Solder paste supply feedback system and circuit board printer using same

Abstract

The present application provides a solder paste delivery feedback system 10 for a circuit board printer. The system 10 includes a solder paste container 101, a solder paste extrusion device, a first sensor, a second sensor, and a controller. The solder paste container 101 is used to contain solder paste and has an outlet. The solder paste extrusion device is used to extrude the solder paste from the outlet of the solder paste container 101. The first sensor is used to sense the solder paste in the solder paste container 101 and generate a first signal indicative of whether the solder paste container 101 still contains solder paste. The second sensor is used to sense an operating state of the solder paste container 101 and generate a second signal indicative of whether the solder paste is being extruded from the outlet of the solder paste container 101. The controller is used to receive the first signal and the second signal, and to control the operation of the circuit board printer according to the instructions of the first signal and the second signal.

Description

[Technical field]

[0001] Technical Field The present invention relates to a solder paste dispensing feedback system for a circuit board printer, and to a circuit board printer using a solder paste dispensing feedback system. [Background technology]

[0002] Background technology In manufacturing surface mount printed circuit boards, a circuit board printer can be used to print solder paste onto the circuit board before electronic components can be deposited on the circuit board. A circuit board having a conductive surface is transported into the circuit board printer and properly aligned from below by one or more small holes or marks (called "fiducials") on the circuit board with openings in the stencil of the circuit board printer. A solder paste dispenser of the circuit board printer moves down from above the stencil to a height close to the stencil and extrudes solder paste from a solder paste cartridge onto the stencil. After the solder paste is dispensed onto the stencil, a squeegee of the circuit board printer moves against the top surface of the stencil and extrudes the solder paste through the openings in the stencil and onto the conductive surface of the circuit board. The solder paste is typically dispensed onto the stencil from a standard solder paste cartridge. The solder paste cartridge contains a limited amount of solder paste, and after all the solder paste in the solder paste cartridge has been dispensed, the cartridge must be replaced with a new solder paste cartridge for dispensing. Summary of the Invention

[0003] The present application provides a solder paste supply (dispensing) feedback system that makes it possible to determine whether the solder paste in a solder paste cartridge has been used up, thus helping to improve the operating efficiency of a circuit board printer and ensure print quality.

[0004] The solder paste supply feedback system provided herein uses two sensors, and the control device determines whether the solder paste in the solder paste cartridge is exhausted according to the results detected by both sensors, so that the controller can more accurately determine whether the solder paste in the solder paste cartridge is exhausted, and control the operation of the circuit board printer accordingly.

[0005] According to one aspect of the present application, the present application provides a solder paste supply feedback system for a circuit board printer. The system includes a solder paste container, a solder paste extrusion device, a first sensor, a second sensor, and a controller. The solder paste container is used to contain solder paste and has an outlet. The solder paste extrusion device is used to extrude the solder paste from the outlet of the solder paste container. The first sensor is configured to sense solder paste in the solder paste container and generate a first signal, the first signal is used to indicate whether the solder paste container still contains solder paste. The second sensor is configured to sense an operating state of the solder paste container and generate a second signal, the second signal is used to indicate whether solder paste is being extruded from the outlet of the solder paste container. The controller is configured to receive the first signal and the second signal, and to control an operation of the circuit board printer according to instructions of the first signal and the second signal.

[0006] In the above solder paste supply feedback system, the control device controls the circuit board printer to continue operation when the first signal of the first sensor indicates that there is solder paste in the solder paste container and the second signal of the second sensor indicates that the solder paste is being extruded from the outlet of the solder paste container, or controls the circuit board printer to continue operation when the first signal of the first sensor indicates that there is solder paste in the solder paste container and the second signal of the second sensor indicates that the solder paste is not being extruded from the outlet of the solder paste container within a predetermined period of time, to issue a confirmation prompt to prompt an operator to confirm by observation whether the solder paste in the solder paste container has been used up. The control device is configured to: control the circuit board printer to issue a request notification (a request notification), or to control the circuit board printer to continue operation if the first signal of the first sensor indicates that there is no solder paste in the solder paste container and the second signal of the second sensor indicates that solder paste is being extruded from an outlet of the solder paste container, or to control the circuit board printer to issue a replacement prompt to prompt an operator to replace the solder paste container if the first signal of the first sensor indicates that there is no solder paste in the solder paste container and the second signal of the second sensor indicates that solder paste is being extruded from an outlet of the solder paste container within a predetermined period of time.

