet-curing resin that hardens when exposed to ultraviolet light. However, the tape may also be a thermocompression sheet that does not include an adhesive layer and can be thermocompression bonded to the workpiece 11 and the frame.

[0065] With the workpiece 11 placed inside the opening of the frame, the center of the tape is attached to the second surface 11b of the workpiece 11, and the outer periphery of the tape is attached to the frame. This allows the workpiece 11 to be supported by the frame via the tape, and a frame unit is formed in which the workpiece 11, frame, and tape are integrated. However, the workpiece 11 does not have to be supported by the frame.

[0066] The to-be-processed line 13 may or may not be exposed on the first surface 11a of the workpiece 11. In other words, the to-be-processed line 13 does not have to be visible to the operator, and does not have to be recognizable by the controller 54 through analysis of images acquired by the cameras 50a, 50b, etc.

[0067] Next, a part of the procedure for processing the workpiece 11 in the method for manufacturing a semiconductor device according to this embodiment will be described. Fig. 3 is a flowchart showing a part of the procedure for processing the workpiece 11 in the method for manufacturing a semiconductor device according to the first embodiment.

[0068] As shown in Figure 3, the manufacturing method of a semiconductor device according to this embodiment includes a step S1 of holding a workpiece, a step S2 of cutting the first group of processing lines 13a, 13c, and 13e, a step S3 of cutting the second group of processing lines 13h, 13j, and 13l, a step S4 of cutting the third group of processing lines 13b, 13d, and 13f, and a step S5 of cutting the fourth group of processing lines 13g, 13i, and 13k.

[0069] In the step (S1) of holding the workpiece 11, the workpiece 11 is held by the chuck table 12 (see FIG. 1). Specifically, the frame unit is placed on the chuck table 12 by a transport mechanism so that the tape attached to the workpiece 11 contacts the upper surface 16a of the holding plate 16 (see FIG. 1) of the chuck table 12. Note that the workpiece 11 may be transported to the chuck table 12 manually by an operator.

[0070] When the suction source is activated and the valve is opened, negative pressure from the suction source acts on the upper surface 16a of the holding plate 16 through a flow path, etc. As a result, the workpiece 11 is sucked and held by the chuck table 12 via the tape. In addition, the frame to which the tape is fixed is fixed by a clamp 18.

[0071] Next, the first group of processing lines 13a, 13c, and 13e are cut (S2). Figure 4 is a top view of the workpiece 11 after the first group of processing lines 13a, 13c, and 13e have been cut and processing marks 21a, 21c, and 21e have been formed. Note that in Figure 4, the processing feed direction is indicated by an arrow. When the first group of processing lines 13a, 13c, and 13e have been cut, the first group of processing marks 21a, 21c, and 21e are formed, as shown in Figure 4.

[0072] The specific operation of the cutting device 2 when cutting the first group of lines to be processed 13a, 13c, and 13e will be described. Note that, although the following describes how each line to be processed 13 is cut by the cutting unit 40a, each line to be processed 13 may also be cut by the cutting unit 40b.

[0073] First, a rotary drive source connected to the chuck table 12 rotates the chuck table 12 so that the first group of lines to be processed 13a, 13c, and 13e are parallel to the X1 axis. Next, the positional relationship between the cutting blade 44 (see FIG. 1) of the cutting unit 40a and the workpiece 11 is adjusted. Specifically, the position of the chuck table 12 in the direction along the X1 axis is adjusted by the chuck table moving mechanism 10 (see FIG. 1) so that the cutting blade 44 does not overlap the workpiece 11 when viewed from above.

[0074] In addition, the position of the cutting unit 40a in the direction along the Y1 axis is adjusted by the cutting unit moving mechanism 22 (see Figure 1) so that the position of one end of the processing line 13a (the end at the outer edge of the workpiece 11) coincides with the position of the cutting blade 44 in the direction along the Y1 axis.

[0075] Furthermore, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 (see Figure 1) so that the lower end of the cutting blade 44 is positioned slightly below the second surface 11b (i.e., the lower surface) of the workpiece 11.

[0076] Next, machining fluid is supplied from nozzle 48 (see FIG. 1) to the tip of cutting blade 44 and workpiece 11. Then, a motor (not shown), which is a rotation drive source, rotates cutting blade 44 together with a spindle (not shown), while chuck table moving mechanism 10 moves chuck table 12 along the X1 axis. As a result, cutting blade 44 and chuck table 12 move relatively along the X1 axis (machining feed).

[0077] As a result, while the machining fluid is being supplied to the cutting blade 44 and the workpiece 11, the cutting blade 44 cuts into the intended machining line 13a of the workpiece 11. By cutting the cutting blade 44 into the intended machining line 13a, machining marks 21a are formed that penetrate the workpiece 11 in the thickness direction along the intended machining line 13a.

[0078] For example, if the material of the workpiece 11 is silicon, the thickness of the workpiece 11 is 1000 μm, and the thickness of the tape is 250 μm, the cutting depth of the cutting blade 44 (the cutting depth set in the cutting device 2, the distance from the first surface 11a of the workpiece 11 to the tip of the cutting blade 44) is set to 1080 μm (the thickness of the workpiece 11 plus 80 μm), the feed speed (the speed at which the chuck table 12 is fed along the X1 axis) is set to 5 mm / sec, the spindle rotation speed is set to 30,000 rpm, and the supply amount of machining fluid is set to 4 L / min.

