Printed circuit board for battery pack capable of measuring temperature and its manufacturing method

The integration of a conductive pattern and thermistor on a flexible film in a printed circuit board allows for efficient temperature measurement in battery packs, addressing the need for effective temperature control and performance management.

JP2025502430APending Publication Date: 2025-01-24LG ENERGY SOLUTION LTD
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Patent Information

Application Number
JP2024543165
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-01-28
Filing Date
2023-01-20
Publication Date
2025-01-24

AI Technical Summary

Technical Problem

Existing battery packs lack an efficient and easy method for temperature measurement, which is crucial for effective temperature control and performance management.

Method used

A printed circuit board with a conductive pattern and integrated temperature element, such as a thermistor, is embedded in a flexible film to measure the temperature of battery packs, utilizing silver and nickel oxide materials for conductivity and temperature sensing.

Benefits of technology

Enables easy and accurate temperature measurement within battery packs, preventing structural issues and ensuring reliable temperature control without protrusions or insulation problems.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a manufacturing method thereof. The printed circuit board for a battery pack capable of measuring temperature according to the present invention is a printed circuit board provided in a battery pack including a plurality of secondary batteries, and includes a film, a conductive pattern provided in a first portion of the film, and a temperature element provided in a second portion of the film for measuring the temperature inside the battery pack.
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Description

[Technical field]

[0001] This application claims the benefit of priority based on Korean Patent Application No. 10-2022-0013746 filed on January 28, 2022, and all contents disclosed in the documents of that Korean patent application are incorporated herein by reference.

[0002] The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a method for manufacturing the same. [Background technology]

[0003] Unlike primary batteries, secondary batteries can be recharged, and they have the potential to be small and have large capacity, so they have been actively researched and developed in recent years. With technological development and increasing demand for mobile devices, the demand for secondary batteries as an energy source is rapidly increasing.

[0004] Secondary batteries are classified into coin type batteries, cylindrical type batteries, square type batteries, and pouch type batteries depending on the shape of the battery case. In the secondary battery, the electrode assembly installed inside the battery case is a power generating element that can be charged and discharged and has a laminated structure of electrodes and a separator.

[0005] Secondary batteries have attracted considerable attention as energy sources not only for mobile devices such as mobile phones, digital cameras, and notebook computers, but also for power plants such as electric bicycles, electric cars, and hybrid electric cars.

[0006] Small devices such as mobile phones and cameras use small battery packs that contain one battery cell, while medium- to large-sized devices such as notebook computers and electric cars use medium- to large-sized battery packs that contain two or more battery cells connected in parallel and / or series. Therefore, the number of battery cells included in the battery pack can be set in various ways depending on the required output voltage or charge / discharge capacity.

[0007] Meanwhile, when a battery pack is constructed by connecting a plurality of battery cells in series / parallel, a method is generally used in which a battery module consisting of at least one battery cell is constructed first, and then the battery pack is constructed by adding other components using the at least one battery module. The number of battery modules included in the battery pack or the number of battery cells included in the battery module can be set in various ways depending on the required output voltage or charge / discharge capacity. The battery module thus configured is configured to include a plurality of battery cells stacked on top of each other, and a busbar that electrically connects the electrode leads of the plurality of battery cells.

[0008] In order to prevent the performance of the battery pack from deteriorating, a battery temperature management system is installed in the vehicle. In addition, sensing is required to manage the temperature of the battery pack, and a temperature sensor is required for sensing. Summary of the Invention [Problem to be solved by the invention]

[0009] SUMMARY OF THE PRESENT EMBODIMENT An aspect of the present invention is to provide a printed circuit board for a battery pack capable of easily sensing the temperature of the battery pack, and a method for manufacturing the same. [Means for solving the problem]

[0010] A printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention may be a printed circuit board provided in a battery pack including a plurality of secondary batteries, and may include a film, a conductive pattern provided in a first portion of the film, and a temperature element provided in a second portion of the film and for measuring a temperature within the battery pack.

