Rotation speed calculation device, rotation speed calculation method, substrate cleaning device, and substrate processing device

Abstract

To calculate the rotation speed of a substrate with greater accuracy.SOLUTION: Provided is a rotation speed calculation device comprising: a vibration amplifier that, when a substrate to be cleaned is rotated by rotation drive of a roller which holds a peripheral edge of the substrate, amplifies vibration which is caused by a notch of the peripheral edge of the substrate hitting the roller; one or more vibration sensors that detect the amplified vibration; and a rotation speed calculation unit that calculates the rotation speed of the substrate on the basis of the vibration which is detected by the vibration sensor.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a rotational speed calculation device and a rotational speed calculation method for calculating the rotational speed of a substrate, as well as to a substrate cleaning device and a substrate processing device. [Background technology]

[0002] In a substrate cleaning apparatus, a technique is known in which vibrations and sounds generated when the notches on the periphery of the substrate hit the rollers are detected to calculate the rotation speed of the substrate (Patent Document 1). However, the detected vibrations and sounds include not only those generated when the notches hit the rollers (signals), but also those generated by other factors (noise). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7078602 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to calculate the rotation speed of a substrate with higher accuracy. [Means for solving the problem]

[0005] By way of example, the following solution is provided:

[0006] [1] a vibration amplifier that amplifies vibrations generated when a notch on the peripheral edge of the substrate strikes a roller that holds the peripheral edge of the substrate to be cleaned when the substrate is rotated by rotating the roller; one or more vibration sensors that detect the amplified vibrations; a rotational speed calculation unit that calculates the rotational speed of the substrate based on the vibration detected by the vibration sensor.

[0007] [2] The rotational speed calculation device according to [1], wherein when the natural frequency of the vibration amplifier and the angular velocity corresponding to the rotational speed of the substrate coincide with each other, the vibration amplifier most greatly amplifies the vibration generated when the notch on the peripheral edge of the substrate hits the roller.

[0008] [3] When a ratio of an angular velocity corresponding to a rotational velocity of the substrate to a natural frequency of the vibration amplifier is within a predetermined range, the vibration amplifier amplifies vibrations generated when a notch on a peripheral edge of the substrate hits the roller; The rotational speed calculation device according to [1 or 2], wherein the natural frequency is determined so that the ratio of a predicted angular velocity corresponding to a predicted value of the rotational speed of the substrate to the natural frequency of the vibration amplifier is within the predetermined range.

[0009] [4] the vibration amplifier has a system described by an added mass and a spring constant; The rotation speed calculation device according to any one of [1] to [3], wherein a natural frequency is determined according to the added mass and the spring constant.

[0010] [5] the vibration amplifier has a system described by an added mass, a spring constant, and a damping constant; a natural frequency is determined according to the added mass and the spring constant, The rotation speed calculation device according to any one of [1] to [3], wherein an amplification factor is determined depending on the added mass, the spring constant, and the damping constant.

[0011] [6] The rotation speed calculation device according to any one of [1] to [5], wherein the natural frequency of the vibration amplifier is variable.

[0012] [7] The rotational speed calculation device according to [6], wherein the vibration amplifier is a cantilever beam with a weight attached at a predetermined position, and the natural frequency can be changed by changing the position of the weight.

[0013] [8] There are a plurality of rollers, There are two or more vibration amplifiers and two or more vibration sensors, each of which is provided corresponding to two or more of the plurality of rollers; The rotational speed calculation device according to any one of [1] to [7], wherein the rotational speed calculation unit calculates the rotational speed of the substrate based on the largest vibration among the vibrations detected by the two or more vibration sensors.

[0014] [9] There are a plurality of rollers, There are two or more vibration amplifiers and two or more vibration sensors, each of which is provided corresponding to two or more of the plurality of rollers; The rotational speed calculation device according to any one of [1] to [7], wherein the rotational speed calculation unit calculates the rotational speed of the substrate based on secondary data obtained by performing statistical processing on vibrations detected by the two or more vibration sensors.

[0015]

[10] The rotational speed calculation device according to any one of [1] to [9], wherein the rotational speed calculation unit amplifies a signal corresponding to the vibration detected by the vibration sensor and calculates the rotational speed of the substrate based on the amplified signal.