[0079] After the cutting blade 44 cuts from one end of the line to be processed 13a to the other end (the end in the region inside the outer edge of the workpiece 11) to form a processing mark 21a, the movement of the chuck table 12 along the X1 axis by the chuck table moving mechanism 10 stops. Thereafter, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 (see FIG. 1) so that the lower end of the cutting blade 44 is positioned a predetermined distance above the first surface 11a of the workpiece 11.

[0080] Next, the chuck table moving mechanism 10 moves the chuck table 12 along the X1 axis in the direction opposite to the processing feed direction. Specifically, the position of the chuck table 12 along the X1 axis is adjusted by the chuck table moving mechanism 10 so that the cutting blade 44 moves relatively to a position where it does not overlap the workpiece 11 when viewed from above.

[0081] Next, the position of the cutting unit 40a in the direction along the Y1 axis is adjusted by the cutting unit moving mechanism 22 so that the positions of one end of the processing line 13c (the end at the outer edge of the workpiece 11) and the cutting blade 44 in the direction along the Y1 axis coincide with each other.

[0082] Furthermore, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 so that the lower end of the cutting blade 44 is positioned slightly below the second surface 11b of the workpiece 11.

[0083] Then, in the same procedure as when cutting the planned processing line 13a, the cutting blade 44 cuts into the planned processing line 13c of the workpiece 11. By cutting the cutting blade 44 into the planned processing line 13c, a processing mark 21c (see FIG. 4) having a predetermined depth is formed in the planned processing line 13c.

[0084] After the machining marks 21c are formed, the movement of the chuck table 12 along the X1 axis by the chuck table moving mechanism 10 stops. Thereafter, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 (see FIG. 1) so that the lower end of the cutting blade 44 is positioned a predetermined distance above the first surface 11a of the workpiece 11.

[0085] Next, the chuck table moving mechanism 10 moves the chuck table 12 along the X1 axis in the direction opposite to the processing feed direction. Specifically, the position of the chuck table 12 along the X1 axis is adjusted by the chuck table moving mechanism 10 so that the cutting blade 44 moves relatively to a position where it does not overlap the workpiece 11 when viewed from above.

[0086] Next, the position of the cutting unit 40a in the direction along the Y1 axis is adjusted by the cutting unit moving mechanism 22 so that the positions of one end of the processing line 13e (the end at the outer edge of the workpiece 11) and the cutting blade 44 in the direction along the Y1 axis coincide with each other.

[0087] Furthermore, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 so that the lower end of the cutting blade 44 is positioned slightly below the second surface 11b of the workpiece 11.

[0088] Then, in the same procedure as when cutting the planned processing lines 13a and 13c, the cutting blade 44 cuts into the planned processing line 13e of the workpiece 11. By cutting the cutting blade 44 into the planned processing line 13e, a processing mark 21e (see FIG. 4) having a predetermined depth is formed in the planned processing line 13e.

[0089] After the machining marks 21e are formed, the movement of the chuck table 12 along the X1 axis by the chuck table moving mechanism 10 stops. Thereafter, the height of the cutting unit 40a is adjusted by the cutting unit moving mechanism 22 (see FIG. 1) so that the lower end of the cutting blade 44 is positioned a predetermined distance above the first surface 11a of the workpiece 11.

[0090] Furthermore, the chuck table moving mechanism 10 moves the chuck table 12 along the X1 axis in the direction opposite to the processing feed direction. Specifically, the position of the chuck table 12 along the X1 axis is adjusted by the chuck table moving mechanism 10 so that the cutting blade 44 moves relatively to a position where it does not overlap with the workpiece 11 when viewed from above.

[0091] 4, one end of the first group of machining marks 21a, 21c, 21e exists on the outer edge of the workpiece 11, and one side portion of the first group of machining marks 21a, 21c, 21e cuts out the outer edge of the workpiece 11. On the other hand, the other end of the first group of machining marks 21a, 21c, 21e exists in a region inside the outer edge of the workpiece 11, and the other side portion of the first group of machining marks 21a, 21c, 21e does not cut out the outer edge of the workpiece 11.

[0092] Next, the second group of processing lines 13h, 13j, and 13l are cut (S3). Figure 5 is a top view of the workpiece 11 after the second group of processing lines 13h, 13j, and 13l have been cut and processing marks 21h, 21j, and 21l have been formed. Note that the processing feed direction is also indicated by an arrow in Figure 5. When the second group of processing lines 13h, 13j, and 13l have been cut, the second group of processing marks 21h, 21j, and 21l are formed, as shown in Figure 5.

[0093] The specific operation of the cutting device 2 when cutting the second group of processing lines 13h, 13j, and 13l will be described. After the first group of processing lines 13a, 13c, and 13e have been cut, the chuck table 12 holding the workpiece 11 rotates 90 degrees around a rotation axis approximately parallel to the Z1 axis (see FIG. 1) by the rotational driving force applied by the rotational driving source.

[0094] Specifically, the chuck table 12 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 4 toward Fig. 4 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the second group of lines to be processed 13h, 13j, and 13l are cut using the same procedure as when cutting the first group of lines to be processed 13a, 13c, and 13e (S2).