[0007] In the solder paste dispensing feedback system described above, the solder paste dispensing feedback system includes a mounting support for securing a solder paste container, the solder paste container having a tail proximate the outlet, and a first sensor disposed on the mounting support proximate the tail of the solder paste container.

[0008] In the above solder paste supply feedback system, the solder paste has an extrusion path from an outlet of the solder paste container, and the second sensor is located adjacent to the outlet of the solder paste container downstream of the outlet of the solder paste container in the direction of the extrusion path of the solder paste.

[0009] In the above solder paste dispensing feedback system, the first sensor is an eddy current proximity switch.

[0010] In the above solder paste dispensing feedback system, the second sensor is a high frequency photoelectric sensor.

[0011] In the above solder paste dispensing feedback system, the high frequency photoelectric sensor defines an aperture area and an extrusion path of the solder paste passes through the aperture area.

[0012] In the above solder paste supply feedback system, the photoelectric sensor is a slot-type photoelectric sensor or a frame-type photoelectric sensor.

[0013] In the above solder paste supply feedback system, the solder paste extrusion device is a gas input device. The solder paste container has a gas inlet and a piston, the gas inlet being disposed at one end of the solder paste container opposite the outlet, and the piston is housed within the solder paste container. The solder paste container receives gas from the gas input device via the gas inlet, and the piston is configured to be pushed by the gas input via the gas inlet toward the outlet of the solder paste container to extrude the solder paste from the solder paste container.

[0014] According to another aspect of the present application, there is provided a circuit board printer including a solder paste dispensing feedback system according to the present application. [Brief description of the drawings]

[0015] [Figure 1]FIG. 2 is a three-dimensional view of one embodiment of a solder paste delivery feedback system according to the present application from one angle. [Diagram 2] 2 is a longitudinal cross-sectional view of a solder paste cartridge in the solder paste supply feedback system of FIG. 1. [Diagram 3] 2 is a three-dimensional view of the solder paste supply feedback system shown in FIG. 1 from another angle. [Figure 4a] FIG. 2 is a diagram showing a slot-type photoelectric sensor. [Figure 4b] FIG. 1 is a diagram showing a frame type photoelectric sensor. [Diagram 5] FIG. 2 is a block diagram of the functional modules of the solder paste delivery feedback system according to the present application. [Figure 6] FIG. 6 is a block diagram of the control device of FIG. 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Detailed Description of the Invention Various specific embodiments of the present application are described below with reference to the accompanying drawings, which form a part hereof, and in which it should be understood that the same or similar reference numerals used herein refer to the same elements wherever possible.

[0017] 1 shows a three-dimensional view from one angle of one embodiment of a solder paste delivery feedback system 10 according to the present application. As shown in FIG 1, the solder paste delivery feedback system 10 includes a solder paste cartridge 101 and a gas input device 201. The gas input device 201 is connected to the solder paste cartridge 101 and inputs gas into the solder paste cartridge 101.

[0018] FIG. 2 shows a longitudinal cross-sectional view of a solder paste cartridge 101 used in the solder paste supply feedback system 10 shown in FIG. 1. The solder paste cartridge 101 is made of a plastic material. As shown in FIG. 2, the solder paste cartridge 101 includes a gas inlet 104. The gas inlet 104 is connected to a gas input device 201 and receives gas from the gas input device 201. FIG. 2 shows that the solder paste cartridge 101 further includes an outlet 102 disposed on the opposite side to the gas inlet 104, a tail 103 adjacent to the outlet 102, and a piston 105 housed within the solder paste cartridge 101 and made of plastic. The gas input from the gas inlet 104 moves the piston 105 toward the outlet 102, so that the solder paste can be pushed out of the solder paste cartridge 101 onto a stencil (not shown) of a circuit board printer. As shown in FIG. 2, the two ends of the piston 105 abut against the cylindrical wall 106 of the solder paste cartridge 101, so that when the solder paste has good fluidity, the piston 105 can push out all the solder paste from the solder paste cartridge 101 without forming any residue on the cylindrical wall 103 of the solder paste cartridge 101.

