Tape attaching device, sticking method, and manufacturing method of chip

Abstract

To preferably attach an adhesive tape attached to a frame to an object.SOLUTION: A tape attaching device includes a holding table that holds an object, a frame table that supports a frame so as to face the object, an attaching operation body that is configured to sandwich an adhesive tape held by the frame between the frame and the object and press the adhesive tape against the object, and an attaching movement mechanism that performs an attaching operation of relatively moving the attaching operation body and the holding table along a direction intersecting a direction of a pressing force by the attaching operation body. The frame table is configured to support the frame in a non-parallel state during the attaching operation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an apparatus and method for adhering an adhesive tape adhered to a frame to an object, and to a method for manufacturing a chip using the adhering method. [Background technology]

[0002] In the manufacturing process of device chips, objects such as semiconductor wafers and package substrates are sometimes handled while attached to adhesive tape. For example, when cutting a semiconductor wafer, the object, which is the semiconductor wafer, is attached to adhesive tape, and the adhesive tape is attached to a ring-shaped frame called a ring frame, forming a frame unit. The object is then carried into a processing device and subjected to processing such as cutting.

[0003] The frame unit is formed, for example, by the following procedure. First, a circular adhesive tape is attached to a ring frame. The peripheral edge of the adhesive tape adheres to the ring frame, but the adhesive surface of the adhesive tape is exposed at the central opening of the ring frame. An object, such as a disk-shaped semiconductor wafer, is attached to the adhesive surface exposed at the opening. For the attachment operation, for example, a roller is used, and the adhesive tape is pressed against the ring frame or object so that it is sandwiched between the roller and the ring frame or object.

[0004] Examples of documents that describe techniques relating to the application of adhesive tape to such ring frames and objects include Patent Documents 1 and 2.

[0005] When applying adhesive tape to an object using the procedure described above, the adhesive tape held by the ring frame is pressed against the object with a roller, but at this time, the portion of the adhesive surface of the adhesive tape that is not pressed by the roller (the portion of the adhesive surface that is exposed at the central opening of the ring frame and will be applied to the object that the roller does not reach) may come into contact with and stick to the object. As a result, air bubbles may get trapped between the adhesive tape and the object, or the adhesive tape may wrinkle, resulting in the formation of a frame unit with uneven adhesion between the two. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-86687 [Patent Document 2] Patent Publication No. 2021-68817 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a tape application device and application method, and a chip manufacturing method, that can suitably apply adhesive tape applied to a frame to an object. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a tape application device comprising: a holding table for holding an object; a frame table for supporting a frame that holds an adhesive tape to be adhered to the object so as to surround the adhesive surface of the tape on the object, with the adhesive surface of the adhesive tape facing the object held on the holding table; an application body configured to sandwich the adhesive tape held by the frame between the object held on the holding table and the adhesive tape, and press the adhesive tape against the object; and an application movement mechanism that performs an application operation by moving the application body and the holding table relatively in a direction that intersects with the direction of the pressing force applied by the application body, wherein the frame table is configured to support the frame in a non-parallel state during the application operation, such that the distance between the adhesive tape and the object in the front in the direction of movement of the application body relative to the holding table is greater than the distance between the adhesive tape and the object in the rear in the direction of movement of the application body relative to the holding table.

[0009] Preferably, the frame table is provided with a biasing section that biases at least the portion of the frame supported on the frame table that is forward in the direction of movement of the sticking action body relative to the holding base during the sticking operation, in a direction away from the object held on the holding base, and the biasing section is configured so that, during the sticking operation, the pressing force of the sticking action body pressing the frame against the object causes the portion of the frame that is forward in the direction of movement of the sticking action body relative to the holding base to move in a direction toward the object.

[0010] Preferably, the apparatus further comprises a retraction movement mechanism for relatively moving the holder and the frame table in a direction intersecting a plane of relative movement of the adhering body with respect to the holder during the adhering operation.

[0011] Preferably, the apparatus further comprises a heating section for heating both or one of the adhering body and the holder.

[0012] According to another aspect of the present invention, there are provided a frame adhering step of adhering an adhesive tape to be adhered to an object to a frame that holds the object so as to surround the adhesive surface of the tape; an object holding step of holding the object on a holding stand; a frame supporting step of supporting the frame in a position where, when the object is held on the holding stand and the adhesive tape is held on the frame, the adhesive surface of the adhesive tape faces the object held on the holding stand; and a frame supporting step of sandwiching the adhesive tape held on the frame between an adhering body and the object held on the holding stand, and pressing the adhesive tape against the object while moving the adhering body and the holding stand in a direction of a pressing force by the adhering body. and a main adhering step of performing an adhering operation by relatively moving the adhesive tape and the object along a direction intersecting the direction of movement of the adhering action body relative to the holding base, wherein the main adhering step includes a non-parallel supporting step of supporting the frame in a non-parallel state in which the distance between the adhesive tape and the object at the front in the direction of movement of the adhering action body relative to the holding base is greater than the distance between the adhesive tape and the object at the rear in the direction of movement of the adhering action body relative to the holding base, and a moving step of moving a portion of the frame at the front in the direction of movement of the adhering action body relative to the holding base closer to the object during the adhering operation in conjunction with the relative movement between the adhering action body and the object.

[0013] Preferably, in the frame adhering step, the adhesive tape is adhered to the frame in a state in which the adhesive surface of the adhesive tape overlaps with the holding surface of the holding stand when viewed in a direction perpendicular to the adhesive surface, and the holding surface of the holding stand is in a retracted position away from the adhesive surface in the direction perpendicular to the adhesive surface.

[0014] Preferably, the main adhering step is carried out in a state in which both or one of the adhering body and the holder is heated.

[0015] According to another aspect of the present invention, there is provided a method for manufacturing a chip using the above-mentioned tape application method, wherein the object is a semiconductor wafer, and the method further includes a dividing step of dividing the object into chips. [Effects of the Invention]

[0016] According to the tape application device and application method and chip manufacturing method relating to each aspect of the present invention, the application operation is performed at a portion of the adhesive surface of the adhesive tape that is forward of the portion where application is being performed by the application body in the direction of movement of the application body relative to the object, while making the distance between the portion and the object longer than the portion where application is being performed by the application body.