[0011] A manufacturing method for a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention, in a manufacturing method for a printed circuit board provided in a battery pack including a plurality of secondary batteries, may include a film preparation step of preparing a film, a conductive pattern formation step of forming a conductive pattern in a first portion of the prepared film, and a temperature element formation step of forming a temperature element in a second portion of the film after the conductive pattern is formed, the temperature element measuring a temperature inside the battery pack. Effect of the Invention

[0012] According to the present invention, a temperature element is provided on the printed circuit board provided in the battery pack, so that the temperature of the battery pack can be easily measured. [Brief description of the drawings]

[0013] [Figure 1] 1 is a cross-sectional view showing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention. [Diagram 2] 1 is an exploded perspective view showing a battery pack to which a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention is applied; [Diagram 3] 1 is a perspective view showing a main part of a battery pack to which a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention is applied; [Figure 4] 1 is a front view conceptually showing a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention. [Diagram 5] 4 is a cross-sectional view showing a temperature element forming step in a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention. [Figure 6] 4 is a front view showing a cover layer forming step in a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The object, particular advantages, and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. In this specification, when referring to components in each drawing, it should be noted that the same components are given the same reference numerals as much as possible even if they are shown in different drawings. In addition, the present invention can be realized in various different forms, and is not limited to the embodiments described below. Furthermore, in describing the present invention, detailed descriptions of related publicly known techniques that may obscure the gist of the present invention will be omitted.

[0015] [Printed circuit board for battery pack capable of measuring temperature according to an embodiment of the present invention] FIG. 1 is a cross-sectional view showing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view showing a battery pack to which a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention is applied.

[0016] 1 and 2, a printed circuit board 100 for a battery pack capable of measuring temperature according to an embodiment of the present invention is provided in a battery pack 1000 including a plurality of secondary batteries 210, and includes a film 110, a conductive pattern 130 formed in a first portion of the film 110, and a temperature element 140 formed in a second portion of the film 110 to measure a temperature within the battery pack 1000. The printed circuit board 100 for a battery pack capable of measuring temperature according to an embodiment of the present invention may further include a cover layer 150 and a binder 120.

[0017] FIG. 3 is a perspective view showing a main part of a battery pack to which a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention is applied.

[0018] 1 to 3, a battery pack 1000 to which the printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention is applied may include a cell stack 200 in which a plurality of secondary batteries 210 are stacked, bus bar frames 400, 500 that electrically connect electrode leads 211 of the plurality of secondary batteries 210, and a pack case 300 that houses the cell stack 200 and the bus bar frames 400, 500. In addition, the battery pack 1000 may further include end plates 600, 700 that cover openings on both sides of the pack case 300.

[0019] The printed circuit board for a battery pack capable of measuring temperature according to the embodiment of the present invention is, for example, a flexible printed circuit board (FPC) that connects a plurality of bus bar frames 400, 500. However, the printed circuit board for a battery pack capable of measuring temperature according to the embodiment of the present invention is not necessarily limited to a flexible printed circuit board that connects bus bar frames 400, 500, and can be applied to any flexible printed circuit board that can be used in a battery pack 1000.

[0020] The cell stack 200 may form a stack of multiple secondary batteries 210 containing an electrolyte.

[0021] The secondary battery 210 may include an electrode assembly, an electrolyte, and a pouch that contains the electrode assembly and the electrolyte.

[0022] The electrode assembly is a power generating element capable of charging and discharging, and may be formed by alternately stacking electrodes and separators. Here, the electrodes may include positive and negative electrodes, and the positive electrodes, separators, and negative electrodes may be alternately stacked. Here, the separator separates and electrically insulates the positive and negative electrodes.

[0023] The secondary battery 210 may further include an electrode lead 211 having one side connected to an electrode of the electrode assembly and the other side extending outside the pouch.

[0024] The electrode lead 211 may include a positive electrode lead connected to the positive electrode and a negative electrode lead connected to the negative electrode.

[0025] Referring to FIG. 1, a film 110 may be provided in the form of a sheet.

[0026] Also, the film 110 may be made of an insulating material and a flexible material. Here, the film 110 may include, for example, a resin. Here, as a specific example, the film 110 may be made of a synthetic resin.

[0027] Additionally, the film 110 may provide a substrate on which the conductive pattern 130 and the temperature element 140 are printed.

[0028] The conductive pattern 130 may be formed in a first portion of the film 110. Here, the conductive pattern 130 may be located in the first portion on one surface of the film 110.