[0019] FIG. 3 shows a three-dimensional view of the solder paste delivery feedback system 10 shown in FIG. 1 from another angle. As shown in FIG. 3, the solder paste delivery feedback system 10 further includes a mounting support 501, and the solder paste cartridge 101 is fixed to the mounting support 501. FIG. 3 also shows that the solder paste delivery feedback system 10 includes sensors 301 and 302. The sensor 301 is disposed on the mounting support 501 proximate to the tail 103 of the solder paste container 101. The sensor 301 is configured to detect whether metal is nearby and thus can detect whether the tail 103 of the solder paste cartridge 101 contains solder paste and can transmit a first signal indicative of the detection result. In one embodiment, the sensor 301 is an eddy current proximity switch. The sensor 302 is located downstream of and proximate to the outlet 102 in the direction of the solder paste extrusion path from the outlet 102 of the solder paste cartridge 101 to a stencil (not shown). The sensor 302 is configured to detect whether there is solder paste being extruded from the outlet 102 of the solder paste cartridge 101 and transmit a second signal indicative of the detection result. In one embodiment, the sensor 302 is a high frequency photoelectric sensor that defines an opening area through which the solder paste extrusion path passes. As shown in FIG. 4a or FIG. 4b, in one embodiment, the high frequency photoelectric sensor 302 is a slot type sensor 302a or a frame type sensor 302b, and the solder paste extrusion path passes through an opening 303a in the slot type sensor 302a or an opening 303b in the frame type sensor 302b.

[0020] 5 is a block diagram of the functional modules of the solder paste dispensing feedback system according to the present application. As shown in FIG. 5, the solder paste dispensing feedback system 10 further includes a control device 401 and a prompt device 601. The control device 401 communicates with the sensors 301, 302 and the prompt device 601 to receive the first and second signals sent by the sensors 301 and 302, respectively, and determines whether the solder paste cartridge 101 contains solder paste by integrating the states indicated by the first and second signals, and then sends an instruction signal to the prompt device 601 or controls the operation of the circuit board printer. Specifically, when the first signal of the sensor 301 indicates that there is solder paste in the solder paste cartridge 101 and the second signal of the sensor 302 indicates that there is solder paste being extruded from the outlet 102 of the solder paste cartridge 101, the control device 401 determines that the solder paste cartridge 101 contains solder paste and controls the circuit board printer to continue operation. Alternatively, if the first signal of sensor 301 indicates that there is solder paste in solder paste cartridge 101 and the second signal of sensor 302 indicates that no solder paste is being extruded from outlet 102 of solder paste cartridge 101 within a predetermined period of time, controller 401 controls prompt device 601 to send a control signal to prompt device 601 to issue a confirmation prompt to prompt an operator to confirm by observation whether the solder paste in solder paste cartridge 101 has been used up. Alternatively, if the first signal of sensor 301 indicates that there is no solder paste in solder paste cartridge 101 and the second signal of sensor 302 indicates that there is solder paste being extruded from outlet 102 of solder paste cartridge 101, controller 401 determines that solder paste cartridge 101 contains solder paste and controls circuit board printer to continue operation.Alternatively, when the first signal of the sensor 301 indicates that there is no solder paste in the solder paste cartridge 101 and the second signal of the sensor 302 indicates that there is no solder paste being extruded from the outlet 102 of the solder paste cartridge 101 within a predetermined period of time, the control device 401 determines that the solder paste in the solder paste cartridge 101 is used up, and controls the prompt device 601 to send a control signal to the prompt device 601 to issue a replacement prompt, so as to prompt the operator to replace the solder paste cartridge 101. The predetermined period during which the second signal indicates that there is no solder paste being extruded from the outlet 102 of the solder paste cartridge 101 can be set to an appropriate period as required. In one embodiment, the predetermined period can be set to 10 seconds. In one embodiment, the prompt device 601 is a display of the circuit board printer, which issues a visual alert according to a control signal received from the control device 401 to prompt observation to see if the solder paste in the solder paste cartridge 101 has been used up or to prompt replacement of the solder paste cartridge 101. In other embodiments, the prompt device 601 can be an audible alarm.