[0017] This effectively prevents the occurrence of pre-adhesion, where a portion of the adhesive surface that is forward in the direction of movement of the adhering body relative to the object comes into contact with the object first, rather than the portion of the adhesive tape sandwiched between the adhering body and the object, thereby enabling the adhesive tape attached to the frame to be preferably attached to the object. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a side view showing an example of the configuration of a tape application device. [Figure 2] FIG. 2 is an exploded perspective view showing an example of the configuration of a frame unit including an object, an adhesive tape, and a frame. [Figure 3] FIG. 3 is a flowchart showing an example of a procedure relating to a tape application method and a chip manufacturing method. [Figure 4] FIG. 4 is a side view showing a step in the frame attachment process in which adhesive tape is attached to the frame. [Figure 5] FIG. 5 is a side view showing another stage in the frame attachment. [Figure 6] Figure 6(A) is a side view showing one stage in the actual application process in which adhesive tape attached to a frame is applied to an object, and Figure 6(B) is a plan view of the state of Figure 6(A) viewed from a different direction. [Figure 7] FIG. 7(A) is a side view showing another step in the actual attachment, and FIG. 7(B) is a plan view of the state of FIG. 7(A) seen from another direction. [Figure 8]FIG. 8(A) is a side view showing yet another stage in the actual attachment, and FIG. 8(B) is a plan view of the state of FIG. 8(A) seen from another direction. [Figure 9] FIG. 9 is a side view showing a stage in the manufacture of the chip. DETAILED DESCRIPTION OF THE INVENTION

[0019] An embodiment of the present invention will be described with reference to the accompanying drawings, in which Fig. 1 is a side view showing the configuration of a tape application device according to this embodiment, and Fig. 2 is an exploded perspective view showing an example of the configuration of a frame unit formed using the application device.

[0020] 2, the frame unit 8 is formed by using the object 2, the adhesive tape 4, and the frame 6 as its constituent elements. However, the frame unit 8 may further include other items as its constituent elements.

[0021] The object 2 is, for example, a disk-shaped semiconductor wafer, a package substrate, etc. However, articles of other shapes or types can also be handled as the object.

[0022] The adhesive tape 4 is a sheet-like article configured with one side (the lower side in FIG. 2) being an adhesive surface. The material constituting the adhesive tape 4 is, for example, a thin flexible resin sheet, and an adhesive material is laminated on one side (adhesive surface) of the sheet to form an adhesive layer. Note that the adhesive surface of the adhesive tape 4 before use is covered with a release sheet, but the release sheet is not shown in FIG. 2.

[0023] Planar objects may be referred to as, for example, a "sheet" or a "film" depending on their thickness, but in this specification, all planar objects are referred to as a "sheet" regardless of their specific thickness.

[0024] The frame 6 is a plate-like member having an opening in the central region and a shape surrounding the opening. Although the frame 6 is illustrated as an annular frame called a ring frame here, the frame 6 does not necessarily have to be annular, and may have any shape that surrounds the central region. For example, the frame 6 may be configured as a C-shaped object.

[0025] The peripheral portion of the adhesive surface of the circular adhesive tape 4 is attached to the frame 6. The central portion of the adhesive surface (the central area of ​​the frame 6 configured as an opening) is not attached to the frame 6 and is exposed. The object 2 is attached to this area.

[0026] In this way, the frame 6 is attached to the adhesive tape 4 so as to surround the adhesive surface of the adhesive tape 4, thereby holding the adhesive tape 4 in the frame 6, and the object 2 is attached to the adhesive surface of the adhesive tape 4 surrounded by the frame 6, thereby forming a frame unit 8.

[0027] When forming a frame unit from an object, adhesive tape, and a frame, there are several procedures for attaching the adhesive tape, such as a method of attaching the adhesive tape to the frame and then attaching the object to the adhesive tape, or a method of attaching the adhesive tape to the frame and the object at the same time, but in this embodiment, the method of attaching the adhesive tape to the frame and then attaching the object to the adhesive tape is particularly used. The attachment procedure will be described in detail later.

[0028] The adhesion device 10 of this embodiment shown in Figure 1 is capable of adhering an adhesive tape 4 to a frame 6 (hereinafter referred to as "frame adhering" for convenience) and adhering an object 2 to the adhesive tape 4 held by the frame 6 (hereinafter referred to as "main adhering").

[0029] The application device 10 includes a holder 12 that holds the object 2, a frame table 14 that supports the frame 6, and a tape holder 16 that holds the adhesive tape 4 so that it can be fed out and is to be applied to the object 2 and the frame 6. The application device 10 further includes an application body 18, a pressing mechanism 20, an application movement mechanism 22, a retraction movement mechanism 24, a winding unit 26, and a peeling plate 28.

[0030] The holder 12 is a table that holds the object 2, such as a semiconductor wafer, and is, for example, a chuck table that uses negative pressure by a mechanism (not shown) to suction the object 2. The upper surface of the holder 12 is configured as a holding surface 12a for holding the object 2 thereon.

[0031] The frame table 14 is provided around the holder 12 and is a base that supports the frame 6 at an appropriate height relative to the holder 12 and the object 2. The upper surface of the frame table 14 forms a support surface 14a that supports the frame 6.

[0032] During the actual application of the adhesive tape 4 to the object 2, the frame 6 is supported so as to surround the object 2 held on the holding surface 12a of the holding stand 12 in a plan view (as viewed from the Z direction, which will be described later), and to be slightly closer to (above) the applying body 18 than the object 2 in the Z direction (these positional relationships will be described in detail later). In this embodiment, the frame table 14 also supports the frame 6 during frame application, in which the adhesive tape 4 is applied to the frame 6.

[0033] The tape holding portion 16 is a portion that holds a bundle of adhesive tapes 4 wound into a roll. Before use, the adhesive tapes 4 are held by the release sheet 4a with the adhesive layer in contact with one side of the release sheet 4a, and are bundled together with the release sheet 4a into a roll. The roll-shaped bundle of adhesive tapes 4 before use is held by the tape holding portion 16 at a portion corresponding to the central axis of the roll, and when attached to the frame 6, the adhesive tapes 4 are unwound in a tangential direction from the outer periphery of the roll while rotating relative to the tape holding portion 16.

[0034] The sticking operation body 18 is, for example, a roller having a cylindrical rotation surface. The rotation axis of the sticking operation body 18, which is a roller, is set along a direction parallel to the surface (upper surface) of the object 2 held on the holder 12 that faces the adhesive tape 4, and along a direction (Y direction; a direction perpendicular to the plane of the paper in FIG. 1) perpendicular to the movement direction (X direction) of the sticking movement mechanism 22, which will be described later.