[0095] 5, one end of the second group of machining marks 21h, 21j, 21l is present on the outer edge of the workpiece 11, and one side portion of the second group of machining marks 21h, 21j, 21l cuts out the outer edge of the workpiece 11. On the other hand, the other end of the second group of machining marks 21h, 21j, 21l is present in an area more inward than the outer edge of the workpiece 11, and the other side portion of the second group of machining marks 21h, 21j, 21l does not cut out the outer edge of the workpiece 11.

[0096] Next, a third group of processing lines 13b, 13d, and 13f are cut along the first direction (S4). Figure 6 is a top view of the workpiece 11 after the third group of processing lines 13b, 13d, and 13f have been cut and processing marks 21b, 21d, and 21f have been formed. Note that the processing feed direction is also indicated by an arrow in Figure 6. When the third group of processing lines 13b, 13d, and 13f have been cut, the third group of processing marks 21b, 21d, and 21f are formed, as shown in Figure 6.

[0097] The specific operation of the cutting device when cutting the third group of processing lines 13b, 13d, and 13f will be described. After the third group of processing lines 13b, 13d, and 13f have been cut, the chuck table 12 holding the workpiece 11 is rotated 90 degrees around a rotation axis approximately parallel to the Z1 axis (see FIG. 1) by the rotational driving force applied by the rotational driving source.

[0098] Specifically, the chuck table 12 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 5 toward Fig. 5 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the third group of planned processing lines 13b, 13d, and 13f are cut using the same procedure as when cutting the first group of planned processing lines 13a, 13c, and 13e (S2).

[0099] 6, one end of the third group of machining marks 21b, 21d, 21f exists on the outer edge of the workpiece 11, and one end of the third group of machining marks 21b, 21d, 21f cuts out the outer edge of the workpiece 11. On the other hand, the other end of the third group of machining marks 21b, 21d, 21f exists in a region more inward than the outer edge of the workpiece 11, and the other end of the third group of machining marks 21b, 21d, 21f does not cut out the outer edge of the workpiece 11.

[0100] Next, a fourth group of processing lines 13g, 13i, and 13k along the second direction are cut (S5). Figure 7 is a top view of the workpiece 11 after the fourth group of processing lines 13g, 13i, and 13k have been cut and processing marks (processing marks) 21g, 21i, and 21k have been formed. Note that the processing feed direction is also indicated by an arrow in Figure 7. When the fourth group of processing lines 13g, 13i, and 13k have been cut, the fourth group of processing marks 21g, 21i, and 21k are formed, as shown in Figure 7.

[0101] The specific operation of the cutting device when cutting the fourth group of processing lines 13g, 13i, and 13k will be described. After the fourth group of processing lines 13g, 13i, and 13k have been cut, the chuck table 12 holding the workpiece 11 is rotated 90 degrees around a rotation axis approximately parallel to the Z1 axis (see FIG. 1) by the rotational driving force applied by the rotational driving source.

[0102] Specifically, the chuck table 12 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 6 toward Fig. 6 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the fourth group of planned processing lines 13g, 13i, and 13k are cut using the same procedure as when cutting the first group of planned processing lines 13a, 13c, and 13e (S2).

[0103] 7, one end of the fourth group of machining marks 21g, 21i, 21k exists on the outer edge of the workpiece 11, and one end of the fourth group of machining marks 21g, 21i, 21k cuts out the outer edge of the workpiece 11. On the other hand, the other end of the fourth group of machining marks 21g, 21i, 21k exists in a region inside the outer edge of the workpiece 11, and the other end of the fourth group of machining marks 21g, 21i, 21k does not cut out the outer edge of the workpiece 11.

[0104] Through the above steps, cutting by the cutting device 2 is completed, and the workpiece 11 is divided along all of the planned processing lines 13. This results in the formation of multiple chips having shapes and sizes corresponding to the chip sections 15. The excess areas 19 then become waste chips 23.

[0105] In this embodiment, since neither end of each machining mark 21 cuts through the outer edge of the workpiece 11, the scrap chips 23 are larger than when both ends of each machining mark 21 cut through the outer edge. For example, length I, which corresponds to the length of the scrap chip 23 shown in Figure 7, is 10.2 mm, and length II, which corresponds to the length of another scrap chip 23, is 8.3 mm. The width of each machining mark 21 is 0.2 mm.

[0106] Fig. 8 is a top view of the workpiece after the intended processing line according to the comparative example has been cut and processing marks have been formed. Both ends of the processing marks 31a to 31l shown in Fig. 8 cut out the outer edge of the workpiece 11. The length III corresponding to the length of the scrap chip 33 shown in Fig. 8 is 3 mm, the length IV corresponding to the length of another scrap chip 33 is 7 mm, and the length V corresponding to the length of yet another scrap chip 33 is 1.1 mm. The width of each processing mark 31 is 0.2 mm, the same as each processing mark 21.

[0107] 7 and 8, according to this embodiment, the scrap chips 23 are larger than when both ends of the planned processing line 13 are set on the outer edges of the workpiece 11. Specifically, the size of the scrap chips 23 in this embodiment is the sum of the sizes (and the width of the processing marks) of two adjacent scrap chips 33 obtained when both ends are set on the outer edges of the workpiece 11.

[0108] The workpiece 11 on which the machining marks 21 were formed by the above-described procedure was checked for the occurrence of chip flying during cleaning by the cleaning unit 52 (see FIG. 1). Specifically, the workpiece 11 cut along the intended processing lines 13a to 13l as described above was placed on the spinner table of the cleaning unit 52 by a transport mechanism.