[0021] The simultaneous use of sensors 301 and 302 in the solder paste supply feedback system of the present application is particularly advantageous. The inventors of the present application have found that when the fluidity of the solder paste in the solder paste cartridge 101 decreases, the piston 105 may not be able to scrape off all the solder paste adhering to the wall 103 of the solder paste cartridge 101 when sliding against the wall 103 toward the outlet 102, resulting in a residue of solder paste on the wall 103. In this case, the sensor 301 may detect the solder paste remaining on the wall 103, and as a result, the first signal sent to the controller 401 may indicate that the solder paste cartridge 101 still contains solder paste. Thus, even if the solder paste in the solder paste cartridge 101 is exhausted, the sensor 301 will still send a signal indicating that there is still solder paste in the solder paste cartridge 101. Therefore, if only the sensor 301 is provided, a situation may arise where an operator of the circuit board printer fails to replace the solder paste cartridge in a timely manner, which affects the print quality. The inventors of the present application have also found that only when gas is input from the gas input device 201 to the gas inlet 104 of the solder paste cartridge 101 for a certain period of time, the piston 105 can be pushed to extrude the solder paste from the outlet 102 of the solder paste cartridge 101, and as a result, the solder paste may not be extruded from the outlet 102 of the solder paste cartridge 101 within a predetermined period of time. Alternatively, when the fluidity of the solder paste in the solder paste cartridge 101 decreases, the movement speed of the piston 105 when pushed by the gas decreases, and as a result, the speed at which the solder paste is extruded from the outlet 102 of the solder paste cartridge 101 decreases, and the solder paste may not be extruded from the outlet 102 of the solder paste cartridge 101 within a predetermined period of time.If the signal sent by the sensor 302 indicates that the solder paste has not been extruded within a predetermined period of time, even if there is still solder paste in the solder paste cartridge 101 in fact, the control device 401 will erroneously determine that there is no solder paste in the solder paste cartridge 101 based on the signal sent by the sensor 302, and thus erroneously send a control signal to the prompt device 601 to prompt the replacement of the solder paste cartridge, which will affect the operation efficiency of the circuit board printer. In the present application, as a result of using the sensors 301 and 302 simultaneously and configuring the control device 401 to comprehensively consider the conditions indicated by the signals sent by these two sensors, the erroneous determination of whether the solder paste cartridge contains solder paste is reduced or avoided, thus ensuring the print quality and improving the operation efficiency of the circuit board printer.

[0022] FIG. 6 is a schematic block diagram of the control device 401 of FIG. 5. As shown in FIG. 6, the control device includes a bus 411. A processor 412, a memory 413, a mass storage device 414, an input interface 415, and an output interface 416 are connected to the bus 411. The processor 412 can read a program (or instruction) from the memory 413 or the mass storage device 414 and execute the program (or instruction) to perform a control function. The processor 412 can also write data or instructions to the memory 413 or the mass storage device 414. The memory 413 and the mass storage device 414 can store a program (instruction) or data. In general, the memory 413 has a faster access speed than the mass storage device 414, and the mass storage device 414 has a larger memory size than the memory 413. By executing instructions in the memory 413, the processor 412 can control the memory 413, the mass storage device 414, the input interface 415, and the output interface 416.

[0023] The input interface 415 receives inputs from the sensors 301, 302 and converts the inputs received from the sensors 301, 302 into signals recognizable by the processor 412. The output interface 416 receives control signals from the processor 412 and converts the control signals into outputs suitable for the prompt device 601. In the course of operation, after receiving signals from the sensors 301, 302, the processor 412 performs the necessary functions according to the inputs from the sensors 301, 302, determines whether the solder paste cartridge 101 still contains solder paste, and sends a control signal to the prompt device 601 to control the prompt device 601 to issue an appropriate prompt. Similarly, in the course of operation, upon receiving a control signal from the processor 412, the output interface 416 outputs a control signal to the prompt device 601 to control the prompt device 601 to issue an appropriate prompt.

[0024] Although the present disclosure has been described in connection with the example embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantial equivalents, whether already known or currently or soon foreseeable, may be apparent to those skilled in the art. In addition, the technical effects and / or technical problems described herein are exemplary and not limiting, and thus the disclosure herein may be used to solve other technical problems, may have other technical effects, and / or may solve other technical problems. Thus, the example embodiments of the present disclosure as described above are intended to be illustrative and not limiting. Various changes can be made without departing from the spirit or scope of the present disclosure. Thus, the present disclosure is intended to include all known or previously developed alternatives, modifications, variations, improvements, and / or substantial equivalents.