[0035] When performing the adhering operation of adhering the adhesive tape 4 to the frame 6 or the object 2, the adhering body 18 is pressed against the frame 6 or the object 2 by a pressing mechanism 20. The pressing mechanism 20 is a mechanism for pressing the adhering body 18 and the object 2 relative to each other, and in this embodiment, it supports the adhering body 18 and moves the adhering body 18 up and down (along the Z direction).

[0036] Although the detailed structure of the pressing mechanism 20 is not shown, the pressing mechanism 20 applies force to the adhering body 18 in a direction toward the holder 12 or the frame table 14 (a direction along the vertical direction (Z direction)) using a mechanism that uses, for example, hydraulic pressure, air pressure, elastic force, or the like, and presses the adhering body 18 with an appropriate force against the frame 6 or the object 2. In this way, the adhering body 18 presses the adhesive tape 4 against the object 2.

[0037] The adhering body 18 is not limited to the roller shown here, but may be any object that can perform the adhering operation by appropriately pressing the adhesive tape 4. For example, it may be an object that does not rotate relative to the adhesive tape 4, frame 6, or object 2, but slides relative to these and presses the adhesive tape 4.

[0038] Furthermore, the mechanism for pressing the adhesive tape 4 against the object 2 by the adhering body 18 is not limited to a mechanism for moving the adhering body 18 up and down. For example, the adhering body 18, which is a roller, is supported at a fixed position, and the holder 12 is slid in the X direction while the object 2 is in contact with the adhering body 18.

[0039] If the roller, which is the sticking action body 18, is made of a flexible material or is equipped with a mechanism for biasing the sticking action body 18 against the object 2, the object 2 can be supported in an appropriate position relative to the sticking action body 18 and slid, thereby allowing the sticking action body 18 to press the adhesive tape 4 against the object 2.

[0040] The adhesion movement mechanism 22 is a mechanism for relatively moving the adhesion body 18 and the holder 12 in a direction (X direction) that intersects with the direction of the pressing force by the adhesion body 18, thereby performing the operation of adhering the adhesive tape 4 to the object 2 (main adhesion). Furthermore, the adhesion movement mechanism 22 also performs the operation of adhering the adhesive tape 4 to the frame 6 by a similar operation (frame adhesion).

[0041] The adhering movement mechanism 22 includes a pair of moving rails 30 provided at the bottom of the frame that constitutes the adhering device 10, and a moving table 32 that moves along the moving rails 30.

[0042] The movable rails 30 are a pair of plate-like members arranged parallel to each other along the horizontal direction (only the front movable rail 30 of the pair of movable rails 30 is shown in FIG. 1), and the movable table 32 is installed on the upper surface of the movable rail 30 so as to be slidable along the longitudinal direction of the movable rail 30. A ball screw 34 is arranged between the pair of movable rails 30, parallel to the direction in which the movable rails 30 extend.

[0043] A nut portion (not shown) is provided at the bottom of the moving table 32, and the nut portion is passed through by a ball screw 34 and engages with the ball screw 34. A pulse motor 36 is attached to one end of the ball screw 34, and operation of the pulse motor 36 rotates the ball screw 34, causing the moving table 32 to move along the moving rail 30.

[0044] The support base 12 and frame table 14 are placed on the upper surface of the moving table 32, and the support base 12 and frame table 14 move in the horizontal direction as the moving table 32 moves. The direction along the moving direction of the moving table 32 is defined as the X direction in this specification.

[0045] In this embodiment, the pressing mechanism 20 is described as a mechanism for pressing the adhesive action body 18 against the object 2 and the frame 6, but instead of or in addition to this, a mechanism for pressing the object 2 and the frame 6 against the adhesive action body 18 may be adopted.

[0046] Similarly, the adhesion movement mechanism 22 has been described as a mechanism for moving the object 2 and the frame 6 relative to the adhesion operation body 18, but instead of or in addition to this, a mechanism for moving the adhesion operation body 18 may be adopted.

[0047] Furthermore, although expressions such as "along a direction parallel to the surface" and "along the vertical direction" are used in this specification, these do not necessarily mean that the two directions are strictly the same or parallel. For example, they may be at a slight angle to each other, but generally point in the same direction.

[0048] A retraction movement mechanism 24 is provided at a mounting portion of the moving table 32 to which the holder 12 is attached. The retraction movement mechanism 24 is a mechanism that moves the holder 12 and the frame table 14 relatively in a direction (Z direction, vertical direction) that intersects with the plane of relative movement of the bonding body 18 with respect to the holder 12 during the bonding operation, and is capable of moving the holder 12 in the Z direction between a bonding position where the position of the holding surface 12a of the holder 12 in the Z direction is close to the support surface 14a of the frame table 14, and a retracted position where the holding surface 12a of the holder 12 is separated from the support surface 14a of the frame table 14 in the Z direction.

[0049] The adhering position and the retreating position will now be described. In this embodiment, in forming the above-mentioned frame unit 8 (see FIG. 2), first, the adhesive tape 4 is adhered to the frame 6 (frame adhering; see FIGS. 4 and 5), and then the object 2 is adhered to the adhesive surface of the adhesive tape 4 (main adhering; see FIGS. 6 to 8).

[0050] In this attachment step (see FIGS. 6 to 8), the object 2 is attached to the same adhesive surface of the adhesive tape 4 to which the frame 6 is attached, so it is necessary to bring the heights (positions in the Z direction) of the upper surface of the frame 6 (the surface to be attached to the adhesive tape 4) and the upper surface of the object 2 (the surface to be attached to the adhesive tape 4) close to each other. In other words, the attachment position refers to a positional relationship in which the holder 12 and the frame table 14 are relatively close to each other in the Z direction so that the object 2 can be attached to the adhesive tape 4 attached to the frame 6.

[0051] In the frame adhering step (see FIGS. 4 and 5) that precedes this, the adhesive tape 4 is adhered to the frame 6 supported on the support surface 14a of the frame table 14. At this time, if the frame 6 and the holder 12 are close to each other in the Z direction, there is a concern that part of the adhesive surface of the adhesive tape 4 may be adhered to the holder 12.

[0052] The adhesive tape 4 is made of a flexible sheet-like material, and the application unit 18, which is a roller used for application, also has a certain degree of flexibility. Therefore, during the application operation for attaching the tape to the frame, depending on conditions such as the pressure applied to the application unit 18, the thickness of the frame 6, the diameter of the opening, and the material of the application unit 18, part of the application unit 18 may protrude together with the adhesive tape 4 from the opening of the frame 6 toward the holder 12 located below.