[0109] Next, while the spinner table was rotating, pure water (cleaning liquid) was supplied from a nozzle to the first surface 11a of the workpiece 11. The cleaning conditions were as follows: the rotation speed of the spinner table was set to 800 rpm, the supply rate of pure water supplied from the nozzle was set to 0.2 L / min, and the cleaning time was set to 1 minute. After cleaning was completed, the workpiece 11 was removed from the cleaning unit 52.

[0110] Next, the operator visually inspected the workpiece 11 to check whether chipping had occurred at the outer edge of the workpiece 11. In the workpiece 11 on which the processing marks 21 had been formed by the above-described procedure, none of the offcut chips 23 located at the outer edge of the workpiece 11 had come off the tape holding the workpiece 11, and no chipping had occurred.

[0111] The small scrap chips 23 located closer to the center than the outer edge of the workpiece 11 are surrounded by chip compartments 15 and the relatively large scrap chips 23. For this reason, the scrap chips 23 located closer to the center than the outer edge of the workpiece 11 are less likely to fly off than the scrap chips 23 located on the outer edge of the workpiece 11.

[0112] As a comparative example, a workpiece 11 on which a machining mark 31 shown in Fig. 8 was formed was cleaned under the same conditions as above, and the presence or absence of chipping at the outer edge of the workpiece 11 was inspected. This inspection was carried out on a plurality of workpieces 11 on which a machining mark 31 was formed.

[0113] As a result of the inspection, it was found that the number of scrap chips 33 located on the outer edge of the workpiece 11 was between 14% and 28%. This is thought to be because the size of the scrap chips 33 located on the outer edge of the workpiece 11 was smaller than the size of the scrap chips 23 located on the outer edge of the workpiece 11.

[0114] In this way, in the semiconductor device manufacturing method according to this embodiment, for example, when cleaning the workpiece 11, flying chips do not occur at the outer edge of the workpiece 11, and therefore the first surface 11a of the workpiece 11 is not damaged. In addition, flying scrap chips do not damage the cleaning unit 52.

[0115] In the above-described embodiment, machining marks 21 penetrating the workpiece 11 in the thickness direction are formed by cutting, but machining marks having a depth smaller than the thickness of the workpiece 11 may be formed on the first surface 11a of the workpiece 11. In this case, the workpiece 11 can be divided along the intended machining line by grinding the workpiece 11 from the second surface 11b side after the machining marks have been formed.

[0116] Furthermore, after the workpiece 11 has been cut on the intended processing line by the cutting device 2, burrs on the workpiece 11 may be removed by spraying a water jet onto the workpiece 11. When spraying a water jet onto the workpiece 11, even if just one offcut chip flies off due to chipping, there is a high possibility that the tape constituting the frame unit or the workpiece 11 will be damaged.

[0117] According to this embodiment, as described above, cleaning of the workpiece 11 does not result in any chips flying off. Therefore, in the workpiece 11 processed according to this embodiment, even when deburring using a water jet, the occurrence of chips flying off is significantly reduced compared to the workpiece 11 processed by the conventional method. Therefore, even when deburring using a water jet is performed, the possibility of damaging the workpiece 11 or the tape is extremely low.

[0118] In this embodiment, the cutting blade 44 cuts into the workpiece 11 in a direction from the end at the outer edge of the workpiece 11 of the line 13 to be processed to the end in an area more inward than the outer edge of the workpiece 11 of the line 13 to be processed, but the manner in which the cutting blade 44 cuts into the workpiece 11 is not limited to this.

[0119] For example, the cutting blade 44 may cut into the workpiece 11 from an end portion of the workpiece 11 located in a region on the inside of the outer edge of the line 13 to be processed toward an end portion of the workpiece 11 located in the outer edge of the line 13 to be processed. In this case, the cutting blade 44 is lowered from above the workpiece 11 toward the end portion of the region on the inside of the outer edge, and after the cutting blade 44 has cut into the workpiece 11 from above, the chuck table 12 is moved along the X1 axis.

[0120] Next, a second embodiment of the present invention will be described. In the first embodiment described above, a plurality of semiconductor devices (chips) are manufactured by cutting the workpiece 11 along the planned processing line 13. In contrast, in the second embodiment, a laser beam is irradiated along the planned processing line 13 to divide the workpiece 11, thereby manufacturing a plurality of semiconductor devices.

[0121] Fig. 9 is a perspective view of a laser processing apparatus 60 used in a semiconductor manufacturing method according to the second embodiment. Note that in Fig. 9, some components are expressed as functional blocks. Also, the X2 axis (processing feed axis), Y2 axis (indexing feed axis), and Z2 axis (vertical axis) used in the following description are perpendicular to one another.

[0122] 9, the laser processing apparatus 60 includes a base 62 that supports various components that make up the laser processing apparatus 60. The upper surface of the base 62 is a flat surface that is roughly parallel to the horizontal plane (X2-Y2 plane), and a movement mechanism (movement unit) 64 is disposed on the upper surface of the base 62. The movement mechanism 64 includes a Y2-axis movement mechanism 66 and an X2-axis movement mechanism 76.

[0123] The Y2-axis movement mechanism 66 includes a pair of Y2-axis guide rails 68 arranged along the Y2 axis. A flat Y2-axis movement table 70 is mounted on the pair of Y2-axis guide rails 68 so as to be slidable along the Y2-axis guide rails 68.