[0016]

[11] a vibration amplifier that amplifies vibrations generated when a notch on the peripheral edge of the substrate strikes a roller that holds the peripheral edge of the substrate to be cleaned when the substrate is rotated by rotating the roller; a sound sensor that detects sound caused by the amplified vibration; a rotation speed calculation unit that calculates the rotation speed of the substrate based on the sound detected by the sound sensor.

[0017]

[12] The roller; a rotation drive unit that rotates the substrate by driving the roller to rotate; a substrate cleaning tool that comes into contact with the rotating substrate to be cleaned and cleans it; A substrate cleaning apparatus comprising: the rotation speed calculation device according to any one of [1] to

[11] .

[0018]

[13] a substrate polishing apparatus for polishing a substrate;

[12] A substrate processing apparatus comprising: a substrate cleaning apparatus according to

[12] , which cleans a substrate after polishing.

[0019]

[14] a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral edge of the substrate; a second step of amplifying vibrations generated when the notch on the peripheral edge of the substrate hits the roller; a third step of detecting the amplified vibration; and a fourth step of calculating the rotation speed of the substrate based on the detected vibration.

[0020]

[15] a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral edge of the substrate; a second step of amplifying vibrations generated when the notch on the peripheral edge of the substrate hits the roller; a third step of detecting sound caused by the amplified vibrations; and a fourth step of calculating the rotation speed of the substrate based on the detected sound. [Effects of the Invention]

[0021] The rotation speed of the substrate can be calculated with higher accuracy. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a schematic configuration diagram of a substrate processing apparatus 100 according to an embodiment. [Figure 2] 1 is a schematic diagram of a substrate cleaning apparatus 4 according to an embodiment. [Figure 3] FIG. 4 is a plan view showing the arrangement of rollers 42a to 42d and rotational drive units 43a and 43b. [Figure 4] 3A and 3B are diagrams illustrating a notch formed in a substrate W. [Figure 5] 5A and 5B are schematic diagrams illustrating calculation of rotation speed in the present embodiment. [Figure 6] FIG. 10 is a model diagram of an example of a vibration amplifier 51. [Figure 7] 10 is a graph showing an example of the relationship between the angular velocity ω of the substrate W and the amplification factor. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0024] (First embodiment) 1 is a schematic diagram of a substrate processing apparatus 100 according to one embodiment. The substrate processing apparatus 100 is, for example, a CMP apparatus, and includes a substantially rectangular housing 1 and a load port 2 disposed adjacent to the housing 1.

[0025] A substrate cassette (not shown) for stocking a plurality of substrates W is placed on the load port 2. Examples of the substrates W include semiconductor wafers. However, the substrates W to be processed are not limited to semiconductor wafers, and may be other types of substrates used in the manufacture of semiconductor devices, such as glass substrates and ceramic substrates. Furthermore, at least one surface of the substrate W has a semiconductor film, a metal film, or the like formed thereon.

[0026] The substrate processing apparatus 100 includes one or more (four in FIG. 1) substrate polishing apparatuses 3a-3d (which may be collectively referred to as "substrate polishing apparatuses 3" when no particular distinction is made), one or more (two in FIG. 1) substrate cleaning apparatuses 4a, 4b (which may be collectively referred to as "substrate cleaning apparatus 4" when no particular distinction is made), and one or more (one in FIG. 1) substrate drying apparatus 5, all of which are arranged inside a housing 1.

[0027] As an example, substrate polishing apparatuses 3a to 3d are arranged along one longitudinal side of housing 1. Substrate cleaning apparatuses 4a and 4b and substrate drying apparatus 5 are arranged along the other longitudinal side of housing 1.

[0028] The substrate polishing apparatus 3 polishes the surface of the substrate W. More specifically, the substrate polishing apparatus 3 supplies slurry onto the substrate W while rotating the substrate W, and polishes the surface of the substrate W by pressing a polishing member (not shown) against the surface of the substrate W. After polishing, polishing debris and slurry may remain on the substrate W.

[0029] The substrate cleaning apparatus 4 cleans the surface of the polished substrate W. More specifically, the substrate cleaning apparatus 4 cleans the surface of the substrate W by pressing a substrate cleaning tool (not shown in FIG. 1) against the surface of the substrate W while rotating the substrate W. A specific example of the substrate cleaning apparatus 4 will be described later.