[0053] At this time, if the holder 12 is not sufficiently spaced apart from the frame 6, the adhesive tape 4 that protrudes downward from the frame 6 will be stuck to the upper surface (holding surface 12a) of the holder 12. To prevent this, when sticking the adhesive tape to the frame, the holding surface 12a of the holder 12 is retracted to a position that is downward (opposite the upper side where the sticking body 18 and the adhesive tape 4 are located in the Z direction) with respect to the support surface 14a of the frame table 14 that supports the frame 6. In other words, the retracted position refers to a positional relationship in which the holder 12 and the frame table 14 are relatively spaced apart in the Z direction so that the holder 12 does not stick to the adhesive tape 4 when sticking the adhesive tape 4 to the frame 6.

[0054] During the actual attachment (see Figures 6 to 8), the object 2 is held on the holding surface 12a, which is the upper surface of the holding table 12, and the object 2 is attached to the adhesive surface, which is the lower surface of the adhesive tape 4 attached to the upper surface of the frame 6, so that the upper surface of the object 2 held on the holding table 12 and the upper surface of the frame 6 to which the adhesive tape 4 is attached are located at approximately the same height (approximately the same position in the Z direction).

[0055] Therefore, when attaching the frame (see Figures 4 and 5), if the holder 12 and frame table 14 are placed in the same positional relationship (attaching position) as in the actual attachment, the upper surface (holding surface) 12a of the holder 12 will be separated from the adhesive surface of the adhesive tape 4 held by the frame 6 on the support surface 14a of the frame table 14 by approximately the thickness of the object 2.

[0056] However, if the amount of adhesive tape 4 that protrudes from frame 6 in the Z direction during the adhering operation exceeds the thickness of object 2, the adhesive tape 4 will stick, so it is still preferable to move holding table 12 to a retracted position when adhering to the frame.

[0057] Here, with regard to movement between the adhesion position and the retracted position, the case where the holder 12 is moved relative to the frame table 14 has been described, but the frame table 14 may be moved instead of the holder 12, or both the holder 12 and the frame table 14 may be moved.

[0058] Furthermore, in this embodiment, the frame table 14 is provided with a tilting mechanism 40 so as to support the frame 6 in a tilted state during the adhering operation. The tilting mechanism 40 is, for example, a mechanism as described below.

[0059] The frame table 14 is configured to include a plurality of support columns 42 that protrude upward from the upper surface of the movable table 32, and a base portion 44 that is a top plate supported on the support columns 42. The upper surface of the base portion 44 forms the support surface 14a of the frame table 14.

[0060] The underside of the base 44 is connected to the upper end of the support 42. In a part of the connection between the base 44 and the support 42 that is rearward (left side in FIG. 1 ) with respect to the direction of movement of the adhesive moving body 18 relative to the holder 12 during the adhesive operation, the base 44 is rotatably attached to the support 42. More specifically, the base 44 is connected by a hinge-like connection structure so as to rotate about an axis along the horizontal direction (Y direction; the direction of the rotation axis of the adhesive moving body 18, which is a roller) that is perpendicular to the direction of movement (X direction) by the adhesive moving mechanism 22.

[0061] On the other hand, in the connection portion between the base 44 and the support 42, in a part that is forward in the direction of movement of the adhesion action body 18 relative to the holding base 12 during the adhesion operation, the base 44 is attached so as to be movable up and down (along the Z direction) relative to the support 42.

[0062] 1 and 4 to 8, during the pasting operation, the pasting body 18 moves from left to right relative to the holder 12 (when viewed from the pasting body 18, the holder 12 moves from right to left), so "rear" here refers to the left side in the figures, and "front" refers to the right side in the figures. The arrows in Figures 6 to 8 indicate the direction of movement of the pasting body 18 as viewed from the holder 12, frame table 14, object 2, and frame 6.

[0063] In some of the support pillars 42 located in the front (right side in the drawing) in the movement direction of the adhering body 18, a biasing portion 46 is provided between the support pillars 42 and the base portion 44, which biases the base portion 44 upward from the support pillars 42. When no external force is applied, the biasing force of the biasing portion 46 causes the base portion 44 to rise slightly upward from the upper end of the support pillar 42.

[0064] In this way, the base portion 44 is connected to the upper end of the support pillar 42 located on the left side of the figure by a hinge-like structure, while when connected to the support pillar 42 located on the right side of the figure, it is supported so as to be slightly raised above the upper end of the support pillar 42 via the biasing portion 46.

[0065] As a result, the part of the frame 6 supported by the frame table 14 that is forward in the direction of movement of the adhering body 18 relative to the holding base 12 during the adhering operation is biased in a direction away from the holding base 12 and the object 2 held by the holding base 12.

[0066] When no external force is applied that resists the biasing force of the biasing portion 46, or when the external force is sufficiently small compared to the biasing force of the biasing portion 46, the right side of the base portion 44 and the frame 6 in the figure is raised relative to the left side, as shown by the solid line in Figure 1, and the entire base portion 44 and the frame 6 are supported in a non-parallel state that is inclined relative to the movable table 32.

[0067] Furthermore, during the adhering operation in which the adhering body 18 adheres the adhesive tape 4 to the frame 6 on the frame table 14 or the object 2 on the holding base 12, the pressing force of the adhering body 18 pressing the frame 6 against the object 2 causes the forward parts of the base 44 and the frame 6 in the direction of movement of the adhering body 18 relative to the holding base 12 to move in a direction approaching the object 2.

[0068] In this specification, the term "non-parallel state" refers to a state in which, assuming the actual adhesion step, the distance between the adhesive tape 4 (the adhesive tape 4 adhered to the frame 6) and the object 2 (the object 2 held on the holding table 12 during actual adhesion) in the front (right side in Figures 1 and 4 to 8) with respect to the direction of movement of the adhesion operating body 18 relative to the holding table 12 is greater than the distance between the adhesive tape 4 and the object 2 in the rear (left side in Figures 1 and 4 to 8) with respect to the direction of movement of the adhesion operating body 18 relative to the holding table 12, and a state in which the frame 6 is supported so that the adhesive tape 4 and the object 2 are in such a non-parallel positional relationship.