[0124] A nut portion (not shown) is provided on the rear surface (lower surface) side of the Y2-axis moving table 70. A Y2-axis ball screw 72, which is disposed along the Y2 axis between a pair of Y2-axis guide rails 68, is threadedly engaged with this nut portion. A Y2-axis pulse motor 74, which rotates the Y2-axis ball screw 72, is connected to an end of the Y2-axis ball screw 72. When the Y2-axis pulse motor 74 rotates the Y2-axis ball screw 72, the Y2-axis moving table 70 moves along the Y2-axis guide rails 68, i.e., along the Y2 axis.

[0125] The X2-axis movement mechanism 76 includes a pair of X2-axis guide rails 78 arranged along the X2 axis on the front (upper) surface side of the Y2-axis movement table 70. A flat X2-axis movement table 80 is mounted on the pair of X2-axis guide rails 78 so as to be slidable along the X2-axis guide rails 78.

[0126] A nut portion (not shown) is provided on the rear surface (lower surface) side of the X2-axis moving table 80. An X2-axis ball screw 82, which is disposed along the X2 axis between a pair of X2-axis guide rails 78, is threadedly engaged with this nut portion. An X2-axis pulse motor 84, which rotates the X2-axis ball screw 82, is connected to an end of the X2-axis ball screw 82. When the X2-axis pulse motor 84 rotates the X2-axis ball screw 82, the X2-axis moving table 80 moves along the X2-axis guide rails 78, i.e., along the X2 axis.

[0127] A chuck table 86 is supported on the moving mechanism 64. The chuck table 86 holds the frame unit having the workpiece 11, frame, and tape described above. However, the workpiece 11 does not have to be held by a frame.

[0128] 9, the upper surface (holding surface) 86a of the chuck table 86 is a flat surface that is roughly parallel to the horizontal plane (X2-Y2 plane) and constitutes the upper surface 86a that holds the frame unit. The upper surface 86a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), and the like formed inside the chuck table 86. In addition, a plurality of clamps 88 that grip and fix the frame are provided around the periphery of the chuck table 86.

[0129] When the Y2-axis moving table 70 is moved along the Y2 axis, the chuck table 86 is moved along the Y2 axis. When the X2-axis moving table 80 is moved along the X2 axis, the chuck table 86 is moved along the X2 axis. Furthermore, a rotation drive source (not shown), such as a motor, is connected to the chuck table 86 to rotate the chuck table 86 about a rotation axis that is generally parallel to the Z2 axis.

[0130] A rectangular parallelepiped support structure 90 is provided at the rear end of the base 62 (rear of the movement mechanism 64). The support structure 90 is formed so as to protrude upward from the upper surface of the base 62, and the surface (front surface) of the support structure 90 is disposed along the X2-Z2 plane. A columnar support member 92 protruding forward from the front surface of the support structure 90 is connected to the support structure 90.

[0131] The laser processing device 60 is equipped with a processing unit (laser irradiation unit) 94 that irradiates a laser beam onto the workpiece 11. The laser irradiation unit 94 includes a laser oscillator (not shown). The laser oscillator includes a laser medium such as Nd:YAG that is suitable for laser oscillation.

[0132] The laser irradiation unit 94 also includes a processing head (laser processing head) 96 attached to the tip of the support member 92. The laser irradiation unit 94 also includes a deflector and a condenser that guide a laser beam generated by laser oscillation of the laser oscillator to the processing head 96. The laser beam generated by the laser oscillator is irradiated onto the workpiece 11 held by the chuck table 86 via the deflector, condenser, and processing head 96, thereby subjecting the workpiece 11 to laser processing.

[0133] The support member 92 may be connected to the support structure 90 via a Z2-axis movement mechanism (not shown) that moves the support member 92 along the Z2 axis. For example, a ball screw-type movement mechanism equipped with a ball screw is installed as the Z2-axis movement mechanism on the front side of the support structure 90. In this case, the height position of the focal point of the laser beam irradiated from the processing head 96 is adjusted by moving (raising and lowering) the support member 92 along the Z2 axis with the Z2-axis movement mechanism.

[0134] The laser processing apparatus 60 also includes a controller 98 that controls each part of the laser processing apparatus 60. The controller 98 is connected to each component (such as the moving mechanism 64, the chuck table 86, and the laser irradiation unit 94) that make up the laser processing apparatus 60. The operation of each component is controlled by the controller 98. The laser processing apparatus 60 includes the controller 98, a processing device 98a, and a storage device 98b. The processing device 98a and the storage device 98b are similar to the processing device 54a and the storage device 54b that the controller 54 of the cutting apparatus 2 has.

[0135] Next, a semiconductor manufacturing method according to this embodiment will be described. First, a frame unit including the workpiece 11 is held by the chuck table 86. Specifically, the frame unit is placed on the chuck table 86 by a transport mechanism so that the tape attached to the workpiece 11 contacts the upper surface 86a of the chuck table 86. Note that the workpiece 11 may also be transported to the chuck table 12 manually by an operator.

[0136] Next, the laser beam is irradiated onto the first group of lines to be processed 13a, 13c, and 13e. Specifically, first, the rotary drive source connected to the chuck table 86 rotates the chuck table 86 so that the lines to be processed 13a, 13c, and 13e are parallel to the X2 axis.