[0030] The substrate drying apparatus 5 dries the surface of the cleaned substrate W. For example, the substrate drying apparatus 5 is a spin drying apparatus that dries the substrate W by spraying isopropyl alcohol vapor from a spray nozzle onto the rotating substrate W, while rotating the substrate W at high speed to dry the substrate W by centrifugal force.

[0031] Furthermore, the substrate processing apparatus 100 is equipped with substrate transfer devices 6a to 6d (which may be collectively referred to as "substrate transfer devices 6" when no particular distinction is needed), which are arranged inside the housing 1.

[0032] The substrate transfer device 6a is disposed adjacent to the load port 2. The substrate transfer device 6a receives an unprocessed substrate W from the load port 2 and passes it to the substrate transfer device 6b, and receives a processed substrate W from the substrate transfer device 6b.

[0033] Substrate transport device 6b extends in the longitudinal direction in the center of housing 1. Substrate transport device 6b receives unprocessed substrates W from substrate transport device 6a and transports them to one of substrate polishing devices 3a to 3d, receives polished substrates W from substrate polishing devices 3a to 3d and passes them to substrate transport device 6c, and receives dried substrates W from substrate transport device 6d and passes them to substrate transport device 6a.

[0034] The substrate transfer device 6c is disposed between the substrate cleaning devices 4a and 4b. The substrate transfer device 6c receives the polished substrate W from the substrate transfer device 6b and transfers it to either the substrate cleaning device 4a or 4b, or receives the cleaned substrate W from the substrate cleaning device 4a and transfers it to the substrate cleaning device 4b.

[0035] The substrate transfer device 6d is disposed between the substrate cleaning device 4b and the substrate drying device 5. The substrate transfer device 6d receives the cleaned substrate W from the substrate cleaning device 4b and transfers it to the substrate drying device 5, and receives the dried substrate W from the substrate drying device 5 and passes it to the substrate transfer device 6b.

[0036] The arrangement of the substrate polishing apparatus 3, substrate cleaning apparatus 4, substrate drying apparatus 5, and substrate transport apparatus 6 is merely an example. It is sufficient that one or more substrate transport apparatuses 6 are provided so that the substrate W can be transported through the substrate polishing apparatus 3, substrate cleaning apparatus 4, and substrate drying apparatus 5 in this order.

[0037] 2 is a schematic diagram of a substrate cleaning apparatus 4 according to the first embodiment. The substrate cleaning apparatus 4 includes one or more (four in this embodiment) rollers 42a to 42d (only rollers 42a and 42b are shown in FIG. 2), rotation drivers 43a and 43b, substrate cleaners 44a and 44b, a cleaning liquid supply nozzle 45, and a housing 46.

[0038] The rollers 42a to 42d hold the peripheral edge of the substrate W. The rotation drive units 43a and 43b rotate the rollers 42a to 42d, thereby rotating the substrate W.

[0039] 3 is a plan view showing the arrangement of rollers 42a to 42d and rotation drivers 43a and 43b. Rollers 42a to 42d are arranged in this order at equal intervals in a clockwise direction. For example, rollers 42b and 42d are arranged adjacent to roller 42a, and roller 42c is arranged opposite roller 42a.

[0040] The rotational drive units 43a and 43b have motors (not shown). As shown in Fig. 3, the motor of the rotational drive unit 43a rotates the rollers 42a and 42d via pulleys and belts. The motor of the rotational drive unit 43b rotates the rollers 42b and 42c via pulleys and belts. The rotational drive units 43a and 43b rotate the rollers 42a to 42d in the same direction (counterclockwise in the example shown in Fig. 3). As a result, the substrate W held by the rollers 42a to 42d is rotated in the direction opposite to the rotational direction of the rollers 42a to 42d (clockwise in the example shown in Fig. 3) due to frictional forces acting between each of the rollers 42a to 42d and the peripheral edge of the substrate W.

[0041] In this embodiment, a notch (a V-shaped cutout in part of the substrate W) is formed on the periphery of the substrate W as shown in Fig. 4. Therefore, when the substrate W rotates and the notch comes into contact with the rollers 42a to 42d, vibrations and noise are generated. If the rotation speed (number of rotations per unit time) of the substrate W is constant, vibrations and noise are generated periodically. Therefore, the rotation speed can be calculated from this period.