[0069] When the base 44 is pressed down with sufficient force against the biasing force of the biasing portion 46, the underside of the base 44 located on the right side in the figure moves downward (in the direction in which the frame 6 supported on the base 44 approaches the object 2, assuming that the object 2 is held on the holding base 12) and comes into contact with the upper end of the support 42. In this state, as shown by the dashed-dotted line in FIG. 1, the base 44 and the frame 6 supported by the base 44 are supported as a whole substantially parallel to the XY plane.

[0070] The mechanism for biasing the base 44 with the biasing unit 46 can be, for example, an elastic body such as a helical spring. Note that the mechanism for supporting the frame 6 in a non-parallel state with the tilting mechanism 40 and the mechanism for biasing the base 44 with the biasing unit 46 may be any mechanism that can support the frame 6 in a non-parallel state during actual attachment and can be released from this non-parallel state by an external force. For example, mechanisms using hydraulic pressure, air pressure, electromagnetic force, etc. can also be envisioned.

[0071] In addition, although the example described here is one in which the biasing portions 46 are provided on some of the multiple support columns 42 constituting the legs of the frame table 14, and the base portion 44 is raised by these biasing portions 46, thereby tilting the base portion 44 as a whole and supporting the frame 6 in a non-parallel state, it is also possible to tilt the base portion 44 by, for example, providing biasing portions 46 on all of the support columns 42 and supporting the base portion 44 at different heights among the multiple biasing portions 46. In this way, when adhering to the frame or during actual adhering, the adhesive tape 4 can be pressed against the frame 6 or the object 2 with a stronger force by applying a pressing force from the pressing mechanism 20 against the biasing force of each biasing portion 46.

[0072] The winding unit 26 and the peeling plate 28 are used when adhering the adhesive tape 4 to the frame 6. When adhering the adhesive tape 4 to the frame 6, as shown in Figures 4 and 5, the adhesive tape 4 bundled in a roll together with the peeling sheet 4a is held by the tape holding unit 16, which is located above and in front of the holder 12 (to the right in the figure) in relation to the direction of movement of the adhering body 18 relative to the holder 12, and the adhesive tape 4 is then unwound from there together with the peeling sheet 4a toward the holder 12.

[0073] The sticking action body 18 is positioned above a frame 6 supported by a frame table 14, and the peeling plate 28 is positioned between the sticking action body 18 and the frame 6, and in a position forward of the sticking action body 18 in the direction of movement of the sticking action body 18 relative to the holding table 12.

[0074] 1, 4, and 5, peeling plate 28 is a plate-like member having a thin triangular cross section, and extends in a direction (Y direction) perpendicular to the paper plane of Figures 1, 4, and 5. When attaching the frame, peeling plate 28 is arranged in the position shown in Figures 4 and 5, with a portion (cutting edge 28a) that is formed to become thinner toward the end being sandwiched between attachment body 18 and the upper surface of frame 6.

[0075] When adhering to the frame, the winding unit 26 is supported at a position above the front (right side in the figure) of the holder 12 and below the tape holding unit 16 in relation to the direction of movement of the adhering body 18 relative to the holder 12. When adhering to the frame, the release sheet 4a that is fed out together with the adhesive tape 4 from the tape holding unit 16 extends toward the release plate 28, folds back at the cutting edge 28a of the release plate 28, extends toward the winding unit 26, and is taken up here.

[0076] The release sheet 4a is folded back at the cutting edge 28a of the release plate 28, but the adhesive tape 4 carried from the tape holding part 16 to the release plate 28 while stuck to the upper surface of the release sheet 4a does not follow the release sheet 4a that is folded back at the cutting edge 28a, but remains on the upper surface of the frame 6 and is stuck to the frame 6.

[0077] By adjusting the amount of release sheet 4a and adhesive tape 4 fed out in tape holding section 16 and the amount of release sheet 4a taken up in winding section 26, the tension of the release sheet 4a between tape holding section 16 and release plate 28, and between release plate 28 and winding section 26, is adjusted.

[0078] The adhering body 18 has a built-in heating unit 48 for heating the outer peripheral surface (the surface that comes into contact with the adhesive tape 4 when adhering to the frame or during actual adhering) of the adhering body 18. The heating unit 48 is, for example, an electric heater.

[0079] When heating the adhesive tape 4 to the frame 6 or the object 2, the adhesiveness may be improved by heating the material that constitutes the adhesive tape 4 to a certain temperature. Therefore, in this embodiment, when adhering to the frame or during the main adhering, the adhering body 18 is heated by the heating unit 48, thereby raising the temperature of the adhesive tape 4. Note that instead of or in addition to the heating unit 48 provided in the adhering body 18, a heating unit may be provided that is built into the holding base 12, for example.

[0080] Next, the operation of the present embodiment described above will be described with reference to the flowchart in Fig. 3 and Figs. 4 to 8. Figs. 4 and 5 are side views showing a stage in frame adhering in which adhesive tape 4 is adhered to frame 6. Figs. 6 to 8 show a stage in actual adhering in which adhesive tape 4 adhered to frame 6 is adhered to object 2, with Figs. 6(A), 7(A), and 8(A) being side views and Figs. 6(B), 7(B), and 8(B) being plan views.

[0081] First, a frame adhering step is performed in which the adhesive tape 4 is adhered to the frame 6 (step S10). As shown in Figures 4 and 5, the frame 6, which is an annular frame (ring frame), is supported on the support surface 14a of the frame table 14, and the adhesive tape 4 is sandwiched between the frame 6 and an adhering body 18 located above the frame 6.

[0082] The sticking action body 18 and the frame 6 are pressed relative to each other by the pressing mechanism 20 while sandwiching the adhesive tape 4 therebetween, and the sticking action body 18 and the frame 6 move relative to each other along the X direction by operation of the sticking movement mechanism 22 (in this embodiment, the sticking action body 18 is pressed against the frame 6, and the moving table 32 to which the frame table 14 is attached moves relative to the sticking action body 18).

[0083] When adhering to the frame, the adhesive tape 4 is unwound together with the release sheet 4a from the tape holding part 16. The release sheet 4a is folded back at the cutting edge 28a of the release plate 28 arranged between the adhering body 18 and the frame 6, and extends to the winding part 26 where it is taken up.

[0084] As shown in Figures 4 and 5, the adhesive tape 4 on the frame 6 is sandwiched between the adhering body 18 and the frame 6, and while being pressed in the Z direction by the pressing mechanism 20, it moves in the X direction together with the frame 6 relative to the adhering body 18 by the operation of the adhering movement mechanism 22, and is adhered to the upper surface of the frame 6.