[0029] The conductive pattern 130 may be of an ink type and may be provided in a form printed on the film 110. Here, the conductive pattern 130 may be printed on a first portion on one surface of the film 110.

[0030] Also, the conductive pattern 130 may be made of a silver (Ag) material.

[0031] Furthermore, the conductive pattern 130 may be, for example, an electrically conductive circuit pattern.

[0032] Temperature element 140 may be formed in a second portion of film 110 to measure the temperature inside battery pack 1000. Here, temperature element 140 may be located in the second portion on one side of film 110.

[0033] Also, the temperature element may be located between the conductive patterns 130. Here, the temperature element may be provided so as to be in contact with the conductive patterns 130. Here, for example, the conductive patterns 130 may be in contact with both sides of the temperature element.

[0034] The temperature element 140 may be of an ink type and may be provided in a form printed on the film 110. Here, the temperature element 140 may be printed on a second portion on one surface of the film 110. Here, the temperature element 140 may form, for example, a pattern.

[0035] Furthermore, the temperature element may be a thermistor. A thermistor is an element whose electrical resistance changes depending on temperature, so that the temperature can be measured by the resistance of the temperature element.

[0036] Here, the temperature element may include a nickel oxide (NiO) material.

[0037] The cover layer 150 may cover the conductive pattern 130 and the temperature element 140. Here, the cover layer 150 may be located on one side of the film 110 and coat the conductive pattern 130 and the temperature element 140 printed on one side of the film 110.

[0038] The cover layer 150 may also include an insulating material.

[0039] Furthermore, the cover layer 150 may be made of, for example, resin.

[0040] The binder 120 can bond the conductive pattern 130 and the temperature element 140 to the film 110 .

[0041] Additionally, the binder 120 may be located between the conductive pattern 130 and the temperature element 140 and the film 110 to form a layer.

[0042] [Method of manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention] Hereinafter, a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention will be described.

[0043] FIG. 4 is a front view conceptually showing a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention.

[0044] 1 and 4, the method for manufacturing a secondary battery according to an embodiment of the present invention is a method for manufacturing a printed circuit board included in a battery pack 1000 including a plurality of secondary batteries 210, and includes a film preparation step of preparing a film 110, a conductive pattern formation step of forming a conductive pattern 130 in a first portion of the prepared film 110, and a temperature element formation step of forming a temperature element 140 for measuring a temperature inside the battery pack 1000 in a second portion of the film 110 after the conductive pattern 130 is formed. In addition, the method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention includes a cover layer formation step and a binder application step.

[0045] The method for manufacturing a temperature-measurable printed circuit board for a battery pack according to an embodiment of the present invention relates to a method for manufacturing a temperature-measurable printed circuit board for a battery pack 100 according to the above-described embodiment. Therefore, in this embodiment, the contents overlapping with the above-described embodiment will be omitted or will be described briefly, and differences will be mainly described.

[0046] More specifically, in the film preparation step, a film 110 can be prepared. Here, in the film preparation step, a sheet-like film 110 can be prepared.

[0047] Here, the film 110 may be made of an insulating material and a flexible material. Here, the film 110 may include, for example, a resin. Here, the film 110 may be made of a synthetic resin, for example.

[0048] Meanwhile, the film 110 may move in a traveling direction G through a binder application step, a conductive pattern formation step, a temperature element formation step, and a cover layer formation step, and the movement may be guided by a guide roller. Here, the guide roller 70 may include a first guide roller 71, a second guide roller 72, and a third guide roller 73.

[0049] Referring to Figures 1 and 4, in the binder application step, between the film preparation step and the conductive pattern formation step, a binder 120 can be applied to the film 110 so as to adhere the conductive pattern 130 and the temperature element 140 to the film 110.

[0050] In addition, in the binder application step, the binder 120 can be positioned between the conductive pattern 130 and the temperature element 140 and the film 110 to form a layer.

[0051] Furthermore, in the binder application step, the binder ink contained in a binder pool 20 can be applied to one side of the film 110 by the binder roller 10 .