[0137] Next, the positional relationship between the processing head 96 of the laser irradiation unit 94 and the workpiece 11 is adjusted. Specifically, the position of the chuck table 86 in the direction along the X2 axis is adjusted by the X2-axis movement mechanism 76 so that the laser irradiation unit 94 does not overlap the workpiece 11 when viewed from above.

[0138] Furthermore, the position of the laser irradiation unit 94 in the direction along the Y2 axis is adjusted by the Y2-axis moving mechanism 66 so that the position of one end of the line to be processed 13a (the end on the outer edge of the workpiece 11) coincides with the position of the laser irradiation unit 94 in the direction along the Y2 axis. Then, emission of the laser beam from the processing head 96 begins.

[0139] Next, with the position of the focal point of the laser beam adjusted to a height position approximately the same as that of the workpiece 11, the X2-axis moving table 80 is moved along the X2 axis by the X2-axis moving mechanism 76. As a result, the laser beam is irradiated onto the line to be processed 13a on the workpiece 11. Then, the laser beam ablates the workpiece 11 along the line to be processed 13a, and a processing mark penetrating the workpiece 11 is formed on the workpiece 11.

[0140] When the material of the workpiece 11 is silicon, for example, the wavelength of the laser beam is set to 266 nm or more and 1100 nm or less, typically 355 nm. The average power of the laser beam is set to 0.2 W or more and 5 W or less, typically 1.5 W. The repetition frequency of the laser beam is set to 30 kHz or more and 200 kHz or less, typically 80 kHz.

[0141] The pulse width of the laser beam is set to 1 ns or more and 300 ns or less, typically 5 ns. The focal length of the condenser lens is set to 90 mm or more and 300 mm or less, typically 100 mm. The diameter (spot diameter) of the laser beam on the workpiece 11 is set to 10 μm or more and 50 μm or less, typically 15 μm.

[0142] After the laser beam is irradiated from one end of the line to be processed 13a to the other end (the end in the region inside the outer edge of the workpiece 11) and a processing mark is formed, the movement of the chuck table 86 along the X2 axis by the X2-axis moving mechanism 76 stops. Also, the emission of the laser beam from the processing head 96 stops.

[0143] Next, the X2-axis movement mechanism 76 moves the chuck table 86 along the X2 axis in the direction opposite to the direction in which the machining marks are formed (the machining feed direction). Specifically, the position of the chuck table 86 in the direction along the X2 axis is adjusted by the X2-axis movement mechanism 76 so that the laser irradiation unit 94 moves relatively to a position where it does not overlap with the workpiece 11 when viewed from above.

[0144] Next, the position of the chuck table 86 along the Y2 axis is adjusted by the Y2 axis moving mechanism 66 so that the positions of one end of the processing line 13c (the end on the outer edge of the workpiece 11) and the laser irradiation unit 94 along the Y2 axis coincide with each other.

[0145] Then, the laser beam is irradiated onto the line to be processed 13c in the same procedure as when the laser beam is irradiated onto the line to be processed 13a. As a result, a processing mark penetrating the workpiece 11 is formed on the line to be processed 13c. After the processing mark is formed, the movement of the chuck table 86 along the X2 axis by the X2-axis moving mechanism 76 stops. In addition, the emission of the laser beam from the processing head 96 stops.

[0146] Next, the X2-axis movement mechanism 76 moves the chuck table 86 along the X2 axis in the direction opposite to the processing feed direction. Specifically, the position of the chuck table 86 in the direction along the X2 axis is adjusted by the X2-axis movement mechanism 76 so that the laser irradiation unit 94 moves relatively to a position where it does not overlap with the workpiece 11 when viewed from above.

[0147] Next, the position of the chuck table 86 along the Y2 axis is adjusted by the Y2 axis moving mechanism 66 so that the positions of one end of the processing line 13e (the end on the outer edge of the workpiece 11) and the laser irradiation unit 94 along the Y2 axis coincide with each other.

[0148] Then, the laser beam is irradiated onto the line to be processed 13e in the same procedure as when the laser beam is irradiated onto the line to be processed 13a, thereby forming a processing mark penetrating the workpiece 11 on the line to be processed 13e.

[0149] After the processing marks are formed on the line to be processed 13e, the movement of the chuck table 86 along the X2 axis by the X2-axis moving mechanism 76 stops. Also, the emission of the laser beam from the processing head 96 stops.

[0150] Thereafter, the X2-axis movement mechanism 76 moves the chuck table 86 along the X2 axis in the direction opposite to the processing feed direction. Specifically, the position of the chuck table 86 in the direction along the X2 axis is adjusted by the X2-axis movement mechanism 76 so that the laser irradiation unit 94 moves relatively to a position where it does not overlap with the workpiece 11 when viewed from above.

[0151] Next, the laser beam is irradiated onto the second group of lines to be processed 13h, 13j, and 13l. Specifically, after the first group of lines to be processed 13a, 13c, and 13e are irradiated with the laser beam, the chuck table 86 that holds the workpiece 11 is rotated 90 degrees around a rotation axis that is approximately parallel to the Z2 axis by the rotational driving force applied by the rotational driving source.

[0152] Specifically, the chuck table 86 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 4 toward Fig. 4 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the laser beam is irradiated onto the second group of lines to be processed 13h, 13j, 13j in the same procedure as when the laser beam is irradiated onto the first group of lines to be processed 13a, 13c, 13e.