[0042] 2, the substrate cleaners 44a and 44b come into contact with the upper and lower surfaces of the substrate W, respectively, to clean the substrate W. The substrate cleaners 44a and 44b shown in Fig. 2 are long, cylindrical, roll substrate cleaners (roll sponges) made of, for example, polyvinyl alcohol (PVA). However, instead of roll cleaners, the substrate cleaners 44a and 44b may be, for example, cylindrical pen-type cleaners extending vertically, or buffing / polishing members having a rotation axis extending vertically.

[0043] The cleaning liquid supply nozzle 45 supplies a cleaning liquid to the upper surface of the substrate W. The cleaning liquid may be pure water or a chemical liquid. Also, a cleaning liquid supply nozzle that supplies a cleaning liquid to the lower surface of the substrate W may be provided.

[0044] The housing 46 defines a cleaning space in which the substrate W is cleaned. The housing 46 houses at least the rollers 42a to 42d, the substrate cleaners 44a and 44b, and the cleaning liquid supply nozzle 45, and may further house the rotational drive units 43a and 43b. By arranging the rollers 42a to 42d, the substrate cleaners 44a and 44b, and the cleaning liquid supply nozzle 45 inside the housing 46, the cleaning liquid supplied onto the substrate W is prevented from splashing outside the cleaning space.

[0045] An opening (substrate loading / unloading port) for loading or unloading the substrate W is formed in the side wall of the housing 46, and the substrate loading / unloading port can be opened and closed by shutters 46a, 46b. An exhaust port 46c is also formed in the bottom of the housing 46. Air inside the housing 46 is exhausted through the exhaust port 46c, and air outside the housing 46 flows in through gaps between the substrate loading / unloading port and the shutters 46a, 46b, thereby ventilating the cleaning space.

[0046] One of the features of this embodiment is that a rotational speed calculation device 50 is provided in the substrate cleaning apparatus 4. The rotational speed calculation device 50 may be included in the substrate cleaning apparatus 4 or may be separate from the substrate cleaning apparatus 4. The rotational speed calculation device 50 includes a vibration amplifier 51, a vibration sensor 52, and a rotational speed calculation unit 53.

[0047] The vibration amplifier 51 amplifies the vibrations generated when the notch of the substrate W hits the rollers 42a to 42d. More specifically, the vibration amplifier 51 is provided corresponding to one of the rollers 42a to 42d (roller 42a in the example of FIG. 2), and detects the vibrations generated when the notch of the substrate W hits the roller 42a to 42d. There are no particular restrictions on the installation position of the vibration amplifier 51, but it is desirable to install it in a non-rotating part and near the vibration source, such as a non-rotating part of the shaft supporting the rollers 42a to 42d or a non-rotating part of the structure supporting the rotational drive units 43a and 43b. Details of the vibration amplifier 51 will be described later.

[0048] During substrate cleaning, the vibration sensor 52 detects the vibrations amplified by the vibration amplifier 51. There are no particular restrictions on the installation position of the vibration sensor 52, but it is installed near the vibration amplifier 51, for example.

[0049] The rotation speed calculation unit 53 calculates the rotation speed of the substrate W based on the vibration detected by the vibration sensor 52.

[0050] 5 is a schematic diagram for explaining the calculation of the rotation speed in this embodiment. In this example, it is assumed that a vibration amplifier 51 and a vibration sensor 52 are disposed near the roller 42a. 5(a) shows vibrations generated when the notch of the substrate W hits the rollers 42a to 42d. Times t1 to t4 are the timings when vibrations are generated when the notch hits the rollers 42a to 42d, respectively. If the rollers 42a to 42d are arranged at equal intervals, times t1 to t2, t2 to t3, etc. correspond to one-fourth of the period (T / 4). However, the vibrations generated at each time are not necessarily large enough to allow the rotation speed to be calculated. There is also a possibility that vibrations that become noise are generated.

[0051] FIG. 5(b) shows vibrations generated when the notch of the substrate W hits rollers 42a to 42d, which are amplified by vibration amplifier 51 and detected by vibration sensor 52. Time t1 is the timing when vibration occurs when the notch hits roller 42a. If vibration sensor 52 is located near roller 42a, large vibrations are detected. Time t2 is the timing when vibration occurs when the notch hits roller 42b. This vibration propagates through the substrate W or housing 46, is amplified by vibration amplifier 51, and is detected by vibration sensor 52. Since vibration sensor 52 is located away from roller 42b, the detected vibrations are small, but are large enough to allow the rotation speed to be calculated.