[0052] On the other hand, in the binder application step, the other surface of the film 110 comes into contact with the first guide roller 71, and the first guide roller 71 can guide the movement of the film 110. Here, the first guide roller 71 can face the binder roller 10 with the film 110 interposed therebetween.

[0053] In the conductive pattern forming step, the conductive pattern 130 can be formed on a first portion of the prepared film 110. Here, in the conductive pattern forming step, the conductive pattern 130 can be positioned on one surface of the film 110 at the first portion.

[0054] Also, in the conductive pattern forming step, the conductive pattern 130 may be formed by printing a conductive pattern ink on the film 110. Here, the conductive pattern 130 may be made of a silver (Ag) material.

[0055] Furthermore, in the conductive pattern forming step, the conductive pattern roller 30 can print silver (Ag) ink stored in the conductive pattern pool 40 on a first portion on one side of the film 110. Here, in the conductive pattern forming step, the conductive pattern roller 30 can print silver (Ag) ink on a first portion on one side of the film 110 on which the binder 120 is applied.

[0056] The conductive pattern roller 30 may be a roll type printing type, and a pattern corresponding to the conductive pattern 130 may be formed along the outer circumferential surface.

[0057] Therefore, in the conductive pattern forming step, the conductive pattern 130 can be nano-printed directly on the film using silver (Ag) ink by the conductive pattern roller 30. As a result, the conductive pattern 130 does not protrude, and structural problems due to protrusion can be prevented. In addition, the conductive pattern 130 is made of silver (Ag) material with excellent water resistance, and insulation problems caused by vulnerability to moisture can be prevented.

[0058] Meanwhile, in the conductive pattern forming step, the other surface of the film 110 comes into contact with the second guide roller 72, and the second guide roller 72 can guide the movement of the film 110. Here, the second guide roller 72 can face the conductive pattern roller 30 with the film 110 interposed therebetween.

[0059] FIG. 5 is a cross-sectional view showing a temperature element forming step in a method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention.

[0060] 4 and 5, in the temperature element forming step, after the conductive pattern 130 is formed, a temperature element 140 for measuring the temperature inside the battery pack 1000 can be formed in a second portion of the film 110. Here, in the temperature element forming step, the temperature element 140 can be located in the second portion on one side of the film 110.

[0061] In addition, in the temperature element forming step, the temperature element 140 can be formed by printing temperature element ink on the film 110 .

[0062] Furthermore, the temperature element may be a thermistor, where the temperature element may include a nickel oxide (NiO) material.

[0063] Furthermore, in the temperature element forming step, the temperature element roller 50 can print the nickel oxide (NiO) ink contained in the temperature element pool 60 on a second portion on one side of the film 110. Here, in the temperature element forming step, the temperature element roller 50 can print the nickel oxide (NiO) ink on a second portion on one side of the film 110 on which the binder 120 is applied.

[0064] The temperature element roller 50 may be a roll type printing type, and a pattern corresponding to the temperature element 140 pattern may be formed along the outer circumferential surface.

[0065] Therefore, in the temperature element formation step, the temperature element 140 pattern can be nano-printed directly on the film 110 by the temperature element roller 50 using nickel oxide (NiO) ink. As a result, the temperature element 140 pattern does not protrude, preventing structural problems due to protrusion. Also, since the SMT (Surface Mounted Technology) process for structurally mounting the temperature element 140 is not used, manufacturing is easy. Furthermore, the temperature element 140 is made of nickel oxide (NiO), which is easy to measure the temperature, and the temperature inside the battery pack 1000 can be measured easily and accurately.

[0066] Meanwhile, in the temperature element forming step, the other surface of film 110 comes into contact with third guide roller 73, and third guide roller 73 can guide the movement of film 110. Here, third guide roller 73 can face temperature element roller 50 with film 110 interposed therebetween.

[0067] FIG. 6 is a front view showing a cover layer forming step in the method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to an embodiment of the present invention.

[0068] 1, 4 and 6, in the cover layer formation step, after the temperature element formation step, a cover layer 150 covering the conductive pattern 130 and the temperature element 140 can be formed.

[0069] Here, in the cover layer forming step, the cover layer 150 may be positioned on one side of the film 110 to coat the conductive pattern 130 and the temperature element 140 printed on one side of the film 110 .

[0070] The cover layer 150 may include an insulating material and may be made of, for example, resin.