[0153] Next, the laser beam is irradiated onto the third group of lines to be processed 13b, 13d, and 13f. Specifically, after the second group of lines to be processed 13h, 13j, and 13l are irradiated with the laser beam, the chuck table 86 that holds the workpiece 11 is rotated 90 degrees around a rotation axis that is approximately parallel to the Z2 axis by the rotational driving force applied by the rotational driving source.

[0154] Specifically, the chuck table 86 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 5 toward Fig. 5 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the laser beam is irradiated onto the third group of lines to be processed 13h, 13j, and 13l in the same procedure as when the first group of lines to be processed 13a, 13c, and 13e are irradiated with the laser beam.

[0155] Next, the laser beam is irradiated onto the fourth group of lines to be processed 13g, 13i, and 13k. Specifically, after the third group of lines to be processed 13h, 13j, and 13l are irradiated with the laser beam, the chuck table 86 that holds the workpiece 11 is rotated 90 degrees around a rotation axis that is approximately parallel to the Z2 axis by the rotational driving force applied by the rotational driving source.

[0156] Specifically, the chuck table 86 rotates so that the orientation of the workpiece 11 rotates 90 degrees clockwise from the state shown in Fig. 6 toward Fig. 6 (that is, when the workpiece 11 is viewed from the first surface 11a side). Thereafter, the laser beam is irradiated onto the fourth group of lines to be processed 13g, 13i, and 13k in the same procedure as when the first group of lines to be processed 13a, 13c, and 13e are irradiated with the laser beam.

[0157] Through the above steps, the irradiation of the laser beam by the laser processing device 60 is completed. As in the first embodiment (see FIG. 7), the irradiation of the laser beam by the laser processing device 60 divides the workpiece 11 along all of the intended processing lines 13. As a result, a plurality of chips having shapes and sizes corresponding to the chip sections 15 are formed. The excess area 19 becomes the waste chip 23. In this embodiment, as in the first embodiment, since neither end of each processing mark 21 cuts out the outer edge of the workpiece 11, the waste chip 23 is larger than when both ends of each processing mark 21 cut out the outer edge.

[0158] In this embodiment, a portion of the workpiece 11 is removed along the intended processing line 13 by ablation processing using a laser beam with a wavelength that is absorbed by the workpiece 11, but the workpiece 11 may also be modified along the intended processing line 13 by a laser beam with a wavelength that passes through the workpiece 11.

[0159] In this case, after forming a modified layer as a processing mark on the workpiece 11 along the planned processing line 13, the tape attached to the workpiece 11 is expanded, thereby dividing the workpiece 11 starting from the modified layer. Alternatively, after forming a modified layer on the workpiece 11 along the planned processing line 13, the workpiece 11 is ground from the second surface 11b side, thereby dividing the workpiece 11 starting from the modified layer.

[0160] Alternatively, a laser beam may be irradiated onto the first surface 11a of the workpiece 11, and a machining mark having a depth smaller than the thickness of the workpiece 11 may be formed on the first surface 11a of the workpiece 11. In this case, the second surface 11b of the workpiece 11 after the machining mark is formed may be ground to divide the workpiece 11 along the intended machining line.

[0161] In addition, in this embodiment, the laser beam is irradiated onto the workpiece 11 in a direction from an end portion at the outer edge of the workpiece 11 along the line 13 to be processed to an end portion at a region more inward than the outer edge of the workpiece 11 along the line 13 to be processed, but the manner in which the laser beam is irradiated onto the workpiece 11 is not limited to this.

[0162] For example, the laser beam may be irradiated onto the workpiece 11 from an end portion of the line 13 that is located inside the outer edge of the workpiece 11 toward an end portion of the line 13 that is located at the outer edge of the workpiece 11. In the method of processing using a laser beam, changes in processing quality due to the processing direction (processing feed direction) are unlikely to occur, and the method of processing using a laser beam offers a high degree of freedom regarding the processing direction.

[0163] As explained above, in the semiconductor device manufacturing method according to each embodiment and each modification, a plurality of parallel processing lines 13 are set, each having ends in an area inside the outer edge of the workpiece 11 and at the outer edge of the workpiece 11. In any two adjacent processing lines 13, the end inside the outer edge and the end at the outer edge are not located on the same side. This allows large-sized waste chips 23 to be formed on both sides of the processing line 13.

[0164] The present invention is not limited by the description of the above-described embodiments and modifications, and can be implemented in various modifications. For example, in the above-described embodiments and modifications, two processing lines 13 are set between two adjacent chip sections 15. However, even if one processing line 13 is set between two adjacent chip sections 15, the present invention is useful in that large scrap chips can be formed. In this case, scrap chips are formed only on the outer edge of the workpiece 11.

[0165] Furthermore, in each of the above-described embodiments and modifications, the workpiece 11 is repeatedly rotated 90 degrees clockwise, so that the workpiece 11 is processed in the order of the first group of processing lines 13, the second group of processing lines 13, the third group of processing lines 13, and the fourth group of processing lines 13, but the processing order is not limited to this. For example, after the workpiece 11 is processed in the first group of processing lines 13, the workpiece 11 may be rotated 180 degrees and processed in the third group of processing lines 13.