[0052] 5(b) is detected by the vibration sensor 52, allowing the rotation speed calculation unit 53 to accurately calculate the rotation speed of the substrate W. For example, the rotation speed calculation unit 53 can calculate the rotation speed of the substrate W from the period T / 4 at which the signal shown in FIG. 5(b) becomes equal to or greater than a predetermined value. Alternatively, the rotation speed calculation unit 53 can calculate the rotation speed of the substrate W from the number of times per unit time that the signal shown in FIG. 5(b) becomes equal to or greater than a predetermined value.

[0053] Figure 6 is a model diagram of an example of a vibration amplifier 51. As shown in the figure, the vibration amplifier 51 has a system described by an added mass m, a spring constant k, and a damping constant c. As a specific example, the vibration amplifier 51 can be considered to be configured such that an object with added mass m is attached to a vibration amplification target (in this embodiment, roller 42a) via a spring with a spring constant k and a vibration-isolating rubber with a damping coefficient c. Such a vibration amplifier 51 is also called a spring-mass system or a dynamic damper.

[0054] Assume that vibration expressed as Fcosωt is applied to this system when the notch hits the roller 42a. Here, ω corresponds to the rotational speed N of the substrate W (ω=2πN). F corresponds to the magnitude of the vibration. t is time. The equation of motion in this case is expressed by the following equation (1).

number

[0055] The general solution of this equation of motion is expressed by the following equation (2).

number

[0056] In equation (2), the amplitude x0 is expressed by the following equation (3).

number

[0057] The natural frequency ω0 and the damping ratio ζ in equation (3) are expressed by the following equations (4) to (6).

number

[0058] In this way, the natural frequency ω0 is determined according to the added mass m and spring constant k. In the above equation (3), F / k is the static displacement when a static force F is applied. Therefore, if xs = F / k, the above equation (3) can be expressed as the following equation (7).

number

[0059] Therefore, the amplitude magnification (amplification rate) xa / xs is expressed by the following equation (8).

number

[0060] In this way, the amplitude magnification is determined according to the natural frequency ω0 and the damping ratio ζ. Referring to the above equations (4) to (6), the amplitude magnification is determined according to the added mass m, the spring constant k, and the damping constant c.

[0061] According to the above formula (8), when the angular velocity of the substrate W is ω (that is, when the rotational speed N is ω / 2π), the vibration generated by the notch of the substrate W hitting the roller 42a is amplified by the right side of the formula (8).

[0062] FIG. 7 is a graph showing an example of the relationship between the angular velocity ω of the substrate W and the amplification factor, which is calculated with damping ratios ζ of 0.05, 0.1, and 0.2. In any case, when the natural angular frequency ω0 and the angular velocity ω of the substrate W coincide, the amplification factor becomes the largest. It can also be said that when the natural angular frequency ω0 of the vibration amplifier 51 and the angular velocity (frequency) corresponding to the rotational speed N of the substrate W coincide, the vibration amplifier 51 amplifies the vibration the most.

[0063] Also, in FIG. 7, even if the natural angular frequency ω0 and the angular velocity ω of the substrate W do not completely coincide, if ω / ω0 < 1.4, the amplification factor becomes 1 or more, and the vibration generated by the notch of the substrate W hitting the roller 42a is amplified. Therefore, when the amplification factor becomes 1 or more if ω / ω0 < A, for the predicted angular velocity ωp corresponding to the predicted value of the rotational speed of the substrate W, the natural angular frequency ω0 may be designed so that ωp / ω0 < A.

[0064] Such a vibration amplifier 51 having the natural angular frequency ω0 may be applied, or the natural angular frequency of the vibration amplifier 51 may be variable.[[ID=十三]]

[0065] For example, there are four rollers 42a to 42d, and the predicted value of the rotational speed N of the substrate W is set to 200 rpm. In this case, the frequency of the substrate W is 4 * 200 / 60 = 13.3 Hz, and the angular velocity ω is 13.3 * 2π = 83.6 rad / s. Therefore, the natural angular frequency ω0 may be 13.3 Hz. As an example, by setting the added mass m = 2.85 kg and the spring constant k = 20 N / mm, the natural angular frequency ω0 = 83.6 rad / s (13.3 Hz) can be obtained.