[0071] Furthermore, in the cover layer forming step, a cover sheet can be laminated onto one side of the film 110 by a lamination roller 80 to form a cover layer 150 .

[0072] The lamination roller 80 may include an upper lamination roller 81 and a lower lamination roller 82. Here, in the cover layer forming step, the film 110 on which the conductive pattern 130 and the temperature element 140 are printed and the cover sheet are passed between the upper lamination roller 81 and the lower lamination roller 82, and can be bonded to each other by applying heat and pressure.

[0073] Although the present invention has been described in detail above with reference to specific embodiments, these are for the purpose of specifically explaining the present invention, and the present invention is not limited thereto. It can be said that various implementations are possible within the technical concept of the present invention by those having ordinary skill in the art.

[0074] Moreover, the specific scope of protection of the invention will be made clear by the appended claims. [Explanation of symbols]

[0075] 10 Binder roller 20. Binder Pool 30 Conductive Pattern Roller 40 Conductive Pattern Pool 50 Temperature element roller 60 Temperature Element Pool 70 Guide roller 71 First guide roller 72 Second guide roller 73 3rd guide roller 80 Lamination roller 81 Upper Laminar Roller 82 Lower Laminar Roller 100 Printed Circuit Board 110 Film 120 Binder 130 Conduction Pattern 140 Temperature element 150 Cover Layer 200 cell stack 210 Secondary battery 211 Electrode Lead 300 pack case 400, 500 busbar frame 600, 700 End Plates 1000 Battery Packs

Claims

1. A printed circuit board provided in a battery pack including a plurality of secondary batteries, Film and a conductive pattern disposed on a first portion of the film; a temperature element provided on the second portion of the film for measuring a temperature inside the battery pack.

2. the conductive pattern is located on the first portion on one side of the film; The printed circuit board for a battery pack capable of measuring temperature according to claim 1 , wherein the temperature element is located on the second portion on one surface of the film.

3. 3. The printed circuit board for a battery pack capable of measuring temperature according to claim 1, further comprising a cover layer covering the conductive pattern and the temperature element.

4. 3. The printed circuit board for a battery pack capable of measuring temperature according to claim 1, wherein the conductive pattern is made of a silver (Ag) material.

5. 3. The printed circuit board for a battery pack capable of measuring temperature according to claim 1, wherein the temperature element is a thermistor.

6. the conductive pattern is of ink type; The printed circuit board for a battery pack capable of measuring temperature according to claim 5 , wherein the temperature element is an ink-type thermistor and is provided in a form printed on the film.

7. 7. The printed circuit board for a battery pack capable of measuring temperature according to claim 6, wherein the temperature element is made of nickel oxide (NiO).

8. 3. The printed circuit board for a battery pack capable of measuring temperature according to claim 1, further comprising a binder that bonds the conductive pattern and the temperature element to the film.

9. A method for manufacturing a printed circuit board provided in a battery pack including a plurality of secondary batteries, comprising the steps of: a film preparation step of preparing a film; A conductive pattern forming step of forming a conductive pattern on a first portion of the film provided; and forming a temperature element on the second portion of the film after the conductive pattern is formed, the temperature element measuring a temperature inside the battery pack.

10. In the conductive pattern forming step, the conductive pattern is positioned on the first portion on one surface of the film; The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9 , wherein in the temperature element forming step, the temperature element is positioned in the second portion on one surface of the film.

11. 11. The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9, further comprising the step of forming a cover layer to cover the conductive pattern and the temperature element after the temperature element forming step.

12. In the conductive pattern forming step, the conductive pattern is formed by printing a conductive pattern ink on the film; 11. The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9, wherein in the temperature element forming step, the temperature element is formed by printing a temperature element ink on the film.

13. The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9 or 10, wherein the conductive pattern is made of a silver (Ag) material.

14. 11. The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9 or 10, wherein the temperature element is made of a nickel oxide (NiO) material.

15. Between the film preparation step and the conductive pattern formation step, 11. The method for manufacturing a printed circuit board for a battery pack capable of measuring temperature according to claim 9, further comprising a binder applying step of applying a binder to the film so as to bond the conductive pattern and the temperature element to the film.

Citation Information

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