[0166] The structures, methods, and the like according to the above-described embodiments and modifications may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0167] 11: Workpiece 11a: 1st page 11b: 2nd side 13: Processing line 13a, 13c, 13e: Processing lines for the first group 13h, 13j, 13l: Processing lines for the second group 13b, 13d, 13f: Processing lines for the third group 13g, 13i, 13k: Processing lines planned for the 4th group 15: Chip section 17: Device 19: Excess area 21: Machining marks 21a, 21c, 21e: Processing marks of the first group 21h, 21j, 21l: Processing marks of the second group 21b, 21d, 21f: Processing marks of the third group 21g, 21i, 21k: 4th group machining marks 23: Scrap wood chips 31, 31a, 31b, 31c, 31d, 31d, 31e, 31f, 31g, 31h, 31i, 31j, 31k, 31l: Machining marks 33: Scrap wood chips 2:Cutting device 4: Base 4a, 4b, 4c: opening 6: Cassette table 8: Cassette 10: Chuck table moving mechanism (processing feed mechanism) 10a: Table cover 10b: Dustproof and water-resistant cover 12: Chuck table 14:Frame body 16: Holding plate 16a:Top surface (holding surface) 18: Clamp 20:Support structure 22a: Cutting unit movement mechanism (indexing feed mechanism, cutting feed mechanism) 22b: Cutting unit movement mechanism (indexing feed mechanism, cutting feed mechanism) 24: Y1 axis guide rail 26: Y1 axis moving plate 28: Screw shaft 30: Rotation drive source 32: Z1 axis guide rail 34: Z1 axis moving plate 36: Screw shaft 38: Rotation drive source 40a: Cutting unit 40b: Cutting unit 42: Spindle housing 44: Cutting blade 46: Cover 48: Nozzle 50a: Camera 50b: Camera 52: Cleaning unit 54: Controller 54a: Processing device 54b: Storage device 60: Laser processing equipment 62: Foundation 64: Mobile unit (mobile mechanism) 66: Y2 axis movement mechanism 68: Y2 axis guide rail 70: Y2 axis moving table 72: Y2 axis ball screw 74: Y2 axis pulse motor 76:X2 axis movement mechanism 78: X2 axis guide rail 80: X2 axis moving table 82: X2 axis ball screw 84: X2 axis pulse motor 86: Chuck table 86a:Top surface (holding surface) 88: Clamp 90:Support structure 92: Support member 94: Laser irradiation unit 96: Controller 96a: Processing device 96b: Storage device

Claims

1. A method for manufacturing a semiconductor device by dividing a workpiece into a plurality of semiconductor devices, a first processing step of processing the workpiece along a first planned processing line set along the surface of the workpiece; a second processing step of processing the workpiece along a second processing line that is set along the surface and is parallel to and adjacent to the first processing line; a third processing step of processing the workpiece along a third processing line that is set along the surface, parallel to the first processing line, and adjacent to the second processing line; a fourth processing step of processing the workpiece along a fourth processing line that is set along the surface and intersects with the first processing line, the second processing line, and the third processing line; an end of the first planned processing line located on one side along a first direction parallel to the first planned processing line is in a region inside the outer edge of the workpiece, and an end of the first planned processing line located on the other side along the first direction is at the outer edge; an end of the second planned processing line located on one side along the first direction is at the outer edge, and an end of the second planned processing line located on the other side along the first direction is in a region inside the outer edge; A method for manufacturing a semiconductor device, wherein the end of the third processing line located on one side along the first direction is in an area inside the outer edge, and the end of the third processing line located on the other side along the first direction is at the outer edge.

2. a fifth processing step of processing the workpiece along a fifth processing line that is set along the surface and is parallel to and adjacent to the fourth processing line; A sixth processing step of processing the workpiece along a sixth processing line that is set along the surface and is parallel to and adjacent to the fifth processing line, an end of the fourth planned processing line located on one side along a second direction parallel to the fourth planned processing line is in an area inside the outer edge, and an end of the fourth planned processing line located on the other side along the second direction is at the outer edge; an end of the fifth processing line located on one side along the second direction is at the outer edge, and an end of the fifth processing line located on the other side along the second direction is in a region inside the outer edge; 2. A method for manufacturing a semiconductor device as described in claim 1, wherein an end of the sixth processing line located on one side along the second direction is in an area inside the outer edge, and an end of the sixth processing line located on the other side along the second direction is at the outer edge.

3. The workpiece is divided into a plurality of division-planned sections by intermediate excess areas, 2. The method for manufacturing a semiconductor device according to claim 1, wherein the first processing line, the second processing line, the third processing line, and the fourth processing line are set along the boundary between the intermediate excess area and the division-planned section.

4. 2. The method for manufacturing a semiconductor device according to claim 1, wherein in the first processing step, the second processing step, and the third processing step, the workpiece is cut by rotating an annular cutting blade and cutting the first processing line, the second processing line, and the third processing line into the workpiece, respectively.

5. In the first processing step, the cutting blade is caused to cut into the workpiece from the end of the first planned processing line located on the other side along the first direction, thereby cutting the workpiece along the first planned processing line; In the second processing step, the cutting blade is caused to cut into the workpiece from the end of the second planned processing line located on one side along the first direction, thereby cutting the workpiece along the second planned processing line; 5. A method for manufacturing a semiconductor device as described in claim 4, wherein in the third processing step, the workpiece is cut along the third planned processing line by cutting the cutting blade into the workpiece from the end of the third planned processing line located on the other side along the first direction.

6. 2. The method for manufacturing a semiconductor device according to claim 1, wherein in the first processing step, the second processing step, and the third processing step, a laser beam is irradiated onto the first processing line, the second processing line, and the third processing line of the workpiece, respectively.

Images