[0066] The vibration amplifier 51 is, for example, a cantilever beam, with a weight attached at a predetermined position on the beam. The spring constant k changes by changing the position of the weight (the distance from the base of the beam). More specifically, by moving the position of the weight away from the base of the beam, the effective length of the beam increases, and the spring constant k decreases. In this way, the natural frequency of the vibration amplifier 51 can be varied. Alternatively, the natural frequency can be varied by adjusting the weight of the weight to change the added mass m. The natural frequency may also be adjusted by other methods to change at least one of the added mass m and the spring constant k.

[0067] As described above, in this embodiment, the vibrations generated when the notches hit the rollers 42a to 42d are amplified, and the rotation speed of the substrate W is calculated based on the amplified vibrations. Therefore, even if the generated vibrations are small, the rotation speed of the substrate can be calculated with high accuracy.

[0068] It is also possible to provide a vibration amplifier 51 and a vibration sensor 52 corresponding to two or more of the rollers 42a to 42d. The rotational speed calculation unit 53 may then calculate the rotational speed of the substrate W based on the largest vibration among the vibrations detected by the two or more vibration sensors 52. Alternatively, the rotational speed calculation unit 53 may calculate the rotational speed of the substrate W based on the results of secondary data obtained by performing statistical processing (arithmetic sum or product, energy sum or product, etc.) on the vibrations detected by the two or more vibration sensors.

[0069] Furthermore, the rotation speed calculation unit 53 may amplify a signal corresponding to the vibration detected by the vibration sensor 52 and calculate the rotation speed of the substrate W based on the amplified signal. Considering that the signal corresponding to the detected vibration is an impulse-like signal in the time-axis waveform, one possible amplification process is to square the signal.

[0070] Furthermore, the vibration sensor 52 in the above embodiment may be replaced with a sound sensor. The vibrations generated when the notches hit the rollers 42a to 42d are amplified, and the sound generated when the notches hit the rollers 42a to 42d is also amplified. That is, in this case, the sound sensor detects the sound caused by the vibrations amplified by the vibration sensor 52. This sound has a waveform as shown in FIG. 5(b), and therefore the rotation speed calculation unit 53 can calculate the rotation speed of the substrate W based on the detected sound.

[0071] Any part or all of the functional units described in this specification may be realized by a program. The program mentioned in this specification may be distributed by being non-temporarily recorded on a computer-readable recording medium, or may be distributed via a communication line (including wireless communication) such as the Internet, or may be distributed in a state where it is installed on any terminal.

[0072] Based on the above description, a person skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. For example, inventions that extract only a part of each embodiment or inventions that combine multiple embodiments are naturally envisioned. Various additions, modifications, and partial deletions are possible within the scope of the conceptual idea and spirit of the present invention, which can be derived from the content defined in the claims and their equivalents.

[0073] For example, what is described in this specification as a single device (or component, the same applies hereinafter) (including what is depicted as a single device in the drawings) may be realized by multiple devices. Conversely, what is described in this specification as multiple devices (including what is depicted as multiple devices in the drawings) may be realized by a single device. Alternatively, some or all of the means or functions included in one device may be included in another device. Furthermore, a "system" may be composed of a single device, or may be composed of two or more devices.

[0074] Furthermore, not all of the features described in this specification are essential requirements. In particular, features described in this specification but not included in the claims can be considered optional additional features.

[0075] Furthermore, unless otherwise specified, the term "means" in this specification and claims refers to hardware itself (or a function realized by hardware) and does not include a human being (or human mental activity).

[0076] It should be noted that the applicant is only aware of the inventions disclosed in the documents listed in the "Prior Art Documents" section of this specification, and the present invention does not necessarily aim to solve the problems of the disclosed inventions. The problem that the present invention aims to solve should be determined by taking into consideration the entire specification. For example, if this specification states that a specific configuration achieves a certain effect, it can also be said that the present invention solves a problem that is the reverse of that effect. However, it is not necessarily intended that such a specific configuration be an essential requirement. [Explanation of symbols]

[0077] 100 Substrate processing apparatus 1. Housing 2 Loading port 3,3a~3d Substrate polishing equipment 4, 4a, 4b Substrate cleaning equipment 5 Substrate drying equipment 6, 6a to 6c Substrate transport device 42a~42d Laura 43a, 43b Rotation drive unit 44a, 44b Substrate cleaning tool 45 Cleaning liquid supply nozzle 46 Case 50 Rotational speed calculation device 51 Vibration Amplifier 52 Vibration Sensor 53 Rotational speed calculation unit

Claims

1. a vibration amplifier that amplifies vibrations generated when a notch on the peripheral edge of the substrate strikes a roller that holds the peripheral edge of the substrate to be cleaned when the substrate is rotated by rotating the roller; one or more vibration sensors that detect the amplified vibrations; a rotational speed calculation unit that calculates the rotational speed of the substrate based on the vibration detected by the vibration sensor.