Claims

1. 1. A solder paste dispensing feedback system for a circuit board printer, comprising: A solder paste container (101) used to contain solder paste and having an outlet (102); a solder paste extrusion device (201) used to extrude the solder paste from the outlet (102) of the solder paste container (101); a first sensor (301) configured to sense solder paste in the solder paste container (101) and generate a first signal, the first signal being used to indicate whether the solder paste container (101) still contains solder paste; a second sensor (302) configured to sense an operational state of the solder paste container (101) and generate a second signal, the second signal being used to indicate whether solder paste is being extruded from the outlet (102) of the solder paste container (101); a control device (401) configured to receive the first signal and the second signal and to control an operation of the circuit board printer according to instructions of the first signal and the second signal; 1. A solder paste delivery feedback system comprising:

2. The control device (401) when the first signal of the first sensor (301) indicates that there is solder paste in the solder paste container (101) and the second signal of the second sensor (302) indicates that solder paste is being extruded from the outlet (102) of the solder paste container (101), the control device (401) controls the circuit board printer to continue operation; when the first signal of the first sensor (301) indicates that there is solder paste in the solder paste container (101) and the second signal of the second sensor (302) indicates that no solder paste is being extruded from the outlet (102) of the solder paste container (101) within a predetermined period of time, the control device (401) controls the circuit board printer to issue a confirmation prompt to prompt an operator to confirm by observation whether the solder paste in the solder paste container (101) has been used up; when the first signal of the first sensor (301) indicates that there is no solder paste in the solder paste container (101) and the second signal of the second sensor (302) indicates that solder paste is being extruded from the outlet (102) of the solder paste container (101), the control device (401) controls the circuit board printer to continue operation, or When the first signal of the first sensor (301) indicates that there is no solder paste in the solder paste container (101) and the second signal of the second sensor (302) indicates that no solder paste is extruded from the outlet (102) of the solder paste container (101) within a predetermined period of time, the control device (401) controls the circuit board printer to issue a replacement prompt to prompt the operator to replace the solder paste container (101).

2. The solder paste supply feedback system of claim 1, configured as follows:

3. the solder paste supply feedback system comprises a mounting support (501) for fixing the solder paste container (101); The solder paste container (101) has a tail (103) adjacent to the outlet (102); the first sensor (301) is disposed on the mounting support (501) adjacent to the tail (103) of the solder paste container (101); 2. The solder paste delivery feedback system of claim 1 .

4. the solder paste has an extrusion path from the outlet (102) of the solder paste container (101), and the second sensor (302) is located downstream of the outlet (102) of the solder paste container (101) in relation to the direction of the extrusion path of the solder paste and in close proximity to the outlet (102) of the solder paste container (101); 2. The solder paste delivery feedback system of claim 1 .

5. The first sensor (301) is an eddy current proximity switch.

4. The solder paste delivery feedback system of claim 3.

6. the second sensor (302) is a high frequency photoelectric sensor; 5. The solder paste supply feedback system of claim 4.

7. the high frequency photoelectric sensor defines an opening area (303a, 303b), and the extrusion path of the solder paste passes through the opening area (303a, 303b); 7. The solder paste delivery feedback system of claim 6.

8. The high frequency photoelectric sensor is a slot type photoelectric sensor (302a) or a frame type photoelectric sensor (302b); 8. The solder paste delivery feedback system of claim 7.

9. The solder paste extrusion device (201) is a gas input device (201), the solder paste container (101) has a gas inlet (104) and a piston (105), the gas inlet (104) being located at one end of the solder paste container (101) opposite the outlet (102), and the piston (105) being housed within the solder paste container (101); the solder paste container (101) receives gas from the gas input device (201) via the gas inlet (104), and the piston (105) is configured to be pushed by the gas input via the gas inlet (104) towards the outlet (102) of the solder paste container (101) to push the solder paste out of the solder paste container (101); 2. The solder paste delivery feedback system of claim 1 .

10. A circuit board printer comprising a solder paste supply feedback system according to any one of claims 1 to 9.

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