[0085] The cutting edge 28a of the peeling plate 28 is located between the adhering body 18 and the frame 6, slightly forward of the part where the adhering body 18 contacts the frame 6 with the adhesive tape 4 sandwiched between them, in the direction of movement of the adhering body 18 relative to the frame 6.

[0086] As the frame 6 and the adhering body 18 move relative to each other in the X direction (in this embodiment, the frame 6 moves from right to left in the figure relative to the adhering body 18), the release sheet 4a is simultaneously wound up by the winding section 26 by a length corresponding to the amount of movement.

[0087] The adhesive tape 4 held on the upper surface of the release sheet 4a does not follow the movement of the release sheet 4a, which is folded back by the cutting edge 28a of the release plate 28 and taken up by the take-up unit 26, but remains on the frame 6 and is sandwiched between the adhering body 18 and the frame 6. When this operation is performed from one end side to the other end side of one piece of adhesive tape 4 in the X direction, the piece of adhesive tape 4 comes to be stuck to the upper surface of the frame 6.

[0088] During this frame adhering step, the retracting mechanism 24 moves the holder 12 to a position (retracted position) below and away from the adhesive surface of the adhesive tape 4 to be adhered to the frame 6.

[0089] That is, while the adhesive tape 4 is being adhered to the frame 6, the adhesive surface of the holding table 12 overlaps with the holding surface 12a when viewed from a direction perpendicular to the adhesive surface of the adhesive tape 4 (Z direction), and the holding surface 12a is in a retracted position separated from the adhesive surface in the Z direction. This makes it possible to adhere the adhesive tape 4 to the frame 6 while preventing the adhesive surface of the adhesive tape 4 from adhering to the holding surface 12a of the holding table 12.

[0090] The object 2 is held on the holder 12 (object holding step; step S20). The object 2, which is a disk-shaped wafer or the like, is held on a holding surface 12a of the holder 12, which is a chuck table.

[0091] The frame 6, to which the adhesive tape 4 is adhered, is supported on the frame table 14 (frame supporting step; step S30). The adhesive tape 4 that adheres to the object 2 is held by the frame 6 so as to surround the adhesive surface that adheres to the object 2. The frame 6 is supported on the frame table 14 so that the adhesive surface faces the object 2. The adhesive tape 4 is held on the upper surface of the frame 6 with the adhesive surface facing downward, and the object 2 to which the tape is to be adhered is located below it.

[0092] That is, in the frame support step, when the object 2 is held on the holding table 12 and the adhesive tape 4 is supported on the frame 6, the frame 6 is supported in a position where the adhesive surface of the adhesive tape 4 faces the object 2 held on the holding table 12.

[0093] Although the frame adhering step (step S10), object holding step (step S20), and frame supporting step (step S30) have been described in this order, the order of these steps is not limited to the order described here. For example, the frame adhering step may be performed after the frame supporting step, or the object holding step may be performed before the frame adhering step (in this case, it is recommended to use the retraction movement mechanism 24 to keep a sufficient distance between the adhesive tape and the object so that the adhesive tape does not stick to the object in the frame adhering step).

[0094] Once the object 2 is held on the holder 12 and the frame 6 with the adhesive tape 4 attached is supported on the frame table 14, the actual attachment step is performed to attach the adhesive tape 4 attached to the frame 6 to the object 2 (step S40).

[0095] 6 to 8, in this adhering step, the adhesive tape 4 held in a manner such that a portion of its adhesive surface is adhered to the frame 6 is sandwiched between the adhering body 18 and the object 2 held on the holder 12, and an adhering operation is performed to adhere the adhesive tape 4 to the object 2. While the adhering body 18 and the object 2 are pressed relatively to each other by the pressing mechanism 20, the adhering body 18 and the holder 12 are moved relatively along a direction (X direction) that intersects with the direction of the pressing force by the pressing mechanism 20 (the direction of the pressing force applied between the adhering body 18 and the object 2; Z direction).

[0096] In this actual adhering step (step S40), a non-parallel support step (step S42) and a movement step (step S44) are further performed to adjust the posture of the frame 6 as the adhesive tape 4 is adhered to the object 2.

[0097] At the start of this adhesion step (step S40), the frame 6 is supported by the biasing unit 46 in a non-parallel state in which the distance between the adhesive tape 4 and the object 2 in the front (right side in Figure 6(A)) relative to the movement direction of the adhesion operating body 18 relative to the holding base 12 is greater than the distance between the adhesive tape 4 and the object 2 in the rear (left side in Figure 6(A)) relative to the movement direction (non-parallel support step; step S42).

[0098] When the pressing mechanism 20 presses the sticking action body 18 against the object 2 with the adhesive tape 4 sandwiched between them, and the sticking action body 18 moves relative to the object 2 in the X direction by the sticking movement mechanism 22 (in this embodiment, the object 2 moves relative to the sticking action body 18 by movement of the moving table 32), the part of the base part 44 supporting the frame 6 that is located forward in the movement direction of the sticking action body 18 relative to the holding base 12 is pushed down by the pressing force of the pressing mechanism 20 against the biasing force of the biasing part 46.

[0099] That is, during the adhering operation performed in this adhering step (step S40), the frame 6 is initially supported in a non-parallel state as shown in Figure 6(A), but as the adhering body 18 and the object 2 move relative to each other, the part of the frame 6 that is forward in terms of the movement direction of the adhering body 18 relative to the holding base 12 is gradually brought closer to the object 2 as shown in Figures 7(A) to 8(A) (movement step; step S44).

[0100] When the object 2 is adhered to the adhesive tape 4 adhered to the frame 6, if the adhering operation is performed by the adhering action body 18 while the frame 6 and the object 2 are parallel to each other, depending on the state of the adhesive tape 4, the part of the adhesive surface that is forward in the direction of movement of the adhering action body 18 relative to the object 2 may come into contact with the object 2 first, rather than the part where the adhesive tape 4 is sandwiched between the adhering action body 18 and the object 2 (the part where adhering is performed by the adhering action body 18) (for convenience, this is referred to as "first adhering").

[0101] When pre-adhesion occurs, there is an unadhered portion between the pre-adhered portion of the adhesive surface and the portion adhered by the adhering unit 18, and further adhering by the adhering unit 18 is performed by filling in the unadhered portion. This may result in air bubbles being trapped between the adhesive tape 4 and the object 2 in that region, or the adhesive tape 4 may wrinkle.