2. 2. The rotational speed calculation device according to claim 1, wherein when a natural frequency of the vibration amplifier coincides with an angular velocity corresponding to the rotational speed of the substrate, the vibration amplifier most greatly amplifies vibrations generated when a notch on the peripheral edge of the substrate hits the roller.

3. When a ratio of an angular velocity corresponding to a rotational velocity of the substrate to a natural frequency of the vibration amplifier is within a predetermined range, the vibration amplifier amplifies vibrations generated when a notch on a peripheral edge of the substrate hits the roller; 3. The rotational speed calculation device according to claim 1, wherein the natural frequency of the vibration amplifier is determined so that a ratio of a predicted angular velocity corresponding to a predicted value of the rotational speed of the substrate to the natural frequency of the vibration amplifier falls within the predetermined range.

4. the vibration amplifier has a system described by an added mass and a spring constant; 3. The rotational speed calculation device according to claim 1, wherein a natural frequency is determined in accordance with the added mass and the spring constant.

5. the vibration amplifier has a system described by an added mass, a spring constant, and a damping constant; a natural frequency is determined according to the added mass and the spring constant, 3. The rotational speed calculation device according to claim 1, wherein an amplification factor is determined in accordance with the added mass, the spring constant, and the damping constant.

6. 3. The rotational speed calculation device according to claim 1, wherein the natural frequency of the vibration amplifier is variable.

7. 7. The rotational speed calculation device according to claim 6, wherein the vibration amplifier is a cantilever beam having a weight attached at a predetermined position, and the natural frequency can be changed by changing the position of the weight.

8. There are a plurality of rollers, two or more vibration amplifiers and two or more vibration sensors are provided corresponding to two or more of the plurality of rollers, 3. The rotational speed calculation device according to claim 1, wherein the rotational speed calculation unit calculates the rotational speed of the substrate based on the largest vibration among the vibrations detected by the two or more vibration sensors.

9. There are a plurality of rollers, two or more vibration amplifiers and two or more vibration sensors are provided corresponding to two or more of the plurality of rollers, 3. The rotational speed calculation device according to claim 1, wherein the rotational speed calculation unit calculates the rotational speed of the substrate based on secondary data obtained by performing statistical processing on vibrations detected by the two or more vibration sensors.

10. 3. The rotational speed calculation device according to claim 1, wherein the rotational speed calculation section amplifies a signal corresponding to the vibration detected by the vibration sensor, and calculates the rotational speed of the substrate based on the amplified signal.

11. a vibration amplifier that amplifies vibrations generated when a notch on the peripheral edge of the substrate strikes a roller that holds the peripheral edge of the substrate to be cleaned when the substrate is rotated by rotating the roller; a sound sensor that detects sound caused by the amplified vibration; a rotation speed calculation unit that calculates the rotation speed of the substrate based on the sound detected by the sound sensor.

12. The roller; a rotation drive unit that rotates the substrate by driving the roller to rotate; a substrate cleaning tool that comes into contact with the rotating substrate to be cleaned and cleans it; A substrate cleaning apparatus comprising: the rotational speed calculation device according to claim 1 or 2.

13. a substrate polishing apparatus for polishing a substrate; A substrate processing apparatus comprising: the substrate cleaning apparatus according to claim 12, which cleans a substrate after polishing.

14. a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral edge of the substrate; a second step of amplifying vibrations generated when the notch on the peripheral edge of the substrate hits the roller; a third step of detecting the amplified vibration; and a fourth step of calculating the rotational speed of the substrate based on the detected vibration.

15. a first step of rotating a substrate to be cleaned by rotating a roller that holds a peripheral edge of the substrate; a second step of amplifying vibrations generated when the notch on the peripheral edge of the substrate hits the roller; a third step of detecting sound caused by the amplified vibration; and a fourth step of calculating the rotation speed of the substrate based on the detected sound.

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