[0102] Therefore, in this embodiment, during the actual adhering, the adhering operation is performed while supporting the frame 6 in a non-parallel state so that the adhesive tape 4 and the upper surface of the object 2 are not parallel to each other.

[0103] In this way, in the adhesive surface of the adhesive tape 4, in the direction of movement of the adhering body 18 relative to the object 2, the distance between the adhesive surface of the adhesive tape 4 and the object 2 is longer than the part being adhered by the adhering body 18. This prevents contact between the adhesive surface of the adhesive tape 4 and the object 2 in areas other than the part being adhered by the adhering body 18 and the part that has already been adhered by the adhering body 18, and effectively prevents pre-adherence.

[0104] However, during the actual attachment, the object 2 and the adhesive tape 4 must eventually move away from the non-parallel state, and the entire adhesive surface of the adhesive tape 4 must be in contact with the top surface of the object 2. Therefore, in this embodiment, a tilting mechanism 40 equipped with a biasing unit 46 is provided as a mechanism for supporting the frame 6 in a non-parallel state.

[0105] At the start of the actual application, the tilting mechanism 40 uses the biasing force of the biasing section 46 to lift a part of the base section 44, tilting the frame 6 and maintaining the adhesive tape 4 in a non-parallel state. As the application operation in the actual application progresses, the base section 44 is pushed in by the application operating body 18 against the biasing force of the biasing section 46. In this way, the frame 6 escapes from the non-parallel state and assumes a position in which the adhesive surface of the adhesive tape 4 and the object 2 come into close contact with each other, ensuring complete application between them.

[0106] In the non-parallel state, the frame 6 is supported in a position where the adhesive surface of the adhesive tape 4 is inclined relative to the top surface of the object 2 to which it is to be stuck, but in this case, the angle and distance between them must be within an appropriate range. If the angle or distance between them is too small, pre-sticking is likely to occur, and if it is too large, it will cause problems in sticking the adhesive tape 4 to the object 2.

[0107] For example, if the object 2 is a wafer with a diameter of 300 mm, depending on the material and thickness of the adhesive tape 4, the pressing force applied to the adhering body 18 by the pressing mechanism 20, the material of the adhering body 18, etc., the distance between the top surface of the frame 6 on which the adhesive tape 4 is held and the top surface of the object 2 to be adhered should be approximately 100 μm or more and 1 mm or less (e.g., approximately 400 μm) at the forwardmost point in the direction of movement of the adhering body 18 relative to the object 2.

[0108] Furthermore, from the start of the actual adhesion until just before its completion, the adhesive tape 4 is basically in a non-parallel state to the object 2 (while gradually changing the angle of inclination as the adhesion body 18 moves), but if the adhesion body 18 is made of a flexible material as described above, the pressing force of the pressing mechanism 20 causes a part of the adhesion body 18 to protrude downward from the upper surface of the frame 6, pushing out the adhesive tape 4 along with it. As a result, even if there is a small distance between the upper surface of the frame 6 and the upper surface of the object 2 due to support in a non-parallel state, the adhesive surface of the adhesive tape 4 can come into contact with the object 2, and the two can be adhered to each other.

[0109] When the main attachment is completed, it is desirable for the top surface of the object 2 to which the adhesive tape 4 is to be attached to be flush with the top surface of the frame 6. When performing the main attachment, it is advisable to adjust the positions of the attachment operating body 18 and the holding base 12 in the Z direction, and the support position of the base portion 44 of the frame table 14 by the tilting mechanism 40 and the biasing unit 46, etc., so that the top surface of the object 2 and the top surface of the frame 6 are flush with each other upon completion.

[0110] The mechanism for maintaining the adhesive tape 4 and the object 2 in a non-parallel state and for releasing the non-parallel state between them is not limited to the mechanism using the biasing unit 46 described above, and any other appropriate mechanism can be adopted. For example, instead of the above-described mechanism in which the base 44 supporting the frame 6 is pressed in response to the pressing force of the adhering body 18, changing the inclination angle of the base 44, a mechanism may be used in which the angle of the frame 6 is adjusted without depending on the pressing force. For example, a mechanism in which the height and angle of the support columns 42 in the frame table 14 are changed by hydraulic pressure or the like can also be envisaged.

[0111] During frame attachment and main attachment, if the attachment operating body 18 is heated by the heating unit 48 and the adhesive tape 4 is heated to an appropriate temperature, the adhesive strength of the adhesive tape 4 to the frame 6 and the object 2 is increased, and the frame unit 8 (see FIG. 2) can be suitably formed by attachment. If the heating unit is provided in the holding table 12, the object 2 held on the holding table 12 can be heated by the heating unit during main attachment, thereby raising the temperature of the adhesive tape 4 that is in close contact with the object 2.

[0112] After the frame unit 8 is formed as described above, the object 2, which is a semiconductor wafer, is divided into individual chips to manufacture the chips (dividing step; step S50). Fig. 9 is a side view showing one stage (dividing step) in the manufacture of the chips.

[0113] In the dividing step (step S50), a laser processing device 50 such as that shown in FIG. 9 is used, and the object (wafer) 2 is divided by irradiating the object (wafer) 2 with a laser beam.

[0114] The laser processing device 50 includes an irradiation unit 52 that irradiates the wafer 2 with a laser beam, and a holding mechanism 54 that holds the wafer 2.

[0115] The irradiation unit 52 is a mechanism that guides and focuses a laser beam emitted from a laser oscillator (not shown) through an optical system including optical elements such as lenses and mirrors (not shown), and irradiates the laser beam onto the wafer 2 held by the holding mechanism 54.

[0116] The holding mechanism 54 is, for example, a chuck table, and is configured to hold the wafer 2, which is the object, by suction. An upper surface 54a of the holding mechanism 54 forms a holding surface that holds the wafer 2. A negative pressure is supplied to the holding surface 54a from a suction source (not shown), thereby adsorbing the wafer 2, which is the object, onto the holding surface 54a. A rotation mechanism (not shown) that rotates the holding mechanism 54 around a rotation axis along the vertical direction is connected to the lower part of the holding mechanism 54.

[0117] The frame unit 8 including the wafer 2 is held on the holding surface 54a of the holding mechanism 54, and a laser beam having a wavelength that is absorbed by the material of the wafer 2 is irradiated. The laser beam is adjusted by a condenser lens provided in the irradiation unit 52 to have a focal point at a target position on the wafer 2, and then irradiated.

[0118] While the laser beam is being irradiated onto the wafer 2, the holding mechanism 54 and the irradiation unit 52 move relatively in a direction along the holding surface 54a, thereby subjecting the wafer 2 to ablation processing along the planned dividing lines set in a grid pattern on the wafer 2. In this way, the wafer 2 is divided into individual chips, and the chips are manufactured.

[0119] When chips are manufactured in this manner, the wafer 2, which is the object, is adhered to the adhesive tape 4 in the frame unit 8 in a good condition with few wrinkles in the adhesive tape 4 and few air bubbles between the wafer 2 and the adhesive tape 4. This prevents problems such as a decrease in processing accuracy due to wrinkles and the like, and chip peeling due to unattached areas caused by air bubbles and the like, and allows chips to be manufactured with good quality and yield.

[0120] In the dividing step (step S50), a groove along the planned dividing line may be formed in the wafer 2 by laser ablation processing, and then the wafer 2 may be divided along the groove by applying an external force, or a modified layer along the planned dividing line may be formed in the material of the wafer 2 by irradiating it with a laser beam, and then the wafer 2 may be divided along the modified layer.

[0121] Alternatively, the dividing step S50 may be performed using a cutting device, which may include, for example, a cutting unit and a holding mechanism.

[0122] The cutting unit includes a spindle to which a cutting blade is attached and a housing that rotatably supports the spindle. The cutting blade includes, for example, an annular base and an annular cutting edge attached along the outer periphery of the base.

[0123] The spindle is cylindrical, has one end equipped with a blade mount to which the cutting blade is attached, and has the other end equipped with a rotational drive source such as a motor. The cylindrical spindle is housed in a housing with its axis aligned horizontally, and when the rotational drive source is activated, it rotates together with the cutting blade around the horizontal axis.

[0124] During cutting, the cutting blade cuts into the wafer 2 held by the holding mechanism while rotating together with the spindle. While the cutting blade cuts into the wafer 2, the cutting unit and the holding mechanism move relatively in a direction along the holding surface, thereby dividing the wafer 2 along the planned dividing line. After the cutting blade forms a cutting groove in the wafer 2 along the planned dividing line, the wafer 2 may be divided along the cutting groove by a method such as applying an external force.

[0125] Furthermore, when chips are manufactured from the wafer 2, other processes such as ultraviolet irradiation and film formation may be carried out as appropriate before or after division.

[0126] The structures, methods, etc. according to the above-described embodiments are not limited to the above-described embodiments, and may be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0127] 2: Object (wafer), 4: Adhesive tape, 4a: Release sheet, 6: Frame 8: Frame unit 10: Adhesion device, 12: Holding table, 12a: Holding surface, 14: Frame table 14a: Support surface, 16: Tape holding portion, 18: Sticking action body, 20: Pressing mechanism 22: Adhesion movement mechanism, 24: Retraction movement mechanism, 26: Winding section, 28: Peeling plate 28a: cutting edge, 30: moving rail, 32: moving table, 34: ball screw 36: Pulse motor, 40: Tilt mechanism, 42: Support, 44: Base, 46: Pressurizing unit 48: Heating part 50: laser processing device, 52: irradiation unit, 54: holding mechanism, 54a: holding surface

Claims

1. a holding table for holding an object; a frame table that supports a frame that holds an adhesive tape that adheres to the object so as to surround an adhesive surface of the adhesive tape that adheres to the object, such that the adhesive surface of the adhesive tape faces the object held on the holding table; a sticking action body configured to sandwich the adhesive tape held by the frame between the frame and the object held by the holding base and press the adhesive tape against the object; a sticking movement mechanism that performs a sticking operation by relatively moving the sticking body and the holder in a direction that intersects with the direction of the pressing force of the sticking body, The frame table includes: The tape application device is configured to support the frame in a non-parallel state in which, during the application operation, the distance between the adhesive tape and the object in the front in the direction of movement of the application body relative to the holding base is greater than the distance between the adhesive tape and the object in the rear in the direction of movement of the application body relative to the holding base.

2. the frame table includes a biasing section that biases at least a portion of the frame supported on the frame table that is in a front position in a direction in which the adhering body moves relative to the holding base during the adhering operation, in a direction away from the object held on the holding base; The biasing portion is 2. The tape application device of claim 1, wherein, during the application operation, the pressing force of the application body pressing the frame against the object causes the portion of the frame that is forward in the direction of movement of the application body relative to the holding base to move in a direction toward the object.

3. 3. The tape application device according to claim 1, further comprising a retraction mechanism for relatively moving the holding table and the frame table along a direction intersecting the relative movement plane of the application body relative to the holding table during the application operation.

4. 3. The tape application device according to claim 1, further comprising a heating unit for heating both or either of the application body and the holding table.

5. a frame adhering step of adhering the adhesive tape to be adhered to the object to a frame that holds the adhesive tape so as to surround the adhesive surface of the adhesive tape to be adhered to the object; an object holding step of holding the object on a holding table; a frame supporting step of supporting the frame at a position where, when the object is held on the holding base and the adhesive tape is held on the frame, an adhesive surface of the adhesive tape faces the object held on the holding base; a main adhering step in which the adhesive tape held by the frame is sandwiched between an adhering body and the object held by the holder, and the adhesive tape is pressed against the object while the adhering body and the holder are moved relatively in a direction intersecting the direction of the pressing force of the adhering body, In the attaching step, a non-parallel supporting step for supporting the frame in a non-parallel state in which a distance between the adhesive tape and the object at a front side in a moving direction of the adhering operation body relative to the holding base is larger than a distance between the adhesive tape and the object at a rear side in the moving direction of the adhering operation body relative to the holding base; A tape application method in which, during the application operation, the application body and the object move relative to each other, and a movement step is performed in which the part of the frame that is forward in the direction of movement of the application body relative to the holding base is brought closer to the object.

6. 6. The tape applying method according to claim 5, wherein in the frame applying step, the adhesive tape is applied to the frame in a state in which the adhesive surface of the adhesive tape overlaps with the holding surface of the holding stand when viewed in a direction perpendicular to the adhesive surface, and the holding surface of the holding stand is in a retracted position away from the adhesive surface in the direction perpendicular to the adhesive surface.

7. 7. The tape applying method according to claim 5, wherein the main applying step is performed in a state where both or one of the applying body and the holding table is heated.

8. A method for manufacturing a chip using the tape adhering method according to claim 5, the object is a semiconductor wafer, The method for manufacturing a chip further comprises a dividing step of dividing the object into chips.

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